Electronic component processing film and electronic component processing method

Abstract

An electronic component processing film comprising an adhesive layer and a substrate layer, the electronic component processing film satisfying at least one of the following (1), (2), and (3). (1) The adhesive layer includes a terephthalic acid ester, and the substrate layer includes a reaction product of an aliphatic dicarboxylic acid and glycol. (2) The tack force is 40 gf or higher, and the SUS adhesive force s 1.1 N / 25 mm or higher. (3) The thickness of the adhesive layer is 12 μm or greater.

Description

Technical Field

[0001] The present disclosure relates to an electronic component processing film and an electronic component processing method.

Background Art

[0002] In the manufacturing method of electronic components such as semiconductor chips and ceramic capacitors, after dicing a wafer placed on a stretchable film into individual pieces of a desired size, the film is stretched to increase the distance between the chips, and the step of picking up the chips has been conventionally performed.

[0003] In recent years, the diversification of electronic component processing technologies has advanced, and technologies for processing diced chips on a stretched film have been studied. For this reason, the development of a film that can expand the interval between chips more than when the purpose is to pick up chips has been studied. For example, International Publication No. 2018 / 216621 proposes a method for manufacturing a semiconductor device including a step of expanding the interval between diced chips on a film from 100 μm or less to 300 μm or more, and a film used in this method.

Summary of the Invention

Problems to be Solved by the Invention

[0004] As a method for improving the stretchability of a film, it is conceivable to add a plasticizer. However, phthalic acid esters such as bis(2-ethylhexyl) phthalate, which are generally used as plasticizers, are a concern for their effects on living organisms. Therefore, the development of a film having the same characteristics as a film containing a phthalic acid ester and replacing the phthalic acid ester with another plasticizer is desired.

[0005] In view of the above circumstances, an aspect of the present disclosure aims to provide an electronic component processing film excellent in stretchability and biocompatibility, and an electronic component processing method using this electronic component processing film.

[0006] Furthermore, with the increasing functionality and integration of electronic component devices, the miniaturization of chips is progressing. For this reason, as the stretching ratio of the film increases, the problem of chip detachment from the film is becoming a concern.

[0007] In view of the above circumstances, one aspect of the present disclosure aims to provide an electronic component processing film in which chip detachment during stretching is suppressed. Another aspect of the present disclosure aims to provide an electronic component processing method using this electronic component processing film.

Means for Solving the Problems

[0008] Specific means for achieving the above problems include the following embodiments. <1> An electronic component processing film comprising an adhesive layer and a base material layer, wherein the adhesive layer contains terephthalic acid ester and the base material layer contains a reaction product of an aliphatic dicarboxylic acid and glycol. <2> An electronic component processing film comprising an adhesive layer and a base material layer, having a tack force of 40 gf or more and a SUS adhesive force of 1.1 N / 25 mm or more. <3> An electronic component processing film comprising an adhesive layer and a base material layer, wherein the thickness of the adhesive layer is 12 μm or more. <4> The electronic component processing film according to any one of <1> to <3>, wherein the adhesive layer contains an acrylic adhesive. <5> The electronic component processing film according to any one of <1> to <4>, wherein the base material layer contains polyvinyl chloride. <6> The electronic component processing film according to any one of <1> to <5>, wherein the base material layer contains a colorant and the maximum particle diameter of the colorant is 25 μm or less. <7> The electronic component processing film according to any one of <1> to <6>, having a tensile strength of 20 MPa or more. <8> The electronic component processing film according to any one of <1> to <7>, having a tensile elongation rate of 200% or more. <9> An electronic component processing method including a step of stretching the electronic component processing film in a state where the singulated electronic components are arranged on the electronic component processing film according to any one of <1> to <8>. <10>The electronic component processing method according to <9>, wherein after the step of stretching the electronic component processing film, the electronic component is processed on the electronic component processing film.

Effect of the Invention

[0009] According to one aspect of the present disclosure, an electronic component processing film excellent in stretchability and biocompatibility is provided. According to one aspect of the present disclosure, an electronic component processing film in which the dropping of chips during stretching is suppressed is provided. According to one aspect of the present disclosure, an electronic component processing method using these electronic component processing films is provided.

Brief Description of the Drawings

[0010] [Figure 1] It is a figure which shows the shape of the test piece used for a tensile test.

Modes for Carrying Out the Invention

[0011] Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values and ranges thereof, which do not limit the present invention. In the present disclosure, the term "step" includes not only a step independent of other steps but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the numerical range indicated by "~" in the present disclosure, the numerical values described before and after "~" are included as the minimum value and the maximum value, respectively. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other step-by-step descriptions. Also, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. In the present disclosure, each component may contain a plurality of corresponding substances. When there are a plurality of substances corresponding to each component in the composition, the content rate or content of each component means the total content rate or content of the plurality of substances present in the composition, unless otherwise specified.

[0012] <First Embodiment> The first embodiment of the present disclosure is an electronic component processing film including an adhesive layer and a base material layer, wherein the adhesive layer contains a terephthalic acid ester, and the base material layer contains a reaction product of an aliphatic dicarboxylic acid and a glycol.

[0013] The electronic component processing film having the above configuration uses a terephthalic acid ester as a plasticizer, so it has excellent biocompatibility. In addition, the electronic component processing film having the above configuration has the same stretchability as an electronic component processing film using a phthalic acid ester as a plasticizer.

[0014] Furthermore, the electronic component processing film having the above configuration is excellent in adhesive strength stability over time compared to an electronic component processing film using a phthalic acid ester or a terephthalic acid ester as a plasticizer in each of the adhesive layer and the base material layer, and the adhesion (interlayer adhesion) between the adhesive layer and the base material layer is excellent compared to an electronic component processing film using a reaction product of an aliphatic dicarboxylic acid and a glycol as a plasticizer in each of the adhesive layer and the adhesive layer.

[0015] (Adhesive layer) The adhesive layer of the electronic component processing film is not particularly limited as long as it contains a terephthalic acid ester. The type of terephthalic acid ester is not particularly limited. For example, those in which an alkyl group (preferably an alkyl group having 5 to 10 carbon atoms) is bonded to the benzene ring of terephthalic acid via two ester groups (dialkyl phthalate esters) can be mentioned. Specifically, bis(2-ethylhexyl) terephthalate and the like can be mentioned. The terephthalic acid ester contained in the adhesive layer may be only one kind or two or more kinds.

[0016] The content rate of the terephthalic acid ester contained in the adhesive layer is preferably, for example, 5 to 35 parts by mass, more preferably 10 to 20 parts by mass, and even more preferably 15 to 25 parts by mass with respect to 100 parts by mass of the solid content of the adhesive contained in the adhesive layer.

[0017] When the content rate of the terephthalic acid ester is 5 parts by mass or more (preferably 15 to 25 parts by mass) with respect to 100 parts by mass of the solid content of the adhesive, sufficient adhesion stability over time tends to be obtained. When the content rate of the terephthalic acid ester is 35 parts by mass or less with respect to 100 parts by mass of the solid content of the adhesive, the remaining of the adhesive layer on the electronic component (adhesive residue) tends to be suppressed.

[0018] If necessary, the adhesive layer may contain a plasticizer other than the terephthalic acid ester. In this case, the ratio of the terephthalic acid ester in the whole plasticizer is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. When the adhesive layer contains a phthalic acid ester as a plasticizer, the ratio of the phthalic acid ester in the whole plasticizer is preferably 20% by mass or less, more preferably 10% by mass or less, and even more preferably 5% by mass or less.

[0019] The adhesive layer preferably contains an adhesive. The type of the adhesive is not particularly limited, and it can be selected from known adhesives such as acrylic adhesives, rubber adhesives, silicone adhesives, and urethane adhesives. Among them, from the viewpoint of the stability of the characteristics, it is preferable to contain an acrylic adhesive.

[0020] As the acrylic adhesive, in order to ensure a certain level of adhesive characteristics, a copolymer (acrylic copolymer) containing a monomer having a low glass transition temperature (for example, -20°C or lower) as a copolymerization component is preferable. Examples of the acrylic monomer having a glass transition temperature of -20°C or lower include butyl acrylate, ethyl acrylate, and 2-ethylhexyl acrylate. The above glass transition temperature is the glass transition temperature of the homopolymer obtained using the monomer.

[0021] From the viewpoint of suppressing the migration of the adhesive layer to the electronic component, it is preferable that the acrylic copolymer has a large molecular weight. For example, the weight average molecular weight is preferably 1,000,000 or more. The upper limit of the molecular weight of the acrylic copolymer is not particularly limited, but from the viewpoint of ensuring adhesiveness, the weight average molecular weight is preferably 5,000,000 or less.

[0022] If necessary, the adhesive layer may contain a crosslinking agent. Examples of the crosslinking agent include isocyanate-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, and the like. Among them, from the viewpoint of stable adhesive properties, isocyanate-based crosslinking agents are preferable. The crosslinking agent contained in the adhesive layer may be only one kind or two or more kinds.

[0023] The content rate of the crosslinking agent contained in the adhesive layer may be, for example, 0.5 parts by mass to 20 parts by mass, 1 part by mass to 15 parts by mass, or 2 parts by mass to 10 parts by mass with respect to 100 parts by mass of the solid content of the adhesive contained in the adhesive layer.

[0024] If necessary, the adhesive layer may contain a tackifier, a surfactant, a filler, and the like.

[0025] From the viewpoint of facilitating the pick-up of the chip, the adhesive layer may have a property that the adhesive force decreases by high energy rays such as ultraviolet rays and radiation, or heat. For example, by using an adhesive having a property of curing by irradiation with high energy rays such as ultraviolet rays and radiation, heating, etc., the adhesive force of the adhesive layer may be decreased.

[0026] From the viewpoint of ensuring sufficient adhesive force to the chip, the thickness of the adhesive layer is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. From the viewpoint of economy, the thickness of the adhesive layer is preferably 100 μm or less, and more preferably 50 μm or less.

[0027] If necessary, a separator or the like may be disposed on the outer surface of the adhesive layer (the surface opposite to the side facing the base material layer).

[0028] (Base material layer) The base material layer of the electronic component processing film is not particularly limited as long as it contains a reaction product of an aliphatic dicarboxylic acid and a glycol. Examples of the aliphatic dicarboxylic acid reacted with the glycol include adipic acid, sebacic acid, azelaic acid, etc., and examples of the glycol reacted with the aliphatic dicarboxylic acid include 1,2-propanediol, butanediol, etc. Among these, a reaction product of adipic acid and glycol (adipic acid-based polyester) is preferable.

[0029] The molecular weight of the reaction product of the aliphatic dicarboxylic acid and the glycol is not particularly limited. For example, it may be in the range of 500 to 3,000. The reaction product of the aliphatic dicarboxylic acid and the glycol contained in the base material layer may be only one kind or two or more kinds.

[0030] The content rate of the reaction product of the aliphatic dicarboxylic acid and the glycol contained in the base material layer is preferably, for example, 30% by mass to 60% by mass of the total solid content of the base material layer, more preferably 35% by mass to 55% by mass, and even more preferably 40% by mass to 45% by mass.

[0031] When the content rate of the reaction product of the aliphatic dicarboxylic acid and the glycol is 30% by mass or more of the total solid content of the base material layer, sufficient stretchability tends to be obtained.

[0032] If necessary, the base material layer may contain a plasticizer other than the reaction product of the aliphatic dicarboxylic acid and the glycol. In this case, the ratio of the reaction product of the aliphatic dicarboxylic acid and the glycol in the total plasticizer is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more.

[0033] From the viewpoint of obtaining good stretchability, the base material layer preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl chloride, polyester, polyolefin, polyamide, polyimide, polyurethane, etc. Among them, from the viewpoint of stretchability, polyvinyl chloride is preferable.

[0034] From the viewpoint of improving visibility during processing, the base material layer may contain a colorant. Examples of the colorant include dyes, pigments, etc. From the viewpoint of durability, pigments are preferable. The color of the colorant is preferably a color other than black, and more preferably blue. Specific examples of the colorant include alkaline blue, disazo yellow, phthalocyanine blue, ultramarine blue, ultramarine, cobalt blue, etc.

[0035] When the colorant is in a particulate state, it is preferable that the maximum particle diameter thereof is smaller than the thickness at the time of stretching of the base material layer. When the maximum diameter of the colorant contained in the base material layer is smaller than the thickness at the time of stretching of the base material layer, the dropout of the colorant from the base material layer when the base material layer is stretched is suppressed, which is advantageous in terms of maintenance of the electronic component processing apparatus. Specifically, for example, the maximum particle diameter of the colorant is preferably 25 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less. In the present disclosure, the "maximum particle diameter" of the colorant is defined as the maximum value of the maximum diameter (the length when the diameter of the projection image is the longest) of each particle obtained from the projection images of the particles (preferably 100 or more) of the colorant.

[0036] The content of the colorant contained in the base material layer is preferably, for example, 0.1% by mass to 2.0% by mass of the total solid content of the base material layer, more preferably 0.2% by mass to 1.5% by mass, and even more preferably 0.3% by mass to 1.0% by mass.

[0037] From the perspective of ensuring sufficient strength, the thickness of the base material layer is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 50 μm or more. From the perspective of ensuring sufficient stretchability, the thickness of the base material layer is preferably 500 μm or less, more preferably 200 μm or less, and even more preferably 150 μm or less.

[0038] If necessary, the outer surface of the base material layer (the surface opposite to the side facing the adhesive layer) may be subjected to matting treatment, antistatic treatment, etc.

[0039] The electronic component processing film of the present disclosure is excellent in adhesion stability over time. Specifically, good adhesiveness to electronic components is maintained even after a long period from the production of the electronic component processing film. In one embodiment, the SUS adhesion (adhesion to a stainless steel plate) 90 days after the production of the electronic component processing film may be 1 N / 25 mm or more, may be 1.2 N / 25 mm or more, or may be 1.5 N / 25 mm or more.

[0040] From the perspective of facilitating the pickup of chips, the SUS adhesion of the electronic component processing film (when a treatment for reducing the adhesion is performed, the adhesion after the treatment) is preferably 3.0 N / 25 mm or less, more preferably 2.5 N / 25 mm or less, and even more preferably 2.0 N / 25 mm or less.

[0041] For the measurement of SUS adhesion, a "Tensilon tensile tester RTA-100 type" manufactured by Orientec Co., Ltd. or a similar tester having a gripper and a 90-degree peeling device is used. As the SUS plate, cold-rolled stainless steel 430BA is used. Prior to the test, in order to make the surface tension of the SUS plate constant, a heat treatment is carried out, and further, in order to remove the dirt on the surface of the test plate, ultrasonic cleaning with toluene is carried out. The conditions of the heat treatment and the toluene ultrasonic cleaning can be appropriately changed according to the state of the SUS plate.

[0042] Cut the electronic component processing film into a size of 50 mm in width and 100 mm in length. If there is a separator, peel it off, and attach the adhesive layer to the SUS plate to prepare a test piece. Pass this test piece between rubber rolls under a pressure of 5880 N / m at a speed of 2 m / min in an environment of 23°C to crimp the adhesive layer. After leaving the crimped test piece for 30 minutes, cut the test piece into a width of 25 mm and a length of 100 mm, and peel the electronic component processing film from the SUS plate in a direction perpendicular to the SUS plate (90-degree peel) at a speed of 200 mm / min. The peel force at this time is defined as the SUS adhesive strength.

[0043] From the viewpoint of obtaining sufficient stretchability, the tensile strength of the electronic component processing film is preferably 10 MPa or more, more preferably 15 MPa or more, and even more preferably 20 MPa or more. From the viewpoint of ensuring the required strength, the tensile strength of the electronic component processing film is preferably 100 MPa or less, more preferably 50 MPa or less, and even more preferably 30 MPa or less.

[0044] From the viewpoint of obtaining sufficient stretchability, the tensile elongation rate of the electronic component processing film is preferably 100% or more, more preferably 150% or more, and even more preferably 200% or more. From the viewpoint of ensuring the required strength, the tensile elongation rate of the electronic component processing film is preferably 1000% or less, more preferably 700% or less, and even more preferably 500% or less.

[0045] Examples of methods for adjusting the tensile strength and tensile elongation rate of the electronic component processing film include adjusting the thickness of the base material layer and selecting the type and amount of components (thermoplastic resin, plasticizer, etc.) contained in the base material layer.

[0046] For measuring the tensile strength and tensile elongation rate of the electronic component processing film, use a "Tensilon tensile testing machine RTA-100 type" manufactured by Orientec Co., Ltd. or a similar testing machine having a gripping tool and a 180-degree peeling device.

[0047] First, a test piece having the shape shown in FIG. 1 is produced using an electronic component processing film. Both ends of this test piece are grasped by a testing machine and a tensile test is performed. The test is carried out at an environment of 23 ± 5°C and a tensile speed of 500 mm / min. When there is a separator on the adhesive layer, the test is carried out after peeling it off.

[0048] The tensile strength is calculated by the following formula from the average thickness (0.100 mm) and width (10 mm) of the test piece before the test and the maximum load (N) until the sample is cut. The tensile elongation rate is calculated by the following formula from the distance A between the marks of the sample before the test (the length of the part where the width of the test piece shown in FIG. 1 is 10 mm: 40 mm) and the distance B between the marks when the sample is cut.

[0049]

Equation

[0050] The electronic component processing film of the first embodiment may satisfy the requirements described in the electronic component processing film of the second embodiment or the third embodiment.

[0051] <Second Embodiment> The second embodiment of the present disclosure is an electronic component processing film including an adhesive layer and a base material layer, having a tack force of 40 gf or more and a SUS adhesive force of 1.1 N / 25 mm or more.

[0052] As a result of the study by the present inventors, it has been found that the chip dropout when the electronic component processing film is stretched cannot be sufficiently suppressed only by the high adhesive force of the electronic component processing film to the electronic component or only by the high tack force. Therefore, further study has revealed that when the tack force of the electronic component processing film is 40 gf or more and the SUS adhesive force is 1.1 N / 25 mm or more, the chip dropout is effectively suppressed.

[0053] In the present disclosure, the tack force of the electronic component processing film is measured as follows. For the measurement of tack force, use the "Probe Tack Tester TAC-II" manufactured by Resca Co., Ltd. or a similar tester.

[0054] Cut the electronic component processing film into a size of 20 mm in width and 100 mm in length. If there is a release sheet, peel it off and place it on the measuring part of the tack tester with the adhesive layer facing up. Under the conditions of 23 ± 5°C, a probe lowering speed of 120 mm / min, a load of 10 gf, a pressurization time of 10 seconds, and a probe rising speed of 600 mm / min, lower, pressurize, and raise the probe, and take the obtained value as the tack force.

[0055] From the viewpoint of suppressing chip dropout, the above-mentioned tack force is preferably 45 gf or more, more preferably 50 gf or more, and even more preferably 70 gf or more.

[0056] From the viewpoint of facilitating chip pickup, the above-mentioned tack force is preferably 300 gf or less, more preferably 250 gf or less, and even more preferably 200 gf or less.

[0057] Examples of methods for adjusting the tack force of the electronic component processing film include adjusting the thickness of the adhesive layer and selecting the types and amounts of components (such as adhesives, plasticizers, crosslinking agents, etc.) contained in the adhesive layer.

[0058] From the viewpoint of obtaining sufficient adhesiveness to the electronic component, the SUS adhesive force (adhesive force to a stainless steel plate) of the electronic component processing film is preferably 1.2 N / 25 mm or more, more preferably 1.3 N / 25 mm or more, and even more preferably 1.5 N / 25 mm or more.

[0059] From the viewpoint of facilitating chip pickup, the above-mentioned SUS adhesive force (when a treatment for reducing the adhesive force is performed, the adhesive force after the treatment) is preferably 3.0 N / 25 mm or less, more preferably 2.5 N / 25 mm or less, and even more preferably 2.0 N / 25 mm or less.

[0060] As a method for adjusting the SUS adhesiveness of the electronic component processing film, there may be mentioned adjustment of the thickness of the adhesive layer, selection of the types and amounts of components (adhesive, plasticizer, crosslinking agent, etc.) contained in the adhesive layer, and the like.

[0061] The measurement of the SUS adhesiveness is carried out in the same manner as the SUS adhesiveness of the electronic component processing film of the first embodiment.

[0062] From the viewpoint of obtaining sufficient stretchability, the tensile strength of the electronic component processing film is preferably 10 MPa or more, more preferably 15 MPa or more, and still more preferably 20 MPa or more. From the viewpoint of ensuring the required strength, the tensile strength of the electronic component processing film is preferably 100 MPa or less, more preferably 50 MPa or less, and still more preferably 30 MPa or less.

[0063] From the viewpoint of obtaining sufficient stretchability, the tensile elongation rate of the electronic component processing film is preferably 100% or more, more preferably 150% or more, and still more preferably 200% or more. From the viewpoint of ensuring the required strength, the tensile elongation rate of the electronic component processing film is preferably 1000% or less, more preferably 700% or less, and still more preferably 500% or less.

[0064] As a method for adjusting the tensile strength and the tensile elongation rate of the electronic component processing film, there may be mentioned adjustment of the thickness of the base material layer, selection of the types and amounts of components (thermoplastic resin, plasticizer, etc.) contained in the base material layer, and the like.

[0065] The measurement of the tensile strength and the tensile elongation rate of the electronic component processing film is carried out in the same manner as the tensile strength and the tensile elongation rate of the electronic component processing film of the first embodiment.

[0066] (Adhesive layer) The adhesive layer of the electronic component processing film preferably contains an adhesive. The type of the adhesive is not particularly limited and can be selected from known adhesives such as acrylic adhesives, rubber adhesives, silicone adhesives, and urethane adhesives. Among them, from the viewpoint of stability, it is preferable to contain an acrylic adhesive. The adhesive may be dissolved or dispersed in an organic solvent, water, or the like.

[0067] As the acrylic adhesive, the acrylic adhesive that may be contained in the adhesive layer of the electronic component processing film of the first embodiment may be used.

[0068] If necessary, the adhesive layer may contain a plasticizer. When the adhesive layer contains a plasticizer, the stretchability of the electronic component processing film tends to be improved.

[0069] The type of the plasticizer is not particularly limited. From the viewpoint of biocompatibility, it is preferable to contain a plasticizer other than phthalic acid esters, and more preferably to contain terephthalic acid esters. The plasticizer contained in the adhesive layer may be only one kind or two or more kinds.

[0070] As the terephthalic acid ester, the same terephthalic acid ester as that contained in the adhesive layer of the electronic component processing film of the first embodiment may be used. The terephthalic acid ester contained in the adhesive layer may be only one kind or two or more kinds.

[0071] When the adhesive layer contains terephthalic acid ester as a plasticizer, the proportion of terephthalic acid ester in the total plasticizer is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more.

[0072] The content rate of the plasticizer contained in the adhesive layer is preferably, for example, 5% by mass to 35% by mass, more preferably 10% by mass to 30% by mass, and even more preferably 15% by mass to 25% by mass of the total solid content of the adhesive layer.

[0073] When the adhesive layer contains a plasticizer, the stretchability of the electronic component processing film tends to improve. On the other hand, when the content of the plasticizer is 35 parts by mass or less with respect to 100 parts by mass of the solid content of the adhesive, the residue (adhesive residue) of the adhesive layer on the electronic component tends to be suppressed. Also, a decrease in the SUS adhesive force and tack force due to a decrease in the ratio of the adhesive contained in the adhesive layer tends to be suppressed.

[0074] If necessary, the adhesive layer may contain a crosslinking agent. As the crosslinking agent, a crosslinking agent that the adhesive layer of the electronic component processing film of the first embodiment may contain may be used. From the viewpoint of obtaining stable adhesive properties, an isocyanate-based crosslinking agent is preferable. The crosslinking agent contained in the adhesive layer may be only one kind or two or more kinds.

[0075] The content rate of the crosslinking agent contained in the adhesive layer is preferably, for example, 0.5% by mass to 20% by mass of the entire solid content of the adhesive layer, more preferably 1% by mass to 15% by mass, and even more preferably 2% by mass to 10% by mass.

[0076] If necessary, the adhesive layer may contain components other than the adhesive, plasticizer, and crosslinking agent. For example, it may contain a tackifier, a surfactant, a filler, and the like.

[0077] From the viewpoint of facilitating the pickup of the chip, the adhesive layer may have a property that the adhesive force decreases by high-energy rays such as ultraviolet rays and radiation, or heat. For example, by using an adhesive having a property of curing by irradiation with high-energy rays such as ultraviolet rays and radiation, heating, etc., the adhesive force of the adhesive layer may be decreased.

[0078] From the viewpoint of ensuring sufficient adhesive force to the chip, the thickness of the adhesive layer is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. From the viewpoint of economy, the thickness of the adhesive layer is preferably 100 μm or less, more preferably 50 μm or less.

[0079] If necessary, a separator or the like may be disposed on the outer surface of the adhesive layer (the surface opposite to the side facing the base material layer).

[0080] (Base material layer) The base material layer of the electronic component processing film preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl chloride, polyester, polyolefin, polyamide, polyimide, polyurethane, etc. Among them, from the viewpoint of stretchability, polyvinyl chloride is preferable.

[0081] If necessary, the base material layer may contain a plasticizer. When the base material layer contains a plasticizer, the stretchability of the electronic component processing film tends to be improved.

[0082] The content of the plasticizer contained in the base material layer is preferably, for example, 30% by mass to 60% by mass of the total solid content of the base material layer, more preferably 35% by mass to 55% by mass, and even more preferably 40% by mass to 45% by mass.

[0083] When the content of the plasticizer is 30% by mass or more of the total solid content of the base material layer, sufficient stretchability tends to be obtained. When the content of the plasticizer is 60% by mass or less of the total solid content of the base material layer, sufficient strength tends to be obtained.

[0084] The type of the plasticizer is not particularly limited. From the viewpoint of biocompatibility, it is preferable to contain a plasticizer other than phthalic acid ester, and more preferably to contain a reaction product of an aliphatic dicarboxylic acid and a glycol. The plasticizer contained in the adhesive layer may be only one kind or two or more kinds.

[0085] As the reaction product of the aliphatic dicarboxylic acid and the glycol, a reaction product of the same aliphatic dicarboxylic acid and glycol as that contained in the base material layer of the electronic component processing film of the first embodiment may be used.

[0086] When the base material layer contains a reaction product of an aliphatic dicarboxylic acid and a glycol as a plasticizer, the proportion of the reaction product of the aliphatic dicarboxylic acid and the glycol in the total plasticizer is preferably 50% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass or more.

[0087] From the viewpoint of improving visibility during processing, the base material layer may contain a colorant. As the colorant, a colorant that may be contained in the base material layer of the electronic component processing film of the first embodiment may be used.

[0088] The content rate of the colorant contained in the base material layer is preferably, for example, 0.1% by mass to 2.0% by mass, more preferably 0.2% by mass to 1.5% by mass, and still more preferably 0.3% by mass to 1.0% by mass, based on the total solid content of the base material layer.

[0089] From the viewpoint of ensuring sufficient strength, the thickness of the base material layer is preferably 10 μm or more, more preferably 20 μm or more, and still more preferably 50 μm or more. From the viewpoint of ensuring sufficient stretchability, the thickness of the base material layer is preferably 500 μm or less, more preferably 200 μm or less, and still more preferably 150 μm or less.

[0090] If necessary, the outer surface of the base material layer (the surface opposite to the side facing the adhesive layer) may be subjected to matting treatment, antistatic treatment, etc.

[0091] The electronic component processing film of the second embodiment may satisfy the requirements described in the electronic component processing film of the first embodiment or the third embodiment.

[0092] <Third Embodiment> The third embodiment of the present disclosure is an electronic component processing film including an adhesive layer and a base material layer, wherein the thickness of the adhesive layer is 12 μm or more.

[0093] The electronic component processing film with the above-mentioned configuration has a thick adhesive layer, which allows for high embeddability of chips, preventing chips from falling off even when the contact surface with the adhesive layer is narrow, such as in the case of small chips, which have become increasingly popular in recent years, as well as conventional chips.

[0094] Furthermore, it was found that the electronic component processing film having the above-described configuration suppresses chip detachment regardless of the size of the chip, even when stretched at a high ratio.

[0095] The thickness of the adhesive layer may be 12 μm or more, and may be 15 μm or more, or 20 μm or more. From the viewpoint of economic efficiency, the thickness of the adhesive layer is preferably 100 μm or less, and more preferably 50 μm or less.

[0096] Other than the thickness of the adhesive layer, the details and preferred aspects of the film for processing electronic components are the same as those of the film for processing electronic components in the first or second embodiment described above.

[0097] The film for fabricating electronic components of the third embodiment may satisfy the requirements described for the film for fabricating electronic components of the first or second embodiment.

[0098] <Electronic component processing method> The electronic component processing method of the present disclosure includes a step of stretching the electronic component processing film described above in a state in which individual electronic components are arranged on the electronic component processing film (stretching step).

[0099] In the above method, the electronic components placed on the electronic component processing film may be singulated on the electronic component processing film, or may be singulated before being placed on the electronic component processing film.

[0100] Electronic components that have been singulated before being placed on the electronic component processing film can be placed on the electronic component processing film, for example, by singulating the electronic components on another film, then attaching the adhesive layer of the electronic component processing film to the electronic components, and transferring the electronic components onto the electronic component processing film.

[0101] The stretching ratio of the film for electronic parts processing in the stretching step is not particularly limited and can be selected depending on the type of processing to be performed after stretching, etc. For example, the stretching ratio may be 1.2 or more, or 1.5 or more.

[0102] The stretching ratio is a value calculated by the following formula. Stretching ratio = Maximum diameter of film for electronic parts processing after stretching / Maximum diameter of film for electronic parts processing before stretching

[0103] The distance between electronic components after the stretching step (the minimum distance if the distance is not constant) is not particularly limited and can be selected depending on the type of processing to be performed after stretching, etc. For example, the distance between electronic components may be 100 μm or more, 200 μm or more, or 300 μm or more.

[0104] If necessary, after the stretching step, processing of electronic parts (sealing treatment, heat treatment, etc.) may be carried out on the film for processing electronic parts.

[0105] After the stretching step and the processing of the electronic parts as required, the electronic parts are picked up from the film for processing electronic parts. The method for picking up the electronic parts is not particularly limited, and can be any known method. Before picking up, the adhesive layer may be subjected to treatment (such as ultraviolet irradiation or heat treatment) to reduce the adhesive strength.

[0106] The type of electronic component used in the above method is not particularly limited, and examples thereof include various semiconductor chips and ceramic capacitors. [Example]

[0107] Hereinafter, the above-described embodiments will be specifically described by way of examples. However, the above-described embodiments are not limited to these examples. Unless otherwise specified, all chemicals used were reagents.

[0108] <First Embodiment> (Preparation of Adhesive Composition) The materials shown in Table 1 below were mixed in the amounts (parts by mass) described in Table 1 to prepare a composition for the adhesive layer. As the base material, the materials shown in Table 1 below were used. The amount of the adhesive shown in Table 1 is the amount of the solid content contained in the adhesive.

[0109] Details of the materials shown in Table 1 are as follows. Adhesive: Acrylic adhesive (Toape Co., Ltd., XE-2644, solid content 12% by mass, copolymer of 80% to 90% by mass of butyl acrylate and 10% to 20% by mass of acrylonitrile) Plasticizer 1: Bis(2-ethylhexyl) terephthalate, ADEKA Co., Ltd., D-810, solid content 100% by mass Plasticizer 2: Bis(2-ethylhexyl) phthalate, Godo Solvent Co., Ltd., DOP, solid content 100% by mass Plasticizer 3: Adipic acid-based polyester (molecular weight of about 2,000), ADEKA Co., Ltd., P-200, solid content 100% by mass Crosslinking agent: Polyfunctional isocyanate (Nippon Polyurethane Industry Co., Ltd., Coronate L, solid content 75% by mass) Solvent: Methyl ethyl ketone

[0110] Base material 1: Polyvinyl chloride film (thickness 80 μm) containing 39% by mass of bis(2-ethylhexyl) terephthalate and 0.5% by mass of pigment (phthalocyanine blue, maximum particle diameter 10 μm) based on the total amount of the base material Base material 2: Polyvinyl chloride film (thickness 80 μm) containing 38% by mass of bis(2-ethylhexyl) phthalate and 0.5% by mass of pigment (ultramarine blue, maximum particle diameter 30 μm) based on the total amount of the base material Base material 3... A polyvinyl chloride film (thickness: 80 μm) containing 44% by mass of an adipic acid-based polyester (molecular weight: approximately 2,000) and 0.5% by mass of a pigment (phthalocyanine blue, maximum particle diameter: 10 μm) based on the total amount of the base material

[0111] (Production of an electronic component processing film) On the release-treated side of a polyethylene terephthalate film with a thickness of 38 μm and one side release-treated, an adhesive layer composition was applied so that the thickness after drying would be the thickness shown in Table 1, and then dried to form an adhesive layer. Next, the adhesive layer side of the above polyethylene terephthalate film was bonded to one side of the base material at room temperature (25°C), and pressure was applied with a rubber roll to transfer the adhesive layer onto the base material, thereby producing the electronic component processing films of Example 1-1 and Comparative Examples 1-1 to 1-3 each having a base material layer and an adhesive layer.

[0112] (Evaluation of stretchability) When the tensile strength and elongation at break of the electronic component processing film of Example 1-1 were measured by the method described above, the tensile strength was 26.5 MPa and the elongation at break was 339%. When the same test was conducted for Comparative Example 1-1, the tensile strength was 27.5 MPa and the elongation at break was 347%. From the above results, it was found that the electronic component processing film of Example 1-1 had stretchability equivalent to that of the electronic component processing film of Comparative Example 1-1 in which the adhesive layer and the base material layer each contained a phthalate ester.

[0113] (Evaluation of adhesion stability over time) The SUS adhesion of the electronic component processing film was measured by the method described above. The measurement was carried out 2 days and 90 days after the production of the electronic component processing film, respectively. The change rate was calculated by the following formula and evaluated according to the following criteria. The results are shown in Table 1.

[0114] A: The change rate of SUS adhesion is within ±20%. B: The change rate of SUS adhesion exceeds ±20%.

[0115] (Evaluation of interlayer adhesion) The SUS adhesion of the electronic component processing film was measured by the method described above. After the measurement, the surface of the SUS plate and the state of the electronic component processing film were visually observed and evaluated according to the following criteria. The results are shown in Table 1.

[0116] A: No peeling occurs between the adhesive layer and the base material layer, and the adhesive layer does not transfer to the SUS plate. B: Peeling occurs between the adhesive layer and the base material layer, and the adhesive layer transfers to the SUS plate.

[0117] (Evaluation of Pigment Discharge) For the electronic component processing film, a step of stretching at 60 °C was carried out once on the stretching device so that the maximum diameter became twice. Then, in order to confirm the presence or absence of pigment discharge from the base material layer, the surface of the base material layer that had been in contact with the device side was wiped three times with a white cloth, and the presence or absence of remaining pigment on the white cloth was confirmed with a microscope and evaluated according to the following criteria. The results are shown in Table 1.

[0118] A: No pigment adheres to the white cloth. B: Pigment adheres to the white cloth.

[0119]

Table 1

[0120] As shown in Table 1, the electronic component processing film of Example 1-1 using terephthalic acid ester as the plasticizer of the adhesive layer and the reaction product of aliphatic dicarboxylic acid and glycol as the plasticizer of the base material layer showed a change rate of the SUS adhesion after 90 days from the SUS adhesion after 2 days within ±20%, indicating good adhesion stability over time. In addition, since the maximum particle diameter of the pigment contained in the base material layer was 10 μm, the pigment discharge from the base material layer on the stretching device side after the stretching process was suppressed.

[0121] In Comparative Example 1-1 of the electronic component processing film in which phthalic acid esters were used as plasticizers for the adhesive layer and the base material layer, the change rate of the SUS adhesive strength after 90 days from the SUS adhesive strength after 2 days exceeded ±20%, and the adhesive strength stability over time was inferior to that of the examples. Further, since the maximum particle diameter of the pigment contained in the base material layer was 30 μm, pigment discharge from the base material layer occurred. In Comparative Example 1-2 of the electronic component processing film in which reaction products of aliphatic dicarboxylic acids and glycols were used as plasticizers for the adhesive layer and the base material layer, the change rate of the SUS adhesive strength after 90 days from the SUS adhesive strength after 2 days was within ±20%, indicating good adhesive strength stability over time, but the interlayer adhesion was insufficient. In Comparative Example 1-3 of the electronic component processing film in which terephthalic acid esters were used as plasticizers for the adhesive layer and the base material layer, the change rate of the SUS adhesive strength after 90 days from the SUS adhesive strength after 2 days exceeded ±20%, and the adhesive strength stability over time was insufficient.

[0122] <Second Embodiment> (Preparation of Adhesive Composition) The materials shown in Table 2 below were mixed in the amounts (parts by mass) shown in Table 2 to prepare a composition for the adhesive layer. As the base material, the materials shown in Table 2 below were used. The amount of the adhesive shown in Table 2 is the amount of the solid content contained in the adhesive.

[0123] Details of the materials shown in Table 2 are as follows. Adhesive 1: Acrylic adhesive (Toa Gosei Co., Ltd., XE-2644, solid content 12% by mass, copolymer of 80% to 90% by mass of butyl acrylate and 10% to 20% by mass of acrylonitrile) Adhesive 2: Acrylic adhesive (dissolved in toluene, Nagase ChemteX Corporation, Teisan Resin WS-023DR, solid content 17% by mass, copolymer of 60% to 70% by mass of butyl acrylate, 10% to 20% by mass of ethyl acrylate, and 10% to 20% by mass of acrylonitrile) Plasticizer 1: Bis(2-ethylhexyl) terephthalate, Adeka Corporation, D-810, solid content 100% by mass Plasticizer 2: bis(2-ethylhexyl) phthalate, Godo Solvent Co., Ltd., D-810, solid content 100% by mass Crosslinking agent: Polyfunctional isocyanate (Nippon Polyurethane Industry Co., Ltd., Coronate L, solid content 75% by mass) Solvent: Methyl ethyl ketone

[0124] Substrate 1: Polyvinyl chloride film (thickness 80 μm) containing bis(2-ethylhexyl) phthalate at 38% by mass of the substrate and pigment (ultramarine blue, maximum particle size 30 μm) at 0.5% by mass of the substrate. Substrate 2: Polyvinyl chloride film (thickness 80 μm) containing 44% by mass of adipic acid polyester and 0.5% by mass of pigment (phthalocyanine blue, maximum particle size 10 μm)

[0125] (Production of electronic component processing film) The adhesive layer composition was applied to the release-treated surface of a 38 μm thick polyethylene terephthalate film with one side treated for release, so that the thickness after drying would be as shown in Table 2, and the film was dried to form an adhesive layer. Next, the adhesive layer side of the polyethylene terephthalate film was attached to one side of the substrate at room temperature (25°C), and the adhesive layer was transferred onto the substrate by applying pressure with a rubber roll, thereby producing electronic component processing films for Examples 2-1 to 2-6 and Comparative Examples 2-1 to 2-4.

[0126] (Evaluation of stretchability) The tensile strength and tensile elongation of the electronic component processing film of Example 2-1 using substrate 2 were measured using the method described above. The tensile strength was 26.5 MPa and the tensile elongation was 339%, indicating excellent stretchability. The tensile strength and tensile elongation of the electronic component processing film of Example 2-6 using substrate 1 were measured using the method described above. The tensile strength was 27.5 MPa and the tensile elongation was 347%, indicating excellent stretchability.

[0127] (Evaluation of SUS adhesive strength and tackiness) The SUS adhesion and tack force of the electronic component processing film were measured by the method described above. The results are shown in Table 2.

[0128] (Evaluation of chip detachment) The adhesive layer of the electronic component processing film was attached to the chips (size 1 mm × 1 mm) individualized on the dicing film, and the chips were transferred from the dicing film to the electronic component processing film. The situation of chip detachment when the electronic component film was stretched at 60°C in this state was evaluated according to the following criteria. A: Almost no chip detachment occurs. B: Chip detachment occurs to such an extent that there is no practical problem. C: Chip detachment occurs to such an extent that there is a practical problem.

[0129] (Evaluation of pigment ejection) For the electronic component processing film, a process of stretching at 60°C so that the maximum diameter becomes twice as large was carried out once on the stretching device. Then, in order to confirm the presence or absence of pigment ejection from the base material layer, the surface of the base material layer that had been in contact with the device side was rubbed 3 times with a white cloth, and the presence or absence of pigment residue on the white cloth was confirmed with a microscope. As a result, in the case of the electronic component processing film of Example 2-6 where the maximum particle diameter of the pigment was 30 μm, the pigment adhered to the white cloth, and in the case of the other electronic component processing films, the pigment did not adhere to the white cloth. From this, it was found that by making the maximum particle diameter of the pigment contained in the base material layer 25 μm or less, pigment ejection can be effectively suppressed.

[0130]

Table 2

[0131] As shown in Table 2, for the electronic component processing films of Examples 2-1 to 2-6 where the tack force was 40 gf or more and the SUS adhesion was 1.1 N / 25 mm or more, the chip detachment during stretching was suppressed compared to the electronic component processing films of Comparative Examples 2-1 to 2-4 where the tack force was less than 40 gf or the adhesion was less than 1.1 N / 25 mm.

[0132] Third Embodiment (Preparation of Pressure-Sensitive Adhesive Composition) Compositions for adhesive layers were prepared by mixing the materials shown in Table 3 below in the amounts (parts by mass) shown in Table 3. The materials shown in Table 3 below were used as the substrates. The amounts of adhesive shown in Table 3 are the amounts of solids contained in the adhesive.

[0133] The details of the materials shown in Table 3 are as follows: Adhesive 1: Acrylic adhesive (Tohpe Corporation, XE-2644, solid content 12% by mass, copolymer of 80% to 90% by mass of butyl acrylate and 10% to 20% by mass of acrylonitrile) Adhesive 2: Acrylic adhesive (Nagase ChemteX Corporation, Teisan Resin WS-023DR dissolved in toluene, solids content 17% by mass, copolymer of 60% to 70% by mass of butyl acrylate, 10% to 20% by mass of ethyl acrylate, and 10% to 20% by mass of acrylonitrile) Plasticizer: bis(2-ethylhexyl) terephthalate, ADEKA Corporation, D-810, solid content 100% by mass Crosslinking agent: Polyfunctional isocyanate (Nippon Polyurethane Industry Co., Ltd., Coronate L, solid content 75% by mass) Solvent: Methyl ethyl ketone

[0134] Substrate: Polyvinyl chloride film (80 μm thick) containing 44% by mass of adipic acid polyester (molecular weight approximately 2,000) and 0.5% by mass of pigment (phthalocyanine blue, maximum particle size 10 μm)

[0135] (Production of electronic component processing film) The adhesive layer composition was applied to the release-treated surface of a 38 μm thick polyethylene terephthalate film with one side treated for release, so that the thickness after drying would be as shown in Table 3, and the film was dried to form an adhesive layer. Next, the adhesive layer side of the polyethylene terephthalate film was attached to one side of the substrate at room temperature (25°C), and the adhesive layer was transferred onto the substrate by applying pressure with a rubber roll, thereby producing electronic component processing films for Examples 3-1 to 3-4 and Comparative Examples 3-1 to 3-6.

[0136] (Evaluation of stretchability) The tensile strength and tensile elongation of the film for electronic parts processing in Example 3-2 were measured by the above-mentioned method, and the tensile strength was 26.5 MPa and the tensile elongation was 339%, indicating excellent stretchability.

[0137] (SUS adhesive strength evaluation) The adhesive strength to SUS was measured for the films for processing electronic parts of the Examples and Comparative Examples using the method described above. The results are shown in Table 3.

[0138] (Evaluation of chip dropout) The adhesive layer of the produced electronic component processing film was attached to a chip (dimensions 1 mm × 1 mm) separated from the dicing film, and the chip was transferred from the dicing film to the electronic component processing film. In this state, the electronic component film was stretched at 60 ° C., and the state of chip detachment was evaluated according to the following criteria. A: The tip does not fall off. B: Chip falls off.

[0139] [Table 3]

[0140] As shown in Table 3, chips did not fall off in the films for electronic parts processing of the examples in which the adhesive layer was 12 μm or thicker. Conversely, in the films for electronic parts processing of the comparative examples in which the adhesive layer was less than 12 μm thick, chips fell off even when the SUS adhesive strength was high.

[0141] The disclosures of Japanese Patent Applications Nos. 2019-152301 and 2019-152302 are incorporated herein by reference in their entirety. All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually indicated to be incorporated by reference.

Claims

1. 1. A film for processing electronic components, comprising an adhesive layer and a substrate layer, wherein the adhesive layer contains a terephthalic acid ester, and the substrate layer contains a reaction product of an aliphatic dicarboxylic acid and a glycol, the reaction product having a molecular weight of 2,000 or more.

2. 2. The film for processing electronic parts according to claim 1, comprising an adhesive layer and a substrate layer, and having a tack strength of 40 gf or more and an adhesive strength to SUS of 1.1 N / 25 mm or more.

3. 3. The film for processing electronic parts according to claim 1, comprising an adhesive layer and a base layer, the adhesive layer having a thickness of 12 μm or more.

4. The electronic parts processing film according to any one of claims 1 to 3, wherein the adhesive layer contains an acrylic adhesive.

5. The film for processing electronic parts according to any one of claims 1 to 4, wherein the base layer contains polyvinyl chloride.

6. 6. The film for processing electronic parts according to claim 1, wherein the base layer contains a colorant, and the maximum particle size of the colorant is 25 μm or less.

7. The film for processing electronic parts according to any one of claims 1 to 6, wherein the film has a tensile strength of 20 MPa or more.

8. The film for processing electronic parts according to any one of claims 1 to 7, wherein the film has a tensile elongation of 200% or more.

9. An electronic component processing method comprising a step of stretching the electronic component processing film with individualized electronic components arranged on the electronic component processing film according to any one of claims 1 to 8.

10. 10. The method for processing electronic components according to claim 9, wherein after the step of stretching the electronic component processing film, processing of electronic components is carried out on the electronic component processing film.

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