Guide wire with a conductive element

Abstract

To provide an effective configuration of a guidewire in which one or more electrodes and / or sensors are incorporated along a length thereof.SOLUTION: Multiple approaches to incorporating multiple conductors on a guidewire 10 by building multiple conductor traces of variable sizes and material compositions on separate insulating layers are described. The approaches described in the invention facilitate ease of assembly of sensors to the guidewire or a catheter element. This approach is particularly useful in scenarios where electrical or mechanical properties of the device need to be altered in specific sections to either enhance device performance and reliability (e.g., selective abrasion resistance), or facilitate ease of assembly (e.g., soldering or connection ease), or in some instances achieve desired electrical characteristics (e.g., impedance).SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the benefit of the priority history of U.S. Patent Application No. 63 / 122,430, filed on December 7, 2020, with the United States Patent and Trademark Office. The entire disclosure of that application is incorporated herein by reference.

[0002] The present invention relates to a guide wire having sensors and a method and apparatus for assembling a guide wire having a plurality of sensors incorporated within or along the body of the guide wire. In particular, the present invention relates to a guide wire having a pressure sensor incorporated within or along the body of the guide wire, and a method and apparatus for assembling such a guide wire.

Background Art

[0003] A guide wire can have a number of sensors or sensor assemblies directly incorporated into the guide wire. A guide wire equipped with such sensors may be adapted to measure various physiological parameters within a patient's body. For example, the sensor typically has one or more cables passed through the guide wire to electrically couple the sensor element to an electronic assembly.

[0004] A guide wire generally consists of a hypodermic tube of a core wire that can extend through the length or a partial length of the guide wire and a coiled segment. The guide wire core is manufactured from stainless steel or nitinol, and the coiled segment may be manufactured from a wire or blade that provides flexibility, pushability, and kink resistance to the guide wire. Nitinol wire can be used by itself or in combination with stainless steel to increase flexibility and further assist the wire in returning to its shape.

[0005] Furthermore, the standard diameter of a guide wire is 0.014 inches, and as a result, accommodating certain sensors or having multiple sensors can be limited by the relatively small space provided by the guide wire. Additionally, guide wires are generally used to insert into blood vessels with very tortuous paths or to advance within blood vessels. Therefore, the guide wire and sensors or electrodes along the guide wire can be subject to relatively large stresses when the guide wire is pushed, pulled, or twisted on a path with numerous curves and bends.

[0006] A guide wire incorporating one or more electrodes along its length can pose additional challenges to the structure and use of the guide wire. For example, the presence of multiple electrodes along the guide wire may require additional conductive wiring that spans the length of the guide wire. Since the guide wire requires limited space and flexibility, the sensors and / or electrodes arranged along its length are preferably configured accordingly.

Summary of the Invention

Problems to be Solved by the Invention

[0007] As a result, there is a need for a guide wire design that provides an effective construction of a guide wire incorporating one or more electrodes and / or sensors along its length.

Means for Solving the Problems

[0008] The present disclosure provides a guide wire comprising a guide wire core, a first insulating layer provided on the surface of the guide wire core, a plurality of first conductive traces provided spaced apart in the lateral direction of the guide wire core, on the surface of the first insulating layer, and along the length direction of the guide wire core, and a plurality of connection portions provided at at least one of both ends in the length direction of the plurality of first conductive traces and electrically connected to electronic components. The ends of the plurality of first conductive traces provided with the plurality of connection portions are provided in parallel with respect to the length direction of the guide wire core, and the plurality of connection portions are arranged on a straight line parallel to the axis in the length direction of the guide wire core.

[0009] Furthermore, a second insulating layer covering the plurality of first conductive traces and the first insulating layer is provided, and the plurality of connection portions may be configured to include inner openings opened in the second insulating layer so as to reach the corresponding first conductive traces.

[0010] The end of at least one conductive trace may be formed to extend in the circumferential direction of the guide wire core such that it is positioned via a gap ahead in the length direction of the guide wire core than the end of another adjacent conductive trace.

[0011] A conductive band formed of a conductive material is disposed so as to cover at least a part of the inner opening of the connection portion, a conductive connection member is disposed in the inner opening, and the connection portion and the conductive band are electrically connected via the conductive connection member, and the conductive band and the conductive connection member may be formed of different conductive materials.

[0012] The plurality of conductive bands have outer openings penetrating in the thickness direction of the conductive band and overlapping with the inner openings, and the conductive connection members for electrically connecting the conductive bands and the connection portions may be provided inside the outer openings.

[0013] The outer opening and the inner opening may be arranged to overlap with a shift in the length direction of the guide wire core.

[0014] The area of the inner opening may be larger than the area of the outer opening.

[0015] The outer opening may be formed in a rectangular shape in a plan view.

[0016] The outer opening may be formed in a notch shape that is open at at least one end side of both end portions in the width direction of the conductive band in a plan view.

[0017] The outer opening may be formed in an inverted tapered shape that widens toward a side located at a position displaced in the width direction of the conductive band from a location where the outer opening opens at one end of both end portions in the width direction of the conductive band in a plan view.

[0018] The plurality of connection portions may be provided on the proximal end side of both end sides in the length direction of the plurality of first conductive traces.

[0019] The outer openings may be formed on both end sides in the width direction of the conductive band, respectively.

[0020] The conductive band and the conductive connection member may be formed of a conductive material.

[0021] The conductive connection member is an anisotropic conductive material in which a conductive path is formed in the thickness direction of the conductive band when pressure is applied from the thickness direction of the conductive band, and may be formed of the anisotropic conductive material that is more elastically deformable than solder.

[0022] The conductive band may include a conductive connection member made of an anisotropic conductive material provided so as to fill the inside of the outer opening and the inside of the inner opening and to cover the second insulating layer, and a C-shaped member provided outside the conductive connection member, the C-shaped member being formed of a conductive material.

[0023] A conductive band formed of a conductive material is disposed so as to cover at least a part of the inner opening of the connection portion, and the connection portion and the conductive band are electrically connected via a conductive connection member disposed in the inner opening. The conductive band and the conductive connection member may be integrally formed.

[0024] A conductive wire wound around the outer peripheral surface of the second insulating layer is disposed, and both ends of the conductive wire may be fixed to the first conductive trace through the inner opening.

[0025] In a region of the first conductive trace where one end of the conductive wire is fixed, a metal layer of gold or a gold alloy and a barrier metal layer for preventing diffusion of the metal layer into the conductive trace are formed, and the conductive wire may be formed of gold, a gold alloy, or aluminum.

[0026] The plurality of connection portions may be provided on the distal end side among both ends in the longitudinal direction of the plurality of first conductive traces.

[0027] Furthermore, a plurality of second conductive traces provided on the surface of the second insulating layer, a third insulating layer provided so as to cover the plurality of second conductive traces and the second insulating layer, and at least one of both ends in the longitudinal direction of the plurality of second conductive traces are arranged on a straight line parallel to the longitudinal axis of the guide wire core and are electrically connected to the electronic component. The plurality of second connection portions including a second inner opening opened in the third insulating layer so as to reach the corresponding second conductive trace, and a second conductive band formed in the circumferential direction of the guide wire core so as to cover at least one of the plurality of second connection portions. The second connection portion covered by the second conductive band and the second conductive band may be electrically connected via a conductive connection member provided in the second inner opening.

[0028] The plurality of connection portions are provided on the distal end side among both end sides in the longitudinal direction of the plurality of first conductive traces, and a conductive band formed of a conductive material is disposed so as to cover at least a part of the inner opening. The connection portion and the conductive band are electrically connected via a conductive connection member disposed within the inner opening. The conductive band may be electrically connected to a printed wiring board on which an electronic component is mounted via a conductive connection member for a substrate.

[0029] The printed wiring board has a flexible substrate portion located on the conductive band side and a rigid substrate portion located on the distal end side of the flexible substrate portion, and the electronic component may be provided on the rigid substrate portion.

[0030] A housing portion for housing and attaching an electronic component is formed in the rigid substrate portion, and the rigid substrate portion may be disposed on the distal end side of the guide wire core.

[0031] The plurality of first conductive traces may include at least one group of a plurality of first conductive traces having equal lengths.

[0032] The plurality of first conductive traces constituting the group may be formed as a point-symmetric pair.

[0033] At least one of the plurality of first conductive traces constituting the group may have a meandering portion so as to have the same length as the other first conductive traces of the group.

[0034] In one aspect of the present disclosure, a guide wire includes a guide wire core, a first insulating layer provided on the surface of the guide wire core, a plurality of first conductive traces provided on the surface of the first insulating layer at a distance in the lateral direction of the guide wire core and along the longitudinal direction of the guide wire core, a second insulating layer covering the plurality of first conductive traces and the first insulating layer, a plurality of connection portions provided on at least one of both ends in the longitudinal direction of the plurality of first conductive traces and electrically connected to an electronic component, the plurality of connection portions including inner openings opened in the second insulating layer so as to reach the corresponding first conductive traces, a conductive band formed circumferentially so as to cover the plurality of connection portions and the second insulating layer, an outer opening penetrating in the thickness direction of the plurality of conductive bands and disposed overlapping the inner opening, and a conductive connection member provided inside the outer opening and inside the inner opening and electrically connecting the conductive band and the connection portion.

[0035] The outer opening and the inner opening may be arranged to overlap with a shift in the longitudinal direction of the guide wire core.

[0036] The area of the inner opening may be larger than the area of the outer opening.

[0037] The outer opening may be formed in a rectangular shape in plan view.

[0038] The outer opening may be formed in a notch shape in plan view with an end side of the conductive band open.

[0039] The outer opening may be formed in an inverted tapered shape that widens toward a side at a position displaced in the width direction of the conductive band from a location where the outer opening opens at one of both ends in the width direction of the conductive band in plan view.

[0040] The outer openings may be formed on both end sides in the width direction of the conductive band, respectively.

[0041] The conductive band and the conductive connection member may be formed of a conductive material.

[0042] The conductive connection member may be formed of an anisotropic conductive material in which a conductive path is formed in the thickness direction of the conductive band when pressure is applied from the thickness direction of the conductive band.

[0043] Furthermore, a plurality of second conductive traces provided on the surface of the second insulating layer, a third insulating layer provided so as to cover the plurality of second conductive traces and the second insulating layer, and at least one of both ends in the length direction of the plurality of second conductive traces are arranged on a straight line parallel to the axis in the length direction of the guide wire core, and a plurality of second connection portions electrically connected to the electronic component, the plurality of second connection portions including second inner openings opened in the third insulating layer so as to reach the corresponding second conductive traces, and a second conductive band formed in the circumferential direction of the guide wire core so as to cover at least one of the plurality of second connection portions, and the second connection portion covered by the second conductive band and the second conductive band may be electrically connected via a conductive connection member provided in the second inner opening.

[0044] The plurality of first conductive traces includes at least one group of a plurality of first conductive traces having equal lengths.

[0045] The plurality of first conductive traces constituting the group may be formed as a point-symmetric pair.

[0046] At least one of the plurality of first conductive traces constituting the group may have a meandering portion so as to have the same length as the other first conductive traces of the group.

[0047] In yet another aspect of the present invention, a guide wire includes a guide wire core, a first insulating layer provided on the surface of the guide wire core, a plurality of first conductive traces spaced apart in the lateral direction of the guide wire core, provided on the surface of the first insulating layer, and along the length direction of the guide wire core, a second insulating layer covering the plurality of first conductive traces and the first insulating layer, and a plurality of connection portions provided on at least one of both ends in the length direction of the plurality of first conductive traces and including inner openings opened in the second insulating layer so as to reach the plurality of first conductive traces, and a conductive member formed to cover the first conductive traces and the second insulating layer via at least one of the plurality of connection portions, and when pressure is applied from the thickness direction, a conductive path is formed in the thickness direction.

[0048] Furthermore, an electronic component electrically connected to the plurality of connection portions is provided, and the electrical connection component as the electronic component has a plurality of pressing portions corresponding to the plurality of first conductive traces, and the electrical connection component and the plurality of first conductive traces may be electrically connected by pressing each pressing portion against the conductive member.

[0049] The conductive member may be formed of an anisotropic conductive material that is more elastically deformable than solder.

[0050] A conductive band covering the surface of the conductive member may be provided.

[0051] The present disclosure can also be applied to a long medical instrument including the guide wire having the above-described configuration.

[0052] In another aspect of the present disclosure, there is provided a method of manufacturing a guide wire, comprising the steps of: providing a guide wire core; forming a first insulating layer on the surface of the guide wire core; forming a plurality of first conductive traces provided along the length direction of the guide wire core on the surface of the first insulating layer; forming a plurality of connection portions on at least one of both ends in the length direction of the plurality of first conductive traces, the plurality of connection portions being arranged on a straight line parallel to the axis in the length direction of the guide wire core; disposing an electronic component on the distal side of the guide wire core; and electrically connecting the first conductive trace and the electronic component through the inner opening of the connection portion.

[0053] In another aspect of the present disclosure, there is provided a method of manufacturing a guide wire, comprising the steps of: providing a guide wire core; forming a first insulating layer on the surface of the guide wire core; forming a plurality of first conductive traces provided along the length direction of the guide wire core on the surface of the first insulating layer; forming a second insulating layer covering the plurality of first conductive traces and the first insulating layer; forming a plurality of connection portions on at least one of both ends in the length direction of the plurality of first conductive traces, the plurality of connection portions including inner openings opened in the second insulating layer so as to reach each of the plurality of first conductive traces; disposing a conductive band having an outer opening on the surface of the second insulating layer such that the outer opening and the inner opening overlap; forming a conductive connection member for electrically connecting the inside of the outer opening and the inside of the inner opening, the conductive connection member connecting the conductive band and the connection portion corresponding to the conductive band; disposing an electronic component on the distal side of the guide wire core; and electrically connecting the electronic component and the conductive band.

[0054] In yet another aspect of the present disclosure, there is provided a method of manufacturing a guide wire, comprising the steps of providing a guide wire core, forming a first insulating layer on a surface of the guide wire core, forming a plurality of first conductive traces provided along a length direction of the guide wire core on a surface of the first insulating layer, forming a second insulating layer covering the plurality of first conductive traces and the first insulating layer, forming a plurality of connection portions including inner openings opened in the second insulating layer so as to reach each of the plurality of first conductive traces at at least one of both ends in the length direction of the plurality of first conductive traces, forming a conductive member provided so as to cover the first conductive traces and the second insulating layer located inside the inner openings of the connection portions, the conductive member being configured to form a conductive path in a thickness direction when pressure is applied from a thickness direction, disposing an electronic component on a distal side of the guide wire core, and electrically connecting the electronic component and the conductive member.

[0055] A guide wire can incorporate a number of different sensors within or along the body of the guide wire. In certain particular variations, a pressure sensor having optionally one or more electrodes may be incorporated along the body of the guide wire or at the distal end of the guide wire. A guide wire having one or more electrodes directly integrated along the guide wire body may have a proximal coil attached to an electrode assembly having one or more electrodes and a distal coil attached to the distal end of the electrode assembly. The guide wire core may extend through the length of the guide wire assembly and may extend partially or completely through the electrode assembly.

[0056] One variation for assembling a guide wire assembly can generally include providing a core wire having a tapered distal portion, securing one or more conductive wires to the core wire by passing the core wire through a wire receiving channel defined through or along a sensor package, and then encapsulating the one or more conductive wires and the core wire.

[0057] An example of a method of forming a guide wire assembly can generally include providing a guide wire core, disposing an insulating layer on the surface of the guide wire core, and directly printing one or more conductive traces on the surface of the insulating layer.

[0058] Another example of a method of forming a guide wire assembly can generally include providing a guide wire core, disposing an insulating layer on the surface of the guide wire core, and disposing aerosolized conductive ink on the surface of the insulating layer to form one or more conductive traces.

[0059] Yet another example of a method of forming a guide wire assembly can generally include providing a guide wire core, disposing an insulating layer on the surface of the guide wire core, disposing a conductive layer on the surface of the insulating layer, and removing a portion of the conductive layer such that one or more conductive traces are formed on the insulating layer.

[0060] In one variation, when forming a guide wire assembly, the pressure sensor packaging may generally include a sensor casing that forms a cylindrical housing surrounding or supporting the components of a pressure sensor fixed therein. The sensor casing may define a detection window along the side of the casing, which exposes the internal pressure sensor to the fluid environment. The sensor core is fixed within the sensor casing and connected to a flex circuit extending from the proximal end of the sensor casing, and may be connected to a controller or processor via one or more conductive wires extending through the length of the guide wire. Conductive traces or wires along the flex circuit may be directly attached to one or more corresponding conductive wires extending proximally through the guide wire body for electrically connecting to the controller or processor.

[0061] Another variation includes a configuration where the flex circuit extends proximally from the sensor casing. Instead of being directly attached to one or more conductive wires, the flex circuit may be electrically connected to one or more conductive ring elements, which are in turn electrically connected to one or more conductive wires. The ring elements are arranged coaxially adjacent to each other, and the number of elements used may depend on the number of electrical connections required. One or more conductive wires may be selectively electrically coupled to specific pads or traces of the flex circuit such that each ring element is electrically connected to a single pad or trace. Each ring element may be electrically coupled to a selected conductive wire along the inner diameter of the ring element, and the remainder of the ring element may be electrically connected to another conductor or component as needed.

[0062] The sensor casing may define a longitudinal passage through the entire casing to allow passage of the guide wire core therethrough. The casing may further define a distal opening positioned and fixed such that the tip of the guide wire extends from the distal end of the casing, and the core of the guide wire extends longitudinally through the casing adjacent to or beneath the flex circuit, pressure sensor, and detection window. The sensor core is shown fixed within the casing adjacent to the flex circuit extending proximally from the casing.

[0063] In yet another variation for electrically coupling elements within or along the guide wire, the guide wire assembly may have conductive ink printed on a polymer substrate to form a subassembly for carrying signals from one end of the guide wire or catheter to the other. By using conductive traces directly on the device substrate and then insulating the traces with a dielectric material, the need for conductive wires, and associated processing and handling, can be eliminated.

[0064] A polymer layer (e.g., PET, PTFE, etc.) may be coated on the core of the guide wire via heat shrinkage to provide an insulating substrate. The polymer layer may be coated or laid over the entire guide wire core, or a portion of the distal end may be left uncoated to secure the pressure sensor assembly. Next, one or more conductive traces (e.g., nano silver, nano gold, nano copper, etc.) may be printed directly on the polymer layer such that the traces extend from one or more corresponding distal pads to one or more corresponding proximal pads.

[0065] Since these one or more conductive traces are printed directly on the polymer layer, they can be configured in a number of different patterns. Once one or more conductive traces are printed on the polymer layer, the traces may then be insulated. One variation for insulating the traces is to mask the ends of the traces that need to remain exposed to form pads for electrical connection and then deposit another polymer layer over the conductive traces. For example, another heat shrink tube or layer can be used, or a physical vapor deposition method or dip coating method can be used to deposit another polymer layer (PTFE, parylene, etc.) on the exposed conductive traces.

[0066] As yet another variation, a conductive coating can be applied on the dielectric layer by methods such as a bulk metallization process like physical vapor deposition (PVD), or by using electroplating, electroless plating, or printing a wider metal layer using conductive ink on top of a dielectric layer. Such a metal layer can provide an EM shield to remove or reduce noise and improve the system's SNR (Signal to Noise Ratio).

[0067] As another variation for insulating the trace, a dielectric polymer can be printed directly onto the conductive trace using a polymer ink. When printing directly onto the conductive trace using the polymer ink, the printing process can be used to selectively print the polymer ink to form the insulating layer while leaving a portion of the conductive trace exposed to form a conductive pad for electrical coupling to the component.

[0068] Regardless of which method is used, the resulting guide wire core and polymer layer may be coupled to the pressure sensor assembly. One or more ring elements may be electrically coupled to corresponding pads exposed along the flex circuit along a portion of their inner diameter, and a second portion along the one or more ring elements may be electrically coupled to corresponding pads of the conductive trace disposed on the polymer layer to electrically couple the pressure sensor assembly (or any other component). Next, the distal coil chip can be attached to the distal end of the sensor casing, and the polymer can be reflowed or molded over the guide wire core along the central portion, the distal coil or chip along the distal portion, and the remaining portion of the guide wire core along the proximal portion, as well as the portion between the electrodes (if utilized).

[0069] Another variation of the assembly method includes a polymer layer formed separately before being placed on the guide wire core. Conductive traces may be printed directly on the outer layer of the polymer, along with their corresponding exposed pads that extend along the length of the polymer layer. Similarly, the insulating layer may also be printed directly on the conductive traces. Using the pre-printed polymer layer, the guide wire core may be inserted into the polymer layer and adhered with any number of suitable adhesives, such as cyanoacrylate. Thereafter, the pressure sensor assembly may be fixed to the guide wire core and the flex circuit may be electrically coupled directly to the exposed pads of the attachment to complete the electrical connection. In another variation for printing the conductive traces, a polymer tube may be placed on the guide wire core and one or more conductive traces may be printed on the outer layer of the tube. Next, a circular ring may be printed on the polymer tube using conductive ink such that the ring coincides with the exposed area of the conductive trace, allowing the flex circuit and other components of the pressure sensor assembly to be electrically coupled to the conductive trace via the connection to the circular ring. Since the circular ring is printed circumferentially on the tube, the exposed areas may be offset longitudinally from each other such that the ring can be printed around the entire circumference of the tube. Also, there is preferably sufficient longitudinal spacing between the exposed areas such that the rings can be printed coaxially with each other without interference. In other variations, a partial circumferential ring rather than a full circumferential ring may be printed.

[0070] Yet another variant for creating a conductive trace may have a first insulating polymer layer (e.g., PARYLENE (Specialty Coating Systems, Inc., Indianapolis, IN), TEFLON (E. I. Du Pont De Nemours, Wilmington, DE), polyimide, etc.) disposed on the outer surface of the guide wire core. Next, a second conductive polymer layer having a conductive material (such as gold, silver, copper, etc.) may be coated on the first polymer layer using any number of processes such as electroless deposition, physical vapor deposition, etc. The thickness of the conductive layer varies depending on the application and is often determined considering both the electrical requirements (current-carrying capacity) and the mechanical requirements (such as rigidity) of the device. This second conductive layer may be separated into individual conductive elements using laser microfabrication, photochemical etching, etc.

[0071] Next, depending on the application, the entire assembly can be insulated using a dielectric insulating polymer in the form of either a coating or heat shrink (such as Teflon, PET, etc.). Depending on the application, a plurality of individual conductive elements can be formed. Also, depending on the application, various connection terminal sizes and shapes can be formed at both ends to facilitate connection with the formed individual conductive elements. With such a structural technique, since a plurality of individual conductive elements can be directly formed on the device, there is no need to remove material to accommodate individual conductive wires or to make the device hollow to accommodate conductive wires and elements. Therefore, the performance of the intended device is significantly improved and the manufacturing cost is reduced.

Brief Description of the Drawings

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DETAILED DESCRIPTION OF THE INVENTION

[0073] In the present disclosure, a conductive trace is formed on a guide wire core, and a plurality of electrical connection parts are respectively provided on both ends in the length direction of the conductive trace. The plurality of electrical connection parts are arranged linearly with respect to the axis in the length direction of the guide wire core. The fact that the plurality of electrical connection parts are arranged linearly includes not only the case where the plurality of electrical connection parts are accurately arranged side by side on one straight line, but also the case where the plurality of electrical connection parts are arranged along substantially the same straight line. The fact that the plurality of electrical connection parts are arranged along substantially the same straight line includes, for example, the case where the plurality of electrical connection parts are arranged along one direction within a predetermined rectangular range.

[0074] In the present disclosure, a plurality of conductive traces are electrically connected to at least one sensor provided on a guide wire via a plurality of electrical connectors. The sensor measures parameters such as the pressure, temperature, and flow rate of body tissue into which the guide wire is inserted. The sensor physically or chemically measures those parameters or other parameters. The signal measured by the sensor is output to a measuring device outside the guide wire via the conductive trace.

[0075] In the present disclosure, the guide wire is taken as an example of a long medical instrument for description. However, the present disclosure is not limited to the guide wire and can also be applied to catheters. The present disclosure is applicable to, for example, balloon catheters, micro catheters, heart catheters, pulmonary artery catheters, angiographic catheters, urethral catheters, gastrointestinal catheters, and the like.

[0076] It should be noted that the present disclosure includes various modifications in addition to the embodiments described below. A part of the configuration described in one embodiment may be replaced with the configuration described in another embodiment. The configuration of another embodiment may also be added to the configuration of one embodiment.

[0077] FIG. 1 shows the entire guide wire 10 with the sensor 52 attached to the conductive trace. FIG. 2 is a front view of the guide wire core 20 with the sensor 52 attached. The guide wire 10 includes, for example, a guide wire core 20 and a sensor assembly 50 provided on the tip side of the guide wire core 20. In the present disclosure, the proximal end side or the hand side of the guide wire 10 may be referred to as the proximal end side, and the distal end side of the guide wire 10 may be referred to as the distal end side. The guide wire core 20 is formed by assembling coil bodies 41 and 42 and each ring electrode 31 to the guide wire core 20 shown in FIG. 2. The coil bodies 41 and 42 are fixed to the small-diameter portion 202 of the guide wire core 20 using a fixing material. The tip chip 43 located at the tip of the guide wire core 20 is formed in a substantially hemispherical shape by a fixing member that fixes the tip of the small-diameter portion 202 of the guide wire core 20 and the tip of the coil body 42. As the fixing material, for example, a solder or an adhesive can be used.

[0078] The guide wire core 20 is formed of, for example, nitinol or stainless steel. The guide wire core 20 includes a large-diameter portion 201 on the hand side, a small-diameter portion 202 located on the tip side of the large-diameter portion 201, and a tapered portion 203 located between the large-diameter portion 201 and the small-diameter portion 202. A sensor attachment portion 2021 is formed on the distal end side of the small-diameter portion 202 as shown in FIG. 2. An external connection portion 204 is formed on the proximal end side of the large-diameter portion 201. A plurality of ring electrodes 31, which are an example of the conductive band 30, are provided on the external connection portion 204. The conductive band 30 will be described later. The ring electrode 31 is a component for electrically connecting the guide wire 10 to an external circuit (not shown).

[0079] The tapered portion 203 is formed such that the diameter gradually decreases so as to smoothly connect the distal end side of the large-diameter portion 201 to the proximal end side of the small-diameter portion 202. A plurality of coil bodies 41, 42 are provided on the outside of the small-diameter portion 202. The sensor assembly 50 is disposed between the proximal coil body 41 and the distal coil body 42. The coil bodies 41, 42 are formed of, for example, stainless steel, platinum (Pt), platinum-iridium alloy (Pt / Ir), or the like. As will be described later, the guide wire core 20 may include one coil body. Other arrangement examples of the sensor assembly 50 will be described later.

[0080] As will be described later, a plurality of conductive traces 22 are formed on the outside of the guide wire core 20, spaced apart in the side surface direction (SD direction in FIG. 1), from the sensor attachment portion 2021 to the external connection portion 204. A plurality of electrical connection portions 24, which will be described later with reference to FIG. 3, are provided at both the sensor attachment portion 2021 and the external connection portion 204 on the plurality of conductive traces 22. The side surface direction of the guide wire core 20 is, for example, the circumferential direction of the guide wire core 20 as shown as the SD direction in FIG. 1. The cross section of the guide wire core 20 is not limited to a circular shape, and may be an elliptical shape or a polygonal shape. It is called the side surface direction to clarify that the cross-sectional shape of the guide wire core 20 is not limited to a circular shape.

[0081] The "length direction of the guide wire core 20" means, for example, the direction of the central axis O1-O1 of the guide wire core 20 shown in FIG. 1. The central axis of the guide wire 10 and the central axis of the guide wire core 20 substantially coincide. Therefore, the length direction of the guide wire core 20 and the length direction of the guide wire 10 are substantially the same. The longitudinal sectional view is a sectional view along the length direction of the guide wire 10.

[0082] FIG. 3 is a longitudinal sectional view showing a state in which the conductive trace and the conductive band are electrically connected. The structure of FIG. 3 is applicable to either the distal end side or the proximal end side of the guide wire 10. The structure shown in FIG. 3 may be provided on both the distal end side and the proximal end side of the guide wire 10.

[0083] A first insulating layer 21 is provided on the surface of the guide wire core 20. A plurality of conductive traces 22 are formed on the surface of the first insulating layer 21 at intervals in the lateral direction of the guide wire core 20. A gap 28, which will be described later with reference to FIG. 6, is formed between adjacent conductive traces 22. The gap 28 is formed, for example, by etching a conductive layer formed on the surface of the first insulating layer 21 into a predetermined shape using a laser beam or the like. By controlling the output of the laser beam and / or the scanning locus and the like, a gap 28 having a desired width dimension can be formed. The gap 28 is usually filled with an insulating material. The gap 28 can also be referred to as an insulating interval segment.

[0084] A plurality of electrical connection portions 24 are provided at either or both of the distal end and the proximal end of each conductive trace 22. The electrical connection portions 24 on the distal end side of each conductive trace 22 are for electrically connecting to the sensor 52 via the printed wiring board 60. The electrical connection portions 24 on the proximal end side of each conductive trace 22 are for electrically connecting to an external device (not shown) such as a measuring device. Each electrical connection portion 24 includes an inner opening 231 and a conductive connection member 25. The inner opening 231 is an opening formed in the second insulating layer 23 so as to reach the conductive trace 22. The conductive connection member 25 electrically connects the conductive band 30 provided so as to cover at least a part of the inner opening 231 and the conductive trace 22. The conductive connection member 25 is provided inside the inner opening 231. In the example described later, the conductive connection member 25 is provided in the inner opening 231 and the outer opening 301 described in FIG. 10.

[0085] As will be described later with reference to FIG. 26, when the second conductive trace 26 is provided with the second insulating layer 23 interposed therebetween outside the conductive trace 22, an electrical connection portion 24 is formed by an opening being formed at a predetermined location of the third insulating layer 27 that covers the second conductive trace 26. In this case, as will be described later with reference to FIG. 21, a second inner opening 271 is formed at a predetermined location of the third insulating layer 27. Among the electrical connection portions 24M, the electrical connection portion 24M connected to the first conductive trace 22 is electrically connected to the first conductive trace 22 via a conductive connection member 25 provided at both the first inner opening 231 and the second inner opening 271. The electrical connection portion can also be referred to as an opening, i.e., a via hole, formed at a predetermined position of the insulating layer for making an electrical connection.

[0086] The conductive band 30 is formed in a cylindrical, annular, or C-shaped form from a conductive material. Each conductive band 30 may be formed in the same shape, or the width dimension of at least one of the conductive bands 30 may be made different from the width dimensions of the other conductive bands. The thickness dimension of at least one of the conductive bands 30 may be made different from the thickness dimensions of the other conductive bands 30.

[0087] The conductive band 30 is provided on the surface of the second insulating layer 23 corresponding to each electrical connection portion 24. Each conductive band 30 is provided so as to cover at least a part of the inner opening 231 of the electrical connection portion 24 corresponding thereto. Each conductive band 30 and the corresponding electrical connection portion 24 are electrically connected by a conductive connection member 25.

[0088] FIG. 3 shows an example in which a predetermined region on the inner peripheral surface of the conductive band 30 and the electrical connection portion 24 are electrically connected by a conductive connection member 25. That is, the conductive band 30 and the conductive connection member 25 are connected in a planar manner. More precisely, the conductive band 30 and the conductive connection member 25 are connected by a curved surface.

[0089] The conductive band 30 and the conductive connection member 25 may be formed from different conductive materials or the same conductive material. The conductive band 30 and the conductive connection member 25 may be formed as separate members or integrally formed. Examples of the conductive material include metallic materials having conductivity such as copper, silver, and gold, and conductive polymers. The conductive polymer is, for example, polypyrrole, polythiophene, polyacetylene, or polyaniline, but is not limited to these materials.

[0090] The guide wire core 20 can be formed from a conductive material. When the guide wire core 20 is formed from a conductive material such as stainless steel, the guide wire core 20 itself can be used as a ground electrode. A highly conductive metal layer (not shown) may be formed on the surface of the guide wire core 20. The highly conductive metal layer is not limited to metals such as copper, gold, and silver. The highly conductive metal layer may be formed from a conductive polymer. By forming the highly conductive metal layer 29 on the surface of the guide wire core 20, a return path can be ensured when the guide wire core 20 is used as a ground layer (GND). The guide wire core 20 alone can also be used as a ground electrode.

[0091] When the guide wire core 20 is not used as an electrical ground, any one of the plurality of conductive traces 22 can also be used as an electrical ground. The guide wire core 20 and any one of the conductive traces 22 can also be used as an electrical ground.

[0092] Figure 4 is a cross-sectional view taken along the arrow IV-IV direction in Figure 3. Figure 5 is a cross-sectional view taken along the arrow V-V direction in Figure 3. As described above, a first insulating layer 21 is formed over the entire circumference on the surface of the guide wire core 20. On the surface of the first insulating layer 21, a plurality of conductive traces 22 spaced apart in the side surface direction of the guide wire core 20 are formed. The second insulating layer 23 is formed so as to cover both the first insulating layer 21 and the plurality of conductive traces 22. The first insulating layer 21, the conductive traces 22, and the second insulating layer 23 are formed by a build-up method. The first insulating layer 21 and the second insulating layer 23 can use materials according to the characteristics required for the guide wire 10. The characteristics required for these insulating layers 21, 23 include, for example, electrical insulation, core adhesion, dielectric properties (low ε), heat resistance, sterilization resistance, scratch resistance, abrasion resistance, chemical resistance, good lubricity, waterproof and moisture resistance, rust prevention, adhesion to hydrophilic coating agents (hyaluronic acid, silicone, ···), etc.

[0093] The characteristics of the first insulating layer 21 and the second insulating layer 23 can also be made different. In one example, the first insulating layer 21 may be formed of a material having a lower dielectric constant than the second insulating layer 23. By reducing the dielectric constant of the first insulating layer 21, the parasitic capacitance between the conductive trace 22 and the guide wire core 20 can be reduced. That is, when the guide wire core 20 is used as an electrical wiring together with the conductive trace 22, the mutual capacitance between the conductive trace 22 and the guide wire core 20 tends to be much larger than the mutual capacitance generated between the conductive traces. When suppressing the increase in this mutual capacitance, it is effective to make the first insulating layer 21 sandwiched between the conductive trace 22 and the guide wire core 20 a dielectric material with a lower dielectric constant. In another example, the first insulating layer 21 may be formed of a material having a higher adhesion to the surface of the guide wire core 20 than the second insulating layer 23. In still another example, the second insulating layer 23 may be formed of a material having higher moisture resistance than the first insulating layer 21.

[0094] Examples of materials that can be used for the first insulating layer 21 and / or the second insulating layer 23 include, for example, epoxy resin, glass epoxy resin, bismaleimide triazine resin, BCB, polyimide, polyamide, polyamideimide, polyurethane, LCP (liquid crystal polymer), PE (polyethylene), PET (polyethylene terephthalate), PFA (perfluoroalkoxy fluororesin), PTFE (polytetrafluoroethylene), ETFE (copolymer of tetrafluoroethylene (C2F4) and ethylene (C2H4)), PEEK (polyetheretherketone), parylene resin, solder resist, and the like.

[0095] As an example, the first insulating layer 21 may be formed of polyimide, and the second insulating layer 23 may be formed of polyimide (filler-containing reinforced grade). As another example, the first insulating layer 21 may be formed of LCP, and the second insulating layer 23 may be formed of polyimide. As still another example, the first insulating layer 21 may be formed of LCP, and the second insulating layer 23 may be formed of PEEK. As yet another example, the first insulating layer 21 may be formed of polyimide, and the second insulating layer 23 may be formed of PTFE. As another example, the first insulating layer 21 may be formed of polyimide, and the second insulating layer 23 may be formed of parylene.

[0096] The width dimension and thickness dimension of each conductive trace 22 can be set according to the purpose of use of the conductive trace 22. The width dimension and thickness dimension of each conductive band 30 can be set according to the purpose of use of the conductive band 30.

[0097] FIG. 6 is a view of one end side in the longitudinal direction of the guide wire 10A as seen from above, showing the arrangement relationship among each conductive trace 22, each electrical connection part 24, and each conductive band 30. In FIG. 6, two conductive traces 22(1) and 22(2) are taken as examples for explanation, but the number of conductive traces 22 is not limited to two. The guide wire 10A can also include three or more conductive traces 22. The arrangement shown in FIG. 6 is applicable to at least one of both end sides in the longitudinal direction of the guide wire 10A, that is, at least one of the distal end side or the proximal end side of the guide wire. Here, the configuration on the distal end side of the guide wire 10A will be described. That is, the right side in FIG. 6 is the distal end side of the guide wire 10A. Here, in order to distinguish a plurality of conductive traces 22, a plurality of electrical connection parts 24, and a plurality of conductive bands 30, numbers (1) and (2) with parentheses are added to the reference numerals indicating these configurations.

[0098] The end 221(1) of one conductive trace 22(1) is formed in a linear (rectangular shape) extending toward the distal end side of the guide wire core 20. The end 221(2) of the other conductive trace 22(2) extends further toward the distal end side of the guide wire core 20 than the end 221(1) of the conductive trace 22(1) and bends approximately 90 degrees toward the conductive trace 22(1). Thereby, the distal end side of the conductive trace 22(2) is formed in a substantially L shape as a whole.

[0099] The trace width TW11 of the conductive trace 22(1) and the trace width TW12 (trace width TW12 in the longitudinal direction) other than the end 221(2) of the conductive trace 22(2) are set to be substantially the same (TW11 = TW12). The trace width TW2 of the end 221(2) of the conductive trace 22(2) can be made wider than the trace width TW12 in the longitudinal direction (TW2 > TW12). The end 221(2) having a width TW2 wider than the trace width TW12 in the longitudinal direction can be called, for example, a flag portion. Alternatively, the end 221(2) can also be called a large area portion or a land portion. The naming methods such as the flag portion and the large area portion are the same for the other ends 221.

[0100] The ends 221(1) and 221(2) of the plurality of conductive traces 22(1) and 22(2) are provided in parallel with respect to the longitudinal direction of the guide wire core 20. An electrical connection portion 24(1) is provided at the end 221(1) of one conductive trace 22(1). An electrical connection portion 24(2) is provided at the end 221(2) of the other conductive trace 22(2). A line O2 passing through the centers of the plurality of electrical connection portions 24(1) and 24(2) is substantially parallel to the axis O1 in the longitudinal direction of the guide wire core 20. Each of the electrical connection portions 24(1) and 24(2) does not have to be exactly located on the line O2 and may be arranged slightly deviated in the circumferential direction (the minor axis direction of the guide wire core) of the guide wire core 20. In other words, the electrical connection portions 24(1) and 24(2) may be arranged within a predetermined range considering manufacturing tolerances and the like. Alternatively, the central position (center of gravity position) of the electrical connection portion 24(1) provided on one conductive trace 22(1) may exist within the range where the width dimension W1 of the conductive trace 22(1) overlaps with the circumferential width dimension W2 of the end 221(2) of the other conductive trace 22(2).

[0101] The dimension L1 from the distal end of the end 221(1) of the conductive trace 22(1) to the proximal end of the end 221(2) of the conductive trace 22(2) can be made larger than the dimension L2 of the gap 28 in the circumferential direction (SD direction) between the conductive trace 22(1) and the conductive trace 22(2). The dimension L1 and the dimension L2 may be made substantially equal, or the dimension L1 may be made shorter than the dimension L2. Examples in which three or more electrical connection portions 24 are arranged on the axis O1 in the longitudinal direction of the guide wire core 20 will be described later.

[0102] Conductive bands 30(1) and 30(2) are provided on the respective electrical connection portions 24(1) and 24(2). The electrical connection portion 24(1) electrically connects the conductive trace 22(1) and the conductive band 30(1) via a conductive connection member 25 (not shown in FIG. 6). The electrical connection portion 24(2) electrically connects the conductive trace 22(2) and the conductive band 30(2) via a conductive connection member 25 (also not shown in FIG. 6).

[0103] FIG. 7 is a modification of FIG. 5. The conductive band 30A of the guide wire 10AA may be formed in a C-shaped cross section having a gap 30A1 in the circumferential direction. For example, the conductive band 30A having a C-shaped cross section can be attached to the guide wire core 20 by covering and caulking it from the outside of the second insulating layer 23.

[0104] The relationship among the plurality of conductive traces 22, the plurality of electrical connection portions 24, and the plurality of conductive bands 30 will be described with reference to FIGS. 8A to 8C and FIG. 9. FIGS. 8A to 8C and FIG. 9 are diagrams in which the circumferential surface of the guide wire is developed into a plane so that the arrangement relationship of the conductive traces 22, the electrical connection portions 24, etc. can be understood. In FIGS. 8A to 8C and FIG. 9, in order to distinguish each conductive trace 22 and each electrical connection portion 24, numerals with parentheses are added. In FIGS. 8A to 8C and FIG. 9, the illustration of the guide wire core 20 and the insulating layers 21, 23 is omitted, and the arrangement of each conductive trace 22, each electrical connection portion 24, and each conductive band 30 is schematically shown. In the following drawings, in order to distinguish the configuration described in other embodiments, capital alphabets added to the reference numeral of the guide wire are also added to the conductive trace 22, the electrical connection portion 24, etc.

[0105] In FIG. 8A, as an example of a plurality of conductive traces, three conductive traces 22B(1) to 22B(3) are shown. The conductive trace 22B(2) located in the center of the figure is formed in a straight line and has no flag portion. On the other hand, flag portions 221B(1) and 221B(3) extending onto a straight line O2 where the end of the conductive trace 22B(2) is located are formed at the distal ends of the conductive traces 22B(1) and 22B(3) that are spaced apart in the circumferential direction of the guide wire core 20 so as to sandwich the conductive trace 22B(2). No flag portion is formed on the proximal ends of each of the conductive traces 22B(1) to 22B(3).

[0106] In the conductive trace 22B(1) on the upper side in the figure, an electrical connection portion 24B(1) is provided at the distal end side end portion 221B(1), and an electrical connection portion 24B(4) is provided at the proximal end side. In the conductive trace 22B(2) in the center of the figure, an electrical connection portion 24B(2) is provided at the distal end side, and an electrical connection portion 24B(5) is provided at the proximal end side. In the conductive trace 22B(3) on the lower side in the figure, an electrical connection portion 24B(3) is provided at the distal end side end portion 221B(3), and an electrical connection portion 24B(6) is provided at the proximal end side.

[0107] Conductive bands 30B are respectively provided at each of the electrical connection portions 24B(1) to 24B(6). Thereby, the conductive traces 22B(1) to 22B(6) are electrically connected to the corresponding conductive bands 30B via the electrical connection portions 24B(1) to 24B(6). The distal end sides of the conductive traces 22B(1) to 22B(6) are electrically connected to a sensor 52 (not shown here) via the conductive bands 30B. The proximal end sides of the conductive traces 22B(1) to 22B(6) are electrically connected to an external device (not shown) via the conductive bands 30B. This description is similarly applicable to the examples shown in FIGS. 8B, 8C, and 9.

[0108] In the guide wire 10B shown in FIG. 8A, the plurality of electrical connection portions 24B(1) to 24B(3) on the distal end side are arranged on a line O3 parallel to the axis O1 (not shown) in the length direction of the guide wire core 20 (not shown). The plurality of electrical connection portions 24B(4) to 24B(6) on the proximal end side are arranged along the circumferential direction SD of the guide wire core 20 (which can also be called the side surface direction SD). Thus, only the electrical connection portions 24B(1) to 24B(3) on the distal end side among the plurality of first conductive traces 22B(1) to 22B(3) may be arranged along the straight line O3.

[0109] The guide wire 10C shown in FIG. 8B has three conductive traces 22C(1) to 22C(3) as an example of a plurality of conductive traces. The conductive trace 22C(2) located in the center of the figure is formed in a straight line and no flag portion is provided. Flag portions 221C(1) and 221C(3) extending onto a straight line O4 where the ends of the conductive trace 22C(2) are located are formed on the proximal end side and the distal end side of the conductive traces 22C(1) and 22C(3) that are spaced apart in the circumferential direction of the guide wire core 20 so as to sandwich the conductive trace 22C(2). That is, flag portions 221C(1) and 221C(3) that bend at a right angle and extend toward the central conductive trace 22C(2) are formed on the proximal end side and the distal end side of the conductive traces 22C(1) and 22C(3). When the conductive trace 22C(2) is arranged parallel to the axis O1 in the length direction of the guide wire core 20, the straight line O4 connecting the centers of both ends in the length direction of the conductive trace 22C(2) becomes a line substantially parallel to the axis O1 in the length direction of the guide wire core 20.

[0110] In the conductive trace 22C(1), an electrical connection portion 24C(1) is provided at the distal end side end portion 221C(1), and an electrical connection portion 24C(4) is provided at the proximal end side. In the conductive trace 22C(2), an electrical connection portion 24C(2) is provided at the distal end side, and an electrical connection portion 24C(5) is provided at the proximal end side. In the conductive trace 22C(3), an electrical connection portion 24C(3) is provided at the distal end side end portion 221C(3), and an electrical connection portion 24C(6) is provided at the proximal end side end portion 221C(6).

[0111] In the guide wire 10C shown in FIG. 8B, the plurality of electrical connection portions 24C(1) to 24C(3) located on the distal end side and the plurality of electrical connection portions 24C(4) to 24C(6) located on the proximal end side are arranged on a straight line O4 substantially parallel to the axis O1 in the length direction of the guide wire core 20.

[0112] The guide wire 10D shown in FIG. 8C also has three conductive traces 22D(1) to 22D(3) as an example of a plurality of conductive traces. The conductive trace 22D(2) is formed in a straight line and no flag portion is provided. At the distal end sides of the conductive traces 22D(1) and 22D(3) that are spaced apart in the circumferential direction of the guide wire core 20 so as to sandwich the conductive trace 22D(2), flag portions 221D(1) and 221D(3) that extend onto a straight line O5 where the end of the conductive trace 22D(2) is located are formed. At the proximal end sides of the conductive traces 22D(1) and 22D(3), flag portions 221D(4) and 221D(6) that extend onto the straight line O5 where the end of the conductive trace 22D(2) is located are formed. The straight line O5 is a line connecting the centers of both ends in the length direction of the conductive trace 22D(2) located at the center in the circumferential direction of the guide wire 10D. When the conductive trace 22D(2) is arranged parallel to the axis O1 in the length direction of the guide wire core 20, the straight line O5 becomes a line substantially parallel to the axis O1.

[0113] Comparing the guide wire 10D shown in FIG. 8C with the guide wire 10C described in FIG. 8B, the length dimensions of the conductive traces 22D(1) and 22D(3) are different from the length dimensions of the conductive traces 22C(1) and 22C(3). In the example of FIG. 8B, both ends 221C(3) and 221C(6) of the conductive trace 22C(3) are located outside the length direction of the guide wire core 20 compared to both ends 221C(1) and 221C(4) of the conductive trace 22C(1). That is, the length dimension of the conductive trace 22C(3) is larger than the length dimension of the conductive trace 22C(1). In contrast, in the example of FIG. 8C, the length dimensions of the conductive trace 22D(1) and the conductive trace 22D(3) are substantially the same.

[0114] In the example of FIG. 8B, the distal end portion 221C(3) of the conductive trace 22C(3) is located at the most distal end side in the longitudinal direction of the guide wire core, and the proximal end portion 221C(6) of the conductive trace 22C(3) is located at the proximal end side in the longitudinal direction of the guide wire core. The conductive trace 22C(2) is formed with the shortest length dimension. The distal end portion 221C(1) of the conductive trace 22C(1) is located between the distal end portion 221C(3) of the conductive trace 22C(3) and the distal end portion of the conductive trace 22C(2). The proximal end portion 221C(4) of the conductive trace 22C(1) is located between the proximal end portion 221C(6) of the conductive trace 22C(3) and the proximal end portion of the conductive trace 22C(2).

[0115] In contrast, in the example of FIG. 8C, on the distal end side of the guide wire core 20, the distal end portion 221D(3) of the conductive trace 22D(3) is located at the most distal end side in the longitudinal direction of the guide wire core 20. Closer to the proximal end side than the distal end portion 221D(3), the distal end portion 221D(1) of the conductive trace 22D(1) is located. Closer to the proximal end side than the distal end portion 221D(1), the distal end side of the conductive trace 22D(2) is located. On the proximal end side of the guide wire core, the proximal end portion 221D(6) of the conductive trace 22D(1) is located at the most proximal end side in the longitudinal direction of the guide wire core 20. Closer to the distal end side than the proximal end portion 221D(6), the proximal end portion 221D(4) of the conductive trace 22D(3) is located. Closer to the distal end side than the proximal end portion 221D(4), the proximal end portion of the conductive trace 22D(2) is located.

[0116] As shown in FIG. 8C, by making the length dimensions (wiring lengths) of the conductive trace 22D(1) and the conductive trace 22D(3) substantially equal, a wiring pair for differential signals can be obtained. Examples of the equal-length wiring pair will be further described later.

[0117] As shown in FIG. 9, the distal ends of the conductive traces 22E(1) to 22E(3) may be bent at an angle other than a right angle. In the guide wire 10E of FIG. 9, the electrical connection portions 24E(1) to 24E(3) at the distal ends of the respective conductive traces 22E(1) to 22E(3) are located on a line O6 that is substantially parallel to the axis O1 in the length direction of the guide wire core 20 (not shown). The distal ends of the conductive traces 22E(1) and 22E(2) spaced apart from the line O6 in the circumferential direction (SD direction) extend obliquely toward the line O6.

[0118] The conductive trace 22E(3) is located on the line O6 and is formed in a linear (rectangular shape). An electrical connection portion 24E(3) is provided at the distal end side of the conductive trace 22E(3), and an electrical connection portion 24E(6) is provided at the proximal end side of the conductive trace 22E(3).

[0119] The conductive trace 22E(2) is formed to be spaced apart from the conductive trace 22E(3) in the circumferential direction of the guide wire core 20. The distal end side of the conductive trace 22E(2) extends to a position intersecting the line O6 further toward the distal end side of the guide wire core 20 than the distal end of the conductive trace 22E(3). An electrical connection portion 24E(2) is provided at the distal end side of the conductive trace 22E(2), and an electrical connection portion 24E(5) is provided at the proximal end side of the conductive trace 22E(2).

[0120] The conductive trace 22E(1) is formed to be spaced apart from the conductive trace 22E(2) in the circumferential direction of the guide wire core 20. The distal end side of the conductive trace 22E(1) extends to a position intersecting the line O6 further toward the distal end side of the guide wire core 20 than the distal end of the conductive trace 22E(2). An electrical connection portion 24E(1) is provided at the distal end side of the conductive trace 22E(1). An electrical connection portion 24E(4) is provided at the proximal end side of the conductive trace 22E(1).

[0121] Each of the electrical connection parts 24E(1) to 24E(6) is provided with a conductive band 30E. Each of the conductive traces 22E(1) to 22E(6) is electrically connected to the corresponding conductive band 30E by a conductive connection member 25 (not shown) provided at the corresponding electrical connection part 24E(1) to 24E(6).

[0122] FIG. 10 is a plan view showing a state in which a plurality of electrical connection parts 24F and a plurality of conductive bands 30F are electrically connected. FIG. 10 shows the proximal end side of the guide wire 10F (the proximal end side of the guide wire core 20).

[0123] The conductive band 30F is formed in a cylindrical shape, an annular shape, or a substantially C-shaped. In the following description, the width direction of the conductive band is the direction along the axis O1 in the length direction of the guide wire core when the conductive band is attached to the guide wire core. Therefore, both end portions in the width direction of the conductive band 30F are the end portion on the proximal end side of the guide wire core 20 and the end portion on the distal end side of the guide wire core 20.

[0124] An outer opening 301F is formed at the end portion on the distal end side among both end portions in the width direction (the length direction of the guide wire) of the conductive band 30F. The outer opening 301F is formed by notching the end portion on the distal end side among both end portions in the width direction of the conductive band 30F in a rectangular shape. The outer opening 301F is formed in a rectangular shape with its distal end side open. The outer opening 301F can also be called a notch portion 301F.

[0125] The outer opening 301F of the conductive band 30F is attached to the guide wire core 20 so as to partially overlap with the first inner opening 231F opened in the second insulating layer 23 (not shown). A conductive connecting member 25F such as solder is filled from the outer opening 301F into the inner opening 231F, whereby the conductive band 30F and the conductive trace 22 (not shown in FIG. 10) are electrically and mechanically connected. That is, the conductive band 30F is adhered or fixed to the conductive trace 22 and electrically connected to the conductive trace 22 by the conductive connecting member 25F provided inside the outer opening 301F and inside the first inner opening 231F.

[0126] The state of attaching the conductive band 30F shown in FIG. 10 to the guide wire core 20 will be described with reference to FIGS. 11A to 11D.

[0127] FIG. 11A is a plan view of the guide wire core 20. A rectangular first inner opening 231F is formed at a predetermined position of the second insulating layer 23. Since the first inner opening 231F is formed in a rectangular tube shape so as to reach the surface of the first conductive trace 22, a part of the conductive trace 22 is exposed inside the first inner opening 231F.

[0128] FIG. 11B is a plan view of one conductive band 30F. As described above, the distal end side of both ends in the width direction of the conductive band 30F is cut in a rectangular shape, and the outer opening 301F is formed.

[0129] FIG. 11C shows a state in which the conductive band 30F shown in FIG. 11B is attached to the guide wire core 20 shown in FIG. 11A. The conductive band 30F is attached to the outside of the guide wire core 20 so that the outer opening 301F overlaps with the proximal end side of the first inner opening 231F. The outer opening 301F can be attached to the guide wire core 20 so as to overlap, for example, approximately half of the area of the first inner opening 231F.

[0130] FIG. 11D shows a state in which a conductive connection member 25F such as solder is injected into the inside of the outer opening 301F and the inside of the first inner opening 231F to electrically and mechanically connect the conductive band 30F and the conductive trace 22. When the conductive band 30F is formed of a metal material and the conductive connection member 25F is formed of a metal material such as solder, the area where the metal forming the conductive band 30F and the metal forming the conductive connection member 25F are joined can be widened. Thereby, the reliability of the electrical and mechanical connection between the conductive band 30F and the conductive trace 22 can be improved.

[0131] As shown in FIG. 12, the opening dimension L5 of the outer opening 301FF of the conductive band 30FF can also be set to be slightly smaller than the opening dimension L6 of the first inner opening 231FF. The opening dimensions L5 and L6 are the lengths in the circumferential direction (SD direction) of the openings 301FF and 231FF. The outer opening 301FF can be attached to the guide wire core 20 so as to overlap at least approximately half of the area of the first inner opening 231FF.

[0132] In the guide wire 10G shown in FIG. 13, outer openings 301G with one side in the direction of the axis O1 open are formed on both ends in the width direction of the conductive band 30G. The first inner opening 231G is formed longer than the width dimension L7 of the conductive band 30G. The conductive band 30G is attached to the guide wire core 20 so as to be positioned approximately at the center of the first inner opening 231G. A conductive connection member 25 (not shown) such as solder is filled from the inside of the outer openings 301G on both sides in the width direction of the conductive band 30G toward the inside of the first inner opening 231G.

[0133] The example shown in FIG. 13 can widen the area where the conductive band 30G and the conductive connection member 25 are in contact as compared with the examples shown in FIG. 11 or FIG. 12. For this reason, in the guide wire 10G shown in FIG. 13, when both the conductive band 30G and the conductive connection member 25 are formed of a conductive metal material, the reliability of the electrical and mechanical connection between the conductive band 30G and the conductive trace 22 can be further improved.

[0134] In the guide wire 10H shown in FIG. 14, outer openings 301H that are notched in a substantially trapezoidal shape are formed on both sides in the width direction of the conductive band 30H. The first inner opening 231H is formed longer than the width dimension L8 of the conductive band 30H.

[0135] The outer opening 301H is formed in a trapezoidal shape that widens as it goes from a location 3011 where it opens at one end in the width direction of the conductive band 30H in a plan view to a side 3012 that is displaced in the width direction of the conductive band 30H. The outer opening 301H may be expressed as being formed in an inverted taper shape. The inverted taper shape means a shape in which the opening width WH gradually increases as it goes from the opening location 3011 toward the center side in the width direction of the conductive band 30H. Conversely, each outer opening 301H is formed in a tapered shape in which the opening width WH gradually decreases as it goes from the side 3012 located closer to the center in the width direction of the conductive band 30H to the end (opening location 3011) of the conductive band 30H.

[0136] By forming the outer openings 301H on both sides in the width direction of the conductive band 30H, as described in the example of FIG. 13, the electrical and mechanical connection between the conductive band 30H and the conductive trace 22 is enhanced in reliability. Further, since the outer openings 301H are formed in an inverted taper shape or a substantially trapezoidal shape, they have sides 3013 that are inclined with respect to the axis O1 in the length direction of the guide wire core 20. Therefore, in a plan view, the conductive band 30H can include not only the side 3012 that is orthogonal to the axis O1 but also the sides 3013, 3013 that intersect the axis O1 at an angle other than 90 degrees. As a result, the conductive band 30H is electrically and mechanically connected to the conductive trace 22 by the conductive connection member 25 from a plurality of directions with different angles. Therefore, when the guide wire 10H is inserted into and moved in a body tissue such as a blood vessel, it is possible to suppress displacement of the position of the conductive band 30H.

[0137] In the guide wire 10J shown in FIGS. 15 to 17, the area of the outer opening 301J is larger than the area of the first inner opening 231J. A rectangular outer opening 301J is formed at approximately the center of the conductive band 30J. For example, the center of the outer opening 301J is approximately at the center in the width direction (axis O1 direction) of the conductive band 30J and is located approximately at the center in the circumferential direction (SD direction) of the conductive band 30J. However, the outer opening 301J may be provided at a location deviated from the center of the conductive band 30J. A plurality of outer openings 301J may be formed in the conductive band 30J.

[0138] FIG. 16 is a longitudinal sectional view of the example of FIG. 15. The width dimension (dimension in the axis O1 direction) of the outer opening 301J is longer than the width dimension of the first inner opening 231J. Conductive connection members 25J such as solder are provided inside the outer opening 301J and inside the first inner opening 231J.

[0139] FIG. 17 is a plan view seen from the direction of the arrow in FIG. 16. As described above, the area of the outer opening 301J is larger than the area of the first inner opening 231J. In other words, the outer opening 301J is formed in a rectangular shape larger than the first inner opening 231J. For example, the shape of the outer opening 301J and the shape of the first inner opening 231J are similar. However, even when the shape of the outer opening 301J and the shape of the first inner opening 231J are not similar, it is included in the scope of the present disclosure. For example, the aspect ratio of the outer opening 301J and the aspect ratio of the first inner opening 231J may be different. Further, the shape of the outer opening 301J and the shape of the first inner opening 231J may be different. For example, the outer opening 301J may be rectangular and the first inner opening 231J may be triangular, or the outer opening 301J may be elliptical and the first inner opening 231J may be circular. Combinations of other shapes are also included in the scope of the present disclosure.

[0140] In the guide wire 10K shown in FIGS. 18 and 19, the area of the first inner opening 231K is larger than the area of the outer opening 301K. Thereby, the area where the conductive connection member 25K contacts the conductive trace 22 can be made larger than in the example of FIG. 16. Therefore, the reliability of the electrical and mechanical connection between the conductive band 30K and the conductive trace 22 can be improved. The outer opening 301K and the first inner opening 231K may have similar shapes or different shapes.

[0141] FIG. 19 is a plan view seen from the direction of the arrow in FIG. 18. The center of the outer opening 301K and the center of the first inner opening 231K coincide. The outer opening 301K and the first inner opening 231K have similar shapes. However, a configuration in which the center of the outer opening 301K and the center of the first inner opening 231K are offset is also included in the scope of the present disclosure.

[0142] After electrically connecting the conductive band 30K and the conductive trace 22 with solder, a conductive paste, or the like, the conductive band 30K can also be mechanically connected to the guide wire core 20 by applying or filling an adhesive on the outer periphery of the conductive band 30K and within the outer opening 301K. Similarly to the other examples described above, the conductive band and the conductive trace 22 of the guide wire 20 may be electrically connected by a conductive material, and the conductive band and the guide wire 20 may be mechanically connected by a non-conductive material. Alternatively, as described above, a material having both conductivity and adhesiveness such as solder may be used to electrically and mechanically connect the conductive band and the guide wire core 20.

[0143] FIG. 20 is a cross-sectional view of a guide wire 10L showing an example in which an anisotropic conductive material is used as the conductive connection member. An anisotropic conductive layer 251 formed of an anisotropic conductive material is provided between the second insulating layer 23 and the conductive band 30L. The electrical connection portion 24L is composed of the first inner opening 231 and the layer 251 of the anisotropic conductive material that has entered the first inner opening 231.

[0144] Apply or attach an anisotropic conductive material to the surface of the second insulating layer and the inside of the first inner opening 231, cover the outside of the anisotropic conductive material with the conductive band 30L, and crimp or thermocompression bond it, so that the conductive band 30L can be electrically connected to the conductive trace 22 and mechanically attached to the guide wire core 20. Thereby, after electrically connecting the conductive band 30L and the conductive trace 22, the conductive band 30L can be more reliably electrically and mechanically connected to the guide wire core 20 compared to the case where the adhesive is filled and fixed from the outside of the conductive band 30L.

[0145] Examples of the anisotropic conductive material include ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), and ACR (Anisotropic Conductive Rubber). ACF is a sealing resin formed by dispersing conductive particles in a thermosetting epoxy resin. ACP is formed in a paste shape by dispersing conductive particles in a thermosetting epoxy resin.

[0146] When the layer 251 is formed from ACF or ACP, when the conductive band 30L is covered with the layer 251 and thermocompression bonded, an anisotropic conductive path is formed. The conductive path becomes a semi-permanent path, and the conduction state is maintained even if the conductive band 30L is removed. Thereby, reliable adhesion between the conductive band 30L and the polyimide constituting the insulating layer and strength improvement can be realized. On the other hand, ACR conducts only when pressure is applied and loses conduction when the pressure is removed.

[0147] By providing an anisotropic conductive layer 251 between the conductive band 30L, the insulating layer 23, and the conductive trace 22, the conductive band 30L can be electrically and mechanically connected to the insulating layer 23 and the conductive trace 22, and the electrical and mechanical connection can be made durable. For example, when the conductive band 30L and the conductive trace 22 are connected by solder or a conductive adhesive, cracks may occur due to mechanical stress applied from the outside. By constructing the electrical connection portion 24L using a flexible anisotropic conductive layer 251, flexibility can be imparted to the electrical connection portion 24L. Even if a crack temporarily occurs in the electrical connection portion 24L, the crack will be naturally eliminated by the flexible anisotropic conductive layer 251. Therefore, even when external stress is applied, the electrical connection between the conductive band 30L and the conductive trace 22 can be maintained, enhancing the reliability of the guide wire 10L.

[0148] FIG. 21 is a longitudinal sectional view showing the distal end side of the guide wire 10M having a plurality of layers of conductive traces 22, 26. FIG. 22 is a longitudinal sectional view showing the proximal end side of the guide wire 10M having a plurality of layers of conductive traces 22, 26.

[0149] In the guide wire 10M, a plurality of conductive trace layers are formed on the guide wire core 20 in a build-up manner. The first conductive trace layer is a conductive layer on which the first conductive trace 22 is formed. The second conductive trace layer is a conductive layer on which the second conductive trace 26 is formed. Different sensors (not shown) can be connected to each of the conductive traces 22, 26 via different printed wiring boards.

[0150] The surface of the second conductive trace layer is covered with a third insulating layer 27. A second inner opening 271 is formed at a predetermined location of the third insulating layer 27. The electrical connection portion 24M(2) of the second conductive trace layer is composed of the second inner opening 271 and a conductive connection member 25. The electrical connection portion 24M(1) of the first conductive trace layer is composed of the first inner opening 231, the second inner opening 271, and a conductive connection member 25. Each of the electrical connection portions 24M(1) and 24M(2) is electrically and mechanically connected to a corresponding conductive band 30 by the conductive connection member 25. As the conductive connection member 25, for example, solder, a conductive adhesive, an ACF, an ACP, etc. can be used.

[0151] FIG. 23 shows the distal end side of the guide wire 10N before the printed wiring board 60 on which the sensor 52 is mounted is attached to the conductive band 30N formed from the conductive wire 32. The conductive wire 32 is a fine-diameter wire or ribbon wire formed from a conductive metal material such as gold, silver, copper, or a gold alloy. The conductive wire 32 is wound around the guide wire core 20 from above the insulating layer 23 by a so-called wire bonding method and fixed to the conductive trace 22, whereby the conductive band 30N is formed. That is, the conductive wire 32 is wound around the guide wire core 20 from above the insulating layer 23 at the position of the first inner opening 231, and both ends of the conductive wire 32 are adhered and fixed to the conductive trace 22 within the first inner opening 231, whereby the conductive band 30N can be obtained.

[0152] The conductive wire 32 is electrically and mechanically connected to the end portion 221 (not shown in FIG. 23) of the conductive trace 22. The end portion 221 formed in a flag shape can be formed as a metal multilayer film in which gold or an alloy of nickel and gold is plated on the surface of a copper-plated conductive trace, for example. The conductive wire 32 can be formed from gold, a gold alloy, aluminum, etc. Since gold or a gold alloy is electrochemically stable, forming the conductive wire 32 from gold or a gold alloy can suppress the occurrence of ion movement between adjacent conductive bands 30N.

[0153] A sensor 52 is mounted on the distal end side of the printed wiring board 60. A plurality of pads 611 are provided on the proximal end side of the printed wiring board 60 corresponding to the conductive band 30N. Each pad 611 is electrically connected to the terminal of the sensor 52 via a wiring pattern (both not shown). By fixing each pad 611 to the corresponding conductive band 30N with solder or a conductive adhesive, etc., the conductive trace 22 and the sensor 52 are electrically connected.

[0154] FIG. 24 shows the distal end side of the guide wire 10P. In FIG. 24, the sensor 52 is attached using the conductive band 30 and the printed wiring board 60 on the distal end side of the guide wire core 20. FIG. 24 is a view of the guide wire 10P seen from the side direction.

[0155] A plurality of conductive traces 22P are formed at intervals in the circumferential direction (SD direction or side direction) of the guide wire core 20. An electrical connection portion 24P is formed on each conductive trace 22P. Each conductive trace 22P is electrically connected to the conductive band 30 via the electrical connection portion 24P. The positions of the respective electrical connection portions 24P are spaced apart in the circumferential direction and the axis O1 direction of the guide wire core 20. Each electrical connection portion 24P is electrically connected to the conductive band 30 respectively. For this reason, the printed wiring board 60 can be electrically connected to the electrical connection portion 24P regardless of the position of the electrical connection portion 24P. The pad (not shown in FIG. 24) of the printed wiring board 60 is electrically and mechanically connected to the conductive band 30 via a conductive connection member 612 such as solder.

[0156] FIG. 25 shows the sensor portion of the guide wire 10Q, and illustration of the configuration on the guide wire core side is omitted. The printed wiring board 60Q has a flexible board portion 61 and a rigid board portion 62, and a sensor 52 is mounted on the rigid board portion 62. The printed wiring board 60Q used in the guide wire 10Q includes a flexible board portion 61 located on the proximal end side and a rigid board portion 62 provided on the distal end side of the flexible board portion 61. Pads 611 corresponding to the respective conductive bands 30 (not shown in FIG. 25) are formed on the surface of both sides of the flexible board portion 61 facing the guide wire core 20 (not shown in FIG. 25). The surface facing the guide wire core 20 is the downward-facing surface in FIG. 25. Among the plurality of surfaces of the rigid board portion 62, a connection portion 621 connected to other conductive bands (all not shown) provided on the thin diameter portion 202 of the guide wire core 20 is formed on the surface facing the guide wire core 20.

[0157] FIG. 26 shows an example in which a plurality of sensors 52R1 and 52R2 are accommodated in the rigid board portion 62R. The printed wiring board 60R used in the guide wire 10R includes a flexible board portion 61 and a rigid board portion 62R. A plurality of sensor accommodating portions 622R1 and 622R2 are formed in the rigid board portion 62R. The sensors 52R1 and 52R2 are attached to the sensor accommodating portions 622R1 and 622R2. The rigid board portion 62R having the sensor accommodating portions 622R1 and 622R2 realizes the function as a sensor housing. In FIG. 26, an example in which a plurality of sensors 52R1 and 52R2 are accommodated in the rigid board portion 62R is shown. Instead of this, only one of the sensors 52R1 and 52R2 may be accommodated in the rigid board portion 62R. Three or more sensors may be accommodated in the rigid board portion 62R. The rigid board portion 62R may accommodate a sensor and electronic components other than the sensor. Examples of the electronic components other than the sensor include a signal processing circuit and a transmission / reception circuit. Each first conductive trace 22R is electrically connected to the corresponding conductive band 30 via the electrical connection portion 24R.

[0158] FIG. 27 shows an example in which conductive bands 30S1 and 30S2 are provided corresponding to the layers of the respective conductive traces 22S and 26S. FIG. 27 shows the distal end side of the guide wire 10S. A plurality of first conductive traces 22S are formed to extend to the distal end side of the guide wire core 20. Each first conductive trace 22S is electrically connected to the first printed wiring board 60S1 via the conductive band 30S1. The first printed wiring board 60S1 is mounted with a first sensor 52S1.

[0159] A second conductive trace 26S provided outside the first conductive trace 22S is formed to extend such that its tip reaches a position closer to the proximal end side than the distal end side of the first conductive trace 22S. Each second conductive trace 26S is electrically connected to the second printed wiring board 60S2 via the conductive band 30S2. The second printed wiring board 60S2 is mounted with a second sensor 52S2. In this way, the printed wiring boards can be connected via the conductive bands for each layer of the conductive traces. [[ID=S]]

[0160] In the guide wire 10T shown in FIG. 28, an example in which one printed wiring board is connected to a plurality of layers of conductive traces is shown. The printed wiring board 60T1 is electrically connected to the first conductive trace 22T via the conductive band 30T(1) and is also electrically connected to the second conductive trace 26T via the conductive band 30T(5). Although illustration is omitted, wiring patterns connected to the first conductive trace 22T and wiring patterns connected to the second conductive trace 26T are formed on the first printed wiring board 60T1.

[0161] The second printed wiring board 60T2 is electrically connected to the first conductive trace 22T via the conductive band 30T(2) and is also electrically connected to a plurality of second conductive traces 26T via the conductive bands 30T(3) and 30T(4). Although illustration is omitted, wiring patterns connected to the first conductive trace 22T and wiring patterns connected to the second conductive trace 26T are formed on the second printed wiring board 60T2.

[0162] FIG. 29 shows an example in which a flexible substrate including a flexible substrate portion and a rigid substrate portion is used when conductive bands are associated with respective conductive trace layers. The printed wiring board 60T1 used for the guide wire 10T1 includes a flexible substrate portion 61T and a rigid substrate portion 62T. The flexible substrate portion 61T is electrically connected to a plurality of second conductive traces 26T via conductive bands 30T1(3), 30T1(4), 30T1(5). The rigid substrate portion 62T is electrically connected to a plurality of first conductive traces 22T via conductive bands 30T1(1), 30T1(2).

[0163] Inside the rigid substrate portion 62T, a plurality of wiring patterns (not shown) are formed, and the first conductive trace 22T and the sensor 52T are electrically connected via those wiring patterns. A plurality of wiring patterns (not shown) are also formed in the flexible substrate portion 61T, and the second conductive trace 26T and the sensor 52T are electrically connected via those wiring patterns.

[0164] Examples of the arrangement of the conductive trace and the electrical connection portion and the conductive band (which may be a ring electrode) on the proximal end side of the guide wire will be described with reference to FIGS. 30 to 32. In the guide wire 10U shown in FIG. 30, conductive traces 22U(1) and 22U(3) are arranged so as to sandwich a conductive trace 22U(2) located at the center in the circumferential direction (SD direction) of a guide wire core 20 (not shown) from both sides in the circumferential direction. An end 221U(1) of the conductive trace 22U(1) and an end 221U(3) of the conductive trace 22U(3) are formed to bend substantially at a right angle toward the center in the circumferential direction of the guide wire core 20 so as to be located on the proximal end side of the guide wire core 20 with respect to the proximal end of the conductive trace 22U(2).

[0165] Each conductive band 30 is attached to the surface of the second insulating layer 23 on the guide wire core so as to cover a part of the corresponding electrical connection part 24U. That is, a part of the first inner opening 231U of each electrical connection part 24U is exposed and not hidden by the conductive band 30.

[0166] In the guide wire 10U1 shown in FIG. 31, each electrical connection part 24U1 is arranged side by side on the straight line O7. The straight line O7 is a line parallel to the longitudinal axis O1 of the guide wire 20. Both ends of the first inner opening 231U1 of each electrical connection part 24U1 in the width direction are exposed from the conductive band 30. The width direction of the first inner opening 231U1 is the direction of the axis O1.

[0167] The width dimension of the first inner opening 231U1 is set longer than the width dimension of the conductive band 30. And the conductive band 30 is attached onto a second insulating layer (both not shown in the figure) covering the guide wire core 20 such that the center of the conductive band 30 and the center in the width direction of the first inner opening 231U1 substantially coincide. Therefore, both ends of the first inner opening 231U1 protrude from the conductive band 30. The conductive traces 22U1(1) to 22U1(4) are electrically connected to the conductive band 30 via the corresponding electrical connection parts 24U1.

[0168] In the guide wire 10U2 shown in FIG. 32, one electrical connection part 24U2L and 24U2R is provided on each side in the width direction of each conductive band 30. The electrical connection part 24U2L on the proximal end side is exposed from the proximal end side of the two ends in the width direction of the conductive band 30. The electrical connection part 24U2R on the distal end side is exposed from the distal end side of the two ends in the width direction of the conductive band 30. That is, each conductive band 30 is attached onto a second insulating layer (both shown omitted in the figure) covering the guide wire core 20 such that the corresponding electrical connection parts 24U2L and 24U2R partially protrude. The conductive traces 22U2(1) to 22U2(4) are electrically connected to the conductive band 30 via the corresponding electrical connection parts 24U2L and 24U2R.

[0169] FIG. 33 shows an example of the arrangement of the conductive traces 22V. In the guide wire 10V, a plurality of first conductive traces 22V(1) to 22V(4) are formed at intervals in the circumferential direction (SD direction). The first conductive trace 22V(1) is the shortest, and the first conductive trace 22V(2) is longer than the first conductive trace 22V(1). The first conductive trace 22V(3) is longer than the first conductive trace 22V(2). The first conductive trace 22V(4) is the longest. As shown in FIG. 33, the lengths of the first conductive traces 22V(1) to 22V(4) can be made different from each other. Electrical connection portions 24V are provided on both end sides of each of the first conductive traces 22V(1) to 22V(4).

[0170] FIG. 34 shows an example in which a plurality of first conductive traces 22V1(1) to 22V1(4) include at least one group of first conductive traces having equal lengths. In the guide wire 10V1 of FIG. 34, a first group of the first conductive trace 22V1(1) and the first conductive trace 22V1(4), and a second group of the first conductive trace 22V1(2) and the first conductive trace 22V1(3) are shown. The first group and the second group are groups composed of conductive traces having equal wiring lengths, and can also be called equal-length wiring pairs. A pair of conductive traces having equal wiring lengths can be used, for example, as wiring for differential signals.

[0171] The first conductive trace 22V1(1) and the first conductive trace 22V1(4) constituting the first group are a point-symmetric pair. The first conductive trace 22V1(2) and the first conductive trace 22V1(3) constituting the second group are also a point-symmetric pair. That is, when one of the first conductive traces belonging to the same group is rotated 180 degrees about its center of gravity, it overlaps with the other first trace belonging to the same group. Therefore, the lengths of the first conductive traces belonging to the same group are equal.

[0172] Both ends of each of the first conductive traces 22V1(1) to 22V1(4) are provided with electrical connection portions 24V1. Each of the first conductive traces 22V1(1) to 22V1(4) is electrically connected to the conductive band 30 via the corresponding electrical connection portion 24V1.

[0173] FIG. 35 shows an example in which at least one of the first conductive traces belonging to the same group has a meandering portion 221V so as to have the same length as the other conductive traces. In the guide wire 10V2 of FIG. 35, a plurality of first conductive traces 22V2(1) to 22V2(4) have the same length and belong to the same group. Both ends of each of the conductive traces 22V2(1) to 22V2(4) are provided with electrical connection portions 24V2.

[0174] Both ends of the first conductive trace 22V2(1) are located on the innermost side in the direction of the axis O1 as compared with both ends of the other first conductive traces 22V2(2) to 22V2(4), and both ends of the first conductive trace 22V2(2) are located outside the first conductive trace 22V2(1) in the direction of the axis O1. Both ends of the first conductive trace 22V2(3) are located outside the first conductive trace 22V2(2) in the direction of the axis O1. Both ends of the first conductive trace 22V2(4) are located outside the first conductive trace 22V2(3) in the direction of the axis O1. Therefore, when the middle of each of the conductive traces 22V2(1) to 22V2(4) shown in FIG. 35 is a simple rectangular shape, it is the same as the example described in FIG. 33.

[0175] However, a part of the plurality of first conductive traces shown in FIG. 35 includes a meandering portion 221V2. That is, among the plurality of first conductive traces, some of the first conductive traces 22V2(1) to 22V2(3) have meandering portions 221V2(1) to 221V2(3) formed at substantially the middle portion in their longitudinal directions. The meandering portion 221V2 can also be called a meander wiring. Since both ends of the first conductive trace 22V2(4) are located at the outermost sides in the direction of the axis O1, the meandering portion 221V2 is not provided. The other first conductive traces 22V2(1) to 22V2(3) whose both ends are located inside the both ends of the first conductive trace 22V2(4) are provided with meandering portions 221V2(1) to 221V2(3) so as to have the same length as the first conductive trace 22V2(4) that does not have a meandering portion.

[0176] Meandering portions 221V2 may be provided on all of the first conductive traces 22V2(1) to 22V2(4) so that all of the first conductive traces 22V2(1) to 22V2(4) have the same length. In FIG. 35, a meandering portion 221V2 that bends at a right angle is shown, but the meandering portion 221V2 can also be formed to bend smoothly.

[0177]

[0232] In the guide wire 10W of FIG. 36, the first conductive trace 22 and the conductive band 30W are connected via an anisotropic conductive material layer 251. The anisotropic conductive material is, for example, ACR. Other materials may be used. For example, the anisotropic conductive material layer 251 is provided so as to cover the entire surface of the relatively large-area end portion 221 (flag portion) of the first conductive trace 22.

[0178] Examples of using the anisotropic conductive material layer 251X instead of the electrical connection part and the conductive band will be described with reference to FIGS. 37 to 39. As the anisotropic conductive material, for example, ACR is used. FIG. 37 shows the proximal end side of the guide wire 10X. When using the guide wire 10X, the proximal end side of the guide wire 10X is attached to the connector member 100. The connector member 100 is a member for electrically connecting an external device (not shown) such as a measuring device or a control device and the guide wire 10X. The connector member 100 includes a bottom portion 104, a clip portion 101 rotatably attached to the bottom portion 104, a plurality of pressing pins 102 provided so as to protrude from the inner surface side of the clip portion 101, and wirings 103 connected to the respective pressing pins 102. Each pressing pin 102 is provided corresponding to the conductive trace 22.

[0179] The proximal end of the guide wire 10X is inserted into the connector member 100 so as to abut against the bottom portion 104 of the connector member 100. Thereafter, when the clip portion 101 sandwiches the guide wire 10X, the pressing pins 102 provided on the inner surface side of the clip portion 101 press a predetermined portion of the anisotropic conductive material layer 251X. When the anisotropic conductive layer 251X is pressed from the radial direction by the pressing pins 102, a conductive path connecting from the pressing pins 102 to the conductive trace 22 is formed. Thereby, a sensor (not shown) on the distal end side of the guide wire 10X and an external device are electrically connected via the conductive trace 22 and the connector member 100.

[0180] FIG. 38 is a cross-sectional view taken in the direction XXXVIII shown in FIG. 37. The anisotropic conductive material layer 251X is provided so as to fill the inside of the first inner opening 231 formed in the second insulating layer 23 corresponding to the end portion 221 of the first conductive trace 22. In FIG. 38, the illustration of the wiring 103 is omitted.

[0181] FIG. 39 is a perspective view showing an outline of the connector member 100.

[0182] A plurality of approaches for incorporating multiple conductors into a guide wire are described by constructing multiple conductor traces of various sizes and material compositions on separate insulating layers. The approaches described in the present invention facilitate the assembly of sensors onto guide wires or catheter elements. This approach can modify the electrical or mechanical characteristics of the device at specific parts to enhance the performance and reliability of the device (e.g., selective abrasion resistance), facilitate assembly (e.g., ease of soldering or connection), or in some scenarios, achieve desired electrical characteristics (e.g., impedance). To incorporate such desired characteristics into the device, an innovative approach is needed to form signal lines in a narrow space without affecting the main mechanical performance of the device.

[0183] It is difficult to incorporate conductive elements into the core of a typical 0.014 - inch guide wire without affecting desired mechanical properties such as followability and torque response. Using a layered manufacturing method as described in patent application 63 / 090,487 (described herein), it is possible to form conductive elements directly on the core to maintain the basic mechanical performance of the guide wire device. However, it is very difficult to incorporate more conductive elements, for example, four or more conductive elements, into the core of a guide wire with a diameter of 0.014 inches or less. There may be cases where it is necessary to incorporate two or more types of sensors into one device, or cases where it is necessary to incorporate sensors that require four or more independent communication channels, and in such cases, it may be beneficial to have four or more different signal - transmitting elements in one device. To achieve this, the following layered approach is effective. Note that the present disclosure is applicable not only to the 0.014 - inch guide wire core 20 but also to guide wires of other common diameter dimensions 10.

[0184] A typical guide wire core 20 is shown in Fig. 40A. It has multiple diameters and tapers, and the diameter at the distal end of the device is usually smaller than other parts of the device. The core material is generally stainless steel (SS), nitinol, or a combination thereof.

[0185] As shown in Fig. 40B, an insulating layer 21 is formed on the metal core 20. The insulating layer 21 can be formed by various methods such as dip coating, spray coating, PVD (Physical Vapor Depostion), CVD (Chemical Vapor Deposition), printing, melt flow, etc. Polymers include polyimide, PET, nylon, Pebax, etc.

[0186] Next, as shown in Fig. 40C, a conductive layer is formed on the insulating layer 21. One method is to first apply a seed conductive layer such as palladium or silver, and then apply a layer of highly conductive metal such as copper or gold using electroless plating or electroplating.

[0187] After that, the conductive layer is selectively etched to form electrically insulated individual conductive elements 22. One way to achieve this is to use a laser to cut the conductor to form individual traces.

[0188] Substrates that need to incorporate conductive elements often do not have a constant dimensional profile. For example, a typical core of a coronary guide wire is polished so that the distal end tapers towards a smaller outer diameter, reducing the rigidity of the device and making it more trackable and intact when the distal end crosses a blood vessel. In the prior art, it has been described to embed conductive elements such as flat wire ribbons in a polymer insulating layer (US 10791991 B1). This method has the limitation that it is difficult to vary the conductor profile over the entire length of the device (from 180 cm to 300 cm).

[0189] Furthermore, at the distal end that must be electrically connected to the sensor, it is necessary to form or laminate a conductive band in the opening of the insulator in order to connect to the embedded conductor. Figures 41 to 43 below illustrate this problem. Since the exposed portions are radially separated, they cannot normally be connected to sensor pads that are usually in one plane. Therefore, an additional process is required to form a conductive band for connecting the sensor to the trace. Figure 42 is a front view seen in the direction of the arrow in Figure 41.

[0190] As is clear from Figures 41 and 42, since the openings D1, D2, D3 are radially separated, it is not possible to connect the sensor pads S1, S2, S3 and the embedded conductors C1, C2, C3 through the exposed portions D1, D2, D3. By forming conductive bands CB1, CB2, CB3 on the exposed portions, the connection of the sensor becomes easier (Figure 43).

[0191] As an approach to reducing the above problems, as shown in Figure 40B, there is a method of applying a conductive layer on the insulating layer so that the conductive layer follows the contour of the substrate. As described above, as shown in Figure 40D, individual conductive traces can be formed, for example, by laser ablation. In this method, as shown in Figures 44 to 46, by controlling the ablation pattern, "flags" can be formed at the distal end and the proximal end.

[0192] Furthermore, in this approach, the trace width can be varied along the length of the device. Therefore, at the distal end where the length of the core wire is significantly shortened, the trace width can be significantly reduced. This method is characterized by a high degree of processing freedom compared to other methods of embedding conductors in insulating materials. Furthermore, by changing the conductive material itself at specific positions in the length direction, desired characteristics can be imparted. For example, the conductive trace can be made of copper over its entire length and gold-plated at both ends to enhance electrical connectivity.

[0193] Subsequently, as shown in Fig. 47, a second insulating layer is applied onto the electrically insulated conductor. Examples of insulating polymers include polyimide, PET, nylon, Pebax, etc. In this method, a different insulating layer from the first base insulating layer can be provided to impart different properties. For example, to improve the abrasion resistance of the coating, the insulating layer can be impregnated with nano-sized silica.

[0194] Next, as shown in Fig. 48, openings are provided in the second insulating layer 23 and the third insulating layer 27 by methods such as etching or laser ablation to form vias for accessing the corresponding conductive traces directly beneath the insulating layers. These vias form connection pads for connecting or coupling the formed conductive elements to the outside of the guide wire, and are appropriately connected to, for example, one or more sensors at the distal end of the guide wire or connection terminals at the proximal end.

[0195] As can be seen, all vias or exposed surfaces on the external insulator for accessing the formed conductive elements are, unlike Fig. 41, all on one longitudinal axis, and can thus be easily connected directly to the sensor pads or via flex circuit elements. (Appendix 1) A guide wire core, A first insulating layer provided on the surface of the guide wire core, A plurality of first conductive traces provided on the surface of the first insulating layer and spaced apart in the lateral direction of the guide wire core and along the length direction of the guide wire core, each of the plurality of first conductive traces having a distal end and a proximal end, A plurality of connection portions provided at at least one of both ends in the length direction of the plurality of first conductive traces and electrically connected to electronic components, The ends of the plurality of first conductive traces provided with the plurality of connection portions are provided to be parallel to the length direction of the guide wire core, The plurality of connection portions are arranged on a straight line parallel to the axis in the longitudinal direction of the guide wire core. Among the distal ends of the plurality of first conductive traces, the most proximal distal end and the most distal proximal end of the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the axis in the longitudinal direction of the guide wire core. Guide wire. (Appendix 2) Furthermore, a second insulating layer covering the plurality of first conductive traces and the first insulating layer is provided. The plurality of connection portions are configured to include inner openings opened in the second insulating layer so as to reach the corresponding first conductive traces. The guide wire according to Appendix 1. (Appendix 3) The end of the at least one conductive trace is formed to extend in the circumferential direction of the guide wire core so as to be positioned via a gap ahead in the longitudinal direction of the guide wire core than the end of the other adjacent conductive trace. The guide wire according to Appendix 2. (Appendix 4) A conductive band formed of a conductive material is arranged so as to cover at least a part of the inner opening of the connection portion. A conductive connection member is arranged in the inner opening. The connection portion and the conductive band are electrically connected via the conductive connection member, and the conductive band and the conductive connection member are formed of different conductive materials. The guide wire according to Appendix 2. (Appendix 5) The plurality of conductive bands have outer openings that penetrate in the thickness direction of the conductive band and overlap with the inner openings. Inside the outer opening, the conductive connection member that electrically connects the conductive band and the connection portion is provided. The guide wire according to Appendix 4. (Appendix 6) The outer opening and the inner opening are arranged so as to be offset and overlap in the longitudinal direction of the guide wire core. The guide wire according to Supplementary Note 5. (Supplementary Note 7) The area of the inner opening is larger than the area of the outer opening. The guide wire according to Supplementary Note 6. (Supplementary Note 8) The outer opening is formed in a rectangular shape in plan view. The guide wire according to Supplementary Note 7. (Supplementary Note 9) The outer opening is formed in a notch shape in plan view, with at least one end side of both ends of the conductive band open. The guide wire according to Supplementary Note 5. (Supplementary Note 10) The outer opening is formed in an inverted taper shape that widens as it extends toward a side at a position displaced in the width direction of the conductive band from a location where it opens at one end of both ends in the width direction of the conductive band in plan view. The guide wire according to Supplementary Note 5. (Supplementary Note 11) The plurality of connection portions are provided on the proximal end side of both ends in the longitudinal direction of the plurality of first conductive traces. The guide wire according to Supplementary Note 5. (Supplementary Note 12) The outer openings are respectively formed on both end sides in the width direction of the conductive band. The guide wire according to Supplementary Note 8. (Supplementary Note 13) The conductive band and the conductive connection member are formed of a conductive material. The guide wire according to Supplementary Note 5. (Supplementary Note 14) The conductive connection member is an anisotropic conductive material in which a conductive path is formed in the thickness direction of the conductive band when pressure is applied from the thickness direction of the conductive band, and is formed of the anisotropic conductive material that is more elastically deformable than solder. The guide wire according to Supplementary Note 5. (Supplementary Note 15) The conductive band is a conductive connection member made of an anisotropic conductive material provided so as to fill the inside of the outer opening and the inside of the inner opening and to cover the second insulating layer, and a C-shaped member provided outside the conductive connection member, the C-shaped member being formed of a conductive material. The guide wire according to Supplementary Note 5. (Supplementary Note 16) A conductive band formed of a conductive material is disposed so as to cover at least a part of the inner opening of the connection portion, and the connection portion and the conductive band are electrically connected via a conductive connection member disposed in the inner opening. The conductive band and the conductive connection member are integrally formed. The guide wire according to Supplementary Note 2. (Supplementary Note 17) A conductive wire wound around the outer peripheral surface of the second insulating layer is disposed, and both ends of the conductive wire are fixed to the first conductive trace via the inner opening. The guide wire according to Supplementary Note 2. (Supplementary Note 18) In a region of the first conductive trace where one end of the conductive wire is fixed, a metal layer of gold or a gold alloy and a barrier metal layer for preventing diffusion of the metal layer into the conductive trace are formed. The conductive wire is formed of gold, a gold alloy, or aluminum. The guide wire according to Supplementary Note 17. (Supplementary Note 19) The plurality of connection portions are provided on the distal end side of both ends in the longitudinal direction of the plurality of first conductive traces. The guide wire according to Supplementary Note 17. (Supplementary Note 20) Furthermore, a plurality of second conductive traces provided on the surface of the second insulating layer, a third insulating layer provided so as to cover the plurality of second conductive traces and the second insulating layer, A plurality of second connection portions that are arranged on a straight line parallel to the axis in the longitudinal direction of the guide wire core at at least one of both end sides in the longitudinal direction of the plurality of second conductive traces and are electrically connected to the electronic component, the plurality of second connection portions being configured to include second inner openings opened in the third insulating layer so as to reach the corresponding second conductive traces, A second conductive band formed in the circumferential direction of the guide wire core so as to cover at least one of the plurality of second connection portions, The second connection portion covered by the second conductive band and the second conductive band are electrically connected via a conductive connection member provided in the second inner opening. The guide wire according to Supplementary Note 2. (Supplementary Note 21) The plurality of connection portions are provided on the distal end side of both end sides in the longitudinal direction of the plurality of first conductive traces, A conductive band formed of a conductive material is disposed so as to cover at least a part of the inner opening, and the connection portion and the conductive band are electrically connected via a conductive connection member disposed in the inner opening. The conductive band is electrically connected to the printed wiring board on which the electronic component is mounted via a conductive connection member for the substrate. The guide wire according to Supplementary Note 2. (Supplementary Note 22) The printed wiring board has a flexible board portion located on the conductive band side and a rigid board portion located on the distal end side of the flexible board portion, The electronic component is provided on the rigid board portion. The guide wire according to Supplementary Note 21. (Supplementary Note 23) A housing portion for housing and attaching the electronic component is formed in the rigid board portion, and the rigid board portion is disposed on the distal end side of the guide wire core. The guide wire according to Supplementary Note 22. (Supplementary Note 24) The plurality of first conductive traces includes at least one group of a plurality of first conductive traces having equal lengths with each other. The guide wire according to Appendix 1. (Appendix 25) The plurality of first conductive traces constituting the group are formed as a point-symmetric pair. The guide wire according to Appendix 24. (Appendix 26) At least one of the plurality of first conductive traces constituting the group has a meandering portion so as to have the same length as the other first conductive traces of the group. The guide wire according to Appendix 24. (Appendix 27) A guide wire core, A first insulating layer provided on the surface of the guide wire core, A plurality of first conductive traces provided on the surface of the first insulating layer and spaced apart in the lateral direction of the guide wire core and along the longitudinal direction of the guide wire core, each of the plurality of first conductive traces having a distal end and a proximal end, A second insulating layer covering the plurality of first conductive traces and the first insulating layer, A plurality of connection portions provided on at least one of both ends in the longitudinal direction of the plurality of first conductive traces and electrically connected to an electronic component, the plurality of connection portions including inner openings opened in the second insulating layer so as to reach corresponding first conductive traces, A conductive band formed circumferentially so as to cover the plurality of connection portions and the second insulating layer, An outer opening penetrating in the thickness direction of the plurality of conductive bands and arranged to overlap the inner opening, A conductive connection member provided inside the outer opening and inside the inner opening and electrically connecting the conductive band and the connection portion, Among the distal ends of the plurality of first conductive traces, between the most proximal distal end and the most distal proximal end of the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the longitudinal axis of the guide wire core. Guide wire. (Appendix 28) The outer opening and the inner opening are arranged offset and overlapping in the longitudinal direction of the guide wire core. The guide wire according to Appendix 27. (Appendix 29) The area of the inner opening is larger than the area of the outer opening. The guide wire according to Appendix 28. (Appendix 30) The outer opening is formed in a rectangular shape in plan view. The guide wire according to Appendix 27. (Appendix 31) The outer opening is formed in a notch shape with the end side of the conductive band open in plan view. The guide wire according to Appendix 27. (Appendix 32) The outer opening is formed in an inverted taper shape in plan view, where the width dimension of the end side of the conductive band is narrow and the width dimension widens as it progresses in the width direction of the conductive band. The guide wire according to Appendix 27. (Appendix 33) The outer opening is formed on both end sides in the width direction of the conductive band. The guide wire according to Appendix 29. (Appendix 34) [[ID=z42]]The conductive band and the conductive connection member are formed of a conductive metal material. The guide wire according to Appendix 29. [[ID=^45]] (Appendix 35) The conductive connection member is formed of an anisotropic conductive material in which a conductive path is formed in the thickness direction of the conductive band when pressure is applied from the thickness direction of the conductive band. The guide wire according to Appendix 29. It should be noted that there seems to be an error in the original text where "z42" and "^45" are used instead of proper tags. This translation is based on the best understanding of the provided content.(Appendix 36) Furthermore, a plurality of second conductive traces provided on the surface of the second insulating layer; a third insulating layer provided so as to cover the plurality of second conductive traces and the second insulating layer; a plurality of second connection parts disposed on a straight line parallel to the longitudinal axis of the guide wire core at at least one of both ends in the longitudinal direction of the plurality of second conductive traces and electrically connected to electronic components, the plurality of second connection parts including second inner openings opened in the third insulating layer so as to reach corresponding second conductive traces; a second conductive band formed in the circumferential direction of the guide wire core so as to cover at least one of the plurality of second connection parts; the second connection part covered by the second conductive band and the second conductive band are electrically connected via a conductive connection member provided in the second inner opening; The guide wire according to Appendix 29. (Appendix 37) The plurality of first conductive traces include at least one group of a plurality of first conductive traces having equal lengths. The guide wire according to Appendix 29. (Appendix 38) The plurality of first conductive traces constituting the group are formed as a point-symmetric pair. The guide wire according to Appendix 37. (Appendix 39) At least one of the plurality of first conductive traces constituting the group has a meandering portion so as to have the same length as the other first conductive traces of the group. The guide wire according to Appendix 37. (Appendix 40) A guide wire core; a first insulating layer provided on the surface of the guide wire core; A plurality of first conductive traces provided on the surface of the first insulating layer at a distance in the side surface direction of the guide wire core and along the length direction of the guide wire core, each of the plurality of first conductive traces having a distal end and a proximal end; A second insulating layer covering the plurality of first conductive traces and the first insulating layer; A plurality of connection portions provided on at least one of both end sides in the length direction of the plurality of first conductive traces and including inner openings opened in the second insulating layer so as to reach the plurality of first conductive traces; A conductive member formed to cover the first conductive traces and the second insulating layer via at least one of the plurality of connection portions, and when pressure is applied from the thickness direction, a conductive path is formed in the thickness direction; Between the most proximal distal end among the distal ends of the plurality of first conductive traces and the most distal proximal end among the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the axis in the length direction of the guide wire core. A guide wire. (Appendix 41) Further comprising an electronic component electrically connected to the plurality of connection portions; The electrical connection component as the electronic component has a plurality of pressing portions corresponding to the plurality of first conductive traces, and by pressing each pressing portion against the conductive member, the electrical connection component and the plurality of first conductive traces are electrically connected. The guide wire according to Appendix 40. (Appendix 42) The conductive member is formed of an anisotropic conductive material that is more elastically deformable than solder. The guide wire according to Appendix 40. (Appendix 43) Comprising a conductive band covering the surface of the conductive member. The guide wire according to Appendix 40. (Appendix 44) A long medical instrument comprising the guide wire according to Appendix 1. (Supplementary Note 45) providing a guide wire core; forming a first insulating layer on the surface of the guide wire core; forming a plurality of first conductive traces provided along the length direction of the guide wire core on the surface of the first insulating layer, each of the plurality of first conductive traces having a distal end and a proximal end; forming a plurality of connection portions on at least one of both end sides in the length direction of the plurality of first conductive traces so as to be arranged on a straight line parallel to the axis in the length direction of the guide wire core; arranging an electronic component on the distal side of the guide wire core; electrically connecting the first conductive trace and the electronic component through the inner opening of the connection portion; and between the most proximal distal end among the distal ends of the plurality of first conductive traces and the most distal proximal end among the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the axis in the length direction of the guide wire core, A method for manufacturing a guide wire. (Supplementary Note 46) providing a guide wire core; forming a first insulating layer on the surface of the guide wire core; forming a plurality of first conductive traces provided along the length direction of the guide wire core on the surface of the first insulating layer, each of the plurality of first conductive traces having a distal end and a proximal end; forming a second insulating layer covering the plurality of first conductive traces and the first insulating layer; forming a plurality of connection portions including inner openings opened in the second insulating layer so as to reach each of the plurality of first conductive traces on at least one of both end sides in the length direction of the plurality of first conductive traces; A step of disposing a conductive band having an outer opening on the surface of the second insulating layer such that the outer opening and the inner opening overlap; A step of forming a conductive connection member that electrically connects the inside of the outer opening and the inside of the inner opening, the conductive band, and the connection portion corresponding to the conductive band; A step of disposing an electronic component on the distal side of the guide wire core; A step of electrically connecting the electronic component and the conductive band, and comprising: Among the distal ends of the plurality of first conductive traces that are the closest to the proximal side and the proximal ends of the plurality of first conductive traces that are the farthest from the distal side, the plurality of first conductive traces are arranged parallel to the longitudinal axis of the guide wire core. A method for manufacturing a guide wire. (Appendix 47) A step of providing a guide wire core; A step of forming a first insulating layer on the surface of the guide wire core; A step of forming a plurality of first conductive traces provided along the length direction of the guide wire core on the surface of the first insulating layer, each of the plurality of first conductive traces having a distal end and a proximal end; A step of forming a second insulating layer that covers the plurality of first conductive traces and the first insulating layer; A step of forming a plurality of connection portions including inner openings opened in the second insulating layer so as to reach each of the plurality of first conductive traces at at least one of both ends in the length direction of the plurality of first conductive traces; A step of forming a conductive member provided so as to cover the first conductive trace and the second insulating layer located inside the inner opening of the connection portion, and forming a conductive path in the thickness direction when pressure is applied from the thickness direction; A step of disposing an electronic component on the distal side of the guide wire core; comprising the step of electrically connecting the electronic component and the conductive member; Among the distal ends of the plurality of first conductive traces, between the most proximal distal end and the most distal proximal end of the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the longitudinal axis of the guide wire core. Method for manufacturing a guide wire.

Claims

1. A guide wire core, a first insulating layer provided on the surface of the guide wire core, a plurality of first conductive traces provided on the surface of the first insulating layer and spaced apart in the lateral direction of the guide wire core and along the longitudinal direction of the guide wire core, each of the plurality of first conductive traces having a distal end and a proximal end, a second insulating layer covering the plurality of first conductive traces and the first insulating layer, a plurality of connection portions provided on at least one of both ends in the longitudinal direction of the plurality of first conductive traces and electrically connected to an electronic component, the plurality of connection portions including inner openings opened in the second insulating layer so as to reach corresponding first conductive traces, a conductive band formed circumferentially so as to cover the plurality of connection portions and the second insulating layer, an outer opening penetrating in the thickness direction of the plurality of conductive bands and arranged to overlap the inner opening, and the connection portion is provided inside the outer opening and inside the inner opening and includes a conductive connection member electrically connected to the conductive band, in a portion where the diameter of the guide wire core is the same between the most proximal distal end among the distal ends of the plurality of first conductive traces and the most distal proximal end among the proximal ends of the plurality of first conductive traces, the plurality of first conductive traces are arranged parallel to the axis in the longitudinal direction of the guide wire core, the inner opening and the outer opening are formed to extend in a direction perpendicular to the axis in a longitudinal cross-sectional view, the conductive band and the conductive connection member are connected in a curved surface. A guide wire.

2. The outer opening and the inner opening are arranged to overlap with a shift in the longitudinal direction of the guide wire core. The guide wire according to Claim 1.

3. The area of the inner opening is larger than the area of the outer opening. The guide wire according to Claim 2.

4. The outer opening is formed in a rectangular shape in a plan view. The guide wire according to Claim 1.

5. The outer opening is formed in a notch shape with the end side of the conductive band open in a plan view. The guide wire according to Claim 1.

6. The outer opening is formed in an inverted taper shape in which the width dimension of the end side of the conductive band is narrow and the width dimension widens as it advances in the width direction of the conductive band in a plan view. The guide wire according to claim 1.

7. The outer openings are respectively formed at both ends in the width direction of the conductive band. The guide wire according to any one of claims 1 to 6.

8. The conductive band and the conductive connection member are formed of a conductive metal material. The guide wire according to any one of claims 1 to 7.

9. The conductive connection member is formed of an anisotropic conductive material in which a conductive path is formed in the thickness direction of the conductive band when pressure is applied from the thickness direction of the conductive band. The guide wire according to any one of claims 1 to 8.

10. Furthermore, a plurality of second conductive traces provided on the surface of the second insulating layer; a third insulating layer provided so as to cover the plurality of second conductive traces and the second insulating layer; a plurality of second connection portions arranged on a straight line parallel to the axis in the length direction of the guide wire core at at least one of both ends in the length direction of the plurality of second conductive traces and electrically connected to an electronic component, the plurality of second connection portions including second inner openings opened in the third insulating layer so as to reach the corresponding second conductive traces; a second conductive band formed in the circumferential direction of the guide wire core so as to cover at least one of the plurality of second connection portions; The second connection portion covered by the second conductive band and the second conductive band are electrically connected via a conductive connection member provided in the second inner opening. The guide wire according to any one of claims 1 to 9.

11. The plurality of first conductive traces include at least one group of a plurality of first conductive traces having equal lengths. The guide wire according to any one of claims 1 to 10.

12. The plurality of first conductive traces constituting the group are formed as a point-symmetric pair. The guide wire according to claim 11.

13. The conductive band and the conductive connection member are formed of different conductive materials. The guide wire according to any one of claims 1 to 12.

14. The guide wire core has a large-diameter portion having a large diameter and a small-diameter portion located on the tip side of the large-diameter portion and having a smaller diameter than the large-diameter portion. One of the plurality of connection portions is located on the tip side of the large-diameter portion. The guide wire according to any one of claims 1 to 13.

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