Display device having a micro LED module
By inclining the side surfaces of adjacent micro-LED modules in the same direction, the challenges of manufacturing yield and workability in micro-LED displays are addressed, reducing line defects and improving assembly efficiency.
Patent Information
- Application Number
- JP2022543745
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-01-19
- Filing Date
- 2021-01-21
- Publication Date
- 2025-07-31
- Estimated Expiration
- 2041-01-21
AI Technical Summary
Micro-LED displays face challenges in manufacturing yield and workability due to the small form factor and fragility of micro-LEDs, which are difficult to handle and mount on display panels, leading to defects and line defects when tiling micro-LED modules.
Inclining the side surfaces of adjacent micro-LED modules in the same direction on a display substrate to prevent boundary regions from being displayed, using a tiling technique that allows for better alignment and reduces line defects.
Improves manufacturing yield and workability by minimizing line defects and enhancing the assembly process of micro-LED displays.
Smart Images

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Abstract
Description
Technical Field
[0001] The present disclosure relates to an LED display device, and more particularly, to an LED display device having a tile-shaped micro LED module.
Background Art
[0002] Light-emitting diodes, as inorganic light sources, are widely used in various fields such as display devices, vehicle lamps, and general lighting. Since light-emitting diodes have the advantages of long life, low power consumption, and fast response speed, they are replacing existing light sources at a high speed.
[0003] For example, a display device generally uses a mixture of blue, green, and red colors to realize various colors. A display device includes a plurality of pixels to realize various images, and each pixel includes blue, green, and red sub-pixels. The color of a specific pixel is determined through the colors of these sub-pixels, and an image is realized by the combination of these pixels.
[0004] Light-emitting diodes have been mainly used as backlight light sources in display devices. However, in recent years, micro LED displays that directly realize images using light-emitting diodes have been developed.
[0005] LEDs can emit light of various colors depending on their materials, and a display device can be provided by arranging individual light-emitting elements that emit blue, green, and red light on a two-dimensional plane. However, when arranging one light-emitting element for each sub-pixel, the number of light-emitting elements increases, so it takes a lot of time for the mounting process. Therefore, stacked light-emitting elements are being studied to save the time required for the mounting process. For example, by manufacturing a light-emitting element in which a red LED, a blue LED, and a green LED are stacked, red, blue, and green light can be realized using one light-emitting element. As a result, one pixel that emits red, blue, and green light can be provided by one light-emitting element, so the number of light-emitting elements mounted on the display device can be reduced.
[0006] FIG. 1 is a plan view for explaining a micro LED display device 10 according to the prior art.
[0007] Referring to FIG. 1, the display device 10 includes a display substrate 11 and light-emitting elements (R, G, B). The light-emitting elements (R, G, B) are micro LEDs, respectively, and as is well known in the art, they have an area of about 10,000 um 2 and have the following form factor.
[0008] The red, green, and blue light-emitting elements (R, G, B) are sub-pixels, respectively, and these constitute one pixel P. A plurality of pixels P are arranged on the display substrate 11, and an image is realized by these pixels P. The display substrate 11 is a substrate corresponding to the entire screen of the display device, and millions to tens of millions of micro LEDs are mounted on the display substrate 11.
[0009] However, due to the small form factor of micro-LEDs, it is difficult to handle micro-LEDs. Therefore, it is not easy to transfer and mount millions to tens of millions of micro-LEDs onto a display panel. Furthermore, micro-LEDs may be damaged by external impacts, and thus defects may occur in micro-LEDs during transportation.
[0010] Therefore, when all micro-LEDs are mounted on the display substrate 11 corresponding to one screen, the manufacturing yield of the display device is not good. Furthermore, since a large number of light-emitting elements (R, G, B) must be mounted on the large-area display substrate 11, the workability is not good.
[0011] Such problems also occur similarly when pixels are configured using stacked light-emitting elements. To solve such problems, tile-shaped micro-LED modules can be used.
[0012] FIG. 2 is a plan view for explaining a display device 20 including a micro-LED module according to the prior art, and FIG. 3 is a schematic partial cross-sectional view taken along the cut line A-A' of FIG. 2.
[0013] Referring to FIG. 2, the display device 20 includes a display substrate 21 and a tile-shaped micro-LED module T. The micro-LED module T includes light-emitting elements (R, G, B) and is aligned on the display substrate 21.
[0014] The micro-LED module T may include a plurality of pixels, and these modules T can be mounted on the display substrate 21 to form an entire screen. Therefore, instead of mounting all the light-emitting elements (R, G, B) on the display substrate 21, the light-emitting elements (R, G, B) can be divided and mounted on a plurality of micro-LED modules T, and this LED module T can be mounted on the display substrate 21 to provide the display device 20.
[0015] Since a good LED module T can be selected to manufacture the display device 20, the manufacturing yield of the display device 20 can be improved, and the workability may also be improved.
[0016] However, when manufacturing the display device 20 by tiling a plurality of micro-LED modules T, considering the tolerances generated during the manufacturing and mounting of the micro-LED modules T, as shown by the dotted line in FIG. 3, the micro-LED modules T need to be separated from each other.
[0017] When the micro-LED modules T are separated, the space between them may appear on the screen, for example, as a line defect. Such line defects are observed not only in the idle state where no image is realized but also when an image is realized.
Summary of the Invention
Problems to be Solved by the Invention
[0018] In an exemplary embodiment, there is provided a display device capable of reducing line defects observed when arranging micro-LED modules using a tiling technique.
[0019] In an exemplary embodiment, there is also provided a micro-LED module having a new structure.
Means for Solving the Problems
[0020] In an exemplary embodiment, a display device is provided, which includes a display substrate; a first micro LED module disposed on the display substrate; and a second micro LED module disposed on the display substrate adjacent to the first micro LED module. The first micro LED module and the second micro LED module have side surfaces facing each other, and the side surfaces where the first micro LED module and the second micro LED module face each other are inclined in the same direction with respect to the upper surface of the display substrate.
[0021] In an exemplary embodiment, a micro LED module is provided, which includes a substrate having a lower surface, an upper surface, and side surfaces; and micro LEDs aligned on the upper surface of the substrate. At least one side surface of the substrate is inclined so as to have an acute angle or an obtuse angle with respect to the upper surface of the substrate.
Brief Description of the Drawings
[0022]
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MODE FOR CARRYING OUT THE INVENTION
[0023] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following-described embodiments are provided as examples in order to sufficiently convey the idea of the present disclosure to those of ordinary skill in the technical field to which the present disclosure pertains. Therefore, the present disclosure is not limited to the embodiments described below, and can also be embodied in other forms. In the drawings, the widths, lengths, thicknesses, etc. of the components may be exaggerated for convenience. Also, when one component is described as being "above" or "on" another component, it includes not only the case where each part is "directly above" or "directly on" another part, but also the case where another component is interposed between each component and another component. Throughout the specification, the same reference numerals represent the same components.
[0024] In an exemplary embodiment, a display device is provided, the display device including a display substrate; a first micro LED module disposed on the display substrate; and a second micro LED module disposed on the display substrate adjacent to the first micro LED module, the first micro LED module and the second micro LED module having side surfaces facing each other, and the side surfaces of the first micro LED module and the second micro LED module facing each other being inclined in the same direction with respect to the upper surface of the display substrate.
[0025] By inclining the side surfaces of the first micro LED module and the second micro LED module facing each other in the same direction, it is possible to prevent a boundary region therebetween from being displayed.
[0026] Here, the fact that the facing side surfaces are inclined in the same direction means that the inclined directions are the same, and does not mean that the degrees of inclination are the same. In one embodiment, the facing side surfaces may have different angles of inclination with respect to the display substrate. In another embodiment, the facing side surfaces may be parallel to each other. That is, the angles of inclination of the facing side surfaces may be the same as each other.
[0027] Furthermore, in the vertical direction, the facing side surfaces may at least partially overlap. By arranging the facing side surfaces to overlap, it is possible to prevent a boundary region between the side surfaces from being displayed.
[0028] In one embodiment, the first micro LED module and the second micro LED module may have the same size and structure. In another embodiment, the first micro LED module and the second micro LED module may have different sizes or different shapes from each other. Furthermore, the second micro LED module may be disposed between two first micro LED modules.
[0029] In one embodiment, the display substrate may further include a third micro-LED module disposed adjacent to the first micro-LED module. The first micro-LED module and the third micro-LED module may have side surfaces facing each other. The side surfaces of the first micro-LED module and the third micro-LED module facing each other may be inclined in the same direction with respect to the upper surface of the display substrate. The side surface of the first micro-LED facing the side surface of the third micro-LED module may be adjacent to the side surface of the first micro-LED module facing the side surface of the second micro-LED module.
[0030] The third micro-LED module may be disposed between two first micro-LED modules.
[0031] Also, the side surface of the third micro-LED module facing the side surface of the first micro-LED module may extend to face the side surface of the second micro-LED module. Further, the third micro-LED module may be disposed between two second micro-LED modules.
[0032] The first micro-LED module may further include a first connector for connecting the wiring on the upper surface and the wiring on the lower surface of the first substrate. In one embodiment, the first connector can connect the wiring on the upper surface and the wiring on the lower surface of the first substrate through the via holes of the first substrate. In another embodiment, the first connector may be formed on the side surface of the first substrate to connect the wiring on the upper surface and the wiring on the lower surface of the first substrate.
[0033] The first micro-LED module includes a first substrate and micro-LEDs aligned on the first substrate, and the second micro-LED module includes a second substrate and micro-LEDs aligned on the second substrate, and the side surfaces of the first substrate and the second substrate may face each other.
[0034] The first micro-LED module may include a plurality of pixel regions, and the second micro-LED module may include a plurality of pixel regions.
[0035] Also, each of the pixel regions may be capable of emitting red light, green light, and blue light.
[0036] The display device may further include a molding member covering the first and second micro-LED modules.
[0037] Furthermore, the molding member may be capable of filling the region between the first micro-LED module and the second micro-LED module.
[0038] A micro-LED module according to an embodiment includes a substrate having a bottom surface, a top surface, and side surfaces; micro-LEDs aligned on the top surface of the substrate, and at least one side surface of the substrate is inclined so as to have an acute angle or an obtuse angle with respect to the top surface of the substrate.
[0039] The substrate has two pairs of opposing side surfaces, and at least one pair of opposing side surfaces may be inclined in the same direction.
[0040] The substrate may have two pairs of opposing side surfaces, and at least one pair of opposing side surfaces may be inclined in opposite directions.
[0041] On the other hand, the micro-LED module may have a plurality of pixel regions on the top surface of the substrate, and each pixel region may emit red light, green light, and blue light.
[0042] Hereinafter, embodiments of the present disclosure will be specifically described with reference to the drawings.
[0043] FIG. 4 is a schematic plan view for explaining a display device including a micro LED module according to an embodiment, and FIG. 5 is a schematic partial cross-sectional view taken along line B-B' of FIG. 4. In the cross-sectional view of FIG. 5, the display substrate 21 is omitted.
[0044] Referring to FIGS. 4 and 5, the display device 100 includes a display substrate 21, a first micro LED module T1, and a second micro LED module T2. The first and second micro LED modules T1, T2 may include a plurality of pixels P, and each pixel P may include a micro LED (R, G, B).
[0045] The display device 100 is a so-called micro LED display device, and the light-emitting area of one sub-pixel is 10,000 um 2 Hereinafter, further 4,000 um 2 Hereinafter, further still 1,000 um 2 It may be as follows.
[0046] The display substrate 21 is used to support the first and second micro LED modules T1, T2, and is not particularly limited as long as it can fix them. In this embodiment, the display substrate 21 may be a circuit board including a circuit such as a TFT, but is not limited thereto, and may be a substrate without a circuit, for example, a glass substrate. The display substrate 21 may have a size corresponding to the size of the screen of the display device 100, but the present disclosure is not necessarily limited thereto.
[0047] The display substrate 21 can be, for example, glass, quartz, ceramic, Si, SiC, metal, fiber, polymer, etc., and can be a transparent or opaque substrate. Further, the display substrate 21 may be a rigid or flexible printed circuit board (PCB).
[0048] In one embodiment, the display substrate 21 may be a transparent substrate such as glass, quartz, transparent ceramic, transparent film, transparent PCB, etc. The transparent film may be, for example, PEN (Poly Ethylene Naphthalene), PET (Poly Ethylene Terephthalate), PI (Polyimide), PE (Poly Ethylene) film, or PMMA (Poly Methyl Methacrylate), etc.
[0049] The wiring portion on the display substrate 21 may also be formed of a transparent conductive layer such as a transparent film like a transparent conductive oxide film, carbon nanotubes, or carbon graphite, etc., but is not limited thereto. When the display substrate 21 is a transparent substrate, the background can be observed through the display substrate 21 before turning on the display device. For example, when the display substrate 21 is attached to a wall, in the state where the display device is turned off, the display screen can hardly be observed, and the wall surface may be observed. Since the micro LEDs (R, G, B) are very small, the background may be observed through the regions between the micro LEDs (R, G, B). Thereby, a transparent display device such as a head-up display can be provided.
[0050] Furthermore, when the display substrate 21 is formed of a flexible plastic, a flexible display can also be realized.
[0051] In one embodiment, a transparent display device can use a glass plate such as a window glass of a building or an automotive glass, etc. as the display substrate 21.
[0052] In another embodiment, the transparent display device can be fabricated using a transparent printed circuit board as the display substrate 21, and this transparent display device can be attached to a glass plate such as window glass or automotive glass.
[0053] In yet another embodiment, a flexible printed circuit board (FPCB) is used as the display substrate 21 to manufacture a flexible display device, and the flexible display device can be attached to a glass plate such as window glass or automotive glass, or the flexible display device can be used in place of the glass plate.
[0054] In a specific embodiment, a glass plate such as window glass or automotive glass, or a transparent display substrate, can be fabricated to have electrochromic properties, and the light transmittance thereof can be adjusted by adjusting the current and voltage. Also, the transparency of the display substrate 21 can be adjusted by adjusting the amount of light emitted from the micro LEDs (R, G, B) within each pixel.
[0055] The first micro LED module T is aligned on the display substrate 21. The first and second micro LED modules T1, T2 may be attached on the display substrate 21 using a tiling technique. The first and second micro LED modules T1, T2 are aligned so as to be spaced apart from each other.
[0056] The first micro LED module T1 includes a plurality of pixels P disposed on a first substrate, and the pixels P may include micro LEDs (R, G, B). The first substrate can have a generally flat upper surface and a lower surface. On the other hand, as shown in the figure, the first substrate may have a side surface inclined with respect to the upper surface of the display substrate 21. Here, the inclined side surface means that the side surface of the first substrate is inclined such that it has an acute angle or an obtuse angle with respect to the upper surface of the display substrate 21. The upper surface of the first substrate can be substantially parallel to the upper surface of the display substrate 21, and thus, the inclined side surface of the first substrate has an acute angle or an obtuse angle with respect to the upper surface of the first substrate.
[0057] As shown in FIG. 4, a pair of opposite side surfaces of the first substrate may be inclined in opposite directions to each other, and another pair of side surfaces may be inclined in the same direction as each other. However, the present invention is not limited thereto, and all of the opposite side surfaces of each pair may be inclined in the same direction or in opposite directions to each other.
[0058] In this embodiment, on the first substrate of the first micro-LED module T1, the upper surface may have an area smaller than that of the lower surface. However, the present invention is not limited thereto, and on the first substrate of the first micro-LED module T1, the upper surface and the lower surface may have substantially the same area as each other.
[0059] Micro-LEDs (R, G, B) can each emit red light, green light, and blue light. In this specification, a micro-LED means a micro-scale light emitter fabricated using an inorganic semiconductor layer. A micro-LED may usually include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The structure of such a micro-LED may be diverse, such as a vertical type, a horizontal type, a flip-chip type, etc., and is not particularly limited to a specific structure. As is well known in the art, electrodes, pads, and insulating layers for electrical connection to the micro-LED may be further formed.
[0060] Each micro-LED (R, G, B) can form a sub-pixel, and sub-pixels arranged horizontally with respect to each other can form a pixel P. In another embodiment, a stacked light-emitting element in which micro-LEDs (R, G, B) are stacked on each other can also form a pixel. The stacked light-emitting element may include micro-LEDs that emit red light, green light, and blue light, and these micro-LEDs can each form a sub-pixel.
[0061] On one hand, the second micro-LED module T2 is arranged adjacent to the first micro-LED module T1. One side surface of the second micro-LED module T2 can face one side surface of the adjacent first micro-LED module T1. At this time, the side surfaces where the first micro-LED module T1 and the second micro-LED module T2 face each other may be inclined in the same direction with respect to the upper surface of the display substrate 21. For example, the first substrate of the first micro-LED module T1 and the second substrate of the second micro-LED module T2 may have side surfaces facing each other, and the side surfaces of the first substrate and the second substrate facing each other may be inclined in the same direction with respect to the upper surface of the display substrate 21.
[0062] The first substrate and the second substrate may be transparent or opaque substrates. In one embodiment, the first substrate and the second substrate may be transparent substrates formed of a transparent material to provide a transparent display device. The first substrate and the second substrate may be, for example, the transparent substrates described with respect to the display substrate 21, and detailed descriptions are omitted to avoid duplication.
[0063] As shown in FIGS. 4 and 5, the side surfaces where the first micro-LED module T1 and the second micro-LED module T2 face each other may overlap. Thereby, the boundary line between the micro-LED modules can be made not to be displayed.
[0064] The second micro-LED module T2 includes at least one pixel P disposed on a second substrate, and the pixel P can include micro-LEDs (R, G, B). The micro-LEDs (R, G, B) may have the same structure and size as the micro-LEDs of the first micro-LED module T1, but are not necessarily limited thereto. The micro-LEDs (R, G, B) can emit red light, green light, and blue light, respectively. Each of the micro-LEDs (R, G, B) can form a sub-pixel, and the sub-pixels arranged horizontally with respect to each other can form the pixel P. In another embodiment, a stacked light-emitting element can also form the pixel P. The stacked light-emitting element can include semiconductor stacks that emit red light, green light, and blue light, and these semiconductor stacks can each form a sub-pixel.
[0065] The second micro-LED module T2 can be disposed between two first micro-LED modules T1. That is, both side surfaces of the second micro-LED module T2 can be arranged to face the side surfaces of different first micro-LED modules T1, respectively.
[0066] As shown in FIG. 4, the first micro-LED module T1 and the second micro-LED module T2 can be alternately arranged in one direction. In the direction orthogonal to the one direction, the first micro-LED modules T1 can be arranged such that their side surfaces face each other, and the second micro-LED modules T2 can be arranged such that their side surfaces face each other. However, the present disclosure is not limited thereto, and the first and second micro-LED modules T1, T2 can be arranged in various ways depending on the inclination of these side surfaces.
[0067] On the one hand, in this embodiment, the first micro-LED module T1 has a larger area on the lower surface than on the upper surface, and the second micro-LED module T2 has a larger area on the upper surface than on the lower surface. In particular, in the embodiment of FIG. 4, the horizontal width WUL1 of the upper surface of the first micro-LED module T1 may be smaller than the horizontal width WLL1 of the lower surface, and the vertical width WUV1 of the upper surface may be substantially the same as the vertical width WLV1 of the lower surface. The horizontal width WUL2 of the upper surface of the second micro-LED module T2 may be larger than the horizontal width WLL2 of the lower surface, and the vertical width WUV2 of the upper surface may be substantially the same as the vertical width WLV2 of the lower surface. In another embodiment, the horizontal width WUL1 and the vertical width WUV1 of the upper surface of the first micro-LED module T1 may be smaller than the horizontal width WLL1 and the vertical width WLV1 of the lower surface, and the horizontal width WUL2 and the vertical width WUV2 of the upper surface of the second micro-LED module T2 may be larger than the horizontal width WLL2 and the vertical width WLV2 of the lower surface.
[0068] According to this embodiment, by including the side surfaces of the first micro-LED module T1 and the second micro-LED module T2 facing each other, it is possible to prevent line defects from being displayed by the boundary portion between the micro-LED modules T1 and T2.
[0069] FIG. 6 is a schematic cross-sectional view for explaining a display device including a micro-LED module according to an embodiment.
[0070] Referring to FIG. 6, the display device according to this embodiment is substantially similar to the display device 100 described with reference to FIGS. 4 and 5, but the first micro-LED module T1 and the second micro-LED module T2 have a pair of side surfaces inclined in the same direction respectively. In one example, the first micro-LED module T1 and the second micro-LED module T2 may have the same shape. Also, the first micro-LED module T1 and the second micro-LED module T2 may have substantially the same area of the upper surface and the lower surface respectively.
[0071] FIG. 7 is a schematic perspective view for explaining a micro-LED module according to an embodiment. Here, the shape of the micro-LED module T will be described in a generalized manner.
[0072] Referring to FIG. 7, in an embodiment of the present disclosure, the micro-LED module T may include an upper surface 31, a lower surface 32, a front side surface 33, a rear side surface 34, a left side surface 35, and a right side surface 36. The micro-LEDs are arranged on the upper surface 31. Here, the front side surface 33 and the rear side surface 34 are a pair of side surfaces facing each other, and the left side surface 35 and the right side surface 36 are another pair of side surfaces facing each other.
[0073] In the micro-LED module T of this embodiment, at least one of the front side surface 33, the rear side surface 34, the left side surface 35, and the right side surface 36 is inclined so as to have an acute angle or an obtuse angle with respect to the upper surface 31. Further, a pair of opposing side surfaces may be inclined with respect to the upper surface 31, and furthermore, all four side surfaces may be inclined so as to have an acute angle or an obtuse angle with respect to the upper surface 31.
[0074] On the other hand, the micro-LED modules T may be aligned on the display substrate such that the facing side surfaces are inclined in the same direction, or the facing side surfaces may overlap each other.
[0075] FIG. 8 is a schematic cross-sectional view for explaining a connector of the micro-LED module T according to an embodiment.
[0076] Referring to FIG. 8, a connector 25a for connecting the wiring on the upper surface and the wiring on the lower surface of the first substrate may be disposed on the side surface of the first substrate. The side surface of the first substrate may be inclined so as to have an acute angle or an obtuse angle with respect to the upper surface of the first substrate, and the connector 25a is disposed on the inclined side surface of the first substrate.
[0077] A driver (not shown) is disposed on the lower surface of the first substrate. For example, a scan driver for driving scan lines and a data driver for driving data lines may be disposed. The micro LEDs (R, G, B) on the first substrate may be electrically connected to the driver and driven by the driver. At this time, the wirings on the upper surface side and the lower surface side of the first substrate may be connected through the connector 25a in order to electrically connect the micro LEDs (R, G, B) disposed on the upper portion of the first substrate to the driver. A plurality of wirings are disposed on the upper surface side and the lower surface side of the first substrate, and thus, a plurality of connectors 25a are provided on the first substrate.
[0078] FIG. 9 is a schematic cross-sectional view for explaining a connector of a micro LED module according to an embodiment.
[0079] Referring to FIG. 9, in this embodiment, the connector 25b is substantially similar to the connector 25a described with reference to FIG. 8, but is different in that it is formed in a through hole penetrating the first substrate. The connector 25b can be formed near the edge of the first substrate.
[0080] FIG. 10 is a schematic plan view for explaining a display device 200 including a micro LED module according to an embodiment, and FIGS. 11, 12, and 13 are schematic cross-sectional views taken along the cut lines C-C', D-D', and E-E' of FIG. 10, respectively.
[0081] Referring to FIGS. 10 and 11, the display device 200 according to this embodiment may include a first micro LED module T1, a second micro LED module T2, and a third micro LED module T3. The first to third micro LED modules T1, T2, and T3 may each include a first, a second, and a third substrate, respectively, and may include micro LEDs (R, G, B) disposed on each substrate. For the sake of simplicity of the drawing, the micro LEDs in FIG. 10 are omitted. Also, a plurality of pixel regions may be disposed on the first to third substrates.
[0082] The second micro-LED module T2 is disposed between the two first micro-LED modules T1. That is, both side surfaces of the second micro-LED module T2 face the side surfaces of the first micro-LED module T1, respectively. The side surfaces of the first micro-LED module T1 and the second micro-LED module T2 facing each other are inclined in the same direction with respect to the upper surface of the display substrate 21 as described with reference to FIGS. 4 and 5 above.
[0083] Referring to FIGS. 10 and 12, the third micro-LED module T3 may be disposed on the display substrate 21 adjacent to the first micro-LED module T1. The first micro-LED module T1 and the third micro-LED module T3 have side surfaces facing each other. Further, the side surfaces of the first micro-LED module T1 and the third micro-LED module T3 facing each other may be inclined in the same direction with respect to each other with respect to the upper surface of the display substrate. Here, the side surface of the first micro-LED module T1 facing the side surface of the third micro-LED module T3 is adjacent to the side surface of the first micro-LED module T1 facing the side surface of the second micro-LED module T2.
[0084] As shown in FIG. 10, the third micro-LED module T3 may be disposed between two first micro-LED modules T1. Also, the side surface of the third micro-LED module T3 facing the side surface of the first micro-LED module T1 may extend to face the side surface of the second micro-LED module. Further, as shown in FIG. 13, the third micro-LED module T3 may be disposed between two second micro-LED modules T2. That is, both side surfaces of the third micro-LED module T3 may face the side surfaces of the second micro-LED modules T2, respectively, and these facing side surfaces may overlap each other. In FIGS. 11 to 13, although a space is illustrated between the side surfaces, such a space is illustrated for representing the shape and direction of the side surfaces. When the side surface of the third micro-LED module T3 overlaps the side surface of the second micro-LED module T2, the space may not exist.
[0085] FIG. 14 is a schematic plan view for explaining a display device 200a including a micro-LED module according to an embodiment.
[0086] Referring to FIG. 14, the display device 200a according to the present embodiment corresponds to a specific example of the display device 200 described with reference to FIG. 10. The display device 200a includes a first micro-LED module T1, a second micro-LED module T2, and a third micro-LED module T3 aligned on a display substrate 21. In the present embodiment, four first micro-LED modules T1, two second micro-LED modules T2, and one third micro-LED module T3 are illustrated as being disposed on the display substrate 21, but more first to third micro-LED modules (T1, T2, T3) can be disposed on the display substrate 21.
[0087] Here, the first micro-LED module T1 may have two pairs of side surfaces whose opposing side surfaces are inclined in opposite directions to each other. The first micro-LED modules T1 are arranged spaced apart from each other.
[0088] The second micro-LED module T2 is disposed between two first micro-LED modules T1. Both side surfaces of the second micro-LED module T2 face the side surfaces of the first micro-LED module T1 respectively. The facing side surfaces of the first and second micro-LED modules T1 and T2 are inclined in the same direction and at least partially overlap.
[0089] A pair of side surfaces of the second micro-LED module T2 that face the side surfaces of the first micro-LED module T1 may be inclined so as to have an acute angle with respect to the upper surface of the second micro-LED module T2. On the other hand, another pair of side surfaces of the second micro-LED module T2 may be inclined so as to have an obtuse angle with respect to the upper surface of the second micro-LED module T2.
[0090] On the other hand, the third micro-LED module T3 may be disposed between the first micro-LED module T1 and the second micro-LED module T2. The side surface of the third micro-LED module T3 can face the side surfaces of the first micro-LED module T1 and the second micro-LED module T2.
[0091] FIG. 15 is a schematic cross-sectional view for explaining a display device according to an embodiment.
[0092] Referring to FIG. 15, the display device according to this embodiment is substantially similar to the display devices 100 and 200 described above, but differs in that it further includes a molding member 40.
[0093] The molding member 40 covers the micro LEDs (R, G, B) on the first micro LED module T1 and the second micro LED module T2. The molding member 40 can cover all the micro LED modules T1, T2 on the display substrate 21. The molding member 40 can also be formed of a transparent resin or may be a black molding having a light absorption function. The black molding enhances the contrast and improves the quality of the final product.
[0094] FIG. 16 is a schematic cross-sectional view for explaining a display device according to an embodiment.
[0095] Referring to FIG. 16, the display device according to this embodiment is generally similar to the display device described with reference to FIG. 15, but the molding member 40 fills the region between the first micro LED module T1 and the second micro LED module T2.
[0096] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications should be apparent from this description. Thus, the present disclosure is not limited to such embodiments and includes the broader scope of the appended claims and various obvious and equivalent configurations to those skilled in the art.
Claims
1. Display substrate; a first micro LED module disposed on the display substrate; and a second micro LED module disposed on the display substrate adjacent to the first micro LED module; the first micro LED module and the second micro LED module have sides facing each other; a display device, wherein the facing sides of the first micro LED module and the second micro LED module are inclined parallel to each other with respect to the top surface of the display substrate, and the facing sides of the first micro LED module and the second micro LED module are inclined in opposite directions to each other.
2. The display device of claim 1 , wherein the opposing sides at least partially overlap in the vertical direction.
3. 10. The display device of claim 1, wherein the second micro LED module is disposed between two first micro LED modules.
4. further comprising a third micro LED module disposed on the display substrate adjacent to the first micro LED module; the first micro LED module and the third micro LED module have sides facing each other; the first micro LED module and the third micro LED module have opposing side surfaces that are inclined in the same direction relative to the upper surface of the display substrate; 10. The display device of claim 1, wherein a side of the first micro LED module facing a side of the third micro LED module is adjacent to a side of the first micro LED module facing a side of the second micro LED module.
5. 5. The display device of claim 4, wherein the third micro LED module is disposed between two first micro LED modules.
6. 5. The display device of claim 4, wherein a side of the third micro LED module facing a side of the first micro LED module extends to face a side of the second micro LED module.
7. 7. The display device of claim 6, wherein the third micro LED module is disposed between two second micro LED modules.
8. the first micro LED module includes a first substrate and micro LEDs aligned on the first substrate; The display device of claim 1 , wherein the first micro LED module further includes a first connector connecting wiring on the upper surface and wiring on the lower surface of the first substrate.
9. The display device of claim 8 , wherein the first connector connects wiring on an upper surface of the first substrate to wiring on a lower surface of the first substrate through a via hole in the first substrate.
10. The display device of claim 8, wherein the first connector is formed on a side surface of the first substrate to connect wiring on an upper surface and wiring on a lower surface of the first substrate.
11. the first micro LED module includes a first substrate and micro LEDs aligned on the first substrate; the second micro LED module includes a second substrate and micro LEDs aligned on the second substrate; The display device of claim 1 , wherein the sides of the first substrate and the second substrate face each other.
12. the first micro LED module includes a plurality of pixel regions; 10. The display device of claim 1, wherein the second micro LED module comprises a plurality of pixel regions.
13. 13. The display device of claim 12, wherein each of the pixel regions emits red, green, and blue light.
14. 10. The display device of claim 1, further comprising a molding member covering the first and second micro LED modules.
15. 15. The display device of claim 14, wherein the molding member fills an area between the first micro LED module and the second micro LED module.
Citation Information
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