Waveguide converter, electronic component mounting package, and waveguide conversion device

Abstract

A waveguide converter according to the present invention comprises a first substrate, a signal conductor, a first grounding conductor, a first frame body, a second grounding conductor, and a first lid body. The first substrate has a first upper surface including a first region and a second region extending from the first region. The signal conductor comprises a conversion unit positioned in the first region, and a track part connected to the conversion unit and positioned extending from the first region to the second region. The first grounding conductor is positioned in the second region so as to sandwich the track section in a plan view. The first frame body has a second upper surface and an inner surface that connects with the second upper surface. The first frame body is positioned on the first upper surface so as to surround at least a portion of the second region and the first region in a plan view. The second grounding conductor is positioned on the second upper surface. The first lid body is positioned on the second upper surface so as to cover the first region in a plan view.

Description

Technical Field

[0001] The present disclosure relates to a waveguide converter, a package for mounting electronic components, and a waveguide conversion device.

Background Art

[0002] With the demand for higher speed and larger capacity in wireless communication, the frequency band used in wireless communication is becoming higher in frequency. For this reason, the signals to be processed by wireless devices are also becoming higher in frequency.

[0003] As a transmission medium capable of efficiently transmitting such high-frequency signals, a waveguide can be mentioned. However, since a waveguide cannot be directly connected to an integrated circuit mounted on a circuit board, a configuration in which a microstrip line is interposed between the integrated circuit and the waveguide is widely used. When such a configuration is adopted, a converter for mutually converting signals between the waveguide and the microstrip line is required.

[0004] As such a converter, the invention described in Patent Document 1 is known. The invention described in Patent Document 1 includes a waveguide - planar line conversion substrate having a dielectric substrate on which a ground layer and a signal line for propagating a high-frequency signal are formed, and a housing having a waveguide. A short cover is disposed on the upper surface of the waveguide - planar line conversion substrate (see, for example, FIG. 1 of Patent Document 1).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] The waveguide converter (1) according to an embodiment of the present disclosure includes a first substrate, a signal conductor, a first ground conductor, a first frame body, a second ground conductor, and a first lid. The first substrate has a first upper surface including a first region and a second region extending from the first region. The signal conductor has a conversion portion located in the first region and a line portion connected to the conversion portion and extending at least from the first region to the second region. The first ground conductor is located in the second region of at least the first upper surface and sandwiches the line portion in a plan view. The first frame body has a second upper surface and an inner surface connected to the second upper surface. The first frame body is located on the first upper surface and surrounds at least a part of the first region and the second region in a plan view. Further, the first frame body is made of a non-metallic material. The second ground conductor is located on the second upper surface. The first lid is located on the second upper surface so as to cover the first region in a plan view. The first lid is made of a metallic material. The first frame body further has a first end portion and a second end portion that are located opposite to each other with the second region sandwiched therebetween in a plan view. The first ground conductor, the second ground conductor, and the first lid are electrically connected.

[0007] (2) The waveguide converter of (1) above further includes a second frame body made of a non-metallic material. The second frame body is located on the second upper surface and surrounds at least a part of the first region outside the inner surface in a plan view. When the direction in which the line portion extends is defined as a first direction and the direction intersecting the first direction is defined as a second direction in a plan view, the second frame body has a third end portion and a fourth end portion that are located opposite to each other in the second direction in a plan view.

[0008] (3) In the waveguide converter of (2) above, the distance between the first end portion and the second end portion in the second direction is equal to or less than the distance between the third end portion and the fourth end portion in the second direction.

[0009] (4) In the waveguide converter of (1) to (3) above, the first lid has a first surface located opposite to the first region. In a cross-sectional view intersecting the first upper surface, the distance from the conversion portion to the first surface is equal to or more than 1 / 13.12 and equal to or less than 1 / 9.85 of the signal wavelength λ transmitted through the signal conductor.

[0010] (5) In the waveguide converter according to (1) to (4) above, the first lid body has a second surface that overlaps with the second upper surface, and a first recess having a first opening in the second surface. In a plan view, the area of the first opening is equal to or less than the area of the first region.

[0011] (6) In the waveguide converter according to (1) to (4) above, the first lid body has a second surface that overlaps with the second upper surface, and a first recess having a first opening in the second surface. The first recess has a first surface.

[0012] (7) In the waveguide converter according to (1) to (6) above, the first upper surface has a third region that is connected to the second region and is located away from the first region. The first frame body further has a fifth end portion and a sixth end portion that are located facing each other across the third region in a plan view. The second region is located between the first region and the third region in a plan view. When the direction in which the line portion extends is defined as the first direction and the direction intersecting the first direction is defined as the second direction in a plan view, the distance in the second direction between the first end portion and the second end portion is equal to or less than the distance in the second direction between the fifth end portion and the sixth end portion.

[0013] (8) In the waveguide converter according to (2) to (7) above, the line portion has a first portion. In a plan view, the first portion is located away from the conversion portion. The dimension of the first portion in the second direction is the maximum dimension of the line portion in the second direction.

[0014] (9) In the waveguide converter according to (8) above, in a plan view, the distance in the first direction from the conversion portion to the first portion is equal to or greater than 5 / 8 and equal to or less than 7 / 8 of the signal wavelength λ transmitted by the signal conductor.

[0015] (10) In the waveguide converter according to (8) above, in a plan view, the distance in the first direction from the conversion portion to the first portion is equal to or greater than 1 / 8 and equal to or less than 3 / 8 of the signal wavelength λ transmitted by the signal conductor.

[0016] (11) In the waveguide converter of (8) to (10) above, the second surface has a first side that overlaps with the second region in a plan view. In the plan view, at least a part of the first portion is located overlapping the first side.

[0017] (12) In the waveguide converter of (1) to (11) above, in a plan view, when the direction in which the line portion extends is defined as the first direction and the direction intersecting the first direction is defined as the second direction, the conversion portion has a second portion connected to the line portion. The line portion has a third portion connected to the second portion. The dimension of the conversion portion in the second direction is larger than the dimension of the third portion in the second direction. The dimension of the second portion in the second direction becomes smaller as it goes outward along the first direction.

[0018] (13) The package for mounting an electronic component according to an embodiment of the present disclosure includes a second substrate, the waveguide converter of (1) to (12) above, and a third frame. The second substrate has a third upper surface, a third lower surface opposite to the third upper surface, and a through hole. The through hole penetrates from the third upper surface to the third lower surface. The waveguide converter of (1) to (12) above is located overlapping the through hole in a plan view on the third upper surface. The third frame is joined to the third upper surface and is located surrounding the waveguide converter.

[0019] (14) In the package for mounting an electronic component of (13) above, the second substrate further has a second recess including a second opening on the third upper surface. The second recess has a through hole. The waveguide converter of (1) to (12) above is located in the second recess. The first substrate has a second side and a third side connected via the second side and the first corner portion in a plan view. The second opening has a fourth side and a fifth side connected via the fourth side and the second corner portion in a plan view. The second side is in contact with at least a part of the fourth side. The third side is in contact with at least a part of the fifth side.

[0020] (15) The waveguide converter according to an embodiment of the present disclosure includes the package for mounting electronic components described in the above (13) or (14), an electronic component, a second lid, and a waveguide. The electronic component is located on the third upper surface of the second substrate and is electrically connected to the waveguide converter of the package for mounting electronic components. The second lid is located on the third frame and covers the inside of the package for mounting electronic components. The waveguide is located on the third lower surface side of the second substrate.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Mode for Carrying Out the Invention

[0022] <Configuration of Waveguide Converter> Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. Note that the waveguide converter may be oriented in any direction as being upward or downward. For convenience, a rectangular coordinate system xyz is defined, and the positive side in the z direction is defined as upward. In the present disclosure, the first direction refers to, for example, the x direction in the drawings. The second direction intersecting the first direction refers to, for example, the y direction in the drawings. In the present disclosure, the outward direction refers to, for example, the direction away from the first region 1a1 described later in the x direction or the y direction. Also, in the present disclosure, the plan view is a concept including a plane perspective.

[0023] The waveguide converter 101 according to the embodiment of the present disclosure will be described with reference to FIGS. 1 to 10. The waveguide converter 101 includes a first substrate 1, a signal conductor S1, a first ground conductor G1, a first frame body 2, a second ground conductor G2, and a first lid body 4.

[0024] As shown in FIGS. 1 and 6, the first substrate 1 has a first upper surface 1a including a first region 1a1 and a second region 1a2 extending from the first region 1a1. The first substrate 1 is made of, for example, a non-metallic material. As the material of the first substrate 1, for example, ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body or silicon nitride sintered body, or non-metallic materials such as glass ceramic materials can be used. Also, the first substrate 1 may be a printed circuit board such as a copper-clad laminate.

[0025] The first substrate 1 may be composed of a single layer of non-metallic material or a structure in which a plurality of laminated non-metallic materials are laminated. The first substrate 1 is, for example, rectangular in plan view, with a size of 4 mm × 4 mm to 50 mm × 50 mm and a thickness of 0.05 mm to 1 mm.

[0026] Also, although not shown, one or more vias may be provided in the first substrate 1. The via can be created by providing a hole in the first substrate 1 that forms the outer shape of the via and filling the hole with a conductor paste containing a high melting point metal powder such as tungsten or molybdenum.

[0027] Furthermore, as shown in FIG. 3, the first substrate 1 has a first lower surface 1b. Also, a third ground conductor G3 may be provided on the first lower surface 1b. The third ground conductor G3 may be an annular metal layer that surrounds the first region 1a1 in plan view. The third ground conductor G3 may be electrically connected to the first ground conductor G1 described later and the aforementioned vias, etc. By the third ground conductor G3 being located on the first lower surface 1b, the ground potential of the signal conductor S1 can be strengthened, and it can also serve as a conductor wall that is electromagnetically connected to the waveguide 107 described later.

[0028] The first frame body 2 has a second upper surface 2a and an inner surface 2c connected to the second upper surface 2a. The first frame body 2 is located on the first upper surface 1a of the first substrate 1 so as to surround at least a part of the first region 1a1 and the second region 1a2 in a plan view. The first frame body 2 further has a first end portion 21 and a second end portion 22 that are located facing each other with the second region 1a2 interposed therebetween in a plan view. Further, the first frame body 2 is made of a non-metallic material. The material of the first frame body 2 may be the same as or different from the material of the first substrate 1, and examples thereof include the same material as the material of the first substrate 1 described above. When the materials of the first substrate 1 and the first frame body 2 are ceramic materials or glass ceramic materials, the waveguide converter 101 can be easily manufactured because the green sheets formed on the outer shapes of the first substrate 1 and the first frame body 2 can be laminated. The first frame body 2 is, for example, U-shaped in a plan view, has a size of 4 mm × 4 mm to 50 mm × 50 mm, and a thickness of 0.1 mm to 5 mm.

[0029] Since the first frame body 2 is located on the first upper surface 1a of the first substrate 1, the thickness of the first substrate 1 can be reduced while reducing the possibility of damage to the first substrate 1, and good high-frequency characteristics can be obtained.

[0030] Further, the first frame body 2 may be provided with vias in the same manner as the first substrate 1. The presence of the vias can facilitate the electrical connection of the first ground conductor G1, the second ground conductor G2, and the first lid 4, which will be described later. Further, the vias can be formed by the same method as the vias provided in the first substrate 1 described above.

[0031] The signal conductor S1 has a conversion section S11 located in the first region 1a1 and a line section S12 connected to the conversion section S11 and extending at least from the first region 1a1 to the second region 1a2. Examples of the material of the signal conductor S1 include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. Also, the signal conductor S1 may be formed by sintering a metal paste on the first upper surface 1a of the first substrate 1, or may be formed using a thin film forming technique such as vapor deposition or sputtering. An insulating film such as ceramic (e.g., alumina coat) or resin may be located on a part of the signal conductor S1. The insulating film can be provided on the signal conductor S1 by screen printing. Also, the insulating film may be located only on a part of the conversion section S11 or the line section S12. With such a configuration, the possibility that the signal conductor S1 is short-circuited with the first ground conductor G1 described later can be reduced.

[0032] Although not shown, the signal conductor S1 may be electrically connected to an electronic component 104 described later via a connection member such as a wire mainly composed of a conductive metal material such as platinum. The signal conductor S1 is, for example, a transmission line suitable for transmitting a high-frequency signal such as a millimeter wave. The signal transmitted through the line section S12 is electromagnetically coupled to a waveguide 107 described later in the conversion section S11.

[0033] The first ground conductor G1 is located, in at least the second region 1a2 of the first upper surface 1a, with the line portion S12 interposed therebetween in a plan view. The material of the first ground conductor G1 may be the same as or different from the material of the signal conductor S1. For example, a material similar to the material of the signal conductor S1 described above can be mentioned. Also, the first ground conductor G1 may be formed by the same method as the signal conductor S1. In one embodiment, the signal conductor S1 and the first ground conductor G1 are also located in the third region 1a3 described later, and the first ground conductor G1 is also located, in the third region 1a3, with the line portion S12 interposed therebetween in a plan view. Since the signal conductor S1 is located sandwiched between the first ground conductors G1, the ground potential can be strengthened and the electric field coupling can be enhanced. For this reason, when the signal conductor S1 transmits a high-frequency signal, it is possible to reduce the possibility of resonance occurring due to the electric field distribution spreading beyond a desired range.

[0034] Note that the first ground conductor G1 does not necessarily have to be located, in the third region 1a3, with the line portion S12 interposed therebetween in a plan view. Also, the first ground conductor G1 may be a pair of separated metal films provided on the first upper surface 1a so as to sandwich the signal conductor S1. Also, similar to the signal conductor S1, the first ground conductor G1 may be electrically connected to an electronic component 104 described later via a connection member such as a wire.

[0035] The second ground conductor G2 is located on the second upper surface 2a. The material of the second ground conductor G2 may be the same as or different from the material of the signal conductor S1. For example, a material similar to the material of the signal conductor S1 described above can be mentioned. The second ground conductor G2 may be formed by the same method as the signal conductor S1. By providing the second ground conductor G2, it is possible to facilitate joining the first lid 4 to the first frame 2 described later.

[0036] In one embodiment, as shown in FIG. 1, the second ground conductor G2 is continuously located from the second upper surface 2a to the inner surface 2c of the first frame body 2. Although not shown, the second ground conductor G2 may be continuously located up to the surface on the opposite side of the second upper surface 2a of the first frame body 2 (the surface facing the first upper surface 1a). This can facilitate electrically connecting the first ground conductor G1, the second ground conductor G2, and the first lid body 4. Also, since the ground potential can be strengthened, the signal conductor S1 can reduce the signal loss that occurs when transmitting a high-frequency signal. Further, when the second ground conductor G2 is continuously located from the second upper surface 2a to the inner surface 2c, by being electrically connected to the first lid body 4 described later, it can be regarded as a pseudo so-called backshort block (in other words, a conductor block). More specifically, the first frame body 2 and the first lid body 4 can be regarded as an integrated lid body.

[0037] As shown in FIGS. 1 and 2, the first lid body 4 is located on the second upper surface 2a so as to cover the first region 1a1 in a plan view. Also, the first lid body 4 is made of a metal material. The first lid body 4 is, for example, square in a plan view, with a size of 1 mm × 1 mm to 50 mm × 50 mm and a thickness of 0.2 mm to 20 mm. Examples of the material of the first lid body 4 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten, or alloys formed by combining a plurality of these metal materials. By subjecting such a metal material ingot to metal processing methods such as a rolling process or a punching process, a metal member constituting the first lid body 4 can be manufactured. The first lid body 4 can efficiently cause the signal transmitted by the signal conductor S1 to enter the waveguide 107. Also, it can efficiently cause the signal propagated through the waveguide 107 to enter the signal conductor S1. The first lid body 4 can be joined to the first frame body 2 and the second ground conductor G2 by a joining material.

[0038] The first ground conductor G1, the second ground conductor G2, and the first cover 4 are electrically connected. In one embodiment, the first ground conductor G1, the second ground conductor G2, and the first cover 4 are electrically connected by a via provided in the first frame body 2 and the second ground conductor G2 that extends to the inner surface 2c. By this, the ground potential can be strengthened. Note that the present invention is not limited to the above-described embodiment as long as the first ground conductor G1, the second ground conductor G2, and the first cover 4 can be electrically connected.

[0039] As shown in FIGS. 1 to 3 and FIG. 6, the waveguide converter 101 may further include a second frame body 3 made of a non-metallic material. The second frame body 3 is located on the second upper surface 2a and, in a plan view, surrounds at least a part of the first region 1a1 outside the inner surface 2c. The second frame body 3 has a third end 33 and a fourth end 34 that face each other in the y direction in a plan view. With the above-described configuration, since the first cover 4 can be joined to the first frame body 3 while the first cover 4 is applied to the second frame body 3, the first cover 4 can be accurately joined to the first frame body 3. That is, the second frame body 3 serves as a guide for positioning when joining the first cover 4.

[0040] The material of the second frame body 3 may be the same as or different from the material of the first frame body 2. For example, a material similar to the material of the first frame body 2 described above can be mentioned. When the materials of the first substrate 1, the first frame body 2, and the second frame body 3 are ceramic materials or glass-ceramic materials, since the green sheets formed on the outer shapes of the first substrate 1, the first frame body 2, and the second frame body 3 can be laminated and manufactured, the waveguide converter 101 can be easily manufactured. The second frame body 3 is, for example, U-shaped in a plan view, has a size of 4 mm × 4 mm to 50 mm × 50 mm, and a thickness of 0.1 mm to 5 mm. When the second frame body 3 is mainly composed of a ceramic material or a glass-ceramic material, the U-shape of the second frame body 3 can reduce the possibility of the second frame body 3 warping during sintering.

[0041] Incidentally, as described above, the second frame body 3 does not necessarily have to be U-shaped as long as it can function as a positioning guide when joining the first lid body 4. For example, it may be L-shaped, or a shape in which the U is separated in the center, etc.

[0042] As described above, the second frame body 3 is located on the second upper surface 2a and, in a plan view, is located so as to surround at least a part of the first region 1a1 outside the inner surface 2c. More specifically, in a plan view, the inner edge of the second frame body 3 is located outside the inner edge of the first frame body 2. And in one embodiment, in a plan view, the distances between the three sides of the inner edge of the second frame body 3 and the three sides of the inner edge of the corresponding first frame body 2 are constant on the corresponding sides.

[0043] Also, in one embodiment, the outer edge of the second frame body 3 coincides with the outer edges of the first substrate 1 and the first frame body 2 in a plan view, but the outer edge of the second frame body 3 does not necessarily have to coincide with the outer edges of the first substrate 1 and the first frame body 2. That is, the outer edge of the second frame body 3 may be larger or smaller than the outer edges of the first substrate 1 and the first frame body 2.

[0044] As shown in FIG. 7, when the distance in the x direction from the outer edge of the first frame body 2 to the first end portion 21 and / or the second end portion 22 is defined as Lx21, and the dimension in the x direction of the first end portion 21 and / or the second end portion 22 is defined as Lx22, Lx22 > Lx21 may be satisfied. With this configuration, the area for mounting the lid body 4 can be widened. Therefore, the lid body 4 can be stably positioned on the first frame body 2. Furthermore, as shown in FIG. 8, when the dimension in the x direction of the portion of the first frame body that is located on the side opposite to the side surrounding the second region 1a2 across the first region 1a1 is defined as Lx23, (Lx21 + Lx22) > Lx23 may be satisfied. With this configuration, the second frame body 3 can be stably positioned on the first frame body 2.

[0045] As shown in FIGS. 6 to 9, the distance L12 (FIG. 8) in the y direction between the first end 21 and the second end 22 of the first frame body 2 may be equal to or less than the distance L34 (FIG. 9) in the y direction between the third end 33 and the fourth end 34 of the second frame body 3. With such a configuration, when the first lid body 4 is joined to the first frame body 2, the first lid body 4 can be fitted in from the opening side of the second frame body 3 (the portion sandwiched between the third end 33 and the fourth end 34), so that the manufacture of the waveguide converter 101 can be facilitated.

[0046] As shown in FIG. 10, the first lid body 4 may have a first surface 411 that faces the first region 1a1. In this case, as shown in FIGS. 4 and 5, in a cross-sectional view (FIGS. 4 and 5 are cross-sectional views in the xz plane) intersecting the first upper surface 1a, the distance H from the conversion portion S11 to the first surface 411 is not less than 1 / 13.12 and not more than 1 / 9.85 of the signal wavelength λ transmitted by the signal conductor S1. The waveguide converter 101 in one embodiment is used in the waveguide conversion device 10 that handles signals in the frequency band of 65 GHz to 87 GHz, and each part of the waveguide converter 101 is set so that the operating frequency band is 65 GHz to 87 GHz. With the above-described configuration, the insertion loss and reflection loss in the frequency band of 65 GHz to 87 GHz can be reduced.

[0047] FIG. 12 is a graph showing the reflection characteristics of the waveguide converter 101 when the distance H from the conversion section S11 to the first surface 411 is changed. The horizontal axis represents the frequency (GHz) of the input signal, and the vertical axis represents the reflection characteristics (dB). Also, in the graph showing the reflection characteristics, the smaller the value of the reflection characteristics (dB), the smaller the signal reflection (the same applies to FIGS. 14 and 16 described later). The graph of FIG. 12 shows the reflection characteristics of the waveguide converter 101 having the following three different values of the distance H. The distance H in Example 1 is 0.35 mm (corresponding to 1 / 13.12 of the wavelength λ at a frequency of 65 GHz or 1 / 9.85 of the wavelength λ at a frequency of 87 GHz), the distance H in Example 2 is 1.154 mm (corresponding to 1 / 4 of the wavelength λ at a frequency of 65 GHz), and the distance H in Example 3 is 0.862 mm (corresponding to 1 / 4 of the wavelength λ at a frequency of 87 GHz). In Example 2 and Example 3, the distance H from the conversion section S11 to the first surface 411 is set to a known value as the distance to the short stub (1 / 4 of the wavelength λ of the signal frequency transmitted through the signal conductor S1). In FIG. 12, the reflection characteristics in each example are shown with Example 1 as a solid line, Example 2 as a dashed line, and Example 3 as a dotted line.

[0048] Referring to FIG. 12, it can be seen that in the operating frequency band (65 GHz to 87 GHz) of the waveguide 101, Example 1 provides better characteristics compared to Example 2 and Example 3.

[0049] FIG. 13 is a graph showing the passing characteristics of the waveguide converter 101 when the distance H from the conversion section S11 to the first surface 411 is changed. The horizontal axis represents the frequency (GHz) of the input signal, and the vertical axis represents the passing characteristics (dB). Also, in the graph showing the passing characteristics, the larger the value of the passing characteristics (dB), the smaller the signal loss (the same applies to FIG. 15 described later). The graph of FIG. 13 shows the passing characteristics of the waveguide converter 101 having the following three different values of the distance H. The distance H in Example 1 is 0.35 mm (corresponding to 1 / 13.12 of the wavelength λ at a frequency of 65 GHz, or 1 / 9.85 of the wavelength λ at a frequency of 87 GHz), the distance H in Example 2 is 1.154 mm (corresponding to 1 / 4 of the wavelength λ at a frequency of 65 GHz), and the distance H in Example 3 is 0.862 mm (corresponding to 1 / 4 of the wavelength λ at a frequency of 87 GHz). In Example 2 and Example 3, the distance H from the conversion section S11 to the first surface 411 is set to a conventionally known distance (1 / 4 of the wavelength λ of the signal frequency transmitted through the signal conductor S1) from the conversion section S11 to the short stub. In FIG. 12, the passing characteristics in each example are shown with Example 1 as a solid line, Example 2 as a dashed line, and Example 3 as a one-dot chain line.

[0050] Referring to FIG. 13, it can be seen that in the operating frequency band (from 65 GHz to 87 GHz) of the waveguide 101, Example 1 has better characteristics compared to Example 2 and Example 3.

[0051] As shown in FIG. 10, the first lid body 4 may have a second surface 412 that overlaps with the second upper surface 2a, and a first recess 41 having a first opening 41O in the second surface 412. The first recess 41 has a first surface 411. Since the first lid body 4 has the first recess 41, the height of the back short forming the short stub from the conversion section S11 (the distance H from the conversion section S11 to the first surface 411) can be accurately adjusted.

[0052] The area of the first opening 41O may be equal to or less than the area of the first region 1a1. In one embodiment, in a plan view, the area of the first opening 41O may be equal to or less than the area of the first region 1a1, and in a plan view, the first opening 41O may be located inside the first region 1a1. With the configuration as described above, since the joint area between the first lid body 4 and the first frame body 3 increases, the joint strength between the first lid body 4 and the first frame body 3 can be improved.

[0053] Here, when the area of the first opening 41O is smaller than the first region 1a1, as shown in FIGS. 4 and 5, the portion of the first lid body 4 surrounding the first opening 41O may protrude in the x direction. Here, the protruding portion is, for example, the portion indicated by Lx42. With this configuration, in a plan view, it is possible to easily overlap the first region 1a1 and the first opening 41O.

[0054] As shown in FIG. 6, the first upper surface 1a may have a third region 1a3 that is connected to the second region 1a2 and is located away from the first region 1a1. As shown in FIG. 8, the first frame body 2 further has a fifth end portion 25 and a sixth end portion 26 that are located facing each other with the third region 1a3 interposed therebetween in a plan view. The second region 1a2 is located between the first region 1a1 and the third region 1a3 in a plan view. The distance L12 in the y direction between the first end portion 21 and the second end portion 22 is equal to or less than the distance L56 in the y direction between the fifth end portion 25 and the sixth end portion 26. In this case, in the third region 1a3, the first ground conductor G1 and the signal conductor S1 are connected by a connection member such as a wire to an electronic component 104 described later. With the configuration as described above, in a plan view, since the third region 1a3 is larger than the second region 1a2 in the y direction, it is possible to easily connect the electronic component 104 to the first ground conductor G1 and the signal conductor S1 with a connection member such as a wire.

[0055] As shown in FIG. 7, the line portion S12 may have a first portion S12a. The dimension Ls1 of the first portion S12a in the y direction is the maximum dimension of the line portion S12 in the y direction. That is, the dimension Ls1 of the first portion S12a in the y direction is larger than the dimension Ls4 in the y direction of the portion of the line portion S12 other than the first portion S12a. By having the configuration as described above, a capacitive component can be added to the line portion S12, and the impedance can be adjusted. Therefore, in the signal conductor S1, the high-frequency characteristics are improved, and the frequency band to which the waveguide converter 101 can be applied can be widened.

[0056] Also, by positioning the line portion S12 closer to the first ground conductor G1 located across the line portion S12 in the y direction, a capacitive component can be added to the line portion S12. Therefore, the same effect as in the above case can be achieved.

[0057] In one embodiment, the line portion S12 extends to and is located in the third region 1a3 in a plan view. The first portion S12a is located from the second region 1a2 to the third region 1a3 in a plan view. Note that the first portion S12a may be located only in the second region 1a2 or only in the third region 1a3. Also, the line portion S12 may have a plurality of first portions S12a.

[0058] Note that in one embodiment, the dimension Ls1 of the first portion S12a in the y direction is smaller than the dimension Ls11 of the conversion portion S11 in the y direction, but can be changed according to the frequency of the signal transmitted through the signal conductor S1. That is, the dimension Ls1 of the first portion S12a in the y direction may be larger than the dimension Ls11 of the conversion portion S11 in the y direction, or may be the same.

[0059] FIG. 14 is a graph showing the reflection characteristics of the waveguide converter 101 with and without the first part S12a of the line part S12. In Example 1, the first part S12a is provided in the line part S12, and in Example 4, the first part S12a is not provided in the line part S12. In FIG. 14, the reflection characteristics in each example are shown with the solid line for Example 1 and the dashed line for Example 4. Referring to FIG. 14, it can be seen that the frequency band in which the reflection characteristics can be -15 dB or less is wider compared to Example 4.

[0060] FIG. 15 is a graph showing the transmission characteristics of the waveguide converter 101 with and without the first part S12a of the line part S12. In Example 1, the first part S12a is provided in the line part S12, and in Example 4, the first part S12a is not provided in the line part S12. In FIG. 15, the transmission characteristics in each example are shown with the solid line for Example 1 and the dashed line for Example 4. Referring to FIG. 15, it can be seen that in Example 1, the frequency band in which the transmission characteristics can be -0.6 dB or more is wider compared to Example 4.

[0061] As shown in FIG. 7, in a plan view, the distance Ls13 in the x direction from the conversion part S11 to the first part S12a may be 5 / 8 or more and 7 / 8 or less of the signal wavelength λ transmitted by the signal conductor S1. When the signal conductor S1 transmits a high-frequency signal, since the distance in the x direction from the conversion part S11 is around 3 / 4 of the signal wavelength λ to be transmitted and the inductive component increases, impedance adjustment can be performed by having the above-described configuration. As a result, the high-frequency characteristics of the signal conductor S1 can be improved. Here, the distance Ls13 can be defined as the distance from the center points in the x and y directions of the conversion part S11 to the center points in the x and y directions of the first part S12a.

[0062] FIG. 16 is a graph showing the reflection characteristics of the waveguide converter 101 when the distance Ls13 in the x direction from the line section S12 to the first section S12a is changed. The distance Ls13 in Example 1 is near 3 / 4 of the signal wavelength λ transmitted through the signal conductor S1, the distance Ls13 in Example 5 is near 1 / 2 of the signal wavelength λ, and the distance Ls13 in Example 6 is near 7 / 8 of the signal wavelength λ. In FIG. 16, the reflection characteristics in each example are shown with Example 1 as a solid line, Example 5 as a dashed line, and Example 6 as a one-dot chain line. Referring to FIG. 16, it can be seen that Example 1 has better characteristics compared to Example 5 and Example 6.

[0063] As shown in FIG. 7, in a plan view, the distance Ls13 in the x direction from the conversion section S11 to the first section S12a may be 1 / 8 or more and 3 / 8 or less of the signal wavelength λ transmitted through the signal conductor S1. When the signal conductor S1 transmits a high-frequency signal, since the distance in the x direction from the conversion section S11 is near 1 / 4 of the signal wavelength λ to be transmitted and the inductive component increases, impedance adjustment can be performed by having the above-described configuration. As a result, the high-frequency characteristics of the signal conductor S1 can be improved.

[0064] As shown in FIG. 10, the second surface 412 of the first lid 4 may have a first side 412a that overlaps with the second region 1a2 in a plan view. In this case, in the plan view, at least a part of the first section S12a of the line section S12 overlaps with the first side 412a. The first side 412a is a side that constitutes a part of the outer periphery of the second surface 412.

[0065] As shown in FIG. 7, the conversion unit S11 may have a second part S11b connected to the line part S12. Also, the line part S12 may have a third part S12b connected to the second part S11b. The dimension Ls11 of the conversion unit S11 in the y direction is larger than the dimension Ls3 of the third part S12b in the y direction. Further, the dimension Ls2 of the second part S11b in the y direction becomes smaller as it goes outward along the x direction (in one embodiment, in the negative direction of the x axis). With the configuration as described above, the possibility of a rapid change in impedance from the conversion unit S11 to the line part S12 can be reduced, and the mode conversion between the signal conductor S1 and the waveguide 107 can be made gentle. As a result, when the waveguide 107 is positioned below the conversion unit S11, the possibility of a rapid deterioration in reflection characteristics due to misalignment or the like can be reduced.

[0066] <Method for manufacturing a waveguide converter> Here, a method for manufacturing the waveguide converter 101 according to an embodiment of the present disclosure will be described. Note that the present disclosure is not limited to the following embodiments, and for example, it may be manufactured using a 3D printer. Also, as described above, the first substrate 1 and the first frame 2 do not necessarily need to be made of the same material as in the following manufacturing method.

[0067] (1) First, a plurality of green sheets are formed. Specifically, for example, an organic binder, a plasticizer, a solvent, etc. are added to and mixed with ceramic powder such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, or beryllium oxide to obtain a mixture. The obtained mixture is formed into layers to produce a plurality of green sheets. Next, the plurality of green sheets described above are processed using a mold or the like, and in plan view, a plurality of green sheets formed in the outer shapes of the first substrate 1 and the first frame 2 are prepared. Also, when the first substrate 1 and the first frame 2 have vias, holes that become the outer shapes of the vias are provided in the first substrate 1 and the first frame 2 using a mold or a laser or the like. When forming the waveguide converter 101 having the second frame 3, a green sheet formed in the outer shape of the second frame 3 is further prepared.

[0068] (2) Prepare high melting point metal powders such as tungsten or molybdenum, and add and mix an organic binder, a plasticizer, a solvent, etc. to this powder to prepare a metal paste. Next, print the metal paste in a predetermined pattern on a plurality of green sheets formed on the outer shapes of the first substrate 1 and the first frame 2 to form a signal conductor S1, a first ground conductor G1, and a second ground conductor G2. Note that the metal paste may contain glass or ceramics in order to increase the bonding strength with the first substrate 1 and the first frame 2. Also, fill the holes provided in the first substrate 1 and the first frame 2 in the step (1) described above with the metal paste to form vias.

[0069] (3) Stack the plurality of green sheets formed on the outer shapes of the first substrate 1 and the first frame 2 so that the outer edges thereof coincide to form a green sheet laminate. Note that after forming the green sheet laminate, the metal paste may be printed in a predetermined pattern, and then a signal conductor S1, a first ground conductor G1, a second ground conductor G2, and other wirings (for example, a third ground conductor G3) may be formed.

[0070] (4) By firing the green sheet laminate, sinter the plurality of green sheets to obtain a sintered body in which the first substrate 1 and the first frame 2 are laminated.

[0071] (5) Form the first lid 4 by subjecting the ingot of the metal material constituting the first lid 4 to a metal processing method such as a rolling process or a punching process.

[0072] (6) By bonding the first lid 4 to the sintered body prepared in the step (4) described above using a bonding material, obtain a waveguide converter 101.

[0073] <Configuration of Package for Mounting Electronic Components> Next, the package 100 for mounting electronic components according to an embodiment of the present disclosure will be described with reference to FIG. 11. FIG. 11 is an exploded perspective view of a waveguide conversion device 10 including a package 100 for mounting electronic components and having a waveguide converter 101 according to an embodiment of the present disclosure. The package 100 for mounting electronic components includes a second substrate 102, a waveguide converter 101, and a third frame 103.

[0074] The second substrate 102 has a third upper surface 102a, a third lower surface 102b opposite to the third upper surface 102a, and a through hole 102H. The second substrate 102 is, for example, rectangular in plan view, has a size of 10 mm × 10 mm to 100 mm × 100 mm, and a thickness of 0.5 mm to 20 mm. Examples of the material of the second substrate 102 include metal materials such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or alloys containing these metal materials. In this case, the second substrate 102 may be a single metal plate or a laminate obtained by laminating a plurality of metal plates. Further, when the material of the second substrate 102 is the above metal material, a plating layer such as nickel or gold may be formed on the surface of the second substrate 102 by an electroplating method or an electroless plating method in order to reduce oxidation corrosion. Further, the material of the second substrate 102 may be an insulating material, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics.

[0075] The through hole 102H penetrates from the third upper surface 102a to the third lower surface 102b. Further, the waveguide converter 101 is located overlapping the through hole 102H in plan view on the third upper surface 102a. In plan view, the through hole 102H is located overlapping the first region 1a1 and the conversion section S11. Further, in plan view, the through hole 102H is located overlapping a waveguide 107, which will be described later.

[0076] The third frame body 103 is joined to the third upper surface 102a and is positioned surrounding the waveguide converter 101. The third frame body 103 is, for example, square-shaped in a plan view, has a size of 10 mm × 10 mm to 100 mm × 100 mm, and a thickness of 0.5 mm to 20 mm. The material of the third frame body 103 may be the same as or different from the material of the second substrate 102. For example, the same material as that of the first frame body 2 described above can be mentioned. The third frame body 103 may have a wiring portion for electrically connecting to the electronic component 104 described later. The wiring portion may be formed using a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese on the green sheet that forms the outer shape of the third frame body 103. Further, the wiring portion may be formed by sintering a metal paste, or may be formed using a thin film forming technique such as vapor deposition or sputtering. An insulating film such as ceramic (for example, alumina coat) or resin may be located on a part of the wiring portion.

[0077] The third frame body 103 can be joined to the second substrate 102 via a bonding material such as a brazing material. The material of the brazing material is, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0078] The second substrate 102 may further have a second recess 102K including a second opening 102O on the third upper surface 102a. The second recess 102K has the aforementioned through-hole 102H. In this case, the waveguide converter 10 is located in the second recess 102K. The first substrate 1 has a second side 12 and a third side 13 connected to the second side 12 via the first corner 1K in plan view. The second opening 102O has a fourth side 1024 and a fifth side 1025 connected to the fourth side 1024 via the second corner 1026 in plan view. The second side 12 is in contact with at least a part of the fourth side 1024. The third side 13 is in contact with at least a part of the fifth side 1025. With such a configuration, when mounting the waveguide converter 101 on the second substrate 102, the first substrate 1 of the waveguide converter 101 can be mounted while being applied to the fourth side 1024 and the fifth side 1025. Therefore, the waveguide converter 101 can be mounted on the second substrate 102 with high positional accuracy. In one embodiment, the side where the signal conductor S1 is located is defined as the second side 12. By this, when the electronic component 104 and the signal conductor S1 are electrically connected via a connection member such as a wire, the possibility of positional deviation can be reduced in the direction (x direction) in which the wire is connected, and the impedance fluctuation can be reduced.

[0079] When the first substrate 1 is a polygon such as a rectangle, any corner may be defined as the first corner 1K. By determining the first corner 1K, the second side 12 and the third side 13 can be uniquely determined. Also, by determining the second side 12 and the third side 13, the fourth side 1024 and the fifth side 1025 can be uniquely determined.

[0080] Further, as shown in one embodiment, the corner portion (including the first corner portion 1K) of the first substrate 1 may be rectangular with rounded corners. With such a configuration, the possibility of the first substrate 1 being damaged during the manufacture of the waveguide converter 101 or during mounting on the second substrate 102 can be reduced. Similarly, the first frame body 2 and the second frame body 3 may also be rectangular with rounded corners in plan view. With such a configuration, the above-described effects can be obtained similarly. Note that the corner portion (including the first corner portion 1K) of the first substrate 1 is not limited to the above-described embodiment, and may be, for example, a rectangular shape with rounded corners.

[0081] <Configuration of Waveguide Conversion Device> Next, a waveguide conversion device 10 according to an embodiment of the present disclosure will be described. As shown in FIG. 11, the waveguide conversion device 10 includes at least an electronic component mounting package 100, an electronic component 104, a second lid 106, and a waveguide 107.

[0082] The electronic component 104 is located on the third upper surface 102a of the second substrate 102 and is electrically connected to the waveguide converter 101 of the electronic component mounting package 100. The electronic component 104 may be a component that performs signal processing such as converting an optical signal into an electrical signal or converting an electrical signal into an optical signal. Although not shown, the electronic component 104 and the waveguide converter 101 are electrically connected by a connecting member such as a wire made of a conductive metal material. The electronic component 104 and the third frame body 103 may be electrically connected by a connecting member such as a wire. The electronic component 104 may be directly mounted on the second base portion 102 or may be mounted via a pedestal component such as a submount.

[0083] The second lid 106 is located on the third frame 103 and covers the inside of the package 100 for mounting electronic components. The second lid 106 protects the electronic component 104 together with the second frame 103. The second lid 106 is, for example, square in plan view, with a size of 10 mm × 10 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 2 mm. Examples of the material of the second lid 106 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten, or alloys formed by combining a plurality of these metal materials. By subjecting such an ingot of a metal material to metal processing methods such as a rolling process or a punching process, a metal member constituting the second lid 106 can be produced.

[0084] The second lid 106 may be joined to the third frame 103 via a sealing ring or the like, or may be joined via a joining material such as solder, brazing material, glass, or resin adhesive. The waveguide 107 is located on the side of the third lower surface 102b of the second substrate 102. Examples of the material of the waveguide 107 include conductors such as metal. A printed circuit board (PCB) or the like is located between the second substrate 102 and the waveguide 107, and the second substrate 102 (package 100 for mounting electronic components) may be joined to the waveguide 107 via a printed circuit board or the like.

[0085] Due to the configuration of the waveguide converter according to one embodiment as described above, the strength of the waveguide converter can be improved, and the possibility of the first substrate being damaged can be reduced. In addition, since the thickness of the first substrate can be reduced thereby, good high-frequency characteristics can be obtained.

[0086] Note that various combinations of the characteristic parts in one embodiment are not limited to the examples of the above-described embodiments. Combinations of different embodiments are also possible.

Industrial Applicability

[0087] The present disclosure can be used as a waveguide converter, an electronic component mounting package, and a waveguide conversion device.

Explanation of Signs

[0088] 1 First substrate 1a First upper surface 1a1 First region 1a2 Second region 1a3 Third region 1b First lower surface 12 Second side 13 Third side 1K First corner G1 First ground conductor G2 Second ground conductor G3 Third ground conductor S1 Signal conductor S11 Conversion part S11b Second part S12 Line part S12a First part S12b Third part 2 First frame 2a Second upper surface 2c Inner surface 21 First end 22 Second end 25 Fifth end 26 Sixth end 3 Second frame 33 Third end 34 Fourth end 4 First cover 41 First recess 41O First opening 411 First surface 412 Second surface 412a First side L12 Distance between the first end and the second end L34 Distance between the third end and the fourth end L56 Distance between the fifth end and the sixth end Ls1 Dimension of the first part Ls2 Dimension of the second part Ls3 Dimension of the third part Ls4 Dimension of the part other than the first part of the line part Ls11 Dimension of the conversion part Distance from the Ls13 conversion section to the first section Distance between the H conversion section and the first surface 10 Waveguide conversion device 100 Package for mounting electronic components 101 Waveguide converter 102 Second substrate 102a Third upper surface 102b Third lower surface 1024 Fourth side 1025 Fifth side 1026 Second corner 102K Second recess 102O Second opening 102H Through-hole 103 Third frame 104 Electronic component 106 Second cover 107 Waveguide

Claims

1. A first substrate having a first upper surface including a first region and a second region extending from the first region; A signal conductor having a conversion portion located in the first region and a circuit portion connected to the conversion portion and extending at least from the first region to the second region; A first ground conductor located in the second region of at least the first upper surface and sandwiching the circuit portion in a plan view; A first frame body made of a non-metallic material, located on the first upper surface, surrounding at least a part of the first region and the second region in a plan view, and having a second upper surface and an inner surface connecting to the second upper surface; A second ground conductor located on the second upper surface; A first cover body made of a metallic material, located on the second upper surface and covering the first region in a plan view, and comprising: The first frame body further has a first end portion and a second end portion that are located opposite to each other with the second region sandwiched therebetween in a plan view; A waveguide converter in which the first ground conductor, the second ground conductor, and the first cover body are electrically connected.

2. In a plan view, when the direction in which the circuit portion extends is defined as a first direction and the direction intersecting the first direction is defined as a second direction, The waveguide converter according to claim 1, further comprising a second frame body made of a non-metallic material, located on the second upper surface, and surrounding at least a part of the first region outside the inner surface in a plan view; In a plan view, the second frame body has a third end portion and a fourth end portion that are located opposite to each other in the second direction.

3. The waveguide converter according to claim 2, wherein the distance in the second direction between the first end portion and the second end portion is equal to or less than the distance in the second direction between the third end portion and the fourth end portion.

4. The first cover body has a first surface located opposite to the first region; In a cross-sectional view intersecting the first upper surface, the distance from the conversion portion to the first surface is not less than 1 / 13.12 and not more than 1 / 9.85 of the signal wavelength λ transmitted by the signal conductor. The waveguide converter according to any one of claims 1 to 3.

5. The first cover body has a second surface overlapping with the second upper surface and a first recess having a first opening in the second surface; In a plan view, the area of the first opening is equal to or less than the area of the first region. The waveguide converter according to any one of claims 1 to 3.

6. The first lid has a second surface that overlaps with the second upper surface, and a first recess having a first opening in the second surface. The waveguide converter according to claim 4, wherein the first recess has the first surface.

7. The first upper surface has a third region that is connected to the second region and is located away from the first region. The first frame further has a fifth end portion and a sixth end portion that are positioned facing each other with the third region interposed therebetween in a plan view. The second region is located between the first region and the third region in a plan view. In a plan view, when the direction in which the line portion extends is defined as a first direction and the direction intersecting the first direction is defined as a second direction. The waveguide converter according to any one of claims 1 to 3, wherein the distance in the second direction between the first end portion and the second end portion is equal to or less than the distance in the second direction between the fifth end portion and the sixth end portion.

8. The line portion has a first portion that is located away from the conversion portion in a plan view. The waveguide converter according to claim 2 or 3, wherein the dimension of the first portion in the second direction is the maximum dimension of the line portion in the second direction.

9. The waveguide converter according to claim 8, wherein the distance in the first direction from the conversion portion to the first portion in a plan view is equal to or more than 5 / 8 and equal to or less than 7 / 8 of the signal wavelength λ transmitted by the signal conductor.

10. The waveguide converter according to claim 8, wherein the distance in the first direction from the conversion portion to the first portion in a plan view is equal to or more than 1 / 8 and equal to or less than 3 / 8 of the signal wavelength λ transmitted by the signal conductor.

11. The second surface of the first lid that overlaps with the second upper surface has a first side that overlaps with the second region in a plan view. The waveguide converter according to claim 8, wherein at least a part of the first portion overlaps with the first side in a plan view.

12. In a plan view, when the direction in which the line portion extends is defined as a first direction and the direction intersecting the first direction is defined as a second direction. The conversion portion has a second portion that is connected to the line portion. The line portion has a third portion that is connected to the second portion. The dimension of the conversion portion in the second direction is larger than the dimension of the third portion in the second direction. The waveguide converter according to any one of claims 1 to 3, wherein the dimension of the second part in the second direction becomes smaller as it goes outward along the first direction.

13. A third upper surface, a third lower surface on the side opposite to the third upper surface, and a second substrate having a through hole penetrating from the third upper surface to the third lower surface; On the third upper surface, in a plan view, the waveguide converter according to claim 1, which is positioned to overlap the through hole; An electronic component mounting package, comprising: a third frame body that is joined to the third upper surface and is positioned so as to surround the waveguide converter.

14. The second substrate further has a second recess including a second opening on the third upper surface; The second recess has the through hole; The waveguide converter is positioned in the second recess; The first substrate has a second side and a third side connected via the second side and a first corner portion in a plan view; The second opening has a fourth side and a fifth side connected via the fourth side and a second corner portion in a plan view; The second side is in contact with at least a part of the fourth side; The electronic component mounting package according to claim 13, wherein the third side is in contact with at least a part of the fifth side.

15. The electronic component mounting package according to claim 13 or 14; An electronic component positioned on the third upper surface of the second substrate and electrically connected to the waveguide converter of the electronic component mounting package; A second lid positioned on the third frame body and covering the inside of the electronic component mounting package; A waveguide converter device, comprising: a waveguide positioned on the third lower surface side of the second substrate.

Images