Semiconductor Devices

Abstract

The present invention inhibits misalignment of a center position of a hole that is detected by a binarization process based on an image of a flange portion of a sleeve.　A sleeve (30A) comprises: a cylindrical portion (32) that is mounted to an electrically conductive layer of an insulated circuit board of a semiconductor device, and has a hole (31); and a flange portion (33) that is provided at an open end thereof. The flange portion (33) has a plurality of protrusions (34) that extend from a first outer edge portion (36a) of an inner surface (36) of the hole (31) to an outer circumference (33a) as seen in a plan view from the open end side of the flange portion (32), and a plurality of recesses (35) that are provided between the protrusions and extend from a second outer edge portion (36b) of the inner surface (36) to the outer circumference (33a). Each protrusion (34) has a top surface (34a) that is continuous with the inner surface (36) at the first outer edge portion (36a), and each recess (35) has a bottom surface (35a) that is continuous with the inner surface (36) at the second outer edge portion (36b).

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device. [Background technology]

[0002] A technique is known in which a connection element having a cylindrical shaft into which a connection pin is inserted and a flange provided at the end thereof is soldered onto a conductive area of a circuit carrier, and a technique is known in which a plurality of webs are provided on the end face of the flange, protruding at a predetermined height from the flat surface thereof, along the outer edge of the flange (Patent Document 1).

[0003] Also, a technology is known in which a contact component has a hollow hole into which an external terminal fits and a flange at its lower end that is solder-bonded to a metal area on an insulating substrate, and the end face of the flange is provided with a flat bottom and a recess extending from the inner peripheral edge of the tube to the outer peripheral edge of the flange, and a cutout portion such as a chamfered portion, a stepped portion, or a concave processed portion is provided at the lower end of the interior of the tube (Patent Document 2).

[0004] Also known is a technology for providing multiple protrusions on a flange portion connected to the end of the cylindrical portion of a tubular component that is solder-joined to a circuit layer of a laminated substrate, so that the distance between adjacent protrusions is greater than the inner diameter of the cylindrical portion, and a technology for providing multiple protrusions not on the curved portion on the inner circumference that connects to the cylindrical portion, but on a disk-shaped flat portion on the outer circumference that connects to the curved portion, so that they are in contact with the outer periphery of the flange portion (Patent Document 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US Patent Application Publication No. 2009 / 0194884 [Patent Document 2] International Publication No. 2014 / 148319 Brochure [Patent Document 3] Japanese Patent Application Publication No. 2017-11221 Summary of the Invention [Problem to be solved by the invention]

[0006] In a semiconductor device in which a cylindrical component called a sleeve for inserting an external terminal is connected to the conductive layer of an insulated circuit board having an insulating substrate and a conductive layer disposed on the main surface of the insulating substrate, an automatic insertion machine is used, for example, to insert one end of the external terminal into a hole in the sleeve. Prior to insertion of the external terminal using the automatic insertion machine, the sleeve is first binarized based on an image captured from the sleeve side of the insulated circuit board, and the center position of the sleeve hole is detected. The automatic insertion machine then inserts one end of the external terminal into the center position of the sleeve hole thus detected.

[0007] A sleeve typically includes a cylindrical portion with a hole and flanges at both ends of the opening. The flange end surface, where image acquisition and binarization based on the image are performed, has traditionally been provided with the above-described irregularities to allow for soldering between the flange and the conductive layer of the insulated circuit board. However, in this case, when acquiring an image from the flange side of the sleeve, depending on the arrangement of the irregularities on the end surface and the resulting shadows, the center position of the sleeve hole detected by the binarization process may be offset from the actual center position. If the center position of the hole detected by the binarization process is offset, an automatic insertion machine may insert one end of the external terminal relative to the offset center position, resulting in the external terminal being inserted into the sleeve at an angle.

[0008] Such an inclination of the external terminal may result in damage due to a collision with the misaligned end when attempting to insert the other end of the external terminal opposite the sleeve insertion side into a component such as a circuit board, or in poor insertion where the external terminal is not inserted into the specified insertion position.

[0009] In one aspect, the present invention aims to realize a semiconductor device that can reduce the deviation of the center position of a hole detected by binarization processing based on an image of the flange portion of the sleeve, and can reduce the inclination of an external terminal, one end of which is inserted into the sleeve. [Means for solving the problem]

[0010] In one aspect, an insulating circuit board includes an insulating substrate and a conductive layer disposed on a main surface of the insulating substrate, and a sleeve connected to the conductive layer, wherein the sleeve includes a cylindrical portion having a hole extending in a direction perpendicular to the conductive layer, and a flange portion provided at an open end of the cylindrical portion, wherein the flange portion includes, in a plan view seen from the open end side, a plurality of protrusions extending from a first outer edge portion on the inner surface of the hole to an outer periphery of the flange portion, and a plurality of recesses provided between the plurality of protrusions in a plan view seen from the open end side, the plurality of recesses extending from a second outer edge portion on the inner surface to the outer periphery, each of the plurality of protrusions having a top surface continuous with the inner surface at the first outer edge portion, and each of the plurality of recesses having a bottom surface continuous with the inner surface at the second outer edge portion. An external terminal is inserted into the hole in the cylindrical portion of the sleeve. , a semiconductor device is provided.

[0011] In one embodiment, an insulating circuit board includes an insulating substrate and a conductive layer disposed on a main surface of the insulating substrate, and a sleeve connected to the conductive layer, wherein the sleeve includes a cylindrical portion having a hole extending in a direction perpendicular to the conductive layer, and a flange portion provided at an open end of the cylindrical portion, wherein the flange portion includes, in a plan view seen from the open end side, a plurality of protrusions extending from a first outer edge portion on the inner surface of the hole to an outer periphery of the flange portion, and a plurality of recesses provided between the plurality of protrusions in a plan view seen from the open end side, the recesses extending from a second outer edge portion on the inner surface to the outer periphery, and wherein, in a plan view seen from the open end side, a total length of the first outer edge portions is equal to or greater than a total length of the second outer edge portions. An external terminal is inserted into the hole in the cylindrical portion of the sleeve. , a semiconductor device is provided. [Effects of the Invention]

[0012] In one aspect, it is possible to reduce the deviation of the center position of the hole detected by binarization processing based on an image of the flange portion of the sleeve, thereby realizing a semiconductor device that can reduce the inclination of the external terminal, one end of which is inserted into the sleeve.

[0013] The above and other objects, features and advantages of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings illustrating preferred embodiments of the present invention. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a diagram (part 1) illustrating an example of a semiconductor device. [Figure 2] FIG. 10 is a diagram (part 2) illustrating an example of a semiconductor device. [Figure 3] FIG. 1 is a diagram (part 1) for explaining the insertion of an external terminal into a sleeve mounted on an insulating circuit board. [Figure 4] FIG. 2 is a diagram (part 2) for explaining the insertion of an external terminal into a sleeve mounted on an insulating circuit board. [Figure 5] FIG. 10 is a diagram (part 3) for explaining the insertion of an external terminal into a sleeve mounted on an insulating circuit board. [Figure 6] FIG. 4 is a diagram (part 4) for explaining the insertion of an external terminal into a sleeve mounted on an insulating circuit board. [Figure 7] FIG. 2 is a diagram (part 1) illustrating an example of a sleeve according to the first embodiment. [Figure 8] FIG. 10 is a diagram (part 2) illustrating an example of a sleeve according to the first embodiment. [Figure 9] 4A and 4B are diagrams illustrating an example of a state of a sleeve when photographing the sleeve according to the first embodiment. [Figure 10] 10A and 10B are diagrams illustrating an example of a sleeve according to a second embodiment. [Figure 11] 10A and 10B are diagrams illustrating an example of a sleeve according to a third embodiment. [Figure 12]FIG. 10 is a diagram (part 1) illustrating an example of a sleeve according to a fourth embodiment. [Figure 13] FIG. 10 is a diagram (part 2) illustrating an example of a sleeve according to the fourth embodiment. [Figure 14] 13A and 13B are diagrams illustrating an example of a sleeve according to a fifth embodiment. [Figure 15] 13A and 13B are diagrams illustrating an example of a sleeve according to a sixth embodiment. [Figure 16] FIG. 13 is a diagram illustrating an example of a semiconductor device according to a seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] First, a configuration example of a semiconductor device will be described. 1 and 2 are diagrams illustrating an example of a semiconductor device. Fig. 1 shows a circuit diagram of the example of the semiconductor device. Fig. 2 shows a schematic cross-sectional view of a main part of the example of the semiconductor device.

[0016] Fig. 1 shows a circuit diagram of a semiconductor device 1 including a three-phase voltage-type inverter circuit. The semiconductor device 1 shown in Fig. 1 is an example of a PIM (Power Integrated Module) including an inverter circuit using a voltage-type PWM (Pulse Width Modulation) control method. The semiconductor device 1 includes a converter circuit section 2, an inverter circuit section 3, a regenerative power discharge circuit section 4 (dynamic brake section), and a thermistor 5.

[0017] The converter circuit section 2 includes a diode bridge circuit 2a for the R, S, and T phases of a three-phase AC power supply. current is rectified to DC current Convert to. The inverter circuit 3 generates a direct current by PWM control. Current Three-phase AC: U, V, and W phases Convert to current do.

[0018] Here, the inverter circuit unit 3 includes semiconductor elements 3a and 3b connected in series. The semiconductor elements 3a and 3b each include a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). The switching elements used in the semiconductor elements 3a and 3b may each be connected to a diode element such as an FWD (Free Wheeling Diode) or an SBD (Schottky Barrier Diode). In the example of FIG. 1, the semiconductor element 3a is an RC (Reverse Conducting)-IGBT in which an IGBT 3aa and an FWD 3ab are connected, and the semiconductor element 3b is an RC-IGBT in which an IGBT 3ba and an FWD 3bb are connected.

[0019] In the semiconductor element 3a, the collector of IGBT 3aa is connected to the cathode of FWD 3ab, and the emitter of IGBT 3aa is connected to the anode of FWD 3ab. In the semiconductor element 3b, the collector of IGBT 3ba is connected to the cathode of FWD 3bb, and the emitter of IGBT 3ba is connected to the anode of FWD 3bb. The emitter of IGBT 3aa in the semiconductor element 3a is connected to the collector of IGBT 3ba in the semiconductor element 3b. The semiconductor element 3a constitutes the upper arm of the inverter circuit unit 3. The semiconductor element 3b constitutes the lower arm of the inverter circuit unit 3. The collector of the semiconductor element 3a is connected to the positive (P) terminal. The emitter of the semiconductor element 3b is connected to the negative (N) terminal. The connection node between the series-connected semiconductor elements 3a and 3b is connected to an output terminal from which an output current is output.

[0020] The semiconductor element 3a constituting the upper arm is not limited to including a pair of IGBT 3aa and FWD 3ab, but may be a plurality of pairs of IGBT 3aa and FWD 3ab connected in parallel.The semiconductor element 3b constituting the lower arm is not limited to including a pair of IGBT 3ba and FWD 3bb, but may be a plurality of pairs of IGBT 3ba and FWD 3bb connected in parallel.

[0021] Three pairs of semiconductor elements 3a and 3b constituting the upper and lower arms as described above are connected in parallel between the PN terminals to realize the inverter circuit unit 3. The output terminals of the three pairs of semiconductor elements 3a and 3b correspond to the U-phase, V-phase and W-phase output nodes of the inverter circuit unit 3, respectively, and are connected to a load, for example, a motor.

[0022] Here, the semiconductor element 3a includes the IGBT 3aa and the FWD 3ab, and the semiconductor element 3b includes the IGBT 3ba and the FWD 3bb. Alternatively, the IGBT 3aa and the IGBT 3ba may be replaced with other switching elements such as MOSFETs, and the FWD 3ab and the FWD 3bb may be replaced with other diode elements such as SBDs.

[0023] The regenerative power discharge circuit 4 includes a semiconductor element 4a such as an IGBT and a diode 4b, and is used to suppress a voltage rise caused by energy generated during regenerative operation of the motor. The thermistor 5 is built into the module insulated from the main circuit, and is used to detect temperature to prevent damage caused by abnormal heat generation due to increased loss in the IGBT.

[0024] A semiconductor device 1 that realizes the above circuit can have a configuration as shown in FIG. 2, for example. The semiconductor device 1 (also referred to as a "semiconductor module") shown in the example of FIG. 2 includes an insulating circuit board 10, a semiconductor element 20, a sleeve 30, external terminals 40, a case 50, and a sealing resin 60.

[0025] The insulating circuit board 10 includes an insulating substrate 11, conductive layers 12, 13, and 14 disposed on a main surface 11a of the insulating substrate 11, and a conductive layer 15 disposed on a main surface 11b opposite the main surface 11a of the insulating substrate 11. The insulating substrate 11 is made of alumina, a composite ceramic containing alumina as a main component, aluminum nitride, silicon nitride, or the like. The conductive layers 12, 13, 14, and 15 are made of a conductive material such as copper. The insulating circuit board 10 may be, for example, a direct copper bonding (DCB) substrate. Other substrates such as an active metal brazed (AMB) substrate may also be used for the insulating circuit board 10. A semiconductor element 20 and a sleeve 30 are mounted at predetermined positions on the conductive layers 12, 13, and 14 provided on the main surface 11a of the insulating substrate 11 of the insulating circuit board 10.

[0026] For example, in the inverter circuit unit 3 described above, a semiconductor element 20 functioning as a switch element of an upper arm of the inverter circuit unit 3 is mounted on the conductive layer 12, and a semiconductor element 20 functioning as a switch element of a lower arm of the inverter circuit unit 3 is mounted on the conductive layer 13. Each semiconductor element 20 uses a switch element such as an IGBT or a MOSFET. For example, a diode element such as an FWD or an SBD is integrated in each semiconductor element 20.

[0027] The semiconductor element 20 of the inverter circuit unit 3 has a collector electrode on one side and a gate electrode and an emitter electrode on the other side. The upper arm semiconductor element 20 has a collector electrode connected to the conductive layer 12 using a bonding material such as solder or a sintered material, and an emitter electrode connected to the conductive layer 13 using a wire 71. Although not shown in detail here, a wire 72 connected to the gate electrode of the upper arm semiconductor element 20 is connected to a gate terminal provided on the case 50 or a conductive layer connected thereto. The lower arm semiconductor element 20 has a collector electrode connected to the conductive layer 13 using a bonding material such as solder or a sintered material, and an emitter electrode connected to the conductive layer 14 using a wire 73. Although not shown in detail here, a wire 74 connected to the gate electrode of the lower arm semiconductor element 20 is connected to a gate terminal provided on the case 50 or a conductive layer connected thereto. The semiconductor elements 20 on the upper and lower arms are connected in series using the conductive layers 12, 13 and 14, and the wires 71 and 73.

[0028] 2 shows two semiconductor elements 20 in cross section, the number of semiconductor elements 20 mounted on the insulating circuit board 10 is not limited to this. Furthermore, the semiconductor elements 20 mounted on the insulating circuit board 10 are not limited to those used in the inverter circuit section 3 described above, but may include those used in the regenerative power discharge circuit section 4 described above, etc. Furthermore, the insulating circuit board 10 may be mounted with a diode bridge circuit 2a used in the converter circuit section 2 described above, a diode 4b used in the regenerative power discharge circuit section 4, etc.

[0029] The sleeves 30 are mounted on, for example, the conductive layers 12, 13, and 14, respectively. The sleeves 30 are made of a conductive material such as copper. Each sleeve 30 includes a cylindrical portion 32 having a hole 31 extending in a direction D1 perpendicular to the conductive layers 12, 13, and 14, and a flange portion 33 provided at each of both open ends of the cylindrical portion 32. The flange portion 33 provided at one open end of each sleeve 30 is joined (solder-joined) to a predetermined one of the conductive layers 12, 13, and 14 via solder 80. The sleeve 30 is electrically connected to a predetermined one of the conductive layers 12, 13, and 14 via the solder 80.

[0030] The external terminals 40 are pin-shaped. One first end 41 of the pin-shaped external terminal 40 is inserted into the hole 31 of the sleeve 30 mounted on the insulating circuit board 10. The first end 41 of the external terminal 40 is inserted into and fixed in the hole 31 of the sleeve 30 by means of press-fitting, fitting, or the like. The external terminal 40 is electrically connected to the sleeve 30 by inserting the first end 41 into the hole 31 of the sleeve 30. For example, if the semiconductor element 20 is used in the inverter circuit unit 3 as described above, the external terminal 40 inserted into the sleeve 30 mounted on the conductive layer 12 functions as a P terminal, the external terminal 40 inserted into the sleeve 30 mounted on the conductive layer 14 functions as an N terminal, and the external terminal 40 inserted into the sleeve 30 mounted on the conductive layer 13 functions as an output terminal (U-phase, V-phase, or W-phase).

[0031] Although Figure 2 shows three sleeves 30 and external terminals 40 inserted into them in cross section, the number of sleeves 30 and external terminals 40 mounted on the insulating circuit board 10 is not limited to this.

[0032] The case 50 is provided so as to cover the side of the insulating circuit board 10 on which the semiconductor element 20 and the sleeve 30 are mounted. The case 50 is, for example, a resin case formed using a resin material such as PPS (Poly-Phenylene-Sulfide) resin. For example, the lower end of the case 50 is fixed to the edge of the insulating circuit board 10 using an adhesive or the like (not shown). An opening 51 is provided in the case 50 at a position facing the sleeve 30 mounted on the insulating circuit board 10. The external terminal 40, with a first end 41 inserted into the sleeve 30, is inserted into the opening 51 of the case 50, and a second end 42 on the other side opposite the first end 41 inserted into the sleeve 30, is drawn out to the outside of the case 50.

[0033] The second ends 42 of the external terminals 40 drawn out of the case 50 are inserted into and connected to, for example, connection holes of a circuit board (not shown here) having connection holes at positions corresponding to the external terminals 40. This electrically connects the circuit board and the insulating circuit board 10 on which the semiconductor elements 20 and the like are mounted via the external terminals 40. The second ends 42 of the external terminals 40 may have a press-fit shape that allows them to be inserted into and connected to connection holes of such a circuit board.

[0034] The case 50 is provided with a sealing resin 60 inside to seal the insulating circuit board 10, the semiconductor element 20 mounted thereon, the sleeve 30, and the like. The sealing resin 60 may be made of, for example, a resin material such as epoxy resin or phenolic resin, or a gel material such as silicone. The sealing resin 60 may contain an insulating filler such as silica. The sealing resin 60 may be made of a plurality of materials, and may have a layered structure in which, for example, a gel material such as silicone is provided as a buffer coating material in a lower layer, and a resin material such as epoxy resin is provided as an upper layer.

[0035] A base plate, a heat sink, a cooler, etc. may be connected to the conductive layer 15 side of the insulating circuit board 10, opposite to the side on which the semiconductor element 20, the sleeve 30, etc. are mounted. For example, the base plate, heat sink, cooler, etc. are joined to the conductive layer 15 via a thermally conductive material such as a TIM (Thermal Interface Material), solder, or sintered material.

[0036] In assembling the semiconductor device 1 having the above configuration, after the sleeve 30 is mounted on the insulating circuit board 10, the external terminals 40 are inserted into the sleeve 30 before the case 50 and the sealing resin 60 are arranged. An automatic insertion machine, for example, is used to insert the external terminals 40. When inserting the external terminals 40 using the automatic insertion machine, first, prior to the insertion, binarization processing of the sleeve 30 is performed based on an image acquired by photographing the sleeve 30 side of the insulating circuit board 10, and the center position of the hole 31 in the sleeve 30 is detected. Then, the automatic insertion machine inserts the first end 41 of the external terminal 40 into the center position of the hole 31 in the sleeve 30 thus detected. Insertion of the external terminals 40 into the sleeve 30 mounted on the insulating circuit board 10 will be described with reference to FIGS. 3 to 6 .

[0037] 3 to 6 are diagrams for explaining the insertion of external terminals into sleeves mounted on an insulating circuit board. Fig. 3(A) is a schematic plan view of a main part of an example of an insulating circuit board 10 mounted with a sleeve 30. Fig. 3(B) is a schematic cross-sectional view of a main part of an example of an insulating circuit board 10 mounted with a sleeve 30 during an image acquisition process.

[0038] A plurality of sleeves 30 are mounted on predetermined conductive layers (not shown) of the insulating circuit board 10 via solder 80. The sleeves 30 can be mounted at various locations on the insulating circuit board 10. For example, as shown in Figures 3(A) and 3(B), the sleeves 30 are mounted via solder 80 to a central region 10a of the insulating circuit board 10 and an outer peripheral region 10b surrounding the central region 10a.

[0039] 3(B), the insulating circuit board 10 on which the sleeve 30 is mounted is illuminated from the mounting surface side of the sleeve 30 and photographed using the imaging device 100 to obtain an image. Based on the obtained image, the sleeve 30 is binarized and the center position of the hole 31 in the sleeve 30 is detected.

[0040] Here, when acquiring an image using the imaging device 100, the sleeve 30 located in the central region 10a of the insulating circuit board 10 is photographed from directly above, while the sleeve 30 located in the peripheral region 10b of the insulating circuit board 10 is photographed at an angle from an oblique direction.

[0041] Furthermore, the sleeve 30 typically includes a cylindrical portion 32 having a hole 31 and flange portions 33 provided at both open ends thereof. The end face of the flange portion 33 of such a sleeve 30 is formed with a recess that serves as a path for discharging volatile gas components such as flux that are generated during soldering between the flange portion 33 and the insulated circuit board 10 to the outside, thereby providing an uneven surface. The end face of the flange portion 33 at both open ends of the sleeve 30 is provided with such an uneven surface. Therefore, when an image is acquired, a shadow caused by the uneven surface may appear on the end face of the flange portion 33 depending on the position of the sleeve 30 on the insulated circuit board 10, i.e., depending on the direction from which the sleeve 30 is photographed.

[0042] Fig. 4(A) shows a schematic plan view of an example of an image of the sleeve 30 taken from directly above, and Fig. 4(B) shows a schematic plan view of an example of an image of the sleeve 30 taken at an angle.

[0043] 4(A) and 4(B) show an example of a sleeve 30Z in which protrusions 34Z are arranged at three locations along the outer periphery 33Za of a flange portion 33Z provided on both open end sides of a cylindrical portion 32Z, and recesses 35Z are arranged in a region from the periphery of a hole 31Z to the outer periphery 33Za between adjacent protrusions 34Z of the flange portion 33Z. Note that an uneven shape such as this sleeve 30Z is described in the above-mentioned Patent Document 1, etc.

[0044] In a sleeve 30Z having such convex portions 34Z and concave portions 35Z arranged on a flange portion 33Z, when photographed from directly above, the outline of the hole 31Z on the upper opening end side (photographed surface side) overlaps with the outline of the hole 31Z on the lower opening end side (solder joint surface side), as shown in FIG. 4(A). Furthermore, the convex portions 34Z prevent shadows from being cast on the end face of the flange portion 33Z on the photographed surface side. Therefore, when photographed from directly above, the influence of shadows cast by the irregularities (holes 31Z, concave portions 35Z, or convex portions 34Z) of the flange portion 33Z is reduced, and the outline of the hole 31Z is accurately recognized by binarization processing. A circle is then drawn in the area corresponding to the outline of the hole 31Z, and the center of the circle is detected as the center 37Z of the hole 31Z. This allows the original position of the center 37Z of the hole 31Z to be accurately detected.

[0045] On the other hand, when the sleeve 30Z having the convex portions 34Z and concave portions 35Z arranged on the flange portion 33Z is photographed at an angle, as shown in Fig. 4(B), the inner wall surface 31Za is reflected in the hole 31Z at the upper opening end side (the photographed surface side), and further, a shadow 110 (only a part of which is shown for convenience) is cast on the flange portion 33Z by the concave and convex portions (hole 31Z, concave portion 35Z, or convex portion 34Z). Fig. 4(B) shows an example of the case where the sleeve 30Z is illuminated from the left side of the drawing and photographed by the imaging device 100 (Fig. 3).

[0046] In the flange portion 33Z of the sleeve 30Z, the entire circumference of the hole 31Z is surrounded by a recess 35Z. Therefore, when photographed at an angle, a shadow 110 caused by the unevenness of the flange portion 33Z may extend to the recess 35Z. In this case, the boundary between the hole 31Z or its inner wall surface 31Za and the recess 35Z of the flange portion 33Z surrounding it becomes unclear over a relatively long area of the edge of the hole 31Z. This may result in the area recognized as the hole 31Z through binarization processing being different from the actual area of the hole 31Z. In other words, the area of the hole 31Z and the area of the shadow 110 cast on the recess 35Z outside it being mistakenly recognized as the hole 31Z of the sleeve 30Z. Therefore, when the sleeve 30Z is photographed at an angle, a discrepancy may occur in the outline of the hole 31Z recognized through binarization processing. If a circle is set in the area corresponding to the outline of the misaligned hole 31Z (the area including the hole 31Z and its outer shadow 110) and the center of the circle is detected as the center 37Za of the hole 31Z, a deviation occurs from the actual position of the center 37Z. In this way, when the sleeve 30Z is photographed at an angle, it may happen that the actual position of the center 37Z of the hole 31Z is not detected with high accuracy.

[0047] 2, the sleeve 30Z mounted in the outer peripheral region 10b of the insulating circuit board 10 is likely to be photographed at an angle as shown in FIG. 4(B). Therefore, the center 37Z of the hole 31Z is more likely to be displaced from its original position in the sleeve 30Z mounted in the outer peripheral region 10b of the insulating circuit board 10 than in the sleeve 30Z mounted in the central region 10a.

[0048] An automatic insertion machine inserts the external terminals 40 into the centers 37Z and 37Za of the holes 31Z detected by the image acquisition and binarization process described above. Examples of inserted states of the external terminals 40 are shown in FIGS.

[0049] FIG. 5(A) is a schematic plan view of an example of a state in which an external terminal 40 is inserted into the center 37Z of a hole 31Z detected for a sleeve 30Z photographed from directly above. FIG. 5(B) is a schematic cross-sectional view of an example of a state in which an external terminal 40 is inserted into the center 37Z of a hole 31Z detected for a sleeve 30Z photographed from directly above. FIG. 5(B) is a cross-sectional view taken along the V-V line of FIG. 5(A). FIG. 6(A) is a schematic plan view of an example of a state in which an external terminal 40 is inserted into the center 37Za of a hole 31Z detected for a sleeve 30Z photographed at an angle. FIG. 6(B) is a schematic cross-sectional view of an example of a state in which an external terminal 40 is inserted into the center 37Za of a hole 31Z detected for a sleeve 30Z photographed at an angle. FIG. 6(B) is a cross-sectional view taken along the VI-VI line of FIG. 6(A).

[0050] When the sleeve 30Z is photographed from directly above, the center 37Z of the hole 31Z, which is detected by image acquisition and binarization processing, is accurately detected in its original position. An automatic insertion machine inserts the first end 41 of the external terminal 40 into the center 37Z of the hole 31Z in its original position. For example, the square-bar-shaped external terminal 40 is press-fitted or fitted so that its outer periphery (corner) deforms the inner wall surface 31Za of the hole 31Z. When the sleeve 30Z is photographed from directly above and the center 37Z of the hole 31Z is accurately detected in its original position, the external terminal 40 is inserted straight into the hole 31Z, as shown in FIGS. 5(A) and 5(B).

[0051] On the other hand, if the sleeve 30Z is photographed at an angle, the center 37Za of the hole 31Z detected by image acquisition and binarization processing may be detected as being shifted from the actual center 37Z. If the center 37Za of the hole 31Z is detected as being shifted from the actual position, the first end 41 of the external terminal 40 will be inserted by an automatic insertion machine into the center 37Za of the hole 31Z that is shifted from the actual position. Therefore, for example, when a square-bar-shaped external terminal 40 is press-fitted or fitted so that its outer periphery (corner) deforms the inner wall surface 31Za of the hole 31Z, the way in which the outer periphery of the external terminal 40 contacts the inner wall surface 31Za of the hole 31Z and the pressing force may be biased. As a result, if the sleeve 30Z is photographed at an angle and the center 37Za of the hole 31Z is detected as being shifted from the actual position, the external terminal 40 may be inserted at an angle relative to the hole 31Z, as shown in FIGS. 6(A) and 6(B).

[0052] When the sleeve 30Z shown in FIGS. 4 to 6 is used as the sleeve 30 in the semiconductor device 1 (FIG. 2), the first end 41 of each external terminal 40 is inserted into the sleeve 30Z, and the second end 42 opposite the first end 41 is pulled out of the case 50. The second end 42 pulled out of the case 50 is then inserted into, for example, a connection hole of a circuit board having a connection hole, and connected to the circuit board. However, as shown in FIGS. 6(A) and 6(B), if the external terminal 40 is inserted into the sleeve 30Z in an inclined state, the second end 42, which is displaced from its original position, may collide with the circuit board, resulting in damage to the external terminal 40 or the circuit board, or may result in an insertion failure in which the second end 42 of the external terminal 40 is not inserted into the connection hole of the circuit board.

[0053] In view of the above, a method as shown in the following embodiment is used to realize a semiconductor device that can reduce the deviation of the center position of the hole detected by binarization processing based on an image of the flange portion of the sleeve, and can reduce the tilt of the external terminal, one end of which is inserted into the sleeve.

[0054] [First embodiment] 7 and 8 are diagrams illustrating an example of a sleeve according to the first embodiment. Fig. 7 is a schematic perspective view of a main part of an example of a sleeve. Fig. 8(A) is a schematic plan view of a main part of an example of a sleeve. Fig. 8(B) is a schematic cross-sectional view of a main part of an example of a sleeve. Fig. 8(B) is a cross-sectional view taken along line VIII-VIII of Fig. 8(A).

[0055] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 shown in FIG. 2, for example, a sleeve 30A as shown in FIGS. 7, 8(A) and 8(B) is mounted.

[0056] The sleeve 30A includes a cylindrical portion 32 having a hole 31 and flange portions 33 provided at both open ends thereof. Each of the flange portions 33 has a plurality of protrusions 34 and a plurality of recesses 35 provided between them. As an example, the flange portion 33 shown here has three protrusions 34 and three recesses 35 between them. The flange portions 33 provided at both open ends of the cylindrical portion 32 have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0057] Each of the group of protrusions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each protrusion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30A, the first outer edge 36a has a bent portion that is continuous with the top surface 34a. The end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (FIG. 8(B)) that includes the top surface 34a. In a plan view seen from one open end side of the cylindrical portion 32, the group of protrusions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 8(A)) as the axis of symmetry. As an example, three protrusions 34 are arranged so that the center 37 of the hole 31 is the center of the hole 31. Symmetry They are arranged so as to be rotationally symmetrical by 120° about the axis.

[0058] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30A, the second outer edge 36b has a bent portion that is continuous with the bottom surface 35a. An end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 that includes the bottom surface 35a (FIG. 8(B)). The recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 as the axis of symmetry in a plan view seen from one open end of the cylindrical portion 32 (FIG. 8(A)). As an example, three recesses 35 are arranged in a circle with the center 37 of the hole 31 as the axis of symmetry. Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 120° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0059] The group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, in a plan view seen from one open end side of the cylindrical portion 32, the total length L1 (FIG. 8(A)) of the first outer edge portion 36a is equal to or greater than the total length L2 (FIG. 8(A)) of the second outer edge portion 36b. Here, the length L1 of the first outer edge portion 36a can also be said to be the length of the transition from the first outer edge portion 36a to the top surface 34a of the convex portion 34, or the length of the end 36d of the inner surface 36 of the first outer edge portion 36a. The length of the second outer edge portion 36b L2 It can also be said that this is the length of the transition from the second outer edge 36b to the bottom surface 35a of the recess 35, or the length of the end 36e of the inner surface 36 at the second outer edge 36b.

[0060] The group of recesses 35 is provided in the flange portion 33 so that, for example, in a plan view seen from one open end side of the cylindrical portion 32, a length L3 ( FIG. 8(A) ) of a straight line connecting both ends of a second outer edge portion 36b continuous with the bottom surface 35a is the same as a length L4 ( FIG. 8(A) ) of a straight line connecting both ends of an outer periphery 33a of the flange portion 33. That is, each recess 35 extends with a constant width from the second outer edge portion 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33.

[0061] 7, 8(A), and 8(B), the sleeve 30A having the flange portion 33 is disposed in both the central region 10a and the outer peripheral region 10b of the insulating circuit board 10, or in at least the outer peripheral region 10b of the central region 10a and the outer peripheral region 10b, as the sleeve 30 of the semiconductor device 1 shown in Fig. 2. One of the flange portions 33 on both opening ends of the sleeve 30A is bonded to the conductive layer 12, the conductive layer 13, or the conductive layer 14 of the insulating circuit board 10 via the solder 80, as described above.

[0062] The solder 80 used to join the sleeve 30A contains volatile components such as flux. When joining the sleeve 30A, the flux and other components in the solder 80 may volatilize as the solder 80 melts, generating gas. The flange portion 33 of the sleeve 30A, which is joined using the solder 80, is provided with a group of recesses 35 that communicate from the hole 31 (the second outer edge portion 36b on the inner surface 36) to the outer periphery 33a. Therefore, gases such as flux generated from the solder 80 during joining are discharged to the outside of the flange portion 33 through the group of recesses 35 as well as the hole 31 of the sleeve 30A. If the only discharge path for gases such as flux were the hole 31, the gas pressure would increase excessively, causing the molten solder 80 to scatter and adhere to the inner surface 36 of the hole 31 at the same time as the gas is discharged, potentially hindering the insertion of the external terminal 40 that is subsequently inserted into the hole 31. In contrast, in the sleeve 30A, gases such as flux are discharged to the outside of the flange portion 33 through a group of recesses 35 provided in the flange portion 33, thereby effectively suppressing excessive increases in gas pressure and the resulting scattering of solder 80.

[0063] Furthermore, on flange portion 33 of sleeve 30A, a group of protrusions 34, which are provided on either side of a group of recesses 35, are arranged from hole 31 (first outer edge 36a on inner surface 36 thereof) to outer periphery 33a, and are arranged rotationally symmetrically with center 37 of hole 31 as the axis of symmetry. Therefore, the posture of sleeve 30A is stable when flange portion 33 is joined using solder 80, and it is possible to prevent sleeve 30A from being connected to insulating circuit board 10 in an inclined state.

[0064] 7, 8(A), and 8(B) is disposed as the sleeve 30 of the semiconductor device 1 shown in Fig. 2 above, the external terminal 40 is connected to the sleeve 30A connected to the insulating circuit board 10, as shown in Fig. 2 above. That is, the first end 41 of the external terminal 40 is inserted into the hole 31 of the sleeve 30A.

[0065] When connecting the external terminal 40, prior to inserting the first end 41, an image is taken from the side of the flange portion 33 opposite to the side of the flange portion 33 joined to the insulating circuit board 10 with the solder 80 as described above, and a binarization process is performed based on the image to detect the center 37 of the hole 31 in the sleeve 30A.

[0066] Here, a group of protrusions 34 is arranged on the flange portion 33 of the sleeve 30A, extending from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33. Furthermore, a group of recesses 35 is arranged, extending from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of protrusions 34 extend to the first outer edge 36a of the hole 31, and the bottom surfaces 35a of the group of recesses 35 extend to the second outer edge 36b of the hole 31. This reduces the effect of shadows cast on the flange portion 33 when an image of the flange portion 33 of the sleeve 30A is captured. Then, by the binarization process, it becomes possible to accurately image-recognize the first outer edge 36a, which is continuous with the top surface 34a of the convex portion 34 and is less susceptible to the influence of shadows, out of the first outer edge 36a (bent portion) and second outer edge 36b (bent portion) of the hole 31 of the sleeve 30A. This point will be described with reference to FIG. 9.

[0067] Fig. 9 is a diagram illustrating an example of a state when an image of a sleeve according to the first embodiment is captured, and shows a schematic plan view of a main part of an example of an image of a sleeve captured at an angle.

[0068] When the flange portion 33 of the sleeve 30A is photographed at an angle, a shadow 110 is generated by the irregularities (holes 31, recesses 35, or protrusions 34) of the flange portion 33, as shown in FIG. A 1 shows an example in which the image is captured by the imaging device 100 (FIG. 3) with illumination coming from the left side of the drawing.

[0069] When the sleeve 30A is photographed at an angle, as shown in FIG. 9 , shadows 110 may appear on the bottom surfaces 35a of the recessed portions 35, but shadows 110 are unlikely to appear on the top surfaces 34a of the protruding portions 34. In the sleeve 30A, the top surfaces 34a of the protruding portions 34, on which such shadows 110 are unlikely to appear, extend to the first outer edge 36a of the hole 31. In the binarization process, the hole 31 is recognized as a black region in the image, and the top surfaces 34a of the protruding portions 34, on which shadows 110 are unlikely to appear, are recognized as a white region in the image. This prevents the boundary between the first outer edge 36a of the hole 31 and the top surfaces 34a of the protruding portions 34 from becoming unclear due to the influence of the shadow 110, or from becoming unclear over a relatively long region of the edge of the hole 31 due to the influence of the shadow 110.

[0070] This enables accurate image recognition of the position of the first outer edge 36a of the hole 31, and based on the information on the position of the first outer edge 36a, enables accurate image recognition of the outline of the hole 31. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the image recognition accuracy of the first outer edge 36a and therefore the image recognition accuracy of the outline of the hole 31 is improved. Accurate image recognition of the outline of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from its original position.

[0071] Until now, deviation of the center 37 of the hole 31 from its original position has tended to occur in the sleeve 30 in the outer circumferential region 10b, which is more susceptible to the influence of shadows when capturing an image, among the sleeves 30 connected to the central region 10a and outer circumferential region 10b of the insulating circuit board 10. Therefore, by disposing the sleeve 30A, which is equipped with the flange portion 33 having the group of convex portions 34 and the group of concave portions 35 as described above, in at least the outer circumferential region 10b of the insulating circuit board 10, it becomes possible to accurately detect the position of the center 37 of the hole 31 while suppressing deviation.

[0072] The external terminal 40 is inserted by an automatic insertion machine into the position of the center 37 of the hole 31 detected as described above, as shown in Fig. 2 above. Because the first end 41 of the external terminal 40 is inserted into the hole 31 whose center 37 has been detected with high accuracy, tilt of the external terminal 40 with respect to the sleeve 30A is effectively suppressed. Because tilt of the external terminal 40 is suppressed, damage or improper insertion due to collision of the second end 42 when attempting to insert the second end 42 into a circuit board or the like is suppressed.

[0073] [Second embodiment] Figure 10 is a diagram illustrating an example of a sleeve according to the second embodiment. Figure 10(A) is a schematic plan view of a main part of the example of the sleeve. Figure 10(B) is a schematic cross-sectional view of a main part of the example of the sleeve. Figure 10(B) is a cross-sectional view taken along line XX in Figure 10(A).

[0074] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 as shown in FIG. 2, for example, a sleeve 30B as shown in FIGS. 10(A) and 10(B) is mounted.

[0075] The sleeve 30B has a configuration in which flange portions 33 having a plurality of (three, for example) protrusions 34 and a plurality of (three, for example) recesses 35 are provided at each of both open ends of a cylindrical portion 32. The flange portions 33 at both open ends have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0076] Each of the group of protrusions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each protrusion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30B, the first outer edge 36a has a curved surface that is continuous with the top surface 34a. The end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (FIG. 10(B)) that includes the top surface 34a. In a plan view seen from one open end side of the cylindrical portion 32, the group of protrusions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 10(A)) as the axis of symmetry. As an example, three protrusions 34 are arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry They are arranged so as to be rotationally symmetrical by 120° about the axis.

[0077] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30B, the second outer edge 36b has a bent portion that is continuous with the bottom surface 35a. The end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 (FIG. 10(B)) that includes the bottom surface 35a. In a plan view seen from one open end side of the cylindrical portion 32, the recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 10(A)) as the axis of symmetry. As an example, three recesses 35 may be arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 120° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0078] In addition, in the sleeve 30B, the group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, when viewed in a plan view from one open end side of the cylindrical portion 32, the sum of the lengths L1 (Figure 10(A)) of the first outer edge portions 36a is equal to or greater than the sum of the lengths L2 (Figure 10(A)) of the second outer edge portions 36b.

[0079] In the sleeve 30B, the group of recesses 35 is provided in the flange portion 33 so that, in a plan view seen from one open end of the cylindrical portion 32, the length L3 ( FIG. 10(A) ) of a straight line connecting both ends of a second outer edge portion 36b continuous with the bottom surface 35a is the same as the length L4 ( FIG. 10(A) ) of a straight line connecting both ends of an outer periphery 33a of the flange portion 33. That is, each recess 35 extends with a constant width from the second outer edge portion 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33.

[0080] In the sleeve 30B, the first outer edge 36a on the inner surface 36 of the hole 31 has a curved surface. This configuration distinguishes the sleeve 30B from the sleeve 30A described in the first embodiment. The flat top surface 34a of the convex portion 34 extends from the end 36d of the curved first outer edge 36a to the outer periphery 33a. The curved surface of the first outer edge 36a may be formed unavoidably during the manufacturing process of the sleeve 30B, or may be formed by grinding or pressing the bent portion (see FIG. 8B). Meanwhile, the second outer edge 36b on the inner surface 36 of the hole 31 has a curved portion, similar to the sleeve 30A described in the first embodiment. The flat bottom surface 35a of the concave portion 35 extends from the end 36e of the bent second outer edge 36b to the outer periphery 33a.

[0081] The sleeve 30B having this configuration also achieves the same effects as the sleeve 30A described in the first embodiment. That is, by arranging a group of recesses 35 that communicate from the hole 31 to the outer periphery 33a in the flange portion 33, gas generated during soldering of the sleeve 30B is discharged to the outside of the flange portion 33 through the group of recesses 35, effectively suppressing scattering of the solder 80 due to an increase in gas pressure. Because the group of protrusions 34 is arranged from the hole 31 to the outer periphery 33a and is rotationally symmetrical with the center 37 of the hole 31 as the axis of symmetry, the posture of the sleeve 30B during soldering is stabilized and tilting is suppressed.

[0082] Furthermore, in sleeve 30B, by making first outer edge 36a, which is continuous with group of protrusions 34, a curved surface portion, the space between flange 33 and the conductive layer (conductive layer 12, conductive layer 13, or conductive layer 14) of insulated circuit board 10 is wider than when it is a bent portion, the amount of solder 80 interposed between flange 33 and the conductive layer of insulated circuit board 10 is increased, and the bonding strength is improved. Alternatively, a space in which solder 80 can accumulate is secured between the curved surface portion of flange 33 of sleeve 30B and the conductive layer of insulated circuit board 10, and solder 80 remains in this space, reducing the amount of solder 80 that enters hole 31 and the amount of solder 80 that creeps up inner surface 36.

[0083] Furthermore, in the sleeve 30B, the group of convex portions 34 and the group of concave portions 35 extend from the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of convex portions 34 extend to the first outer edge portion 36a of the hole 31, and the bottom surfaces 35a of the group of concave portions 35 extend to the second outer edge portion 36b of the hole 31. Therefore, when detecting the position of the center 37 of the hole 31 prior to inserting the external terminal 40, binarization processing based on the image of the flange portion 33 accurately recognizes the first outer edge portion 36a, which is continuous with the top surfaces 34a of the convex portions 34 and is less susceptible to the influence of shadows, out of the first outer edge portion 36a (curved portion) and second outer edge portion 36b (bent portion) of the hole 31. In other words, the boundary between the first outer edge portion 36a of the hole 31 and the top surfaces 34a of the group of convex portions 34 is prevented from becoming unclear due to the influence of shadows. This allows the position of the first outer edge 36a of the hole 31 to be accurately recognized, and based on the information on the position of the first outer edge 36a, the outline of the hole 31 to be accurately recognized. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the accuracy of image recognition of the first outer edge 36a, and therefore the accuracy of image recognition of the outline of the hole 31, is improved.

[0084] Accurate image recognition of the contour of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from the original position, and prevents the external terminal 40, whose first end 41 is inserted by an automatic insertion machine, from being tilted relative to the detected position of the center 37. As a result, damage or improper insertion due to collision of the second end 42 of the external terminal 40 when attempting to insert the second end 42 of the external terminal 40 into a circuit board or the like is reduced.

[0085] [Third embodiment] Figure 11 is a diagram illustrating an example of a sleeve according to the third embodiment. Figure 11(A) is a schematic plan view of a main part of the example of the sleeve. Figure 11(B) is a schematic cross-sectional view of a main part of the example of the sleeve. Figure 11(B) is a cross-sectional view taken along line XI-XI of Figure 11(A).

[0086] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 shown in FIG. 2, for example, a sleeve 30C as shown in FIGS. 11(A) and 11(B) is mounted.

[0087] Sleeve 30 C has a configuration in which flange portions 33 having a plurality of (three, for example) protrusions 34 and a plurality of (three, for example) recesses 35 are provided at each of both open ends of a cylindrical portion 32. The flange portions 33 at both open ends have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0088] Each of the group of protrusions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each protrusion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30C, the first outer edge 36a has a bent portion that is continuous with the top surface 34a. The end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (FIG. 11(B)) that includes the top surface 34a. In a plan view seen from one open end side of the cylindrical portion 32, the group of protrusions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 11(A)) as the axis of symmetry. As an example, three protrusions 34 are arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry They are arranged so as to be rotationally symmetrical by 120° about the axis.

[0089] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30C, the second outer edge 36b has a curved portion that is continuous with the bottom surface 35a. The end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 (FIG. 11(B)) that includes the bottom surface 35a. In a plan view seen from one open end side of the cylindrical portion 32, the recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 11(A)) as the axis of symmetry. As an example, three recesses 35 may be arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 120° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0090] In addition, in the sleeve 30C, the group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, when viewed in a plan view from one open end side of the cylindrical portion 32, the sum of the lengths L1 (Figure 11(A)) of the first outer edge portions 36a is equal to or greater than the sum of the lengths L2 (Figure 11(A)) of the second outer edge portions 36b.

[0091] In the sleeve 30C, the group of recesses 35 is provided in the flange portion 33 so that, in a plan view seen from one open end of the cylindrical portion 32, the length L3 ( FIG. 11(A) ) of a straight line connecting both ends of a second outer edge portion 36b continuous with the bottom surface 35a is the same as the length L4 ( FIG. 11(A) ) of a straight line connecting both ends of an outer periphery 33a of the flange portion 33. That is, each recess 35 extends with a constant width from the second outer edge portion 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33.

[0092] In the sleeve 30C, the second outer edge 36b on the inner surface 36 of the hole 31 has a curved surface. This configuration distinguishes the sleeve 30C from the sleeve 30A described in the first embodiment. The flat bottom surface 35a of the recess 35 extends from the end 36e of the curved second outer edge 36b to the outer periphery 33a. The curved surface of the second outer edge 36b may be formed unavoidably during the manufacturing process of the sleeve 30C, or may be formed by grinding or pressing the bent portion (see FIG. 8B). Meanwhile, the first outer edge 36a on the inner surface 36 of the hole 31 has a curved portion, similar to the sleeve 30A described in the first embodiment. The flat top surface 34a of the protrusion 34 extends from the end 36d of the bent first outer edge 36a to the outer periphery 33a.

[0093] The sleeve 30C having this configuration also achieves the same effects as the sleeve 30A described in the first embodiment. That is, by arranging a group of recesses 35 that communicate from the hole 31 to the outer periphery 33a in the flange portion 33, gas generated during soldering of the sleeve 30C is discharged to the outside of the flange portion 33 through the group of recesses 35, effectively suppressing scattering of the solder 80 due to an increase in gas pressure. Because the group of protrusions 34 is arranged from the hole 31 to the outer periphery 33a and is rotationally symmetrical with the center 37 of the hole 31 as the axis of symmetry, the posture of the sleeve 30C during soldering is stabilized and tilting is suppressed.

[0094] Furthermore, in sleeve 30C, by making second outer edge 36b, which is continuous with the group of recesses 35, a curved surface, compared to when it is a bent portion, the space between flange 33 and the conductive layer (conductive layer 12, conductive layer 13, or conductive layer 14) of insulated circuit board 10 is wider, the amount of solder 80 interposed between flange 33 and the conductive layer of insulated circuit board 10 is increased, and the bonding strength is improved. Alternatively, a space is secured between the curved surface of flange 33 of sleeve 30C and the conductive layer of insulated circuit board 10, and solder 80 remains in this space, reducing the amount of solder 80 that enters hole 31 and the amount of solder 80 that creeps up inner surface 36.

[0095] Furthermore, in the sleeve 30C, the group of convex portions 34 and the group of concave portions 35 extend from the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of convex portions 34 extend to the first outer edge portion 36a of the hole 31, and the bottom surfaces 35a of the group of concave portions 35 extend to the second outer edge portion 36b of the hole 31. Therefore, when detecting the position of the center 37 of the hole 31 prior to inserting the external terminal 40, binarization processing based on the image of the flange portion 33 accurately recognizes the first outer edge portion 36a, which is continuous with the top surfaces 34a of the convex portions 34 and is less susceptible to the influence of shadows, out of the first outer edge portion 36a (bent portion) and the second outer edge portion 36b (curved portion) of the hole 31. In other words, the boundary between the first outer edge portion 36a of the hole 31 and the top surfaces 34a of the group of convex portions 34 is prevented from becoming unclear due to the influence of shadows. This allows the position of the first outer edge 36a of the hole 31 to be accurately recognized, and based on the information on the position of the first outer edge 36a, the outline of the hole 31 to be accurately recognized. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the accuracy of image recognition of the first outer edge 36a, and therefore the accuracy of image recognition of the outline of the hole 31, is improved.

[0096] Accurate image recognition of the contour of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from the original position, and prevents the external terminal 40, whose first end 41 is inserted by an automatic insertion machine, from being tilted relative to the detected position of the center 37. As a result, damage or improper insertion due to collision of the second end 42 of the external terminal 40 when attempting to insert the second end 42 of the external terminal 40 into a circuit board or the like is reduced.

[0097] In the second embodiment, a configuration was exemplified in which the first outer edge 36a of the inner surface 36 of the hole 31 that is continuous with the group of convex portions 34 has a curved portion, and the second outer edge 36b of the inner surface 36 of the hole 31 that is continuous with the group of concave portions 35 has a bent portion (FIGS. 10(A) and 10(B)). In addition, in the third embodiment, a configuration was exemplified in which the first outer edge 36a of the inner surface 36 of the hole 31 that is continuous with the group of convex portions 34 has a bent portion, and the second outer edge 36b of the inner surface 36 of the hole 31 that is continuous with the group of concave portions 35 has a curved portion (FIGS. 11(A) and 11(B)). In addition, it is also possible for the first outer edge 36a of the inner surface 36 of the hole 31 that is continuous with the group of convex portions 34 and the second outer edge 36b of the inner surface 36 of the hole 31 that is continuous with the group of concave portions 35 to both have curved portions. This makes it possible to obtain the effects described in both the second and third embodiments.

[0098] [Fourth embodiment] 12 and 13 are diagrams illustrating an example of a sleeve according to the fourth embodiment. Fig. 12 is a schematic perspective view of a main part of the example of the sleeve. Fig. 13(A) is a schematic plan view of a main part of the example of the sleeve. Fig. 13(B) is a schematic cross-sectional view of a main part of the example of the sleeve. Fig. 13(B) is a cross-sectional view taken along line XIII-XIII of Fig. 13(A).

[0099] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 shown in FIG. 2, for example, a sleeve 30D as shown in FIGS. 12, 13(A) and 13(B) is mounted.

[0100] The sleeve 30D has a configuration in which flange portions 33 having a plurality of (three, for example) protrusions 34 and a plurality of (three, for example) recesses 35 are provided at each of both open ends of a cylindrical portion 32. The flange portions 33 at both open ends have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0101] Each of the group of protrusions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each protrusion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30D, the first outer edge 36a has a curved surface that is continuous with the top surface 34a. The end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (Fig. 13(B)) that includes the top surface 34a. In a plan view seen from one open end side of the cylindrical portion 32, the group of protrusions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 (Fig. 13(A)) as the axis of symmetry. As an example, three protrusions 34 are arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry They are arranged so as to be rotationally symmetrical by 120° about the axis.

[0102] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30D, the second outer edge 36b has a curved portion that is continuous with the bottom surface 35a. The end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 (Fig. 13(B)) that includes the bottom surface 35a. In a plan view seen from one open end side of the cylindrical portion 32, the recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 (Fig. 13(A)) as the axis of symmetry. As an example, three recesses 35 may be arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 120° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0103] Here, in the sleeve 30D, the curved surface portion of the first outer edge portion 36a is formed by a curved surface that begins to curve from the end of the inner wall 36c that extends linearly in direction D1 on the inner surface 36 of the hole 31 and extends from that end to the top surface 34a of the group of protrusions 34. The group of recesses 35 is formed to a depth such that the edge of the bottom surface 35a on the hole 31 side, i.e., the end 36e of the second outer edge portion 36b, is located within the curved surface. The curved surface portions of the first outer edge portion 36a and the second outer edge portion 36b are both part of the curved surface that extends from the end of the inner wall 36c of the hole 31 to the top surface 34a and the bottom surface 35a.

[0104] In addition, in the sleeve 30D, the group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, when viewed in a plan view from one open end side of the cylindrical portion 32, the sum of the lengths L1 (Figure 13(A)) of the first outer edge portions 36a is equal to or greater than the sum of the lengths L2 (Figure 13(A)) of the second outer edge portions 36b.

[0105] In the sleeve 30D, the group of recesses 35 is provided in the flange portion 33 so that, in a plan view seen from one open end of the cylindrical portion 32, the length L3 ( FIG. 13(A) ) of a straight line connecting both ends of a second outer edge portion 36b continuous with the bottom surface 35a is the same as the length L4 ( FIG. 13(A) ) of a straight line connecting both ends of an outer periphery 33a of the flange portion 33. That is, each recess 35 extends with a constant width from the second outer edge portion 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33.

[0106] In the sleeve 30D, the first outer edge 36a and the second outer edge 36b of the inner surface 36 of the hole 31 have curved surfaces. This configuration distinguishes the sleeve 30D from the sleeve 30A described in the first embodiment. The flat top surface 34a of the convex portion 34 extends from the end 36d of the curved first outer edge 36a to the outer periphery 33a, and the flat bottom surface 35a of the concave portion 35 extends from the end 36e of the curved second outer edge 36b to the outer periphery 33a. The curved surfaces of the first outer edge 36a and the second outer edge 36b may be unavoidable during the manufacturing process of the sleeve 30D, or may be formed by grinding or pressing the bent portion (see FIG. 8B).

[0107] The sleeve 30D having such a configuration also achieves the same effects as the sleeve 30A described in the first embodiment. That is, by arranging a group of recesses 35 that communicate from the hole 31 to the outer periphery 33a in the flange portion 33, gas generated during soldering of the sleeve 30D is discharged to the outside of the flange portion 33 through the group of recesses 35, effectively suppressing scattering of the solder 80 due to an increase in gas pressure. Because the group of protrusions 34 is arranged from the hole 31 to the outer periphery 33a and is rotationally symmetrical with the center 37 of the hole 31 as the axis of symmetry, the posture of the sleeve 30D during soldering is stabilized and tilting is suppressed.

[0108] Furthermore, in sleeve 30D, first outer edge 36a continuous with group of convex portions 34 and second outer edge 36b continuous with group of concave portions 35 are both curved portions, which increases the space between flange portion 33 and the conductive layer (conductive layer 12, conductive layer 13, or conductive layer 14) of insulated circuit board 10 compared to when they are bent portions, thereby increasing the amount of solder 80 interposed between flange portion 33 and the conductive layer of insulated circuit board 10 and improving bonding strength. Alternatively, a space is secured between the curved portion of flange portion 33 of sleeve 30D and the conductive layer of insulated circuit board 10, and solder 80 remains in the space, reducing the amount of solder 80 that enters hole 31 and the amount of solder 80 that creeps up inner surface 36.

[0109] Furthermore, in the sleeve 30D, the group of convex portions 34 and the group of concave portions 35 extend from the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of convex portions 34 extend to the first outer edge portion 36a of the hole 31, and the bottom surfaces 35a of the group of concave portions 35 extend to the second outer edge portion 36b of the hole 31. Therefore, when detecting the position of the center 37 of the hole 31 prior to inserting the external terminal 40, binarization processing based on the image of the flange portion 33 accurately recognizes the first outer edge portion 36a, which is continuous with the top surfaces 34a of the convex portions 34 and is less susceptible to the influence of shadows, out of the first outer edge portion 36a (curved portion) and the second outer edge portion 36b (curved portion) of the hole 31. In other words, the boundary between the first outer edge portion 36a of the hole 31 and the top surfaces 34a of the group of convex portions 34 is prevented from becoming unclear due to the influence of shadows. This allows the position of the first outer edge 36a of the hole 31 to be accurately recognized, and based on the information on the position of the first outer edge 36a, the outline of the hole 31 to be accurately recognized. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the accuracy of image recognition of the first outer edge 36a, and therefore the accuracy of image recognition of the outline of the hole 31, is improved.

[0110] Accurate image recognition of the outline of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from the original position, and prevents the external terminal 40, whose first end 41 is inserted by an automatic insertion machine, from being tilted relative to the detected position of the center 37. As a result, damage or improper insertion due to a collision of the second end 42 of the external terminal 40 when attempting to insert the second end 42 of the external terminal 40 into a circuit board or the like is reduced.

[0111] [Fifth embodiment] Figure 14 is a diagram illustrating an example of a sleeve according to the fifth embodiment. Figure 14(A) is a schematic plan view of a main part of the example of the sleeve. Figure 14(B) is a schematic cross-sectional view of a main part of the example of the sleeve. Figure 14(B) is a cross-sectional view taken along line XIV-XIV of Figure 14(A).

[0112] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 as shown in FIG. 2, for example, a sleeve 30E as shown in FIGS. 14(A) and 14(B) is mounted.

[0113] The sleeve 30E has a configuration in which flange portions 33 having a plurality of (for example, six) protrusions 34 and a plurality of (for example, six) recesses 35 are provided at each of both open ends of a cylindrical portion 32. The flange portions 33 at both open ends have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0114] Each of the convex portions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end of the cylindrical portion 32. Each convex portion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30E, the first outer edge 36a has a bent portion that is continuous with the top surface 34a. An end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (FIG. 14(B)) that includes the top surface 34a. The convex portions 34 are arranged to extend radially from the center 37 (FIG. 14(A)) of the hole 31 toward the outer periphery 33a of the flange portion 33 in a plan view seen from one open end of the cylindrical portion 32. The group of protrusions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 as the axis of symmetry in a plan view seen from one open end side of the cylindrical portion 32. As an example, six protrusions 34 are arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry They are arranged so as to be rotationally symmetrical by 60° about the axis.

[0115] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view from one open end of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30E, the second outer edge 36b has a bent portion that is continuous with the bottom surface 35a. An end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 (FIG. 14(B)) that includes the bottom surface 35a. The recesses 35 are arranged to extend radially from the center 37 (FIG. 14(A)) of the hole 31 toward the outer periphery 33a of the flange portion 33 in a plan view from one open end of the cylindrical portion 32. The group of recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 as the axis of symmetry in a plan view seen from one open end side of the cylindrical portion 32. As an example, six recesses 35 are arranged so that the center 37 of the hole 31 is Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 60° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0116] In addition, in the sleeve 30E, the group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, when viewed in a plan view from one open end side of the cylindrical portion 32, the sum of the lengths L1 (Figure 14(A)) of the first outer edge portions 36a is equal to or greater than the sum of the lengths L2 (Figure 14(A)) of the second outer edge portions 36b.

[0117] In the sleeve 30E, the group of recesses 35 is provided in the flange portion 33 so that, in a plan view seen from one open end of the cylindrical portion 32, the length L3 ( FIG. 14(A) ) of a straight line connecting both ends of a second outer edge portion 36b continuous with the bottom surface 35a is the same as the length L4 ( FIG. 14(A) ) of a straight line connecting both ends of an outer periphery 33a of the flange portion 33. That is, each recess 35 extends with a constant width from the second outer edge portion 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33.

[0118] The sleeve 30E having such a configuration also achieves the same effects as the sleeve 30A described in the first embodiment. That is, by arranging a group of recesses 35 that communicate from the hole 31 to the outer periphery 33a in the flange portion 33, gas generated during soldering of the sleeve 30E is discharged to the outside of the flange portion 33 through the group of recesses 35, effectively suppressing scattering of the solder 80 due to an increase in gas pressure. Because the group of protrusions 34 is arranged from the hole 31 to the outer periphery 33a and is rotationally symmetrical with the center 37 of the hole 31 as the axis of symmetry, the posture of the sleeve 30E during soldering is stabilized and tilting is suppressed.

[0119] Furthermore, in the sleeve 30E, the group of convex portions 34 and the group of concave portions 35 extend from the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of convex portions 34 extend to the first outer edge portion 36a of the hole 31, and the bottom surfaces 35a of the group of concave portions 35 extend to the second outer edge portion 36b of the hole 31. Therefore, when detecting the position of the center 37 of the hole 31 prior to inserting the external terminal 40, binarization processing based on the image of the flange portion 33 accurately recognizes the first outer edge portion 36a, which is continuous with the top surfaces 34a of the convex portions 34 and is less susceptible to the influence of shadows, out of the first outer edge portion 36a (bent portion) and the second outer edge portion 36b (bent portion) of the hole 31. In other words, the boundary between the first outer edge portion 36a of the hole 31 and the top surfaces 34a of the group of convex portions 34 is prevented from becoming unclear due to the influence of shadows. This allows the position of the first outer edge 36a of the hole 31 to be image-recognized with high accuracy, and based on the information on the position of the first outer edge 36a, the outline of the hole 31 to be image-recognized with high accuracy. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the image recognition accuracy of the first outer edge 36a and therefore the image recognition accuracy of the outline of the hole 31 is improved. By increasing the number of convex portions 34 and concave portions 35 of the flange portion 33 and arranging them radially, the influence of shadows caused by illumination light from various directions can be suppressed, and the outline of the hole 31 can be image-recognized with high accuracy.

[0120] Accurate image recognition of the contour of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from the original position, and prevents the external terminal 40, whose first end 41 is inserted by an automatic insertion machine, from being tilted relative to the detected position of the center 37. As a result, damage or improper insertion due to collision of the second end 42 of the external terminal 40 when attempting to insert the second end 42 of the external terminal 40 into a circuit board or the like is reduced.

[0121] In the sleeve 30E described in the fifth embodiment, the first outer edge portion 36a of the inner surface 36 of the hole 31 to which the group of convex portions 34 of the flange portion 33 are continuous may be configured to have a curved portion instead of a bent portion, as in the example of the sleeve 30B described in the second embodiment.

[0122] Furthermore, in the sleeve 30E described in the fifth embodiment, the second outer edge portion 36b of the inner surface 36 of the hole 31 to which the group of recesses 35 of the flange portion 33 are continuous may be configured to have a curved portion instead of a bent portion, as in the example of the sleeve 30C described in the third embodiment above.

[0123] Furthermore, in the sleeve 30E described in the fifth embodiment, the first outer edge portion 36a and the second outer edge portion 36b of the inner surface 36 of the hole 31 to which the group of convex portions 34 and the group of concave portions 35 of the flange portion 33 are respectively continuous may be configured to have curved portions, instead of having bent portions, as in the example of the sleeve 30D described in the fourth embodiment.

[0124] [Sixth embodiment] Figure 15 is a diagram illustrating an example of a sleeve according to the sixth embodiment. Figure 15(A) is a schematic plan view of a main part of the example of the sleeve. Figure 15(B) is a schematic cross-sectional view of a main part of the example of the sleeve. Figure 15(B) is a cross-sectional view taken along line XV-XV of Figure 15(A).

[0125] As the sleeve 30 mounted on the insulating circuit board 10 of the semiconductor device 1 as shown in FIG. 2, for example, a sleeve 30F as shown in FIGS. 15(A) and 15(B) is mounted.

[0126] The sleeve 30F has a configuration in which flange portions 33 having a plurality of (three, for example) protrusions 34 and a plurality of (three, for example) recesses 35 are provided at each of both open ends of a cylindrical portion 32. The flange portions 33 at both open ends have the same configuration. The plurality of protrusions 34 have the same shape, and the plurality of recesses 35 have the same shape.

[0127] Each of the convex portions 34 of the flange portion 33 is arranged to extend from a first outer edge 36a on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each convex portion 34 has a top surface 34a that is continuous with the inner surface 36 at the first outer edge 36a. In the sleeve 30F, the first outer edge 36a has a bent portion that is continuous with the top surface 34a. The end 36d of the inner surface 36 at the first outer edge 36a is located within a first plane 91 (FIG. 15(B)) that includes the top surface 34a. In a plan view seen from one open end side of the cylindrical portion 32, the convex portions 34 are arranged rotationally symmetrically with the center 37 of the hole 31 (FIG. 15(A)) as the axis of symmetry. As an example, three convex portions 34 are arranged so that the center 37 of the hole 31 is the axis of symmetry. Symmetry They are arranged so as to be rotationally symmetrical by 120° about the axis.

[0128] Each of the recesses 35 in the flange portion 33 is arranged to extend from a second outer edge 36b on the inner surface 36 of the hole 31 to the outer periphery 33a of the flange portion 33 in a plan view seen from one open end side of the cylindrical portion 32. Each recess 35 has a bottom surface 35a that is continuous with the inner surface 36 at the second outer edge 36b. In the sleeve 30F, the second outer edge 36b has a bent portion that is continuous with the bottom surface 35a. The end 36e of the inner surface 36 at the second outer edge 36b is located within a second plane 92 (Fig. 15(B)) that includes the bottom surface 35a. In a plan view seen from one open end side of the cylindrical portion 32, the recesses 35 are arranged rotationally symmetrically with the center 37 of the hole 31 (Fig. 15(A)) as the axis of symmetry. As an example, three recesses 35 may be arranged so that the center 37 of the hole 31 is the center of the hole 31. Symmetry The recesses 35 are arranged so as to be rotationally symmetrical by 120° about the axis. The recesses 35 are arranged so that the depth from the top surface 34a of the protrusion 34 to the bottom surface 35a of the recess 35 is, for example, 0.055 mm or less.

[0129] In addition, in the sleeve 30F, the group of convex portions 34 and the group of concave portions 35 are provided on the flange portion 33 so that, for example, when viewed in a plan view from one open end side of the cylindrical portion 32, the sum of the lengths L1 (Figure 15(A)) of the first outer edge portions 36a is equal to or greater than the sum of the lengths L2 (Figure 15(A)) of the second outer edge portions 36b.

[0130] In the sleeve 30F, each of the recesses 35 has a planar shape, for example, in a plan view seen from one open end of the cylindrical portion 32, such that the recesses 35 extend from the center 37 of the hole 31 toward the outer periphery 33a of the flange portion 33 with a constant first width from the second outer edge 36b to partway and then with a second width greater than the first width from partway to the outer periphery 33a. In the sleeve 30F, the recesses 35 are arranged so as to form a substantially T-shape in a plan view seen from one open end of the cylindrical portion 32. In the recesses 35 having such a planar shape, the length L3 ( FIG. 15(A) ) of a straight line connecting both ends of the second outer edge 36b continuous with the bottom surface 35a in a plan view seen from one open end of the cylindrical portion 32 is equal to or shorter than the length L4 ( FIG. 15(A) ) of a straight line connecting both ends of the outer periphery 33a of the flange portion 33.

[0131] On the flange portion 33 of the sleeve 30F, a group of protrusions 34 is arranged with a planar shape corresponding to the group of recesses 35 so as to sandwich the group of recesses 35 having such a planar shape (or to be sandwiched between the group of recesses 35).

[0132] The sleeve 30F having such a configuration also achieves the same effects as the sleeve 30A described in the first embodiment. That is, by arranging a group of recesses 35 that communicate from the hole 31 to the outer periphery 33a in the flange portion 33, gas generated during soldering of the sleeve 30F is discharged to the outside of the flange portion 33 through the group of recesses 35, effectively suppressing scattering of the solder 80 due to an increase in gas pressure. Because the group of protrusions 34 is arranged from the hole 31 to the outer periphery 33a and is rotationally symmetrical with the center 37 of the hole 31 as the axis of symmetry, the posture of the sleeve 30F during soldering is stabilized and tilting is suppressed.

[0133] Furthermore, in sleeve 30F, in a plan view seen from one open end side of cylindrical portion 32, the group of recesses 35 is arranged in a planar shape that widens partway in a direction from center 37 of hole 31 toward outer periphery 33a of flange portion 33, i.e., in a planar shape such that length L3 of a straight line connecting both ends of second outer edge portion 36b is equal to or less than length L4 of a straight line connecting both ends of outer periphery 33a. This widens the space between flange portion 33 and the conductive layer (conductive layer 12, conductive layer 13, or conductive layer 14) of insulating circuit board 10, increasing the amount of solder 80 interposed between flange portion 33 and the conductive layer of insulating circuit board 10 and improving the bonding strength.

[0134] Furthermore, in the sleeve 30F, the group of convex portions 34 and the group of concave portions 35 extend from the hole 31 to the outer periphery 33a of the flange portion 33. In other words, the top surfaces 34a of the group of convex portions 34 extend to the first outer edge portion 36a of the hole 31, and the bottom surfaces 35a of the group of concave portions 35 extend to the second outer edge portion 36b of the hole 31. Therefore, when detecting the position of the center 37 of the hole 31 prior to inserting the external terminal 40, binarization processing based on the image of the flange portion 33 accurately recognizes the first outer edge portion 36a, which is continuous with the top surfaces 34a of the convex portions 34 and is less susceptible to the influence of shadows, out of the first outer edge portion 36a (bent portion) and the second outer edge portion 36b (bent portion) of the hole 31. In other words, the boundary between the first outer edge portion 36a of the hole 31 and the top surfaces 34a of the group of convex portions 34 is prevented from becoming unclear due to the influence of shadows. This allows the position of the first outer edge 36a of the hole 31 to be accurately recognized, and based on the information on the position of the first outer edge 36a, the outline of the hole 31 to be accurately recognized. If the total length L1 of the first outer edge 36a is set to be equal to or greater than the total length L2 of the second outer edge 36b, the accuracy of image recognition of the first outer edge 36a, and therefore the accuracy of image recognition of the outline of the hole 31, is improved.

[0135] Accurate image recognition of the contour of the hole 31 makes it possible to accurately detect the position of the center 37 of the hole 31 while minimizing deviation from the original position, and prevents the external terminal 40, whose first end 41 is inserted by an automatic insertion machine, from being tilted relative to the detected position of the center 37. As a result, damage or improper insertion due to collision of the second end 42 of the external terminal 40 when attempting to insert the second end 42 of the external terminal 40 into a circuit board or the like is reduced.

[0136] Here, as an example, the group of recesses 35 has a generally T-shaped planar shape that widens midway in a direction from the center 37 of the hole 31 toward the outer periphery 33a of the flange portion 33 in a plan view from one open end of the cylindrical portion 32. However, the planar shape of the group of recesses 35 is not limited to this. The group of recesses 35 may have various planar shapes as long as the length L3 ( FIG. 15(A) ) of a straight line connecting both ends of the second outer edge portion 36b that is continuous with the bottom surface 35a in a plan view from one open end of the cylindrical portion 32 is equal to or less than the length L4 ( FIG. 15(A) ) of a straight line connecting both ends of the outer periphery 33a of the flange portion 33. For example, the group of recesses 35 may have a planar shape that is generally isosceles trapezoidal in a plan view, or a planar shape that widens in multiple stages in a direction from the center 37 of the hole 31 toward the outer periphery 33a of the flange portion 33.

[0137] In the sleeve 30F described in the sixth embodiment, the first outer edge portion 36a of the inner surface 36 of the hole 31 to which the group of convex portions 34 of the flange portion 33 are continuous may be configured to have a curved portion instead of a bent portion, as in the example of the sleeve 30B described in the second embodiment.

[0138] Furthermore, in the sleeve 30F described in the sixth embodiment, the second outer edge portion 36b of the inner surface 36 of the hole 31 to which the group of recesses 35 of the flange portion 33 are continuous may be configured to have a curved portion instead of a bent portion, following the example of the sleeve 30C described in the third embodiment above.

[0139] Furthermore, in the sleeve 30F described in the sixth embodiment, the first outer edge portion 36a and the second outer edge portion 36b of the inner surface 36 of the hole 31 to which the group of convex portions 34 and the group of concave portions 35 of the flange portion 33 are respectively connected may be configured to have curved portions, instead of having bent portions, as in the example of the sleeve 30D described in the fourth embodiment.

[0140] Furthermore, in the sleeve 30F described in the sixth embodiment, the group of convex portions 34 and the group of concave portions 35 of the flange portion 33 may be configured to be radially arranged in a direction from the center 37 of the hole 31 toward the outer periphery 33a of the flange portion 33 in a plan view from one opening end side of the cylindrical portion 32, following the example of the sleeve 30E described in the fifth embodiment above.

[0141] [Seventh embodiment] Fig. 16 is a diagram illustrating an example of a semiconductor device according to the seventh embodiment, which diagrammatically shows a cross-sectional view of a main part of the example of the semiconductor device.

[0142] The semiconductor device 1A shown in FIG. 16 includes the semiconductor device 1 (herein referred to as the "semiconductor module 1" for convenience) as shown in FIG.

[0143] As described above with reference to FIG. 2 , the semiconductor module 1 includes an insulating circuit board 10, a semiconductor element 20, a sleeve 30, external terminals 40, a case 50, and a sealing resin 60. The insulating circuit board 10 includes an insulating substrate 11, conductive layers 12, 13, and 14 disposed on one main surface 11a of the insulating substrate 11, and a conductive layer 15 disposed on the other main surface 11b of the insulating substrate 11. For example, a group of semiconductor elements 20 constituting an inverter circuit are mounted at predetermined positions on the conductive layers 12, 13, and 14 using a bonding material such as solder and wires 71-74. Furthermore, a sleeve 30 is mounted at predetermined positions on the conductive layers 12, 13, and 14 using solder 80.

[0144] As the sleeve 30 of this semiconductor module 1, for example, the sleeve 30A, 30B, 30C, 30D, 30E, or 30F described in the first to sixth embodiments is mounted. First ends 41 of external terminals 40 are inserted into the sleeve 30. A case 50 is provided to cover the side of the insulating circuit board 10 on which the semiconductor element 20 and sleeve 30 are mounted. Second ends 42 of the external terminals 40, opposite the first ends 41 inserted into the sleeve 30, are drawn out to the outside through openings 51 of the case 50. A sealing resin 60 is provided inside the case 50 to seal the insulating circuit board 10 and the semiconductor element 20 and sleeve 30 mounted thereon.

[0145] In the semiconductor module 1 having the above-described configuration, second ends 42 of the external terminals 40 extending to the outside of the case 50 are connected to the circuit board 200. The circuit board 200 includes an insulating substrate 201, connection holes 202 formed to penetrate the insulating substrate 201, and circuit patterns 203 formed on the surface of the insulating substrate 201 and on the inner walls of the connection holes 202. The connection holes 202 of the circuit board 200 are formed in positions corresponding to the external terminals 40 of the semiconductor module 1. When the second ends 42 of the external terminals 40 of the semiconductor module 1 are inserted into the connection holes 202 of the circuit board 200, the second ends 42 are connected to the circuit patterns 203 formed on the inner walls of the connection holes 202. The second ends 42 of the external terminals 40 may have a press-fit shape that allows them to be inserted and connected to the connection holes 202, or they may be connected by soldering or the like after being inserted into the connection holes 202. This electrically connects the semiconductor module 1 to the circuit board 200 via the external terminals 40.

[0146] In the semiconductor module 1, the sleeve 30 may be, for example, the sleeve 30A, 30B, 30C, 30D, 30E, or 30F described in the first to sixth embodiments. With such a sleeve 30, the center position of the hole 31 can be accurately detected by binarization processing based on an image captured from the flange portion 33 side. An automatic insertion machine inserts the first end 41 of the external terminal 40 into the sleeve 30 with respect to the detected center position of the hole 31. Because the center position of the hole 31 is accurately detected, tilting of the external terminal 40, whose first end 41 is inserted into the hole 31, is reduced. As a result, misalignment between the second end 42 of the external terminal 40, which is drawn out of the case 50, and the connection hole 202 of the circuit board 200 is reduced. This prevents the second ends 42 of the external terminals 40 from colliding with the circuit board 200 when inserting them into the connection holes 202 of the circuit board 200, resulting in damage to the external terminals 40 or the circuit board 200, and prevents improper insertion in which the second ends 42 are not inserted into the corresponding connection holes 202. This allows for the realization of a high-quality semiconductor device 1A.

[0147] The flange portions 33 at both open ends of the sleeve 30 have the same shape on the side closer to the insulating circuit board 10 and the side closer to the circuit board 200. Therefore, during manufacturing, it is not necessary to control which of the flange portions 33 at both open ends is closer to the insulating circuit board 10 or the circuit board 200, which makes it possible to reduce manufacturing costs. The flange portions 33 at both open ends of the sleeve 30 can be connected to solder 80 with flux, and furthermore, they have the same and appropriate shape to allow external terminals 40 to be inserted.

[0148] The foregoing merely illustrates the principles of the present invention. Further, since numerous modifications and changes will be apparent to those skilled in the art, the present invention is not limited to the exact construction and application shown and described above, and all corresponding modifications and equivalents are deemed to be within the scope of the present invention as defined by the appended claims and their equivalents. [Explanation of symbols]

[0149] 1, 1A Semiconductor Device 2 Converter circuit section 2a Diode bridge circuit 3 Inverter circuit section 3a, 3b, 4a, 20 semiconductor elements 3aa, 3ba IGBT 3ab, 3bb FWD 4 Regenerative power discharge circuit section 4b Diode 5 Thermistor 10. Insulated circuit board 10a central area 10b Outer area 11 Insulating substrate 11a, 11b main surface 12, 13, 14, 15 Conductive layers 30, 30A, 30B, 30C, 30D, 30E, 30F, 30Z Sleeve 31, 31Z hole 31Za inner wall 32, 32Z cylindrical part 33, 33Z flange 33a, 33Za outer circumference 34, 34Z convex part 34a top surface 35, 35Z recess 35a Bottom 36 Inner 36a First outer edge 36b Second outer edge 36c inner wall 36d, 36e termination 37, 37Z, 37Za center 40 External terminal 41 First end 42 Second end 50 cases 51 Opening 60 Sealing resin 71, 72, 73, 74 Wires 80 Solder 91 1st plane 92 2nd plane 100 Imaging device 110 Shadow 200 Circuit Boards 201 Insulating substrate 202 Connection hole 203 Circuit Pattern D1 direction

Claims

1. an insulating circuit board having an insulating substrate and a conductive layer disposed on a main surface of the insulating substrate; a sleeve connected to the conductive layer; Including, The sleeve is a cylindrical portion having a hole extending in a direction perpendicular to the conductive layer; a flange portion provided at an open end of the cylindrical portion; Equipped with The flange portion is a plurality of protrusions extending from a first outer edge portion of the inner surface of the hole to an outer periphery of the flange portion in a plan view seen from the opening end side; a plurality of recesses provided between the plurality of protrusions in a plan view seen from the opening end side, the recesses extending from second outer edge portions on the inner surface to the outer periphery; Including, each of the plurality of protrusions has a top surface that is continuous with the inner surface at the first outer edge portion; each of the plurality of recesses has a bottom surface that is continuous with the inner surface at the second outer edge portion; An external terminal is inserted into the hole in the cylindrical portion of the sleeve.

2. 2. The semiconductor device according to claim 1, wherein said flange portion is provided at each of both open ends of said cylindrical portion.

3. the inner surface of the first outer edge portion terminates in a first plane that includes the top surface; The semiconductor device according to claim 2 , wherein an end of said inner surface at said second outer edge portion is located within a second plane including said bottom surface.

4. the plurality of protrusions are arranged rotationally symmetrically with respect to the center of the hole as an axis of symmetry in a plan view seen from the opening end side, The semiconductor device according to claim 2 , wherein the plurality of recesses are arranged rotationally symmetrically with respect to the center of the hole as an axis of symmetry in a plan view seen from the opening end side.

5. the plurality of protrusions extend radially from the center of the hole toward the outer periphery in a plan view seen from the opening end side, The semiconductor device according to claim 2 , wherein the plurality of recesses extend radially from the center of the hole toward the outer periphery in a plan view seen from the opening end side.

6. 3. The semiconductor device according to claim 2, wherein the inner surface of the hole has, at the first outer edge, a first bent portion that is continuous with the top surface, and at the second outer edge, a second bent portion that is continuous with the bottom surface.

7. 3. The semiconductor device according to claim 2, wherein the inner surface of the hole has, at the first outer edge portion, a first curved surface portion that is continuous with the top surface, and at the second outer edge portion, a second curved portion that is continuous with the bottom surface.

8. 3. The semiconductor device according to claim 2, wherein the inner surface of the hole has, at the first outer edge portion, a first bent portion that is continuous with the top surface, and at the second outer edge portion, a second curved surface portion that is continuous with the bottom surface.

9. 3. The semiconductor device according to claim 2, wherein the inner surface of the hole has, at the first outer edge portion, a first curved surface portion that is continuous with the top surface, and at the second outer edge portion, a second curved surface portion that is continuous with the bottom surface.

10. 3. The semiconductor device according to claim 2, wherein a total length of said first outer edge portions is equal to or greater than a total length of said second outer edge portions in a plan view seen from said opening end side.

11. 3. The semiconductor device according to claim 2, wherein, in a plan view from the opening end side, the length of a straight line connecting both ends of the second outer edge portion of the bottom surface is less than or equal to the length of a straight line connecting both ends of the outer periphery.

12. the insulating circuit board has, in a plan view, a central region and an outer peripheral region surrounding the central region, The semiconductor device according to claim 2 , wherein the sleeve is disposed in at least the outer periphery region out of the central region and the outer periphery region.

13. The semiconductor device according to claim 2 , wherein the flange portion of the sleeve on one of the opening ends is joined to the conductive layer via solder.

14. A semiconductor device as described in Claim 13, wherein the external terminal has a first end inserted into the hole from the other opening end side of the sleeve.

15. a case that covers the insulating circuit board and the sleeve; The semiconductor device according to claim 14 , wherein a second end of each of the external terminals opposite to the first end is disposed outside the case.

16. 16. The semiconductor device according to claim 15, further comprising a circuit board disposed opposite said insulating circuit board, said circuit board having connection holes into which said second ends of said external terminals are inserted.

17. an insulating circuit board having an insulating substrate and a conductive layer disposed on a main surface of the insulating substrate; a sleeve connected to the conductive layer; Including, The sleeve is a cylindrical portion having a hole extending in a direction perpendicular to the conductive layer; a flange portion provided at an open end of the cylindrical portion; Equipped with The flange portion is a plurality of protrusions extending from a first outer edge portion of the inner surface of the hole to an outer periphery of the flange portion in a plan view seen from the opening end side; a plurality of recesses provided between the plurality of protrusions in a plan view seen from the opening end side, the recesses extending from second outer edge portions on the inner surface to the outer periphery; Including, In a plan view seen from the opening end side, a total length of the first outer edge portion is equal to or greater than a total length of the second outer edge portion, An external terminal is inserted into the hole in the cylindrical portion of the sleeve.

18. the flange portion is provided at each of both open ends of the cylindrical portion, each of the plurality of protrusions has a top surface that is continuous with the inner surface at the first outer edge portion; The semiconductor device according to claim 17 , wherein each of the plurality of recesses has a bottom surface that is continuous with the inner surface at the second outer edge portion.

19. the inner surface of the first outer edge portion terminates in a first plane that includes the top surface; The semiconductor device according to claim 18 , wherein an end of the inner surface at the second outer edge portion is located in a second plane including the bottom surface.

20. the plurality of protrusions are arranged rotationally symmetrically with respect to the center of the hole as an axis of symmetry in a plan view seen from the opening end side, 18. The semiconductor device according to claim 17, wherein said plurality of recesses are arranged rotationally symmetrically with said center of said hole as an axis of symmetry in a plan view seen from said opening end side.

21. the plurality of protrusions extend radially from the center of the hole toward the outer periphery in a plan view seen from the opening end side, 18. The semiconductor device according to claim 17, wherein said plurality of recesses extend radially from the center of said hole toward said outer periphery in a plan view seen from said opening end side.

22. 19. The semiconductor device according to claim 18, wherein the inner surface of the hole has, at the first outer edge, a first bent portion that is continuous with the top surface, and at the second outer edge, a second bent portion that is continuous with the bottom surface.

23. 19. The semiconductor device according to claim 18, wherein the inner surface of the hole has, at the first outer edge portion, a first curved surface portion that is continuous with the top surface, and at the second outer edge portion, a second curved portion that is continuous with the bottom surface.

24. 19. The semiconductor device according to claim 18, wherein the inner surface of the hole has, at the first outer edge portion, a first bent portion that is continuous with the top surface, and has, at the second outer edge portion, a second curved surface portion that is continuous with the bottom surface.

25. 19. The semiconductor device according to claim 18, wherein the inner surface of the hole has, at the first outer edge portion, a first curved surface portion that is continuous with the top surface, and at the second outer edge portion, a second curved surface portion that is continuous with the bottom surface.

26. 19. The semiconductor device according to claim 18, wherein, in a plan view from the opening end side, the length of a straight line connecting both ends of the second outer edge portion of the bottom surface is less than or equal to the length of a straight line connecting both ends of the outer periphery.

27. the insulating circuit board has, in a plan view, a central region and an outer peripheral region surrounding the central region, The semiconductor device according to claim 17 , wherein the sleeve is disposed in at least the outer periphery region out of the central region and the outer periphery region.

28. 19. The semiconductor device according to claim 18, wherein the flange portion of the sleeve on one of the opening ends is joined to the conductive layer via solder.

29. A semiconductor device as described in Claim 28, wherein the external terminal has a first end inserted into the hole from the other opening end side of the sleeve.

30. a case that covers the insulating circuit board and the sleeve; 30. The semiconductor device according to claim 29, wherein a second end of the external terminal opposite to the first end is disposed outside the case.

31. 31. The semiconductor device according to claim 30, further comprising a circuit board disposed opposite said insulating circuit board, said circuit board having connection holes into which said second ends of said external terminals are inserted.

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