Load Sensor Element

Abstract

To improve the accuracy of temperature compensation.SOLUTION: A load sensor element 10 comprises a substrate 12, and an inorganic layer 16 that has a pressure receiving plane 13 that receives a load and is provided in a manner to cover a portion of a surface 14 that is one plane of the substrate 12. The load sensor element 10 includes a thin-film resistor 20 that is composed of a resistor whose resistance value changes in accordance with the load that the inorganic layer 16 receives. The thin-film resistor 20 has a body part 32 that is sandwiched between the substrate 12 and the inorganic layer 16, and one end 34 and anther end 36 which are both end portions placed on an exposure part 28 of the substrate 12 that is not covered by the inorganic layer 16. The load sensor element 10 includes a first temperature compensation resistor 22 that is independent from the thin-film resistor 20 and is disposed on the exposure part 28 of the surface 14 that is one plane of the substrate 12. The load sensor element 10 includes a second temperature compensation resistor that is disposed on the reverse side that is the other plane of the substrate 12, and that indicates the same behavior as the first temperature compensation resistor 22.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a load sensor element. [Background technology]

[0002] Patent Document 1 discloses a pressure sensor.

[0003] This pressure sensor is constructed by being assembled into a resin upper case and an upper case. The pressure sensor element has the peripheral edge of the circular part of its substrate as the fixed part, and the circular part inside this fixed part as the pressure receiving part. A strain-sensitive resistor is provided in the pressure receiving part of the pressure sensor element. In addition, the pressure sensor has an adjustment resistor provided in the non-strain part of the pressure sensor element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 07-167720 Summary of the Invention [Problem to be solved by the invention]

[0005] In this type of pressure sensor, a pipe is attached to communicate with a recess in the lower case or a pipe is attached to communicate with a recess in the upper case corresponding to the element, and the pressure to be measured is applied to the circular part of the element through one of these pipes. In other words, the pressure sensor element deforms as a whole when subjected to a load. Therefore, even if an adjustment resistor is used for temperature compensation, the output of the adjustment resistor will be affected by the deformation of the pressure sensor element.

[0006] This leads to a decrease in the accuracy of temperature correction.

[0007] Therefore, an object of the present invention is to enable improvement in temperature compensation accuracy. [Means for solving the problem]

[0008] A load sensor element according to one embodiment of the present invention is a load sensor element for measuring a surface pressure load, and includes a substrate and an inorganic layer having a pressure-receiving surface that receives a load and that is provided so as to cover a portion of one surface of the substrate. The load sensor element includes a thin-film resistor whose resistance value changes in response to the load received by the inorganic layer, the thin-film resistor having a main body sandwiched between the substrate and the inorganic layer and both ends disposed in an exposed portion of the substrate that is not covered by the inorganic layer. The load sensor element includes a first temperature-compensated resistor that is independent from the thin-film resistor and that is disposed in the exposed portion of one surface of the substrate, and a second temperature-compensated resistor that is disposed on the other surface of the substrate and that behaves in the same manner as the first temperature-compensated resistor. [Effects of the Invention]

[0009] According to this aspect, when the substrate is deformed by a load applied to the inorganic layer, the first temperature-compensated resistor provided on one surface of the substrate and the second temperature-compensated resistor provided on the other surface of the substrate exhibit resistance value changes of opposite polarities. Specifically, as an example, when the resistance value of the first temperature-compensated resistor increases, the resistance value of the second temperature-compensated resistor decreases.

[0010] Therefore, by using the resistance value indicated by the first temperature-compensated resistor and the resistance value indicated by the second temperature-compensated resistor, it is possible to cancel the change in resistance value caused by the deformation of the substrate, thereby making it possible to obtain the change in resistance value that depends on the environmental temperature.

[0011] Therefore, in the load sensor element that measures the surface pressure load, the temperature compensation accuracy can be improved by suppressing the influence of the deformation of the substrate on the change in resistance value. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a load sensor element according to a first embodiment, as viewed from the front surface side. [Figure 2] FIG. 2 is a perspective view of the load sensor element according to the first embodiment as viewed from the back surface side. [Figure 3] FIG. 3 is a diagram showing the load sensor element according to the first embodiment, and is a plan view showing the load sensor element from which the leads have been removed as viewed from the front surface side. [Figure 4] FIG. 4 is a diagram showing the load sensor element according to the first embodiment, and is a plan view showing the load sensor element from which the leads have been removed, as viewed from the back surface side. [Figure 5] FIG. 5 is a perspective view of the load sensor element according to the second embodiment as viewed from the front surface side. [Figure 6] FIG. 6 is a perspective view of the load sensor element according to the second embodiment as viewed from the back side. [Figure 7] FIG. 7 is a perspective view of the load sensor element according to the third embodiment as viewed from the front surface side. [Figure 8] FIG. 8 is a perspective view of the load sensor element according to the third embodiment as viewed from the back surface side. [Figure 9] FIG. 9 is a diagram showing a load sensor element according to the fourth embodiment, and is a plan view showing a state in which the load sensor element with the leads removed is viewed from the front surface side. [Figure 10] FIG. 10 is a diagram showing a load sensor element according to the fourth embodiment, and is a plan view showing the load sensor element from which the leads have been removed, as viewed from the back surface side. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of the invention will be described with reference to the accompanying drawings.

[0014] (First embodiment) First, a load sensor element 10 according to a first embodiment will be described with reference to FIGS.

[0015] FIG. 1 is a perspective view of a load sensor element 10 according to the first embodiment, as viewed from the front surface 14 side of a substrate 12. FIG. 2 is a perspective view of the load sensor element 10 according to the first embodiment, as viewed from the back surface 24 side. FIG. 3 is a diagram showing the load sensor element 10 according to the first embodiment, and is a plan view showing the load sensor element 10 with the leads removed, as viewed from the front surface 14 side. FIG. 4 is a diagram showing the load sensor element 10 according to the first embodiment, and is a plan view showing the load sensor element 10 with the leads removed, as viewed from the back surface 24 side.

[0016] The load sensor element 10 according to this embodiment is a sensor element for measuring a surface pressure load. As an example, the load sensor element 10 is provided in a machine tool and is used to detect a load in the machining axis direction of the machine tool and perform preload management.

[0017] As shown in FIG. 1, the load sensor element 10 includes a substrate 12 made of a ceramic material or a metal material having an insulating layer on its surface, and an inorganic layer 16 having a pressure-receiving surface 13 that receives a load and is arranged to cover a portion of a surface 14, which is one side of the substrate 12.

[0018] 1 and 2, the load sensor element 10 includes a thin-film resistor 20 and a first temperature-compensating resistor 22 provided on the front surface 14 of the substrate 12. The load sensor element 10 also includes a second temperature-compensating resistor 26 provided on the rear surface 24, which is the other surface of the substrate 12.

[0019] (Inorganic layer) As shown in FIG. 1, the surface of the inorganic layer 16 constitutes the pressure-receiving surface 13. The entire surface of the pressure-receiving surface 13 is pressed almost uniformly by a load. The inorganic layer 16 has a rectangular shape (including a square) in a plan view. The inorganic layer 16 is made of an inorganic material. The inorganic layer 16 is made of, for example, an insulating ceramic substrate. As with the substrate 12, the material of the inorganic layer 16 preferably uses zirconia (ZrO2) or alumina (Al2O3) as the main component of the ceramic material.

[0020] The inorganic layer 16 has an area smaller than that of the substrate 12. The inorganic layer 16 covers a portion of the surface 14 of the substrate 12. The inorganic layer 16 covers a portion of the thin-film resistor 20 provided on the substrate 12, but does not cover both ends (one end 34 and the other end 36) of the thin-film resistor 20.

[0021] The inorganic layer 16 is fixed to the substrate 12 by an adhesive layer (not shown) made of a resin material. The adhesive layer is, for example, mainly made of epoxy resin.

[0022] (substrate) The substrate 12 has a rectangular shape in a plan view, and is formed in the shape of a rectangular plate. The substrate 12 is made of, for example, an insulating ceramic material. From the viewpoint of improving the compressive strength of the substrate 12, it is preferable to use zirconia (ZrO2) or alumina (Al2O3) as the main component of the ceramic material. The substrate 12 may also be made of a metal material having an insulating layer on the surface 14.

[0023] 3, the surface 14 of the substrate 12 has a covered portion 27 that is covered with the inorganic layer 16 and an exposed portion 28 that is not covered with the inorganic layer 16. The covered portion 27 constitutes a pressure-receiving region 30 to which a load is applied from the inorganic layer 16.

[0024] (thin film resistor) The thin-film resistor 20 is a resistor whose resistance value changes depending on the load applied to the inorganic layer 16. The thin-film resistor 20 has a main body 32 sandwiched between the substrate 12 and the inorganic layer 16, and one end 34 and the other end 36 disposed on an exposed portion 28 of the substrate 12 that is not covered by the inorganic layer 16.

[0025] The thin film resistor 20 is made of, for example, a nichrome (NiCr)-based material or a chromium (Cr)-based material, which reduces the temperature coefficient of resistance (TCR), allowing the load sensor element 10 to accurately detect load even in a high-temperature environment of 50°C or higher.

[0026] The thin-film resistor 20 is a resistive layer formed on the surface 14 of the substrate 12 by vacuum processing such as vapor deposition or sputtering. Sputtering formation methods tend to produce films with uniform characteristics and thickness. Therefore, a uniform resistive layer is formed by vacuum processing such as vapor deposition or sputtering, allowing the load sensor element 10 to detect loads with high accuracy.

[0027] The thin film resistor 20 has a first thin film extension 42 that extends linearly along one side edge 40 of the substrate 12. The first thin film extension 42 extends from one side 44 to the other side 46 of the substrate 12. The thin film resistor 20 has a second thin film extension 50 that extends linearly along the other side edge 48 of the substrate 12. The second thin film extension 50 extends from one side 44 to the other side 46 of the substrate 12.

[0028] The thin-film resistor 20 has a thin-film connecting portion 52 connecting the first thin-film extending portion 42 and the second thin-film extending portion 50. The thin-film connecting portion 52 is disposed on the other side 46 of the substrate 12 and extends linearly along the other edge 54 of the substrate 12.

[0029] The first thin film extending portion 42, the second thin film extending portion 50, and the thin film continuous portion 52 are set to have approximately the same width dimension.

[0030] A first widened portion 58 is connected to one side 44 of the first thin-film extending portion 42, and the width dimension of the first widened portion 58 increases toward one edge 56 of the substrate 12. A first rectangular portion 60 having a rectangular shape is connected to the first widened portion 58.

[0031] A second widened portion 62 is connected to one side 44 of the second thin-film extending portion 50, and the width dimension of the second widened portion 62 increases toward one edge 56 of the substrate 12. A rectangular second rectangular portion 64 is connected to the second widened portion 62. This allows the thin-film resistor 20 to be formed in a U-shape.

[0032] In this thin-film resistor 20 , the thin-film connecting portion 52 , a portion of the first thin-film extending portion 42 , and a portion of the second thin-film extending portion 50 are coated with the inorganic layer 16 to form the main body portion 32 .

[0033] In this embodiment, the main body 32 is formed in a U-shape, but the present embodiment is not limited to this shape. For example, the main body 32 may be formed in a serpentine shape with repeated folds.

[0034] In the thin-film resistor 20, a part of the first thin-film extension 42, the first widened portion 58, and the first rectangular portion 60 form one end 34 that is not covered by the inorganic layer 16. In addition, in the thin-film resistor 20, a part of the second thin-film extension 50, the second widened portion 62, and the second rectangular portion 64 form the other end 36 that is not covered by the inorganic layer 16.

[0035] A rectangular first electrode 70 is provided on the first rectangular portion 60 of the thin-film resistor 20. The first electrode 70 is electrically connected to the first rectangular portion 60 and is disposed on one side 44 of the substrate 12.

[0036] Furthermore, a rectangular second electrode 72 is provided on the second rectangular portion 64 of the thin-film resistor 20. The second electrode 72 is electrically connected to the second rectangular portion 64 and is disposed on one side 44 of the substrate 12. The first electrode 70 and the second electrode 72 are laminated on the first rectangular portion 60 of the thin-film resistor 20 and the second rectangular portion 64 of the thin-film resistor 20, respectively, by a method such as sputtering or vapor deposition. The first electrode 70 and the second electrode 72 are formed so as to have smaller dimensions than the first rectangular portion 60 of the thin-film resistor 20 and the second rectangular portion 64 of the thin-film resistor 20, respectively.

[0037] (First temperature compensation resistor) The first temperature-compensating resistor 22 is independent from the thin-film resistor 20 and is disposed on an exposed portion 28 of the surface 14, which is one surface of the substrate 12. The first temperature-compensating resistor 22 is disposed between one end 34 and the other end 36 of the thin-film resistor 20. The first temperature-compensating resistor 22 is disposed inside the U-shape formed by the thin-film resistor 20.

[0038] The first temperature-compensating resistor 22 is formed of the same material as the thin-film resistor 20. The first temperature-compensating resistor 22 is formed on the substrate 12 by the same method as the thin-film resistor 20.

[0039] The first temperature-compensating resistor 22 has a first compensation extension 80 and a second compensation extension 82 that extend linearly from one side 44 to the other side 46 within the exposed portion 28 of the substrate 12. The first compensation extension 80 and the second compensation extension 82 are spaced apart from each other.

[0040] The first-front compensation extension 80 is disposed at a position closer to one end 34 of the thin-film resistor 20 than the second-front compensation extension 82. The second-front compensation extension 82 is disposed at a position closer to the other end 36 of the thin-film resistor 20 than the first-front compensation extension 80.

[0041] The first temperature-compensating resistor 22 has a front-compensation connecting portion 84 connecting the other side 46 of the first front-compensation extending portion 80 to the other side 46 of the second front-compensation extending portion 82. The front-compensation connecting portion 84 extends linearly along a boundary line 90 between the covered portion 27 and the exposed portion 28. This allows the first temperature-compensating resistor 22 to be formed in a U-shape.

[0042] A rectangular third rectangular portion 92 is connected to the end of one side 44 of the first table compensation extension portion 80. A rectangular fourth rectangular portion 94 is connected to the end of one side 44 of the second table compensation extension portion 82.

[0043] A rectangular third electrode 96 is provided on the third rectangular portion 92 of the first temperature compensation resistor 22. The third electrode 96 is electrically connected to the third rectangular portion 92 and is disposed on one side 44 of the substrate 12.

[0044] A rectangular fourth electrode 98 is provided on the fourth rectangular portion 94 of the first temperature-compensating resistor 22. The fourth electrode 98 is electrically connected to the fourth rectangular portion 94 and is disposed on one side 44 of the substrate 12.

[0045] The first front compensation extension portion 80, the second front compensation extension portion 82, and the front compensation connecting portion 84 are set to have approximately the same width dimension.

[0046] The width of the first temperature-compensating resistor 22 in the region from the first front compensation extension 80 to the second front compensation extension 82 is set to be narrower than the width of the thin-film resistor 20 in the region from the first thin-film extension 42 to the second thin-film extension 50. This allows the first temperature-compensating resistor 22 and the thin-film resistor 20 to have approximately the same resistance value.

[0047] (Second temperature compensation resistor) The second temperature-compensating resistor 26 is disposed on the other surface, that is, the back surface 24, of the substrate 12. The second temperature-compensating resistor 26 exhibits the same behavior as the first temperature-compensating resistor 22.

[0048] Configurations that exhibit the same behavior include at least one of a first configuration in which the resistance temperature coefficients of the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 are equivalent, and a second configuration in which the absolute values of the changes in resistance value in the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 for the same deformation are equivalent.

[0049] In this embodiment, the resistance temperature coefficients of the first temperature compensating resistor 22 and the second temperature compensating resistor 26 are made equal, and the absolute values of the resistance value changes of the first temperature compensating resistor 22 and the second temperature compensating resistor 26 when deformed by the same load are made equal (positive and negative are opposite), so that they behave in the same way.

[0050] The temperature coefficient of resistance refers to the rate of change in resistance value with a change in temperature.

[0051] The resistance value of the first temperature compensating resistor 22 and the resistance value of the second temperature compensating resistor 26, which are deformed by the same load, change in different directions (polarities) of the resistance value. The reason why the resistance values of the temperature compensating resistors 22 and 26 change in different directions (polarities) of the resistance value will be described below.

[0052] When the pressure-receiving surface 13 is pressed by a load, the substrate 12 sandwiched between the inorganic layer 16 and the mounting surface (e.g., a base) on which the load sensor element 10 is attached is deformed so as to bend in the load direction. When such deformation occurs, one surface of the substrate 12 is deformed in the tensile direction, and the other surface is deformed in the compressive direction.

[0053] At this time, the amount of deformation on one surface is approximately the same as that on the opposite surface. Therefore, the first temperature-compensating resistor 22 formed on the front surface 14 of the substrate 12 and exhibiting the same behavior and the second temperature-compensating resistor 26 formed on the back surface 24 of the substrate 12 exhibit approximately the same absolute change in resistance value, but the directions (polarities) of the increase and decrease in resistance value are different.

[0054] The advantages of having the same temperature coefficient of resistance will be explained below.

[0055] The temperature-compensating resistors 22, 26 have approximately the same temperature coefficient of resistance. Therefore, by arranging the temperature-compensating resistors 22, 26 on one side of a bridge circuit (in parallel or in series), it is possible to cancel out the change in resistance value of each temperature-compensating resistor 22, 26 due to deformation of the substrate 12. This makes it possible to easily obtain the change in resistance value due to temperature change without performing complex circuit processing or the like.

[0056] The term "the temperature coefficients of resistance are substantially the same" means that the difference between the temperature coefficient of resistance of the first temperature compensating resistor 22 and the temperature coefficient of resistance of the second temperature compensating resistor 26 is within a predetermined first range.

[0057] The first range is, for example, 100 ppm / K.

[0058] The resistance value changes being equivalent means that after applying a predetermined identical load to each temperature-compensating resistor 22, 26, i.e., after the front surface 14 and back surface 24 of the substrate 12 are deformed due to the load being applied to the pressure-receiving area 30, the difference between the resistance value change occurring in the first temperature-compensating resistor 22 and the resistance value change occurring in the second temperature-compensating resistor 26 is within a predetermined second range. An example of the predetermined uniform load is 10 kN. An example of the second range is 100 ppm.

[0059] In this way, by providing the first temperature-compensating resistor 22 on the front surface 14 of the substrate 12 and the second temperature-compensating resistor 26, which behaves in the same way as the first temperature-compensating resistor 22, on the back surface 24, the change in resistance value when the substrate 12 is deformed can be made to have the opposite polarity.

[0060] The second temperature-compensating resistor 26 is formed of the same material as the thin-film resistor 20 and the first temperature-compensating resistor 22. The second temperature-compensating resistor 26 is formed on the substrate 12 by the same method as the thin-film resistor 20 and the first temperature-compensating resistor 22.

[0061] The second temperature-compensating resistor 26 is disposed on the rear side of the position where the first temperature-compensating resistor 22 is disposed. The second temperature-compensating resistor 26 is formed in substantially the same shape as the first temperature-compensating resistor 22.

[0062] As a result, the second temperature-compensating resistor 26 is disposed at a position overlapping the first temperature-compensating resistor 22 in the thickness direction 100 (see FIGS. 1 and 2) of the substrate 12. The second temperature-compensating resistor 26 is set to have substantially the same resistance value as the first temperature-compensating resistor 22.

[0063] Here, when the second temperature-compensating resistor 26 overlaps with the first temperature-compensating resistor 22, this does not exclude the possibility that, when the second temperature-compensating resistor 26 is overlapped with the first temperature-compensating resistor 22 in the thickness direction 100 of the substrate 12, a non-overlapping area may be formed on part of the outer edge.

[0064] As an example, the non-overlapping area is set to within 50%, preferably within 25%, of the total area of the first temperature-compensating resistor 22. The smaller the non-overlapping area, the more the front surface 14 and back surface 24 of the substrate 12 will be in the same state, and therefore the behavior of the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 can be made the same, although variations in the formation positions during manufacturing are allowed.

[0065] The second temperature compensating resistor 26 is disposed in the area behind the exposed portion 28 .

[0066] The second temperature compensating resistor 26 has a first back compensation extension portion 110 arranged in a position overlapping with the first front compensation extension portion 80 of the first temperature compensating resistor 22 in the thickness direction 100 of the substrate 12, and a second back compensation extension portion 112 arranged in a position overlapping with the second front compensation extension portion 82.

[0067] In addition, the second temperature compensating resistor 26 has a back compensation connecting portion 114 arranged in a position overlapping with the front compensation connecting portion 84 of the first temperature compensating resistor 22 in the thickness direction 100 of the substrate 12, and a fifth rectangular portion 116 arranged in a position overlapping with the third rectangular portion 92.

[0068] Furthermore, the second temperature-compensating resistor 26 has a sixth rectangular portion 118 that is arranged at a position that overlaps with the fourth rectangular portion 94 of the first temperature-compensating resistor 22 in the thickness direction 100 of the substrate 12 .

[0069] A rectangular fifth electrode 120 is provided on the fifth rectangular portion 116 of the second temperature compensation resistor 26. The fifth electrode 120 is electrically connected to the fifth rectangular portion 116 and is disposed on one side 44 of the substrate 12.

[0070] In addition, a rectangular sixth electrode 122 is provided on the sixth rectangular portion 118 of the second temperature-compensating resistor 26. The sixth electrode 122 is electrically connected to the sixth rectangular portion 118 and is disposed on one side 44 of the substrate 12.

[0071] Thus, each of the resistors 20, 22, 26 has a respective electrode 70, 72, 96, 98, 120, 122 electrically connected to its end.

[0072] The electrodes 70, 72, 96, 98, 120, and 122 are made of a material such as copper (Cu), silver (Ag), or gold (Au).

[0073] The first back compensation extension portion 110, the second back compensation extension portion 112, and the back compensation continuous portion 114 are set to have approximately the same width dimension.

[0074] The width of the second temperature-compensating resistor 26 in the region from the first rear compensation extension 110 to the second rear compensation extension 112 is set to be narrower than the width of the thin-film resistor 20 in the region from the first thin-film extension 42 to the second thin-film extension 50. This allows the second temperature-compensating resistor 26 and the thin-film resistor 20 to have approximately the same resistance value.

[0075] 1, a first lead wire 130 is connected to a first electrode 70 provided on the surface 14 of the substrate 12. A second lead wire 132 is connected to the second electrode 72. A third lead wire 134 is connected to the third electrode 96. A fourth lead wire 136 is connected to the fourth electrode 98.

[0076] 2, a fifth lead wire 138 is connected to the fifth electrode 120 provided on the rear surface 24 of the substrate 12. A sixth lead wire 140 is connected to the sixth electrode 122.

[0077] Each of the lead wires 130 , 132 , 134 , 136 , 138 , and 140 is electrically connected to a corresponding one of the electrodes 70 , 72 , 96 , 98 , 120 , and 122 by solder 142 .

[0078] Each of the lead wires 130, 132, 134, 136, 138, and 140 is made of a material such as a copper (Cu) alloy or an iron (Fe) alloy. Each of the lead wires 130, 132, 134, 136, 138, and 140 may be made of, for example, an uncoated conductor wire (plated with tin (Sn) or the like), a coated conductor wire, or an enameled conductor wire coated with an insulating layer. Alternatively, a terminal made of a flat lead frame may be used.

[0079] (Action and effect) Next, the effects of the first embodiment will be described.

[0080] The load sensor element 10 of this embodiment is a load sensor element 10 that measures a surface pressure load. The load sensor element 10 includes a substrate 12 and an inorganic layer 16 that has a pressure-receiving surface 13 that receives a load and is provided so as to cover a portion of the front surface 14, which is one surface of the substrate 12. The load sensor element 10 includes a thin-film resistor 20 composed of a resistor whose resistance value changes in response to a load received by the inorganic layer 16. The thin-film resistor 20 has a main body 32 sandwiched between the substrate 12 and the inorganic layer 16, and one end 34 and the other end 36, which are both ends located on an exposed portion 28 of the substrate 12 that is not covered by the inorganic layer 16. The load sensor element 10 includes a first temperature-compensating resistor 22 that is independent from the thin-film resistor 20 and is located on the exposed portion 28 of the front surface 14, which is one surface of the substrate 12. The load sensor element 10 also includes a second temperature-compensating resistor 26 that is located on the back surface 24, which is the other surface of the substrate 12, and that behaves in the same manner as the first temperature-compensating resistor 22.

[0081] The configurations that exhibit the same behavior include at least one of a first configuration in which the resistance temperature coefficients of the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 are equivalent, and a second configuration in which the absolute values of the change in resistance value in response to the same deformation in the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 are equivalent.

[0082] In this configuration, the first temperature-compensating resistor 22 provided on the front surface 14 of the substrate 12 and the second temperature-compensating resistor 26 provided on the back surface 24 of the substrate 12 undergo resistance value changes of opposite polarities when the substrate 12 is deformed due to the load applied to the inorganic layer 16.

[0083] Specifically, when the substrate 12 is deformed due to the load applied to the inorganic layer 16, for example, if the resistance value of the first temperature-compensating resistor 22 increases, the resistance value of the second temperature-compensating resistor 26 decreases.

[0084] Therefore, by using the resistance value indicated by the first temperature compensating resistor 22 and the resistance value indicated by the second temperature compensating resistor 26, it is possible to cancel the change in resistance value caused by the deformation of the substrate 12. This makes it possible to obtain the change component in resistance value that depends on the ambient temperature.

[0085] Therefore, in the load sensor element 10 that measures the surface pressure load, by suppressing the influence caused by the deformation of the substrate 12, it is possible to improve the temperature compensation accuracy.

[0086] In addition, as a method for canceling the change in resistance value caused by deformation of the substrate 12 using the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26, for example, a method of connecting the first temperature-compensating resistor 22 and the second temperature-compensating resistor 26 in series or in parallel can be mentioned.

[0087] In the load sensor element 10 of this embodiment, the first temperature compensating resistor 22 and the second temperature compensating resistor 26 have substantially the same shape and are arranged at positions where they overlap in the thickness direction of the substrate 12.

[0088] In this configuration, the resistance value of the first temperature-compensating resistor 22 when the substrate 12 is deformed due to the load applied to the inorganic layer 16 can be made closer to the resistance value of the second temperature-compensating resistor 26.

[0089] Second Embodiment A load sensor element 200 according to the second embodiment will be described with reference to Figures 5 and 6. In this embodiment, the same or equivalent parts as those in the first embodiment will be denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted, and only the parts different from the first embodiment will be described.

[0090] Fig. 5 is a perspective view of the load sensor element 200 according to the second embodiment as seen from the front surface 14 side. Fig. 6 is a perspective view of the load sensor element 200 according to the second embodiment as seen from the back surface 24 side.

[0091] The load sensor element 200 according to the second embodiment differs from the first embodiment in that it has a hole 202 in the substrate 12. Furthermore, the load sensor element 200 according to the second embodiment differs from the first embodiment in the arrangement of the first temperature compensating resistor 204 and the arrangement of the second temperature compensating resistor 206.

[0092] (First temperature compensation resistor) The first temperature compensating resistor 204 has a first front compensation extension 80 and a second front compensation extension 82 that extend linearly from one side 44 to the other side 46 within the exposed portion 28 of the substrate 12 .

[0093] The first temperature compensating resistor 204 has a front compensation connecting portion 84 connecting one side 44 of the first front compensation extension portion 80 to one side 44 of the second front compensation extension portion 82. The front compensation connecting portion 84 of the first temperature compensating resistor 204 extends linearly along one edge 56 of the substrate 12.

[0094] A rectangular third rectangular portion 92 is connected to the end of the other side 46 of the first table compensation extension portion 80. A rectangular fourth rectangular portion 94 is connected to the end of the other side 46 of the second table compensation extension portion 82.

[0095] A third electrode 96 is provided on the third rectangular portion 92 of the first temperature compensating resistor 204. A fourth electrode 98 is provided on the fourth rectangular portion 94 of the first temperature compensating resistor 204.

[0096] One side 44 of the first front compensation extension portion 80 of the first temperature compensating resistor 204 and one side 44 of the second front compensation extension portion 82 are connected by a front compensation connecting portion 84. The front compensation connecting portion 84 extends linearly along one end edge 56 of the substrate 12. As a result, the front compensation connecting portion 84 is located on the one side 44 of the hole 202.

[0097] As a result, the region of the first temperature-compensating resistor 204, from one end where the third electrode 96 is provided to the other end where the fourth electrode 98 is provided, is disposed at a location farther from the thin-film resistor 20 than the third electrode 96 and the fourth electrode 98. Furthermore, the first temperature-compensating resistor 204 is disposed so that the region from one end where the third electrode 96 is provided to the other end where the fourth electrode 98 is provided avoids the hole 202.

[0098] (Second temperature compensation resistor) 6, the second temperature-compensating resistor 206 has a first back-side compensation extension 110 arranged at a position overlapping the first front-side compensation extension 80 of the first temperature-compensating resistor 204 in the thickness direction 100 of the substrate 12. The second temperature-compensating resistor 206 has a second back-side compensation extension 112 arranged at a position overlapping the second front-side compensation extension 82.

[0099] The second temperature-compensating resistor 206 also has a rear-side compensation connecting portion 114 that is arranged at a position that overlaps the front-side compensation connecting portion 84 of the first temperature-compensating resistor 204 in the thickness direction 100 of the substrate 12 .

[0100] Furthermore, the second temperature-compensating resistor 206 has a fifth rectangular portion 116 arranged in a position overlapping with the third rectangular portion 92 of the first temperature-compensating resistor 204 in the thickness direction 100 of the substrate 12, and a sixth rectangular portion 118 arranged in a position overlapping with the fourth rectangular portion 94.

[0101] A fifth electrode 120 is provided on the fifth rectangular portion 116 of the second temperature compensating resistor 206. A sixth electrode 122 is provided on the sixth rectangular portion 118 of the second temperature compensating resistor 206.

[0102] One side 44 of the first back compensation extension portion 110 of the second temperature compensating resistor 206 and one side 44 of the second back compensation extension portion 112 are connected by a back compensation connecting portion 114. The back compensation connecting portion 114 of the second temperature compensating resistor 206 extends linearly along one end edge 56 of the substrate 12. As a result, the back compensation connecting portion 114 is positioned on the one side 44 of the hole 202.

[0103] Moreover, the second temperature-compensating resistor 206 is arranged such that the region from one end where the fifth electrode 120 is provided to the other end where the sixth electrode 122 is provided is farther from the main body 32 (see FIG. 3 ) of the thin-film resistor 20 than the fifth electrode 120 and the sixth electrode 122. Furthermore, the second temperature-compensating resistor 206 is arranged such that the region from one end where the fifth electrode 120 is provided to the other end where the sixth electrode 122 is provided avoids the hole 202.

[0104] The lead wires 130, 132, 134, 136, 138, 140 connected to the electrodes 70, 72, 96, 98, 120, 122 are made of coated wires in which the conductor is covered with a coating, or enameled wires in which the conductor is covered with an insulating layer.

[0105] (hole) The substrate 12 of this load sensor element 200 has holes 202, which are deformation suppression portions, between the pressure-receiving area 30 where the inorganic layer 16 overlaps in the thickness direction 100 of the substrate 12 and the first temperature-compensating resistor 204, and between the pressure-receiving area 30 and the second temperature-compensating resistor 206.

[0106] Here, the deformation suppression may be a through hole or a bottomed hole having a bottom, and the deformation suppression may be a through groove or a groove having a bottom.

[0107] The deformation suppression may be such that, when the substrate 12 is deformed by the load from the inorganic layer 16, the deformation occurring in the pressure-receiving area 30 suppresses the deformation of the area of the substrate 12 where the first temperature-compensating resistor 204 and the second temperature-compensating resistor 206 are provided.

[0108] More specifically, the hole 202 is formed between the third rectangular portion 92 and the fourth rectangular portion 94 of the first temperature compensation resistor 204 and the pressure-receiving area 30 .

[0109] The hole 202 extends along the boundary line 90 between the covered portion 27 (see FIG. 3) and the exposed portion 28. The hole 202 can be formed by, for example, a mold that shapes the substrate 12 or a laser that processes the substrate 12.

[0110] The hole 202 is formed as a slit penetrating the substrate 12. As a result, the hole 202 opens on the rear surface 24 of the substrate 12, between the fifth rectangular portion 116 and the sixth rectangular portion 118 of the second temperature-compensating resistor 206 and the pressure-receiving area 30.

[0111] In this embodiment, the case where the hole 202 serving as the deformation suppression portion is configured as a slit penetrating the substrate 12 will be described, but the embodiment is not limited to this. For example, the hole 202 serving as the deformation suppression portion may be configured as a groove.

[0112] When the hole 202 is configured as a groove, the groove may be formed on either the front surface 14 or the back surface 24 of the substrate 12, or the groove may be formed on both the front surface 14 and the back surface 24 of the substrate 12. In order to make the behavior of the first temperature-compensating resistor 204 on the front surface 14 of the substrate 12 and the behavior of the second temperature-compensating resistor 206 on the back surface 24 of the substrate 12 approximately identical, it is desirable to form the groove on both the front surface and the back surface 24 of the substrate 12. When forming the groove on the front surface 14 and the back surface 24 of the substrate 12, it is desirable to form both grooves at positions that overlap in the thickness direction 100 of the substrate 12 and to form both grooves with approximately the same depth and approximately the same length dimensions, in order to make the conditions on both surfaces approximately the same.

[0113] (Action and effect) Next, the effects of the second embodiment will be described.

[0114] In the load sensor element 200 of this embodiment, the same or equivalent parts as those in the first embodiment can also obtain the same effects as those in the first embodiment.

[0115] In the load sensor element 200 of this embodiment, the substrate 12 has a hole 202, which is a deformation suppression portion, in at least one of the positions between the pressure-receiving area 30 where the inorganic layer 16 overlaps in the thickness direction 100 of the substrate 12 and the first temperature-compensating resistor 204, or between the pressure-receiving area 30 and the second temperature-compensating resistor 206.

[0116] In this configuration, when the substrate 12 is deformed due to the load received by the inorganic layer 16, the hole 202 can prevent the deformation occurring in the pressure-receiving area 30 from being transmitted to the first temperature-compensating resistor 204 and the second temperature-compensating resistor 206.

[0117] This reduces the effect of the load received by the inorganic layer 16 on the first temperature-compensating resistor 204 and the second temperature-compensating resistor 206. This makes it possible to improve the temperature compensation accuracy using the temperature-compensating resistors 204, 206. In particular, when the hole 202 is a through slit, a space is provided between the exposed portion 28 of the substrate 12, on which the first temperature-compensating resistor 204 and the second temperature-compensating resistor 206 are formed, and the pressure-receiving region 30, thereby further reducing the effect of the load.

[0118] Furthermore, when the holes 202 are through slits, the positions of the holes 202 on the front surface 14 and the back surface 15 of the substrate 12 are the same, eliminating the need for alignment and facilitating manufacturing.

[0119] Furthermore, in the load sensor element 200 of this embodiment, the load sensor element 10 includes a first electrode 70 electrically connected to one end 34 of the thin-film resistor 20 and provided on one side 44 of the substrate 12. The load sensor element 10 includes a second electrode 72 electrically connected to the other end 36 of the thin-film resistor 20 and provided on one side 44 of the substrate. The load sensor element 10 includes a third electrode 96 electrically connected to one end of the first temperature-compensating resistor 22 and provided on one side 44 of the substrate 12. The load sensor element 10 includes a fourth electrode 98 electrically connected to the other end of the first temperature-compensating resistor 22 and provided on one side 44 of the substrate 12. The load sensor element 10 includes a fifth electrode 120 electrically connected to one end of the second temperature-compensating resistor 26 and provided on one side 44 of the substrate 12. The load sensor element 10 includes a sixth electrode 122 that is electrically connected to the other end of the second temperature compensating resistor 26 and is provided on one side 44 that is one side of the substrate 12 .

[0120] The first temperature-compensating resistor 204 is disposed such that the region from one end where the third electrode 96 is provided to the other end where the fourth electrode 98 is provided is farther from the thin-film resistor 20 than the third electrode 96 and the fourth electrode 98. The second temperature-compensating resistor 206 is disposed such that the region from one end where the fifth electrode 120 is provided to the other end where the sixth electrode 122 is provided is farther from the thin-film resistor 20 than the fifth electrode 120 and the sixth electrode 122.

[0121] This configuration can reduce the effect of the load received by the inorganic layer 16 on the first temperature-compensating resistor 204 and the second temperature-compensating resistor 206. This allows for further improvement in the accuracy of temperature compensation using the temperature-compensating resistors 204 and 206.

[0122] (Third embodiment) A load sensor element 300 according to the third embodiment will be described with reference to Figures 7 and 8. In this embodiment, the same or equivalent parts as those in the first embodiment will be denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted, and only the parts different from the first embodiment will be described.

[0123] Fig. 7 is a perspective view of the load sensor element 300 according to the third embodiment as seen from the front surface 14 side. Fig. 8 is a perspective view of the load sensor element 300 according to the third embodiment as seen from the back surface 24 side.

[0124] The load sensor element 300 according to the third embodiment is different from the first embodiment in the arrangement of the first temperature compensating resistor 302 and the arrangement of the second temperature compensating resistor 304. Furthermore, the load sensor element 300 according to the third embodiment is different from the first embodiment in the shape of the thin film resistor 306.

[0125] (thin film resistor) The thin film resistor 306 has a first thin film extension 42 extending along one side edge 40 of the substrate 12, a second thin film extension 50 extending along the other side edge 48 of the substrate 12, and a thin film connecting portion 52 connecting the first thin film extension 42 and the second thin film extension 50.

[0126] A first extension portion 310 extending toward the other side edge 48 of the substrate 12 is connected to the end of one side 44 of the first thin-film extension portion 42. A one-edge widened portion 312 whose width increases toward one edge 56 of the substrate 12 is connected to the end of the first extension portion 310. A rectangular first rectangular portion 314 is connected to the one-edge widened portion 312. A first electrode 70 is provided on the first rectangular portion 314.

[0127] A second extension portion 320 extending toward one side edge 40 of the substrate 12 is connected to the end of one side 44 of the second thin-film extension portion 50. An other-edge widened portion 322 whose width increases toward one edge 56 of the substrate 12 is connected to the end of the second extension portion 320. A rectangular second rectangular portion 324 is connected to the other-edge widened portion 322. A second electrode 72 is provided on the second rectangular portion 324.

[0128] This thin film resistor 306 constitutes a main body 32 in which the thin film connecting portion 52, the first thin film extending portion 42, the first extending portion 310, a portion of the one edge side widening portion 312, the second thin film extending portion 50, the second extending portion 320, and a portion of the other edge side widening portion 322 are covered with an inorganic layer 16.

[0129] A part of the one-edge widening portion 312 and the first rectangular portion 314 constitute one end portion that is not covered with the inorganic layer 16. In addition, a part of the other-edge widening portion 322 and the second rectangular portion 324 constitute the other end portion that is not covered with the inorganic layer 16.

[0130] (First temperature compensation resistor) The first temperature compensating resistor 302 has a first front compensation extension 330 and a second front compensation extension 332 that extend linearly from one side 44 to the other side 46 within the exposed portion 28 of the substrate 12 .

[0131] In the first temperature compensating resistor 302, one side 44 of the first front compensation extension portion 330 and one side 44 of the second front compensation extension portion 332 are connected by a front compensation connecting portion 334. The front compensation connecting portion 334 of the first temperature compensating resistor 302 extends linearly along one edge 56 of the substrate 12.

[0132] A rectangular third rectangular portion 340 is connected to the end of the other side 46 of the first front compensation extension portion 330. The third rectangular portion 340 is provided between the first rectangular portion 314 and one side edge 40 of the substrate 12. A third electrode 96 is provided on the third rectangular portion 340.

[0133] A rectangular fourth rectangular portion 342 is connected to the end of the other side 46 of the second surface compensation extension portion 332. The fourth rectangular portion 342 is provided between the second rectangular portion 324 and the other side edge 48 of the substrate 12. A fourth electrode 98 is provided on the fourth rectangular portion 342.

[0134] As a result, the region of the first temperature-compensating resistor 302 from one end where the third electrode 96 is provided to the other end where the fourth electrode 98 is provided is positioned farther from the thin-film resistor 306 than the third electrode 96 and the fourth electrode 98.

[0135] (Second temperature compensation resistor) 8, the second temperature-compensating resistor 304 has a first back-side compensation extension 350 arranged at a position overlapping the first front-side compensation extension 330 of the first temperature-compensating resistor 302 in the thickness direction 100 of the substrate 12. The second temperature-compensating resistor 304 has a second back-side compensation extension 352 arranged at a position overlapping the second front-side compensation extension 332.

[0136] In addition, the second temperature compensating resistor 304 has a back compensation connecting portion 354 arranged in a position overlapping with the front compensation connecting portion 334 of the first temperature compensating resistor 302 in the thickness direction 100 of the substrate 12, and a fifth rectangular portion 356 arranged in a position overlapping with the third rectangular portion 340.

[0137] Furthermore, the second temperature-compensating resistor 304 has a sixth rectangular portion 358 that is arranged at a position that overlaps with the fourth rectangular portion 342 of the first temperature-compensating resistor 302 in the thickness direction 100 of the substrate 12 .

[0138] A fifth electrode 120 is provided on the fifth rectangular portion 356 of the second temperature compensating resistor 304. A sixth electrode 122 is provided on the sixth rectangular portion 358 of the second temperature compensating resistor 304.

[0139] As a result, the second temperature-compensating resistor 304 is positioned such that the region from one end where the fifth electrode 120 is provided to the other end where the sixth electrode 122 is provided is farther from the thin-film resistor 306 than the fifth electrode 120 and the sixth electrode 122.

[0140] The lead wires 130, 132, 134, 136, 138, 140 connected to the electrodes 70, 72, 96, 98, 120, 122 are made of coated wires in which the conductor is covered with a coating, or enameled wires in which the conductor is covered with an insulating layer.

[0141] (Action and effect) Next, the effects of the third embodiment will be described.

[0142] In the load sensor element 300 of this embodiment, the same or equivalent parts as those in the first embodiment can also obtain the same effects as those in the first embodiment.

[0143] In the load sensor element 300 of this embodiment, the first temperature-compensating resistor 302 is arranged such that the region from one end where the third electrode 96 is provided to the other end where the fourth electrode 98 is provided is farther from the thin-film resistor 306 than the third electrode 96 and the fourth electrode 98. The second temperature-compensating resistor 304 is arranged such that the region from one end where the fifth electrode 120 is provided to the other end where the sixth electrode 122 is provided is farther from the thin-film resistor 306 than the fifth electrode 120 and the sixth electrode 122.

[0144] In this configuration, as in the second embodiment, it is possible to reduce the influence of the load received by the inorganic layer 16 on the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304. This is because the distance between the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304 and the pressure-receiving region 30 is increased. This makes it possible to further improve the accuracy of temperature compensation using the temperature-compensating resistors 302, 304.

[0145] Furthermore, in the load sensor element 300 of this embodiment, the front compensation connecting portion 334 of the first temperature compensating resistor 302 and the back compensation connecting portion 354 of the second temperature compensating resistor 304 can be made longer than in the load sensor element 200 of the second embodiment.

[0146] As a result, in order to achieve a high resistance value, the width dimensions of the first temperature-compensated resistor 302 and the second temperature-compensated resistor 304 can be made wider than those of the first temperature-compensated resistor 22 and the second temperature-compensated resistor 26 of the second embodiment. Furthermore, when the width dimensions of the first temperature-compensated resistor 302 and the second temperature-compensated resistor 304 are made the same as those of the first temperature-compensated resistor 22 and the second temperature-compensated resistor 26 of the second embodiment, the resistance value can be made higher than that of each of the temperature-compensated resistors 22, 26.

[0147] Increasing the resistance of each resistor makes it possible to reduce the power consumption of the circuit that each resistor constitutes. Also, by expanding the range of manufacturable resistance values, it becomes possible to offer a wide range of products with different resistance values, contributing to increased freedom in circuit design.

[0148] Furthermore, the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304 are disposed at positions away from the pressure-receiving area 30. This makes it possible to suppress the influence of deformation occurring in the pressure-receiving area 30 on the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304.

[0149] (Fourth embodiment) A load sensor element 400 according to the fourth embodiment will be described with reference to Figures 9 and 10. In this embodiment, the same or equivalent parts as those in the third embodiment will be denoted by the same reference numerals as those in the third embodiment and the description thereof will be omitted, and only the parts different from the third embodiment will be described.

[0150] Fig. 9 is a diagram showing a load sensor element 400 according to the fourth embodiment, and is a plan view showing the load sensor element 400 with the leads removed as viewed from the front surface 14. Fig. 10 is a diagram showing the load sensor element 400 according to the fourth embodiment, and is a plan view showing the load sensor element 400 with the leads removed as viewed from the back surface 24.

[0151] The load sensor element 400 according to the fourth embodiment differs from the third embodiment in that the thin film resistor 306, the first temperature compensating resistor 302, and the second temperature compensating resistor 304 each have an adjustment unit for adjusting the resistance value.

[0152] (thin film resistor) 9, in the thin-film resistor 306, the first extension portion 310 and the first rectangular portion 314 are connected by a linear first connecting portion 410. In the thin-film resistor 306, the second extension portion 320 and the second rectangular portion 324 are connected by a linear second connecting portion 412.

[0153] The first extension portion 310 is integrally formed with a rectangular first adjustment portion 414 that protrudes toward the other edge 54 of the substrate 12. The second extension portion 320 is integrally formed with a rectangular second adjustment portion 416 that protrudes toward the other edge 54 of the substrate 12.

[0154] (First temperature compensation resistor) In the first temperature compensating resistor 302, a rectangular third adjustment portion 420 and a fourth adjustment portion 422 are integrally formed in the front compensation connecting portion 334 and protrude toward the other edge 54 of the substrate 12. In the front compensation connecting portion 334, the third adjustment portion 420 is disposed closer to the third rectangular portion 340 than the fourth adjustment portion 422.

[0155] (Second temperature compensation resistor) 10 , in the second temperature-compensating resistor 304, a rectangular fifth adjustment portion 430 and a sixth adjustment portion 432 are integrally formed with the rear compensation connecting portion 354 and protrude toward the other edge 54 of the substrate 12. In the rear compensation connecting portion 354, the fifth adjustment portion 430 is disposed closer to the fifth rectangular portion 356 than the sixth adjustment portion 432.

[0156] In this embodiment, the case where the front compensation connecting portion 334 of the first temperature-compensating resistor 302 and the rear compensation connecting portion 354 of the second temperature-compensating resistor 304 are provided with the adjustment portions 420, 422, 430, and 432, respectively, has been described, but this embodiment is not limited to this. For example, an adjustment portion for adjusting the resistance value may be provided in at least one of the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304.

[0157] (Action and effect) Next, the effects of the fourth embodiment will be described.

[0158] In the load sensor element 400 of this embodiment, the same or equivalent parts as those of the third embodiment can also obtain the same effects as those of the third embodiment.

[0159] In the load sensor element 400 of this embodiment, at least one of the first temperature compensating resistor 302 and the second temperature compensating resistor 304 has adjusting sections 420, 422, 430, 432 for adjusting the resistance value.

[0160] In this configuration, the resistance value of the first temperature-compensating resistor 302 or the second temperature-compensating resistor 304 can be adjusted by trimming the adjustment section 420, 422, 430, 432 of either the temperature-compensating resistor 302, 304 with a laser or the like. This makes it possible to adjust the resistance values of the first temperature-compensating resistor 302 and the second temperature-compensating resistor 304 so that they approach approximately the same value.

[0161] Therefore, compared to when the resistance values of the first temperature compensation resistor 302 and the second temperature compensation resistor 304 are significantly different, it is possible to easily perform temperature compensation using each of the temperature compensation resistors 302 and 304.

[0162] In this embodiment, the thin film resistor 306, the first temperature compensation resistor 302, and the second temperature compensation resistor 304 are provided with adjustment units 414, 416, 420, 422, 430, and 432, respectively.

[0163] Therefore, it is possible to make the resistance value of each of the resistors 306, 302, 304 closer to the target resistance value by trimming each of the adjustment units 414, 416, 420, 422, 430, 432. Therefore, even if the resistance value of each of the resistors 306, 302, 304 formed on the substrate 12 deviates significantly from the target resistance value due to the condition of the surface 14 of the substrate 12 or the like, it is possible to make the resistance value of each of the resistors 306, 302, 304 closer to the target resistance value.

[0164] Although the present embodiment has been described above, the above embodiment merely shows some of the application examples of the present invention, and is not intended to limit the technical scope of the present invention to the specific configurations of the above embodiment. [Explanation of symbols]

[0165] 10, 200, 300, 400 Load sensor element 12 PCB 13 Pressure-receiving surface 14 Surface 16 Inorganic layer 20, 306 thin film resistor 22, 204, 302 First temperature compensation resistor 24 Back side 26, 206, 304 Second temperature compensation resistor 27 Covering part 28 Exposed part 30 Pressure receiving area 32 Main body 34 One end 36 Other end 44 One side 70 First electrode 72 Second electrode 96 Third Electrode 98 Fourth Electrode 100 thickness direction 120 Fifth Electrode 122 Sixth Electrode 202 holes 420 Third adjustment section 422 Fourth adjustment section 430 Fifth Adjustment Department 432 Sixth Adjustment Department

Claims

1. A load sensor element for measuring a surface pressure load, A substrate; an inorganic layer having a pressure-receiving surface that receives a load and that is provided so as to cover a part of one surface of the substrate; a thin-film resistor whose resistance value changes depending on a load applied to the inorganic layer, the thin-film resistor having a main body sandwiched between the substrate and the inorganic layer and both ends disposed on exposed portions of the substrate that are not covered by the inorganic layer; a first temperature-compensating resistor that is separate from the thin-film resistor and that is disposed on the exposed portion of one surface of the substrate; a second temperature-compensating resistor disposed on the other surface of the substrate and exhibiting the same behavior as the first temperature-compensating resistor; A load sensor element comprising:

2. The load sensor element according to claim 1, The configuration exhibiting the same behavior includes at least one of a first configuration in which the first temperature-compensated resistor and the second temperature-compensated resistor have the same resistance temperature coefficient, and a second configuration in which the first temperature-compensated resistor and the second temperature-compensated resistor have the same absolute value of the change in resistance value with respect to the same deformation. Load sensor element.

3. The load sensor element according to claim 1 or 2, the first temperature-compensating resistor and the second temperature-compensating resistor have the same shape and are arranged at positions overlapping each other in the thickness direction of the substrate. Load sensor element.

4. The load sensor element according to any one of claims 1 to 3, the substrate has a deformation suppression portion at least either between a pressure-receiving region where the inorganic layer overlaps in a thickness direction of the substrate and the first temperature-compensating resistor or between the pressure-receiving region and the second temperature-compensating resistor; Load sensor element.

5. The load sensor element according to any one of claims 1 to 4, a first electrode electrically connected to one end of the thin-film resistor and provided on one side of the substrate; a second electrode electrically connected to the other end of the thin-film resistor and provided on one side of the substrate; a third electrode electrically connected to one end of the first temperature compensation resistor and provided on one side of the substrate; a fourth electrode electrically connected to the other end of the first temperature compensation resistor and provided on one side of the substrate; a fifth electrode electrically connected to one end of the second temperature compensation resistor and provided on one side of the substrate; a sixth electrode electrically connected to the other end of the second temperature-compensating resistor and provided on one side of the substrate; the first temperature-compensating resistor is disposed such that a region from one end where the third electrode is provided to the other end where the fourth electrode is provided is farther from the thin-film resistor than the third electrode and the fourth electrode are, the second temperature-compensating resistor is disposed such that a region from one end where the fifth electrode is provided to the other end where the sixth electrode is provided is farther from the thin-film resistor than the fifth electrode and the sixth electrode are. Load sensor element.

6. The load sensor element according to any one of claims 1 to 5, At least one of the first temperature-compensating resistor and the second temperature-compensating resistor has an adjustment unit for adjusting a resistance value. Load sensor element.

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