Joining device and method for manufacturing joined article

Abstract

A joining device and a method for manufacturing a joined article that suppress the transmission of heat generated when welding a stem and a cap to an electronic chip. [Solution] The bonding device (1) includes a first electrode (10) with which a base (92) contacts, a second electrode (20) with which a cap (95) contacts, a moving mechanism (40) that relatively moves the first electrode (10) and / or the second electrode (20) in directions toward and away from each other, a current generator (51) that generates a current to flow between the first electrode (10) and the second electrode (20) through a contact portion (99), and a cooling medium (32) that contacts the base (92) while preventing current from flowing between the first electrode (10) and the second electrode (20). A method for manufacturing a bonded article includes bringing the base (92) and the cap (95) into contact with each other to sandwich the contact portion (99) between the first electrode (10) and the second electrode (20), and, while the cooling medium (32) is in contact with the base (92), passing a current between the first electrode (10) and the second electrode (20) through the contact portion (99) to bond the contact portion (99).

Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to a bonding apparatus and a method for manufacturing a bonded article. [Background technology]

[0002] Among the various types of semiconductor packages, there is an electronic chip package in which a cap is attached to a stem on which an electronic chip such as a light-emitting diode is mounted, to cover the electronic chip. Of the stems that make up the electronic chip package, the base on which the electronic chip is mounted is generally made of iron or an iron-nickel alloy. On the other hand, in consideration of the fact that the electronic chip attached to the stem generates heat and heat dissipation is necessary to maintain the performance of the electronic chip, there are also some packages in which the base of the stem is made of copper or a copper-based alloy to improve heat dissipation (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2024-083123 Summary of the Invention [Problem to be solved by the invention]

[0004] In electronic chip packages, the stem and cap are typically joined by resistance welding. If the base on which the electronic chip is mounted is made of copper or a copper-based alloy, which has high thermal conductivity, heat dissipation performance is improved, but heat generated during resistance welding of the stem and cap is more likely to be transferred to the electronic chip, which may damage the electronic chip.

[0005] In view of the above-mentioned problems, the present disclosure relates to providing a joining device and a method for manufacturing a joined article that suppress the transfer of heat generated during welding of a stem and a cap to an electronic chip. [Means for solving the problem]

[0006] A joining device according to a first aspect of the present disclosure is a device for joining a stem having a base on which an electronic chip is mounted and a cap that houses the electronic chip inside and is connected to the base to seal the periphery of the electronic chip, and is equipped with a first electrode with which the base contacts, a second electrode that is positioned opposite the first electrode and with which the cap contacts, a moving mechanism that moves at least one of the first electrode and the second electrode relatively in directions in which the first electrode and the second electrode approach and move away from each other, a current generator that generates a current to flow between the first electrode and the second electrode through the contact portion between the base and the cap, and a cooling medium that contacts the base while preventing current from flowing between the first electrode and the second electrode.

[0007] With this configuration, the heat generated when current is passed between the first electrode and the second electrode to weld the stem and the cap can be prevented from being absorbed by the cooling medium from the base and transmitted to the electronic chip.

[0008] Furthermore, as a joining device according to a second aspect of the present disclosure, in the joining device according to the first aspect of the present disclosure, the cooling medium may be a metal member that absorbs heat from the base.

[0009] With this configuration, the heat diffused (or conducted) to the base can be stably conducted to the metal member, and the heat can be prevented from being conducted to the electronic chip.

[0010] Furthermore, as a joining device according to a third aspect of the present disclosure, in the joining device according to the second aspect of the present disclosure, the metal member may be positioned closer to the first electrode than the base that contacts the first electrode.

[0011] With this configuration, a relatively large contact area between the metal member and the base can be ensured, and the amount of heat dissipated from the base to the metal member can be increased.

[0012] Furthermore, as a joining device according to a fourth aspect of the present disclosure, the joining device according to the second or third aspect of the present disclosure may be provided with a cooling fluid supply unit that supplies a cooling fluid for heat exchange with the metal member.

[0013] With this configuration, it is possible to prevent the metal member from reaching thermal saturation.

[0014] A method for manufacturing a bonded article according to a fifth aspect of the present disclosure is a method for manufacturing a bonded article in which the stem and the cap are bonded using the bonding apparatus according to any one of the first to fourth aspects of the present disclosure, and includes the steps of contacting the base with the first electrode, contacting the base with the cap, sandwiching the contact portion between the base and the cap between the first electrode and the second electrode, contacting the base with the cooling medium, and, while contacting the cooling medium with the base, passing a current between the first electrode and the second electrode through the contact portion between the base and the cap to bond the contact portion between the base and the cap. Note that the steps listed here may be performed in an order different from that described, unless the order is explicitly or implicitly specified.

[0015] With this configuration, the heat generated when current is passed between the first electrode and the second electrode to weld the stem and the cap can be prevented from being absorbed by the cooling medium from the base and transmitted to the electronic chip.

[0016] A sixth aspect of the present disclosure relates to a method for manufacturing a bonded article, which is a method for manufacturing a bonded article comprising a stem having a base on which an electronic chip is mounted, and a cap that houses the electronic chip inside and is connected to the base to seal the periphery of the electronic chip, and includes the steps of: bringing the base and the cap into contact with each other and sandwiching the contact portion between the base and the cap between a first electrode and a second electrode; and, while bringing a cooling medium into contact with the base, passing an electric current between the first electrode and the second electrode through the contact portion between the base and the cap to bond the contact portion between the base and the cap.

[0017] With this configuration, the heat generated when current is passed between the first electrode and the second electrode to weld the stem and the cap can be prevented from being absorbed by the cooling medium from the base and transmitted to the electronic chip. [Effects of the Invention]

[0018] According to the present disclosure, heat generated when current is passed between the first electrode and the second electrode to weld the stem and the cap can be prevented from being absorbed by the cooling medium from the base and transmitted to the electronic chip. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a schematic configuration diagram of a joining device according to an embodiment of the present disclosure. [Figure 2] 1A is a perspective view showing an example of a joined article manufactured by a joining device according to an embodiment of the present disclosure, and FIG. 1B is an exploded, partially cross-sectional side view of the joined article. [Figure 3] 1 is a flowchart showing the steps of a method for manufacturing a bonded article according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, identical or similar reference numerals are used to designate identical or corresponding components, and redundant explanations will be omitted. Furthermore, the dimensions and proportions of the drawings are exaggerated for the sake of explanation and may differ from the actual proportions.

[0021] First, a joining device 1 according to an embodiment of the present disclosure will be described with reference to FIG. 1. FIG. 1 is a schematic configuration diagram of the joining device 1. The joining device 1 is a device that joins a stem 91 and a cap 95 by resistance welding. In summary, the joining device 1 joins a contact portion 99 between the stem 91 and the cap 95 by sandwiching and pressurizing the contact portion 99 between a lower electrode 10 and an upper electrode 20 and then passing a current between the lower electrode 10 and the upper electrode 20 via the stem 91 and the cap 95. Before describing the joining device 1 in detail, a joined article manufactured by joining the stem 91 and the cap 95 will be described below.

[0022] FIG. 2(A) is a perspective view of a device 90 as a bonded article, and FIG. 2(B) is an exploded, partially cross-sectional side view of the device 90. The device 90 manufactured by the bonding apparatus 1 (see FIG. 1) according to this embodiment is a package in which an optical semiconductor is sealed, and will be described as being also called a "TO-CAN." The device 90 is configured by bonding a stem 91 and a cap 95. FIG. 2(B) shows the state in which the stem 91 and the cap 95 are separated before becoming the device 90, with the stem 91 shown from the side and the cap 95 shown in cross section.

[0023] The stem 91 has an electronic chip 94 mounted on a base 92, with leads 93 extending from the base 92. The electronic chip 94 is typically an optical semiconductor, preferably a light-emitting diode or laser diode, but also a light-receiving element such as a photodiode or other optical semiconductor. The electronic chip 94 generates heat when in operation. Recently, higher-power electronic chips 94 have been developed, and while the higher the power output, the greater the heat dissipation. However, exceeding the optimum operating temperature can cause malfunction or damage. Therefore, the higher the power output, the greater the heat dissipation required. The base 92 is preferably made of a material with high thermal conductivity to facilitate heat dissipation from the high-power electronic chip 94. In this embodiment, the base 92 is made of copper or a copper-based alloy. Brass is typically used as a copper-based alloy, but chromium copper may also be used. Alternatively, bronze, in which the amount of added elements in copper is limited to a range that achieves the desired thermal conductivity, may also be used. The base 92 may be made of copper or a copper-based alloy, which is a base material, and may be plated with nickel, gold, or the like. In this embodiment, the base 92 is made of the above-mentioned material and is formed into a disk shape with a thickness of approximately 1 mm to 2 mm (including 1.5 mm). The leads 93 extend from the base 92 to the opposite side of the electronic chip 94. The leads 93 are preferably made of a metal with high conductivity, and may be made of the same material as the base 92.

[0024] The cap 95 is a component that covers the electronic chip 94 mounted on the base 92 and is attached to the base 92. The cap 95 has a generally cylindrical appearance and can accommodate the electronic chip 94 inside. The cap 95 has an outer periphery 96, which corresponds to the side of the cylinder, and one end face is open and the other end face is closed. A lens 97 that transmits laser light is provided on the top face, which is the closed end face of the cap 95. The edge 98 of the open end face of the cap 95 is slightly expanded outward to ensure a surface that receives pressure during welding. In this embodiment, the outer periphery of the edge 98 is formed into a circle that is smaller than the outer periphery of the base 92. The cap 95 is made of metal except for the lens 97. The metal portion of the cap 95 is typically made of an iron-nickel alloy, Kovar, or the like, but may be made of other metals. The metal portion of the cap 95 may be plated, for example, with nickel. The device 90 has an electronic chip 94 covered with a cap 95, and a contact portion 99 between an edge 98 and a base 92 is welded.

[0025] In this embodiment, the bonding apparatus 1 shown in FIG. 1 will be described as an apparatus capable of manufacturing the above-described device 90. The bonding apparatus 1 includes a lower electrode 10, an upper electrode 20, a cooling member 32, a moving device 40, a power source 51, a cooling device 60, and a control device 80. FIG. 1 shows a cross section of a stem 91, a cap 95, the lower electrode 10, the upper electrode 20, the cooling member 32, and an insulator 39. In the following description of the bonding apparatus 1, when referring to the configuration of the device 90, reference will be made to FIGS. 2(A) and 2(B) as appropriate.

[0026] The lower electrode 10 is an electrode that comes into contact with the base 92 and corresponds to the first electrode. In this embodiment, the lower electrode 10 is formed in a cylindrical shape. The lower electrode 10 is typically arranged with its cylindrical axis extending vertically, and the end faces of the cylinder form the top surface 11 and bottom surface. The lower electrode 10 is formed to a size that allows the top surface 11 to support the entire area near the outer periphery of the back surface of the base 92 (i.e., the surface opposite to the surface on which the electronic chip 94 is mounted). The cylindrical hollow portion of the lower electrode 10 is formed to a size that can accommodate all the leads 93 of the stem 91 placed on the top surface 11. The lower electrode 10 may have a clamping mechanism (not shown) with multiple claws that move along the top surface 11. The lower electrode 10 may be configured such that, by operating a clamping mechanism (not shown), multiple claws come into contact with the outer periphery of the base 92 and press it toward the center of the base 92 to support the stem 91, and the multiple claws are moved away from the base 92 to release the stem 91. The lower electrode 10 is typically formed of a metal suitable for a resistance welding electrode.

[0027] The upper electrode 20 is an electrode that comes into contact with the cap 95 and corresponds to the second electrode. The upper electrode 20 is disposed opposite the lower electrode 10, and in this embodiment, is disposed above the lower electrode 10. In this embodiment, the upper electrode 20 has a basic cylindrical shape, and an upper depression 23 is formed on a bottom surface 22 of the cylinder when the cylinder is disposed with its axis extending vertically. When the upper electrode 20 is disposed in a welding position relative to the lower electrode 10, the upper depression 23 is located above the cylindrical hollow portion of the lower electrode 10 and is sized to generally encompass the hollow portion in a plan view. The upper electrode 20 is typically sized and shaped so that the outer periphery 96 of the cap 95 is accommodated in the upper depression 23 while the edge 98 contacts the bottom surface 22. The upper depression 23 is a cylindrical space, and its diameter is larger than the outer diameter of the outer periphery 96 and smaller than the outer diameter of the edge 98. The upper electrode 20 is configured such that when the cap 95 is inserted into the upper recess 23 from the lens 97 side, the edge 98 cannot enter the upper recess 23, and the entire circumferential direction of the edge 98 contacts the bottom surface 22 of the upper electrode 20. The upper electrode 20 may have a vacuum suction mechanism (not shown) that creates a negative pressure in the space inside the upper recess 23. By activating the vacuum suction mechanism (not shown), the upper electrode 20 can suction and hold the cap 95, whose entire circumferential direction of the edge 98 contacts the bottom surface 22 of the upper electrode 20, and the cap 95 can be released by stopping the vacuum suction mechanism (not shown). The upper electrode 20 is typically formed of a metal suitable for a resistance welding electrode.

[0028] The cooling member 32 is a member that contacts the base 92 of the stem 91 and absorbs heat from the base 92. In this embodiment, a metal member is used. The metal member is typically formed of aluminum or a metal with a higher thermal conductivity than aluminum, and may be formed of copper. In this embodiment, the cooling member 32 is disposed in the cylindrical hollow portion of the lower electrode 10, and is therefore disposed closer to the lower electrode 10 than the back surface of the base 92. In this embodiment, the cooling member 32 is formed in a generally cylindrical shape, and an insulator 39, which is an insulating material that does not substantially conduct current, is disposed on its exterior. In other words, the insulator 39 is disposed between the lower electrode 10 and the cooling member 32, preventing direct contact between the lower electrode 10 and the cooling member 32. The insulator 39 disposed between the lower electrode 10 and the cooling member 32 prevents current from flowing between the cooling member 32 and the lower electrode 10. Furthermore, during welding, the portion of the upper electrode 20 other than the upper depression 23 is positioned opposite the lower electrode 10, so that the current flows between the upper electrode 20 and the lower electrode 10, which is the shortest distance, and the current flow between the cooling member 32 and the upper electrode 20 can be substantially prevented. In this way, the cooling member 32, which contacts the base 92 while preventing the current from flowing between the lower electrode 10 and the upper electrode 20, corresponds to the cooling medium. In this specification, the cooling medium refers to a substance in general, and is a concept that includes solids and fluids, but in this embodiment, a solid metal member is used.

[0029] To promote heat dissipation from the base 92, the cooling member 32 preferably has a large contact surface with the base 92 and a large heat capacity. From this perspective, the cooling member 32 is preferably formed with a larger diameter and a longer axial length in its basic cylindrical shape. In this embodiment, the cooling member 32 is formed with lead holes 33 for accommodating the leads 93 of the stem 91. The cooling member 32 is modified from its basic cylindrical shape in that it has the lead holes 33. The number of lead holes 33 formed in the cooling member 32 typically corresponds to the number of leads 93 provided on the stem 91 it contacts. In other words, if the type of stem 91 it contacts is changed and a stem 91 with a different number and / or arrangement of leads 93 is used, the cooling member 32 can be replaced with one that is compatible with that stem 91. It is preferable to make the lead holes 33 as small as possible within a range that can accommodate the leads 93, as this prevents a reduction in the contact area between the base 92 and the cooling member 32.

[0030] The insulator 39 covering the side surface of the cooling member 32 is formed in a cylindrical shape. Materials that can be used to form the insulator 39 include synthetic resins such as polyethylene, polyvinyl chloride, or fluororesin, rubber-based materials such as silicone rubber, ceramics such as alumina or zirconia, and other insulating materials. The insulator 39 may be press-fitted into the gap between the lower electrode 10 and the cooling member 32, which is disposed in the cylindrical hollow portion of the lower electrode 10, and thereby be formed into a cylindrical shape.

[0031] It is preferable that the top surface 11 of the lower electrode 10, the upper surface of the cooling member 32, and the upper surface of the insulator 39 are flush with each other so that the base 92 is in contact with them as evenly as possible. In order to make the top surface 11 of the lower electrode 10, the upper surface of the cooling member 32, and the upper surface of the insulator 39 flush with each other, these surfaces may be flat-polished. The bottom surface of the cooling member 32 (i.e., the end surface opposite to the cylindrical upper surface) may not be covered by the lower electrode 10 and may be open to, for example, the space in which the bonding device 1 is installed. If the bottom surface of the cooling member 32 is open, the heat removed from the base 92 (i.e., heat absorption) can be released into the air in the space.

[0032] The moving device 40 is a device that moves the lower electrode 10 and the upper electrode 20 relatively in directions that bring them closer to and away from each other, and corresponds to a moving mechanism. In this embodiment, the moving device 40 supports the upper electrode 20 and moves the upper electrode 20 up and down. With this configuration, the upper electrode 20 (and thus the cap 95) and the lower electrode 10 (and thus the stem 91) can be moved relatively closer to and away from each other in the vertical direction in this embodiment. The lower electrode 10 is typically fixed to a housing (not shown). The moving device 40 can be a slide reciprocating mechanism that combines a pneumatic, hydraulic, or electric cylinder with a linear guide, or a mechanism that combines an electric motor with a ball screw, or the like.

[0033] The power supply 51 generates a current that flows between the lower electrode 10 and the upper electrode 20 via a contact portion 99 between the base 92 and the cap 95 and corresponds to a current generator. The power supply 51 is electrically connected to each of the lower electrode 10 and the upper electrode 20 by electric wires 55. The power supply 51 applies a voltage to the lower electrode 10 and the upper electrode 20 to supply a current. The power supply 51 typically receives power from a commercial power source, but may also receive power from a private generator. The power supply 51 may include a rectifier that converts input AC power to DC power, a transformer that converts voltage, a capacitor that stores electricity, etc. The power supply 51 can supply a current suitable for resistance welding between the stem 91 and the cap 95.

[0034] The cooling device 60 supplies a cooling fluid C that removes heat from the cooling element 32, i.e., the cooling fluid C that exchanges heat with the cooling element 32, and corresponds to a cooling fluid supply unit. The cooling device 60 typically includes a cold heat source 61, piping 62, and a pump 63. The cooling device 60 circulates the cooling fluid C between the cold heat source 61 and the cooling element 32, causing the cooling fluid C to remove heat from the cooling element 32. The cooling fluid C is typically water, but may also be brine or other liquids. The cold heat source 61 may be a heat source device capable of cooling the cooling fluid C, or may be a fluid that retains cold heat that is secondarily discharged from equipment for other purposes. The piping 62 forms a flow path for the cooling fluid C and is typically a hard pipe made of metal or synthetic resin, but may also be flexible and include tubes. The piping 62 is typically disposed in contact with the surface of the cooling element 32, but may also be embedded inside the cooling element 32. The pump 63 is a device that causes the cooling fluid C inside the piping 62 to flow between the cold heat source 61 and the cooling member 32. Note that if the cooling fluid C inside the piping 62 can be caused to flow by the pressure of the cold heat source 61, the pump 63 does not need to be provided.

[0035] The control device 80 is a device that controls the operation of the bonding apparatus 1. The control device 80 is connected to the moving device 40 via a communication line (wired or wireless; the same applies below) and controls the up and down movement of the upper electrode 20 held by the moving device 40. The control device 80 is also connected to the power source 51 via a communication line and controls whether or not to supply current to the lower electrode 10 and the upper electrode 20 and the magnitude of the current to be supplied. The control device 80 is also connected to the cooling device 60 (typically a cold heat source 61 and a pump 63) via a communication line and controls the temperature and / or flow rate of the cooling fluid C. The control device 80 is also connected to the clamping mechanism (not shown) of the lower electrode 10 via a communication line and controls the operation of the clamping mechanism (not shown). The control device 80 is also connected to the vacuum suction mechanism (not shown) of the upper electrode 20 via a communication line and controls the operation of the vacuum suction mechanism (not shown).

[0036] The control device 80 may include at least one physical configuration of a processor 81, a memory 82 (e.g., RAM and / or ROM), and a storage 83. The control device 80 may also have a program for properly operating each of the above-mentioned devices, for example, stored in the memory 82 and / or the storage 83, and may use the processor 81 to execute the program. This program may include a sequence program that determines the sequence and timing of operations of each of the above-mentioned devices. The control device 80 is typically attached to the outer surface of a housing (not shown) of the bonding device 1, but may also be installed at a location away from the housing (not shown) to remotely operate the bonding device 1.

[0037] Next, a method for manufacturing a device 90 according to an embodiment of the present disclosure will be described with reference to FIG. 3. FIG. 3 is a flowchart showing the steps for manufacturing the device 90. The method for manufacturing the device 90 described below is typically performed using the bonding apparatus 1 described above, but can also be performed using an apparatus other than the bonding apparatus 1. The method for manufacturing the device 90 described below also serves as an explanation of the operation of the bonding apparatus 1. In the following explanation of the method for manufacturing the device 90, when referring to the configuration of the bonding apparatus 1 or the structure of the device 90, reference will be made to FIG. 1 and FIGS. 2(A) and 2(B) as appropriate. The operation of each device connected to the control device 80 via a communication line, as described below, is typically controlled by the control device 80, unless otherwise noted.

[0038] In manufacturing the device 90, in this embodiment, a stem pallet (not shown) on which a plurality of stems 91 are arranged and a cap pallet (not shown) on which a plurality of caps 95 are arranged are placed near or inside the bonding apparatus 1. The stem pallet (not shown) is typically placed at a position away from the lower electrode 10 within the movement range of a stem transfer robot hand (not shown) that delivers the stems 91 to the clamping mechanism (not shown) of the lower electrode 10. On the other hand, the cap pallet (not shown) is typically placed at a position away from the upper electrode 20 within the movement range of a cap transfer robot hand (not shown) that delivers the caps 95 to the vacuum suction mechanism (not shown) of the upper electrode 20. In this embodiment, the cooling device 60 is operated to cause the cooling fluid C to flow inside the piping 62.

[0039] When the manufacture of the device 90 starts, the control device 80 activates a stem-transporting robot hand (not shown) to place one of the stems 91 in a stem pallet (not shown) on the lower electrode 10 (S1). At this time, all of the leads 93 of the stem 91 are inserted into the lead holes 33. By placing the stem 91 on the lower electrode 10, the entire outer periphery of the back surface of the base 92 comes into contact with the top surface 11 of the lower electrode 10, and the inside of the back surface of the base 92 (i.e., the inner part of the outer periphery that comes into contact with the top surface 11) comes into contact with the top surface of the cooling member 32. In this embodiment, the process of bringing the base 92 into contact with the lower electrode 10 and the process of bringing the base 92 into contact with the cooling member 32 are performed simultaneously. Next, the control device 80 activates a cap-transporting robot hand (not shown) to hold one of the caps 95 in the cap pallet (not shown) on the upper electrode 20 (S2). At this time, the cap 95 is placed into the upper recess 23 from the lens 97 side, and the vacuum suction mechanism (not shown) is activated in a state where the edge 98 is in contact with the bottom surface 22 of the upper electrode 20 over the entire circumferential direction. In this way, the cap 95 is held to the upper electrode 20.

[0040] Next, the upper electrode 20 holding the cap 95 is moved toward the lower electrode 10 by the moving device 40, and the cap 95 is brought into contact with the stem 91 (S3). At this time, the electronic chip 94 is housed inside the cap 95, and the cap 95 comes into contact with the base 92 of the stem 91 at the bottom surface of the rim 98. When the cap 95 comes into contact with the base 92, the base 92 and the cap 95 at a contact portion 99 are sandwiched between the lower electrode 10 and the upper electrode 20. In this embodiment, the process of bringing the base 92 and the cap 95 into contact and the process of sandwiching the base 92 and the cap 95 between the lower electrode 10 and the upper electrode 20 are performed simultaneously. After the cap 95 is brought into contact with the base 92, the moving device 40 further presses the upper electrode 20 toward the lower electrode 10, applying pressure to the contact portion 99 between the base 92 and the cap 95 (S4). At this time, the portion of the back surface of base 92 that is inside the outer periphery remains in contact with the upper surface of cooling member 32. Thereafter, while the back surface of base 92 is in contact with cooling member 32, power supply 51 is turned on with pressure being applied to contact portion 99 between base 92 and cap 95, to pass electricity through contact portion 99 (S5).

[0041] When power supply 51 is turned on and a voltage is applied, current from power supply 51 flows through electric wire 55 to upper electrode 20, cap 95, base 92 of stem 91, and lower electrode 10 (or flows in the opposite direction). Because upper electrode 20 and lower electrode 10 are disposed opposite each other with contact portion 99 sandwiched between them, current flows between them over the shortest distance, preventing current from flowing from upper electrode 20 to cooling member 32. Furthermore, because insulator 39 is provided between lower electrode 10 and cooling member 32, current is prevented from flowing from lower electrode 10 to cooling member 32. When current flows through contact portion 99 between base 92 and cap 95 while pressure is applied to contact portion 99, resistance welding of contact portion 99 is performed (S6). At this time, heat is generated in contact portion 99 due to the resistance welding. When copper or a copper-based alloy, which has a relatively high thermal conductivity, is used as the material for the base 92 as in the present embodiment, conventional joining devices may transmit heat generated during resistance welding to the electronic chip 94 through the base 92, potentially damaging the electronic chip 94. In contrast, with the joining device 1 according to the present embodiment, the base 92 is in contact with the cooling member 32 during resistance welding of the contact portion 99. This prevents heat from being transmitted through the base 92 to the cooling member 32, which has a lower temperature, and thus prevents heat from being transmitted to the electronic chip 94. In this manner, the joining device 1 can disperse heat generated during resistance welding to the cooling member 32 during joining of the contact portion 99, thereby sealing the stem 91 and the cap 95 while reducing the thermal impact on the electronic chip 94. This prevents damage to the electronic chip 94 during joining of the stem 91 and the cap 95. Furthermore, because heat is continuously removed from the cooling member 32 by the cooling device 60, thermal saturation of the cooling member 32 can be suppressed.

[0042] The device 90 is manufactured by resistance welding the stem 91 having the electronic chip 94 to the cap 95. Once the device 90 is manufactured, the vacuum suction mechanism (not shown) is stopped to release the upper electrode 20 from holding the cap 95, and the upper electrode 20 is moved upward. Thereafter, the clamping mechanism (not shown) is activated to release the device 90 from the lower electrode 10, and the device 90 is removed from the lower electrode 10 (S7). This completes the manufacture of one device 90. If a new device 90 is to be manufactured, the above-described steps shown in FIG. 3 are repeated.

[0043] As described above, the bonding apparatus 1 according to this embodiment includes the cooling member 32 with which the base 92 comes into contact when the stem 91 is placed on the lower electrode 10. This prevents heat generated during resistance welding of the contact portion 99 from being transmitted to the electronic chip 94. Furthermore, since a metal member is used as the cooling member 32, heat conducted through the base 92 can be stably transmitted to the cooling member 32, preventing heat generated during welding from being transmitted from the base 92 to the electronic chip 94. Furthermore, since the cooling member 32 is positioned so as to contact the rear surface of the base 92, the contact area between the cooling member 32 and the base 92 can be relatively large, thereby increasing the amount of heat dissipated from the base 92 to the cooling member 32. Furthermore, since the cooling device 60 is provided, thermal saturation of the cooling member 32 can be prevented, allowing stable heat absorption from the base 92 to the cooling member 32. Furthermore, the manufacturing method for the device 90 according to this embodiment allows devices 90 having a base 92 with excellent heat dissipation performance while mounting a high-output electronic chip 94 to be manufactured with a high yield.

[0044] In the above description, the lower electrode 10 is fixed to a housing (not shown), while the upper electrode 20 moves toward and away from the lower electrode 10. However, the upper electrode 20 may be fixed and the lower electrode 10 may be moved, or both the lower electrode 10 and the upper electrode 20 may be movable.

[0045] In the above explanation, the bonding apparatus 1 is provided with a cooling device 60, but if the cooling member 32 can dissipate heat outside the device 90 without becoming thermally saturated even without the cooling device 60, the cooling device 60 does not need to be provided.

[0046] In the above description, the cooling member 32 made of a metal member is arranged closer to the lower electrode 10 than the back surface of the base 92, but it may also be arranged higher than the top surface 11 of the lower electrode 10. In this case, the cooling member 32 may be arranged so as to contact the outer peripheral side surface of the disk-shaped base 92, or so as to contact the surface (or upper surface) of the base 92 outside the edge 98 of the cap 95. However, from the viewpoint of increasing the contact area between the cooling member 32 and the base 92, it is preferable that the cooling member 32 be arranged closer to the lower electrode 10 than the back surface of the base 92 and so as to contact the back surface of the base 92.

[0047] In the above description, the cooling medium is the cooling member 32 formed of a metal material. However, the cooling medium may be a solid material other than metal, as long as it can absorb heat from the base 92 and dissipate it to the outside of the device 90. Alternatively, the cooling medium is not limited to a solid material and may be a fluid, such as a low-temperature gas. When a fluid is used as the cooling medium, the cylindrical hollow portion of the cylindrical lower electrode 10 may be left hollow as a space into which the fluid can enter. When, for example, low-humidity cold air is supplied as the cooling medium to the hollow portion of the cylindrical lower electrode 10, the cooling medium itself functions as an insulator, preventing current from flowing between the cold air (i.e., the cooling medium) and the lower electrode 10 and upper electrode 20. When a fluid is used as the cooling medium, a step of starting the supply of the fluid cooling medium to the back surface of the base 92 may be added between the step (S4) of pressurizing the contact portion 99 and the step (S5) of applying current to the contact portion 99 in the flowchart shown in FIG. 3 . The step of stopping the supply of the fluid cooling medium supplied to the back surface of the base 92 may be performed after the temperature of the base 92 has dropped to a level that will not damage the electronic chip 94, and before the step (S7) of removing the device 90.

[0048] In the above explanation, it has been assumed that the base 92 is made of copper or a copper-based alloy, which has a relatively high thermal conductivity, that is, a material in which heat generated when joining the stem 91 and the cap 95 is transferred to the electronic chip 94 via the base 92 and may damage the electronic chip 94. However, it is also acceptable to join the stem 91, whose base 92 is made of an iron-based material, to the cap 95 using the joining device 1.

[0049] In each of the above embodiments, the term "processor" refers to a processor in a broad sense, and includes general-purpose processors (e.g., CPU: Central Processing Unit, etc.) and dedicated processors (e.g., GPU: Graphics Processing Unit, ASIC: Application Specific Integrated Circuit, FPGA: Field Programmable Gate Array, programmable logic device, etc.). Furthermore, the operations of the processor in each of the above embodiments may be performed not only by a single processor but also by multiple processors located at physically separate locations working together. Furthermore, the order of the operations of the processor is not limited to the order described in each of the above embodiments and may be changed as appropriate. The program may be provided by a computer-readable non-transitory recording medium such as a USB (Universal Serial Bus) memory, a flexible disk, or a CD-ROM (Compact Disc Read Only Memory), or may be provided online via a network such as the Internet. In this case, the program recorded on the computer-readable non-transitory recording medium is typically transferred to and stored in a memory or storage device. The program may be provided as standalone application software, or may be incorporated into the software of each device as a function of the device. The program of the present disclosure can be provided as a program product. The program product includes any product for providing the program. For example, the program product includes a program provided over a network such as the Internet, and a non-transitory computer-readable recording medium such as a CD-ROM or DVD on which the program is stored.

[0050] In the above description, the bonding apparatus and the method for manufacturing a bonded article have been described as exemplary embodiments using the drawings. The configuration, structure, number, arrangement, shape, material, etc. of each part in the description are not limited to the above specific examples, and any suitable alternatives selected by a person skilled in the art are also included within the scope of the present invention as long as they include the gist of the present invention. [Explanation of symbols]

[0051] 1 Bonding equipment 10 Lower electrode (first electrode) 20 upper electrode (second electrode) 32 Cooling element (cooling medium) 40 Moving device (moving mechanism) 51 Power supply (current generator) 60 Cooling device (cooling fluid supply section) 90 Devices (jointed articles) 91 Stem 92 base 94 Electronic Chips 95 Cap C cooling fluid

Claims

1. 1. A device for joining a stem having a base on which an electronic chip is mounted, and a cap that houses the electronic chip inside and is connected to the base to seal the periphery of the electronic chip, comprising: a first electrode in contact with the base; a second electrode disposed opposite to the first electrode and in contact with the cap; a movement mechanism that relatively moves at least one of the first electrode and the second electrode in a direction in which the first electrode and the second electrode approach each other and in a direction in which the first electrode and the second electrode move away from each other; a current generator that generates a current that flows between the first electrode and the second electrode through a contact portion between the base and the cap; a cooling medium in contact with the base while preventing current from flowing between the first electrode and the base and preventing current from flowing between the first electrode and the base and the base and the second electrode. Bonding equipment.

2. The cooling medium is a metal member that absorbs heat from the base. The joining device according to claim 1 .

3. the metal member is disposed closer to the first electrode than the base, which is in contact with the first electrode; The joining device according to claim 2 .

4. a cooling fluid supply unit that supplies a cooling fluid that exchanges heat with the metal member; The joining device according to claim 2 .

5. A method for manufacturing a joined article in which the stem and the cap are joined using the joining device according to any one of claims 1 to 4, comprising: contacting the base with the first electrode; contacting the base and the cap; sandwiching a contact portion between the base and the cap between the first electrode and the second electrode; contacting the base with the cooling medium; and a step of causing a current to flow between the first electrode and the second electrode through the contact portion between the base and the cap while the cooling medium is in contact with the base, thereby joining the contact portion between the base and the cap. Method for manufacturing a bonded article.

6. A method for manufacturing a bonded article in which a stem having a base on which an electronic chip is mounted and a cap that houses the electronic chip and is connected to the base to seal the periphery of the electronic chip are bonded together, the method comprising the steps of: a step of contacting the base and the cap and sandwiching the contact portion between the base and the cap between a first electrode and a second electrode; and a step of causing a current to flow between the first electrode and the second electrode through the contact portion between the base and the cap while bringing a cooling medium into contact with the base, thereby joining the contact portion between the base and the cap. Method for manufacturing a bonded article.

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