Substrate holder, plating apparatus, and method for managing substrate holder

Abstract

To provide a technique for appropriately handling a substrate holder according to a use state of the substrate holder.SOLUTION: A substrate holder for holding a substrate to be plated in a plating device is proposed. The substrate holder includes an RFID tag. The RFID tag has a storage area in which a use attribute is stored including an attribute indicating a state of being used for plating processing.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present application relates to a substrate holder, a plating apparatus, and a method for managing a substrate holder. [Background technology]

[0002] Conventionally, electroplating devices are known that immerse substrates held by substrate holders in a plating tank containing a plating solution. In such plating devices, the substrate holders are stored in a stocker for storing substrate holders before the device is operated. When the device is started, the substrate holders are removed from the stocker and hold substrates, such as wafers, to be processed. The substrate holders holding the substrates are transported by a substrate holder transporter to the plating tank and each processing tank required for the plating process, where the necessary processing is performed sequentially. Furthermore, if a substrate holder is found to have a power supply failure, it is returned to the stocker and its use is restricted until maintenance is completed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-190507 [Patent Document 2] JP 2014-19900 A [Patent Document 3] Japanese Patent Application Publication No. 2018-53301 Summary of the Invention [Problem to be solved by the invention]

[0004] In such plating apparatuses, if a malfunction or other problem occurs in the apparatus, the user may remove a substrate holder from the stocker or during processing to resolve the malfunction. In particular, in such cases, the state of the substrate holder, such as whether the substrate holder was unused or in the middle of a processing process, may become unclear. Using a substrate holder that was in the middle of a processing process as an unused substrate holder may cause substrate contamination and may prevent proper maintenance of the substrate holder. Furthermore, in the past, it was up to the operator to determine whether the substrate holders stored in the stocker were properly maintained and stored in an unused state. Therefore, if the operator does not properly manage the substrate holders, an unmaintained substrate holder may be used as an unused substrate holder.

[0005] In view of the above circumstances, one of the objects of the present application is to provide a technique for appropriately handling a substrate holder depending on the state of use of the substrate holder. [Means for solving the problem]

[0006] According to one embodiment, a substrate holder for holding a substrate to be plated in a plating apparatus is proposed, the substrate holder having an RFID tag, the RFID tag having a memory area in which usage attributes are stored, including an attribute indicating the state of use in a plating process.

[0007] According to another embodiment, a method for managing substrate holders used in a plating apparatus is proposed, which includes the steps of reading an RFID tag attached to the substrate holder within the plating apparatus, selecting a destination for the substrate holder based on usage attributes stored in the RFID tag, and updating the usage attributes stored in the RFID tag for the substrate holder used in a process in the plating apparatus. [Brief explanation of the drawings]

[0008] [Figure 1]1 is a general layout diagram of a plating apparatus according to one embodiment. [Figure 2] 1A and 1B are diagrams illustrating a schematic configuration of a substrate holder according to one embodiment. [Figure 3] 1 is a flowchart illustrating a process for using a substrate holder in a plating apparatus, according to one embodiment. [Figure 4] 10 is a flow chart illustrating a maintenance process for a substrate holder by a maintenance terminal, according to one embodiment. [Figure 5] FIG. 10 is a schematic diagram of a modified plating system having multiple processing lanes. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of a plating apparatus and a plating method according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are designated by identical or similar reference numerals, and duplicate descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, features shown in each embodiment may also be applied to other embodiments as long as they are not mutually inconsistent.

[0010] FIG. 1 is an overall layout diagram of a plating apparatus according to an embodiment. The object to be plated in this embodiment is a substrate such as a semiconductor wafer. The substrate may be a rectangular or hexagonal substrate, or a circular substrate. As shown in FIG. 1, this plating apparatus is broadly divided into a load port 170A that loads or unloads a substrate onto or from a substrate holder 60, and a processing section 170B that processes the substrate.

[0011] The load port 170A has two cassette tables 102, an aligner 104, and a spin rinse dryer 106. A cassette 100 containing substrates such as semiconductor wafers is mounted on the cassette table 102. The aligner 104 is provided to align the substrate's orientation flat, notch, and other features in a predetermined direction. The spin rinse dryer 106 is provided to dry the substrate after plating by rotating it at high speed. A substrate loading / unloading mechanism 120 is provided near the spin rinse dryer 106. A substrate loading / unloading mechanism 120 holds the substrate holder 60 and loads / unloads the substrate. A substrate transport device 122 consisting of a transport robot that transports substrates between these units is located in the center of these units 100, 104, 106, and 120.

[0012] The substrate loading / unloading mechanism 120 includes a flat loading plate 152 that can slide laterally along rails 150. Two substrate holders 60 are placed horizontally in parallel on this loading plate 152. After a substrate is transferred between one substrate holder 60 and the substrate transport device 122, the loading plate 152 slides laterally, and the substrate is transferred between the other substrate holder 60 and the substrate transport device 122. The substrate loading / unloading mechanism 120 may also include functions as a leak detection device and a current measurement device for performing various tests on the substrate holders 60.

[0013] The leak detection device is a device for inspecting the sealed space of the substrate holder 60 for leaks. As will be described later, the substrate holder 60 seals the surface of the substrate when the substrate is held by the substrate holder 60, forming a space that does not allow the plating solution to enter. The substrate holder 60 has multiple electrical contacts that come into contact with the surface of the substrate in this sealed space to pass current through the substrate. If the function of this seal deteriorates, the plating solution will enter the electrical contacts of the substrate holder during the plating process, making it impossible to properly pass current through the substrate. Therefore, the sealing performance of the substrate holder 60 is inspected using the leak detection device. Any leak detection device can be used, including known leak detection devices. The leak detection device can also be configured to inspect the substrate holder for leaks before and after the plating process. Alternatively, multiple leak detection devices can be provided, with some used for leak inspection before the plating process and others used for leak inspection after the plating process. The leak detection device may also be used for leak testing after plating. For example, as a leak detection device for leak testing before plating, it may be used as a device that evacuates the sealed area of the substrate holder 60 and checks whether a predetermined vacuum level can be maintained for a predetermined period of time. Also, as a leak detection device for leak testing after plating, it may be used as a device that checks whether a liquid such as a plating solution is attached to the sealed area of the substrate holder 60.

[0014] The current measuring device is a device for measuring the current or resistance of the electrical contacts of the substrate holder 60. The substrate holder 60 has multiple electrical contacts to ensure that a uniform current flows through the substrate it holds. If an abnormality occurs in one of the electrical contacts, causing the resistance to be higher or lower than that of the other electrical contacts, a uniform current cannot flow through the substrate, and normal plating processing cannot be performed. Therefore, the current measuring device measures the current or resistance flowing through the electrical contacts of the substrate holder 60 before plating processing to check for abnormalities in the electrical contacts of the substrate holder 60. Any current measuring device can be used, including known current measuring devices.

[0015] The processing section 170B of the plating apparatus includes a stocker 124, a pre-wet tank 126, a pre-soak tank 128, a first cleaning tank 130a, a blow tank 132, a second cleaning tank 130b, and the plating tank 50 in the plating module 10. The stocker 124 stores and temporarily places the substrate holder 60. In the pre-wet tank 126, the substrate is immersed in a pre-wet liquid such as pure water. In the pre-soak tank 128, an oxide film on the surface of a conductive layer such as a seed layer formed on the surface of the substrate is etched away. In the first cleaning tank 130a, the substrate after pre-soaking is cleaned together with the substrate holder 60 in a cleaning liquid (such as pure water). In the blow tank 132, the substrate after cleaning is drained. In the second cleaning tank 130b, the plated substrate is cleaned together with the substrate holder 60 in a cleaning liquid. The stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, the blow tank 132, the second cleaning tank 130b, and the plating tank 50 are arranged in this order, for example.

[0016] The plating module 10 has, for example, a plurality of plating tanks 50 each equipped with an overflow tank 54. Each plating tank 50 accommodates one substrate therein, and the substrate is immersed in the plating solution held therein to perform plating such as copper plating on the surface of the substrate.

[0017] The plating apparatus includes a substrate holder transfer module 140, which is positioned to the side of each of these devices and uses, for example, a linear motor system, to transfer the substrate holder 60 together with the substrate between these devices. The substrate holder transfer module 140 includes a first transporter 142 and a second transporter 144. The first transporter 142 is configured to transfer substrates between the substrate loading / unloading mechanism 120, the stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, and the blow tank 132. The second transporter 144 is configured to transfer substrates between the first cleaning tank 130a, the second cleaning tank 130b, the blow tank 132, and the plating tank 50. In other embodiments, the plating apparatus may include only one of the first transporter 142 and the second transporter 144.

[0018] On both sides of the overflow tank 54, paddle driving devices 19 are arranged for driving paddles (not shown) that are positioned inside each plating tank 50 and act as stirring rods for stirring the plating solution in the plating tank 50.

[0019] The plating apparatus has a controller 175 as an example of a control module configured to control the above-mentioned components. The controller 175 includes a memory 175B that stores a predetermined program, and a CPU (Central Processing Unit) that executes the program in the memory 175B. The controller 175 includes a CPU (Processing Unit) 175A and a control unit 175C that is realized by the CPU 175A executing a program. The control unit 175C can, for example, control the transport of the substrate transport device 122, the transport of the substrate holder transport module 140, and control the plating current and plating time in the plating module 10. The controller 175 can be configured, for example, as a general-purpose computer or a dedicated computer equipped with an input / output device, a display device, a storage device, etc., and can be installed with a program for controlling the operation of the plating apparatus. Furthermore, the controller 175 is, for example, configured to be able to communicate with a host controller (not shown) that controls the plating apparatus and other related devices, and can exchange data with a database held by the host controller.

[0020] In this embodiment, a maintenance terminal 200 is provided for performing maintenance on the plating apparatus. The maintenance terminal 200 may be configured, for example, as a general-purpose computer or a dedicated computer equipped with an input / output device, a display device, a storage device, etc., and may have a maintenance program installed. The maintenance terminal 200 includes a memory 200B storing a predetermined program, a CPU 200A that executes the program stored in the memory 200B, and a control unit 200C that is realized by the CPU 200A executing the program. The maintenance terminal 200 and the controller 175 are configured to be connectable via wire or wirelessly. The control unit 200C can perform maintenance tasks such as resetting or backing up the controller 175 of the plating apparatus. The maintenance terminal 200 also has an RFID reader / writer function that can read and write information stored in an RFID tag 62 of a substrate holder 60 (described later), enabling maintenance of the substrate holder 60.

[0021] 2 is a schematic diagram showing the configuration of a substrate holder 60 that can be used in a plating apparatus according to one embodiment of the present invention. The substrate holder 60 of this embodiment has a handle bar 111 at one end. The handle bar 111 is held by a substrate holder transfer module 140. The handle bar 111 has a round bar shape so that it can rotate freely when the substrate holder 60 changes its position from a vertical state to a horizontal state or from a horizontal state to a vertical state.

[0022] The handlebar 111 is preferably made of corrosion-resistant stainless steel in case of adhesion of plating solution. Furthermore, if the stainless steel cannot withstand corrosion by the plating solution, it is recommended to enhance the corrosion resistance by chrome plating or coating with TiC or the like on the surface of the stainless steel. Furthermore, the handlebar 111 can also be made of titanium, which has high corrosion resistance.

[0023] In addition, rectangular or cubic hanger portions 112 are provided on both ends of the upper portion of the substrate holder 60. The hanger portions 112 function as supports for suspending the substrate holder 60 by placing them on hanger receiving members (not shown) when placing the substrate holder 60 in each processing tank. In the stocker 124 shown in FIG. 1, the substrate holder 60 is supported and suspended vertically by hooking the hanger portions 112 onto the upper surface of the peripheral wall of the stocker 124. The substrate holder 60 is transported by holding the hanger portions 112 of the suspended substrate holder 60 with a first transporter 142 or a second transporter 144. In the pre-wet tank 126, the pre-soak tank 128, the cleaning tanks 130a and 130b, the blow tank 132, and the plating tank 50, the substrate holder 60 is also supported and suspended from the peripheral wall of each tank via the hanger portions 112. The hanger part 112 is also provided with external contacts 114 for connection to an external power supply part. These external contacts 114 are electrically connected to electrical contacts (not shown) for supplying current to the substrate Wf via a plurality of wirings inside the substrate holder 60. The electrical contacts of the substrate holder 60 are arranged on the outer circumferential side of the substrate Wf so that the ends of the electrical contacts come into contact with the surface of the substrate Wf when the substrate Wf is held by the substrate holder 60. A conductive layer (seed layer) is formed on the surface of the substrate Wf, and when the substrate Wf is held by the substrate holder 60, the electrical contacts come into contact with the conductive film on the surface of the substrate Wf, allowing current to flow through the substrate Wf. When the external contacts 114 provided on the hanger part 112 and the electrical contacts of the hanger receiving member come into contact with each other, current can be supplied from an external power source to the surface to be plated of the substrate Wf via the multiple electrical contacts of the substrate holder 60. The external contacts 114 are provided in a position that will not come into contact with the plating solution in the plating tank when the substrate holder 60 is suspended on the hanger receiving member.

[0024] The substrate holder 60 has a movable holding member 11, which serves as a cover, and a fixed holding member 15, which is placed on a mounting plate 152 of the substrate attachment / detachment mechanism 120. The substrate Wf is sandwiched between the movable holding member 11 and the fixed holding member 15 (FIG. 2 shows the sandwiched state). The movable holding member 11 is substantially ring-shaped and has a presser member 12 and a lug 13 that is integral with the presser member 12 and protrudes from the outer periphery. The movable holding member 11 can be fixed to and detached from the fixed holding member 15. The fixed holding member 15 has a clamper 16 at a position corresponding to the lug 13. The clamper 16 has an inverted L-shape with an inwardly bent tip. The lug 13 fits (fits) inside the bent tip to secure the movable holding member 11 to the fixed holding member 15. It is desirable that the lug 13 and the clamper 16 have tapered portions for smooth fitting.

[0025] The pressing member 12 is rotatable relative to the movable holding member 11 and is held so as not to come off, and rotates together with the ears 13 around the center R of the movable holding member 11 as the center of rotation and a substantially horizontal plane as the plane of rotation. The pressing member 12 is, for example, in the shape of a substantially circular ring.

[0026] The movable holding member 11 and the fixed holding member 15 clamp the substrate, and the pressing member 12 is rotated to fit the ears 13 into the clamper 16 to fix the substrate Wf. When attaching or detaching the substrate, the pressing member 12 is rotated to release the engagement between the ears 13 and the clamper 16. The movable holding member 11 has a seal ring for sealing portions of the substrate Wf that do not need to be plated, such as the edge and back surface, from the plating solution, and an electrical contact (not shown) that comes into contact with the sealed edge region of the substrate Wf to apply electricity to the substrate Wf.

[0027] The substrate holder 60 also includes an RFID tag 62. As an example, the RFID tag 62 is attached to the hanger portion 112 of the fixed holding member 15, but it may be attached to any position on the substrate holder 60. The RFID tag 62 can hold various information. For example, the RFID tag 62 can hold information specific to the substrate holder, such as the manufacturing date of the substrate holder 60, the substrate holder's management number (such as the substrate holder's ID), plating apparatus information (such as the plating apparatus's ID), the stocker number where the substrate holder should be placed, the cleaning date, the total number of cleanings since the substrate holder was manufactured, the number of cleanings since the substrate holder was loaded into the plating apparatus, the integrated current value through the electrical contacts of the substrate holder, the number of NGs detected by a current measuring device or a leak detection device in the substrate loading / unloading mechanism 120, the maintenance date, and the replacement date of parts such as a seal ring and electrical contacts. In this embodiment, the RFID tag 62 also has a memory area 62a for storing "usage attributes." As an example, the storage area 62a may be configured by a virtual logical volume in the RFID tag 62. The "usage attribute" is information indicating the current usage state of the substrate holder 60, and includes at least an attribute indicating the state in which the substrate holder 60 is currently being used for plating processing. The usage attribute may also include a state in which the substrate holder 60 is undergoing maintenance, or a state in which the substrate holder 60 is waiting for maintenance. The usage attribute may also include an attribute indicating the state in which the substrate holder 60 is available for plating processing. Here, the state in which the substrate holder 60 is available for plating processing may include a state in which the substrate holder 60 is unused, a state in which the substrate holder 60 has undergone maintenance, etc. In this embodiment, "maintenance" includes cleaning. However, the "usage attribute" is separate from "maintenance". The "usage attribute" may include a status related to cleaning, such as "waiting for cleaning." It is also preferable that the "usage attribute" also stores time information when the usage attribute was updated.

[0028] In this embodiment, the transporter 142 for transporting the substrate holder 60 has an RFID reader 142a configured to read information stored in the RFID tag 62 of the substrate holder 60 (see FIG. 1). The RFID reader 142a is controlled by the controller 175. Note that, without being limited to this example, the RFID reader may be provided in the substrate loading / unloading mechanism 120 or the transporter 144 instead of or in addition to the transporter 142. Also, in this embodiment, the RFID reader 142a has a function as a writer that can update the information stored in the RFID tag 62 of the substrate holder 60. However, without being limited to this example, instead of or in addition to the RFID reader 142a, a configuration having the function of an RFID writer may be provided in the substrate loading / unloading mechanism 120 or the transporter 144.

[0029] 3 is a flowchart showing a substrate holder usage process in a plating apparatus according to one embodiment. This flowchart is executed by the controller 175 when a plating process is to be performed on a substrate Wf using a specific substrate holder 60. In this process, first, in order to use the specific substrate holder 60, the substrate holder 60 is removed from the stocker 124 (S102). Specifically, in response to a command from the controller 175, the first transporter 142 removes the specific substrate holder 60 from the stocker 124. At this time, the RFID reader 142a of the first transporter 142 reads information stored in the RFID tag 62 of the substrate holder 60 (S104). The information read by the RFID reader 142a includes usage attributes of the substrate holder 60.

[0030] The controller 175 then determines whether or not the substrate holder 60 may be used for the plating process based on the information read from the RFID tag 62 (S106). In the process of S106, the controller 175 particularly determines whether or not the substrate holder 60 may be used based on the usage attribute of the substrate holder 60. As an example, if the usage attribute of the substrate holder 60 indicates "available for plating process," the controller 175 determines that the substrate holder 60 may be used. If the usage attribute of the substrate holder 60 indicates "under maintenance" or "waiting for maintenance," the controller 175 determines that the substrate holder 60 is in a state requiring maintenance, and determines that the substrate holder 60 cannot be used. If the usage attribute of the substrate holder 60 indicates "currently being used for plating process," the controller 175 determines that the previous plating process of the substrate holder 60 was not properly completed, and determines that the substrate holder 60 cannot be used. Furthermore, in the process of S106, the controller 175 may determine whether or not the substrate holder 60 may be used for the plating process based on other information read from the RFID tag 62 in addition to the usage attribute of the substrate holder 60. As an example, even if the usage attribute of the substrate holder 60 indicates a "state usable for plating process," the controller 175 may determine that the substrate holder 60 cannot be used based on the substrate holder's unique information and maintenance history stored in the RFID tag 62.

[0031] If it is determined based on the information stored in the RFID tag 62 that the substrate holder 60 may be used (S106: Yes), the plating process is carried out using the substrate holder 60 (S108). At this time, the RFID reader 142a may update the usage attribute stored in the RFID tag 62 to information indicating "currently being used in the plating process." If an abnormality (NG) is detected in the substrate holder 60 to be used by the leak detection device or current measurement device in the substrate loading / unloading mechanism 120, the controller 175 may clean the substrate holder 60 and use the substrate holder 60 in the plating process. If an abnormality is detected in the substrate holder 60 in the substrate loading / unloading mechanism 120, the controller 175 may update the usage attribute stored in the RFID tag 62 to " Alternatively, the substrate holder 60 may be returned to the stocker 124 after updating the information to indicate "waiting for maintenance."

[0032] When a plating process using the substrate holder 60 is started, the controller 175 stores information about the usage status of the substrate holder 60, such as the integrated current value through the electrical contacts of the substrate holder 60 and the number of NGs in the substrate loading / unloading mechanism 120, until the plating process is completed (S110). Then, when the plating process is completed (S110: Yes), the controller 175 updates the information stored in the RFID tag 62 based on the information about the usage status of the substrate holder 60 stored during the plating process (S112). This updates the unique information of the substrate holder 60 stored in the RFID tag 62. At this time, it is also preferable to update the usage attribute of the substrate holder 60 stored in the RFID tag 62 to information indicating "awaiting maintenance" or "available for plating." Then, the controller 175 returns the substrate holder 60 to the stocker 124 (S114), thereby completing the use of the substrate holder 60.

[0033] If the controller 175 determines based on the information stored in the RFID tag 62 that the substrate holder 60 cannot be used (S106: No), the plating process using the substrate holder 60 is not performed and a non-use process is executed (S118). This non-use process includes returning the substrate holder 60 to the stocker 124 as is. Furthermore, the non-use process may be executed in a different manner based on the usage attribute stored in the RFID tag 62. For example, if the substrate holder 60 is undergoing maintenance or waiting for maintenance, a predetermined maintenance process may be executed on the substrate holder 60. Furthermore, for example, if the substrate holder 60 removed from the stocker 124 is currently being used in a plating process, the substrate holder 60 may be returned to the stocker 124 as is, and a lamp, buzzer, or indicator may be activated to notify the user that the substrate holder 60 is abnormal. Furthermore, the non-use process may involve removing the substrate holder 60 from the plating apparatus. In this case, a swap station (not shown) provided in the plating apparatus may be used. After the controller 175 performs the non-use process on the substrate holder 60, the use process shown in FIG. 3 ends.

[0034] According to this substrate holder usage process, the RFID tag 62 of the substrate holder 60 stores "usage attributes." The controller 175 of the plating apparatus then determines whether or not to perform plating processing on the substrate Wf using the substrate holder 60 based on the "usage attributes" stored in the RFID tag. This allows the substrate holder to be handled appropriately depending on its usage state.

[0035] Next, maintenance of the substrate holder 60 using the maintenance terminal will be described. Fig. 4 is a flowchart showing a maintenance process according to one embodiment. As an example, this process is performed by an operator removing the substrate holder 60 from the stocker 124 and connecting the substrate holder 60 to the maintenance terminal 200. As another example, the process shown in Fig. 4 is performed by a swap station (not shown) removing the substrate holder 60 from the plating apparatus and transporting it to a predetermined maintenance location.

[0036] In the maintenance process of the substrate holder 60 by the maintenance terminal 200, first, the maintenance terminal 200 reads the RFID tag 62 of the substrate holder 60 (S204). Next, the maintenance terminal 200 determines whether the usage attribute stored in the RFID tag 62 indicates "currently being used for plating processing" (S206). If the "usage attribute" does not indicate "currently being used for plating processing" (S206: No), normal maintenance processing is performed using the maintenance terminal 200 (S208). In the processing of S208, for example, components of the substrate holder 60, such as a seal ring or electrical contacts, are replaced, and the substrate holder's unique information and maintenance history stored in the RFID tag 62 are updated. Then, after completing the maintenance processing of the substrate holder 60, the maintenance terminal 200 updates the usage attribute of the RFID tag 62 to information indicating "currently usable for plating processing" (S212), and ends the maintenance process. After the maintenance process is completed, the substrate holder 60 is returned to the stocker 124 and is used again for plating processing in the plating device.

[0037] When the usage attribute stored in the RFID tag 62 indicates "currently being used in plating processing" (S206: Yes), the maintenance terminal 200 determines that an abnormality occurred in the plating processing using the substrate holder 60, and executes abnormality processing (S218). In this abnormality processing, for example, the maintenance terminal 200 may communicate with the controller 175 of the plating apparatus to investigate the cause. In particular, if the RFID tag 62 stores time information when the usage attribute was updated to "currently being used in plating processing," the cause can be investigated based on the time information. Furthermore, in the abnormality processing, a leak or an abnormality in the electrical contacts of the substrate holder 60 may be detected. Furthermore, in the abnormality processing, the substrate holder 60 may be cleaned. Then, after completing the abnormality processing, the maintenance terminal 200 updates the usage attribute of the RFID tag 62 according to the result of the abnormality processing (S212) and ends the maintenance process. As an example, when the maintenance terminal 200 determines in the abnormality process that the substrate holder 60 can be used for plating, it may update the use attribute of the RFID tag 62 to information indicating "state usable for plating." In this case, the substrate holder 60 is returned to the stocker 124 and used again for plating in the plating apparatus.

[0038] <Modification> FIG. 5 is a schematic diagram of a plating system having multiple processing lanes according to a modified example. The plating system shown in FIG. 5 includes a first processing lane 20A and a second processing lane 20B. The plating system may include three or more processing lanes. In this modified example, each of the first and second processing lanes 20A and 20B corresponds to processing unit 170B in the above-described embodiment. The plating system also includes components corresponding to controller 175 and maintenance terminal 200 in the above-described plating apparatus. Components identical to those described in the above-described embodiment are designated by the same reference numerals, and redundant explanations will be omitted.

[0039] In this modification, the "usage attribute" stored in the RFID tag 62 of the substrate holder 60 includes information for individually identifying the lane (apparatus) in which the substrate holder 60 is currently placed. That is, the usage attribute includes, for example, information indicating "used in the first processing lane" and "used in the second processing lane." In addition, in this modification, the usage attribute includes information indicating an "unused state" in which the substrate holder is not being used in either the first or second processing lane 20A, 20B, and a "waiting for maintenance state" in which maintenance outside the first or second processing lanes 20A, 20B is required.

[0040] The controller 175 of the plating system in this modified example determines whether to permit or prohibit use of the substrate holder 60 at the destination of use, based on the usage attribute stored in the RFID tag 62 of the substrate holder 60. As an example, for a substrate holder 60 whose usage attribute indicates "used in the first processing lane," the controller 175 permits use in the first processing lane 20A but prohibits use in the second processing lane 20B. Furthermore, for a substrate holder 60 whose usage attribute indicates "used in the second processing lane," the controller 175 prohibits use in the first processing lane 20A but permits use in the second processing lane 20B. Furthermore, when the usage attribute of the substrate holder 60 is "unused," the controller 175 permits use in both the first and second processing lanes 20A and 20B. Furthermore, when the usage attribute of the substrate holder 60 is "waiting for maintenance", the controller 175 prohibits the substrate holder 60 from being used in either the first or second processing lane 20A, 20B.

[0041] The plating system of the modified example described above has multiple processing lanes that use substrate holders 60, and determines the processing lane in which the substrate holder 60 can be used based on the usage attributes stored in the RFID tag 62 of the substrate holder 60. This prevents a substrate holder that has been used in a different processing lane from being used in an unintended processing lane. This prevents, for example, mixing of different processing solutions when different processing solutions are used in the processing lanes. Therefore, the plating system of the modified example allows the substrate holder 60 to be handled appropriately depending on the usage state.

[0042] The present invention can also be described as the following aspects. [Mode 1] According to Mode 1, a substrate holder for holding a substrate to be plated in a plating apparatus is proposed, the substrate holder is provided with an RFID tag, and the RFID tag has a memory area for storing usage attributes, including attributes indicating the state of use in a plating process. According to Mode 1, the substrate holder can be handled appropriately based on the usage attributes stored in the RFID tag.

[0043] [Mode 2] According to mode 2, the usage attributes stored in the storage area in mode 1 include a state in which the substrate holder is undergoing maintenance or a state in which the substrate holder is awaiting maintenance. According to mode 2, it is possible to know whether the substrate holder is undergoing maintenance or a state in which the substrate holder is awaiting maintenance based on the usage attributes stored in the RFID tag.

[0044] [Mode 3] According to Mode 3, in Mode 1 or Mode 2, the usage attributes stored in the storage area include information for individually identifying the device in which the substrate holder is currently placed. According to Mode 3, by reading the RFID tag, it is possible to know the device in which the substrate holder is currently placed.

[0045] [Mode 4] According to Mode 4, in Modes 1 to 3, the usage attribute stored in the storage area includes time information when the usage attribute was updated. According to Mode 4, it is possible to know the update time of the usage attribute stored in the RFID tag.

[0046] [Mode 5] According to Mode 5, in Modes 1 to 4, the RFID tag stores information indicating the number of times or the duration of use of each component constituting the substrate holder. According to Mode 5, the number of times or the duration of use of the substrate holder can be managed based on the status stored in the RFID tag.

[0047] [Mode 6] According to Mode 6, there is proposed a plating apparatus having a plating tank, the plating apparatus comprising: a substrate holder according to Modes 1 to 5; a transfer module for transferring the substrate holder; an RFID reader configured to read information stored in the RFID tag of the substrate holder; and a control module for determining whether or not to perform plating processing on a substrate using the substrate holder based on the usage attributes of the substrate holder read by the RFID reader. Mode 6 can achieve the same effects as Modes 1 to 5.

[0048] [Mode 7] According to Mode 7, in Mode 6, the plating apparatus has a first processing lane and a second processing lane, and the usage attributes stored in the storage area of the substrate holder include: The substrate holder includes attributes indicating "unused state," "in use in the first processing lane," "in use in the second processing lane," and "awaiting maintenance," and the control module allows the substrate holder whose usage attribute indicates "unused state" to be used in the first processing lane or the second processing lane, allows the substrate holder whose usage attribute indicates "in use in the first processing lane" to be used in the first processing lane, allows the substrate holder whose usage attribute indicates "in use in the second processing lane" to be used in the second processing lane, and prohibits the substrate holder whose usage attribute indicates "awaiting maintenance" from being used in the first processing lane and the second processing lane. According to form 7, the substrate holder can be handled appropriately depending on the usage state of the substrate holder.

[0049] [Eighth Mode] According to an eighth mode, in the sixth or seventh mode, the RFID reader is provided in the transport module.

[0050] [Mode 9] According to Mode 9, in Modes 6 to 8, the RFID reader can update the information stored in the RFID tag.

[0051] [Form 10] According to form 10, in form 9, the RFID reader reads the usage attributes stored in the RFID tag when use of the substrate holder begins, the control module stores the usage status of the substrate holder in the plating process, and the RFID reader updates the usage attributes stored in the RFID tag based on the usage status of the substrate holder stored by the control module when use of the substrate holder ends.

[0052] [Mode 11] According to Mode 11, there is provided a method for managing substrate holders used in a plating apparatus, the method including the steps of: reading an RFID tag attached to the substrate holder within the plating apparatus; determining whether or not to perform plating processing on a substrate using the substrate holder based on usage attributes stored in the RFID tag; and updating the usage attributes stored in the RFID tag for the substrate holder used in the plating processing. According to Mode 11, the substrate holder can be appropriately handled based on the usage attributes stored in the RFID tag.

[0053] [Form 12] According to form 12, in form 11, the reading step is a step performed when use of the substrate holder begins, and the updating step is a step performed when use of the substrate holder ends.

[0054] [Mode 13] According to Mode 13, in Modes 11 or 12, the plating apparatus has a first processing lane and a second processing lane, and the usage attributes include attributes indicating "unused state," "in use in the first processing lane," "in use in the second processing lane," and "awaiting maintenance," and the management method allows the substrate holder whose usage attribute indicates "unused state" to be used in the first processing lane or the second processing lane, allows the substrate holder whose usage attribute indicates "in use in the first processing lane" to be used in the first processing lane, allows the substrate holder whose usage attribute indicates "in use in the second processing lane" to be used in the second processing lane, and prohibits the substrate holder whose usage attribute indicates "awaiting maintenance" from being used in the first processing lane and the second processing lane. According to Mode 13, substrate holders can be handled appropriately depending on their usage states. [Explanation of symbols]

[0055] 20A, 20B...Processing lanes 50...Plating tank 60...Substrate holder 62...RFID tag 62a...Storage area 120...Board attachment / detachment mechanism 122...Substrate transport device 124... Stocker 140...Substrate holder transfer module 142...First Transporter 142a...RFID reader 175...Controller 200...Maintenance terminal

Claims

1. A plating apparatus having a plating tank, A substrate holder for holding a substrate to be plated, Equipped with an RFID tag, The RFID tag has a storage area in which usage attributes, including an attribute indicating a state of being used in a plating process, are stored. a substrate holder; a transfer module for transferring the substrate holder; an RFID reader configured to read information stored on the RFID tag of the substrate holder; a control module that determines whether or not to perform plating processing on a substrate using the substrate holder based on the usage attributes of the substrate holder read by the RFID reader; Equipped with the plating apparatus has a first processing lane and a second processing lane; the use attributes stored in the storage area of the substrate holder include attributes indicating "unused state," "used in the first processing lane," "used in the second processing lane," and "waiting for maintenance," the control module permits the substrate holder whose usage attribute indicates "unused state" to be used in the first processing lane or the second processing lane, permits the substrate holder whose usage attribute indicates "used state in the first processing lane" to be used in the first processing lane, permits the substrate holder whose usage attribute indicates "used state in the second processing lane" to be used in the second processing lane, and prohibits the substrate holder whose usage attribute indicates "waiting for maintenance state" from being used in the first processing lane and the second processing lane. Plating equipment.

2. A plating apparatus having a plating tank, A substrate holder for holding a substrate to be plated, Equipped with an RFID tag, The RFID tag has a storage area in which usage attributes, including an attribute indicating a state of being used in a plating process, are stored. a substrate holder; a transfer module for transferring the substrate holder; an RFID reader configured to read information stored on the RFID tag of the substrate holder; a control module that determines whether or not to perform plating processing on a substrate using the substrate holder based on the usage attributes of the substrate holder read by the RFID reader; Equipped with the RFID reader is capable of updating information stored in the RFID tag; the RFID reader reads the usage attribute stored in the RFID tag when use of the substrate holder is started; the control module stores the utilization status of the substrate holder in the plating process; the RFID reader updates the usage attribute stored in the RFID tag based on the usage status of the substrate holder stored by the control module when use of the substrate holder is terminated. Plating equipment.

3. 3. The plating apparatus according to claim 2, wherein the usage attributes stored in the storage area include a state in which the substrate holder is undergoing maintenance or a state in which the substrate holder is waiting for maintenance.

4. 4. The plating apparatus according to claim 1, wherein the usage attributes stored in the storage area include information for individually identifying the currently installed apparatus.

5. The plating apparatus according to claim 1 , wherein the usage attributes stored in the storage area include time information when the usage attributes were updated.

6. 6. The plating apparatus according to claim 1, wherein the RFID tag holds information indicating the number of times or duration of use of each component constituting the substrate holder.

7. The plating apparatus according to claim 1 , wherein the RFID reader is provided in the transfer module.

8. The plating apparatus of claim 1 , wherein the RFID reader is capable of updating information stored in the RFID tag.

9. the RFID reader reads the usage attribute stored in the RFID tag when use of the substrate holder is started; the control module stores the utilization status of the substrate holder in the plating process; the RFID reader updates the usage attribute stored in the RFID tag based on the usage status of the substrate holder stored by the control module when use of the substrate holder is terminated. The plating apparatus according to claim 8.

10. A plating apparatus described in any one of claims 1 to 9, wherein the RFID reader reads the usage attributes stored in the RFID tag when use of the substrate holder begins and updates the usage attributes.

11. A method for managing a substrate holder used in a plating apparatus, comprising: reading an RFID tag attached to the substrate holder within the plating apparatus; determining whether or not to perform plating processing on a substrate using the substrate holder based on the usage attributes stored in the RFID tag; updating the usage attributes stored in the RFID tag for the substrate holder used in the plating process; Including, the reading step is a step performed at a timing when use of the substrate holder is started, The updating step is performed at a timing when use of the substrate holder is finished. Management method.

12. A management method as described in claim 11, wherein the reading step and the updating step are performed when the substrate holder begins to be used.

13. A method for managing a substrate holder used in a plating apparatus, comprising: reading an RFID tag attached to the substrate holder within the plating apparatus; determining whether or not to perform plating processing on a substrate using the substrate holder based on the usage attributes stored in the RFID tag; updating the usage attributes stored in the RFID tag for the substrate holder used in the plating process; Including, the plating apparatus has a first processing lane and a second processing lane; The usage attributes include attributes indicating "unused state," "used state in the first processing lane," "used state in the second processing lane," and "waiting for maintenance," The management method allows the substrate holder whose usage attribute indicates "unused state" to be used in the first processing lane or the second processing lane, allows the substrate holder whose usage attribute indicates "used state in the first processing lane" to be used in the first processing lane, allows the substrate holder whose usage attribute indicates "used state in the second processing lane" to be used in the second processing lane, and prohibits the substrate holder whose usage attribute indicates "waiting for maintenance state" from being used in the first processing lane and the second processing lane. Management method.

Images