Antenna device

Abstract

This antenna device comprises a base (4b) that has a mounting unit (land (16a)), and a chip electronic component (capacitor chip (12)). The land (16a) has at least a pair of mounting terminals (16c) for mounting the capacitor chip (12). The base (4b) has uneven sections (20) formed at edge portions (4g) of an opening (4e). The uneven sections (20) are each configured by a recess section (21) and a protruding section (22) that respectively protrude from and are recessed into the edge portions (4g) of the opening (4e) in the direction in which the mounting terminals (16c) that form a pair are aligned. The protruding sections (22) demarcate mounting spaces at positions where at least a pair of terminals (12a) of the capacitor chip (12) face the mounting terminals (16c) that form a pair.

Description

[Technical Field]

[0001] The present invention relates to an antenna device on which a chip electronic component is mounted. [Background technology]

[0002] 2. Description of the Related Art In recent years, keyless entry systems capable of transmitting and receiving radio signals when locking and unlocking doors installed in vehicles, houses, etc. have been put to practical use. To realize a keyless entry system, antenna devices such as LF (Low Frequency) transmitting antennas capable of transmitting and receiving radio signals are widely used.

[0003] For example, the antenna device disclosed in Patent Document 1 includes a base having a through opening, a coil, a terminal member, and a capacitor. The terminal member has a chip support piece that is partially exposed from the opening of the base. The capacitor is mounted on the chip support piece by reflow soldering. Furthermore, in order to prevent the capacitor from shifting position during reflow (to maintain physical and electrical connection with the mounting terminals), the terminal members themselves are provided with a plurality of protrusions. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-103549 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the antenna device disclosed in Patent Document 1, in order to provide a protrusion on the terminal member, it was necessary to select a material with suitable plasticity and toughness, and the material itself also needed to be thick.

[0006] The present invention has been made in view of the above-mentioned problems, and has as its object to provide an antenna device that can suitably maintain physical and electrical connection with a mounting terminal. [Means for solving the problem]

[0007] According to the present invention, there is provided an antenna device comprising a base having an opening and a mounting portion within the opening, and a chip electronic component mounted on the mounting portion, wherein the mounting portion has at least a pair of mounting terminals for mounting the chip electronic component, the base has a concave-convex portion formed on the edge portion of the opening, the concave-convex portion being composed of a concave portion and a convex portion and protruding and recessed at the edge portion of the opening in the arrangement direction of the pair of mounting terminals, the convex portion defining a mounting space for the chip electronic component, and at least a pair of terminals of the chip electronic component defining the mounting space at a position facing the pair of mounting terminals. [Effects of the Invention]

[0008] According to the present invention, an antenna device can be provided in which a protrusion is provided on the base portion, thereby positioning a chip electronic component and suitably maintaining physical and electrical connection with the mounting terminal. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective view of the antenna device. [Figure 2] 2 is an enlarged view of part II in FIG. 1, and is a front view showing an opening. FIG. [Figure 3] 10 is a front view showing an opening provided with a capacitor chip therein, the capacitor chip being in contact with a protrusion; FIG. [Figure 4] FIG. 4 is a schematic cross-sectional view showing a cross section taken along line IV-IV in FIG. 2. [Figure 5] 10 is a front view showing an opening in a state where a fillet is formed between a terminal of a capacitor chip and a mounting terminal. FIG. [Figure 6] FIG. 10 is a front view showing an opening in which a protrusion according to a first modified example is provided. [Figure 7] 5 is a schematic cross-sectional view corresponding to FIG. 4, showing a convex portion according to a second modified example. FIG. Detailed Description of the Invention

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The embodiment described below is merely an example to facilitate understanding of the present invention, and is not intended to limit the present invention. In other words, the shapes, dimensions, arrangements, etc. of the components described below may be changed or improved without departing from the spirit of the present invention, and the present invention naturally includes equivalents thereof. Furthermore, the various components of the present invention do not need to be independent entities, and it is acceptable for multiple components to be configured as a single component, for one component to be divided into multiple components, for one component to be part of another component, or for part of one component to overlap with part of another component, etc.

[0011] In addition, in all drawings, like elements are denoted by like reference numerals, and redundant explanations are omitted where appropriate. Furthermore, although the present specification may refer to an up-down direction, this is set for the sake of convenience in explaining the relative relationships between elements, and does not limit the directions when manufacturing or using the product according to the present invention.

[0012] <Outline of the antenna device> First, an overview of the antenna device 1 will be described mainly with reference to FIGS. Fig. 1 is a perspective view of the antenna device 1, and Fig. 2 is an enlarged view of part II in Fig. 1, showing an opening 4e. Note that Fig. 2 and Fig. 3, which will be described later, omit illustration of the fillet 19 shown in Fig. 5.

[0013] The antenna device 1 includes a base 4b having a mounting portion (lands 16a) within the opening 4e, and a chip electronic component (capacitor chip 12) mounted on the lands 16a. The lands 16a have at least a pair of mounting terminals 16c for mounting the capacitor chip 12. The base 4b has an uneven portion 20 formed on an edge portion 4g of the opening 4e. The uneven portion 20 is composed of a recessed portion 21 and a protruding portion 22, and protrudes and recesses at the edge portion 4g of the opening 4e in the arrangement direction of the paired mounting terminals 16c.

[0014] The protrusion 22 defines a mounting space for the capacitor chip 12, and defines the mounting space at a position where at least one pair of terminals 12a of the capacitor chip 12 faces a pair of mounting terminals 16c. Specifically, the position where a pair of terminals 12a faces the pair of mounting terminals 16c may be a position where any portion of one of the pair of mounting terminals 16c contacts any portion of one of the pair of terminals 12a of the capacitor chip 12, and any portion of the other of the pair of mounting terminals 16c contacts any portion of the other of the pair of terminals 12a of the capacitor chip 12.

[0015] As shown in FIG. 2, specifically, the uneven portions 20 are provided on the opposing surfaces of the edge portion 4g of the opening 4e that face each other in the arrangement direction of the pair of mounting terminals 16c. In this specification, "opposing" is not limited to opposing things that extend parallel to each other, but also includes opposing things that are inclined at an angle of 0 degrees or more but less than ±90 degrees when the parallel state is defined as 0 degrees.

[0016] In the arrangement direction of the paired mounting terminals 16c, the recessed portions 21 are recessed farther from the center of the opening 4e than the protruding portions 22. In contrast, in the arrangement direction of the paired mounting terminals 16c, the protruding portions 22 protrude closer to the center of the opening 4e than the recessed portions 21. The chip electronic components include, for example, resistor chips in addition to the capacitor chip 12 described in this embodiment.

[0017] According to the above configuration, the protrusion 22 provided on the base 4b allows each of a pair of terminals 12a provided on the chip electronic component (capacitor chip 12) to be suitably arranged in a position facing each of the pair of mounting terminals 16c. Furthermore, since the uneven portion 20 is provided on a part of the base 4b, rather than on the mounting terminal 16c, the material of the mounting terminal 16c can be freely selected from conductive materials, and the material can be made thinner to reduce material costs.

[0018] [Overall configuration] Next, we will explain the overall configuration of the antenna device 1. As shown in Fig. 1, the antenna device 1 mainly includes a long, plate-shaped core 3, a base 4 that holds the core 3, a coil 5 that is wound spirally around the periphery of the base 4 at intervals, and a capacitor chip 12.

[0019] The core 3 amplifies the magnetic field generated by the coil 5, and is housed in the base 4 (a bobbin 4a described later) with a portion exposed. The core 3 is formed long and has a flat cross-sectional shape (rectangular) in a cross section perpendicular to the long direction.

[0020] Materials for the core 3 include those made of ceramics primarily composed of iron oxide (ferrite core), those made of amorphous alloys (amorphous core), those made by compressing and molding metal powder (dust core), and those made by electrically insulating multiple electromagnetic steel sheets and forming a laminated structure (laminated core).

[0021] The coil 5 is an element that serves as a main inductance element in the series resonant circuit of the antenna device 1. The coil 5 according to this embodiment is wound spirally at four intervals around the periphery of the base portion 4 (a bobbin 4a described later). Ends of the coil 5 are connected to the lead frame 16 shown in FIG.

[0022] The base portion 4 in this embodiment is formed from an insulating material such as resin, and as shown in Figure 1, insulates the core 3 housed inside from the coil 5 wound around the bobbin 4a. The base portion 4 continuously comprises a bobbin 4a located in the center in the longitudinal direction, around which the coil 5 is wound spirally, and a base 4b formed on both sides of the bobbin 4a, having an opening 4e on one side, within which the capacitor chip 12 is attached.

[0023] Opening Next, the opening 4e provided in the base portion 4 will be described in detail. In the antenna device 1 according to this embodiment, an opening 4e is provided in the base 4b to expose the mounting terminals 16c (lands 16a) from the base 4b and mount the capacitor chip 12. The opening 4e does not penetrate the base 4b in the thickness direction. In other words, the opening 4e is formed thinner than the surrounding area of the base 4b, exposes the lands 16a, and forms a mounting space for the capacitor chip 12.

[0024] In this embodiment, the opening 4e is formed in a double rectangular shape in a plan view, and is formed so as to flare out in the depth direction toward the opening tip (the front side in the paper direction of FIG. 2). That is, the edge portion 4g of the opening 4e is formed to be inclined with respect to the opening and a land 16a (described later) on the opposite side of the opening. In a plan view, a pair of lands 16a, which will be described later, is provided on the bottom surface of the opening 4e.

[0025] [Uneven parts] Next, the uneven portion 20 that defines the mounting position of the capacitor chip 12 and ensures the formation area of the fillet 19 will be described with reference mainly to FIGS. 3 and 4 in addition to FIGS. Fig. 3 is a front view showing an opening 4e provided therein with a capacitor chip 12 in a position where it is in contact with a protrusion 22. Fig. 4 is a schematic cross-sectional view showing a cross section taken along line IV-IV in Fig. 2. 4 and FIG. 7, which will be described later, the cross section of the capacitor chip 12 is shown in a simplified form, and unlike FIGS. 2 and 3, the fillet 19 is shown.

[0026] 2 to 4, the concave-convex portion 20 is provided on each of the surfaces of the edge portion 4g of the opening 4e that face each other in the arrangement direction of the pair of mounting terminals 16c. Of the concave-convex portion 21 and convex portion 22 that make up the concave-convex portion 20, the convex portion 22 functions as a positioning portion that determines the position of the capacitor chip 12.

[0027] In this specification, "convex and concave" are relative terms, and when only convex portions are formed on the side (more precisely, the surface) of the opening 4e in a plan view, the portion other than this convex portion is called a concave portion. Conversely, when only concave portions are formed on this side (more precisely, the surface), the portion other than this concave portion is called a convex portion. In other words, it is not the case that only one of the concave and convex portions is formed.

[0028] The concave-convex portion 20 may be provided on one of the opposing surfaces of the pair of mounting terminals 16c in the arrangement direction. Even in this case, the chip electronic component (capacitor chip 12) can be positioned on the side where the concave-convex portion 20 is provided, and an area for forming the fillet 19 shown in FIG. 5 can be secured.

[0029] However, by providing the terminals on each of the opposing surfaces, that is, on both sides, the capacitor chip 12 can be positioned on both sides in the direction in which the paired mounting terminals 16c are arranged. Therefore, since it is possible to secure an area for forming the fillet 19 on both sides of the capacitor chip 12, it is possible to prevent a tombstone state (a state in which one side is joined but the other is separated) caused by tensile force generated from one side during reflow due to an uneven amount of solder, which is more preferable.

[0030] In this embodiment, the protrusion 22 is disposed in the center of the mounting surface 16e in a direction (width direction) perpendicular to the arrangement direction of the paired mounting terminals 16c in a plan view of the opening 4e. The "central portion of the mounting surface 16e in a direction perpendicular to the arrangement direction of the paired mounting terminals 16c" where the protrusion 22 is arranged refers to, for example, an area within 40 percent of the central portion of the overall length of the mounting surface 16e in the perpendicular direction.

[0031] According to the above configuration, the convex portion 22 is arranged in the central portion of the mounting surface 16e, which allows fillets 19 to be formed on both sides of the convex portion 22 on the mounting surface 16e, thereby increasing the bonding strength between the terminal 12a of the capacitor chip 12 and the mounting terminal 16c.

[0032] 3, the pair of protrusions 22 are formed in the center of the mounting area in the width direction, and the width dimension of the capacitor chip 12 is larger than half of the opening 4e. With this configuration, no matter how much the capacitor chip 12 moves in the left-right direction (width direction), the upper edge of the capacitor chip 12 abuts against the protrusions 22, and the capacitor chip 12 is positioned by the protrusions 22.

[0033] However, the present invention is not limited to such a configuration, and as described above, it is preferable that the protrusions 22 are provided on each of the opposing surfaces that face each other in the arrangement direction of the pair of mounting terminals 16c, and the arrangement and number thereof can be set arbitrarily. However, by reducing the number of protrusions 22, a wide area for forming the fillets 19 can be secured, and the occurrence of solder cracks can be suppressed.

[0034] By forming the recess 21 at the edge 4g of the opening 4e, the fillet 19 is formed smoothly and continuously so as to become thinner in a skirt shape from the terminal 12a of the capacitor chip 12 toward the edge 4g of the opening 4e of the land 16a. By forming the fillet 19 in this way, stress concentration is reduced, making it less likely for solder cracks to occur.

[0035] The protrusion 22 is formed to be narrower on the protruding side in a plan view relative to the opening 4e. In this embodiment, the protruding end of the protruding portion 22 is formed in a semicircular shape in a plan view relative to the opening 4e, and therefore the protruding portion 22 is formed narrower on the protruding side. However, the present invention is not limited to this configuration as long as the width is narrow on the protruding side, and the protruding side may be formed in a stepped shape. According to the above configuration, the width of the protrusion 22 is narrowed, so that the fillet 19 formed between the terminal 12a and the mounting terminal 16c of the chip electronic component (capacitor chip 12) can be made wider in the width direction of the protrusion 22 accordingly.

[0036] Furthermore, it is preferable that the protrusion 22 according to this embodiment is formed so as to gradually narrow on the protruding side in a plan view relative to the opening 4e. As described above, in the convex portion 22 according to this embodiment, the portion protruding from the concave portion 21 is formed in a semicircular shape in a plan view relative to the opening 4e, and is smoothly narrowed on the protruding side. The above-mentioned "gradually narrowing" means that the width narrows smoothly, and is not limited to the semicircular convex portion 22, in which the surface on the protruding side is formed in a curved shape.

[0037] The gradually narrowing convex portion 22 may be formed so as to be inclined so as to narrow in the protruding direction of the convex portion 22 in a plan view relative to the opening 4e, for example, may be formed in a trapezoidal shape.

[0038] According to the above configuration, the convex portion 22 gradually narrows on the protruding side, making it easier to form the fillet 19 formed between the terminal 12a and the mounting terminal 16c of the chip electronic component (capacitor chip 12) continuously along the convex portion 22.

[0039] As shown in FIG. 4, the upper surface 22a of the protrusion 22 (the surface opposite to the side facing the mounting surface 16e) is perpendicular to the mounting surface 16e of the mounting terminal 16c and is inclined so as to approach the mounting surface 16e as it moves toward the center of the opening 4e within an imaginary plane including the arrangement direction of the pair of mounting terminals 16c. The "upper surface" refers to the surface opposite to the surface facing the mounting terminal 16c, and "upper and lower" are unrelated to the direction of gravity.

[0040] According to the above configuration, it is possible to prevent the protrusion 22 from interfering with the placement of the chip electronic component (capacitor chip 12) at the center of the opening 4e. Specifically, as described above, the upper surface 22a of the convex portion 22 slopes downward so as to approach the mounting surface 16e as it moves toward the center of the opening 4e, allowing the capacitor chip 12 to be oriented toward the center of the opening 4e.

[0041] More specifically, even if the capacitor chip 12 is dropped onto the upper surface 22a of the protrusion 22, the capacitor chip 12 can slide along the upper surface 22a of the protrusion 22 due to the reaction force applied to the center of the opening 4e from the protrusion 22 or due to the weight of the capacitor chip 12, and the capacitor chip 12 can be directed toward the center of the opening 4e where the mounting terminals 16c are exposed.

[0042] As shown in FIG. 3, in a plan view of the opening 4e, the length W1 of the protrusion 22 is shorter than the length W2 of the mounting terminals 16c in a direction perpendicular to the arrangement direction of the pair of mounting terminals 16c. According to the above configuration, the area of the fillet 19 provided between the terminal 12a of the chip electronic component (capacitor chip 12) and the mounting terminal 16c can be secured in a portion that does not overlap with the protrusion 22 of the mounting terminal 16c.

[0043] [Mounting section] Next, the mounting portion (lands 16a, mounting terminals 16c) will be described mainly with reference to Fig. 5 in addition to Fig. 3 and Fig. 4. Fig. 5 is a front view showing the opening 4e in a state where a fillet 19 is formed between the terminal 12a of the capacitor chip 12 and the mounting terminal 16c.

[0044] The lands 16a are part of the lead frame 16 and are mounting terminals 16c to which the terminals 12a of the capacitor chip 12 are soldered. Another part of the lead frame 16 is disposed inside the base 4, and the pair of lands 16a are exposed to the outside from the base 4.

[0045] The pair of mounting terminals 16c are arranged side by side with a gap 16d therebetween. As shown in Fig. 3, the length L1, which is the sum of the length of the protrusion 22 from the recess 21 into the mounting space and the longitudinal dimension of the chip electronic component (capacitor chip 12), is longer than the shortest length L2 from the recess 21 to the mounting terminal 16c that is distal to the gap 16d among the pair of mounting terminals 16c.

[0046] The "longitudinal dimension of the chip electronic component" here refers to the dimension from the end of the chip electronic component (capacitor chip 12) that abuts on the protrusion 22 to the distal end (lower end in FIG. 3) of the distal terminal 12a. The relationship between the above-mentioned lengths L1 and L2 applies not only to the relationship between the upper protrusion 22 and the lower mounting terminal 16c shown in FIG. 3, but also to the relationship between the lower protrusion 22 and the upper lower mounting terminal 16c.

[0047] In the above, the mounting terminal 16c on the "distal side" for determining the length L2 refers to the mounting terminal 16c on the side away from the recess 21 that was used as the reference when determining the length L1.

[0048] According to the above configuration, the chip electronic component (capacitor chip 12), the uneven portion 20 (concave portion 21 and convex portion 22), and the mounting terminal 16c have the above-mentioned length relationship, so that the pair of terminals 12a of the capacitor chip 12 positioned on the convex portion 22 is always positioned on the mounting terminal 16c.

[0049] The mounting terminal 16c is preferably a metal terminal that is insert-molded into the base 4b. According to the above configuration, the mounting terminals 16c are formed by insert molding when the base portion 4 is injection molded, so that the mounting terminals 16c can be easily disposed within the openings 4e.

[0050] The mounting terminal 16c may be a thin film of conductive material printed on the base 4b. According to the above configuration, since the protrusions 22 are formed on the base 4b, it is not necessary to form a portion of the mounting terminals 16c thick for positioning purposes, and the mounting terminals 16c can be formed into a thin film by printing. For example, the mounting terminals 16c may be formed into a thin film by forming a land pattern including the mounting terminals 16c with a conductive paste or by plating the base 4b with resin, and the manufacturing method is not limited.

[0051] (First Modification) Next, the protrusion 32 according to the first modified example will be described with reference to Fig. 6. Fig. 6 is a front view showing an opening 4e in which the protrusion 32 according to the first modified example is provided.

[0052] The protrusion 22 according to this example has a rectangular protrusion at the protruding end that is narrower than the base end in plan view relative to the opening 4e, so that the protrusion 22 is narrower on the protruding side. In other words, the protrusion 32 gradually narrows on the protruding side in plan view relative to the opening 4e. According to the above configuration, the width of the protrusion 22 is narrowed, so that the fillet 19 formed between the terminal 12a and the mounting terminal 16c of the chip electronic component (capacitor chip 12) can be made wider in the width direction of the protrusion 22 accordingly. The protrusion 22 may further have a plurality of steps.

[0053] (Second Modification) Next, a convex portion 42 according to a second modified example will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view showing a convex portion 42 according to a second modified example, corresponding to Fig. 4.

[0054] As shown in FIG. 7, the protrusion 42 according to this example is disposed at a distance from the mounting terminal 16c in the mounting direction (direction perpendicular to the mounting surface 16e). Specifically, a gap 42a is formed between the protrusion 42 and the mounting terminal 16c. Solder penetrates into this gap 42a to form a fillet 19, and the protrusion 42 and the mounting terminal 16c are joined together via the fillet 19 in the gap 42a, becoming one body.

[0055] In this way, by having the protrusions 42 spaced apart from the mounting terminals 16c (protruding like eaves), it is possible to prevent the protrusions 42 spaced apart from the mounting terminals 16c from interfering with the formation of the fillets 19. In particular, since the fillet 19 tends to be biased toward the mounting terminal 16c due to its own weight, providing the gap 42a between the protrusion 42 and the mounting terminal 16c can effectively prevent the formation of the fillet 19 from being impeded. If it is difficult to form the protrusions 42 when injection molding the base 4b, the protrusions 42 may be attached to other parts of the base 4b later.

[0056] The above-described embodiments and modifications encompass the following technical ideas. (1) a base having an opening and a mounting portion within the opening; a chip electronic component mounted on the mounting portion, the mounting portion has at least one pair of mounting terminals for mounting the chip electronic component; the base has a concave-convex portion formed on the edge portion of the opening, The uneven portion is configured by a recess and a protrusion, and protrudes and is recessed at the edge portion of the opening in the direction in which the pair of mounting terminals are arranged, The antenna device is characterized in that the convex portion defines a mounting space for the chip electronic component, and the mounting space is defined at a position where at least one pair of terminals in the chip electronic component faces the pair of mounting terminals. (2) The pair of mounting terminals are arranged with a gap therebetween, The antenna device described in (1), wherein the sum of the length of the protrusion from the recess into the mounting space and the longitudinal dimension of the chip electronic component is longer than the shortest length from the recess to the mounting terminal of the pair that is distal to the gap. (3) The antenna device according to (1) or (2), wherein the uneven portion is provided on each of the surfaces of the edge portion of the opening that face each other in the arrangement direction of the pair of mounting terminals. (4) The antenna device according to any one of (1) to (3), wherein the protrusion is narrower on the protruding side in a plan view relative to the opening. (5) The antenna device according to (4), wherein the convex portion is formed so as to gradually narrow on the protruding side in a plan view relative to the opening. (6) The antenna device according to any one of (1) to (5), wherein the upper surface of the convex portion is perpendicular to the mounting surface of the mounting terminal and slopes downwardly toward the mounting surface as it moves toward the center of the opening within an imaginary plane including the arrangement direction of the pair of mounting terminals. (7) The antenna device according to any one of (1) to (6), wherein the protrusion is disposed apart from the mounting terminal in the mounting direction. (8) An antenna device described in any one of (1) to (7), wherein, in a planar view of the opening, the length of the convex portion is shorter than the length of the mounting terminals in a direction perpendicular to the arrangement direction of the pair of mounting terminals. (9) The antenna device according to (8), wherein the protrusion is disposed in a central portion of the mounting surface in a direction perpendicular to an arrangement direction of the pair of mounting terminals in a plan view of the opening. (10) The antenna device according to any one of (1) to (9), wherein the mounting terminal is a metal terminal insert-molded into the base. (11) The antenna device according to any one of (1) to (10), wherein the mounting terminal is a thin film of conductive material printed on the base. [Explanation of symbols]

[0057] 1 Antenna device 3 cores 4 Base 4a bobbin 4b bass 4e opening 4g Edge 5 coils 12 Capacitor chips (chip electronic components) 12a terminal 16 Lead Frame 16a Land (mounting part) 16c Mounting terminal 16d gap 16e Mounting surface 19 Fillet 20 Uneven part 21 Recess 22, 32, 42 convex parts 22a Top side 42a Gap

Claims

1. a base having an opening and a mounting portion within the opening; a chip electronic component mounted on the mounting portion, the mounting portion has at least one pair of mounting terminals for mounting the chip electronic component; the base has a concave-convex portion formed on the edge portion of the opening, The uneven portion is configured by a recess and a protrusion, and protrudes and is recessed at the edge portion of the opening in the direction in which the pair of mounting terminals are arranged, The antenna device is characterized in that the convex portion defines a mounting space for the chip electronic component, and the mounting space is defined at a position where at least one pair of terminals in the chip electronic component faces the pair of mounting terminals.

2. The pair of mounting terminals are arranged with a gap therebetween, 2. The antenna device according to claim 1, wherein the sum of the length of the protrusion from the recess into the mounting space and the longitudinal dimension of the chip electronic component is longer than the shortest length from the recess to the mounting terminal of the pair that is distal to the gap.

3. The antenna device according to claim 1 , wherein the uneven portion is provided on each of the surfaces of the edge portion of the opening that face each other in the direction in which the pair of mounting terminals are arranged.

4. The antenna device according to claim 1 , wherein the protrusion is narrower on the protruding side in a plan view with respect to the opening.

5. The antenna device according to claim 4 , wherein the protrusion is formed so as to gradually narrow on the protruding side in a plan view of the opening.

6. 4. The antenna device according to claim 1, wherein the upper surface of the convex portion is perpendicular to the mounting surface of the mounting terminal and slopes downwardly in an imaginary plane including the arrangement direction of the pair of mounting terminals so as to approach the mounting surface as it moves toward the center of the opening.

7. The antenna device according to claim 1 , wherein the protrusion is disposed at a distance from the mounting terminal in a mounting direction.

8. The antenna device according to claim 1 , wherein a length of the protrusion is shorter than a length of the mounting terminal in a direction perpendicular to an arrangement direction of the pair of mounting terminals in a plan view of the opening.

9. The antenna device according to claim 8 , wherein the protrusion is disposed in a central portion of the mounting surface in a direction perpendicular to an arrangement direction of the pair of mounting terminals in a plan view of the opening.

10. The antenna device according to claim 1 , wherein the mounting terminal is a metal terminal that is insert-molded into the base.

11. The antenna device according to claim 1 , wherein the mounting terminal is a thin film of conductive material printed on the base.

Images