Integrated functional multilayer structure and method of manufacturing the same

Abstract

The integrated functional multilayer structure (100) comprises a substrate film (102) formed or formable to assume a selected shape (103), and several functional, preferably optical, mechanical, opto-electrical, electrical and / or especially electronic elements (110, 112, 114, 210), such as conductors (112), insulators (114), components (110, 210) and / or integrated circuits (110, 210), provided on the substrate film in the vicinity of the shape (103). Such substrate films (102) are optionally further provided with structural adjustment elements (116, 316, 416, 616, 716, 816, 916, 1016) including elongated structural adjustment elements (316, 416), circumferential structural adjustment elements (616, 716), or other selected shapes, said structural adjustment elements configured to locally control induced deformation, optionally stretching, bending, compression, and / or shear, of the substrate film within said vicinity of the shape. Related manufacturing methods are presented.

Description

[Technical Field]

[0001] The present invention relates generally to functional integrated structures incorporating functional features such as electronic, mechanical, or optical elements. Specifically, but not exclusively, the present invention relates to situations in which the substrate layer of the structure is subjected to processing activities that cause deformation thereof. [Background technology]

[0002] For example, in the field of electronics and electronic products, there are a variety of different stacked assemblies and multi-layer structures associated with different functional assemblies. For example, the motivations behind the integration of functionality involving electronic, mechanical, and optical features can be as diverse as the relevant use situations. Size savings, weight savings, cost savings, or even just efficient integration of components are relatively often pursued, for which the resulting solution ultimately exhibits multi-layered functionality. Relevant use scenarios can then relate to product packaging or casings, visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicle electronics, and the like.

[0003] Electronics, such as electronic components, ICs (integrated circuits), and conductors, can generally be provided on substrate elements by several different techniques. For example, prefabricated electronics, such as various surface-mounted devices (SMDs), can be attached to substrate surfaces that ultimately form the inner or outer interface layers of multilayer structures. In addition, technologies that fall under the term "printed electronics" can be applied to actually fabricate electronics directly and additively on the associated substrate. The term "printing," in this context, refers to various printing techniques that can produce electronics / electrical elements from printed matter through a substantially additive printing process, including, but not limited to, screen printing, flexography, and inkjet printing. The substrates used can be flexible, but are not necessarily organic printed matter.

[0004] Furthermore, the concept of injection-molded structural electronics (IMSE) involves building functional devices and their components in the form of multilayer structures, which encapsulate electronic functionality as seamlessly as possible. Another characteristic of IMSE is that electronics are typically manufactured in true three-dimensional (3D) (non-planar) shapes according to a 3D model of the target product, component, or generally the entire design. To achieve the desired 3D layout of electronics on the 3D substrate and within the associated end product, electronics can still be provided on an initially planar substrate, such as a film, using two-dimensional (2D) methods of electronics assembly. The substrate already housing the electronics can then be formed into the desired three-dimensional, i.e., 3D, shape and overmolded, for example, with a suitable plastic material that covers and embeds the underlying elements, such as the electronics, thus protecting and potentially hiding them from the environment. Additional layers and elements can be naturally added to the construction.

[0005] When elements, particularly non-electronic, but also mechanical, optical, or electrical components, are manufactured or mounted on a film-type substrate, e.g., a thermoplastic film, a fabric, or a leather sheet, other surrounding layers that are at least indirectly connected to the substrate or the element may subsequently be subjected to forces, e.g., involving twisting, stretching, compression, or bending, which may cause the element, if not the substrate itself, to break or become detached from the attached element.

[0006] With respect to elements such as electronics packages (e.g., thin quad flat packages (TQFPs)) or other components that arguably have many favorable properties, such as fairly manageable contact densities from the standpoint of IMSE technology, it has further been found that such elements can easily trap air underneath them during various processing steps, such as overmolding, which can then reduce the actual size of the associated contact areas.

[0007] However, direct embedding of common elements, such as those found in TQFPs and other packages, or in hard resins, has not proven to be a fully applicable approach, especially in scenarios involving wide temperature ranges due to the large mismatch in coefficients of thermal expansion (CTE) between the features involved, which can ultimately lead to structural failure and failure. Larger packages or elements can be challenging because associated contacts can be torn or lost during certain processing steps, such as forming (e.g., thermoforming) of the hosting substrate film.

[0008] When there is a dramatic change in the stiffness of the structure, considering its location on the substrate film at the edge of a potentially underfilled element, such as a component or module, large transient forces of film deformation caused by, for example, stretching during thermoforming can appear, which in turn causes excessive stresses in potentially more vulnerable adjacent materials, such as insulating layers, conductive and / or colored inks.

[0009] In general, when elements such as conductor traces or associated crossover structures are positioned near drastic radii in terms of the surface contour of the hosting substrate film, the elements can tear and fail. For example, the conductive inks used in crossovers can be more brittle than standard conductive inks, which increases the risk of failure, for example, near insulator boundaries and at significant substrate curvatures. Insulator prints are often more tolerant of stretching, thus causing transient deformation at their edges, most importantly where the insulator terminates and the overlying crossover conductive ink connects to more standard conductive ink.

[0010] Additionally, in scenarios where large features such as shielding hatches or antennas are established on a 3D (substrate) surface from a rigid material such as conductive ink (as opposed to a substrate such as a plastic film itself), the harder material may have undesirable effects such as deformation, creases, or tears in the surrounding features on the film and the film itself, potentially ruining the workpiece. Summary of the Invention

[0011] It is an object of the present invention to at least alleviate one or more of the drawbacks associated with known solutions in the context of integrated structures where at least some of the included or future included features, such as, for example, the substrate (film), are subjected to deformation-inducing forces, for example during processing or manufacturing of the structure, installation of the structure or use of the structure.

[0012] The objectives are achieved by various embodiments of an integrated functional multi-layer structure and related methods for providing an integrated functional multi-layer structure.

[0013] According to a first aspect, an integrated functional multilayer structure is provided. The multilayer structure includes a substrate film formed or formable (optionally thermoformed) to assume a selected, preferably three-dimensional, non-planar shape. Furthermore, the multilayer structure includes several functional elements, preferably including, for example, optical, mechanical, photoelectric, electrical, and / or particularly electronic functional elements, such as conductors, e.g., traces or "wiring," insulators, components, and / or integrated circuits, provided on the substrate film in proximity to the formed non-planar shape. The substrate film is optionally further provided with structural adjustment elements, including or defining elongated, circumferential, and / or other selected shapes. The structural adjustment elements are configured to locally control, for example, process-induced deformation, such as, for example, formation-induced deformation, optionally including stretching, bending, compression, and / or shearing of the substrate film within the aforementioned vicinity of the shape that includes or consists of the formed non-planar shape. The structural tuning elements may, for example, comprise electrically conductive materials (e.g., conductive inks) or electrically insulating materials (e.g., insulating inks, or, for example, plastics / polymers, ceramics, or glasses). The tuning elements may, for example, be generally attachable or printable.

[0014] A substrate film included in a multilayer structure may refer to an element in which one of the three dimensions (e.g., z, as in "thickness") is significantly shorter than the other two dimensions (e.g., x and y). The substrate film may be flexible or bendable at least in places, although it may be essentially flat.

[0015] In a preferred embodiment, the multilayer structure is manufactured on a substrate film, optionally molded, such as by injection molding, or cast, and may further comprise a plastic, optionally thermoplastic, layer having at least a portion of some functional and / or structurally adjusting elements embedded therein.

[0016] In various embodiments, the substrate film can define or at least locally include a 3D, preferably thermoformed, non-flat shape, and the structural adjustment element can be configured to control deformation of the substrate within the vicinity of the 3D non-flat shape, preferably including control over the distribution of deformation forces in selected directions.

[0017] However, one or more of the functional elements may include, for example, a subassembly having its own substrate (a "sub-substrate") and an element such as an electrical or particularly electronic component hosted by the (sub-)substrate, such as an electrical node.

[0018] In various embodiments, instead of or in addition to disposing functional elements, such as electrical elements, on a substrate film so that they substantially protrude from any side of the substrate film, the functional elements can be provided in recesses, blind holes, or through-holes established in the substrate film. Recesses can be obtained, for example, by shaping, e.g., thermoforming, the substrate film before or after providing the functional elements thereon, such that the recess shape is defined by the substrate film. Holes, such as through-holes or blind holes, can be obtained, for example, by removing substrate material or establishing the substrate directly (e.g., by molding) from the relevant source material to define the hole. Thus, elements may be at least partially accommodated by recesses or holes in the substrate so that they do not protrude at all from the substrate film, or so that they at least protrude significantly or completely. Smaller recesses may still remain in place of the elements, optionally partially filled by a molded or cast material layer or other feature. The substrate film may be provided with a flat first surface by embedding the functional elements therein.

[0019] In various embodiments, the structurally adjusting element may be in contact with or adjacent to at least one of several functional elements.

[0020] In various embodiments, the structural adjustment elements may alternatively or additionally be configured to locally limit, reduce or increase deformation of the substrate film.

[0021] In various embodiments, the structural adjustment element can be configured to limit, reduce or increase the slope of the deformation, limit, reduce or increase the magnitude of the change in slope, shift the deformation region, shape the deformation region, limit, reduce or increase the magnitude of the deformation, and / or extend or reduce the length of the deformation region or transition between the deformation region and an adjacent, optionally substantially flat, substrate portion.

[0022] In various embodiments, the structural adjustment element may alternatively or additionally comprise a first material that is harder and preferably more tear-resistant than a second material contained in either the substrate, any material layer thereon, or the functional element, or vice versa.

[0023] In various embodiments, alternatively or additionally, the structural adjustment element may include an optionally printed, preferably insulating or conductive, element configured to reduce and / or move the slope and / or transition area caused by deformation of the substrate film at the location of at least one functional element of the several functional elements, the preferably insulating or conductive element optionally being integral with or adjacent to an electrically insulating or conductive crossover element such as a crossover print, and further optionally establishing an extension of the crossover element.

[0024] In various embodiments, the structural adjustment element may alternatively or additionally include at least a portion configured to extend toward and optionally widen or reduce the maximum extent of deformation or associated tilt from the functional element.

[0025] In various embodiments, the structural adjustment element may alternatively or additionally comprise, or may essentially or solely consist of, at least one element selected from the group consisting of a mechanical element, an optically functional element, a printed electronics technology provided element, an electrically insulating element, a conductive element, a printed electronics provided electrically insulating element, a printed electronics provided conductive element, an additively generated element, a sputtered element, a deposited element, a vacuum deposited element, an etched element, an additively generated conductive element, an additively generated electrically insulating element, an engraved element, a thinned or thickened portion of a larger element such as a conductive element or an electrically insulating element, a cavity, a recess, a through-hole, an ablation-generated element, an ablation-generated conductive element, an ablation-generated electrically insulating element, a physical extension of a conductive element such as a conductor trace or contact pad, a physical extension of an electrically insulating element such as an insulator fill or an electrical crossover insulating layer, and an optical function such as a transmissive, refractive, diffractive, opaque, absorptive, scattering, or reflective element.

[0026] In various embodiments, alternatively or additionally, the structural adjustment element may include at least a portion of a frame that is circumferentially aligned with any of the functional elements on the substrate film, and the at least a portion of the frame optionally includes a conductive material such as conductive ink, silver ink, dielectric ink or other electrically insulating material, color ink, adhesive, and / or SMD adhesive.

[0027] In various embodiments, alternatively or additionally, the structural adjustment element may be further configured to guide, restrict, or prevent the flow of a material, optionally an underfill, conductive adhesive, conductive or insulating ink, wetting agent, surface energy influencer, or glob-top material, flowably disposed on either the substrate film or the functional element, so that the material remains within a circumferential boundary zone defined by the structural adjustment element. The zone may have a selected shape, area, and / or volume as at least partially defined by the adjustment element. Thus, in this and other embodiments, the material of the adjustment element may be configured to define guiding structures such as walls, conduits, grooves, and / or receptacles for desired control of the flow of the target material.

[0028] In various embodiments, the structural adjustment element may alternatively or additionally comprise a frame, optionally a snap-on or printed frame, connected to or at least adjacent to at least one of several functional elements, optionally, for example, an electronics package, a mechanical or optical element.

[0029] The multilayer structure, the adjustment element, and / or specifically, for example, the frame described above, optionally further comprises at least one element selected from the group consisting of an adhesive between the substrate film and the functional element, a spacer between the substrate film and the functional element, a mechanical barrier element, an optical barrier element, an electrically insulating barrier element, a barrier element between conductive portions or between elements on the substrate film and / or the functional element, a viscous conductive adhesive disposed on conductive portions such as leads of the functional element, preferably a low viscosity capillary flowable underfill between the substrate film and the aggregate of the frame and the functional element, and an embedding material layer such as a glob top layer at least on the aggregate of the frame and the functional element.

[0030] When the structural adjustment element defines a guiding structure such as a conduit or receptacle for a flowable material such as a conductive adhesive, ink, solder, wetting agent, surface energy affecting substance, and / or underfill material, the guiding structure may be configured in particular to allow the flowable material, in its flowable state, to contact a functional element of several functional elements and, preferably, to flow towards or away from the functional element after provision of an element on or adjacent to the guiding structure.

[0031] In various embodiments, the structural adjustment element may alternatively or additionally comprise a mechanical stress relief structure, preferably including a plurality of fins, teeth and / or gradually expanding or contracting elongated features.

[0032] In various embodiments, the structural adjustment element may alternatively or additionally comprise an optionally printed (printed electronics) pattern, which may be defined by or at least incorporate a plurality of, e.g., non-linear or piecewise linear and / or discontinuous, preferably repeating and / or alternating shapes, optionally including chevrons, the area spanned by the pattern optionally defining electromagnetic shielding or antenna radiation, such as an antenna structure.

[0033] In various embodiments, the structural adjustment element may alternatively or additionally include an optionally printed gradient pattern having several repeating geometric shapes that gradually vary in size and / or other properties within the pattern, or a diffuser pattern having a substantially uniform shape.

[0034] Additionally, in some embodiments, the pattern may be configured for light control, such as irradiation, treatment, or coupling, optionally incoupling or outcoupling, to the substrate film or elements thereon.

[0035] According to a second aspect, there is provided a method for producing an integrated multi-layer structure, the method comprising: - obtaining a substrate film comprising a formable, optionally thermoformable, material; - providing several functional elements, including at least one functional element, on a substrate film, The substrate film preferably further comprises structural tuning elements within the vicinity of any of the aforementioned functional elements, which are configured to locally control process-induced deformation of the substrate.

[0036] In various embodiments, the method may further include forming the substrate film to exhibit a selected deformation, optionally including a three-dimensional non-flat shape, in the vicinity of the functional element.

[0037] In various embodiments of the method, the structural adjustment elements may be preferably arranged to control deformation of the substrate within the vicinity of the three-dimensional non-flat shape, including control over the distribution of deformation forces during non-flat shape-induced deformation of the substrate film.

[0038] In various embodiments, the method may alternatively or additionally include producing, preferably by molding, such as injection molding or casting, a plastic layer on the substrate film, at least partially embedding one or more of the functional elements and / or structural adjusting elements.

[0039] For example, a film-like and / or receptacle-type mold, preferably reusable or disposable, can be utilized to contain and shape the material of the molding material layer during solidification, the mold optionally comprising at least one element selected from the group consisting of metal, plastic, fiber, wood, textile or fabric, lignin, ceramic, and sacrificial material. In some embodiments, at least a portion of the mold layer or the like can also establish a portion of the finished structure, e.g., a (protective) layer thereon.

[0040] In various embodiments of the method, alternatively or additionally, the structural adjustment elements may be provided on the substrate film using at least one technique selected from the group consisting of additive manufacturing techniques, printing, attaching, sputtering, deposition, preferably using selected printed electronics techniques, and removal processes such as etching, cutting or engraving of the substrate film or elements thereon.

[0041] The present invention naturally offers different advantages over a wide variety of known solutions depending on each particular embodiment. One major advantage is that various embodiments of the present invention allow for more complex and more reliable IMSE designs, since substrate deformation can be better, e.g., more precisely controlled, e.g., with respect to location and extent. The enhanced control of deformation in various embodiments of the present invention results in less damage and / or dislodgment of functional elements, e.g., fragile components.

[0042] Various other advantages will become apparent to those skilled in the art based on the following detailed description of several embodiments of the invention.

[0043] The term "some" as used herein may refer to any positive integer starting from one (1).

[0044] The term "plurality" may refer to any positive integer starting from two (2) respectively.

[0045] The terms "first," "second," "third," and "fourth" are used herein to distinguish one element from other elements and do not dictate any special priority or ordering among them unless expressly stated otherwise.

[0046] The exemplary embodiments of the present invention presented herein should not be construed as imposing limitations on the applicability of the appended claims. The verb "comprises" is used herein as an open limitation that does not exclude the presence of unrecited features. Features recited in the various embodiments and, for example, dependent claims can be freely combined with each other unless expressly stated otherwise.

[0047] The novel features which are believed characteristic of the invention are set forth with particularity in the appended claims. However, the invention itself, both as to its structure and its method of operation, together with additional objects and advantages thereof, will best be understood from the following description of specific embodiments when read in connection with the accompanying drawings. [Brief explanation of the drawings]

[0048] [Figure 1] 1 illustrates one embodiment of a multi-layer structure according to the present invention. [Figure 2] The potential element disposed on the base film of the multilayer structure, specifically, in this example, an embodiment of a functional component such as an electrically functioning node type, is shown. [Figure 3] 1 illustrates one embodiment of a structural adjustment element according to the present invention. [Figure 4] For example, one embodiment of a structural adjustment element that may be provided in association with crossover and / or joint structures on a substrate is shown. [Figure 5] 1 shows a circuit design provided on a substrate to receive electronic components and provide electrical connections therebetween. [Figure 6] 1 illustrates one embodiment of a structural adjustment element associated with a functional element such as an electronic component. [Figure 7] 1 illustrates one embodiment of a structural adjustment element. [Figure 8] 1 illustrates one embodiment of a gradient type pattern for use as a structural adjustment element and / or other functional element, such as an optical functional element. [Figure 9]10 shows a further embodiment of a patterned structural adjustment element. [Figure 10] 1 illustrates a use case of one embodiment of a structural adjustment element in relation to a three-dimensional substrate and an overall structure. [Figure 11] 1 is a flow diagram of one embodiment of a method in accordance with the present invention. [Figure 12] Two embodiments of structural adjustments and associated adjustment elements are shown in relation to transitions or joints of materials or elements. [Figure 13] 1 illustrates one embodiment of a structural adjustment element associated with a joint structure of two elements such as conductors. DETAILED DESCRIPTION OF THE INVENTION

[0049] 1 illustrates one embodiment of a multi-layer structure 100, such as an integrated function multi-layer structure 100, in accordance with the present invention. The structure 100 may itself establish an end product, such as, for example, an electrical or electronic device, or may be connected to or installed in such a product after manufacture.

[0050] The multilayer structure 100 may include a substrate film 102, such as a flexible substrate film, formed or formable to exhibit a selected shape 103, e.g., a 3D shape such as a bend, a recess, a protrusion, etc. The structure 100 may further include several functional elements 110, 112, 114, including optical, mechanical, optoelectronic, electrical, and / or especially electronic functional elements, such as conductors 112, insulators 114, components 110, and / or integrated circuits 110, preferably provided on the substrate film 102 adjacent to the shape 103. The substrate film 102 may optionally further be provided with structural adjustment elements 116 or elements 116 having an elongated, circumferential, or other selected shape. The structural adjustment element 116 may be configured to locally control (limit or reduce) induced deformation, such as deformation induced by (thermo)forming, other processes, or time in use, including, for example, essentially in the transition region 103B, optionally including stretching, bending, compression, and / or shearing of the substrate film 102 within said proximity of the shape 103. For example, such control may be preferred to avoid the functional element 110 being broken, detached, or otherwise disturbed by the shape 103. As shown in FIG. 1 , the structural adjustment element 116 may be at least partially located within the transition region introduced into the substrate film 102 by the shape 103. The functional element 110 may be considered to be present within (at the edge of) or at least adjacent to the transition region 103B.

[0051] In various additional or supplemental embodiments, at least a portion of some functional elements, such as connection / contact elements such as conductors and / or pads, comprise at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, alloys, silver alloys, zinc, brass, titanium, solder, and any component thereof. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength, such as visible light, and thus mask or reflect therefrom, absorb therein, or allow radiation, such as visible light, to pass therethrough.

[0052] In various embodiments as shown in FIG. 1, the multilayer structure 100 is fabricated on a substrate film 102, optionally molded, such as by injection molding, or cast, and may further include a plastic, optionally thermoplastic, layer 104 having at least a portion of several functional elements 110, 112, 114 and / or structural adjustment elements 116 embedded therein.

[0053] 1, the multilayer structure 100 can include a second substrate 106, such as a second substrate film, disposed on the opposite side of the plastic layer 104 from the substrate film 102. In such embodiments, the plastic layer 104 can be manufactured, optionally molded, such as by injection molding or cast molding, between the substrate film 102 and the second substrate 106, and can have at least a portion of some of the functional elements 110, 112, 114 and / or the structural adjustment element 116 embedded therein.

[0054] Additionally, first connections 108, arranged in a wired manner, e.g., providing an electrical connection, or arranged wirelessly, e.g., by wireless electrical, photoelectric, or optical means, may be arranged to extend through or across plastic layer 104. Optionally, first connections 108 may be configured to connect or provide a connection between at least one functional element 110, 112, 114, or any element on substrate film 102, and second substrate 106, such as a functional element thereon.

[0055] As mentioned above, the substrate film 102 may include a 3D, optionally thermoformed, or otherwise (e.g., during the process of use or manufacture of the induced multilayer structure 100) non-planar shape 103. The induced shape 103 may be essentially permanent (molded, punched, cut, or, for example, a thermoformed shape) or temporary (e.g., remaining while an external force is exposed to the structure 100 or an element such as the film 100). The structure-adjusting element 106 may be configured to control deformation of the substrate film 102 within the vicinity of the 3D non-planar shape, preferably including control over the distribution of deformation forces in a selected direction, for example, as shown in FIG. 1 by the tangent 118 or slope 118 of the surface of the substrate film 102 substantially at the location of the non-planar shape 103 or at the transition region 103B.

[0056] The utilized substrate film 102 and optional second substrate film 106 may refer to a rigid or flexible (and bendable) substrate film in which one of three dimensions (e.g., "thickness") is significantly shorter than the other two dimensions (e.g., x and y). Thus, the substrate films 102, 106 may, at least originally, be essentially flat or planar substrates. However, the substrate films 102, 106 may generally or locally define a 3D shape 103, e.g., a curved or bent shape, either originally or after processing such as 3D forming (e.g., thermoforming).

[0057] In various embodiments, the substrate films 102, 106 can include or consist of materials such as plastics, e.g., thermoplastic polymers, and / or organic or biomaterials, for example, wood, leather, or fabric, or combinations of any of these materials with each other or with plastics, polymers, or metals. The substrate film 102 can include or consist of a thermoplastic material. The thickness of the film can vary depending on the embodiment and can be only tens or hundreds of millimeters, or can be quite thick, for example, on the order of one or several millimeters.

[0058] The substrate film 102, and optionally the second substrate (film) 106, may comprise at least one material selected from the group consisting of, for example, polymers, thermoplastic materials, electrically insulating materials, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyesters, copolyester resins, polyimides, copolymers of methyl methacrylate and styrene (MS resins), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural textile or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination thereof. If the second substrate 106 is present, it may differ, for example, in size, shape, and / or material from the first substrate film 102.

[0059] As mentioned herein, in various embodiments, the material of the substrate films 102, 106 and / or additional layers may be at least partially optically substantially opaque or at least translucent with respect to predetermined wavelengths, e.g., in the visible spectrum. This is also applicable, for example, to the molded or cast plastic layer 104. Related elements, such as film-type substrates, coatings, or other layers, optionally defining at least a portion of the exterior (surface) of the multilayer structure 100 or at least visible or otherwise perceptible through it, may be provided with some visually distinguishable, decorative / aesthetic, and / or informational features, such as graphic patterns and / or colors thereon or therein. The features may be provided on the same side of the substrate film 102 as the functional elements 110, 112, 114, or on the opposite side, so that they are also at least partially sealed, and thus may or may not be sealed by the material of the plastic layer 104, for example, through an associated overmold. Therefore, IML (in-mold labeling) / IMD (in-mold decoration) techniques are applicable. The materials used may be at least partially, i.e., at least in places, substantially optically transparent to radiation, such as visible light emitted by electronics, for example. The transmittance may be, for example, 80%, 85%, 90%, 95% or more.

[0060] Referring to the plastic layer 104, it may comprise a thermoplastic and / or thermosetting material. The thickness of the molded or otherwise manufactured layer may vary depending on the embodiment. It may be, for example, less than a millimeter, a millimeter, several millimeters, or tens of millimeters in size. The material may be, for example, electrically insulating. The layer may comprise at least one material selected from the group consisting of elastomeric resins, thermosetting materials, thermoplastic materials, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone sulfite), and MS resin.

[0061] In various embodiments, selected features, including, for example, graphics, coloring, or other visual features, can be provided on an interior surface or layer of structure 100. Thus, different impacts, friction, chemicals, etc., that can easily damage, for example, painted, printed, or attached surface features, do not affect or reach the embedded / non-surface features. A cover layer, such as a film or elastic (filler) material, can be manufactured or processed, and optionally cut, engraved, etched, or drilled, into a desired shape with the required characteristics, such as holes or cutouts, necessary to expose selected areas of the material layer or underlying features, such as electrical elements, to the environment.

[0062] Below, various examples of structural coordination elements 116 are described, which refer to a single element or a group of components that together establish the coordination element 116 from a functional standpoint. An embodiment may describe properties of the structural coordination element 116 that may be present either explicitly or in combination with one or more of the properties described in relation to others of the preceding embodiments.

[0063] The structural adjustment elements 116 according to various embodiments of the present invention may include at least one element selected from the group consisting of mechanical elements, optically functional elements, printed electronics technology provided elements, electrically insulating elements, conductive elements, printed electronics provided electrically insulating elements, printed electronics provided conductive elements, additively generated elements, sputtered elements, deposition elements, vacuum deposited elements, etching elements, additively generated conductive elements, additively generated electrically insulating elements, engraved elements, thinned or thickened portions of larger elements such as conductive or insulating elements, cavities, recesses, through holes, ablation or ablation generated elements, ablation generated conductive elements, ablation generated electrically insulating elements, physical extensions of conductive elements such as conductor traces or contact pads, physical extensions of electrical insulating elements such as insulator fills or electrical crossover insulating layers, and optical functions such as transmissive, refractive, diffractive, opaque, absorptive, scattering or reflective elements.

[0064] In various embodiments, the structural adjustment element 116 may preferably be in contact with or adjacent, preferably proximate to, at least one of several functional elements 110, 112, 114. In FIG. 1, for example, the structural adjustment element 116 in the illustrated transition region 103B is in contact with or at least adjacent to element 110.

[0065] In various alternative or additional embodiments, the structural adjustment element 116 can be configured to locally limit, reduce, or increase deformation of the substrate film 102. In FIG. 1 , for example, the structural adjustment element 116 is positioned adjacent to the element 110 to locally stiffen the substrate film 102. Thus, as shown on the left side of FIG. 1 , when the shape of the substrate film 102 changes, i.e., is deforming, the structural adjustment element 116 prevents or at least reduces deformation of the substrate film 102 in the transition region 103B (indicated by the dashed oval) relative to the shape 103. For example, in FIG. 1 , if the structural adjustment element 116 were not present in the substrate film 102 on the left side, the tangent line 118 would deviate further from horizontal (i.e., have a higher slope / gradient), meaning that deformation would create more severe stress on the element 110, which could even cause the substrate film 102 to delaminate or break during deformation.

[0066] In various alternative or additional embodiments, the structural adjustment element 116 can be configured to limit, reduce, or increase the slope 118 of the deformation, for example, as described above. Alternatively or additionally, the structural adjustment element 116 can limit, reduce, or increase the magnitude of the change in slope 118. Further, alternatively or additionally, the structural adjustment element 116 may move or shape the deformation region 103B. Alternatively or additionally, the structural adjustment element 116 can limit, reduce, or increase the magnitude of the deformation 103B and / or extend or reduce the length of the transition region 103B or the transition between the transition region 103B and an adjacent, optionally substantially flat, substrate portion.

[0067] However, a functional element or elements may also include, for example, a subassembly having its own substrate (a "sub-substrate") and elements such as electrical or especially electronic components hosted by the (sub-)substrate. An example of this is shown in FIG. 2, which includes electrical functional node components 110, 210 that can be considered as a whole functional element 110.

[0068] FIG. 2 illustrates an embodiment of a potential functional element 110, specifically a functional node component 210, such as an electrical function in this example, disposed on the substrate film 102 of the multilayer structure 100. In FIG. 2, an exploded view of one embodiment of the node 110, 210 is shown. The node 110, 210 may include, for example, a functional element such as electronics on the substrate film 102 (potentially multiple layers), a first material layer 208 or filler material 208, a shell 210, printing, underfill 206, and a protective pattern 202 such as electrical contacts 204. Optionally, at least a portion or even the entire node 110, 210 may be encapsulated or embedded, such as protected, by a plastic layer 104, 212, such as an injection-molded plastic layer. The layer 212 may be, for example, a thermoplastic material.

[0069] 2 , for example, the protective pattern or print 202 may include, as at least a portion thereof, at least a portion of the structural adjustment element 116, according to some embodiments of the present invention. Thus, the protective pattern 202 on the substrate film 102 may include the structural adjustment element 116, which may include an elongated shape, for example, on a peripheral portion of the pattern 202. The structural adjustment element 116 may be configured to locally limit, reduce, or increase deformation of the substrate film 102, for example, near the connector pins of the electrical nodes 110, 210.

[0070] In various embodiments, the first layer of material 208 may define at least a portion of the outer surface of the nodes 110, 210. However, as will be understood by those skilled in the art, the first layer of material 208 may be covered, at least in places, i.e., selectively, by a further material such as a selected coating or film layer, or by an optionally thicker layer of material 212, such as one that may be molded or cast over the nodes 110, 210, particularly upon installation within a host structure, e.g., on a host substrate.

[0071] The substrate film 102 utilized in the node 210 or related host structure, as previously contemplated herein, may refer to a stiff, flexible substrate, for example, having one of its three dimensions (e.g., z, such as "thickness") significantly shorter than the other two dimensions (e.g., x and y). Typically, the substrate film is made of or provided with an electrically insulating material.

[0072] In various embodiments, it is preferred that at least one material of first layer of material 208 have a hardness of, for example, about 85 Shore Scale A or less or about 40 Shore Scale D or less.

[0073] In various embodiments, the modulus of elasticity of at least one material of first layer of material 208 is preferably about 2000 MPA or less, more preferably about 500 MPA or less, and most preferably about 100 MPA or less.

[0074] Thus, a relatively soft material (lower hardness and / or lower modulus of elasticity) may be applied as at least one component of the first material layer 208 (e.g., base or filler), if not substantially completely constitutes it.

[0075] In various embodiments, the first material layer 208 is preferably flowable / flowable, and then preferably solidified, and provided in contact with the first material layer, and optionally adhered to a plastic material, preferably selected from the group consisting of thermoplastic materials, polymers or similar materials, lignin or similar materials, TPU, polymers, elastomeric materials, PC, PMMA, ABS, PET, PA (polyamide), GPPS, PCPA (pentachlorophenyl acrylate), cellulosic thermoplastic materials, and MS resins. The plastic material may be, for example, molded or cast onto the first material layer and the nodes generally.

[0076] In various embodiments, first material layer 208 is then provided in contact with first material layer 208 and may optionally be adhered to a material selected from the group consisting of metal, wood, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, leather, fabric or textile, natural leather, natural textile or textile material, textile material, cotton, wool, linen, silk, moldable material, heat formable material, cold formable material, epoxy, multi-component epoxy, ink, and conductive ink.

[0077] In various embodiments, the first material layer 208 may be selected and / or treated to adhere to the material of the substrate film 102 and / or to the material of at least one of the aforementioned functions or, specifically, the electrical element, and the relevant material is preferably a polymer, a conductive polymer, a thermoplastic material, an organic material, an elastomeric material, an electrically insulating material, PMMA (polymethyl methacrylate), polycarbonate (PC), polyimide, a copolymer of methyl methacrylate and styrene (MS resin), glass, an organic material, a fibrous material, a poly The material comprises at least one material selected from the group consisting of ethylene terephthalate (PET), metal, wood, solid wood, veneer, plywood, bark, tree bark, tree bark, birch bark, cork, (natural) leather, (natural) textile or fabric material, textile material, cotton, wool, linen, silk, formable material, thermoformable material, cold formable material, gold, copper, silver, palladium, solder resist, thermosetting solder resist, UV curable solder resist, epoxy, lignin or similar material, cellulose based material, multi-component epoxy, ink, conductive ink.

[0078] In various embodiments, first material layer 208 may include or consist of a material associated with a coefficient of thermal expansion (CTE) that falls within the range of about 1-300 ppm / K, more preferably about 10-200 ppm / K, and most preferably about 25-80 ppm / K. Thermal expansion properties, such as the coefficient, of a particular material may vary significantly with temperature, which one skilled in the art must recognize when considering the applicability of various materials in light of such properties and in light of the temperatures to which the associated material may ultimately be subjected, for example, during use or storage of the associated node. Similar considerations apply to the elasticity of the material.

[0079] In various embodiments, the first material layer 208 may include a composite material and / or some filler in a host material, the first material layer optionally includes or consists of multiple sub-layers, and / or the first material layer includes materials, preferably organized in sub-layers, of different compositions that have characterizing functional properties such as refractive index or other optical properties to establish a selected optical functionality.

[0080] In various embodiments, the first material layer 208 can include or consist essentially of a thermally conductive material, which is optionally provided in the form of one or more fillers, which can be mixed, for example as particles, with other potentially predominant materials of the first material.

[0081] In various embodiments, first material layer 208 can include or consist essentially of an essentially transparent and / or colorless material that is optically, optionally with respect to selected wavelengths including visible light, substantially chemically inert, preferably to discoloration when exposed to heat or high-energy photons. The material of first material layer 208 can additionally or alternatively have various other desirable properties, for example, in terms of electrical conductivity (conductive / insulating, where desired conductive features, such as conductors or shields for embedded electronics, or insulating features can be implemented therefrom, considering metallic materials such as silver or copper).

[0082] However, in some embodiments, the material of the first material layer 208 can be used for photon down- or up-conversion. The material can emit light at least locally. It can then be applied, for example, as a scintillator excited by radiation. Thus, for example, a radiation detector can be manufactured. Nevertheless, the first material layer can be configured and used for dissipation or amplification of electromagnetic fields, heat conduction or insulation, and / or light diffusion (or alternative light control), among other options.

[0083] The first material layer 208 can include, for example, a base (host) material and a filler to achieve the desired functionality. In various embodiments, the substrate film 102 can include at least one member selected from the group consisting of a planar portion of a substrate material, a printed substrate, a rigid printed substrate, a flexible printed circuit substrate, an FR4-based circuit substrate, a ceramic electrical substrate (e.g., HTCC or LTCC, i.e., high-temperature or low-temperature co-fired ceramic), a multilayer circuit substrate, a 3D-formed substrate such as a thermoformed substrate, an additively manufactured (3D-printed) single or multilayer circuit substrate, an additively manufactured circuit substrate including both electrically insulating and conductive materials, a multilayer substrate, a film substrate, a flexible film substrate, a 3D-formed substrate, a thermoformed substrate, a molded substrate, an injection-molded substrate, an extruded substrate, a thermoformable substrate, a thermoplastic substrate, a polymer substrate, a printed film substrate, and a patterned conductive polymer substrate.

[0084] In various embodiments, the node may be at least thermally coupled, if not physically coupled, to a cooling or heating element, optionally including a thermal management element, optionally further including at least one element selected from the group consisting of a heat sink, a thermal slug, and a thermal well.

[0085] In various embodiments, the first material layer generally defines, across the entire first material layer or node, or locally at one or more locations, at least one shape such as a cross-sectional shape selected from the group consisting of: a rectangle, a trapezoid, a truncated cone, an equilateral trapezoid, an equilateral trapezoid with a shorter base facing the substrate film, an equilateral trapezoid with a longer base facing the substrate film, a rounded shape, a rounded rectangle, a rounded equilateral trapezoid, a triangle, a rounded triangle, a semicircle, a dome, a convex shape, a bell shape, a mushroom shape, a cone shape, a semi-ellipse, and a droplet or column shape.

[0086] In various embodiments, the at least one functional or in particular e.g. at least partially electrical element is an electronic component, an integrated circuit, an electromechanical component, an active component, a passive component, an electrical conductor, a printed conductor, a printed electronics manufacturing conductor, an electrode, a contact pad, a conductor trace, an electro-optical (or opto-electronic) component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side-illuminated LED or other light source, a top-illuminated LED or other light source, a bottom-illuminated LED or other light source, a radiation detecting component, a light detecting or light sensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component , a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a moisture sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitive sensor, a projected capacitive sensor or switch, a single-electrode capacitive switch or sensor, a capacitive button, a multi-electrode capacitive switch or sensor, a self-capacitance sensor, a mutual-capacitance sensor, an inductive sensor, a sensor electrode, a microelectromechanical (MEMS) component, a UI element, a user input element, a vibration element, a sound generation element, a communication element, a transmitter, a receiver, a transceiver, an antenna, a resonator, a wireless communication element, a wireless tag, a tag reader, a data processing element, a data storage or memory element, and an electronic subassembly.

[0087] In various embodiments, the node 210 may include a second substrate on the side of the first material layer 208 opposite the side facing the substrate film 102, and at least one functional element, such as electrical, thereon, the second substrate optionally configured for attaching the electrical node to a host structure or particularly its host sub-substrate. Thus, the (first) substrate and the second substrate may establish a laminate structure with, for example, electronics and at least a portion of the first material layer 208 between them.

[0088] FIG. 3 shows, at 300, one embodiment of a structural adjustment element 316 or element 316 (group) according to the present invention. FIG. 3 illustrates an example of a pattern of adjustment elements 316, preferably of electrically insulating material or insulator-filled material, designed to locally and gradually facilitate deformation of the substrate film 102, starting above or above a central region 320 where a typically substantially non-deformable large component, such as an electrical node, may be bonded, and proceeding through the remainder of the film. Together with the insulating elements 114, the elements 316 establish a gradually diluted structure of electrically insulating material. The structural adjustment elements 316 fan out from the central region 320 and are configured to prevent, or at least attempt to prevent, tearing of sensitive conductors (shown in FIG. 3 as having a U-shape) during thermoforming. As mentioned above, in this case, the structural adjustment elements 316 may have, for example, but not limited to, an elongated shape.

[0089] FIG. 4 illustrates one embodiment of a structural adjustment element 416 that may be established in association with, for example, a crossover and / or joint structure 400 on the substrate film 102 .

[0090] In various embodiments, conductive elements 112B from conductive ink can be disposed on the substrate film 102 and, for example, beneath the printed insulator elements 414, for example, by printing. The conductive elements 112B can be configured to connect (relevant joints shown in the figures as circles 412) to other conductive elements, such as conductor traces 112 of a printed nature, potentially also established from the conductive ink. The materials of the conductive elements 112B, 112B, can be the same or different. The conductive material used in one or more crossover region elements, such as conductive element 112B, can, in some embodiments, be weaker than that used in the traces 112, for example. Additionally, other conductors or functional elements not explicitly shown can be disposed within the crossover structure.

[0091] Further shown is an embodiment of a structural adjustment element 416 that is fabricated, for example, but not limited to, by printing a material onto a substrate, for example, to soften deformation transients of the shape 103 affected by the crossover insulator 414 and / or to move the deformed shape 103 away from the most sensitive parts of the crossover structure, such as the joint 412. The adjustment element 416 may, for example, comprise an electrically insulating material. The adjustment element 416 may actually be established as an extension or protrusion of the crossover insulator 414 or may be provided separately therefrom (thus, essentially, as multiple / two (component) elements 416). Thus, the electrical joint 412 may be protected by the surrounding ("horn") elongated element portion 416.

[0092] The structural adjustment element 416 may thus be positioned adjacent to the crossover insulator 414 to redirect deformation transients away from the weaker crossover ink 112B or associated joint 412, and optionally extend or shift them toward the softer conductive ink 112. The elongated structural adjustment element 416 is configured to extend beyond the weaker element, and thus can limit, and otherwise control, deformation in the weaker element.

[0093] In various embodiments, the structural adjustment element 416 can include a first material that is harder and preferably more tear-resistant than either the second material of the substrate, any material layers thereon, or the functional elements, or vice versa. For example, an electrically insulating printed material, such as an insulating ink, can be harder and more tear-resistant than a conductive printed material, such as the crossover region conductive ink, as described above.

[0094] However, the structural adjustment element 416 can be used to limit deformation when using large, potentially in-mold components, modules, and / or electrical nodes. For example, in the case of nodes, and potentially additionally at the edges of underfilled components / modules, the stiffness of the substrate film 102 changes abruptly, causing large transients in the film 102 due to stretching during processing such as thermoforming. Also, when a conductive ink layer is involved, this also poses a risk of tearing. In the case of stretching due to deformation, for example, the structural adjustment element 416 can be arranged to be thin in the area beyond the weakened element.

[0095] 4 can be utilized to mitigate crossover insulator boundary issues near significant radii of surface contours, since deformation can cause conductors, such as conductive inks, which are typically much weaker than regular conductive inks, to tear in the immediate vicinity of the crossover structure. The structural adjustment element 416 can be positioned to be more resistant to stretching, and thus induce deformation transients, at the edge where the crossover structure terminates and the conductor at the crossover is positioned to connect to another conductor extending outside the crossover structure.

[0096] 5 illustrates a circuit design 500 provided on a substrate 102 for receiving electronic components and providing electrical connections therebetween. As can be seen, the circuit design 500 may include a structural adjustment element 316 or elements 316, such as a group of elements, as shown in FIG. 3 and / or in the crossover / joint structure 400, as shown in FIG. 4.

[0097] A plurality of structural adjustment elements 116, 316 can be disposed on the substrate film 102 to control deformation of the substrate film 102 in a desired manner. This can involve moving the transition region 103B or deformation shape 103 away from, or at least making less severe than, larger components, such as weak elements such as electrical nodes or crossover joints. The structural adjustment elements 116 can have virtually any shape; however, an elongated shape can often be advantageous.

[0098] 6 illustrates at 600 one embodiment of a structural adjustment element 616 associated with a functional element 110, such as, but not necessarily, an electronic component such as a semiconductor component. The functional element 110 may be, for example, a microcontroller, a transceiver, an RF amplifier, or the like.

[0099] In various embodiments of the multilayer structure 100, the substrate film 102 may be processed during its manufacture, for example by thermoforming or injection molding (e.g., overmolding), or may be subsequently utilized in a manner that causes deformation (e.g., twisting).

[0100] A functional element 110, such as a node or integrated circuit, may generally be composed of several components that may optionally have a common casing, for example, with multiple pads, wires, and / or traces extending from or connecting to the casing, as in the scenario shown in Figure 6. In various embodiments, the functional element 110 and associated elements, such as wires / traces, may be protected from deformation. This may be done by using various materials, such as silver conductive ink, dielectric ink, color ink, and SMD glue, that have properties that limit the elongation of the substrate film 102, such as the aforementioned thermoplastic or urethane film substrate or other substrate.

[0101] For example, the functional element 110, and optionally other associated elements, such as mounting pads and / or sections of the connecting traces 112, may be protectively positioned within a boundary area or frame defined by structural adjustment elements 616 of a selected material, such as those described above. Thus, deformations, such as elongation, may be minimized or at least reduced within the frame / zone to ensure component mounting and, for example, (electrical) performance.

[0102] The conditioning element 616 may comprise or consist solely of, or at least largely of, a circumferentially surrounding material entity (a boundary, edge, or wall-type entity), which at least partially surrounds the functional element 110. Thus, the element 616 may have a hollow or hollow center, or a generally hollow interior region or volume. Alternatively, in addition to the surrounding portion, the interior region of the element 616 may also be provided with an associated conditioning material, resulting in a more, if not essentially fully filled, type of frame or zone structure.

[0103] The conditioning element 616 may be provided on the substrate 102 and / or element 110, for example, by printing, attachment, and / or (over)molding to protect it. In some embodiments, the conditioning element 616 may be, or at least include, a piece of film or other material locally provided on the substrate film 102. In some embodiments, the boundary zone shown in FIG. 6 may be prepared or reinforced, for example, during injection molding, by using multiple materials, such as two or more different ones, that together transition the dynamic subsequent stretching to occur primarily outside the protected boundary zone.

[0104] Depending on various embodiments of the adjustment element 616, and in the context of extensible products such as wearables, fabric sensors, etc., the shape 103 caused, for example, by dynamic stretching of the substrate film 102 may remain limited, if not completely prevented, within the boundary zone / frame 616. In other words, within the boundary zone, material elongation may be maintained moderately to ensure component attachment, trace connectivity, and electrical performance. Outside the boundary region, dynamic stretching then occurs to a greater extent and may preferably be designed to maintain the possibly applicable elongation within the limits of the conductors and other components used, such as conductive inks.

[0105] FIG. 7 shows at 700 an embodiment of a structural adjustment element 716 that can again define or encompass a frame, where the discussion given herein, for example with respect to FIG. 6, is still generally applicable, and vice versa.

[0106] 7, a functional element 110, such as a standard TQFP (Thin Quad Flat Package) and / or other moderate contact density IC package for use in an IMSE structure, may be provided for the structure, typically on a substrate film 102. Such packages may include, but are not necessarily limited to, QFN (Quad Flat No Leads), SSOP (Shrink Small Outline Package), and TDFN (Thin Dual Flat No Leads). According to one embodiment, a TQFP may be considered a particularly advantageous functional element 110 because it often has a manageable contact density and therefore allows for reliable printing of contact pads.

[0107] For example, the material barrier structure provided by the conditioning element 716 may be configured to create stiffer regions on the substrate film 102 that limit localized stretching, e.g., during formation of the film 102, thus protecting the containing elements, such as the functional element 110. In various embodiments, the conditioning element 716 may be utilized, for example, to spread interface stresses over a longer gradient, thus reducing the risk of conductor failure at typically sharp, discontinuous interfaces. Furthermore, the barrier provided by the element 716 may be utilized, for example, to block the flow of solder adhesive or other conductive materials, thereby dramatically increasing the contact material volume and contact surface area to significantly reduce the risk of short circuits. Furthermore, the outer edge of the barrier structure may be designed with stress-relieving features, such as fins or thickness gradients, depending on the particular embodiment.

[0108] In some embodiments, the element 716 may include a snap-on frame for a package such as a TQFP or other, particularly component-type, functional element 110, in which case the conductive material can be dispensed from the leads after the element is attached. In one embodiment, a pre-prepared frame can be snapped onto the element, and the combined assembly can then be attached to the substrate film 102, for example, with a few drops of adhesive underneath the element. Additionally, spacers can be printed or otherwise placed underneath the structure to ensure a slow flow of capillary underfill or the like. A viscous conductive adhesive can then be dispensed onto the component leads. The viscosity prevents the material from flowing underneath the frame, but allows for very large-area contact with the exposed portions of the component leads and the underlying printed pads. Furthermore, the entire structure can be underfilled with a low-viscosity capillary underfill, potentially with top / edge glob processing.

[0109] In various other embodiments, for example, the print containment structure type of frame may include a "pool" on the pad that directs flow outward during attachment of the target functional element 110, such as a QFN or SSOP type component package. In some embodiments, a print frame, e.g., approximately 15 or 20 μm thick, may be fabricated on the substrate film 102. The conductive adhesive may be generously dispensed onto the pad, for example, and the element may be pressed onto the frame. Any excess adhesive will flow outward from areas that could cause short circuits. In some cases, if the adhesive has good adhesion to the metal pads and the underlying printed contact pads, the print frame may provide poor wetting of the conductive adhesive. This may further help contain the adhesive's spread and allow for capillary wetting of the component pads. The frame limits the conductive adhesive from flowing outward when the component is pressed into place; if it does flow outward, the adhesive will move when the component is pressed into place, breaking contact. The frame material preferably has at least some elasticity to ensure this functionality. In some embodiments, the print frame can be manufactured or configured with channels for applying additional underfill with capillary underfill.

[0110] Nevertheless, pre-attached deep plastic frames or printed containment structures can be provided on the substrate film 102 (dispensing onto the pads, subsequent component attachment). The pads can thus be separated by a barrier high enough to block adhesive flow and spatter during attachment of the elements 110 (components). The frame can be manufactured by cutting an appropriate shape from a thin plastic sheet and fixing it onto the substrate film 102 with adhesive. Alternatively, the frame structure can simply be printed onto the substrate film 102. In either case, if there are (electrical) insulator materials provided on the substrate 102, these may also be used for this purpose, in which case it may not even be necessary to perform additional process steps to create the frame.

[0111] The provided frame may also be used to contain the extent of any glob top material used.

[0112] However, in various embodiments, the barrier structure can be configured to contain the spread of capillary underfill material applied to element 110, reducing the risk of the material ending up where it shouldn't. Depending on the height of the containment structure, it may also be possible to cap the structure, for example, to completely seal element 110 to the amount of filler deflection.

[0113] In view of the foregoing, the structural adjustment element 716 or other features of the multi-layer structure may therefore be configured to define a barrier or containment structure that protects, for example, the electrical contacts from stretching during processing such as (thermo)forming, thereby allowing the use of most heat-resistant conductive adhesives.

[0114] Additionally, barrier structures allow for containment of underfill and glob top spread, for example, which is commonly required while using larger component packages with harder resins such as PC or PMMA. These materials are desirable for use with softer injection resins, as they help eliminate air traps from under, around, and between components.

[0115] However, frames from which various structural adjustment features (e.g., spikes or teeth) may be printed or pre-cut can be arranged to facilitate the embedding of certain more difficult elements, such as flat inductors, because they can be cleanly and repeatably filled with low-viscosity underfill material in a pool formed by the frame. This may allow, for example, LED drivers to be embedded within plastic. In some embodiments, for example, a micromodule structure may include components mounted directly onto the substrate film 102 using the frames described herein and then packed together within the same frame and / or glob top. Various embodiments may utilize copper and solder-based modules or directly bonded components.

[0116] FIG. 8 shows at 800 an embodiment of a gradient-type pattern for use as a structural adjustment element 116, or one or more groups of such elements, and / or otherwise functional element 110, such as an optical element.

[0117] In addition to or instead of structural adjustment, gradient-type patterns that can be used, for example, as light guiding or coupling patterns, can be easily produced in an automated manner, such as by printing. A pattern of structural adjustment elements 816, such as that shown in Figure 8, advantageously provides desired control, such as control of deformation of the substrate film 102, by gradually varying printed features, such as the density and / or size of printed elements, such as dots, in the pattern.

[0118] FIG. 9 shows, at 900, a further embodiment of a patterned structural adjustment element 916 that can find application in electrical structures such as antennas / radiators and electromagnetic shields, as well as various other (non-electrical) structures in which a larger surface area is provided with an entirely rigid material (e.g., ink printing) and subjected to deformation-inducing forces, such as (thermo)forming. The patterned structural adjustment element 916 can be used to control deformation of the substrate film 102. The patterned structural adjustment element 916 can comprise, for example, printed chevron-like structures that can be used to modify the deformation mechanism within the hatch structure. Typical hatch structures provide long, straight lengths of material, such as conductive or insulating lines, such that nearly all deformation forces the material to stretch, which can be more challenging in terms of material failure than other deformation mechanisms, such as shear and / or bending. As can be seen in Figure 9, the patterned structure adjusting elements 916 do not encompass long, continuous, straight stretches of conductor material (or other material, depending on the nature of the provided pattern material(s) as discussed above depending on the use case) in any given direction that extend across the entire area of Figure 9, e.g., the target area, thereby limiting the amount of actual stretch imposed on the conductive ink or other pattern shape providing material, while allowing more room for stretching in intermediate void areas of the substrate film. Thus, with structures of the type shown, material deformation, such as stretching, can be conveniently concentrated in intermediate substrate areas that lack (printed) pattern features.

[0119] The patterned structural adjustment element 916 may comprise multiple elements that define a discontinuous pattern in the target area. However, the patterned structural adjustment element 916 can change deformation from stretching to bending and shearing instead, allowing for some stretching and compression to conform to shapes that would normally result in wrinkles during processing. In various embodiments, several different shapes can be envisioned to achieve this more malleable hatch structure.

[0120] 10 illustrates the use of one embodiment of a structural adjustment element 1016, such as a (printing) frame, in relation to a three-dimensional substrate, e.g., a deformed substrate film, and an overall structure 1000. As can be seen, the structural adjustment element 1016 can be positioned to control deformation at the location of the connecting element. The structural adjustment element 1016 advantageously prevents too severe deformation at the location of the weak portion.

[0121] FIG. 11 is a flow diagram 1100 of one embodiment of a method according to the present invention. At the beginning of the method for manufacturing the multilayer structure 100, an initiation stage 1102 may be performed. During initiation, necessary tasks such as material (e.g., substrate), component and tool selection, acquisition, calibration, and other configuration tasks may be performed. Special care must be taken to ensure that the selection of the individual elements and materials works together and survives the selected manufacturing and installation process, which is, of course, preferably pre-checked based on manufacturing process specifications and component data sheets or, for example, by inspecting and testing fabricated prototypes. Thus, the equipment to be used, such as molding / IMD (in-mold decoration), lamination, bonding, (thermo)forming, electronics assembly, cutting, drilling, and / or printing equipment, among others, may be brought up to operational status at this stage.

[0122] Step 1104 may refer to obtaining a substrate film comprising a formable, optionally thermoformable, material.

[0123] Steps 1108, 1109, 1110, and 1112 may refer to providing several functional elements, including at least one functional element, on the substrate film. Step 1109 may refer to providing electrical nodes or subassemblies as functional elements on the substrate film.

[0124] In step 1113, the substrate film may further be provided with structural adjustment elements configured to locally control process-induced deformation of the substrate film, preferably within the vicinity of any of the aforementioned functional elements. This step may be performed before, simultaneously with, or after any or all of steps 1108, 1109, 1110, and 1112. Furthermore, the structural adjustment elements may preferably be arranged to control deformation of the substrate film within the vicinity of the three-dimensional non-planar shape, including control over the distribution of deformation forces during non-planar shape-induced deformation of the substrate film. The structural adjustment elements may be provided to the substrate film using at least one technique selected from the group consisting of additive manufacturing techniques, printing, attaching, sputtering, deposition, preferably utilizing selected printed electronics technologies, and subtractive processes such as etching, cutting, or engraving elements on or in the substrate film.

[0125] In various embodiments, the method may preferably further include forming 1114 the substrate film to exhibit a selected deformation, optionally including a three-dimensional non-flat shape, near the functional element after step 1113. Forming 1114 may include, for example, thermoforming, vacuum forming, high pressure forming, or cold forming.

[0126] In various embodiments, the method may include manufacturing 1116, preferably by molding, such as injection molding or cast molding, at least one plastic layer on the substrate film, at least partially embedding one or more of the functional elements and / or structural adjustment elements therebetween.

[0127] Additionally, in various embodiments, the method may include post-processing 1118 of the multi-layer structure 100. This may mean, for example, cutting certain portions thereof, disconnecting it, attaching it to a host device, or other known post-processing tasks that will be appreciated by those skilled in the art.

[0128] At 1120, method execution ends.

[0129] 12 illustrates, at 1200, a material transition, such as a (conductive) ink transition and associated joint between two elements 1216A (dashed line) and 1216B (solid line), which may represent an electrical conductor. Instead of an abrupt step-type transition, the joint involves a longer switch or gradient between gradual types of material, as provided by the illustrated element shapes 1216A, 1216B and their positioning within the joint region. Thus, the joint region is generally enlarged, resulting in a structure that is resistant to deformations such as stretching. Thus, the contacting edge regions of elements 1216A, 1216B can be considered to establish a structural alignment element in the illustrated scenario.

[0130] In 1202, redundancy is provided in the form of multiple slightly different joint locations between spreading elements 1216A and 1216B via associated nodes and branches. Clearly, the solutions of scenarios 1200 and 1202 can also be combined.

[0131] FIG. 13 illustrates a further embodiment of a structural adjustment element associated with a two-element joint structure 1300, such as a conductor. In FIG. 13, the two elements can be the same or different materials, preferably conductive materials or conductive traces. However, as noted above, the first of the two elements, element 1316A, can be adapted to have an extension or extension (i.e., an integral structural adjustment element) that extends to surround and thus protect the joint 1300 between the two elements against deformation (deformation at the actual location of the joint can thus be reduced or eliminated). The extension generally can stiffen the structure. Thus, the second of the two elements, element 1316B, can simply be connected to the aforementioned first of the elements, element 1316A, or can additionally be adapted to include such a protective shape or integral structural adjustment element. The material of element 1316A can, in some embodiments, be harder than the material of element 1316B, for example.

[0132] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments have been constructed for illustrative purposes only, and that other configurations applying many of the principles described above can be readily prepared to best suit each potential use scenario.

Claims

1. An integrated functional multi-layer structure (100), comprising: a substrate film (102) formed or formable to assume a selected shape (103); several functional elements (110, 112, 114, 210), including conductors (112), insulators (114), components (110, 210), and / or integrated circuits (110, 210), provided on the substrate film (102) in a deformation region of the substrate film (102) or at the edge of the deformation region caused by the shaping of the shape (103); The base film (102) is further provided with structural adjustment elements (116, 316, 416, 616, 716, 816, 916, 1016, 1216A, 1216B, 1316A), the structural adjustment elements are configured to locally control induced deformations to protect the several functional elements from the induced deformations that occur due to and during shaping of the selected shape; The structural adjustment elements (116, 316, 416, 616, 716, 816, 916, 1016, 1216A, 1216B, 1316A) are provided on the base film (102) before the molding, and the structural adjustment elements are - mechanical stress relief structures including multiple fins, teeth and / or gradually expanding or contracting extensions; and / or a pattern (900) defined by or at least incorporating a plurality of non-linear or piecewise linear and / or discontinuous shapes (916), and / or - Including gradient patterns (800) with several repeating geometric shapes that gradually change in size and / or other properties within the pattern, or diffuser patterns with uniform shapes, structure.

2. 2. The structure of claim 1, further comprising a layer (104) of plastic manufactured on said substrate film and having at least a portion of said functional elements and / or said structural adjustment elements embedded therein.

3. 3. The structure of claim 1 or claim 2, wherein the substrate film includes a three-dimensional thermoformed non-flat shape, and the structural adjustment element is configured to control deformation of the substrate film within a deformation region of the substrate film or at an end of the deformation region caused by forming the three-dimensional non-flat shape.

4. 4. The structure according to claim 1, wherein the structural adjustment element is in contact with or adjacent to at least one of the functional elements. Structure.

5. The structure according to claim 1 , wherein the structural adjustment element is configured to locally limit, reduce or increase deformation of the substrate film.

6. 6. The structure of claim 1, wherein the structural adjustment element is configured to limit, reduce or increase the inclination (118) of the surface of the deformation region of the substrate film relative to the horizontal plane, limit, reduce or increase the magnitude of the change in inclination of the deformation region, shift the deformation region, shape the deformation region, limit, reduce or increase the size of the deformation region, and / or extend or reduce the length of the deformation region or the length of the transition between the deformation region and an adjacent substrate portion.

7. 7. The structure of claim 1, wherein the structural adjustment element comprises a first material that is harder than a second material of either the substrate film, any material layer on the substrate film, or the functional element, or vice versa.

8. 8. A structure according to any one of claims 1 to 7, wherein the structural adjustment element comprises an element (416) configured to reduce and / or move an inclined portion and / or transition area (103B) caused by deformation of the substrate film at the location of at least one functional element (112B) of the several functional elements.

9. 9. A structure according to any one of claims 1 to 8, wherein the structural adjustment element is an extension extending outward from one of two functional elements that are connected to each other, and the extension extends to surround the connection between the two functional elements.

10. The structural adjustment element is Mechanical elements, optical functional elements, elements provided by printed electronics technology, electrically insulating elements, conductive elements, electrically insulating elements provided by printed electronics, conductive elements provided by printed electronics, additively generated elements, sputtered elements, deposited elements, vacuum deposited elements, etched elements, additively generated conductive elements, additively generated electrically insulating elements, engraved elements, portions of conductive or insulating elements with locally changed thickness, a physical extension of a conductive element, including a cavity, a recess, a through-hole, an element created by a removal process, a conductive element created by a removal process, an electrically insulating element created by a removal process, a conductor trace or a contact pad; a physical extension of the electrical insulation element, including an insulator fill or an electrical crossover insulation layer; and 10. The structure of any one of claims 1 to 9, comprising at least one element selected from the group consisting of transmissive, refractive, diffractive, opaque, absorptive, scattering, or reflective elements.

11. 11. The structure of claim 1, wherein the structural adjustment element comprises at least a portion of a frame (616, 716, 1016) that is circumferentially aligned with any of the functional elements (110) on the substrate film.

12. 12. The structure of any one of claims 1 to 11, wherein the structural adjustment element (616, 716) is further configured to guide, restrict, or prevent the flow of a material flowably disposed on either the base film or the functional element.

13. 13. The structure of any one of claims 1 to 12, wherein the structural adjustment element comprises a frame (716) connected to or at least adjacent to at least one functional element of the number of functional elements.

14. The structure-controlling element may be a conduit or a flowable material, such as a conductive adhesive, ink, solder, wetting agent, substance that affects surface energy, and / or underfill material.

14. The structure of claim 1, further comprising a guide structure, such as a receptacle, configured to allow a flowable material, in its flowable state, to contact a functional element of the number of functional elements.

15. 10. The structure of claim 1, wherein the pattern is configured for use in directing or coupling light to the substrate film or elements thereon.

16. 1. A method (1100) for manufacturing an integrated multilayer structure, comprising: Obtaining a substrate film comprising a formable material (1104); providing several functional elements (1108, 1109, 1110, 1112) on the substrate film, including at least one functional element; The substrate film further comprises (1113) structural adjustment elements configured to locally control process-induced deformations of the substrate film, the process-induced deformations occurring due to and during forming of the substrate film into a selected shape, and protecting the certain functional elements on the substrate film from deformations of the substrate film in or at the edges of the deformation areas of the substrate film (102) caused by the forming, The structural adjustment elements (116, 316, 416, 616, 716, 816, 916, 1016, 1216A, 1216B, 1316A) are provided on the base film (102) before the molding; The structural adjustment element is - mechanical stress relief structures including multiple fins, teeth and / or gradually expanding or contracting extensions; and / or a pattern (900) defined by or at least incorporating a plurality of non-linear or piecewise linear and / or discontinuous shapes (916), and / or - Including gradient patterns (800) with several repeating geometric shapes that gradually change in size and / or other properties within the pattern, or diffuser patterns with uniform shapes, method.

17. 17. The method of claim 16, further comprising forming (1114) the substrate film to exhibit a selected deformation comprising a three-dimensional non-planar shape in an area adjacent the functional element.

18. 18. The method of claim 16 or claim 17, comprising producing (1116) on the substrate film a plastic layer at least partially embedding one or more of the functional elements and / or the structural adjustment elements.

19. 19. The method of any one of claims 16 to 18, wherein the structural adjustment elements are provided on the substrate film using at least one technique selected from the group consisting of additive manufacturing techniques, printing, attaching, sputtering, deposition, and subtractive processes including etching, cutting, or engraving elements on or in the substrate film.

Images