Electronic Components

Abstract

To provide an electronic component which can be flexibly corresponded to a change in size of a ceramic element in an inner part, and has an excellent productivity.SOLUTION: An electronic component comprises: a case having a concave part and an open edge part of the concave part; a ceramic element arranged in the concave part, and having a first main surface and a second main surface which are opposite each other and having a first electrode part formed on the first main surface and a second electrode part formed on the second main surface; a first metal terminal containing a first mounting part that is arranged on the open edge part and is approximately vertical to the first main surface and the second main surface and a first electrode connection part connected to the first electrode part; and a second metal terminal having a second mounting part that is arranged in the open edge part and is approximately vertical to the first main surface and the second main surface and a second electrode connection part connected to the second electrode part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component used as a capacitor or the like. [Background technology]

[0002] Conventionally, capacitors and the like have been proposed that are configured by connecting metal terminals to a single-plate dielectric disk, and electronic components have also been proposed in which the periphery of such a dielectric disk is molded with an exterior material, making it suitable for surface mounting.

[0003] However, conventional surface-mount electronic components have the problem of a complicated assembly process, since they require a process of fixing a dielectric disk and metal terminals in a cavity for resin molding and then molding with an exterior material.Furthermore, since the molding die must be changed when the size of the dielectric disk changes, it is difficult to flexibly respond to changes in the size of the dielectric disk. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-196348 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and provides an electronic component that can flexibly accommodate changes in the size of the internal ceramic element and has good productivity. [Means for solving the problem]

[0006] In order to solve the above problems, the electronic component according to the present invention comprises: a case having a recess and an opening edge of the recess; a ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface; a first metal terminal having a first mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a first electrode connecting portion connected to the first electrode portion; The second metal terminal has a second mounting portion that is arranged on the opening edge portion and is approximately perpendicular to the first main surface and the second main surface, and a second electrode connection portion that connects to the second electrode portion.

[0007] The electronic component according to the present invention accommodates the ceramic element in a recess in the case, eliminating the need for a process of placing the ceramic element in a cavity for resin molding and then molding it with an exterior material, resulting in good productivity. Furthermore, because the main surface of the ceramic element is perpendicular to the mounting portion, the mounting area can be effectively reduced.

[0008] Furthermore, for example, the case may have first and second outer surfaces that are substantially perpendicular to the first and second main surfaces and the first and second mounting portions and face in opposite directions, A distance from a tip of the first mounting portion to the first outer surface may be shorter than a distance from the tip of the first mounting portion to the recessed portion, The distance from the tip of the second mounting portion to the second outer surface may be shorter than the distance from the tip of the second mounting portion to the recess.

[0009] In such electronic components, the first mounting portion and second mounting portion extend from the recess toward the outer surface of the case along the opening edge, so that the first metal terminal and second metal terminal are securely supported by the case, the mounting posture is stable, and tipping over during mounting can be effectively prevented.

[0010] Furthermore, for example, the ceramic element may have a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion, The first element portion and the second element portion may be arranged in the recessed portion side by side along the length direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing in opposite directions, The first electrode connection portion may be connected to the first electrode portion of the first element portion, The second electrode connection portion may be connected to the second electrode portion of the second element portion, The semiconductor device may further include a third metal terminal that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion. Furthermore, the first element portion and the second element portion may be arranged in the recess so that the first main surface of the first element portion and the second main surface of the second element portion are located on approximately the same plane, and so that the second main surface of the first element portion and the first main surface of the second element portion are located on approximately the same plane.

[0011] The ceramic element placed in the recess may be a single ceramic element, or may be a combination of multiple plate-like portions, such as a first element portion and a second element portion.Such an electronic component has a small mounting area and comprises two element portions connected in series.

[0012] Furthermore, for example, the third metal terminal may have a third electrode connection portion that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion, and a third mounting portion that is arranged at the opening edge portion and is approximately perpendicular to the first main surface and the second main surface.

[0013] In such an electronic component, the connection state of the two element portions to the circuit or the like can be changed by changing the connection to the third mounting portion.

[0014] Furthermore, for example, the ceramic element may have a first element portion and a second element portion each having the first main surface, the second main surface, the first electrode portion, and the second electrode portion, The first element portion and the second element portion may be arranged in the recessed portion side by side along the length direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing the same direction, the first electrode connection portion may be connected to the first electrode portions of both the first element portion and the second element portion; The second electrode connection portion may be connected to the second electrode portions of both the first element portion and the second element portion. Furthermore, the first element portion and the second element portion may be arranged in the recess so that the first main surface of the first element portion and the first main surface of the second element portion are located on approximately the same plane, and the second main surface of the first element portion and the second main surface of the second element portion are located on approximately the same plane.

[0015] Such an electronic component has a small mounting area and is configured with two element sections connected in parallel.

[0016] Also, for example, at least a part of the opening edge of the case may be visible from below.

[0017] Such an electronic component has at least a part of the opening of the recess exposed, has a simple structure, and is highly manufacturable.

[0018] Furthermore, for example, the case may be substantially hexagonal prism-shaped, with both outer surfaces not parallel to the first main surface and the second main surface.

[0019] Such electronic components can improve stability during mounting while maintaining a small mounting area.

[0020] Further, for example, the electronic component according to the present invention may include a groove formed on the third outer surface of the case; The case may have a protrusion formed on a fourth outer surface thereof and corresponding to the shape of the groove.

[0021] By connecting multiple electronic components together, when transporting them to a mounting board or the like using a mounting machine, the multiple connected electronic components can be transported at once, thereby improving mounting efficiency.

[0022] Furthermore, for example, the first metal terminal may have a first folded portion extending upward from a tip of the first mounting portion along an outer surface of the case, The second metal terminal may have a second folded portion that extends upward from a tip of the second mounting portion along an outer surface of the case.

[0023] Electronic components having such metal terminals are more likely to form solder fillets during mounting, and have good mountability. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a schematic perspective view of an electronic component according to a first embodiment of the present invention, viewed obliquely from below. [Figure 2] FIG. 2 is a perspective view of the electronic component shown in FIG. 1 as viewed from a different angle. [Figure 3] FIG. 3 is a bottom view of the electronic component shown in FIG. [Figure 4] 4 is a perspective view of the case of the electronic component shown in FIG. 1. FIG. [Figure 5] 5 is a perspective view showing first and second metal terminals of the electronic component shown in FIG. [Figure 6] FIG. 6 is a schematic perspective view of an electronic component according to a second embodiment of the present invention. [Figure 7] FIG. 7 is a bottom view of the electronic component shown in FIG. [Figure 8] FIG. 8 is a conceptual diagram showing an electronic component according to a third embodiment of the present invention. [Figure 9] FIG. 9 is a conceptual diagram showing an electronic component according to a fourth embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view showing an electronic component according to a fifth embodiment of the present invention. [Figure 11] FIG. 11 is a bottom view of the electronic component shown in FIG. [Figure 12] FIG. 12 is a conceptual diagram showing an example of a state in which the electronic component shown in FIG. 10 is used. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

[0026] First embodiment FIG. 1 is a schematic perspective view of an electronic component 10 according to a first embodiment of the present invention, viewed from the bottom side. As shown in FIG. 1, electronic component 10 has a case 20 and a ceramic element 30 disposed in a recess 21 of case 20. As can be seen from FIG. 4, which shows the interior of electronic component 10, electronic component 10 has a first metal terminal 40 and a second metal terminal 50 that are connected to ceramic element 30 disposed in recess 21. FIG. 4 is a conceptual diagram of electronic component 10, showing a see-through state of case 20. In FIG. 4, case 20 is shown by a virtual line (two-dot chain line).

[0027] FIG. 2 is a perspective view of electronic component 10 as viewed from the side. As shown in FIGS. 1 and 2, electronic component 10 has a generally rectangular plate shape or a rectangular parallelepiped shape in which two of the three lengths are generally equal and one length is shorter than the other two lengths. However, electronic component 10 is not limited to this and may have a polygonal plate shape other than a rectangle, or a polygonal prism shape other than a rectangular parallelepiped (see FIG. 6). As can be seen from a comparison of FIGS. 2 and 4, in electronic component 10, the side on which opening 21a of recess 21 formed in case 20 is formed is the mounting surface side that faces a substrate or the like to be mounted when electronic component 10 is mounted.

[0028] As shown in Fig. 1, case 20 has recess 21 and opening edge 22 surrounding opening 21a of recess 21. As shown in Fig. 2, opening 21a of recess 21 is formed on one of four narrow faces of case 20, rather than on two wide faces. This allows the mounting area for electronic component 10 to be narrower.

[0029] Fig. 3 is a bottom view of electronic component 10 as viewed from the mounting surface side. Case 20 accommodates ceramic element 30 and the like inside recess 21. Opening 21a of recess 21 has a rectangular shape that is smaller than the outer shape of case 20. As shown in Fig. 4, recess 21 forms a substantially rectangular parallelepiped space inside case 20. An upper base 23 of case 20 is formed above electronic component 10, in the opposite direction from opening 21a of recess 21.

[0030] 3, opening edge 22 is formed of a frame-shaped flat surface surrounding opening 21a. Opening edge 22 is approximately perpendicular to first main surface 31a and second main surface 31b of ceramic element 30, which will be described later. Note that the shape of opening edge 22 may differ from that shown in FIG. 3 depending on the shape of opening 21a, the outer peripheral shape of case 20, and the like (see FIG. 7, etc.).

[0031] As shown in FIG. 3, the first mounting portion 42 of the first metal terminal 40 and the second mounting portion 52 of the second metal terminal 50 are arranged on the opening edge portion 22.

[0032] As shown in FIGS. 3 and 4, the ceramic element 30 is disposed in the recess 21 of the case 20. As shown in FIG. 3, the ceramic element 30 has a first main surface 31a and a second main surface 31b facing each other and has a generally disc-shaped outer shape. However, the ceramic element 30 may have a shape other than a disc, such as an elliptical disk or a rectangular plate. The first main surface 31a and the second main surface 31b are the pair of surfaces with the largest areas of the ceramic element 30. Furthermore, in the description of the ceramic element 30 shown in FIG. 3, one of the two main surfaces is referred to as the first main surface 31a and the other as the second main surface 31b, but the first main surface 31a and the second main surface 31b may be interchanged relative to the state shown in the drawings.

[0033] As shown in FIG. 3 , which is a bottom view of the electronic component 10, the ceramic element 30 has a first electrode portion 33 formed on the first main surface 31 a, a second electrode portion 34 formed on the second main surface 31 b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. The material of the dielectric portion 35 is not particularly limited and may be a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The ceramic element 30 is not limited to a capacitor in which the dielectric portion 35 is sandwiched between the first electrode portion 33 and the second electrode portion 34. For example, the ceramic element may be a varistor or thermistor in which a semiconductor ceramic is sandwiched between the first electrode portion 33 and the second electrode portion.

[0034] The materials for the first electrode portion 33 and the second electrode portion 34 are not particularly limited, and typically copper, copper alloys, nickel, nickel alloys, etc. are used, but silver, silver-palladium alloys, etc. can also be used. The thickness of the first electrode portion 33 and the second electrode portion 23 is not particularly limited, but is typically about 10 to 50 μm. The surfaces of the first and second electrode portions 33, 34 may be coated with at least one metal coating selected from Ni, Cu, Sn, etc.

[0035] As shown in FIG. 4, ceramic element 30 is placed in recess 21 so that first main surface 31a and second main surface 31a are oriented perpendicular to opening 21a. Therefore, depth W2, which is the distance from opening 21a of case 20 to upper bottom 23 of recess 21, is greater than diameter W1 of ceramic element 30. This allows electronic component 10 to accommodate the entire ceramic element 30 in recess 21 without a portion of ceramic element 30 being exposed through opening 21a of recess 21. Furthermore, in electronic component 10, recess 21 may be filled with a molding resin, in which case the entire ceramic element 30 can be covered with the molding resin.

[0036] As shown in Fig. 4, case 20 does not have a lid that covers opening 21a. Therefore, as shown in Fig. 3, in electronic component 10, at least a portion of opening edge 22 in case 20, i.e., the remaining portion of opening edge 22 excluding the portions where first mounting portion 42 and second mounting portion 52 are arranged, is visible from below. As such, case 20 has a simple shape without a lid, electronic component 10 has good productivity.

[0037] 5 is a schematic perspective view showing a first metal terminal 40 and a second metal terminal 50 in the electronic component 10. As shown in FIGS. 3 to 5, the electronic component 10 has a pair of metal terminals 40, 50. The first metal terminal 40 and the second metal terminal 50 are arranged at a distance from each other in the electronic component 10 and are electrically insulated. The first metal terminal 40 and the second metal terminal 50 are formed, for example, by machining a conductive metal plate, but the method for forming the metal terminals 40, 50 is not particularly limited.

[0038] 3 to 5, the first metal terminal 40 has a first mounting portion 42 disposed on the opening edge portion 22, a first electrode connecting portion 44 connected to the first electrode portion 33 of the ceramic element 30, a first terminal arm portion 46 connecting the first mounting portion 42 and the first electrode connecting portion 44, and a first folded portion 47 extending upward from a tip end 42a of the first mounting portion 42. As shown in FIG. 4, the first electrode connecting portion 44 and the first terminal arm portion 46 are housed in the recess 21 of the case 20, similar to the ceramic element 30.

[0039] 3 and 4, the first electrode connection portion 44 extends substantially parallel to the first main surface 31a of the ceramic element 30, and is connected to the first electrode portion 33 formed on the first main surface 31a via solder, a conductive adhesive, or the like. In contrast, the first mounting portion 42 is disposed on one side of the opening edge portion 22 (the side facing the first outer surface 24 of the case 20).

[0040] 4 and 5, the first terminal arm 46 of the first metal terminal 40 connects the first electrode connection portion 44 inside the recess 21 and the first mounting portion 42 outside the recess 21. In addition, as shown in FIGS. 3 and 4, the first mounting portion 42 is approximately perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0041] 3 and 4, the case 20 has a first outer surface 24 and a second outer surface 25 that are perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30 and the first mounting portion 42 and the second mounting portion 52 of the metal terminals 40, 50. That is, the first outer surface 24 and the second outer surface 25 are a pair of outer surfaces that face each other among the four outer surfaces of the case 20, and have a smaller area than the other outer surfaces excluding the first outer surface 24 and the second outer surface 25. Of the outer surfaces of the case 20, the surfaces perpendicular to the opening edge portion 22 are the outer surfaces.

[0042] 3, the tip 42a of the first mounting portion 42 is the end of the first mounting portion 42 opposite the side connected to the first terminal arm portion 46, and is connected to the first folded portion 47. A distance D1 from the tip 42a of the first mounting portion 42 to the first outer surface 24 is shorter than a distance D2 from the tip 42a of the first mounting portion 42 to the recess 21. Such a first mounting portion 42 can ensure a certain area or more along the opening edge portion 22, thereby achieving good mountability.

[0043] As shown in FIG. 4 , the first folded portion 47 of the first metal terminal 40 extends upward from the tip 42 a of the mounting portion 42 along the first outer surface 24 of the case 20. The first folded portion 47 of the first metal terminal 40 facilitates the formation of a solder fillet during mounting, and an electronic component 10 having such a first folded portion 47 exhibits good mountability. Furthermore, as shown in FIG. 4 , the first terminal arm 46, the first mounting portion 42, and the first folded portion 47 form a J-shaped tip of the first metal terminal 40. Therefore, in the electronic component 10, a portion of the case 20 is sandwiched between the first terminal arm 46 and the first folded portion 47, allowing the first metal terminal 40 to be more firmly engaged with the case 20.

[0044] 3 to 5, the second metal terminal 50 has a second mounting portion 52 disposed on the opening edge portion 22, a second electrode connecting portion 54 connected to the second electrode portion 34 of the ceramic element 30, a second terminal arm portion 56 connecting the second mounting portion 52 and the second electrode connecting portion 54, and a second folded portion 57 extending upward from the tip 52a of the second mounting portion 52. The second electrode connecting portion 54 is accommodated in the recess 21 of the case 20, similar to the first electrode connecting portion 44. The second metal terminal 50 has substantially the same shape as the first metal terminal 40 and is disposed substantially symmetrically with respect to the first metal terminal 40. However, the second metal terminal 50 is not limited to having the same shape as the first metal terminal 40.

[0045] 3 and 4, the second electrode connection portion 54 extends substantially parallel to the second main surface 31b of the ceramic element 30 and is connected to the second electrode portion 34 formed on the second main surface 31b via solder, a conductive adhesive, or the like. In contrast, the second mounting portion 52 is disposed on the other side of the opening edge portion 22 (the side facing the second outer surface 25 of the case 20).

[0046] 4 and 5, the second terminal arm 56 of the second metal terminal 50 connects the second electrode connection portion 54 inside the recess 21 and the second mounting portion 52 outside the recess 21. In addition, as shown in FIGS. 3 and 4, the second mounting portion 52 is approximately perpendicular to the first main surface 31a and the second main surface 31b of the ceramic element 30.

[0047] 3, the tip 52a of the second mounting portion 52 is the end of the second mounting portion 52 opposite the side connected to the second terminal arm portion 56, and is connected to the second folded portion 57. A distance D3 from the tip 52a of the second mounting portion 52 to the second outer surface 25 is shorter than a distance D4 from the tip 52a of the second mounting portion 52 to the recess 21. Such a second mounting portion 52 can ensure a certain area or more along the opening edge portion 22, thereby achieving good mountability.

[0048] 4, the second folded portion 57 of the second metal terminal 50 extends upward from the tip 52a of the second mounting portion 52 along the second outer surface 25 of the case 20. The second metal terminal 50 having the second folded portion 57 has the same effect as the first metal terminal 40 having the first folded portion 47.

[0049] 5 and the like, the material of the first metal terminal 40 and the second metal terminal 50 is not particularly limited as long as it is a metallic material having electrical conductivity, and for example, iron, nickel, copper, silver, etc., or an alloy containing these can be used. Furthermore, a metal coating of Ni, Sn, Cu, etc. may be formed on the surface of the first metal terminal 40 and the second metal terminal 50.

[0050] 3 and 4 may be filled with a molding resin that fills gaps between the inner wall (including the bottom surface 21c) of the recess 21 and the ceramic element 30 and the metal terminals 40, 50. This can improve the strength and insulating properties of the electronic component 10. However, the recess 21 does not have to be filled with resin, and as shown in FIG. 3, gaps may be formed between the inner wall of the recess 21 and the ceramic element 30 and the metal terminals 40, 50.

[0051] The case 20 can be manufactured by, for example, injection molding using resin, etc. However, the material of the case 20 is not limited to resin.

[0052] 1 to 5 can be manufactured by, for example, the following process. First, the ceramic element 30, the first metal terminal 40, and the second metal terminal 50 are prepared, and the first metal terminal 40 and the second metal terminal 50 are connected to the ceramic element 30. The connection between the ceramic element 30 and the first metal terminal 40 and the second metal terminal 50 can be performed using solder, a conductive adhesive, or the like.

[0053] Next, the intermediate product in which first metal terminal 40, second metal terminal 50, and ceramic element 30 are integrated is placed in recess 21 of case 20. Thereafter, molding resin is injected into recess 21 as necessary to obtain electronic component 10 shown in FIG. 1. In this way, electronic component 10 shown in FIGS. 1 to 5 accommodates ceramic element 30 in recess 21 within case 20, eliminating the need for a process of placing ceramic element 30, etc., in a cavity for resin molding and molding with an exterior material, and thus improving productivity.

[0054] Because electronic component 10 can accommodate ceramic element 30 and the like within case 20, it can flexibly accommodate changes in the size of ceramic element 30 as long as it fits within case 20. Furthermore, because first mounting portion 42 and second mounting portion 52 are perpendicular to first main surface 31a and second main surface 31b of ceramic element 30, electronic component 10 can have a small mounting area, making it suitable for surface mounting.

[0055] Second embodiment Fig. 6 is a schematic perspective view of an electronic component 210 according to a second embodiment of the present invention, and Fig. 7 is a bottom view of the electronic component 210. As shown in Figs. 6 and 7, the external shape of the case 220 of the electronic component 210 is different from that of the case 20 of the electronic component 10 shown in Figs. 1 and 2, but the electronic component 210 is otherwise similar to the electronic component 10. In the description of the electronic component 210, only the differences from the electronic component 10 will be described, and a description of the commonalities with the electronic component 10 will be omitted.

[0056] 6 and 7, the case 220 has a generally hexagonal prism shape in which all of the outer surfaces 224, 225, 226a, 226b, 228a, and 228b are non-parallel to the first main surface 31a and the second main surface 31b of the ceramic element 30. However, as shown in FIG. 7, the internal shape of the case 220, such as the shape of the recess 21, is similar to that of the case 20 shown in FIG.

[0057] 6 and 7, the case 220 has six outer surfaces that are perpendicular to the opening edge 222 that surrounds the opening 21a of the recess 21. The six outer surfaces of the case 220 are composed of a first outer surface 224, a second outer surface 225, a third outer surface 226b, a fourth outer surface 228a, a fifth outer surface 226a, and a sixth outer surface 228b.

[0058] As shown in Fig. 7, the first outer surface 224 and the second outer surface 225 are a pair of outer surfaces facing each other, and are similar to the first outer surface 24 and the second outer surface 25 shown in Fig. 3. As shown in Fig. 7, the fifth outer surface 226a is connected to the first outer surface 224 at an included angle greater than 90 degrees, and the third outer surface 226b is connected to the second outer surface 225 at an included angle greater than 90 degrees. The fifth outer surface 226a and the third outer surface 226b have approximately the same area and are connected to each other at the center of the electronic component 210 at an included angle greater than 90 degrees.

[0059] 6 and 7, the fourth outer surface 228a and the sixth outer surface 228b are symmetrical with respect to the fifth outer surface 226a and the third outer surface 226b, respectively. That is, the fourth outer surface 228a is connected to the first outer surface 224 at an angle greater than 90 degrees, and the sixth outer surface 228b is connected to the second outer surface 225 at an angle greater than 90 degrees. The fourth outer surface 228a and the sixth outer surface 228b have substantially the same area and are connected to each other at a central portion of the electronic component 210 at an angle greater than 90 degrees.

[0060] 6 and 7, the first and second outer side surfaces 224, 225 are substantially perpendicular to the first main surface 31a and the second main surface 31b, while the fourth to sixth outer side surfaces are disposed at an angle relative to the first main surface 31a and the second main surface 31b. As shown in Fig. 7, the width of the opening edge portion 222 of the electronic component 210 in the direction perpendicular to the first main surface 31a and the second main surface 31b is narrow on both sides near the first and second outer side surfaces 224, 225 and is wide in the center. Such an electronic component 210 can prevent tipping over in a mounted position while maintaining a small mounting area.

[0061] In addition, the electronic component 210 according to the second embodiment has the same effects as the electronic component 10 according to the first embodiment in terms of the commonalities with the electronic component 10.

[0062] Third embodiment Fig. 8 is a schematic perspective view of an electronic component 310 according to a third embodiment of the present invention. Similar to electronic component 10 shown in Fig. 3, Fig. 8 shows a see-through view of the inside of case 320 of electronic component 310, with case 320 indicated by virtual lines.

[0063] As shown in FIG. 8, electronic component 310 differs from electronic component 210 shown in FIGS. 6 and 7 in that ceramic element 330 has two short-plate-shaped dielectric elements, first element portion 330a and second element portion 370a, and in that second metal terminal 350 has a different shape and third metal terminal 380. However, case 320 of electronic component 310 is similar to case 220 of electronic component 210 according to the second embodiment, except that the longitudinal dimension, which is the distance between first outer surface 324 and second outer surface 325, is approximately twice as long. In the description of electronic component 310, only the differences from electronic component 210 will be described, and a description of the commonalities with electronic component 210 will be omitted.

[0064] As shown in FIG. 8, the ceramic element 330 of the electronic component 310 has two element portions: a first element portion 330a and a second element portion 370a. The first element portion 330a and the second element portion 370a are disposed in a recess 321 of the case 320. Similar to the case 220 shown in FIGS. 6 and 7, the case 320 has a first outer surface 324, a second outer surface 325, a fifth outer surface 326a, a third outer surface 326b, a fourth outer surface 328a, and a sixth outer surface 328b, and has a generally hexagonal prism-like outer shape. Similarly to the case 220 shown in FIG. 7, the case 320 has an opening edge portion 322 that surrounds the periphery of the opening 321a of the recess 321 and faces the mounting surface side (downward).

[0065] First element portion 330a and second element portion 370a, which are disposed in recess 321 of case 320, have first main surfaces 331a, 371a and second main surfaces 331b, 371b, similar to ceramic element 30 included in electronic components 10, 210 of the first and second embodiments. That is, first element portion 330a and second element portion 370a have first electrode portions formed on first main surfaces 331a, 371a, second electrode portions formed on second main surfaces 331b, 371b, and a dielectric portion sandwiched between the first electrode portions and the second electrode portions, similar to ceramic element 30 shown in FIG. 3 (see first electrode portion 33, second electrode portion 34, and dielectric portion 35 in FIG. 3).

[0066] 8, first element portion 330a and second element portion 370a are arranged in recess 321 of case 320 so that first main surface 331a of first element portion 330a and second main surface 371b of second element portion 370a are positioned on approximately the same plane. Furthermore, first element portion 330a and second element portion 370a are arranged in recess 321 of case 320 so that second main surface 331b of first element portion 330a and first main surface 371a of second element portion 370a are positioned on approximately the same plane.

[0067] That is, the first element portion 330a and the second element portion 370a are arranged side by side in the recess 321 along the longitudinal direction of the case 320, with the first main surface 331a of the first element portion 330a and the first main surface 371a of the second element portion 370a facing in opposite directions.

[0068] 8, the first metal terminal 40 has a shape similar to that of the first metal terminal 40 shown in Figures 4 and 7. The first electrode connection portion 44 of the first metal terminal 40 in the electronic component 310 is connected to a first electrode portion formed on the first main surface 331a of the first element portion 330a.

[0069] 4 and 7, the second metal terminal 350 shown in FIG. 8 is symmetrical with respect to the first metal terminal 40 with respect to the center line of the electronic component 310. The second metal terminal 350 has a second mounting portion 352 disposed on the opening edge portion 322, a second electrode connecting portion 354 connected to the second electrode portion of the second element portion 370a, a second terminal arm portion 356 connecting the second mounting portion 352 and the second electrode connecting portion 354, and a second folded portion 357 extending upward from the tip of the second mounting portion 352. However, the second metal terminal 350 is similar to the second metal terminal 50 shown in FIGS. 4 and 7 except that the second electrode connecting portion 354 and the second terminal arm portion 356 are connected at different positions.

[0070] 8, electronic component 310 has a third metal terminal 380 that connects a second electrode portion formed on second main surface 331b of first element portion 330a to a first electrode portion formed on first main surface 371a of second element portion 370a. Third metal terminal 380 has a third electrode connection portion 384 that connects the second electrode portion of first element portion 330a to the first electrode portion of second element portion 370a, a third mounting portion 382 disposed on opening edge portion 322, and a third terminal arm portion 386 that connects third electrode connection portion 384 and third mounting portion 382.

[0071] The third electrode connection portion 384 and the third terminal arm portion 386 of the third metal terminal 380 are disposed within the recess 321, and the third mounting portion 382 is exposed to the outside of the recess 321. Similar to the second mounting portion 352, the third mounting portion 382 is substantially perpendicular to the first principal surfaces 331a, 371a and the second principal surfaces 331b, 371b.

[0072] 8 has a small mounting area and can be configured as an electronic component in which the first element portion 330a and the second element portion 370a are connected in series. Furthermore, because the third metal terminal 380 has the third mounting portion 382, the electronic component 310 can change the connection state of the first element portion 330a and the second element portion 370a to a circuit or the like, and can also have a configuration other than the configuration in which the first element portion 330a and the second element portion 370a are connected in series.

[0073] In addition, the electronic component 310 according to the third embodiment has the same effects as the electronic component 210 according to the second embodiment in terms of the commonalities with the electronic component 210.

[0074] Fourth embodiment Fig. 9 is a schematic perspective view of an electronic component 410 according to a fourth embodiment of the present invention. Similar to electronic component 310 shown in Fig. 8, Fig. 9 shows a see-through view of the inside of case 320 of electronic component 410, with case 320 indicated by virtual lines.

[0075] As shown in Fig. 9, electronic component 410 differs from electronic component 210 shown in Figs. 6 and 7 in that ceramic element 430 has two short-plate-shaped dielectric elements, first element portion 430a and second element portion 470a, and that first metal terminal 440 and second metal terminal 450 have different shapes. However, case 320 of electronic component 410 is similar to case 320 of electronic component 310. In the description of electronic component 410, only the differences from electronic component 210 or electronic component 410 will be described, and a description of the commonalities with electronic component 210 or electronic component 410 will be omitted.

[0076] 9, ceramic element 430 of electronic component 410 has two element portions: first element portion 430a and second element portion 470a. First element portion 430a and second element portion 470a are disposed in recess 321 of case 320.

[0077] First element portion 430a and second element portion 470a, which are disposed in recess 321 of case 320, have first main surfaces 431a, 471a and second main surfaces 431b, 471b, similar to ceramic element 30 included in electronic components 10, 210 of the first and second embodiments. That is, first element portion 430a and second element portion 470a have first electrode portions formed on first main surfaces 431a, 471a, second electrode portions formed on second main surfaces 431b, 471b, and a dielectric portion sandwiched between the first electrode portions and the second electrode portions, similar to ceramic element 30 shown in FIG. 3 (see first electrode portion 33, second electrode portion 34, and dielectric portion 35 in FIG. 3).

[0078] 9, first element portion 430a and second element portion 470a are arranged in recess 321 of case 320 so that first main surface 431a of first element portion 430a and first main surface 471a of second element portion 470a are positioned on approximately the same plane. Also, first element portion 430a and second element portion 470a are arranged in recess 321 of case 320 so that second main surface 431b of first element portion 430a and second main surface 371b of second element portion 470a are positioned on approximately the same plane.

[0079] That is, the first element portion 330a and the second element portion 370a are arranged side by side in the recess 321 along the length direction, with their first main surfaces 331a and 371a facing the same direction.

[0080] 9, the first metal terminal 440 has a different shape of the first electrode connection portion 444 from the first metal terminal 40 shown in FIGS. 4 and 7, but the first mounting portion 42, the first terminal arm portion 46, and the first folded portion 47 are the same as those of the first metal terminal 40. As shown in FIG. 9, the first electrode connection portion 444 extends in the longitudinal direction of the electronic component 410. The first electrode connection portion 444 is connected to first electrodes formed on the first main surfaces 431a, 471a of both the first element portion 430a and the second element portion 470a.

[0081] 4 and 7, the second metal terminal 450 has a different shape of the second electrode connection portion 454 than the second metal terminal 50 shown in FIGS. 4 and 7, but the second mounting portion 52, the second terminal arm portion 56, and the second folded portion 57 are the same as those of the second metal terminal 50. As shown in FIG. 9, the second electrode connection portion 454 extends in the length direction of the electronic component 510, similar to the first electrode connection portion 444. The second electrode connection portion 454 is connected to second electrodes formed on the second main surfaces 431b, 471b of both the first element portion 430a and the second element portion 470a.

[0082] 9, in electronic component 410, first electrode connection portion 444 connects the first electrode portions of first element portion 430a and second element portion 470a, and second electrode connection portion 454 connects the second electrode portions of first element portion 430a and second element portion 470a. By having such first electrode connection portion 444 and second electrode connection portion 454, electronic component 410 constitutes an electronic component that has a small mounting area and in which the dielectric portions of the two element portions are connected in parallel.

[0083] In addition, the electronic component 410 according to the fourth embodiment has the same effects as the electronic component 210 according to the second embodiment in terms of the commonalities with the electronic component 210.

[0084] Fifth embodiment Fig. 10 is a schematic perspective view of an electronic component 510 according to a fifth embodiment of the present invention, and Fig. 11 is a bottom view of the electronic component 510. Fig. 12 is a conceptual diagram showing an example of a state in which a plurality of electronic components 510 are connected together.

[0085] 10 and 11 , electronic component 510 differs from electronic component 210 shown in FIGS. 6 and 7 in that protrusions 526aa and 528aa are formed on fifth outer side surface 526a and fourth outer side surface 528a of case 520, and grooves 526ba and 528ba are formed on third outer side surface 526b and sixth outer side surface 528b of case 520. However, electronic component 510 is similar to electronic component 210 shown in FIGS. 6 and 7 except for protrusions 526aa and 528aa and grooves 526ba and 528ba formed on case 520. In describing electronic component 510, only the differences from electronic component 210 according to the second embodiment will be described, and a description of the commonalities with electronic component 10 will be omitted.

[0086] 10 and 11, case 520 has a substantially hexagonal prism-like outer shape similar to case 220 shown in Fig. 6. However, among the outer surfaces, grooves 526ba, 528ba or protrusions 526aa, 528aa are formed on third to sixth outer surfaces 526b, 528a, 526a, 528b, excluding first outer surface 524 and second outer surface 525 on which first and second folded portions 47, 57 of first and second metal terminals 40, 50 are arranged.

[0087] 11, groove portion 526ba extending in the height direction is formed on third outer surface 526b of case 520. Groove portion 526ba is formed with a gap between them and is composed of two parallel grooves. The two grooves constituting groove portion 526ba continue to opening edge portion 522.

[0088] 10 and 11, a protrusion 528aa extending in the height direction is formed on the fourth outer surface 528a of the case 520. The protrusion 528aa corresponds to the shape of the groove 526ba formed on the third outer surface 526b and is composed of two parallel protrusions. The two protrusions constituting the protrusion 528aa continue to the opening edge 522.

[0089] Fig. 12 is a conceptual diagram showing a state in which multiple electronic components 510 are connected together. As shown in Fig. 12, a protrusion 528aa formed on the fourth outer surface 528a can be engaged with a groove 526ba formed on a third outer surface 526b, which is parallel to the fourth outer surface 528a, of another electronic component 510 of the same shape. As shown in Fig. 12, by engaging the protrusion 528aa with the groove 526ba, multiple electronic components 510 can be connected together.

[0090] A protrusion 526aa similar to the protrusion 528aa on the fourth outer surface 528a is formed on the fifth outer surface 526a of the case 520. A groove 528ba similar to the groove 526ba on the third outer surface 526b is formed on the sixth outer surface 528b of the case 520. The protrusion 526aa can engage with a groove 528ba formed in the sixth outer surface 528b, which is parallel to the fifth outer surface 526a, of another electronic component 510 of the same shape. Therefore, multiple electronic components 510 can be connected by engaging the protrusion 526aa with the groove 528ba.

[0091] By connecting multiple electronic components 510 shown in Figures 10 to 12, when transporting them to a mounting board or the like using a mounting machine, the multiple connected electronic components 510 (see Figure 12) can be transported at once, thereby improving mounting efficiency.

[0092] In addition, the electronic component 410 according to the fourth embodiment has the same effects as the electronic component 210 according to the second embodiment in terms of the commonalities with the electronic component 210.

[0093] While the electronic component according to the present invention has been described above using the embodiments, it goes without saying that the present invention is not limited to the above-described embodiments and includes many other embodiments and modifications. For example, the recess of the case may house multiple ceramic elements stacked one on top of the other, or three or more ceramic elements may be arranged in a row along the length of the case.

[0094] Furthermore, protrusions and grooves similar to protrusions 528aa and grooves 526ba of electronic component 510 may be formed on the outer surface of electronic component 10 having a substantially quadrangular prism shape. [Explanation of symbols]

[0095] 10, 210, 310, 410, 510...Electronic components 20, 220, 320, 520…case 21, 321...recess 21a, 321a...Aperture 22, 222, 322, 522...Opening edge 24, 224, 324, 524...first outer surface 25, 225, 325, 525…Second outer surface 226a, 326a, 526a...5th outer surface 226b, 326b, 526b...Third outer surface 228a, 328a, 528a...4th outer surface 228b, 328b, 528b...6th outer surface 30, 330, 430...ceramic element 330a, 430a...first element portion 370a, 470a...second element portion 31a, 331a, 371a, 431a, 471a...first principal surface 33...First electrode part 31b, 331b, 371b, 431b, 471b...Second principal surface 34…Second electrode part 35...Dielectric part W1…Diameter W2…Depth 40, 440...1st metal terminal 42...First mounting section 42a, 52a...tip 44, 244, 444...First electrode connection portion 47...First fold 46...1st terminal arm 50, 350, 450…Second metal terminal 52, 352...Second mounting section 54, 354, 454...Second electrode connection part 56, 356...Second terminal arm 57, 357...Second fold 380…Third metal terminal 382...Third mounting section 384...Third electrode connection part 386...Third terminal arm 526aa, 528aa...Protrusion 526ba, 528ba…Groove

Claims

1. a case having a recess and an opening edge of the recess; a ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a first electrode connecting portion connected to the first electrode portion; a second metal terminal including a second mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a second electrode connecting portion connected to the second electrode portion; the ceramic element includes a first element portion and a second element portion, each of which has the first main surface, the second main surface, the first electrode portion, and the second electrode portion; the first element portion and the second element portion are arranged in the recessed portion side by side along the length direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing in opposite directions, the first electrode connection portion is connected to the first electrode portion of the first element portion, the second electrode connection portion is connected to the second electrode portion of the second element portion, an electronic component having a third metal terminal connecting the second electrode portion of the first element portion and the first electrode portion of the second element portion;

2. 2. The electronic component according to claim 1, wherein the first element portion and the second element portion are arranged in the recess so that the first main surface of the first element portion and the second main surface of the second element portion are located on approximately the same plane, and the second main surface of the first element portion and the first main surface of the second element portion are located on approximately the same plane.

3. 3. The electronic component according to claim 1, wherein the third metal terminal has a third electrode connection portion that connects the second electrode portion of the first element portion and the first electrode portion of the second element portion, and a third mounting portion that is arranged on the opening edge portion and is approximately perpendicular to the first main surface and the second main surface.

4. A case having a recess and an opening edge of the recess; a ceramic element disposed in the recess, having a first main surface and a second main surface facing each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a first electrode connecting portion connected to the first electrode portion; a second metal terminal including a second mounting portion disposed on the opening edge portion and substantially perpendicular to the first main surface and the second main surface, and a second electrode connecting portion connected to the second electrode portion; the ceramic element includes a first element portion and a second element portion, each of which has the first main surface, the second main surface, the first electrode portion, and the second electrode portion; the first element portion and the second element portion are arranged in the recessed portion side by side along the length direction of the case with the first main surface of the first element portion and the first main surface of the second element portion facing the same direction, the first electrode connection portion is connected to the first electrode portions of both the first element portion and the second element portion, The second electrode connection portion is connected to the second electrode portions of both the first element portion and the second element portion.

5. 5. The electronic component according to claim 4, wherein the first element portion and the second element portion are arranged in the recess so that the first main surface of the first element portion and the first main surface of the second element portion are located on approximately the same plane, and the second main surface of the first element portion and the second main surface of the second element portion are located on approximately the same plane.

6. the case has first and second outer side surfaces that are substantially perpendicular to the first and second main surfaces and the first and second mounting portions and face in opposite directions; a distance from a tip of the first mounting portion to the first outer surface is shorter than a distance from the tip of the first mounting portion to the recess; The electronic component according to claim 1 , wherein a distance from a tip of the second mounting portion to the second outer surface is shorter than a distance from the tip of the second mounting portion to the recess.

7. 7. The electronic component according to claim 1, wherein at least a portion of the edge of the opening in the case is visible from below.

8. 8. The electronic component according to claim 1, wherein the case has a substantially hexagonal prism shape, and both outer surfaces of the case are non-parallel to the first main surface and the second main surface.

9. a groove formed on a third outer surface of the case; 9. The electronic component according to claim 1, further comprising: a protrusion formed on a fourth outer surface of the case, the protrusion having a shape corresponding to the groove.

10. the first metal terminal has a first folded portion extending upward from a tip of the first mounting portion along an outer surface of the case, The electronic component according to claim 1 , wherein the second metal terminal has a second folded portion that extends upward from a tip of the second mounting portion along an outer surface of the case.

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