Thin film capacitor assembly and motor controller

Abstract

The disclosure provides a thin film capacitor assembly and a motor controller, and belongs to the technical field of motors. The thin film capacitor assembly comprises a plurality of cooling pipes, a plurality of columns of silicon carbide single pipes and a plurality of columns of capacitor cores. The plurality of cooling pipes are arranged side by side, and a cooling channel is formed between adjacent two cooling pipes, and the cooling pipes have cooling liquid. Each column of silicon carbide single pipes is located in a cooling channel, and each column of capacitor cores is located in a cooling channel, and the silicon carbide single pipes and the capacitor cores are located in different cooling channels. In this way, the heat dissipation effect inside the thin film capacitor assembly can be better, the temperature of the thin film capacitor assembly can be prevented from being too high, and the temperature resistance of the thin film capacitor assembly can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electric machines, and in particular to a film capacitor assembly and an electric machine controller. BACKGROUND

[0002] The film capacitor assembly is a core component in the electric machine controller of a vehicle, and the film capacitor assembly plays a role of energy storage and current buffering in the electric machine controller.

[0003] However, the film capacitor assembly generates a large amount of heat when working, and if the temperature is too high, the film capacitor assembly will be damaged. SUMMARY

[0004] The present disclosure provides a film capacitor assembly, which can solve the technical problems in the related art. The technical scheme of the film capacitor assembly is as follows.

[0005] In a first aspect, the present disclosure provides a film capacitor assembly, which comprises a plurality of cooling pipes, a plurality of columns of silicon carbide single pipes and a plurality of columns of capacitor cores.

[0006] The plurality of cooling pipes are arranged side by side, and a cooling channel is formed between adjacent two cooling pipes. The cooling pipes contain cooling liquid.

[0007] Each column of silicon carbide single pipes is located in one cooling channel, and each column of capacitor cores is located in one cooling channel. The silicon carbide single pipes and the capacitor cores are located in different cooling channels.

[0008] In a possible implementation, the film capacitor assembly further comprises two interfaces.

[0009] The two interfaces are respectively connected to two ends of the cooling pipes.

[0010] The interface has a common interface and a plurality of branch interfaces. The common interface and the plurality of branch interfaces are in communication. Each branch interface is connected to one cooling pipe, and the common interface is used to connect an external water pipe.

[0011] In a possible implementation, a sealing agent is arranged between the inner wall of the branch interface and the outer wall of the cooling pipe.

[0012] In a possible implementation, the cooling pipe comprises a pipe body and a support plate.

[0013] The support plate is fixed to the inside of the pipe body and extends along the length direction of the pipe body.

[0014] In a possible implementation, the width X1 of the cooling pipe is 3mm-5mm.

[0015] In a possible implementation, the thin-film capacitor assembly further comprises a plurality of limiting blocks.

[0016] In each column of silicon carbide single tubes, there is one limiting block between two adjacent silicon carbide single tubes.

[0017] In each column of capacitor cores, there is one limiting block between two adjacent capacitor cores.

[0018] In a possible implementation, the limiting block has a through hole, the through hole encircles the cooling pipe, and the side walls on both sides of the through hole are located in the cooling channel.

[0019] In a possible implementation, the width X2 of the silicon carbide single tube is the same as the width X3 of the capacitor core.

[0020] In a possible implementation, the thin-film capacitor assembly further comprises a positive copper electrode, a negative copper electrode, and a three-phase copper electrode.

[0021] The positive copper electrode is electrically connected to the first positive electrode of the silicon carbide single tube and the second positive electrode of the capacitor core.

[0022] The negative copper electrode is electrically connected to the first negative electrode of the silicon carbide single tube and the second negative electrode of the capacitor core.

[0023] The three-phase copper electrode is electrically connected to the output electrode of the silicon carbide single tube.

[0024] In a second aspect, the disclosure also provides a motor controller, which comprises the thin-film capacitor assembly according to any one of the first aspect.

[0025] The technical solutions provided by the disclosure have at least the following beneficial effects:

[0026] The disclosure provides a thin-film capacitor assembly, each column of silicon carbide single tubes is arranged in a cooling channel between two cooling pipes, so that both sides of the silicon carbide single tube can be well cooled. Similarly, each column of capacitor cores is arranged in a cooling channel between two cooling pipes, so that both sides of each column of capacitor cores can be well cooled. In this way, the cooling effect inside the thin-film capacitor assembly can be better, the temperature of the thin-film capacitor assembly can be prevented from being too high, and the temperature resistance of the thin-film capacitor assembly can be improved.

[0027] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, further serve to explain the principles of the present disclosure. In the drawings:

[0029] Figure 1 is a structural schematic diagram of a thin-film capacitor assembly according to an embodiment of the present disclosure;

[0030] Figure 2 is a structural schematic diagram of a thin-film capacitor assembly according to an embodiment of the present disclosure;

[0031] Figure 3 is an exploded view of a thin-film capacitor assembly according to an embodiment of the present disclosure;

[0032] Figure 4 is a structural schematic diagram of an interface according to an embodiment of the present disclosure;

[0033] Figure 5 is a structural schematic diagram of an interface according to an embodiment of the present disclosure;

[0034] Figure 6 is a structural schematic diagram of an interface according to an embodiment of the present disclosure;

[0035] Figure 7 is a structural schematic diagram of an interface according to an embodiment of the present disclosure;

[0036] Figure 8 is a structural schematic diagram of an interface according to an embodiment of the present disclosure;

[0037] Figure 9 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0038] Figure 10 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0039] Figure 11 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0040] Figure 12 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0041] Figure 13 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0042] Figure 14 is a structural schematic diagram of a cooling tube according to an embodiment of the present disclosure;

[0043] Figure 15 is a structural schematic diagram of a silicon carbide single tube according to an embodiment of the present disclosure;

[0044] Figure 16 is a structural schematic diagram of a silicon carbide single tube according to an embodiment of the present disclosure;

[0045] Figure 17 is a structural schematic diagram of a silicon carbide single tube according to an embodiment of the present disclosure;

[0046] Figure 18 is a structural schematic diagram of a capacitor core according to an embodiment of the present disclosure;

[0047] Figure 19 is a structural schematic diagram of a capacitor core according to an embodiment of the present disclosure;

[0048] Figure 20 is a structural schematic diagram of a capacitor core according to an embodiment of the present disclosure;

[0049] Figure 21 is a structural schematic diagram of a capacitor core according to an embodiment of the present disclosure;

[0050] Figure 22 is a structural schematic diagram of a positive copper electrode according to an embodiment of the present disclosure;

[0051] Figure 23 is a structural schematic diagram of a positive copper electrode according to an embodiment of the present disclosure;

[0052] Figure 24 is a structural schematic diagram of a positive copper electrode according to an embodiment of the present disclosure;

[0053] Figure 25 is a structural schematic diagram of a three-phase copper electrode according to an embodiment of the present disclosure;

[0054] Figure 26 is a structural schematic diagram of a three-phase copper electrode according to an embodiment of the present disclosure;

[0055] Figure 27 is a structural schematic diagram of a three-phase copper electrode according to an embodiment of the present disclosure;

[0056] Figure 28 is a structural schematic diagram of a thin-film capacitor assembly according to an embodiment of the present disclosure;

[0057] Figure 29 is a structural schematic diagram of a thin-film capacitor assembly according to an embodiment of the present disclosure;

[0058] Figure 30 is a structural schematic diagram of a thin-film capacitor assembly according to an embodiment of the present disclosure.

[0059] Legend:

[0060] 1. Cooling pipe, 10. Cooling channel, 11. Pipe body, 12. Support plate;

[0061] 2. Silicon carbide single pipe, 21. First positive electrode, 22. First negative electrode;

[0062] 3. Capacitor core, 31. Second positive electrode, 32. Second negative electrode, 33. Output electrode;

[0063] 4. Interface, 41. Common interface, 42. Branch interface;

[0064] 5. Limiting block, 50. Through hole;

[0065] 6. Positive copper electrode, 61. First sub-positive copper electrode, 62. Second sub-positive copper electrode;

[0066] 7. Negative copper electrode;

[0067] 8. Three-phase copper electrode.

[0068] The specific embodiments of the present disclosure have been shown in the above-described drawings, and will be described in more detail hereinafter. These drawings and written descriptions are not intended to limit the scope of the concept of the present disclosure in any way, but to illustrate the concept of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0069] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in further detail below with reference to the drawings.

[0070] The terms used in the embodiments of the present disclosure are only used to explain the embodiments of the present disclosure, and are not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used herein should be understood as the general meaning understood by those skilled in the art to which the present disclosure belongs. The terms "first", "second", "third" and the like used in the specification and claims of the present patent application do not represent any order, number or importance, but are only used to distinguish different components. Similarly, "one" or "a" and the like do not represent a quantity limitation, but represent the existence of at least one. The terms "include" or "contain" and the like mean that the elements or objects appearing before "include" or "contain" cover the elements or objects listed after "include" or "contain" and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and the like are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0071] In the field of new energy vehicle drive motor control today, IGBT (Insulated Gate Bipolar Transistor) and thin film capacitor components are the core components in the motor controller.

[0072] Insulated gate bipolar transistor is a core device for energy conversion and transmission, which is a composite full-controlled voltage drive power semiconductor device composed of BJT (Bipolar Junction Transistor) and MOS (Metal Oxide Semiconductor), and has the characteristics of high input impedance and low on-state voltage drop. The motor controller needs to provide a large instantaneous current when driving the motor to start, and the distribution inductance of the wire from the battery to the motor controller causes the inability to output such a large current instantaneously, so a thin film capacitor component needs to be added as a buffer. In addition, when the vehicle brakes, the motor instantaneously feeds back a large current, which cannot be completely absorbed by the battery in a short time, so a thin film capacitor component is added as an energy storage. The fast charging and discharging characteristics of the thin film capacitor component play a role in buffering and energy storage in the motor controller.

[0073] At present, the base material of the thin film capacitor in the motor controller has a temperature resistance of 105 DEG C, and no new high-temperature-resistant material will be applied in batches in the short term. The temperature resistance of other electronic auxiliary materials, including IGBT, can be increased to 125 DEG C. The temperature of the applied silicon carbide module is easily reached to 175 DEG C. In the electric drive system of passenger cars, the temperature resistance of the thin film capacitor has become the biggest obstacle to improve the power upper limit of the motor controller.

[0074] In view of the above technical problems, the present embodiment provides a thin film capacitor component, as shown in Figures 1-3 The thin film capacitor component includes a plurality of cooling pipes 1, a plurality of columns of silicon carbide single pipes 2 and a plurality of columns of capacitor cores 3. The plurality of cooling pipes 1 are arranged side by side, and a cooling channel 10 is formed between adjacent two cooling pipes 1. The cooling pipe 1 has a cooling liquid therein. Each column of silicon carbide single pipes 2 is located in a cooling channel 10, and each column of capacitor cores 3 is located in a cooling channel 10, and the silicon carbide single pipes 2 and the capacitor cores 3 are located in different cooling channels 10.

[0075] Each column of silicon carbide single pipes 2 has a plurality of silicon carbide single pipes 2 arranged along the length direction of the cooling channel 10, and each column of capacitor cores 3 has a plurality of capacitor cores 3 arranged along the length direction of the cooling channel 10.

[0076] The number of columns of silicon carbide single pipes 2 is the same as the number of columns of capacitor cores 3, and each column of capacitor cores 3 is located on the same side of the silicon carbide single pipes 2.

[0077] The cooling liquid in the cooling pipe 1 can be water.

[0078] The height of the cooling pipe 1 is greater than or equal to the height of the silicon carbide single tube 2 and the height of the capacitor core 3.

[0079] The technical solution provided by the embodiments of the present disclosure is that each column of silicon carbide single tubes 2 is arranged in the cooling channel 10 between two cooling pipes 1, so that both sides of the silicon carbide single tube 2 can be well cooled. Similarly, each column of capacitor cores 3 is arranged in the cooling channel 10 between two cooling pipes 1, so that both sides of each column of capacitor cores 3 can be well cooled. In this way, the heat dissipation effect inside the film capacitor assembly can be better, the temperature of the film capacitor assembly can be prevented from being too high, and the temperature resistance of the film capacitor assembly can be improved.

[0080] The two ends of the cooling pipe 1 are respectively used for connecting and discharging the cooling liquid. In some examples, as shown in Figures 3-8 The film capacitor assembly further includes two interfaces 4, and the two interfaces 4 are respectively connected to the two ends of the cooling pipe 1. The interface 4 has a common interface 41 and a plurality of branch interfaces 42, and the common interface 41 and the plurality of branch interfaces 42 are in communication. Each branch interface 42 is connected to one cooling pipe 1, and the common interface 41 is used for connecting an external water pipe.

[0081] The common interface 41 of one of the interfaces 4 is used for connecting a water inlet pipe. After the cooling liquid is introduced into the common interface 41 through the water inlet pipe, the cooling liquid is dispersed to the plurality of branch interfaces 42, so that the cooling liquid enters each cooling pipe 1. The other interface 4 is used for connecting a water outlet pipe. The cooling liquid in each cooling pipe 1 enters the common interface 41 through the branch interface 42, and then enters the water outlet pipe. In this way, the cooling liquid flows in each cooling pipe 1, so that the heat of each column of silicon carbide single tubes 2 and each column of capacitor cores 3 can be continuously taken away, and the heat dissipation efficiency of the film capacitor assembly is improved.

[0082] In some examples, as shown in Figures 6-8 The length X4 of the interface 4 is 24 mm, the width Y4 is 62 mm, and the height Z4 is 24.9 mm.

[0083] In some examples, the inner wall of the branch interface 42 has a sealing agent. In this way, the sealing property between the branch interface 42 and the cooling pipe 1 can be ensured, and the cooling liquid can be prevented from leaking from the connection between the branch interface 42 and the cooling pipe 1, so that the film capacitor assembly is not easily damaged.

[0084] Of course, in other examples, in order to ensure the sealing property between the branch interface 42 and the cooling pipe 1, a sealing ring or a sealing pad can also be arranged on the inner wall of the branch interface 42, which is not limited in the embodiments of the present disclosure.

[0085] In some examples, as shown in Figure 9As shown, the cooling pipe 1 comprises a pipe body 11 and a support plate 12, the support plate 12 is fixed to the inside of the pipe body 11 and extends along the length direction of the pipe body 11. The cooling pipe 1 has a high height, and the support plate 12 can strengthen the strength of the cooling pipe 1 and avoid deformation of the cooling pipe 1.

[0086] As shown in the example, Figure 9 As shown, the cooling pipe 1 has two support plates 12, and the two support plates 12 are parallel and arranged along the height direction of the pipe body 11. In this way, the flow of the cooling liquid is facilitated, and the support plates 12 do not hinder the discharge of the cooling liquid.

[0087] Of course, in other examples, the two support plates 12 can also be arranged in parallel, and the embodiments of the present disclosure do not make specific limitations on this.

[0088] The number of support plates 12 is not limited in the embodiments of the present disclosure, and can be 1-5.

[0089] In some examples, as shown in the example, Figure 10 The width X1 of the cooling pipe 1 is 3-5 mm. The width D of the cooling pipe 1 is small, so that the cooling pipe 1 occupies a small space, which is beneficial to reduce the volume of the film capacitor assembly.

[0090] In some examples, as shown in the example, Figure 11 The length Y1 of the cooling pipe 1 is 132.5 mm, and the height Z1 is 20.9 mm.

[0091] In some examples, as shown in the example, Figure 3 The film capacitor assembly further comprises a plurality of limiting blocks 5. In each column of silicon carbide single pipes 2, there is one limiting block 5 between the adjacent two silicon carbide single pipes 2. In each column of capacitor cores 3, there is one limiting block 5 between the adjacent two capacitor cores 3.

[0092] The limiting block 5 plays a limiting role on the silicon carbide single pipe 2 and the capacitor core 3, avoids displacement of the silicon carbide single pipe 2 and the capacitor core 3, and causes damage to the film capacitor assembly, thereby enhancing the stability of the film capacitor assembly.

[0093] In some examples, as shown in the example, Figure 12 The limiting block 5 has a through hole 50, the through hole 50 sleeves the cooling pipe 1, and the side walls on both sides of the through hole 50 are located in the cooling channel 10.

[0094] In some examples, as shown in the example, Figure 12 The limiting block 5 comprises two plate bodies 51 and a pipe body 52, the two plate bodies 51 are connected with the two ends of the pipe body 52 respectively, and the pipe body 52 has a through hole 50. The length Y5 of the plate body 51 is greater than the length Y52 of the pipe body 52. In this way, the plate body 51 can realize height direction limiting of the silicon carbide single pipe 2 and the capacitor core 3. In some examples, as shown in the example,

[0095] In some examples, as shown in Figure 13 and Figure 14 , the length Y5 of the limiting block 5 is 10.5 mm, the width X5 is 8 mm, and the height Z5 is 25 mm. Among them, the height Z52 of the tube body 52 is 21 mm, and the width X50 of the through hole 50 is 4 mm.

[0096] In some examples, the width X2 of the silicon carbide single tube 2 is the same as the width X3 of the capacitor core 3. In this way, the silicon carbide single tube 2 and the capacitor core 3 are arranged in the cooling channel 10. If the width X2 of the silicon carbide single tube 2 is different from the width X3 of the capacitor core 3, two cooling channels 10 with different widths need to be set. In this way, the complexity of assembling the film capacitor assembly is increased.

[0097] In some examples, as shown in Figure 16 and Figure 17 , the length Y2 of the silicon carbide single tube 2 is 15.9 mm, the width X2 is 5.1 mm, and the height Z2 is 24.8 mm. As shown in Figure 20 and Figure 21 , the length Y3 of the capacitor core 3 is 15.9 mm, the width X3 is 5.1 mm, and the height Z3 is 22 mm. The sizes of the silicon carbide single tube 2 and the capacitor core 3 are similar, which is conducive to reducing the volume of the film capacitor assembly.

[0098] In some examples, as shown in Figure 3 , Figure 15 and Figure 18 , the film capacitor assembly further includes a positive copper electrode 6, a negative copper electrode 7, and a three-phase copper electrode 8. The positive copper electrode 6 is electrically connected to the first positive electrode 21 of the silicon carbide single tube 2 and the second positive electrode 31 of the capacitor core 3, and the negative copper electrode 7 is electrically connected to the first negative electrode 22 of the silicon carbide single tube 2 and the second negative electrode 32 of the capacitor core 3. The three-phase copper electrode 8 is electrically connected to the output electrode 23 of the silicon carbide single tube 2.

[0099] In some examples, as shown in Figure 17 , the first positive electrode 21 and the output electrode 23 are located on the same side of the silicon carbide single tube 2, and the first negative electrode 22 is located on the side opposite to the first positive electrode 21 of the silicon carbide single tube 2.

[0100] In some examples, as shown in Figure 22 , the positive copper electrode 6 includes a first sub-positive copper electrode 61 and a plurality of second sub-positive copper electrodes 62. The first sub-positive copper electrode 61 is rectangular, and the plurality of second sub-positive copper electrodes 62 are connected to the first sub-positive copper electrode 61 and arranged side by side. The first sub-positive copper electrode 61 is electrically connected to the first positive electrode 21, and the second sub-positive copper electrode 62 is electrically connected to the second positive electrode 31. As shown in Figure 25 , the three-phase copper electrode 8 is in the shape of U, and the two sides of the three-phase copper electrode 8 are respectively located on the two sides of the second sub-positive copper electrode 62.

[0101] In some examples, as shown in Figure 23 and Figure 24 The length of the positive copper pole 6 is 120.1 mm, the width is 59.2 mm, and the thickness is 2.3 mm. The negative copper pole 7 has the same structure and size as the positive copper pole 6, which will not be described here. Figure 26 and Figure 27 The length Y8 of the three-phase copper pole 8 is 30.7 mm, the width X8 is 27.8 mm, and the thickness Z8 is 3.3 mm.

[0102] In some examples, as shown in Figures 28-30 The length Y of the thin film capacitor assembly is 171.5 mm, the width X is 68.2 mm, and the height Z is 27.1 mm.

[0103] Next, the assembly process of the thin film capacitor assembly is described.

[0104] Step 1: Customize the required size of the silicon carbide single tube 2.

[0105] Step 2: After overlapping the metal foil electrode and the plastic film from both ends, winding, and then extruding and forming the capacitor core 3 with the same structure and size as the silicon carbide single tube 2.

[0106] Step 3: After coating the port of the cooling pipe 1 with a fixing sealant, sequentially assembling it into the branch port 42 of an interface 4, and then heating and hardening, a plurality of cooling channels 10 are formed.

[0107] Step 4: Fix the semi-finished product of Step 3 with a tool.

[0108] Step 5: Sequentially assemble the silicon carbide single tube 2 and the capacitor core 3 according to the required number and order between the cooling channels 10 of the semi-finished product of Step 4.

[0109] Step 6: Sequentially pass the limiting block 5 through the cooling pipe 1 and clamp the silicon carbide single tube 2 and the capacitor core 3.

[0110] Step 7: Repeat the operations of Step 5 and Step 6 until the final assembly of the silicon carbide single tube 2 and the capacitor core 3 is completed.

[0111] Step 8: First, evenly coat the branch port 42 of another interface 4 with a fixing sealant, then assemble the water outlet branch port 42 to the cooling pipe 1, and press the silicon carbide single tube 2 and the capacitor core 3.

[0112] Step 9: Place the semi-finished product of Step 8 into a heating furnace to heat and harden the fixing sealant.

[0113] Step 10: Test for leaks by passing water through the cooling pipe 1, and then air dry after passing the test.

[0114] The tenth step is to evenly apply solder paste to all the silicon carbide single tubes 2 first negative electrodes 22 and the capacitor core 3 second negative electrode 32 after air drying.

[0115] The twelfth step is to place the negative copper electrode 7 on the first negative electrode 22 and the second negative electrode 32 after the solder paste is applied, and then complete the welding through the flow soldering furnace.

[0116] The thirteenth step is to evenly apply solder paste to the welding area of the positive copper electrode 6 and the three-phase copper electrode 8, and then assemble them to the first positive electrode 21 of the silicon carbide single tube 2 and the second positive electrode 31 of the capacitor core 3, respectively, and finally complete the welding through the flow soldering furnace.

[0117] The thin film capacitor assembly provided by the embodiment of the present disclosure has strong universality of parts and simple forming method. The power level of the motor controller can be adjusted only by changing the number of the silicon carbide single tube 2, the capacitor core 3 and the cooling tube 1, which greatly reduces the mold cost and production cost of the product parts. Moreover, the procurement cost of the thin film capacitor assembly in the embodiment of the present disclosure is greatly reduced, and the procurement cycle is short. At the same time, the diversity of the motor controller power device is also improved, breaking the single situation of the selection of the motor controller power device in the past, thereby greatly reducing the cost of the motor controller and the production cost of the whole vehicle, promoting the popularization of new energy vehicles, and taking an immeasurable effect on reducing CO2 emissions and alleviating the greenhouse effect. In addition, the thin film capacitor assembly provided by the embodiment of the present disclosure has a small size, so as to reduce the structural size of the motor controller, thereby improving the power density of the motor controller and the market competitiveness of the product.

[0118] The embodiment of the present disclosure also provides a motor controller, which comprises the above-mentioned thin film capacitor assembly.

[0119] The motor controller provided by the embodiment of the present disclosure has good heat dissipation capacity of the thin film capacitor assembly in the motor controller, so that the temperature resistance of the motor controller is strong, thereby improving the output current and power of the motor controller. Moreover, the diversity of the motor controller power device is also improved, breaking the single situation of the selection of the motor controller power device in the past, thereby greatly reducing the cost of the motor controller and the production cost of the whole vehicle, and promoting the popularization of new energy vehicles.

[0120] The above only describes optional embodiments of the present disclosure, and does not limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A thin film capacitor assembly characterized by, The thin film capacitor assembly comprises a plurality of cooling pipes (1), a plurality of columns of silicon carbide single pipes (2), a plurality of columns of capacitor cores (3) and limiting blocks (5); The plurality of cooling pipes (1) are arranged side by side, and a cooling channel (10) is formed between adjacent two cooling pipes (1). The cooling pipe (1) comprises a pipe body (11) and a supporting plate (12). The supporting plate (12) is fixed to the inside of the pipe body (11) and extends along the length direction of the pipe body (11). The pipe body (11) has a cooling liquid therein; Each column of silicon carbide single pipes (2) is located in one cooling channel (10), and each column of capacitor cores (3) is located in one cooling channel (10). The silicon carbide single pipes (2) and the capacitor cores (3) are located in different cooling channels (10); The width X2 of the silicon carbide single pipe (2) is the same as the width X3 of the capacitor core (3); The limiting block (5) comprises two plate bodies (51) and a pipe body (52). The two plate bodies (51) are respectively connected with the two ends of the pipe body (52). The pipe body (52) has a through hole (50). The length of the plate body (51) is greater than the length of the pipe body (52). The through hole (50) surrounds the cooling pipe (1), and the side walls on both sides of the through hole (50) are located in the cooling channel (10); In each column of silicon carbide single pipes (2), one limiting block (5) is arranged between adjacent two silicon carbide single pipes (2). In each column of capacitor cores (3), one limiting block (5) is arranged between adjacent two capacitor cores (3).

2. The thin film capacitor assembly of claim 1, wherein, The thin film capacitor assembly further comprises two interfaces (4); The two interfaces (4) are respectively connected with the two ends of the cooling pipe (1); The interface (4) has a common interface (41) and a plurality of branch interfaces (42). The common interface (41) and the plurality of branch interfaces (42) are communicated. Each branch interface (42) is connected with one cooling pipe (1). The common interface (41) is used for connecting an external water pipe.

3. The thin film capacitor assembly of claim 2, wherein, A sealing agent is arranged between the inner wall of the branch interface (42) and the outer wall of the cooling pipe (1).

4. The thin film capacitor assembly of claim 1, wherein The width X1 of the cooling pipe (1) is 3-5 mm.

5. The film capacitor assembly of any of claims 1-4, wherein, The thin film capacitor assembly further comprises a positive copper electrode (6), a negative copper electrode (7) and a three-phase copper electrode (8); The positive copper electrode (6) is electrically connected with the first positive electrode (21) of the silicon carbide single pipe (2) and the second positive electrode (31) of the capacitor core (3); The negative copper electrode (7) is electrically connected with the first negative electrode (22) of the silicon carbide single pipe (2) and the second negative electrode (32) of the capacitor core (3); The three-phase copper electrode (8) is electrically connected with the output electrode (23) of the silicon carbide single pipe (2).

6. An electric machine controller characterized by The motor controller comprises the thin film capacitor assembly according to any one of claims 1-5.

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