Component mounting device, mounting head, and method of manufacturing the mounting head

Abstract

To provide a component mounting device, a mounting head and a manufacturing method of the mounting head which can sufficiently secure the holding force of a nozzle while suppressing reduction in the mechanical strength (fatigue strength) due to heat in the time of welding of a leaf spring for nozzle holding that holds the nozzle.SOLUTION: A mounting head 71 of a component mounting device 1000 comprises: a head body part 711; and a plurality of plate-like leaf springs 714 for nozzle holding which are attached to the head body part 711 and hold a nozzle 72 by sandwiching the nozzle in a detachable manner. Each of the plurality of leaf springs 714 for nozzle holding includes: a first plate-like part 714b and a second plate-like part 714c which are bent and superimposed; and an engagement part 714a which is provided in at least one of the first plate-like part 714b and the second plate-like part 714c and is engaged with the nozzle 72.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus, a mounting head, and a method for manufacturing the mounting head, and more particularly to a component mounting apparatus, a mounting head, and a method for manufacturing the mounting head, which mount components on a substrate. [Background technology]

[0002] BACKGROUND ART Conventionally, component mounting apparatuses that mount components on a board have been known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses an electronic component mounting device (component mounting device) that mounts components on a board. This electronic component mounting device includes a component supply station (component supply section) and a head unit. The component supply station is configured to supply components to be mounted on the board. The head unit includes a head to which a nozzle that sucks up the component is detachably attached. The head has a nozzle holder and a leaf spring. The nozzle holder has a space into which the upper end of the nozzle is inserted.

[0004] The leaf springs in Patent Document 1 are attached as a pair to a nozzle holder while facing each other. Each of the pair of leaf springs has an engaging portion that engages with a groove formed in the nozzle. When the upper end of the nozzle is inserted into the space in the nozzle holder, the pair of leaf springs are configured to elastically deform in directions away from each other, and then the engaging portions engage with the grooves formed in the nozzle, thereby holding the nozzle. Furthermore, when the nozzle is pulled in the direction opposite to the insertion direction, the pair of leaf springs are also configured to elastically deform in directions away from each other, thereby disengaging the engaging portions from the grooves in the nozzle, thereby releasing the nozzle from its holding position. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-283187 Summary of the Invention [Problem to be solved by the invention]

[0006] Although not explicitly stated in Patent Document 1, it is conceivable that in an electronic component mounting device such as that described in Patent Document 1, each of a pair of leaf springs may have two leaf springs stacked on top of each other to improve the nozzle holding force. In such a case, when an installation worker attaches the two leaf springs to the nozzle holder, the two leaf springs are conventionally joined by spot welding to keep them stacked together so that they do not come apart.

[0007] However, when using the conventional techniques described above, heat applied to the leaf springs during spot welding reduces the mechanical strength (fatigue strength) of the leaf springs at and around the spot-welded portion. Here, leaf springs in electronic component mounting devices such as those described in Patent Document 1 undergo repeated elastic deformation to hold and release the nozzle each time a nozzle is attached to or detached from the head. As a result, the stress generated during elastic deformation can cause irreversible deformation and a reduction in the holding force of two leaf springs joined using the conventional techniques described above at the portion where the mechanical strength (fatigue strength) has been reduced by spot welding. Therefore, to prevent this from occurring, it is desirable to ensure sufficient nozzle holding force while suppressing the reduction in mechanical strength (fatigue strength) of the leaf springs that hold the nozzles (nozzle holding leaf springs) due to the heat generated during welding.

[0008] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting device, a mounting head, and a method for manufacturing a mounting head that can ensure sufficient nozzle holding force while suppressing a decrease in mechanical strength (fatigue strength) caused by heat during welding of the nozzle holding leaf spring that holds the nozzle. [Means for solving the problem]

[0009] In order to achieve the above object, a component mounting device in a first aspect of the present invention comprises a head unit including a component supply unit that supplies components to be mounted on a board, and a mounting head having a nozzle detachably attached to its tip and using the nozzle to pick up the components supplied by the component supply unit and mount them on the board, the mounting head having a head main body and a plurality of elastically deformable plate-shaped nozzle holding leaf springs that are attached to the head main body and detachably clamp and hold the nozzles, each of the plurality of nozzle holding leaf springs having first and second plate-shaped portions that are bent and stacked, and an engaging portion that is provided on at least one of the first and second plate-shaped portions and engages with the nozzle.

[0010] As described above, a component mounting device according to a first aspect of the present invention includes a plurality of elastically deformable, plate-shaped nozzle-retaining leaf springs that detachably sandwich and hold a nozzle. Each of the plurality of nozzle-retaining leaf springs has a first plate-shaped portion and a second plate-shaped portion that are folded and overlapped. By folding and overlapping the first and second plate-shaped portions, the elastic force of the nozzle-retaining leaf spring can be increased compared to a single leaf spring, thereby improving the nozzle-retaining force of the nozzle-retaining leaf spring. Furthermore, because the nozzle-retaining leaf spring is formed by folding and overlapping the first and second plate-shaped portions, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that is caused by heat during welding can be suppressed. As a result, a sufficient nozzle-retaining force can be ensured while suppressing a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that is caused by heat during welding. Furthermore, because the nozzle retention leaf spring is formed by bending and overlapping the first and second plate portions without the need for spot welding, the manufacturing worker who produces the nozzle retention leaf spring does not need to perform the cumbersome task of overlapping the first and second plate portions, which are separate plate-shaped members, and welding the first and second plate portions together with a spot welder while abutting the overlapped first and second plate portions against a jig, as compared to when spot welding is used. As a result, the manufacturing process for the nozzle retention leaf spring can be simplified.

[0011] Furthermore, in the above-mentioned nozzle-retaining leaf spring, the first and second plate-shaped portions are formed integrally by bending a single plate-shaped member, which improves the workability of attaching the nozzle-retaining leaf spring to the head main body portion, unlike when the first and second plate-shaped portions are separate plate-shaped members.

[0012] In the component mounting device according to the first aspect, the engaging portion is preferably provided on one of the first and second plate-shaped portions that is located on the head main body side. With this configuration, compared to when engaging portions are provided on both the one plate-shaped portion located on the head main body side and the other plate-shaped portion located on the opposite side from the head main body side, when the first and second plate-shaped portions are folded and stacked, there is no need to align the engaging portion on one plate-shaped portion with the engaging portion on the other plate-shaped portion, which can further simplify the manufacturing process of the nozzle retention leaf spring.

[0013] In the component mounting device according to the first aspect, each of the plurality of nozzle-retaining leaf springs preferably has a bent portion formed by hemming so that the first plate-shaped portion and the second plate-shaped portion overlap. With this configuration, when performing the hemming process, the first plate-shaped portion and the second plate-shaped portion are pressed by a press process to crush the first plate-shaped portion and the second plate-shaped portion, thereby bringing the first plate-shaped portion and the second plate-shaped portion closer to each other. As a result, the elastic force of the first plate-shaped portion and the second plate-shaped portion brought closer to each other can be reliably applied to the engaging portion that engages with the nozzle.

[0014] In this case, preferably, the bent portion is provided at the upper end of each of the plurality of nozzle retention leaf springs, and the engaging portion is provided near the lower end of each of the plurality of nozzle retention leaf springs. This configuration eliminates the need for processing (e.g., bending) to form both the bent portion and the engaging portion in the relatively narrow area of the lower end of the nozzle retention leaf spring, thereby reducing the complexity of processing the nozzle retention leaf springs. Note that the "near the lower end of each of the plurality of nozzle retention leaf springs" is a broad concept that includes not only the lower end of each of the plurality of nozzle retention leaf springs, but also the portion above the lower end of each of the plurality of nozzle retention leaf springs.

[0015] In a component mounting device including a mounting head having a nozzle retention leaf spring attached thereto, the bending portion being provided at the upper end and the engaging portion being provided near the lower end, the mounting head preferably further includes fastening members for attaching the plurality of nozzle retention leaf springs to the head main body, the plurality of nozzle retention leaf springs each having a through-hole through which the fastening member is inserted and penetrating the first plate-shaped portion and the second plate-shaped portion in the thickness direction of the first plate-shaped portion, the through-hole being located above each of the plurality of nozzle retention leaf springs. With this configuration, when attaching a nozzle to the mounting head, the portions of the first plate-shaped portion and the second plate-shaped portion below the through-holes at the top of the first plate-shaped portion and the second plate-shaped portion can be elastically deformed toward the side opposite the head main body in accordance with the shape of the nozzle, with the portions of the first plate-shaped portion and the second plate-shaped portion between the fastening member and the head main body serving as fulcrums. As a result, the vertical length of the elastically deformable portions of the first plate-shaped portion and the second plate-shaped portion can be relatively large, thereby enabling the first plate-shaped portion and the second plate-shaped portion to be configured to be relatively easily elastically deformed.

[0016] In a component mounting device including a mounting head to which the nozzle retention leaf spring having the above-described through hole is attached, preferably, the through hole has a circular shape of approximately the same diameter in each of the first plate-shaped portion and the second plate-shaped portion when viewed in the thickness direction, and the bent portion is disposed at a position from the position of the upper end of the through hole to within the radius of the through hole above the upper end of the through hole. With this configuration, the bent portion can be disposed at a position relatively close to the through hole in the upward direction, thereby preventing the nozzle retention leaf spring from becoming larger in the upward direction.

[0017] In a component mounting device including a mounting head to which the nozzle-retaining leaf spring having the above-described through hole is attached, preferably, the through hole has a circular shape of approximately the same diameter in each of the first plate-shaped portion and the second plate-shaped portion when viewed in the thickness direction, and the bent portion is disposed above the upper end of the through hole at a position spaced apart by more than the radius of the through hole. With this configuration, the bent portion and the through hole can be sufficiently spaced apart, and therefore, when the first plate-shaped portion and the second plate-shaped portion are formed by bending a single plate-shaped member at the bent portion, deformation of the shape of the through hole due to stress generated in the bent portion of the single plate-shaped member by bending can be suppressed.

[0018] In a component mounting device including a mounting head to which the nozzle holding leaf spring having the above-described through hole is attached, preferably, the first plate-shaped portion has a first through hole as a through hole, and the second plate-shaped portion has a second through hole as a through hole whose dimension is larger than that of the first through hole when viewed in the thickness direction. With this configuration, when a single plate-shaped member is bent at the bending portion to form the first plate-shaped portion and the second plate-shaped portion, even if the centers of the first through hole and the second through hole are slightly misaligned, the first through hole and the second through hole can be communicated with each other. As a result, there is no need to align the first through hole and the second through hole with high precision, and therefore the operation of bending the single plate-shaped member at the bending portion can be easily performed.

[0019] In a component mounting device including a mounting head equipped with a nozzle-retaining leaf spring having a second through hole larger in size than the first through hole, preferably, the first plate-shaped portion is disposed closer to the head main body than the second plate-shaped portion in the thickness direction of the first plate-shaped portion, and the first plate-shaped portion has a protruding portion that protrudes from the periphery of the first through hole toward the second plate-shaped portion in the thickness direction, and the protruding portion of the first plate-shaped portion is inserted into and tightly contacted with the inner circumferential surface of the second through hole. With this configuration, even if the first plate-shaped portion attempts to move in a direction away from the second plate-shaped portion, the protruding portion is tightly contacted with the second through hole, thereby stopping the movement of the first plate-shaped portion, and therefore the gap between the first plate-shaped portion and the second plate-shaped portion can be maintained in a small state. As a result, when multiple nozzle holding leaf springs are plated together using plating filled in a container, it is possible to prevent another nozzle holding leaf spring from getting between the first plate-shaped portion and the second plate-shaped portion, so that the adhesion of plating to each of the multiple nozzle holding leaf springs is not hindered by each other.

[0020] A mounting head in a second aspect of the present invention is a mounting head having a nozzle detachably attached to its tip, which adsorbs components supplied by a component supply unit and mounts them on a board using the nozzle, and comprises a head main body and a plurality of elastically deformable plate-shaped nozzle holding leaf springs attached to the head main body and which detachably clamp and hold the nozzle, each of the plurality of nozzle holding leaf springs including first and second plate-shaped portions that are folded and stacked, and an engaging portion provided on at least one of the first and second plate-shaped portions that engages with the nozzle.

[0021] A mounting head according to a second aspect of the present invention includes a plurality of elastically deformable, plate-shaped nozzle-retaining leaf springs that detachably sandwich and hold a nozzle, as described above. Each of the plurality of nozzle-retaining leaf springs has a first plate-shaped portion and a second plate-shaped portion that are folded and overlapped. By folding and overlapping the first and second plate-shaped portions, the elastic force of the nozzle-retaining leaf spring can be increased compared to a single leaf spring, thereby improving the nozzle-retaining force of the nozzle-retaining leaf spring. Furthermore, because the nozzle-retaining leaf spring is formed by folding and overlapping the first and second plate-shaped portions, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that is caused by heat during welding can be suppressed. As a result, a mounting head can be provided that can ensure sufficient nozzle-retaining force while suppressing a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that is caused by heat during welding.

[0022] A manufacturing method of a mounting head in a third aspect of the present invention is a manufacturing method of a mounting head in which a nozzle is detachably attached to a tip end, and components supplied by a component supply unit are sucked up by the nozzle and mounted on a board by the nozzle, and the method includes the steps of forming an engaging portion that engages with the nozzle at the end of a plurality of elastically deformable plate-shaped nozzle holding leaf springs that detachably clamp and hold the nozzle, bending the leaf springs by hemming to overlap a first plate-shaped portion and a second plate-shaped portion, and attaching each of the plurality of nozzle holding leaf springs, with the first plate-shaped portion and the second plate-shaped portion overlapped by hemming, to a head main body.

[0023] A mounting head manufacturing method according to a third aspect of the present invention includes a step of hemming and overlapping the first and second plate-shaped portions, as described above. By hemming and overlapping the first and second plate-shaped portions, the elastic force of the nozzle-retaining leaf spring can be increased compared to a single leaf spring, thereby improving the nozzle-retaining force of the nozzle-retaining leaf spring. Furthermore, because the nozzle-retaining leaf spring is formed by bending and overlapping the first and second plate-shaped portions, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that holds the nozzle, due to heat generated during welding, can be suppressed. As a result, a mounting head manufacturing method can be provided that ensures sufficient nozzle-retaining force while suppressing a decrease in mechanical strength (fatigue strength) of the nozzle-retaining leaf spring that holds the nozzle, due to heat generated during welding.

[0024] The method for manufacturing a mounting head according to the third aspect preferably further includes a step of forming circular through holes in the first plate-shaped portion and the second plate-shaped portion, the through holes having substantially the same diameter as viewed in the thickness direction of the first plate-shaped portion, in each of the first plate-shaped portion and the second plate-shaped portion after hemming to overlap the first plate-shaped portion. With this configuration, when a single plate-shaped member is bent to form the first plate-shaped portion and the second plate-shaped portion, the shape of the through holes may be deformed due to stress generated in the bent portion of the single plate-shaped member by bending. However, by forming the through holes in the first plate-shaped portion and the second plate-shaped portion after bending to overlap the first plate-shaped portion, it is possible to prevent the shape of the through holes from being deformed due to stress generated by bending the single plate-shaped member.

[0025] The method for manufacturing a mounting head according to the third aspect preferably further includes, before hemming the first plate-shaped portion and the second plate-shaped portion together, forming a first through hole in the first plate-shaped portion and forming a second through hole in the second plate-shaped portion with a diameter larger than that of the first through hole as viewed in the thickness direction of the first plate-shaped portion. The step of hemming the first plate-shaped portion and the second plate-shaped portion together includes hemming the first plate-shaped portion and the second plate-shaped portion together so that the first through hole and the second through hole communicate with each other in the thickness direction. With this configuration, when a single plate-shaped member is bent to form the first and second plate-shaped portions, even if the centers of the first and second through holes are slightly misaligned, the first through hole and the second through hole can be communicated with each other. As a result, there is no need to align the first through hole and the second through hole with high precision, and the operation of bending the single plate-shaped member at the bending portion can be easily performed.

[0026] In this case, the method preferably further includes the steps of, after overlapping the first plate-shaped portion and the second plate-shaped portion, inserting into the second through hole a protruding portion that protrudes from the periphery of the first through hole toward the second plate-shaped portion in the thickness direction, and bringing the protruding portion inserted into the second through hole into close contact with the inner circumferential surface of the second through hole. With this configuration, even if the first plate-shaped portion attempts to move in a direction away from the second plate-shaped portion, the protruding portion can be stopped from moving in a direction away from the second plate-shaped portion because the protruding portion is in close contact with the second through hole, and therefore it is possible to prevent the gap between the first plate-shaped portion and the second plate-shaped portion from becoming larger due to the first plate-shaped portion moving away from the second plate-shaped portion. [Effects of the Invention]

[0027] According to the present invention, as described above, it is possible to ensure sufficient nozzle holding force while suppressing a decrease in mechanical strength (fatigue strength) caused by heat during welding of the nozzle holding leaf spring that holds the nozzle. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a plan view showing a component mounting apparatus according to a first embodiment. [Figure 2] 2 is a side view of the component mounting apparatus according to the first embodiment as viewed from the Y2 direction side. FIG. [Figure 3] 3 is a side view of the mounting head of the component mounting device according to the first embodiment, viewed from the Y2 direction side. FIG. [Figure 4] 4 is a cross-sectional view of the mounting head of FIG. 3 taken along the Z direction. [Figure 5] 2 is a perspective view showing a state in which a nozzle is removed from the mounting head of the component mounting apparatus according to the first embodiment. FIG. [Figure 6] 3 is a perspective view of a nozzle holding leaf spring of the mounting head of the component mounting apparatus according to the first embodiment. FIG. [Figure 7] 10 is a side view of the nozzle holding leaf spring of the mounting head of the component mounting device according to the first embodiment, viewed from the Y2 direction side. FIG. [Figure 8] FIG. 8 is an enlarged view of the Zm portion of FIG. [Figure 9] 10 is a side view of the nozzle holding leaf spring of the mounting head of the component mounting device according to the first embodiment, viewed from the X1 direction side. FIG. [Figure 10] 5 is a flowchart showing a method for manufacturing the mounting head according to the first embodiment. [Figure 11] 10 is a perspective view of a nozzle holding plate spring of a mounting head of a component mounting apparatus according to a second embodiment, in which an elongated through-hole is formed in a second plate-shaped portion. FIG. [Figure 12] 10 is a perspective view of a nozzle holding plate spring of a mounting head of a component mounting apparatus according to a second embodiment, in which an elongated through-hole is formed in a first plate-shaped portion. FIG. [Figure 13] 10 is a perspective view of a nozzle holding plate spring of a mounting head of a component mounting apparatus according to a second embodiment, in which a larger circular through-hole is formed in a second plate-shaped portion. FIG. [Figure 14] 10 is a perspective view of a nozzle holding leaf spring of a mounting head of a component mounting apparatus according to a second embodiment, in which a larger circular through-hole is formed in a first plate-shaped portion. FIG. [Figure 15] 10 is a flowchart showing a method for manufacturing a mounting head according to a second embodiment. [Figure 16]FIG. 11 is a perspective view of a nozzle holding leaf spring of the mounting head of the component mounting apparatus according to the third embodiment. [Figure 17] FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. [Figure 18] 10 is a flowchart showing a method for manufacturing a mounting head according to a third embodiment. [Figure 19] FIG. 11 is a cross-sectional view showing a state in step S305 of the manufacturing method of the mounting head according to the third embodiment. [Figure 20] FIG. 11 is a cross-sectional view showing a state in step S306 of the manufacturing method of the mounting head according to the third embodiment. [Figure 21] FIG. 10 is a perspective view of a nozzle holding leaf spring of a mounting head of a component mounting apparatus according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0030] [First embodiment] The configuration of a component mounting apparatus 1000 according to a first embodiment of the present invention will be described with reference to FIGS.

[0031] (Component mounting equipment) As shown in FIGS. 1 and 2, the component mounting apparatus 1000 is configured to mount (place) a component E at a predetermined mounting position on a board Sb on which cream solder has been printed.

[0032] Here, in the component mounting apparatus 1000, the transport direction in which the substrate Sb is transported is the X1 direction, the opposite direction to the transport direction in which the substrate Sb is transported is the X2 direction, and the combined direction of the X1 and X2 directions is the X direction. Furthermore, the horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. Furthermore, the up-down direction perpendicular to the X and Y directions is the Z direction (up-down direction), one side of the Z direction is the Z1 direction (upward), and the other side of the Z direction is the Z2 direction (downward).

[0033] The component mounting apparatus 1000 has a base 1, a feeder arrangement section 2, a tray arrangement section 3, a board transport section 4, a support section 5, a pair of rail sections 6, a head unit 7, a component imaging section 8, a board imaging section 9, and a control section (not shown).

[0034] The base 1 is a base on which each component is arranged in the component mounting apparatus 1000. A feeder arrangement section 2 is provided on the Y1 direction side of the base 1. Furthermore, a plurality of (two) tray arrangement sections 3 are provided on the Y2 direction side of the base 1. Note that one or three or more tray arrangement sections 3 may be provided on the base 1.

[0035] A plurality of tape feeders 20 can be arranged in the feeder arrangement section 2. The tape feeders 20 are configured to supply components E to be mounted on the board Sb. The tape feeders 20 hold reels (not shown) around which component supply tape is wound, which holds a plurality of components E spaced at predetermined intervals. The tape feeders 20 are an example of a "component supply section" in the claims.

[0036] The plurality of tray arrangement sections 3 include a first tray arrangement section 31 on the X1 direction side and a second tray arrangement section 32 on the X2 direction side. Trays 31a are arranged in the first tray arrangement section 31. Trays 32a are arranged in the second tray arrangement section 32. Trays 31a and 32a are configured to supply components E to be mounted on a board Sb. Package-type components E such as QFPs (Quad Flat Packages) and BGAs (Ball Grid Arrays) are aligned and placed on each of trays 31a and 32a. Trays 31a and 32a are an example of a "component supply section" in the claims.

[0037] The board transport unit 4 is configured to carry in the board Sb from outside the component mounting apparatus 1000 and transport the board Sb in a transport direction (X1 direction). The board transport unit 4 has a pair of conveyors 41 and a drive unit (not shown).

[0038] The support section 5 is configured to support the head unit 7 so that the head unit 7 can move in the X direction. The support section 5 has a ball screw shaft 51 and a drive section 52.

[0039] The pair of rail portions 6 are configured to support the support portion 5 so as to be movable in the Y direction. The rail portion 6 has a ball screw shaft 61, a guide rail 62, and a drive portion 63.

[0040] The head unit 7 is a component mounting head unit configured to move in the Z1 direction (upward) of the board Sb and perform mounting work on the board Sb. In other words, the head unit 7 is configured to mount components E on the board Sb fixed at a work position.

[0041] Specifically, the head unit 7 includes a mounting head 71, a Z-axis motor (not shown), and an R-axis motor (not shown). The mounting head 71 is configured to pick up components E supplied by the tape feeder 20, tray 31a, or tray 32a using a nozzle 72 and mount the components E on the board Sb. The components E are mounted at predetermined mounting positions (not shown) on the board Sb. A plurality of mounting heads 71 (five heads) are arranged in a line in the X direction. In this way, the head unit 7 is an inline head in which the mounting heads 71 are arranged in a line in the X direction. Note that the number of mounting heads 71 may be one to four, or six or more.

[0042] Each of the multiple mounting heads 71 has a detachable nozzle 72 attached to its tip. Each of the multiple mounting heads 71 is connected to a negative pressure generator (not shown) and is configured to be able to hold (suck) a component E onto the nozzle 72 by the negative pressure generated by the negative pressure generator. Each of the multiple mounting heads 71 is also configured to be able to mount (load) the component E onto the board Sb from the nozzle 72 by switching the negative pressure generated by the negative pressure generator to positive pressure. Here, the pressure generated in the nozzle 72 by the negative pressure generator is measured by a pressure sensor (not shown).

[0043] Each of the multiple mounting heads 71 is configured to be movable in the Z direction (up and down) by a Z-axis motor. Also, each of the multiple mounting heads 71 is configured to be rotatable around a rotation axis by an R-axis motor. The mounting heads 71 will be described in detail later.

[0044] The component imaging unit 8 is configured to capture an image of the component E to be mounted on the board Sb. That is, the component imaging unit 8 is a component imaging camera that captures an image of the component E held (sucked) by the nozzle 72 prior to mounting the component E on the board Sb. The component imaging unit 8 is fixed on the base 1, and is configured to capture an image of the component E held (sucked) by the nozzle 72 from below the component E (in the Z2 direction).

[0045] The board imaging unit 9 is attached to the head unit 7 and is a mark imaging camera that images an FI mark (fiducial mark: not shown) attached to the top surface of the board Sb prior to mounting the component E on the board Sb. The FI mark is a mark for confirming the position of the board Sb.

[0046] (Detailed structure of the mounting head) The detailed structure of the mounting head 71 will be described with reference to Figures 3 to 9. Since the detailed structure of all of the multiple mounting heads 71 is the same, the detailed structure of one of the multiple mounting heads 71 will be described.

[0047] In the mounting head 71, the currently attached nozzle 72 is replaced with another nozzle 72 having a different shape or size as needed. Nozzle replacement is performed in a nozzle replacement device (not shown) after one cycle of mounting operations has finished and before the next cycle of mounting operations begins. Nozzle replacement is performed by inserting and removing the nozzle 72 into and from the head main body 711 (described below) as the mounting head 71 is raised and lowered in the nozzle replacement device. Therefore, as described above, the mounting head 71 is configured so that the nozzle 72 is detachable.

[0048] As shown in FIGS. 3 and 4, the mounting head 71 has a head main body 711, a fastening member 712, a fastening member 713, and a nozzle holding leaf spring 714.

[0049] The head main body 711 is configured to generate negative and positive pressures generated by a negative pressure generator in the nozzle 72. Specifically, it has an air passage 711a, a shaft member 711b, and a holder member 711c. The air passage 711a connects an air hose connected to the negative pressure generator with an air passage 72a inside the nozzle 72. The air passage 711a passes through the head main body 711 in the Z direction. The shaft member 711b has a cylindrical shape that extends in the Z direction.

[0050] The holder member 711c is configured to be inserted into the air passage 72a of the nozzle 72 and thereby fitted with the nozzle 72 in a loose fit state. The holder member 711c is fitted with the air passage 72a of the nozzle 72 in a loose fit state. The holder member 711c is fastened to the shaft member 711b with fastening members 712 and 713, and thereby fixed to the shaft member 711b. The holder member 711c is fixed to the end of the shaft member 711b on the Z2 direction side.

[0051] The head main body 711 is configured to be moved up and down by a Z-axis motor (not shown) and rotated by an R-axis motor (not shown).

[0052] The fastening member 712 and the fastening member 713 are, for example, bolts. The fastening member 712 fixes the holder member 711c to the head main body 711. That is, although not shown in the figure, the fastening member 712 fixes the holder member 711c to the shaft member 711b from the Y1 direction side. The fastening member 712 also fixes the holder member 711c to the shaft member 711b from the Y2 direction side. The fastening member 713 fixes the holder member 711c and the nozzle holding leaf spring 714 to the shaft member 711b. That is, the fastening member 713 fixes the holder member 711c and the nozzle holding leaf spring 714 to the shaft member 711b from the X1 direction side. The fastening member 713 fixes the holder member 711c and the nozzle holding leaf spring 714 to the shaft member 711b from the X2 direction side.

[0053] <Nozzle holding leaf spring> As shown in FIGS. 5 and 6, the nozzle holding leaf spring 714 is an elastically deformable plate-shaped spring member that detachably clamps and holds the nozzle 72. The nozzle holding leaf springs 714 are attached to multiple (two) head main bodies 711 with fastening members 713. The nozzle holding leaf springs 714 are attached to the side surface of the head main body 711 on the X1 direction side. The nozzle holding leaf springs 714 are attached to the side surface of the head main body 711 on the X2 direction side. In this manner, the multiple nozzle holding leaf springs 714 are arranged to face each other in the X direction. Therefore, the nozzle 72 is held by the multiple nozzle holding leaf springs 714 with the holder member 711c fitted into the air passage 72a by clearance fit.

[0054] In the nozzle retention leaf spring 714 of the first embodiment, a structure resembling two overlapping leaf springs is realized by hemming a single metal plate. The nozzle retention leaf spring 714 is made of a metal plate such as stainless steel. Note that the detailed structure of all of the multiple nozzle retention leaf springs 714 is the same, so the detailed structure of the nozzle retention leaf spring 714 on the X1 direction side of the multiple nozzle retention leaf springs 714 will be described below.

[0055] 6 and 7, the nozzle holding leaf spring 714 has an engaging portion 714a, a first plate-shaped portion 714b, a second plate-shaped portion 714c, a bent portion 714d, and a through-hole 714e. The first plate-shaped portion 714b is an example of the "one plate-shaped portion" in the claims.

[0056] The engaging portion 714a is configured to engage with the engaged portion 72b (see FIG. 4) of the nozzle 72. The engaging portion 714a has an L-shape when viewed from the Y1 direction side. The engaging portion 714a is formed by bending the vicinity of the end portion on the Z2 direction side of a single metal plate through bending processing. The engaging portion 714a is provided near the end portion on the Z2 direction side of the nozzle holding leaf spring 714. In other words, the engaging portion 714a is provided near the end portion on the Z2 direction side of the first plate-shaped portion 714b arranged on the head main body portion 711 side.

[0057] The first plate-shaped portion 714b has an engaging portion 714a that engages with the nozzle 72. The first plate-shaped portion 714b has a flat plate shape extending along the Z direction. The first plate-shaped portion 714b is arranged on the head main body 711 side of the second plate-shaped portion 714c in the thickness direction (X direction) of the first plate-shaped portion 714b. The second plate-shaped portion 714c has a flat plate shape extending along the Z direction. The second plate-shaped portion 714c is arranged on the opposite side of the first plate-shaped portion 714b from the head main body 711 side in the thickness direction (X direction) of the first plate-shaped portion 714b. Here, the thickness direction of the first plate-shaped portion 714b is a direction parallel not only to the X direction but also to the direction in which the first plate-shaped portion 714b and the second plate-shaped portion 714c are aligned.

[0058] 7 and 8, the first plate-shaped portion 714b and the second plate-shaped portion 714c are stacked side by side in the X direction by bending a single metal plate using a hemming process. That is, after bending a single metal plate at the bending portion 714d using a hemming process, the first plate-shaped portion 714b and the second plate-shaped portion 714c are pressed together using a press process, so that the first plate-shaped portion 714b and the second plate-shaped portion 714c are stacked side by side in a state in which they are close to each other (in close contact) in the X direction. In this way, the first plate-shaped portion 714b and the second plate-shaped portion 714c are stacked side by side in the X direction in at least one of a state in which they face each other with a minute gap Ga therebetween and a state in which they abut each other.

[0059] As shown in FIGS. 8 and 9, the bent portion 714d is formed by hemming the first plate portion 714b and the second plate portion 714c so that they overlap. The bent portion 714d is provided at the end (upper end) of each of the plurality of nozzle holding leaf springs 714 on the Z1 direction side. The bent portion 714d connects the upper end of the first plate portion 714b to the upper end of the second plate portion 714c. The bent portion 714d is formed at the upper end of each of the plurality of nozzle holding leaf springs 714 across the entire width direction (Y direction) perpendicular to the thickness direction of the first plate portion 714b in the horizontal direction. The bent portion 714d is located at a position P2 within a radius Rd of the through hole 714e (shown by a dotted line in FIG. 9) above the upper end P1 of the through hole 714e, from a position P1 of the upper end of the through hole 714e.

[0060] The through hole 714e is formed by bending a single metal plate at the bending portion 714d using a hemming bending process, pressing the first plate-shaped portion 714b and the second plate-shaped portion 714c using a press process, and then passing a tool through the first plate-shaped portion 714b and the second plate-shaped portion 714c.

[0061] Through hole 714e penetrates each of first plate-shaped portion 714b and second plate-shaped portion 714c in the thickness direction (X direction) of first plate-shaped portion 714b. Thus, through hole 714f is formed as through hole 714e in first plate-shaped portion 714b. Through hole 714g is formed as through hole 714e in second plate-shaped portion 714c. Fastening member 713 (see FIG. 5) is inserted into through hole 714f and through hole 714g.

[0062] The through holes 714f and 714g are disposed in the upper part of the nozzle holding leaf spring 714. That is, the through holes 714f and 714g are disposed in a position closer to the Z2 direction side than the upper end of the nozzle holding leaf spring 714. When viewed from the X1 direction side, the through holes 714f and 714g have circular shapes with approximately the same diameter in each of the first plate-shaped portion 714b and the second plate-shaped portion 714c.

[0063] (Manufacturing method of mounting head) 10, a method for manufacturing the mounting head 71, which manufactures the mounting head 71 to which the above-described nozzle holding leaf spring 714 is attached, will be described below. In the following description of the method for manufacturing the mounting head 71, the worker who manufactures the mounting head 71 to which the nozzle holding leaf spring 714 is attached will be referred to as the manufacturing worker.

[0064] 10, in step S1, a manufacturing worker forms the engaging portions 714a of the nozzle holding leaf springs 714 near the end of a single metal plate by bending the vicinity of the end of the metal plate. That is, step S1 is a step in which the engaging portions 714a that engage with the nozzles 72 are formed at the ends of the multiple elastically deformable plate-shaped nozzle holding leaf springs 714 that detachably sandwich and hold the nozzles 72.

[0065] In step S2, a manufacturing worker uses a hemming process to fold a single metal plate having engaging portions 714a formed near its end portion, thereby overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c. That is, step S2 includes a step of forming the first plate-shaped portion 714b and the second plate-shaped portion 714c from the single metal plate by bending the end portion opposite the engaging portions 714a of the single metal plate having engaging portions 714a formed near its end portion toward the engaging portions 714a. Step S2 also includes a step of pressing the first plate-shaped portion 714b and the second plate-shaped portion 714c together (to bring them into close contact with each other).

[0066] In step S3, the manufacturing worker overlaps the first plate-shaped portion 714b and the second plate-shaped portion 714c by folding using hemming bending, and then forms circular through-holes 714f and 714g in the first plate-shaped portion 714b and the second plate-shaped portion 714c, respectively, having approximately the same diameter when viewed in the thickness direction of the first plate-shaped portion 714b. That is, step S3 is a step in which a tool is passed through the first plate-shaped portion 714b and the second plate-shaped portion 714c, which are overlapped in a closely spaced (closely contacted) state, thereby forming through-hole 714f in the first plate-shaped portion 714b and through-hole 714g in the second plate-shaped portion 714c.

[0067] In step S4, the manufacturing worker overlaps the first plate-shaped portion 714b and the second plate-shaped portion 714c in close proximity (close contact), and attaches the nozzle holding leaf spring 714, in which the through-hole 714e is formed, to a predetermined position on the head main body 711 using the fastening member 713. That is, step S4 is a step in which each of the multiple nozzle holding leaf springs 714, in which the first plate-shaped portion 714b and the second plate-shaped portion 714c are overlapped, is attached to the head main body 711 by hemming. After step S4, the manufacturing method of the mounting head 71 is completed.

[0068] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0069] In the first embodiment, as described above, the mounting head 71 of the component mounting apparatus 1000 includes a plurality of elastically deformable, plate-shaped nozzle holding leaf springs 714 that detachably sandwich and hold the nozzle 72. Each of the plurality of nozzle holding leaf springs 714 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are folded and overlapped. By folding and overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, the elastic force of the nozzle holding leaf spring 714 can be increased compared to a single plate spring, thereby improving the holding force of the nozzle 72 by the nozzle holding leaf spring 714. Furthermore, because the nozzle holding leaf spring 714 is formed by folding and overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle holding leaf spring 714 that is caused by heat during welding can be suppressed. As a result, a sufficient holding force for the nozzle 72 can be ensured while suppressing a decrease in the mechanical strength (fatigue strength) of the nozzle holding leaf spring 714 that holds the nozzle 72 due to heat generated during welding. Furthermore, because the nozzle holding leaf spring 714 is formed by bending and overlapping the first and second plate portions 714b and 714c without the need for spot welding, a manufacturing worker who manufactures the nozzle holding leaf spring 714 does not need to perform the cumbersome task of overlapping the first and second plate portions 714b and 714c, which are separate plate-shaped members, and then welding the first and second plate portions 714b and 714c together using a spot welder while abutting the overlapped first and second plate portions 714b and 714c against a jig. This simplifies the manufacturing process for the nozzle holding leaf spring 714.

[0070] Furthermore, in the first embodiment, as described above, each of the multiple nozzle holding leaf springs 714 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are folded and stacked. This allows the first plate-shaped portion 714b and the second plate-shaped portion 714c to be integrally formed by bending a single plate-shaped member, thereby improving the workability of attaching the nozzle holding leaf springs 714 to the head main body 711, unlike when the first plate-shaped portion 714b and the second plate-shaped portion 714c are separate plate-shaped members. That is, by forming the first plate-shaped portion 714b and the second plate-shaped portion 714c integrally by bending a single plate-shaped member, unlike when the first plate-shaped portion 714b and the second plate-shaped portion 714c are separate plate-shaped members, an installation worker does not need to assemble the nozzle holding leaf spring 714 by gathering the first plate-shaped portion 714b and the second plate-shaped portion 714c together at the work site where the nozzle holding leaf spring 714 is attached to the head main body portion 711. As a result, the nozzle holding leaf spring 714 is assembled without the installation worker having to gather the first plate-shaped portion 714b and the second plate-shaped portion 714c together, and therefore it is possible to prevent errors in the assembly order of the first plate-shaped portion 714b and the second plate-shaped portion 714c of the nozzle holding leaf spring 714 at the work site. Furthermore, since the installer does not need to assemble the nozzle holding leaf spring 714 by gathering the first plate-shaped portion 714b and the second plate-shaped portion 714c together at the work site, it is possible to prevent a plate member of a different type of leaf spring than the first plate-shaped portion 714b from being incorporated into the nozzle holding leaf spring 714 at the work site. Furthermore, since the installer does not need to assemble the nozzle holding leaf spring 714 by gathering the first plate-shaped portion 714b and the second plate-shaped portion 714c together at the work site, the workload of the installer at the work site can be reduced.

[0071] Furthermore, in the first embodiment, as described above, the engaging portion 714a is provided on one of the first plate-shaped portion 714b and the second plate-shaped portion 714c that is located on the head main body portion 711 side. This means that, compared to when engaging portions are provided on both the one plate-shaped portion located on the head main body portion 711 side and the other plate-shaped portion located on the opposite side from the head main body portion side, when the first plate-shaped portion 714b and the second plate-shaped portion 714c are folded and stacked, there is no need to align the engaging portion on one plate-shaped portion with the engaging portion on the other plate-shaped portion, which further simplifies the manufacturing process of the nozzle holding leaf spring 714.

[0072] Furthermore, in the first embodiment, as described above, each of the multiple nozzle retention leaf springs 714 has a bent portion 714d formed by hemming so that the first plate-shaped portion 714b and the second plate-shaped portion 714c overlap each other. This allows the first plate-shaped portion 714b and the second plate-shaped portion 714c to be pressed together by a press during the hemming process, thereby crushing the first plate-shaped portion 714b and the second plate-shaped portion 714c. This allows the first plate-shaped portion 714b and the second plate-shaped portion 714c to be brought closer together. As a result, the elastic force of both the first plate-shaped portion 714b and the second plate-shaped portion 714c, which are brought closer together, can be reliably applied to the engagement portion 714a that engages with the nozzle 72.

[0073] Furthermore, in the first embodiment, as described above, the bent portion 714d is provided at the upper end of each of the plurality of nozzle holding leaf springs 714. The engaging portion 714a is provided near the lower end of each of the plurality of nozzle holding leaf springs 714. This eliminates the need for processing (for example, bending) to form both the bent portion 714d and the engaging portion 714a in the relatively narrow range of the lower end of the nozzle holding leaf spring 714, thereby preventing the processing of the nozzle holding leaf spring 714 from becoming complicated.

[0074] Furthermore, in the first embodiment, as described above, the mounting head 71 includes fastening members 713 that attach the plurality of nozzle holding leaf springs 714 to the head main body 711. The plurality of nozzle holding leaf springs 714 have through holes 714e into which the fastening members 713 are inserted, the through holes 714e penetrating each of the first plate-shaped portion 714b and the second plate-shaped portion 714c in the thickness direction of the first plate-shaped portion 714b. The through holes 714e are disposed at the upper portions of each of the plurality of nozzle holding leaf springs 714. As a result, when attaching the nozzles 72 to the mounting head 71, the portions of the first plate-shaped portion 714b and the second plate-shaped portion 714c below the through holes 714e provided at the upper portions thereof can be elastically deformed toward the side opposite the head main body 711 in accordance with the shape of the nozzles 72, with the portions of the first plate-shaped portion 714b and the second plate-shaped portion 714c between the fastening members 713 and the head main body 711 as fulcrums. As a result, the vertical length of the elastically deformable portions of the first plate-shaped portion 714b and the second plate-shaped portion 714c can be made relatively large, making it possible to configure the first plate-shaped portion 714b and the second plate-shaped portion 714c to be relatively easily elastically deformable.

[0075] Furthermore, in the first embodiment, as described above, the through-hole 714e has a circular shape with approximately the same diameter in each of the first plate-shaped portion 714b and the second plate-shaped portion 714c when viewed in the thickness direction. The bent portion 714d is disposed from a position P1 of the upper end of the through-hole 714e to a position P2 within the radius Rd of the through-hole 714e, which is above the upper end of the through-hole 714e. This allows the bent portion 714d to be disposed relatively close to the through-hole 714e in the upward direction, thereby preventing the nozzle holding leaf spring 714 from becoming larger in the upward direction.

[0076] Furthermore, in the first embodiment, as described above, each of the multiple nozzle holding leaf springs 714 of the mounting head 71 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are folded and overlapped. By folding and overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, the elastic force of the nozzle holding leaf spring 714 can be increased compared to a single plate spring, thereby improving the holding force of the nozzle holding leaf spring 714 for holding the nozzle 72. Furthermore, because the nozzle holding leaf spring 714 is formed by folding and overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle holding leaf spring 714 that holds the nozzle 72, which is caused by heat during welding, can be suppressed. As a result, it is possible to provide a mounting head 71 that can ensure sufficient holding force for the nozzle 72 while suppressing a decrease in mechanical strength (fatigue strength) caused by heat during welding of the nozzle holding leaf spring 714 that holds the nozzle 72.

[0077] Furthermore, in the first embodiment, as described above, the manufacturing method of the mounting head 71 includes step S2 of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c by hemming. By overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c by hemming, the elastic force of the nozzle holding leaf spring 714 can be increased compared to a single leaf spring, thereby improving the holding force of the nozzle holding leaf spring 714 for holding the nozzle 72. Furthermore, because the nozzle holding leaf spring 714 is formed by folding and overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, spot welding is not required, and a decrease in mechanical strength (fatigue strength) of the nozzle holding leaf spring 714 that holds the nozzle 72, due to heat generated during welding, can be suppressed. As a result, it is possible to provide a manufacturing method for a mounting head 71 that can ensure sufficient holding force for the nozzle 72 while suppressing a decrease in mechanical strength (fatigue strength) caused by heat during welding of the nozzle holding leaf spring 714 that holds the nozzle 72.

[0078] Furthermore, in the first embodiment, as described above, the manufacturing method of the mounting head 71 includes step S3 of forming circular through holes 714e of approximately the same diameter in each of the first plate-shaped portion 714b and the second plate-shaped portion 714c, after folding them by hemming bending to overlap the first plate-shaped portion 714b and the second plate-shaped portion 714c, when viewed from the thickness direction of the first plate-shaped portion 714b. As a result, when a single plate-shaped member is bent to form the first plate-shaped portion 714b and the second plate-shaped portion 714c, the shape of the through hole 714e may be deformed due to stress generated in the bent portion 714d of the single plate-shaped member by bending it. However, by forming the through hole 714e in the first plate-shaped portion 714b and the second plate-shaped portion 714c after bending them to overlap each other, it is possible to prevent the shape of the through hole 714e from being deformed due to stress generated by bending the single plate-shaped member.

[0079] [Second embodiment] 11 to 15, the configuration of a mounting head 2071 provided in a component mounting apparatus 2000 according to the second embodiment will be described. In the second embodiment, unlike the first embodiment, the dimensions of the through holes 2714f and 2714g are different when viewed from the X1 direction side. Note that in the second embodiment, detailed descriptions of the same configuration as in the first embodiment will be omitted.

[0080] (Component mounting equipment) The component mounting apparatus 2000 is configured to mount (place) a component E at a predetermined mounting position on a board Sb on which cream solder has been printed.

[0081] Here, in the component mounting apparatus 2000, the transport direction in which the board Sb is transported is the X1 direction, the opposite direction to the transport direction in which the board Sb is transported is the X2 direction, and the combined direction of the X1 and X2 directions is the X direction. Furthermore, the horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. Furthermore, the up-down direction perpendicular to the X and Y directions is the Z direction (up-down direction), one side of the Z direction is the Z1 direction (upward direction), and the other side of the Z direction is the Z2 direction (downward direction).

[0082] The component mounting apparatus 2000 has a base 1, a feeder arrangement unit 2, a tray arrangement unit 3, a board transport unit 4, a support unit 5, a pair of rail units 6, a head unit 2007, a component imaging unit 8, a board imaging unit 9, and a control unit (not shown).Here, the head unit 2007 includes a mounting head 2071, a Z-axis motor (not shown), and an R-axis motor (not shown).

[0083] (Detailed structure of the mounting head) 11 to 14, the detailed structure of the mounting head 2071 will be described. Note that the detailed structure of all of the multiple mounting heads 2071 is the same, so the detailed structure of one of the multiple mounting heads 2071 will be described.

[0084] As shown in FIG. 11, the mounting head 2071 has a head main body 711 (see FIG. 5), a fastening member 712 (see FIG. 5), a fastening member 713 (see FIG. 5), and a nozzle holding leaf spring 2714.

[0085] <Nozzle holding leaf spring> The nozzle holding leaf spring 2714 of the second embodiment has an engaging portion 714a, a first plate-shaped portion 714b, a second plate-shaped portion 714c, a bent portion 714d, and a through-hole 2714e. The first plate-shaped portion 714b is an example of "one plate-shaped portion" in the claims.

[0086] The through hole 2714e is formed by bending a single metal plate at the bending portion 714d by hemming bending, and then penetrating a tool into each of the first plate-shaped portion 714b of the single metal plate and the second plate-shaped portion 714c of the single metal plate before pressing the first plate-shaped portion 714b and the second plate-shaped portion 714c together by press working.

[0087] A through hole 2714f is formed in the first plate-shaped portion 714b as the through hole 2714e. The through hole 2714f penetrates the first plate-shaped portion 714b in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 2714f has a circular shape when viewed in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 2714f is an example of a "first through hole" in the claims.

[0088] A through hole 2714g is formed in the second plate-shaped portion 714c as the through hole 2714e. The through hole 2714g penetrates the second plate-shaped portion 714c in the thickness direction (X direction) of the second plate-shaped portion 714c. When viewed from the thickness direction (X direction) of the second plate-shaped portion 714c, the through hole 2714g has an oblong shape that is long in the Z direction. The through hole 2714g is an example of a "second through hole" in the claims.

[0089] The fastening member 713 (see FIG. 5) is inserted into the through-hole 2714f and the through-hole 2714g.

[0090] When viewed from the thickness direction (X direction) of the first plate-shaped portion 714b, the dimensions of the through hole 2714f and the through hole 2714g are different. That is, in the Z direction, the dimension of the through hole 2714g is larger than the dimension of the through hole 2714f. In the Y direction, the dimension of the through hole 2714g is larger than the dimension of the through hole 2714f. Thus, when viewed from the thickness direction (X direction) of the first plate-shaped portion 714b, the dimension of the through hole 2714g is larger than the dimension of the through hole 2714f. Here, the centers of the through holes 2714f and 2714g are approximately aligned when viewed from the thickness direction (X direction) of the first plate-shaped portion 714b.

[0091] The through holes 2714f and 2714g are disposed in the upper part of the nozzle holding leaf spring 2714. That is, the through holes 2714f and 2714g are disposed at a position on the Z2 direction side of the upper end of the nozzle holding leaf spring 2714. Here, the upper end of the through holes 2714f and 2714g are disposed at a position spaced apart from the bent portion 714d by more than the radius Rd of the through hole 2714f.

[0092] Here, as shown in FIG. 12, a through-hole 2714g that is an elongated hole may be formed in the first plate-shaped portion 714b, and a through-hole 2714f that is a circular hole may be formed in the second plate-shaped portion 714c.

[0093] 13, a through-hole 2714f that is a circular hole may be formed in the first plate-shaped portion 2714b, and a through-hole 2714g that is a circular hole may be formed in the second plate-shaped portion 2714c. Here, when viewed from the thickness direction (X direction) of the first plate-shaped portion 714b, the size (diameter) of the through-hole 2714g that is a circular hole may be larger than the size (diameter) of the through-hole 2714f that is a circular hole. Also, as shown in FIG. 14, when viewed from the thickness direction (X direction) of the first plate-shaped portion 714b, the size (diameter) of the through-hole 2714f that is a circular hole may be larger than the size (diameter) of the through-hole 2714g that is a circular hole. Note that the other configurations of the second embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0094] (Manufacturing method of mounting head) A method for manufacturing the mounting head 2071 to which the above-described nozzle holding leaf spring 2714 is attached will be described below with reference to Fig. 15. Note that the method for manufacturing the mounting head 2071 will be described assuming, as an example, a case in which the nozzle holding leaf spring 2714 shown in Fig. 11 is attached to the head main body part 711.

[0095] Steps S1 and S4 correspond to steps S1 and S4 in the first embodiment, respectively, and therefore will not be described.

[0096] In step S202, a manufacturing worker forms a circular through-hole 2714f in a single metal plate at the first plate-shaped portion 714b of the nozzle holding leaf spring 2714. That is, step S202 is a step in which a tool penetrates the first plate-shaped portion 714b, thereby forming the through-hole 2714f in the first plate-shaped portion 714b.

[0097] In step S203, a manufacturing worker forms an elongated through-hole 2714g in a single metal plate at the second plate-shaped portion 714c of the nozzle holding leaf spring 2714. That is, step S203 is a step in which a tool penetrates the second plate-shaped portion 714c, thereby forming the through-hole 2714g in the second plate-shaped portion 714c.

[0098] In this way, steps S202 and S203 are steps in which a through hole 2714g is formed in the first plate-shaped portion 714b and a through hole 2714f having dimensions larger than that of the through hole 2714g when viewed from the thickness direction of the first plate-shaped portion 714b is formed in the second plate-shaped portion 714c before the first plate-shaped portion 714b and the second plate-shaped portion 714c are stacked by folding using a hemming bending process.

[0099] In step S204, the manufacturing worker uses hemming to bend the single metal plate in which the through holes 2714f and 2714g are formed, thereby overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c. Here, step S204 includes a step of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c by bending the metal plate so that the through holes 2714f and 2714g communicate with each other in the thickness direction of the first plate-shaped portion 714b. Furthermore, step S204 also includes a step of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c in a state where the first plate-shaped portion 714b and the second plate-shaped portion 714c are closely spaced (in close contact) by press working. After step S204, the manufacturing method of the mounting head 2071 is completed via step S4.

[0100] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0101] In the second embodiment, similarly to the first embodiment, each of the plurality of nozzle holding leaf springs 2714 of the component mounting apparatus 2000 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are bent and overlapped. This makes it possible to ensure a sufficient holding force for the nozzle 72 while suppressing a decrease in mechanical strength (fatigue strength) of the nozzle holding leaf springs 2714 that hold the nozzle 72, which is caused by heat during welding.

[0102] Furthermore, in the second embodiment, as described above, first plate-shaped portion 714b has through hole 2714f as through hole 2714e. Second plate-shaped portion 714c has through hole 2714g as through hole 2714e, which is larger in size than through hole 2714f when viewed in the thickness direction. This allows through hole 2714f and through hole 2714g to communicate with each other even if the centers of through holes 2714f and 2714g are slightly misaligned when bending a single plate-shaped member at bending portion 714d to provide first plate-shaped portion 714b and second plate-shaped portion 714c. As a result, it is not necessary to align through hole 2714f and through hole 2714g with high precision, which facilitates the operation of bending a single plate-shaped member at bending portion 714d.

[0103] Furthermore, in the second embodiment, as described above, the manufacturing method of the mounting head 2071 includes steps S202 and S203 of forming a through hole 2714f in the first plate-shaped portion 714b and forming a through hole 2714g in the second plate-shaped portion 714c having a diameter larger than that of the through hole 2714f when viewed in the thickness direction of the first plate-shaped portion 714b, before overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c by bending them by hemming. The step of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c by bending them by hemming includes step S204 of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c such that the through hole 2714f and the through hole 2714g are connected in the thickness direction. As a result, when bending a single plate-shaped member to provide first plate-shaped portion 714b and second plate-shaped portion 714c, even if the centers of through holes 2714f and 2714g are slightly misaligned, through holes 2714f and 2714g can be made to communicate with each other. As a result, there is no need to align through holes 2714f and 2714g with high precision, and the work of bending a single plate-shaped member at bending portion 714d can be easily performed. Note that other effects of the second embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0104] [Third embodiment] 16 to 20, the configuration of a mounting head 3071 provided in a component mounting apparatus 3000 according to the third embodiment will be described. Unlike the second embodiment, the third embodiment has a protrusion 3714h caulked to the inner circumferential surface of a through-hole 3714g. Note that in the third embodiment, detailed description of the same configuration as in the second embodiment will be omitted.

[0105] (Component mounting equipment) The component mounting apparatus 3000 is configured to mount (place) a component E at a predetermined mounting position on a board Sb on which cream solder has been printed.

[0106] Here, in the component mounting apparatus 3000, the transport direction in which the substrate Sb is transported is the X1 direction, the opposite direction to the transport direction in which the substrate Sb is transported is the X2 direction, and the combined direction of the X1 and X2 directions is the X direction. Furthermore, the horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. Furthermore, the up-down direction perpendicular to the X and Y directions is the Z direction (up-down direction), one side of the Z direction is the Z1 direction (upward direction), and the other side of the Z direction is the Z2 direction (downward direction).

[0107] The component mounting apparatus 3000 has a base 1, a feeder arrangement unit 2, a tray arrangement unit 3, a board transport unit 4, a support unit 5, a pair of rail units 6, a head unit 3007, a component imaging unit 8, a board imaging unit 9, and a control unit (not shown).Here, the head unit 3007 includes a mounting head 3071, a Z-axis motor (not shown), and an R-axis motor (not shown).

[0108] (Detailed structure of the mounting head) 16 and 17, the detailed structure of the mounting head 3071 will be described. Note that the detailed structure of all of the multiple mounting heads 3071 is the same, so the detailed structure of one of the multiple mounting heads 3071 will be described.

[0109] As shown in Figures 16 and 17, the mounting head 3071 has a head main body part 711 (see Figure 5), a fastening member 712 (see Figure 5), a fastening member 713 (see Figure 5), and a nozzle holding leaf spring 3714.

[0110] <Nozzle holding leaf spring> The nozzle holding leaf spring 3714 of the third embodiment has an engaging portion 714a, a first plate-shaped portion 714b, a second plate-shaped portion 714c, a bent portion 714d, and a through-hole 3714e. The first plate-shaped portion 714b is an example of "one plate-shaped portion" in the claims.

[0111] The through hole 3714e is formed by bending a single metal plate at the bending portion 714d by hemming bending, and then penetrating a tool into each of the first plate-shaped portion 714b of the single metal plate and the second plate-shaped portion 714c of the single metal plate before pressing the first plate-shaped portion 714b and the second plate-shaped portion 714c together by press working.

[0112] A through hole 3714f is formed in the first plate-shaped portion 714b as the through hole 3714e. The through hole 3714f penetrates the first plate-shaped portion 714b in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 3714f has a circular shape when viewed in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 3714f is an example of a "first through hole" in the claims.

[0113] A through hole 3714g is formed in the second plate-shaped portion 714c as the through hole 3714e. The through hole 3714g penetrates the second plate-shaped portion 714c in the thickness direction (X direction) of the second plate-shaped portion 714c. The through hole 3714g has a circular shape when viewed in the thickness direction (X direction) of the second plate-shaped portion 714c. The through hole 3714g is an example of a "second through hole" in the claims.

[0114] The fastening member 713 (see FIG. 5) is inserted into the through-hole 3714f and the through-hole 3714g.

[0115] When viewed from the thickness direction (X direction) of first plate-shaped portion 714b, the dimensions of through hole 3714f and through hole 3714g are different. When viewed from the thickness direction (X direction) of first plate-shaped portion 714b, the diameter of through hole 3714g is larger than the diameter of through hole 3714f. Here, the centers of through holes 3714f and 3714g are approximately aligned when viewed from the thickness direction (X direction) of first plate-shaped portion 714b.

[0116] The first plate-shaped portion 714b has a protruding portion 3714h that protrudes from the periphery of the through-hole 3714f toward the second plate-shaped portion 714c in the thickness direction (X direction). The protruding portion 3714h protrudes from the first plate-shaped portion 714b side toward the second plate-shaped portion 714c side. The protruding portion 3714h has a tapered shape in a cross section taken along the Z direction. When viewed from the thickness direction (X direction) of the first plate-shaped portion 714b, the tapered protruding portion 3714h is formed in an annular shape such that the length in the direction perpendicular to the X direction increases toward the X1 direction.

[0117] The protrusion 3714h of the first plate-shaped portion 714b is inserted into and tightly contacts the inner circumferential surface of the through-hole 3714g. Here, the length of the substantially circular protrusion 3714h in the direction perpendicular to the X-direction increases toward the X1 direction, so that the protrusion 3714h engages with the inner circumferential surface of the through-hole 3714g. Specifically, the protrusion 3714h is crimped to the inner circumferential surface of the through-hole 3714g. This makes it difficult for the protrusion 3714h to come out of the through-hole 3714g, making it difficult for the first plate-shaped portion 714b and the second plate-shaped portion 714c to separate, and therefore the gap between the first plate-shaped portion 714b and the second plate-shaped portion 714c to widen.

[0118] The through holes 3714f and 3714g are disposed in the upper portion of the nozzle holding leaf spring 3714. That is, the through holes 3714f and 3714g are disposed in a position closer to the Z2 direction than the upper end of the nozzle holding leaf spring 3714. Here, the upper end of the through holes 3714f and 3714g are disposed in a position spaced apart from the bent portion 714d by more than the radius Rd of the through hole 3714f. Note that the other configurations of the third embodiment are similar to those of the second embodiment, and therefore description thereof will be omitted.

[0119] (Manufacturing method of mounting head) A method for manufacturing the mounting head 3071 to manufacture the mounting head 3071 to which the above-described nozzle holding leaf spring 3714 is attached will be described below with reference to FIGS.

[0120] Steps S1 and S4 correspond to steps S1 and S4 in the second embodiment, respectively, and therefore will not be described.

[0121] In step S302, a manufacturing worker forms a circular through-hole 3714f in a single metal plate at the first plate-shaped portion 714b of the nozzle holding leaf spring 3714. That is, step S202 is a step in which a tool penetrates the first plate-shaped portion 714b, thereby forming the through-hole 3714f in the first plate-shaped portion 714b.

[0122] In step S303, a manufacturing worker forms a circular through-hole 3714g in a single metal plate at the second plate portion 714c of the nozzle holding leaf spring 3714. That is, in step S203, a tool is passed through the second plate portion 714c to form the through-hole 3714g in the second plate portion 714c. The diameter of the circular through-hole 3714g is larger than the diameter of the circular through-hole 3714f.

[0123] In step S304, a manufacturing worker hems and bends the metal plate in which through-holes 3714f and 3714g are formed, thereby overlapping first plate-shaped portion 714b and second plate-shaped portion 714c. At this time, through-holes 3714f and 3714g communicate with each other.

[0124] 18 and 19, in step S305, a manufacturing worker forms a protrusion 3714h in the through hole 3714f of the first plate-shaped portion 714b. In step S305, after the first plate-shaped portion 714b and the second plate-shaped portion 714c are overlapped, the protrusion 3714h, which protrudes from the periphery of the through hole 3714f toward the second plate-shaped portion 714c in the thickness direction of the first plate-shaped portion 714b, is inserted into the through hole 3714g. Here, the protrusion 3714h is formed by burring.

[0125] 18 and 20, in step S306, a manufacturing worker forms a tapered protrusion 3714h using a tool To. In step S306, the protrusion 3714h inserted into the through-hole 3714g is brought into close contact with the inner circumferential surface of the through-hole 3714g. This forms the nozzle holding leaf spring 3714 shown in FIG. 17. Then, after step S306, the manufacturing method of the mounting head 3071 is completed via step S4.

[0126] (Effects of the third embodiment) In the third embodiment, the following effects can be obtained.

[0127] In the third embodiment, similarly to the first embodiment, each of the plurality of nozzle holding leaf springs 3714 of the component mounting apparatus 3000 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are bent and overlapped. This makes it possible to ensure a sufficient holding force for the nozzle 72 while suppressing a decrease in the mechanical strength (fatigue strength) of the nozzle holding leaf springs 3714 that hold the nozzle 72, which is caused by heat during welding.

[0128] Furthermore, in the third embodiment, as described above, the first plate-shaped portion 714b is disposed on the head main body portion 711 side of the second plate-shaped portion 714c in the thickness direction of the first plate-shaped portion 714b. The first plate-shaped portion 714b has a protruding portion 3714h that protrudes from the periphery of the through-hole 3714f toward the second plate-shaped portion 714c in the thickness direction. The protruding portion 3714h of the first plate-shaped portion 714b is inserted into and closely contacts the inner circumferential surface of the through-hole 3714g. As a result, even if the first plate-shaped portion 714b attempts to move in a direction away from the second plate-shaped portion 714c, the protruding portion 3714h is in close contact with the through-hole 3714g, preventing the first plate-shaped portion 714b from moving away from the second plate-shaped portion 714c. This allows the gap between the first plate-shaped portion 714b and the second plate-shaped portion 714c to be maintained in a small state. As a result, when multiple nozzle retention leaf springs 3714 are plated together using plating filled in a container, it is possible to prevent another nozzle retention leaf spring 3714 from getting between the first plate-shaped portion 714b and the second plate-shaped portion 714c, so that the adhesion of plating to each of the multiple nozzle retention leaf springs 3714 is not hindered. That is, before attaching the nozzle retention leaf springs 3714 to the mounting head 3071, each of the multiple nozzle retention leaf springs 714 may be plated black to suppress reflection of light from lighting used when imaging the tip of the mounting head 3071. In this case, the multiple nozzle retention leaf springs 714 are plated by placing them in a container filled with plating and stirring the plating. At this time, because the gap between the first plate-shaped portion 714b and the second plate-shaped portion 714c is very small, it is possible to prevent another nozzle holding leaf spring 714 from getting between the first plate-shaped portion 714b and the second plate-shaped portion 714c. Therefore, it is possible to prevent another nozzle holding leaf spring 714 from being sandwiched between the first plate-shaped portion 714b and the second plate-shaped portion 714c of one nozzle holding leaf spring 714, so that the deposition of plating on one nozzle holding leaf spring 714 and the deposition of plating on another nozzle holding leaf spring 714 are not hindered by each other. As a result, it is possible to more reliably plate a plurality of nozzle holding leaf springs 714, and therefore it is possible to more reliably manufacture plated nozzle holding leaf springs 714.

[0129] Furthermore, in the third embodiment, as described above, the manufacturing method of the mounting head 3071 includes step S305 of overlapping the first plate-shaped portion 714b and the second plate-shaped portion 714c, and then inserting the protruding portion 3714h, which protrudes from the periphery of the through hole 3714f toward the second plate-shaped portion 714c in the thickness direction, into the through hole 3714g. The manufacturing method of the mounting head 3071 also includes step S306 of bringing the protruding portion 3714h inserted into the through hole 3714g into close contact with the inner circumferential surface of the through hole 3714g. As a result, even if first plate-shaped portion 714b attempts to move in a direction away from second plate-shaped portion 714c, the movement of first plate-shaped portion 714b can be stopped because protrusion 3714h is in close contact with through-hole 3714g, and therefore it is possible to prevent first plate-shaped portion 714b from moving away from second plate-shaped portion 714c and thereby prevent the gap between first plate-shaped portion 714b and second plate-shaped portion 714c from becoming larger. Note that other effects of the third embodiment are similar to those of the second embodiment, and therefore description thereof will be omitted.

[0130] [Fourth embodiment] 21, the configuration of a mounting head 4071 provided in a component mounting apparatus 4000 according to the fourth embodiment will be described. In the fourth embodiment, unlike the second embodiment, the diameter of the through hole 4714f and the diameter of the through hole 4714g are the same when viewed from the X1 direction side. Note that in the fourth embodiment, detailed description of the same configuration as in the second embodiment will be omitted.

[0131] (Component mounting equipment) The component mounting apparatus 4000 is configured to mount (place) a component E at a predetermined mounting position on a board Sb on which cream solder has been printed.

[0132] Here, in the component mounting apparatus 4000, the transport direction in which the substrate Sb is transported is the X1 direction, the opposite direction to the transport direction in which the substrate Sb is transported is the X2 direction, and the combined direction of the X1 and X2 directions is the X direction. Furthermore, the horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. Furthermore, the up-down direction perpendicular to the X and Y directions is the Z direction (up-down direction), one side of the Z direction is the Z1 direction (upward direction), and the other side of the Z direction is the Z2 direction (downward direction).

[0133] The component mounting apparatus 4000 has a base 1, a feeder arrangement section 2, a tray arrangement section 3, a board transport section 4, a support section 5, a pair of rail sections 6, a head unit 4007, a component imaging section 8, a board imaging section 9, and a control section (not shown).Here, the head unit 4007 includes a mounting head 4071, a Z-axis motor (not shown), and an R-axis motor (not shown).

[0134] (Detailed structure of the mounting head) The detailed structure of the mounting head 4071 will be described with reference to Fig. 21. Note that the detailed structure of all of the multiple mounting heads 4071 is the same, so the detailed structure of one of the multiple mounting heads 4071 will be described.

[0135] As shown in FIG. 21, the mounting head 4071 has a head main body 711 (see FIG. 5), a fastening member 712 (see FIG. 5), a fastening member 713 (see FIG. 5), and a nozzle holding leaf spring 4714.

[0136] <Nozzle holding leaf spring> The nozzle holding leaf spring 4714 of the fourth embodiment has an engaging portion 714a, a first plate-shaped portion 714b, a second plate-shaped portion 714c, a bent portion 714d, and a through-hole 4714e. The first plate-shaped portion 714b is an example of "one plate-shaped portion" in the claims.

[0137] The bent portion 714d is formed by hemming the first plate portion 714b and the second plate portion 714c so that they overlap. The bent portion 714d is provided at the end (upper end) of each of the plurality of nozzle holding leaf springs 714 on the Z1 direction side. The bent portion 714d is disposed at a position P2 that is spaced apart from the position P1 of the upper end of the through hole 714e by a distance greater than the radius Rd (shown by a dotted line in FIG. 21) of the through hole 714e above the upper end P1 of the through hole 714e.

[0138] The through hole 4714e is formed by bending a single metal plate at the bending portion 714d by hemming bending, and then penetrating a tool into each of the first plate-shaped portion 714b of the single metal plate and the second plate-shaped portion 714c of the single metal plate before pressing the first plate-shaped portion 714b and the second plate-shaped portion 714c together by press working.

[0139] A through hole 4714f is formed in the first plate-shaped portion 714b as the through hole 4714e. The through hole 4714f penetrates the first plate-shaped portion 714b in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 4714f has a circular shape when viewed in the thickness direction (X direction) of the first plate-shaped portion 714b. The through hole 4714f is an example of a "first through hole" in the claims.

[0140] A through hole 4714g is formed in the second plate-shaped portion 714c as the through hole 4714e. The through hole 4714g penetrates the second plate-shaped portion 714c in the thickness direction (X direction) of the second plate-shaped portion 714c. The through hole 4714g has a circular shape when viewed in the thickness direction (X direction) of the second plate-shaped portion 714c. The through hole 4714g is an example of a "second through hole" in the claims.

[0141] The fastening member 713 is inserted into the through-hole 4714f and the through-hole 4714g.

[0142] When viewed from the thickness direction (X direction) of first plate-shaped portion 714b, the diameter of through hole 4714f and the diameter of through hole 4714g are approximately the same. When viewed from the thickness direction (X direction) of first plate-shaped portion 714b, the center of through hole 4714f and the center of through hole 4714g are approximately aligned. Note that the other configurations of the fourth embodiment are similar to those of the second embodiment, and therefore description thereof will be omitted.

[0143] (Effects of the fourth embodiment) In the fourth embodiment, the following effects can be obtained.

[0144] In the fourth embodiment, similarly to the second embodiment, each of the plurality of nozzle holding leaf springs 4714 of the component mounting device 4000 has a first plate-shaped portion 714b and a second plate-shaped portion 714c that are bent and overlapped. This makes it possible to ensure a sufficient holding force for the nozzle 72 while suppressing a decrease in mechanical strength (fatigue strength) of the nozzle holding leaf springs 4714 that hold the nozzle 72, which is caused by heat during welding.

[0145] Furthermore, in the fourth embodiment, as described above, the through hole 4714e has a circular shape with approximately the same diameter in each of the first plate-shaped portion 714b and the second plate-shaped portion 714c when viewed in the thickness direction. The bent portion 714d is positioned at position P2, which is spaced upward from position P1 of the upper end of the through hole 4714e by more than the radius Rd of the through hole 4714e. This allows the bent portion 714d and the through hole 4714e to be sufficiently spaced apart. Therefore, when a single plate-shaped member is bent at the bent portion 714d to form the first plate-shaped portion 714b and the second plate-shaped portion 714c, deformation of the shape of the through hole 4714e due to stress generated in the bent portion 714d of the single plate-shaped member by bending can be suppressed. Note that other advantages of the fourth embodiment are similar to those of the second embodiment, and therefore description thereof will be omitted.

[0146] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the above description of the embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0147] For example, in the first to fourth embodiments, the multiple nozzle retention leaf springs 714 (2714, 3714, 4714) are arranged to face each other in the X direction, but the present invention is not limited to this. In the present invention, the multiple nozzle retention leaf springs may be arranged at equal angular intervals on the side surface of the head main body (for example, five at 72-degree intervals, four at 90-degree intervals, or three at 120-degree intervals, etc.).

[0148] In the first to fourth embodiments, the nozzle holding leaf spring 714 (2714, 3714, 4714) is bent once by providing the bent portion 714d at the end (upper end) on the Z1 direction side, but the present invention is not limited to this. In the present invention, the nozzle holding leaf spring may be bent two or more times by providing bent portions at the upper end and lower end.

[0149] In addition, in the first to fourth embodiments, the head unit 7 (2007, 3007, 4007) is an inline head in which the mounting heads 71 (2071, 3071, 4071) are arranged in a line in the X direction, but the present invention is not limited to this. The head unit may also be a rotary head in which the mounting heads are arranged in the circumferential direction.

[0150] In the first to fourth embodiments, the fastening member 713 fixes the nozzle holding leaf spring 714, in which the first plate-shaped portion 714b and the second plate-shaped portion 714c are brought into close proximity (close contact) by hemming bending, to the shaft member 711b, but the present invention is not limited to this. In the present invention, the nozzle holding leaf spring may be formed by bending the first plate-shaped portion and the second plate-shaped portion, which are bent by bending, and brought into close proximity (close contact) by the fastening member. [Explanation of symbols]

[0151] 7, 2007, 3007, 4007 head unit 20 Tape feeder (parts supply section) 31a Tray (Parts supply section) 32a Tray (Parts supply section) 71, 2071, 3071, 4071 Mounting head 72 nozzles 711 Head body 713 Fastening members 714, 2714, 3714, 4714 Nozzle retaining leaf spring 714a Engagement part 714b First plate-shaped portion (one plate-shaped portion) 714c Second plate-shaped part 714d Bending part 714e, 2714e, 3714e, 4714e through hole 714f, 2714f, 3714f, 4714f Through hole (1st through hole) 714g, 2714g, 3714g, 4714g Through hole (2nd through hole) 1000, 2000, 3000, 4000 component mounting equipment 3714h Protrusion E parts P1 (top of through hole) position P2 (Bending point) position Rd radius Sb substrate

Claims

1. A component supply unit that supplies components to be mounted on the board; a head unit including a mounting head having a nozzle detachably attached to a tip end thereof, the head unit detachably attaching the nozzle to the mounting head and mounting the components supplied by the component supply unit onto the substrate; the mounting head includes a head main body and a plurality of elastically deformable plate-shaped nozzle holding leaf springs attached to the head main body and configured to detachably sandwich and hold the nozzles, Each of the plurality of nozzle holding leaf springs has a first plate-shaped portion and a second plate-shaped portion that are folded and stacked, and an engaging portion that is provided on at least one of the first plate-shaped portion and the second plate-shaped portion and engages with the nozzle.

2. The component mounting device according to claim 1 , wherein the engaging portion is provided on one of the first plate-shaped portion and the second plate-shaped portion that is disposed closer to the head main body portion.

3. 2. The component mounting device according to claim 1, wherein each of the plurality of nozzle holding leaf springs has a bent portion formed by hemming so that the first plate portion and the second plate portion overlap each other.

4. 4. The component mounting device according to claim 3, wherein the bent portion is provided at an upper end of each of the plurality of nozzle holding leaf springs, and the engaging portion is provided near a lower end of each of the plurality of nozzle holding leaf springs.

5. the mounting head further includes a fastening member that attaches the plurality of nozzle holding leaf springs to the head main body portion, the plurality of nozzle holding leaf springs each have a through hole into which the fastening member is inserted, the through hole penetrating each of the first plate-shaped portion and the second plate-shaped portion in a thickness direction of the first plate-shaped portion; The component mounting device according to claim 4 , wherein the through-holes are disposed above each of the plurality of nozzle holding leaf springs.

6. the through holes have circular shapes with substantially the same diameter in each of the first plate-shaped portion and the second plate-shaped portion when viewed in the thickness direction, The component mounting device according to claim 5 , wherein the bent portion is disposed at a position within a radius of the through hole above the upper end of the through hole from the position of the upper end of the through hole.

7. the through holes have circular shapes with substantially the same diameter in each of the first plate-shaped portion and the second plate-shaped portion when viewed in the thickness direction, The component mounting device according to claim 5 , wherein the bent portion is disposed at a position spaced above the upper end of the through hole by a distance greater than the radius of the through hole.

8. the first plate-shaped portion has a first through hole as the through hole, The component mounting device according to claim 5 , wherein the second plate-shaped portion has a second through hole as the through hole, the second through hole having a dimension larger than that of the first through hole when viewed in the thickness direction.

9. the first plate-shaped portion is disposed closer to the head main body portion than the second plate-shaped portion in a thickness direction of the first plate-shaped portion, the first plate-shaped portion has a protruding portion that protrudes from a peripheral edge portion of the first through hole toward the second plate-shaped portion in the thickness direction, The component mounting device according to claim 8 , wherein the protruding portion of the first plate-shaped portion is inserted into and in close contact with an inner circumferential surface of the second through-hole.

10. a mounting head having a nozzle detachably attached to a tip end thereof, which picks up components supplied by a component supply unit by means of the nozzle and mounts them on a board, a head main body; a plurality of elastically deformable plate-shaped nozzle holding leaf springs attached to the head main body and configured to detachably sandwich and hold the nozzles, A mounting head, wherein each of the plurality of nozzle holding leaf springs includes a first plate-shaped portion and a second plate-shaped portion that are folded and stacked, and an engaging portion that is provided on at least one of the first plate-shaped portion and the second plate-shaped portion and engages with the nozzle.

11. A method for manufacturing a mounting head having a detachable nozzle attached to a tip end thereof, which picks up components supplied by a component supply unit and mounts them on a substrate by using the nozzle, comprising: forming an engaging portion that engages with the nozzle at an end of a plurality of elastically deformable plate-shaped nozzle holding leaf springs that detachably sandwich and hold the nozzle; a step of folding the first plate-shaped portion and the second plate-shaped portion by hemming and bending; and attaching each of the plurality of nozzle holding leaf springs, in which the first plate-shaped portion and the second plate-shaped portion are overlapped by hemming bending, to a head main body portion.

12. 12. The method for manufacturing a mounting head according to claim 11, further comprising the step of forming circular through holes of approximately the same diameter in each of the first plate-shaped portion and the second plate-shaped portion when viewed from the thickness direction of the first plate-shaped portion after folding the first plate-shaped portion and the second plate-shaped portion by hemming bending to overlap each other.

13. before folding the first plate-shaped portion and the second plate-shaped portion by hemming and bending, forming a first through hole in the first plate-shaped portion and forming a second through hole in the second plate-shaped portion, the second through hole having a diameter larger than that of the first through hole as viewed in the thickness direction of the first plate-shaped portion, 12. A method for manufacturing a mounting head as described in claim 11, wherein the step of folding the first plate-shaped portion and the second plate-shaped portion by hemming includes the step of overlapping the first plate-shaped portion and the second plate-shaped portion so that the first through hole and the second through hole are connected in the thickness direction.

14. a step of inserting a protruding portion, which protrudes from a peripheral portion of the first through hole toward the second plate-shaped portion in the thickness direction, into the second through hole after the first plate-shaped portion and the second plate-shaped portion are stacked together; The method for manufacturing a mounting head according to claim 13 , further comprising the step of bringing the protrusion inserted into the second through hole into tight contact with an inner circumferential surface of the second through hole.

Images