RFID label and method for manufacturing the same

Abstract

To prevent an RFID label used for a cylindrical body from lifting from the surface of the cylindrical body and to prevent printing spots by a printer and label conveyance from being disturbed.SOLUTION: An RFID label has a base material, an antenna pattern formed on the base material, and an IC chip connected to the antenna pattern, wherein the label base material is laminated on the side of the base material on which the IC chip is mounted via a first adhesive, and a second adhesive for sticking to an adherend is laminated on the opposite surface of the base material on the side on which the IC chip is mounted, and slits are formed in the base material in a pair of opposite side edges parts of the base material where no antenna pattern is formed in the base material.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an RFID label and a method for manufacturing an RFID label. [Background technology]

[0002] Labels that can be attached to cylindrical bodies such as blood collection tubes and test tubes have been proposed (see Patent Document 1). The label described in Patent Document 1 has a notch or a through hole formed in the label end to prevent the label end from peeling off because it cannot follow the curved surface of the test tube. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-73109 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which sends and receives information via contactless communication from IC chips containing product-related and identification information, have become widespread in fields such as product manufacturing, management, and distribution.

[0005] Such RFID labels contain an antenna pattern and a resin substrate for forming the antenna pattern, making them less likely to bend than labels that do not contain an RFID inlay, and the edges of the label are more likely to lift up when attached to a cylindrical object such as a test tube.

[0006] Furthermore, in the label described in Patent Document 1, the notches and holes formed at the edges are exposed on the surface of the label, which can cause printing spots in the printer or hinder the transport of the label during printing.

[0007] Therefore, an object of the present invention is to prevent an RFID label used on a cylindrical body from lifting off the surface of the cylindrical body, and to prevent printing spots by a printer and interference with label transport. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a method for manufacturing a cellular phone, comprising: attaching a substrate and an antenna pattern formed on the substrate along the axial direction of a cylindrical body as an adherend; , printable by printer An RFID label, comprising: an RFID tag; a base material having a pair of opposite peripheral edges; and a base material having an area where the antenna pattern is not formed; Along the edge A slit is formed and the slit is covered with a label substrate. Information is printed on the surface of the label base material. RFID labels are provided. [Effects of the Invention]

[0009] According to the RFID label of the present invention, slits are formed in the substrate in a pair of opposing peripheral areas where no antenna pattern is formed, and the RFID label is attached to an adherend by an adhesive layer laminated on the surface of the substrate on which the IC chip is mounted. Therefore, the slits formed in the peripheral areas allow the peripheral areas of the substrate to easily conform to the surface of a cylindrical object, thereby preventing the label from lifting off the surface of the cylindrical object.

[0010] Furthermore, the slits formed in the substrate are covered by the label substrate and are not exposed on the label surface, which prevents printing irregularities and prevents label transport by the printer. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view of an RFID label according to a first embodiment, viewed from the side of the surface to be attached to an adherend. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3]FIG. 10 is a plan view of an RFID label according to a second embodiment, seen from the side of the surface to be attached to an adherend. [Figure 4] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 5] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 6] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 7] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 8] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 9] 5A to 5C are schematic diagrams illustrating a method for manufacturing an RFID label according to the present embodiment. [Figure 10] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a first modified example. [Figure 11] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a first modified example. [Figure 12] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a second modified example. [Figure 13] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a second modified example. [Figure 14] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a second modified example. [Figure 15] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a second modified example. [Figure 16] 10A to 10C are schematic diagrams illustrating a method for manufacturing an RFID label according to a second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0012] [First embodiment] <RFIDラベル> An RFID label 10 according to an embodiment of the present invention will be described. Fig. 1 is a plan view of an RFID label according to a first embodiment, seen from the side of the surface to be attached to an adherend. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. In Fig. 1, the adhesive A2 has been omitted to make the drawing easier to understand.

[0013] As shown in FIG. 2, the RFID label 10 includes an RFID inlay 1 and a label substrate 6 laminated to the RFID inlay 1 via an adhesive A1.

[0014] The RFID inlay 1 includes a substrate 2 , an antenna pattern 3 formed on the substrate 2 by metal foil, and an IC chip 4 connected to the antenna pattern 3 .

[0015] 2, in the RFID label 10, a first adhesive A1 for laminating a label base material 6 is laminated on the surface of the base material 2 on which the IC chip 4 is mounted. In addition, a second adhesive A2 for adhering to an adherend is laminated on the surface of the base material 2 opposite the surface on which the IC chip 4 is mounted.

[0016] 1 and 2, the RFID label 10 has a slit 5 formed in the base material 2 in a pair of opposing edges 21, 22 of the base material 2, in an area where the antenna pattern 3 is not formed on the base material 2. In this embodiment, the slit 5 is formed so as to penetrate the base material 2 and the adhesive A2.

[0017] In the first embodiment, the slit 5 is a perforation having a cut portion of a predetermined length (referred to as a cut portion) and a portion without a cut (referred to as an uncut portion).

[0018] In the first embodiment, the antenna pattern 3 is a dipole antenna, and the slit 5 is formed along the direction in which the antenna pattern 3 extends when viewed from the IC chip 4 (the X direction in FIG. 1), as shown in FIG.

[0019] In the RFID label 10 according to the first embodiment, the slits 5 are formed in the peripheral portions 21, 22 of the base material 2, which makes the peripheral portions 21, 22 more easily bendable (they are more easily bent relative to a surface that curves with the Y direction in FIG. 1 being the circumferential direction). Therefore, when the RFID label 10 according to the first embodiment is attached to a cylindrical body with the X direction of the RFID label 10 aligned with the axial direction of the adherend, the peripheral portions 21, 22 of the base material 2 more easily conform to the surface of the cylindrical body.

[0020] Additionally, adhesive A2 is laminated on the surface of substrate 2 opposite to the surface on which IC chip 4 is mounted. Therefore, slit 5 formed in substrate 2 is covered by label substrate 6 and is not exposed on the label surface side.

[0021] The RFID label 10 according to the first embodiment may have information printed thereon to specify the direction in which the RFID label 10 is to be attached to a cylindrical body so that the X direction of the RFID label 10 is aligned with the axial direction of the cylindrical body that is the adherend.

[0022] Next, each component of the RFID label 10 will be described.

[0023] <Base material> For example, the substrate 2 may be a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film formed by laminating a plurality of these resin films.

[0024] In this embodiment, the substrate 2 may be the above-mentioned resin film substrate, or a paper substrate such as high-quality paper, medium-quality paper, or coated paper formed using these.

[0025] When mounting an IC chip 4 on the antenna pattern 3 formed on the substrate 2 using an anisotropic conductive material, it is preferable to use a paper substrate, as this can increase the adhesive strength between the IC chip 4 and the substrate 2.

[0026] The thickness of the substrate 2 can be appropriately selected within the above range depending on the design and use of the RFID medium as a product produced using the RFID inlay 1.

[0027] <Antenna pattern> 1, the antenna pattern 3 includes a loop portion 31, an IC chip connection portion 32 on which an IC chip 4 is mounted, meanders 33 and 34 extending symmetrically from the loop portion 31, and capacitor hats 35 and 36 connected to the ends of the meanders 33 and 34. In other words, the antenna pattern 3 forms a dipole antenna.

[0028] In this embodiment, the antenna pattern 3 is designed to have an antenna length and antenna wire width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz), for example.

[0029] In this embodiment, the antenna pattern 3 is adhered to the substrate 2 with an adhesive such as an acrylic adhesive, a urethane adhesive, a silicone adhesive, or a rubber adhesive, although this is not shown.

[0030] The antenna pattern 3 is made of a metal foil. Examples of metals that can be used for the antenna pattern 3 include copper and aluminum. From the viewpoint of reducing manufacturing costs, it is preferable to use aluminum foil.

[0031] From the viewpoints of the overall thickness of the RFID inlay 1, the overall thickness of the RFID medium when molded into an RFID medium, and manufacturing costs, the thickness of the metal foil is preferably 3 μm or more and 25 μm or less. In this embodiment, as an example, an aluminum foil with a thickness of 20 μm is used.

[0032] <ICチップ> In the RFID inlay 1, the IC chip 4 is a semiconductor package designed to be compatible with the UHF band and to be capable of communicating with a reader (not shown) that is a reading device for the IC chip 4.

[0033] The IC chip 4 is electrically and mechanically connected to an IC chip connection portion 32 formed in a part of the loop portion 31 of the antenna pattern 3 by an anisotropic conductive material E (shown in Figure 2), such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0034] The anisotropic conductive material E is a mixture of conductive filler particles of a predetermined particle size in a binder resin, which is an adhesive component, and can electrically and mechanically connect the antenna pattern 3 and the IC chip 4 by processes such as thermocompression bonding or ultraviolet curing.

[0035] <Effects> 2, slits 5 are formed in a pair of opposing peripheral edges 21, 22 of the base material 2 in areas where the antenna pattern 3 is not formed, penetrating the base material 2 and the adhesive A2. The RFID label 10 is configured such that a label base material 6 is laminated via a first adhesive A1 on the surface of the base material 2 on which the IC chip 4 is mounted, and the RFID label 10 is attached to an adherend by a second adhesive A2 on the surface of the base material 2 opposite to the surface on which the IC chip 4 is mounted.

[0036] Test tubes are often made of highly transparent materials such as polymethylpentene (product name: TPX), which has the second lowest surface tension after fluororesin. Such polymethylpentene test tubes also have the characteristic of being difficult for adhesive A1 to adhere to. Furthermore, they are exposed to a wide range of temperature environments, from low to high, as well as high humidity environments.

[0037] In contrast, according to the RFID label 10 of the first embodiment, when the X direction of the RFID label 10 is oriented along the axial direction of a cylindrical body, which is the adherend, the slits 5 formed in the peripheral portions 21, 22 of the base material 2 make it easier for the peripheral portions 21, 22 of the base material 2 to conform to the surface of the cylindrical body. Therefore, even if the cylindrical body is one to which adhesives are difficult to adhere, such as a TPX test tube, the peripheral portions 21, 22 can be attached along the surface of the cylindrical body, preventing the peripheral portions 21, 22 from lifting off the surface of the cylindrical body.

[0038] In addition, adhesive A2 is laminated on the surface of substrate 2 opposite to the surface on which IC chip 4 is mounted, and this surface is formed to adhere to the cylindrical body. Therefore, slit 5 formed in substrate 2 is covered by label substrate 6 and is not exposed on the label surface side.

[0039] Therefore, the slit 5 is not visible to the user due to the surface (printed surface) of the label substrate 6 of the RFID label 10. Therefore, the information printed on the label substrate 6 of the RFID label 10 does not overlap with the slit 5, making it easier for the user to read the printed information.

[0040] Furthermore, since the slit 5 is covered by the label substrate 6, it is possible to prevent the occurrence of printing irregularities and the obstruction of label transport that may occur if the slit 5 is exposed.

[0041] [Second embodiment] <RFIDラベル> Next, an RFID label 20 according to a second embodiment will be described. Fig. 3 is a plan view of the RFID label according to the second embodiment, seen from the side of the surface to be attached to an adherend. In Fig. 3, as in Fig. 1, the adhesive A2 is omitted to make the drawing easier to understand.

[0042] In the RFID label 20, of the plurality of slits 5 formed in the base material 2, the slits 5 adjacent to each other along the peripheral portions 21 and 22 are formed alternately in the direction along the peripheral portions 21 and 22.

[0043] Specifically, the RFID label 20 has slits 5 formed in the peripheral portions 21 and 22, which are alternately formed on a virtual line (dotted line L1 in Figure 3) along the peripheral portions 21 and 22 and on other virtual lines L2 and L3 parallel to the virtual line L1, for a predetermined number of stitches.

[0044] In the RFID label 20 shown in FIG. 3, there are portions where the slits 5 are formed at opposing positions of the imaginary lines L1 and L3 on both sides of the three imaginary lines, and portions where the slits 5 are formed only on the central imaginary line L2, and these portions are formed in a shape that is repeated along the X direction.

[0045] In the RFID label 10 according to the first embodiment described above, the slits 5 are formed continuously along the peripheral portions 21, 22, which makes the base material 2 more likely to bend at the peripheral portions 21, 22 and more likely to tear and divide in the Y direction starting from the slits 5.

[0046] In contrast, in the RFID label 20 according to the second embodiment, some of the slits 5 adjacent along the edge portions 21, 22 are not continuous along the edge portions 21, 22, but are formed alternately in the direction along the edge portions 21, 22 on different imaginary lines L1, L2, L3 for each predetermined number of stitches.

[0047] Therefore, in addition to the effect that the peripheral portions 21, 22 of the substrate 2 can easily conform to the surface of the cylindrical body to be adhered, compared to the RFID label 10 of the first embodiment, even if a force is applied to tear the substrate 2 in the Y direction starting from the slit 5, adjacent slits 5 will not be connected along the peripheral portions 21, 22, thereby preventing part of the substrate 2 from separating.

[0048] [RFID label manufacturing method] Next, a method for manufacturing an RFID label according to this embodiment will be described below. Figures 4 to 9 are schematic diagrams illustrating a method for manufacturing an RFID label according to this embodiment.

[0049] The manufacturing method of the RFID label according to this embodiment is a method of forming slits 5 in a pair of opposing edge portions of the base material 2 in an RFID inlay 1 having a base material 2, an antenna pattern 3 formed on the base material 2, and an IC chip 4 connected to the antenna pattern 3.

[0050] First, as shown in Figure 4, a long body 102 of base material 2 is laminated onto a long body 101 that serves as a backing (separator) via an adhesive A2, and a continuous body 100 is formed in which multiple antenna patterns 3 are laminated at predetermined intervals on the long body 102 of base material 2 using a third adhesive A3.

[0051] 5, slits 5 are formed in the elongated body 102 of the substrate 2 in predetermined regions of the continuous body 100 that face each other across the antenna pattern 3. In this embodiment, the slits 5 can be formed from the surface on which the antenna pattern 3 is laminated toward the elongated body 101 of the backing paper so as to penetrate through the elongated body 102 of the substrate 2 and the adhesive A2, using a die roll with a convex blade formed thereon and an anvil roller or the like that backs up the die roll.

[0052] The predetermined region where the slit 5 is formed corresponds to a pair of opposing edges 21, 22 of the substrate 2 in the RFID label 10. In this embodiment, the continuous body 100 is arranged so that the direction in which the antenna pattern 3 extends (X direction) coincides with the width direction of the continuous body 100 when viewed from the IC chip 4, and is transported in the Y direction. The slit 5 is formed across the width direction of the continuous body 100.

[0053] 6, an IC chip 4 is mounted on the antenna pattern 3. As in this embodiment, the IC chip 4 is mounted on the antenna pattern 3 after the formation of the antenna pattern 3 and the slits 5, thereby preventing the IC chip 4 from being damaged during the formation of the slits 5.

[0054] Subsequently, as shown in FIG. 7, a first adhesive A1 for the label substrate 6 is applied to the surface of the continuous body 100 on which the IC chip 4 is mounted.

[0055] Next, as shown in FIG. 8, the elongated body 103 of the label substrate 6 is laminated on the surface of the substrate 2 on which the first adhesive A1 is applied and on which the IC chip 4 is mounted.

[0056] Next, as shown in Fig. 9, unnecessary portions of the elongated bodies 103 and 102 that do not constitute the RFID labels 10 are removed from the continuous body 100. This is known as scrap removal. This results in a label sheet in which the RFID labels 10 are temporarily attached in succession to the elongated body 101 on the backing paper.

[0057] Here, the manufacturing method of the RFID label according to this embodiment may include a step of applying adhesive A3 to the elongated body 102 of the base material 2 while transporting it, bonding a metal sheet M to the elongated body 102 of the base material 2 to which adhesive A3 has been applied, and further removing the portion of the metal sheet that does not constitute the antenna pattern 3, thereby manufacturing the continuum 100.

[0058] <Effects> According to the above-described manufacturing method, it is possible to form slits 5 penetrating the base material 2 and the adhesive A2 in a pair of opposing peripheral edges 21, 22 of the base material 2 in regions where the antenna pattern 3 is not formed. Furthermore, since the label base material 6 is laminated via the adhesive A1 on the surface of the base material 2 opposite the surface on which the IC chip 4 is mounted, the slits 5 formed in the base material 2 are covered by the label base material 6 and are not exposed on the label surface side.

[0059] Therefore, it is possible to manufacture RFID labels that can prevent the occurrence of printing irregularities and the obstruction of label transport that may occur if the slit 5 is exposed.

[0060] <First Modification> Next, a first modified example of the method for manufacturing an RFID label according to this embodiment will be described below. Figures 10 and 11 are schematic diagrams illustrating the method for manufacturing an RFID label according to the first modified example.

[0061] In the first variant of the manufacturing method for an RFID label, as shown in Figure 10, after a slit 5 is formed in the continuous body 100, the elongated body 102 of the base material 2 and the adhesive A2 are peeled off from the elongated body 101 that serves as the backing.

[0062] Then, as shown in Fig. 11, the peeled elongated body 102 of the base material 2 and the adhesive A2 are laminated onto another elongated body 110 of a mount. Note that the steps from Fig. 11 onwards are the same as those in Figs. 6 to 9, and therefore detailed explanations will be omitted.

[0063] According to the RFID label manufacturing method of the first variant, the long backing body 101 used in the process of manufacturing the continuous body 100, which is designed to be easy to handle during manufacturing, can be replaced with a long backing body 110 for the product, which takes into consideration the ease of handling and design when the RFID label 10 is used.

[0064] <Second Modification> Next, a second modified example of the method for manufacturing an RFID label according to the second modified example will be described below. Figures 12 to 16 are schematic diagrams illustrating the method for manufacturing an RFID label according to the second modified example.

[0065] In the second variant of the method for manufacturing an RFID label, similar to the process shown in Figure 10 described above, after a slit 5 is formed in the continuous body 100, the elongated body 102 of the base material 2 and the adhesive A2 are peeled off from the elongated body 101 of the first backing sheet.

[0066] Then, as shown in FIG. 12, the elongated body 102 of the base material 2 and the adhesive A2 are laminated not on the mount but on the elongated body 103 of the label base material 6 on which the print surface is formed.

[0067] Subsequently, as shown in FIG. 13, an IC chip 4 is mounted on the antenna pattern 3.

[0068] Next, as shown in Fig. 14, a fourth adhesive A4 for the second mount is applied to the surface of the base material 2 on which the IC chip 4 is mounted. Subsequently, as shown in Fig. 15, a long element 104 of a second mount, which is different from the long element 101 of the first mount, is laminated on the fourth adhesive A4.

[0069] Next, as shown in FIG. 16, unnecessary portions of the elongated body 104 and the elongated body 102 that do not constitute the label base material 6 are removed.

[0070] According to the second modification, it is possible to manufacture an RFID label 30 that can be attached with the surface on which the IC chip 4 is mounted facing the adherend side.

[0071] <Effects> According to the above-described manufacturing method, slits 5 can be formed in the base material 2 in a pair of opposing peripheral edges 21, 22 of the base material 2 in regions where the antenna pattern 3 is not formed. In addition, a label base material 6 is laminated via a fourth adhesive A4 on the surface of the base material 2 opposite the surface on which the IC chip 4 is mounted. Therefore, the slits 5 formed in the base material 2 are covered by the label base material 6 and are not exposed on the label surface side.

[0072] Therefore, it is possible to manufacture RFID labels that can prevent the occurrence of printing irregularities and the obstruction of label transport that may occur if the slit 5 is exposed.

[0073] Furthermore, according to the second modification, it is possible to manufacture an RFID label that can be attached with the surface on which the IC chip 4 is mounted facing the adherend side.

[0074] [Other embodiments] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0075] In this embodiment, the slits 5 include those formed so as to penetrate the base material 2, as well as so-called embossed slits that do not penetrate the base material 2, such as V-grooves and recessed grooves.

[0076] In this embodiment, the formation of the antenna pattern 3 and the formation of the slit 5 may be performed in one step, for example, using a die roll having a blade portion for forming the antenna pattern 3 and a convex blade portion for forming the slit 5.

[0077] In this embodiment, the slits 5 may be formed in a pair of edge portions along the Y direction intersecting the direction in which the dipole antenna spreads (X direction). In this case, information for specifying the direction of attachment to a cylindrical body may be printed so that the Y direction of the RFID label 10 is oriented along the axial direction of the cylindrical body.

[0078] In this embodiment, the case where the antenna pattern 3 is a dipole antenna for a UHF band inlet has been described, but it may also be a coil antenna for an HF band.

[0079] As the anisotropic conductive material E, an anisotropic conductive film can be used in addition to an anisotropic conductive adhesive. The anisotropic conductive film is formed by fixing the above-mentioned filler and binder to a resin sheet, and is used by thermocompression bonding. The anisotropic conductive material E may be a thermosetting type or an ultraviolet curing type. [Explanation of symbols]

[0080] 1 RFID inlay 2 Base material 3 Antenna Pattern 4 IC chip 5 Slits 6 Label substrate 10, 20, 30 RFID labels 21,22 Periphery 31 Loop section 32 IC chip connection part 33,34 Meander 35,36 Capacitor Hat 100 Continuum 101,102,103,104,110 Long body A1 First Adhesive A2 Secondary adhesive A3 Third adhesive A4 fourth adhesive E Anisotropic conductive material L1, L2, L3 virtual lines

Claims

1. An RFID label having a substrate and an antenna pattern formed on the substrate, attached along the axial direction of a cylindrical body as an adherend, and printable by a printer, slits are formed along the edges of the base material only in an area where the antenna pattern is not formed and only in a pair of opposing edges of the base material; The slit is covered with a label base material, and information is printed on the surface of the label base material. RFID label.

2. 2. The RFID label of claim 1, The slit is a perforation. RFID label.

3. 3. The RFID label according to claim 1, A plurality of slits are formed in the substrate, At least some of the slits among the plurality of slits are formed such that adjacent slits along the edge portion are alternately formed in a direction along the edge portion. RFID label.

4. 4. The RFID label according to claim 1, The antenna pattern is a dipole antenna, The slit is formed along the direction in which the antenna pattern extends. RFID label.

5. 5. The RFID label according to claim 1, The label substrate covers the entire substrate. RFID label.

6. 2. The RFID label of claim 1, The information is information for specifying the direction of attachment to the adherend. RFID label.

7. 7. The RFID label of claim 6, The adhesion direction is along the axial direction of the cylindrical body that is the adherend. RFID label.

8. An RFID label according to any one of claims 1 to 7; A continuous label strip comprising a long backing sheet, The RFID label is laminated on the long piece of backing paper, The slit of the RFID label is covered by the elongated body of the backing paper. Label continuum.

9. A method for manufacturing an RFID label that has a substrate and an antenna pattern formed on the substrate, that is attached to a cylindrical body as an adherend along an axial direction, that has slits formed only in an area of the substrate where the antenna pattern is not formed and only on a pair of opposing edge portions of the substrate, and that can be printed on by a printer, comprising: a continuous body in which the elongated base material is laminated on the elongated base material via an adhesive, and a plurality of the antenna patterns are formed at predetermined intervals on the elongated base material, the continuous body being formed in predetermined regions opposing each other across the antenna pattern, the slits being formed only in regions of the base material where the antenna pattern is not formed and along a pair of opposing peripheral edges of the base material, After forming the slits, a label substrate having information printed on its surface is laminated on the surface of the continuous body on which the antenna pattern is formed; removing a portion of the label substrate that does not constitute the RFID label; A method for manufacturing an RFID label.

10. 10. A method for manufacturing an RFID label according to claim 9, comprising: The slit is formed across the width direction of the continuum. A method for manufacturing an RFID label.

Images