Electrical switchgear with improved cooling

The disconnector housing with airflow openings addresses cooling challenges in high-density switchgears, ensuring effective thermal management and insulation, even in airtight/watertight conditions.

JP7725708B2Active Publication Date: 2025-08-19EATON INTELLIGENT POWER LTD
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Patent Information

Application Number
JP2024509110
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-10-27
Filing Date
2022-09-01
Publication Date
2025-08-19
Estimated Expiration
2042-09-01

AI Technical Summary

Technical Problem

Switchgears with increasing component density face challenges in cooling, especially when airtight and/or watertight, restricting external airflow and hindering effective thermal management.

Method used

Incorporating a disconnector housing with specific openings to facilitate airflow through thermal convection, enhancing insulation and cooling within the switchgear, while maintaining IP68 or IP67 ratings for dust and water resistance.

Benefits of technology

Improves thermal convection and insulation, ensuring effective cooling of switchgear components even in harsh environmental conditions, with optimized airflow design and material selection.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Abstract

A switchgear (1) is disclosed, comprising a switchgear housing (2), a number of busbars (L1..L3), and a number of disconnectors (3a..3c) in the switchgear housing (2), the disconnectors (3a..3c) being arranged in the middle of the busbars (L1..L3). The switchgear (1) further comprises a disconnector housing (4), the disconnector housing (4) being arranged in the switchgear housing (2) and enclosing at least the disconnectors (3a..3c). The disconnector housing (4) has at least one bottom opening (A..'') and at least one top opening (D..F) and allows an air flow (G) to flow from the at least one bottom opening (A..C'') to the at least one top opening (D..F) through the disconnectors (3a..3c).
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Citation Information

Patent Citations

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    JP2011172357A

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