Eddy Current (EC) Inspection Configuration Systems and Technology

Abstract

Various approaches can be used to perform eddy current inspection of a structure. The sensor configuration described herein can include a flex circuit with multiple EC sensor elements. The flex circuit can conform to an area of ​​the structure under test, such as a desired portion of the profile and supported by a spacer, to maintain a desired standoff distance between the object under test and the probe assembly. The techniques of the specification can be used to establish inspection configuration data that defines the activation or deactivation of each EC sensor in the probe assembly. For example, a graphical user interface (GUI) can be used to provide graphical feedback regarding one or more attributes of the test, such as an indication of the location of the test probe or other attributes.

Description

[Technical Field]

[0001] Priority claims This patent application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 268,784 to Beaulieu et al. (Attorney Docket No. 6409.230PRV), filed March 2, 2022, and entitled "EDDY CURRENT (EC) PROBE CONFIGURATION, TECHNIQUES FOR EC TESTING, AND EC TESTING USER INTERFACE," which is incorporated herein by reference in its entirety.

[0002] This document relates generally, but not exclusively, to apparatus and techniques for non-destructive testing, such as facilitating eddy current testing, and more particularly to apparatus and techniques for performing eddy current testing, including establishing configurations for enabling or disabling each eddy current sensor element within an eddy current probe assembly. [Background technology]

[0003] Nondestructive testing (NDT) can refer to the use of one or more different techniques to inspect an area on or within an object, for example, to determine whether the inspected object has flaws or defects or to otherwise characterize the inspected object. An example of a nondestructive testing technique can include the use of eddy current testing, in which electromagnetic energy is applied to an object and the resulting induced current on or within the object creates an electrical signature that can be detected. For example, the value of the detected current (or associated impedance) can provide an indication of the structure of the object, such as indicating the presence of cracks, voids, porosity, or other non-uniformities at or near the surface of the conductive object being tested. Eddy current testing can be used as a surface inspection technique for steel structures, such as in combination with other inspection techniques (e.g., acoustic inspection) to achieve surface or subsurface coverage. Summary of the Invention [Means for solving the problem]

[0004] Eddy current (EC) testing can be used as a nondestructive inspection technique, such as to assist in inspection operations during or after the manufacture of an article. For example, steel structures such as railroad rails can be inspected as part of the production or receiving process, using eddy current technology or a combination of eddy current and other inspection modalities, such as visual or acoustic inspection. In one approach, inspection can be performed by a technician using a pencil probe or other probe configuration. Such approaches can present various challenges. For example, eddy current inspection generally involves maintaining a desired spatial relationship between the eddy current sensor and the surface of the object under test. Lifting the sensor away from the surface of the object under test can affect test coverage and require rescanning. Additionally, manually scanning a structure using a raster or other pattern can be time-consuming and inconsistent. While automation, such as using a fixture to house the EC probe assembly, can help improve inspection consistency, such fixtures are still sensitive to misorientation or incorrect probe location of the probe relative to the object under test.

[0005] The inventors have recognized that EC inspections can be facilitated, among other things, through the use of machine-implemented tools (e.g., computer-implemented tools, such as those providing a user or operator interface) for planning and executing EC inspections. Arrays of eddy current sensors can be used to enhance testing productivity by providing greater coverage for each scan or pass, etc. Illustratively, such machine-implemented tools can include or use models representing each eddy current array (ECA) probe configuration and an associated model of each object being inspected. For example, the present subject matter can include or use such models to assist a user in one or more of: (a) establishing a specified probe location relative to an object under test for a specified inspection configuration; (b) selecting or deselecting each of the ECA probe sensors for a specified inspection configuration; or (c) storing a specified inspection configuration for use in controlling EC inspection operations.

[0006] The devices and techniques described herein can be used to implement “offline” inspection plans for future inspection operations, or can be used in an “online” manner, where such devices and techniques can be used to configure and trigger such inspections. The devices and techniques described herein can also be used to facilitate evaluation of inspection results, such as providing a visual representation of EC inspection operation findings superimposed on a representation of the object under test for evaluation, reporting, or record-keeping purposes. The devices and techniques described herein can include the use of ECA probe assemblies with flexible substrates, such as each probe assembly configured for inspection of a portion of the object under test having a complex profile. By way of illustration, the devices and techniques described herein can be used to facilitate EC inspection of railway rails, such as supporting simultaneous inspection of the rails using multiple ECA inspection probes. For example, such inspections using configuration techniques as described herein can provide coverage of multiple portions of a rail profile using multiple ECA inspection probe assemblies in a single pass.

[0007] In one example, a technique such as a machine-implemented method can support eddy current (EC) inspection, the machine-implemented method including receiving a model defining an outline of an object under test, receiving a model of an eddy current array (ECA) probe, the model defining spatial locations of multiple eddy current sensors, receiving an indication of the location of the ECA probe relative to the location of the object under test, and responsively indicating each activated eddy current sensor among the multiple eddy current sensors using the received model defining the outline of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe. The machine-implemented method can include generating a presentation for a user identifying each indicated activated eddy current sensor. The machine-implemented method can include the received model defining the ECA probe defining a plurality of spacers, where the plurality of spacers establish a specified standoff distance between the multiple eddy current sensors and the object under test when each of the plurality of spacers is in contact with the object under test. For example, the machine-implemented method may include generating a presentation for a user indicating the location of the ECA probe, including the location of at least one of the spacers among the plurality of spacers and whether at least one of the spacers among the plurality of spacers is within a specified trajectory.

[0008] In one example, a system can support eddy current (EC) inspection, the system comprising: a processor circuit; a display communicatively coupled to the processor circuit; a user input; and a memory circuit communicatively coupled to the processor circuit, the memory circuit including instructions that, when executed by the processor circuit, cause the processor circuit to: receive a model defining an outline of an object under test; receive a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors; receive an indication of the locations of the ECA probe relative to the location of the object under test using the user input; and responsively generate a presentation for a display indicating each activated eddy current sensor among the plurality of eddy current sensors using the received model defining the outline of the object under test, the received model of the ECA probe, and the received indication of the locations of the ECA probe. The instructions can include instructions for storing an EC inspection configuration including data indicative of each activated eddy current sensor and including data indicative of the locations of the ECA probe relative to the location of the object under test. The instructions may also include instructions to store a plurality of EC test configurations corresponding to respective ECA probe definitions and corresponding locations.

[0009] This Summary is intended to provide an overview of the subject matter of this patent application. It is not intended to provide an exclusive or exhaustive description of the invention. The Detailed Description is included to provide further information regarding this patent application.

[0010] In the drawings, which are not necessarily drawn to scale, like numerals may describe like components in different views. Like numerals with different letter suffixes may represent different instances of similar components. The drawings generally illustrate, by way of example, various embodiments discussed in this document, although not by way of limitation. [Brief explanation of the drawings]

[0011] [Figure 1] Examples are generally illustrated that include a non-destructive inspection system, such as may be used to implement at least a portion of one or more of the techniques shown and described herein. [Figure 2A] An example is generally illustrated that includes an eddy current array (ECA) probe assembly, such as one having a curved shape. [Figure 2B] The examples generally illustrate examples including eddy current array (ECA) probe assemblies with respective spacers that maintain a specified standoff distance between the ECA probe assembly and an object under test. [Figure 2C] The examples are generally illustrated including eddy current array (ECA) probe assemblies included as part of a test fixture, the test fixture having respective actuators. [Figure 3] 1 generally illustrates an illustrative example of a presentation (eg, a graphical user interface) that can be presented to a user to assist in establishing an EC test configuration. [Figure 4A] Illustrative examples of techniques that can be used to provide an indication of each EC sensor activation based on different criteria are generally illustrated. [Figure 4B] Illustrative examples of techniques that can be used to provide an indication of each EC sensor activation based on different criteria are generally illustrated. [Figure 5] Illustrating generally illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 5 defines a probe selection situation. [Figure 6A] Illustrating further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6A defines a probe location situation. [Figure 6B]6B generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that can be presented to a user, the illustrative example of FIG. 6B defining a further probe location situation showing an enlarged (e.g., "zoomed") view. [Figure 6C] Illustrating generally further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 6C defines an inspection zone situation. [Figure 6D] Further illustrative examples of presentations (e.g., graphical user interfaces) that can be presented to a user are generally illustrated, with the illustrative example of FIG. 6D defining an overall EC inspection configuration, such as using different EC probe assemblies to facilitate respective inspection operations. [Figure 7] To generally illustrate further illustrative examples of presentations (eg, graphical user interfaces) that may be presented to a user, the illustrative example of FIG. 7 defines a lab result reporting situation. [Figure 8] The present invention generally illustrates techniques, such as machine implementation methods, that may include indicating each of the eddy current sensors that assist and activate an inspection operation, such as using a received model. [Figure 9] 9 illustrates an example block diagram comprising a machine 900 upon which any one or more of the techniques (eg, methodologies) discussed herein may be implemented. DETAILED DESCRIPTION OF THE INVENTION

[0012] Eddy current (EC) testing can be used as a non-destructive inspection technique, such as to support inspection operations during or after the manufacture of an article. The systems and techniques described herein can provide a graphical user interface (GUI) and associated machine-implemented tools to support EC testing and facilitate such testing, such as assisting a user in establishing an EC inspection configuration. Such a configuration can be defined as a stored data structure providing details regarding probe selection, the object under test, the probe location, and the respective sensors to be activated or deactivated for the corresponding inspection operation. The present subject matter can also include flaw visualization tools, such as providing an indication of detected flaws superimposed on a visualization of at least a portion of the object under test. Such visualization can be facilitated using inspection configuration data corresponding to the inspection operation, as such inspection configuration data can indicate probe type, location, or other information that enables flaws to be localized on the object under test.

[0013] FIG. 1 generally illustrates an example including a non-destructive inspection system 100 that can be used to implement at least a portion of one or more of the techniques shown and described herein. The non-destructive inspection system 100 can include a test instrument 140, such as a handheld or portable assembly. The test instrument 140 can be electrically coupled to a probe assembly 150, such as using a multi-conductor interconnect 130. The probe assembly 150 can include one or more transducers, such as an eddy current (EC) transducer array 152 including respective EC sensors 154A-154N. The transducer array 152 can follow a linear or curved profile or can include an array of elements extending in multiple axes. The size and pitch of the elements can vary depending on the inspection application.

[0014] A modular probe assembly 150 configuration can be used to enable the test instrument 140 to be used with a variety of different probe assemblies. Generally, the transducer array 152 includes an EC coil, for example, located on or within a substrate. The EC coil is electromagnetically coupled to a target 158 (e.g., a test sample or "subject under test"). The test instrument 140 can include digital and analog circuitry, such as a front-end circuit 122 that includes one or more transmit signal chains, receive signal chains, or switching circuitry (e.g., transmit / receive switching circuitry). The transmit signal chain can include amplifier and filter circuitry to provide transmit pulses for delivery to the probe assembly 150 through the interconnect 130. A flaw 160 associated with the target 158 can be detected, for example, by monitoring the impedance or other electrical characteristics associated with each sensor 154A-154N in the transducer array 152.

[0015] While FIG. 1 shows a single probe assembly 150 and a single transducer array 152, other configurations can be used, such as multiple probe assemblies connected to a single test instrument 140 or multiple transducer arrays 152 used with a single probe assembly 150. Similarly, test protocols can be performed using coordination among multiple test instruments 140, for example, in response to an overall test scheme established from each test instrument 140 or established by another remote system such as computing equipment 108 or a general-purpose computing device such as a laptop 132, tablet, smartphone, or desktop computer. The test scheme can be established in accordance with published standards or regulatory requirements and, as illustrative examples, can be performed repeatedly at initial production or for ongoing monitoring. In general, as described elsewhere herein, EC test configurations can be established separately, such as to be executed by the test instruments 140 in a fully automated or semi-automated manner.

[0016] The front-end circuitry 122 may be coupled to and control one or more processor circuits, such as the processor circuitry 102 included as part of the test instrument 140. The processor circuit may be coupled to the memory circuitry 104, for example, to cause the test instrument 140 to execute instructions that cause the test instrument 140 to perform one or more of the EC testing, processing, or storage of data related to the EC testing, or otherwise implement techniques as shown and described herein. The test instrument 140 may be communicatively coupled to other portions of the system 100, such as using a wired or wireless communication interface 120.

[0017] For example, performance of one or more techniques as shown and described herein may be achieved on the test instrument 140 or using other processing or storage facilities, such as using the computing equipment 108 or general-purpose computing devices such as laptops 132, tablets, smartphones, desktop computers, etc. For example, processing tasks that would be unnecessarily slow if performed on the test instrument 140 or beyond the capabilities of the test instrument 140 may be performed remotely (e.g., on a separate system), e.g., in response to a request from the test instrument 140. The test instrument 140 may include a display 110, such as for presenting configuration information or results, and input devices 112, including one or more of a keyboard, trackball, function keys or softkeys, a mouse interface, a touch screen, a stylus, etc., for receiving operator commands, configuration information, or responses to queries.

[0018] FIG. 2A generally illustrates an example including an eddy current array (ECA) probe assembly 250 having a curved shape. The probe assembly 250 can include a rigid portion 266, which can include interconnects for coupling electrical conductors within the probe assembly 250 to other test fixtures. The probe assembly 250 can include a flexible substrate 264 having a curved profile. The flexible substrate 264 can include or support each eddy current sensor (e.g., EC sensors 254A-254N). For example, the probe assembly 250 can include a linear array of EC sensors, such as 16 coils. Other fixtures, such as a rigid core, can provide a shape to which the flexible substrate 264 can conform. In this manner, a general flexible probe configuration can be used across multiple different profiles by bending or curving the flexible substrate 264 as needed.

[0019] FIG. 2B generally illustrates an example including an eddy current array (ECA) probe assembly with respective spacers that maintain a specified standoff distance between the ECA probe assembly 250 and an object under test. Similar to the example probe assembly 250 of FIG. 2A, the probe assembly 250 of FIG. 2B includes a rigid portion 266, a flexible substrate 264, and sensors, such as EC sensors 254A-254N. First spacer 262A, second spacer 262B, and third spacer 262C can maintain a specified standoff distance between the probe assembly 250 and an object under test 258 (e.g., a rail leg in the example of FIG. 2B). Illustratively, the spacers (first spacer 262A, second spacer 262B, and third spacer 262C) can include a carbide material to define a carbide pin or cylindrical structure. In this manner, the first spacer 262A, the second spacer 262B, and the third spacer 262C can be wear-resistant and damage-resistant to protect the EC sensors 254A to 254N of the probe assembly 250 from damage and to maintain the specified distance "h" between the flexible substrate 264 carrying the EC sensors 254A to 254N and the object under test 258.

[0020] 2C generally illustrates an example including an eddy current array (ECA) probe assembly 250 included as part of a test fixture 268, the test fixture having a respective actuator. As described above, a flexible portion of the probe assembly 250 can be attached to the test fixture 268. The test fixture 268 can be robotically manipulated to be translated along the object under test 258, or, as shown illustratively in FIG. 2C, the test fixture 268 can be supported by or incorporated into a frame assembly, with the object under test 258 being translated relative to the probe assembly 250 and the test fixture 268. For example, as shown illustratively in FIG. 2C, the object under test 258 can include a railway rail, and the rail can be transported past the test fixture 268.

[0021] As shown and described elsewhere herein, the location of the probe assembly 250 can be defined by a stored inspection configuration, and sensors within the probe assembly can be activated or deactivated according to the stored configuration. The probe assembly 250 can be positioned robotically or using actuators to establish the probe assembly 250 at a specified memory location corresponding to the stored inspection configuration. For example, as shown in FIG. 2C , a combination of two pivoting elements and two linear actuators can be used to provide various degrees of freedom for probe positioning. Such an example is merely illustrative, and other configurations can be used. Multiple probe assemblies 250 can be positioned either collectively or independently, such as using respective fixtures 268, to achieve coverage of different regions of the object under test 258. In this manner, multiple inspection operations can be performed simultaneously as the object under test 258 is translated relative to the respective fixtures 268. Such inspection operations can include longitudinal, lateral, and diagonal probe configurations relative to the long axis of the object under test 258.

[0022] FIG. 3 generally illustrates an illustrative example of a presentation (e.g., a graphical user interface) that can be presented to a user to assist in establishing an EC test configuration. FIG. 3 conceptually illustrates various aspects of a test configuration that can be established, retrieved, or stored and supported by machine-implemented techniques and graphical presentation to a user. For example, probe assembly 250 can be shown in probe position display 374 as corresponding to a selected probe ("E400115"). The representation of probe assembly 250 can be defined by a model including a point cloud that includes the locations of flexible substrate 264, spacers 262A, 262B, and 262C, and respective EC sensors, such as sensors 254A and 254C. Object under test 258 can also be defined by a model including a point cloud, such as defining a coordinate system with an origin (0,0), as illustratively shown in probe position display 374. Test coverage along the longitudinal extent of the object under test 258 can be controlled, such as using coverage control area 372, and groups of EC sensors to be activated or deactivated can be controlled using sensor configuration area 370. For example, as shown and described elsewhere below, machine-implemented techniques can provide an indication (e.g., suggestion or selection) of each sensor to be activated or deactivated based on various criteria. For example, such indication can include shading, texturing, or coloring of each sensor element, as illustratively shown in FIG. 3 (sensors indicated as active for the inspection operation are shaded, and sensors indicated as inactive are unshaded). For example, EC sensor 254A is unshaded, and EC sensor 254C is shaded. Generally, when an inspection operation is stored, retrieved, and then executed, the EC inspection can be performed using the indicated active sensors. Depending on the configuration of the machine-implemented tool, the automatic selection of sensors can be a suggestion to the user, and the user can override the automatically determined assignment of active and inactive sensors.

[0023] 4A and 4B generally illustrate illustrative examples of techniques that can be used to provide an indication of each activated EC sensor based on different criteria. As described above, the indication of each activated EC sensor can be automated or semi-automated. For example, as shown in FIGS. 4A and 4B, a model, such as a point cloud or other data indicating the geometry of the object under test 458 (in this example, the head of a railroad rail), can be received, such as retrieved from a data file. In FIGS. 4A and 4B, a model of the test probe assembly 450 can also be received, such as retrieved from a data file. For example, a user can select the object under test 458 and the corresponding probe assembly 450 to be used for an inspection operation. The location of the probe assembly 450 can be displayed, and the user can manipulate the probe location of the probe assembly 450. As discussed below, an indication can be provided of whether the location of the probe assembly 450 is nominal, such as by changing the color, texture, or shading of elements in a graphical user interface. For example, such visual indicators may be presented in relation to the location of one or more spacers 462A, 462B, or 462C.

[0024] Each EC sensor 454A in the ECA of the probe assembly 450 can have an associated normal vector 442A (defined as being perpendicular to a tangent defined at a location along the substrate of the probe assembly 450, e.g., extending outward from a plane defined by the corresponding EC sensor or substrate). If the normal vector 442A fails to intersect the contour of the object under test 458 within a specified distance of the probe assembly 450, the respective EC sensor 454A can be deactivated (or an indication of such deactivation can be presented as a proposed EC sensor configuration). Similarly, if each EC sensor 454C has a corresponding normal vector 442C that intersects the contour of the object under test 458, the sensor can be activated (or an indication of such activation can be presented as a proposed EC sensor configuration). In this manner, a generic probe assembly can be used for different object under test 458 geometries, with activation or deactivation of each sensor performed to provide a nominal inspection configuration, such as suppressing the acquisition of inspection data from a particular sensor that is spaced apart or elevated from the surface of the object under test 458 due to the geometry of the probe assembly 450 extending beyond the contour of the object under test 458. As an illustrative example, a sensor can be designated as activated if the distance between the sensor and the contour of the object under test is less than 3 millimeters as indicated by the corresponding normal vector (e.g., 3 millimeters may be the lift-off or detection limit of the probe assembly 450).

[0025] Other criteria can be used to provide an indication of an activated or deactivated EC sensor. For example, referring to FIG. 4B, probe assembly 450, spacers 462A, 462B, and 462C, and object under test 458 can be co-located with respect to one another, similar to FIG. 4A. In FIG. 4B, normal vectors, such as normal vector 442M corresponding to EC sensor 454M and normal vector 442N corresponding to EC sensor 454N, can be determined in a manner similar to FIG. 4A. An indication of curvature can be determined, such as by determining the distance between each EC sensor 454M or 454N and the contour of object under test 458, such as using corresponding normal vectors 442M and 442M. Illustratively, a radius of curvature or other value can be determined to be compared against a specified threshold. For example, if such a determination indicates a relatively sharp radius of curvature, one or more EC sensors located at or near such curvature can be indicated as deactivated. As shown in the illustration in Figure 4B, EC sensor 454N is shown as unshaded and therefore deactivated, even though EC sensor 454N meets the criteria for activation according to the technique of Figure 4A. This deactivated display in Figure 4B is due to EC sensor 454N being in an area of relatively sharp curvature.

[0026] FIG. 5 generally illustrates an illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user, and the illustrative example of FIG. 5 defines a probe selection context. In the example of FIG. 5, an ECA probe assembly 550 may be selected by a user, such as using a probe and object under test selection pane 578. As shown in the illustration of FIG. 5, a machine-implemented method may receive the ECA probe assembly 550 definition, which may be retrieved in response to a user selection. Other aspects of the test configuration may also be input by the user, such as selection of an object under test, a test type, or other information, such as spacer (e.g., "carbide") pin size, associated with the ECA probe assembly 550 and associated test fixture. As with other examples described herein, the probe display pane 576 may show a representation of the received model of the ECA probe assembly 550, including the probe substrate shape, the locations of spacers 562A, 562B, and 562C, and individual EC sensors, such as EC sensor 554A and corresponding normal vector 542A. A simplified probe shape identifier ("3") may also be displayed as shown illustratively in FIG.

[0027] FIG. 6A generally illustrates a further illustrative example of a presentation (e.g., a graphical user interface) that can be presented to a user, and the illustrative example of FIG. 6A defines a probe location context. Similar to other examples herein, such as shown in FIG. 5, the location of the ECA probe assembly 550 can be displayed, such as relative to a model of the object under test 658. A probe position display 674 can be presented in a pane, such as with a configuration and position control pane 673. For example, a probe can be selected at 682, and a machine-implemented method can receive and display a representation of the model of the ECA probe assembly 550. The probe position relative to the object under test 658 can be determined, such as by using translation controls at 686 or by rotating the probe representation. A quick shortcut input, such as shown at 684, can be provided to roughly position the representation of the ECA probe assembly 550, and the translation controls are used for fine adjustments. The locations of spacers 562A, 562B, and 562C can be indicated. When each one (or more) of spacers 562A, 562B, or 562C is within the designated trajectory, a representation in probe position display 674 may indicate that each one (or more) of spacers 562A, 562B, or 562C is in a nominal or otherwise designated location for testing. For example, because EC testing is sensitive to the distance between each EC sensor in ECA probe assembly 550 and object under test 658, a visual aid may assist the user in establishing the proper probe position for testing. Illustratively, the circles representing spacers 562A, 562B, and 562C may automatically change color, texture, or shape to indicate, as an illustrative example, whether each one (or more) of spacers 562A, 562B, and 562C is in the proper location for testing.

[0028] FIG. 6B generally illustrates a further illustrative example of a presentation (e.g., a graphical user interface) that can be presented to a user, where the illustrative example of FIG. 6B defines a further probe location situation showing an enlarged (e.g., “zoomed”) view. Similar to the example of FIG. 6A, the enlarged view of FIG. 6B allows for manipulation of the location or orientation (or both) of the ECA probe assembly 550 (with greater precision than the view of FIG. 6A). The example of FIG. 6B includes a probe position display 674, a configuration and position control pane 673, a representation of a model of the ECA probe assembly 550 relative to a representation of a model of the object under test 658, spacers 562A, 562B, and 562C, a shortcut input at 684, and a translation input at 686. The representation of the ECA probe assembly 550 can include respective representations of vectors normal to each EC sensor, as shown and described elsewhere herein. For example, as shown in FIG. 6B , each EC sensor 554A can have a corresponding vector that extends vertically outward, such as normal vector 542A, and each EC sensor 554N can have a corresponding vector that extends vertically outward, such as normal vector 542N. Because the ECA probe assembly 550 may be used in a different orientation in which the opposite surface of the substrate faces the object under test 658, the vectors may extend in opposite directions, as shown in FIG. 6B . As with the example of FIG. 6A and other examples herein, an indication of probe location or alignment may be provided by shading, texturing, coloring, or the like of indicia in the probe position display 674. For example, when the ECA probe assembly 550 is in the proper orientation for an inspection operation, each one (or more) of the spacers 562A, 562B, or 562C may change color. The location of the ECA probe assembly 550 can be stored to facilitate subsequent inspection operations or to display received EC inspection results correlated with the spatial location of the fault based on the stored location of the ECA probe assembly 550 relative to the object under test 658, etc.

[0029] FIG. 6C generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that can be presented to a user, and the illustrative example of FIG. 6C defines an inspection zone context. A user can select and manipulate representations of the ECA probe assembly 550 as shown and described elsewhere, such as discussed above in connection with FIGS. 6A and 6B. In the inspection zone context, the established location of the ECA probe assembly 550, along with a normal vector or other criteria, can be used to provide an indication of each EC sensor that is activated or deactivated for an inspection operation. For example, a group of EC sensors can be assigned an identifier in the sensor group pane 680, and an inspection zone pane 688 can be provided to display an inspection zone 690 (e.g., an area of surface coverage for an EC inspection operation). For example, a visual indicator can be provided for each activated or deactivated EC sensor in the ECA probe assembly 550 based on the normal vector and the distance between each sensor and the contour of the object under test 658. For example, in the illustration of FIG. 6C , EC sensor 554A is shown as deactivated (and farther away from object under test 658 than the other sensors). In contrast, sensor 554N is shown as active. The user can accept the automatically provided suggested probe activation configuration, or in one example, the user can override the automatic indication and manually activate or deactivate the EC sensors. Once the sensor configuration and corresponding inspection zones are established, the probe location and the EC sensors selected to activate can be stored, for example, to facilitate subsequent inspection operations. Alternatively (or additionally), a user interface similar to the example of FIG. 6C or other examples herein can be provided to facilitate inspection in an “online” manner.

[0030] FIG. 6D generally illustrates a further illustrative example of a presentation (e.g., a graphical user interface) that may be presented to a user, the illustrative example of FIG. 6D defining an overall EC inspection configuration, such as facilitating respective inspection operations using different EC probe assemblies. The sequence of selecting a probe, establishing a probe location relative to the object under test, and selecting activated sensors may be performed for a variety of different ECA probe assembly configurations. Generally, an EC inspection protocol may include multiple scans corresponding to different sensor configurations and positions to achieve desired inspection coverage. For example, as illustratively shown in FIG. 6D , an overall inspection configuration may be established or selected by a user in a selection pane 692, and the corresponding selected probe assembly, probe assembly location, active EC sensors, or other attributes may be graphically depicted in relation to the object under test 658, as shown in a probe configuration view 694. For example, for a selected test configuration, models and corresponding visual representations of eight different probe assemblies 650A, 650B, 650C, 650D, 650E, 650F, 650G, and 650H may be displayed relative to the object under test 658. Probe attributes, such as the selected EC sensor to be activated or deactivated, may be displayed similarly to other examples herein, and a simplified probe number may be displayed to assist in identifying each probe (e.g., "8" in association with the first probe assembly 650A). The configurations shown in the configuration view 694 may correspond to test operations performed simultaneously by different probes attached to each fixture, facilitating the inspection of all display areas along the object under test 658 in just a single pass. The configuration selected in the selection pane 692 may be stored for retrieval by automated or semi-automated test equipment for use in controlling test operations. For example, a user may provide input selecting a desired test configuration, and a test operation may be triggered using the corresponding test configuration.

[0031] FIG. 7 generally illustrates further illustrative examples of presentations (e.g., graphical user interfaces) that may be presented to a user, and the illustrative example of FIG. 7 defines an inspection result reporting context. Stored inspection configuration data, as established or modified using other examples herein, can also be used to facilitate visualization or reporting of inspection results. For example, because the location of the ECA probe assembly is established as part of the inspection configuration, the ECA probe assembly and corresponding sensor locations are known relative to the contours of the object under test 658. Thus, recorded inspection results corresponding to individual sensors, groups of sensors, or probe assemblies can be correlated with such location information to overlay representations of flaws, defects, or other features onto a visual representation of the object under test 658. For example, in a first view 796A (e.g., an end view) of the object under test, a first location 760A can be highlighted (e.g., using color, texture, or shading that provides an indication of the flaw or defect location). In another view 796B, such as an elevation or side view of the object under test 658, the corresponding indication at the second location 760B may be highlighted. In this manner, potential flaw or defect locations may be localized along the actual object under test 658, such as during or after an inspection operation. The visualization in FIG. 7 is not limited to eddy current inspection data. For example, acoustic inspection results may also be superimposed, such as showing the flaw or defect highlighted at 761A in the first view 796A and at 761B in the second view 796B. Inspection results (e.g., suspected flaw or defect locations) may also be presented in a tabular format, as generally illustrated in the bottom pane of FIG. 7.

[0032] FIG. 8 generally illustrates a technique 800, such as a machine-implemented method, that may include indicating each of the eddy current sensors that support and operate an inspection operation, such as using a received model. At 805, a model defining the contours of an object under test may be received. As described above, such a model may include a data structure including a point cloud representation or other representation. At 810, a model of an eddy current array probe may be received, such as including a data structure including a point cloud representation or other representation. The models described above may be selected or established by a user, such as being stored, and the machine-implemented method may receive such models by retrieving them from storage in response to a user selection. At 815, an indication of the location of the ECA probe (e.g., the location of a model representing the ECA probe) relative to the object under test (e.g., a model of the object under test, or at least a portion thereof) may be received. Receiving such an indication may include retrieving stored data indicating the location, such as using a graphical user interface, or receiving user input to orient or position a representation of the ECA probe relative to the object under test, as shown and described in connection with other examples herein. At 825, each of the eddy current sensors in the plurality of eddy current sensors of the ECA probe can be indicated as active (e.g., indicated as activated during the corresponding inspection operation). Such indication can be implemented using a received model defining the contours of the object under test, a received model of the ECA probe, and a received indication of the location of the ECA probe. For example, such indication can be the result of one or more criteria, such as using normal vectors, and the respective EC sensor distances from the object under test, as described elsewhere herein. Optionally, as shown at 830, a presentation can be generated for the user indicating the location of the ECA probe, including the location of at least one spacer, including whether the at least one spacer is within a specified trajectory. Such an approach can assist the user in guiding the probe location to the nominal probe location.The stored location of the ECA probe relative to the object under test can also be used to generate a presentation of the inspection results, such as overlaying flaw or defect locations onto a representation of the object under test.

[0033] 9 illustrates an example block diagram comprising a machine 900 upon which any one or more of the techniques (e.g., methodologies) discussed herein may be implemented. The machine 900 (e.g., a computer system) may include a hardware processor 902 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 904, and a static memory 906, which are connected via an interlink 930 (e.g., a link or bus), and some or all of these components may constitute hardware for the systems and related implementations discussed above.

[0034] Specific examples of main memory 904 include semiconductor memory devices, which may include storage locations in a semiconductor, such as random access memory (RAM) and registers. Specific examples of static memory 906 include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic disks, such as internal hard disks and removable disks, magneto-optical disks, RAM, or optical media, such as CD-ROM and DVD-ROM disks.

[0035] The machine 900 may further include a display device 910, an input device 912 (e.g., a keyboard), and a user interface (UI) navigation device 914 (e.g., a mouse). In one example, the display device 910, the input device 912, and the UI navigation device 914 may be touchscreen displays. The machine 900 may further include a mass storage device (e.g., a drive unit) 908, a signal generating device 918 (e.g., a speaker), a network interface device 920, and one or more sensors 916, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensor. The machine 900 may include an output controller 928, such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection, for communicating with or controlling one or more peripheral devices (e.g., a printer, a card reader, etc.).

[0036] The mass storage device 908 may comprise a machine-readable medium 922 having stored thereon one or more sets of data structures or instructions 924 (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein. The instructions 924 may also reside, completely or at least partially, within the main memory 904, within the static memory 906, or within the hardware processor 902 during execution thereof by the machine 900. In one example, one or any combination of the hardware processor 902, the main memory 904, the static memory 906, or the mass storage device 908 comprises a machine-readable medium.

[0037] Specific examples of machine-readable media include one or more of: non-volatile memory, such as semiconductor memory devices (e.g., EPROM or EEPROM) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; RAM; or optical media, such as CD-ROM and DVD-ROM disks. Although the machine-readable medium is illustrated as a single medium, the term "machine-readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database, or associated caches and servers) configured to store one or more instructions 924.

[0038] The device of machine 900 includes one or more of a hardware processor 902 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 904 and static memory 906, a sensor 916, a network interface device 920, an antenna, a display device 910, an input device 912, a UI navigation device 914, a mass storage device 908, an instruction device 924, a signal generation device 918, or an output controller 928. The device may be configured to perform one or more of the methods or operations disclosed herein.

[0039] The term "machine-readable medium" includes any medium capable of storing, encoding, or carrying instructions for execution by machine 900, causing machine 900 to perform any one or more of the techniques of this disclosure, or causing another device or system to perform any one or more of the techniques, or capable of storing, encoding, or carrying data structures used by or associated with such instructions. Non-limiting examples of machine-readable media include solid-state memory, and optical or magnetic media. Specific examples of machine-readable media include non-volatile memory such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic disks such as internal hard disks and removable disks, magneto-optical disks, random access memory (RAM), or optical media such as CD-ROM and DVD-ROM disks. In some embodiments, machine-readable media include non-transitory machine-readable media. In some embodiments, machine-readable media include machine-readable media that are not transitory, propagating signals.

[0040] The instructions 924 may be transmitted or received over a communications network 926 using a transmission medium via the network interface device 920, for example, utilizing any one of several transport protocols (e.g., frame relay, Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Hypertext Transfer Protocol (HTTP), etc.). Exemplary communication networks include, among others, local area networks (LANs), wide area networks (WANs), packet data networks (e.g., the Internet), mobile telephone networks (e.g., cellular networks), plain old telephone service (POTS) networks, and wireless data networks (e.g., the Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi®), the IEEE 802.15.4 family of standards, the Long Term Evolution (LTE) 4G or 5G family of standards, the Universal Mobile Telecommunications System (UMTS) family of standards, peer-to-peer (P2P) networks, and satellite networks.

[0041] In one example, network interface device 920 includes one or more physical jacks (e.g., Ethernet, coaxial, or interconnect) or one or more antennas for accessing communications network 926. In one example, network interface device 920 includes one or more antennas that communicate wirelessly using at least one of single-input multiple-output (SIMO), multiple-input multiple-output (MIMO), or multiple-input single-output (MISO) technologies. In some embodiments, network interface device 920 communicates wirelessly using multi-user MIMO technologies. The term “transmission medium” should be understood to include any intangible medium capable of storing, encoding, or carrying instructions for execution by machine 900, including digital or analog communications signals or other intangible media for facilitating the communication of such software.

[0042] Various notes Each of the above non-limiting aspects may stand alone or may be combined in various permutations or combinations with one or more of the other aspects or other subject matter described herein.

[0043] The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are also generally referred to as "examples." Such examples may include elements in addition to those shown or described. However, the inventors also contemplate examples in which only the elements shown or described are provided. Furthermore, the inventors also contemplate examples that use any combination or permutation of those elements (or one or more aspects thereof) shown or described with respect to a particular example (or one or more aspects thereof), or with respect to any other example (or one or more aspects thereof) shown or described herein.

[0044] In the event of a conflict of usage between this document and any document so incorporated by reference, the usage in this document shall control.

[0045] As used herein, the terms "a" or "an" are used, as is common in patent documents, to include one or more, regardless of any other instance or usage of "at least one" or "one or more." As used herein, the term "or" is used to refer to a non-exclusive or, unless otherwise indicated, such that "A or B" includes "A but not B," "B but not A," and "A and B." As used herein, the terms "including" and "in which" are used as the plain-English equivalents of the terms "comprising" and "wherein," respectively. Also, in the following claims, the terms "including" and "comprising" are open-ended, i.e., systems, devices, articles, compositions, formulations, or processes that include elements in addition to the elements recited after such terms in a claim are still deemed to be within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third," etc., are used merely as labels and are not intended to impose numerical requirements on their objects.

[0046] Method embodiments described herein may be implemented at least in part by a machine or computer. Some examples include computer-readable or machine-readable media encoded with instructions operable to configure an electronic device to perform the methods described in the examples. Implementations of such methods may include code, such as microcode, assembly language code, higher-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Such instructions may be readable and executed by one or more processors to enable performance of operations including methods. The instructions may be in any suitable form, such as, but not limited to, source code, compiled code, interpreted code, executable code, static code, dynamic code, etc. Furthermore, in one example, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), and the like.

[0047] The above description is intended to be illustrative, not limiting. For example, the examples described above (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, for example, by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be construed as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in fewer than all features of a particular disclosed embodiment. Accordingly, the following claims are incorporated into the Detailed Description as an example or embodiment, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full range of equivalents to which such claims are entitled. [Explanation of symbols]

[0048] 100 Non-destructive Inspection System 102 Processor Circuit 104 Memory Circuit 110 Display 112 Input Devices 120 Wireless Communication Interface 122 Front-end circuit 130 Multi-Conductor Interconnect 132 laptops 140 Test equipment 150 Modular Probe Assembly 152 Eddy Current (EC) Transducer Array 154 EC sensor 158 Target 160 wounds 250 Eddy Current Array (ECA) Probe Assembly 254 EC sensor 258 Test Object 262 Spacer 264 Flexible substrate 266 Rigid part 268 Inspection Fixture 268 Fixtures 370 Sensor Configuration Area 372 Coverage Control Area 374 Probe Position Display 442 Normal Vector 450 Test Probe Assembly 454 EC sensor 458 Test Object 462 Spacer 542 Normal Vector 550 ECA Probe Assembly 554 EC sensor 562 Spacer 576 Probe Display Pane 578 Test Object Selection Pane 650 First Probe Assembly 658 Test object 673 Position Control Pane 674 Probe Position Display 680 Sensor Group Pane 688 Inspection Zone Pane 690 Inspection Zone 692 Selection Pane 694 Probe Configuration View 796 views 900 machines 902 Hardware Processor 904 main memory 906 Static Memory 908 Mass Storage Devices 910 Display Device 912 Input Devices 914 User Interface (UI) Navigation Devices 916 Sensors 918 Signal Generating Device 920 Network Interface Device 922 Machine-readable medium 924 command 926 Communication Network 928 Output Controller 930 Interlink

Claims

1. 1. A machine-implemented method for supporting eddy current (EC) inspection, the machine-implemented method comprising: receiving a model defining a contour of an object under test; receiving a model of an eddy current array (ECA) probe, the model defining spatial locations of a plurality of eddy current sensors; receiving an indication of a location of the ECA probe relative to a location of the object under test; and correspondingly indicating each eddy current sensor to activate among the plurality of eddy current sensors using the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

2. The machine-implemented method of claim 1 , further comprising generating a presentation for a user that identifies the indicated each of the eddy current sensors to be activated.

3. 2. The machine implementation method of claim 1, wherein the received model defining the ECA probe defines a plurality of spacers, the plurality of spacers establishing a specified standoff distance between the plurality of eddy current sensors and the object under test when each of the plurality of spacers is in contact with the object under test.

4. the location of the ECA probe including the location of at least one of the spacers among the plurality of spacers; 4. The machine-implemented method of claim 3, comprising generating a presentation for a user indicating whether the at least one of the spacers in the plurality of spacers is within a specified trajectory.

5. 2. The machine-implemented method of claim 1, wherein indicating each of the plurality of eddy current sensors to activate includes determining an orientation of each of the eddy current sensors relative to the contour of the object under test according to the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

6. 2. The machine-implemented method of claim 1, wherein indicating each of the eddy current sensors to be activated among the plurality of eddy current sensors includes indicating each of the other eddy current sensors to be deactivated, each of the other eddy current sensors having a respective normal vector that cannot intersect with the contour of the object under test according to the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

7. 2. The machine-implemented method of claim 1, wherein indicating each of the plurality of eddy current sensors to activate includes indicating each of the other eddy current sensors to deactivate, each of the other eddy current sensors having a respective normal vector associated with a trajectory along the contour of the object under test that has a curvature exceeding a specified threshold in accordance with the received model defining the contour of the object under test, the received model of the ECA probe, and the received indication of the location of the ECA probe.

8. The machine-implemented method of claim 1 , further comprising triggering an inspection operation with an ECA probe array using the indicated each of the eddy current sensors in the plurality of eddy current sensors.

9. 2. The machine-implemented method of claim 1, further comprising generating a presentation of results of inspection operations performed using the indicated each of the plurality of eddy current sensors, the presentation comprising graphically overlaying an indication of inspection results on a representation of the model defining the contour of the object under test.

10. The machine mounting method according to any one of claims 1 to 9, wherein the object under test is a railway rail.

11. 1. A system for supporting eddy current (EC) inspection, the system comprising: a processor circuit; a display communicatively coupled to the processor circuit; a user input communicatively coupled to the processor circuit; and a memory circuit containing instructions that, when executed by the processor circuit, cause the processor circuit to perform the machine-implemented method of any one of claims 1 to 9.

12. The system of claim 11 , wherein the object under test is a railway rail.

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