Wiring Module

The wiring module enhances connection reliability by embedding the core wire in a first solder and separating it from a second solder, addressing complexity and cost issues in battery pack wiring.

JP7730457B2Active Publication Date: 2025-08-28AUTONETWORKS TECH LTD +2
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Patent Information

Application Number
JP2021146623
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-09-09
Publication Date
2025-08-28
Estimated Expiration
2041-09-09

AI Technical Summary

Technical Problem

The complexity and cost of wiring modules in battery packs for electric vehicles are increased due to numerous components, and direct connection of wires to lands during soldering risks lifting off, compromising connection strength.

Method used

A wiring module design that includes an electric wire with a core wire connected via a wire relay member to a circuit board through different composition solders, ensuring the core wire is embedded in the first solder and separated from a second solder, enhancing connection reliability.

Benefits of technology

Improves connection reliability by increasing design freedom and ensuring robust solder connections without composition mixing, thus reducing manufacturing complexity and costs.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a wiring module that can increase the connection reliability of an electric wire.SOLUTION: A wiring module 20 attached to a plurality of power storage elements 10 each having electrode terminals 11A, 11B comprises: an electric wire 30 that includes a core wire 31; an electric wire relay member 80 that is connected with the core wire 31 by first solder S1; a bus bar 40 that is connected with the electrode terminals 11A, 11B; and a circuit board 50 that includes a conducting path 52 including a first rand 53 connected with the bus bar 40 and a second rand 54 connected with the electric wire relay member 80 by second solder S2.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a wiring module. [Background technology]

[0002] A battery pack used in an electric vehicle, a hybrid vehicle, or the like includes a plurality of unit cells, a plurality of bus bars connecting the electrodes of the unit cells, and a detection module (wiring module) electrically connected to the bus bars for detecting the voltage of each unit cell, etc. Such a wiring module includes, for example, a fuse unit that integrates bus bar connection terminals connected to the bus bars, electric wire connection terminals connected to the ends of electric wires, and fuses that connect the bus bar connection terminals and the electric wire connection terminals (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-115616 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above configuration, the fuse unit includes many components, such as busbar connection terminals, wire connection terminals, and a synthetic resin housing that houses the fuse, which increases the complexity of the configuration and raises concerns about increased manufacturing costs. To simplify the configuration of the wiring module and reduce costs, it is conceivable to prepare a circuit board that has conductive paths including lands for busbars and lands for wires and is mounted with necessary electronic components, and then connect the busbars and wires to the respective lands. However, if the wires are directly connected to the lands, there is a risk that the wires may lift off the lands during soldering, making it difficult to ensure connection strength. [Means for solving the problem]

[0005] The wiring module disclosed in this specification is a wiring module attached to a plurality of energy storage elements having electrode terminals, and includes: an electric wire having a core wire; an electric wire relay member connected to the core wire by a first solder; a bus bar connected to the electrode terminal; and a circuit board having a conductive path including a first land electrically connected to the bus bar; and a second land connected to the electric wire relay member by a second solder. [Effects of the Invention]

[0006] According to the wiring module disclosed in this specification, the connection reliability of the electric wires can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a partially enlarged plan view of the electricity storage module of the first embodiment. [Figure 2] FIG. 2 is a partially enlarged plan view showing the periphery of a circuit board in the line module of the first embodiment. [Figure 3] FIG. 3 is a partially enlarged perspective view showing the periphery of a circuit board in the line module of the first embodiment. [Figure 4] FIG. 4 is an enlarged exploded perspective view showing the board mounting portion, the circuit board, the bus bar relay member, and the electric wire relay member of the first embodiment. [Figure 5] FIG. 5 is a cross-sectional view taken along line AA in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line BB in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line CC in FIG. [Figure 8] FIG. 8 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of the second embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line DD in FIG. [Figure 10] FIG. 10 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of the third embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line EE in FIG. [Figure 12] FIG. 12 is a partially enlarged perspective view showing the periphery of a wire relay member in the wiring module of the fourth embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along the line FF in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] [Outline of the embodiment] (1) The wiring module disclosed in this specification is a wiring module attached to a plurality of energy storage elements having electrode terminals, and includes: an electric wire having a core wire; an electric wire relay member connected to the core wire by a first solder; a bus bar connected to the electrode terminal; and a circuit board having a conductive path including a first land electrically connected to the bus bar; and a second land connected to the electric wire relay member by a second solder.

[0009] According to the above configuration, by connecting the core wire to the land via the wire relay member, the degree of freedom in design for increasing the connection strength is increased compared to when the core wire is directly connected to the land, and the connection reliability of the wire can be improved.

[0010] (2) In the wiring module described in (1) above, the wire relay member may include a core wire connection portion on which the core wire is placed and a partition wall erected from the core wire connection portion, the first solder may be disposed in a space partitioned by the core wire connection portion and the partition wall, and the core wire may be embedded in the first solder.

[0011] With this configuration, the first solder is arranged with a certain thickness within the space partitioned by the core wire connection portion and the partition wall, and the core wire is embedded in this first solder, thereby ensuring connection strength.

[0012] (3) In the wiring module described in (1) or (2) above, the first solder and the second solder may have different compositions and may be disposed in a non-contact state.

[0013] With this configuration, it is possible to avoid adverse effects on electrical connection caused by the first solder and the second solder having different compositions being mixed together.

[0014] [Details of the embodiment] Specific examples of the technology disclosed in this specification will be described below with reference to the drawings. Note that the present invention is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0015] <Embodiment 1> A first embodiment will be described with reference to Fig. 1 to Fig. 7. The energy storage module 1 of this embodiment is a power supply device used as a drive source for electric vehicles and hybrid vehicles, and includes a plurality of energy storage elements 10 and a wiring module 20 connected to the energy storage elements 10, as shown in Fig. 1.

[0016] [Electricity storage element 10] The energy storage elements 10 are, for example, secondary batteries. As shown in FIG. 1, each energy storage element 10 has a flat rectangular parallelepiped shape overall and includes two electrode terminals 11A, 11B arranged on one surface. One of the two electrode terminals 11A, 11B is a positive terminal 11A, and the other is a negative terminal 11B. The multiple energy storage elements 10 are arranged in a row. Two adjacent energy storage elements 10 are arranged so that the electrode terminals 11A, 11B of opposite polarities are adjacent to each other, that is, so that the positive terminal 11A of one energy storage element 10 and the negative terminal 11B of the adjacent energy storage element 10 are adjacent to each other.

[0017] [Wiring module 20] As shown in FIG. 1, the wiring module 20 includes a plurality of electric wires 30, a plurality of bus bars 40, a plurality of circuit boards 50, a plurality of rivets 60 that fix the circuit boards 50 to the bus bars 40, a plurality of bus bar relay members 70 that electrically connect the bus bars 40 to the circuit boards 50, a plurality of electric wire relay members 80 that electrically connect the circuit boards 50 to the electric wires 30, and a holding member 90 that holds these members.

[0018] [Wire 30] As shown in FIGS. 2 and 3 , the electric wire 30 includes a core wire 31 and an insulating coating 32 made of synthetic resin and surrounding the outer periphery of the core wire 31. The core wire 31 is, for example, a single-core wire made of metal and is electrically conductive. Examples of materials for the core wire 31 include copper, copper alloy, aluminum, and aluminum alloy. At one end of the electric wire 30, the insulating coating 32 is stripped to expose the core wire 31. The other end of the electric wire 30 is connected to an external ECU (Electronic Control Unit) via, for example, a connector. The ECU is equipped with a microcomputer, elements, and the like, and has a well-known configuration having functions for detecting the voltage, current, temperature, etc. of each energy storage element 10 and controlling the charging and discharging of each energy storage element 10.

[0019] [Busbar 40] The bus bar 40 is made of a metal and is electrically conductive. Examples of materials for the bus bar 40 include copper, a copper alloy, aluminum, an aluminum alloy, and stainless steel (SUS). As shown in Figs. 1 and 4, the bus bar 40 includes a bus bar main body 41 that connects the positive terminal 11A of one energy storage element 10 to the negative terminal 11B of another energy storage element 10 adjacent to this energy storage element 10, and a board mounting portion 42 that is continuous with the bus bar main body 41 and to which a circuit board 50 is fixed.

[0020] 1, the busbar body 41 includes a plate-shaped first electrode connection portion 41A that is placed on one of the electrode terminals 11A, 11B, a plate-shaped second electrode connection portion 41B that is placed on the other electrode terminal, and a connecting portion 41C that connects the first electrode connection portion 41A and the second electrode connection portion 41B. The first electrode connection portion 41A and the second electrode connection portion 41B are connected to the electrode terminals 11A, 11B, respectively, by, for example, laser welding.

[0021] As shown in FIG. 4 , the board placement portion 42 includes a board support portion 43 that is connected to the first electrode connection portion 41A and supports the circuit board 50, a wire holding portion 45 that is connected to the board support portion 43 and holds the wire 30, and a positioning protrusion 46 that extends from the board support portion 43 and positions the circuit board 50. The board placement portion 42 is plate-shaped and has a first fixing hole 44. The first fixing hole 44 is a through-hole for inserting a rivet 60. The wire holding portion 45 is U-shaped overall and is capable of receiving the wire 30 inside the U. The positioning protrusion 46 is a plate piece that extends perpendicular to the board support portion 43.

[0022] [Circuit board 50] As shown in FIGS. 2, 3, and 4, the circuit board 50 includes an insulating plate 51 and a conductive path 52 disposed on one surface of the insulating plate 51. The insulating plate 51 is a hard plate made of, for example, a glass cloth-based epoxy resin and has insulating properties. The conductive path 52 is made of, for example, a conductive metal such as copper or a copper alloy and is formed by printed wiring technology. A portion of the conductive path 52 serves as a first land 53 connected to the bus bar 40 via a bus bar relay member 70 (described later), and another portion serves as a second land 54 connected to the electric wire 30. A chip fuse 55 is connected to the conductive path 52 between the first land 53 and the second land 54. The conductive path 52 has two third lands 56 between the first land 53 and the second land 54, and two terminals of the chip fuse 55 are connected to these two third lands 56, respectively, by soldering. Most of the conductive path 52, except for the first land 53, the second land 54, and the two third lands 56, is covered with an insulating film made of synthetic resin.

[0023] The insulating plate 51 has a second fixing hole 57 and a positioning recess 58. The second fixing hole 57 is a through hole for inserting a rivet 60. The positioning recess 58 is a recess recessed from the outer edge of the insulating plate 51 and is capable of receiving the positioning protrusion 46 therein. The circuit board 50 is positioned relative to the board support part 43 by accommodating the positioning protrusion 46 inside the positioning recess 58.

[0024] [Rivet 60] 5 , the rivet 60 is made of metal and includes a shank 61 that is inserted into the first fixing hole 44 and the second fixing hole 57, and two heads 62A, 62B that are formed on both ends of the shank 61 and have outer diameters larger than the diameters of the first fixing hole 44 and the second fixing hole 57. The circuit board 50 is arranged so as to overlap the board support part 43, the shank 61 is inserted into the first fixing hole 44 and the second fixing hole 57, and the two heads 62A, 62B are arranged to sandwich the peripheral portion of the first fixing hole 44 in the board support part 43 and the peripheral portion of the second fixing hole 57 in the circuit board 50. In this way, the circuit board 50 is fixed to the board support part 43.

[0025] [Busbar relay member 70] 2, 3, and 4, the busbar relay member 70 is a conductive metal plate, and has one end serving as a busbar connection portion 71 and the other end serving as a land connection portion 72. The busbar connection portion 71 is connected to the busbar 40 by, for example, welding. The land connection portion 72 is connected to the first land 53 by soldering.

[0026] [Electric wire relay member 80] The wire relay member 80 is made of a conductive metal, and as shown in Fig. 4, includes a rectangular, plate-shaped core wire connecting portion 81, two compartment walls 82 erected from two parallel side edges of the core wire connecting portion 81, and a top wall 83 arranged opposite the core wire connecting portion 81 and connecting the two compartment walls 82. The two compartment walls 82 are arranged opposite each other. In each compartment wall 82, the half adjacent to one end of the core wire connecting portion 81 is a high wall portion 82A, and the other half is a low wall portion 82B that is shorter than the high wall portion 82A. The top wall 83 bridges the gap between the two high wall portions 82A.

[0027] As shown in FIGS. 6 and 7 , the core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is placed on the core wire connecting portion 81, and this core wire 31 is connected to the core wire connecting portion 81 by soldering. In the following description, the solder connecting the core wire 31 to the core wire connecting portion 81 is referred to as a first solder S1. The first solder S1 is disposed in a space surrounded by the core wire connecting portion 81 and two partition walls 82 in the electric wire relay member 80, and the core wire 31 is embedded in the first solder S1. The first solder S1 is disposed between the two partition walls 82 with a certain thickness, and the core wire 31 is embedded in the first solder S1. In particular, the electric wire relay member 80 has a cylindrical portion surrounded by the core wire connecting portion 81, two high wall portions 82A, and a top wall 83, and the inside of this cylindrical portion is filled with the first solder S1. This ensures that the core wire 31 is embedded in the first solder S1, and the entire periphery of the core wire 31 is covered with the first solder S1.

[0028] The wire relay member 80 is disposed on the second land 54 with the core wire connecting portion 81 overlapping the second land 54 and connected to the second land 54 by soldering. The solder used to connect the wire relay member 80 to the second land 54 by the core wire connecting portion 81 is a second solder S2 having a different composition from the first solder S1. The core wire 31 is connected to the wire relay member 80 by the first solder S1, and the wire relay member 80 is connected to the second land 54 by the second solder S2, thereby connecting the wire 30 to the conductive path 52 via the wire relay member 80. Because the first solder S1 and the second solder S2 have different compositions, it is preferable that they do not mix with each other, i.e., are in a non-contact state. This is to avoid a decrease in connection reliability. The partition wall 82 also serves to shield the first solder S1 from mixing with the second solder S2.

[0029] [Holding member 90] The holding member 90 is made of synthetic resin, and as shown in FIG. 1, includes busbar holding portions 91 that hold the plurality of busbars 40, respectively, and an electric wire routing portion 92 in which the electric wires 30 are routed.

[0030] [Method of manufacturing the energy storage module 1] Next, an example of a method for manufacturing the electricity storage module 1 having the above configuration will be described.

[0031] First, the circuit board 50 is manufactured using printed wiring technology. Next, the second solder S2 is applied onto the first land 53, the second land 54, and the third land 56 of the circuit board 50, and the land connection portion 72 of the bus bar relay member 70, the electric wire relay member 80, and the chip fuse 55 are connected to the first land 53, the second land 54, and the third land 56, respectively, by reflow soldering.

[0032] Next, the circuit board 50, to which the wire relay members 80, busbar relay members 70, and chip fuses 55 are connected, is placed on the board support member 43. At this time, the positioning protrusions 46 are received inside the positioning recesses 58, thereby positioning the circuit board 50. In this state, the circuit board 50 is fixed to the board mounting member 42 by the rivet 60. Before being fixed, the rivet 60 does not have a head 62B. After the shank 61 is inserted through the first fixing hole 44 and the second fixing hole 57, the tip of the shank 61 is crushed to form the head 62B. Next, the busbar connecting portion 71 is connected to the busbar 40 by welding. This electrically connects the busbar 40 and the first land 53 via the busbar relay member 70.

[0033] Next, the multiple bus bars 40 to which the circuit boards 50 are fixed are respectively set in the bus bar holding portions 91 of the holding member 90. Next, the electric wires 30 are routed in the electric wire routing portion 92 of the holding member 90, and the core wires 31 exposed at the terminal portions of the electric wires 30 are placed on the core wire connection portions 81. The portion of the electric wires 30 that is covered with the insulating coating 32 and adjacent to the exposed portion of the core wire 31 is inserted into and held inside the electric wire holding portion 45. In this state, the core wires 31 are connected to the wire relay member 80 with the first solder S1 using, for example, a robotic soldering device. In this manner, the manufacture of the wiring module 20 is completed.

[0034] Finally, the wiring module 20 is arranged on the plurality of energy storage elements 10, and each bus bar 40 and the electrode terminals 11A, 11B are connected by laser welding. In this way, the manufacture of the energy storage module 1 is completed.

[0035] [Action and effect] As described above, according to this embodiment, the wiring module 20 attached to a plurality of energy storage elements 10 having electrode terminals 11A, 11B includes an electric wire 30 having a core wire 31, an electric wire relay member 80 connected to the core wire 31 by a first solder S1, a bus bar 40 connected to the electrode terminals 11A, 11B, and a circuit board 50 having a conductive path 52 including a first land 53 electrically connected to the bus bar 40 and a second land 54 connected to the electric wire relay member 80 by a second solder S2.

[0036] According to the above configuration, by connecting the core wire 31 to the second land 54 via the wire relay member 80, the degree of freedom in design for increasing the connection strength is increased compared to when the wire is directly connected to the land, and the connection reliability of the wire 30 can be improved.

[0037] In addition, the wire relay member 80 has a core wire connection portion 81 on which the core wire 31 is placed and a partition wall 82 erected from the core wire connection portion 81, and the first solder S1 is arranged in the space partitioned by the core wire connection portion 81 and the partition wall 82, and the core wire 31 is embedded in the first solder S1.

[0038] According to this configuration, the first solder S1 is arranged with a certain thickness within the space partitioned by the core wire connection portion 81 and the partition wall 82, and the core wire 31 is embedded in this first solder S1, thereby ensuring connection strength.

[0039] Moreover, the first solder S1 and the second solder S2 have different compositions and are disposed in a non-contact state.

[0040] With this configuration, it is possible to avoid adverse effects on electrical connection caused by the first solder S1 and the second solder S2 having different compositions being mixed together.

[0041] <Embodiment 2> Next, a second embodiment will be described with reference to Figures 8 and 9. This embodiment differs from the first embodiment in the configuration of the wire relay board 100. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0042] The wire relay member 100 is made of a conductive metal and includes a rectangular plate-shaped core wire connection portion 101 that is overlaid on the second land 54, a partition wall 102 that stands upright from one side edge of the core wire connection portion 101, and a top wall 103 that extends from the extending end of the partition wall 102 and is arranged opposite the core wire connection portion 101.

[0043] The core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is placed on the core wire connecting portion 101, and the core wire 31 is connected to the electric wire relay member 100 by the first solder S1. The protruding length of the top wall 103 is Core wire connection part 101 103, and soldering can be easily performed by inserting a soldering iron through the gap between the core wire connecting portion 101 and the top wall 103. The first solder S1 is disposed in the space surrounded by the core wire connecting portion 101, the partition wall 102, and the top wall 103 in the wire relay member 100. As a result, the first solder S1 is disposed with a certain thickness, and the core wire 31 is embedded in the first solder S1, ensuring connection strength.

[0044] As in the above embodiment, the wire relay member 100 is disposed on the second land 54 so that the core wire connecting portion 101 overlaps the second land 54, and is connected to the second land 54 by the second solder S2. Because the first solder S1 and the second solder S2 have different compositions, they preferably do not mix with each other and are in a non-contact state. The partition wall 102 also serves to shield the first solder S1 from mixing with the second solder S2 at one side edge of the core wire connecting portion 101 (the left side edge in FIG. 9 ). Furthermore, because the partition wall 102 is not disposed at the other side edge of the core wire connecting portion 101, it is conceivable that the first solder S1 will spill onto the second land 54 from the other side edge of the core wire connecting portion 101, as shown in FIG. 9 . Therefore, in order to prevent the first solder S1 and the second solder S2 from mixing, it is preferable that the area on the second land 54 adjacent to the other side edge of the core wire connection portion 101 (the side edge on which the partition wall 102 is not arranged) is an area on which the second solder S2 is not arranged.

[0045] <Embodiment 3> Next, a third embodiment will be described with reference to Figures 10 and 11. This embodiment differs from the first embodiment in the configuration of the wire relay member 110. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0046] The wire relay member 110 is made of a conductive metal and includes a rectangular plate-shaped core wire connection portion 111 that is overlaid on the second land 54, a partition wall 112 that stands upright from one side edge of the core wire connection portion 111, and a top wall 113 that extends from the extending end of the partition wall 112 and is arranged opposite the core wire connection portion 111.

[0047] The core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is placed on the core wire connection part 111, and this core wire 31 is connected to the electric wire relay member 110 by a first solder S1. The first solder S1 is arranged in the space surrounded by the core wire connection part 111, the partition wall 112, and the top wall 113 in the electric wire relay member 110. As a result, the first solder S1 is arranged with a certain thickness, and the core wire 31 is embedded in the first solder S1. The protruding length of the top wall 113 is Core wire connection part 111, and a larger amount of the first solder S1 is disposed in the space surrounded by the core wire connecting portion 111, the partition wall 112, and the top wall 113. This ensures that the core wire 31 is embedded in the first solder S1 reliably, and the connection strength is ensured.

[0048] The top wall 113 has a soldering iron insertion hole 114. The soldering iron insertion hole 114 is a through-hole for inserting a soldering iron Is. By inserting the soldering iron Is through the soldering iron insertion hole 114, soldering can be easily performed.

[0049] As in the above embodiment, the wire relay member 110 is disposed on the second land 54 so that the core wire connecting portion 111 overlaps the second land 54, and is connected to the second land 54 by the second solder S2. Because the first solder S1 and the second solder S2 have different compositions, they preferably do not mix with each other and are in a non-contact state. The partition wall 112 also serves to shield the first solder S1 from mixing with the second solder S2 at one side edge of the core wire connecting portion 111 (the left side edge in FIG. 9 ). Furthermore, because the partition wall 112 is not disposed at the other side edge of the core wire connecting portion 111, it is conceivable that the first solder S1 will spill onto the second land 54 from the other side edge of the core wire connecting portion 111, as shown in FIG. 11 . Therefore, in order to prevent the first solder S1 and the second solder S2 from mixing, it is preferable that the area on the second land 54 adjacent to the other side edge of the core wire connection portion 111 (the side edge on which the partition wall 112 is not arranged) is an area on which the second solder S2 is not arranged.

[0050] <Embodiment 4> Next, a fourth embodiment will be described with reference to Figures 12 and 13. This embodiment differs from the first embodiment in the configuration of the wire relay member 120. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0051] The wire relay member 120 is made of a conductive metal and includes a rectangular plate-shaped core wire connecting portion 121 that is placed on the second land 54, and a wire insertion wall 122 that stands upright from one side edge of the core wire connecting portion 121. The wire insertion wall 122 has a wire insertion hole 123. The wire insertion hole 123 is a through-hole that allows the wire 30 to be inserted therethrough.

[0052] The core wire 31 exposed from the insulating coating 32 at the end of the electric wire 30 is inserted into the electric wire insertion hole 123, placed on the core wire connecting portion 121, and connected to the electric wire relay member 120 by the first solder S1. The first solder S1 protrudes in a mountain-like shape above the core wire connecting portion 121, and the core wire 31 is embedded in the first solder S1. This ensures connection strength.

[0053] As in the above embodiment, the wire relay member 120 is disposed on the second land 54 so that the core wire connecting portion 121 overlaps the second land 54, and is connected to the second land 54 by the second solder S2. The first solder S1 is disposed only on the core wire connecting portion 121 so as to be out of contact with the second solder S2.

[0054] <Other embodiments> (1) In the above embodiment, the core wire 31 is a single core wire. However, the core wire may be a stranded wire formed by twisting together a plurality of wires. (2) In the above embodiment, the circuit board 50 is fixed to the bus bar 40 by the rivet 60. However, the means for fixing the circuit board to the bus bar is not limited to the above embodiment and may be, for example, a screw, an adhesive, or the like. [Explanation of symbols]

[0055] 1: Energy storage module 10: Energy storage element 11A: Positive terminal (electrode terminal) 11B: Negative terminal (electrode terminal) 20: Wiring module 30: Electric wire 31: Core wire 32: Insulation coating 40: Busbar 41: Busbar body 41A: First electrode connection part 41B: Second electrode connection part 41C: Connection part 42: Circuit board placement section 43: Substrate support part 44: 1st fixing hole 45: Electric wire holding part 46: Positioning protrusion 50: Circuit board 51: Insulating board 52: Conductive path 53: First Land 54: Second Land 55: Chip fuse 56: Third Land 57:Second fixing hole 58: Positioning recess 60: Rivet 61: Shaft 62A, 62B: Head 70: Busbar relay component 71: Busbar connection 72: Land connection part 80, 100, 110, 120: Electrical wire relay components 81, 101, 111, 121: Core wire placement section 82, 102, 112: Compartment walls 82A: High wall section 82B: Low wall part 83, 103, 113: Ceiling wall 90: Holding member 91: Busbar holding part 92: Wire routing section 114: Soldering iron insertion hole 122: Electric wire insertion wall 123: Wire insertion hole Is: Soldering iron S1: First solder S2: Second solder

Claims

1. A wiring module attached to a plurality of energy storage elements having electrode terminals, an electric wire having a core wire; a wire relay member connected to the core wire by a first solder; a bus bar connected to the electrode terminal; a circuit board having a conductive path including a first land electrically connected to the bus bar and a second land connected to the wire relay member by a second solder; The wiring module, wherein the core wire is embedded in the first solder.

2. the wire relay member includes a core wire connecting portion on which the core wire is placed and a partition wall erected from the core wire connecting portion, The wiring module according to claim 1 , wherein the first solder is disposed in a space defined by the core wire connecting portion and the partition wall.

3. 3. The wiring module according to claim 1, wherein the first solder and the second solder have different compositions and are disposed in a non-contact state.

Citation Information

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