Multilayer coupled coil component and circuit board including the same

Abstract

To provide a laminated coupling coil component capable of obtaining the desired coupling coefficient while reducing the height of the component.SOLUTION: A laminated coupling coil component 1 has conductor layers L1, L3, L5 including spiral coils 11-13, conductor layers L2, L4, L6 including spiral coils 21-23, and a conductor layer L7 including spiral coils 31, 41 provided at different planar positions from each other. The spiral coils 11-13 and 21-23 overlap each other when viewed from the laminated direction. Spiral coils 11-13 and 31 are connected in series between terminal electrodes E1 and E2, and spiral coils 21-23 and 41 are connected in series between terminal electrodes E4 and E3. This allows the coupling coefficient to be adjusted, making it possible to obtain the desired coupling coefficient while reducing the height of the components.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a multilayer coupled coil component having a structure in which a plurality of conductor layers are stacked, and a circuit board including the same. [Background technology]

[0002] Patent Document 1 discloses a multilayer coupled coil component having a structure in which multiple conductor layers are stacked. The multilayer coupled coil component disclosed in Patent Document 1 has four conductor layers, and has a structure in which spiral coils connected to one line and spiral coils connected to the other line are stacked alternately. This makes it possible to obtain strong magnetic coupling between a pair of lines. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-174888 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when a multilayer coupled coil component is used in an LC filter for removing noise in unnecessary bands, the required coupling coefficient varies depending on the desired frequency characteristics, and in some cases, it may be necessary to reduce the coupling coefficient to some extent. One method for reducing the coupling coefficient is to increase the distance between the spiral coil connected to one line and the spiral coil connected to the other line, but this poses the problem of increasing the height of the component.

[0005] Therefore, an object of the present invention is to provide a laminated coupled coil component that can obtain a desired coupling coefficient while reducing the height of the component, and a circuit board including the same. [Means for solving the problem]

[0006] A laminated coupled coil component according to the present invention comprises an element body in which a plurality of laminated conductor layers are embedded, and first to fourth terminal electrodes formed on the surface of the element body, wherein the plurality of conductor layers include a first conductor layer including a first spiral coil, a second conductor layer including a second spiral coil, and a third conductor layer including third and fourth spiral coils provided at mutually different planar positions, the first and second spiral coils overlap each other when viewed from the lamination direction, the first and third spiral coils are connected in series between the first terminal electrode and the second terminal electrode, and the second and fourth spiral coils are connected in series between the fourth terminal electrode and the third terminal electrode.

[0007] According to the present invention, the coupling coefficient can be adjusted by the number of first and second conductor layers and the number of third conductor layers, making it possible to obtain a desired coupling coefficient while keeping the height of the component small.

[0008] In the present invention, the first and second conductor layers may be alternately stacked in multiple layers, which makes it possible to enhance the coupling between the first spiral coil and the second spiral coil.

[0009] In the present invention, a plurality of third conductor layers may be stacked. This allows the coupling coefficient to be reduced. In this case, the third spiral coils formed on at least two of the plurality of third conductor layers may be connected in parallel, and the fourth spiral coils formed on at least two of the plurality of third conductor layers may be connected in parallel. This allows the outer circumferential ends of the third and fourth spiral coils to be connected to the second and third terminal electrodes even if the number of first or second conductor layers is odd and the number of third conductor layers is even.

[0010] In the present invention, the first spiral coil may be wound in a first direction from the first terminal electrode to the second terminal electrode, and the second spiral coil may be wound in a second direction opposite to the first direction from the fourth terminal electrode to the third terminal electrode. This makes it possible to block differential signal components input to the first and fourth terminal electrodes and pass common-mode noise components input to the first and fourth terminal electrodes. In this case, the third spiral coil may be wound in the first direction from the first terminal electrode to the second terminal electrode, and the fourth spiral coil may be wound in the second direction from the fourth terminal electrode to the third terminal electrode. This makes it possible to further weaken the coupling coefficient by using the third conductor layer.

[0011] A circuit board according to the present invention includes a substrate having first and second signal lines and a ground pattern, and the above-mentioned laminated coupled coil component mounted on the substrate, wherein the first and fourth terminal electrodes of the laminated coupled coil component are connected to the first and second signal lines, respectively, and the second and third terminal electrodes of the laminated coupled coil component are commonly connected to the ground pattern via a capacitor. This makes it possible to pass common-mode noise components through the ground pattern without attenuating differential signal components transmitted through the first and second signal lines. [Effects of the Invention]

[0012] As described above, according to the present invention, it is possible to provide a multilayer coupled coil component that can obtain a desired coupling coefficient while suppressing the height of the component, and a circuit board including the same. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of a multilayer coupled coil component 1 according to one embodiment of the present invention. [Figure 2] FIG. 2 is a development view illustrating a first example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 3]FIG. 3 is a cross-sectional view illustrating a first example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 4] FIG. 4 is an equivalent circuit diagram of the multilayer coupled coil component 1 according to the first example. [Figure 5] FIG. 5 is a circuit diagram of a circuit board 4 on which the multilayer coupled coil component 1 is mounted. [Figure 6] FIG. 6 is a development view illustrating a second example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view illustrating a second example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 8] FIG. 8 is an equivalent circuit diagram of the multilayer coupled coil component 1 according to the second example. [Figure 9] FIG. 9 is a cross-sectional view for explaining a first modified example of the pattern shape shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view for explaining a second modified example of the pattern shape shown in FIG. [Figure 11] FIG. 11 is a development view illustrating a third example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view illustrating a third example of the pattern shape of a plurality of conductor layers embedded in element body 2. As shown in FIG. [Figure 13] FIG. 13 is an equivalent circuit diagram of the multilayer coupled coil component 1 according to the third example. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0015] FIG. 1 is a schematic perspective view showing the appearance of a multilayer coupled coil component 1 according to one embodiment of the present invention.

[0016] 1, the multilayer coupled coil component 1 according to this embodiment includes an element body 2 and terminal electrodes E1 to E4 formed on the surface of the element body 2. As will be described later, multiple conductor layers are stacked inside the element body 2, and a spiral coil is formed on each conductor layer. The element body 2 is made of a composite material containing a metal magnetic filler made of iron (Fe), a permalloy-based material, or the like, and a resin binder.

[0017] 2 and 3 are a development view and a cross-sectional view, respectively, for explaining a first example of the pattern shape of a plurality of conductor layers embedded in element body 2. FIG.

[0018] As shown in FIGS. 2 and 3, the multilayer coupled coil component 1 according to this embodiment has eight conductor layers L1 to L8 stacked in this order. The surfaces of the conductor patterns provided on each of the conductor layers L1 to L8 are covered with an insulating resin layer 3. In the first example shown in FIGS. 2 and 3, spiral coils 11 to 13 are provided on the conductor layers L1, L3, and L5, respectively; spiral coils 21 to 23 are provided on the conductor layers L2, L4, and L6, respectively; spiral coils 31 and 41 are provided on the conductor layer L7; and spiral coils 32 and 42 are provided on the conductor layer L8. Here, the spiral coils 11 to 13 and the spiral coils 21 to 23 overlap each other when viewed from the stacking direction. The spiral coils 31 and 41 are provided at different planar positions, and the spiral coils 32 and 42 are provided at different planar positions.

[0019] The outer peripheral end of the spiral coil 11 provided on the conductor layer L1 is connected to the terminal electrode E1. The inner peripheral end of the spiral coil 11 is connected to the inner peripheral end of the spiral coil 12 provided on the conductor layer L3 via a relay pattern 51 provided on the conductor layer L2. The outer peripheral end of the spiral coil 12 is connected to the outer peripheral end of the spiral coil 13 provided on the conductor layer L5 via a relay pattern 52 provided on the conductor layer L4. The inner peripheral end of the spiral coil 13 is commonly connected to the inner peripheral ends of the spiral coils 31 and 32 provided on the conductor layers L7 and L8 via a relay pattern 53 provided on the conductor layer L6. The outer peripheral ends of the spiral coils 31 and 32 are connected to the terminal electrode E2.

[0020] The outer peripheral end of the spiral coil 21 provided on the conductor layer L2 is connected to the terminal electrode E4. The inner peripheral end of the spiral coil 21 is connected to the inner peripheral end of the spiral coil 22 provided on the conductor layer L4 via a relay pattern 61 provided on the conductor layer L3. The outer peripheral end of the spiral coil 22 is connected to the outer peripheral end of the spiral coil 23 provided on the conductor layer L6 via a relay pattern 62 provided on the conductor layer L5. The inner peripheral end of the spiral coil 23 is commonly connected to the inner peripheral ends of the spiral coils 41 and 42 provided on the conductor layers L7 and L8. The outer peripheral ends of the spiral coils 41 and 42 are connected to the terminal electrode E3.

[0021] With this configuration, as shown in the equivalent circuit diagram of FIG. 4, spiral coils 31 and 32, which are connected in parallel to spiral coils 11 to 13, are connected in series between terminal electrodes E1 and E2. Furthermore, spiral coils 41 and 42, which are connected in parallel to spiral coils 21 to 23, are connected in series between terminal electrodes E4 and E3. Since spiral coils 11 to 13 and spiral coils 21 to 23 overlap each other when viewed from the stacking direction and are alternately stacked, strong magnetic coupling M1 occurs between spiral coils 11 to 13 and spiral coils 21 to 23. In contrast, spiral coils 31 and 32 and spiral coils 41 and 42 do not overlap each other when viewed from the stacking direction and are located at different planar positions, so weak magnetic coupling M2 occurs between spiral coils 31 and 32 and spiral coils 41 and 42. Furthermore, because the spiral coils 11 to 13 partially overlap with the spiral coils 41 and 42, magnetic coupling also occurs between them. Similarly, because the spiral coils 21 to 23 partially overlap with the spiral coils 31 and 32, magnetic coupling also occurs between them.

[0022] Here, when terminal electrode E1 is the starting point and terminal electrode E2 is the end point, spiral coils 11-13, 31, and 32 are all wound clockwise. On the other hand, when terminal electrode E4 is the starting point and terminal electrode E3 is the end point, spiral coils 21-23, 41, and 42 are all wound counterclockwise. Therefore, when terminal electrodes E1 and E4 are connected to a pair of differential signal lines, the spiral coils 11-13 and 21-23 reinforce each other's magnetic fluxes and thus are blocked from differential signal components, whereas the spiral coils 11-13 and 21-23 cancel each other out in terms of common mode noise components, which are output to terminal electrodes E2 and E3. Although spiral coils 31, 32 and spiral coils 41, 42 cancel out the magnetic flux generated by the differential signal components and strengthen the magnetic flux generated by the common mode noise components, the degree of coupling between spiral coils 31, 32 and spiral coils 41, 42 is less than 1 / 10 of the degree of coupling between spiral coils 11 to 13 and spiral coils 21 to 23, and therefore there is almost no effect in blocking the common mode noise components.

[0023] Specifically, the inductance obtained by spiral coils 11-13 and 21-23 is 1.5 μH, and the inductance obtained by spiral coils 31, 32, 41, and 42 is 1.3 μH, resulting in an overall coupling coefficient of 0.96. The coupling coefficient can also be adjusted by shifting the planar positions of spiral coils 11-13 and spiral coils 21-23 from each other.

[0024] Although the conductor layer L8 on which the spiral coils 32 and 42 are provided may be omitted, connecting the spiral coils 31 and 32 in parallel and the spiral coils 41 and 42 in parallel reduces DC resistance. On the other hand, connecting the spiral coils 31 and 32 in series and the spiral coils 41 and 42 in series again results in an odd number (5) of spiral coils in series, which causes the spiral coils 32 and 42 to terminate at the inner circumferential ends, making it difficult to extend the spiral coils to the terminal electrodes E2 and E3. Therefore, in this case, it is preferable to add another conductor layer to make the number of spiral coils in series an even number.

[0025] FIG. 5 is a circuit diagram of a circuit board 4 on which the multilayer coupled coil component 1 according to this embodiment is mounted.

[0026] As shown in Fig. 5, a pair of signal lines 71 and 72 and a ground pattern 73 are provided on a substrate 70. Terminal electrodes E1 and E4 of the multilayer coupled coil component 1 are connected to the signal lines 71 and 72, respectively, and terminal electrodes E2 and E3 of the multilayer coupled coil component 1 are commonly connected to the ground pattern 73 via a capacitor C. This forms an LC filter, which allows common-mode noise components to flow to the ground pattern 73 without attenuating differential signal components flowing through the pair of signal lines 71 and 72. The frequency characteristics of the LC filter can be adjusted by the inductance and degree of coupling of the multilayer coupled coil component 1, the capacitance of the capacitor C, and the like. According to the configuration shown in Figs. 2 to 4, strong magnetic coupling occurs in the conductor layers L1 to L6, while the magnetic coupling is weakened in the conductor layers L7 and L8. This makes it possible to obtain a degree of coupling M corresponding to the frequency characteristics required of the LC filter while ensuring sufficient inductance.

[0027] 6 and 7 are a development view and a cross-sectional view, respectively, for explaining a second example of the pattern shape of a plurality of conductor layers embedded in element body 2. In FIG.

[0028] In the second example shown in FIGS. 6 and 7, spiral coils 11 and 12 are provided on conductor layers L1 and L3, respectively; spiral coils 21 and 22 are provided on conductor layers L2 and L4, respectively; spiral coils 31 and 41 are provided on conductor layer L5; spiral coils 32 and 42 are provided on conductor layer L6; spiral coils 33 and 43 are provided on conductor layer L7; and spiral coils 34 and 44 are provided on conductor layer L8. Here, the spiral coils 11 and 12 and the spiral coils 21 and 22 overlap each other when viewed from the stacking direction. Furthermore, the spiral coils 31 and 41 are provided at different planar positions, the spiral coils 32 and 42 are provided at different planar positions, the spiral coils 33 and 43 are provided at different planar positions, and the spiral coils 34 and 44 are provided at different planar positions. Furthermore, the spiral coils 31 to 34 overlap each other when viewed from the stacking direction. The spiral coils 41 to 44 overlap each other when viewed from the stacking direction.

[0029] The outer peripheral end of the spiral coil 11 provided on the conductor layer L1 is connected to the terminal electrode E1. The inner peripheral end of the spiral coil 11 is connected to the inner peripheral end of the spiral coil 12 provided on the conductor layer L3 via a relay pattern 51 provided on the conductor layer L2. The outer peripheral end of the spiral coil 12 is connected to the outer peripheral end of the spiral coil 31 provided on the conductor layer L5 via a relay pattern 52 provided on the conductor layer L4. The inner peripheral end of the spiral coil 31 is connected to the inner peripheral end of the spiral coil 32 provided on the conductor layer L6. The outer peripheral end of the spiral coil 32 is connected to the outer peripheral end of the spiral coil 33 provided on the conductor layer L7. The inner peripheral end of the spiral coil 33 is connected to the inner peripheral end of the spiral coil 34 provided on the conductor layer L8. The outer peripheral end of the spiral coil 34 is connected to the terminal electrode E2.

[0030] The outer peripheral end of the spiral coil 21 provided on the conductor layer L2 is connected to the terminal electrode E4. The inner peripheral end of the spiral coil 21 is connected to the inner peripheral end of the spiral coil 22 provided on the conductor layer L4 via a relay pattern 61 provided on the conductor layer L3. The outer peripheral end of the spiral coil 22 is connected to the outer peripheral end of the spiral coil 41 provided on the conductor layer L5. The inner peripheral end of the spiral coil 41 is connected to the inner peripheral end of the spiral coil 42 provided on the conductor layer L6. The outer peripheral end of the spiral coil 42 is connected to the outer peripheral end of the spiral coil 43 provided on the conductor layer L7. The inner peripheral end of the spiral coil 43 is connected to the inner peripheral end of the spiral coil 44 provided on the conductor layer L8. The outer peripheral end of the spiral coil 44 is connected to the terminal electrode E3.

[0031] With this configuration, as shown in the equivalent circuit diagram of FIG. 8, spiral coils 11, 12, and 31-34 are connected in series between terminal electrode E1 and terminal electrode E2. Furthermore, spiral coils 21, 22, and 41-44 are connected in series between terminal electrode E4 and terminal electrode E3. Since spiral coils 11, 12 and spiral coils 21, 22 overlap each other and are alternately stacked when viewed from the stacking direction, strong magnetic coupling M1 occurs between spiral coils 11, 12 and spiral coils 21, 22. In contrast, spiral coils 31-34 and spiral coils 41-44 do not overlap each other when viewed from the stacking direction and are located at different planar positions. Therefore, weak magnetic coupling M2 occurs between spiral coils 31-34 and spiral coils 41-44. Furthermore, since spiral coils 11, 12 and spiral coils 41-44 also partially overlap each other, magnetic coupling also occurs between them. Similarly, the spiral coils 21 and 22 and the spiral coils 31 to 34 also partially overlap each other, so that magnetic coupling occurs between them as well.

[0032] Here, when terminal electrode E1 is the starting point and terminal electrode E2 is the end point, spiral coils 11, 12, 31-34 are all wound clockwise. On the other hand, when terminal electrode E4 is the starting point and terminal electrode E3 is the end point, spiral coils 21, 22, 41-44 are all wound counterclockwise. Therefore, when terminal electrodes E1 and E4 are connected to a pair of differential signal lines, the spiral coils 11 and 12 and the spiral coils 21 and 22 reinforce each other's magnetic fluxes and are therefore blocked, whereas the common mode noise components are output to terminal electrodes E2 and E3 because the spiral coils 11 and 12 and the spiral coils 21 and 22 cancel each other's magnetic fluxes. Although spiral coils 31 to 34 and spiral coils 41 to 44 cancel out the magnetic flux generated by the differential signal components and strengthen the magnetic flux generated by the common mode noise components, the degree of coupling between spiral coils 31 to 34 and spiral coils 41 to 44 is much smaller than the degree of coupling between spiral coils 11, 12 and spiral coils 21, 22, and therefore there is almost no effect in blocking the common mode noise components.

[0033] As such, according to the configurations shown in Figures 6 to 8, strong magnetic coupling occurs in the conductor layers L1 to L4, while the magnetic coupling is weakened in the conductor layers L5 to L8, so it is possible to reduce the overall coupling degree M compared to the configurations shown in Figures 2 to 4 while ensuring sufficient inductance.

[0034] Specifically, the inductance obtained by spiral coils 11, 12, 21, and 22 is 1.0 μH, and the inductance obtained by spiral coils 31 to 34 and 41 to 44 is 1.8 μH, resulting in an overall coupling coefficient of 0.63. The coupling coefficient can also be adjusted by shifting the planar positions of spiral coils 11 and 12 and spiral coils 21 and 22 from each other.

[0035] 6 to 8, spiral coils 11, 12, 21, and 22 that generate strong magnetic coupling are arranged on conductor layers L1 to L4, and spiral coils 31 to 34 and 41 to 44 that generate weak magnetic coupling are arranged on conductor layers L5 to L6, but the positions of the spiral coils that generate strong magnetic coupling and the spiral coils that generate weak magnetic coupling are arbitrary. For example, as shown in Fig. 9, spiral coils that generate strong magnetic coupling may be arranged on conductor layers L3 to L6, and spiral coils that generate weak magnetic coupling may be arranged on conductor layers L1, L2, L7, and L8, or as shown in Fig. 10, spiral coils that generate strong magnetic coupling may be arranged on conductor layers L1, L2, L7, and L8, and spiral coils that generate weak magnetic coupling may be arranged on conductor layers L3 to L6.

[0036] 11 and 12 are a development view and a cross-sectional view, respectively, for explaining a third example of the pattern shape of a plurality of conductor layers embedded in element body 2. In FIG.

[0037] 11 and 12, the spiral coil 11 is provided on the conductor layer L1, the spiral coil 21 is provided on the conductor layer L2, the spiral coils 31 and 41 are provided on the conductor layer L3, the spiral coils 32 and 42 are provided on the conductor layer L4, the spiral coils 33 and 43 are provided on the conductor layer L5, the spiral coils 34 and 44 are provided on the conductor layer L6, the spiral coils 35 and 45 are provided on the conductor layer L7, and the spiral coils 36 and 46 are provided on the conductor layer L8. Here, the spiral coils 11 and 21 overlap each other when viewed from the stacking direction. Furthermore, spiral coils 31 and 41 are provided at different planar positions from each other, spiral coils 32 and 42 are provided at different planar positions from each other, spiral coils 33 and 43 are provided at different planar positions from each other, spiral coils 34 and 44 are provided at different planar positions from each other, spiral coils 35 and 45 are provided at different planar positions from each other, and spiral coils 36 and 46 are provided at different planar positions from each other. Furthermore, spiral coils 31 to 36 overlap each other when viewed from the stacking direction. Spiral coils 41 to 46 overlap each other when viewed from the stacking direction.

[0038] The outer peripheral end of the spiral coil 11 provided on the conductor layer L1 is connected to the terminal electrode E1. The inner peripheral end of the spiral coil 11 is connected to the inner peripheral end of the spiral coil 31 provided on the conductor layer L3 via a relay pattern 51 provided on the conductor layer L2. The outer peripheral end of the spiral coil 31 is connected to the outer peripheral end of the spiral coil 32 provided on the conductor layer L4. The inner peripheral end of the spiral coil 32 is connected to the inner peripheral end of the spiral coil 33 provided on the conductor layer L5. The outer peripheral end of the spiral coil 33 is connected to the outer peripheral end of the spiral coil 34 provided on the conductor layer L6. The inner peripheral end of the spiral coil 34 is commonly connected to the inner peripheral ends of the spiral coils 35 and 36 provided on the conductor layers L7 and L8. The outer peripheral ends of the spiral coils 35 and 36 are connected to the terminal electrode E2.

[0039] The outer peripheral end of the spiral coil 21 provided on the conductor layer L2 is connected to the terminal electrode E4. The inner peripheral end of the spiral coil 21 is connected to the inner peripheral end of the spiral coil 41 provided on the conductor layer L3. The outer peripheral end of the spiral coil 41 is connected to the outer peripheral end of the spiral coil 42 provided on the conductor layer L4. The inner peripheral end of the spiral coil 42 is connected to the inner peripheral end of the spiral coil 43 provided on the conductor layer L5. The outer peripheral end of the spiral coil 43 is connected to the outer peripheral end of the spiral coil 44 provided on the conductor layer L6. The inner peripheral end of the spiral coil 44 is commonly connected to the inner peripheral ends of the spiral coils 45 and 46 provided on the conductor layers L7 and L8. The outer peripheral ends of the spiral coils 45 and 46 are connected to the terminal electrode E3.

[0040] 13, which is an equivalent circuit diagram, spiral coils 11, 31-34 and parallel-connected spiral coils 35, 36 are connected in series between terminal electrode E1 and terminal electrode E2. Furthermore, spiral coils 21, 41-44 and parallel-connected spiral coils 45, 46 are connected in series between terminal electrode E4 and terminal electrode E3. Since spiral coils 11 and 21 overlap each other when viewed from the stacking direction, strong magnetic coupling M1 occurs between spiral coils 11 and 21. In contrast, spiral coils 31-36 and spiral coils 41-46 do not overlap each other when viewed from the stacking direction and are located at different planar positions, so weak magnetic coupling M2 occurs between spiral coils 31-36 and spiral coils 41-46.

[0041] Here, when terminal electrode E1 is the starting point and terminal electrode E2 is the end point, spiral coils 11, 31-36 are all wound clockwise. On the other hand, when terminal electrode E4 is the starting point and terminal electrode E3 is the end point, spiral coils 21, 41-46 are all wound counterclockwise. Therefore, when terminal electrodes E1, E4 are connected to a pair of differential signal lines, the spiral coils 11 and 21 reinforce each other's magnetic fluxes and thus block the differential signal components, while the spiral coils 11 and 21 cancel each other out in terms of the magnetic fluxes and thus output the common mode noise components to terminal electrodes E2, E3. Although spiral coils 31 to 36 and spiral coils 41 to 46 cancel out the magnetic flux generated by the differential signal components and strengthen the magnetic flux generated by the common mode noise components, the degree of coupling between spiral coils 31 to 36 and spiral coils 41 to 46 is much smaller than the degree of coupling between spiral coil 11 and spiral coil 21, and therefore there is almost no effect in blocking the common mode noise components.

[0042] As such, according to the configurations shown in Figures 11 to 13, strong magnetic coupling occurs in the conductor layers L1 and L2, while the magnetic coupling is weakened in the conductor layers L3 to L8, so it is possible to further reduce the overall coupling degree M compared to the configurations shown in Figures 6 to 8 while ensuring sufficient inductance.

[0043] Specifically, the inductance obtained by the spiral coils 11 and 21 is 0.5 μH, and the inductance obtained by the spiral coils 31 to 36 and 41 to 46 is 2.6 μH, resulting in an overall coupling coefficient of 0.33. The coupling coefficient can also be adjusted by shifting the planar positions of the spiral coils 11 and 21 from each other.

[0044] Although the conductor layer L8 on which the spiral coils 36 and 46 are provided may be omitted, connecting the spiral coils 35 and 36 in parallel and the spiral coils 45 and 46 in parallel reduces DC resistance. On the other hand, connecting the spiral coils 35 and 36 in series and the spiral coils 45 and 46 in series again results in an odd number (7) of spiral coils in series, which causes the spiral coils 36 and 46 to terminate at the inner circumferential ends, making it difficult to extend the spiral coils to the terminal electrodes E2 and E3. Therefore, in this case, it is preferable to add another conductor layer to make the number of spiral coils in series an even number.

[0045] The above describes a preferred embodiment of the present invention, but the present invention is not limited to the above embodiment, and various modifications are possible within the scope of the present invention, and it goes without saying that these modifications are also included within the scope of the present invention. [Explanation of symbols]

[0046] 1. Multilayer coupled coil components 2 Base 3. Insulating resin layer 4 Circuit Board 11~13, 21~23, 31~36, 41~46 Spiral coil 51~53,61,62 relay pattern 70 boards 71,72 Signal lines 73 Ground Pattern C capacitor E1~E4 terminal electrode L1~L8 conductor layers

Claims

1. an element body in which a plurality of stacked conductor layers are embedded; first to fourth terminal electrodes formed on a surface of the element body, the plurality of conductor layers include a first conductor layer including a first spiral coil, a second conductor layer including a second spiral coil, and a third conductor layer including third and fourth spiral coils provided at mutually different planar positions; the first and second spiral coils overlap each other when viewed from the stacking direction, the first and third spiral coils are connected in series between the first terminal electrode and the second terminal electrode; the second and fourth spiral coils are connected in series between the fourth terminal electrode and the third terminal electrode, a plurality of the third conductor layers are stacked, the third spiral coils formed on at least two of the plurality of third conductor layers are connected in parallel to each other; The laminated coupled coil component is characterized in that the fourth spiral coils formed on at least two of the plurality of third conductor layers are connected in parallel to each other.

2. 2. The multilayer coupled coil component according to claim 1, wherein the first and second conductor layers are alternately stacked a plurality of times.

3. the first spiral coil is wound in a first direction from the first terminal electrode to the second terminal electrode, 3. The multilayer coupled coil component according to claim 1, wherein the second spiral coil is wound in a second direction opposite to the first direction from the fourth terminal electrode toward the third terminal electrode.

4. the third spiral coil is wound in the first direction from the first terminal electrode to the second terminal electrode, 4. The multilayer coupled coil component according to claim 3, wherein the fourth spiral coil is wound in the second direction from the fourth terminal electrode toward the third terminal electrode.

5. a substrate having first and second signal lines and a ground pattern; the multilayer coupled coil component according to claim 3 or 4 mounted on the substrate, the first and fourth terminal electrodes of the multilayer coupled coil component are connected to the first and second signal lines, respectively; The circuit board according to claim 1, wherein the second and third terminal electrodes of the multilayer coupled coil component are commonly connected to the ground pattern via a capacitor.

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