Sensor Systems and Gas Systems

Abstract

To provide a sensor system and a gas system that can improve characteristics.SOLUTION: According to an embodiment, a sensor system includes piping and a sensor. The sensor can detect a substance to be detected in the piping. The sensor includes a substrate, a first detection unit, and a second detection unit. The substrate includes a first substrate area and a second substrate area. The first detection unit includes a first support part, a first connection part, and a first detection element. The second detection unit includes a second support part, a second connection part, and a second detection element.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to sensor systems and gas systems. [Background technology]

[0002] For example, there are sensors using MEMS (Micro Electro Mechanical Systems) elements, etc. The sensors are applied to gas systems such as gas conversion systems, and improvements in the characteristics of the sensors are desired. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-205105 Summary of the Invention [Problem to be solved by the invention]

[0004] Embodiments provide sensor systems and gas systems that allow for improved performance. [Means for solving the problem]

[0005] According to an embodiment, a sensor system includes a pipe and a sensor. The sensor is capable of detecting a detection target substance in the pipe. The sensor includes a substrate, a first detection unit, and a second detection unit. The substrate includes a first substrate region and a second substrate region. The first detection unit includes a first support, a first connection unit, and a first detection element. The position of the first detection unit relative to the first substrate region is fixed. The first connection unit is supported by the first support. The first connection unit supports the first detection element. A first gap is provided between the first substrate region and the first detection element. The first detection unit has a first area of ​​the first detection element, a first connection length of the first connection unit, a first connection width of the first connection unit, a first connection thickness of the first connection unit, a first connection material of the first connection unit, and a first distance. The first distance is the distance between the first substrate region and the first detection element. The second detection unit includes a second support portion, a second connection portion, and a second detection element. The position of the second support portion relative to the second base region is fixed. The second connection portion is supported by the second support portion. The second connection portion supports the second detection element. A second gap is provided between the second base region and the second detection element. The second detection unit has at least one of: a second area of ​​the second detection element that is different from the first area; a second connection length of the second connection portion that is different from the first connection length; a second connection width of the second connection portion that is different from the first connection width; a second connection thickness of the second connection portion that is different from the first connection thickness; a second connection material of the second connection portion that is different from the first connection material; and a second distance that is different from the first distance. The second distance is the distance between the second base region and the second detection element. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic view illustrating the sensor system according to the first embodiment. [Figure 2] FIG. 2 is a schematic diagram illustrating a part of the sensor system according to the first embodiment. [Figure 3] FIG. 3 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 4] FIG. 4 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 5] 5(a) and 5(b) are schematic views illustrating the sensor system according to the first embodiment. [Figure 6] 6(a) and 6(b) are schematic views illustrating the sensor system according to the first embodiment. [Figure 7] 7(a) to 7(d) are schematic views illustrating the sensor system according to the first embodiment. [Figure 8] 8(a) to 8(c) are schematic views illustrating the sensor system according to the first embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 10] FIG. 10 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 11] FIG. 11 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 12] FIG. 12 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 13] FIG. 13 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 14] FIG. 14 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 15] FIG. 15 is a schematic view illustrating a part of the sensor system according to the first embodiment. [Figure 16] 16(a) and 16(b) are graphs illustrating the characteristics of the sensor system according to the first embodiment. [Figure 17] 17(a) and 17(b) are graphs illustrating the characteristics of the sensor system according to the first embodiment. [Figure 18] FIG. 18 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 19]FIG. 19 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 20] FIG. 20 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 21] FIG. 21 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 22] FIG. 22 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 23] 23(a) to 23(c) are schematic cross-sectional views illustrating the sensor system according to the first embodiment. [Figure 24] FIG. 24 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 25] FIG. 25 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. [Figure 26] 26(a) and 26(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. [Figure 27] 27(a) and 27(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. [Figure 28] 28(a) and 28(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. [Figure 29] 29(a) and 29(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. [Figure 30] 30(a) to 30(c) are schematic views illustrating the gas system according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) FIG. 1 is a schematic view illustrating the sensor system according to the first embodiment. 1, a sensor system 210 according to an embodiment includes a pipe 80P and at least one sensor 110. The sensor 110 is capable of detecting a detection target substance 88 in the pipe 80P. For example, the detection target substance 88 is a gas. The sensor 110 detects the detection target substance 88 flowing through the pipe 80P.

[0009] In the embodiment, the sensor 110 includes a plurality of detection units (for example, a first detection unit 10A and a second detection unit 10B, etc.) By processing the detection signals obtained from the plurality of detection units, the detection target substance 88 can be detected with higher accuracy.

[0010] For example, the detection target substance 88 includes a first substance 88a and a second substance 88b. The second substance 88b is different from the first substance 88a.

[0011] At least two of the multiple detection units have different detection characteristics. Detection signals (detection results) from the detection units with different detection characteristics are processed. For example, the concentrations of multiple different types of substances can be detected with high accuracy. A sensor system capable of improving characteristics can be provided.

[0012] An example of a sensor (such as the sensor 110) according to an embodiment will be described below. 2 to 4 are schematic views illustrating a part of the sensor system according to the first embodiment. Fig. 2 is a cross-sectional view taken along line A1-A2 in Fig. 3. Figs. 3 and 4 are plan views. As shown in Figs. 2 to 4, a sensor 110 according to the embodiment includes a base 41, a first detection unit 10A, and a second detection unit 10B.

[0013] 2, the base 41 includes a first base region 41a and a second base region 41b. In this example, the base 41 includes a substrate 41s and an insulating film 41i. The substrate 41s may be, for example, a semiconductor substrate (e.g., a silicon substrate). The substrate 41s may include, for example, a semiconductor circuit. The substrate 41s may include a connecting member such as a via electrode.

[0014] In this example, the second substrate region 41b is continuous with the first substrate region 41a. For example, multiple detection units are provided on one semiconductor substrate. As will be described later, the second substrate region 41b may be separated from the first substrate region 41a.

[0015] The direction from the first substrate region 41a to the second substrate region 41b is along the upper surface of the substrate 41, for example.

[0016] As shown in FIG. 2, the first detection unit 10A includes a first detection element 11E. The first detection element 11E includes a first resistive member 11, a first conductive member 21, and a first insulating member 18A. At least a portion of the first insulating member 18A is located between the first resistive member 11 and the first conductive member 21. In this example, the first insulating member 18A is located around the first resistive member 11. The first insulating member 18A is located around the first conductive member 21. In this example, the first conductive member 21 is located between the base 41 and the first resistive member 11. In an embodiment, the first resistive member 11 may be located between the base 41 and the first conductive member 21. A first gap g1 is provided between the first base region 41a and the first detection element 11E.

[0017] 3 illustrates the planar patterns of the first conductive member 21 and the second conductive member 22. FIG. 4 illustrates the planar patterns of the first resistive member 11 and the second resistive member 12.

[0018] As shown in Figures 3 and 4, in this example, the first detection element 11E (the portion including the first resistance member 11, the first conductive member 21, and the first insulating member 18A) is octagonal. The planar shape of the first detection element 11E is arbitrary. The first detection element 11E has a first area S1. The first area S1 is the area of ​​the first detection element 11E in a plane that intersects with a first direction from the first base region 41a to the first detection element 11E.

[0019] As shown in Figure 2, the first direction is the Z-axis direction. The direction perpendicular to the Z-axis direction is the X-axis direction. The direction perpendicular to the Z-axis direction and the X-axis direction is the Y-axis direction. The plane intersecting with the first direction is, for example, the XY plane.

[0020] As shown in FIG. 2, the second detection unit 10B includes a second detection element 12E. The second detection element 12E includes a second resistive member 12, a second conductive member 22, and a second insulating member 18B. At least a portion of the second insulating member 18B is located between the second resistive member 12 and the second conductive member 22. In this example, the second insulating member 18B is located around the second resistive member 12. The second insulating member 18B is located around the second conductive member 22. In this example, the second conductive member 22 is located between the base 41 and the second resistive member 12. In an embodiment, the second resistive member 12 may be located between the base 41 and the second conductive member 22. A second gap g2 is provided between the second base region 41b and the second detection element 12E.

[0021] As shown in Figures 3 and 4, in this example, the second detection element 12E (the portion including the second resistance member 12, the second conductive member 22, and the second insulating member 18B) is octagonal. The second detection element 12E may have any planar shape. The second detection element 12E has a second area S2. The second area S2 is the area of ​​the second detection element 12E in the above plane (a plane intersecting with the first direction). The second area S2 is smaller than the first area S1.

[0022] 3 and 4, a control unit 70 may be provided. The control unit 70 is electrically connectable to the first resistance member 11, the first conductive member 21, the second resistance member 12, and the second conductive member 22. For example, the control unit 70 supplies a first current i1 to the first conductive member 21 to increase the temperature of the first detection element 11E. The control unit 70 supplies a second current i2 to the second conductive member 22 to increase the temperature of the second detection element 12E.

[0023] The temperature of these detection elements rises due to Joule heat generated by the supplied current. The amount of heat generated by these detection elements changes through substances (such as gas) contained in the space surrounding these detection elements. The degree of change in the amount of heat depends on the thermal conductivity of the substances contained in the surrounding space. The temperature of these detection elements is detected by a resistive element. By detecting the temperature of these detection elements, the presence or absence and concentration of substances contained in the surrounding space can be detected. A detection signal 70s containing the detection result is output from the control unit 70.

[0024] In the embodiment, for example, the area is different between the first detection element 11E and the second detection element 12E. Due to the difference in area, the characteristics of the change in heat quantity (for example, heat dissipation characteristics) of these detection elements are different. Due to the difference in area, the characteristics of the change in temperature of these detection elements are different from each other. By utilizing the difference in the characteristics of the change in temperature, for example, it is possible to detect the substance to be detected with higher accuracy. According to the embodiment, it is possible to provide a sensor capable of improving the characteristics.

[0025] For example, the space around these detection elements may contain multiple different types of substances. For example, the space may contain carbon monoxide, carbon dioxide (e.g., a first substance), and hydrogen (e.g., a second substance). In the first reference example using one detection element, the temperature of the detection element is affected by both the thermal conductivity of the multiple different types of substances and the concentrations of those substances. For this reason, in the first reference example, it is difficult to detect multiple different types of substances (e.g., a first substance and a second substance).

[0026] In the second reference example, one detection element is used, and the detection element is heated to multiple temperatures, and the temperature (degree of heat dissipation) of the detection element at the multiple temperatures is detected. In the second reference example, when multiple types of substances are detected using the measurement results of the multiple temperatures of the detection element, the detection accuracy is insufficient. In the second reference example, only one detection element is used and there is only one type of heat dissipation characteristic, so the accuracy is insufficient. Furthermore, in the second reference example, multiple temperature increases are required, so the measurement time is long. In the second reference example, the control circuit is complex.

[0027] In the embodiment, a plurality of detection elements having different heat dissipation characteristics are used. By utilizing the temperature change characteristics of the detection elements having different heat dissipation characteristics, it is possible to separate the influence of the thermal conductivity of a plurality of different substances from the concentrations of those substances. For example, for each of the plurality of detection elements, information regarding the relationship between the concentration of each of the plurality of different substances and temperature (or a value corresponding to temperature) is acquired in advance. By using this information and the measured values ​​(multiple values) of temperature (or a value corresponding to temperature) obtained from these detection elements, it is possible to detect the concentrations of each of the plurality of different substances with high accuracy. For example, by solving simultaneous equations, it is possible to detect the concentrations of each of the plurality of different substances with high accuracy. In the embodiment, since measurements are performed using a plurality of detection elements, the measurement time is short.

[0028] In the embodiment, an example of a processing method for detection will be described later.

[0029] As described above, in the embodiment, the second area S2 of the second detection element 12E is smaller than the first area S1 of the first detection element 11E. In the embodiment, the relationship between these areas may be reversed.

[0030] As shown in FIG. 2, the first detection element 11E has a first length L1 in a direction (e.g., a second direction) intersecting the first direction (Z-axis direction). The second direction is a direction along the XY plane. The second direction may be, for example, the X-axis direction. The second detection element 12E has a second length L2 in a direction (e.g., the second direction) intersecting the first direction (Z-axis direction). In this example, the second length L2 is shorter than the first length L1. The difference in area is obtained.

[0031] As shown in FIGS. 2 to 4, for example, the first detection unit 10A may further include a first support portion 31S and a first connection portion 31C. The first support portion 31S is fixed to the base 41. The first connection portion 31C is supported by the first support portion 31S and supports the first detection element 11E. A gap is provided between the first base region 41a and the first connection portion 31C. The first connection portion 31C has, for example, a spring structure. The first detection unit 10A may have a cantilever structure.

[0032] The second detection unit 10B may further include a second support portion 32S and a second connection portion 32C. The second support portion 32S is fixed to the base 41. The second connection portion 32C is supported by the second support portion 32S and supports the second detection element 12E. A gap is provided between the second base region 41b and the second connection portion 32C. The second connection portion 32C has, for example, a spring structure. The second detection unit 10B may have a cantilever structure.

[0033] As shown in FIGS. 2 to 4, for example, the first detection unit 10A may further include a first other support portion 31aS and a first other connection portion 31aC. The first other support portion 31aS is fixed to the base 41. The first other connection portion 31aC is supported by the first other support portion 31aS and supports the first detection element 11E. A gap is provided between the first base region 41a and the first other connection portion 31aC. In this example, the first detection element 11E is provided between the first connection portion 31C and the first other connection portion 31aC. The first detection unit 10A may have a doubly supported beam structure.

[0034] The second detection unit 10B may further include a second other support portion 32aS and a second other connection portion 32aC. The second other support portion 32aS is fixed to the base 41. The second other connection portion 32aC is supported by the second other support portion 32aS and supports the second detection element 12E. A gap is provided between the second base region 41b and the second other connection portion 32aC. In this example, the second detection element 12E is provided between the second connection portion 32C and the second other connection portion 32aC. The second detection unit 10B may have a doubly supported beam structure.

[0035] 3 and 4, the first detection unit 10A may further include a support portion 31bS and a connection portion 31bC. The support portion 31bS is fixed to the base 41. The connection portion 31bC is supported by the support portion 31bS and supports the first detection element 11E. A gap (not shown) is provided between the first base region 41a and the connection portion 31bC. The connection portion 31bC has, for example, a spring structure.

[0036] The first detection unit 10A may further include a support portion 31cS and a connection portion 31cC. The support portion 31cS is fixed to the base 41. The connection portion 31cC is supported by the support portion 31cS and supports the first detection element 11E. A gap (not shown) is provided between the first base region 41a and the connection portion 31cC. The connection portion 31cC has, for example, a spring structure.

[0037] In this example, the direction from connecting portion 31bC to connecting portion 31cC intersects with the direction from first connecting portion 31C to first other connecting portion 31aC. In this example, first conductive member 21 is electrically connected to wiring provided on base 41 via connecting portion 31bC, connecting portion 31cC, supporting portion 31bS, and supporting portion 31cS. The wiring is electrically connected to control portion 70. First conductive member 21 has a meander structure.

[0038] 2 and 4, the second detection unit 10B may further include a support portion 32bS and a connection portion 32bC. The support portion 32bS is fixed to the base 41. The connection portion 32bC is supported by the support portion 32bS and supports the second detection element 12E. A gap (not shown) is provided between the second base region 41b and the connection portion 32bC. The connection portion 32bC has, for example, a spring structure.

[0039] The second detection unit 10B may further include a support portion 32cS and a connection portion 32cC. The support portion 32cS is fixed to the base 41. The connection portion 32cC is supported by the support portion 32cS and supports the second detection element 12E. A gap (not shown) is provided between the second base region 41b and the connection portion 32cC. The connection portion 32cC has, for example, a spring structure.

[0040] In this example, the direction from the connecting portion 32bC to the connecting portion 32cC intersects with the direction from the second connecting portion 32C to the second other connecting portion 32aC. In this example, the second conductive member 22 is electrically connected to wiring provided on the base 41 via the connecting portion 32bC, the connecting portion 32cC, the supporting portion 32bS, and the supporting portion 32cS. The wiring is electrically connected to the control unit 70. The second conductive member 22 has a meandering structure. In one example, the shape of the second conductive member 22 may be similar to that of the first conductive member 21.

[0041] For example, the first connecting portion 31C, the first other connecting portion 31aC, the connecting portion 31bC, and the connecting portion 31cC may have a meander structure. For example, the second connecting portion 32C, the second other connecting portion 32aC, the connecting portion 32bC, and the connecting portion 32cC may have a meander structure.

[0042] 4, the first detection element 11E may include a first layer 15a and a second layer 15b. The first layer 15a and the second layer 15b have the same material and thickness as the first resistance member 11. The first resistance member 11 is provided between the first layer 15a and the second layer 15b. By providing these layers, warping (deformation) of the first detection element 11E is suppressed.

[0043] 4, the second detection element 12E may include a third layer 15c and a fourth layer 15d. The third layer 15c and the fourth layer 15d have the same material and thickness as the second resistance member 12. The second resistance member 12 is provided between the third layer 15c and the fourth layer 15d. By providing these layers, warping (deformation) of the second detection element 12E is suppressed.

[0044] As shown in FIG. 2, the sensor 110 may further include a resistive element 16. For example, the resistive element 16 is fixed to the base 41. As described below, the control unit 70 may derive a difference between an electrical signal obtained from the first resistive element 11 and an electrical signal obtained from the resistive element 16. The control unit 70 may derive a difference between an electrical signal obtained from the second resistive element 12 and an electrical signal obtained from the resistive element 16. This, for example, can suppress the effects of fluctuations in the ambient temperature or the temperature of the base 41. This enables more accurate detection. The resistive element 16 is omitted in FIGS. 3 and 4. Multiple resistive elements 16 may be provided. For example, the difference between the electrical signal obtained from the first resistive element 11 and an electrical signal obtained from one of the multiple resistive elements 16 may be derived. For example, the difference between the electrical signal obtained from the second resistive element 12 and an electrical signal obtained from another one of the multiple resistive elements 16 may be derived.

[0045] Other examples of sensors that can be applied to the sensor system according to the embodiment will be described later.

[0046] 5(a) and 5(b) are schematic views illustrating the sensor system according to the first embodiment. 5(a), in a sensor system 210a according to this embodiment, the sensor 110 includes a housing (for example, a first housing 55a). At least a portion of the first detection unit 10A and at least a portion of the second detection unit 10B are provided between the base 41 and the first housing 55a.

[0047] The first housing 55a includes a first inlet 55I and a first outlet 55O. The detection target substance 88 is introduced through the first inlet 55The detection target substance 88 can flow from the first outlet 1 into the space between a part of the first housing 55a and the first detection unit 10A, and into the space between a part of the first housing 55a and the second detection unit 10B. 55 The flow path of the detection target substance 88 is appropriately set. More stable detection becomes possible.

[0048] As shown in FIG. 5(b), in a sensor system 210b according to this embodiment, a pipe 80P includes a first flow path 81 and a second flow path 82. The second flow path 82 branches off from the first flow path 81. In this example, the first flow path 81 has a first portion 81A. The second flow path 82 branches off from the first portion 81A. A portion of the detection target substance 88 passes through the second flow path 82. The sensor 110 is provided in, for example, the second flow path 82. For example, the influence of the sensor 110 on the detection target substance 88 flowing mainly through the first flow path 81 is suppressed. More stable detection becomes possible.

[0049] 6(a) and 6(b) are schematic views illustrating the sensor system according to the first embodiment. As shown in FIG. 6(a), in the sensor system 210c according to the embodiment, the direction from the first inlet 55I to the detection unit (first detection unit 10A and second detection unit 10B) intersects with the direction of gas flowing through the space between the detection unit and the first housing 55a. The direction from the detection unit (first detection unit 10A and second detection unit 10B) to the first outlet 55O intersects with the direction of gas flowing through the space between the detection unit and the first housing 55a. The flow path of the detection target substance 88 is appropriately set. More stable detection is possible.

[0050] 6(b), in a sensor system 210d according to this embodiment, a second flow path 82 branches off from a first flow path 81. The sensor 110 is provided, for example, in the second flow path 82. This enables more stable detection.

[0051] 7(a) to 7(d) are schematic views illustrating the sensor system according to the first embodiment. As shown in FIG. 7(a), in a sensor system 211a according to the embodiment, the sensor 110 is provided in a pipe 80P (for example, in a first flow path 81).

[0052] 7(b), in a sensor system 211b according to this embodiment, the pipe 80P (first flow path 81) includes a recess 81d. The sensor 110 is provided in the recess 81d.

[0053] 7(c), in a sensor system 211c according to the embodiment, a pipe 80P includes a first flow path 81 and a second flow path 82. The second flow path 82 branches off from the first flow path 81. For example, the second flow path 82 is separated from a first portion 81A of the first flow path 81. The sensor 110 is provided in either the first flow path 81 or the second flow path 82. In this example, the sensor 110 is provided in the second flow path 82.

[0054] 7(d), in a sensor system 211d according to this embodiment, a first flow path 81 includes a first portion 81A and a second portion 81B. A second flow path 82 branches off from the first portion 81A and is connected to the second portion 81B. A sensor 110 is provided in the second flow path 82. The sensor 110 may be provided in either the first flow path 81 or the second flow path 82.

[0055] 8(a) to 8(c) are schematic views illustrating the sensor system according to the first embodiment. 8(a), a sensor system 212a according to the embodiment is provided with a plurality of sensors 110. At least one of the plurality of sensors 110 is provided in a pipe 80P (for example, a first flow path 81).

[0056] 8(b), a sensor system 212b according to the embodiment is provided with a plurality of sensors 110. The pipe 80P includes a first flow path 81 and a second flow path 82 branching from the first flow path 81. At least two of the plurality of sensors are provided in the second flow path 82.

[0057] As shown in FIG. 8(c), a sensor system 212c according to this embodiment is provided with a plurality of sensors 110. The pipe 80P includes a first flow path 81, a second flow path 82, and a third flow path 83. The first flow path 81 includes a first portion 81A, a second portion 81B, a third portion 81C, and a fourth portion 81D. The second flow path 82 branches from the first portion 81A and is connected to the second portion 81B. The third flow path 83 branches from the third portion and is connected to the fourth portion 81D. At least one of the plurality of sensors 110 is provided in the second flow path 82. Another of the plurality of sensors 110 is provided in the third flow path 83.

[0058] Providing multiple sensors 110 enables more accurate detection. For example, if one of the multiple sensors 110 fails, detection can be performed by the other sensors 110. More stable detection is possible.

[0059] Another example of the sensor according to the embodiment will be described below. FIG. 9 is a schematic cross-sectional view illustrating a part of the sensor system according to the first embodiment. Fig. 9 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in Fig. 3. As shown in Fig. 9, in sensor 111 according to the embodiment, first detection element 11E and second detection element 12E have different heights relative to base 41. The remaining configuration of sensor 111 may be similar to that of sensor 110.

[0060] In the sensor 111, a first distance d1 in the first direction (Z-axis direction) between the first substrate region 41a and the first detection element 11E is different from a second distance d2 in the first direction between the second substrate region 41b and the second detection element 12E. These distances correspond to the lengths of the gaps (first gap g1 and second gap g2). These different distances result in different heat dissipation characteristics from these detection elements via the substrate 41. Different heat dissipation characteristics are obtained. Utilizing the difference in heat dissipation characteristics enables detection with higher accuracy.

[0061] For example, the first distance d1 is longer than the second distance d2. Due to the longer first distance d1, heat dissipation through the base 41 of the first detection element 11E is suppressed more than that of the second detection element 12E. For example, the first area S1 of the first detection element 11E is larger than the second area S2 of the second detection element 12E. The difference in area and the difference in distance (difference in gap length) more effectively achieves a difference in heat dissipation characteristics.

[0062] 10 to 12 are schematic views illustrating a part of the sensor system according to the first embodiment. Fig. 10 is a cross-sectional view taken along line A1-A2 in Fig. 11. Figs. 11 and 12 are plan views. As shown in Figs. 10 to 12, a sensor 120 according to this embodiment includes a base 41, a first detection unit 10A, and a second detection unit 10B. In sensor 120, the configuration of the connection units included in the detection units differs from the configuration in sensor 110. For example, the thermal resistance of the connection unit included in first detection unit 10A differs from the thermal resistance of the connection unit included in second detection unit 10B. The remaining configuration of sensor 120 may be the same as the configuration in sensor 110 or sensor 111.

[0063] 10 to 12, in sensor 120, for example, first detection unit 10A includes a first support portion 31S and a first connection portion 31C. First support portion 31S is fixed to base 41. First connection portion 31C is supported by first support portion 31S and supports first detection element 11E. A gap is provided between first base region 41a and first connection portion 31C.

[0064] The second detection unit 10B includes a second support portion 32S and a second connection portion 32C. The second support portion 32S is fixed to the base 41. The second connection portion 32C is supported by the second support portion 32S and supports the second detection element 12E. A gap is provided between the second base region 41b and the second connection portion 32C.

[0065] 12, in the sensor 120, the first connection portion 31C has a first connection length LC1. The first connection length LC1 is the length of the first connection portion 31C along the path (first connection portion path) between the first support portion 31S and the first detection element 11E.

[0066] As shown in FIG. 12, the second connection portion 32C has a second connection length LC2. The second connection length LC2 is the length of the second connection portion 32C along the path (second connection portion path) between the second support portion 32S and the second detection element 12E. The second connection length LC2 is different from the first connection length LC1. This difference in length results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion is created. By utilizing the difference in the heat dissipation characteristics through the connection portion, it is possible to detect the detection target substance with higher accuracy. According to the embodiment, it is possible to provide a sensor with improved characteristics. For example, it is possible to detect the respective concentrations of multiple different types of substances with high accuracy. In the embodiment, the measurement time is short.

[0067] 11, in the sensor 120, the first other connection portion 31aC has a first other connection length LCa1. The first other connection length LCa1 is the length of the first other connection portion 31aC along the path (first other connection portion path) between the first other support portion 31aS and the first detection element 11E.

[0068] 12, the second other connection portion 32aC has a second other connection length LCa2. The second other connection length LCa2 is the length of the second other connection portion 32aC along the path (second other connection portion path) between the second other support portion 32aS and the second detection element 12E. The second other connection length LCa2 is different from the first other connection length LCa1. This difference in length results in a difference in the thermal resistance of the other connection portion.

[0069] In this example, the second connection length LC2 is shorter than the first connection length LC1 In this example, the second other connection length LCa2 is shorter than the first other connection length LCa1.

[0070] In the sensor 120, the first area S1 may be the same as or different from the second area S2. In this example, the first area S1 is larger than the second area S2. In this case, the second connection length LC2 is shorter than the first connection length LC1. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in connection length are utilized. This makes it possible to more effectively utilize the difference in heat dissipation characteristics.

[0071] In the embodiment, for example, the length of connecting portion 31bC along the path of connecting portion 31bC may be different from the length of connecting portion 32bC along the path of connecting portion 32bC. The length of connecting portion 31cC along the path of connecting portion 31cC may be different from the length of connecting portion 32cC along the path of connecting portion 32cC.

[0072] As shown in FIG. 11 , the first connection portion 31C has a first connection portion width w1. The first connection portion width w1 is the width of the first connection portion 31C along a direction intersecting the first connection portion path between the first support portion 31S and the first detection element 11E. The second connection portion 32C has a second connection portion width w2. The second connection portion width w2 is the width of the second connection portion 32C along a direction intersecting the second connection portion path between the second support portion 32S and the second detection element 12E. The second connection portion width w2 may be different from the first connection portion width w1. The difference in width creates a difference in thermal resistance between the connection portions. By utilizing the difference in heat dissipation characteristics through the connection portions, it is possible to detect the target substance with higher accuracy. According to the embodiment, a sensor with improved characteristics can be provided. For example, the respective concentrations of multiple different types of substances can be detected with high accuracy.

[0073] As shown in FIG. 11 , the first other connection portion 31aC has a first other connection portion width wa1. The first other connection portion width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection portion path between the first other support portion 31aS and the first detection element 11E. The second other connection portion 32aC has a second other connection portion width wa2. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is different from the first other connection portion width wa1. The difference in width results in a difference in the thermal resistance of the connection portion.

[0074] In the sensor 120, at least one of a difference in length and a difference in width may be provided between the connection portion of the first detection unit 10A and the connection portion of the second detection unit 10B.

[0075] Fig. 13 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. Fig. 13 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in Fig. 11. As shown in Fig. 13, in a sensor 121 according to the embodiment, the thicknesses of the connecting portions are different among the multiple detecting elements. Except for this, the configuration of the sensor 121 may be the same as that of the sensor 110 or the sensor 111.

[0076] As shown in FIG. 13 , in the sensor 121, the first connection portion 31C has a first connection portion thickness t1. The first connection portion thickness t1 is the thickness of the first connection portion 31C in the first direction (Z-axis direction). The second connection portion 32C has a second connection portion thickness t2. The second connection portion thickness t2 is the thickness of the second connection portion 32C in the first direction (Z-axis direction). The second connection portion thickness t2 is different from the first connection portion thickness t1. This difference in thickness results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion is created. By utilizing the difference in the heat dissipation characteristics through the connection portion, it is possible to detect a substance to be detected with higher accuracy. According to the embodiment, a sensor capable of improving characteristics can be provided. For example, the respective concentrations of multiple different types of substances can be detected with high accuracy. In the embodiment, the measurement time is short.

[0077] In the sensor 121, the first other connection portion 31aC has a first other connection portion thickness ta1. The first other connection portion thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction). The second other connection portion 32aC has a second other connection portion thickness ta2. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction). Second other connection portion Thickness ta2 is different from the first other connection portion thickness ta1. Such a difference in thickness results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion.

[0078] In sensor 121, at least one of a difference in length of the connection portion and a difference in width of the connection portion may be provided, as in the example of sensor 120. A difference in length of the connection portion, a difference in width of the connection portion, and a difference in thickness of the connection portion may provide a difference in thermal resistance of the connection portion.

[0079] In this example, the second connection portion thickness t2 is thicker than the first connection portion thickness t1. In this example, the second other connection portion thickness ta2 is thicker than the first other connection portion thickness ta1.

[0080] In the sensor 121, the first area S1 may be the same as or different from the second area S2. In this example, the first area S1 is larger than the second area S2. In this case, the second connection portion thickness t2 is thicker than the first connection portion thickness t1. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in connection portion thickness are utilized. This makes it possible to more effectively obtain the difference in heat dissipation characteristics.

[0081] FIG. 14 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. FIG. 14 is a cross-sectional view corresponding to the cross section taken along line A1-A2 in FIG. 11. As shown in FIG. 14, in a sensor 122 according to the embodiment, a connection portion is provided for each of a plurality of detection elements. In the sensor 122, the connection portions of the plurality of detection elements are made of different materials. The remaining configuration of the sensor 122 may be the same as that of the sensor 110 or the sensor 111.

[0082] In the sensor 122, the first connection portion 31C includes a first connection portion material. The second connection portion 32C includes a second connection portion material that is different from the first connection portion material. This difference in materials results in a difference in the thermal resistance of the connection portion. For example, a difference in the heat dissipation characteristics through the connection portion.

[0083] In sensor 122, the lengths of the connecting portions may be different, as in the example of sensor 120. In sensor 122, the thicknesses of the connecting portions may be different, as in the example of sensor 121. Differences in the thermal resistance of the connecting portions may be created by at least one of differences in the lengths of the connecting portions, differences in the thicknesses of the connecting portions, and differences in the materials of the connecting portions.

[0084] For example, the thermal conductivity of the second connection portion material is different from the thermal conductivity of the first connection portion material, for example, the thermal conductivity of the second connection portion material is higher than the thermal conductivity of the first connection portion material.

[0085] In the sensor 122, the first area S1 may be the same as or different from the second area S2. In this example, the thermal conductivity of the second connection material is higher than that of the first connection material. The difference in heat dissipation characteristics based on the difference in area and the difference in heat dissipation characteristics based on the difference in thermal conductivity of the connection are utilized. This makes it possible to more effectively utilize the difference in heat dissipation characteristics.

[0086] The configurations of the sensors 120 to 122 may be combined. For example, the first connection portion 31C includes a first connection length LC1, a first connection width w1, a first connection thickness t1, and a first connection material. The first connection length LC1 is the length of the first connection portion 31C along the first connection path between the first support portion 31S and the first detection element 11E. The first connection width w1 is the width of the first connection portion 31C in a direction intersecting the first connection path. The first connection thickness t1 is the thickness of the first connection portion 31C in the first direction (Z-axis direction).

[0087] The second connection portion 32C may include at least one of a second connection length LC2 different from the first connection length LC1, a second connection width w2 different from the first connection width w1, a second connection thickness t2 different from the first connection thickness t1, and a second connection material different from the first connection material. The second connection length LC2 is the length of the second connection portion 32C along the second connection path between the second support portion 32S and the second detection element 12E. The second connection width w2 is the width of the second connection portion 32C in a direction intersecting the second connection path. The second connection thickness t2 is the thickness of the second connection portion 32C in the first direction (Z-axis direction).

[0088] For example, in one example, the second connection length LC2 is shorter than the first connection length LC1. The second connection width w2 is greater than the first connection width w1. The second connection thickness t2 is thicker than the first connection thickness t1. The thermal conductivity of the second connection material is higher than the thermal conductivity of the first connection material. For example, the second connection portion 32C includes at least one of the following: a second connection length LC2 shorter than the first connection length LC1; a second connection width w2 greater than the first connection width w1; a second connection thickness t2 thicker than the first connection thickness t1; and a thermal conductivity of the second connection material higher than the thermal conductivity of the first connection material. A difference in thermal resistance is effectively obtained.

[0089] For example, the first other connection portion 31aC includes a first other connection portion length LCa1, a first other connection portion width wa1, a first other connection portion thickness ta1, and a first other connection portion material. The first other connection portion length LCa1 is the length of the first other connection portion 31aC along the first other connection portion path between the first other support portion 31aS and the first detection element 11E. The first other connection portion width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection portion path. The first other connection portion thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction).

[0090] For example, the second other connection portion 32aC may include at least one of a second other connection portion length LCa2 different from the first other connection portion length LCa1, a second other connection portion width wa2 different from the first other connection portion width wa1, a second other connection portion thickness ta2 different from the first other connection portion thickness ta1, and a second other connection portion material different from the first other connection portion material. The second other connection portion length LCa2 is the length of the second other connection portion 32aC along the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting the second other connection portion path. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction).

[0091] For example, in one example, the second other connection length LCa2 is shorter than the first other connection length LCa1. The second other connection width wa2 is larger than the first other connection width wa1. The second other connection thickness ta2 is thicker than the first other connection thickness ta1. The thermal conductivity of the second other connection portion material is higher than the thermal conductivity of the first other connection portion material. A difference in thermal resistance is effectively achieved.

[0092] FIG. 15 is a schematic view illustrating a part of the sensor system according to the first embodiment. 15 shows an example of the control unit 70. As already described, the sensor according to the embodiment (for example, the sensor 110) may include the resistance element 16 provided on the base body 41.

[0093] 15, the control unit 70 may include a differential circuit 71. The differential circuit 71 may include a first differential circuit 71a and a second differential circuit 71b.

[0094] In this example, the first resistance element 11 and the resistance element 16 are electrically connected in parallel. A resistor 16a is connected in series with the first resistance element 11 and the resistance element 16 and electrically connected to ground GND. A current is supplied from a constant current source 72 to the first resistance element 11 and the resistance element 16 connected in parallel. The voltage of the first resistance element 11 is input to one input terminal of a first differential circuit 71a. The voltage of the resistance element 16 is input to another input terminal of the first differential circuit 71a.

[0095] The second resistance member 12 and the resistance element 16 are electrically connected in parallel. A resistor 16b is connected in series with the second resistance member 12 and the resistance element 16 and is electrically connected to ground GND. A current is supplied from a constant current source 72 to the second resistance member 12 and the resistance element 16 connected in parallel. The voltage of the second resistance member 12 is input to one input terminal of a second differential circuit 71b. The voltage of the resistance element 16 is input to another input terminal of the second differential circuit 71b.

[0096] The differential circuit 71 (first differential circuit 71a) can derive a value (first value va1) corresponding to the difference between the potential corresponding to the electrical resistance of the resistive element 16 and the potential corresponding to the first electrical resistance of the first resistive member 11. The differential circuit 71 (second differential circuit 71b) can derive a value (first value va1) corresponding to the difference between the potential corresponding to the electrical resistance of the resistive element 16 and the potential corresponding to the second electrical resistance of the second resistive member 12. difference It is possible to derive a value (second value va2) according to the above. These values ​​are, for example, voltages.

[0097] In the above, a voltage may be applied to each of the first resistance element 11 and the second resistance element 12. These voltages may be the same. A configuration in which the same voltage is applied simplifies the circuit, for example.

[0098] For example, the outputs (first value va1 and second value va2) of the first differential circuit 71a and the second differential circuit 71b are supplied to the processing unit 75. Detection is performed in the processing unit 75 based on these values. A detection signal 70s (information) including the detection result is output from the control unit 70.

[0099] The control unit 70 is capable of performing the following first operation. In the first operation, the control unit 70 supplies a first current i1 to the first conductive member 21 to increase the temperature of the first detection element 11E. In the first operation, the control unit 70 supplies a second current i2 to the second conductive member 22 to increase the temperature of the second detection element 12E. In the first operation, the control unit 70 derives a first value va1 corresponding to the first electrical resistance of the first resistance member 11. In the first operation, the control unit 70 derives a second value va2 corresponding to the second electrical resistance of the second resistance member 12.

[0100] In the first operation, the control unit 70 can output a detection signal 70s including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element 11E and the second detection element 12E and a second detection value corresponding to the concentration of a second substance contained in the space based on the first value va1 and the second value va2. The first detection value and the second detection value may be obtained by, for example, a processing unit 75 included in the control unit 70.

[0101] For example, the control unit 70 (processing unit 75) can derive the first detection value and the second detection value based on first information i01 and second information i02 (see FIG. 15). For example, the first information i01 relates to the relationship between the concentration of the first substance for the first detection element 11E and the first value va1, and the relationship between the concentration of the second substance for the first detection element 11E and the first value va1. The second information i02 relates to the relationship between the concentration of the first substance for the second detection element 12E and the second value va2, and the relationship between the concentration of the second substance for the second detection element 12E and the second value va2.

[0102] The first information i01 is obtained in advance for the first detection element 11E, for example. The second information i02 is obtained in advance for the second detection element 12E, for example. These pieces of information may include an equation (e.g., an approximate equation) showing the relationship between the concentration and the value. These pieces of information may also be a table including the relationship between the concentration and the value.

[0103] 15, a memory unit 76 may be provided. The control unit 70 may include the memory unit 76. The memory unit 76 stores first information i01 and second information i02. The control unit 70 (processing unit 75) reads the first information i01 and the second information i02 from the memory unit 76. The processing unit 75 can output a detection signal 70s including a first detection value corresponding to the concentration of a first substance contained in the space around the first detection element 11E and the second detection element 12E, and a second detection value corresponding to the concentration of a second substance contained in the space, based on the read-out first information i01 and second information i02 and the measured first value va1 and second value va2.

[0104] 16(a) and 16(b) are graphs illustrating the characteristics of the sensor system according to the first embodiment. FIG. 16(a) corresponds to the first detection element 11E. FIG. 16(b) corresponds to the second detection element 12E. The horizontal axis of these figures represents the concentration Cg1 of a substance contained in the space. These figures illustrate the characteristics when the first substance contained in the space is carbon dioxide (CO2) and the characteristics when the second substance contained in the space is helium (He). In these cases, the space contains nitrogen (N2) as a third substance in addition to the above substances. When the first substance is carbon dioxide, the concentration Cg1 corresponds to the concentration of the first substance relative to the sum of carbon dioxide (first substance) and nitrogen (third substance). When the second substance is helium, the concentration Cg1 corresponds to the concentration of the second substance relative to the sum of helium (second substance) and nitrogen (third substance). The vertical axis of FIG. 16(a) represents the signal value Sg0 (e.g., voltage) obtained from the first detection element 11E. The vertical axis of FIG. 16(b) is the signal value Sg0 (for example, voltage) obtained from the second detection element 12E.

[0105] 16(a) and 16(b), the signal value Sg0 depends on the concentration Cg1. In this example, the signal value Sg0 for carbon dioxide is approximately represented by a linear function of the carbon dioxide concentration Cg1. The signal value Sg0 for helium is approximately represented by a quadratic function of the helium concentration Cg1.

[0106] With respect to carbon dioxide, at least one coefficient included in the linear function differs between the first detection element 11E and the second detection element 12E. With respect to helium, at least one coefficient included in the quadratic function differs between the first detection element 11E and the second detection element 12E. The above coefficient for carbon dioxide becomes at least a part of the first information i01. The above coefficient for helium becomes at least a part of the second information i02. Such characteristics are acquired in advance and stored, for example, in the storage unit 76.

[0107] For example, a function for the signal value Sg0 when the first substance and the second substance are included may be derived from these multiple functions. This function may be stored in the storage unit .

[0108] Similarly, coefficients of the functions may be obtained in advance for other substances (for example, hydrogen or methane), and information including these coefficients is stored in the storage unit 76.

[0109] Meanwhile, in detection using the sensors, measurement data (first value va1 and second value va2) are obtained from the first detection element 11E and the second detection element 12E. The obtained measurement data is processed using the stored information (e.g., coefficients included in the function). As a result, a first detection value corresponding to the concentration of the first substance and a second detection value corresponding to the concentration of the second substance are derived from the measurement data. Even when these multiple detection target substances are contained in a space, the concentrations of each of these multiple detection target substances can be detected with high accuracy.

[0110] 17(a) and 17(b) are graphs illustrating the characteristics of the sensor system according to the first embodiment. 17(a) corresponds to the first detection element 11E. FIG. 17(b) corresponds to the second detection element 12E. These figures illustrate the signal value Sg1 (e.g., voltage) when the space contains carbon dioxide (first substance), helium (second substance), and nitrogen (third substance). The horizontal axis of these figures is the carbon dioxide concentration Cg1. The vertical axis of these figures is the signal value Sg1. In this example, the change in the signal value Sg1 with respect to the carbon dioxide concentration Cg1 is illustrated when the helium concentration is 6.9 vol%, 13.5 vol%, or 25.9 vol%.

[0111] 17(a) and 17(b), when the space contains carbon dioxide (first substance), helium (second substance), and nitrogen (third substance), signal values ​​Sg1 corresponding to the concentrations of carbon dioxide (first substance) and helium (second substance) are obtained. Based on the signal value Sg1 obtained from the first detection element 11E and the signal value Sg1 obtained from the second detection element 12E, the concentrations of carbon dioxide (first substance) and helium (second substance) can be derived.

[0112] 18 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. As shown in FIG. 18, the sensor 130 according to the embodiment may further include a third detection unit 10C in addition to the first detection unit 10A and the second detection unit 10B. The remaining configuration of the sensor 130 may be the same as the configuration of the sensor according to the first or second embodiment.

[0113] In the sensor 130, the base 41 further includes a third base region 41c. The third detection unit 10C includes a third detection element 13E. The third detection element 13E includes a third resistive member 13, a third conductive member 23, and a third insulating member 18C. At least a portion of the third insulating member 18C is located between the third resistive member 13 and the third conductive member 23. A third gap g3 is provided between the third base region 41c and the third detection element 13E. The third detection element 13E has a third area S3 in the above-mentioned plane (XY plane). The third area S3 is different from the first area S1 and different from the second area S2.

[0114] For example, the first detection element 11E has a first length L1 in a direction intersecting the first direction (Z-axis direction). The second detection element 12E has a second length L2 in a direction intersecting the first direction. The third detection element 13E has a third length L3 in a direction intersecting the first direction. The second length L2 is different from the first length L1. The third length L3 is different from the first length L1 and different from the second length L2. In this example, the second length L2 is shorter than the first length L1. In this example, the third length L3 is shorter than the second length L2.

[0115] For example, by providing three or more detection elements with different heat dissipation characteristics, even when the number of types of substances (gases) contained in the space increases, the substances can be detected with high accuracy.

[0116] In the sensor 130, the third distance d3 in the first direction (Z-axis direction) between the third substrate region 41c and the third detection element 13E may be different from at least one of the first distance d1 (see FIG. 9) and the second distance d2 (see FIG. 9).

[0117] 19 and 20 are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. 19 and 20, the sensors 131 and 132 according to the embodiment further include a third detection unit 10C in addition to the first detection unit 10A and the second detection unit 10B. The remaining configuration of the sensors 131 and 132 may be the same as the configuration of the sensors according to the first or second embodiment.

[0118] In the sensors 131 and 132, the third detection unit 10C includes a third detection element 13E, a third support portion 33S, and a third connection portion 33C. The third support portion 33S is fixed to the base 41. The third connection portion 33C is supported by the third support portion 33S and supports the third detection element 13E. Gaps (e.g., third gap g3) are provided between the third base region 41c and the third connection portion 33C, and between the third base region 41c and the third detection element 13E. The third detection element 13E includes a third resistance member 13 and a third conductive member 23.

[0119] In sensors 131 and 132, the third connection portion 33C includes at least one of a third connection length LC3 that is different from the first connection length LC1 (see FIG. 11) and different from the second connection length LC2 (see FIG. 11), a third connection width w3 that is different from the first connection width w1 (see FIG. 11) and different from the second connection width w2 (see FIG. 11), a third connection thickness t3 that is different from the first connection thickness t1 (see FIG. 13) and different from the second connection thickness t2 (see FIG. 13), and a third connection material that is different from the first connection material and different from the second connection material. The third connection length LC3 is the length of the third connection portion 33C along the third connection path between the third support portion 33S and the third detection element 13E. The third connection width w3 is the width of the third connection portion 33C in a direction intersecting the third connection path. The third connection portion thickness t3 is the thickness of the third connection portion 33C in the first direction (Z-axis direction).

[0120] For example, the thermal resistance at the third connection portion 33C is different from the thermal resistance at the first connection portion 31C, and different from the thermal resistance at the second connection portion 32C.

[0121] In sensor 131, third connection length LC3 is different from first connection length LC1 and different from second connection length LC2. Third connection portion width w3 is different from first connection portion width w1 and different from second connection portion width w2. In sensor 131, third connection portion thickness t3 is different from first connection portion thickness t1 and different from second connection portion thickness t2.

[0122] In the sensors 131 and 132, the first other connection portion 31aC includes a first other connection length LCa1 (see FIG. 11), a first other connection width wa1 (see FIG. 11), a first other connection thickness ta1 (see FIG. 8), and a first other connection material. The first other connection length LCa1 is the length of the first other connection portion 31aC along the first other connection path between the first other support portion 31aS and the first detection element 11E. The first other connection width wa1 is the width of the first other connection portion 31aC in a direction intersecting the first other connection path. The first other connection thickness ta1 is the thickness of the first other connection portion 31aC in the first direction (Z-axis direction).

[0123] The second other connection portion 32aC includes at least one of a second other connection length LCa2 (see FIG. 11) different from the first other connection length LCa1, a second other connection width wa2 (see FIG. 11) different from the first other connection length wa1, a second other connection portion thickness ta2 (see FIG. 11) different from the first other connection portion thickness ta1, and a second other connection material different from the first other connection portion material. The second other connection length LCa2 is the length of the second other connection portion 32aC along the second other connection portion path between the second other support portion 32aS and the second detection element 12E. The second other connection portion width wa2 is the width of the second other connection portion 32aC in a direction intersecting with the second other connection portion path. The second other connection portion thickness ta2 is the thickness of the second other connection portion 32aC in the first direction (Z-axis direction).

[0124] In the sensors 131 and 132, the third other connection portion 33aC includes at least one of a third other connection length LCa3 that is different from the first other connection length LCa1 (see FIG. 11) and different from the second other connection length LCa2 (see FIG. 11), a third other connection portion width wa3 that is different from the first other connection portion width wa1 (see FIG. 11) and different from the second other connection portion width wa2 (see FIG. 11), a third other connection portion thickness ta3 that is different from the first other connection portion thickness ta1 (see FIG. 13) and different from the second other connection portion thickness ta2 (see FIG. 13), and a third other connection portion material that is different from the first other connection portion material and different from the second other connection portion material. The third other connection length LCa3 is the length of the third other connection portion 33aC along the third other connection portion path between the third other support portion 33aS and the third detection element 13E. The third other connection portion width wa3 is the width of the third other connection portion 33aC in a direction intersecting the third other connection portion path. The third other connection portion thickness ta3 is the thickness of the third other connection portion 33aC in the first direction (Z-axis direction).

[0125] For example, the thermal resistance at the third other connection portion 33aC is different from the thermal resistance at the first other connection portion 31aC, and different from the thermal resistance at the second other connection portion 32aC. For example, by providing three or more detection elements with different heat dissipation characteristics, even when the number of types of substances (gases) contained in the space increases, the substances can be detected with high accuracy.

[0126] As already described, in the embodiment, the space around the detection element may further include a third substance in addition to the first substance and the second substance. For example, the third substance may include at least one selected from the group consisting of nitrogen, air, carbon monoxide, and oxygen. The first substance may include, for example, one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride (SF6), and hydrogen. The second substance may include, for example, another selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride (SF6), and hydrogen.

[0127] These materials have different thermal conductivities, and in the embodiment, a characteristic based on a difference in heat dissipation characteristics caused by the difference in thermal conductivity of the materials is detected.

[0128] For example, the thermal conductivity at one temperature condition is as follows: The thermal conductivity of carbon dioxide is 14.5 mW / (m·K). The thermal conductivity of helium is 144.2 mW / (m·K). The thermal conductivity of methane is 30.4 mW / (m·K). The thermal conductivity of hydrogen is 167.5 mW / (m·K). The thermal conductivity of nitrogen is 24.1 mW / (m·K). The thermal conductivity of carbon monoxide is 23.3 mW / (m·K).

[0129] In embodiments, the first substance may include one selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, hydrogen, ammonia, and ethylene. In embodiments, the second substance may include another selected from the group consisting of carbon dioxide, helium, methane, chlorine, sulfur hexafluoride, hydrogen, ammonia, ethylene, and water. The second substance may include, for example, water vapor.

[0130] Fig. 21 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. As shown in Fig. 21, a sensor 135a according to the embodiment includes a first mounting member 56a. Other configurations of the sensor 135a may be similar to those of any of the sensors according to the first to third embodiments. As shown in Fig. 21, in the sensor 135a, the base 41 is fixed to the first mounting member 56a. The first mounting member 56a may be, for example, a printed circuit board.

[0131] FIG. 22 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. As shown in FIG. 22, a sensor 135b according to the embodiment includes a first housing 55a. The first housing 55a is, for example, a package. Other configurations of the sensor 135b may be similar to those of any of the sensors according to the first to third embodiments. As shown in FIG. 22, in the sensor 135b, the base 41, the first detection unit 10A, and the second detection unit 10B are provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a.

[0132] 22, a hole 55aH is provided in a part (for example, the lid) of the first housing 55a. A plurality of holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance (gas, etc.) to be detected.

[0133] 23(a) to 23(c) are schematic cross-sectional views illustrating the sensor system according to the first embodiment. 23(a), a structure including a base 41, a first detection unit 10A, and a second detection unit 10B is fixed to the bottom of a first housing 55a. For example, a terminal included in the first detection unit 10A and a terminal included in the second detection unit 10B are connected to an electrode 41E or the like provided on the base 41 by a connecting member (e.g., a bonding wire 50w or the like). The remaining configuration of the sensor 135c may be the same as the configuration of any of the sensors according to the first to third embodiments.

[0134] 23(b), a hole 55aH is provided in a part (for example, a lid) of the first housing 55a. A plurality of holes 55aH may be provided. The remaining configuration of the sensor 135d may be similar to that of the sensor 135c.

[0135] 23(c), a first housing 55a is fixed to a first mounting member 56a. The remaining configuration of the sensor 135e may be the same as that of the sensor 135c or the sensor 135d.

[0136] In the above sensors 135a to 135e, multiple detection units (such as the first detection unit 10A and the second detection unit 10B) are provided on one substrate 41. The multiple substrate regions (such as the first substrate region 41a and the second substrate region 41b) on the substrate 41 may be continuous with each other. The first detection unit 10A and the second detection unit 10B may be created simultaneously in one process. It is easy to control the thermal characteristics (such as thermal resistance or thermal conductivity) between the multiple detection units with high precision. Higher detection results are easy to obtain.

[0137] As will be explained below, in an embodiment, the second substrate region 41b may be separate from the first substrate region 41a.

[0138] FIG. 24 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. As shown in FIG. 24, a sensor 140a according to the embodiment includes a base 41, a first detection unit 10A, and a second detection unit 10B. The base 41 includes a first base region 41a and a second base region 41b. The first detection unit 10A includes a first support unit 31S, a first connection unit 31C, and a first detection element 11E. The position of the first detection unit 10A relative to the first base region 41a is fixed. The second detection unit 10B includes a second support unit 32S, a second connection unit 32C, and a second detection element 12E. The position of the second support unit 32S relative to the second base region 41b is fixed.

[0139] In the sensor 140a, the second substrate region 41b is separate from the first substrate region 41a. The sensor 140a may be considered to have a plurality of substrates 41. In this case, one of the plurality of substrates 41 may be considered to be the first substrate region 41a, and another of the plurality of substrates 41 may be considered to be the second substrate region 41b.

[0140] As already described, in sensor 140a, first detection unit 10A has first area S1 of first detection element 11E, first connection length LC1 of first connection portion 31C, first connection width w1 of first connection portion 31C, first connection thickness t1 of first connection portion 31C, first connection material of first connection portion 31C, and first distance d1, which is the distance between first base region 41a and first detection element 11E.

[0141] As already described, second detection unit 10B has at least one of: second area S2 of second detection element 12E that is different from first area S1; second connection length LC2 of second connection portion 32C that is different from first connection length LC1; second connection width w2 of second connection portion 32C that is different from first connection width w1; second connection thickness t2 of second connection portion 32C that is different from first connection thickness t1; second connection material of second connection portion 32C that is different from first connection material; and second distance d2 that is different from first distance d1. Second distance d2 is the distance between second base region 41b and second detection element 12E.

[0142] The sensor 140a can also detect the concentration of the detection target substance with higher accuracy, thereby providing a sensor with improved characteristics.

[0143] FIG. 25 is a schematic cross-sectional view illustrating a portion of the sensor system according to the first embodiment. As shown in FIG. 25, a sensor 140b according to the embodiment includes a first housing 55a. The first housing 55a is, for example, a package. The remaining configuration of the sensor 140b may be the same as that of the sensor 140a. As shown in FIG. 25, in the sensor 140b, the first detection unit 10A and the second detection unit 10B are provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a. As shown in FIG. 25, a hole 55aH is provided in a portion (for example, the lid) of the first housing 55a. Multiple holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance to be detected (such as a gas).

[0144] 26(a) and 26(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. 26(a), a sensor 140c according to the embodiment is provided with a first housing 55a and a second housing 55b. A first detection unit 10A is fixed to the first housing 55a. A second detection unit 10B is fixed to the second housing 55b. The first housing 55a and the second housing 55b are fixed to a first mounting member 56a.

[0145] In a sensor 140d according to the embodiment shown in FIG. 26(b), the first detection unit 10A is provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a. As shown in FIG. 26(b), a hole 55aH is provided in a portion of the first housing 55a (for example, the lid). Multiple holes 55aH may be provided. The hole 55aH serves as an inlet or outlet for the substance (such as a gas) to be detected.

[0146] As shown in FIG. 26(b), in sensor 140d, second detection unit 10B is provided between multiple portions of second housing 55b. The multiple portions are, for example, the bottom portion of second housing 55b and the lid portion of second housing 55b. As shown in FIG. 26(b), hole 55bH is provided in a portion of second housing 55b (for example, the lid portion). Multiple holes 55bH may be provided. Hole 55bH serves as an inlet or outlet for the substance to be detected (such as gas).

[0147] 27(a) and 27(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. In a sensor 140e according to the embodiment shown in Fig. 27(a), a first mounting member 56a and a second mounting member 56b are provided. The first detection unit 10A is fixed to a first housing 55a. The second detection unit 10B is fixed to a second housing 55b. The first housing 55a is fixed to the first mounting member 56a. The second housing 55b is fixed to the second mounting member 56b.

[0148] In a sensor 140f according to the embodiment shown in FIG. 27(b), the first detection unit 10A is provided between multiple portions of the first housing 55a. The multiple portions are, for example, the bottom of the first housing 55a and the lid of the first housing 55a. As shown in FIG. 27(b), a hole 55aH may be provided in a portion of the first housing 55a (for example, the lid). Multiple holes 55aH may be provided.

[0149] As shown in FIG. 27(b), in the sensor 140f, the second detection unit 10B is provided between multiple portions of the second housing 55b. The multiple portions are, for example, the bottom portion of the second housing 55b and the lid portion of the second housing 55b. As shown in FIG. 27(b), a hole 55bH may be provided in a portion of the second housing 55b (for example, the lid portion). Multiple holes 55bH may be provided.

[0150] 28(a) and 28(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. In a sensor 140g according to the embodiment shown in FIG. 28(a), the first base region 41a and the second base region 41b are fixed to a first mounting member 56a.

[0151] In a sensor 140h according to the embodiment shown in FIG. 28(b), a first detection unit 10A and a second detection unit 10B are provided between a first mounting member 56a and a first housing 55a.

[0152] 29(a) and 29(b) are schematic cross-sectional views illustrating a part of the sensor system according to the first embodiment. In a sensor 140i according to the embodiment shown in Fig. 29(a), the first base region 41a is fixed to a first mounting member 56a, and the second base region 41b is fixed to a second mounting member 56b.

[0153] 29(b), the first detector 10A is provided between the first mounting member 56a and the first housing 55a, and the second detector 10B is provided between the second mounting member 56b and the second housing 55b.

[0154] In the above sensors 140a to 140j, the configurations of the first support portion 31S, the first connection portion 31C, the first detection element 11E, the second support portion 32S, the second connection portion 32C, and the second detection element 12E can be the same as those described for sensors 110, 111, 120 to 122, 130 to 132, and 135a to 135e.

[0155] The above-described sensors 135a to 135e and sensors 140a to 140j may be provided with three or more detection units, which may include, for example, a first detection unit 10A, a second detection unit 10B, and a third detection unit 10C.

[0156] (Second embodiment) 30(a) to 30(c) are schematic views illustrating the gas system according to the second embodiment. 30(a), a gas system 310 according to an embodiment includes any one of the sensor systems 210 according to the first embodiment and a gas supply unit 80S. In the following, a case will be described in which the sensor system 210 includes a sensor 110. The gas supply unit 80S is capable of supplying a gas containing a detection target substance 88 to a pipe 80P.

[0157] In the gas system 310, the gas supply unit 80S includes an input unit 89I. A supply gas 89G is supplied to the input unit 89I. The gas supply unit 80S is capable of converting at least a portion of the supply gas 89G supplied to the gas supply unit 80S into at least a portion of a gas containing a detection target substance 88. In this example, the gas supply unit 80S is a gas conversion unit 80C.

[0158] For example, carbon dioxide is supplied to gas conversion unit 80C. In gas conversion unit 80C, for example, the following chemical reaction occurs. CO2+4H2→CH4+2H2O This chemical reaction produces a gas containing the target substance 88. In this case, the gas containing the target substance 88 contains methane and water. For example, the gas containing the target substance 88 may contain carbon dioxide. For example, the gas containing the target substance 88 may contain hydrogen. Thus, in one example, the gas containing the target substance 88 contains at least one selected from the group consisting of methane, water, carbon dioxide, and hydrogen.

[0159] In the gas converting section 80C, for example, the following chemical or electrochemical reactions may occur. CO2+H2O→CO+H2+O2 For example, a gas containing the detection target substance 88 is obtained. The gas containing the detection target substance 88 may contain carbon monoxide, hydrogen, and oxygen. The gas containing the detection target substance 88 may also contain carbon dioxide. The gas containing the detection target substance 88 may also contain hydrogen.

[0160] In this embodiment, the detection target substance 88 includes a first substance 88a and a second substance 88b that is different from the first substance 88a. For example, the first substance 88a includes one selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen. The second substance 88b includes another selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen.

[0161] The gas supply unit 80S can, for example, convert at least a portion of the raw material supplied to the gas supply unit 80S into at least a portion of a gas containing the detection target substance 88. Heat or electricity can be supplied to the gas conversion unit 80C from an external source. A catalyst can be disposed in the gas conversion unit 80C to cause a conversion reaction.

[0162] 30(b), in a gas system 311 according to the embodiment, a sensor system 210 includes a plurality of pipes 80P and a plurality of sensors 110. One of the plurality of sensors 110 is capable of detecting a detection target substance 88 in one of the plurality of pipes 80P. Another of the plurality of sensors 110 is capable of detecting a detection target substance 88 in another one of the plurality of pipes 80P.

[0163] In this example, one of the plurality of sensors 110 is provided in one of the plurality of pipes 80P, and another of the plurality of sensors 110 is provided in another of the plurality of pipes 80P.

[0164] In the gas system 311, the detection target substance 88 in one of the multiple pipes 80P includes a first substance 88a and a second substance 88b different from the first substance 88a. In one example, the first substance 88a includes one selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen. The second substance 88b includes another selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen.

[0165] The detection target substance 88 of another one of the plurality of pipes 80P includes a third substance 88c and a fourth substance 88d different from the third substance 88c. In one example, the third substance 88c includes one selected from the group consisting of oxygen and carbon dioxide. The fourth substance 88d includes another one selected from the group consisting of oxygen and carbon dioxide.

[0166] As shown in Figure 30(c), a gas system 312 according to the embodiment includes any one of the sensor systems 210 according to the first embodiment and a gas supply unit 80S. The gas supply unit 80S is capable of generating a gas containing a detection target substance 88 from a raw material 89M. The gas supply unit 80S is a gas generation unit 80G. The gas system 312 is, for example, a gas production system. The raw material 89M may include a gas, a liquid, or a solid.

[0167] The embodiment may include the following configurations (for example, technical solutions). (Configuration 1) Piping and At least one sensor capable of detecting a detection target substance in the piping; Equipped with The sensor a substrate; A first detection unit; A second detection unit; Including, the substrate includes a first substrate region and a second substrate region; the first detection unit includes a first support unit, a first connection unit, and a first detection element; the position of the first detection unit relative to the first substrate region is fixed; the first connection portion is supported by the first support portion, the first connection portion supports the first detection element; a first gap is provided between the first substrate region and the first detection element; the first detection portion has a first area of ​​the first detection element, a first connection length of the first connection portion, a first connection width of the first connection portion, a first connection thickness of the first connection portion, a first connection material of the first connection portion, and a first distance, the first distance being a distance between the first substrate region and the first detection element; the second detection unit includes a second support unit, a second connection unit, and a second detection element; the position of the second support portion relative to the second base region is fixed; the second connection portion is supported by the second support portion, the second connection portion supports the second detection element; a second gap is provided between the second substrate region and the second detection element; A sensor system in which the second detection portion has at least one of a second area of ​​the second detection element that is different from the first area, a second connection length of the second connection portion that is different from the first connection length, a second connection width of the second connection portion that is different from the first connection width, a second connection thickness of the second connection portion that is different from the first connection thickness, a second connection material of the second connection portion that is different from the first connection material, and a second distance that is different from the first distance, wherein the second distance is the distance between the second substrate region and the second detection element.

[0168] (Configuration 2) 2. The sensor system of claim 1, wherein the second substrate region is contiguous with the first substrate region.

[0169] (Configuration 3) 2. The sensor system of claim 1, wherein the second substrate region is spaced apart from the first substrate region.

[0170] (Configuration 4) 4. The sensor system according to any one of configurations 1 to 3, wherein the detection target substance includes a first substance and a second substance different from the first substance.

[0171] (Configuration 5) the first substance comprises one selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; the second substance comprises another member selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; 5. The sensor system of claim 4.

[0172] (Configuration 6) 6. The sensor system according to claim 4, wherein the substance to be detected is a gas.

[0173] (Configuration 7) the sensor includes a housing; at least a portion of the first detection unit and at least a portion of the second detection unit are provided between the base and the housing; the housing includes a first inlet and a first outlet; the detection target substance can flow from the first inlet into a space between a part of the housing and the first detection unit, and into a space between the part of the housing and the second detection unit, 7. The sensor system according to any one of configurations 1 to 6, wherein the detection target substance is able to exit to the outside through the first outlet.

[0174] (Configuration 8) the piping includes a first flow path and a second flow path branched from the first flow path, 8. The sensor system according to any one of configurations 1 to 7, wherein the sensor is provided in either the first flow path or the second flow path.

[0175] (Configuration 9) The piping is a first flow path including a first portion and a second portion; a second flow path branching from the first portion and connected to the second portion; Including, 8. The sensor system according to any one of configurations 1 to 7, wherein the sensor is provided in either the first flow path or the second flow path.

[0176] (Configuration 10) A plurality of said sensors are provided, 8. The sensor system according to any one of configurations 1 to 7, wherein at least one of the plurality of sensors is provided inside the piping.

[0177] (Configuration 11) A plurality of said sensors are provided, the piping includes a first flow path and a second flow path branched from the first flow path, 8. The sensor system according to any one of configurations 1 to 7, wherein at least two of the plurality of sensors are provided in the second flow path.

[0178] (Configuration 12) A plurality of said sensors are provided, The piping is a first flow path including a first portion, a second portion, a third portion, and a fourth portion; a second flow path branching from the first portion and connected to the second portion; a third flow path branching from the third portion and connected to the fourth portion; Including, At least one of the plurality of sensors is provided in the second flow path, 8. The sensor system according to any one of configurations 1 to 7, wherein another of the plurality of sensors is provided in the third flow path.

[0179] (Configuration 13) the first detection element includes a first resistive member, a first conductive member, and a first insulating member, and at least a portion of the first insulating member is located between the first resistive member and the first conductive member; The sensor system of configuration 4 or 5, wherein the second detection element includes a second resistive member, a second conductive member, and a second insulating member, and at least a portion of the second insulating member is between the second resistive member and the second conductive member.

[0180] (Configuration 14) The sensor further includes a controller; the control unit is electrically connectable to the first resistance member, the first conductive member, the second resistance member, and the second conductive member; The control unit is capable of performing a first operation, In the first operation, the control unit supplies a first current to the first conductive member to increase the temperature of the first detection element; In the first operation, the control unit supplies a second current to the second conductive member to increase the temperature of the second detection element; the control unit derives a first value corresponding to a first electrical resistance of the first resistance member in the first operation; the control unit derives a second value corresponding to a second electrical resistance of the second resistance member in the first operation; The sensor system of configuration 13, wherein the control unit is capable of outputting, in the first operation, a detection signal including a first detection value corresponding to the concentration of the first substance contained in the space around the first detection element and the second detection element, and a second detection value corresponding to the concentration of the second substance contained in the space, based on the first value and the second value.

[0181] (Configuration 15) A plurality of the pipes; A plurality of said sensors; is established, one of the plurality of sensors is capable of detecting the detection target substance in one of the plurality of pipes; 4. The sensor system according to any one of configurations 1 to 3, wherein another one of the plurality of sensors is capable of detecting the detection target in another one of the plurality of pipes.

[0182] (Configuration 16) the detection target substance in one of the plurality of pipes includes a first substance and a second substance different from the first substance; the first substance comprises one selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; the second substance comprises another member selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; the detection target substance of the other one of the plurality of pipes includes a third substance and a fourth substance different from the third substance; the third substance comprises one selected from the group consisting of oxygen and carbon dioxide; 16. The sensor system of claim 15, wherein the fourth substance includes another selected from the group consisting of oxygen and carbon dioxide.

[0183] (Configuration 17) The sensor system according to any one of configurations 1 to 16, a gas supply unit capable of supplying a gas containing the detection target substance to the piping; Gas system with.

[0184] (Configuration 18) 18. The gas system according to claim 17, wherein the gas supply unit is capable of converting at least a portion of the supply gas supplied to the gas supply unit into at least a portion of the gas containing the target substance.

[0185] (Configuration 19) 18. The gas system according to claim 17, wherein the gas supply unit is capable of converting at least a portion of the raw material supplied to the gas supply unit into at least a portion of the gas containing the detection target substance.

[0186] (Configuration 20) 18. The gas system according to claim 17, wherein the gas supply unit is capable of generating the gas containing the detection target substance from a raw material.

[0187] According to the embodiment, it is possible to provide a sensor system and a gas system that can improve characteristics.

[0188] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of the elements included in the sensor system, such as the piping, sensor, substrate, detection unit, and control unit, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0189] Furthermore, any combination of two or more elements of each specific example within the scope of technical feasibility is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0190] In addition, all sensor systems and gas systems that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensor system and gas system described above as embodiments of the present invention also fall within the scope of the present invention, as long as they include the gist of the present invention.

[0191] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0192] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0193] 10A to 10C...first to third detection portions, 11 to 13...first to third resistance members, 11E to 13E...first to third detection elements, 15a to 15d...first to fourth layers, 16...resistance element, 16a, 16b...resistor, 18A to 18C...first to third insulating members, 21 to 23...first to third conductive members, 31C to 33C...first to third connection portions, 31S to 33S...first to third support portions, 31aC to 33aC...first to third other connection portions, 31aS to 33aS...first to third other support portions, 31bC, 31cC, 32bC, 32cC...connection portions, 31bS, 31cS, 32bS, 32cS...support portions, 41...base, 41A, 41B...first and second substrates, 41E...electrode, 41a-41c...first to third substrate regions, 41i, 41iA, 41iB...insulating film, 41s, 41sA, 41sB...substrate, 50w...bonding wire, 55a, 55b...first and second housings, 55aH, 55bH...holes, 56a, 56b...first and second mounting members, 70...control unit, 70s...detection signal, 71...differential circuit, 71a, 71b...first and second differential circuits, 72...constant current source, 75...processing unit, 76...storage unit, 80C...gas conversion unit, 80G...gas generation unit, 80P...piping, 80S...gas supply unit, 81-83...first to third flow paths, 81A to 81D...first to fourth portions, 81d...recess, 88 detection target substance, 88I...inlet, 88O...outlet, 88a to 88d...first to fourth substances, 89G...supply gas, 89I...input portion, 89M...raw material, 110, 111, 120 to 122, 130 to 132, 135a to 135e, 140a to 140j...sensors, 210, 210a to 210d, 211a to 211d...sensor system, 310 to 312...gas system, Cg1...concentration, GND...ground, L1 to L3...first to third lengths, LC1 to LC3...first to third connection lengths, LCa1 to LCa3...first to third other connection lengths, S1 to S3...first to third areas, Sg0, Sg1...signal value, d1-d3...first to third distances, g1-g3...first to third gaps, i01, i02...first and second information, i1, i2...first and second currents, t1-t3...first to third connection thicknesses, ta1-ta3...first to third other connection thicknesses, va1, va2...first and second values, w1-w3...first to third connection widths, wa1-wa3...first to third other connection widths

Claims

1. Piping and At least one sensor capable of detecting a detection target substance in the piping; Equipped with The sensor a substrate; A first detection unit; A second detection unit; Including, the substrate includes a first substrate region and a second substrate region; the first detection unit includes a first support unit, a first connection unit, and a first detection element; the position of the first detection unit relative to the first substrate region is fixed; the first connection portion is supported by the first support portion, the first connection portion supports the first detection element; a first gap is provided between the first substrate region and the first detection element; the first detection portion has a first area of ​​the first detection element, a first connection length of the first connection portion, a first connection width of the first connection portion, a first connection thickness of the first connection portion, a first connection material of the first connection portion, and a first distance, the first distance being a distance between the first base region and the first detection element; the second detection unit includes a second support unit, a second connection unit, and a second detection element; the position of the second support portion relative to the second base region is fixed; the second connection portion is supported by the second support portion, the second connection portion supports the second detection element; a second gap is provided between the second substrate region and the second detection element; the second detection portion has at least one of a second area of ​​the second detection element that is different from the first area, a second connection length of the second connection portion that is different from the first connection length, a second connection width of the second connection portion that is different from the first connection width, a second connection thickness of the second connection portion that is different from the first connection thickness, a second connection material of the second connection portion that is different from the first connection material, and a second distance that is different from the first distance, wherein the second distance is a distance between the second base region and the second detection element, the detection target substance includes a first substance and a second substance different from the first substance, the first detection element includes a first resistive member, a first conductive member, and a first insulating member, and at least a portion of the first insulating member is located between the first resistive member and the first conductive member; The second sensing element includes a second resistive member, a second conductive member, and a second insulating member, and at least a portion of the second insulating member is between the second resistive member and the second conductive member.

2. The sensor further includes a controller; the control unit is electrically connectable to the first resistance member, the first conductive member, the second resistance member, and the second conductive member; The control unit is capable of performing a first operation, In the first operation, the control unit supplies a first current to the first conductive member to increase the temperature of the first detection element; In the first operation, the control unit supplies a second current to the second conductive member to increase the temperature of the second detection element; the control unit derives a first value corresponding to a first electrical resistance of the first resistance member in the first operation; the control unit derives a second value corresponding to a second electrical resistance of the second resistance member in the first operation; 2. The sensor system of claim 1, wherein the control unit is capable of outputting, in the first operation, a detection signal including a first detection value corresponding to the concentration of the first substance contained in the space around the first detection element and the second detection element, and a second detection value corresponding to the concentration of the second substance contained in the space, based on the first value and the second value.

3. the first substance comprises one selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; the second substance comprises another member selected from the group consisting of carbon monoxide, carbon dioxide, and hydrogen; The sensor system of claim 1 .

4. the sensor includes a housing; at least a portion of the first detection unit and at least a portion of the second detection unit are provided between the base and the housing; the housing includes a first inlet and a first outlet; the detection target substance can flow from the first inlet into a space between a part of the housing and the first detection unit, and into a space between the part of the housing and the second detection unit, The sensor system according to claim 1 , wherein the detection target substance is able to exit to the outside through the first outlet.

5. The piping is a first flow path including a first portion and a second portion; a second flow path branching from the first portion and connected to the second portion; Including, The sensor system according to claim 1 , wherein the sensor is provided in either the first flow path or the second flow path.

6. A plurality of said sensors are provided, The piping is a first flow path including a first portion, a second portion, a third portion, and a fourth portion; a second flow path branching from the first portion and connected to the second portion; a third flow path branching from the third portion and connected to the fourth portion; Including, At least one of the plurality of sensors is provided in the second flow path, The sensor system according to claim 1 , wherein another one of the plurality of sensors is provided in the third flow path.

7. A sensor system according to any one of claims 1 to 6; a gas supply unit capable of supplying a gas containing the detection target substance to the piping; Gas system with.

8. The gas system according to claim 7 , wherein the gas supply unit is capable of converting at least a portion of the supply gas supplied to the gas supply unit into at least a portion of the gas containing the detection target substance.

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