Array substrate, manufacturing method thereof, and display device

Abstract

To disclose an array substrate and manufacturing method of the array substrate, a display device.SOLUTION: In an array substrate, an organic material layer (02) includes: a first plane portion (021); a folded portion (022); and a second plane portion (023), which are connected sequentially. The first plane portion (021) and second plane portion (023) are arranged on both sides of a base substrate (01), and a lead structure (03) includes: a first lead portion (031); a folding lead portion (032); and a second lead portion (033), which are connected sequentially. The first lead portion (031) is arranged on an outer side of the first plane portion (021), the folding lead portion (032) is arranged outside the folded portion (022), the second lead portion (033) is arranged outside the second plane portion (023). An LED layer (04) and a control circuit (05) are arranged on both sides of the base substrate (01).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This application is a divisional application of Japanese Patent Application No. 2021-568080, and claims priority to a Chinese patent application filed on November 8, 2019, application number PCT / CN2019 / 116824, entitled "Array substrate and manufacturing method thereof, display panel, and display device," the entire contents of which are incorporated herein by reference.

[0002] The present application relates to an array substrate, a manufacturing method thereof, and a display device. [Background technology]

[0003] 2. Description of the Related Art With the development of display technology, bonded light emitting diode (LED) display devices have become widely used, which include multiple bonded LED array substrates and have a larger display area.

[0004] However, there are wide slits between each of the bonded LED array substrates, which affects the display effect of the LED display device. Summary of the Invention [Means for solving the problem]

[0005] The embodiments of the present application provide an array substrate, a manufacturing method thereof, and a display device.

[0006] According to a first aspect, a light emitting diode (LED) device includes a base substrate, an organic material layer, a lead structure, an LED layer, and a control circuit, the base substrate includes first and second opposing sides and a third side adjacent to the first and second sides, respectively; the organic material layer includes a first plane portion, a bent portion, and a second plane portion connected in sequence, the first plane portion being disposed on the first side, the second plane portion being disposed on the second side, and the bent portion being disposed on the third side; the lead structure includes a first lead portion, a bent lead portion, and a second lead portion connected in sequence, the first lead portion being disposed on a side of the first plane portion away from the base substrate, the bent lead portion being disposed on a side of the bent portion away from the base substrate, and the second lead portion being disposed on a side of the second plane portion away from the base substrate; the LED layer is disposed on a side of the first lead portion away from the base substrate and is connected to the first lead portion; the control circuit is disposed on a second side of the base substrate and connected to the second lead portion, the control circuit being used to control the LED layer to emit light; This relates to an array substrate.

[0007] In some embodiments, the connection between the second side and the third side includes a chamfered structure.

[0008] In some embodiments, the array substrate satisfies at least one of the following conditions: b ≥ 0.6a, b <p / 2、 2a represents the length of any one of the plurality of LEDs in the extension direction of the base substrate, b represents the distance between the LED among the plurality of LEDs closest to the bending portion and the bending portion, and the distance between the centers of any two LEDs among the plurality of LEDs is P.

[0009] In some embodiments, the surface of the bent lead has a recessed area.

[0010] In some embodiments, the array substrate further includes a first spacer structure disposed between the base substrate and the folding portion.

[0011] In some embodiments, the first spacer structure has adhesive properties.

[0012] In some embodiments, the surface of the first spacer structure facing away from the base substrate comprises an arcuate surface.

[0013] In some embodiments, the arc surface is a semicircular arc surface, and a maximum length of the first spacer structure in an arrangement direction of the base substrate and the first spacer structure is greater than a radius of the semicircular arc surface.

[0014] In some embodiments, the surface of the first spacer structure remote from the base substrate includes n first arcuate surfaces, a plane, and n second arcuate surfaces connected in sequence, where n≧1.

[0015] In some embodiments, n=1 and the radius of the first arcuate surface is equal to the radius of the second arcuate surface.

[0016] In some embodiments, n>1, the radii of the n first arc surfaces are different from each other, the radius of the i-th first arc surface is equal to the radius of the n-i+1-th second arc surface, and 1≦i≦n.

[0017] In some embodiments, the array substrate further includes a second spacer structure disposed between the base substrate and the second plane portion, the second spacer structure being connected to the first spacer structure.

[0018] In some embodiments, the side of the first spacer structure closer to the second spacer structure is located on the extending plane of the third side, and the side of the second spacer structure closer to the first spacer structure is located on the extending plane of the third side.

[0019] In some embodiments, the array substrate further includes a binding substrate disposed between the base substrate and the second plane portion.

[0020] In some embodiments, the material of the base substrate is the same as the material of the binding substrate, and the thickness of the base substrate is the same as the thickness of the binding substrate.

[0021] In some embodiments, the array substrate further includes a light-reflecting layer disposed between the base substrate and the first plane portion.

[0022] In some embodiments, the distance between the light reflecting layer and the fold is greater than zero.

[0023] According to a second aspect, there is provided a method for manufacturing any one of the array substrates according to the first aspect, comprising: forming an initial structure; moving the control circuitry from a first side of the base substrate to a second side of the base substrate by bending the organic material layer and the lead structure; Including, the initial structure includes a base substrate, an organic material layer, a lead structure, an LED layer, and a control circuit, the base substrate including opposing first and second sides and a third side adjacent to the first and second sides, the organic material layer, the lead structure, and the LED layer are all disposed on the first side of the base substrate and sequentially disposed along a direction away from the base substrate, the control circuit and the LED layer are disposed in the same layer, an orthogonal projection of the organic material layer onto the surface on which the base substrate is disposed partially overlaps with an orthogonal projection of the base substrate onto the surface on which the base substrate is disposed, the lead structure covers the side of the organic material layer away from the base substrate, and is connected to both the LED layer and the control circuit, the folded organic material layer includes a first plane portion, a folded portion, and a second plane portion connected in sequence, the first plane portion being disposed on a first side of the base substrate, the second plane portion being disposed on a second side of the base substrate, and the folded portion being disposed on the third side; the folded lead structure includes a first lead portion, a folded lead portion, and a second lead portion connected in sequence, the first lead portion being disposed on a side of the first plane portion remote from the base substrate and connected to the LED layer, the folded lead portion being disposed on a side of the folded portion remote from the base substrate, and the second lead portion being disposed on a side of the second plane portion remote from the base substrate and connected to the control circuit; The present invention relates to a method for manufacturing an array substrate.

[0024] In some embodiments, forming the initial structure comprises: forming an initial substrate, the organic material layer, the lead structure, and the LED layer, which are sequentially stacked; connecting control circuitry to the lead structure on a side of the lead structure remote from the initial substrate; removing a region of the initial substrate to obtain the initial structure; Including, an orthogonal projection of the organic material layer onto the surface on which the initial substrate is disposed is within an orthogonal projection of the initial substrate onto the surface on which the initial substrate is disposed, the organic material layer covers a side away from the initial substrate, and is connected to the LED layer; The orthogonal projection of the partial region onto the surface on which the initial substrate is disposed is outside the orthogonal projection of the LED layer onto the surface on which the initial substrate is disposed.

[0025] In some embodiments, the initial structure further comprises a binding substrate spaced apart from the base substrate; Both ends of the organic material layer are bonded to the base substrate and the binding substrate, respectively, and after the organic material layer and the lead structure are bent, the binding substrate is between the base substrate and the second plane portion.

[0026] In some embodiments, the initial structure further comprises a light-reflecting layer disposed between the base substrate and the organic material layer; forming the initial structure further includes forming the light-reflecting layer on the initial substrate before forming an organic material layer on the initial substrate, wherein an orthogonal projection of the light-reflecting layer onto the surface on which the initial substrate is disposed is outside an orthogonal projection of the partial region onto the surface on which the initial substrate is disposed; Removing a region of the initial substrate includes: irradiating the initial substrate with a laser from a side of the initial substrate away from the light reflecting layer to separate the partial region from the organic material layer; cutting an edge of the partial region on the initial substrate; peeling off the partial region; Includes.

[0027] In some embodiments, forming the initial structure further includes forming a release layer on the initial substrate before forming the organic material layer on the initial substrate, wherein an orthogonal projection of the partial region onto a surface on which the initial substrate is disposed is within an orthogonal projection of the release layer onto the surface on which the initial substrate is disposed, and a viscosity between the release layer and the organic material layer is smaller than a viscosity between the initial substrate and the organic material layer; Removing a region of the initial substrate includes: cutting an edge of the partial region on the initial substrate; peeling off the partial region and a portion of the release layer covering the partial region; Includes.

[0028] According to a third aspect, the present invention relates to a display device including the array substrate according to any one of the first aspects.

[0029] In some embodiments, the display device comprises a plurality of the array substrates bonded together.

[0030] In some embodiments, the LED layer of the array substrate includes a plurality of LEDs arranged on the first plane portion, and a distance between the centers of any two LEDs among the plurality of LEDs is P; For any two adjacent array substrates in the display device, the distance between the centers of the two nearest LEDs is Q, and P=Q. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure; [Figure 2] FIG. 2 is a schematic structural diagram of a base substrate according to an embodiment of the present disclosure. [Figure 3] 1A-1C are schematic diagrams of different examples of topographical structures of organic material layers according to embodiments of the present disclosure. [Figure 4] 1A-1C are schematic diagrams of different examples of topographical structures of organic material layers according to embodiments of the present disclosure. [Figure 5] 1A-1C are schematic diagrams of different examples of topographical structures of organic material layers according to embodiments of the present disclosure. [Figure 6] 1A-1C are schematic diagrams of different examples of topographical structures of organic material layers according to embodiments of the present disclosure. [Figure 7] 10A-10C are schematic exploded views of different embodiments of bent lead portions and bent portions according to embodiments of the present disclosure. [Figure 8] 10A-10C are schematic exploded views of different embodiments of bent lead portions and bent portions according to embodiments of the present disclosure. [Figure 9] FIG. 2 is a schematic diagram of multiple LEDs in an LED layer according to an embodiment of the present disclosure. [Figure 10] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 11] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 12] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 13]1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 14] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 15] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 16] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 17] 1A and 1B are schematic development views of different embodiments of partial structures of an array substrate according to an embodiment of the present disclosure. [Figure 18] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 19] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 20] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 21] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 22] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 23] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 24] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 25] 3A-3C are schematic diagrams of different embodiments of first spacer structures according to embodiments of the present disclosure. [Figure 26] 3A to 3C are schematic structural diagrams of different embodiments of array substrates according to embodiments of the present disclosure; [Figure 27] 3A to 3C are schematic structural diagrams of different embodiments of array substrates according to embodiments of the present disclosure; [Figure 28] 3A to 3C are schematic structural diagrams of different embodiments of array substrates according to embodiments of the present disclosure; [Figure 29] 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure; [Figure 30] 3A to 3C are schematic diagrams of bonding portions of any two array substrates in different embodiments in a display device according to an embodiment of the present disclosure. [Figure 31] 3A to 3C are schematic diagrams of bonding portions of any two array substrates in different embodiments in a display device according to an embodiment of the present disclosure. [Figure 32] 3A to 3C are schematic diagrams of bonding portions of any two array substrates in different embodiments in a display device according to an embodiment of the present disclosure. [Figure 33] 3A to 3C are schematic diagrams of bonding portions of any two array substrates in different embodiments in a display device according to an embodiment of the present disclosure. [Figure 34] 3A to 3C are schematic diagrams of bonding portions of any two array substrates in different embodiments in a display device according to an embodiment of the present disclosure. [Figure 35] 1 is a flowchart of a method for manufacturing an array substrate according to an embodiment of the present disclosure. [Figure 36] 10 is a flowchart of another method for manufacturing an array substrate according to an embodiment of the present disclosure. [Figure 37] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 38] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 39] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 40] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 41] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 42] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 43] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 44] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 45]1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 46] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 47] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 48] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 49] 1A-1C are schematic diagrams illustrating a manufacturing process for an array substrate according to an embodiment of the present disclosure. [Figure 50] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 51] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 52] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 53] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 54] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 55] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 56] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. [Figure 57] 1A-1C are schematic diagrams of initial structures in different embodiments according to embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0032] In order to make the principles, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in more detail below with reference to the drawings.

[0033] In the related art, in an LED display device constructed by joining multiple LED array substrates, the frame of each LED array substrate is wide, which results in the formation of slits visible to the human eye in the LED display device, affecting the display effect of the LED display device. The embodiments of the present disclosure provide an array substrate that solves the problem of wide slits for joining LED display devices by reducing the frame of at least each LED array substrate.

[0034] FIG. 1 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure. As shown in FIG. 1, the array substrate 0 includes a base substrate 01, an organic material layer 02, a lead structure 03, an LED layer 04, and a control circuit 05.

[0035] The base substrate 01 includes a first side X1 and a second side X2 that face each other, and a third side X3 that is adjacent to the first side X1 and the second side X2.

[0036] The organic material layer 02 includes a first plane portion 021, a bent portion 022, and a second plane portion 023, which are connected in sequence. Here, the first plane portion 021 is disposed on a first side X1 of the base substrate 01, the second plane portion 023 is disposed on a second side X2 of the base substrate 01, and the bent portion 022 is disposed on a third side X3.

[0037] The lead structure 03 includes a first lead portion 031, a bent lead portion 032, and a second lead portion 033, which are connected in sequence. Here, the first lead portion 031 is arranged on the side of the first flat portion 021 that is farther from the base substrate 01, the bent lead portion 032 is arranged on the side of the bent portion 022 that is farther from the base substrate 01, and the second lead portion 033 is arranged on the side of the second flat portion 023 that is farther from the base substrate 01.

[0038] The LED layer 04 is disposed on the side of the first lead portion 031 away from the base substrate 01 and is connected to the first lead portion 031 .

[0039] The control circuit 05 is disposed on the second side X2 of the base substrate 01 and connected to the second lead portion 033, and the control circuit 05 is used to control the LED layer 04 to emit light.

[0040] In view of the above, in the array substrate according to the embodiment of the present disclosure, by bending the organic material layer and the lead structure to the second side of the base substrate, the lead structure is bound to the control circuit on the side (second side) opposite to the side (first side) where the LED layer is arranged. As a result, the problem of the array substrate becoming wider due to the binding of the lead structure and the control circuit on the side (first side) where the LED layer is arranged is avoided. When joining multiple display substrates, the gap between the display substrates can be effectively reduced.

[0041] In some embodiments, the material of the base substrate 01 may include a rigid material such as glass, or a flexible material with a certain strength such as polyethylene terephthalate (PET) or metal. In the embodiments of the present disclosure, the material of the base substrate 01 is taken as a rigid material, and in this case, the base substrate 01 is a rigid substrate.

[0042] 2 is a schematic structural diagram of a base substrate according to an embodiment of the present disclosure. As shown in FIG. 2, based on FIG. 1, the base substrate 01 includes a first side X1 and a third side X3 adjacent to the second side X2, respectively, and the connection portion between the surface of the second side X2 and the surface of the third side X3 may include a chamfered structure 011. Under the effect of the chamfered structure 011, when the organic material layer 02 is bent from the first side X1 to the second side X2, the organic material layer 02 can be reduced in possibility of being damaged by the right angle of the base substrate 01, and the organic material layer 02 can be protected.

[0043] The material of the organic material layer 02 may be any flexible material, such as polyimide (PI). The thickness of the organic material layer 02 may be in the range of 5 micrometers to 10 micrometers, or in other ranges such as 2 micrometers to 11 micrometers. The material of the lead structure 03 may be any conductive material, such as copper or iron.

[0044] In any array substrate according to the embodiments of the present disclosure, the organic material layer 02 may include one first planar portion 021, m folded portions 022, and m second planar portions 023. When the base substrate 01 is polygonal, m≧1. FIG. 1 shows an example where m=2. When m>2, the m folded portions 022 are respectively disposed on different third sides X3 of the base substrate 01, and the m second planar portions 023 are all disposed on the second side X2 of the base substrate 01. The entire surface of the first planar portion 021 is located on the first side X1 of the base substrate 01, and the first planar portion 021 is sequentially connected to the ith second planar portion 023 in an integral structure via the ith folded portion 022, where 1≦i≦m.

[0045] The lead structure 03 includes n first lead portions 031, n bent lead portions 032, and n second lead portions 033, and the jth first lead portion 031 is connected to the jth second lead portion 031 via the jth second lead portion 033, where 1≦j≦n. All of the n first lead portions 031 may be arranged on the first flat portion 021, and all of the n bent lead portions 032 may be arranged on the same bent portion 022, or the bent lead portions 032 may be grouped and the same or different numbers of bent lead portions 032 may be arranged on multiple bent portions 022, respectively. All of the n second lead portions 031 may be arranged on the same second flat portion 023, or the second lead portions 031 may be grouped and the same or different numbers of second lead portions 031 may be arranged on multiple second flat portions 023, respectively.

[0046] Here, the n first lead portions 031 include all or part of a set of signal lines such as power lines, drive lines, data lines, and fan-out wiring. The lead structure 03 is used to connect each LED in the LED layer to a control circuit, and transmits electrical signals from the control circuit to each LED with high quality to cause the LED to emit light. In some embodiments, the first lead portions further include connection electrodes directly contacting and electrically connected to each LED.

[0047] Furthermore, the surface of one bent portion 022 away from the base substrate 01 and the surface of one or more bent lead portions 032 disposed thereon away from the base substrate 01 are conformal. The fact that at least two surfaces are conformal means that the extension direction and undulation form of these at least two surfaces are the same or similar.

[0048] 3, 4, 5, and 6 are schematic diagrams of different local structures of the organic material layer 02. In FIGS. 3, 4, 5, and 6, only the first planar portion 021 and the bent portion 022 of the organic material layer 02 are shown, and the second planar portion 023 is not shown. In FIGS. 3, 4, 5, and 6, the position of the bent portion 022 relative to the first planar portion 021 may be adjusted to match the shape of the base substrate. Here, in FIG. 3, m=1 is taken as an example, in FIG. 4, m=2 is taken as an example, in FIG. 5, m=3 is taken as an example, and in FIG. 6, m=4 is taken as an example. In some embodiments, when the plane on which the base substrate is disposed is pentagonal, the first planar portion 021 is also pentagonal, and m=5. Alternatively, when the plane on which the base substrate is disposed is hexagonal, the first planar portion 021 is also hexagonal, and m=6. When m=1, the bent portion 022 does not have to be located on the right side of the first flat portion 021 as shown in FIG. 3 . For example, the bent portion 022 may be located on any side other than the right side of the first flat portion 021. When m=2, the two bent portions 022 do not have to be located on the left and right sides of the first flat portion 021 as shown in FIG. 4 . For example, one of the two bent portions 022 is located on the upper side of the first flat portion 021, and the other is located on the right side of the first flat portion 021. When m=3, the three bent portions 022 do not have to be located on the left, right, and upper sides of the first flat portion 021 as shown in FIG. 5 . For example, the three bent portions 022 are located on the left, right, and lower sides of the first flat portion 021, respectively. In the embodiment of the present disclosure, the first flat portion 021 of the organic material layer is rectangular. However, the first flat portion 021 may have a shape other than a rectangle, such as a circle, an ellipse, or a triangle. Please refer to FIG. 4 for a schematic development view of the organic material layer 02 in FIG.

[0049] In some embodiments, the embodiments of the present disclosure may provide a recessed region on the surface of the bent lead 032 to improve the surface tension of the bent lead and reduce the risk of the bent lead breaking during the bending process. For illustrative purposes, the embodiments of the present disclosure take the case where the surface of the bent lead 032 that is far from the base substrate 01 has the recessed region. Of course, the embodiments of the present disclosure are not limited to the case where the surface of the bent lead 032 that is close to the base substrate 01 has the recessed region, or where both the surface of the bent lead 032 that is close to the base substrate 01 and the surface that is far from the base substrate 01 have the recessed region.

[0050] 7 shows a schematic development view of the bent lead portion and the bent portion of any array substrate according to the embodiments of the present disclosure. As shown in FIG. 7, a first recessed region 0321 can be formed on the surface of the bent lead portion 032 away from the base substrate by digging a groove and / or providing a protrusion in the surface of the bent lead portion 032 away from the base substrate, and the area of ​​the surface of the bent lead portion 032 away from the base substrate other than the first recessed region 0321 is a first protrusion region 0322. Here, for a position of the first recessed region 0321 of the bent lead portion 032, the minimum distance between the surface of the bent lead portion 032 away from the base substrate and the surface close to the base substrate is Y1, and for a position of the first protrusion region 0322 of the bent lead portion 032, the distance between the surface of the bent lead portion 032 away from the base substrate and the surface close to the base substrate is Y2, where Y1 is smaller than Y2. In the embodiment of the present disclosure, the recessed area (e.g., the first recessed area) in the bent lead portion 032 is formed by forming a groove in the bent lead portion. When forming the groove, an exposure and dry etching process can be used.

[0051] Also, for example, for any array substrate according to the embodiments of the present disclosure, Fig. 8 shows another schematic development view of the bent lead portion and the bent portion. As shown in Fig. 8, a second recessed region 0221 can be formed on the surface of the bent portion 022 away from the base substrate by digging a groove and / or providing a protrusion in the surface of the bent portion 022 away from the base substrate, and the area of ​​the surface of the bent portion 022 away from the base substrate other than the second recessed region 0221 is the second protrusion region 0222. Under the action of the second recessed region 0221 in the bent portion 022, the surface of the bent lead portion 032 away from the base substrate has a first recessed region 0321, and the area of ​​the surface of the bent lead portion 032 away from the base substrate other than the first recessed region 0321 is the first protrusion region 0322.

[0052] Here, for the position where the first recessed region 0321 of the bent lead 032 is arranged, the minimum distance between the surface of the bent lead 032 far from the base substrate and the surface close to the base substrate is Y1, and for the position where the first protrusion region 0322 of the bent lead 032 is arranged, the distance between the surface of the bent lead 032 far from the base substrate and the surface close to the base substrate is Y2, and Y1 is equal to Y2. For the position where the second recessed region 0221 of the bent portion 022 is arranged, the minimum distance between the surface of the bent portion 022 far from the base substrate and the surface close to the base substrate is Y3, and for the position where the second protrusion region 0222 of the bent portion 022 is arranged, the distance between the surface of the bent portion 022 far from the base substrate and the surface close to the base substrate is Y4, and Y3 is smaller than Y4.

[0053] The second recessed region in the embodiment of the present disclosure is formed by forming a groove in the bent portion, which may be formed by an exposure and dry etching process.

[0054] In some embodiments, the shape of any of the recessed regions described above may be any shape, such as a V-shape, a U-shape, or a trapezoid, and the embodiments of the present disclosure are not limited thereto.

[0055] In some embodiments, in any array substrate according to the embodiments of the present disclosure, the LED layer may include a plurality of LEDs. The LED may be an ordinary LED or a micro-LED. Here, the size of the micro-LED is smaller than that of the ordinary LED. Exemplarily, the minimum size of the micro-LED can reach the micrometer level. The micro-LEDs in the embodiments of the present invention may include micro light-emitting diodes (Micro Light Emitting Diode, Micro LED) or mini light-emitting diodes (mini Light Emitting Diode, mini-LED). The LEDs in the LED layer can be fixed to a flexible substrate provided with connection electrodes in any manner, such as a reflow method or an eutectic welding method.

[0056] Exemplarily, for any array substrate according to the embodiments of the present disclosure, FIG. 9 is a schematic diagram of a plurality of LEDs 041 in the LED layer 04. As shown in FIG. 9, these LEDs 041 are all arranged on the side away from the base substrate 01 of the first lead portion 031. The length of any one of the LEDs 041 in the extending direction D is represented as 2a, and the distance between the centers of any two of the plurality of LEDs 041 is represented as P. The distance between the LED 041 close to the bending portion and the bending portion 022 (not shown in FIG. 9, see FIG. 1) among the plurality of LEDs 041 is represented as b. The array substrate satisfies at least one of the conditions of b≧0.6a and b<p / 2. For example, the array substrate satisfies b≧0.6a, or b<p / 2, or b≧0.6a and b<p / 2. Tests have demonstrated that when b≧0.6a, the light-emitting effect of the LED 041 is good and the display effect of the LED layer 04 is good. When b<p / 2, the bonding effect between the array substrates is good and the display effect of the display device formed by bonding a plurality of array substrates is good.

[0057] In some embodiments, the array substrate according to the embodiments of the present disclosure may further include a black rubber (e.g., 06 in FIG. 1 ). The black rubber is filled between the LEDs and is used to enhance the contrast of each LED. The black rubber may slightly cover the side of the LED away from the base substrate, and at least a portion of the light emitted from the LED passes through the black rubber, although the embodiments of the present disclosure are not limited thereto.

[0058] In some embodiments, the control circuit according to the embodiments of the present disclosure may be any control circuit, of which eight types will be described below as examples.

[0059] 1 and 2, the control circuit 05 includes an FPC 051 and a printed circuit board (PCB) 052. The FPC 051 is disposed on a side of the lead structure (e.g., the second lead portion 033 of the lead structure) away from the base substrate 01, and is connected to both the second lead portion 033 and the PCB 052. The PCB 052 may be disposed on either side of the FPC 051. In the embodiment of the present disclosure, the PCB 052 and the second lead portion 033 are disposed on the same side of the FPC 051.

[0060] 11 is a schematic development view of a partial structure of an array substrate according to an embodiment of the present disclosure, and as shown in Fig. 11, based on Fig. 10, the control circuit 05 includes an FPC 051 but does not include a PCB 052. Here, the FPC 051 is arranged on the side of the second lead portion 033 away from the base substrate 01 and is connected to the second lead portion 033.

[0061] (3) FIG. 12 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 12, based on FIG. 10, the control circuit 05 includes not only an FPC 051 and a PCB 052, but also a chip 053. Here, the FPC 051 is disposed on the side of the second lead portion 033 away from the base substrate 01 and is connected to both the second lead portion 033 and the PCB 052. The PCB 052 may be disposed on either side of the FPC 051. In this embodiment of the present disclosure, the PCB 052 and the second lead portion 033 are disposed on the same side of the FPC 051, for example. The chip 053 is disposed on the side of the second lead portion 033 away from the base substrate 01 and is connected to the second lead portion 033. The chip 053 and the FPC 051 are disposed on the same layer.

[0062] (4) Figure 13 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in Figure 13, based on Figure 12, the control circuit 05 does not need to include the PCB 052.

[0063] (5) FIG. 14 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 14, based on FIG. 10, the control circuit 05 includes not only an FPC 051 and a PCB 052 but also a chip 053. Here, the FPC 051 is disposed on the side of the second lead portion 033 away from the base substrate 01. The PCB 052 may be disposed on either side of the FPC 051. In this embodiment of the present disclosure, the PCB 052 and the second lead portion 033 are disposed on the same side of the FPC 051. The chip 053 is disposed on the side of the FPC 051 away from the base substrate 01, and the FPC 051 is connected to the second lead portion 033, the PCB 052, and the chip 053. When the chip 053 is disposed on the FPC 051, the chip 053 and the FPC 051 can be collectively referred to as a chip-on-film (COF).

[0064] (6) Figure 15 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in Figure 15, based on Figure 14, the control circuit 05 does not need to include the PCB 052.

[0065] 16 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 16, based on FIG. 10, the control circuit 05 includes a connector 054. Here, the connector 054 is arranged on the side of the second lead portion 033 away from the base substrate 01, and is connected to both the second lead portion 033 and the PCB 052. The PCB 052 may be arranged on either side of the connector 054. In the embodiment of the present disclosure, the PCB 052 and the second lead portion 033 are arranged on the same side of the connector 054, for example.

[0066] 17 is a schematic exploded view of a partial structure of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 17, based on FIG. 10, the control circuit 05 includes a terminal (LEAD) 055. Here, the terminal 055 is arranged on the side of the second lead portion 033 away from the base substrate 01, and is connected to both the second lead portion 033 and the PCB 052. The PCB 052 may be arranged on either side of the terminal 055. In the embodiment of the present disclosure, the PCB 052 and the second lead portion 033 are arranged on the same side of the terminal 055, for example.

[0067] In some embodiments, regardless of how the control circuit 05 is implemented, the array substrate according to the embodiments of the present disclosure may further include an adhesive (e.g., adhesive 07 in FIG. 1 ) disposed between the base substrate 01 and the control circuit 05. Under the action of the adhesive, the control circuit 05 can be effectively fixed to the base substrate 01, thereby ensuring the stability of the array substrate. The adhesive may be a rubber adhesive. Exemplarily, if the control circuit 05 includes a PCB, the adhesive is used to bond the PCB to the base substrate. If the control circuit does not include a PCB, the adhesive is used to bond the FPC to the base substrate.

[0068] 1, the array substrate according to the embodiment of the present disclosure may further include a first spacer structure 08 disposed between the base substrate 01 and the folding portion 022. The first spacer structure 08 can support the folding portion 022 to prevent the folding portion 022 from breaking.

[0069] In some embodiments, the material of the first spacer structures 08 may be any material, such as an adhesive material or a non-adhesive material. If the first spacer structures 08 are adhesive, the first spacer structures 08 can not only support the bent portions 022 but also fix the bent portions 022 to the base substrate 01, so as to improve the stability of the array substrate.

[0070] In some embodiments, in an array substrate according to an embodiment of the present disclosure, a surface of the first spacer structure facing away from the base substrate may include an arcuate surface. The arcuate surface can enhance the support effect of the first spacer structure against the bent portion. For illustrative purposes, the first spacer structure may have various shapes. Four types of shapes of the first spacer structure will be described below as examples.

[0071] (1) Fig. 18 is a schematic diagram of a first spacer structure (wire structures are not shown in Fig. 18) according to an embodiment of the present disclosure. As shown in Fig. 18, the surface of the first spacer structure 08 away from the base substrate 01 is a semicircular arc surface. In addition, in the arrangement direction Z1 of the base substrate 01 and the first spacer structure 08, the maximum length Z2 of the first spacer structure 08 is greater than the radius R of the semicircular arc surface.

[0072] 19 is a schematic diagram of another first spacer structure according to an embodiment of the present disclosure (wire structures are not shown in FIG. 19 ). As shown in FIG. 19 , based on FIG. 18 , the array substrate further includes a second spacer structure 09 disposed between the base substrate 01 and the second planar portion 022, and the second spacer structure 09 is connected to the first spacer structure 08. In this case, the contact area between the entire structure consisting of the first spacer structure 08 and the second spacer structure 09 and the base substrate 01 is large, so the array substrate is stable and easy to assemble. In some embodiments, the side of the first spacer structure 08 closer to the second spacer structure 09 is located on the extension plane of the third side X3, and the side of the second spacer structure 09 closer to the first spacer structure 08 is located on the extension plane of the third side X3. When the connection portion between the second side X2 and the third side X3 includes a chamfered structure, it can be understood that the side of the first spacer structure 08 closer to the second spacer structure 09 and the side of the second spacer structure 09 closer to the first spacer structure 08 are both arranged on the extending plane of the plane on which the main region of the third side X3 excluding the chamfered structure is arranged. The first spacer structure 08 and the second spacer structure 09 may be an integral structure.

[0073] It should be noted that the embodiments of the present disclosure do not limit the extension length of the second spacer structure 09. For example, when a structure (e.g., adhesive 07 in FIG. 1) needs to be provided on the second side of the base substrate, the second spacer structure 09 may extend to the position of the structure and be disposed between the base substrate and the structure, or the second spacer structure 09 may extend beyond the position of the structure and be disposed between the base substrate and the structure, or the second spacer structure 09 may not extend to the position of the structure, and in this case, the second spacer structure 09 and the structure are disposed side by side on the second side of the base substrate.

[0074] (3) Figure 20 is a schematic diagram of another first spacer structure according to an embodiment of the present disclosure (the wire structure is not shown in Figure 20), and as shown in Figure 20, the surface of the first spacer structure 08 away from the base substrate 01 includes a first arc surface, a plane, and a second arc surface connected in sequence, and the radius R1 of the first arc surface is equal to the radius R2 of the second arc surface.

[0075] (4) Figure 21 is a schematic diagram of another first spacer structure according to an embodiment of the present disclosure (the wire structure is not shown in Figure 21). As shown in Figure 21, based on Figure 20, the array substrate further includes a second spacer structure 09. For the second spacer structure 09 in Figure 21, refer to the second spacer structure 09 in Figure 19, and the description will be omitted in the embodiment of the present disclosure.

[0076] (5) Fig. 22 is a schematic diagram of another first spacer structure (wire structure is not shown in Fig. 22) according to an embodiment of the present disclosure. As shown in Fig. 22, the surface of the first spacer structure 08 away from the base substrate 01 includes n first arcuate surfaces, a plane, and n second arcuate surfaces connected in sequence, where n>1, the radii of the n first arcuate surfaces are different from each other, the radius of the i-th first arcuate surface is equal to the radius of the (n-i+1)-th second arcuate surface, and 1≦i≦n. Take n=2 as an example in Fig. 22, in this case, the first spacer structure 08 has two first arcuate surfaces and two second arcuate surfaces, where the radius R11 of the first first arcuate surface is equal to the radius R22 of the second second arcuate surface, and the radius R12 of the second first arcuate surface is equal to the radius R21 of the first second arcuate surface.

[0077] (6) FIG. 23 is a schematic diagram of another first spacer structure according to an embodiment of the present disclosure (the wire structure is not shown in FIG. 23 ). As shown in FIG. 23 , n=3, and the first spacer structure 08 has three first arc surfaces and two second arc surfaces, and the radius R11 of the first first arc surface is equal to the radius R23 of the third second arc surface, the radius R12 of the second first arc surface is equal to the radius R22 of the second second arc surface, and the radius R13 of the third first arc surface is equal to the radius R21 of the first second arc surface.

[0078] (7) Figure 24 is a schematic diagram of yet another first spacer structure according to an embodiment of the present disclosure (the wire structure is not shown in Figure 24). As shown in Figure 24, based on Figure 22, the array substrate further includes a second spacer structure 09. For the second spacer structure 09 in Figure 24, refer to the second spacer structure 09 in Figure 19, and the description will be omitted in the embodiment of the present disclosure.

[0079] (8) Figure 25 is a schematic diagram of another first spacer structure according to an embodiment of the present disclosure (the wire structure is not shown in Figure 25). As shown in Figure 25, based on Figure 23, the array substrate further includes a second spacer structure 09. For the second spacer structure 09 in Figure 25, refer to the second spacer structure 09 in Figure 19, and the description will be omitted in the embodiment of the present disclosure.

[0080] 26 is a schematic structural diagram of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 26, based on FIG. 1, the array substrate further includes a binding substrate 10 disposed between a base substrate 01 and a second planar portion 023. In some embodiments, the material of the base substrate 01 may be the same as that of the binding substrate 10, and the thickness of the base substrate 01 may be the same as that of the binding substrate 10. The base substrate 01 may be used to support the second planar portion. Note that the array substrate shown in FIG. 26 may or may not include the spacer structures (e.g., the first spacer structure and the second spacer structure). Therefore, the spacer structures are not shown in FIG. 26.

[0081] In some embodiments, the array substrate further includes a light-reflecting layer disposed between the base substrate and the first plane portion. For example, FIG. 27 is a schematic structural diagram of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 27, based on FIG. 1, the array substrate further includes a light-reflecting layer 11. In some embodiments, the distance between the light-reflecting layer 11 and the folding portion 022 is greater than 0.

[0082] 28 is a schematic structural diagram of another array substrate according to an embodiment of the present disclosure. As shown in FIG. 28, based on FIG. 26, the array substrate further includes a light reflecting layer 11. The light reflecting layer 11 includes a first light reflecting portion 111 disposed between the base substrate 01 and the first planar portion 021, and a second light reflecting portion 112 disposed between the binding substrate 10 and the second planar portion 023. In some embodiments, the distance between the first light reflecting portion 111 and the bending portion 022 is greater than 0, and the distance between the second light reflecting portion 112 and the bending portion 022 is also greater than 0.

[0083] In view of the above, in the array substrate according to the embodiment of the present disclosure, by bending the organic material layer and the lead structure to the second side of the base substrate, the lead structure is bound to the control circuit on the side (second side) opposite to the side (first side) where the LED layer is arranged. As a result, the problem of the array substrate becoming wider due to the binding of the lead structure and the control circuit on the side (first side) where the LED layer is arranged is avoided. When joining multiple display substrates, the gap between the display substrates can be effectively reduced.

[0084]

[0010] An embodiment of the present disclosure provides a display device, which may include any of the array substrates according to the embodiments of the present disclosure. In some embodiments, the display device may include covers corresponding to the array substrates according to the embodiments of the present disclosure in a one-to-one correspondence, with each cover being disposed on a side of the LED layer of the corresponding array substrate away from the base substrate.

[0085] For example, the display device may be any product or component with a display function, such as an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigation system.

[0086] In some embodiments, FIG. 29 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. As shown in FIG. 29, the display device 20 may include multiple array substrates O bonded together. Because the borders of the array substrates O according to the embodiment of the present disclosure are narrow, in a display device 20 including multiple bonded array substrates O, the slits between the array substrates are narrow. For any two adjacent array substrates O among the multiple array substrates O arranged along a first direction (e.g., the vertical direction in FIG. 29), the distance between the two closest LEDs in the first direction is Q1, and the spacing between the two LEDs arranged along the first direction on each array substrate O is P1, where P1 = Q1. For any two adjacent array substrates O among the multiple array substrates O arranged along a second direction (e.g., the horizontal direction in FIG. 29), the distance between the two closest LEDs in the second direction on each array substrate O is Q2, and the spacing between the two LEDs arranged along the second direction on each array substrate O is P2, where P2 = Q2. In this way, when the display device 20 is displaying a screen, it is difficult for a viewer to notice the presence of the frames of adjacent array substrates, i.e., it is difficult or impossible to see the slits created by the joining of each array substrate.

[0087] In some embodiments, the display device 20 may include a frame bracket (not shown in FIG. 29) disposed on the non-display side of the plurality of array substrates 0, and the plurality of array substrates 0 in the display device may be fixed to the frame bracket by mechanical force, adhesive force, magnetic force, etc. (e.g., the second side of the base substrate in the array substrate is connected to the bracket), thereby joining the plurality of array substrates 0 to form the display device.

[0088] In some embodiments, the LED layer in each array substrate includes a plurality of LEDs arranged in a first plane portion, the distance between the centers of any two LEDs among the plurality of LEDs is P, and the distance between the centers of the two nearest LEDs in any two adjacent array substrates in the display device is Q, where P = Q. In some embodiments, the spacing between any two adjacent array substrates in the display device is greater than or equal to 0.

[0089] 30, 31, 32, 33, and 34 are schematic diagrams of the joints of any two array substrates in five types of display devices according to embodiments of the present disclosure. Here, in FIGS. 30, 31, 32, and 33, the distance between adjacent array substrates is greater than 0, while in FIG. 34, the distance between adjacent array substrates is equal to 0. For the spacer structure in FIG. 30, see FIG. 18; for the spacer structure in FIG. 31, see FIG. 21; for the spacer structure in FIG. 32, see FIG. 24; for the spacer structure in FIG. 33, see FIG. 25; and for the spacer structure in FIG. 34, see FIG. 19.

[0090] Furthermore, when the distance between adjacent array substrates in a display device is greater than 0, the difficulty of joining multiple array substrates is low. The shorter the length of the first spacer structure in the array substrate in the arrangement direction of the base substrate and the first spacer structure, the larger the distance between adjacent array substrates in the display device, and the lower the difficulty of joining multiple array substrates. Therefore, in the embodiments of the present disclosure, the distance between adjacent array substrates and the length of the first spacer structure can be reasonably set according to the difficulty of joining the array substrates.

[0091] An embodiment of the present disclosure provides a method for manufacturing an array substrate for manufacturing any array substrate according to an embodiment of the present disclosure, and as shown in FIG. 35, the method may include the following steps.

[0092] In step 3501, an initial structure is formed, where the initial structure includes a base substrate, an organic material layer, a lead structure, an LED layer, and a control circuit, where the base substrate includes opposing first and second sides and a third side adjacent to the first and second sides, respectively, the organic material layer, the lead structure, and the LED layer are all disposed on the first side of the base substrate and sequentially disposed along a direction away from the base substrate, the control circuit and the LED layer are disposed in the same layer, the orthogonal projection of the organic material layer onto the surface on which the base substrate is disposed partially overlaps with the orthogonal projection of the base substrate onto the surface on which the base substrate is disposed, and the lead structure covers the side of the organic material layer away from the base substrate and is connected to both the LED layer and the control circuit.

[0093] In step 3502, the control circuit is moved from a first side of the base substrate to a second side of the base substrate by bending the organic material layer and the lead structure, wherein the folded organic material layer includes a first planar portion, a bent portion, and a second planar portion connected in sequence, the first planar portion being disposed on the first side of the base substrate, the second planar portion being disposed on the second side of the base substrate, and the bent portion being disposed on the third side, and the bent lead structure includes a first lead portion, a bent lead portion, and a second lead portion connected in sequence, the first lead portion being disposed on a side of the first planar portion away from the base substrate and connected to the LED layer, the bent lead portion being disposed on a side of the bent portion away from the base substrate, and the second lead portion being disposed on a side of the second planar portion away from the base substrate and connected to the control circuit.

[0094] The method for manufacturing an array substrate according to the embodiments of the present disclosure is easy to implement and therefore can facilitate mass production.

[0095] FIG. 36 is a flowchart of another array substrate manufacturing method according to an embodiment of the present disclosure, which can be used to manufacture the array substrate shown in FIG. 1, and as shown in FIG. 36, the method can include the following steps:

[0096] In step 3601, an initial substrate, an organic material layer, a lead structure, and an LED layer are formed in sequential order.

[0097] 37, the orthogonal projection of the organic material layer 02 onto the surface U2 on which the initial substrate U1 is placed, which is parallel to the initial substrate U1, is within the orthogonal projection of the initial substrate U1 onto the surface U2 on which the initial substrate is placed. The lead structure 03 covers the side of the organic material layer 02 away from the initial substrate U1 and is connected to the LED layer 04.

[0098] Meanwhile, in step 3601, an organic material layer, a lead structure, and an LED layer can be sequentially formed on an initial substrate.

[0099] Alternatively, in step 3601, a flexible film layer (which can partially cover the base substrate) and a lead layer may be sequentially formed on a base substrate. Then, the base substrate on which the flexible film layer and lead layer are formed is cut into multiple substrate units, each of which includes an initial substrate obtained by cutting the base substrate, an organic material layer obtained by cutting the flexible film layer, and a lead structure obtained by cutting the lead layer. Finally, a mass transfer technique is used to form multiple LEDs on the lead structure of each substrate unit, thereby forming an LED layer on each substrate unit.

[0100] In some embodiments, after step 3601, a black rubber coating may be applied to the side of the LED layer away from the initial substrate, which can improve the display effect of the LED layer, protect the LED layer, and increase the welding strength of the LED layer.

[0101] In step 3602, control circuitry is connected to the lead structure on the side of the lead structure away from the initial substrate.

[0102] The structure obtained by connecting the control circuit 05 to the lead structure 03 is as shown in Figure 38. In the embodiment of the present disclosure, the control circuit 05 includes an FPC051 and a PCB052, the lead structure 03 is connected to the FPC051, and the FPC051 is connected to the PCB052.

[0103] In step 3603, an initial structure including a base substrate, an organic material layer, a lead structure, an LED layer, and a control circuit is obtained by removing a portion of the initial substrate.

[0104] Here, the orthogonal projection of the partial region onto the surface on which the initial substrate is disposed is outside the orthogonal projection of the LED layer onto the surface on which the initial substrate is disposed. For example, after removing the partial region of the initial substrate, the initial substrate can be formed into the base substrate 01 shown in FIG. 39. Here, the organic material layer 02, the lead structure 03, and the LED layer 04 are all disposed on the first side X1 of the base substrate 01 and are sequentially disposed along a direction away from the base substrate 01. The control circuit 05 and the LED layer 04 are disposed in the same layer. The orthogonal projection of the organic material layer 02 onto the surface U3 on which the base substrate is disposed, which is parallel to the base substrate 01, partially overlaps with the orthogonal projection of the base substrate 01 onto the surface U3 on which the base substrate is disposed. The lead structure 03 covers the side of the organic material layer 02 away from the base substrate 01 and is connected to both the LED layer 04 and the control circuit 05.

[0105] In step 3604, the control circuitry is transferred from the first side of the base substrate to the second side of the base substrate by bending the organic material layer and the lead structure.

[0106] Here, as shown in FIG. 1, the second side X2 faces the first side X1, and the folded organic material layer 02 includes a first plane portion 021, a folding portion 022, and a second plane portion 023 connected in sequence, the first plane portion 021 being disposed on the first side X1 of the base substrate 01, the folding portion 022 being folded from the first side X1 to the second side X2 of the base substrate 022, and the second plane portion 023 being disposed on the second side X2 of the base substrate 01, forming a folded lead structure. 03 includes a first lead portion 031, a bent lead portion 032, and a second lead portion 033 connected in sequence, the first lead portion 031 being arranged on the side of the first flat portion 021 away from the base substrate 01 and connected to the LED layer 04, the bent lead portion 032 being arranged on the side of the bent portion 022 away from the base substrate 01, and the second lead portion 033 being arranged on the side of the second flat portion 023 away from the base substrate 01 and connected to the control circuit 05.

[0107] In some examples, the above step 3603 can be realized in various embodiments, and the embodiments of the present disclosure will be described using two of these embodiments as examples.

[0108] (1) In one embodiment of step 3603, as shown in FIG. 40, first, a laser is irradiated onto a separation waiting region U4 of the initial substrate U1 from the side of the initial substrate U1 away from the organic material layer O2, thereby separating the separation waiting region U4 from the organic material layer O2. Here, the partial region U5 to be removed may be located within the separation waiting region U4 and may be smaller than the separation waiting region U4. Then, as shown in FIG. 41, the edge of the partial region U5 on the initial substrate U1 can be cut. Finally, as shown in FIG. 42, the partial region U5 is peeled off.

[0109] In some embodiments, if the fabricated base substrate has a chamfered structure near the bent portion, the chamfered structure can be formed during the process of cutting the edge of the partial region U5 of the initial substrate U1.

[0110] (2) In another embodiment of step 3603, before forming an organic material layer on the initial substrate, a light-reflecting layer 11 can be formed on an initial substrate U1, as shown in Fig. 43. The orthogonal projection of the light-reflecting layer 11 onto the surface U2 on which the initial substrate is disposed is outside the orthogonal projection of the partial region U5 of the initial substrate to be removed onto the surface U2 on which the initial substrate is disposed. In some embodiments, there may be a gap between the orthogonal projection of the light-reflecting layer 11 onto the surface U2 on which the initial substrate is disposed and the orthogonal projection of the partial region U5 onto the surface U2 on which the initial substrate is disposed.

[0111] In step 3603, as shown in FIG. 44, first, a laser is irradiated onto the initial substrate U1 from the side away from the light reflective layer 11 of the initial substrate U1, thereby separating the region of the initial substrate U1 irradiated with the laser (including the partial region U5) from the organic material layer O2. The reflective layer 11 reflects the laser (for example, its reflectivity to the laser may be greater than 80% or 90%) and prevents the laser from passing through, so that the region of the initial substrate U1 covered with the light reflective layer 11 is not separated from the organic material layer O2. Then, as shown in FIG. 45, the edge of the partial region U5 of the initial substrate U1 can be cut. Finally, as shown in FIG. 46, the partial region U5 is peeled off.

[0112] In the above embodiment, the initial structure formed in step 3603 further includes a light-reflecting layer disposed between the base substrate and the organic material layer.

[0113] In this way, in the second realization form, when irradiating the laser, the light-reflecting layer can effectively define the area in the organic material layer where the laser is irradiated, so there is no need to set the laser from the laser irradiating device, and the laser irradiation accuracy can be made less than 1 micrometer.

[0114] In some embodiments, if the fabricated base substrate has a chamfered structure near the bent portion, the chamfered structure can be formed during the process of cutting the edge of the partial region U5 of the initial substrate U1.

[0115] (3) In yet another embodiment of step 3603, a release layer 12 may be formed on an initial substrate U1 before forming an organic material layer on the initial substrate, as shown in FIG. 47. The orthogonal projection of the partial region U5 to be removed on the initial substrate U1 onto the surface U2 on which the initial substrate is disposed is within the orthogonal projection of the release layer 12 onto the surface U2 on which the initial substrate is disposed, and the viscosity between the release layer 12 and the organic material layer O2 is smaller than the viscosity between the initial substrate U1 and the organic material layer O2. Exemplarily, the material of the release layer 12 may include a polyimide-based material or a modified ultraviolet (UV) low-viscosity adhesive. In some embodiments, the area of ​​the orthogonal projection of the partial region U5 onto the surface U2 on which the initial substrate is disposed is smaller than the area of ​​the orthogonal projection of the release layer 12 onto the surface U2 on which the initial substrate is disposed.

[0116] In step 3603, as shown in FIG. 48, the edge of the partial region U5 in the initial substrate U1 can be cut first. Then, as shown in FIG. 49, the partial region U5 and the portion of the release layer 11 covering the partial region U5 can be peeled off. Because the partial region U5 removed from the initial substrate U1 is the same as the region separated from the organic material layer O2 in the initial substrate U1, when cutting the partial region U5, there is no need to move the cutting position outward, and the border of the fabricated array substrate can be further reduced (for example, by about 30 micrometers). In such a case, the fabricated array substrate may include a portion of the release layer 11 that does not cover the partial region U5.

[0117] In some embodiments, if the fabricated base substrate has a chamfered structure near the bent portion, the chamfered structure can be formed during the process of cutting the edge of the partial region U5 of the initial substrate U1.

[0118] In some embodiments, if the fabricated array substrate needs to include the binding substrate 10 shown in FIG. 26 , after removing a portion of the initial substrate in step 3603, not only the base substrate but also the binding substrate can be obtained. In this manner, in the initial substrate, the base substrate and the binding substrate are respectively disposed on both sides of the portion. The initial structure obtained in step 3603 may further include a binding substrate spaced apart from the base substrate. Both ends of the organic material layer are bonded to the base substrate and the binding substrate, respectively.

[0119] For example, if the array substrate including the control circuit shown in FIG. 10 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 50. If the array substrate including the control circuit shown in FIG. 11 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 51. If the array substrate including the control circuit shown in FIG. 12 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 52. If the array substrate including the control circuit shown in FIG. 13 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 53. If the array substrate including the control circuit shown in FIG. 14 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 54. If the array substrate including the control circuit shown in FIG. 15 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in FIG. 55. If the array substrate including the control circuit shown in Figure 16 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in Figure 56. If the array substrate including the control circuit shown in Figure 17 includes the auxiliary substrate 10, the initial structure obtained in step 3603 will be as shown in Figure 57.

[0120] In some embodiments, if the fabricated array substrate needs to include a spacer structure (e.g., a first spacer structure, or a first spacer structure and a second spacer structure), the spacer structure can be assembled on the side of the base substrate before step 3604. In step 3604, the organic material layer needs to be folded onto the second side of the base substrate to bypass the spacer structure.

[0121] It should be noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity. When an element or layer is referred to as being "on" another element or layer, it is understood that it may be directly on top of the other element, or that intermediate layers may be present. When an element or layer is referred to as being "under" another element or layer, it is understood that it may be directly under the other element, or that one or more intermediate layers or elements may be present. When a layer or element is referred to as being "between" two layers or elements, it is understood that it may be the only layer between the two layers or elements, or that one or more intermediate layers or elements may also be present. Similar reference numbers refer to similar elements throughout this specification.

[0122] In this disclosure, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise specified.

[0123] It should be noted that method embodiments according to the embodiments of the present disclosure may be mutually referenced, and the embodiments of the present disclosure are not limited thereto. The priority of steps in the method embodiments according to the embodiments of the present disclosure may be adjusted as appropriate, and steps may be increased or decreased depending on the circumstances. Any variations that a person skilled in the art would easily come up with within the scope of the technology disclosed in the present disclosure are intended to be included within the scope of protection of the present disclosure, and therefore, description thereof will be omitted.

[0124] The above are merely optional examples of the present application and do not limit the present application, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of the present application. [Explanation of symbols]

[0125] 01 Base board 02 Organic material layer 03 Lead structure 04 LED layer 05 Control circuit 021 1st plane part 022 Bending part 023 Second plane part 031 First lead part 032 Bent lead 033 Second lead part

Claims

1. The device comprises a base substrate (01), an organic material layer (02), a lead structure (03), an LED layer (04), and a control circuit (05), The base substrate (01) includes a first side and a second side facing each other, and a third side adjacent to the first side and the second side; The organic material layer (02) includes a first plane portion (021), a bent portion (022), and a second plane portion (023) connected in sequence, the first plane portion (021) being disposed on the first side, the second plane portion (023) being disposed on the second side, and the bent portion (022) being disposed on the third side; The lead structure (03) includes a first lead portion (031), a bent lead portion (032), and a second lead portion (033) connected in sequence, the first lead portion (031) being arranged on the side of the first plane portion (021) away from the base substrate (01), the bent lead portion (032) being arranged on the side of the bent portion (022) away from the base substrate (01), and the second lead portion (033) being arranged on the side of the second plane portion (023) away from the base substrate (01); The LED layer (04) is disposed on a side of the first lead portion (031) away from the base substrate (01) and is connected to the first lead portion (031); the control circuit (05) is disposed on the second side of the base substrate (01) and connected to the second lead portion (033), and the control circuit (05) is used to control the LED layer (04) to emit light; The binding substrate (10) is disposed between the base substrate (01) and the second plane portion (023), The third side includes two third sides facing each other in the extension direction of the base substrate (01), The binding substrate (10) includes an opening extending through the binding substrate (10) in a thickness direction of the binding substrate (10), and the binding substrate (10) includes a portion of the binding substrate near one of the third sides in the extension direction of the base substrate (01) and another portion of the binding substrate near the other of the third sides in the extension direction of the base substrate (01) so as to form the opening, and at least a portion of the control circuit (05) is arranged within the opening. Array board.

2. The array substrate according to claim 1 , wherein the connection between the second side and the third side includes a chamfered structure (011).

3. The array substrate satisfies at least one of the following conditions: b ≥ 0.6a, b<p / 2, The LED layer (04) includes a plurality of LEDs (041), 2a represents the length of any one of the plurality of LEDs (041) in the extension direction of the base substrate (01), b represents the distance between an LED (041) of the plurality of LEDs (041) that is closest to the bending portion (022) and the bending portion (022), and the distance between the centers of any two LEDs (041) of the plurality of LEDs (041) is P.

3. The array substrate according to claim 1.

4. 4. The array substrate according to claim 1, wherein the surface of the bent lead portion has a recessed area.

5. The array substrate of claim 1 , further comprising a first spacer structure (08) disposed between the base substrate (01) and the fold (022).

6. The array substrate according to claim 5, wherein the first spacer structure (08) has adhesive properties.

7. 7. The array substrate according to claim 5, wherein the surface of the first spacer structure (08) facing away from the base substrate (01) comprises an arcuate surface.

8. 8. The array substrate of claim 7, wherein the arc surface is a semicircular arc surface, and the maximum length of the first spacer structure (08) in the arrangement direction of the base substrate (01) and the first spacer structure (08) is greater than the radius of the semicircular arc surface.

9. 8. The array substrate of claim 7, wherein a surface of the first spacer structure (08) away from the base substrate (01) comprises n first arc surfaces, a plane, and n second arc surfaces connected in sequence, where n≧1.

10. 10. The array substrate according to claim 9, wherein n=1 and the radius of the first arc surface is equal to the radius of the second arc surface.

11. 10. The array substrate of claim 9, wherein n>1, the radii of the n first arc surfaces are different from each other, the radius of the i-th first arc surface is equal to the radius of the (n-i+1)-th second arc surface, and 1≦i≦n.

12. 12. The array substrate of claim 5, further comprising a second spacer structure (09) disposed between the base substrate (01) and the second plane portion (023), the second spacer structure (09) being connected to the first spacer structure (08).

13. 13. The array substrate of claim 12, wherein a side of the first spacer structure (08) closer to the second spacer structure (09) is located on the extension plane of the third side, and a side of the second spacer structure (09) closer to the first spacer structure (08) is located on the extension plane of the third side.

14. 2. The array substrate according to claim 1, wherein the material of the base substrate (01) is the same as the material of the binding substrate (10), and the thickness of the base substrate (01) is the same as the thickness of the binding substrate (10).

15. 15. The array substrate of claim 1, further comprising a light-reflecting layer (11) disposed between the base substrate (01) and the first planar portion (021).

16. 16. The array substrate according to claim 15, wherein the distance between the light reflecting layer (11) and the bent portion (022) is greater than zero.

17. The control circuit (05) includes a flexible printed circuit (FPC) (051) and a PCB (printed circuit board) (52); 17. The array substrate according to claim 1, wherein the FPC (051) is arranged on a side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033) and the PCB (52).

18. The control circuit (05) includes a flexible printed circuit (FPC) (051), 17. The array substrate according to claim 1, wherein the FPC (051) is arranged on a side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033).

19. The control circuit (05) includes a flexible printed circuit (FPC) (051), a PCB (printed circuit board) (52), and a chip (053); The FPC (051) is arranged on the side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033) and the PCB (52); 17. An array substrate according to claim 1, wherein the chip (053) is arranged on a side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033), and the chip (053) and the FPC (051) are arranged in the same layer.

20. The control circuit (05) includes a flexible printed circuit (FPC) (051) and a chip (053), The FPC (051) is arranged on the side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033); 17. An array substrate according to claim 1, wherein the chip (053) is arranged on a side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033), and the chip (053) and the FPC (051) are arranged in the same layer.

21. The control circuit (05) includes a flexible printed circuit (FPC) (051), a PCB (printed circuit board) (52), and a chip (053); The FPC (051) is arranged on the side of the second lead portion (033) away from the base substrate (01), and the chip (053) is arranged on the side of the FPC (051) away from the base substrate (01), 17. The array substrate according to claim 1, wherein the FPC (051) is connected to the second lead portion (033), the PCB (052), and the chip (053).

22. The control circuit (05) includes a flexible printed circuit (FPC) (051) and a chip (053), The FPC (051) is arranged on the side of the second lead portion (033) away from the base substrate (01), and the chip (053) is arranged on the side of the FPC (051) away from the base substrate (01), 17. The array substrate according to claim 1, wherein the FPC (051) is connected to the second lead portion (033) and the chip (053).

23. The control circuit (05) includes any of a flexible printed circuit (FPC) (051), a PCB (printed circuit board) (52), a connector (054) and a terminal (055), 17. An array substrate according to claim 1, wherein either the connector (054) or the terminal (055) is arranged on a side of the second lead portion (033) away from the base substrate (01) and is connected to the second lead portion (033) and the PCB (52).

24. 24. The array substrate of any one of claims 1 to 23, comprising an adhesive (07) between the base substrate (01) and the control circuit (05).

25. 25. The array substrate of claim 1, wherein the control circuit (05) includes a PCB (Printed Circuit Board) (52), the PCB (52) being disposed within the opening.

26. 26. The array substrate of claim 25, wherein the distance between the side of the PCB (52) away from the base substrate (01) and the base substrate (01) is smaller than the distance between the side of the second lead portion (033) away from the base substrate (01) and the base substrate (01).

27. The control circuit (05) includes a flexible printed circuit (FPC) (051), 26. The array substrate of claim 25, wherein the FPC (051) includes a first end and a second end, the first end being connected to a side of the second lead portion (033) away from the base substrate (01), and the second end being connected to a side of the PCB (52) away from the base substrate (01).

28. Further comprising a light-reflecting layer (11), 28. An array substrate according to any one of claims 1 to 14 and 17 to 27, wherein the light-reflecting layer (11) includes a second light-reflecting portion (112) disposed between the binding substrate (10) and the second planar portion (023).

29. The light-reflecting layer (11) includes a first light-reflecting portion (111) disposed between the base substrate (01) and the first plane portion (021), The distance between the first light reflecting portion (111) and the bent portion (022) is greater than 0; 29. The array substrate of claim 28, wherein a distance between the second light reflecting portion (112) and the bent portion (022) is greater than zero.

30. A first recessed region (0321) is provided on a surface of the bent lead portion (032) away from the base substrate (01), and a region other than the first recessed region (0321) on the surface of the bent lead portion (032) away from the base substrate is a first protrusion region (0322), the minimum distance between the surface of the bent lead portion (032) farther from the base substrate (01) and the surface of the bent lead portion (032) closer to the base substrate (01) is Y1; The distance between the surface of the bent lead portion (032) far from the base substrate (01) and the surface of the bent lead portion (032) close to the base substrate (01) is Y2, and Y1 is smaller than Y2; 2. The array substrate according to claim 1, wherein the first plane portion (021), the bent portion (022), and the second plane portion (023) are of an integral structure.

31. a second recessed region (0221) is provided on a surface of the bending portion (022) that is remote from the base substrate (01), and a region other than the second recessed region (0221) on the surface of the bending portion (022) that is remote from the base substrate is a second protrusion region (0222); In the presence of the second recessed region (0221) on the bent portion (022), the surface of the bent lead portion (032) away from the base substrate (01) is a first recessed region (0321), and the region other than the first recessed region (0321) on the surface of the bent lead portion (032) away from the base substrate is a first protruding region (0322); the minimum distance between the surface of the bent portion (022) remote from the base substrate (01) and the surface of the bent portion (022) close to the base substrate (01) is Y3; At the position where the second protrusion region (0222) of the bending portion (022) is arranged, the distance between the surface of the bending portion (022) far from the base substrate (01) and the surface of the bending portion (022) close to the base substrate (01) is Y4, and Y3 is smaller than Y4.

31. The array substrate according to claim 30.

32. 32. The array substrate according to claim 30 or 31, wherein the shape of at least one of the first recessed area (0321) and the second recessed area (0221) is either V-shaped, U-shaped or trapezoidal.

33. 32. The array substrate of claim 31, wherein there are a plurality of the second recessed regions (0221), and the minimum distance Y3 between the surface of the folded portion (022) away from the base substrate (01) and the surface of the folded portion (022) closer to the base substrate (01) is the same in the plurality of the second recessed regions (0221).

34. 32. The array substrate according to claim 31, wherein the surface of the folded portion (022) close to the base substrate (01) is a smooth surface.

35. Further comprising a first spacer structure (08) disposed between the base substrate (01) and the bent portion (022), 32. The array substrate of claim 31, wherein the surface of the fold (022) closer to the base substrate (01) is conformal with a surface of the first spacer structure (08) remote from the base substrate (01).

36. A display device comprising the array substrate according to any one of claims 1 to 35.

37. a plurality of the array substrates joined together; the LED layer of the array substrate includes a plurality of LEDs arranged on the first plane portion, and a distance between the centers of any two of the plurality of LEDs is P; 37. The display device of claim 36, wherein the distance between the centers of the two nearest LEDs on any two adjacent array substrates in the display device is Q, and P=Q.

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