Intraoral sensing device

The intraoral sensing device addresses manufacturing and safety issues by using dual resin materials and recess/protrusion configurations, ensuring easy detachment and improved safety with reduced damage risks and precise force control.

JP7734934B2Active Publication Date: 2025-09-08SEIKO CORP +1
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Patent Information

Application Number
JP2024168328
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-03-13
Filing Date
2024-09-27
Publication Date
2025-09-08
Estimated Expiration
2040-12-28

AI Technical Summary

Technical Problem

Existing intraoral sensing devices face challenges in easy manufacturing and safety due to adhesive resins causing damage during removal and potential short circuits, with existing solutions complicating appliance design and increasing risk of moisture exposure.

Method used

An intraoral sensing device design featuring a first dental resin material covering the electronic device, a second dental resin material adhering to the first, and a recess or protrusion configuration to securely attach and detach the device without direct force application, using materials with varying adhesion strengths and manufacturing methods like vacuum stamping.

Benefits of technology

The device is safer, easier to manufacture, and reduces damage risks during attachment and detachment, with improved waterproofing and ease of reuse, while allowing precise control of force application in orthodontic appliances.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an intraoral sensing apparatus that is easily manufactured and has high safety in use.SOLUTION: An intraoral sensing apparatus is configured to be installed in an oral cavity, and is provided with: an electronic device 2 equipped with electronic components mounted on a circuit board; a first dental resin material 3 which completely covers the electronic device; a second dental resin material 4 which completely covers the first dental resin material 3; and an intraoral instrument 1 having a first recess in which the electronic device covered with the first dental resin material and the second dental resin material is accommodated. The second dental resin material is provided in the gap between the electronic device, completely covered by the first dental resin material, and the first recess, and is bonded to the inner side of the first recess. A protrusion 1c for fixing the electronic device accommodated in the first recess is formed on the first recess or the second dental resin material. The electronic device, covered by the first and second dental resin materials, can be detached from the oral appliance when the protrusion deforms.SELECTED DRAWING: Figure 5
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Description

[Technical Field]

[0001] The present invention relates to an intraoral sensing device. [Background technology]

[0002] To date, intraoral sensing devices that are placed in the oral cavity to obtain biometric information have been put into practical use. Conventionally, when attaching electronic devices such as biomonitoring sensors to oral appliances, they have been attached to the oral appliance using a resin that has adhesive properties to both the oral appliance and the electronic device. However, when attempting to remove the electronic device from the oral appliance to recharge the battery, the resin tightly adheres to the electronic device, making it impossible to remove, and forcibly removing the electronic device could result in damage to the electronic device. One possible solution to this problem is to dissolve the resin bonding the oral appliance and electronic device with a solvent, allowing the electronic device to be removed. However, because electronic devices are equipped with batteries, immersing them in a solvent could cause a short circuit between the circuit terminals, potentially damaging the electronic device. One possible solution to this problem is to cover the entire electronic device with the material of the oral appliance. For example, Patent Document 1 describes a method for forming a moisture-resistant and insulating protective coating on at least the areas of an electronic circuit board on which electronic components are mounted, where moisture resistance and insulation are required. The method includes a first step of applying a first coating agent containing a resin to form a first coating, and a second step of applying a second coating agent to the first coating agent to form a second coating agent containing a thickening additive. In this case, the electronic device and the oral appliance are not bonded, reducing the risk of breakage when the electronic device is removed. However, this approach requires a thicker oral appliance material for fabrication, which, in the case of orthodontic appliances, can make it difficult to control the force applied to the teeth. Furthermore, if the material of the oral appliance were to crack, moisture could come into direct contact with the electronic device, potentially destroying it. For safety reasons, a second means must be provided to prevent electrical leakage even if a crack or other problem occurs in one means (in this case, the material of the orthodontic appliance). The method described above has safety issues because it only provides one means. Furthermore, the dental resin material used to secure the oral appliance and electronic device is made by polymerizing and curing two liquids, which creates the problem of low liquid viscosity, causing the dental resin material to flow off before hardening.

[0003] To address these issues, it is conceivable to construct an oral appliance 41 by sandwiching an electronic device 42 between two sealing films made of a thermoplastic polymer compound, as shown in FIG. 17, but there is a demand for further simplification of the manufacturing process. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-66080 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an intraoral sensing device that is easy to manufacture and has excellent safety in use. [Means for solving the problem]

[0006] (1) The intraoral sensing device of the present invention is a sensing device to be placed in the oral cavity, and comprises: an electronic device having electronic components mounted on a circuit board; a first dental resin material that covers all of the electronic device; a second dental resin material that covers the entire first dental resin material; and an oral appliance having a first recess that houses the electronic device covered with the first dental resin material and the second dental resin material, wherein the second dental resin material is provided in the gap between the electronic device entirely covered with the first dental resin material and the first recess and is adhered to the inside of the first recess, and a protrusion is formed in the first recess or the second dental resin material to fix the electronic device housed in the first recess, and the electronic device covered with the first dental resin material and the second dental resin material can be removed from the oral appliance by deformation of the protrusion.

[0007] (2) The second dental resin material is formed such that one of the broad surfaces of the first dental resin material is a bottom surface, and the thickness of at least two or more corners of the surface opposite to the bottom surface is thinner than the thickness of the other parts, and the protrusion is formed in the first recess. a portion where the thickness of the corner of the second dental resin material is thinner than the thickness of the other portion; and the electronic device may be fixed by the protrusion and a portion of the second dental resin material where the thickness of the corner is thinner than the thickness of the other portion.

[0008] (3) The second dental resin material may have a second recess on at least two or more surfaces corresponding to the side surfaces of the first dental resin material, with one of the larger surfaces of the first dental resin material serving as the bottom surface, and the protrusion may be formed at a location of the second dental resin material corresponding to the second recess, and the electronic device may be fixed by the second recess and the protrusion.

[0009] (4) The protrusion is formed in the second dental resin material and is formed on at least two or more surfaces corresponding to the side surfaces of the first dental resin material, with one of the broad surfaces of the first dental resin material serving as the bottom surface, and a recess is formed in the first recess at a location corresponding to the protrusion, and the electronic device may be fixed by the recess and the protrusion.

[0010] (5) The second dental resin material may be made of a material that is softer than the first dental resin material.

[0011] (6) The first dental resin material may be formed from a material that has a weaker adhesion between the first dental resin material and the second dental resin material than the adhesion between the second dental resin material and the oral appliance, and also has a weaker adhesion between the first dental resin material and the electronic device. [Effects of the Invention]

[0012] According to the present invention, an intraoral sensing device can be provided that is easy to manufacture and has excellent safety in use. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a cross-sectional view of an intraoral sensing device when an electronic device 2 is attached to an intraoral appliance 1. [Figure 2] FIG. 2 is a schematic diagram of the intraoral sensing device when the electronic device 2 is attached to the intraoral appliance 1. [Figure 3] FIG. 3 is a schematic diagram of another intraoral sensing device when an electronic device 2 is attached to an intraoral appliance 1. [Figure 4] FIG. 4 is a schematic diagram showing the shape of an electronic device covered with a second dental resin material 4 to be placed in a first cavity of an intraoral appliance. [Figure 5] FIG. 5 is a cross-sectional view of the first recess of the oral appliance 1 when the electronic device 2 is placed in the first recess. [Figure 6] FIG. 6 is a cross-sectional view showing a state in which the electronic device 2 placed in the first recess of the oral appliance 1 is being removed. [Figure 7] FIG. 7 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first recess of an intraoral appliance. [Figure 8] FIG. 8 is another cross-sectional view of the first cavity of the oral appliance 1 when the electronic device 2 is placed in the first cavity. [Figure 9] FIG. 9 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first recess of an intraoral appliance. [Figure 10] FIG. 10 is a cross-sectional view of another first recess of the oral appliance 1 when the electronic device 2 is placed in the first recess. [Figure 11] FIG. 11 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first recess of an intraoral appliance. [Figure 12] FIG. 12 is a schematic diagram showing another shape of an electronic device covered with a second dental resin material 4 to be placed in a first recess of an intraoral appliance. [Figure 13] FIG. 13 is another cross-sectional view of the first recess of the oral appliance 1 when the electronic device 2 is placed in the first recess. [Figure 14] FIG. 14 is another cross-sectional view of the first recess of the oral appliance 1 when the electronic device 2 is placed in the first recess. [Figure 15] FIG. 15 is a cross-sectional view of the intraoral sensing device when the electronic device 2 is attached to an implant-type denture 32. [Figure 16] FIG. 16 is a schematic block diagram showing the circuit configuration of the electronic device 2. As shown in FIG. [Figure 17]FIG. 17 is a cross-sectional view of a conventional intraoral sensing device when an electronic device 42 is attached to an intraoral appliance 41. [Figure 18] FIG. 18 is a process flow diagram illustrating a method for manufacturing an intraoral sensing device. [Figure 19] FIG. 19 is a process flow diagram illustrating another method for manufacturing an intra-oral sensing device. DETAILED DESCRIPTION OF THE INVENTION

[0014] The present invention has the following advantageous features: When used in the oral cavity, the electronic device 2 is doubly covered with the first dental resin material 3 and the second dental resin material 4. Therefore, even if a crack occurs in one of them, the other protects the electronic device, resulting in excellent safety for the human body. Furthermore, particularly when the first dental resin material 3 is a silicone resin, the silicone resin does not adhere to the electronic device 2, so the first dental resin material 3 can be easily peeled off from the electronic device 2, preventing damage to the electronic device 2 and allowing it to be reused. Furthermore, the first dental resin material 3 can be peeled off from the electronic device 2 and installed in the electronic device 2 to replace the battery, which is particularly useful when the battery is a primary battery.

[0015] In a first specific embodiment of the present invention, as shown in Fig. 1, an electronic device 2 entirely covered with a first dental resin material 3 is housed in a first recess of an oral appliance 1, a second dental resin material 4 is filled in the gap between the first recess and the electronic device 2 entirely covered with the first dental resin material 3, and the electronic device 2 and the oral appliance 1 are bonded together by the second dental resin material 4. Figs. 2 and 3 are perspective views of the oral appliance 1. When the oral appliance is attached to the teeth and gums, the electronic device 2 may be placed inside the oral cavity (lingual side) as shown in Fig. 2, or may be placed outside the oral cavity (cheek side) as shown in Fig. 3. By adopting such a configuration, the intraoral sensing device is safer to use and easier to manufacture.

[0016] In a second specific embodiment of the present invention, as shown in Figure 4, a second dental resin material 4 that covers an electronic device entirely covered with a first dental resin material is molded so that one of the wide surfaces of the first dental resin material serves as a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of other parts, and as shown in Figure 5, the first recess of the oral appliance 1 has a first protrusion 1c provided at a location corresponding to the part of the side surface of the second dental resin material 4 where the thickness of the corner is thinner than the thickness of other parts. By adopting this configuration, as shown in Figure 6, the force applied to the oral appliance 1 when putting on and taking off the oral appliance 1 is not directly applied to the electronic device 2, reducing the possibility of the electronic device 2 being damaged by repeated putting on and taking off. In particular, when the oral appliance 1 is formed by vacuum stamping, the first protrusion 1c can be formed at the same time as the first recess is formed, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

[0017] In a third specific embodiment of the present invention, as shown in Figure 7, a second dental resin material 4 covering an electronic device entirely covered with a first dental resin material has a second recess provided on at least two or more surfaces corresponding to the side surfaces of the first dental resin material, with one of the wider surfaces of the first dental resin material serving as a bottom surface, and as shown in Figure 8, a first protrusion 1c is provided at a location of the first recess corresponding to the second recess on the side surface of the dental resin material. By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral device 1 and to reattach the electronic device 2 to the oral device 1. In particular, when the oral device 1 is formed by vacuum stamping, the first protrusion 1c can be formed simultaneously with the formation of the first recess, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

[0018] In a third specific embodiment of the present invention, as shown in Figure 9, a second dental resin material 4 that covers an electronic device entirely covered with a first dental resin material has second protrusions on at least two or more surfaces that correspond to the side surfaces relative to one of the wide surfaces of the first dental resin material as a bottom surface, and as shown in Figure 10, a recess 1d is provided in the first recess at a location that corresponds to the second protrusion on the side surface of the second dental resin material 4. By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral device 1 and to reattach the electronic device 2 to the oral device 1. In particular, when the oral device 1 is formed by vacuum stamping, the recess 1d can be formed simultaneously with the formation of the first recess, and the setting of the electronic device 2 is also performed automatically, improving work efficiency.

[0019] In the second and third specific embodiments of the present invention described above, the shape is not limited to a substantially rectangular parallelepiped, and the corners may be rounded or chamfered as shown in Figure 11 or 12. Furthermore, the corner that contacts the bottom of the first recess may be chamfered or rounded as shown in Figure 13 or 14.

[0020] [Intraoral sensing device] The intraoral sensing device is composed of an electronic device 2, an intraoral appliance 1, a first dental resin material 3, and a second dental resin material 4.

[0021] <Electronic equipment> As shown in FIG. 16, the electronic device 2 is composed of a wireless module part 23 which combines a wireless transceiver part 26, a signal processing part 24 and a memory 25, a sensor 22 and a battery 21, and is covered entirely with a first dental resin material when mounted on a circuit board. The electronic device 2 is composed of a wireless module unit 23 that combines a wireless transceiver unit 26, a signal processing unit 24, and a memory 25, a sensor 22, and a battery 21, and is embedded in an orthodontic appliance, a denture, or an implant. The wireless transmitting / receiving unit 26 has the role of transmitting digital data sensed inside the oral cavity to a network connector 27 outside the oral cavity, and receiving commands transmitted from the network connector 27 to the electronic device 2. The signal processing unit 24 is composed of a microcomputer and an AD converter, and has the following functions: converting the sensing data sent from the sensor 22 into digital data and storing it in the memory 25; converting the digital data stored in the memory 25 into transmittable data; and interpreting commands sent from the network connector 27 and controlling the operation of the sensor 22 and the wireless transceiver unit 26. The sensor 22 comprises at least one sensor selected from the group consisting of a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen levels, a heart rate sensor that uses light to measure heart rate, and a laser sensor that uses laser light to measure blood flow, and acquires various physical information and biological information. The battery 21 is composed of a primary battery or a secondary battery, and supplies power to the wireless transceiver 26 , the signal processor 24 , the memory 25 and the sensor 22 . These circuit blocks are implemented on a thin circuit board or a flexible substrate, and include a battery 21, a sensor 22, a signal processing unit 24, a wireless transceiver unit 26, and a memory 25. Generally, the wireless transceiver unit 26, the signal processing unit 24, and the memory 25 are often provided as a single chip. Furthermore, the electronic device 2 has the battery 21, the sensor 22, the signal processing unit 24, the memory 25, and the wireless transceiver unit 26 implemented on a thin circuit board or a flexible substrate.

[0022] The electronic device 2 is covered with the first dental resin material 3, and the outside of that is further covered with the second dental resin material 4 and placed in the oral appliance, thereby preventing moisture from entering the electronic device 2. Even if a crack occurs in the second dental resin material 4, the electronic device 2 is covered with the soft first dental resin material 3, ensuring double safety.

[0023] The wireless module unit 23 mounted on the electronic device 2 does not necessarily need to exchange data wirelessly with the outside world; it may be an electronic device that exchanges data wired. However, in the case of an electronic device that exchanges data wired, the connector portion connecting the electronic device 2 and the network connector 27 must be waterproofed. The connector portion is equipped with a lid-like mechanism that opens when reading data and closes when placed inside the oral cavity. Therefore, sending and receiving data wirelessly has the advantage of simplifying the waterproof structure.

[0024] By using a temperature sensor for sensor 22, it is possible to measure the time that the oral appliance is worn, which can be used for intraoral orthodontic treatment, as well as to monitor changes in daily body temperature. By using an acceleration sensor and a gyro sensor for sensor 22, it is possible to not only count the number of chews, but also to measure the number of steps, activity level, jaw movement, and bruxism (teeth grinding). By using a pressure sensor and a strain sensor for sensor 22, it is possible to measure not only the force applied to teeth, dentures, and implants, but also the force applied to teeth by oral appliances, bruxism (teeth grinding), biting force, number of chews, and the time the oral appliance is worn.

[0025] <Intraoral appliances> The oral appliance 1 may be, for example, an orthodontic appliance, a denture, or an implant.

[0026] In the case of an orthodontic device, the oral appliance 1 is preferably formed from a thermoplastic polymer compound, and more preferably from any one thermoplastic polymer compound selected from the group consisting of polyethylene-based materials, polyurethane-based materials, and acrylic resins. When attaching an electronic device to an oral appliance, as shown in Figures 1 to 3, the oral appliance is preferably molded by pressing an oral appliance manufacturing material against a dental mold that matches the teeth and gums of the user who will be wearing the oral sensing device, or by molding the oral appliance into the shape of a dental mold and gum mold using a 3D printer, and it is more preferable to mold the oral appliance by pressing it against a dental mold that matches the teeth and gums of the user who will be wearing the oral sensing device. The material for manufacturing the oral appliance is preferably a sheet or film of the above-mentioned thermoplastic polymer compound. A recess is provided in a part of the oral appliance 1, and the electronic device 2 is placed in the recess. The location for placing the electronic device 2 may be either the area corresponding to the side wall of the tooth crown or the area corresponding to the gums, but considering the occlusion of the upper and lower teeth, it is preferable to place it in the area corresponding to the gums as shown in Figure 1. Furthermore, in the case of a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, or a laser sensor that uses laser light to measure blood flow, it is preferable to place it in the area corresponding to the gums because information is obtained from the blood vessels in the gums. Furthermore, when installing the above-mentioned sensor using light or laser, light transmission is essential, so oral appliance 1 is made of a material that can transmit light of any wavelength within the range of 400 to 1000 nm.

[0027] In a first specific embodiment, as shown in FIG. 1 , the entire periphery of the electronic device 2 is covered with a first dental resin material 3, and the entire periphery of the first dental resin material 3 is further covered with a second dental resin material 4, and the second dental resin material 4 is filled into the recess of the oral device 1, thereby bonding the oral device 1 and the electronic device 2 together.

[0028] In a second specific embodiment, as shown in FIG. 4, the second dental resin material 4 has a structure in which the thickness of at least two corners of the surface opposite the bottom, with one of the broad surfaces of the first dental resin material serving as the bottom, is thinner than the thickness of the remaining portions. As shown in FIG. 5, the electronic device is secured between the corners of the second dental resin material 4 where the thickness is thinner than the remaining portions and the first protrusion 1c of the oral appliance 1. Therefore, even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This avoids the problem of the electronic device 2 being damaged when the oral appliance 1 is attached or removed. Furthermore, if the second dental resin material 4 has only one thin corner, the probability of the electronic device 2 falling off is very high, which is undesirable. By forming at least two, preferably four, corners, the electronic device 2 will not fall off even when the oral appliance 1 is attached or removed. FIG. 6 is a schematic diagram showing the state in which the electronic device 2, covered with the first dental resin material 3 and the second dental resin material 4, is removed from the oral appliance 1. When the electronic device 2 is removed in the direction of the arrow, the first protrusion 1c of the oral device 1 is deformed, so that the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 can be easily removed from the oral device 1.

[0029] In a third specific embodiment, as shown in FIG. 7, the second dental resin material 4 has a structure in which one of the wide surfaces of the first dental resin material serves as the bottom surface, and second recesses 4g are provided on at least two surfaces corresponding to the side surfaces of the bottom surface. As shown in FIG. 8, the electronic device 2 is fixed between the second recesses 4g formed on the side surfaces of the second dental resin material 4 and the first protrusions 1c of the oral appliance. Therefore, even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This avoids the problem of the electronic device 2 being damaged by force applied to the electronic device 2 when the oral appliance 1 is attached or removed. Furthermore, forming the second recesses 4g on only one side surface is undesirable, as it increases the likelihood of the electronic device 2 falling off. By forming the second recesses 4g on at least two side surfaces, preferably four, the oral appliance 1 will not fall off even when it is attached or removed. It is preferable that the second recesses 4g are parallel to the bottom surface.

[0030] In a fourth specific embodiment, as shown in FIG. 9, the second dental resin material 4 has a structure in which one of the wide surfaces of the first dental resin material serves as the bottom surface, and second protrusions 4h are provided on at least two or more surfaces corresponding to the side surfaces of the bottom surface. As shown in FIG. 10, the electronic device 2 is fixed between the second protrusions 4h formed on the side surfaces of the second dental resin material 4 and the recess 1d of the oral appliance. Therefore, even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This avoids the problem of the electronic device 2 being damaged by force applied to the electronic device 2 when the oral appliance 1 is attached or removed. Furthermore, forming the second protrusions 4h on only one side surface is undesirable because it is highly likely to fall off. Forming the second protrusions 4h on at least two side surfaces, preferably four, prevents the electronic device 2 from falling off when the oral appliance 1 is attached or removed. It is preferable that the second protrusions 4h are parallel to the bottom surface.

[0031] In the second specific embodiment (FIG. 4), the third specific embodiment (FIG. 7), or the fourth specific embodiment (FIG. 9), the oral device 1 is made of a thermoplastic polymer compound such as a polyethylene-based material, a polyurethane-based material, or an acrylic resin, and is suitable for a method of embossing onto a dental impression made with plaster or a 3D printer. When the electronic device 2 covered with the second dental resin material 4 shown in FIG. 4, 7, or 9 is placed at the desired location on the dental impression where the electronic device 2 is to be installed, and a sheet or film of the thermoplastic polymer compound is molded by vacuum embossing, the thermoplastic polymer compound penetrates into the thin corners and the first recess, automatically forming the first protrusion 1c of the oral device 1 as shown in FIG. 5 or 8, or the recess 1d of the oral device 1 as shown in FIG. 10. If the oral device 1 is produced using a 3D printer, it is then necessary to set the electronic device 2 in the first recess of the oral device 1. However, if vacuum stamping is performed using the electronic device 2 having the shape shown in Figure 4, Figure 7 or Figure 9, the labor required for setting the electronic device 2 is eliminated, and work efficiency is improved.

[0032] The position where the electronic device 2 is attached to the oral appliance 1 may be either the upper or lower jaw, and may be either inside (tongue side) or outside (cheek side) of the oral cavity.

[0033] When attaching the electronic device 2 to a denture or an implant, it is preferable to install the electronic device 2 inside the denture (implant-supported denture 32) as shown in Fig. 15. Fig. 15 shows an example of an implant embedded in the alveolar bone 34, but the same applies to a denture. It is preferable that the electronic device 2 is entirely doubly covered with a first dental resin material 3 and a second dental resin material 4, and installed inside the denture or implant-supported denture 32. In the case of a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, or a laser sensor that uses laser light to measure blood flow, it is preferable to install it in a location that corresponds to the gums 33, in order to obtain information from blood vessels in the gums. Furthermore, when the above-mentioned sensors that use light or laser are installed, a portion of the denture or implant denture is made of a material that can transmit light with a wavelength of 400 to 1000 nm, in order to allow light to pass through.

[0034] <First Dental Resin Material> The first dental resin material 3 is, for example, a silicone resin or methacrylate whose main component is polydimethylsiloxane, to which butyl phthalate as a plasticizer is added, and then polymerized and cured. Examples of the silicone resin include condensation type silicone rubber and addition type silicone rubber. The first dental resin material 3 is not limited to the above-mentioned materials, and other plastics can also be used. Silicone resin is preferred as the first dental resin material 3.

[0035] The silicone resin has weak adhesion to the electronic device 2, so it can be easily removed. Therefore, when reusing the electronic device 2, cleanliness can always be maintained by replacing the silicone resin with new one. Furthermore, since the adhesion between the second dental resin material 4 described below and the silicone resin is weak, the electronic device 2 can be easily peeled off from the oral appliance 1 when reusing the electronic device 2.

[0036] <Second dental resin material> The second dental resin material 4 may be, for example, a polymerized and cured material of methyl methacrylate and polymethyl methacrylate, a material mainly composed of 2,2-bis(4-(3-methaxoloxy-2-hydroxypropoxy)phenyl)propane, urethane dimethacrylate, or triethylene glycol dimethacrylate, a polymerized and cured material of polymethyl methacrylate, 4-methacryloyloxyethyl trimellitate anhydride, or tri-n-butylborane, a polyethylene resin, a polyurethane resin, or an acrylic resin. The second dental resin material 4 is not limited to the above-mentioned materials, and other plastics may also be used. A polymerized and cured material of methyl methacrylate and polymethyl methacrylate is preferred as the second dental resin material 4, as it has good coverage over the electronic device 2 and can prevent moisture from penetrating into the device.

[0037] Dental resin materials made by polymerizing and curing methyl methacrylate and polymethyl methacrylate, or by polymerizing and curing polymethyl methacrylate, 4-methacryloyloxyethyl trimellitate anhydride, and tri-n-butylborane, are types that polymerize and cure liquid and powder, so the dental resin material will not run off and can fill the gap between the electronic device 2 and the oral appliance. The polymerization procedure is to first apply the liquid to a brush or small hand, and then apply the powder to the brush or small hand. This increases the viscosity of the dental resin material, allowing it to be applied to the gap between the electronic device 2 and the oral appliance.

[0038] The second dental resin material 4 is softer than the first dental resin material 3 and has a strong adhesive force to the oral appliance 1, so that the electronic device 2 can be fixed to the oral appliance 1 with a strong holding force. Furthermore, the first dental resin material 3 is harder than the second dental resin material 4 and is suitable for protecting the electronic device 2 from external forces.

[0039] [Manufacturing method for intraoral sensing device] An intraoral sensing device according to a first specific embodiment of the present invention can be manufactured, for example, as shown in FIG. 18 , by preparing an electronic device 2 having electronic components mounted on a circuit board, covering the entire electronic device 2 with a first dental resin material 3, preparing a dental mold that matches the teeth and gums of a user who will wear the intraoral sensing device, placing the electronic device 2 covered with the first dental resin material 3 on the dental mold, and pressing the dental mold against a material for manufacturing an oral appliance to perform embossing to form an oral appliance 1 having a first depression that can accommodate the electronic device 2 covered with the first dental resin material 3, removing the oral appliance 1 from the dental mold with the electronic device 2 covered with the first dental resin material 3 housed in the first depression, and covering the electronic device 2 covered with the first dental resin material 3 with a second dental resin material 4 so as to cover the entire first dental resin material 3 and to adhere to the inside of the first depression of the oral appliance 1.

[0040] The intraoral sensing device according to a second specific embodiment of the present invention includes, for example, as shown in FIG. 19, preparing an electronic device 2 having an electronic device mounted on a circuit board, covering the entire electronic device 2 with a first dental resin material 3, covering the entire first dental resin material 3, and using one of the broad surfaces of the first dental resin material 3 as a bottom surface, covering the electronic device 2 covered with the first dental resin material 3 with a second dental resin material 4 so that the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of other parts, and then mounting the intraoral sensing device. The oral appliance can be manufactured by preparing a dental mold that matches the teeth and gums of the user, placing the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 on the dental mold, pressing the dental mold against a material for manufacturing an oral appliance to perform embossing, forming an oral appliance 1 having a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 can be placed, and removing the oral appliance 1 from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first recess.

[0041] The intraoral sensing device according to a third specific embodiment of the present invention includes, for example, as shown in FIG. 19, preparing an electronic device 2 having an electronic device mounted on a circuit board, covering the entire electronic device 2 with a first dental resin material 3, covering the electronic device 2 covered with the first dental resin material 3 with a second dental resin material 4 so that the entire first dental resin material 3 is covered and one of the broad surfaces of the first dental resin material 3 is set as a bottom surface and second recesses are provided on at least two or more surfaces corresponding to the side surfaces of the bottom surface, and then attaching the intraoral sensing device to a user to whom the intraoral sensing device is to be attached. The method involves preparing a dental mold that matches the teeth and gums of a user, placing the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 on the dental mold, pressing the dental mold against a material for manufacturing an oral appliance to perform embossing, forming an oral appliance 1 having a first depression that can accommodate the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4, and removing the oral appliance 1 from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first depression. The second depression is preferably formed parallel to the bottom surface.

[0042] In the intraoral sensing device according to a fourth specific embodiment of the present invention, for example, as shown in FIG. 19, an electronic device 2 having an electronic device mounted on a circuit board is prepared, the entire electronic device 2 is covered with a first dental resin material 3, and the electronic device 2 covered with the first dental resin material 3 is covered with a second dental resin material 4 so that the entire first dental resin material 3 is covered and one of the broad surfaces of the first dental resin material 3 is set as a bottom surface and second protrusions are provided on at least two or more surfaces corresponding to the side surfaces relative to the bottom surface, and a user to whom the intraoral sensing device is to be attached is provided with the electronic device 2. The method for manufacturing the oral appliance includes preparing a dental mold that matches the teeth and gums of a user, placing the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 on the dental mold, pressing the dental mold against a material for manufacturing an oral appliance to perform embossing, forming an oral appliance 1 having a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 can be placed, and removing the oral appliance 1 from the dental mold with the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 housed in the first recess. The second protrusion is preferably provided parallel to the bottom surface.

[0043] The oral appliance 1, electronic device 2, first dental resin material 3, and second dental resin material 4 are the same as those described for the intraoral sensing device of the present invention, and the preferred embodiments are also the same.

[0044] [Action and effect] In the intraoral sensing device of the present invention, the first dental resin material 3 covers the entire electronic device 2, so even if the adhesion between the first dental resin material 3 and the electronic device 2 is very weak, they will not peel off during use. By using silicone resin as the first dental resin material 3, even when the electronic device 2 is reused for charging or the like, it can be easily peeled off from the oral appliance 1, and the silicone resin can be peeled off cleanly, so that the electronic device 2 is not damaged and can be easily reused. When an item placed in the oral cavity is reused, sufficient sterilization procedures are required, but in the oral sensing device of the present invention, the silicone resin is disposable after each use, making it easy to clean the electronic device 2. When the electronic device 2 is used in the oral cavity, the electronic device 2 is covered with the first dental resin material 3 and the second dental resin material 4, and therefore the waterproof property of the electronic device 2 is improved. When the electronic device 2 is used in the oral cavity, it is covered with the first dental resin material 3 and the second dental resin material 4, so even if a crack occurs in either one, it is protected by the other material, ensuring safety to the human body.

[0045] In the intraoral sensing device of the present invention, a part of the intraoral appliance 1 is recessed and the electronic device 2 is attached thereto, so the manufacturing process is simple. By recessing a portion of the oral appliance 1 and attaching the electronic device 2 there, the thickness of the material of the oral appliance 1 can be reduced. For example, if the oral appliance 1 is an orthodontic device, it is possible to finely control the force applied to the dentition. The second dental resin material 4 used to attach the electronic device 2 to the oral appliance 1 is a liquid and powder that is polymerized and hardened, so the second dental resin material 4 will not run off. Therefore, when covering the first dental resin material 3 with the second dental resin material 4, a brush-layering method can be used in which the liquid material is first soaked into a brush, and then the brush is dipped in powder and used to paint around the first dental resin material 3, or a sprinkling method can be used in which the liquid material and powder are alternately sprinkled on. In the second specific embodiment, the electronic device 2 is fixed via the second dental resin material 4 to the first protrusion 1c of the oral appliance 1 and to the corner where the thickness is thinner than the other parts, so even if a large force is applied to the oral appliance, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem of the electronic device 2 being damaged by the force applied to the electronic device 2 when the oral appliance 1 is attached or detached.

[0046] In the third specific embodiment, the electronic device 2 is fixed via the second dental resin material 4 between the second depression in the second dental resin material 4 and the first protrusion 1c of the oral appliance 1, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This avoids the problem of the electronic device 2 being damaged when force is applied to the electronic device 2 when the oral appliance 1 is attached or removed. If the oral appliance 1 is molded by vacuum stamping, a portion of the oral appliance 1 is recessed, and the first protrusion 1c is further provided so that the electronic device 2 is attached, the first protrusion 1c can be formed automatically, and the electronic device 2 is also automatically set, improving work efficiency.

[0047] In a fourth specific embodiment, the electronic device 2 is fixed via the second dental resin material 4 between the second protrusion of the second dental resin material 4 and the recess 1d of the oral appliance 1, so that even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. This avoids the problem of the electronic device 2 being damaged when force is applied to the electronic device 2 when the oral appliance 1 is attached or removed. If the oral appliance 1 is molded by vacuum stamping, a portion of the oral appliance 1 is recessed, and the recess 1d is further provided so that the electronic device 2 can be attached, the recess 1d can be formed automatically, and the setting of the electronic device 2 can also be performed automatically, improving work efficiency.

[0048] By providing the electronic device 2 with the wireless transmitting / receiving unit 26, it is easy to extract the sensed information to the outside. By using a temperature sensor for the sensor 22, not only can the time that the oral appliance 1 is worn be measured and utilized for intraoral orthodontic treatment, but also daily changes in body temperature can be monitored. By using an acceleration sensor and a gyro sensor for sensor 22, it is possible not only to count the number of chews, but also to measure one or more items selected from the group consisting of step counting, activity level measurement, jaw movement measurement, and bruxism (teeth grinding). By using a pressure sensor and a strain sensor for sensor 22, it is possible to measure not only the force applied to the teeth, dentures, or implants, but also one or more measurements selected from the group consisting of the force applied to the teeth by oral appliance 1, bruxism (teeth grinding), biting force, number of chews, and time spent wearing the oral appliance.

[0049] This application claims priority based on Japanese Patent Application No. 2020-044440, filed on March 13, 2020, the contents of which are incorporated herein by reference. Note that the term "silicone resin" in the specification of Japanese Patent Application No. 2020-044440 means "silicone resin" in the specification of this application.

[0050] The present invention includes the following aspects. <1> A sensing device to be placed in the oral cavity, An electronic device having electronic components mounted on a circuit board; a first dental resin material that covers all of the electronic devices; a second dental resin material that covers the entire first dental resin material; An intraoral sensing device comprising: an intraoral appliance having a first recess in which the electronic device is housed, the first recess being covered with the first dental resin material and the second dental resin material. <2> the second dental resin material adheres the electronic device covered with the first dental resin material to the inside of the first recess; <1> The intraoral sensing device according to claim 1. <3> The second dental resin material has one of the broad surfaces of the first dental resin material as a bottom surface, and the thickness of at least two corners of a surface opposite to the bottom surface is thinner than the thickness of the remaining portion, and a first protrusion is provided at a location of the first recess corresponding to the portion where the thickness of the corner of the second dental resin material is thinner than the thickness of the remaining portion. <1> The intraoral sensing device according to claim 1. <4> The second dental resin material has a second depression on at least two or more surfaces corresponding to the side surfaces of the second dental resin material, with one of the broad surfaces of the first dental resin material serving as a bottom surface, and a first protrusion is provided on the first depression at a position corresponding to the second depression on the side surface of the second dental resin material. <1> The intraoral sensing device according to claim 1. <5> the second recess is parallel to the bottom surface; <4> The intraoral sensing device according to claim 1. <6> The second dental resin material has second protrusions on at least two or more surfaces corresponding to side surfaces of the second dental resin material, with one of the broad surfaces of the first dental resin material serving as a bottom surface, and a recess is provided in the first recess at a position corresponding to the second protrusion on the side surface of the second dental resin material. <1> The intraoral sensing device according to claim 1. <7> the second protrusion is parallel to the bottom surface; <6> The intraoral sensing device according to claim 1. <8> The oral appliance is formed from a thermoplastic polymer compound. <1> from <7> An intraoral sensing device according to any one of the above. <9> The first dental resin material is mainly composed of polydimethylsiloxane. <1> from <7> An intraoral sensing device according to any one of the above. <10> The first dental resin material is a methacrylate to which butyl phthalate is added as a plasticizer, and the resulting material is polymerized and hardened. <1> from <7> An intraoral sensing device according to any one of the above. <11> The second dental resin material is obtained by polymerizing and curing methyl methacrylate and polymethyl methacrylate. <1> from <7> An intraoral sensing device according to any one of the above. <12> The second dental resin material is mainly composed of at least one selected from the group consisting of 2,2-bis(4-(3-methoxoloxy-2-hydroxypropoxy)phenyl)propane, urethane dimethacrylate, and triethylene glycol dimethacrylate. <1> from <7> An intraoral sensing device according to any one of the above. <13> the second dental resin material is obtained by polymerizing and curing polymethyl methacrylate, 4-methacryloyloxyethyl trimellitate anhydride, and tri-n-butylborane; <1> from <3> An intraoral sensing device according to any one of the above. <14> The second dental resin material is characterized in that it can be applied by a brush-on method in which a liquid material is first soaked into a brush, and then powder is applied to the brush and applied around the first dental resin material. <11> from <13> An intraoral sensing device according to any one of the above. <15> The second dental resin material is characterized in that it can be applied by a sprinkling method in which a liquid material and a powder are alternately sprinkled. <11> from <13> An intraoral sensing device according to any one of the above. <16> The second dental resin material is any one selected from the group consisting of a polyethylene resin, a polyurethane resin, and an acrylic resin. <1> from <7> An intraoral sensing device according to any one of the above. <17> The electronic device includes: a sensor for sensing biological information; a battery for powering the sensor; a signal processing unit that receives power from the battery and generates digital data based on the output signal from the sensor; a memory for storing the digital data; a wireless transceiver unit that receives power from the battery and transmits the digital data stored in the memory to the network connector in response to a signal sent from the network connector, <1> from <16> An intraoral sensing device according to any one of the above. <18> The sensor is at least one selected from the group consisting of a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen levels, a heart rate sensor that uses light to measure heart rates, and a laser sensor that uses laser light to measure blood flow. <17> The intraoral sensing device according to claim 1. <19> The oral appliance is an orthodontic appliance, a denture, or an implant. <1> from <18> An intraoral sensing device according to any one of the above. <20> The oral appliance is formed of a material that can transmit light of any wavelength within a wavelength range of 400 to 1000 nm. <1> from <19> An intraoral sensing device according to any one of the above. [Explanation of symbols]

[0051] 1...oral appliance, 1c...first protrusion, 1d...recess, 2...electronic device, 3...first dental resin material, 4...second dental resin material, 4g...second recess, 4h...second protrusion, 5...tooth, 21...battery, 22...sensor, 23...wireless module unit, 24...signal processing unit, 25...memory, 26...wireless transceiver unit, 27...network connector, 31...implant, 32...implant denture, 33...gums, 34...alveolar bone, 41...oral appliance, 42...electronic device

Claims

1. A sensing device to be placed in the oral cavity, An electronic device having electronic components mounted on a circuit board; a first dental resin material that covers all of the electronic devices; a second dental resin material that covers the entire first dental resin material; an intraoral appliance having a first recess for accommodating the electronic device, the first recess being covered with the first dental resin material and the second dental resin material; the second dental resin material is provided in a gap between the electronic device entirely covered with the first dental resin material and the first recess, and is adhered to the inside of the first recess; a protrusion for fixing the electronic device housed in the first recess is formed in the first recess or the second dental resin material; An intraoral sensing device, wherein the electronic device covered with the first dental resin material and the second dental resin material can be removed from the oral appliance by deformation of the protrusion.

2. The intraoral sensing device according to claim 1, The second dental resin material is formed such that one of the broad surfaces of the first dental resin material is a bottom surface, and the thickness of at least two or more corners of the surface opposite the bottom surface is thinner than the thickness of other parts, the protrusion is formed at a location of the first recess corresponding to a portion where the thickness of a corner of the second dental resin material is thinner than the thickness of the other portion, An intraoral sensing device in which the electronic device is fixed by the protrusion and a portion of the second dental resin material where the thickness of the corner is thinner than the thickness of other portions.

3. The intraoral sensing device according to claim 1, The second dental resin material has second recesses on at least two or more surfaces corresponding to side surfaces of the first dental resin material, with one of the broad surfaces of the first dental resin material serving as a bottom surface, and the protrusion is formed at a location of the second dental resin material corresponding to the second depression, An intraoral sensing device, wherein the electronic device is fixed by the second recess and the protrusion.

4. The intraoral sensing device according to claim 1, The protrusions are formed on the second dental resin material, and are formed on at least two or more surfaces of the first dental resin material, with one of the broad surfaces of the first dental resin material being a bottom surface and corresponding to a side surface of the bottom surface; The first recess has a recess formed at a position corresponding to the protrusion, An intraoral sensing device, wherein the electronic device is fixed by the recess and the protrusion.

5. The intraoral sensing device according to any one of claims 1 to 4, An intraoral sensing device, wherein the second dental resin material is formed of a material that is softer than the first dental resin material.

6. The intraoral sensing device according to any one of claims 1 to 5, An intraoral sensing device, wherein the first dental resin material is formed from a material that has a weaker adhesion force between the first dental resin material and the second dental resin material than the adhesion force between the second dental resin material and the oral appliance, and also has a weaker adhesion force between the first dental resin material and the electronic device.

Citation Information

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