Release film and method for manufacturing electronic component device

Abstract

To provide a release film having excellent anti-static performance.SOLUTION: Provided is a release film that includes, in this order, a base layer, a conductive layer, and a release layer. The release layer contains polyacrylonitrile particles.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a release film and a semiconductor package. [Background technology]

[0002] In recent years, as electronic devices, especially mobile phones, have become thinner, there has been a demand for even thinner electronic components such as semiconductor elements. Furthermore, from the perspective of improving heat dissipation, there has been an increasing trend toward exposed die molding, which exposes part of the surface of an electronic component, instead of overmolding, which covers the entire electronic component with encapsulating resin.

[0003] When sealing electronic components so that a portion of the electronic component is exposed, it is necessary to prevent leakage of the sealing material onto the exposed portion of the electronic component (flash burrs).To address this issue, sealing is performed with a film with releasability (mold release film) attached to the exposed portion of the electronic component, and then the release film is peeled off to expose the surface of the electronic component. As such a release film, for example, Patent Document 1 describes a laminated film in which a film made of a fluororesin is laminated on at least one surface of a base film made of a stretched polyester resin film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-49850 Summary of the Invention [Problem to be solved by the invention]

[0005] If the release film is made of a material that is easily charged, discharge may occur when the release film is brought into contact with an electronic component or when the release film is peeled off from the electronic component, which may result in electrostatic damage to the electronic component. In recent years, with the increasing integration of semiconductor elements, process nodes have become increasingly miniaturized, and the risk of electrostatic damage to electronic components is increasing.

[0006] In view of the above circumstances, an object of one aspect of the present disclosure is to provide a release film having excellent antistatic properties.An object of another aspect of the present disclosure is to provide a method for manufacturing a semiconductor package using this release film. [Means for solving the problem]

[0007] The means for solving the above problems include the following embodiments. <1> A release film comprising a substrate layer, a conductive layer, and a release layer in this order, the release layer containing polyacrylonitrile particles. <2> The ratio (A / B) of the average particle size A of the polyacrylonitrile particles to the thickness B of the release layer is greater than 0.7; <1> The release film according to claim 1. <3> The content of the polyacrylonitrile particles is 10% by mass or more of the entire release layer. <1> or <2> The release film according to claim 1. <4> The release layer contains an adhesive. <1> ~ <3> 10. The release film according to claim 1, wherein <5> For temporarily protecting at least a portion of the surface of an object, <1> ~ <4> 10. The release film according to claim 1, wherein <6> For exposed molding, <1> ~ <5> 10. The release film according to claim 1, wherein <7> <1> ~ <6> a step of sealing the periphery of an electronic component with the release film according to any one of the above items in contact with at least a portion of the surface of the electronic component; and a step of peeling the release film from the electronic component. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, there is provided a release film having excellent antistatic properties. According to another aspect of the present disclosure, there is provided a method for manufacturing an electronic component device using the release film. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram schematically illustrating the configuration of a release film. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0011] In this specification, the term "process" includes not only a process that is independent of other processes, but also a process that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In this specification, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In the present specification, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range. In addition, in the present specification, the upper or lower limit of a numerical range may be replaced with a value shown in the examples. In this specification, the content or amount of each component in a composition means, unless otherwise specified, the total content or amount of the multiple substances present in the composition when multiple substances corresponding to each component are present in the composition. In this specification, the particle size of each component in a composition means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified, when multiple types of particles corresponding to each component are present in the composition. In this specification, the term "layer" includes cases where the layer is formed over the entire area when the area in which the layer exists is observed, as well as cases where the layer is formed over only a part of the area. In this specification, the thickness of the release film or each layer constituting the release film can be measured by a known method. For example, it may be measured using a dial gauge or the like, or it may be measured from a cross-sectional image of the release film. Alternatively, the material constituting the layer may be removed using a solvent or the like, and the thickness may be calculated from the mass before and after removal, the density of the material, the area of ​​the layer, etc. If the layer thickness is not constant, the arithmetic average of values ​​measured at any five points is taken as the layer thickness. In this specification, "(meth)acrylic" means either or both of acrylic and methacrylic, and "(meth)acrylate" means either or both of acrylate and methacrylate.

[0012] <Release film> The release film of the present disclosure is a release film having a substrate layer, a conductive layer, and a release layer in this order, and the release layer contains polyacrylonitrile particles.

[0013] The release film having the above-described configuration exhibits excellent antistatic properties. Specifically, the release film exhibits excellent antistatic properties due to the presence of a conductive layer between the substrate layer and the release layer, and the release layer containing polyacrylonitrile particles. The reason why the antistatic performance is improved when the release layer contains polyacrylonitrile particles is thought to be that the unshared electron pairs of the nitrogen atoms contained in the polyacrylonitrile particles impart conductivity to the release layer.

[0014] An example of the configuration of a release film having a substrate layer, a release layer, and a conductive layer is shown schematically in Figure 1. The release film 40 shown in Figure 1 includes a substrate layer 10, a release layer 20, and a conductive layer 30 disposed between the substrate layer 10 and the release layer 20.

[0015] The release film has a base layer, which provides the release film with the necessary strength, and by appropriately selecting the material, the physical properties such as elongation and elastic modulus can be adjusted. By having a release layer on the release film, the release film can be easily peeled off from the adherend surface. By providing the release film with a conductive layer, discharge during application or removal of the release film is suppressed, and electrostatic damage to electronic components is effectively suppressed.

[0016] The total thickness of the release film is not particularly limited and can be set according to the desired physical properties (elongation, elastic modulus, etc.) For example, it may be 30 μm to 300 μm, 35 μm to 250 μm, or 40 μm to 200 μm.

[0017] (base material layer) The material of the substrate layer is not particularly limited. Examples include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, as well as resins such as polyimide, polyamide, polyester ether, polyamideimide, fluorine-containing resins, and thermoplastic elastomers. The substrate layer may contain one or more types of resins.

[0018] From the viewpoint of film handling, it is preferable that the release film has a certain degree of stiffness, and therefore the base layer preferably contains polyester, more preferably polyethylene terephthalate.

[0019] The base layer may or may not be stretched. If the base layer is stretched, the strength of the release film tends to be excellent, and if the base layer is not stretched, the elongation of the release film tends to be excellent.

[0020] The thickness of the base layer is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. When the thickness of the base layer is 10 μm or more, the release sheet is less likely to tear and has excellent handleability. The thickness of the substrate layer is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. When the thickness of the substrate layer is 300 μm or less, sufficient conformability to the adherend surface (the property of deforming to match the shape of the adherend surface) can be obtained.

[0021] The substrate layer may be composed of only one layer or two or more layers. Methods for obtaining a substrate layer composed of two or more layers include a method in which the materials for each layer are co-extruded, a method in which two or more films are laminated, and the like.

[0022] When the release film includes a conductive layer, the surface of the base layer on which the conductive layer is provided may be subjected to a treatment to improve adhesion to the conductive layer. Examples of the treatment method include surface treatment such as corona treatment and plasma treatment, and application of a primer.

[0023] If necessary, a backing treatment agent may be applied to the back surface of the substrate layer (the surface opposite to the side to be attached to the adherend surface) to adjust the unwinding property of the release film from the roll. Examples of backing treatment agents include silicone resins, fluorine-containing resins, polyvinyl alcohol, and resins having alkyl groups. If necessary, these backing treatment agents may be modified. One type of backing treatment agent may be used alone, or two or more types may be used in combination.

[0024] (Release layer) The material of the release layer is not particularly limited as long as it contains polyacrylonitrile particles. From the viewpoint of adhesion to the adherend surface, the release layer preferably has adhesiveness. As a method for imparting adhesiveness to the release layer, a method of incorporating an adhesive agent into the release layer can be mentioned.

[0025] The type of adhesive is not particularly limited and can be selected in consideration of adhesiveness, releasability, heat resistance, etc. Specifically, acrylic adhesives, silicone adhesives, and urethane adhesives are preferred, with acrylic adhesives being more preferred. The adhesive contained in the release layer may be of one type or two or more types.

[0026] The acrylic adhesive is preferably a copolymer (hereinafter also referred to as an acrylic copolymer) obtained by copolymerizing a monomer having a low glass transition temperature (Tg) (for example, −20° C. or lower) such as butyl acrylate, ethyl acrylate, or 2-ethylhexyl acrylate as the main monomer with a monomer having a functional group such as (meth)acrylic acid, hydroxyethyl (meth)acrylate, hydroxyethyl (meth)acrylate, (meth)acrylamide, or (meth)acrylonitrile. The above “glass transition temperature” refers to the glass transition temperature of a homopolymer obtained using the corresponding monomer.

[0027] The acrylic copolymer may be a cross-linked acrylic copolymer. The cross-linked acrylic copolymer can be synthesized by cross-linking the monomers that are the raw materials for the acrylic copolymer using a cross-linking agent. Examples of cross-linking agents used in synthesizing the cross-linked acrylic copolymer include known cross-linking agents such as isocyanate compounds, melamine compounds, and epoxy compounds. In addition, in order to form a network structure that spreads gently in the acrylic pressure-sensitive adhesive, the cross-linking agent is preferably a multifunctional cross-linking agent such as a trifunctional or tetrafunctional cross-linking agent.

[0028] The content of polyacrylonitrile particles in the release layer is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more of the entire release layer. When the content of polyacrylonitrile particles is 10% by mass or more of the entire release layer, the polyacrylonitrile particles function sufficiently as a conductive path in the release layer, and sufficient antistatic performance tends to be obtained. From the viewpoint of suppressing cohesive failure of the release layer and the generation of residues on the adherend surface, the content of polyacrylonitrile particles is preferably 50% by mass or less of the entire release layer, more preferably 40% by mass or less, and even more preferably 30% by mass or less.

[0029] From the viewpoint of imparting sufficient conductivity to the release layer, the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is preferably greater than 0.7, more preferably 0.75 or more, even more preferably 0.8 or more, even more preferably 0.9 or more, and even more preferably 0.95 or more. When the ratio (A / B) of the average particle diameter A of the polyacrylonitrile particles to the thickness B of the release layer is 0.75 or more, the polyacrylonitrile particles tend to function sufficiently as a conductive path, and sufficient antistatic performance tends to be obtained. From the viewpoint of suppressing detachment of polyacrylonitrile particles from the release layer, A / B is preferably 2.0 or less, and more preferably 1.7 or less.

[0030] The thickness B of the release layer is the thickness of the release layer containing polyacrylonitrile particles in the thickness direction of the release film. If the thickness is not constant, the cross section obtained after cutting the release film is observed with an SEM, and the arithmetic average value of the thicknesses at five arbitrarily selected points is taken as the thickness B of the release layer.

[0031] Furthermore, when the approximate resin composition can be determined by known analytical methods, the release layer can be removed using a solvent such as methyl ethyl ketone as described in the examples, and the thickness B of the release layer can be calculated from the difference in mass of the release film before and after removal, the specific gravity of the resin removed with the solvent, and the volume of the polyacrylonitrile particles remaining as insoluble matter.

[0032] The average particle size of the polyacrylonitrile particles may be, for example, in the range of 1 μm to 50 μm, in the range of 5 μm to 30 μm, or in the range of 7 μm to 20 μm.

[0033] In the present disclosure, the average particle size of particles is the particle size (D50) at which the cumulative amount from the small diameter side reaches 50% in the volume-based particle size distribution measured by a laser diffraction / scattering method.

[0034] The particle shape of the polyacrylonitrile particles is not particularly limited, and may be spherical or non-spherical (flat, irregular, etc.). From the viewpoint of incorporating a sufficient amount into the release layer, it is preferable that the polyacrylonitrile particles are non-spherical. For example, the average aspect ratio (major axis / minor axis) of the polyacrylonitrile particles may be 1.1 or more, 1.2 or more, or 1.5 or more. The average aspect ratio of the polyacrylonitrile particles may be 10 or less, 7 or less, or 5 or less. In the present disclosure, the average aspect ratio of particles is the arithmetic mean value of the aspect ratios of 100 arbitrarily selected particles.

[0035] The average particle size of polyacrylonitrile particles contained in a release film can be measured by the following procedure: The release layer of the release film is removed using a solvent such as methyl ethyl ketone, and the polyacrylonitrile particles remaining as insoluble matter are analyzed for volume-based particle size distribution measured by laser diffraction / scattering, and the particle size (D50) at which the cumulative total from the smallest diameter side reaches 50% is taken as the average particle size.

[0036] The release layer may contain only polyacrylonitrile particles, or may contain polyacrylonitrile particles and particles other than polyacrylonitrile particles.

[0037] The material of the particles other than the polyacrylonitrile particles is not particularly limited, and may be an organic substance such as a resin, an inorganic substance such as a metal or a metal oxide, or a combination of an organic substance and an inorganic substance.

[0038] From the viewpoint of affinity with the adhesive contained in the release layer, it is preferable that the particles other than polyacrylonitrile particles are resin particles. Examples of resins constituting the resin particles include acrylic resin, olefin resin, styrene resin, silicone resin, etc. From the viewpoint of suppressing residue on the surface of the semiconductor package after molding, acrylic resin is preferred.

[0039] The average particle size of the particles other than the polyacrylonitrile particles is not particularly limited and can be selected, for example, from the range of 1 μm to 20 μm.

[0040] When the release layer contains polyacrylonitrile particles and particles other than polyacrylonitrile particles, from the viewpoint of imparting sufficient conductivity to the release layer and suppressing cohesive failure of the release layer, it is preferable that the proportion of polyacrylonitrile particles in the total particles is 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.

[0041] The release layer may contain components other than the adhesive and particles, as needed, such as an anchoring improver, a crosslinking accelerator, a colorant, etc.

[0042] The thickness of the release layer is not particularly limited, but is preferably 0.1 μm or more, more preferably 1 μm or more. When the thickness of the release layer is 0.1 μm or more, sufficient adhesive strength to electronic components is obtained, and penetration of the sealing material is effectively suppressed. The thickness of the release layer may be 100 μm or less, 50 μm or less, or 10 μm or less. When the thickness of the release layer is 100 μm or less, heat shrinkage stress is less likely to occur during thermal curing of the release layer, and the flatness of the release film is easily maintained. Furthermore, when the release film has a conductive layer, the distance from the conductive layer to the surface of the release layer is not too far, so that the surface resistivity is maintained low, and electrostatic damage to electronic components is effectively suppressed. Taking into consideration the ease of forming the release layer (such as coating properties), ensuring adhesive strength, ensuring antistatic properties, etc., it is more preferable that the thickness of the release layer is 3 μm to 50 μm.

[0043] (Conductive layer) The conductive layer is not particularly limited in configuration as long as it can increase the conductivity of the release film and suppress charging. For example, it may be a layer containing a conductive material such as an antistatic agent, a conductive polymer material, or a metal.

[0044] Examples of antistatic agents contained in the conductive layer include cationic antistatic agents having cationic groups such as quaternary ammonium salts, pyridinium salts, and primary to tertiary amino groups; anionic antistatic agents having anionic groups such as sulfonate groups, sulfate groups, and phosphate groups; amphoteric antistatic agents such as amino acid-based and amino acid sulfate-based; nonionic antistatic agents having nonionic groups such as amino alcohol-based, glycerin-based, and polyethylene glycol-based; and polymeric antistatic agents obtained by increasing the molecular weight of these antistatic agents. The antistatic agent may be a combination of a main agent and an auxiliary agent (such as a curing agent). Examples of the conductive polymer material contained in the conductive layer include polymer compounds having polythiophene, polyaniline, polypyrrole, polyacetylene, or the like in the skeleton. Examples of metals include aluminum, copper, gold, chromium, and tin, with aluminum being preferred from the viewpoint of availability.

[0045] The method for forming the conductive layer is not particularly limited, and examples thereof include a method of laminating a metal foil or the like on one side of a film that will serve as a base layer, and a method of applying a material for the conductive layer to one side of a film that will serve as a base layer by coating, vapor deposition, or the like.

[0046] The thickness of the conductive layer is not particularly limited as long as it provides a sufficient antistatic effect for the release film, and may be, for example, within the range of 0.01 μm to 1 μm.

[0047] The release film of the present disclosure can be used for various purposes. For example, it can be used to temporarily protect at least a part of the surface of an object. Since the release film of the present disclosure has excellent conformability to the adherend surface, when processing is performed around the area where the release film is attached, the area can be effectively protected from the influence of the processing. In the present disclosure, "temporarily protect" refers to protecting the part of the surface of an object to which the release film is attached from the time the release film is attached to at least a part of the surface until the time the release film is peeled off.

[0048] The type of processing to be performed on the periphery of the region where the release film is attached is not particularly limited. Specific examples include sealing with a sealant, roughening treatment, painting treatment, water-repellent treatment, antistatic treatment, etc. The release film may be one used in exposure molding.

[0049] <Electronic component device manufacturing method> The method for manufacturing an electronic component device of the present disclosure includes a step of sealing the periphery of the electronic component with the above-mentioned release film in contact with at least a portion of the surface of the electronic component, and a step of peeling the release film from the electronic component.

[0050] As described above, the release film of the present disclosure has excellent antistatic properties, which effectively suppresses the occurrence of electrostatic damage to electronic components.

[0051] The type of electronic component used in the above method is not particularly limited, and examples thereof include semiconductor elements, capacitors, terminals, etc. In the above method, the type of material (sealant) used to seal the periphery of the electronic component is not particularly limited, and examples thereof include resin compositions containing epoxy resins, acrylic resins, etc. [Example]

[0052] The release film of the present disclosure will be described below based on examples, although the present disclosure is not limited to the following examples.

[0053] Example 1 As the substrate layer, a biaxially stretched polyethylene terephthalate film (product name "S-38", Unitika Ltd.) having a thickness of 38 μm and having been subjected to a corona treatment on one side was prepared. The following antistatic agent diluted to 2.5% by mass with a mixed solvent (water / isopropyl alcohol = 1 / 1 (mass ratio)) was applied to the corona-treated surface of the substrate layer, and heated at 100°C for 1 minute to form a conductive layer.

[0054] The antistatic agent used in producing the release film was a mixture of the following component A (100 parts by mass) and component B (25 parts by mass).

[0055] Component A: Cationic antistatic agent, an acrylic copolymer containing a quaternary ammonium salt, product name "Bondip PA-100 Main Agent", Konishi Co., Ltd. Component B: Epoxy hardener, product name "Bondip PA-100 Hardener", Konishi Co., Ltd.

[0056] The following composition for forming a release layer was applied onto the formed conductive layer and heated at 100° C. for 1 minute to form a release layer, thereby producing a release film. The release layer forming composition used to prepare the release film was a mixture of the following adhesive (100 parts by mass), crosslinking agent (10 parts by mass), resin particles A (25 parts by mass), and 34 parts by mass of a mixed solvent (toluene / methyl ethyl ketone = 8:2 (mass ratio)).

[0057] Adhesive: Acrylic adhesive, product name "B-3", Lion Specialty Chemicals Co., Ltd., mixture of multiple methacrylate ester monomers Crosslinking agent: Hexamethylene diisocyanate crosslinking agent, product name "Coronate H-CL", Nippon Polyurethane Industry Co., Ltd. Resin particles A: Polyacrylonitrile particles, product name "Tuftic ASF-7", Toyobo Co., Ltd., volume average particle diameter: 7 μm, irregular shape

[0058] <Example 2> A release film was produced in the same manner as in Example 1, except that the amount of resin particles A was changed to 30 parts by mass.

[0059] Example 3 A release film was produced in the same manner as in Example 1, except that the amount of resin particles A was changed to 40 parts by mass.

[0060] Example 4 A release film was produced in the same manner as in Example 1, except that the resin particles A were changed to the following resin particles B and the amount thereof was changed to 30 parts by mass. Resin particles B: Polyacrylonitrile particles, product name "Tuftic AM", Toyobo Co., Ltd., volume average particle diameter: 10 μm, irregular shape

[0061] <Example 5> A release film was produced in the same manner as in Example 1, except that the amount of resin particles A was changed to 15 parts by mass.

[0062] <Comparative Example 1> A release film was produced in the same manner as in Example 1, except that resin particles A were not added to the composition for forming a release layer.

[0063] <Comparative Example 2> A release film was produced in the same manner as in Comparative Example 1, except that 25 parts by mass of the following resin particles C were added to the composition for forming a release layer. Resin particles C: Polyacrylic particles, product name "MX-1000", Soken Chemical & Engineering Co., Ltd., volume average particle size: 10 μm, spherical

[0064] <Comparative Example 3> A release film was produced in the same manner as in Comparative Example 2, except that the amount of resin particles C was changed to 40 parts by mass.

[0065] <Comparative Example 4> A release film was produced in the same manner as in Comparative Example 2, except that resin particles C were changed to 25 parts by mass of resin particles D described below. Resin particles D: Polyacrylic particles, product name "MX-500", Soken Chemical & Engineering Co., Ltd., volume average particle diameter: 5 μm, spherical

[0066] <Comparative Example 5> A release film was produced in the same manner as in Comparative Example 4, except that the amount of resin particles D was changed to 40 parts by mass.

[0067] <Evaluation test> The prepared release films were subjected to the following evaluation tests.

[0068] <Release layer thickness> The release layer of the prepared release film was removed using methyl ethyl ketone, and the thickness of the release layer was calculated from the difference in mass of the release film before and after removal. The results are shown in Table 1.

[0069] <Glue residue> A release film was pressed onto the surface of a mirror-finished SUS (stainless steel) plate at 180°C, 16 MPa, and 5 minutes. After pressing, the plate was left to cool to room temperature (25°C), and then the release film was peeled off from the SUS plate. The surface of the SUS plate was visually inspected, and the condition of the adhesive residue was evaluated as OK if no adhesive residue was observed, or NG if adhesive residue was observed. The results are shown in Table 1.

[0070] <Surface resistivity> The surface resistivity of the release layer side of the release film was measured using an insulation resistance meter (digital ultra-high resistance / microcurrent meter manufactured by Advantest Corporation). Specifically, the release film was left in an atmosphere of 23±2°C and 50±10%RH for 1 hour, and then a voltage of 500V was applied for 1 minute, after which the surface resistance value (Ω) was measured, and the surface resistivity (Ω / □) was calculated using the following formula. The results are shown in Table 1.

[0071] Surface resistivity=π(D+d) / (Dd)×R π: Pi, D: Inner diameter of ring electrode, d: Outer diameter of ring electrode, R: Surface resistance The value of π(D+d) / (Dd) used to calculate the surface resistivity was 18.84.

[0072] [Table 1]

[0073] As shown in the results in Table 1, the release films of the examples, in which the release layer contains polyacrylonitrile particles, have lower surface resistivity than the release films of the comparative examples, in which the release layer does not contain polyacrylonitrile particles, and can be judged to have excellent antistatic performance.

Claims

1. a substrate layer, a conductive layer, and a release layer in this order, the release layer containing polyacrylonitrile particles; A release film, wherein the ratio (A / B) of the average particle size A of the polyacrylonitrile particles to the thickness B of the release layer is 1.04 or more.

2. 2. The release film according to claim 1, wherein the ratio (A / B) of the average particle size A of the polyacrylonitrile particles to the thickness B of the release layer is 2.0 or less.

3. 3. The release film according to claim 1, wherein the content of the polyacrylonitrile particles is 10% by mass or more of the entire release layer.

4. The release film according to any one of claims 1 to 3, wherein the release layer contains an adhesive.

5. The release film according to any one of claims 1 to 4, for temporarily protecting at least a part of the surface of an object.

6. The release film according to any one of claims 1 to 5, which is for exposure molding.

7. 7. A method for manufacturing an electronic component device, comprising: a step of sealing the periphery of an electronic component with the release film according to claim 1 in contact with at least a portion of the surface of the electronic component; and a step of peeling the release film from the electronic component.

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