Sealing assembly for glass, sealing glass and method of manufacturing the same

Abstract

The present disclosure provides a sealing assembly for functional glass, a sealing glass, and a manufacturing method thereof. The sealing assembly includes a body disposed on the edge of the functional glass; and a conductive module embedded in the body or disposed on the surface of the body and electrically connected to a functional module on the functional glass. The process of forming the sealing glass from the sealing assembly for functional glass according to embodiments of the present disclosure can eliminate complex manufacturing steps, save materials, and therefore reduce costs. Simple and stable control of the functional module within the glass can also be achieved. Furthermore, it is much easier to form the sealing glass from the aforementioned glass, which facilitates installation of the glass.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to sealed glass, and more particularly to a sealing assembly for glass and a method for manufacturing the sealed glass. [Background technology]

[0002] With the continued development of industries (e.g., the automotive industry), there is a growing need to integrate more and more functions into glass. For example, some automotive glass is integrated with color-changing or transparency-adjusting functions to adjust color and transparency in response to changes in the surrounding environment (e.g., temperature, etc.). Other glass is integrated with functions such as lighting, displays, touch, antennas, and heating. Regarding color-changing or transparency-adjusting glass, some automotive glass currently uses polymer-dispersed liquid crystal (PDLC) laminated glass. PDLC has electrochromic or electrically induced transparency properties. Therefore, in laminated glass using PDLC, the transparency of the laminated glass can be adjusted by controlling control parameters such as the voltage applied to the PDLC layer via a chip, thereby achieving objectives such as privacy protection.

[0003] Currently, electronic components (e.g., chips) for controlling functional modules such as PDLC are usually placed on a circuit board independent of the encapsulated glass, and the circuit board is connected to the functional modules on the glass, an external power supply module, and an external data module through complex wiring or connectors. Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional encapsulation assemblies for glass with electronic components suffer from problems such as complex wiring, assembly and processing difficulties, etc. Embodiments of the present disclosure provide a glass encapsulation assembly that solves or at least partially solves the above problems and other potential problems with conventional glass encapsulation assemblies. [Means for solving the problem]

[0005] In a first aspect of the present disclosure, a sealing assembly for glass is provided, the sealing assembly including: a body disposed on an edge of functionalized glass; and a conductive module embedded in the body or disposed on a surface of the body and electrically connected to a functional module on the functionalized glass.

[0006] In some embodiments, the conductive module includes a conductive trace and a polymer matrix, the conductive trace being formed on the polymer matrix.

[0007] In some embodiments, the conductive module includes an interface coupled to the functional module, an external power module, an external signal module, and / or an electronic component.

[0008] In some embodiments, the interface comprises a connector or an interface circuit.

[0009] In some embodiments, the encapsulation assembly further comprises an electronic component electrically connected to the functional module via the conductive module to enable control of a function of the functional module.

[0010] In some embodiments, the electronic components are disposed on the body or the polymer matrix via Surface Mount Technology or Dual In-line Packaging technology and are electrically connected to the conductive traces.

[0011] In some embodiments, the electronic components include at least one of a microcontroller, a voltage converter, and / or a bus transceiver.

[0012] In some embodiments, the voltage converter comprises a DC converter or a DC-AC converter.

[0013] In some embodiments, the bus transceiver comprises at least one of a controller area network bus transceiver and a local interconnect network bus transceiver.

[0014] In some embodiments, the body is formed by injection molding.

[0015] In some embodiments, the body comprises at least one of a thermoplastic elastomer material, a polyvinyl chloride material or polyurethane, an acrylonitrile-butadiene-styrene plastic, polypropylene (PP), polyethylene terephthalate (PET), ethylene propylene rubber (EPDM), and a thermoplastic vulcanizate material.

[0016] In a second aspect of the present disclosure, there is provided a sealed glass, the sealed glass comprising: a functional glass having a functional module disposed therein or thereon; and the sealed assembly of the first aspect attached to the functional glass to form the sealed glass.

[0017] In some embodiments, the functional module is used to provide at least one of the following functions: color change, transparency adjustment, lighting, display, touch, solar power generation, heating, or communication.

[0018] In a third aspect of the present disclosure, a method for manufacturing a sealed glass is provided, the method comprising: providing a functional glass and a conductive module, the conductive glass including a functional module and the conductive module being used for electrical connection to the functional module; placing the functional glass in a suitable position in a mold; placing the conductive module in the mold, such that the conductive module is subsequently embedded in a body formed by injection molding or disposed on a surface of the body formed by injection molding; and forming the body by injection molding.

[0019] In some embodiments, the step of providing a conductive module comprises forming conductive traces on a polymer matrix.

[0020] In some embodiments, the manufacturing method further comprises electrically connecting an electrical component to the conductive module before forming the body on the edge of the glass.

[0021] In some embodiments, the manufacturing method further comprises electrically connecting an electrical component to the conductive module after forming the body on the edge of the glass.

[0022] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the disclosure, nor is it intended to be used to limit the scope of the disclosure. [Brief explanation of the drawings]

[0023] The above and other objects, features, and advantages of the present disclosure will become more apparent through the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings, in which like reference numerals generally represent like elements. [Figure 1] FIG. 1 is a perspective view of a sealed glass according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic diagram of a conductive module according to an embodiment of the present disclosure. [Figure 3] FIG. 3 is a flowchart illustrating a method for manufacturing a sealed glass according to an embodiment of the present disclosure.

[0024] Throughout the drawings, the same or like reference numbers refer to the same or like elements. DETAILED DESCRIPTION OF THE INVENTION

[0025] The present disclosure will be described in detail below with reference to some exemplary embodiments. It should be understood that these embodiments of the present disclosure are provided to enable those skilled in the art to better understand and thus practice the present disclosure, without implying any limitation on the scope of the technical solutions of the present disclosure.

[0026] As used herein, the term "comprises" and variations thereof should be read as open-ended terminology meaning "including, but not limited to." The term "based on" should be interpreted as "based at least in part on." The terms "one embodiment" and "embodiment" should be read as "at least one embodiment." The term "other embodiments" should be read as "at least other embodiments." Terms such as "first," "second," etc. can refer to different or the same object. Other definitions, either explicit or implicit, may be included below. Definitions of terms will be consistent throughout the specification unless the context clearly dictates otherwise.

[0027] The use of glass with a sealing assembly (i.e., sealed glass) is more frequently applied to vehicles (e.g., automobiles, trains, or aircraft) and is a current trend in technological development. Sealed glass not only provides excellent sealing performance and facilitates glass assembly, but also maintains desirable bond strength after assembly. Furthermore, sealed glass has the advantage of convenient replacement when it needs to be replaced.

[0028] For example, with the continuous development of technology, glass will be provided with various additional functions. For example, in situations where privacy protection is required, it is expected that glass will be provided with adjustable transparency as needed. Glass can also be provided with a color-changing layer to form laminated glass whose color can be adjusted as needed. In addition to the above functions, glass can be integrated with other functions such as lighting, display, touch, antenna, solar power generation, heating, etc. Furthermore, some glass is integrated with sensing elements (e.g., sensors) for sensing pressure, temperature, etc.

[0029] To achieve these functions, additional electronic components are required to connect the functional modules within the glass with external modules, such as power and data modules, outside the glass. These electronic components are typically located on a circuit board, separate from the encapsulating glass. The circuit board connects the functional modules of the glass to the external power or control modules via complex wiring.

[0030] For example, conventional solutions include using flat metal connectors to connect electrical inputs for controlling the glass's functional modules to the automobile's electronic control unit, which may require welding of the connectors. On the one hand, measures using connectors result in bulky sealing structures. On the other hand, conventional solutions require additional materials and processes such as welding. In addition, this type of solution also hinders the manufacture of sealed glass.

[0031] Furthermore, the complicated wiring involved further increases the difficulty of installation during the installation of the glass, thus affecting the installation efficiency. Since such wiring is independent of the sealed glass, it is easy for problems such as disconnection to occur when assembling the glass, resulting in a poor user experience.

[0032] Embodiments of the present disclosure provide a sealing assembly 100 for functional glass that integrates a conductive module 102 into the body 101 of the sealing assembly 100 to solve or at least partially address the above-mentioned and / or other potential problems of conventional sealing assemblies and sealed glasses. Several exemplary embodiments will now be described with reference to FIGS. 1-2.

[0033] As shown in FIG. 1 , a sealing assembly 100 according to an embodiment of the present disclosure generally includes a body 101 disposed on an edge of a functional glass 201, and a conductive module 102. As used herein, the functional glass 201 may be, for example, a vehicle glass such as an automobile door glass, sunroof glass, corner window glass, and / or windshield glass. It should be understood that the functional glass 201 may also be glass applied to other industries or technologies. The functional glass 201 includes a functional module. For example, in some embodiments, the functional glass 201 may be laminated glass, and the functional module may be sandwiched between two layers of glass. Of course, in some alternative embodiments, the functional glass 201 may be tempered glass, and the functional module is attached to the surface of the glass. The functional module may provide at least one of the following functions: color change, transparency adjustment, or heating.

[0034] Of course, it should be understood that the above-described embodiments regarding at least one of the functions provided by the functional module are merely for illustrative purposes, without implying any limitation on the scope of the present disclosure. Any other suitable modules or arrangements are possible. For example, in some alternative embodiments, the functional module may also be a module for providing communication functions located on or outside the glass.

[0035] In some other alternative embodiments, functional modules within the functional glass 201 can be used to provide functions such as display (e.g., via an LCD screen), lighting, touch, photovoltaic power generation, etc. In addition to being applied to vehicles, the functional glass of the present disclosure can also be architectural glass, showcase glass, liquid crystal glass used in electronic products, etc. Furthermore, as mentioned above, the various functions provided by the functional modules can be implemented by various layers, modules, or sensors between layers of the glass or on the surface of the glass. It should be understood that other modules suitable for placement on the glass to perform various functions are covered by the scope of the present disclosure.

[0036] The sealing assembly for the functional glass can be formed on the edge of the functional glass 201 by injection molding, the specific process of which is further described below. However, it should be understood that the sealing assembly 100 for the functional glass 201 can be pre-formed and then attached to the glass 201 by adhesive, snap-fit ​​connection, etc. to form the sealed glass. Furthermore, as used herein, edge may refer to the proximity of the boundary of the extended surface of the glass in a narrow sense. In some alternative embodiments, edge may refer to any location on the outer contour of the glass in a broad sense, such as any location adjacent to the boundary of the extended surface of the glass, any location adjacent to the center of the extended surface of the glass, or any location therebetween.

[0037] In contrast to conventional sealing assemblies for functional glass, the sealing assembly 100 for functional glass 201 according to an embodiment of the present disclosure includes a conductive module 102 disposed within the body 101 or on the surface of the body 101 and electrically connected to the functional module.

[0038] By integrating the conductive module 102, which is electrically connected to the functional module, into the body 101 of the sealing assembly 100, complex wiring is no longer required when connecting the functional glass functional module, making it more convenient to install the functional glass in a desired location. Furthermore, since wiring is no longer required, problems such as wire breakage that may occur during the assembly process are eliminated, thereby improving the stability of the functional module and the user experience.

[0039] In some embodiments, the conductive module 102 may include conductive traces 1021 and a polymer matrix 1022. As used herein, the conductive traces 1021 may refer to any electrically connected metal wires or lines, or any conductive lines printed on a matrix. For example, in some embodiments, the conductive traces 1021 may be disposed on the polymer matrix 1022, such as by a printing technique. The polymer matrix 1022 with the conductive traces 1021 may then be attached to the seal 101 during manufacturing of the glass seal assembly 100. In some embodiments, to facilitate attachment of the conductive module 102 to the body 101, the polymer matrix 1022 may be in the form of a film, i.e., the polymer matrix 1022 may be a polymer film.

[0040] Furthermore, it should be understood that the embodiment in which the conductive traces 1021 are disposed on the polymer matrix 1022 and then attached to the body 101 is merely for illustrative purposes, without implying any limitation on the scope of the present disclosure, and that other suitable methods are possible. For example, in some alternative embodiments, the conductive traces 1021 are disposed directly on the body 101 at suitable locations in a suitable manner.

[0041] In some embodiments, the encapsulation assembly 100 can include an electronic component 103. The electronic component 103 is electrically connected to a functional module of the functional glass 201 via a conductive module 102. The electronic component 103 can be used to control the function of the functional module. The electronic component 103 can be of various forms, which are described further below.

[0042] It should be understood that the embodiment in which the encapsulation assembly 100 includes the electronic component 103 is for illustrative purposes only, without implying any limitation on the scope of the present disclosure. Any other suitable method or arrangement is possible. For example, in some other alternative embodiments, the encapsulation assembly 100 may not include the electronic component 103. For example, the conductive module 102 may be directly connected to a control system of an automobile or the like to control various functions of the functional modules.

[0043] In some embodiments, the electronic components 103 may be attached to the conductive module 102 before the conductive module 102 is attached to the body 101. For example, in some embodiments, the electronic components 103 may be disposed on the polymer matrix 1022 with conductive traces 1021 using surface mount technology (SMT). In some alternative embodiments, the electronic components 103 may be disposed on the polymer matrix 1022 using dual in-line package (DIP) technology. In this manner, the electronic components 103 may be electrically connected to the functional module to enable control of various functions of the functional module.

[0044] Of course, it should be understood that the embodiment in which the electronic component 103 may be attached to the conductive module 102 before the conductive module 102 is attached to the body 101 is merely for illustrative purposes, without implying any limitation on the scope of the present disclosure. Any other suitable process or arrangement is possible. For example, in some alternative embodiments, in the manufacturing process of the sealing glass 200 or the sealing assembly 100, after the body 101 with the conductive module 102 attached is formed, the electronic component 103 may be attached to the body 101 using SMT, DIP, etc. This manufacturing process allows the electronic component to be conveniently maintained or replaced in the event of a failure, thereby improving maintenance efficiency.

[0045] As mentioned above, the body 101 may be a frame structure attached to the functionalized glass 201 to allow the functionalized glass 201 to be attached to a desired location, such as in a vehicle, an electronic device, etc. In some embodiments, the body 101 may be formed around the functionalized glass 201 by injection molding, as shown in Figure 1. For example, during injection molding, the functionalized glass 201 and / or the conductive module 102 are first placed in an appropriate position in a mold, and then at least one material, such as a thermoplastic elastomer (TPE) material, a polyvinyl chloride (PVC) material or polyurethane (PU), acrylonitrile-butadiene-styrene plastic (ABS), polypropylene (PP), polyethylene terephthalate (PET), ethylene propylene rubber (EPDM), and a thermoplastic vulcanizate (TPV) material, is injected into the mold to form the glass sealing assembly 100.

[0046] As noted above, it should be understood that reference to at least one of the above materials may refer to the injection of two or more of these materials into a mold, either sequentially or in different steps, to perform different functions, such as sealing, securing, etc. In some alternative embodiments, two or more of these materials may be mixed together before being injected into a mold.

[0047] Of course, it should also be understood that the embodiment in which the body 101 serves as a frame for the functional glass 201 is merely for illustrative purposes, without implying any limitation on the scope of the present disclosure. Any other suitable structure or arrangement is feasible. For example, in some alternative embodiments, the body 101 may be a film or bump structure disposed on the edge of the glass and equipped with the conductive module 102. Such an arrangement allows the glass sealing assembly 100, and even the sealed glass, to be applied in more occasions. For example, when a frame structure is not required (i.e., only the glass can be seen from a structural point of view), the glass equipped with the body 101 (e.g., a film or bump structure body) having the conductive module 102 can be directly attached to the desired position.

[0048] In other words, the body 101 as used herein may refer to any suitable member for disposing the conductive module. The body 101 may be integrally formed with the glass sealing assembly 100 during manufacturing of the glass sealing assembly 100. Any suitable body 101 that meets the above conditions is within the scope of the present disclosure.

[0049] The conductive module may have an interface. The conductive wiring 1021 may be coupled to the functional module via the interface and a connector or interface circuit within the functional module. In this manner, the electronic component 103 may control the functional module via the conductive wiring 1021. Furthermore, to perform the control, the conductive wiring 1021 may further include an external power module (e.g., a power supply), an external signal module, or an interface coupled to the electronic component 103 in some embodiments.

[0050] In some embodiments, the external signal module referred to herein may refer to an external control unit that can send command signals to the electronic component 103 and / or receive feedback signals from the electronic component 103. For example, if the sealing assembly 100 is applied to an automobile window, the external signal module may be an automobile control unit for controlling various functions of the automobile. Of course, in some alternative embodiments, the external signal module may be a sensor unit for sending a sensor signal or receiving a control signal. For example, the external signal module may also be a temperature sensor for sending a temperature signal to the electronic component 103 or an automobile control unit to control the function of a functional module. Furthermore, an interface coupled to the electronic component 103 may refer to a slot for facilitating the insertion of the electronic component 103, such as a chip.

[0051] The interface between the conductive module 102 and the functional module may be a connector or an interface circuit. For example, in some embodiments, the connector may be a two-pin socket that allows insertion of a plug for an external power source. In this way, the conductive module 102, the electronic component 103, and the external power module or the external signal module may be electrically connected more conveniently. Of course, in some alternative embodiments, the interface may also be only an interface circuit, and the external power module or the control module may be coupled to the interface circuit in an appropriate manner (e.g., SMT, etc.). For example, the interface circuit may refer to pins that are integrated with or electrically connected to the conductive traces 1021. This approach achieves a higher degree of integration and a much simpler structure.

[0052] Of course, it should be understood that in addition to the above-described wired connection, the interface can also refer to a wireless connection interface. In other words, the interface can also communicate with an external power supply module or an external signal module in a wireless connection manner. For example, in some embodiments, the interface can implement wireless power transmission using electromagnetic induction technology. In some alternative embodiments, the interface can implement the transmission of data for controlling the functional module via Bluetooth, WiFi, etc.

[0053] In some embodiments, a varying voltage signal needs to be applied to the functional module to control it. For example, if the transparency of a polymer-dispersed liquid crystal (PDLC) layer needs to be adjusted, a different voltage needs to be applied to the PDLC layer. In these embodiments, the electronic component 103 may include at least a microwave and a direct current (DC-DC) converter or a direct current to alternating current (DC-AC) and / or a variable DC-DC converter. For example, the electronic component may be coupled to direct current supplied from an external power module, such as an automobile power supply. Depending on the needs of the functional module, the microcontroller converts the input voltage to the desired voltage through the DC-DC converter and outputs the voltage to the functional module through the interface to realize the function required by the functional module.

[0054] For example, the functional module can be a PDLC layer made of electrochromic or electrochromic material that can change transparency. The PDLC layer can be formed in the glass by lamination and has an interface for the conductive module 102 to be coupled to. Meanwhile, the microcontroller can be coupled to an external control module or sensor, i.e., an external signal module. Based on a signal from the external signal module, for example, a control signal from a user to reduce the transparency of the glass or a sensor signal from a sensor indicating that the temperature is higher than a predetermined value, the microcontroller controls the DC-DC converter to convert the input voltage to a voltage value that reduces the transparency of the PDLC layer, thereby controlling the PDLC layer and achieving the desired function.

[0055] Of course, it should be understood that the embodiments relating to DC-DC converters are for illustrative purposes only, without implying any limitation on the scope of the present disclosure. Any other suitable converter is possible. For example, in some alternative embodiments, the electronic components may also include a DC-AC converter or a DC-variable DC converter. In some alternative embodiments, if the input is alternating current (AC), the electronic components may include an AC-DC converter or an AC-AC converter.

[0056] In addition to the microcontroller and voltage converter, the electronic component 103 may also include a bus transceiver for transmitting signals, such as control signals or sensor signals. For example, if the glass is automotive glass, the bus transceiver may include a Controller Area Network (CAN) transceiver and / or a Local Interconnect Network (LIN) bus transceiver. This arrangement allows the electronic component to be connected to the vehicle's control system via the CAN bus and / or LIN bus to perform additional functions. For example, a user may control transparency, etc., via voice control via the vehicle's control system.

[0057] Of course, it should be understood that the embodiments relating to devices included in electronic component 103 are for illustrative purposes only, are not exhaustive, and are not intended to limit the scope of the present disclosure. Any other suitable devices or modules are possible. For example, in embodiments in which the functional module includes a display layer, electronic component 103 may also include a display control chip for controlling the display of the display layer. Alternatively, in some other alternative embodiments, if the functional module provides touch functionality, electronic component 103 may also include a touch chip, etc.

[0058] According to another aspect of the present disclosure, a sealed glass 200 is provided. The sealed glass 200 is formed by attaching the above-described sealing assembly 100 to functional glass 201 in a suitable manner (e.g., by injection molding). As previously mentioned, the functional glass 201 may be laminated glass, i.e., the functional module is disposed between two layers of glass. In some alternative embodiments, the functional glass 201 may be tempered glass, and the functional module is attached to the surface of the glass. The sealed glass 200 according to embodiments of the present disclosure provides convenient and easy installation of glass, such as automotive glass, thereby reducing installation costs.

[0059] According to a further aspect of the present disclosure, there is provided a method for manufacturing the sealed glass 200. Figure 3 shows a flowchart of the method for manufacturing the sealed glass 200 according to an embodiment of the present disclosure. As shown in Figure 3, in block 310, a functional glass 201 and a conductive module 1011 are provided. The conductive module 1011 is electrically connected to the functional film in the functional glass 201.

[0060] In block 320, the functional glass 201 is placed in an appropriate position in a mold. For example, if the main body 101 is a frame structure surrounding the functional glass, the mold for forming the main body 101 can surround the functional glass 201. Next, in block 330, the conductive module 102 is placed in the mold, so that the conductive module 102 is subsequently embedded in the main body (101) formed by injection molding or disposed on the surface of the main body (101) formed by injection molding. In block 340, the main body 101 is formed by injection molding. Here, at least a portion of the conductive module 102 needs to be coupled to an interface of the functional module in the functional glass 201 to facilitate subsequent control of the functional module.

[0061] In some embodiments, the conductive module 102 can be obtained by pre-disposing the conductive traces 1021 on the polymer matrix 1022. In some embodiments, on the polymer matrix 1022 formed with the conductive traces 1021, the electronic components 103 can be attached to the polymer matrix 1022 via SMT or the like to electrically connect to the conductive traces 1021. The polymer matrix 1022 with the conductive traces 1021 and the electrical components 103 is then placed in a suitable position in a mold. Subsequently, the body 101 is formed by injection molding, and the conductive module 102 and the electronic components 103 are embedded together in the body 101. By embedding the conductive module 102 and the electronic components 103 together in the body 101, the encapsulation assembly 100 becomes more integrated and easier to maintain and assemble.

[0062] In some embodiments, a polymer matrix 1022 (such as a film) with conductive traces 1021 can be placed directly in the appropriate locations on the mold, which then forms the body 101. Electronic components 103 are then attached to the body 101 and electrically connected to the conductive traces 1021.

[0063] As can be seen from the above description, by forming the sealed glass 201 from the sealing assembly 100 of the functionalized glass 201 according to the embodiment of the present disclosure, complicated manufacturing processes and materials can be omitted, thus reducing costs. Easy and stable control of the functional modules in the functionalized glass 201 can also be achieved. Furthermore, it is much easier to form the sealed glass 200 from the functionalized glass 201, thus facilitating installation of the glass.

[0064] It should be understood that the above description of various embodiments of the present disclosure is presented for the purpose of illustration or description of the principles of the present disclosure, without implying any limitation to the present disclosure. Therefore, any modifications, equivalent replacements, improvements, etc. within the spirit and principles of the present disclosure shall fall within the scope of protection of the present disclosure. Furthermore, the appended claims are intended to cover all changes and modifications that fall within the scope and boundaries equivalent to their scope and boundaries. The present invention includes the following aspects: <Aspect 1> a body (101) disposed on the edge of the functional glass (201); and A conductive module (102) embedded in the body (101) or disposed on the surface of the body (101) and electrically connected to a functional module on the functional glass (201). A sealing assembly (100) for functionalized glass, comprising: <Aspect 2> the conductive module (102) comprises a conductive trace (1021) and a polymer matrix (1022); The conductive traces (1021) are formed on the polymer matrix (1022). The closure assembly (100) of embodiment 1. <Aspect 3> The sealing assembly (100) of aspect 1 or 2, wherein the conductive module (102) includes an interface coupled to the functional module, an external power supply module, an external signal module, and / or an electronic component (103). <Aspect 4> 4. The sealing assembly (100) of embodiment 3, wherein the interface comprises a connector or an interface circuit. <Aspect 5> The sealing assembly (100) of aspect 1 or 2 further includes an electronic component (103) electrically connected to the functional module via the conductive module (102) to enable control of the function of the functional module. <Aspect 6> The encapsulation assembly (100) of aspect 5, wherein the electronic component (103) is disposed on the body (101) or the polymer matrix (1022) via surface mount technology (SMT) or dual in-line packaging (DIP) technology and is electrically connected to the conductive wiring. <Aspect 7> 6. The encapsulation assembly (100) of embodiment 5, wherein the electronic component (103) comprises at least one of a microcontroller, a voltage converter, and / or a bus transceiver. <Aspect 8> 8. The sealing assembly (100) of embodiment 7, wherein the voltage converter comprises a direct current (DC-DC) converter or a direct current to alternating current (DC-AC) converter. <Aspect 9> 8. The sealing assembly (100) of embodiment 7, wherein the bus transceiver comprises at least one of a controller area network (CAN) bus transceiver and a local interconnect network (LIN) bus transceiver. <Aspect 10> 2. The closure assembly of claim 1, wherein the body is formed by injection molding. <Aspect 11> The sealing assembly (100) of aspect 1, wherein the body (101) comprises at least one of a thermoplastic elastomer (TPE) material, a polyvinyl chloride (PVC) material or a polyurethane (PU), an acrylonitrile-butadiene-styrene plastic (ABS), a polypropylene (PP), a polyethylene terephthalate (PET), an ethylene propylene rubber (EPDM), and a thermoplastic vulcanizate (TPV) material. <Aspect 12> Sealing glass (200), including: Functional glass (201) containing functional modules disposed therein or thereon; and A sealing assembly (100) according to any one of aspects 1 to 11 attached to the functional glass (201) to form the sealed glass (200). <Aspect 13> 13. The sealed glass (200) of embodiment 12, wherein the functional module is used to provide at least one function of color change, transparency adjustment, lighting, display, touch, solar power generation, heating, or communication. <Aspect 14> providing a functional glass (201) and a conductive module (102), the conductive glass (201) containing a functional module, and the conductive module (102) being used for electrical connection to the functional module; placing said functional glass (201) in a suitable position in a mold; placing the conductive module (102) in the mold, so that the conductive module is subsequently embedded in or disposed on the surface of the injection-molded body (101); and forming the body (101) by injection molding; A method for manufacturing a sealing glass (200), comprising: <Aspect 15> 15. The method of claim 14, wherein the step of providing the conductive module (102) comprises forming conductive traces (1021) on a polymer matrix (1022). <Aspect 16> 15. The manufacturing method of claim 14, further comprising electrically connecting an electrical component (103) to the conductive module (102) before forming the body (101) on an edge of the glass (201). <Aspect 17> 15. The manufacturing method of claim 14, further comprising electrically connecting an electrical component (103) to the conductive module (102) after forming the body (101) on the edge of the glass (201).

Claims

1. A sealing assembly (100) for functional glass, comprising: The sealing assembly (100) a body (101) to be placed on the edge of the functional glass (201); and A conductive module (102) embedded in the body (101) or disposed on the surface of the body (101) and to be electrically connected to a functional module on the functional glass (201). and The sealing assembly (100) is pre-formed before being attached to the functionalized glass (201). A sealing assembly (100) for functional glass.

2. the conductive module (102) comprises a conductive trace (1021) and a polymer matrix (1022); The conductive traces (1021) are formed on the polymer matrix (1022). The closure assembly (100) of claim 1.

3. The sealing assembly (100) of claim 1 or 2, wherein the conductive module (102) includes an interface coupled to the functional module, an external power module, an external signal module, and / or an electronic component (103).

4. The sealing assembly (100) of claim 3, wherein the interface comprises a connector or an interface circuit.

5. The sealing assembly (100) of claim 1 or 2, further comprising an electronic component (103) electrically connected to the functional module via the conductive module (102) to enable control of the function of the functional module.

6. the conductive module (102) comprises a conductive trace (1021) and a polymer matrix (1022); The conductive traces (1021) are formed on the polymer matrix (1022); and The encapsulation assembly (100) of claim 5, wherein the electronic component (103) is disposed on the body (101) or the polymer matrix (1022) and is electrically connected to the conductive traces.

7. The encapsulation assembly (100) of claim 5, wherein the electronic component (103) comprises at least one of a microcontroller, a voltage converter, and / or a bus transceiver.

8. The sealing assembly (100) of claim 7, wherein the voltage converter comprises a direct current (DC-DC) converter or a direct current to alternating current (DC-AC) converter.

9. The sealing assembly (100) of claim 7, wherein the bus transceiver comprises at least one of a controller area network (CAN) bus transceiver and a local interconnect network (LIN) bus transceiver.

10. The closure assembly (100) of any one of claims 1 to 9, wherein the body (101) is an injection molded body.

11. The sealing assembly (100) of any one of claims 1 to 10, wherein the body (101) comprises at least one of a thermoplastic elastomer (TPE) material, a polyvinyl chloride (PVC) material or a polyurethane (PU), an acrylonitrile-butadiene-styrene plastic (ABS), a polypropylene (PP), a polyethylene terephthalate (PET), an ethylene propylene rubber (EPDM), and a thermoplastic vulcanizate (TPV) material.

12. A sealing glass (200) comprising: A functional glass (201) containing a functional module disposed therein or thereon; and The sealing assembly (100) of any one of claims 1 to 11, attached to the functional glass (201) by a snap-fit ​​connection to form the sealed glass (200).

13. 13. The sealed glass (200) of claim 12, wherein the functional module is used to provide at least one of the following functions: color change, transparency adjustment, lighting, display, touch, solar power generation, heating, or communication.

14. Attaching the sealing assembly (100) according to any one of claims 1 to 11 to the functional glass (201) by adhesive or snap-fit ​​connection. A method for manufacturing a sealed glass (200), comprising:

15. The method of claim 14, further comprising electrically connecting an electrical component (103) to the conductive module (102) before attaching the sealing assembly (100) to the functional glass (201).

16. The method of claim 14, further comprising electrically connecting an electrical component (103) to the conductive module (102) after attaching the sealing assembly (100) to the functional glass (201).

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