Shape measuring instrument and its calibration method

The shape measuring instrument automates calibration by aligning the probe's central axis with the rotation axis, preventing damage and ensuring accurate measurements.

JP7742016B2Active Publication Date: 2025-09-19TOKYO SEIMITSU CO LTD
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
JP2021147654
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-09-10
Publication Date
2025-09-19
Estimated Expiration
2041-09-10

AI Technical Summary

Technical Problem

Existing shape measuring instruments face issues with probe damage during calibration due to operator error and lack of automation, leading to inaccurate calibration results dependent on human skill.

Method used

A shape measuring instrument equipped with a stage, stage rotation mechanism, probe, stage photographing camera, and control unit that automates the calibration process by aligning the probe's central axis with the rotation axis and adjusting its position to prevent contact with the calibration standard.

Benefits of technology

Prevents probe damage and achieves automated, high-precision calibration by aligning the probe's central axis with the rotation axis, ensuring accurate and reliable measurement results.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007742016000001
    Figure 0007742016000001
  • Figure 0007742016000002
    Figure 0007742016000002
  • Figure 0007742016000003
    Figure 0007742016000003
Patent Text Reader

Abstract

To provide a shape measuring instrument and a calibration method thereof that can prevent a probe from coming into contact with a calibration standard in calibration (magnification calibration) of the shape measuring instrument and automate calibration work.SOLUTION: A method for calibrating a shape measuring instrument (10) includes the steps of: holding a calibration standard (M1, M2) having or capable of setting a first measuring plane and a second measuring plane on a stage; moving a stage photographing camera capable of photographing an image on a surface of the stage to at least two points along a second direction perpendicular to a first direction, which is a direction in which a probe can detect displacement, and detecting the first measuring plane of the calibration standard at the at least two points; and controlling a stage rotation mechanism based on a detection result of the first measuring plane and making the first measuring plane parallel to the second direction.SELECTED DRAWING: Figure 3
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to a shape measuring machine and a calibration method thereof, and more particularly to a shape measuring machine and a calibration method thereof used for calibrating a shape measuring machine for measuring the shape of a workpiece. [Background technology]

[0002] Conventionally, there has been known a shape measuring machine that measures the shape (roundness, etc.) of a workpiece by rotating a probe and the workpiece relatively around a rotation axis. For example, Patent Document 1 discloses a technology for non-contact measurement of the shape of the inner and side surfaces of the center hole of a cylindrical workpiece placed on a rotary table. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-014656 Summary of the Invention [Problem to be solved by the invention]

[0004] With shape measuring instruments like those described above, a probe equipped with a non-contact optical sensor is used to measure the shape of the calibration standard, and a process called magnification calibration is required to correlate the output signal of the probe with the actual calibrated displacement (see, for example, Japanese Industrial Standards JIS B7451:1997, Annex 2).

[0005] When calibrating magnification, the relative position of the calibration standard and the probe is adjusted while visually checking the position of the probe tip and its vicinity using a microscope, etc. During this process, there is a risk that the probe may come into contact (crash) with the calibration standard due to an operator error, resulting in damage to the probe.

[0006] Furthermore, since the position must be confirmed visually, it is difficult to automate the calibration process, and the accuracy of the calibration process depends on the skill of the operator.

[0007] The present invention has been made in view of the above circumstances, and aims to provide a shape measuring instrument and a calibration method therefor that can prevent the probe from coming into contact with a calibration standard during calibration (magnification calibration) of the shape measuring instrument and realize automation of the calibration work. [Means for solving the problem]

[0008] In order to solve the above problem, a shape measuring instrument according to a first aspect of the present invention comprises a stage on which a calibration standard having or capable of being set to a first measurement surface and a second measurement surface is held, a stage rotation mechanism that rotates the stage around a rotation axis, a probe capable of detecting displacement along a first direction, a stage photographing camera capable of capturing images of the surface of the stage, a first linear motion mechanism that moves the probe in the first direction, a second linear motion mechanism to which the probe and stage photographing camera are attached and which moves the probe and stage photographing camera along a second direction perpendicular to the first direction, and a control unit that moves the stage photographing camera to at least two points along the second direction, detects the first measurement surface of the calibration standard at the at least two points, and controls the stage rotation mechanism based on the detection result of the first measurement surface to make the first measurement surface parallel to the second direction.

[0009] A second aspect of the present invention provides a shape measuring instrument according to the first aspect, wherein the control unit moves the stage to make the first measurement surface coincide with the rotation axis.

[0010] A shape measuring instrument according to a third aspect of the present invention is the shape measuring instrument of the first or second aspect, which is provided with a rotating camera that is rotatable together with the stage, and the control unit detects the central axis of the probe based on an image of the probe taken by the rotating camera, and aligns the central axis of the probe with the rotation axis of the stage.

[0011] A fourth aspect of the present invention is a shape measuring instrument according to any one of the first to third aspects, wherein the control unit aligns the central axis of the probe with the rotation axis of the stage, then moves the probe away from the calibration standard along the first direction by a distance equal to or greater than the sum of the radius of the probe and the minimum working distance, and then lowers the probe to a position where it faces the first measurement surface.

[0012] A method for calibrating a shape measuring machine according to a fifth aspect of the present invention includes the steps of holding a calibration standard having or capable of being set to a first measurement surface and a second measurement surface on a stage, moving a stage imaging camera capable of capturing images of the surface of the stage to at least two points along a second direction perpendicular to a first direction in which the probe can detect displacement, and detecting the first measurement surface of the calibration standard at the at least two points, and controlling a stage rotation mechanism based on the detection result of the first measurement surface to make the first measurement surface parallel to the second direction. [Effects of the Invention]

[0013] According to the present invention, it is possible to prevent the probe from coming into contact with the calibration standard and realize automation of the calibration work. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a front view showing a shape measuring instrument according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a block diagram showing a control system of the profile measuring machine according to the first embodiment of the present invention. [Figure 3] FIG. 3 is a plan view (top view) for explaining the method for calibrating a shape measuring machine according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a flowchart showing a method for calibrating a shape measuring machine according to the first embodiment of the present invention. [Figure 5] FIG. 5 is a flowchart showing the calibration standard positioning process. [Figure 6]FIG. 6 is a plan view for explaining the procedure for calculating the tilt θ of the reference surface of the calibration standard. [Figure 7] FIG. 7 is a plan view for explaining the procedure for calculating the tilt θ of the reference surface of the calibration standard. [Figure 8] FIG. 8 is a plan view for explaining the position adjustment of the calibration standard. [Figure 9] FIG. 9 is a diagram showing an example of the position at which the first camera captures the image of the probe. [Figure 10] FIG. 10 is an explanatory diagram showing an example of an image captured by a camera at each of the image capturing positions. [Figure 11] FIG. 11 is a diagram showing a composite image of the first captured image and the third captured image. [Figure 12] FIG. 12 is a diagram showing a composite image of the second captured image and the fourth captured image. [Figure 13] FIG. 13 is a diagram for explaining the relative positioning process between the calibration standard and the probe. [Figure 14] FIG. 14 is a diagram for explaining the magnification calibration process (block gauge). [Figure 15] FIG. 15 is a diagram for explaining the magnification calibration process (screw-type magnification calibrator). [Figure 16] FIG. 16 is a diagram for explaining the magnification calibration error. [Figure 17] FIG. 17 is a diagram for explaining the positioning step of the calibration standard according to the second embodiment of the present invention. [Figure 18] FIG. 18 is a diagram for explaining the calibration standard positioning step according to the second embodiment of the present invention. [Figure 19] FIG. 19 is a flowchart showing the calibration standard positioning process according to the second embodiment of the present invention. [Figure 20] FIG. 20 is a flowchart showing the calibration standard positioning process according to the third embodiment of the present invention. [Figure 21] FIG. 21 is a diagram for explaining the Y vector registration process. DETAILED DESCRIPTION OF THE INVENTION

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A form measuring instrument and a calibration method thereof according to embodiments of the present invention will now be described with reference to the accompanying drawings.

[0016] [First embodiment] (shape measuring machine) First, the schematic configuration of a shape measuring machine will be described with reference to Figures 1 and 2. Figure 1 is a front view showing a shape measuring machine according to a first embodiment of the present invention.

[0017] The shape measuring machine 10 shown in Fig. 1 is a device capable of measuring the outer shape of a workpiece W and the inner shape (roundness, etc.) of a small hole formed in a cylindrical workpiece. The small hole formed in the workpiece is, for example, a through hole formed along the central axis of the workpiece, and the inner diameter of the small hole is extremely small (for example, an inner diameter of 500 µm or less). In Fig. 1, the X, Y, and Z directions are mutually perpendicular, the X direction is the horizontal direction, the Y direction is the horizontal direction perpendicular to the X direction, and the Z direction is the vertical direction.

[0018] As shown in FIG. 1, the shape measuring instrument 10 includes a main body base 12, a stage rotation mechanism 14, a stage 18, a column 20, a carriage 22, a first arm 24X, a second arm 24Y, a displacement detector 26, a detector drive mechanism 28, and a control device 50.

[0019] The stage rotation mechanism (high-precision rotation mechanism) 14 is a rotation mechanism for rotating the workpiece W around a rotation axis C, and rotates a stage 18 (described later) with high precision around the rotation axis C parallel to the Z direction. The stage rotation mechanism 14 includes a rotor 16 rotatably mounted on the main body base 12, and the stage 18 is supported on the upper surface of the rotor 16. The stage rotation mechanism 14 includes a motor (not shown) that rotates the rotor 16 with high precision around the rotation axis C, and an encoder (not shown) that detects the rotation angle of the rotor 16.

[0020] The stage 18 is used to place the workpiece W. The stage 18 may be used to directly support and fix the workpiece W, or may be used to support and fix the workpiece W via a workpiece setting jig (not shown).

[0021] The stage 18 is supported on the support surface (upper surface) of the rotating body 16, and is configured to be rotatable integrally with the rotating body 16 around the rotation axis C. This allows the workpiece W supported and fixed on the stage 18 to rotate integrally with the stage 18 around the rotation axis C. The rotating body 16 is an example of a "stage rotation mechanism."

[0022] The stage 18 is equipped with a linear motion mechanism and a tilting mechanism (neither of which is shown). The linear motion mechanism moves the stage 18 in the X and Y directions by driving a motor (not shown), thereby adjusting the position of the stage 18 in the XY plane (horizontal plane) perpendicular to the rotation axis C. The tilting mechanism rotates the stage 18 in the X and Y directions by driving a motor (not shown), thereby adjusting the tilt of the stage 18 with respect to the XY plane.

[0023] A column (support) 20 extending parallel to the Z direction is erected on the main body base 12. The lower end of the column 20 is fixed to the upper surface of the main body base 12.

[0024] The carriage 22 is supported by the column 20 so as to be movable in the Z direction. The carriage 22 is configured to be movable in the Z direction by being driven by a motor (not shown).

[0025] The first arm 24X is supported by the carriage 22 so as to be movable in the X direction. The second arm 24Y is supported by the first arm 24X so as to be movable in the Y direction. The first arm 24X and the second arm 24Y are configured to be movable in the horizontal direction (X and Y directions) by a first linear motion mechanism 70X and a second linear motion mechanism 70Y (see FIG. 2), respectively. The first linear motion mechanism 70X and the second linear motion mechanism 70Y are equipped with drive sources (motors, etc.) for moving the first arm 24X and the second arm 24Y in the horizontal direction, respectively.

[0026] Scales are provided along the X and Z directions on the side surfaces of the first arm 24X and the column 20. The control device 50 (an example of a control unit) is able to detect the position of the probe 30 in the ZX directions by reading the graduations on these scales using a sensor (not shown).

[0027] The displacement detector 26 is supported by the second arm 24Y via a detector drive mechanism 28. The displacement detector 26 has a probe 30. The probe 30 detects the shape of the surface of the workpiece (the outer surface or the inner surface of a hole formed in the workpiece). The probe 30 according to this embodiment is a non-contact probe that can detect the surface shape of the workpiece without coming into contact with the surface of the workpiece.

[0028] The type of non-contact probe 30 is not particularly limited as long as it can detect the surface shape of the workpiece without contacting the surface. As the non-contact probe, for example, a probe to which various techniques such as a laser interferometer, a white light interferometer, SD-OCT (Spectral Domain-Optical Coherence Tomography) or SS-OCT (Swept Source-Optical Coherence Tomography) can be used.

[0029] Although the following description will be given using an example of a non-contact probe, the type of probe 30 is not limited to non-contact. The probe 30 may also be a contact probe capable of detecting the surface shape of a workpiece by contacting its tip with the surface of the workpiece. A contact probe has a contactor that can contact the surface of the workpiece and detects the inner surface shape by detecting the displacement of the contactor when it is brought into contact with the surface of the workpiece. Examples of contact probes that can be used include probes that employ various techniques, such as an LVDT (Linear Variable Differential Transformer), an interferometer, an optical triangulation method, and a thin film strain measurement method. Furthermore, a contact probe may employ a method in which the contactor of a contact probe is vibrated at a resonant frequency and the resonance point changes upon contact.

[0030] The detector drive mechanism 28 is interposed between the second arm 24Y and the displacement detector 26. The detector drive mechanism 28 includes a linear motion mechanism and a tilt mechanism (neither of which is shown). The linear motion mechanism moves the displacement detector 26 in the X and Y directions by driving a motor (not shown) to adjust the position of the probe 30 in the XY plane (horizontal plane) perpendicular to the rotation axis C. The tilt mechanism rotates the displacement detector 26 around the X and Y directions by driving a motor (not shown) to adjust the tilt of the probe 30 with respect to the XY plane. Therefore, by adjusting the position and tilt of the probe 30 in the horizontal direction (X and Y directions) using the detector drive mechanism 28 (linear motion mechanism and tilt mechanism), it is possible to perform relative positioning (probe alignment) between the probe 30 and the rotation axis C.

[0031] The detector driving mechanism 28 also includes a driving source (for example, a motor) for rotating around a rotation axis (probe rotation axis) AX. The detector driving mechanism 28 is an example of a "probe rotation mechanism."

[0032] As shown in Fig. 1, a camera support 18A is fixed to the surface of the stage 18, and a first camera CAM1 is attached to the camera support 18A. The first camera CAM1 is rotatable in accordance with the rotation of the stage 18, and is capable of capturing images of a workpiece or the like placed on the surface of the stage 18. Although the first camera CAM1 is shown in Fig. 1 to be mounted on the stage 18, the present invention is not limited to this. For example, the first camera CAM1 may be mounted away from the stage 18 as long as it is rotatable around the rotation axis C.

[0033] In addition, a second camera CAM2 is fixed to the second arm 24Y, and the second camera CAM2 is capable of moving linearly in the Y direction together with the second arm 24Y, making it possible to photograph workpieces etc. placed on the surface of the stage 18 from above.

[0034] The first camera CAM1 and the second camera CAM2 are examples of a rotating camera and a stage shooting camera, respectively. As the first camera CAM1 and the second camera CAM2, for example, a CCD (Charge Coupled Device) camera or the like can be used.

[0035] When calibrating the profile measuring machine 10, as shown in FIG. 1, a holder 18B (including, for example, a clamping mechanism or a gripping mechanism) is fixed to the surface of the stage 18, and a calibration standard (a magnification calibrator, such as a block gauge, hereinafter referred to as master M1) is held by this holder 18B. Then, the first camera CAM1 and the second camera CAM2 photograph the master M1 held on the stage 18, and after adjusting the posture of the master M1, measure the master M1. The calibration method according to this embodiment will be described later.

[0036] (Control system of shape measuring machine) FIG. 2 is a block diagram showing a control system of the profile measuring machine according to the first embodiment of the present invention.

[0037] The control device 50 controls the operation of each part of the profile measuring machine 10 (including the operation of measuring the surface profile of the workpiece and the probe alignment operation described below). The control device 50 is realized by, for example, a general-purpose computer such as a personal computer or a microcomputer. The control device 50 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), a storage device (for example, an HDD (Hard Disk Drive) or an SSD (Solid State Drive)), an input / output interface, etc. In the control device 50, various programs such as a control program stored in the storage device are loaded into the RAM, and the programs loaded into the RAM are executed by the CPU, thereby realizing the functions of each part in the profile measuring machine 10 and executing various arithmetic processing or control processing via the input / output interface.

[0038] The control device 50 is provided with an operation unit 52 (for example, a keyboard and a mouse) that accepts operation input from a user, and a display unit 54 that displays an operation UI (User Interface) and detection results.

[0039] As shown in FIG. 2, the control device 50 includes a displacement calculation unit 56 and a drive control unit 58.

[0040] The displacement calculation unit 56 calculates the displacement of the workpiece based on the detection result of the displacement of the workpiece surface detected by the displacement detector 26, and measures the shape of the workpiece surface (for example, the outer shape of the workpiece or the roundness of a hole, etc.).

[0041] The drive control unit 58 controls the first linear motion mechanism 70X, the second linear motion mechanism 70Y, the detector drive mechanism 28, and the stage rotation mechanism 14 to adjust the relative positions of the workpiece and the probe 30.

[0042] (Magnification calibration method) Next, an outline of a method for calibrating the magnification of the shape measuring machine 10 will be described. Fig. 3 is a plan view (top view) for explaining the method for calibrating the shape measuring machine 10.

[0043] As shown in FIG. 3 , the master M1 is a gauge block made of a durable material, has a rectangular cross section, and has two parallel measurement surfaces (first measurement surface R1 and second measurement surface R2) (see, for example, International Organization for Standardization ISO 3650:1998 and JIS B 7506:2004). The step height G1 between the first measurement surface R1 and the second measurement surface R2 of the master M1 is a calibrated known value. Hereinafter, the first measurement surface R1 and the second measurement surface R2 may be referred to as the reference surface R1 and the measurement surface R2, respectively. Note that, in the following description, an example in which the first measurement surface R1 is used as the reference surface will be described; however, the present invention is not limited to this example, and the second measurement surface R2 may also be used as the reference surface.

[0044] In this embodiment, an example will be described in which a master M1 having two measurement surfaces (first measurement surface R1 and second measurement surface R2) is used, but the present invention is not limited to this. For example, a gauge block having three or more measurement surfaces may be used, or a calibration standard (such as a screw-type magnification calibrator; see, for example, JIS B7451:1997) in which the measurement surface can be slid relative to a reference surface may be used. In other words, the calibration standard according to this embodiment may be one that has or can set at least two measurement surfaces.

[0045] When calibrating the magnification of the profile measuring machine 10, first, the master M1 is held by the holder 18B of the stage 18. Then, the stage rotation mechanism 14 and the like are controlled to adjust the posture of the master M1 so that the reference surface R1 of the master M1 is parallel to the Y direction.

[0046] Next, while controlling the second linear motion mechanism 70Y to adjust the Y-direction position of the probe 30, the probe 30 emits measurement light B1 to each of the two measurement surfaces R1 and R2 of the master M1, and detects the light reflected from the master M1 to measure the shape of the master M1. Then, magnification calibration is performed using the detection result of the light reflected from the master M1 and the known step amount d of the master M1.

[0047] Next, the magnification calibration method according to this embodiment will be described in detail with reference to Fig. 4 onwards. Fig. 4 is a flowchart showing the calibration method for the profile measuring machine 10.

[0048] First, the master M1 is held by the holder 18B of the stage 18. Then, using images of the surface of the stage 18 and the master M1 taken by the second camera CAM2 attached to the second arm 24Y, the installation position and installation angle of the master M1 are determined (step S10).

[0049] Next, using an image of the probe 30 taken by the first camera CAM1 attached to the stage 18, the position and angle of the probe 30 are positioned so that they coincide with the rotation axis of the stage rotation mechanism 14 (step S12).

[0050] Next, the relative positions of the master M1 and the probe 30 are adjusted so that the distance between the probe 30 and the master M1 is within the range of the working distance of the probe 30 (step S14). Here, the working distance of the probe 30 is the range of distances that can be measured by the probe 30. For example, in the case of a non-contact type probe (e.g., a ToF (Time-of-Flight) type), the working distance depends on the reach of the measurement light, the detection accuracy of the reflected light, the influence of ambient light, etc. On the other hand, in the case of a contact type probe, the working distance depends on the movable range of the tip of the probe.

[0051] Next, the second linear motion mechanism 70Y is controlled to adjust the Y-direction position of the probe 30 relative to the master M1, while the probe 30 emits measurement light B1 to each of the two measurement surfaces R1 and R2 of the master M1, and the reflected light from the master M1 is detected to measure the shape of the master M1. Then, the magnification is calibrated using the detection result of the reflected light from the master M1 and the known step amount d of the master M1 (step S16).

[0052] Each step in the flowchart shown in FIG. 4 will be described in detail below.

[0053] (Positioning of calibration standards) Next, the step of positioning the master M1 (step S10) will be described. Figure 5 is a flowchart showing the step of positioning the master M1.

[0054] 5, first, the angle of the master M1 is adjusted (steps S100 to S108), and then the position of the master M1 is adjusted (step S110). Specifically, each step is performed as follows.

[0055] First, the second camera CAM2 is used to capture an image PI1 of the reference surface R1 of the master M1 held by the holder 18B of the stage 18 (step S100). Next, the second camera CAM2 is moved in the Y direction by the second linear motion mechanism 70Y (step S102), and the second camera CAM2 is used to capture an image PI2 of the reference surface R1 of the master M1 after the movement (step S104).

[0056] Next, the inclination θ of the reference surface R1 relative to the Y direction is calculated from the images PI1 and PI2 and the amount of movement in the Y direction (step S106), and the stage 18 is rotated by an angle θ using the stage rotation mechanism 14 to make the reference surface R1 of the master M1 parallel to the Y direction (step S108).

[0057] 6 and 7 are plan views for explaining the procedure for calculating the inclination θ of the reference plane R1 with respect to the Y direction.

[0058] 6 and 7, the locus of the Y-direction movement in step S102 is indicated by a vector Y. The positions of the reference surface R1 of the master M1 before and after the Y-direction movement are defined as R1(Y1) and R2(Y2), respectively.

[0059] As shown in Figure 7, if the AB coordinate system is set as a two-dimensional Cartesian coordinate system tilted relative to the XY coordinate system, the straight lines along the reference planes R1 (Y1) and R2 (Y2) before and after movement in the Y direction can be expressed by the following equations (1) and (2), respectively.

[0060] R1(Y1): A=a×B+b2…(1) R1(Y2): A=a×B+b1…(2) As shown in Figure 7, if the length of vector Y (the amount of movement in the Y direction) is Y, the inclination of reference plane R1 with respect to the B direction is θ1, and the inclination of the Y direction with respect to the B direction is θ2, the following equations (3) to (7) can be obtained from the geometric relationship.

[0061] θ = θ1 + θ2…(3) a = tanθ1…(4) L1=Ysinθ2…(5) L2=Ycosθ2×a …(6) L1+L2=(b2-b1) …(7) From the above relational expression, the inclination θ of the reference surface R1 with respect to the Y direction can be calculated using the known variables a, b1, b2, and Y.

[0062] For simplicity, if small angle approximation is used, the following equation (8) can be obtained from equations (5) to (7).

[0063] Yθ2+Y×(1-(1 / 2)θ2 2 )×a=(b2-b1) …(8) By transforming equation (8), the following equation (9) is obtained.

[0064] (a / 2)θ2 2 -θ2+(b2-b1) / Ya=0 …(9) By solving the above quadratic equation (9) and substituting it into equation (1) together with equation (4), the inclination θ of the reference surface R1 with respect to the Y direction can be calculated.

[0065] By rotating the master M1 by the angle θ obtained as described above, the reference surface R1 of the master M1 can be made parallel to the Y direction (step S108).

[0066] Next, the position of the master M1 is adjusted using the linear motion mechanism of the stage 18 so that the rotation axis C (center of rotation) of the stage 18 and the reference surface R1 coincide with each other (step S110).

[0067] In step S110, the position of the rotation axis C of the stage 18 is determined in advance. Next, the focal position of the second camera CAM2 is aligned with the reference surface R1 of the master M1. Then, as shown in Figures 8(a) and 8(b), the linear motion mechanism of the stage 18 is used to adjust the position of the master M1 so that the reference surface R1 of the master M1 coincides with the previously determined rotation axis C (position R1(2)).

[0068] In step S110, the upper and lower ends of the reference surface R1 of the master M1 may be detected by the second camera CAM2, and the tilting mechanism of the stage 18 may be used to tilt the master M1.

[0069] According to the positioning process of the master M1 in this embodiment, the positioning process of the master M1 allows the master M1 to be installed so that the reference surface R1 used for magnification calibration is parallel to the movement axis (Y direction) of the second linear motion mechanism 70Y, and the reference surface R1 can be installed so as to coincide with the rotation axis C of the stage 18.

[0070] (Probe positioning) Next, a description will be given of the positioning step (step S12) of the probe 30. In the positioning step of the probe 30, the probe rotation axis AX of the probe 30 is aligned with the rotation axis C of the stage 18 using the first camera CAM1 installed on the stage 18.

[0071] Fig. 9 is a diagram showing an example of the image capturing positions of the first camera CAM1 on the probe 30. In the example shown in Fig. 9, the first camera CAM1 captures images of the probe 30 at four image capturing positions P1 to P4 that are shifted by 90 degrees from one another on a rotational orbit K of the first camera CAM1 centered on the rotational axis C.

[0072] In this embodiment, the direction in which the first camera CAM1 photographs the probe 30 from the four photographing positions P1 to P4 is the X direction or the Y direction, which is the same as the control direction (movement axis direction) in which the detector driving mechanism 28 linearly moves or tilts the probe 30. That is, the first photographing position P1 and the third photographing position P3 are positions opposite each other in the first direction (Y direction). Also, the second photographing position P2 and the fourth photographing position P4 are positions opposite each other in the second direction (X direction).

[0073] Fig. 10 is a diagram showing examples of images captured by the first camera CAM1 at each of the image capturing positions P1 to P4. In Fig. 10, a first captured image 100A to a fourth captured image 100D are captured at the first to fourth image capturing positions P1 to P4, respectively.

[0074] When there is a relative misalignment between the probe 30 and the rotation axis C, for example, as shown in FIG. 10, in the captured images 100A to 100D captured by the first camera CAM1 at each of the capturing positions P1 to P4, the posture (position and inclination) of the probe 30 differs depending on the capturing position (i.e., the capturing direction of the probe 30 by the first camera CAM1).

[0075] For example, of two photographing positions (first photographing position P1 and third photographing position P3) facing each other in the first direction (Y direction), in a first photographed image 100A photographed from one photographing position (first photographing position P1), the probe 30A is tilted to one side in the second direction (X direction), whereas in a third photographed image 100C photographed from the other photographing position (third photographing position P3), the probe 30C is tilted to the other side in the second direction (X direction). Furthermore, the positions in the second direction (X direction) are also shifted toward opposite sides.

[0076] The same is true for the second photographed image 100B and the fourth photographed image 100D at two photographing positions (second photographing position P2 and fourth photographing position P4) that face each other in the second direction (X direction), with the positions and inclinations of the probes 30B and 30D shifted in opposite directions.

[0077] FIG. 11 is a diagram showing a first composite image 102A obtained by combining a first captured image 100A and a third captured image 100C captured from two opposing capturing positions (first capturing position P1 and third capturing position P3) in the first direction (Y direction).

[0078] 11, in a first combined image 102A obtained by combining the first captured image 100A and the third captured image 100C, a first midline ML1 between the central axis (first probe central axis) L1 of the probe 30A in the first captured image 100A and the central axis (third probe central axis) L3 of the probe 30C in the third captured image 100C indicates the position of the rotation axis C in the XZ plane (i.e., the position of the rotation axis C when the probe 30 is viewed from the first direction (Y direction)). Note that the first midline ML1 refers to a line that passes through the center of the first probe central axis L1 and the third probe central axis L3 in the horizontal direction (X direction) in the first combined image 102A in the vertical direction (Z direction). In other words, the line that bisects the space between the first probe central axis L1 and the third probe central axis L3 in the left and right (X direction) in the first combined image 102A is referred to as the first midline ML1.

[0079] The first midline ML1 in the first composite image 102A indicates the position of the rotation axis C. That is, the first midline ML1 indicates a line in the first composite image 102A (in the XZ plane) that is the movement target of the probe 30, and by adjusting the attitude (position Dx and tilt α) of the probe 30 so that the probe 30 coincides with the first midline ML1, it is possible to eliminate the relative deviation between the rotation axis C and the probe 30 in the XZ plane.

[0080] FIG. 12 is a diagram showing a composite image 102B obtained by combining a second captured image 100B and a fourth captured image 100D captured from two opposing capturing positions (second capturing position P2 and fourth capturing position P4) in the second direction (X direction).

[0081] 12, in a second combined image 102B obtained by combining the second captured image 100B and the fourth captured image 100D, a second midline ML2 between the central axis L2 (second probe central axis) of the probe 30B in the second captured image 100B and the central axis L4 (fourth probe central axis) of the probe 30D in the fourth captured image 100D indicates the position of the rotation axis C in the YZ plane (i.e., the position of the rotation axis C when the probe 30 is viewed from the second direction (X direction)). Note that the second midline ML2 refers to a line that passes through the center of the second probe central axis L2 and the fourth probe central axis L4 in the horizontal direction (X direction) in the second combined image 102B in the vertical direction (Z direction). In other words, the second midline ML2 refers to a line that bisects the space between the second probe central axis L2 and the fourth probe central axis L4 in the left and right (X direction) in the second combined image 102B.

[0082] The second midline ML2 in the second composite image 102B indicates the position of the rotation axis C. That is, the second midline ML2 indicates a line in the second composite image 102B (in the YZ plane) that is the movement target of the probe 30, and by adjusting the attitude (position Dy and tilt β) of the probe 30 so that the probe 30 coincides with the second midline ML2, it is possible to eliminate the relative deviation between the rotation axis C and the probe 30 in the YZ plane.

[0083] Therefore, by calculating the two midlines ML1 and ML2 mentioned above based on the images captured by the first camera CAM1 at four shooting positions P1 to P4 that are shifted by 90 degrees from each other on the rotational orbit K of the first camera CAM1 centered on the rotational axis C, it is possible to detect the rotational axis C (center of rotation) that is the movement target of the probe 30, and it is possible to adjust the relative deviation between the rotational axis C and the probe 30 independently in each direction (X direction and Y direction).

[0084] In positioning the probe 30 in this embodiment, when one of the two probes 30 in the first composite image 102A shown in FIG. 11 is set as the reference probe (probe 30A in the first captured image 100A in this example), the control device 50 detects, as the tilt movement amount α, the tilt angle (rotation angle around the Y direction) for making the probe central axis of the reference probe parallel to the first midline ML1. Furthermore, when the probe central axis of the reference probe is tilted by the tilt movement amount α to be parallel to the first midline ML1, the control device 50 detects, as the linear movement amount Dx, the movement distance in the X direction required for aligning the probe central axis of the reference probe with the first midline ML1. Note that the linear movement amount Dx corresponds to the distance along the movement axis in the X direction of the detector drive mechanism 28 (see FIG. 11).

[0085] Furthermore, when one of the two probes 30 in the second composite image 102B shown in FIG. 12 is set as the reference probe (probe 30B in the second captured image 100B in this example), the control device 50 detects, as the tilt movement amount β, the tilt angle (rotation angle around the X direction) for making the probe central axis of the reference probe parallel to the second midline ML2. Furthermore, when the probe central axis of the reference probe is tilted by the tilt movement amount β to make it parallel to the second midline ML2, the control device 50 detects, as the linear movement amount Dy, the movement distance in the Y direction required for aligning the probe central axis of the reference probe with the second midline ML2. Note that the linear movement amount Dy corresponds to the distance along the movement axis in the Y direction of the detector drive mechanism 28 (see FIG. 12).

[0086] The control device 50 can calculate the probe central axes C1 to C4, midlines ML1 and ML2, linear movement amounts Dx and Dy, and tilt movement amounts α and β from each composite image 102A and 102B using known image processing such as edge extraction.

[0087] In this way, when the control device 50 detects the relative deviation between the probe 30 and the rotation axis C in each direction independently based on the images captured by the first camera CAM1 at each shooting position, the drive control unit 58 controls the detector driving mechanism 28 based on the results detected by the control device 50. Specifically, the drive control unit 58 controls the detector driving mechanism 28 to move the probe 30 by a linear movement amount Dx in the X direction and a linear movement amount Dy in the Y direction, and to tilt the probe 30 by a tilt movement amount β about the X direction and a tilt movement amount α about the Y direction. The direction (orientation) in which the detector driving mechanism 28 is moved or tilted is determined depending on which probe is used as the reference probe in the composite images 102A and 102B shown in FIGS. 11 and 12 .

[0088] As described above, when the drive control unit 58 controls the detector drive mechanism 28 to change the attitude of the probe 30 based on the results detected by the control device 50, the relative deviation between the probe 30 and the rotation axis C in three-dimensional space is eliminated. This completes the basic alignment of the probe 30.

[0089] The photographing position of the first camera CAM1 is not necessarily limited to the above embodiment. For example, the first camera CAM1 may photograph the probe 30 from at least three photographing positions on the rotation orbit K of the first camera CAM1. Furthermore, although the embodiment in which the photographing direction of the first camera CAM1 coincides with the control direction (X direction and Y direction) of the detector drive mechanism 28 has been shown, the present invention is not necessarily limited to this embodiment. For example, the photographing direction of the first camera CAM1 may be a direction different from the control direction of the detector drive mechanism 28.

[0090] According to the positioning process of the probe 30 according to this embodiment, the probe rotation axis AX of the probe 30 can be aligned to coincide with the rotation axis C of the stage 18. Furthermore, in this embodiment, the alignment accuracy of the probe 30 does not depend on the installation accuracy of the first camera CAM1, making it possible to achieve high-precision probe alignment at low cost.

[0091] (Relative positioning of calibration standard and probe) Next, a description will be given of the step (step S14) of positioning the master M1 and the probe 30 relative to each other. FIG.

[0092] As shown in (a) of Figure 13, the positioning process of the master M1 (step S10) aligns the reference surface R1 of the master M1 with the rotation axis C of the stage 18, and the positioning process of the probe 30 (step S12) aligns the probe rotation axis AX of the probe 30 with the rotation axis C of the stage 18 (position 30a).

[0093] In the relative positioning step (step S14) of the master M1 and the probe 30, first, as shown in FIG. 13(b), the first linear motion mechanism 70X moves the probe 30 to the opposite side (-X side) of the master M1 with respect to the rotation axis C of the stage 18 (position 30b). Here, the X-direction movement amount D of the probe 30 is X If the radius of the probe 30 is r and the minimum working distance of the probe 30 is WD, then D X ≧r+WD.

[0094] Here, the minimum working distance of the probe 30 is the minimum value of the range of distances that can be measured by the probe 30. For example, in the case of a non-contact probe, the working distance is the shortest distance from the measurement light emission aperture to the surface of the master M1 that can be detected by the measurement light. On the other hand, in the case of a contact probe, the working distance is the shortest distance from the position of the tip of the probe (probe) when it is at the center position (neutral position) of the detection stroke to the surface of the master M1 that can be detected by the probe.

[0095] 13(c), the probe 30 is lowered to a calibration measurement position 30c where the height of the exit aperture of the measurement light B1 of the probe 30 is lower than the upper ends of the reference surface R1 and the measurement surface R2 of the master M1 and higher than the lower ends. That is, by moving the probe 30 in the Y direction, the probe 30 is lowered so that the exit aperture of the measurement light B1 of the probe 30 can face the reference surface R1 and the measurement surface R2. This moves the probe 30 to a position where the reference surface R1 and the measurement surface R2 of the master M1 can be measured.

[0096] (Magnification calibration) Next, the magnification calibration step (step S16) will be described. Figure 14 is a diagram (plan view and front view) for explaining the magnification calibration step.

[0097] 14, in the magnification calibration step (step S16), the second linear motion mechanism 70Y is controlled to adjust the Y-direction position of the probe 30, and measurement light B1 is emitted to the reference surface R1 and measurement surface R2 of the master M1, and the reflected light from the master M1 is detected to measure the shape of the master M1. Then, magnification calibration is performed using the detection result of the reflected light from the master M1 and the known step amount d of the master M1.

[0098] 14, an example in which a block gauge is used as the master M1 has been described, but the present invention is not limited to this. For example, as shown in FIG. 15, it is also possible to use a screw-type magnification calibrator M2 (hereinafter referred to as the master).

[0099] In the master M2 shown in Fig. 15, the measurement surface can be moved by a screw (not shown), and the amount of movement G2 of the measurement surface by operating the screw is calibrated. Note that Fig. 15 shows only two positions of the reference surface (R21 and R22). Here, the reference surface positions R21 and R22 are examples of the first and second measurement surfaces.

[0100] According to this embodiment, since the movement amount in each step when moving the probe 30 to the calibration measurement position 30c can be obtained by calculation, it is possible to avoid the probe 30 from contacting the masters (M1, M2). Further, the accuracy of the calibration work does not depend on the skill of the operator.

[0101] Furthermore, according to this embodiment, since each step is composed of image processing of images taken by the first camera CAM1 and the second camera CAM2 and the operation of the movement amount calculated by the device configuration or image processing of the shape measuring machine 10, visual confirmation etc. becomes unnecessary and the calibration work can be automated.

[0102] Also, in this embodiment, at the time of magnification calibration, the measurement surfaces (reference surface R1, measurement surfaces R2, R21, and R22) of the masters (M1, M2) are parallel to the Y direction (second direction). And since the measurement light B1 from the probe 30 can be made to enter perpendicularly (from the X direction, first direction) with respect to the measurement surface, it becomes possible to perform more accurate magnification calibration.

[0103] Here, the accuracy of magnification calibration will be described taking the case of a block gauge as an example. As shown in FIG. 16, at the time of magnification calibration, when the reference surface R1 of the master M1 is inclined at an angle θ with respect to the Y direction, if the Y-direction movement amount of the probe 30 is L, the step amount G1(F) measured by the probe 30 is represented by the following formula (10).

[0104] G1(F)=G1 / cosθ+Lsinθ …(10) At this time, the error of magnification calibration is represented by the following formula (11).

[0105] G1 / G1(F)=1 / {1 / cosθ+(L / G1)sinθ} …(11) As shown in formula (11), when the reference surface R1 of the master M1 is inclined with respect to the Y direction, since G1<G1(F), the value after calibration becomes smaller than the actual displacement amount. Also, as shown in formula (11), since the Y-direction movement amount L that changes depending on the measurement conditions is included in the calibration error, the error amount is not stable.

[0106] In contrast to this, in this embodiment, the reference surface R1 and measurement surface R2 of the master M1 are parallel to the Y direction during magnification calibration, so that it is possible to perform magnification calibration with higher accuracy.

[0107] [Second embodiment] Next, a second embodiment of the present invention will be described. In the following description, the same components as those in the first embodiment will be denoted by the same reference numerals and the description thereof will be omitted.

[0108] In this embodiment, in the step of positioning the master M1 (step S10), the angle and position of the master M1 can be adjusted at the same time.

[0109] 17 and 18 are diagrams for explaining the positioning step of the master M1. In this embodiment, in the positioning step of the master M1 (step S10), the position of the rotation axis C (rotation center) of the stage 18 (position C(Y1) before movement) is calculated in advance.

[0110] When the second camera CAM2 is moved in the Y direction while the master M1 is held on the stage 18, the movement direction within the field of view of the second camera CAM2 (the inclination θ2 of the Y direction relative to the B direction in FIG. 7) can be determined. Since the Y direction movement amount Y is a specified movement amount, if it is known, the Y direction movement amount (vector Y) within the field of view of the second camera CAM2 can be calculated.

[0111] Therefore, as shown in Figure 17, from the position R1(Y1) of the reference surface R1 of the master M1 before movement in the Y direction and the position C(Y1) of the rotation axis C of the stage 18, the position R1(Y2) of the reference surface R1 of the master M1 within the field of view of the second camera CAM2 after movement in the Y direction and the position C(Y2) of the rotation axis C of the stage 18 can be calculated.

[0112] Next, as shown in Fig. 18, the amount of movement (N) of the position of the master M1 is adjusted so that the reference surface R1 of the master M1 coincides with the position C(Y2) of the rotation axis C of the stage 18 after movement in the Y direction. That is, as shown in Fig. 18, the N vector is calculated, which is the perpendicular vector drawn from the position C(Y2) of the rotation axis C of the stage 18 after movement in the Y direction to the position R1(Y2) of the reference surface R1 of the master M1. Then, by operating the linear motion mechanism of the stage 18 to move the master M1 according to the N vector, it is possible to align the reference surface R1 of the master M1 with the position C(Y2) of the rotation axis C of the stage 18.

[0113] Next, the stage rotation mechanism 14 rotates the master M1 by an angle θ, thereby making the reference surface R1 of the master M1 parallel to the Y direction.

[0114] FIG. 19 is a flowchart showing the process of positioning the master M1 according to the second embodiment of the present invention.

[0115] First, the rotation axis C (center of rotation) of the stage 18 within the field of view of the second camera CAM2 is calculated in advance (step S130). In step S130, the rotation axis C of the stage 18 can be detected, for example, by placing a workpiece of a known shape (for example, circular or rectangular) on the stage 18, rotating the stage 18, and processing an image captured by the second camera CAM2. Note that the method for calculating the rotation axis C is not limited to the above example.

[0116] Next, the second camera CAM2 is used to capture an image PI1 of the reference surface R1 of the master M1 held by the holder 18B of the stage 18 (step S132). Then, the second camera CAM2 is moved in the Y direction by the second linear motion mechanism 70Y (step S134), and the second camera CAM2 is used to capture an image PI2 of the reference surface R1 of the master M1 after the movement (step S136).

[0117] Next, the tilt θ of the reference plane R1 with respect to the Y direction is calculated from the images PI1 and PI2 and the Y direction movement amount (step S138). Note that the procedure for calculating the tilt θ in step S138 is the same as in the first embodiment, and therefore a description thereof will be omitted (see FIGS. 6 and 7). Then, the Y vector is calculated from the Y direction movement amount Y and the angle θ in step S134 (step S140).

[0118] Next, the position C(Y2) of the rotation axis C after the movement in the Y direction is calculated from the position C(Y1) of the rotation axis C before the movement in the Y direction and the Y vector (step S142). Then, the N vector is calculated from the position C(Y2) of the rotation axis C after the movement in the Y direction and the image PI2 (step S144).

[0119] Next, the master M1 is moved along the N vector (step S146), and the master M1 is rotated by an angle θ so that the reference surface R1 of the master M1 is parallel to the Y direction (step S148).

[0120] According to this embodiment, the angle and position of the master M1 can be adjusted at the same time, which reduces the number of steps required to position the reference surface R1 of the master M1.

[0121] [Third embodiment] Next, a third embodiment of the present invention will be described. In the following description, the same components as those in the first or second embodiment will be denoted by the same reference numerals and the description thereof will be omitted.

[0122] In this embodiment, before and after the calculation of the rotation axis C (center of rotation) of the stage 18 (step S130 in the second embodiment), a Y vector is calculated and registered by performing a Y direction movement.

[0123] FIG. 20 is a flowchart showing the process of positioning the master M1 according to the third embodiment of the present invention.

[0124] First, a Y vector is registered (step S160). In step S160, a known shape S1 is placed on the stage 18 so that it falls within the field of view of the second camera CAM2, as shown in Fig. 21. Here, the known shape S1 is preferably a shape whose reference coordinates can be determined with high precision, such as a circular hole shape, a point, a reticle, or the like.

[0125] Next, an image of the known shape S1 is acquired by the second camera CAM2, and the coordinates of the reference position of the known shape S1 (reference coordinates C1(Y1)) are calculated. In Fig. 21, a circular hole shape is used as an example of the known shape S1, and the position coordinates of the center of the circular hole are used as the reference coordinates.

[0126] Next, the second camera CAM2 is moved in the Y direction by a predetermined distance, an image of the known shape S1 is acquired by the second camera CAM2, and the coordinates of the reference position of the known shape S1 (reference coordinates C1(Y2)) are calculated.

[0127] Next, the control device 50 calculates a Y vector from the reference coordinates C1(Y1) and C1(Y2) before and after the Y direction movement, and registers (stores) the Y vector.

[0128] Next, the rotation axis C (rotation center) of the stage 18 within the field of view of the second camera CAM2 is calculated in advance (step S162). Note that the procedure for calculating the rotation axis C (rotation center) of the stage 18 is the same as in the second embodiment, and therefore a description thereof will be omitted.

[0129] Next, the second camera CAM2 is used to capture an image PI1 of the reference surface R1 of the master M1 held by the holder 18B of the stage 18 (step S164). Then, the second camera CAM2 is moved in the Y direction by the second linear motion mechanism 70Y (step S166), and the second camera CAM2 is used to capture an image PI2 of the reference surface R1 of the moved master M1 (step S168). Here, the distance moved in the Y direction in step S168 is equal to the distance moved in the Y direction during pre-registration of the Y vector in step S160 (see FIG. 21).

[0130] Next, the tilt θ of the reference plane R1 with respect to the Y direction is calculated from the images PI1 and PI2 and the amount of movement in the Y direction (step S170). Note that the procedure for calculating the tilt θ in step S138 is the same as in the first embodiment, and therefore a description thereof will be omitted (see FIGS. 6 and 7).

[0131] Next, the angle and position of the master M1 are adjusted. Steps S172 to S178, which will be described later, are the same as steps S172 to S178 in FIG.

[0132] Next, the position C(Y2) of the rotation axis C after the movement in the Y direction is calculated from the position C(Y1) of the rotation axis C before the movement in the Y direction and the Y vector (step S172). Then, the N vector is calculated from the position C(Y2) of the rotation axis C after the movement in the Y direction and the image PI2 (step S174).

[0133] Next, the master M1 is moved along the N vector (step S176), and the master M1 is rotated by an angle θ so that the reference surface R1 of the master M1 is parallel to the Y direction (step S178).

[0134] According to this embodiment, as in the second embodiment, the angle and position of the master M1 can be adjusted at the same time, so that the number of steps required to position the reference surface R1 of the master M1 can be reduced.

[0135] Furthermore, in this embodiment, known shapes such as circles have shapes that allow the reference coordinates to be calculated with high precision, and the distance actually moved in the Y direction within the field of view of the second camera CAM2 is determined, so the Y vector can be calculated with high precision. [Explanation of symbols]

[0136] 10... Shape measuring machine, 12... Main body base, 14... Stage rotation mechanism, 16... Rotating body, 18... Stage, 20... Column, 22... Carriage, 24X... First arm, 24Y... Second arm, 26... Displacement detector, 28... Detector drive mechanism, 30... Probe, 32... Camera, 34... Camera bracket, 50... Control device, 52... Operation unit, 54... Display unit, 56... Displacement calculation unit, 58... Drive control unit, 60... Photography control unit, 70X... First linear motion mechanism, 70Y... Second linear motion mechanism, CAM1... First camera, CAM2... Second camera, M1 to M2... Calibration standard (master)

Claims

1. a stage on which a calibration standard having or capable of being set to a first measurement surface and a second measurement surface is held; a stage rotation mechanism that rotates the stage around a rotation axis; a probe capable of detecting a displacement along a first direction; a stage photographing camera capable of photographing an image of the surface of the stage; a first linear motion mechanism that moves the probe in the first direction; a second linear motion mechanism to which the probe and the stage photographing camera are attached, the second linear motion mechanism moving the probe and the stage photographing camera along a second direction perpendicular to the first direction; a control unit that moves the stage photographing camera to at least two points along the second direction, detects the first measurement surface of the calibration standard at the at least two points, and controls the stage rotation mechanism based on the detection results of the first measurement surface to make the first measurement surface parallel to the second direction; a rotating camera that is rotatable together with the stage, the control unit moves the stage to align the first measurement surface with the rotation axis, detects a central axis of the probe based on an image of the probe taken by the rotating camera, aligns the central axis of the probe with the rotation axis of the stage, and after aligning the central axis of the probe with the rotation axis of the stage, moves the probe away from the calibration standard along the first direction by a distance equal to or greater than the sum of a radius of the probe and a minimum working distance, and then lowers the probe to a position where the probe faces the first measurement surface.

2. holding a calibration standard having or capable of being set to a first measurement surface and a second measurement surface on a stage; moving a stage imaging camera capable of capturing images of the surface of the stage to at least two points along a second direction perpendicular to a first direction in which a probe can detect displacement, and detecting the first measurement surface of the calibration standard at the at least two points; controlling a stage rotation mechanism based on a detection result of the first measurement surface to make the first measurement surface parallel to the second direction; moving the stage so that the first measurement plane coincides with a rotation axis of the stage; detecting a central axis of the probe based on an image of the probe captured by a rotating camera that is rotatable together with the stage, and aligning the central axis of the probe with a rotation axis of the stage; a step of aligning a central axis of the probe with a rotation axis of the stage, separating the probe from the calibration standard along the first direction by a distance equal to or greater than the sum of the radius of the probe and a minimum working distance, and then lowering the probe to a position where the probe faces the first measurement surface; A method for calibrating a shape measuring machine comprising:

Citation Information

Patent Citations

  • Noncontact side-surface shape measuring apparatus

    JP2010014656A

  • Calibrating jig, profile measuring device, and method of offset calculation

    JP2010019671A

  • Surface property measuring instrument

    JP2011085402A

  • Device for observing stylus

    JP2011174779A

  • Circularity measuring instrument

    JP2018036130A