Sensors and Electronic Devices

The sensor design with a support member and movable member configuration enhances stability and accuracy by maintaining a gap and using insulating and conductive portions, addressing issues of vibration resistance and resonance in existing sensors.

JP7746236B2Active Publication Date: 2025-09-30KK TOSHIBA
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Patent Information

Application Number
JP2022129696
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-08-16
Publication Date
2025-09-30
Estimated Expiration
2042-08-16

AI Technical Summary

Technical Problem

Existing sensors and electronic devices lack stable characteristics, particularly in terms of vibration resistance and resonance stability.

Method used

A sensor design featuring a base with a support member and movable member, where the support member includes a support portion and an extension portion with a wider width in one direction than the extension portion, and a gap is maintained between the base surface and the movable member, utilizing insulating and conductive portions for stability.

Benefits of technology

The design enhances vibration resistance and resonance stability, providing sensors with improved performance and accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a sensor with which stable characteristics can be obtained, and an electronic apparatus.SOLUTION: According to an embodiment, a sensor includes a substrate, a support member, and a movable member. The substrate includes a first surface including a first substrate area. The support member is fixed to the first substrate area. The support member includes a support part and an extension part. The extension part is connected with the support part. The extension part extends along a second direction intersecting a first direction from the first substrate area to the support part. A first width of the support part in a third direction intersecting a plane including the first direction and the second direction is larger than a second width of the extension part in the third direction. The movable member is supported by the extension part. A first gap is provided between the first surface and the movable member.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to sensors and electronic devices. [Background technology]

[0002] There are sensors such as gyro sensors, etc. Stable characteristics are desired in sensors and electronic devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-144065 Summary of the Invention [Problem to be solved by the invention]

[0004] Embodiments of the present invention provide sensors and electronic devices that provide stable characteristics. [Means for solving the problem]

[0005] According to an embodiment of the present invention, a sensor includes a base, a support member, and a movable member. The base includes a first surface including a first base region. The support member is fixed to the first base region. The support member includes a support portion and an extension portion. The extension portion is connected to the support portion. The extension portion extends from the first base region to the support portion along a second direction intersecting with a first direction. A first width of the support portion in a third direction intersecting with a plane including the first direction and the second direction is wider than a second width of the extension portion in the third direction. The movable member is supported by the extension portion. A first gap is provided between the first surface and the movable member. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 2]FIG. 2 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 3] FIG. 3 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 4] FIG. 4 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Figure 5] FIG. 5 is a schematic cross-sectional view illustrating a part of the sensor according to the first embodiment. [Figure 6] FIG. 6 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Figure 7] FIG. 7 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Figure 8] FIG. 8 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view illustrating a part of the sensor according to the first embodiment. [Figure 10] FIG. 10 is a schematic plan view illustrating a part of the sensor according to the first embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view illustrating a part of the sensor according to the first embodiment. [Figure 12] FIG. 12 is a schematic view illustrating an electronic device according to the second embodiment. [Figure 13] 13(a) to 13(h) are schematic diagrams illustrating applications of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) 1 and 2 are schematic cross-sectional views illustrating the sensor according to the first embodiment. FIG. 3 is a schematic plan view illustrating the sensor according to the first embodiment. FIG. 4 is a schematic plan view illustrating a part of the sensor according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating a part of the sensor according to the first embodiment. Fig. 1 is a cross-sectional view taken along line A1-A2 in Fig. 3. Fig. 2 is a cross-sectional view taken along line B1-B2 in Fig. 3.

[0009] As shown in FIG. 1, the sensor 110 according to the embodiment includes a base body 10s, a support member 21M, and a movable member 31M.

[0010] The base 10s includes a first surface 10f. The first surface 10f includes a first base region 10a. The support member 21M is fixed to the first base region 10a.

[0011] 1 and 4, the support member 21M includes a support portion 21s and an extending portion 21e. The extending portion 21e is connected to the support portion 21s.

[0012] 1, a first direction D1 from the first base region 10a to the support portion 21s is defined as the Z-axis direction. A direction perpendicular to the Z-axis direction is defined as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0013] 4, the extending portion 21e extends along a second direction D2. The second direction D2 intersects with the first direction D1. The second direction D2 is, for example, the X-axis direction.

[0014] As shown in Figure 4, the width of the support portion 21s in the third direction D3 is defined as a first width w1. The third direction D3 intersects with a plane including the first direction D1 and the second direction D2. The third direction D3 is, for example, the Y-axis direction. The width of the extending portion 21e in the third direction D3 is defined as a second width w2. The first width w1 is wider than the second width w2.

[0015] 1, the movable member 31M is supported by the extending portion 21e. A first gap G1 is provided between the first surface 10f and the movable member 31M.

[0016] In the embodiment, at least a portion of the extension 21e that supports the movable member 31M is fixed to the base 10s. The extension 21e is stable. For example, the influence of deflection due to gravity can be reduced. For example, vibration resistance can be improved. For example, stable resonance characteristics of the movable member 31M can be obtained. A sensor with stable characteristics can be provided.

[0017] For example, an insulating layer is provided on the base body 10s, and a member that will become the movable member 31M is provided on the insulating layer. A portion of the member that will become the movable member 31M is removed, and then a portion of the insulating layer is also removed, thereby forming the movable member 31M and the first gap G1. In the process of forming the movable member 31M, excessive removal of the insulating layer may occur. For example, if no insulating layer is provided between the entire extension portion 21e and the base body 10s, the extension portion 21e will be unstable.

[0018] In the embodiment, an insulating layer is provided between at least a portion of the extension portion 21e and the base 10s, and at least a portion of the extension portion 21e is fixed to the base 10s. In the embodiment, there is a wide margin of error in processing in the process of forming the movable member 31M. The stable extension portion 21e allows stable resonance characteristics of the movable member 31M to be obtained. For example, processing variations are suppressed. A sensor with stable characteristics can be provided.

[0019] 1 and 5, in this example, the support member 21M includes a support conductive portion 21c and a support insulating portion 21i. As shown in FIG. 5, a portion 21ca of the support conductive portion 21c serves as the support portion 21s. Another portion 21cb of the support conductive portion 21c serves as the extending portion 21e. A portion 21ia of the support insulating portion 21i is provided between the first surface 10f and the portion 21ca of the support conductive portion 21c. Another portion 21ib of the support insulating portion 21i is provided between the first surface 10f and the portion 21cb of the support conductive portion 21c.

[0020] The first width w1 may be, for example, the length of a portion 21ia of the supporting insulating portion 21i in the third direction D3. The second width w2 may be, for example, the length of another portion 21ib of the supporting insulating portion 21i in the third direction D3.

[0021] For example, the supporting insulator 21i includes at least one selected from the group consisting of oxygen and nitrogen, and at least one selected from the group consisting of silicon and aluminum. The supporting insulator 21i includes, for example, silicon oxide.

[0022] For example, the supporting conductive portion 21c may include silicon. The supporting conductive portion 21c may include conductive silicon.

[0023] In the embodiment, the first width w1 is not less than two times and not more than 1000 times the second width w2. The thin extension portion 21e facilitates the movement (vibration) of the movable member 31M.

[0024] As shown in FIG. 4, in this example, the movable member 31M includes a first connecting portion 31C and a first movable portion 31P. The first connecting portion 31C is located between the extending portion 21e and a portion of the first movable portion 31P. As shown in FIG. 1, the first connecting portion 31C is supported by the extending portion 21e. The first connecting portion 31C supports the first movable portion 31P.

[0025] 4, the first connecting portion 31C may have a meander structure, which provides a stable spring function.

[0026] 4, the movable member 31M may further include a first movable extending portion 31e. The first movable extending portion 31e extends along the second direction D2. The first movable extending portion 31e is provided between the first connecting portion 31C and the first movable portion 31P. The direction from the extending portion 21e to the first movable extending portion 31e is along the second direction D2. First gaps G1 are provided between the first surface 10f and the first connecting portion 31C, between the first surface 10f and the first movable extending portion 31e, and between the first surface 10f and the first movable portion 31P.

[0027] 3, the first movable portion 31P is provided around the support portion 21s in a plane (for example, the XY plane) that intersects with the first direction D1. The first movable portion 31P is, for example, annular.

[0028] 3, a plurality of extending portions 21e and a plurality of first connecting portions 31C are provided. One of the plurality of first connecting portions 31C is connected to one of the plurality of extending portions 21e. The extending direction of the extending portion 21e is a radial direction from the support portion 21s. The second direction D2 is one of the radial directions.

[0029] 1 and 3, the sensor 110 may further include a fixed conductive member 22M. As shown in FIG. 1, the first surface 10f further includes a second base region 10b. The fixed conductive member 22M is fixed to the second base region 10b. The fixed conductive member 22M faces the movable member 31M in a direction intersecting the first direction D1.

[0030] In this example, the first movable portion 31P includes a hole 31h extending along the first direction D1. The fixed conductive member 22M passes through the hole 31h. As shown in FIG. 3, a plurality of fixed conductive members 22M and a plurality of holes 31h may be provided. The plurality of fixed conductive members 22M may be arranged on a circumference centered on the support portion 21s. One of the plurality of fixed conductive members 22M passes through one of the plurality of holes 31h. The support portion 21s is provided between one of the plurality of fixed conductive members 22M and another of the plurality of fixed conductive members 22M. One of the plurality of fixed conductive members 22M and another of the plurality of fixed conductive members 22M are aligned along the second direction D2 or the third direction D3.

[0031] For example, when a voltage is applied between the first movable part 31P and the fixed conductive member 22M, the first movable part 31P is displaced within the XY plane. For example, when an AC voltage is applied, the first movable part 31P vibrates.

[0032] The first movable portion 31P is electrically connected to the support portion 21s via the first connection portion 31C and the extending portion 21e. When a voltage is applied between the support portion 21s and the fixed conductive member 22M, a voltage is applied between the first movable portion 31P and the fixed conductive member 22M.

[0033] As shown in FIGS. 1 and 3, a support portion electrode 21E may be provided that is electrically connected to the support portion 21s (support member 21M). A fixed electrode 22E may be provided that is electrically connected to the fixed conductive member 22M. As shown in FIG. 1, a control unit 70 may be connected to these electrodes. The control unit 70 may be included in the sensor 110. The control unit 70 may be provided separately from the sensor 110.

[0034] The control unit 70 can apply an AC signal Sg1 between the support member 21M and the fixed conductive member 22M to vibrate the movable member 31M (first movable portion 31P).

[0035] When an external rotational force is applied to the movable member 31M (first movable portion 31P), the vibration state of the movable member 31M (first movable portion 31P) changes. The change in the vibration state is based on, for example, Coriolis force.

[0036] The control unit 70 may be capable of detecting the vibration state of the movable member 31M. The vibration state of the movable member 31M changes depending on the rotational force applied to the movable member 31M. By detecting the vibration state of the movable member 31M, the rotational force applied to the movable member 31M can be detected.

[0037] As shown in FIG. 2, a part of the supporting insulating portion 21i may protrude from the supporting conductive portion 21c in a direction intersecting the direction from the first base region 10a to the supporting member 21M (first direction D1).

[0038] FIG. 6 is a schematic plan view illustrating a part of the sensor according to the first embodiment. 6, in the sensor 110, the outer edge of the support insulating portion 21i may protrude relative to the support conductive portion 21c. For example, in the portion corresponding to the extending portion 21e, the outer edge of the support insulating portion 21i may protrude in a curved shape relative to the supporting conductive portion 21c. In the example shown in FIG. 6, in the first direction D1, the part of the supporting conductive portion 21c corresponding to the extending portion 21e does not overlap with the supporting insulating portion 21i.

[0039] FIG. 7 is a schematic plan view illustrating a part of the sensor according to the first embodiment. As shown in FIG. 7, in a sensor 111 according to this embodiment, the outer edge of a supporting insulating portion 21i may protrude from the supporting conductive portion 21c in a portion corresponding to the extending portion 21e.

[0040] FIG. 8 is a schematic diagram illustrating a part of the sensor according to the first embodiment. plane Figure. FIG. 9 is a schematic diagram illustrating a part of the sensor according to the first embodiment. cross section Figure. These figures illustrate a sensor 112 according to the embodiment. In the sensor 112, the amount of protrusion of the outer edge of the supporting insulating portion 21i is smaller than that of the sensor 110 and the like.

[0041] 9, a second gap G2 may be provided between the base 10s and a portion of the extension 21e. In the sensor 112, most of the extension 21e is stably fixed to the base 10s. The stable extension 21e allows the movable member 31M to have stable resonance characteristics.

[0042] FIG. 10 is a schematic plan view illustrating a part of the sensor according to the first embodiment. 10, in the sensor 113 according to this embodiment, the amount of protrusion of the outer edge of the support insulating portion 21i is smaller than that of the sensor 112. In the sensor 113, a portion of the extending portion 21e is stably fixed to the base body 10s. The stable extending portion 21e allows stable resonance characteristics of the movable member 31M to be obtained.

[0043] The sensors 111 to 113 may have the same configuration as the sensor 110 except for the above.

[0044] The sensor 113 includes a base 10s (see FIG. 1), a support member 21M (see FIG. 1), and a movable member 31M (see FIG. 1). The base 10s includes a first surface 10f including a first base region 10a. The support member 21M is fixed to the first base region 10a. As shown in FIG. 1, the support member 21M includes a support conductive portion 21c and a support insulating portion 21i. As shown in FIG. 5, a portion 21ia of the support insulating portion 21i is provided between the first surface 10f and the support conductive portion 21c. Another portion 21ib of the support insulating portion 21i does not overlap with the support conductive portion 21c. As shown in FIG. 1, the movable member 31M is supported by the support member 21M. A first gap G1 is provided between the first surface 10f and the movable member 31M. In the sensor 113, another part 21ib of the supporting insulating portion 21i protrudes from the supporting conductive portion 21c in a direction intersecting the direction from the first base region 10a to the supporting member 21M (first direction D1).

[0045] FIG. 11 is a schematic cross-sectional view illustrating a part of the sensor according to the first embodiment. 11, in a sensor 114 according to this embodiment, the side surface of another part 21ib of the supporting insulating part 21i may be curved. Except for this, the configuration of the sensor 114 may be the same as the configuration of the sensor 110.

[0046] In the sensor 114, the other part 21ib of the supporting insulating part 21i includes a part facing the first surface 10f and a part facing the other part 21cb of the supporting conductive part 21c. For example, the length along the second direction D2 of the part facing the first surface 10f is shorter than the length along the second direction D2 of the part facing the other part 21cb of the supporting conductive part 21c. This shape makes it easier to alleviate stress concentration and to obtain more stable characteristics.

[0047] (Second embodiment) The second embodiment relates to an electronic device. FIG. 12 is a schematic view illustrating an electronic device according to the second embodiment. As shown in FIG. 12, an electronic device 310 according to the embodiment includes a sensor according to the embodiment and a circuit control unit 170. In the example of FIG. 12, a sensor 110 (or a sensor device 210) is depicted as the sensor. The circuit control unit 170 can control a circuit 180 based on a signal S1 obtained from the sensor. The circuit 180 is, for example, a control circuit for a drive device 185. According to the embodiment, the circuit 180 for controlling the drive device 185 can be controlled with high precision based on highly accurate detection results.

[0048] 13(a) to 13(h) are schematic diagrams illustrating applications of electronic devices. As shown in FIG. 13(a), the electronic device 310 may be at least a part of a robot. As shown in FIG. 13(b), the electronic device 310 may be at least a part of a machine robot installed in a manufacturing factory or the like. As shown in FIG. 13(c), the electronic device 310 may be at least a part of an automated guided vehicle in a factory or the like. As shown in FIG. 13(d), the electronic device 310 may be at least a part of a drone (unmanned aerial vehicle). As shown in FIG. 13(e), the electronic device 310 may be at least a part of an airplane. As shown in FIG. 13(f), the electronic device 310 may be at least a part of a ship. As shown in FIG. 13(g), the electronic device 310 may be at least a part of a submarine. As shown in FIG. 13(h), the electronic device 310 may be at least a part of an automobile. The electronic device 310 may include, for example, at least one of a robot and a moving object.

[0049] The embodiment may include the following configurations (for example, technical solutions). (Configuration 1) a substrate including a first surface including a first substrate region; a support member fixed to the first base region, the support member including a support portion and an extension portion, the extension portion being connected to the support portion, the extension portion extending from the first base region to the support portion along a second direction intersecting with a first direction, and a first width of the support portion in a third direction intersecting with a plane including the first direction and the second direction being wider than a second width of the extension portion in the third direction; a movable member supported by the extension portion, the movable member having a first gap between the first surface and the movable member; A sensor comprising:

[0050] (Configuration 2) 2. The sensor of claim 1, wherein a second gap is provided between the base and a portion of the extension.

[0051] (Configuration 3) the support member includes a support conductive portion and a support insulating portion; a part of the supporting conductive portion serves as the supporting portion, Another part of the supporting conductive part becomes the extending part, a portion of the supporting insulating portion is provided between the first surface and the portion of the supporting conductive portion, 3. The sensor of claim 1, wherein another portion of the supporting insulating portion is provided between the first surface and the another portion of the supporting conductive portion.

[0052] (Configuration 4) the first width is a length of the portion of the supporting insulating portion in the third direction; The sensor of configuration 3, wherein the second width is the length of the other portion of the support insulating portion in the third direction.

[0053] (Configuration 5) 5. The sensor of claim 4, wherein the support insulator comprises at least one selected from the group consisting of oxygen and nitrogen, and at least one selected from the group consisting of silicon and aluminum.

[0054] (Configuration 6) 6. The sensor of claim 5, wherein the supporting conductive portion comprises silicon.

[0055] (Configuration 7) 7. The sensor according to any one of configurations 1 to 6, wherein the first width is at least two times and at most 1000 times the second width.

[0056] (Configuration 8) the movable member includes a first connection portion and a first movable portion; the first connection portion is located between the extension portion and a part of the first movable portion, the first connection portion is supported by the extension portion, The sensor according to any one of configurations 1 to 7, wherein the first connecting portion supports the first movable portion.

[0057] (Configuration 9) 9. The sensor of claim 8, wherein the first connection portion has a meander structure.

[0058] (Configuration 10) the movable member further includes a first movable extension; the first movable extending portion is provided between the first connecting portion and the first movable portion, 10. The sensor of claim 8 or 9, wherein a direction from the extension to the first movable extension is along the second direction.

[0059] (Configuration 11) 11. The sensor according to any one of configurations 8 to 10, wherein the first movable portion is provided around the support portion in a plane intersecting the first direction.

[0060] (Configuration 12) a plurality of the extending portions and a plurality of first connecting portions are provided; 12. The sensor of claim 11, wherein one of the plurality of first connection portions is connected to one of the plurality of extension portions.

[0061] (Configuration 13) Further comprising a fixed conductive member; the first surface further includes a second substrate region; the fixed conductive member is fixed to the second base region; 13. The sensor according to any one of configurations 8 to 12, wherein the fixed conductive member faces the movable member in a direction intersecting the first direction.

[0062] (Configuration 14) the first movable portion includes a hole extending along the first direction, 14. The sensor of claim 13, wherein the stationary conductive member passes through the hole.

[0063] (Configuration 15) Further comprising a control unit, 15. The sensor of claim 13, wherein the control unit is capable of applying an AC signal between the support member and the fixed conductive member to vibrate the movable member.

[0064] (Configuration 16) 16. The sensor according to claim 15, wherein the control unit is capable of detecting a vibration state of the movable member, which changes in response to a rotational force applied to the movable member.

[0065] (Configuration 17) a substrate including a first surface including a first substrate region; a support member fixed to the first base region, the support member including a support conductive portion and a support insulating portion, a portion of the support insulating portion being provided between the first surface and the support conductive portion, and another portion of the support insulating portion not overlapping with the support conductive portion; a movable member supported by the support member, the movable member having a first gap between the first surface and the movable member; A sensor comprising:

[0066] (Configuration 18) 18. The sensor of claim 17, wherein the other portion of the support insulating portion protrudes relative to the support conductive portion in a direction intersecting a first direction from the first base region to the support member.

[0067] (Configuration 19) The sensor according to any one of configurations 1 to 18, a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

[0068] (Configuration 20) 20. The electronic device of claim 19, wherein the electronic device includes at least one of a robot and a mobile object.

[0069] According to the embodiment, it is possible to provide a sensor and an electronic device that can obtain stable characteristics.

[0070] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element included in the sensor, such as the base, support, movable part, electrodes, insulating member, and circuit part, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0071] Furthermore, any combination of two or more elements of each specific example within the scope of technical feasibility is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0072] In addition, all sensors and electronic devices that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensors and electronic devices described above as embodiments of the present invention also fall within the scope of the present invention, as long as they include the gist of the present invention.

[0073] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0074] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0075] 10a, 10b...first and second base region, 10f...first surface, 10s...substrate, 21E...support part electrode, 21M...support member, 21c...support conductive part, 21ca...part, 21cb...part, 21e...extension part, 21i...support insulating part, 21ia...part, 21ib...part, 21s...support part, 22E... Fixed electrode, 22M... Fixed conductive member, 31C... First connection part, 31M... Movable member, 31P... First movable part, 31e... First movable extension part, 31h... Hole, 70... Control part, 110~114... Sensor, 170... Circuit control part, 180... Circuit, 185... Drive device, 210... Sensor device, 310...electronic equipment, D1~D3...1st~3rd direction, G1, G2...1st, 2nd gap, S1...signal, Sg1...AC signal, w1, w2...1st, 2nd width

Claims

1. a substrate including a first surface including a first substrate region; a support member fixed to the first base region, the support member including a support portion and an extension portion, the extension portion being connected to the support portion, the extension portion extending from the first base region to the support portion along a second direction intersecting with a first direction, and a first width of the support portion in a third direction intersecting with a plane including the first direction and the second direction being wider than a second width of the extension portion in the third direction; a movable member supported by the extension portion, the movable member having a first gap between the first surface and the movable member; Equipped with the support member includes a support conductive portion and a support insulating portion; a part of the supporting conductive portion serves as the supporting portion, Another part of the supporting conductive part becomes the extending part, a portion of the supporting insulating portion is provided between the first surface and the portion of the supporting conductive portion, A sensor wherein another portion of the supporting insulating portion is provided between the first surface and the another portion of the supporting conductive portion.

2. the movable member includes a first connection portion and a first movable portion, the first connection portion is located between the extension portion and a part of the first movable portion, the first connection portion is supported by the extension portion, The sensor of claim 1 , wherein the first connecting portion supports the first movable portion.

3. The sensor according to claim 2 , wherein the first connection portion has a meander structure.

4. The sensor according to claim 2 , wherein the first movable portion is provided around the support portion in a plane intersecting the first direction.

5. a plurality of the extending portions and a plurality of first connecting portions are provided, The sensor according to claim 4 , wherein one of the plurality of first connection portions is connected to one of the plurality of extension portions.

6. Further comprising a fixed conductive member; the first surface further includes a second substrate region; the fixed conductive member is fixed to the second base region; The sensor according to claim 2 , wherein the fixed conductive member faces the movable member in a direction intersecting the first direction.

7. A sensor according to any one of claims 1 to 6; a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

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