Vibration element, vibration device, and method for manufacturing vibration element
The vibration element with side surface electrodes connected to mount electrodes addresses unwanted vibrations in piezoelectric devices, enhancing vibration characteristics and stability by reducing charge distribution.
Patent Information
- Application Number
- JP2021163301
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-10-04
- Publication Date
- 2025-10-01
- Estimated Expiration
- 2041-10-04
AI Technical Summary
Piezoelectric devices suffer from unwanted vibrations due to charge distribution caused by contour vibrations, which degrade the vibration characteristics.
A vibration element with a rectangular shape and side surface electrodes electrically connected to mount electrodes, reducing charge distribution and unwanted vibrations by covering the areas where excitation electrodes are arranged.
The solution suppresses the induction of unnecessary vibrations, thereby improving the vibration characteristics and stability of the piezoelectric device.
Smart Images

Figure 0007746782000001 
Figure 0007746782000002 
Figure 0007746782000003
Abstract
Description
[Technical Field]
[0001] The present invention relates to a vibration element, a vibration device, and a method for manufacturing a vibration element. [Background technology]
[0002] Piezoelectric devices are known that vibrate a piezoelectric piece using excitation electrodes provided on the front and back of the piezoelectric piece to obtain a desired frequency. For example, Patent Document 1 discloses that a conductive film is provided in an area spaced a distance G from the edge of the excitation electrode, and that the temperature at which a frequency dip occurs is adjusted by adjusting this distance G. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Publication No. 2020-155808 Summary of the Invention [Problem to be solved by the invention]
[0004] However, in the piezoelectric device described in Patent Document 1, the conductive film is in an electrically floating state, so that contour vibrations cause charge distribution, which in turn induces unwanted vibrations and may degrade the vibration characteristics. [Means for solving the problem]
[0005] The vibration element is rectangular in plan view, with a first direction as its longitudinal direction and a second direction intersecting the first direction as its width direction, and is made of a piezoelectric material. The vibration element includes a vibration bar having a first main surface, a second main surface that is on the front and back side of the first main surface, and a first side surface and a second side surface that connect the first main surface and the second main surface and extend in the first direction, a first excitation electrode provided on the first main surface, a second excitation electrode provided on the second main surface, a first mount electrode electrically connected to the first excitation electrode, a second mount electrode electrically connected to the second excitation electrode, a first side surface electrode that extends in the first direction on the first side surface and is electrically connected to the first mount electrode, and a second side surface electrode that extends in the first direction on the second side surface and is electrically connected to the second mount electrode.
[0006] The vibration device includes the vibration element described above and a container that houses the vibration element, and the first mount electrode and the second mount electrode are bonded to a mounting surface of the container.
[0007] A method for manufacturing a vibration element includes: preparing a vibration element made of a piezoelectric material and having a first main surface, a second main surface that is opposite to the first main surface, and a first side surface and a second side surface that connect the first main surface and the second main surface; forming a metal film on the entire surface of the vibration element; applying a resist to the entire surface of the vibration element; and exposing the resist from a direction parallel to the first side surface and the second side surface and forming an obtuse angle with the first main surface to form a pattern of a first excitation electrode provided on the first main surface, a second excitation electrode provided on the second main surface, a first mount electrode electrically connected to the first excitation electrode, a second mount electrode electrically connected to the second excitation electrode, a first side surface electrode provided on the first side surface and electrically connected to the first mount electrode, and a second side surface electrode provided on the second side surface and electrically connected to the second mount electrode.
[0008] A method for manufacturing a vibration element includes: preparing a vibration element made of a piezoelectric material and having a first main surface, a second main surface that is opposite to the first main surface, first and second side surfaces that connect the first and second main surfaces and are perpendicular to the first main surface, and third and fourth side surfaces that connect the first and second side surfaces and form an obtuse angle with the first main surface; forming a metal film on the entire surface of the vibration element; applying a resist to the entire surface of the vibration element; and exposing the resist from a direction perpendicular to the first main surface to form a pattern of a first excitation electrode provided on the first main surface, a second excitation electrode provided on the second main surface, a first mount electrode electrically connected to the first excitation electrode, a second mount electrode electrically connected to the second excitation electrode, a first side surface electrode provided on the first side surface and electrically connected to the first mount electrode, and a second side surface electrode provided on the second side surface and electrically connected to the second mount electrode. [Brief explanation of the drawings]
[0009] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a vibration element according to a first embodiment. [Figure 2] Side view of Figure 1. [Figure 3] FIG. 3 is a flowchart showing a method for manufacturing the vibration element according to the first embodiment. [Figure 4] 3A to 3C are diagrams illustrating an exposure method in the method for manufacturing the vibration element according to the first embodiment. [Figure 5] FIG. 10 is a plan view showing a schematic configuration of a vibration element according to a second embodiment. [Figure 6] Side view of Figure 5. [Figure 7] FIG. 10 is a plan view showing a schematic configuration of a vibration element according to a third embodiment. [Figure 8] Side view of Figure 7. [Figure 9] FIG. 10 is a plan view showing a schematic configuration of a vibration element according to a fourth embodiment. [Figure 10] Side view of Figure 9. [Figure 11] FIG. 10 is a flowchart showing a method for manufacturing a vibration element according to a fourth embodiment. [Figure 12]10A to 10C are views for explaining an exposure method in a method for manufacturing a vibration element according to a fourth embodiment. [Figure 13] FIG. 10 is a plan view showing a schematic configuration of a vibration device according to a fifth embodiment. [Figure 14] Cross-sectional view taken along line AA in Figure 13. DETAILED DESCRIPTION OF THE INVENTION
[0010] 1. First embodiment 1.1.Vibration element First, a vibration element 1 according to a first embodiment will be described with reference to FIGS. For ease of explanation, in each of the subsequent figures except for Figures 3 and 11, the X-axis, Y-axis, and Z-axis are illustrated as three mutually orthogonal axes. The direction along the X-axis is referred to as the "X direction," the direction along the Y-axis as the "Y direction," and the direction along the Z-axis as the "Z direction." The arrowed side of each axis is also referred to as the "plus side," and the opposite side as the "minus side." The plus side of the Z-direction is also referred to as the "top" or "front," and the minus side of the Z-direction as the "bottom" or "back." In this embodiment, the first direction is the Y-direction, and the second direction intersecting the first direction is the X-direction.
[0011] The vibration element 1 of this embodiment has a vibration piece 10, a first excitation electrode 21, a second excitation electrode 22, a first mount electrode 23, a second mount electrode 24, a first side electrode 25, a second side electrode 26, a first lead electrode 27, and a second lead electrode 28.
[0012] The vibrating element 10 is capable of thickness-shear vibration and is made of various piezoelectric materials, including quartz crystal. Typically, it is an AT-cut quartz crystal element or a double-rotation-cut quartz crystal element, such as an SC cut. In this embodiment, the vibrating element 10 is an AT-cut quartz crystal element with a square planar shape, specifically a rectangular shape. Therefore, the X-axis, Y-axis, and Z-axis in the figure correspond to the Z'-axis, X-axis, and Y'-axis of the quartz crystal, respectively.
[0013] The resonator element 10 is a rectangular flat plate whose longitudinal direction is the first direction, or Y direction, and whose width direction is the second direction, or X direction. The resonator element 10 has a first main surface 11, a second main surface 12 that is opposite to the first main surface 11, a first side surface 13 and a second side surface 14 that connect the first main surface 11 and the second main surface 12 and extend in the Y direction, and a third side surface 15 and a fourth side surface 16 that connect the first side surface 13 and the second side surface 14 and extend in the X direction.
[0014] The vibrator element 10 has a first excitation electrode 21 provided at approximately the center of the first main surface 11, and a second excitation electrode 22 provided at approximately the center of the second main surface 12 at a position overlapping with the first excitation electrode 21. The first excitation electrode 21 is electrically connected to the first mount electrode 23, which is arranged on the negative side of the X direction, on the negative side of the Y direction, via a first lead electrode 27, and the second excitation electrode 22 is electrically connected to the second mount electrode 24, which is arranged on the positive side of the X direction, on the negative side of the Y direction, via a second lead electrode 28.
[0015] The first mount electrodes 23 are provided on the first main surface 11 and the second main surface 12, and are arranged to overlap each other. The first mount electrodes 23 provided on the first main surface 11 and the first mount electrodes 23 provided on the second main surface 12 are electrically connected via a first side surface electrode 25 provided on the first side surface 13. Like the first mount electrode 23, the second mount electrode 24 is also provided on the first main surface 11 and the second main surface 12, and is arranged so as to overlap each other, and the second mount electrode 24 provided on the first main surface 11 and the second mount electrode 24 provided on the second main surface 12 are electrically connected via a second side electrode 26 provided on the second side surface 14.
[0016] The vibrating element 10 is provided with a first side surface electrode 25 extending in the Y direction on the first side surface 13 and electrically connected to the first mount electrode 23, and a second side surface electrode 26 extending in the Y direction on the second side surface 14 and electrically connected to the second mount electrode 24. This reduces the distribution of electric charges caused by contour vibration, which in turn reduces the induction of unwanted vibrations, thereby suppressing deterioration of vibration characteristics.
[0017] Furthermore, the first excitation electrode 21 and the second excitation electrode 22 are provided in a first range R1 in the Y direction, and the first side surface electrode 25 and the second side surface electrode 26 are provided in a second range R2 in the Y direction that includes the first range R1. That is, the first side surface electrode 25 and the second side surface electrode 26 are longer in the Y direction than the first excitation electrode 21 and the second excitation electrode 22. Therefore, the side surface electrodes 25, 26 are provided so as to cover the side surfaces 13, 14 of the areas where the excitation electrodes 21, 22 are arranged, thereby further suppressing unwanted vibrations.
[0018] The first side surface electrode 25 is directly connected to the first mount electrode 23 at the end on the negative Y-direction side, and is not formed on the end 17 of the first side surface 13 on the positive Y-direction side. The second side surface electrode 26 is directly connected to the second mount electrode 24 at the end on the negative Y-direction side, and is not formed at the end 18 of the second side surface 14 on the positive Y-direction side. Therefore, since the side electrodes 25, 26 are directly connected to the mount electrodes 23, 24, respectively, the transfer of charges caused by unwanted vibration from the side electrodes 25, 26 to the excitation electrodes 21, 22 can be suppressed, reducing the effect on vibration characteristics.
[0019] As described above, the vibration element 1 of this embodiment has side electrodes 25, 26 electrically connected to the mount electrodes 23, 24 on the side surfaces 13, 14 of the vibration piece 10, thereby reducing the distribution of electric charge caused by contour vibration and further reducing the induction of unnecessary vibrations, thereby suppressing deterioration of vibration characteristics.
[0020] 1.2.Method for manufacturing vibration element Next, a method for manufacturing the vibration element 1 according to this embodiment will be described with reference to FIGS. As shown in FIG. 3, the method for manufacturing the vibration element 1 of this embodiment includes a vibration element preparation step, a metal film formation step, a resist application step, an electrode pattern formation step, and a resist removal step.
[0021] 1.2.1. Vibration piece preparation process First, in step S101, a vibrating element 10 is prepared, which is made of a piezoelectric material and has a first main surface 11, a second main surface 12 that is opposite to the first main surface 11, a first side surface 13 and a second side surface 14 in the longitudinal direction that connect the first main surface 11 and the second main surface 12, and a third side surface 15 and a fourth side surface 16 in the width direction that connect the first main surface 11 and the second main surface 12. In addition, it is desirable to prepare the vibrating element 10 by a processing method that can process the end faces flat, such as dry etching, dicing, or sandblasting, so that the side electrodes can be easily sputtered.
[0022] 1.2.2.Metal film formation process In step S102, a metal film such as gold is formed on the entire surface of the vibrating element 10 using a sputtering device or a vapor deposition device.
[0023] 1.2.3.Resist coating process In step S103, a resist 30 is applied to the entire surface of the vibrator element 10 on which the metal film has been formed, using a spray or spin resist application device.
[0024] 1.2.4. Electrode pattern formation process 4, a photomask 31 is placed on the vibrating element 10 on which the resist 30 is applied, and light L from a light source 32 is irradiated from two directions parallel to the first side surface 13 and the second side surface 14 and at obtuse angles θ1 and θ2 with the first main surface 11 to expose the resist 30. Thereafter, the resist 30 is developed, and the metal film exposed from the resist 30 is etched, thereby forming an electrode pattern including a first excitation electrode 21 provided on the first main surface 11, a second excitation electrode 22 provided on the second main surface 12, a first mount electrode 23 electrically connected to the first excitation electrode 21, a second mount electrode 24 electrically connected to the second excitation electrode 22, a first side surface electrode 25 provided on the first side surface 13 and electrically connected to the first mount electrode 23, and a second side surface electrode 26 provided on the second side surface 14 and electrically connected to the second mount electrode 24.
[0025] Furthermore, by exposing from two directions parallel to the first side surface 13 and the second side surface 14, i.e., from two directions intersecting the third side surface 15 and the fourth side surface 16, at angles θ1 and θ2 that form obtuse angles with the first main surface 11, the metal film on the third side surface 15 and the fourth side surface 16 can be removed, and conductivity between the first side surface electrode 25 and the second side surface electrode 26 can be prevented.
[0026] 1.2.5. Resist removal process In step S105, the resist 30 remaining on each electrode is removed using a resist remover or a plasma remover. Through the above steps, the vibration element 1 shown in FIGS. 1 and 2 is completed.
[0027] As described above, the manufacturing method of the vibration element 1 of this embodiment makes it possible to form side electrodes 25, 26 that are electrically connected to the mount electrodes 23, 24 on the side surfaces 13, 14 of the vibration piece 10, thereby reducing the distribution of charge caused by contour vibration and the induction of unnecessary vibrations, and thereby obtaining a vibration element 1 that suppresses deterioration of vibration characteristics.
[0028] 2. Second embodiment Next, a vibration element 1a according to a second embodiment will be described with reference to FIGS.
[0029] The vibration element 1a of this embodiment is similar to the vibration element 1 of the first embodiment except that the shapes of the first side electrode 25a and the second side electrode 26a are different from those of the vibration element 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.
[0030] As shown in FIGS. 5 and 6, the vibration element 1a has a first side electrode 25a provided from the first side surface 13 to the third side surface 15, and a second side electrode 26a provided from the second side surface 14 to the third side surface 15.
[0031] With this configuration, it is possible to obtain the same effects as in the first embodiment.
[0032] 3. Third embodiment Next, a vibration element 1b according to a third embodiment will be described with reference to FIGS.
[0033] The vibration element 1b of this embodiment is similar to the vibration element 1 of the first embodiment except that the shapes of the first side electrode 25b and the second side electrode 26b are different from those of the vibration element 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.
[0034] As shown in Figures 7 and 8, the vibration element 1b has a first side electrode 25b provided across the first main surface 11, the first side surface 13, and the second main surface 12, and a second side electrode 26b provided across the first main surface 11, the second side surface 14, and the second main surface 12.
[0035] With this configuration, it is possible to obtain the same effects as in the first embodiment.
[0036] 4. Fourth embodiment 4.1.Vibration element Next, a vibration element 1c according to a fourth embodiment will be described with reference to FIGS.
[0037] The vibration element 1c of this embodiment is similar to the vibration element 1 of the first embodiment except that the shape of the vibration piece 10c is different from that of the vibration element 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and a description of similar points will be omitted.
[0038] As shown in Figures 9 and 10, the vibration element 1c has a vibration piece 10c in which a third side surface 15c connecting the first side surface 13 and the second side surface 14 is formed at an obtuse angle θ3 with the first main surface 11, and a fourth side surface 16c connecting the first side surface 13 and the second side surface 14 is formed at an obtuse angle θ4 with the first main surface 11.
[0039] This configuration can provide the same effects as in the first embodiment. Furthermore, since the metal films on the third side surface 15c and the fourth side surface 16c can be easily removed during manufacturing, electrical continuity between the first side surface electrode 25 and the second side surface electrode 26 can be prevented.
[0040] 4.2.Method of manufacturing vibration element Next, a method for manufacturing the vibration element 1c according to this embodiment will be described with reference to FIGS. As shown in FIG. 11, the method for manufacturing the vibration element 1c of this embodiment includes a vibration element preparation step, a metal film formation step, a resist application step, an electrode pattern formation step, and a resist removal step.
[0041] 4.2.1. Vibration piece preparation process First, in step S201, a vibrating element 10c is prepared, which is made of a piezoelectric material and has a first main surface 11, a second main surface 12 that is on the front side or back side of the first main surface 11, a first side surface 13 and a second side surface 14 that connect the first main surface 11 and the second main surface 12 and are perpendicular to the first main surface 11, and a third side surface 15c and a fourth side surface 16c that connect the first side surface 13 and the second side surface 14 and form an obtuse angle with the first main surface 11.
[0042] 4.2.2.Metal film formation process In step S202, a metal film such as gold is formed on the entire surface of the vibrating element 10c using a sputtering device or a vapor deposition device.
[0043] 4.2.3. Resist coating process In step S203, a resist 30 is applied to the entire surface of the vibrator element 10c on which the metal film has been formed, using a spray or spin resist application device.
[0044] 4.2.4. Electrode pattern formation process 12, a photomask 31 is placed on the vibrating element 10c on which the resist 30 is applied, and light L from a light source 32c is irradiated from a direction perpendicular to the first main surface 11 to expose the resist 30. Thereafter, the resist 30 is developed, and the metal film exposed from the resist 30 is etched, thereby forming an electrode pattern including a first excitation electrode 21 provided on the first main surface 11, a second excitation electrode 22 provided on the second main surface 12, a first mount electrode 23 electrically connected to the first excitation electrode 21, a second mount electrode 24 electrically connected to the second excitation electrode 22, a first side surface electrode 25 provided on the first side surface 13 and electrically connected to the first mount electrode 23, and a second side surface electrode 26 provided on the second side surface 14 and electrically connected to the second mount electrode 24.
[0045] Furthermore, since the third side surface 15c and the fourth side surface 16c are inclined, the metal film on the third side surface 15c and the fourth side surface 16c can be easily removed by exposure from a direction perpendicular to the first main surface 11, thereby preventing conduction between the first side surface electrode 25 and the second side surface electrode 26.
[0046] 4.2.5. Resist removal process In step S205, the resist 30 remaining on each electrode is removed using a resist remover or a plasma remover. Through the above steps, the vibration element 1c shown in FIGS. 9 and 10 is completed.
[0047] As described above, the manufacturing method of the vibration element 1c of this embodiment makes it possible to form side electrodes 25, 26 that are electrically connected to the mount electrodes 23, 24 on the side surfaces 13, 14 of the vibration piece 10c, thereby reducing the distribution of electric charge caused by contour vibration and the induction of unnecessary vibrations, and thereby obtaining a vibration element 1c that suppresses deterioration of vibration characteristics.
[0048] 5. Fifth embodiment Next, a vibration device 100 including vibration elements 1, 1a, 1b, and 1c according to a fifth embodiment will be described with reference to Figs. 13 and 14. In the following description, a vibrator to which the vibration element 1 is applied will be exemplified. For ease of explanation, the lid 47 is omitted from Fig. 13.
[0049] As shown in Figures 13 and 14, the vibration device 100 of this embodiment includes a vibration element 1, a container 40 made of ceramic or the like that houses the vibration element 1, and a lid 47 made of glass, ceramic, metal, or the like.
[0050] 14, the container 40 is formed by stacking mounting terminals 44, a first substrate 41, a second substrate 42, a third substrate 43, and a bonding member 50. The container 40 also has a cavity 48 that opens upward. The inside of the cavity 48 that houses the vibration element 1 is hermetically sealed in a reduced pressure atmosphere or an inert gas atmosphere such as nitrogen by bonding a lid 47 with a bonding member 50 such as a seal ring.
[0051] A plurality of mounting terminals 44 are provided on the outer bottom surface of the first substrate 41. The mounting terminals 44 are electrically connected to connection terminals 45 provided above the second substrate 42 via through electrodes and interlayer wiring (not shown).
[0052] The vibration element 1 is housed in a cavity 48 of the container 40. The mount electrodes 23, 24 of the vibration element 1 are joined and electrically connected to connection terminals 45 provided on a mounting surface 46 of the second substrate 42 via bonding members 51 such as a conductive adhesive. Therefore, the excitation electrodes 21, 22 of the vibration element 1 and the mounting terminal 44 provided on the container 40 are electrically connected to each other via the mount electrodes 23, 24 and the connection terminals 45, etc.
[0053] The vibration device 100 of this embodiment has a vibration element 1 in which side electrodes 25, 26, which are longer in the Y direction than the excitation electrodes 21, 22, are provided on the sides 13, 14 of the vibration piece 10.This reduces the distribution of charge caused by contour vibration and the induction of unnecessary vibrations, suppresses deterioration of vibration characteristics, and achieves vibration characteristics with excellent stability.
[0054] In this embodiment, a vibrator has been described as an example of the vibrating device 100, but the vibrating device is not limited to this and may be an oscillator in which the vibrating element 1 and an oscillation circuit are housed in a container 40. In addition, in the vibrating element 1, the side electrodes 25, 26 may cover the end portions 17 and 18 and may not be provided on the third side surface 15. [Explanation of symbols]
[0055] 1, 1a, 1b, 1c... vibrating element, 10... vibrating piece, 11... first main surface, 12... second main surface, 13... first side surface, 14... second side surface, 15... third side surface, 16... fourth side surface, 17... end portion, 18... end portion, 21... first excitation electrode, 22... second excitation electrode, 23... first mount electrode, 24... second mount electrode, 25... first side surface electrode, 26... second side surface electrode, 27... first lead electrode, 28... second Lead electrode, 30...resist, 31...photomask, 32...light source, 40...container, 41...first substrate, 42...second substrate, 43...third substrate, 44...mounting terminal, 45...connection terminal, 46...mounting surface, 47...lid, 48...cavity, 50...bonding member, 51...bonding member, 100...vibration device, L...light, R1...first range, R2...second range, θ1, θ2, θ3, θ4...angles.
Claims
1. In a plan view, the first direction is the longitudinal direction, and the second direction intersecting the first direction is the width direction. The piezoelectric element is a rectangular shape, and is made of a piezoelectric material. The piezoelectric element has a first main surface and a front and back surface of the first main surface. a second main surface, a first side surface connecting the first main surface and the second main surface and extending in the first direction; and a second side surface; a first excitation electrode provided on the first main surface; a second excitation electrode provided on the second main surface; a first mount electrode electrically connected to the first excitation electrode; a second mount electrode electrically connected to the second excitation electrode; The first side surface extends in the first direction and is electrically and directly connected to the first mount electrode. a first side electrode connected to the first side electrode; The second side surface extends in the first direction and is electrically and directly connected to the second mount electrode. and a second side electrode connected to the first side electrode, In the longitudinal direction of the first main surface, the first excitation electrode and the second excitation electrode are provided in a first range, The first side electrode and the second side electrode are provided in a second range including the first range. R, the first side surface electrode is not formed on an end portion of the first side surface, the second side surface electrode is not formed on an end portion of the second side surface, In the second range, The first side electrode extends from a connection portion between the first main surface and the first side surface to the second main surface and the A first side surface and a connection portion are provided, The second side surface electrode extends from a connection portion between the first main surface and the second side surface to the second main surface and the A second side surface and a connection portion are provided. Vibration element.
2. The first side surface electrode is provided across the first main surface, the first side surface, and the second main surface. 、 The second side surface electrode is provided across the first main surface, the second side surface, and the second main surface. are The vibration element according to claim 1 .
3. The vibrating element has one end of the first side surface and one end of the second side surface in the first direction. a third side surface connecting the first and second sides, and other sides of the first and second sides in the first direction; a fourth side connecting the two ends; The angle formed between the third side surface and the first main surface and the angle formed between the fourth side surface and the first main surface are The angle is obtuse, The vibration element according to claim 1 or 2.
4. The vibration element according to any one of claims 1 to 3; a container that accommodates the vibration element, The first mount electrode and the second mount electrode are bonded to the mounting surface of the container. 、 Vibration device.
Citation Information
Patent Citations
Manufacture of electrode of rectangular piezoelectric oscillating piece
JP1989292907A
Piezoelectric vibrator and piezoelectric oscillator and manufacture of piezoelectric vibrating element used for the device
JP2000091866A
Manufacturing method of piezoelectric vibrating piece, mask for forming electrode of the piezoelectric vibrating piece, the piezoelectric vibrating piece, piezoelectric vibrator and piezoelectric oscillator
JP2003198300A
Crystal resonator
JP2004180274A
Method of manufacturing piezoelectric vibrating piece, piezoelectric vibrating piece and piezoelectric device
JP2011199849A