Coupling device for coupling vibration systems, and microelectromechanical component

Abstract

A coupling device (100) for coupling two vibration systems (210, 220), the coupling device being mounted on a substrate such that the vibration systems are linearly arranged along a first direction (x) and can vibrate along the first direction (x), the coupling device comprising a closed spring structure (110) that can be connected to the vibration systems (210, 220) on their opposite outer sides along the first direction (x), and an anchor structure (120) rigidly connected to the substrate, arranged within the closed spring structure (110) and connected to the spring structure (110) on their two opposite inner sides along a second direction (y) perpendicular to the first direction. In this way, the coupling device (100) connected to the vibration systems (210, 220) provides a differential mode coupling to the vibration systems (210, 220) as the mode with the lowest frequency.

Description

[Technical Field]

[0001] The present invention relates to a coupling device for coupling two vibration systems, and to a microelectromechanical component such as an inertial sensor or an angular velocity sensor having two coupled vibration systems. [Background technology]

[0002] In microelectromechanical systems (MEMS), such as inertial sensors and gyroscopes, there is often a technical need to oscillate a mass in push-pull mode, for example to create a force- and torque-free system. When both masses are in line, a spring mechanism is often used that can provide a link to make both masses oscillate synchronously (common mode) or in opposite directions (push-pull mode).

[0003] The common mode essentially corresponds to the non-use of the spring mechanism. Therefore, the spring stiffness assigned to the common mode is smaller than the spring stiffness assigned to the push-pull mode. Based on the relationship of natural frequency ω = √k / m (k: spring stiffness, m: mass), the natural frequency / resonant frequency ω of the common mode is, in principle, lower than the natural frequency / resonant frequency of the push-pull mode. Summary of the Invention

[0004] However, push-pull coupling is usually necessary for advantageously designing the functionality of MEMS. It is therefore an object of the present invention to identify coupling devices and microelectromechanical components including coupling devices in which push-pull coupling is not energetically penalized compared to common-mode coupling.

[0005] This object is achieved by the invention according to the independent claims.

[0006] A coupling device for coupling two vibration systems, the coupling device being mounted on a substrate so that the vibration systems are linearly arranged along a first direction and can vibrate along the first direction, and comprising: a closed spring structure that can be connected to the vibration systems at outer surfaces opposite to each other along the first direction, and an anchor structure that is rigidly connected to the substrate, is disposed within the closed spring structure, and is connected to the spring structure at two inner surfaces facing each other along a second direction perpendicular to the first direction, wherein the coupling device coupled to the vibration systems provides push-pull coupling of the vibration systems as the lowest frequency mode.

[0007] A closed spring structure, i.e., an essentially linear and deformable spring structure without open ends (and therefore capable of topologically deforming in a circular shape), when only two vibration systems are connected, will vibrate in a common mode, i.e., in the lowest vibration mode, i.e., the mode with the lowest vibration frequency. This vibration mode is suppressed if the vibration system is connected to the substrate at two points, such that the connecting line between the two points is perpendicular to the vibration direction of the vibration system or between the connections of the spring structure to the vibration system. This connection ensures that at least the same amount of energy must be used for the simultaneous and opposing displacements of the two vibration systems. This can be achieved in a space-saving manner by designing the spring structure's anchors into the spring structure.

[0008] The spring structure can be symmetrically configured with respect to at least two mutually orthogonal axes of symmetry. Two of the vibration systems can be connected to the spring structure along a first axis of symmetry, and two connections of the spring structure to the anchor structure can be arranged along a second axis of symmetry. A symmetrical design of the spring structure facilitates the determination of possible deflections, i.e., eigenmodes, and their excitation energies. Furthermore, if the spring structure is symmetrically configured, equal forces on the two vibration systems result in equal deflections.

[0009] In this way, when the spring structure is deformed along the first axis of symmetry, it can deform in the same direction and in the opposite direction along the second axis of symmetry. That is, deflection of the oscillatory system by a certain amount causes deformation of the spring structure along the first axis of symmetry, and deformation along the first axis of symmetry is accompanied by deformation of the spring structure along the second axis of symmetry that is related to (e.g., proportional to or equal to) the amount of deflection of the oscillatory system. This deformation makes the coupling to the push-pull mode "softer" than the coupling to the common mode, i.e., the spring constant allocable to the push-pull mode is smaller than the spring constant allocable to the common mode. As a result, the natural frequency of the push-pull mode is smaller than the natural frequency of the common mode, making the push-pull mode more energetically favorable than the common mode.

[0010] The coupling device can further comprise a first spring element connecting the anchor structure to the spring structure. In this case, the first spring element can be essentially deflected only along the second direction. The connection of the spring structure to the substrate is thus again provided via a bendable or deformable element, such as a doubly bent bending beam spring. This means that the point where the spring structure is connected to the substrate does not need to be fixed when the spring structure is deformed, but can vibrate along the second direction, i.e., perpendicular to the vibration direction of the vibration system. This allows the creation of push-pull modes of the vibration system, which have lower natural frequencies / energy-favorable eigenmodes than modes leading to common modes.

[0011] Furthermore, the coupling device can have a second spring element connecting the vibration system to the spring structure. In this case, the second spring element can essentially only bend along the first direction. The second spring element therefore serves to simplify the coupling of the vibration system to the spring structure. The second spring element eliminates a rigid coupling between the spring structure and the vibration system, making the vibration behavior of the spring structure more flexible. A rigid coupling would require slaving synchronization of the corresponding part of the spring structure with the vibration system.

[0012] The anchor structure can be configured as a single anchor in the center of the spring structure. This means that the spring structure has only one connection point to the substrate. This is advantageous from a manufacturing standpoint. Furthermore, the single connection to the substrate allows for more different vibration modes, making the coupling device versatile.

[0013] However, the anchor structure may also comprise two (or more) anchors arranged on the first axis of symmetry, i.e. in the vibration direction of the two vibration systems, thereby making it possible to suppress in particular the rotational movements of the spring structure, but it is also possible to arrange several anchors along the second axis of symmetry.

[0014] The spring structure can be configured in a circular, rectangular, square, hexagonal, elliptical or diamond shape, which simplifies the manufacturing of the spring structure.

[0015] If the spring structure is configured as a rectangle, square, or hexagon, the connections to the two vibration systems and to the anchor structure can be designed on the sides of the rectangle, square, or hexagon, respectively. If the spring structure is configured as a square, diamond, or hexagon, the connections to the two vibration systems and to the anchor structure can be designed on the corners of the square, diamond, or hexagon, respectively. Such a symmetrical connection improves the vibration behavior of the connection structure and ensures that common modes are no longer favored.

[0016] The microelectromechanical component may include the above-described coupling device and two of the vibration systems connected to the spring structures of the coupling device, and such a microelectromechanical component can achieve the above-described advantages. [Brief explanation of the drawings]

[0017] The present invention will now be described in detail with reference to the drawings, in which: The specification and drawings are purely exemplary, and the invention is defined solely by the claims.

[0018] [Figure 1] 1 shows a schematic diagram of a coupling device. [Figure 2] 1 shows a schematic diagram of another coupling device. [Figure 3] 1 shows a schematic diagram of a microelectromechanical component with a coupling device. [Figure 4] 1 shows a schematic diagram of another microelectromechanical component with a coupling device. [Figure 5] 1 shows a schematic diagram of another microelectromechanical component with a coupling device. DETAILED DESCRIPTION OF THE INVENTION

[0019] FIG. 1 shows a schematic diagram of a coupling device 100 for coupling two vibration systems 210, 220. The vibration systems 210, 220 can be microelectromechanical components or parts of a microelectromechanical system (MEMS), such as inertial sensors or angular velocity sensors. The vibration systems 210, 220 are arranged along a first direction x and can vibrate along this direction on a substrate (which can be imagined as being drawn below the components in FIG. 1). The vibration systems 210, 220 can be of any complexity, in particular consisting of multiple masses and springs that can perform a wide variety of movements relative to the substrate. However, the crucial factor here is that the vibration systems 210, 220, as a whole, lie on a line defined by the first direction x and can vibrate along this direction.

[0020] The coupling device 100 (when the vibration systems 210, 220 are coupled) is preferably designed to cause the vibration systems 210, 220 to vibrate in push-pull mode, i.e., the excitation mode of the push-pull vibration is energetically preferred over the common mode vibration or has a lower natural frequency.

[0021] For this purpose, the connecting device 100 has a closed spring structure 110. In this case, the term "closed" means that the spring structure is topologically a ring, i.e., can be internally transformed into a ring without breaking. The shape of the spring structure 110 is otherwise arbitrary, as long as it can perform the functions described below. In particular, the spring structure 110 can have a primarily irregular contour, as shown in FIG. 1. In addition to the closed contour, the spring structure 110 can also include parts protruding from this contour, such as springs, connecting points, etc.

[0022] The spring structure 110 is composed of a flexible material that is deformable parallel to the substrate plane (i.e., parallel to the image plane of FIG. 1). For example, the spring structure can be configured as a web that forms a closed bending beam spring that is exposed during MEMS fabrication. This allows the spring structure 110 to impart movement in a first direction x through corresponding deformation.

[0023] The oscillating systems 210, 220 are connected to the spring structure 110 via corresponding connections 118 on the outer surface of the spring structure 110. The connections 118 of the oscillating systems 210, 220 to the spring structure 110 are preferably opposite each other on a line defined by the first direction x, i.e., are preferably not offset along a second direction y perpendicular to the first direction x. However, if the spring structure 110 is appropriately designed, it may also be possible to couple the oscillating systems 210, 220 with an offset along the second direction y.

[0024] Otherwise, the free-floating spring structure 110, which is merely connected to the vibration systems 210 and 220, applies the common mode of the vibration systems 210 and 220 as the lowest vibration mode. In this case, the spring structure 110 basically vibrates in the same way as the vibration systems 210 and 220, which vibrate in the common mode, without being deformed. Push-pull mode vibration occurs only under specific excitation conditions.

[0025] To prevent this, the coupling device 100 includes an anchor structure 120 that connects the spring structure 110 to the substrate. In this case, the anchor structure 120 is connected to the inner surface of the spring structure 110 at two points that face each other along the second direction y, i.e., the anchor structure 120 is designed in an area surrounded by the spring structure 110. By coupling the spring structure 110 at two points so that the connecting lines at the two points are perpendicular to the vibration directions of the two vibration systems 210, 220, the spring structure 110 is no longer able to freely displace, i.e., its natural frequency increases, making common-mode coupling energetically unfavorable. The energy level of the common-mode coupling is increased, preferably above that of the push-pull coupling, at least to the point of energetic degeneracy with the push-pull coupling.

[0026] In the simplest case, the connection of the spring structure 110 to the substrate consists of a direct connection to the substrate, as shown in Figure 1. This leads to an energetic degeneracy of the common mode and the push-pull mode, since the movement of the spring structure on either side of the connection to the substrate no longer affects the movement on the other side, i.e., vibration on both sides in phase is energetically equivalent to vibration in antiphase.

[0027] Preferably, however, the connection of spring structure 110 to the substrate is made indirectly, for example via a first spring element 114 extending from a connection 112 on the spring structure to an anchor of anchor structure 120 that is rigidly connected to the substrate, as will be described in more detail with reference to FIG.

[0028] 2a-c) show a coupling device 100 connected to two vibration systems 210, 220. The coupling device 100 includes a first spring element 114 that is coupled to a spring structure 110 (e.g., configured as a hexagon) via a connector 112, thereby connecting the spring structure 110 to an anchor structure 120 located within the spring structure 110. The configuration of the first spring element 114 depicted in FIG. 2 should be understood as purely schematic, in that a generic pictogram of a spring is depicted. The first spring element 114 can take any form suitable for use in MEMS.

[0029] As shown in FIG. 2, the first spring element 114 of the spring structure 110 allows itself to be stretched and compressed along the second direction y. To this end, the first spring element 114 may be essentially deformable only along the second direction. FIG. 2a) shows the rest position, FIG. 2b) shows compression along the second direction y, and FIG. 2c) shows extension along the second direction y. During this process, the deformation of the spring structure 110 in the second direction y occurs in the opposite direction to the deformation along the first direction x, providing a coupling between the oscillating systems 210 and 220. Furthermore, the deformations may be related to each other, i.e., the amount of deformation in one direction may correspond to the amount of deformation in the other direction. For example, the amount of deflection in the first direction x may be proportional to or equal to the amount of deflection in the second direction y (with the signs of the deflections being reversed).

[0030] The deformation of the coupling device 100 and its components caused by the push-pull coupling is smaller than when the vibration systems 210, 220 vibrate in the common mode. As a result, the push-pull mode has a lower natural frequency and is more energetically advantageous than the common mode.

[0031] This can be additionally supported by the symmetrical design of the coupling device 100 or spring structure 110 shown in Fig. 2. As shown in Fig. 2, the coupling device 100 can be configured symmetrically with respect to at least two axes of symmetry S1, S2. The first axis of symmetry S1 runs in this case along a first direction x, on which the connection 118 of the spring structure 110 to the oscillating systems 210, 220 is located. The second axis of symmetry runs along a second direction y, on which the connection 112 of the spring structure 110 to the anchor structure 120, provided in the example of Fig. 2 by the first spring element 114, is located.

[0032] A symmetrical design of the coupling device 100 improves the flexural dynamics of the coupling device 100, since symmetrical deformations are energetically favorable, and movement of the two oscillating systems 210, 220 along the first direction x is automatically imparted. However, a symmetrical design is not essential. A non-symmetrically configured spring structure 110 can also be advantageous if the oscillating systems 210, 220 are appropriately configured, for example by using flexure springs.

[0033] The coupling device 100, or at least the spring structure 110, can also be configured symmetrically with respect to more than the two symmetry axes S1 and S2 mentioned above. For example, the spring structure 110 in FIG. 2 has a hexagonal shape (in the rest position) that is symmetric with respect to all side bisectors and all angle bisectors. The spring structure 110 can also be configured (in the rest position) as a circle, an ellipse, a rectangle, a square, or a rhombus. Furthermore, the first spring element 114 can also act on other points on the spring structure 110 in order to transfer (part of) the symmetry of the spring structure 114 to the entire coupling device 100. However, for improved guidance of the above-mentioned vibration systems 210 and 220, it is crucial here that any deformation of the coupling device 100 or the spring structure 110 is always symmetric with respect to the two symmetry axes S1 and S2 running along the first direction x and the second direction y.

[0034] 3-5 exemplarily and schematically depict various embodiments of a microelectromechanical component 300 including a coupling device 100 and two vibration systems 210, 220. It will be appreciated that any number of differently configured microelectromechanical components 300 are possible, combining the various elements explicitly described or depicted.

[0035] In the microelectromechanical component 300 shown in Figure 3, two vibration systems 210, 220 are connected to a diamond-shaped spring structure 110 by a second spring element 116, and at the center of the diamond-shaped spring structure 110 is an anchor structure connected to the spring structure 110 via two diamond-shaped bending beam springs that make up the first spring element 114.

[0036] The second spring element 116 is depicted in this case as a doubly folded bending beam spring, eliminating the strict relationship between the movement of the oscillating system 210, 220 and the deformation of the spring structure 110. It goes without saying that spring designs other than the second spring element 116 can also be used to perform this function. In particular, essentially any spring capable of deformation only along the first direction x can be used.

[0037] As a further example, FIG. 4 shows a rectangular spring structure 110 connected to a central anchor structure 120 via two double-folded bending beam springs.

[0038] A design such as that sketched in Fig. 5 is also conceivable. An anchor structure 120 consisting of two anchors is used, arranged along a first axis of symmetry S1, i.e., along a first direction. These anchors are connected to the spring structure 110 by a first spring element 114 designed as an arc-shaped bending beam spring, with a connection 112 arranged along a second axis of symmetry S2. By using such a structure, the coupling device 100 can be stabilized with respect to rotational movements in the substrate plane (i.e., the image plane in Fig. 5).

[0039] The coupling devices 100 described above have in common that they include an anchor structure 120 within a spring structure 110 that provides a push-pull mode. This makes the coupling device 100 particularly compact and therefore suitable for providing push-pull vibrations in a space-saving manner in microelectromechanical systems.

Claims

1. A coupling device (100) for coupling two vibration systems (210, 220), the vibration systems being linearly arranged along a first direction (x) and mounted on a substrate so as to be able to vibrate along the first direction (x); a closed spring structure (110) that can be connected to the vibration system (210, 220) on opposite outer surfaces along the first direction (x); an anchor structure (120) rigidly connected to the substrate, disposed within the closed spring structure (110), and connected to the spring structure (110) at two inner surfaces facing each other along a second direction (y) perpendicular to the first direction; The coupling device (100) connected to the vibration system (210, 220) provides a push-pull coupling of the vibration system (210, 220) as a lowest frequency mode; The anchor structure (120) as a single anchor in the center of the spring structure (110), or A coupling device (100) comprising two anchors arranged on a first axis of symmetry (S1).

2. The spring structure (110) is configured symmetrically with respect to at least the first axis of symmetry (S1) and a second axis of symmetry (S2) perpendicular to the first axis of symmetry (S1); The two vibration systems (210, 220) can be connected to the spring structure (110) along the first axis of symmetry (S1), 2. The coupling device (100) of claim 1, wherein two connections (112) of the spring structure (110) to the anchor structure (120) lie along the second axis of symmetry (S2).

3. 3. The coupling device (100) of claim 2, wherein the spring structure (110), when deformed along the first axis of symmetry (S1), deforms in an equal and opposite direction along the second axis of symmetry (S2).

4. a first spring element (114) connecting the anchor structure (120) to the spring structure (110); The coupling device (100) of any one of claims 1 to 3, wherein the first spring element (114) can be deflected essentially only along the second direction (y).

5. a second spring element (116) capable of connecting the vibration system (210, 220) to the spring structure (110); The coupling device (100) of any one of claims 1 to 3, wherein the second spring element (116) can be deflected essentially only along the first direction (x).

6. The coupling device (100) of any one of claims 1 to 3, wherein the spring structure (110) is configured in a circular, rectangular, square, hexagonal, elliptical, or diamond shape.

7. the spring structure (110) is configured in a rectangular, square or hexagonal shape, and the connections (112, 118) to the two vibration systems (210, 220) and to the anchor structure (120) are designed on the sides of the rectangle, square or hexagon, respectively, or 7. The coupling device (100) of claim 6, wherein the spring structure (110) is configured in the shape of a square, a diamond, or a hexagon, and the connections (112, 118) to the two vibration systems (210, 220) and to the anchor structure (120) are configured at the corners of the square, diamond, or hexagon, respectively.

8. A microelectromechanical component (300) comprising a coupling device (100) according to any one of claims 1 to 3 and two of the vibration systems (210, 220) connected to the spring structure (110) of the coupling device (100).

Images