Wet blasting apparatus and wet blasting method

The wet blasting apparatus adjusts processing depth and surface roughness through controlled liquid film thickness, addressing cost inefficiencies in existing systems and enhancing processing quality.

JP7749487B2Active Publication Date: 2025-10-06MITSUBISHI HEAVY IND LTD
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Patent Information

Application Number
JP2022021066
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-15
Publication Date
2025-10-06
Estimated Expiration
2042-02-15

AI Technical Summary

Technical Problem

Existing wet blasting apparatuses lack the ability to adjust processing depth per unit time without increasing introduction or running costs, primarily due to fixed air pressure supply, and using compressors to adjust pressure further escalates costs.

Method used

A wet blasting apparatus with a first nozzle unit for slurry discharge and a second nozzle unit for forming a liquid film, controlled by a unit to adjust the liquid film thickness, allowing for variable processing depth without additional costs.

Benefits of technology

Enables adjustable processing depth and surface roughness control, reducing operational costs while achieving high-quality surface processing.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To adjust a treatment amount of an object to be treated per unit time without increasing introduction costs nor running costs.SOLUTION: A wet blast treatment device 100 comprises: a first nozzle part 10 that discharges slurry S having first liquid and abrasive grain mixed to each other toward an area A1 to be treated of a work-piece W; a second nozzle part 20 that discharges second liquid LQ2 toward an untreated area A2 adjacent to the area A1 to be treated so that a liquid membrane is formed in the area A1 to be treated of the work-piece W; and a control part 90 that controls a discharge amount of the second liquid LQ2 that is discharged by the second nozzle part 20 so that a thickness of the liquid membrane is equal to a predetermined thickness T.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present disclosure relates to a wet blasting apparatus and a wet blasting method. [Background technology]

[0002] Conventionally, there is known a wet blasting treatment apparatus that sprays a slurry, which is a mixture of liquid and abrasive grains, onto a surface of a treatment object (see, for example, Patent Document 1). In the wet blasting treatment apparatus of Patent Document 1, air is supplied from a blower with a constant air pressure to a slurry spraying section that sprays the slurry. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5749324 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the wet blasting apparatus of Patent Document 1, the pressure of the air supplied to the slurry injection part is constant, so it is not possible to adjust the amount of processing (processing depth) of the processing target per unit time. Furthermore, if an air supply source such as a compressor is used to adjust the pressure of the air supplied to the slurry injection part, the introduction cost and running cost of the wet blasting apparatus will increase.

[0005] The present disclosure has been made in consideration of the above circumstances, and aims to provide a wet blasting processing apparatus and a wet blasting processing method that are capable of adjusting the amount of processing to be performed on the object per unit time without increasing the introduction cost or running cost. [Means for solving the problem]

[0006] In order to solve the above problems, the present disclosure employs the following means. A wet blasting processing apparatus according to one embodiment of the present disclosure includes a first nozzle unit that ejects a slurry containing a first liquid and abrasive grains toward a processing target area, a second nozzle unit that ejects a second liquid toward an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area, and a control unit that controls the amount of the second liquid ejected by the second nozzle unit so that the thickness of the liquid film is a predetermined thickness.

[0007] A wet blasting method according to one embodiment of the present disclosure includes a first discharge step of discharging a slurry containing a first liquid and abrasive grains from a first nozzle portion toward a processing target area, a second discharge step of discharging a second liquid from a second nozzle portion toward an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area, and a control step of controlling the amount of the second liquid discharged in the second discharge step so as to form a predetermined thickness of the liquid film. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to provide a wet blasting processing apparatus and a wet blasting processing method that are capable of adjusting the processing amount of the processing target per unit time without increasing the introduction cost or running cost. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic configuration diagram of a wet blasting treatment apparatus according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a partially enlarged view of the vicinity of the processing target area shown in FIG. 1, showing the collision direction of abrasive grains contained in the slurry. [Figure 3] 1 is a flowchart showing a wet blasting method according to an embodiment of the present invention. [Figure 4] FIG. 10 is a schematic configuration diagram of a wet blasting treatment apparatus according to a second embodiment of the present disclosure. [Figure 5] FIG. 10 is a schematic configuration diagram of a wet blasting treatment apparatus according to a third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] [First embodiment] Hereinafter, a wet blasting apparatus 100 according to a first embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a schematic configuration diagram of the wet blasting apparatus 100 according to the first embodiment of the present disclosure.

[0011] 1, the wet blasting apparatus 100 of this embodiment includes a first nozzle unit 10, a second nozzle unit 20, a housing 30, a mounting table 40, a recovery unit 50, a separation unit 60, a first pump 71, a second pump 72, a compressed gas supply source 80, and a control unit 90. The wet blasting apparatus 100 processes the surface of a workpiece (processing target) W mounted on the mounting table 40 by spraying abrasive grains onto the surface of the workpiece W. The workpiece W is formed of, for example, a metal material.

[0012] The first nozzle unit 10 is a device that discharges a slurry S, which is a mixture of a liquid (first liquid) and abrasive grains, toward a processing target area A1 on the surface of the workpiece W. The first nozzle unit 10 has a nozzle body 11 and a movement mechanism 12. The nozzle body 11 accelerates the slurry S, which is supplied from the separation unit 60 via a slurry supply line L1, using high-pressure compressed gas (e.g., compressed air) supplied from a compressed gas supply source 80, and discharges it in a direction along the Z axis extending vertically toward the processing target area A1.

[0013] The movement mechanism 12 is a mechanism for moving the nozzle body 11 to any position within an XY plane defined by an X axis extending horizontally and a Y axis perpendicular to the X axis. The first nozzle unit 10 moves the nozzle body 11 to any position within the XY plane using the movement mechanism 12, and discharges the slurry S to a desired position on the workpiece W. FIG. 1 shows a state in which the nozzle body 11 is fixed at a predetermined position on the Y axis, and the movement mechanism 12 moves the nozzle body 11 from left to right along the X axis. The Z axis is an axis perpendicular to the X and Y axes. The nozzle body 11 discharges the slurry S in a direction along the Z axis.

[0014] Although the moving mechanism 12 is described as a mechanism for moving the nozzle body 11 to any position within the XY plane, other configurations are also possible. For example, the moving mechanism 12 may be a mechanism for moving the nozzle body 11 along the Z axis in addition to the X and Y axes. In this case, the moving mechanism 12 moves the nozzle body 11 to any position within the XYZ space defined by the X, Y, and Z axes. The nozzle body 11 may also be provided with an angle adjustment mechanism (not shown) for changing the discharge direction of the slurry S at any tilt angle with respect to the Z axis.

[0015] 1, the processing target area A1 of the workpiece W is the area into which the slurry S is discharged from the first nozzle unit 10, and is the area processed by the wet blasting processing apparatus 100. The unprocessed area (adjacent area) A2 of the workpiece W is the area adjacent to the processing target area A1, and is the area that has not been processed with the slurry S. The processed area A3 of the workpiece W is the area adjacent to the processing target area A1, and is the area that has already been processed with the slurry S.

[0016] The liquid contained in the slurry S is, for example, pure water. The abrasive grains contained in the slurry S are made of, for example, stainless steel, ceramics, alumina, or tungsten carbide. The grain size of the abrasive grains is preferably 1 μm or more and 1 mm or less.

[0017] The volume percentage of the abrasive grains contained in the slurry S is preferably 1% or more and 99% or less, more preferably 20% or more and 99% or less, and even more preferably 50% or more and 99% or less.

[0018] The second nozzle unit 20 is a device that ejects a liquid (second liquid) LQ2 toward an unprocessed area A2 adjacent to the processing target area A1 so as to form a liquid film on the processing target area A1 of the workpiece W. The liquid LQ2 ejected into the unprocessed area A2 passes over the surfaces of the processing target area A1 and the processed area A3, and is guided from the installation table 40 to the recovery unit 50. The liquid LQ2 ejected by the second nozzle unit 20 is, for example, pure water.

[0019] The housing 30 accommodates the first nozzle unit 10, the second nozzle unit 20, the installation table 40, and the workpiece W inside. The installation table 40 is attached to the lower side of the housing 30. The installation table 40 is a plate-like member that supports the workpiece W. The installation table 40 has a plurality of through-holes (not shown) formed therein that guide the mixed liquid LQM of the slurry S and the liquid LQ2 that has passed through the processing target area A1 and the processed area A3 of the workpiece W and fallen from the workpiece W to the recovery section 50.

[0020] The recovery unit 50 is a device that stores the mixed liquid LQM of the slurry S and the liquid LQ2. The mixed liquid LQM that passes through the processing target area A1 and the processed area A3 of the work W and drops from the work W is recovered by the recovery unit 50. The mixed liquid LQM recovered by the recovery unit 50 is guided to the separation unit 60.

[0021] The separation unit 60 is a device that separates the mixed liquid LQM recovered by the recovery unit 50 into a liquid containing abrasive grains (third liquid) and a liquid not containing abrasive grains (fourth liquid). The liquid containing abrasive grains separated by the separation unit 60 is supplied to the first nozzle unit 10 via a slurry supply line L1 by the power of a first pump 71. The liquid not containing abrasive grains separated by the separation unit 60 is supplied to the second nozzle unit 20 via a pure water supply line L2 by the power of a second pump 72.

[0022] The compressed gas supply source 80 is a device that supplies high-pressure compressed gas (e.g., compressed air) for discharging liquid to the first nozzle section 10 and the second nozzle section 20. The compressed gas supply source 80 supplies compressed gas to the first nozzle section 10 via a compressed gas supply line L3. The compressed gas supply source 80 supplies compressed gas to the second nozzle section 20 via a compressed gas supply line L4.

[0023] The control unit 90 is a device that controls the first nozzle unit 10, the second nozzle unit 20, the first pump 71, the second pump 72, and the compressed gas supply source 80. The control unit 90 controls the amount of the liquid LQ2 discharged by the second nozzle unit 20 so that the thickness of the liquid film formed on the surface of the workpiece W by the liquid LQ2 discharged by the second nozzle unit 20 becomes a predetermined thickness T.

[0024] The predetermined thickness T of the liquid film is set in advance according to the machining depth Dp, which is the target value for machining the workpiece W to remove its surface, and the target value for the surface roughness of the workpiece W after machining. When the machining depth Dp is increased, the predetermined thickness T is made thinner in order to increase the collision speed when the abrasive grains collide with the surface of the workpiece W. When the surface roughness is reduced to perform high-quality surface machining, the predetermined thickness T is made thicker in order to decrease the collision speed when the abrasive grains collide with the surface of the workpiece W.

[0025] The control unit 90 preferably controls the discharge speed of the liquid LQ2 so that the second velocity V2 of the liquid LQ2 when the second nozzle unit 20 discharges the liquid LQ2 is higher than the first velocity V1 of the slurry S when the first nozzle unit 10 discharges the slurry S. By making the second velocity V2 higher than the first velocity V1, the collision angle when the abrasive grains collide with the surface of the workpiece W can be adjusted to a desired angle.

[0026] Figure 2 is a partially enlarged view of the vicinity of the processing target area A1 shown in Figure 1, showing the collision direction of abrasive grains AG contained in the slurry S. A velocity component MV1 along the discharge direction of the slurry S and a velocity component MV2 along the movement direction of the liquid LQ2 act on the abrasive grains AG shown in Figure 2. A velocity vector SV, which is a combination of the velocity components MV1 and MV2, acts on the abrasive grains AG.

[0027] Due to the action of both the slurry S and the liquid LQ2, the abrasive grains AG move in a collision direction aligned with the velocity vector SV and collide with the surface of the workpiece W. As shown in FIG. 2, the collision direction of the abrasive grains AG is inclined at a predetermined angle θ with respect to the discharge direction of the slurry S. The control unit 90 adjusts the magnitude of the predetermined angle θ by controlling the second velocity V2 of the liquid LQ2 discharged from the second nozzle unit 20. The control unit 90 decreases the second velocity V2 to decrease the predetermined angle θ, and increases the second velocity V2 to increase the predetermined angle θ.

[0028] As a result of studies by the present inventors, it was found that, compared to when the predetermined angle θ is 0 degrees, when the predetermined angle θ is greater than 0 degrees, the machining depth of the workpiece W becomes deeper and the surface roughness of the workpiece W becomes smaller. It was also found that as the predetermined angle θ is increased from 0 degrees to 30 degrees, the machining depth of the workpiece W gradually becomes deeper and the surface roughness of the workpiece W gradually becomes smaller. Therefore, in this embodiment, the control unit 90 controls the second velocity V2 of the liquid LQ2 discharged from the second nozzle unit 20 so that the predetermined angle θ is any angle greater than or equal to 10 degrees and less than or equal to 30 degrees.

[0029] Here, a description will be given of a wet blasting method executed by the wet blasting apparatus 100 of this embodiment. Fig. 3 is a flowchart showing the wet blasting method of this embodiment.

[0030] In step S101, the control unit 90 controls the second nozzle unit 20 to eject liquid toward an unprocessed area (adjacent area) A2 adjacent to the processing target area A1 so as to form a liquid film in the processing target area A1 of the workpiece W. The control unit 90 preferably controls the ejection speed of the liquid LQ2 so that a second velocity V2 of the liquid LQ2 when the second nozzle unit 20 ejects the liquid LQ2 is higher than a first velocity V1 of the slurry S when the first nozzle unit 10 ejects the slurry S.

[0031] Furthermore, the control unit 90 controls the discharge speed of the liquid LQ2 so that the collision direction of the abrasive grains when they collide with the processing target area A1 is inclined at a predetermined angle θ with respect to the discharge direction of the slurry S discharged from the first nozzle unit 10.

[0032] In step S102, the control unit 90 controls the first nozzle unit 10 and the compressed gas supply source 80 to discharge the slurry S toward the processing target area A1 of the workpiece W. After starting to discharge the slurry S in step S102, the control unit 90 controls the movement mechanism 12 so that the nozzle body 11 discharges the slurry S toward the unprocessed area A2.

[0033] In step S103, the control unit 90 determines whether or not to change the amount of liquid ejected from the second nozzle unit 20. If YES, the process proceeds to step S104; if NO, steps S101 and S102 are repeated.

[0034] In step S104, the control unit 90 controls the amount of liquid discharged from the second nozzle unit 20 in response to instructions from the operator. When increasing the machining depth Dp, the operator instructs the operator to change the amount of liquid discharged so as to reduce the predetermined thickness T in order to increase the collision speed when the abrasive grains collide with the surface of the workpiece W. When reducing the surface roughness to perform high-quality surface machining, the operator instructs the operator to change the amount of liquid discharged so as to increase the predetermined thickness T in order to decrease the collision speed when the abrasive grains collide with the surface of the workpiece W.

[0035] In step S105, the control unit 90 determines whether or not to end the wet blasting process. If YES, the process proceeds to step S106, and if NO, the control unit 90 executes step S101 again.

[0036] In step S106, the control unit 90 controls the first nozzle unit 10 and the compressed gas supply source 80 to stop the operation of discharging the slurry S toward the processing target area A1 of the workpiece W. The control unit 90 also controls the movement mechanism 12 to stop the movement of the nozzle body 11. In step S107, the control unit 90 controls the second nozzle unit 20 to stop the operation of ejecting the liquid toward the unprocessed region A2.

[0037] In the above description, the liquid discharged from the second nozzle part 20 is pure water, but other embodiments are also possible. For example, the liquid LQ2 discharged from the second nozzle part 20 may be a water-insoluble and volatile solvent (for example, a ketone-based solvent such as acetone or methyl propyl ketone, or a fluorine-based solvent such as cis-1-chloro-3,3,3-trifluoropropene).

[0038] In this case, the separation unit 60 has the function of separating the mixture of the slurry S and the liquid LQ2 recovered in the recovery unit 50 into the slurry S (a mixture of pure water and abrasive grains) and the liquid LQ2. The slurry S separated from the mixture in the separation unit 60 is supplied to the first nozzle unit 10. On the other hand, the liquid LQ2 separated from the mixture in the separation unit 60 is supplied to the second nozzle unit 20.

[0039] According to the wet blasting processing apparatus 100 of the above aspect, because the liquid LQ2 is volatile, the processing target area A1 is cooled by the heat of vaporization when the liquid LQ2 volatilizes in the processing target area A1, and it is possible to prevent problems caused by the processing target area A1 being excessively heated by the collision of abrasive grains. Furthermore, because the liquid contained in the slurry S discharged by the first nozzle unit 10 is pure water and the liquid LQ2 discharged by the second nozzle unit 20 is water-insoluble, these can be separated by the separation unit 60 and supplied to the first nozzle unit 10 and the second nozzle unit 20, respectively.

[0040] The functions and effects of the wet blasting apparatus 100 of this embodiment described above will be described. According to the wet blasting processing apparatus 100 of this embodiment, the slurry S is discharged from the first nozzle unit 10 toward the processing target area A1 of the workpiece W, and the liquid LQ2 is discharged from the second nozzle unit 20 toward the unprocessed area A2 adjacent to the processing target area A1 so as to form a liquid film in the processing target area A1 of the workpiece W. The abrasive grains contained in the slurry S discharged from the first nozzle unit 10 collide with the liquid film, decelerate, and then collide with the processing target area A1.

[0041] According to the wet blasting processing apparatus 100 of this embodiment, the discharge amount of the liquid LQ2 discharged from the second nozzle unit 20 is controlled so that the thickness of the liquid film becomes a predetermined thickness T. Even when the first velocity V1 of the slurry S discharged from the first nozzle unit 10 is constant, the predetermined thickness T of the liquid film can be arbitrarily controlled by the control unit 90 to adjust the collision speed of the abrasive grains with the processing target area A1. Therefore, the processing amount (processing depth) of the workpiece W per unit time can be adjusted without increasing the introduction cost or running cost by adjusting the first velocity V1 of the slurry S discharged from the first nozzle unit 10.

[0042] According to the wet blasting processing apparatus 100 of this embodiment, by making the second velocity V2 of the liquid LQ2 when the second nozzle unit 20 discharges the liquid LQ2 higher than the first velocity V1 of the slurry S when the first nozzle unit 10 discharges the slurry S, it is possible to tilt the collision direction of the abrasive grains AG when they collide with the processing target area A1 from the discharge direction of the slurry S discharged from the first nozzle unit 10. This makes it possible to reduce the surface roughness of the processing target area A1 and perform high-quality surface processing.

[0043] According to the wet blasting processing apparatus 100 of this embodiment, the collision direction of the abrasive grains AG is inclined at a predetermined angle θ of 10 degrees or more and 30 degrees or less relative to the discharge direction of the slurry S, thereby reducing the surface roughness of the processing target area A1 and performing high-quality surface processing.

[0044] According to the wet blasting processing apparatus 100 of this embodiment, by setting the volume fraction of abrasive grains contained in the slurry S to 1% or more, the proportion of liquid contained in the slurry S is reduced compared to when the volume fraction of abrasive grains contained in the slurry S is less than 1%. As a result, the bias between the areas in the processing target area A1 where the abrasive grains collide and the areas where only the liquid collide is reduced, thereby reducing the difference in the amount of processing in each part of the processing target area A1. Furthermore, by setting the volume fraction of abrasive grains contained in the slurry S to 15% or less, wear on the slurry supply line (pipe) L1 through which the slurry flows can be reduced compared to when the volume fraction of abrasive grains contained in the slurry is greater than 15%.

[0045] Second Embodiment Next, a wet blasting apparatus 100A according to a second embodiment of the present disclosure will be described with reference to the drawings. This embodiment is a modified example of the first embodiment, and is the same as the first embodiment except as otherwise described below.

[0046] The wet blasting apparatus 100A of this embodiment differs from the wet blasting apparatus 100 of the first embodiment in that it includes a calculation unit 110. Fig. 4 is a schematic configuration diagram of the wet blasting apparatus 100A according to a second embodiment of the present disclosure. As shown in Fig. 4, the wet blasting apparatus 100A of this embodiment includes the calculation unit 110.

[0047] The calculation unit 110 includes an imaging unit 111 that acquires an image of the surface of the workpiece W including the processing target area A1, and an image processing unit 112 that processes the image captured by the imaging unit 111 to calculate the processing depth Dp of the workpiece W processed by the surface treatment performed on the workpiece W. The image processing unit 112 calculates the processing depth Dp by, for example, comparing an image of the processing target area A1 on the surface of the workpiece W placed on the placement table 40 before the surface treatment is performed with an image of the processing target area A1 on the surface of the workpiece W placed on the placement table 40 while the surface treatment is being performed.

[0048] For example, by executing a calculation step of the machining depth Dp by the calculation unit 110 before step S103 in Fig. 3, the machining depth Dp calculated by the calculation unit 110 can be used in the judgment in step S103 in Fig. 3 and in the control of the discharge rate of the second nozzle unit 20 in step S104. For example, if the machining depth Dp calculated by the calculation unit 110 is deeper than a predetermined target machining depth, the operator instructs the discharge rate to be changed so as to increase the predetermined thickness T in order to reduce the collision speed when the abrasive grains collide with the surface of the workpiece W.

[0049] Furthermore, if the machining depth Dp calculated by the calculation unit 110 is shallower than a predetermined target machining depth, the operator instructs the discharge amount to be changed to reduce the predetermined thickness T in order to increase the collision speed when the abrasive grains collide with the surface of the workpiece W. In this way, when the wet blasting process is repeated multiple times to achieve the final machining depth, the machining depth processed by one wet blasting process device 100 can be adjusted to an appropriate amount.

[0050] Thus, according to the wet blasting processing apparatus 100A of this embodiment, the calculation unit 110 can calculate the processing depth Dp of the processing target area A1, so that appropriate surface processing can be performed, such as adjusting the thickness of the liquid film according to the processing depth Dp.

[0051] Third Embodiment Next, a wet blasting apparatus 100B according to a third embodiment of the present disclosure will be described with reference to the drawings. This embodiment is a modified example of the first embodiment, and is the same as the first embodiment except as otherwise described below.

[0052] In the wet blasting apparatus 100B of this embodiment, the first nozzle unit 10, the second nozzle unit 20, and the collection unit 50B are integrally formed so as to be movable relative to the workpiece W. Fig. 5 is a schematic configuration diagram of the wet blasting apparatus 100B according to the third embodiment of the present disclosure.

[0053] 5, the wet blasting apparatus 100B has a housing 30B to which a first nozzle unit 10, a second nozzle unit 20, and a recovery unit 50 are attached and integrated. The recovery unit 50B of this embodiment sucks in a mixed liquid LQM of the slurry S discharged from the first nozzle unit 10 and the liquid LQ2 discharged from the second nozzle unit 20, and guides it to the separation unit 60.

[0054] According to the wet blasting processing apparatus 100B of this embodiment, a mixed liquid LQM of the slurry S and the liquid LQ2 mixed in the treatment target area A1 is collected in the collection unit 50B. The mixed liquid LQM is separated in the separation unit 60 into a liquid containing abrasive grains (third liquid) and a liquid not containing abrasive grains (fourth liquid), and these liquids are supplied to the first nozzle unit 10 and the second nozzle unit 20, respectively. Because the first nozzle unit 10, the second nozzle unit 20, and the collection unit 50B are integrally formed so as to be movable, the first nozzle unit 10, the second nozzle unit 20, and the collection unit 50B can be moved to any position on the workpiece W, allowing for easy surface processing of the treatment target area A1.

[0055] The wet blasting apparatus according to the embodiment described above can be understood, for example, as follows. A wet blasting processing apparatus (100) according to one embodiment of the present disclosure includes a first nozzle section (10) that ejects a slurry containing a first liquid and abrasive grains toward a processing target area (A1), a second nozzle section (20) that ejects a second liquid toward an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area, and a control section (90) that controls the amount of the second liquid ejected by the second nozzle section so that the thickness of the liquid film is a predetermined thickness.

[0056] In a wet blasting processing apparatus according to one aspect of the present disclosure, a slurry is discharged from a first nozzle toward a processing target area, and a second liquid is discharged from a second nozzle onto an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area. Abrasive grains contained in the slurry discharged from the first nozzle collide with the liquid film, decelerating before colliding with the processing target area.

[0057] According to one aspect of the wet blasting processing apparatus of the present disclosure, the amount of the second liquid discharged from the second nozzle unit is controlled so that the liquid film has a predetermined thickness. Even when the discharge speed of the slurry discharged from the first nozzle unit is constant, the predetermined thickness of the liquid film can be arbitrarily controlled by the control unit to adjust the collision speed of the abrasive grains with the processing target area. Therefore, the processing amount of the processing target area per unit time can be adjusted without increasing the introduction cost or running cost by adjusting the discharge speed of the slurry discharged from the first nozzle unit.

[0058] In a wet blasting processing apparatus according to one embodiment of the present disclosure, the control unit may be configured to control the ejection speed of the second liquid so that the second speed of the second liquid when the second nozzle unit ejects the second liquid is higher than the first speed of the slurry when the first nozzle unit ejects the slurry.

[0059] With this wet blasting processing apparatus, the second velocity of the second liquid discharged from the second nozzle unit is set higher than the first velocity of the slurry discharged from the first nozzle unit, thereby tilting the direction of impact of the abrasive grains on the processing target area from the direction of discharge of the slurry from the first nozzle unit, thereby reducing the surface roughness of the processing target area and achieving high-quality surface processing.

[0060] In a wet blasting processing apparatus according to one embodiment of the present disclosure, the control unit may control the ejection speed of the second liquid so that the collision direction of the abrasive grains when they collide with the processing target area is inclined by a predetermined angle (θ) relative to the ejection direction of the slurry ejected from the first nozzle unit, and the predetermined angle may be greater than or equal to 10 degrees and less than or equal to 30 degrees.

[0061] With this wet blasting processing device, the collision direction of the abrasive grains is tilted at a predetermined angle of 10 degrees or more and 30 degrees or less relative to the direction of slurry discharge, thereby reducing the surface roughness of the area to be processed and performing high-quality surface processing.

[0062] In a wet blasting processing apparatus according to one aspect of the present disclosure, a calculation unit (110) may be configured to acquire an image including the processing target area and calculate the processing depth (Dp) of the processing target area processed by the abrasive grains.

[0063] According to the wet blasting processing apparatus of this configuration, the calculation unit can calculate the processing depth of the area to be processed, so that appropriate surface processing can be performed, such as adjusting the thickness of the liquid film according to the processing depth.

[0064] In one embodiment of the wet blasting processing apparatus of the present disclosure, the first liquid is water, the second liquid is a water-insoluble and volatile liquid, and the apparatus is equipped with a recovery section (50) that recovers a mixed liquid of the first liquid and the second liquid, and a separation section (60) that separates the second liquid from the mixed liquid recovered by the recovery section, and the first liquid separated by the separation section may be supplied to the first nozzle section, and the second liquid separated by the separation section may be supplied to the second nozzle section.

[0065] In the wet blasting processing apparatus of this configuration, since the second liquid is volatile, the heat of vaporization generated when the second liquid evaporates in the processing area cools the processing area, preventing problems caused by the processing area being overheated by the collision of abrasive grains. Also, since the first liquid is water and the second liquid is water-insoluble, the first liquid and the second liquid can be separated in the separation unit and supplied to the first nozzle unit and the second nozzle unit, respectively.

[0066] In one embodiment of the wet blasting processing apparatus of the present disclosure, the apparatus includes a recovery section (50B) that recovers a mixed liquid obtained by mixing the first liquid and the second liquid, and a separation section (60) that separates the mixed liquid recovered by the recovery section into a third liquid containing the abrasive grains and a fourth liquid not containing the abrasive grains, and the third liquid separated by the separation section is supplied to the first nozzle section, and the fourth liquid separated by the separation section is supplied to the second nozzle section, and the first nozzle section, the second nozzle section, and the recovery section may be integrally formed so as to be movable.

[0067] In the wet blasting apparatus of this configuration, a mixture of a first liquid and a second liquid mixed in the area to be treated is collected in the collection unit. The mixture is separated in the separation unit into a third liquid containing abrasive grains and a fourth liquid not containing abrasive grains, and these are supplied to the first nozzle unit and the second nozzle unit, respectively. Because the first nozzle unit, the second nozzle unit, and the collection unit are integrally formed so as to be movable, the first nozzle unit, the second nozzle unit, and the collection unit can be moved to any position on the area to be treated, facilitating surface processing of the area to be treated.

[0068] In the wet blasting apparatus according to the aspect of the present disclosure, the volume ratio of the abrasive grains contained in the slurry may be 1% or more (more preferably 20% or more).

[0069] With this wet blasting apparatus, by setting the volume fraction of abrasive grains in the slurry to 1% or more, the proportion of liquid in the slurry is smaller than when the volume fraction of abrasive grains in the slurry is less than 1%. Furthermore, by setting the volume fraction of abrasive grains in the slurry to 20% or more, the proportion of liquid in the slurry is smaller than when the volume fraction of abrasive grains in the slurry is less than 20%. This reduces the bias between areas where abrasive grains collide and areas where only liquid collide in the processing area, thereby reducing the difference in the amount of processing in each part of the processing area.

[0070] The wet blasting method according to the embodiment described above can be understood, for example, as follows. A wet blasting method according to one embodiment of the present disclosure includes a first discharge step (S101) of discharging a slurry containing a first liquid and abrasive grains from a first nozzle portion toward a processing target area, a second discharge step (S102) of discharging a second liquid from a second nozzle portion toward an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area, and a control step (S104) of controlling the amount of the second liquid discharged in the second discharge step so as to form a predetermined thickness of the liquid film.

[0071] According to a wet blasting method according to one aspect of the present disclosure, a slurry is discharged from a first nozzle toward a processing target area, and a second liquid is discharged from a second nozzle onto an adjacent area adjacent to the processing target area so as to form a liquid film on the processing target area. Abrasive grains contained in the slurry discharged from the first nozzle collide with the liquid film, decelerating before colliding with the processing target area.

[0072] According to one aspect of the wet blasting processing apparatus of the present disclosure, the amount of the second liquid discharged from the second nozzle unit is controlled so that the liquid film has a predetermined thickness. Even when the discharge speed of the slurry discharged from the first nozzle unit is constant, the predetermined thickness of the liquid film can be arbitrarily controlled by the control process to adjust the collision speed of the abrasive grains with the processing target area. Therefore, the processing amount of the processing target area per unit time can be adjusted without increasing the introduction cost or running cost by adjusting the discharge speed of the slurry discharged from the first nozzle unit.

[0073] In a wet blasting processing method according to one embodiment of the present disclosure, the control process may be configured to control the ejection speed of the second liquid so that the second speed of the second liquid when the second nozzle section ejects the second liquid is higher than the first speed of the slurry when the first nozzle section ejects the slurry.

[0074] According to the wet blasting method of this configuration, by making the second velocity of the second liquid discharged from the second nozzle higher than the first velocity of the slurry discharged from the first nozzle, it is possible to tilt the direction of collision of the abrasive grains with the processing target area from the direction of discharge of the slurry discharged from the first nozzle, thereby reducing the surface roughness of the processing target area and achieving high-quality surface processing.

[0075] In a wet blasting processing method according to one embodiment of the present disclosure, the control process may be configured to control the ejection speed of the second liquid so that the collision direction of the abrasive grains when they collide with the processing target area is inclined at a predetermined angle relative to the ejection direction of the slurry ejected from the first nozzle portion, and the predetermined angle may be greater than or equal to 10 degrees and less than or equal to 30 degrees.

[0076] According to the wet blasting method of this configuration, the collision direction of the abrasive grains is tilted at a predetermined angle of 10 degrees or more and 30 degrees or less with respect to the direction of slurry discharge, thereby reducing the surface roughness of the area to be treated and achieving high-quality surface processing.

[0077] In a wet blasting method according to one aspect of the present disclosure, the method may be configured to include a calculation step of acquiring an image including the processing target area and calculating the processing depth of the processing target area processed by the abrasive grains.

[0078] According to the wet blasting method of this configuration, the calculation unit can calculate the processing depth of the area to be processed, so that appropriate surface processing can be performed, such as adjusting the thickness of the liquid film according to the processing depth.

[0079] In a wet blasting method according to one embodiment of the present disclosure, the first liquid is water, the second liquid is a water-insoluble and volatile liquid, and the method includes a recovery process for recovering a mixed liquid obtained by mixing the first liquid and the second liquid, and a separation process for separating the second liquid from the mixed liquid recovered by the recovery process, and the first liquid separated by the separation process may be supplied to the first nozzle portion, and the second liquid separated by the separation process may be supplied to the second nozzle portion.

[0080] According to the wet blasting method of this configuration, since the second liquid is volatile, the heat of vaporization generated when the second liquid evaporates in the treatment area cools the treatment area, preventing problems caused by excessive heating of the treatment area. Furthermore, since the first liquid is water and the second liquid is water-insoluble, the first liquid and the second liquid can be separated in a separation process and supplied to the first nozzle unit and the second nozzle unit, respectively.

[0081] A wet blasting processing method according to one embodiment of the present disclosure includes a recovery process for recovering a mixed liquid obtained by mixing the first liquid and the second liquid in a recovery section, and a separation process for separating the mixed liquid recovered by the recovery process into a third liquid containing the abrasive grains and a fourth liquid not containing the abrasive grains, wherein the third liquid separated by the separation process is supplied to the first nozzle section, and the fourth liquid separated by the separation process is supplied to the second nozzle section, and the first nozzle section, the second nozzle section, and the recovery section may be integrally formed so as to be movable.

[0082] According to the wet blasting method of this configuration, a mixture of a first liquid and a second liquid mixed in the processing target area is collected in a collection unit. In a separation process, the mixture is separated into a third liquid containing abrasive grains and a fourth liquid not containing abrasive grains, and these are supplied to a first nozzle unit and a second nozzle unit, respectively. Because the first nozzle unit, the second nozzle unit, and the collection unit are integrally formed so as to be movable, the first nozzle unit, the second nozzle unit, and the collection unit can be moved to any position on the processing target, allowing for easy surface processing of the processing target area.

[0083] In the wet blasting method according to the aspect of the present disclosure, the volume ratio of the abrasive grains contained in the slurry may be 1% or more and 50% or less.

[0084] According to the wet blasting method of this configuration, by setting the volume fraction of abrasive grains in the slurry to 1% or more, the volume fraction of liquid in the slurry is reduced compared to when the volume fraction of abrasive grains in the slurry is less than 1%. This reduces the bias between areas of the processing area where abrasive grains collide and areas where only liquid collide, thereby reducing the difference in the amount of processing in each part of the processing area. Furthermore, by setting the volume fraction of abrasive grains in the slurry to 50% or less, wear on the piping through which the slurry flows can be reduced compared to when the volume fraction of abrasive grains in the slurry is more than 50%. [Explanation of symbols]

[0085] 10 First nozzle section 20 Second nozzle section 30,30B housing 40 Installation stand 50,50B Recovery section 60 Separation section 71 First Pump 72 Second Pump 80 Compressed Gas Supply Source 90 Control Unit 100, 100A, 100B Wet blasting equipment 110 Calculation Unit A1 Processing area A2 Unprocessed area (adjacent area) A3 Processed area AG abrasive grain Dp Processing depth L1 Slurry supply line L2 Pure water supply line L3 Compressed gas supply line L4 Compressed gas supply line LQ2 liquid LQM mixture S Slurry T Thickness V1 1st speed V2 2nd speed double work θ Predetermined angle

Claims

1. a first nozzle unit that discharges a slurry, which is a mixture of a first liquid and abrasive grains, toward a processing target area on a surface of the processing target to grind the processing target area; a second nozzle portion that ejects a second liquid toward an unprocessed area of ​​the surface of the processing target that is adjacent to the processing target area and that has not been processed with the slurry, thereby forming a liquid film of the second liquid that passes through the processing target area; a control unit that controls the amount of the second liquid discharged from the second nozzle unit so that the thickness of the liquid film that decelerates the abrasive grains contained in the slurry discharged from the first nozzle unit becomes a predetermined thickness that is set according to a target value of the processing depth of the processing target area.

2. The first nozzle portion discharges the slurry in a discharge direction that is vertical toward the processing target area, the second nozzle portion ejects the second liquid in a moving direction along the surface of the processing object, the control unit controls a discharge speed of the second liquid along the movement direction so that a collision direction of the abrasive grains when they collide with the processing target region is inclined by a predetermined angle with respect to the discharge direction of the slurry discharged from the first nozzle unit; 2. The wet blasting apparatus according to claim 1, wherein the predetermined angle is equal to or greater than 10 degrees and equal to or less than 30 degrees.

3. The wet blasting processing apparatus according to claim 1 or 2, further comprising a calculation unit that acquires an image including the processing target area and calculates a processing depth of the processing target area processed by the abrasive grains.

4. the first liquid is water, the second liquid is a water-insoluble and volatile liquid, a recovery unit that recovers a mixed liquid obtained by mixing the first liquid and the second liquid; a separation unit that separates the second liquid from the mixed liquid recovered by the recovery unit, the first liquid separated by the separation unit is supplied to the first nozzle unit; The wet blasting treatment apparatus according to claim 1 , wherein the second liquid separated by the separation unit is supplied to the second nozzle unit.

5. a recovery unit that recovers a mixed liquid obtained by mixing the first liquid and the second liquid; a separation unit that separates the mixed liquid recovered by the recovery unit into a third liquid containing the abrasive particles and a fourth liquid not containing the abrasive particles, the third liquid separated by the separation unit is supplied to the first nozzle unit, and the fourth liquid separated by the separation unit is supplied to the second nozzle unit, The wet blasting processing apparatus according to claim 1 , wherein the first nozzle portion, the second nozzle portion, and the recovery portion are integrally formed so as to be movable.

6. The wet blasting apparatus according to claim 1 , wherein a volume ratio of the abrasive grains contained in the slurry is 1% or more.

7. 6. The wet blasting apparatus according to claim 1, wherein a volume ratio of the abrasive grains contained in the slurry is 20% or more.

8. a first discharging step of discharging a slurry obtained by mixing a first liquid and abrasive grains from a first nozzle portion toward a processing target area on a surface of the processing target to grind the processing target area; a second discharge step of discharging a second liquid from a second nozzle portion toward an untreated area of ​​the surface of the treatment target that is adjacent to the treatment target area and has not been processed with the slurry, thereby forming a liquid film of the second liquid that passes through the treatment target area; a control process for controlling the amount of the second liquid discharged in the second discharge process so that the thickness of the liquid film that decelerates the abrasive grains contained in the slurry discharged from the first nozzle portion becomes a predetermined thickness that is set according to a target value for the processing depth of the processing target area.

9. The first nozzle portion discharges the slurry in a discharge direction that is vertical toward the processing target area, the second nozzle portion ejects the second liquid in a moving direction along the surface of the processing object, the control step includes controlling a discharge speed of the second liquid along the movement direction so that a collision direction of the abrasive grains when they collide with the processing target region is inclined by a predetermined angle with respect to the discharge direction of the slurry discharged from the first nozzle portion; The wet blasting method according to claim 8, wherein the predetermined angle is equal to or greater than 10 degrees and equal to or less than 30 degrees.

10. The wet blasting method according to claim 8 or 9, further comprising a calculation step of acquiring an image including the processing target area and calculating a processing depth of the processing target area processed by the abrasive grains.

11. the first liquid is water, the second liquid is a water-insoluble and volatile liquid, a recovery step of recovering a mixed liquid obtained by mixing the first liquid and the second liquid; a separation step of separating the second liquid from the mixed liquid recovered in the recovery step, the first liquid separated in the separating step is supplied to the first nozzle portion, The wet blasting method according to claim 8 , wherein the second liquid separated in the separating step is supplied to the second nozzle portion.

12. a recovery step of recovering a mixed liquid obtained by mixing the first liquid and the second liquid in a recovery section; a separation step of separating the mixed liquid recovered in the recovery step into a third liquid containing the abrasive particles and a fourth liquid not containing the abrasive particles, the third liquid separated in the separating step is supplied to the first nozzle portion, and the fourth liquid separated in the separating step is supplied to the second nozzle portion, The wet blasting method according to any one of claims 8 to 10, wherein the first nozzle portion, the second nozzle portion, and the recovery portion are integrally formed so as to be movable.

13. 13. The wet blasting method according to claim 8, wherein a volume ratio of the abrasive grains contained in the slurry is 1% or more and 15% or less.

Citation Information

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