Distance measuring device

Abstract

The ranging device (1) according to the present disclosure comprises a light-emitting element (2), a light-receiving element (3), and a substrate (20). The light-emitting element (2) irradiates an object (X) with light. The light-receiving element (3) receives light from the light-emitting element (2) that has been reflected from the object (X). The light-emitting element (2) and the light-receiving element (3) are mounted on the substrate (20). No bonding wire (W) that electrically connects the light-receiving element (3) and the substrate (20) is disposed on the light-emitting-element (2)-side edge (3s) of the light-receiving element (3).

Description

[Technical Field]

[0001] The present disclosure relates to a distance measuring device. [Background technology]

[0002] One known distance measurement method for measuring the distance to an object using light is the ToF (Time of Flight) method. In this ToF method, light emitted from a light source is reflected by an object and received by a light receiving element, and the distance to the object is measured based on the time from when the light is emitted until when it is received as reflected light (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-153701 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure proposes a distance measuring device that can receive reference light in good condition with a light receiving element. [Means for solving the problem]

[0005] According to the present disclosure, there is provided a distance measuring device. The distance measuring device includes a light emitting element, a light receiving element, and a substrate. The light emitting element irradiates a target object with light. The light receiving element receives light from the light emitting element that is reflected from the target object. The substrate mounts the light emitting element and the light receiving element. In addition, a bonding wire electrically connecting the light receiving element to the substrate is not arranged on the side of the light receiving element facing the light emitting element. [Brief explanation of the drawings]

[0006] [Figure 1]FIG. 1 is a diagram schematically illustrating distance measurement using a direct ToF method that is applicable to an embodiment of the present disclosure. [Figure 2] FIG. 10 is a diagram illustrating an example histogram based on the time at which a light receiving unit receives light, which is applicable to an embodiment of the present disclosure. [Figure 3] 1 is a block diagram showing an example of the configuration of a distance measuring device according to an embodiment. [Figure 4] FIG. 2 is a block diagram illustrating in more detail the configuration of an example of a light receiving element applicable to the embodiment. [Figure 5] FIG. 1 is a diagram illustrating an example of a basic configuration of an effective pixel that can be applied to an embodiment of the present disclosure. [Figure 6] 1 is a schematic diagram illustrating an example of a configuration of a device applicable to a light receiving element according to an embodiment of the present disclosure. [Figure 7] 1 is a cross-sectional view illustrating an example of a configuration of a distance measuring device according to an embodiment of the present disclosure. [Figure 8] FIG. 1 is a plan view illustrating an example of a configuration of a distance measuring device according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is a plan view showing an example of the arrangement of pixel regions in a pixel array unit in a distance measuring device according to an embodiment of the present disclosure. [Figure 10] FIG. 10 is a cross-sectional view taken along the line AA in FIG. 9. [Figure 11] FIG. 2 is an enlarged cross-sectional view showing a bandpass filter and its surrounding configuration according to an embodiment of the present disclosure. [Figure 12] FIG. 10 is a plan view showing an example of the configuration of a distance measuring device according to a first modified example of the embodiment of the present disclosure. [Figure 13] FIG. 10 is a plan view showing an example of the configuration of a distance measuring device according to a second modification of the embodiment of the present disclosure. [Figure 14] FIG. 10 is a plan view showing an example of the configuration of a distance measuring device according to a third modification of the embodiment of the present disclosure. [Figure 15] FIG. 10 is a plan view showing an example of the configuration of a distance measuring device according to a fourth modified example of the embodiment of the present disclosure. [Figure 16] FIG. 11 is a plan view showing an example of the configuration of a distance measuring device according to a fifth modified example of the embodiment of the present disclosure. [Figure 17]FIG. 13 is a cross-sectional view showing an example of the configuration of a distance measuring device according to a sixth modification of the embodiment of the present disclosure. [Figure 18] FIG. 13 is a cross-sectional view showing an example of the configuration of a distance measuring device according to a seventh modified example of the embodiment of the present disclosure. [Figure 19] FIG. 13 is a cross-sectional view showing an example of the configuration of a distance measuring device according to Modification 8 of the embodiment of the present disclosure. [Figure 20] FIG. 13 is a cross-sectional view showing an example of the configuration of a distance measuring device according to a ninth modification of the embodiment of the present disclosure. [Figure 21] FIG. 23 is a cross-sectional view showing an example of the configuration of a distance measuring device according to a tenth modification of the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following embodiments, the same components are designated by the same reference numerals, and redundant description will be omitted.

[0008] One of the distance measurement methods that uses light to measure the distance to an object is the ToF method. In this direct ToF method, light emitted from a light source is reflected by the object and received by a light receiving element, and the distance to the object is measured based on the time between the light being emitted and the light being received as reflected light.

[0009] Furthermore, in a distance measuring device that applies such a distance measuring method, a portion of the light emitted from the light-emitting element (hereinafter also referred to as reference light) can be guided to a light-receiving element within the device, thereby making it possible to accurately evaluate the time at which the light was emitted.

[0010] On the other hand, if the reference light is diffusely reflected by various components inside the device (for example, bonding wires), the reference light may not reach the light receiving element in good condition, and there is a risk that the emission time cannot be accurately evaluated using such reference light.

[0011] Therefore, it is desired to realize a distance measuring device that can overcome the above-mentioned problems and receive reference light in good condition with a light receiving element.

[0012] [Distance measurement method] The present disclosure relates to a technology for measuring distances using light. To facilitate understanding of embodiments of the present disclosure, a distance measurement method applicable to the embodiments will be described with reference to FIGS. 1 and 2.

[0013] 1 is a diagram schematically illustrating distance measurement using a direct ToF method that can be applied to an embodiment of the present disclosure. In the present disclosure, the direct ToF method is applied as the distance measurement method.

[0014] In the direct ToF method, light L1 emitted from a light-emitting element 2 is reflected by an object X, and the reflected light L2 is received by a light-receiving element 3, and distance measurement is performed based on the time difference between the light emission timing and the light reception timing.

[0015] The distance measuring device 1 includes a light emitting element 2 and a light receiving element 3. The light emitting element 2 has a light source such as a laser diode, and is driven to emit pulsed laser light.

[0016] The light L1 emitted from the light-emitting element 2 is reflected by the object X and received as reflected light L2 by the light-receiving element 3. The light-receiving element 3 includes a pixel array unit 10 (see FIG. 4) that converts light into an electrical signal by photoelectric conversion, and outputs a signal corresponding to the received light.

[0017] Here, the time when the light-emitting element 2 emits light (light-emitting timing) is time t0, and the time when the light-receiving element 3 receives the reflected light L2, which is the light L1 emitted from the light-emitting element 2 and reflected by the object X (light-receiving timing) is time t1.

[0018] The constant c is the speed of light (2.9979 x 10 8 [m / sec]), the distance D between the distance measuring device 1 and the object X is calculated by the following equation (1). D = (c / 2) × (t1-t0) … (1)

[0019] The distance measuring device 1 may repeat the above process multiple times. The light receiving element 3 may have multiple effective pixels 10a (see FIG. 5), and may calculate the distance D based on the light receiving timing at which the reflected light L2 is received by each effective pixel 10a.

[0020] The distance measuring device 1 measures the time t from the light emission timing t0 to the light reception timing t when the light is received by the light receiving element 3. m (Hereinafter, “Light reception time t m ) are classified into classes (bins) to generate a histogram.

[0021] 2 is a diagram showing an example histogram based on the time when the light receiving element 3 receives light, which is applicable to an embodiment of the present disclosure. In FIG. 2, the horizontal axis indicates bins, and the vertical axis indicates the frequency of each bin. The bins are divided into two groups, each representing a light receiving time t m are classified into predetermined unit time d.

[0022] Specifically, bin #0 is 0≦t m <d、ビン#1がd≦t m < 2 × d, bin #2 is 2 × d ≦ t m < 3×d, …, bin#(N-2) is (N-2)×d≦t m <(N-1)×d. The exposure time of the light receiving element 3 is set to time t ep In this case, t ep =N×d.

[0023] The distance measuring device 1 receives light for a time t m The number of times the light is acquired is counted based on the bin to determine the frequency 200 for each bin, and a histogram is generated. Here, the light receiving element 3 receives light other than the reflected light L2 that is the light emitted from the light emitting element 2 and reflected therefrom.

[0024] For example, an example of light other than the target reflected light L2 is ambient light around the distance measuring device 1. Such ambient light is light that randomly enters the light receiving element 3, and the ambient light component 201 due to the ambient light in the histogram becomes noise relative to the target reflected light L2.

[0025] On the other hand, the reflected light L2 of interest is light received at a specific distance and appears in the histogram as an active light component 202. The bin corresponding to the frequency of the peak in this active light component 202 is the bin corresponding to the distance D of the object X.

[0026] The distance measuring device 1 can calculate the distance D to the object X according to the above-mentioned formula (1) by acquiring the representative time of the bin (for example, the time at the center of the bin) as the above-mentioned time t1. In this way, by using multiple light reception results, it becomes possible to perform appropriate distance measurement against random noise.

[0027] [Configuration of distance measuring device] Next, the detailed configuration of the distance measuring device 1 according to the embodiment will be described with reference to Fig. 3 to Fig. 6. Fig. 3 is a block diagram showing an example of the configuration of the distance measuring device 1 according to the embodiment. As shown in Fig. 3, the distance measuring device 1 includes a light emitting element 2, a light receiving element 3, a control unit 4, a storage unit 5, a first lens 21, and a second lens 22.

[0028] The light emitting element 2 is, for example, a laser diode, and is driven to emit pulsed laser light. For example, a VCSEL (Vertical Cavity Surface Emitting LASER) that emits laser light as a surface light source can be used as the light emitting element 2.

[0029] The light-emitting element 2 may be configured to use an array of laser diodes arranged in a line, and scan the laser light emitted from the laser diode array in a direction perpendicular to the line. Alternatively, the light-emitting element 2 may be configured to use a laser diode as a single light source, and scan the laser light emitted from the laser diode in both horizontal and vertical directions.

[0030] The light receiving element 3 includes a pixel array section 10 (see FIG. 4) having effective pixels 10a (see FIG. 4) arranged in, for example, a two-dimensional lattice pattern. The first lens 21 guides light L1 emitted from the light emitting element 2 to the outside. The second lens 22 guides light incident from the outside to the light receiving element 3.

[0031] The control unit 4 controls the overall operation of the distance measuring device 1. For example, the control unit 4 supplies a light emission trigger to the light emitting element 2, which is a trigger for the light emitting element 2 to emit light. The light emitting element 2 emits light from its laser diode at a timing based on the light emission trigger, and stores a time t0 indicating the light emission timing. The control unit 4 also sets a pattern for distance measurement for the light receiving element 3 in response to, for example, an external instruction.

[0032] The light receiving element 3 receives time information (light receiving time t m ) is acquired within a predetermined time range, and the frequency of each bin is calculated to generate the above-mentioned histogram. The light receiving element 3 further calculates the distance D to the object X based on the generated histogram. Information indicating the calculated distance D is stored in the memory unit 5.

[0033] 4 is a block diagram showing in more detail an example of the configuration of the light receiving element 3 applicable to the embodiment. In FIG. 4, the light receiving element 3 includes a pixel array unit 10, a distance measurement processing unit 11, a pixel control unit 12, an overall control unit 13, a clock generation unit 14, a light emission timing control unit 15, and an interface (I / F) 16.

[0034] The pixel array unit 10, distance measurement processing unit 11, pixel control unit 12, overall control unit 13, clock generation unit 14, light emission timing control unit 15 and interface 16 are arranged on, for example, one semiconductor chip.

[0035] 4, overall control unit 13 controls the overall operation of light receiving element 3 in accordance with, for example, a pre-installed program. Overall control unit 13 can also execute control in response to an external control signal supplied from the outside.

[0036] The clock generation unit 14 generates one or more clock signals used in the light receiving element 3 based on an externally supplied reference clock signal. The light emission timing control unit 15 generates a light emission control signal indicating the light emission timing in accordance with an externally supplied light emission trigger signal. The light emission control signal is supplied to the light emitting element 2 and also to the distance measurement processing unit 11.

[0037] The pixel array unit 10 includes a plurality of effective pixels 10a, each having a photodiode 10a1 (see FIG. 5), arranged in a two-dimensional lattice. The operation of each effective pixel 10a is controlled by a pixel control unit 12 in accordance with instructions from an overall control unit 13.

[0038] For example, the pixel control unit 12 can control the readout of pixel signals from each effective pixel 10 a for each block including p pixels in the row direction and q pixels in the column direction, that is, (p×q) effective pixels 10 a. Furthermore, the pixel control unit 12 can read pixel signals from each effective pixel 10 a by scanning each effective pixel 10 a in the row direction and then in the column direction, using the block as a unit.

[0039] Alternatively, the pixel control unit 12 may control each of the effective pixels 10 a independently. Furthermore, the pixel control unit 12 may set a predetermined region of the pixel array unit 10 as a target region, and set the effective pixels 10 a included in the target region as the effective pixels 10 a from which pixel signals are to be read out.

[0040] The pixel signals read out from each effective pixel 10a are supplied to a distance measurement processing unit 11. The distance measurement processing unit 11 includes a conversion unit 11a, a generation unit 11b, and a signal processing unit 11c.

[0041] The pixel signals read from each effective pixel 10a and output from the pixel array unit 10 are supplied to the conversion unit 11a. Here, the pixel signals are read asynchronously from each effective pixel 10a and supplied to the conversion unit 11a. That is, the pixel signals are read from the photodiode 10a1 in accordance with the timing at which light is received by each effective pixel 10a and output.

[0042] The converter 11a converts the pixel signals supplied from the pixel array unit 10 into digital information. That is, the pixel signals supplied from the pixel array unit 10 are output in accordance with the timing at which light is received by the photodiode 10a1 included in the effective pixel 10a to which the pixel signals correspond. The converter 11a converts the supplied pixel signals into time information indicating the timing.

[0043] The generation unit 11b generates a histogram based on the time information into which the pixel signals are converted by the conversion unit 11a. Here, the generation unit 11b counts the time information based on a unit time d (see FIG. 2) set by the control unit 4 (see FIG. 3) or the like, and generates a histogram.

[0044] The signal processing unit 11c performs predetermined arithmetic processing based on the histogram data generated by the generation unit 11b, and calculates, for example, distance information. For example, the signal processing unit 11c creates a curve approximation of the histogram based on the histogram data generated by the generation unit 11b. The signal processing unit 11c detects peaks in the curve obtained by approximating the histogram, and can calculate the distance D based on the detected peaks.

[0045] When performing curve approximation of a histogram, the signal processing unit 11c can perform filtering on the curve obtained by approximating the histogram. For example, the signal processing unit 11c can suppress noise components by performing low-pass filtering on the curve obtained by approximating the histogram.

[0046] The distance information obtained by the signal processing unit 11c is supplied to the interface 16. The interface 16 outputs the distance information supplied from the signal processing unit 11c to the outside as output data. As the interface 16, for example, a MIPI (Mobile Industry Processor Interface) can be applied.

[0047] In the above configuration, the distance information calculated by the signal processing unit 11c is output to the outside via the interface 16, but this is not limited to this example. That is, the histogram data, which is the data of the histogram generated by the generation unit 11b, may be output from the interface 16 to the outside.

[0048] In this case, the information indicating the filter coefficients can be omitted from the distance measurement condition information set by the control unit 4 etc. The histogram data output from the interface 16 is supplied to, for example, an external information processing device and processed as appropriate.

[0049] Furthermore, in the above configuration, an example has been shown in which the distance measurement processing section 11 that performs distance measurement processing is provided inside the light receiving element 3, but the distance measurement processing section 11 may also be provided outside the light receiving element 3.

[0050] 5 is a diagram illustrating an example of a basic configuration of an effective pixel 10a applicable to an embodiment of the present disclosure. As shown in FIG. 5, the effective pixel 10a includes a photodiode 10a1, a transistor 10a2, and an inverter 10a3.

[0051] The photodiode 10a1 converts incident light into an electrical signal by photoelectric conversion and outputs the electrical signal. In the embodiment, the photodiode 10a1 converts incident photons (photons) into an electrical signal by photoelectric conversion and outputs a pulse corresponding to the incidence of the photons.

[0052] In this embodiment, a single-photon avalanche diode is used as the photodiode 10a1. Hereinafter, the single-photon avalanche diode will be referred to as a SPAD (Single Photon Avalanche Diode).

[0053] A SPAD has the property that when a large negative voltage that causes avalanche multiplication is applied to the cathode, the electrons generated in response to the incidence of a single photon cause avalanche multiplication, resulting in a large current flow. By utilizing this property of the SPAD, it is possible to detect the incidence of a single photon with high sensitivity.

[0054] In FIG. 5, the cathode of a photodiode 10a1, which is a SPAD, is connected to the drain of a transistor 10a2, and the anode is connected to a voltage source of a voltage (−Vbd).

[0055] The source of the transistor 10a2 is connected to the power supply voltage Vdd, and the reference voltage Vref is input to the gate, so that the transistor 10a2 functions as a current source that can output a current from the drain that corresponds to the power supply voltage Vdd and the reference voltage Vref.

[0056] With this configuration, a reverse bias is applied to the photodiode 10a1, and a photocurrent flows from the cathode to the anode of the photodiode 10a1.

[0057] A signal extracted from the connection point between the drain of transistor 10a2 and the cathode of photodiode 10a1 is input to inverter 10a3. Inverter 10a3 performs threshold determination on the input signal, for example, and inverts the signal every time the signal exceeds the threshold in either the positive or negative direction, and outputs the inverted signal as output signal Vinv.

[0058] The photodiode 10a1 is not limited to a SPAD, and an avalanche photodiode (APD) or a normal photodiode may also be used as the photodiode 10a1.

[0059] Fig. 6 is a schematic diagram showing an example of the configuration of a device applicable to the light receiving element 3 according to the embodiment. In Fig. 6, the light receiving element 3 is configured by stacking a light receiving chip 100 and a logic chip 110, each of which is made up of a semiconductor chip. For the sake of explanation, Fig. 6 shows the light receiving chip 100 and the logic chip 110 in a separated state.

[0060] In the photodetector chip 100, photodiodes 10a1 (see FIG. 5) included in each of a plurality of effective pixels 10a are arranged in a two-dimensional lattice pattern in the region of the pixel array section 10. In each effective pixel 10a, a transistor 10a2 and an inverter 10a3 are formed on a logic chip 110.

[0061] Both ends of the photodiode 10a1 are connected between the light receiving chip 100 and the logic chip 110 via a coupling part such as a CCC (Copper-Copper Connection).

[0062] The logic chip 110 has a logic array section 111 including a signal processing section that processes signals acquired by the effective pixels 10 a. The logic chip 110 further has a signal processing circuit section 112 that is adjacent to the logic array section 111 and processes signals acquired by the effective pixels 10 a, and an element control section 113 that controls the operation of the light receiving element 3.

[0063] For example, the signal processing circuit unit 112 includes the distance measurement processing unit 11 shown in Fig. 4. The element control unit 113 also includes the pixel control unit 12, overall control unit 13, clock generation unit 14, light emission timing control unit 15, and interface 16 shown in Fig. 4.

[0064] The configurations on the photosensor chip 100 and the logic chip 110 are not limited to this example. In addition to controlling the logic array unit 111, the element control unit 113 can be arranged, for example, near the effective pixels 10a for other driving or control purposes. In addition to the arrangement shown in FIG. 6, the element control unit 113 can be provided in any region of the photosensor chip 100 and the logic chip 110 so as to have any function.

[0065] [Module configuration of distance measuring device] Next, the module configuration of the distance measuring device 1 according to the embodiment will be described with reference to Figs. 7 to 11. Fig. 7 is a cross-sectional view showing an example of the configuration of the distance measuring device 1 according to the embodiment of the present disclosure, and Fig. 8 is a plan view showing an example of the configuration of the distance measuring device 1 according to the embodiment of the present disclosure. Note that Fig. 8 shows an example of the arrangement of each component on the front surface 20a of the substrate 20.

[0066] As shown in Figure 7, the distance measuring device 1 of the embodiment has a light-emitting element 2, a light-receiving element 3, a mounted component 6 (see Figure 8), a substrate 20, a first lens 21, a second lens 22, a first housing 31, and a second housing 32.

[0067] The mounted components 6 include components other than the light-emitting element 2 and the light-receiving element 3 in the distance measuring device 1. The mounted components 6 are, for example, passive elements such as resistors, capacitors, and inductors, and active elements such as transistors and diodes. Note that, although the example in Fig. 8 shows an example in which one mounted component 6 is mounted, multiple mounted components 6 may be mounted on the substrate 20.

[0068] The substrate 20 is plate-shaped, and has a front surface 20a on which the light emitting element 2, the light receiving element 3, and the mounted components 6 are mounted. The substrate 20 is, for example, a rigid substrate or a ceramic substrate.

[0069] The substrate 20 is also provided with a circuit pattern (not shown) for configuring various circuits inside the distance measuring device 1, and this circuit pattern is electrically connected to a plurality of electrodes E arranged on the front surface 20a. The electrodes E and the light emitting element 2 or the light receiving element 3 are electrically connected by a plurality of bonding wires W.

[0070] The first lens 21 is disposed on the optical axis of the light-emitting element 2 so as to be focused on the light-emitting element 2 on the substrate 20. The first lens 21 also has a given illumination range FOI (Field Of Illumination).

[0071] In the distance measuring device 1, the emitted light L1 from the light emitting element 2 can be irradiated onto the irradiation range FOI by passing the emitted light L1 through the first lens 21. In the embodiment, the first lens 21 may be composed of one lens or multiple lenses.

[0072] The second lens 22 is disposed on the optical axis of the light receiving element 3 so as to be focused on the pixel array section 10 (see FIG. 8) of the light receiving element 3 on the substrate 20. The second lens 22 also has a given field of view (FOV).

[0073] In the distance measuring device 1, the reflected light L2 from the object X (see FIG. 1) passes through the second lens 22, so that the reflected light L2 from the field of view FOV can be received by the light receiving element 3. In the embodiment, the second lens 22 may be made up of one lens or multiple lenses.

[0074] In the embodiment, the illumination range FOI of the first lens 21 is preferably set to be approximately equal to or slightly larger than the field of view range FOV of the second lens 22. This allows the emitted light L1 to be illuminated over the entire field of view range FOV, and therefore the reflected light L2 can be received from the entire field of view range FOV.

[0075] The first housing 31 is disposed on the front surface 20a of the substrate 20 so as to cover the light-emitting element 2, and supports the first lens 21 on the optical axis of the light-emitting element 2. The first housing 31 is made of, for example, a resin material having light-blocking properties or a metal material having light-blocking properties.

[0076] The second housing 32 is disposed on the front surface 20a of the substrate 20 so as to cover the light receiving element 3, and supports the second lens 22 on the optical axis of the light receiving element 3. The second housing 32 is made of, for example, a resin material having light blocking properties or a metal material having light blocking properties.

[0077] In addition, an opening 31a is formed in the first housing 31 in the area between the light-emitting element 2 and the light-receiving element 3, and an opening 32a is formed in the second housing 32 in the area between the light-emitting element 2 and the light-receiving element 3.

[0078] The distance measuring device 1 is configured so that the reference light L3, which is a part of the emitted light L1 emitted from the light emitting element 2, is incident on the pixel array section 10 of the light receiving element 3 through the openings 31a and 32a.

[0079] The distance measuring device 1 can accurately evaluate the time t0 (see FIG. 1) at which the light emitting element 2 emits light by measuring the time at which the reference light L3 is incident on the light receiving element 3. Therefore, according to the embodiment, the distance D to the object X can be accurately measured.

[0080] Furthermore, a resin material 33 having light-blocking properties may be disposed between the first housing 31 and the second housing 32. This can prevent light other than the reference light L3 from leaking into the light receiving element 3 through the opening 32a. Therefore, according to the embodiment, the quality of the reference light L3 incident on the light receiving element 3 can be maintained at a good level.

[0081] In the embodiment, as shown in FIG. 8, the bonding wire W is not arranged on the side 3s of the light receiving element 3 on the side of the light emitting element 2, and the bonding wire W that electrically connects the light receiving element 3 and the substrate 20 is arranged on a side of the light receiving element 3 other than the side 3s.

[0082] In this way, by not placing the bonding wire W on the side 3s of the light receiving element 3 on the side of the light emitting element 2, it is possible to prevent the reference light L3 irradiated from the light emitting element 2 from being diffusely reflected by the bonding wire W as it travels toward the light receiving element 3.

[0083] Therefore, according to the embodiment, the reference light L3 can be received in good condition by the light receiving element 3. Furthermore, in the embodiment, the bonding wire W is arranged on a side of the light receiving element 3 that is different from the side 3s, thereby enabling good electrical connection between the light receiving element 3 and the substrate 20.

[0084] In addition, in the embodiment, since the bonding wire W is not arranged on the side 3s of the light receiving element 3 on the side of the light emitting element 2, the light emitting element 2 and the light receiving element 3 can be brought closer to each other, and therefore the baseline length between the light emitting element 2 and the light receiving element 3 can be shortened.

[0085] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0086] In addition, in an embodiment, as shown in Figure 8, the bonding wire W is not arranged on the side 2s of the light-emitting element 2 on the side of the light-receiving element 3, and the bonding wire W that electrically connects the light-emitting element 2 and the substrate 20 is arranged on a side of the light-emitting element 2 other than the side 2s.

[0087] In this way, by not placing the bonding wire W on the side 2s of the light-emitting element 2 facing the light-receiving element 3, it is possible to prevent the reference light L3 irradiated from the light-emitting element 2 from being diffusely reflected by the bonding wire W as it travels toward the light-receiving element 3.

[0088] Therefore, according to the embodiment, the reference light L3 can be received in good condition by the light receiving element 3. Furthermore, in the embodiment, the bonding wire W is arranged on a side of the light emitting element 2 that is different from the side 2s, thereby enabling good electrical connection between the light emitting element 2 and the substrate 20.

[0089] In addition, in the embodiment, since the bonding wire W is not arranged on the side 2s of the light-emitting element 2 on the side of the light-receiving element 3, the light-emitting element 2 and the light-receiving element 3 can be brought closer to each other, and therefore the baseline length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0090] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0091] In addition, in the embodiment, as shown in FIG. 8, the mounting component 6 is not placed in the area between the light-emitting element 2 and the light-receiving element 3, and the mounting component 6 is preferably placed in an area other than the area between the light-emitting element 2 and the light-receiving element 3.

[0092] This makes it possible to prevent the reference light L3 emitted from the light-emitting element 2 from being diffused by the mounted component 6 when traveling toward the light-receiving element 3. Therefore, according to the embodiment, the reference light L3 can be received by the light-receiving element 3 in good condition.

[0093] In addition, in the embodiment, since no mounting components 6 are placed in the area between the light-emitting element 2 and the light-receiving element 3, the light-emitting element 2 and the light-receiving element 3 can be brought closer to each other, thereby shortening the baseline length between the light-emitting element 2 and the light-receiving element 3.

[0094] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0095] In the embodiment, the thinner of the first lens 21 and the second lens 22 is preferably disposed farther from the substrate 20 than the thicker lens. For example, as shown in FIG. 7 , when the thickness T1 of the first lens 21 is thinner than the thickness T2 of the second lens 22, the lower end 21a of the first lens 21 is preferably disposed farther from the substrate 20 than the lower end 22a of the second lens 22.

[0096] This allows the entire illumination range FOI of the thinner first lens 21 to be raised, and therefore, even if the base length between the light-emitting element 2 and the light-receiving element 3 is shortened, it is possible to prevent vignetting of the illumination range FOI by the second housing 32. That is, in the embodiment, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0097] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0098] On the other hand, if the thickness T2 of the second lens 22 is thinner than the thickness T1 of the first lens 21, it is preferable that the lower end 22a of the second lens 22 be positioned farther from the substrate 20 than the lower end 21a of the first lens 21.

[0099] This makes it possible to raise the field of view FOV of the thinner second lens 22 as a whole, and therefore makes it possible to prevent vignetting of the field of view FOV by the first housing 31 even when the base length between the light-emitting element 2 and the light-receiving element 3 is shortened. That is, in the embodiment, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0100] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0101] In the embodiment, the first housing 31 and the second housing 32 may be arranged to partially overlap in a plan view, as shown in Fig. 7. For example, in the embodiment, one of the first housing 31 and the second housing 32 (first housing 31 in Fig. 7) may be configured to be able to nest and accommodate a portion of the other housing (second housing 32 in Fig. 7).

[0102] This allows the first lens 21 and the second lens 22 to be closer to each other in a plan view, thereby shortening the base length between the light emitting element 2 and the light receiving element 3.

[0103] Therefore, according to the embodiment, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0104] 8, the center line 10m of the pixel array section 10 provided in the light receiving element 3 is preferably positioned closer to the light emitting element 2 than the center line 3m of the light receiving element 3. That is, in the embodiment, the pixel array section 10 in the light receiving element 3 is preferably disposed closer to the light emitting element 2.

[0105] This allows the pixel array units 10 of the light-emitting elements 2 and the light-receiving elements 3 to be closer to each other, thereby shortening the base line length between the light-emitting elements 2 and the light-receiving elements 3. Therefore, according to the embodiment, the parallax between the light-emitting elements 2 and the light-receiving elements 3 can be reduced, and the distance D to the object X can be calculated with high accuracy.

[0106] FIG. 9 is a plan view showing an example of the arrangement of pixel regions in the pixel array unit 10 in the distance measuring device 1 according to the embodiment of the present disclosure, and FIG. 10 is a cross-sectional view taken along the line AA shown in FIG.

[0107] 9, the pixel array unit 10 has an effective pixel array R1, a reference pixel array R2, and a dummy pixel array R3. The effective pixel array R1 is an area in which the above-mentioned multiple effective pixels 10a (see FIG. 6) are arranged in a two-dimensional lattice pattern.

[0108] The reference pixel array R2 is an area in which a plurality of reference pixels (not shown) are arranged side by side. These reference pixels are pixels for receiving reference light L3. In this embodiment, the pixel control unit 12 measures the time at which the reference light L3 is incident on the reference pixels. This allows for accurate evaluation of the time t0 (see FIG. 1), at which the light-emitting element 2 emits light.

[0109] In the embodiment, the pixel control unit 12 may start the operation of the SPAD included in the effective pixel array R1 using an output signal from the reference pixel, thereby preventing the SPAD of the effective pixel 10a from being erroneously operated by light other than the emitted light L1 (see FIG. 7) before the emitted light L1 is emitted.

[0110] In the embodiment, the pixel control unit 12 may use the output signal from the reference pixel to enable the SPAD included in the effective pixel array R1 to detect photons, thereby preventing the SPAD of the effective pixel 10a from erroneously detecting photons of light other than the emitted light L1 (see FIG. 7) before the emitted light L1 is emitted.

[0111] The dummy pixel array R3 is an area where multiple dummy pixels (not shown) are arranged side by side to suppress process variations and degradation of pixels near the boundary of the effective pixel array R1 or the reference pixel array R2.

[0112] Such dummy pixels include process dummy pixels, OCL (On-Chip Lens) dummy pixels, etc. The dummy pixel array R3 is arranged to surround the periphery of the effective pixel array R1 and the periphery of the reference pixel array R2.

[0113] In the embodiment, the reference pixel array R2 is preferably disposed between the effective pixel array R1 and the light-emitting element 2. This allows the reference light L3 to be incident preferentially on the reference pixels rather than on the effective pixels 10a. Therefore, according to the embodiment, it is possible to prevent the reference light L3 from leaking into the effective pixels 10a.

[0114] 9, the reference pixel array R2 may have its long side positioned on the side of the light-emitting element 2. This allows the multiple reference pixels in the reference pixel array R2 to be arranged as close as possible to the light-emitting element 2, and also makes it possible to recognize in a plan view that the multiple reference pixels in the reference pixel array R2 are arranged as close as possible to the light-emitting element 2.

[0115] In addition, in the embodiment, the reference pixels may be arranged at the end of the pixel array section 10 on the light-emitting element 2 side. That is, in the embodiment, as shown in Fig. 9, the reference pixel array R2 may be arranged at the end of the pixel array section 10 on the light-emitting element 2 side. In other words, in the embodiment, the reference pixels may be arranged closer to the light-emitting element 2 than the effective pixels 10a in the pixel array section 10.

[0116] This allows the reference light L3 to be incident preferentially on the reference pixels rather than on the effective pixels 10a. Therefore, according to the embodiment, it is possible to prevent the reference light L3 from leaking into the effective pixels 10a.

[0117] 10 and other figures, a band-pass filter 40 is disposed above the effective pixel array R1 (i.e., the plurality of effective pixels 10a) of the pixel array section 10 so as to cover the effective pixel array R1. The band-pass filter 40 has a transmission wavelength band set to the peak wavelength (e.g., 940 nm) of the light L1 emitted from the light-emitting element 2 (see FIG. 7).

[0118] This makes it possible to prevent light having a wavelength different from that of the reflected light L2 (see FIG. 7), which has a wavelength substantially equal to that of the emitted light L1, from entering the effective pixel 10a. Therefore, according to the embodiment, noise caused by light having a wavelength different from that of the reflected light L2 can be reduced, and the distance D to the object X can be measured with high accuracy.

[0119] In addition, in the embodiment, the band-pass filter 40 may be supported by ribs 41 arranged on the dummy pixel array R3 of the pixel array section 10. The ribs 41 are arranged, for example, on the surface of the dummy pixel array R3 located on the periphery of the effective pixel array R1. That is, the effective pixel array R1 is located inside the rectangularly arranged rib 41, and the reference pixel array R2 is located outside the rib 41.

[0120] In the embodiment, the ribs 41 preferably have a light-blocking property. That is, the ribs 41 according to the embodiment preferably contain a material having a light-blocking property. This allows the reference light L3 to be blocked by the light-blocking ribs 41, thereby preventing the reference light L3 from leaking into the effective pixel array R1 (i.e., the effective pixels 10a).

[0121] Therefore, according to the embodiment, noise caused by the reference light L3 leaking into the effective pixels 10a can be reduced, and the distance D to the object X can be measured with high accuracy.

[0122] In the embodiment, the ribs 41 may contain a photosensitive adhesive, which allows the ribs 41 to be formed using photolithography technology, thereby enabling the ribs 41 to be positioned with high precision on the surface of the relatively narrow dummy pixel array R3.

[0123] Furthermore, the band-pass filter 40 can be supported above the effective pixel array R1 without using a separate adhesive, etc. Therefore, according to the embodiment, the process of supporting the band-pass filter 40 can be simplified, and the manufacturing cost of the distance measuring device 1 can be reduced.

[0124] In the embodiment, the rib 41 may be disposed on the dummy pixel array R3 (i.e., on a plurality of dummy pixels). This prevents the effective pixel array R1 or the reference pixel array R2 from being covered by the rib 41, thereby preventing the light receiving area of ​​the effective pixel array R1 or the reference pixel array R2 from becoming narrower.

[0125] In the embodiment, the ribs 41 may be arranged to surround the effective pixel array R1, which further prevents the reference light L3 from leaking into the effective pixel array R1 (i.e., the effective pixels 10a).

[0126] Therefore, according to the embodiment, noise caused by the reference light L3 leaking into the effective pixels 10a can be further reduced, and the distance D to the object X can be measured with even greater accuracy.

[0127] 11 is an enlarged cross-sectional view showing a configuration of a bandpass filter 40 and its vicinity according to an embodiment of the present disclosure. As shown in FIG. 11, a light-shielding film 40a, an anti-reflection film 40b, and a bandpass filter film 40c are provided on the surface of the bandpass filter 40.

[0128] The light-shielding film 40a is disposed on the side surface of the bandpass filter 40 and has light-shielding properties. The anti-reflection film 40b is disposed on the upper surface of the bandpass filter 40 (i.e., the surface on the side where reflected light L2 (see FIG. 7) is incident) and has anti-reflection properties.

[0129] The bandpass filter film 40c is disposed on the bottom surface of the bandpass filter 40 (i.e., the surface on the pixel array section 10 side), and is a film whose transmission wavelength band is set to the peak wavelength of the light L1 emitted from the light emitting element 2 (see FIG. 7).

[0130] In the embodiment, a light-shielding film 40a is arranged on the side of the bandpass filter 40, so that the reference light L3 (see FIG. 10) is blocked by the light-shielding film 40a, thereby further suppressing leakage of the reference light L3 into the effective pixel array R1.

[0131] Therefore, according to the embodiment, noise caused by the reference light L3 leaking into the effective pixels 10a can be further reduced, and the distance D to the object X can be measured with even greater accuracy.

[0132] In the embodiment, an anti-reflection film 40b may be provided on the band-pass filter 40. This increases the amount of reflected light L2 incident on the effective pixel array R1, allowing the distance D to the object X to be measured with even greater accuracy.

[0133] 11, the band-pass filter 40 is preferably not disposed above the reference pixel array R2 (i.e., the plurality of reference pixels). This makes it possible to prevent the reference light L3 traveling toward the reference pixels from being blocked by the band-pass filter 40.

[0134] In the embodiment, as shown in FIG. 10, the second housing 32 may be disposed above the rib 41 located between the effective pixel array R1 and the reference pixel array R2 so as to be in contact with the band-pass filter 40.

[0135] This makes it possible to prevent the reference light L3 from leaking into the effective pixel array R1 by bending around the upper surface of the band-pass filter 40. Therefore, according to the embodiment, it is possible to further reduce noise caused by the reference light L3 leaking into the effective pixels 10a, and therefore it is possible to measure the distance D to the object X with even greater accuracy.

[0136] [Various variations] Next, various modifications of the distance measuring device 1 according to the embodiment will be described with reference to FIGS.

[0137] <Variation 1> 12 is a plan view showing an example of the configuration of a distance measuring device 1 according to Modification 1 of the embodiment of the present disclosure. In Modification 1 shown in FIG. 12, the arrangement of the pixel array section 10 in the light receiving element 3 is different from that in the embodiment shown in FIG.

[0138] 12, the pixel array section 10 is arranged so that its long side, not its short side, faces the light-emitting element 2. This allows the center line 10m of the pixel array section 10 provided on the light-receiving element 3 to be arranged closer to the light-emitting element 2 than the center line 3m of the light-receiving element 3.

[0139] That is, in the first modification, the light emitting element 2 and the pixel array section 10 of the light receiving element 3 can be brought closer together, and therefore the base line length between the light emitting element 2 and the light receiving element 3 can be further shortened.

[0140] Therefore, according to the first modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be further reduced, and the distance D to the object X can be obtained with even greater accuracy.

[0141] <Variation 2> 13 is a plan view showing an example of the configuration of a distance measuring device 1 according to Modification 2 of the embodiment of the present disclosure. In Modification 2 shown in Fig. 13, the arrangement of the bonding wires W connected to the light receiving element 3 is different from that of the embodiment shown in Fig. 8.

[0142] 13, in Modification 2, bonding wires W are also arranged on a side 3s of the light receiving element 3 on the side of the light emitting element 2. On the other hand, in Modification 2, the bonding wires W arranged on this side 3s are arranged at a lower density than the bonding wires W arranged on a side other than the side 3s.

[0143] In this way, by reducing the density of the bonding wires W arranged on the side 3s, it is possible to prevent the reference light L3 emitted from the light-emitting element 2 from being diffusely reflected by the bonding wires W as it travels toward the light-receiving element 3.

[0144] Therefore, according to the second modification, the light receiving element 3 can receive the reference light L3 in a good condition.

[0145] In addition, in the second modification, it is preferable that the bonding wire W is not arranged in the portion of the side 3s of the light receiving element 3 facing the light emitting element 2. In other words, it is preferable that the bonding wire W is not arranged in the region R4 located between the portion of the side 3s facing the light emitting element 2 and the light emitting element 2.

[0146] This further reduces the diffuse reflection of the reference light L3 emitted from the light-emitting element 2 by the bonding wire W as it travels toward the light-receiving element 3. Therefore, according to the second modification, the reference light L3 can be received by the light-receiving element 3 in an even better condition.

[0147] <Variation 3> 14 is a plan view showing an example of the configuration of a distance measuring device 1 according to Modification 3 of the embodiment of the present disclosure. In Modification 3 shown in FIG. 14, the arrangement of bonding wires W connected to the light receiving element 3 is different from the example in FIG.

[0148] Specifically, in variant example 3, no bonding wire W is arranged in region R5 located between the portion of side 3s facing the light-emitting element 2 and the bonding wire W connected to the light-emitting element 2 and the bonding wire W connected to the light-emitting element 2.

[0149] This makes it possible to prevent the reference light L3 emitted from the light-emitting element 2 from being diffusely reflected by the bonding wire W when traveling toward the light-receiving element 3. Therefore, according to the third modification, the reference light L3 can be received by the light-receiving element 3 in good condition.

[0150] In addition, in variant example 3, since the bonding wire W is not placed in the above-mentioned region R5, the light-emitting element 2 and the light-receiving element 3 can be brought closer to each other, and therefore the baseline length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0151] Therefore, according to the third modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0152] <Variation 4> 15 is a plan view showing an example of the configuration of a distance measuring device 1 according to Modification 4 of the embodiment of the present disclosure. In Modification 4 shown in FIG. 15, the arrangement of the bonding wires W connected to the light-emitting element 2 is different from the example in FIG.

[0153] Specifically, in the fourth modification, as shown in FIG. 15, the bonding wires W are arranged only on the side of the light emitting element 2 opposite to the side 2s on the light receiving element 3 side.

[0154] This makes it possible to prevent the reference light L3 emitted from the light-emitting element 2 from being diffusely reflected by the bonding wire W when traveling toward the light-receiving element 3. Therefore, according to the fourth modification, the reference light L3 can be received by the light-receiving element 3 in good condition.

[0155] In addition, in the fourth modification, the bonding wire W is not disposed in the region R4, and the bonding wire W is disposed only on the side of the light-emitting element 2 opposite to the side 2s on the light-receiving element 3 side, so that the light-emitting element 2 and the light-receiving element 3 can be brought closer to each other. This allows the base line length between the light-emitting element 2 and the light-receiving element 3 to be shortened.

[0156] Therefore, according to the fourth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0157] <Variation 5> 16 is a plan view showing an example of the configuration of a distance measuring device 1 according to Modification 5 of the embodiment of the present disclosure. Modification 5 shown in FIG. 16 differs from the embodiment shown in FIG. 8 in the method of connecting the light receiving element 3 and the substrate 20.

[0158] 16, the light-receiving element 3 and the substrate 20 are electrically connected by a plurality of solder balls 50 disposed between the bottom surface of the light-receiving element 3 and the front surface 20a of the substrate 20. That is, in the fifth modification, the light-receiving element 3 has a CSP (Chip Size Package) structure.

[0159] This makes it possible to prevent the reference light L3 emitted from the light-emitting element 2 from being diffusely reflected by the bonding wire W when traveling toward the light-receiving element 3. Therefore, according to the fifth modification, the reference light L3 can be received by the light-receiving element 3 in good condition.

[0160] In addition, in variant example 5, since the bonding wire W is not placed in the area between the light-emitting element 2 and the light-receiving element 3, the light-emitting element 2 and the light-receiving element 3 can be brought closer to each other, thereby shortening the baseline length between the light-emitting element 2 and the light-receiving element 3.

[0161] Therefore, according to the fifth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0162] <Variations 6 and 7> 17 is a cross-sectional view showing an example of the configuration of a distance measuring device 1 according to Modification 6 of the embodiment of the present disclosure. Modification 6 shown in Fig. 17 differs from the embodiment shown in Fig. 7 in the arrangement of the substrate 20 and the light receiving elements 3 on the substrate 20.

[0163] 17, the substrate 20 has an opening 20c penetrating between the front surface 20a and the back surface 20b. The light-emitting element 2 is mounted on the front surface 20a of the substrate 20, and the light-receiving element 3 has a flip-chip structure and is mounted on the back surface 20b of the substrate 20 so as to cover the opening 20c.

[0164] Furthermore, in the sixth modification, the pixel array section 10 (see FIG. 8) of the light receiving element 3 is disposed so as to be exposed to the front surface 20a of the substrate 20 through the opening 20c, and receives the reflected light L2 through the second lens 22 and the opening 20c. Similarly, the pixel array section 10 receives the reference light L3 through the openings 31a, 32a, and 20c.

[0165] With this configuration, in the sixth modification, the light emitting element 2 and the light receiving element 3 can be brought closer to each other, and therefore the base length between the light emitting element 2 and the light receiving element 3 can be shortened.

[0166] Therefore, according to the sixth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0167] The substrate 20 applicable to Modification 6 is not limited to a rigid substrate or a ceramic substrate. Fig. 18 is a cross-sectional view showing an example of the configuration of a distance measuring device 1 according to Modification 7 of an embodiment of the present disclosure. As shown in Fig. 18, the substrate 20 may be a glass substrate with a through hole (TGV: Through Glass Via).

[0168] This also allows the light receiving element 3 to receive the reference light L3 in good condition, as in the sixth modification. Furthermore, as in the sixth modification, the distance D to the object X can be determined with high accuracy.

[0169] Furthermore, in the sixth and seventh modifications, the light receiving element 3 is not limited to having a flip-chip structure, and the light receiving element 3 and the substrate 20 may be electrically connected by a plurality of bonding wires W.

[0170] In this case, when the reference light L3 emitted from the light emitting element 2 travels toward the light receiving element 3, it is possible to prevent the reference light L3 from being diffused by the bonding wire W.

[0171] This is because, even when the light receiving element 3 and the substrate 20 are connected by a bonding wire W, the bonding wire W is disposed on the rear surface 20b side of the substrate 20, whereas the reference light L3 does not reach the rear surface 20b side. Therefore, in this case, the light receiving element 3 can receive the reference light L3 in good condition.

[0172] <Variation 8> 19 is a cross-sectional view showing an example of the configuration of a distance measuring device 1 according to Modification 8 of the embodiment of the present disclosure. In Modification 8 shown in FIG. 19, the mounting position of the light-emitting element 2 differs from the embodiment shown in FIG.

[0173] Specifically, in variant example 8, when the thickness T1 of the first lens 21 is thinner than the thickness T2 of the second lens 22, the light-emitting element 2, which is the element facing the first lens 21, which is the thinner lens, is mounted on the front surface 20a of the substrate 20 via a spacer 60.

[0174] That is, in the eighth modification, the light emitting element 2 facing the first lens 21, which is the thinner lens, is disposed at a higher position than the light receiving element 3 facing the second lens 22, which is the thicker lens.

[0175] This allows the entire illumination range FOI of the thinner first lens 21 to be raised, and therefore, even if the base length between the light-emitting element 2 and the light-receiving element 3 is shortened, it is possible to prevent vignetting of the illumination range FOI by the second housing 32. That is, in Modification 8, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0176] Therefore, according to the eighth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0177] On the other hand, if the thickness T2 of the second lens 22 is thinner than the thickness T1 of the first lens 21, the light receiving element 3, which is the element facing the second lens 22, which is the thinner lens, may be mounted on the front surface 20a of the substrate 20 via a spacer 60.

[0178] That is, in this case, the light receiving element 3 facing the second lens 22, which is the thinner lens, should be disposed at a higher position than the light emitting element 2 facing the first lens 21, which is the thicker lens.

[0179] This makes it possible to raise the entire field of view FOV of the thinner second lens 22, thereby making it possible to prevent vignetting of the field of view FOV by the first housing 31 even when the base length between the light-emitting element 2 and the light-receiving element 3 is shortened. That is, in Modification 8, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0180] Therefore, according to the eighth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0181] In addition, in Modification 8, the spacer 60 is preferably made of a material with high thermal conductivity (for example, a metal material), which allows efficient dissipation of heat generated when the light emitting element 2 (or the light receiving element 3) is driven.

[0182] <Variation 9> 20 is a cross-sectional view showing an example of the configuration of a distance measuring device 1 according to Modification 9 of the embodiment of the present disclosure. In Modification 9 shown in FIG. 20, the configuration of the substrate 20 is different from Modification 8 shown in FIG.

[0183] Specifically, in Modification 9, substrate 20 is a rigid-flexible substrate having rigid substrates 20A and 20B and flexible substrate 20C. In Modification 9, when thickness T1 of first lens 21 is thinner than thickness T2 of second lens 22, rigid substrate 20B is arranged overlapping rigid substrate 20A on the optical axis of first lens 21, which is the thinner lens.

[0184] That is, in variant example 9, the light-emitting element 2 facing the first lens 21, which is the thinner lens, is raised by the rigid substrate 20B, and is therefore positioned higher than the light-receiving element 3 facing the second lens 22, which is the thicker lens.

[0185] This allows the entire illumination range FOI of the thinner first lens 21 to be raised, and therefore, even if the base length between the light-emitting element 2 and the light-receiving element 3 is shortened, it is possible to prevent vignetting of the illumination range FOI by the second housing 32. That is, in the 9th modification, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0186] Therefore, according to the ninth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0187] On the other hand, if the thickness T2 of the second lens 22 is thinner than the thickness T1 of the first lens 21, it is preferable that the rigid substrate 20B is arranged overlapping the rigid substrate 20A on the optical axis of the second lens 22, which is the thinner lens.

[0188] In other words, in this case, the light receiving element 3 facing the second lens 22, which is the thinner lens, can be raised by the rigid substrate 20B, and therefore positioned at a higher position than the light emitting element 2 facing the first lens 21, which is the thicker lens.

[0189] This makes it possible to raise the field of view FOV of the thinner second lens 22 as a whole, and therefore makes it possible to prevent vignetting of the field of view FOV by the first housing 31 even when the base length between the light-emitting element 2 and the light-receiving element 3 is shortened. That is, in the 9th modification, the base length between the light-emitting element 2 and the light-receiving element 3 can be shortened.

[0190] Therefore, according to the ninth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be reduced, and the distance D to the object X can be obtained with high accuracy.

[0191] <Modification 10> 21 is a cross-sectional view showing an example of the configuration of a distance measuring device 1 according to Modification 10 of the embodiment of the present disclosure. Modification 10 shown in Fig. 21 differs from Modification 9 shown in Fig. 20 in the configuration of the housing that holds the first lens 21 and the second lens 22.

[0192] Specifically, in Modification 10, the first lens 21 and the second lens 22 are supported by the same housing 30. By holding both lenses in one housing 30 in this way, in Modification 10, even if the base length between the light-emitting element 2 and the light-receiving element 3 is shortened, it is possible to prevent vignetting of the illumination range FOI and the field of view FOV by the housing 30.

[0193] This is because the housing 30, the first lens 21 and the second lens 22 can be further optimized and designed so that vignetting does not occur in the illumination range FOI and the field of view range FOV.

[0194] Furthermore, in Modification 10, similarly to Modification 9 and the like, when the thickness T1 of the first lens 21 is thinner than the thickness T2 of the second lens 22, it is preferable that the light-emitting element 2 is disposed at a higher position than the light-receiving element 3.

[0195] For example, as shown in FIG. 21, the rigid substrate 20B on which the light-emitting element 2 is mounted is positioned higher than the rigid substrate 20A on which the light-receiving element 3 is mounted, so that the light-emitting element 2 is positioned higher than the light-receiving element 3.

[0196] This allows the entire illumination range FOI of the thinner first lens 21 to be raised, and therefore, even if the base line length between the light-emitting element 2 and the light-receiving element 3 is shortened, it is possible to prevent vignetting of the illumination range FOI by the housing 30. That is, in Modification 10, the base line length between the light-emitting element 2 and the light-receiving element 3 can be further shortened.

[0197] Therefore, according to the tenth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be further reduced, and the distance D to the object X can be obtained with even greater accuracy.

[0198] On the other hand, when the thickness T2 of the second lens 22 is thinner than the thickness T1 of the first lens 21, the rigid substrate 20A carrying the light receiving element 3 is positioned higher than the rigid substrate 20B carrying the light emitting element 2, so that the light receiving element 3 is positioned higher than the light emitting element 2.

[0199] This makes it possible to raise the field of view FOV of the thinner second lens 22 as a whole, and therefore makes it possible to prevent vignetting of the field of view FOV by the first housing 31 even when the base length between the light-emitting element 2 and the light-receiving element 3 is shortened. That is, in Modification 10, the base length between the light-emitting element 2 and the light-receiving element 3 can be further shortened.

[0200] Therefore, according to the tenth modification, the parallax between the light-emitting element 2 and the light-receiving element 3 can be further reduced, and the distance D to the object X can be obtained with even greater accuracy.

[0201] [effect] The distance measuring device 1 according to the embodiment includes a light-emitting element 2, a light-receiving element 3, and a substrate 20. The light-emitting element 2 emits light onto an object X. The light-receiving element 3 receives light from the light-emitting element 2 that is reflected by the object X. The substrate 20 mounts the light-emitting element 2 and the light-receiving element 3. Furthermore, a bonding wire W that electrically connects the light-receiving element 3 and the substrate 20 is not arranged on a side 3s of the light-receiving element 3 on the light-emitting element 2 side.

[0202] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0203] The distance measuring device 1 according to the embodiment further includes a plurality of bonding wires W that electrically connect the light receiving element 3 and the substrate 20. The bonding wires W are arranged on a side of the light receiving element 3 that is different from the side 3s on the light emitting element 2 side.

[0204] This allows for good electrical connection between the light receiving element 3 and the substrate 20.

[0205] In the distance measuring device 1 according to the embodiment, the light receiving element 3 has a CSP (Chip Size Package) structure.

[0206] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0207] In addition, in the distance measuring device 1 of the embodiment, the substrate 20 has an opening 20c, the light-emitting element 2 is mounted on the front surface 20a of the substrate 20, and the light-receiving element 3 is mounted on the back surface 20b of the substrate 20 so as to cover the opening 20c.

[0208] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0209] The distance measuring device 1 according to the embodiment includes a light-emitting element 2, a light-receiving element 3, a substrate 20, and a plurality of bonding wires W. The light-emitting element 2 emits light onto an object X. The light-receiving element 3 receives light from the light-emitting element 2 that is reflected by the object X. The substrate 20 mounts the light-emitting element 2 and the light-receiving element 3. The plurality of bonding wires W electrically connect the light-receiving element 3 to the substrate 20. The bonding wires W arranged on a side 3s of the light-receiving element 3 that is closer to the light-emitting element 2 are arranged at a lower density than the bonding wires W arranged on a side other than the side 3s that is closer to the light-emitting element 2.

[0210] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0211] In the distance measuring device 1 according to the embodiment, the bonding wire W is not arranged on the side 3s of the light receiving element 3 on the light emitting element 2 side, at a portion facing the light emitting element 2.

[0212] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0213] Furthermore, in the distance measuring device 1 according to the embodiment, the bonding wire W that electrically connects the light emitting element 2 and the substrate 20 is not arranged on the side 2s of the light emitting element 2 on the light receiving element 3 side.

[0214] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0215] Furthermore, in the distance measuring device 1 according to the embodiment, no mounted components 6 are arranged in the area between the light emitting element 2 and the light receiving element 3.

[0216] This allows the light receiving element 3 to receive the reference light L3 in good condition.

[0217] Although the embodiments of the present disclosure have been described above, the technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present disclosure. Furthermore, components of different embodiments and modifications may be combined as appropriate.

[0218] For example, in the above embodiment, the distance measuring device 1 to which the direct ToF method is applied is shown, but the technology of the present disclosure may also be applied to a distance measuring device 1 to which the so-called indirect ToF method is applied.

[0219] Furthermore, the effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0220] The present technology can also be configured as follows. (1) a light emitting element that irradiates light onto an object; a light receiving element that receives light from the light emitting element that is reflected from the object; a substrate on which the light emitting element and the light receiving element are mounted; Equipped with The bonding wires electrically connecting the light receiving element and the substrate are not arranged on the side of the light receiving element on the light emitting element side. Ranging device. (2) a plurality of bonding wires electrically connecting the light receiving element and the substrate; The bonding wire is disposed on a side of the light receiving element that is different from the side on the light emitting element side. The distance measuring device according to (1) above. (3) The light receiving element has a CSP (Chip Size Package) structure. The distance measuring device according to (1) above. (4) the substrate has an opening; the light-emitting element is mounted on the front surface of the substrate; The light receiving element is mounted on the back surface of the substrate so as to cover the opening. The distance measuring device according to (1) above. (5) a light emitting element that irradiates light onto an object; a light receiving element that receives light from the light emitting element that is reflected from the object; a substrate on which the light emitting element and the light receiving element are mounted; a plurality of bonding wires electrically connecting the light receiving element and the substrate; Equipped with The bonding wires arranged on the side of the light receiving element on the light emitting element side are arranged at a lower density than the bonding wires arranged on the side other than the side on the light emitting element side. Ranging device. (6) The bonding wire is not disposed on the side of the light receiving element facing the light emitting element. 6. The distance measuring device according to claim 5. (7) The bonding wires electrically connecting the light emitting element and the substrate are not disposed on the side of the light receiving element of the light emitting element. The distance measuring device according to any one of (1) to (6) above. (8) No mounting components are disposed in the area between the light emitting element and the light receiving element. The distance measuring device according to any one of (1) to (7) above. [Explanation of symbols]

[0221] 1 Ranging device 2 Light-emitting element 3 Photodetector 6 Mounting parts 10 Pixel array section 10a Effective pixels 12 Pixel control unit 20 Substrate 20a Front 20b back side 20c opening 21 First lens 22 Second lens 31 First cabinet 32 Second cabinet 40 Bandpass Filter 40a Light-shielding film 41 Ribs 60 spacer L1 emission light L2 reflected light L3 reference beam R1 effective pixel array R2 Reference pixel array R3 Dummy Pixel Array T1, T2 thickness W Bonding Wire

Claims

1. a light emitting element that irradiates light onto an object; a light receiving element that receives light from the light emitting element that is reflected from the object; a substrate on which the light emitting element and the light receiving element are mounted; Equipped with a bonding wire electrically connecting the light receiving element and the substrate is not disposed on a side of the light receiving element on the side of the light emitting element; the substrate has an opening; the light-emitting element is mounted on the front surface of the substrate; The light receiving element is mounted on the back surface of the substrate so as to cover the opening. Ranging device.

2. a light emitting element that irradiates light onto an object; a light receiving element that receives light from the light emitting element that is reflected from the object; a substrate on which the light emitting element and the light receiving element are mounted; a plurality of bonding wires electrically connecting the light receiving element and the substrate; Equipped with The bonding wires arranged on the side of the light receiving element on the light emitting element side are arranged at a lower density than the bonding wires arranged on the side other than the side on the light emitting element side. Ranging device.

3. The bonding wire is not disposed on the side of the light receiving element facing the light emitting element.

3. The distance measuring device according to claim 2.

4. The bonding wires electrically connecting the light emitting element and the substrate are not disposed on the side of the light receiving element of the light emitting element.

4. A distance measuring device according to claim 1.

5. No mounting components are disposed in the area between the light emitting element and the light receiving element.

5. A distance measuring device according to claim 1.

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