Transport system and transport method

Abstract

To provide a conveyance method capable of achieving effective conveyance of an article.SOLUTION: A conveyance method includes the steps of: acquiring type identification information for identifying a type of an article which is a conveyance object; acquiring tool identification information for identifying a kind of a tool installed at each of a plurality of devices; determining the kind of the tool associated with the type identified by the type identification information; selecting the device in which the determined type of the tool is installed as an object device, out of the plurality of devices; and outputting a conveyance instruction with respect to a conveyance robot for conveying the article which is the conveyance object to the object device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a transport system and a transport method. [Background technology]

[0002] In recent years, there has been an increasing demand for small-lot, high-mix production. At sites where small-lot, high-mix production is required, manual tasks such as setup changes are frequent, making it difficult to reduce the number of workers required. Japanese Patent Application Laid-Open Publication No. 2012-134260 (Patent Document 1) discloses a system that outputs work instruction information for a lot of offline equipment based on equipment status information obtained by reading signal tower signals from offline equipment, in order to improve the efficiency of manual work. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-134260 Summary of the Invention [Problem to be solved by the invention]

[0004] Some of the equipment installed in high-mix, low-volume production sites requires the use of tools that correspond to the type of product. Workers must check the equipment installed on the equipment and properly transport the item to the equipment that corresponds to the type of item. As a result, the time required for transportation increases.

[0005] The present disclosure has been made in view of the above problems, and its purpose is to provide a conveying system and a conveying method that can realize efficient conveyance of articles. [Means for solving the problem]

[0006] According to an example of the present disclosure, a transport system includes a plurality of devices that perform a predetermined process on an item, a transport robot, and an instruction unit. Each of the plurality of devices is installed with an instrument of a type arbitrarily selected from a plurality of types of instruments. The predetermined process is performed in each of the plurality of devices using the installed instrument. The instruction unit includes a first acquisition unit, a second acquisition unit, an identification unit, a selection unit, and a first output unit. The first acquisition unit acquires first identification information that identifies the type of item to be transported. The second acquisition unit acquires second identification information that identifies the type of instrument installed in each of the plurality of devices. The identification unit identifies the type of instrument associated with the item identified by the first identification information using association information that associates the type of item with the type of instrument used to perform the predetermined process on the item. The selection unit uses the second identification information to select, from the plurality of devices, an apparatus in which the identified type of instrument is installed as a target device. The first output unit outputs a transport instruction to the transport robot to transport the item to the target device.

[0007] According to this disclosure, an item to be transported is transported by a transport robot to a target device equipped with a tool of a type corresponding to the type of the item. This reduces the labor required for transport by a worker. As a result, efficient transport of items can be achieved.

[0008] In the above disclosure, the transport robot includes an autonomous mobile robot, a first mechanism mounted on the autonomous mobile robot for transferring an article, and a control unit for controlling the autonomous mobile robot and the first mechanism. The control unit executes the following processes (a) to (d) in response to a transport instruction. Process (a): The autonomous mobile robot is moved to a first target position and posture according to the collection location of the item to be transported. Process (b): After the autonomous mobile robot reaches the first target position and posture, the first mechanism is caused to execute a first retrieval operation for retrieving the item to be transported. Process (c): After the first retrieval operation is completed, the autonomous mobile robot is moved to a second target position and posture according to the target device. Process (d): After the autonomous mobile robot reaches the second target position and posture, the first mechanism is caused to execute a first delivery operation to deliver the item to be transported to the target device.

[0009] According to this disclosure, there is no need to install belt conveyors, rails, etc. to transport items to each device, and the start-up time of the transport system can be reduced.

[0010] In the above disclosure, the transport system further includes a storage facility capable of storing a plurality of items. The storage facility has a second mechanism for retrieving a designated item. The first target position and posture is determined according to the location of the item retrieved from the storage facility. The instruction unit further includes a second output unit for outputting an instruction to retrieve the item to be transported to the storage facility.

[0011] According to this disclosure, the transport robot can retrieve the transport target item that has been removed from the storage facility and transport it to the target device, thereby reducing the number of workers required to transport the items from the storage facility to the target device.

[0012] In the above disclosure, the conveyance system further includes a shelf on which a plurality of items can be placed. The shelf has a plurality of placement sections and a first management section that manages management information that associates each of the plurality of placement sections with the type of the item placed thereon. The first target position and posture is determined according to a target placement section among the plurality of placement sections on which an item of a type identified by first identification information is placed. The target placement section is identified from the plurality of placement sections based on the management information.

[0013] According to this disclosure, the transport robot can retrieve an item to be transported that is placed on a shelf and transport it to the target device, thereby reducing the number of workers required to transport the item from the shelf to the target device.

[0014] In the above disclosure, the transport robot further includes a storage unit capable of storing a plurality of items. The storage unit has a second management unit that manages the type of each stored item and a second mechanism that retrieves a designated item. The shelf further includes a detection unit that detects whether each of the plurality of placement sections is in a first state in which an item is placed thereon or a second state in which no item is placed thereon. After the second mechanism has completed retrieving the designated item, the first management unit updates the management information so that the type of the designated item corresponds to the placement section among the plurality of placement sections that first changed from the second state to the first state.

[0015] According to this disclosure, the first management unit can accurately manage the types of items transferred from the storage to the shelf, and as a result, the transport robot can transport the target item from the shelf to the target device.

[0016] In the above disclosure, the transport system further includes a third mechanism that moves the article retrieved from the storage to one of the plurality of receivers that is in the second state.

[0017] According to this disclosure, there is no need to employ workers to move items retrieved from the storage facility to the shelves.

[0018] In the above disclosure, after the autonomous mobile robot reaches the second target position and posture and before the first mechanism executes the first distribution operation, the control unit causes the first mechanism to execute a second collection operation to collect an item that has been placed on the target device and that has undergone predetermined processing. After the first distribution operation is completed, the control unit moves the autonomous mobile robot to a third target position and posture corresponding to a distribution location for the item that has undergone predetermined processing. After the autonomous mobile robot reaches the third target position and posture, the control unit causes the first mechanism to execute a second distribution operation to distribute the item that has undergone predetermined processing to the distribution location.

[0019] According to this disclosure, the collection of articles that have undergone a predetermined process from a device and the distribution of articles to the device are performed at the same time, thereby enabling the articles to be transported efficiently.

[0020] In the above disclosure, the conveyance system further includes a server that outputs to the instruction unit a command to perform a predetermined process on the items to be conveyed in accordance with the production plan. The server modifies the production plan based on the second identification information to reduce the frequency of tool replacement in the multiple devices. According to this disclosure, the frequency of tool replacement work by workers in the devices of the devices is reduced.

[0021] In the above disclosure, each of the plurality of devices is movable, and the second target position and orientation is determined according to the position and orientation of the target device.

[0022] According to this disclosure, the second target position and posture are determined according to the positions and postures of the plurality of devices after they have been moved, so that the transport robot can transport the object to the target device.

[0023] In the above disclosure, each of the plurality of devices has a mark provided at a predetermined position. The transport robot further includes a camera. The control unit calculates the position of the mark based on an image captured by the camera after the autonomous mobile robot reaches the second target position and posture, and corrects the first distribution operation by the difference between the calculated position of the mark and a reference position.

[0024] According to this disclosure, even if the position of the first mechanism relative to the target device is shifted due to the influence of the stopping accuracy of the autonomous mobile robot and the target device, the first mechanism can deliver the item to the target device.

[0025] In the above disclosure, each of the plurality of devices has a feature provided at a predetermined position. The transport robot further includes a sensor that detects the position of the feature. The control unit adjusts the position and posture of the autonomous mobile robot by the difference between the position detected by the sensor when the autonomous mobile robot reaches the second target position and the reference position.

[0026] According to this disclosure, even if the position of the first mechanism relative to the target device is shifted due to the influence of the stopping accuracy of the autonomous mobile robot and the target device, the first mechanism can deliver the item to the target device.

[0027] For example, the articles may be parts that constitute a product, the tool may be a tray for storing the parts, and the product may be assembled in the device using the parts stored in the tray.

[0028] Alternatively, the tool is a jig for fixing an article, and the apparatus evaluates the performance of the article fixed by the jig.

[0029] Alternatively, the article is a seedling. The tool is a planting claw for planting the seedling. The device plants the seedling using the planting claw.

[0030] According to an example of the present disclosure, a transport method in a transport system includes first to fifth steps. The transport system includes a plurality of devices that perform a predetermined process on an item and a transport robot. Each of the plurality of devices is installed with a type of tool arbitrarily selected from a plurality of types of tools. In each of the plurality of devices, a predetermined process is performed using the installed tool. The first step is a step of acquiring first identification information that identifies the type of item to be transported. The second step is a step of acquiring second identification information that identifies the type of tool installed in each of the plurality of devices. The third step is a step of identifying the type of tool associated with the item identified by the first identification information using association information that associates the type of item with the type of tool for performing the predetermined process on the item. The fourth step is a step of selecting, from the plurality of devices, a device that has the identified type of tool installed as a target device using the second identification information. The fifth step is a step of outputting a transport instruction to the transport robot to transport the item to be transported to the target device. This disclosure also enables efficient transport of items. [Effects of the Invention]

[0031] According to the present disclosure, efficient transport of items can be achieved. [Brief explanation of the drawings]

[0032] [Figure 1] 1A and 1B are diagrams illustrating application examples of a transport system according to an embodiment. [Figure 2] FIG. 1 is a diagram showing a transport system according to a first specific example of an embodiment. [Figure 3] 1 is a flowchart showing a general flow of inspection of a semiconductor wafer. [Figure 4] 3 is a schematic diagram illustrating an example of a hardware configuration of the instruction server illustrated in FIGS. 1 and 2.

[0023] FIG. [Figure 5] FIG. 3 is a schematic diagram showing an example of a hardware configuration of the transport robot shown in FIGS. 1 and 2. [Figure 6] 3 is a schematic diagram showing an example of a functional configuration of an instruction server and a transport robot shown in FIG. 2. FIG. [Figure 7] FIG. 10 is a diagram illustrating an example of a storage database. [Figure 8] FIG. 10 is a diagram illustrating an example of association information. [Figure 9] 10 is a flowchart showing the flow of processing by an instruction server. [Figure 10] 10 is a flowchart showing the flow of processing by the inspection device. [Figure 11] 10 is a flowchart showing the flow of processing in a repository. [Figure 12] 10 is a flowchart showing the flow of processing by a transport robot. [Figure 13] FIG. 10 is a diagram showing the periphery of a storage cabinet in Modification 1. [Figure 14] 10 is a schematic diagram showing an example of the functional configuration of an instruction server and a temporary storage shelf included in the transport system according to the first modification. FIG. [Figure 15] FIG. 10 is a diagram illustrating an example of a placement database. [Figure 16] FIG. 10 is a diagram showing the periphery of a storage cabinet in Modification 2. [Figure 17] FIG. 10 is a schematic diagram showing an example of the functional configuration of an instruction server, a temporary storage shelf, and a transfer robot included in a transport system according to a second modification. [Figure 18] FIG. 11 is a schematic diagram showing a hardware configuration of a transport robot according to a third modification. [Figure 19] FIG. 11 is a schematic diagram showing the functional configuration of an instruction server and a transport robot of a transport system according to a third modification. [Figure 20] FIG. 10 is a schematic diagram showing a transport system according to a fourth modification. [Figure 21] FIG. 11 is a schematic diagram showing the configuration of a transport system according to a fifth modified example. [Figure 22] FIG. 13 is a schematic diagram showing an example of the hardware configuration of an autonomous mobile robot according to Modification 5. [Figure 23] FIG. 13 is a schematic diagram showing the functional configuration of an instruction server and an inspection device of a transport system according to a fifth modification. [Figure 24] FIG. 10 is a diagram showing a transport system according to a second specific example of the embodiment. [Figure 25] FIG. 25 is a schematic diagram illustrating an example of a functional configuration of the transport system illustrated in FIG. 24. [Figure 26] FIG. 10 is a diagram showing a transport system according to a third specific example of the embodiment. [Figure 27] FIG. 27 is a schematic diagram illustrating an example of a functional configuration of the transport system illustrated in FIG. 26. [Figure 28] FIG. 10 is a diagram showing a transport system according to a fourth specific example of the embodiment. [Figure 29] FIG. 29 is a schematic diagram illustrating an example of a functional configuration of the transport system illustrated in FIG. 28. DETAILED DESCRIPTION OF THE INVENTION

[0033] The present invention will be described in detail with reference to the accompanying drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated. The following modifications may be combined as appropriate.

[0034] §1 Application Examples 1 is a diagram illustrating an application example of a transport system according to an embodiment. As shown in FIG. 1, the transport system 1 includes an instruction server 100, one or more transport robots 200, a plurality of devices 300, a storage 600, and a terminal 800.

[0035] The storage facility 600 is capable of storing a plurality of items 5. The storage facility 600 has a plurality of storage spaces 65. An item 5 is stored in each of the plurality of storage spaces 65. The storage facility 600 has a platform 64 on which an item 5 to be stored or an item 5 to be removed is placed.

[0036] In the apparatus 300, a predetermined process is performed on the item 5. The predetermined process may include various processes such as processing, inspection, assembly, evaluation, calibration, and planting.

[0037] The device 300 is installed with a type of tool 350 arbitrarily selected from a plurality of types of tools 350. The tool 350 is installed in the device 300 by the worker M. In the device 300, a predetermined process is performed on the item 5 using the installed tool 350.

[0038] The transport robot 200 transports an item 5. The transport robot 200 includes an autonomous mobile robot 210 and a mechanism that is mounted on the autonomous mobile robot 210 and transfers the item 5. The transport robot shown in FIG. 1 includes a manipulator 220 configured by a vertical articulated robot as the mechanism. Note that the mechanism is not limited to the manipulator 220 configured by a vertical articulated robot, but may include a horizontal articulated robot, a transport belt, a parallel link mechanism, a lifting mechanism, a mechanism powered by gravity, and the like.

[0039] The instruction server 100 executes processing related to the transport of the item 5 to the device 300. Specifically, the instruction server 100 causes the item 5 to be transported to be retrieved from the storage 600 in response to an external command. Thereafter, the instruction server 100 transmits a transport instruction to the transport robot 200 to transport the item 5 placed on the platform 64 to the device 300. As a result, the transport robot 200 transports the item 5 placed on the platform 64 to the device 300 in response to the transport instruction.

[0040] Furthermore, the instruction server 100 may instruct the terminal 800 carried by the worker M to replace the tool 350 as necessary. As a result, the worker M replaces the tool 350 installed in the apparatus 300 in accordance with the instruction. The terminal 800 is, for example, a smartphone or a tablet.

[0041] The type of tool 350 used varies depending on the type of item 5. Therefore, the item 5 to be transported needs to be transported to the device 300 equipped with the tool 350 appropriate for the type of item 5. Therefore, the instruction server 100 executes the processes of steps (1) to (5).

[0042] First, the instruction server 100 acquires product type identification information that identifies the product type of the product 5 to be transported (step (1)).

[0043] Next, the instruction server 100 acquires appliance identification information that identifies the type of appliance 350 installed in each of the plurality of devices 300 (step (2)).

[0044] Next, the instruction server 100 uses association information that associates the type of item with the type of tool for performing a predetermined process on the item of that type to identify the type of tool 350 associated with the item identified by the type identification information (step (3)). That is, the instruction server 100 identifies the tool 350 corresponding to the item 5 to be transported.

[0045] Next, the instruction server 100 uses the appliance identification information to select, as a target device, from among the multiple devices 300, a device 300 in which the identified type of appliance 350 is installed (step (4)).

[0046] The instruction server 100 outputs an instruction (transport instruction) to the transport robot 200 to transport the item 5 to be transported to the target device (step (5)).

[0047] According to this embodiment, the transport robot 200 transports the item 5 to be transported to the device 300 in which the type of tool 350 corresponding to the type of item 5 is installed. This reduces the labor required for transport by a worker as in the past. As a result, efficient transport of the item 5 can be achieved.

[0048] §2 Example 1 <Outline of Specific Example 1> FIG. 2 is a diagram illustrating a conveyance system according to a first specific example of an embodiment. As shown in FIG. 2, the conveyance system 1A according to the first specific example conveys a semiconductor wafer set 5A as an object 5 to be conveyed. The semiconductor wafer set 5A includes a plurality of semiconductor wafers 6a of the same type and a cassette 6b for holding the plurality of semiconductor wafers. The semiconductor wafer set 5A may include dummy wafers as the semiconductor wafers 6a for checking whether the equipment 300 is operating normally. The conveyance system 1A includes a plurality of inspection equipment 300A as the plurality of equipment 300. A probe card 350A is installed in the inspection equipment 300A as the tool 350. The conveyance system 1A further includes an MES (Manufacturing Execution System) server 700 communicably connected to the instruction server 100.

[0049] The inspection device 300A, also called a prober, uses a probe card 350A to inspect the electrical characteristics of the electrical circuits in each semiconductor wafer 6a in the semiconductor wafer set 5A. A probe card 350A of any type selected from a plurality of types of probe cards 350A can be attached and detached to the inspection device 300A. The probe card 350A is attached to a holding member of the inspection device 300A by an operator M.

[0050] The MES server 700 manages the manufacturing of semiconductor wafers. In the first specific example, the MES server 700 outputs an inspection command for the semiconductor wafer set 5A to the instruction server 100 in accordance with a production plan created in advance.

[0051] Instruction server 100 executes processing related to the transport of semiconductor wafer set 5A to inspection device 300A.

[0052] Specifically, instruction server 100 causes semiconductor wafer set 5A to be transported to be removed from storage 600 in response to an inspection command from MES server 700. Thereafter, instruction server 100 transmits a transport command to transport robot 200 to transport semiconductor wafer set 5A placed on stage 64 to inspection device 300A. In response to the transport command, transport robot 200 transports semiconductor wafer set 5A placed on stage 64 to inspection device 300A. Inspection device 300A inspects the transported semiconductor wafer set 5A using a probe card 350A attached thereto.

[0053] The number and arrangement of terminal electrodes on the semiconductor wafer 6a differ depending on the type of semiconductor wafer set 5A. Therefore, a dedicated probe card 350A is required for each type of semiconductor wafer set 5A. In other words, the semiconductor wafer set 5A to be transported needs to be transported to the inspection device 300A equipped with a probe card 350A appropriate for the type. Therefore, the instruction server 100 executes the processes of steps (1A) to (5A).

[0054] First, instruction server 100 acquires product type identification information that identifies the product type of semiconductor wafer set 5A to be transported (step (1A)).

[0055] Next, the instruction server 100 acquires the instrument identification information for identifying the type of the probe card 350A attached to each of the plurality of testing instruments 300A (step (2A)).

[0056] Next, the instruction server 100 uses association information that associates the type of semiconductor wafer set 5A with the type of probe card 350A for inspecting the semiconductor wafer set 5A of that type to identify the type of probe card 350A associated with the type identified by the type identification information (step (3A)). That is, the instruction server 100 identifies the probe card 350A corresponding to the semiconductor wafer set 5A to be transported.

[0057] Next, the instruction server 100 uses the instrument identification information to select, as a target inspection device, an inspection device 300A to which the specified type of probe card 350A is attached from among the plurality of inspection devices 300A (step (4A)).

[0058] The instruction server 100 outputs an instruction (transport instruction) to the transport robot 200 to transport the semiconductor wafer set 5A to be transported to the target inspection device (step (5A)).

[0059] According to the specific example 1, the transport robot 200 transports the semiconductor wafer set 5A to the inspection device 300A equipped with a probe card 350A of a type corresponding to the type of the semiconductor wafer set 5A. This reduces the labor required for transport by a worker in the past. As a result, efficient transport of the semiconductor wafer set 5A can be achieved.

[0060] <Semiconductor wafer inspection flow> Figure 3 is a flowchart showing the flow of a typical semiconductor wafer inspection. First, a probe card is transported to an inspection device (step S1). Then, the probe card is replaced in the inspection device (step S2). Replacing a probe card usually takes several minutes.

[0061] Next, the semiconductor wafer set is transported from the storage to the inspection device (step S3), and then the semiconductor wafer set is set in the inspection device (step S4).

[0062] Next, the electrical characteristics of the first semiconductor wafer in the set are inspected in the inspection device (step S5). Usually, it takes several tens of minutes to perform step S5.

[0063] After the inspection of the electrical properties of the first semiconductor wafer is completed, the appearance of the first semiconductor wafer is checked (step S6). The appearance of the semiconductor wafer is checked visually or using a microscope.

[0064] If there is no problem with the appearance of the first semiconductor wafer, the electrical characteristics of the second and subsequent semiconductor wafers are inspected (step S7). Usually, it takes several hours to several dozen hours to perform step S7.

[0065] After the inspection of the electrical characteristics of the second and subsequent semiconductor wafers is completed, the appearance of the second and subsequent semiconductor wafers is checked (step S8).

[0066] Thereafter, the semiconductor wafer set is transported to a storage facility and stored therein (step S9). The semiconductor wafer set may be stored in the original storage facility or in a different storage facility.

[0067] In the past, in high-mix, low-volume production sites, steps S1 to S4, S6, S8, and S9 were mainly performed by workers. This placed a heavy burden on workers, resulting in reduced production efficiency. In specific example 1, the instruction server 100 and the transport robot 200 execute steps S3 and S4. This reduces the workload of workers. Note that the instruction server 100 and the transport robot 200 may execute step S9 in addition to steps S3 and S4.

[0068] <Hardware configuration of the instruction server> Fig. 4 is a schematic diagram showing an example of the hardware configuration of the instruction server shown in Fig. 1 and Fig. 2. The instruction server 100 typically has a structure that conforms to a general-purpose computer architecture.

[0069] As shown in FIG. 4, the instruction server 100 includes a processor 101, a memory 102, a storage 103, a communication interface 104, and a wireless communication interface 105.

[0070] The processor 101 is configured with a CPU (Central Processing Unit), an MPU (Micro Processing Unit), etc. The memory 102 is configured with a volatile storage device such as a DRAM (Dynamic Random Access Memory) or an SRAM (Static Random Access Memory). The storage 103 is configured with a non-volatile storage device such as an SSD (Solid State Drive) or an HDD (Hard Disk Drive). The processor 101 implements various processes according to this embodiment by expanding programs stored in the storage 103 into the memory and executing them.

[0071] The storage 103 stores a transfer instruction program 131 for instructing transfer by the transfer robot, and various databases 132 .

[0072] The communication interface 104 exchanges data with external devices (including the MES server 700, the apparatus 300, and the inspection apparatus 300A) via a communication cable. The wireless communication interface 105 exchanges data with external devices (including the transport robot 200 and the terminal 800) using wireless communication. Note that the instruction server 100 and the MES server 700 may be connected for communication wirelessly. In this case, the wireless communication interface 105 exchanges data with the MES server 700.

[0073] When using a computer having a structure conforming to the above-described general-purpose computer architecture, an operating system (OS) for providing basic computer functions may be installed in addition to an application for providing the functions according to the present embodiment. In this case, the program according to the present embodiment may execute processing by calling necessary modules from among program modules provided as part of the OS in a predetermined order and timing. In other words, the program according to the present embodiment itself may not include the above-described modules, and may execute processing in cooperation with the OS. Alternatively, some or all of the functions provided by execution of the transport instruction program 131 may be implemented as dedicated hardware circuits.

[0074] <Hardware configuration of the transport robot> Fig. 5 is a schematic diagram showing an example of the hardware configuration of the transport robot shown in Fig. 1 and Fig. 2. As shown in Fig. 5, the transport robot 200 includes a processor 201, a memory 202, a storage 203, an autonomous mobile robot 210, a manipulator 220, a load sensor 204, a rack 205, and a wireless communication interface 206. The autonomous mobile robot 210 includes a position and orientation sensor 211, a drive unit 212, and at least two wheels 213.

[0075] The processor 201 is configured with a CPU, an MPU, etc. The memory 202 is configured with a volatile storage device such as a DRAM or an SRAM, etc. The storage 203 is configured with a non-volatile storage device such as an SSD or an HDD, etc. The processor 201 implements various processes according to this embodiment by expanding a program stored in the storage 203 into the memory and executing it.

[0076] The storage 203 stores a driving control program 231 for controlling the autonomous driving robot 210, a manipulator control program 232 for controlling the manipulator 220, an integrated control program 233 for determining the execution timing of the driving control program 231 and the manipulator control program 232, and an instruction database 234.

[0077] The teaching database 234 includes teaching data that indicates the driving procedure of each driving axis of the manipulator 220 for picking and placing the semiconductor wafer set 5A.

[0078] The position and orientation sensor 211 uses known technology to measure the position and orientation of the autonomous mobile robot 210. For example, the position and orientation sensor 211 may use a self-position estimation method based on the surrounding environment measurement results using Lidar (Light Detection and Ranging), GPS, a beacon positioning method, a direction sensor, or the like.

[0079] The driving unit 212 drives the at least two wheels 213 in accordance with the operation amount generated by the processor 201. When the at least two wheels 213 are driven at the same speed, the autonomous mobile robot 210 moves forward or backward. When the at least two wheels 213 are driven at different speeds, the autonomous mobile robot 210 turns. Note that the processor 201 may turn the autonomous mobile robot 210 by changing the direction of the wheels 213.

[0080] As described above, the manipulator 220 is a vertical articulated robot and has multiple drive axes. The manipulator 220 can assume various postures by driving the multiple drive axes. The manipulator 220 drives the multiple drive axes in accordance with the operation amount generated by the processor 201.

[0081] Semiconductor wafer sets 5A are placed on rack 205. Presence sensor 204 detects whether semiconductor wafer sets 5A are present on rack 205. Presence sensor 204 is configured by, for example, a limit switch, a proximity switch, an image sensor, a photoelectric sensor, or the like.

[0082] The wireless communication interface 206 exchanges data with external devices (including the instruction server 100) using wireless communication.

[0083] Note that some or all of the functions provided by the execution of the travel control program 231, the manipulator control program 232, and the integrated control program 233 may be implemented as dedicated hardware circuits.

[0084] <Functional configuration> Fig. 6 is a schematic diagram showing an example of the functional configuration of the instruction server and the transport robot shown in Fig. 2. Note that Fig. 6 also shows the internal configurations of the inspection device 300A, the storage 600, and the MES server 700.

[0085] (Inspection equipment) The inspection device 300A includes an instrument mounting mechanism 31A, an instrument management unit 32A, an inspection unit 33A, and a communication unit 34A.

[0086] The instrument mounting mechanism 31A holds the probe card 350A and electrically connects the inspection unit 33A and the probe card 350A.

[0087] The instrument management unit 32A manages instrument identification information that identifies the type of the probe card 350A held by the instrument mounting mechanism 31A. The instrument management unit 32A acquires the instrument identification information, for example, by reading a code (two-dimensional code or barcode) attached to the probe card 350A. In this case, the code attached to the probe card 350A indicates the type of the probe card 350A. Alternatively, the instrument management unit 32A may acquire the instrument identification information by reading an RFID (Radio Frequency Identifier) ​​tag attached to the probe card 350A. Alternatively, the instrument management unit 32A may acquire the instrument identification information based on a signal obtained by electrically connecting to an electrical circuit of the probe card 350A and applying a voltage to the electrical circuit.

[0088] The inspection unit 33A uses a probe card 350A to inspect the electrical characteristics of a semiconductor wafer set 5A held by a holding member (not shown). The inspection unit 33A generates status information indicating the inspection status. The status information includes information indicating whether the currently loaded semiconductor wafer set 5A is being inspected or whether the next semiconductor wafer set 5A is waiting to be loaded.

[0089] In response to a request from the instruction server 100, the communication unit 34A transmits the latest instrument identification information managed by the instrument management unit 32A and the latest status information generated by the inspection unit 33A to the instruction server 100. Note that when the inspection device 300A is out of operation due to maintenance or the like, the communication unit 34A does not respond to the request from the instruction server 100. Alternatively, the communication unit 34A notifies the instruction server 100 that the inspection device 300A is undergoing maintenance.

[0090] (Storage) The storage facility 600 includes a storage database 61, a storage and retrieval mechanism 62, and a controller 63.

[0091] FIG. 7 is a diagram showing an example of a storage database. As shown in FIG. 7, storage database 61 has a table format. Storage database 61 has records 61a corresponding to each of a plurality of storage spaces 65 (see FIG. 1) of storage warehouse 600. Record 61a has fields 61b and 61c. Field 61b describes a storage space ID that identifies the corresponding storage space 65. Field 61c describes type identification information that identifies the type of semiconductor wafer set 5A stored in the corresponding storage space 65.

[0092] The loading / unloading mechanism 62 performs an unloading operation of unloading the semiconductor wafer set 5A from a designated storage space 65 among the plurality of storage spaces 65 to the table 64, and an inloading operation of storing the semiconductor wafer set 5A placed on the table 64 into the designated storage space 65.

[0093] The controller 63 controls the storage / retrieval mechanism 62 and manages the storage database 61 .

[0094] Specifically, controller 63 receives a shipping instruction from instruction server 100. Controller 63 also receives a storage instruction from instruction server 100 or an operation panel (not shown). The shipping instruction and storage instruction are accompanied by product type identification information that identifies the product type of semiconductor wafer set 5A.

[0095] In response to receiving the retrieval instruction, the controller 63 identifies, from the storage database 61, a record 61a in which the product type identification information attached to the retrieval instruction is described in field 61c. The controller 63 controls the loading / unloading mechanism 62 to retrieve the semiconductor wafer set 5A from the storage space 65 identified by the storage space ID described in field 61b of the identified record 61a to the table 64. When the retrieval operation by the loading / unloading mechanism 62 is completed, the controller 63 updates field 61c of the identified record 61a in the storage database 61 to "null." Furthermore, the controller 63 reports the completion of retrieval to the instruction server 100.

[0096] In response to receiving the storage instruction, the controller 63 identifies one record 61a in which "null" is written in field 61c from the storage database 61. The controller 63 controls the loading / unloading mechanism 62 to store the semiconductor wafer set 5A in the storage space 65 identified by the storage space ID written in field 61b of the identified record 61a. When the loading / unloading mechanism 62 completes the storage operation, the controller 63 updates field 61c of the identified record 61a in the storage database 61 to the product type identification information attached to the storage instruction.

[0097] In this way, the controller 63 manages the storage database 61 that indicates the type of each semiconductor wafer set 5A that is stored.

[0098] (MES server) The MES server 700 includes a production plan database 71 and an instruction unit 72. The production plan database 71 indicates a production plan for semiconductor wafers. The instruction unit 72 outputs instructions related to the manufacture of semiconductor wafers to the instruction server 100 based on the production plan database 71. The instructions related to the manufacture include an inspection instruction. The inspection instruction is accompanied by product type identification information that identifies the product type of the semiconductor wafer set 5A to be inspected.

[0099] (Transport robot) The transport robot 200 includes a communication unit 21, an integrated control unit 22, a travel control unit 23, an upper structure control unit 24, and a teaching database 234. The communication unit 21 is realized by a wireless communication interface shown in Fig. 5. The integrated control unit 22 is realized by the processor 201 executing an integrated control program 233. The travel control unit 23 is realized by the processor 201 executing a travel control program 231. The upper structure control unit 24 is realized by the processor 201 executing a manipulator control program 232.

[0100] The teaching database 234 includes first teaching data and second teaching data that indicate the driving procedures for each drive axis of the manipulator 220. The first teaching data indicates the driving procedures for picking up the semiconductor wafer set 5A placed on the platform 64 of the storage 600 and placing it on the rack 205. The second teaching data indicates the driving procedures for picking up the semiconductor wafer set 5A placed on the rack 205 and placing it on the holding member of the inspection device 300A.

[0101] The communication unit 21 receives a transport instruction from the instruction server 100. The transport instruction is accompanied by first target data indicating a first target position and posture to be taken by the autonomous mobile robot 210, and second target data indicating a second target position and posture to be taken by the autonomous mobile robot 210. The communication unit 21 outputs the received transport instruction to the integrated control unit 22.

[0102] In response to receiving the transfer completion signal from the integrated control unit 22, the communication unit 21 reports the transfer completion to the instruction server 100.

[0103] The traveling control unit 23 calculates the amount of operation to be output to the driving unit 212 (see FIG. 4) in accordance with the traveling instruction received from the integrated control unit 22. The traveling instruction is an instruction to move to a target position and orientation. When the current position and orientation measured by the position and orientation sensor 211 (see FIG. 4) reaches the target position and orientation, the traveling control unit 23 stops the operation of the driving unit 212 and reports the arrival at the target position and orientation to the integrated control unit 22.

[0104] In response to an operation start instruction received from integrated control unit 22, upper object control unit 24 calculates the amount of operation of each drive axis of manipulator 220 and outputs the amount of operation to manipulator 220. The operation start instruction received from integrated control unit 22 includes an instruction to start a retrieval operation for retrieving semiconductor wafer sets 5A from the outside to rack 205, and an instruction to start a distribution operation for distributing semiconductor wafer sets 5A in rack 205 to the outside. The instruction to start the retrieval operation and the instruction to start the distribution operation are accompanied by teaching data.

[0105] In response to receiving the instruction to start the retrieval operation, the upper structure control unit 24 calculates the operation amount of each drive shaft for each control period based on the teaching data attached to the instruction to start the retrieval operation. In response to completion of the retrieval operation, the upper structure control unit 24 reports the completion of the retrieval operation to the integrated control unit 22.

[0106] In response to receiving the instruction to start the distribution operation, the facility control unit 24 calculates the operation amount of each drive shaft for each control period based on the teaching data attached to the instruction to start the distribution operation. In response to completion of the distribution operation, the facility control unit 24 reports the completion of the distribution operation to the integrated control unit 22.

[0107] In response to the transport instruction received by the communication unit 21, the integrated control unit 22 executes the following processes (a) to (e) in order.

[0108] Process (a): The integrated control unit 22 outputs to the travel control unit 23 a travel instruction to move to the first target position and posture indicated by the first target data attached to the transfer instruction.

[0109] Process (b): In response to receiving a report from the traveling control unit 23 that the robot has arrived at the first target position and posture, the integrated control unit 22 reads out the first teaching data from the teaching database 234 and outputs an instruction to start the recovery operation accompanied by the first teaching data to the object control unit 24.

[0110] Process (c): In response to receiving a report from the upper object control unit 24 that the recovery operation has been completed, the integrated control unit 22 outputs a travel instruction to the travel control unit 23 to move to the second target position and posture indicated by the second target data attached to the transport instruction.

[0111] Process (d): In response to receiving a report from the driving control unit 23 that the robot has arrived at the second target position and posture, the integrated control unit 22 reads out the second teaching data from the teaching database 234 and outputs an instruction to start the distribution operation accompanied by the second teaching data to the object control unit 24.

[0112] Process (e): The integrated control unit 22 outputs a transport completion signal to the communication unit 21 in response to receiving a report from the goods control unit 24 that the distribution operation has been completed.

[0113] After step (e), the integrated control unit 22 may wait until it receives the next transfer instruction while keeping the autonomous mobile robot 210 stopped. Alternatively, the integrated control unit 22 may determine the home position of the transfer robot 200 as the target position and orientation, and output a travel instruction to the travel control unit 23 to move to the target position and orientation. After the autonomous mobile robot 210 reaches the home position, the integrated control unit 22 may wait until it receives the next transfer instruction. The home position of the transfer robot 200 is determined in advance.

[0114] (Instruction server) The instruction server 100 includes a first acquisition unit 11, a second acquisition unit 12, a control unit 13, an automatic transport instruction unit 14, a release instruction unit 15, an instrument replacement instruction unit 16, a location database 132a, and association information 132b. The first acquisition unit 11, the second acquisition unit 12, and the release instruction unit 15 are realized by a communication interface 104. The control unit 13 is realized by the processor 101 executing a transport instruction program 131. The automatic transport instruction unit 14 and the instrument replacement instruction unit 16 are realized by a wireless communication interface 105.

[0115] The position database 132a includes first position and orientation data and second position and orientation data associated with each of the multiple inspection devices 300A. The first position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the space on the platform 64 of the storage facility 600. The second position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the holding member of the corresponding inspection device 300A.

[0116] Fig. 8 is a diagram showing an example of the association information 132b. As shown in Fig. 8, the association information 132b is information that associates the type of semiconductor wafer set 5A with the type of probe card 350A for inspecting the semiconductor wafer set 5A of that type, and is created in advance.

[0117] The first acquisition unit 11 receives an inspection command from the MES server 700. As described above, the inspection command is accompanied by product type identification information that identifies the product type of the semiconductor wafer set 5A to be transported. Therefore, the first acquisition unit 11 acquires the product type identification information that identifies the product type of the semiconductor wafer set 5A to be transported.

[0118] The second acquisition unit 12 requests information from the plurality of inspection devices 300A, and acquires, for each of the plurality of inspection devices 300A, instrument identification information that identifies the type of probe card 350A attached to the inspection device 300A and status information that indicates the inspection status. The second acquisition unit 12 requests information from the plurality of inspection devices 300A in response to a request instruction from the control unit 13.

[0119] The automatic transfer instruction unit 14 outputs a transfer instruction to the transfer robot 200. The transfer instruction is accompanied by first target data and second target data determined by the control unit 13. In response to receiving the first target data and second target data from the control unit 13, the automatic transfer instruction unit 14 generates a transfer instruction to which the first target data and second target data are attached, and outputs the generated transfer instruction to the transfer robot 200.

[0120] The delivery instruction unit 15 outputs a delivery instruction to the storage 600. The delivery instruction is accompanied by product type identification information that identifies the product type of the semiconductor wafer set 5A to be delivered. In response to receiving the product type identification information from the control unit 13, the delivery instruction unit 15 generates a delivery instruction to which the product type identification information is attached, and outputs the generated delivery instruction to the storage 600.

[0121] The instrument replacement instruction unit 16 outputs an instrument replacement instruction to the terminal 800 in response to receiving the device ID and the instrument identification information from the control unit 13. The instrument replacement instruction is an instruction to replace the probe card 350A attached to the inspection device 300A identified by the device ID received from the control unit 13 with a probe card 350A of the type identified by the instrument identification information received from the control unit 13.

[0122] In response to the first acquisition unit 11 receiving the inspection command, the control unit 13 controls the operations of the second acquisition unit 12, the automatic transport instruction unit 14, the delivery instruction unit 15, and the instrument replacement instruction unit 16.

[0123] In response to the first acquisition unit 11 receiving the inspection command, the control unit 13 outputs a request instruction to the second acquisition unit 12. As a result, the second acquisition unit 12 acquires the instrument identification information and the status information for each of the multiple inspection devices 300A.

[0124] The control unit 13 includes an identification unit 133 and a selection unit 134 as blocks that perform processing using the variety identification information attached to the inspection command and the instrument identification information and status information of each inspection device 300A acquired by the second acquisition unit 12.

[0125] The identifying unit 133 uses the association information 132b to identify the type of probe card 350A associated with the semiconductor wafer set 5A of the type identified by the type identification information attached to the inspection command.

[0126] The selection unit 134 extracts, from the plurality of inspection devices 300A, an inspection device 300A that is waiting for the next semiconductor wafer set 5A to be loaded, using the status information acquired by the second acquisition unit 12. Then, the selection unit 134 uses the instrument identification information acquired by the second acquisition unit 12 to select, from the extracted inspection devices 300A, an inspection device 300A to which the identified type of probe card 350A is attached, as a target inspection device.

[0127] As a result of the processing by the selection unit 134, in addition to the first pattern in which the target inspection device can be selected, the following second and third patterns exist. Second pattern: In all of the inspection devices 300A waiting for the next semiconductor wafer set 5A to be loaded, a probe card 350A of a type different from the identified type is attached. Third pattern: There is no inspection device 300A waiting to load the next semiconductor wafer set 5A (all inspection devices 300A are currently performing inspection). The control unit 13 executes the following process for each of the first to third patterns.

[0128] (i) First pattern If the processing result is the first pattern, control unit 13 outputs the product type identification information attached to the inspection command to delivery instruction unit 15. As a result, delivery instruction unit 15 outputs a delivery instruction with the product type identification information attached to storage 600. As a result, semiconductor wafer set 5A to be transported is delivered onto platform 64.

[0129] When the control unit 13 receives a report of the completion of retrieval from the storage 600, the control unit 13 reads out the first position and orientation data and the second position and orientation data associated with the target inspection device from the position database 132a. The control unit 13 determines the read first position and orientation data and the second position and orientation data as first target data and second target data, respectively, and outputs the determined first target data and second target data to the automatic transfer instruction unit 14. As a result, the automatic transfer instruction unit 14 outputs a transfer instruction accompanied by the first target data and second target data to the transfer robot 200. As a result, the transfer robot 200 moves to the position and orientation indicated by the first position and orientation data (i.e., the position and orientation when the manipulator 220 accesses the stage 64), and retrieves the semiconductor wafer set 5A placed on the stage 64 into the rack 205. Then, the transport robot 200 moves to the position and posture indicated by the second position and posture data (i.e., the position and posture when the manipulator 220 accesses the holding member of the target inspection device), and distributes the semiconductor wafer set 5A placed on the rack 205 to the holding member of the target inspection device.

[0130] (ii) Second pattern If the processing result is the second pattern, the control unit 13 arbitrarily selects one of the inspection devices 300A that are waiting to load the next semiconductor wafer set 5A. The control unit 13 outputs to the device replacement instruction unit 16 a device ID that identifies the selected inspection device 300A and device identification information that identifies the type of the probe card 350A identified by the identification unit 133.

[0131] As a result, the instrument replacement instruction unit 16 outputs an instrument replacement instruction to the terminal 800 to replace the probe card 350A attached to the inspection instrument 300A identified by the instrument ID with a probe card 350A of the type identified by the instrument identification information. As a result, the worker M who has checked the terminal 800 goes to the instructed inspection instrument 300A and replaces the attached probe card 350A with a probe card 350A of the instructed type.

[0132] Furthermore, the control unit 13 periodically outputs a request instruction to the second acquisition unit 12. As a result, the second acquisition unit 12 acquires, from the inspection device 300A in which the probe card 350A has been replaced, status information indicating that the device is waiting for the next semiconductor wafer set 5A to be loaded, and instrument identification information identifying the type of the newly attached probe card 350A. The type of the newly attached probe card 350A matches the type identified by the identification unit 133. As a result, the selection unit 134 can select the target inspection device.

[0133] (iii) Third pattern If the processing result is the third pattern, the control unit 13 periodically outputs a request instruction to the second acquisition unit 12. As a result, the second acquisition unit 12 periodically acquires the instrument identification information and the status information from each of the multiple inspection devices 300A until the processing result becomes the first pattern or the second pattern.

[0134] <Processing flow in the transport system> (Instruction server) 9 is a flowchart showing the processing flow of the instruction server. First, processor 101 of instruction server 100 receives an inspection command from MES server 700 (step S21). The inspection command is accompanied by product type identification information that identifies the product type of semiconductor wafer set 5A to be transported (inspected). Therefore, in step S21, processor 101 acquires product type identification information that identifies the product type of semiconductor wafer set 5A to be transported.

[0135] Next, the processor 101 uses the association information 132b to identify the type of the probe card 350A associated with the product type identified by the product type identification information attached to the inspection command (step S22).

[0136] Next, the processor 101 requests information from each inspection device 300A, and acquires instrument identification information and status information from each inspection device 300A (step S23).

[0137] The processor 101 uses the instrument identification information and status information acquired from each inspection device 300A to determine whether there is an inspection device 300A that has the specified type of probe card 350A attached and is waiting for the next semiconductor wafer set 5A to be inserted (step S24).

[0138] If the answer is NO in step S24, the processor 101 determines whether there is an inspection device 300A that has a probe card 350A of a type other than the identified type attached and is waiting for the next semiconductor wafer set 5A to be inserted (step S25).

[0139] If the answer is YES in step S25, the processor 101 outputs an instrument replacement instruction to the terminal 800 of the operator M (step S26). The instrument replacement instruction is an instruction to replace the probe card 350A attached to one inspection device 300A waiting for the input of the next semiconductor wafer set 5A with the probe card 350A of the type identified in step S22.

[0140] If NO in step S25, or after step S26, the process returns to step S23.

[0141] If the answer is YES in step S24, the processor 101 selects, as the target inspection device, the inspection device 300A to which the probe card 350A of the type identified in step S22 is attached and which is waiting for the next semiconductor wafer set 5A to be loaded (step S27).

[0142] Next, processor 101 outputs a shipping instruction for semiconductor wafer set 5A to be transported to storage 600 (step S28). Specifically, processor 101 outputs a shipping instruction to storage 600, to which the type identification information attached to the inspection command has been added.

[0143] Next, processor 101 determines whether or not a report of the completion of unloading has been received from stocker 600 (step S29). If NO in step S29, the process returns to step S29.

[0144] If the answer is YES in step S29, the processor 101 recovers the semiconductor wafer set 5A placed on the platform 64 and outputs a transport instruction to the transport robot 200 to distribute the semiconductor wafer set 5A to the target inspection device selected in step S27 (step S30).

[0145] Next, the processor 101 determines whether or not a transfer completion report has been received from the transfer robot 200 (step S31). If the result in step S31 is NO, the process returns to step S31. If the result in step S31 is YES, the processor 101 reports the transfer completion to the MES server 700 (step S32). After step S32, the process ends.

[0146] (Inspection equipment) 10 is a flowchart showing the processing flow of the inspection device. First, the inspection device 300A determines whether or not an information request has been received from the instruction server 100 (step S41). If an information request has not been received (NO in step S41), the processing returns to step S41.

[0147] If an information request has been received (YES in step S41), the inspection device 300A transmits the latest tool identification information and the latest status information to the instruction server 100 (step S42). After step S42, the process ends.

[0148] (Storage) 11 is a flowchart showing the flow of processing in the storage warehouse. First, the controller 63 of the storage warehouse 600 determines whether or not a shipping instruction has been received from the instruction server 100 (step S51). If a shipping instruction has not been received (NO in step S51), the processing returns to step S51.

[0149] When a shipping instruction is received (YES in step S51), the controller 63 uses the storage database 61 shown in Fig. 7 to identify the storage space 65 corresponding to the product type identified by the product type identification information attached to the shipping instruction (step S52). That is, the controller 63 identifies the storage space 65 in which the semiconductor wafer set 5A of the product type identified by the product type identification information attached to the shipping instruction is stored.

[0150] Next, the controller 63 controls the loading / unloading mechanism 62 to unload the semiconductor wafer set 5A from the accommodation space 65 identified in step S52 onto the table 64 (step S53).

[0151] Next, the controller 63 updates the field 61c of the record 61a in the storage database 61 that corresponds to the storage space 65 from which the semiconductor wafer set 5A was delivered to "null" (step S54).

[0152] Next, the controller 63 reports the completion of the delivery to the instruction server 100 (step S55). After step S55, the process ends.

[0153] (Transport robot) 12 is a flowchart showing the flow of processing by the transfer robot. First, the processor 201 of the transfer robot 200 determines whether or not a transfer instruction has been received (step S61). The transfer instruction is accompanied by first target data and second target data. If a transfer instruction has not been received (NO in step S61), the processing returns to step S61.

[0154] If a transport instruction has been received (YES in step S61), the processor 201 controls the autonomous mobile robot 210 to move to the first target position and posture indicated by the first target data (step S62).

[0155] Next, the processor 201 determines whether the position and posture of the autonomous mobile robot 210 has reached the first target position and posture (step S63). If NO in step S63, the process returns to step S62.

[0156] If the answer is YES in step S63, the processor 201 controls the manipulator 220 to perform the retrieval operation of the semiconductor wafer set 5A (step S64).

[0157] Next, the processor 201 determines whether or not the collection operation of the semiconductor wafer set 5A is completed (step S65). If NO in step S65, the process returns to step S64.

[0158] If the answer is YES in step S65, the processor 201 controls the autonomous mobile robot 210 to move to the second target position and posture indicated by the second target data (step S66).

[0159] Next, the processor 201 determines whether or not the position and posture of the autonomous mobile robot 210 has reached the second target position and posture (step S67). If NO in step S67, the process returns to step S66.

[0160] If the answer is YES in step S67, the processor 201 controls the manipulator 220 to execute the distribution operation of the semiconductor wafer set 5A (step S68).

[0161] Next, the processor 201 determines whether the distribution operation of the semiconductor wafer set 5A is completed (step S69). If NO in step S69, the process returns to step S68.

[0162] If the determination in step S69 is YES, the processor 201 reports the completion of the transfer to the instruction server 100 (step S70). Note that in step S70, the processor 201 may move the autonomous mobile robot 210 to the home position. After step S70, the processing ends.

[0163] <Advantages> As described above, the transport system 1A according to the first specific example includes a plurality of inspection devices 300A that perform predetermined processing (inspection) on semiconductor wafer sets 5A, a transport robot 200, and an instruction server 100. The instruction server 100 includes a first acquisition unit 11, a second acquisition unit 12, an identification unit 133, a selection unit 134, and an automatic transport instruction unit 14. The first acquisition unit 11 acquires product type identification information that identifies the product type of the semiconductor wafer set 5A to be transported. The second acquisition unit 12 acquires instrument identification information that identifies the type of probe card 350A attached to each of the plurality of inspection devices 300A. The identification unit 133 uses the association information 132b to identify the type of probe card 350A associated with the product type identified by the product type identification information. The association information 132b associates the product type of the semiconductor wafer set 5A with the type of probe card 350A used to perform predetermined processing (inspection) on the semiconductor wafer set 5A of that product type. The selection unit 134 uses the tool identification information to select, as a target inspection device, an inspection device 300A equipped with the specified type of probe card 350A from among the multiple inspection devices 300A. The automatic transport instruction unit 14 outputs a transport instruction to the transport robot 200 to transport the semiconductor wafer set 5A to be transported to the target inspection device.

[0164] As a result, the semiconductor wafer set 5A to be transported is transported by the transport robot 200 to the inspection device 300A equipped with a probe card 350A of a type corresponding to the type of semiconductor wafer set 5A. This reduces the labor required for manual transport by an operator as in the past. As a result, efficient transport of the semiconductor wafer set 5A can be achieved.

[0165] Furthermore, many inspection devices 300A are installed at semiconductor wafer production sites. Therefore, when an operator M mounts a probe card 350A on an inspection device 300A, human error can occur, resulting in the probe card 350A being mounted on a different inspection device 300A than the designated inspection device 300A. Even if such a human error occurs, the selection unit 134 can use the instrument identification information acquired from each inspection device 300A to select, as the target inspection device, an inspection device 300A mounted with a specified type of probe card 350A from among the many inspection devices 300A. As a result, it is possible to prevent a semiconductor wafer set 5A to be transported from being transported to an inspection device 300A mounted with an incompatible type of probe card 350A.

[0166] Furthermore, since the second acquisition unit 12 acquires the instrument identification information from each inspection device 300A, the operator M does not need to input the completion of the installation of the probe card 350A in the inspection device 300A to the instruction server 100. Therefore, the time and effort required for the operator M to install the probe card 350A is reduced.

[0167] In conventional semiconductor wafer production sites, the probe card must be loaded onto the inspection device, taking into consideration the time it takes to transport the semiconductor wafer to the inspection device. The time it takes to load the probe card onto the inspection device can vary depending on the worker's level of skill and their location when they notice the tool replacement instruction. However, the transport system 1A of Example 1 is independent of the transport time by the transport robot 200 and the variance in the loading time of the probe card 350A. Therefore, there is no need to change the operation method of the transport system 1A depending on the transport time and loading time.

[0168] The transfer robot 200 includes an autonomous mobile robot 210, a manipulator 220 mounted on the autonomous mobile robot 210 and configured to transfer semiconductor wafer set 5A, and a processor 201 (an integrated control unit 22, a travel control unit 23, and an object control unit 24) that controls the autonomous mobile robot 210 and the manipulator 220. In response to a transfer instruction, the processor 201 moves the autonomous mobile robot 210 to a first target position and posture corresponding to a collection location for the semiconductor wafer set 5A to be transferred (process (a)). After the autonomous mobile robot 210 reaches the first target position and posture, the processor 201 causes the manipulator 220 to execute a collection operation for collecting the semiconductor wafer set 5A to be transferred (process (b)). After the collection operation is completed, the processor 201 moves the autonomous mobile robot 210 to a second target position and posture corresponding to the target inspection device (process (c)). After the autonomous mobile robot 210 reaches the second target position and posture, the processor 201 causes the manipulator 220 to execute a distribution operation to distribute the semiconductor wafer set 5A to be transported to the target inspection device (processing (d)).

[0169] This eliminates the need to install belt conveyors, rails, etc. for transporting semiconductor wafer set 5A to each inspection device 300A, thereby reducing the start-up time at the production site.

[0170] The transport system 1A further includes a storage 600 capable of storing a plurality of semiconductor wafer sets 5A. The storage 600 has an inlet / outlet mechanism 62 that retrieves a specified semiconductor wafer set 5A. The first target position and attitude is determined according to a platform 64 that is the location of the semiconductor wafer set 5A retrieved from the storage 600. The instruction server 100 further includes an outlet instruction unit 15 that outputs an outlet instruction for the semiconductor wafer set 5A to be transported to the storage 600.

[0171] This allows the transport robot 200 to be taken out of the storage 600, retrieve the semiconductor wafer set 5A to be transported from the platform 64, and transport it to the target inspection device. As a result, the number of workers employed to transport the semiconductor wafer set 5A from the storage 600 to the target inspection device can be reduced.

[0172] <Variation 1> Depending on the specifications of the transport robot 200 and the storage 600, there may be cases where the manipulator 220 of the transport robot 200 cannot access the semiconductor wafer set 5A placed on the platform 64 of the storage 600. Modification 1 is a form that addresses such cases.

[0173] 13 is a diagram showing the periphery of a storage cabinet in Modification 1. As shown in Fig. 13, the transport system 1A_1 according to Modification 1 includes, in addition to a storage cabinet 600, a temporary storage shelf 500 having a placement portion accessible to the manipulator 220 of the transport robot 200. An operator M1 places a semiconductor wafer set 5A placed on a platform 64 of the storage cabinet 600 onto the placement portion of the temporary storage shelf 500.

[0174] Fig. 14 is a schematic diagram showing an example of the functional configuration of the instruction server and temporary storage shelf included in the transport system according to Modification 1. The transport system 1A_1 according to Modification 1 differs from the transport system 1 shown in Fig. 5 in that it includes an instruction server 100_1 instead of the instruction server 100, and also includes a temporary storage shelf 500. Note that the transport system 1A_1 according to Modification 1 includes an MES server 700, a transport robot 200, a plurality of inspection devices 300A, and a terminal 800, similar to the transport system 1A, but these are not shown in Fig. 13.

[0175] In addition to the above functions, the controller 63 of the storage 600 has the following functions: That is, when the semiconductor wafer set 5A is delivered to the table 64 by the loading / unloading mechanism 62, the controller 63 outputs delivery information indicating that the semiconductor wafer set 5A has been delivered to the temporary shelf 500. The delivery information is accompanied by product type identification information that identifies the product type of the delivered semiconductor wafer set 5A.

[0176] The temporary storage shelf 500 includes placement units 51a to 51c, detection units 52a to 52c, a placement database management unit 53, a delivery information acquisition unit 54, and a placement database 55.

[0177] Delivery information acquisition unit 54 acquires delivery information from storage 600. On each of placement units 51a to 51c, semiconductor wafer set 5A is placed by worker M1.

[0178] The detectors 52a to 52c output signals indicating whether or not a semiconductor wafer set 5A is placed on the mounting portions 51a to 51c. Specifically, each of the detectors 52a to 52c outputs a signal indicating either a first state in which the semiconductor wafer set 5A is placed on the corresponding mounting portion, or a second state in which the semiconductor wafer set 5A is not placed on the corresponding mounting portion. The detectors 52a to 52c are configured with, for example, limit switches, image sensors, or photoelectric sensors.

[0179] Fig. 15 is a diagram showing an example of the placement database. As shown in Fig. 14, the placement database 55 is in a table format and has records 55a corresponding to each of the placement units 51a to 51c. Each record 55a includes a field 55b in which a placement unit ID for identifying the corresponding placement unit is written, and a field 55c in which type identification information for identifying the type of semiconductor wafer set 5A placed on the corresponding placement unit is written.

[0180] The placement database management unit 53 updates the placement database 55 based on the shipping information acquired by the shipping information acquisition unit 54 and the signals from the detection units 52a to 52c.

[0181] Specifically, based on the output signals of the detection units 52a to 52c, the placement database management unit 53 identifies one of the placement units 51a to 51c that first changed from the second state to the first state after the shipment information acquisition unit 54 acquired the shipment information. Specifically, the placement database management unit 53 extracts record 55a in which the placement unit ID of the placement unit corresponding to the detection unit whose output signal first switched from the second state to the first state after the shipment information acquisition unit 54 acquired the shipment information is written. The placement database management unit 53 writes the product type identification information attached to the shipment information in field 55c of the extracted record 55a.

[0182] Furthermore, the placement database management unit 53 constantly monitors the output signals of the detection units 52a to 52c. The placement database management unit 53 identifies a detection unit, among the detection units 52a to 52c, whose output signal has switched from the first state to the second state. The placement database management unit 53 extracts, from the placement database 55, a record 55a in which the placement unit ID of the placement unit corresponding to the identified detection unit is written. The placement database management unit 53 updates field 55c of the extracted record 55a to "null."

[0183] In this way, the placement database management unit 53 manages the placement database 55, which is management information associating each of the placement units 51a to 51c with the type of the semiconductor wafer set 5A placed thereon. The placement database management unit 53 provides the latest placement database 55 to the instruction server 100_1 in response to a request from the instruction server 100_1.

[0184] The instruction server 100_1 differs from the instruction server 100 shown in Fig. 6 in that it includes a control unit 13_1 and a location database 132c instead of the control unit 13 and the location database 132a, and also includes a third acquisition unit 17. The instruction server 100_1 has the same hardware configuration as the instruction server 100 shown in Fig. 4. The third acquisition unit 17 is realized by the communication interface 104. The control unit 13 is realized by the processor 101 executing a transport instruction program 131.

[0185] In response to receiving a request instruction from the control unit 13_1, the third obtaining unit 17 makes an information request to the temporary shelf 500 and obtains the latest placement database 55.

[0186] 6, the position database 132c differs in that, instead of the first position and orientation data, it includes third position and orientation data associated with each of the placement sections 51a to 51c of the temporary shelf 500. The third position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the corresponding placement section.

[0187] The control unit 13_1 differs from the control unit 13 shown in FIG. 6 in that it executes the following process when the processing result by the selection unit 134 is the first pattern.

[0188] If the processing result is the first pattern, control unit 13_1 outputs the product type identification information attached to the inspection command to delivery instruction unit 15. As a result, delivery instruction unit 15 outputs a delivery instruction with the product type identification information attached to storage 600. As a result, semiconductor wafer set 5A to be transported is delivered onto table 64. Worker M1 moves semiconductor wafer set 5A placed on table 64 to an empty placement section of temporary shelf 500.

[0189] When control unit 13_1 receives a report of the completion of unloading from storage 600, it outputs a request instruction to third acquisition unit 17 and acquires the latest placement database 55 from the third acquisition unit 17. Control unit 13_1 determines whether or not record 55a in which the product type identification information attached to the inspection command is described in field 55c exists in the latest placement database 55. If the record 55a does not exist in the latest placement database 55, control unit 13_1 outputs a request instruction to third acquisition unit 17 again.

[0190] When the latest placement database 55 contains a record 55a in which the type identification information attached to the inspection command is described in the field 55c, the control unit 13_1 specifies the target placement unit identified by the placement unit ID described in the field 55b of the record 55a. That is, the target placement unit on which the semiconductor wafer set 5A of the type identified by the type identification information attached to the inspection command is placed is specified from among the placement units 51a to 51c based on the placement database 55.

[0191] The control unit 13_1 reads out the third position and orientation data corresponding to the target placement unit from the position database 132c. Furthermore, the control unit 13_1 reads out the second position and orientation data associated with the target inspection device. The control unit 13_1 determines the read out third position and orientation data and second position and orientation data as first target data and second target data, respectively, and outputs the determined first target data and second target data to the automatic transport instruction unit 14. As a result, the first target position and orientation indicated by the first target data is determined according to the target placement unit, among the placement units 51a to 51c, on which the semiconductor wafer set 5A of the type identified by the type identification information attached to the inspection command is placed.

[0192] The automatic transfer instruction unit 14 outputs a transfer instruction accompanied by the first target data and the second target data to the transfer robot 200. As a result, the transfer robot 200 moves to the position and orientation indicated by the third position and orientation data (i.e., the position and orientation when the manipulator 220 accesses the placement unit on which the semiconductor wafer set 5A to be transferred is placed). Then, the transfer robot 200 retrieves the semiconductor wafer set 5A placed on the placement unit to the rack 205. Thereafter, the transfer robot 200 moves to the position and orientation indicated by the second position and orientation data, and distributes the semiconductor wafer set 5A placed on the rack 205 to a holding member of the target inspection device.

[0193] According to variant example 1, even if the manipulator 220 of the transport robot 200 cannot access the semiconductor wafer set 5A placed on the platform 64 of the storage cabinet 600, the transport robot 200 can transport the semiconductor wafer set 5A from the temporary storage shelf 500 to the inspection device 300A.

[0194] The work of attaching the probe card 350A to the inspection device 300A requires specialized knowledge. Therefore, it is necessary to hire a worker M with specialized knowledge to perform this attachment work. In contrast, the work of moving the semiconductor wafer set 5A delivered to the platform 64 to an empty placement section on the temporary shelf 500 (moving work) is simple. Therefore, it is easy to secure a person to perform this moving work.

[0195] <Variation 2> FIG. 16 is a diagram showing the periphery of a storage facility in Modification 2. FIG. 17 is a schematic diagram showing an example of the functional configuration of an instruction server, a temporary storage shelf, and a transfer robot provided in a transport system according to Modification 2. As shown in FIGS. 16 and 17, a transport system 1A_2 according to Modification 2 differs from the transport system 1A_1 according to Modification 1 in that it includes a transfer robot 900. The transfer robot 900 moves semiconductor wafer set 5A placed on platform 64 of storage facility 600 to the placement section of temporary storage shelf 500. This eliminates the need to employ worker M1.

[0196] As shown in FIG. 16, the transfer robot 900 includes a pick-and-place mechanism 91, a teaching database 92, and a controller 93.

[0197] The pick-and-place mechanism 91 moves the semiconductor wafer set 5A removed from the storage 600 to one of the placement sections 51a to 51c that is in the second state where no semiconductor wafer set 5A is placed. Specifically, the pick-and-place mechanism 91 picks up the semiconductor wafer set 5A placed on the platform 64 and places it on one of the placement sections that is in the second state. The pick-and-place mechanism 91 is typically configured by a vertical articulated robot. However, the pick-and-place mechanism 91 is not limited to a vertical articulated robot and can take various forms.

[0198] The instruction database 92 includes instruction data corresponding to each of the placement sections 51a to 51c of the temporary shelf 500. The instruction data indicates a driving procedure for the pick-and-place mechanism 91 to pick up the semiconductor wafer set 5A placed on the temporary shelf 500 and place it on the corresponding placement section 51a to 51c.

[0199] The controller 93 controls the pick-and-place mechanism 91 in response to the output of the retrieval information from the storage 600. The controller 93 requests the latest placement database 55 from the temporary storage shelf 500, and identifies one placement unit that is in the second state where no semiconductor wafer set 5A is placed, based on the placement database 55. That is, the controller 93 identifies, in the placement database 55, the placement unit identified by the placement unit ID described in field 55b of record 55a where field 55c is "null," as the placement unit where no semiconductor wafer set 5A is placed. The controller 93 reads out teaching data corresponding to the identified placement unit from the teaching database 92, and controls the pick-and-place mechanism 91 in accordance with the read teaching data.

[0200] According to variant example 2, even if the manipulator 220 of the transport robot 200 cannot access the semiconductor wafer set 5A placed on the platform 64 of the storage facility 600, the transport robot 200 can transport the semiconductor wafer set 5A from the temporary storage shelf 500 to the inspection device 300A.

[0201] <Variation 3> When the transport robot 200 transports the semiconductor wafer set 5A to be transported to the inspection device 300A, the transport robot 200 may retrieve the inspected semiconductor wafer set 5A from the inspection device 300A, thereby improving the efficiency of transporting the semiconductor wafer set 5A.

[0202] Fig. 18 is a schematic diagram showing a hardware configuration of a transport robot according to Modification 3. As shown in Fig. 18, the transport robot 200_1 according to Modification 3 is different from the transport robot 200 shown in Fig. 5 in that it includes a presence sensor 207 and a rack 208.

[0203] Semiconductor wafer sets 5A are placed on rack 208. Presence sensor 207 detects whether or not semiconductor wafer sets 5A are placed on rack 208. Presence sensor 207 is configured by, for example, a limit switch, a proximity switch, an image sensor, a photoelectric sensor, or the like.

[0204] Fig. 19 is a schematic diagram showing the functional configuration of the instruction server and the transport robot of the transport system according to Modification 3. As shown in Fig. 19, the transport system 1A_3 according to Modification 3 differs from the transport system 1A shown in Fig. 6 in that it includes an instruction server 100_2 and one or more transport robots 200_1 instead of the instruction server 100 and one or more transport robots 200, respectively.

[0205] 6, the transfer robot 200_1 includes an integrated control unit 22_1 and an instruction database 234_1 instead of the integrated control unit 22 and the instruction database 234, and also includes a stock information storage unit 235.

[0206] The inventory information storage unit 235 stores inventory information indicating whether or not the semiconductor wafer set 5A is placed on the racks 205, 208. The communication unit 21 transmits the inventory information to the instruction server 100_2 in response to a request from the instruction server 100_2.

[0207] The teaching database 234_1 differs from the teaching database 234 shown in Fig. 6 in that it further includes third teaching data and fourth teaching data. The third teaching data and fourth teaching data indicate the drive procedures of the respective drive axes of the manipulator 220.

[0208] The third teaching data indicates the driving procedure of each drive shaft for picking up inspected semiconductor wafer set 5A held by the holding member of inspection device 300A and placing it in rack 208. The fourth teaching data indicates the driving procedure of each drive shaft for picking up semiconductor wafer set 5A placed on rack 208 and placing it in storage 1000. Storage 1000 stores inspected semiconductor wafer sets 5A.

[0209] In addition to the functions of the integrated control unit 22, the integrated control unit 22_1 sequentially executes the above processes (a) to (c) and the following processes (f) to (i) in accordance with the fact that the first to third target data are attached to the transport instruction received by the communication unit 21.

[0210] Process (f): In response to receiving a report from the traveling control unit 23 that the robot has arrived at the second target position and posture, the integrated control unit 22_1 reads out the third teaching data from the teaching database 234_1 and outputs an instruction to start the recovery operation accompanied by the third teaching data to the object control unit 24.

[0211] Process (g): In response to receiving a report from the object control unit 24 that the collection operation has been completed, the integrated control unit 22_1 reads out the second teaching data from the teaching database 234_1 and outputs an instruction to start the distribution operation accompanied by the second teaching data to the object control unit 24.

[0212] Process (h): In response to receiving a report of the completion of the distribution operation from the article control unit 24, the integrated control unit 22_1 outputs a transport completion signal to the communication unit 21. Furthermore, the integrated control unit 22_1 outputs a travel instruction to the travel control unit 23 to move to a third target position and posture indicated by the third target data attached to the transport instruction.

[0213] Process (i): In response to receiving a report from the driving control unit 23 that the robot has arrived at the third target position and posture, the integrated control unit 22_1 reads out the fourth teaching data from the teaching database 234_1 and outputs an instruction to start the distribution operation accompanied by the fourth teaching data to the object control unit 24.

[0214] After the process (i), the integrated control unit 22_1 may wait until the next transfer instruction is received while keeping the autonomous mobile robot 210 stopped. Alternatively, the integrated control unit 22_1 may determine the home position of the transfer robot 200_1 as the target position and posture, and output a travel instruction to move to the target position and posture to the travel control unit 23. Then, after the autonomous mobile robot 210 reaches the home position, the integrated control unit 22_1 may wait until the next transfer instruction is received.

[0215] As described above, the communication unit 34A of the inspection device 300A transmits the tool identification information and the status information to the instruction server 100_2 in response to the information request. However, in the third modification, the status information further includes information indicating whether or not the inspected semiconductor wafer set 5A is mounted in the inspection device 300A.

[0216] The instruction server 100_2 differs from the instruction server 100 shown in Fig. 6 in that it includes a control unit 13_2 and a position database 132d instead of the control unit 13 and the position database 132a, and also includes a fourth acquisition unit 18. The instruction server 100_2 has the same hardware configuration as the instruction server 100 shown in Fig. 4. The control unit 13_2 is realized by the processor 101 executing a transport instruction program 131.

[0217] The fourth acquiring unit 18 requests the inventory information from all of the one or more transport robots 200_1, and acquires the inventory information from each of the one or more transport robots 200_1.

[0218] 6 in that it includes fourth position and orientation data. The fourth position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the storage 1000.

[0219] The control unit 13_2 differs from the control unit 13 shown in FIG. 6 in that it executes the following process when the processing result by the selection unit 134 is the first pattern.

[0220] When the processing result is the first pattern, control unit 13_2 determines whether or not inspected semiconductor wafer set 5A is mounted in the target inspection device, based on the status information received from the target inspection device.

[0221] Furthermore, control unit 13_2 instructs the fourth acquiring unit 18 to acquire the inventory information. Based on the inventory information, control unit 13_2 confirms whether or not there is a transport robot 200_1 in which semiconductor wafer sets 5A are not placed on both of racks 205, 208, among the one or more transport robots 200_1.

[0222] When there exists a transport robot 200_1 in which an inspected semiconductor wafer set 5A is mounted in the target inspection device and the semiconductor wafer set 5A is not placed on either of the racks 205, 208, the control unit 13_2 executes the following process.

[0223] Specifically, the control unit 13_2 outputs the type identification information attached to the inspection command to the delivery instructing unit 15. As a result, the semiconductor wafer set 5A to be transported is delivered onto the platform 64. When the control unit 13_2 receives a report of the completion of delivery from the storage 600, it reads out the first position and orientation data, the second position and orientation data associated with the target inspection device, and the fourth position and orientation data from the position database 132d. The control unit 13_2 determines the read first position and orientation data, the second position and orientation data, and the fourth position and orientation data as the first target data, the second target data, and the third target data, respectively. The control unit 13_2 outputs the determined first target data, the second target data, and the third target data to the automatic transport instructing unit 14. Furthermore, the control unit 13_2 designates the output destination of the transport instruction to the transport robot 200_1 in which the semiconductor wafer set 5A is not placed on either of the racks 205 and 208. As a result, the automatic transport instruction unit 14 outputs a transport instruction accompanied by the first target data, second target data, and third target data to the transport robot 200_1 that does not have a semiconductor wafer set 5A placed on either rack 205, 208.

[0224] As a result, processor 201 of transfer robot 200_1, which has received the transfer instruction, moves autonomous mobile robot 210 to the first target position and orientation indicated by the first target data. After reaching the first target position and orientation, processor 201 causes manipulator 220 to execute a retrieval operation to retrieve semiconductor wafer set 5A to rack 205. Then, processor 201 moves autonomous mobile robot 210 to a second target position and orientation indicated by the second target data. After reaching the second target position and orientation, processor 201 causes manipulator 220 to execute a retrieval operation to retrieve inspected semiconductor wafer set 5A placed in the target inspection device to rack 208 before causing manipulator 220 to execute a distribution operation of semiconductor wafer set 5A to the target inspection device. Then, processor 201 causes manipulator 220 to execute a distribution operation of semiconductor wafer set 5A from rack 205 to the target inspection device. After the distribution operation is completed, processor 201 moves autonomous mobile robot 210 to a third target position and orientation indicated by third target data (fourth position and orientation data) corresponding to storage 1000, which is the distribution location of inspected semiconductor wafer set 5A. After autonomous mobile robot 210 reaches the third target position and orientation, processor 201 causes manipulator 220 to execute a distribution operation to distribute inspected semiconductor wafer set 5A to storage 1000.

[0225] When the inspected semiconductor wafer set 5A is not mounted in the target inspection device, the control unit 13_2 outputs the first target data and the second target data to the automatic transport instruction unit 14 in the same manner as the control unit 13.

[0226] <Variation 4> FIG. 20 is a schematic diagram showing a transport system according to Modification 4. As shown in FIG. 20, the transport system 1A_4 according to Modification 4 includes an MES server 700 and a plurality of production bases 1100 (1100a, 1100b). Each of the production bases 1100 is equipped with the instruction server 100, one or more transport robots 200, a plurality of inspection devices 300A, and a storage 600. The instruction server 100 of each of the production bases 1100 outputs tool identification information acquired from the plurality of inspection devices 300A to the MES server 700. The instruction server 100 may also output the latest status information acquired from the plurality of inspection devices 300A and the latest storage database 61 managed by the storage 600 to the MES server 700.

[0227] The MES server 700 may modify the production plans of the multiple production sites 1100 based on the tool identification information obtained from the multiple production sites 1100.

[0228] For example, the MES server 700 modifies the production plan of each production base 1100 so as to reduce the frequency of replacing the probe card 350A in the multiple inspection devices 300A. Specifically, if a production plan for the production base 1100b is made for the semiconductor wafer set 5A of a type corresponding to the type of probe card 350A attached to the inspection device 300A arranged at the production base 1100a, the MES server 700 changes the production plan from the production base 1100b to the production base 1100a. As a result, the frequency of replacing the probe card 350A at the production base 1100a decreases.

[0229] <Variation 5> Fig. 21 is a schematic diagram showing the configuration of a transport system according to Modification 5. As shown in Fig. 21, the transport system 1A_5 according to Modification 5 differs from the transport system 1A shown in Fig. 2 in that it includes an instruction server 100_3 and a plurality of inspection devices 300A_1 instead of the instruction server 100 and the plurality of inspection devices 300A. The inspection device 300A_1 differs from the inspection device 300A in that it includes an autonomous mobile robot 370. That is, each of the plurality of inspection devices 300A_1 can be moved by the autonomous mobile robot 370.

[0230] The autonomous mobile robot 370 provided in each inspection device 300A_1 moves in response to a movement instruction from the instruction server 100_3. By moving the autonomous mobile robot 370, the layout of the plurality of inspection devices 300A_1 can be easily changed.

[0231] 22 is a schematic diagram showing an example of the hardware configuration of an autonomous mobile robot according to Modification 5. As shown in FIG. 22, an autonomous mobile robot 370 includes a processor 371, a memory 372, a storage 373, a position and orientation sensor 374, a drive unit 375, at least two wheels 376, a communication interface 377, and a wireless communication interface 378.

[0232] The processor 371 is configured with a CPU, an MPU, etc. The memory 372 is configured with a volatile storage device such as a DRAM or an SRAM, etc. The storage 373 is configured with a non-volatile storage device such as an SSD or an HDD, etc. The processor 371 implements various processes according to this embodiment by expanding a program stored in the storage 373 into the memory and executing it.

[0233] The storage 373 stores a driving control program 380 and a communication control program 381.

[0234] The position and orientation sensor 374 uses known technology to measure the position and orientation of the autonomous mobile robot 370. For example, the position and orientation sensor 374 may use a self-position estimation method based on the surrounding environment measurement results using Lidar (Light Detection and Ranging), GPS, a beacon positioning method, a direction sensor, or the like.

[0235] The driving unit 375 drives at least two wheels 376 in accordance with the operation amount generated by the processor 371. When the at least two wheels 376 are driven at the same speed, the autonomous mobile robot 370 moves forward or backward. When the at least two wheels 376 are driven at different speeds, the autonomous mobile robot 370 turns. Note that the processor 371 may turn the autonomous mobile robot 370 by changing the direction of the wheels 376.

[0236] The communication interface 377 exchanges data with external devices (including the inspection device 300A_1) via communication means such as a communication cable, optical data communication, etc. The wireless communication interface 378 exchanges data with external devices (including the instruction server 100_3) by wireless communication.

[0237] FIG. 23 is a schematic diagram showing the functional configuration of an instruction server and an inspection device of a transport system according to the fifth modification.

[0238] The command unit 72 of the MES server 700 outputs a layout change command to the instruction server 100_3 in addition to the inspection command. The layout change command is accompanied by a data set corresponding to each of one or more inspection devices 300A_1 that are to be subjected to the layout change. The data set includes a device ID that identifies the inspection device 300A_1 and fourth target data that indicates a target position and orientation. The data set is generated in response to an input by, for example, an administrator. Alternatively, the data set may be generated by a device layout optimization algorithm implemented by AI (Artificial Intelligence) or the like.

[0239] The autonomous mobile robot 370 includes an information acquisition unit 36, a communication control unit 37, a wireless communication unit 38, and a travel control unit 39. The information acquisition unit 36 ​​is realized by a communication interface 377. The wireless communication unit 38 is realized by a wireless communication interface 378. The communication control unit 37 is realized by the processor 371 executing a communication control program 381. The travel control unit 39 is realized by the processor 371 executing a travel control program 380.

[0240] The information acquiring unit 36 ​​acquires the tool identification information and the situation information from the communication unit 34A. In the fifth modification, the communication unit 34A outputs the tool identification information and the situation information to the autonomous mobile robot 370, not to the instruction server 100_3.

[0241] The traveling control unit 39 controls the driving unit 375 (see FIG. 22 ) in accordance with the movement instruction received by the wireless communication unit 38 from the instruction server 100_3, and changes the position and orientation of the autonomous traveling robot 370. The movement instruction is accompanied by fourth position and orientation data indicating a target position and orientation. The traveling control unit 39 controls the driving unit 375 so that the position and orientation measured by the position and orientation sensor 374 approaches the target position and orientation indicated by the fourth position and orientation data attached to the movement instruction. This causes the inspection device 300A_1 to move.

[0242] In addition, the traveling control unit 39 outputs fifth position and orientation data indicating the position and orientation measured by the position and orientation sensor 374 to the communication control unit 37.

[0243] The communication control unit 37 controls the wireless communication unit 38. When the wireless communication unit 38 receives a movement instruction from the instruction server 100_3, the communication control unit 37 outputs the movement instruction to the travel control unit 39.

[0244] Furthermore, when the wireless communication unit 38 receives an information request from the instruction server 100_3, the communication control unit 37 controls the wireless communication unit 38 to transmit the latest tool identification information and latest status information acquired by the information acquisition unit 36, and the latest fifth position and posture data output from the traveling control unit 39 to the instruction server 100_3.

[0245] The instruction server 100_3 differs from the instruction server 100 shown in Fig. 6 in that it includes an inspection equipment management unit 12_3, a control unit 13_3, and a location database 132e instead of the second acquisition unit 12, the control unit 13, and the location database 132a. The instruction server 100_3 has the same hardware configuration as the instruction server 100 shown in Fig. 4. The inspection equipment management unit 12_3 is realized by the wireless communication interface 105. The control unit 13_3 is realized by the processor 101 executing the transport instruction program 131.

[0246] The position database 132e differs from the position database 132a shown in FIG. 6 in that it includes relative position and orientation data instead of the second position and orientation data associated with each of the multiple inspection devices 300A.

[0247] The relative position and orientation data indicates the relative position and orientation that the autonomous mobile robot 210 should take with respect to the inspection device 300A_1 when the manipulator 220 accesses the holding member of the inspection device 300A_1.

[0248] The inspection apparatus management unit 12_3 receives a data set including an apparatus ID and fourth position and orientation data from the control unit 13_3. Upon receiving the data set, the inspection apparatus management unit 12_3 outputs an instruction to move the inspection apparatus 300A_1 identified by the apparatus ID to a target position and orientation indicated by the fourth position and orientation data.

[0249] Furthermore, the inspection device management unit 12_3 requests information from each of the autonomous mobile robots 370 of the plurality of inspection devices 300A_1, and acquires the latest tool identification information, the latest situation information, and the latest fifth position and posture data from each of the autonomous mobile robots 370. The inspection device management unit 12_3 requests information from the plurality of autonomous mobile robots 370 in response to a request instruction from the control unit 13_3.

[0250] Compared to the control unit 13 shown in Figure 6, the control unit 13_3 differs in that it outputs one or more data sets to the inspection equipment management unit 12_3, outputs a request instruction to the inspection equipment management unit 12_3 instead of the second acquisition unit 12, and generates second target data using relative position and orientation data instead of second position and orientation data.

[0251] When the first acquiring unit 11 receives the layout change command, the control unit 13_3 outputs one or more data sets attached to the layout change command to the inspection apparatus managing unit 12_3. As a result, a movement instruction is output to the corresponding inspection apparatus 300A_1 in accordance with each data set.

[0252] The control unit 13_3 outputs a request instruction to the inspection device management unit 12_3 in response to the acceptance of the inspection command by the first acquisition unit 11. As a result, the inspection device management unit 12_3 acquires the tool identification information, the situation information, and the fifth position and posture data from each of the autonomous mobile robots 370 of the plurality of inspection devices 300A_1.

[0253] The control unit 13_3 uses the fifth position and orientation data acquired from the autonomous mobile robot 370 of the target inspection device and the relative position and orientation data included in the position database 132e to calculate the position and orientation to be taken by the autonomous mobile robot 210 when the manipulator 220 accesses the holding member of the target inspection device. That is, the control unit 13_3 calculates the position and orientation to be taken by the autonomous mobile robot 210 by adding the relative position and orientation indicated by the relative position and orientation data to the position and orientation indicated by the fifth position and orientation data. The control unit 13_3 generates data indicating the calculated position and orientation as second target data.

[0254] According to the fifth modification, even if the layout of inspection apparatus 300A_1 is changed, transport robot 200 can transport semiconductor wafer set 5A from storage 600 to the target inspection apparatus.

[0255] Depending on the accuracy of the stopping positions of the autonomous mobile robots 210 and 370, there is a possibility that the operation of delivering the semiconductor wafer set 5A to the inspection device 300A_1 by the manipulator 220 may not be executed normally.

[0256] Therefore, it is preferable to correct the operation of the manipulator 220 according to the actual stopping position of the autonomous mobile robots 210 and 370. For example, a camera is attached to the manipulator 220, and an alignment mark is affixed to a predetermined position of the inspection device 300A_1. For example, the alignment mark may be affixed to the autonomous mobile robot 370 of the inspection device 300A_1. When the autonomous mobile robot 210 reaches the second target position and orientation, the processor 201 of the transfer robot 200 corrects the second teaching data for the distribution operation by the difference between the position of the alignment mark calculated based on the image obtained from the camera and the first reference position. The second teaching data is created so that the manipulator 220 can access the holding member of the inspection device 300A_1 equipped with the autonomous mobile robot 370 when the autonomous mobile robot 370 is stopped so that the alignment mark is located at the first reference position. Therefore, by correcting the second teaching data by the difference, it is possible to reduce the frequency of failure in the operation of manipulator 220 to deliver semiconductor wafer set 5A to inspection device 300A_1.

[0257] Alternatively, the processor 201 of the transfer robot 200 may correct the second target position and posture in accordance with the actual stopping position of the autonomous mobile robot 370. For example, a feature (such as an L-shaped plate or a triangular plate) is provided at a predetermined position of the inspection device 300A_1. For example, the feature may be provided on the autonomous mobile robot 370 of the inspection device 300A_1. Furthermore, a feature detection sensor that detects the position of the feature is provided on the autonomous mobile robot 210. When the autonomous mobile robot 210 reaches the second target position and posture, the processor 201 of the transfer robot 200 adjusts the position and posture of the autonomous mobile robot 210 by the difference between the position detected by the feature detection sensor and the second reference position. The second reference position is the position of the feature detected by the feature detection sensor when the manipulator 220 can access a holding member of the inspection device 300A_1 including the autonomous mobile robot 370. Therefore, by adjusting the position and posture of autonomous mobile robot 210 by the difference described above, it is possible to reduce the frequency of failure in the operation of manipulator 220 to deliver semiconductor wafer set 5A to inspection device 300A_1.

[0258] §3 Example 2 <Outline of Specific Example 2> FIG. 24 is a diagram showing a conveyance system according to a second specific example of the embodiment. As shown in FIG. 24, a conveyance system 1B according to the second specific example conveys parts 5B constituting a finished product as the items 5 to be conveyed. The conveyance system 1B includes a plurality of work tables 300B as the plurality of devices 300. On the work tables 300B, dedicated trays 350B for storing parts are installed as tools 350. On the work tables 300B, a finished product is assembled using the parts 5B stored on the dedicated trays 350B. The assembly of the product may be performed by a worker or a robot.

[0259] The dedicated trays 350B are designed to accommodate the corresponding number of parts 5B of the corresponding type, so that the use of the dedicated trays 350B reduces mistakes (loss, misassembly, etc.) in the type and number of parts 5B that make up the product.

[0260] Furthermore, like the conveyance system 1A of specific example 1, the conveyance system 1B includes an MES server 700 communicably connected to the instruction server 100. The MES server 700 according to specific example 2 manages the production of a product. In specific example 2, the MES server 700 outputs a production command for the product to the instruction server 100 in accordance with a production plan created in advance.

[0261] The instruction server 100 according to the second specific example executes a process related to the transport of the component 5B to the workbench 300B.

[0262] Specifically, instruction server 100 causes part 5B to be transported to be retrieved from storage 600 in response to a manufacturing command from MES server 700. Thereafter, instruction server 100 transmits a transport instruction to transport robot 200 to transport part 5B placed on platform 64 to work bench 300B. In response to the transport instruction, transport robot 200 transports part 5B placed on platform 64 to work bench 300B. The transported part 5B is placed on dedicated tray 350B installed on work bench 300B. At work bench 300B, a product is assembled from the part 5B using dedicated tray 350B.

[0263] As described above, in order to prevent errors in the type and quantity of parts 5B constituting a product, dedicated trays 350B are used according to the type of parts 5B. Therefore, parts 5B to be transported need to be transported to work benches 300B on which dedicated trays 350B according to the type are placed. Therefore, instruction server 100 executes the processes of steps (1B) to (5B).

[0264] First, the instruction server 100 acquires product type identification information that identifies the product type of the part 5B to be transported (step (1B)).

[0265] Next, the instruction server 100 acquires tool identification information that identifies the type of the dedicated tray 350B installed on each of the plurality of workbenches 300B (step (2B)).

[0266] Next, the instruction server 100 uses association information that associates the type of the part 5B with the type of dedicated tray 350B for assembling a product using the part 5B of that type to identify the type of dedicated tray 350B associated with the type identified by the type identification information (step (3B)). That is, the instruction server 100 identifies the dedicated tray 350B corresponding to the part 5B to be transported.

[0267] Next, the instruction server 100 uses the tool identification information to select, as a target workbench, from among the plurality of workbenches 300B, a workbench 300B on which the specified type of dedicated tray 350B is installed (step (4B)).

[0268] The instruction server 100 outputs an instruction (transport instruction) to the transfer robot 200 to transfer the part 5B to be transferred to the target work bench (step (5B)).

[0269] <Functional configuration> FIG. 25 is a schematic diagram illustrating an example of a functional configuration of the transport system illustrated in FIG.

[0270] (Workbench) The workbench 300B includes an appliance management unit 32B, an assembly unit 33B, and a communication unit 34B.

[0271] The tool management unit 32B manages tool identification information that identifies the type of dedicated tray 350B placed on the workbench 300B. The tool management unit 32B acquires the tool identification information, for example, by reading a code (two-dimensional code or barcode) attached to the dedicated tray 350B. In this case, the code attached to the dedicated tray 350B indicates the type of the dedicated tray 350B. Alternatively, the tool management unit 32B may acquire the tool identification information by reading an RFID tag attached to the dedicated tray 350B.

[0272] The assembly unit 33B assembles a product using parts 5B stored in a dedicated tray 350B. The assembly unit 33B includes, for example, an assembly robot. The assembly unit 33B generates status information indicating the work status. The status information includes information indicating whether the product is being assembled or whether the next part 5B is waiting to be introduced.

[0273] In response to a request from the instruction server 100, the communication unit 34B transmits to the instruction server 100 the latest tool identification information managed by the tool management unit 32B and the latest status information generated by the assembly unit 33B.

[0274] (Storage) The storage 600 has the same configuration as in Example 1. However, in the storage database 61, field 61c (see FIG. 7) describes product type identification information that identifies the product type of the component 5B stored in the corresponding storage space 65. Also, compared to Example 1, the storage / retrieval mechanism 62 differs in that it performs the storage and retrieval operations for the component 5B instead of the semiconductor wafer set 5A. The processing content of the controller 63 is the same as in Example 1.

[0275] (MES server) The MES server 700 has the same configuration as in Example 1. However, the command unit 72 outputs a manufacturing command for a product made up of the part 5B to the instruction server 100 based on the production plan database 71. The manufacturing command is provided with product type identification information that identifies the product type of the part 5B that makes up the product to be manufactured.

[0276] (Transport robot) The transport robot 200 has the same configuration as in Example 1. However, the transport robot 200 transports a component 5B to the work bench 300B instead of a semiconductor wafer set 5A. Therefore, the first teaching data included in the teaching database 234 indicates a driving procedure for picking up the component 5B placed on the table 64 of the storage 600 and placing it on the rack 205. The second teaching data included in the teaching database 234 indicates a driving procedure for picking up the component 5B placed on the rack 205 and placing it on the work bench 300B.

[0277] (Instruction server) The instruction server 100 has the same configuration as in Example 1. However, the position database 132a includes second position and orientation data associated with each of the multiple work tables 300B, instead of the second position and orientation data associated with each of the multiple inspection devices 300A. The second position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the corresponding work table 300B.

[0278] Furthermore, the association information 132b associates the type of parts 5B, not the semiconductor wafer set 5A, with the type of special tray 350B used when assembling a product made up of the parts 5B of that type.

[0279] The first acquisition unit 11 differs from the first specific example in that it receives a manufacturing command from the MES server 700. As described above, the manufacturing command is accompanied by product type identification information that identifies the product type of the part 5B that constitutes the product to be manufactured. Therefore, the first acquisition unit 11 acquires the product type identification information that identifies the product type of the part 5B to be transported.

[0280] Compared to specific example 1, the second acquisition unit 12 differs in that it requests information from multiple work tables 300B instead of multiple inspection devices 300A, and acquires, for each of the multiple work tables 300B, instrument identification information that identifies the type of dedicated tray 350B installed on the work table 300B and status information that indicates the work status.

[0281] The shipping instruction unit 15 differs from the first example in that it outputs a shipping instruction accompanied by product type identification information that identifies the product type of the part 5B, not the semiconductor wafer set 5A.

[0282] Compared to specific example 1, the instrument replacement instruction unit 16 differs in that it outputs an instrument replacement instruction to replace the dedicated tray 350B installed on the workbench 300B identified by the device ID received from the control unit 13 with a dedicated tray 350B of the type identified by the instrument identification information received from the control unit 13.

[0283] In response to the first acquisition unit 11 receiving a manufacturing command, the control unit 13 controls the operations of the second acquisition unit 12, the automatic transport instruction unit 14, the shipping instruction unit 15, and the tool replacement instruction unit 16. The control method of each unit by the control unit 13 is the same as in Example 1, except for the following three points. Uses product type identification information that identifies the product type of the part 5B, not the semiconductor wafer set 5A. ·The device identification information for identifying the type of the dedicated tray 350B is used instead of the probe card 350A. Uses status information indicating the work status of the work table 300B instead of the inspection device 300A.

[0284] Moreover, the processing flow in the instruction server 100, workbench 300B, storage 600, and transfer robot 200 follows the flowcharts shown in FIGS. 9 to 12 described in the first specific example, except for the above three points.

[0285] <Advantages> According to the second specific example, the transport robot 200 transports the component 5B to be transported to the work table 300B on which a dedicated tray 350B corresponding to the type of the component 5B is placed. This reduces the labor required for transport by a worker as in the past. As a result, the component 5B can be transported efficiently.

[0286] For example, in the case of automobiles, construction machinery, etc., malfunctions due to incorrect assembly of parts 5B are not permitted in consideration of the safety of users. Therefore, the conveyance system 1B of specific example 2 is applied to production sites of automobiles, construction machinery, etc. Parts 5B in such production sites include, for example, parts such as brakes, gearboxes, and hydraulic pumps.

[0287] <Modification> Modifications 1, 2, 4, and 5 described in the first specific example are also applied to the transport system 1B according to the second specific example.

[0288] Furthermore, the storage 600 does not need to be equipped with the loading / unloading mechanism 62. In this case, the worker simply unloads the part 5B from the storage 600 to the table 64 and inputs a manufacturing command to the instruction server 100, the command carrying product type identification information that identifies the product type of the unloaded part 5B. Because the part 5B has been unloaded from the storage 600, the instruction server 100 does not need to output a unloading command. Therefore, the instruction server 100 does not need to be equipped with the unloading command unit 15.

[0289] §4 Example 3 <Outline of Specific Example 3> Fig. 26 is a diagram showing a conveying system according to a third specific example of the embodiment. As shown in Fig. 26, the conveying system 1C according to the third specific example conveys assembled products 5C as the articles 5 to be conveyed. The conveying system 1C includes a plurality of evaluation devices 300C as the plurality of devices 300. A fixing jig 350C is installed in the evaluation device 300C as a tool 350. The evaluation device 300C evaluates the performance of the products 5C fixed by the fixing jig 350C.

[0290] The evaluation device 300C evaluates the performance of a product 5C that is located at a predetermined reference height and reference position. A fixing jig 350C is used to fix the product 5C at the reference height and reference position. The product 5C has different sizes depending on the product type. Therefore, different types of fixing jigs 350C must be used depending on the product type.

[0291] Furthermore, similar to the conveyance system 1A of specific example 1, the conveyance system 1C includes an MES server 700 communicatively connected to the instruction server 100. The MES server 700 according to specific example 3 manages the manufacture of the product 5C. In specific example 3, the MES server 700 outputs a performance evaluation command for the product 5C to the instruction server 100 in accordance with a production plan created in advance.

[0292] The instruction server 100 according to the third specific example executes a process related to the transport of the product 5C to the evaluation device 300C.

[0293] Specifically, the instruction server 100 causes the product 5C to be transported (evaluated) to be removed from the storage 600 in response to a performance evaluation command from the MES server 700. Thereafter, the instruction server 100 transmits a transport instruction to the transport robot 200 to transport the product 5C placed on the platform 64 to the evaluation device 300C. In response to the transport instruction, the transport robot 200 transports the product 5C placed on the platform 64 to the evaluation device 300C. The transported product 5C is fixed by a fixing jig 350C installed in the evaluation device 300C. The evaluation device 300C evaluates the performance of the product 5C fixed by the fixing jig 350C.

[0294] As described above, different types of fixing jigs 350C need to be used depending on the type of product 5C. Therefore, the product 5C to be transported needs to be transported to the evaluation device 300C in which the fixing jig 350C corresponding to the type is installed. Therefore, the instruction server 100 executes the processes of steps (1C) to (5C).

[0295] First, the instruction server 100 acquires product type identification information that identifies the product type of the product 5C to be transported (step (1C)).

[0296] Next, the instruction server 100 acquires tool identification information that identifies the type of the fixing jig 350C installed in each of the plurality of evaluation devices 300C (step (2C)).

[0297] Next, the instruction server 100 uses association information that associates the type of the product 5C with the type of fixing jig 350C used when evaluating the performance of the product 5C of that type to identify the type of fixing jig 350C associated with the type identified by the type identification information (step (3C)). That is, the instruction server 100 identifies the fixing jig 350C corresponding to the product 5C to be transported.

[0298] Next, the instruction server 100 uses the tool identification information to select, as a target evaluation device, an evaluation device 300C in which the specified type of fixing jig 350C is installed, from among the multiple evaluation devices 300C (step (4C)).

[0299] The instruction server 100 outputs an instruction (transport instruction) to the transport robot 200 to transport the product 5C to be transported to the target evaluation device (step (5C)).

[0300] <Functional configuration> FIG. 27 is a schematic diagram illustrating an example of the functional configuration of the transport system illustrated in FIG.

[0301] (Evaluation device) The evaluation device 300C includes an appliance management unit 32C, an evaluation unit 33C, and a communication unit 34C.

[0302] The tool management unit 32C manages tool identification information that identifies the type of fixture 350C installed in the evaluation device 300C. The tool management unit 32C acquires the tool identification information by, for example, reading a code (two-dimensional code or barcode) attached to the fixture 350C. In this case, the code attached to the fixture 350C indicates the type of the fixture 350C. Alternatively, the tool management unit 32C may acquire the tool identification information by reading an RFID tag attached to the fixture 350C.

[0303] The evaluation unit 33C evaluates the performance of the product 5C fixed by the fixing jig 350C. For example, if the product 5C is a laser rangefinder, the evaluation unit 33C evaluates whether the measurement result by the laser rangefinder is within a reference range. The reference range is set in advance according to a reference height and a reference position at which the product 5C fixed by the fixing jig 350C exists.

[0304] The evaluation unit 33C generates status information indicating the evaluation status. The status information includes information indicating whether the performance of the product 5C is being evaluated or whether the next product 5C is waiting to be introduced.

[0305] In response to a request from the instruction server 100, the communication unit 34C transmits to the instruction server 100 the latest appliance identification information managed by the appliance management unit 32C and the latest status information generated by the evaluation unit 33C.

[0306] (Storage) The storage 600 has the same configuration as in Example 1. However, in the storage database 61, field 61c (see FIG. 7) describes product type identification information that identifies the product type of the product 5C stored in the corresponding storage space 65. Also, compared to Example 1, the storage / retrieval mechanism 62 differs in that it performs the storage and retrieval operations for the product 5C instead of the semiconductor wafer set 5A. The processing content of the controller 63 is the same as in Example 1.

[0307] (MES server) The MES server 700 has the same configuration as in specific example 1. However, the command unit 72 outputs an evaluation command for the performance of the product 5C to the instruction server 100 based on the production plan database 71. The evaluation command is accompanied by product type identification information that identifies the product type of the product 5C to be evaluated.

[0308] (Transport robot) The transport robot 200 has the same configuration as in Example 1. However, the transport robot 200 transports a product 5C to the evaluation device 300C instead of a semiconductor wafer set 5A. Therefore, the first teaching data included in the teaching database 234 indicates a driving procedure for picking up the product 5C placed on the table 64 of the storage 600 and placing it on the rack 205. The second teaching data included in the teaching database 234 indicates a driving procedure for picking up the product 5C placed on the rack 205 and placing it on the fixture 350C of the evaluation device 300C.

[0309] (Instruction server) The instruction server 100 has the same configuration as in Example 1. However, the position database 132a includes second position and orientation data associated with each of the multiple evaluation devices 300C, instead of the second position and orientation data associated with each of the multiple inspection devices 300A. The second position and orientation data indicates the position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the reference height and reference position of the corresponding evaluation device 300C.

[0310] Furthermore, the association information 132b associates the type of product 5C, not the semiconductor wafer set 5A, with the type of fixture 350C used when evaluating the performance of the product 5C of that type.

[0311] The first acquisition unit 11 differs from the first specific example in that it receives an evaluation command from the MES server 700. As described above, the evaluation command is accompanied by product type identification information that identifies the product type of the product 5C to be evaluated. Therefore, the first acquisition unit 11 acquires the product type identification information that identifies the product type of the product 5C to be transported (evaluated).

[0312] Compared to specific example 1, the second acquisition unit 12 differs in that it requests information from multiple evaluation devices 300C instead of multiple inspection devices 300A, and acquires instrument identification information that identifies the type of fixing jig 350C and status information that indicates the evaluation status from each of the multiple evaluation devices 300C.

[0313] The shipping instruction unit 15 differs from the first example in that it outputs a shipping instruction accompanied by product type identification information that identifies the product type of the product 5C, not the semiconductor wafer set 5A.

[0314] Compared to specific example 1, the instrument replacement instruction unit 16 differs in that it outputs an instrument replacement instruction to replace the fixing jig 350C installed on the evaluation device 300C identified by the device ID received from the control unit 13 with a fixing jig 350C of a type identified by the instrument identification information received from the control unit 13.

[0315] In response to the first acquisition unit 11 receiving the evaluation command, the control unit 13 controls the operations of the second acquisition unit 12, the automatic transport instruction unit 14, the delivery instruction unit 15, and the instrument replacement instruction unit 16. The control method of each unit by the control unit 13 is the same as in Example 1, except for the following three points. Uses product identification information that identifies the product type 5C, not the semiconductor wafer set 5A. ·The tool identification information for identifying the type of the fixture 350C is used instead of the probe card 350A. Uses status information indicating the evaluation status of the evaluation device 300C instead of the inspection device 300A.

[0316] Moreover, the processing flows in the instruction server 100, the evaluation device 300C, the storage 600, and the transport robot 200 follow the flowcharts shown in FIGS. 9 to 12 described in the first specific example, except for the above three points.

[0317] <Advantages> According to the specific example 3, the transport robot 200 transports the product 5C to be transported to the evaluation device 300C in which the fixing jig 350C of the type corresponding to the type of the product 5C is installed. This reduces the labor required for transport by a worker as in the past. As a result, efficient transport of the product 5C can be realized.

[0318] <Modification> Modifications 1 to 5 described in the first specific example are also applied to the transfer system 1C according to the third specific example.

[0319] The evaluation device 300C may calibrate the product 5C in accordance with the evaluated performance. That is, the evaluation device 300C may output a deviation of the evaluated performance from a predetermined reference performance.

[0320] Furthermore, the storage 600 does not need to be equipped with the loading / unloading mechanism 62. In this case, the worker simply unloads the product 5C from the storage 600 to the table 64 and inputs an evaluation command to the instruction server 100, the evaluation command being accompanied by product type identification information that identifies the product type of the unloaded product 5C. Because the product 5C has been unloaded from the storage 600, the instruction server 100 does not need to output a unloading instruction. Therefore, the instruction server 100 does not need to be equipped with the unloading instruction unit 15.

[0321] §5 Example 4 <Outline of Specific Example 4> Fig. 28 is a diagram showing a conveying system according to specific example 4 of the embodiment. As shown in Fig. 28, the conveying system 1D according to specific example 4 conveys seedlings 5D as the items 5 to be conveyed. The conveying system 1D includes a plurality of rice transplanters 300D as the plurality of devices 300. The rice transplanters 300D are equipped with planting tines 350D as tools 350. The rice transplanters 300D plant the seedlings 5D using the planting tines 350D.

[0322] The instruction server 100_4 according to the fourth specific example executes a process related to the transportation of the seedlings 5D to the rice transplanter 300D.

[0323] Specifically, in response to the rice planting start command, the instruction server 100_4 causes the seedlings 5D to be transported (planted) to be shipped out from the storage 600. The instruction server 100_4 is connected to an input device (keyboard, mouse, etc.) and receives the rice planting start command from the input device.

[0324] The instruction server 100_4 transmits a transport instruction to the transport robot 200 to transport the seedlings 5D placed on the platform 64 to the rice transplanter 300D. As a result, the transport robot 200 transports the seedlings 5D placed on the platform 64 to the rice transplanter 300D in accordance with the transport instruction. The transported seedlings 5D are fixed by planting tines 350D installed on the rice transplanter 300D. The rice transplanter 300D uses the installed planting tines 350D to plant the seedlings 5D in the rice field.

[0325] It is necessary to use different types of planting claws 350D depending on the variety of the seedlings 5D. Therefore, the seedlings 5D to be transported need to be transported to a rice transplanter 300D equipped with the planting claws 350D according to the variety. Therefore, the instruction server 100_4 executes the processes of steps (1D) to (5D).

[0326] First, the instruction server 100_4 acquires variety identification information for identifying the variety of the seedling 5D to be transported (step (1D)).

[0327] Next, the instruction server 100_4 acquires tool identification information for identifying the type of the planting claw 350D installed in each of the plurality of rice transplanters 300D (step (2D)).

[0328] Next, the instruction server 100_4 uses association information that associates the variety of the seedling 5D with the type of the planting claw 350D used when planting the seedling 5D of that variety to identify the variety identified by the variety identification information (step (3D)). That is, the instruction server 100_4 identifies the planting claw 350D corresponding to the seedling 5D to be transported.

[0329] Next, the instruction server 100_4 uses the implement identification information to select, as a target rice transplanter, a rice transplanter 300D equipped with the identified type of planting claw 350D from among the plurality of rice transplanters 300D (step (4D)).

[0330] The instruction server 100_4 outputs an instruction (transport instruction) to the transport robot 200 to transport the seedlings 5D to be transported to the target rice transplanter (step (5D)).

[0331] <Functional configuration> FIG. 29 is a schematic diagram illustrating an example of a functional configuration of the transport system illustrated in FIG.

[0332] (Rice planter) The rice transplanter 300D includes an implement fixing unit 31D, an implement management unit 32D, a planting unit 33D, a communication unit 34D, and a position and orientation sensor 35D.

[0333] The tool fixing unit 31D holds the planting claw 350D. The tool management unit 32D manages tool identification information that identifies the type of planting claw 350D fixed by the tool fixing unit 31D. The tool management unit 32D acquires the tool identification information, for example, by reading a code (two-dimensional code or barcode) attached to the planting claw 350D. In this case, the code attached to the planting claw 350D indicates the type of planting claw 350D. Alternatively, the tool management unit 32D may acquire the tool identification information by reading an RFID tag attached to the planting claw 350D.

[0334] The planting unit 33D uses the planting claws 350D fixed by the tool fixing unit 31D to plant the seedlings 5D in the rice field. The planting unit 33D generates status information indicating the planting status. The status information includes information indicating whether the seedlings 5D are being planted or whether the next seedlings 5D are waiting to be introduced.

[0335] The position and orientation sensor 35D uses known technology to measure the position and orientation of the rice transplanter 300D. For example, the position and orientation sensor 35D may be a self-position estimation method based on the results of measuring the surrounding environment using Lidar (Light Detection and Ranging), a GPS, a beacon positioning method, a direction sensor, or the like.

[0336] In response to a request from the instruction server 100_4, the communication unit 34D transmits to the instruction server 100_4 the latest tool identification information managed by the tool management unit 32D, the latest status information generated by the planting unit 33D, and the latest sixth position and orientation data indicating the position and orientation measured by the position and orientation sensor 35D.

[0337] (Storage) The storage 600 has the same configuration as in Example 1. However, in the storage database 61, field 61c (see FIG. 7) describes variety identification information that identifies the variety of the seedlings 5D stored in the corresponding storage space 65. Also, compared to Example 1, the storage / retrieval mechanism 62 differs in that it performs the storage and retrieval operations of seedlings 5D instead of semiconductor wafer sets 5A. The processing content of the controller 63 is the same as in Example 1.

[0338] (Transport robot) The transport robot 200 has the same configuration as in Example 1. However, the transport robot 200 transports seedlings 5D to the rice transplanter 300D instead of semiconductor wafer sets 5A. Therefore, the first teaching data included in the teaching database 234 indicates a driving procedure for picking up the seedlings 5D placed on the platform 64 of the storage facility 600 and placing them on the rack 205. The second teaching data included in the teaching database 234 indicates a driving procedure for picking up the seedlings 5D placed on the rack 205 and placing them on the holding member of the rice transplanter 300D.

[0339] (Instruction server) The instruction server 100_4 differs from the instruction server 100_3 shown in FIG. 23 in that the instruction server 100_4 includes a control unit 13_4 and a second obtaining unit 12_4 instead of the control unit 13_3 and the inspection apparatus managing unit 12_3, respectively.

[0340] The relative position and orientation data included in the position database 132e of the instruction server 100_4 indicates the relative position and orientation that the autonomous mobile robot 210 should take when the manipulator 220 accesses the holding member of the rice transplanter 300D.

[0341] The association information 132b associates the variety of the seedling 5D, not the semiconductor wafer set 5A, with the type of planting claw 350D used when planting the seedling 5D of that variety.

[0342] The first acquisition unit 11 differs from the first specific example in that it receives a rice planting start command from an input device. The rice planting start command is accompanied by variety identification information that identifies the variety of the product 5C to be planted. Therefore, the first acquisition unit 11 acquires variety identification information that identifies the variety of the seedling 5D to be transported (to be planted).

[0343] The second acquisition unit 12_4 requests information from the plurality of rice transplanters 300D and acquires the latest tool identification information, the latest situation information, and the latest sixth position and attitude data from each rice transplanter 300D. The second acquisition unit 12_4 requests information from the plurality of rice transplanters 300D in response to a request instruction from the control unit 13_4.

[0344] The shipping instruction unit 15 differs from the first example in that it outputs a shipping instruction accompanied by product type identification information that identifies the product type of the seedling 5D, not the semiconductor wafer set 5A.

[0345] Compared to specific example 1, the implement replacement instruction unit 16 differs in that it outputs an implement replacement instruction to replace the planting claw 350D installed on the rice transplanter 300D identified by the device ID received from the control unit 13_4 with a planting claw 350D of the type identified by the implement identification information received from the control unit 13_4.

[0346] In response to the first acquisition unit 11 receiving the rice planting start command, the control unit 13_4 controls the operations of the second acquisition unit 12_4, the automatic transport instruction unit 14, the delivery instruction unit 15, and the tool replacement instruction unit 16. The control method of each unit by the control unit 13_4 is the same as the control method of the control unit 13_3 shown in Fig. 23 except for the following four points. Uses variety identification information that identifies the variety of the seedling 5D, not the semiconductor wafer set 5A. · Uses tool identification information that identifies the type of implantation nail 350D rather than the probe card 350A. · Status information indicating the planting status of the rice transplanter 300D is used instead of the inspection device 300A. The sixth position and orientation data acquired from the rice transplanter 300D is used instead of the fifth position and orientation data acquired from the autonomous mobile robot 370.

[0347] Moreover, the processing flows in the instruction server 100_4, the rice transplanter 300D, the storage 600, and the transport robot 200 follow the flowcharts shown in FIGS. 9 to 12 described in the first specific example, except for the above four points.

[0348] <Advantages> According to the fourth specific example, the transport robot 200 transports the seedlings 5D to the rice transplanter 300D equipped with the planting claws 350D of the type that corresponds to the variety of the seedlings 5D. This reduces the labor required for transport by a worker as in the past. As a result, the seedlings 5D can be transported efficiently.

[0349] <Modification> The first and second modifications described in the first specific example are also applied to the transfer system 1D according to the fourth specific example.

[0350] In the above description, the position and orientation of the rice transplanter 300D is measured by a position and orientation sensor 35D included in the rice transplanter 300D. However, the position and orientation of the rice transplanter 300D may be measured by another method. For example, the transport system 1D may include one or more cameras that capture images of the movement range of the rice transplanter 300D, and a calculation unit that measures the position and orientation of the rice transplanter 300D by analyzing image data obtained from the cameras and outputs sixth position and orientation data. The camera may be attached to a fixed pole located within the movement range, or may be attached to a drone that can fly within the movement range. The calculation unit outputs the latest sixth position and orientation data to the instruction server 100.

[0351] §6 Supplementary Note As described above, the present embodiment includes the following disclosure.

[0352] (Configuration 1) A conveyance system (1, 1A to 1D, 1A_1 to 1A_5), A plurality of devices (300, 300A to 300D) that perform predetermined processing on articles (5, 5A to 5D); Transport robot (200, 200_1) and An indicator (100, 100_1 to 100_4), Each of the plurality of devices (300, 300A to 300D) is provided with a type of device arbitrarily selected from a plurality of types of devices (350, 350A to 350D), In each of the plurality of devices (300, 300A to 300D, 300A_1), the predetermined process is performed using the installed tools (350, 350A to 350D), The instruction unit (100, 100_1 to 100_4) a first acquisition unit (11, 101) that acquires first identification information that identifies the type of the item (5, 5A to 5D) to be conveyed; a second acquisition unit (12, 12_1 to 12_4, 101) that acquires second identification information that identifies the type of the appliance (350, 350A to 350D) installed in each of the plurality of devices (300, 300A to 300D, 300A_1); an identification unit (13a, 101) that identifies the type of tool associated with the product type identified by the first identification information, using association information (132b) that associates the product type (5, 5A to 5D) with the type of tool (350, 350A to 350D) for performing the predetermined process on the product type (5, 5A to 5D); a selection unit (13b, 101) that uses the second identification information to select, as a target device, a device in which a specified type of appliance is installed from among the plurality of devices (300, 300A to 300D, 300A_1); a first output unit (14, 101) that outputs a transport instruction to the transport robot (200, 200_1) to transport the item (5, 5A to 5D) to be transported to the target device, the transport system (1, 1A to 1D, 1A_1 to 1A_5).

[0353] (Configuration 2) The transport robot (200, 200_1) Autonomous mobile robot (210) and a first mechanism (220) mounted on the autonomous mobile robot (210) and configured to transfer the article (5, 5A to 5D); a control unit (22-24, 22_1, 201) that controls the autonomous traveling robot (210) and the first mechanism (220); In response to the transport instruction, the control unit (22 to 24, 22_1, 201) moving the autonomous mobile robot (210) to a first target position and posture corresponding to a collection location of the item to be transported; After the autonomous mobile robot (210) reaches the first target position and posture, the first mechanism (220) executes a first retrieval operation to retrieve the item to be transported; After the first retrieval operation is completed, the autonomous mobile robot is moved to a second target position and posture corresponding to the target device; The conveying system (1, 1A to 1D, 1A_1 to 1A_5) described in configuration 1, wherein after the autonomous mobile robot (210) reaches the second target position and posture, the first mechanism (220) executes a first distribution operation to distribute the item to be conveyed to the target device.

[0354] (Configuration 3) Further provided is a storage (600) capable of storing a plurality of items (5, 5A to 5D), The storage (600) has a second mechanism (62) that retrieves designated items (5, 5A to 5D), the first target position and posture is determined according to the location of the item (5, 5A to 5D) retrieved from the storage (600); The conveyance system (1, 1A to 1D, 1A_1 to 1A_5) according to configuration 2, wherein the instruction unit (100, 100_1 to 100_4) further includes a second output unit (15, 101) that outputs a retrieval instruction for the article to be conveyed to the storage (5, 5A to 5D).

[0355] (Configuration 4) Further provided is a shelf (500) on which a plurality of articles (5, 5A to 5D) can be placed, The shelf (500) A plurality of placement sections (51a to 51c), a first management unit (53) that manages management information (55) that associates each of the plurality of placement units (51a to 51c) with the type of the article (5, 5A to 5D) placed thereon, the first target position and posture is determined according to a target placement unit among the plurality of placement units on which an article (5, 5A to 5D) of a type identified by the first identification information is placed; 3. The transfer system (1A_1, 1A_2) according to configuration 2, wherein the target receiver is identified from among the plurality of receivers (51a to 51c) based on the management information (55).

[0356] (Configuration 5) Further provided is a storage (600) capable of storing a plurality of items (5, 5A to 5D), The storage (600) a second management section (63) for managing the types of the stored items (5, 5A to 5D); a second mechanism (62) for retrieving the designated item (5, 5A to 5D); the shelf (500) further includes a detection unit (52a-52c) that detects whether each of the plurality of placement sections (51a-51c) is in a first state in which an article (5, 5A-5D) is placed thereon or a second state in which no article (5, 5A-5D) is placed thereon; The conveying system (1A_1, 1A_2) according to configuration 4, wherein after the second mechanism (62) completes the retrieval of the specified item (5, 5A to 5D), the first management unit (53) updates the management information (55) so that the type of the specified item corresponds to the first one of the plurality of placement units (51a to 51c) that changes from the second state to the first state.

[0357] (Configuration 6) The conveying system (1A_2) according to configuration 5 further comprises a third mechanism (91) that moves the items (5, 5A to 5D) removed from the storage (600) to one of the plurality of placement sections (51a to 51c) that is in the second state.

[0358] (Configuration 7) The control unit (22 to 24, 22_1, 201) After the autonomous mobile robot (210) has reached the second target position and posture, and before the first mechanism (220) is caused to execute the first distribution operation, the first mechanism (220) is caused to execute a second collection operation to collect the items (5, 5A to 5D) that have been placed on the target device and that have undergone the predetermined process; After the first distribution operation is completed, the autonomous mobile robot (210) is moved to a third target position and posture corresponding to a distribution location (1000) of the item (5, 5A to 5D) for which the predetermined process has been performed; A conveying system (1A_3) according to any one of configurations 2 to 6, wherein after the autonomous mobile robot (210) reaches the third target position and posture, the first mechanism (220) executes a second distribution operation to distribute the items (5, 5A to 5D) on which the specified processing has been performed to the distribution location.

[0359] (Configuration 8) a server (700) that outputs an instruction to execute the predetermined process on the items (5, 5A to 5D) to be transported to the instruction unit (100, 100_1 to 100_3) according to a production plan; The conveyance system (1A_4) according to any one of configurations 1 to 7, wherein the server (700) modifies the production plan based on the second identification information to reduce the replacement frequency of the tools (350, 350A to 350C) in the plurality of devices (300, 300A to 300C, 300A_1).

[0360] (Configuration 9) Each of the plurality of devices (300A_1, 300D) is movable, The transfer system (1A_5, 1D) according to configuration 2, wherein the second target position and posture is determined according to the position and posture of the target device.

[0361] (Configuration 10) Each of the plurality of devices (300A_1, 300D) has a mark provided at a predetermined position, The transport robot (200) further includes a camera; The control unit (22 to 24, 22_1, 201) calculating the position of the mark based on an image captured by the camera after the autonomous mobile robot (210) has reached the second target position and orientation; The transport system (1A_5, 1D) according to configuration 9, wherein the first distribution operation is corrected by the difference between the calculated position of the mark and a reference position.

[0362] (Configuration 11) Each of the plurality of devices (300A_1, 300D) has a feature provided at a predetermined position, The transfer robot (200) further includes a sensor that detects the position of the feature; The control unit (22 to 24, 22_1, 201) A transport system (1A_5, 1D) described in configuration 9, which adjusts the position and posture of the autonomous mobile robot (210) by the difference between the position detected by the sensor and a reference position when the autonomous mobile robot (210) reaches the second target position and posture.

[0363] (Configuration 12) The article is a part (5B) constituting a product, The tool is a tray (350B) for storing the parts, 12. The conveying system (1B) according to any one of configurations 1 to 11, wherein the product is assembled in the device (300B) using the parts (5B) contained in the tray (350B).

[0364] (Configuration 13) The tool is a jig (350C) for fixing the article, 12. The conveyance system (1C) according to any one of configurations 1 to 11, wherein the device (300C) evaluates the performance of the item (5B) fixed by the jig (350C).

[0365] (Configuration 14) the article is a seedling (5D), The tool is a planting claw (350D) for planting the seedling (5D), 12. A transport system (1D) according to any one of configurations 1 to 11, wherein the device plants the seedlings (5D) using the planting claws (350D).

[0366] (Configuration 15) A conveying method in a conveying system (1, 1A to 1D, 1A_1 to 1A_5), The conveyance system (1, 1A to 1D, 1A_1 to 1A_5) A plurality of devices (300, 300A to 300D) that perform predetermined processing on articles (5, 5A to 5D); a transport robot (200, 200_1); Each of the plurality of devices (300, 300A to 300D) is provided with a type of device arbitrarily selected from a plurality of types of devices (350, 350A to 350D), In each of the plurality of devices (300, 300A to 300D), the predetermined process is performed using the installed device (350, 350A to 350D), The transport method includes: A step of acquiring first identification information that identifies the type of the item (5, 5A to 5D) to be conveyed; A step of acquiring second identification information that identifies the type of the appliance (350, 350A to 350D) installed in each of the plurality of devices (300, 300A to 300D); using association information (132b) that associates the type of the item (5, 5A to 5D) with the type of the item (350, 350A to 350D) for performing the predetermined process on the item (5, 5A to 5D) of that type, to identify the type of the tool (350, 350A to 350D) associated with the item identified by the first identification information; a step of selecting, as a target device, a device in which a specified type of appliance (350, 350A to 350D) is installed from among the plurality of devices (300, 300A to 300D) using the second identification information; a step of outputting a transfer instruction to the transfer robot (200, 200_1) to transfer the item (5, 5A to 5D) to be transferred to the target device.

[0367] Although the embodiments of the present invention have been described, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, and it is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0368] 1,1A~1D Conveying system, 5 Item, 5A Semiconductor wafer set, 5B Part, 5C Product, 5D Seedling, 6a Semiconductor wafer, 6b Cassette, 11 First acquisition unit, 12,12_4 Second acquisition unit, 12_3 Inspection equipment management unit, 13,13_1~13_4 Control unit, 14 Automatic conveying instruction unit, 15 Delivery instruction unit, 16 Tool replacement instruction unit, 17 Third acquisition unit, 18 Fourth acquisition unit, 21,34A~34D Communication unit, 22,22_1 Integrated control unit, 23,39 Travel control unit, 24 Upper object control unit, 31A Tool mounting mechanism, 31D Tool fixing unit, 32A~32D Tool management unit, 33A Inspection unit, 33B Assembly unit, 33C Evaluation unit, 33D Planting unit, 35D,211,374 Position and orientation sensor, 36 Information acquisition unit, 37 Communication control unit, 38 Wireless communication unit, 51a to 51c Placement unit, 52a to 52c Detection unit, 53 Placement database management unit, 54 Delivery information acquisition unit, 55 Placement database, 61 Storage database, 62 Intake / out mechanism, 63, 93 Controller, 64 Unit, 65 Storage space, 71 Production plan database, 72 Command unit, 91 Pick-and-place mechanism, 92, 234 Teaching database, 100, 100_1 to 100_4 Instruction server, 101, 201, 371 Processor, 102, 202, 372 Memory, 103, 203, 373 Storage, 104, 377 Communication interface, 105, 206, 378 Wireless communication interface, 131 Transport instruction program, 132 Database group, 132a, 132c, 132d, 132e position database, 132b association information, 133 identification unit, 134 selection unit, 200, 200_1 transport robot, 204, 207 inventory sensor, 205, 208 rack, 210, 370 autonomous traveling robot, 212, 375 drive unit, 213, 376 wheel, 220 manipulator, 231, 380 travel control program, 232 manipulator control program, 233 integrated control program, 235 inventory information storage unit, 300 device, 300A inspection device, 300B workbench, 300C evaluation device, 300D rice transplanter, 350 implement, 350A probe card, 350B dedicated tray, 350C fixing jig, 350D planting claw, 381 Communication control program, 500 Temporary shelf, 6001000 storage facilities, 700 MES servers, 800 terminals, 900 transfer robots.

Claims

1. A conveying system comprising: a plurality of devices that perform predetermined processes on articles; A transport robot, an indicator; Each of the plurality of devices is equipped with a type of instrument arbitrarily selected from a plurality of types of instruments, In each of the plurality of devices, the predetermined process is performed using the installed device; The instruction unit a first acquisition unit that acquires first identification information that identifies the type of the item to be conveyed; a second acquisition unit that acquires second identification information that identifies the type of the appliance installed in each of the plurality of devices; an identification unit that identifies the type of tool associated with the product type identified by the first identification information, using association information that associates the product type with the type of tool used to perform the predetermined process on the product type; a selection unit that uses the second identification information to select, from the plurality of devices, a device in which a specified type of appliance is installed as a target device; a first output unit that outputs a transport instruction to the transport robot to transport the item to be transported to the target device.

2. The transport robot is An autonomous robot and a first mechanism mounted on the autonomous mobile robot and configured to transfer the item; a control unit that controls the autonomous traveling robot and the first mechanism, In response to the transport instruction, the control unit: moving the autonomous mobile robot to a first target position and posture corresponding to a collection location of the item to be transported; causing the first mechanism to execute a first retrieval operation to retrieve the item to be transported after the autonomous mobile robot has reached the first target position and posture; After the first retrieval operation is completed, the autonomous mobile robot is moved to a second target position and posture corresponding to the target device; The conveying system according to claim 1 , further comprising: causing the first mechanism to execute a first delivery operation to deliver the item to be conveyed to the target device after the autonomous mobile robot reaches the second target position and posture.

3. Further provided with a storage unit capable of storing a plurality of items, the storage facility has a second mechanism for retrieving designated items; the first target position and posture is determined according to a location of the item retrieved from the storage facility; The transport system according to claim 2 , wherein the instruction unit further includes a second output unit that outputs a retrieval instruction for the item to be transported to the storage warehouse.

4. Further provided with a shelf on which a plurality of articles can be placed, The shelf is A plurality of placement units; a first management unit that manages management information that associates each of the plurality of placement units with the type of the item placed thereon, the first target position and posture is determined according to a target placement unit among the plurality of placement units on which an article of a type identified by the first identification information is placed; The transport system according to claim 2 , wherein the target receiver is identified from among the plurality of receivers based on the management information.

5. Further provided with a storage unit capable of storing a plurality of items, The storage facility includes: a second management unit that manages the types of each stored item; a second mechanism for retrieving the designated item; the shelf further includes a detection unit that detects whether each of the plurality of placement sections is in a first state in which an item is placed thereon or a second state in which no item is placed thereon, 5. The conveying system according to claim 4, wherein the first management unit updates the management information so that the type of the specified item corresponds to the first one of the plurality of placement units that changes from the second state to the first state after the second mechanism has completed retrieving the specified item.

6. The conveyance system according to claim 5 , further comprising a third mechanism that moves the article retrieved from the storage facility to one of the plurality of mounting sections that is in the second state.

7. The control unit After the autonomous mobile robot has reached the second target position and orientation and before the first mechanism is caused to execute the first distribution operation, the second collection operation is caused to be performed by the first mechanism, the second collection operation being caused to be performed by the first mechanism to collect the item that has been placed on the target device and that has undergone the predetermined process; After the first distribution operation is completed, the autonomous mobile robot is moved to a third target position and posture corresponding to a distribution location of the item for which the predetermined process has been performed; 7. The conveying system according to claim 2, wherein after the autonomous mobile robot reaches the third target position and orientation, the first mechanism executes a second distribution operation to distribute the item on which the specified processing has been performed to the distribution location.

8. a server that outputs to the instruction unit an instruction to perform the predetermined process on the item to be transported in accordance with a production plan; The transport system according to claim 1 , wherein the server modifies the production plan based on the second identification information so as to reduce the frequency of replacement of the tools in the plurality of machines.

9. each of the plurality of devices is movable; The transfer system according to claim 2 , wherein the second target position and orientation are determined in accordance with the position and orientation of the target device.

10. each of the plurality of devices has a mark provided at a predetermined position; the transport robot further includes a camera; The control unit calculating the position of the mark based on an image captured by the camera after the autonomous mobile robot has reached the second target position and orientation; The transport system according to claim 9 , wherein the first distribution operation is corrected by a difference between the calculated position of the mark and a reference position.

11. each of the plurality of devices has a feature provided at a predetermined position; the transfer robot further includes a sensor that detects the position of the feature; The control unit 10. The transport system according to claim 9, wherein the position and posture of the autonomous mobile robot are adjusted by a difference between a position detected by the sensor and a reference position when the autonomous mobile robot reaches the second target position and posture.

12. The article is a component that constitutes a product, the tool is a tray for containing the part; The conveyance system according to claim 1 , wherein the product is assembled in the device using the parts contained in the tray.

13. the tool is a jig for fixing the article, The transport system according to claim 1 , wherein the device evaluates the performance of the article fixed by the jig.

14. the article is a seedling; the tool is a planting claw for planting the seedling, The transport system according to claim 1 , wherein the device plants the seedlings using the planting claws.

15. A transport method in a transport system, comprising: The transport system includes: a plurality of devices that perform predetermined processes on articles; a transport robot, Each of the plurality of devices is equipped with a type of instrument arbitrarily selected from a plurality of types of instruments, In each of the plurality of devices, the predetermined process is performed using the installed device; The transport method includes: acquiring first identification information that identifies the type of the item to be transported; obtaining second identification information that identifies the type of the appliance installed in each of the plurality of devices; identifying a type of tool associated with the product type identified by the first identification information, using association information that associates the product type with the type of tool used to perform the predetermined process on the product type; selecting, from the plurality of devices, a device in which a specified type of appliance is installed as a target device using the second identification information; and outputting a transport instruction to the transport robot to transport the item to be transported to the target device.

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