earphones

Abstract

An embodiment of the present specification provides an earphone, the earphone including: a sound generating unit including a transducer including a diaphragm that generates sound under the action of an excitation signal, and a housing forming a cavity to accommodate the transducer; and a hanging structure for mounting the sound generating unit in a position near the ear canal but not blocking the ear canal when worn; a sound emission hole is formed on an inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the ear canal; and a first decompression hole is formed on another side of the housing, which guides sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface.

Description

[Technical Field]

[0001] This application relates to the field of acoustics, and more particularly to earphones.

[0002] [Incorporated by reference] This application claims priority to a Chinese application bearing application number 202211336918.4 filed on October 28, 2022, priority to a Chinese application bearing application number 202223239628.6 filed on December 1, 2022, priority to an international application bearing application number PCT / CN2022 / 144339 filed on December 30, 2022, priority to an international application bearing application number PCT / CN2023 / 079411 filed on March 2, 2023, priority to an international application bearing application number PCT / CN2023 / 079404 filed on March 2, 2023, and priority to an international application bearing application number PCT / CN2023 / 079410 filed on March 2, 2023, the entire contents of which are incorporated herein by reference. [Background technology]

[0003] With the development of audio output technology, audio devices (e.g., earphones) have been widely applied in people's daily lives, and can provide users with an auditory feast when used in combination with electronic devices such as mobile phones and computers. Depending on the user's wearing style, audio devices can generally be divided into in-ear type, head-mounted type, ear-hook type, etc.

[0004] Therefore, there is a need to provide earphones that can improve the wearing comfort of users and have excellent output performance. Summary of the Invention

[0005] The earphones according to the embodiments of the present application include a sound generating unit including a transducer including a diaphragm that generates sound under the action of an excitation signal, and a housing that forms a cavity to accommodate the transducer, and a hanging structure that, when worn, attaches the sound generating unit near the ear canal in a position that does not block the ear canal, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the ear canal, and a first decompression hole is formed on another side of the housing, which guides sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface.

[0006] In some embodiments, the ratio of the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface to the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface is in the range of 1.3 to 2.1.

[0007] In some embodiments, the ratio of the area of ​​the sound emitting holes to the depth of the sound emitting holes to the ratio of the area of ​​the first decompression holes to the depth of the first decompression holes is in the range of 1.10 to 1.75.

[0008] In some embodiments, the ratio of the area of ​​the sound release hole to the area of ​​the first decompression hole is in the range of 0.5 to 1.5.

[0009] In some embodiments, when worn, the ratio of the distance from the projection of the center of the sound emission hole onto the sagittal plane to the centroid of the projection of the auditory canal opening onto the sagittal plane to the distance from the projection of the center of the first decompression hole onto the sagittal plane to the centroid of the projection of the auditory canal opening onto the sagittal plane is within the range of 0.10 to 0.35.

[0010] In some embodiments, the suspension structure includes an ear hook, and in a worn state, a first portion of the ear hook is hung between the user's auricle and head, and a second portion of the ear hook extends on the side of the auricle facing away from the head and is connected to the sound generating unit, and the ratio of the distance from the center of the sound emission hole to the top vertex of the ear hook to the distance from the center of the first pressure reduction hole to the top vertex of the ear hook is in the range of 1.10 to 1.70.

[0011] In some embodiments, the transducer further includes a magnetic circuit assembly that provides a magnetic field, and the absolute value of the difference between the distance from the center of the sound emission hole to the longitudinal center plane of the magnetic circuit assembly and the distance from the center of the first decompression hole to the longitudinal center plane is within a range of 4.0 mm to 6.1 mm.

[0012] In some embodiments, the difference between the distance from the center of the sound emission hole to the bottom surface of the magnetic circuit assembly and the distance from the center of the first decompression hole to the bottom surface of the magnetic circuit assembly is within a range of 3.65 mm to 7.05 mm.

[0013] In some embodiments, a second decompression hole is further formed on another side surface of the housing, and the area of ​​the first decompression hole is larger than the area of ​​the second decompression hole.

[0014] In some embodiments, the distance from the center of the sound emission hole to the perpendicular bisector of the line connecting the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

[0015] In some embodiments, the first vacuum hole is formed in an upper surface of the housing and the second vacuum hole is formed in a lower surface of the housing.

[0016] In some embodiments, when the device is worn, the ratio of the distance from the projection of the center of the sound emission hole onto the sagittal plane to the projection of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection of the center of the second decompression hole onto the sagittal plane to the projection of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane is within the range of 0.65 to 1.05.

[0017] In some embodiments, the angle between the line connecting the center of the sound emitting hole to the center of the first decompression hole and the line connecting the center of the sound emitting hole to the center of the second decompression hole is within the range of 46.40° to 114.04°.

[0018] In some embodiments, the ratio of the distance from the center of the sound emission hole to the center of the first decompression hole to the distance from the center of the sound emission hole to the center of the second decompression hole is in the range of 0.9 to 1.1.

[0019] In some embodiments, the ratio of the area of ​​the sound release hole to the total area of ​​the first decompression hole and the second decompression hole is in the range of 0.1 to 0.99.

[0020] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the volume of the rear cavity to the volume of the front cavity is in the range of 0.1-10.

[0021] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the resonant frequency of the front cavity to the resonant frequency of the rear cavity is in the range of 0.1 to 5.

[0022] In some embodiments, the ratio of the area of ​​the sound release hole to the total area of ​​the first decompression hole and the second decompression hole is in the range of 1-10.

[0023] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the volume of the rear cavity to the volume of the front cavity is in the range of 0.1-10.

[0024] In some embodiments, the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front and rear sides of the diaphragm, respectively, and the ratio of the resonant frequency of the front cavity to the resonant frequency of the rear cavity is in the range of 0.5-10.

[0025] In some embodiments, the ratio of the sound pressure at the sound output hole to the total sound pressure at the first and second decompression holes is in the range of 0.4 to 0.6.

[0026] In some embodiments, the ratio of the difference between the area of ​​the first decompression hole and the area of ​​the second decompression hole to the area of ​​the sound release hole is in the range of 2.5 to 3.9.

[0027] In some embodiments, an acoustic resistance mesh is installed in at least one of the first decompression hole and the second decompression hole in the sound emission hole, and the thickness of the acoustic resistance mesh is in the range of 40 μm to 150 μm.

[0028] In some embodiments, the acoustically resistive mesh in the sound emission hole comprises a steel mesh, and the mesh number of the steel mesh is in the range of 60-100.

[0029] In some embodiments, the acoustically resistive mesh in the sound emission hole comprises a steel mesh, and the mesh number of the steel mesh is in the range of 70-90.

[0030] The present application will be further illustrated by exemplary embodiments, which are not limiting and will be described in detail with reference to the drawings, in which like numbers refer to like structures. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic diagram of an exemplary ear according to some embodiments herein. [Figure 2] 1 is an exemplary structural diagram of an earphone according to some embodiments of the present disclosure. [Figure 3] 1 is a schematic diagram of two point sound sources and a listening position according to some embodiments of the present disclosure. [Figure 4] FIG. 10 is a comparison diagram of sound leakage index at different frequencies for a single point sound source and dual point sound sources, in accordance with certain embodiments herein. [Figure 5] FIG. 10 is an exemplary distribution diagram of a dipole sound source with a baffle placed between two sources, according to some embodiments herein. [Figure 6]FIG. 10 illustrates a sound leakage index for a dipole sound source with and without a baffle between the two sources, in accordance with some embodiments herein. [Figure 7] 1 is an exemplary schematic view of an open-type earphone according to some embodiments of the present disclosure; FIG. [Figure 8] FIG. 8 is a schematic diagram of the open-type earphone shown in FIG. 7, showing the side facing the ear. [Figure 9] FIG. 8 is a schematic diagram of the housing of the open-type earphone shown in FIG. 7. [Figure 10] FIG. 10 is an exemplary distribution diagram of a cavity structure placed around one of the dipole sound sources, according to some embodiments herein. [Figure 11A] 1 is a schematic diagram of a dipole source structure and a listening principle when a cavity structure is configured around one of the dipole sources, according to some embodiments of the present disclosure; FIG. [Figure 11B] 1 is a schematic diagram of a dipole source structure and the principle of sound leakage when a cavity structure is configured around one of the dipole sources, according to some embodiments herein; FIG. [Figure 12A] 1 is a schematic diagram of a cavity structure with two horizontal openings, according to some embodiments herein. [Figure 12B] 1 is a schematic diagram of a cavity structure with two vertical openings, according to some embodiments herein. [Figure 13] 10A and 10B are diagrams illustrating a comparison of listening index curves for a two-opening cavity structure and a single-opening cavity structure, according to some embodiments herein. [Figure 14] 10A and 10B are schematic diagrams illustrating exemplary wearing of open-type earphones according to some other embodiments of the present application. [Figure 15] FIG. 15 is a schematic diagram of the ear side of the open-type earphone shown in FIG. 14. [Figure 16] FIG. 1 is a schematic diagram of a sagittal plane projection of an open-type earphone in a worn state, in accordance with some embodiments herein. [Figure 17]FIG. 1 is a schematic diagram of a housing of an open-type earphone according to some embodiments of the present disclosure. [Figure 18] 10 is a contour map of the volume ratio of the front cavity to the rear cavity, and the ratio of the opening area of ​​the sound emission holes to the opening area of ​​the decompression holes, according to some embodiments herein. [Figure 19] 10A-10C are frequency response curve diagrams corresponding to different volume levels at the sound outlet, according to some embodiments herein. [Figure 20] 10A-10C illustrate frequency response curves corresponding to different volumes at the first decompression hole, according to some embodiments herein. [Figure 21] 10A-10C are frequency response curve diagrams corresponding to different volumes at the second decompression hole, according to some embodiments herein. [Figure 22] FIG. 2 is an exemplary internal structural diagram of a sound generating unit according to some embodiments of the present disclosure. [Figure 23] 1 is a diagram illustrating an example internal structure of a transducer according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0032] In order to more clearly describe the technical means of the embodiments of the present application, the drawings necessary for describing the embodiments will be briefly described below. Obviously, the drawings described below are only examples or parts of the embodiments of the present application, and those skilled in the art can apply the present application to other similar scenarios based on these drawings without any creative effort. Unless otherwise clear from the context or described otherwise, the same symbols in the drawings represent the same structures or operations.

[0033] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are ways of distinguishing between various assemblies, elements, components, parts, or structures at different levels, however, other terms may be used in place of the above terms if they achieve the same purpose.

[0034] As used herein and in the claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "containing" merely indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not an exclusive listing; a method or apparatus may also include other steps or elements.

[0035] It should be noted that in the description herein, the terms "first," "second," "third," "fourth," etc. are used for descriptive purposes only and should not be understood to denote or suggest relative importance or to implicitly denote the quantity of the depicted technical features. Therefore, a feature qualified by "first," "second," "third," or "fourth" can explicitly or implicitly denote the inclusion of at least one of the feature. In the description herein, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0036] In this specification, unless otherwise clearly specified or limited, the terms "connected," "fixed," etc. should be understood in a broad sense. For example, unless otherwise clearly limited, the term "connected" may mean a fixed connection, a detachable connection, or an integral connection, a mechanical connection, or an electrical connection, a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art will be able to understand the specific meanings of the above terms in this specification according to specific circumstances.

[0037] In this specification, unless otherwise clearly specified or limited, the distance from a specific point to a line or a surface may refer to the shortest distance from the specific point to the line or surface.

[0038] FIG. 1 is a schematic diagram of an exemplary ear unit according to some embodiments of the present application. As shown in FIG. 1 , the ear unit 100 (also referred to as the pinna) may include an external auditory canal 101, a concha cavity 102, a concha navicularis 103, a triangular fossa 104, an antihelix 105, a scapha 106, a helix 107, an earlobe 108, a tragus 109, and a crus helix 1071. In some embodiments, an acoustic device can be stably worn by being supported by one or more parts of the ear unit 100. In some embodiments, parts such as the external auditory canal 101, the concha cavity 102, the concha navicularis 103, and the triangular fossa 104 have a certain depth and volume in three-dimensional space, which can meet the wearing needs of the acoustic device. For example, an acoustic device (e.g., an in-ear earphone) may be worn in the external auditory canal 101. In some embodiments, the acoustic device can be worn in parts of the ear unit 100 other than the external auditory canal 101. For example, the acoustic device can be attached to the concha scapha 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, or a combination thereof. In some embodiments, to improve comfort and reliability when wearing the acoustic device, the acoustic device can be attached to the user's earlobe 108 or other locations. By attaching the acoustic device and transmitting sound through a location other than the ear canal 101 of the ear unit 100, the user's ear canal 101 can be "opened." When a user wears the acoustic device, the acoustic device does not block the user's ear canal 101 (or ear canal or ear canal opening). This allows the user to receive not only sound from the acoustic device but also sound from the environment (e.g., horns, bicycle bells, voices of people around, traffic control, etc.), thereby reducing the likelihood of traffic accidents. In this specification, an acoustic device that does not block the user's ear canal 101 (or ear canal or ear canal opening) when worn by a user may be referred to as an earphone. In some embodiments, based on the structure of the ear portion 100, the acoustic device can be designed to have a structure that fits the ear portion 100, allowing the sound-generating portion of the acoustic device to be worn at different positions on the ear portion.For example, if the acoustic device is an earphone, the earphone may include a suspension structure (e.g., an ear hook) and an audio generating unit, the audio generating unit and the suspension structure may be physically connected, and the suspension structure may conform to the shape of the pinna so that the entire or a portion of the audio generating unit is located in front of the tragus 109 (e.g., area J surrounded by the dotted line in FIG. 1). Also, for example, when a user wears the earphone, the entire or a portion of the audio generating unit may contact the upper part of the ear canal 101 (e.g., the location of one or more parts such as the concha navicularis 103, the triangular fossa 104, the antihelix 105, the scapha 106, the helix 107, and the crus helix 1071). Also, for example, when a user is wearing earphones, the entire or partial structure of the sound generating unit may be located within a cavity formed by one or more parts of the ear unit 100 (e.g., the concha 102, the concha navicularis 103, the triangular fossa 104, etc.) (e.g., the area M1 surrounded by the dotted line in Figure 1, which includes at least the concha navicularis 103 and the triangular fossa 104, and the area M2 including at least the concha navicularis 102).

[0039] Because there may be individual differences among different users, ears may have different shapes, sizes, and other dimensions. For ease of explanation and understanding, unless otherwise specified, this specification primarily uses an ear model having a "standard" shape and dimensions as a reference, and further describes the wearing method of the acoustic device on the ear model in different embodiments. For example, a simulator including a head and its (left and right) ears manufactured in accordance with ANSI: S3.36, S3.25, and IEC: 60318-7 standards, such as the GRAS 45BC KEMAR, can be used as a reference for wearing an acoustic device and can present a scenario in which most users normally wear an acoustic device. By way of example only, the reference ear may have the relevant characteristics that the projection of the pinna on the sagittal plane in the vertical axis direction is within a range of 49.5 mm to 74.3 mm, and the projection of the pinna on the sagittal plane in the sagittal axis direction is within a range of 36.6 mm to 55 mm. Therefore, in this application, the terms "worn by a user," "in a worn state," and "in a worn state" may refer to the acoustic device described herein being worn in the ear section of the simulator. Naturally, in consideration of individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear section 100 may have certain differences, and the acoustic device may be designed differently to meet the needs of different users. These differentiated designs may be adapted to different ear sections by having different ranges of value for characteristic parameters of one or more parts of the acoustic device (e.g., the sound generating section, ear hook, etc.)

[0040] In fields such as medicine and anatomy, three basic cutting planes of the human body—the sagittal plane, the coronal plane, and the horizontal plane—and three basic axes—the sagittal axis, the coronal axis, and the vertical axis—can be defined. The sagittal plane refers to a cutting plane perpendicular to the ground along the front-to-back direction of the body, dividing the body into two parts, the left and the right. The coronal plane refers to a cutting plane perpendicular to the ground along the left-to-right direction of the body, dividing the body into two parts, the front and the back. The horizontal plane refers to a cutting plane parallel to the ground along the up-down direction of the body, dividing the body into two parts, the top and the bottom. Accordingly, the sagittal axis refers to an axis perpendicular to the coronal plane along the front-to-back direction of the body, the coronal axis refers to an axis perpendicular to the sagittal plane along the left-to-right direction of the body, and the vertical axis refers to an axis perpendicular to the horizontal plane along the up-down direction of the body. Furthermore, the "front side of the ear" described in this application is a concept opposite to the "rear side of the ear," the former referring to the side of the ear facing away from the head, and the latter referring to the side of the ear facing toward the head. When the ear of the simulator is observed along the direction of the coronal axis of the human body, a schematic diagram of the front profile of the ear is obtained as shown in Figure 1.

[0041] FIG. 2 is an exemplary structural diagram of an earphone according to some embodiments of the present disclosure.

[0042] In some embodiments, the earphones 10 may include, but are not limited to, air conduction earphones, combined bone conduction and air conduction earphones, etc. In some embodiments, the earphones 10 may be combined with products such as glasses, headphones, head-mounted displays, AR / VR helmets, etc.

[0043] As shown in FIG. 2, the earphone 10 may include a sound generating unit 11 and an ear hook 12.

[0044] The sound generating unit 11 may be worn on the user's body and may generate sound and input it into the user's ear canal. In some embodiments, the sound generating unit 11 may include a transducer (e.g., transducer 116 shown in FIG. 22 ) and a housing 111 that houses the transducer. The housing 111 may be connected to the ear hook 12. The transducer converts an excitation signal (e.g., an electrical signal) into a corresponding mechanical vibration to generate sound. In some embodiments, a sound emission hole 112 is formed on the side of the housing facing the pinna, and the sound emission hole 112 guides the sound generated by the transducer from the housing 111 to the ear canal so that the user can hear the sound. In some embodiments, a transducer (e.g., a diaphragm) can divide the housing 111 into a front cavity (e.g., front cavity 114 shown in FIG. 22 ) and a rear cavity of the earphone, and the sound output hole 112 communicates with the front cavity and can guide sound generated in the front cavity out of the housing 111 and transmit it to the ear canal. In some embodiments, a portion of the sound guided through the sound output hole 112 is transmitted to the ear canal so that the user can hear the sound, and another portion, together with sound reflected in the ear canal, can be transmitted to the outside of the earphone 10 and the ear unit through a gap between the sound-generating unit 11 and the ear unit (e.g., a portion of the concha not covered by the sound-generating unit 11), thereby forming a first sound leakage in the far field. At the same time, one or more decompression holes 113 (e.g., a first decompression hole 1131) are typically formed on another side of the housing 111 (e.g., a side facing away from the user's ear canal or a side facing away from the ear canal). The decompression hole 113 is farther from the ear canal than the sound emission hole 112, and the sound transmitted from the decompression hole 113 usually forms a second sound leakage in the far field, the intensity of the first sound leakage is equal to the intensity of the second sound leakage, and the phase of the first sound leakage is (substantially) opposite to the phase of the second sound leakage, so that the two are canceled out in the far field, which is advantageous for reducing sound leakage in the far field of the earphone 10.In some embodiments, at least two decompression holes 113 may be formed on other sides of the housing 111 in addition to the side facing the auricle. Providing at least two decompression holes 113 not only allows sound generated in the rear cavity to be guided out of the housing 111, but also breaks up the high-pressure region of the sound field within the rear cavity, thereby shortening the wavelength of standing waves within the rear cavity and increasing the resonant frequency of the sound guided out of the housing 111 from the decompression holes 113 as high as possible, for example, greater than 4 kHz. In this case, the sound guided out of the sound output holes 112 and the sound guided out of the sound output holes 113 can maintain good consistency over a wider frequency range, thereby enhancing the effect of interference cancellation between the two in the far-field and achieving a greater sound leakage reduction effect. For ease of explanation, this specification will exemplarily describe an example in which two decompression holes are provided in the sound generating unit 11. For example, the at least two decompression holes 113 may include a first decompression hole and a second decompression hole (e.g., first decompression hole 1131 and second decompression hole 1132 in FIG. 7 or FIG. 14 ), and the two decompression holes 113 may be located on opposite sides of the housing 111, respectively, to maximize the collapse of the high-pressure region of the sound field in the rear cavity, for example, arranged back to back in the short axis direction Y. Simply put, when a user wears the earphone 10, what is mainly heard is sound transmitted to the ear canal through the sound emitting holes 112, and the decompression holes 113 are arranged mainly to balance the pressure in the rear cavity so that they can vibrate sufficiently at low frequencies and large amplitudes, thereby making the sound sound as deep as possible in the bass and clear in the treble, and reducing sound leaking into the environment through the sound emitting holes 112. For more detailed descriptions of the sound generating unit 11, please refer to other portions of this specification, such as FIG. 7 , FIG. 14 , FIG. 22 , etc., and the descriptions thereof.

[0045] The ear hook 12 may have one end connected to the sound generating unit 11 and the other end extending along the boundary between the user's ear and head. In some embodiments, the ear hook 12 may have an arc-shaped structure that fits the boundary between the user's ear and head so that it can be hung from the user's ear. For example, the ear hook 12 may have an arc-shaped structure that fits the boundary between the user's head and ear so that it can be hung between the user's ear and head. In some embodiments, the ear hook 12 may have a clipping structure that fits the user's ear so that it can be clipped to the user's ear. Exemplarily, the ear hook 12 may include a hook-shaped portion (first portion 121 shown in FIG. 7 ) and a connecting portion (second portion 122 shown in FIG. 7 ) that are connected in sequence. The connecting portion connects the hook-shaped portion to the sound generating unit 11 so that the earphone 10 assumes a curved shape in three-dimensional space when in an unworn state (i.e., natural state). In other words, in three-dimensional space, the hook-shaped portion, the connecting portion, and the sound-generating unit 11 are not on the same plane. By arranging them in this manner, when the earphone 10 is worn, the hook-shaped portion may be primarily hooked between the back of the user's ear and the head, and the sound-generating unit 11 may be primarily in contact with the front of the user's ear, thereby allowing the sound-generating unit 11 and the hook-shaped portion to engage and hold the ear. For example, the connecting portion may extend from the head to the outside of the head and further engage with the hook-shaped portion to apply a pressing force to the sound-generating unit 11 toward the front of the ear. Under the action of a pressing force, the sound-generating unit 11 may be pressed against areas, such as the cavity of the concha 102, the navicularis concha 103, the triangular fossa 104, and the antihelix 105, so as not to block the ear canal 101 of the ear when the earphone 10 is worn.

[0046] In some embodiments, to improve the stability of the earphone 10 when worn, the earphone 10 can use any one of the following methods or a combination thereof. In method 1, at least a portion of the ear hook 12 is arranged as a mimicking structure that fits to at least one of the back of the ear unit 100 and the head to increase the contact area between the ear hook 12 and the ear unit 100 and / or the head, thereby increasing the resistance of the earphone 10 to being removed from the ear unit 100. In method 2, at least a portion of the ear hook 12 is arranged as an elastic structure that has a certain amount of deformation when worn, thereby increasing the positive pressure applied by the ear hook 12 to the ear unit and / or the head, thereby increasing the resistance of the earphone 10 to being removed from the ear unit. In method 3, at least a portion of the ear hook 12 is arranged to abut the head when worn and generate a reaction force that presses against the ear unit, thereby pressing the sound generating unit 11 toward the front of the ear unit, thereby increasing the resistance of the earphone 10 to being removed from the ear unit. In method 4, the sound generating unit 11 and ear hook 12 are installed so as to clamp the area where the antihelix is ​​located, the area where the concha is located, etc. from both the front and back of the ear when worn, thereby increasing the resistance to the earphone 10 being removed from the ear. In method 5, the sound generating unit 11 or the auxiliary structure connected to it is installed so that at least a portion thereof enters a cavity such as the concha cavity, the navicular fossa, the triangular fossa, and the scaphoid fossa, thereby increasing the resistance to the earphone 10 being removed from the ear.

[0047] In some embodiments, the ear hook 12 may include, but is not limited to, an ear hook, an elastic band, etc., to better secure the earphone 10 to the user and prevent it from coming off during use by the user. In some embodiments, the earphone 10 may not include an ear hook 12, and the sound generating unit 11 may be fixed near the user's ear unit 100 in a hanging or clamping manner.

[0048] In some embodiments, the sound-generating unit 11 may have a regular or irregular shape, such as a ring shape, an ellipse shape, a racetrack shape, a polygonal shape, a U-shape, a V-shape, or a semicircle shape, so that it can be directly hung on the user's ear unit 100. In some embodiments, the sound-generating unit 11 may have a major axis direction X and a minor axis direction Y that are perpendicular to the thickness direction Z and are orthogonal to each other. The major axis direction X can be defined as the direction in which the extension dimension is greatest in the shape of a two-dimensional projection surface of the sound-generating unit 11 (e.g., a projection of the sound-generating unit 11 onto a plane on which its outer surface is located, or a projection onto a sagittal plane) (e.g., when the projection shape is rectangular or approximately rectangular, the major axis direction is the length direction of the rectangle or approximately rectangle). The minor axis direction Y can be defined as the direction perpendicular to the major axis direction X in the shape of the sound-generating unit 11 projected onto the sagittal plane (e.g., when the projection shape is rectangular or approximately rectangular, the minor axis direction is the width direction of the rectangle or approximately rectangle). The thickness direction Z can be defined as a direction perpendicular to the two-dimensional projection plane, and corresponds to, for example, the direction of the coronal axis, both of which are oriented in the left-right direction of the body.

[0049] In some embodiments, when a user wears the earphones 10, the sound generating unit 11 may be worn near the user's ear canal 101 in a position that does not block the ear canal. In some embodiments, when the earphones 10 are worn, the projection of the sound generating unit 11 onto the sagittal plane may not cover the user's ear canal. For example, the projection of the sound generating unit 11 onto the sagittal plane may be on both the left and right sides of the head, in front of the tragus on the sagittal axis of the human body (for example, the position indicated by the solid-line box A in FIG. 2). In this case, the sound generating unit 11 is in front of the user's tragus, the long axis of the sound generating unit 11 is vertical or nearly vertical, the projection of the short axis direction Y onto the sagittal plane coincides with the direction of the sagittal axis, the projection of the long axis direction X onto the sagittal plane coincides with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane. Also, for example, the projection of the sound generating unit 11 onto the sagittal plane may be on the antihelix 105 (for example, the position indicated by the dotted-line box C in FIG. 2). In this case, at least a portion of the sound generating unit 11 is located in the antihelix 105, the long axis of the sound generating unit 11 is horizontal or nearly horizontal, the long axis direction X of the sound generating unit 11 projected onto the sagittal plane coincides with the direction of the sagittal axis, the short axis direction Y projected onto the sagittal plane coincides with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane. In this way, the sound generating unit 11 is prevented from blocking the auditory canal, freeing both ears of the user, and the contact area between the sound generating unit 11 and the ear unit 100 is increased, improving the wearing comfort of the earphone 10.

[0050] In some embodiments, when worn, the projection of the earphone 10 onto the sagittal plane may cover the user's ear canal or may at least partially cover the user's ear canal. For example, the projection of the sound generating unit 11 onto the sagittal plane may be within the cavity of the concha 102 (for example, the position indicated by the dotted frame B in FIG. 2 ) and may contact the crus helix 1071 and / or the helix 107. At this time, the sound generating unit 11 is at least partially within the cavity of the concha 102 and is in an inclined state, the projection of the short axis direction Y of the sound generating unit 11 onto the sagittal plane may form a certain angle with the direction of the sagittal axis, i.e., the short axis direction Y is also installed at an inclination, the projection of the long axis direction X onto the sagittal plane may form a certain angle with the direction of the sagittal axis, i.e., the long axis direction X is also installed at an inclination, and the thickness direction Z is perpendicular to the sagittal plane. At this time, because the cavity of the concha 102 has a certain volume and depth, there is a certain gap between the inner surface IS of the earphone 10 and the cavity of the concha, and the ear canal communicates with the outside through the gap between the inner surface IS and the cavity of the concha, allowing the user's ears to be freed. At the same time, the sound-generating unit 11 can engage with the cavity of the concha to form an auxiliary cavity (e.g., a cavity structure described below) that communicates with the ear canal. In some embodiments, the sound emission hole 112 may be at least partially located within the auxiliary cavity, and the sound emitted from the sound emission hole 112 is restricted by the auxiliary cavity. That is, the auxiliary cavity can collect sound and transmit more sound into the ear canal, thereby improving the volume and quality of sound heard by the user in the near field and improving the acoustic effects of the earphone 10.

[0051] The above description of the earphone 10 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art may make various changes and modifications based on the description of the present application. For example, the earphone 10 may further include a battery assembly, a Bluetooth® assembly, etc., or a combination thereof. The battery assembly can supply power to the earphone 10. The Bluetooth® assembly can wirelessly connect the earphone 10 to other devices (e.g., mobile phones, computers, etc.). These changes and modifications still fall within the scope of protection of the present application.

[0052] FIG. 3 is a schematic diagram of two point sound sources and a listening position according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 3 , sound can be transmitted to the outside of the earphone 10 through a sound output hole 112, which can be regarded as a monopole sound source (or point sound source) A generating a first sound, and sound can be transmitted to the outside of the earphone 10 through a decompression hole 113, which can be regarded as a monopole sound source (or point sound source) B generating a second sound. The second sound and the first sound may be in opposite or nearly opposite phase, thereby canceling out in antiphase in the far field, i.e., forming an “acoustic dipole” to reduce sound leakage. In some embodiments, a line connecting the two monopole sound sources may be directed toward the ear canal (referred to as the “listening position”) so that the user can hear a sufficiently loud sound when wearing the earphone. The magnitude of the sound pressure at the listening position (denoted as Pear) can represent the strength of the sound heard by the user (i.e., the listening sound pressure in the near field). Furthermore, the magnitude of the sound pressure (denoted as Pfar) on a sphere centered at the user's listening position (or on a sphere with a radius r and the center of the dipole sound source (A and B shown in FIG. 3) as the center) can be statistically analyzed to represent the strength of the sound leakage radiated from the earphone 10 into the far field (i.e., the sound pressure of the far-field sound leakage). Pfar can be obtained using various statistical methods, such as by taking the average value of the sound pressure at each point on the sphere, or by performing a surface integral on the sound pressure distribution at each point on the sphere.

[0053] It should be noted that the sound leakage measurement method described in this specification is merely an illustrative explanation of the principles and effects and is not intended to be limiting. The sound leakage measurement method and calculation method can be reasonably adjusted according to actual conditions. For example, the center of a dipole sound source is taken as the center of a circle, and the sound pressure amplitudes of two or more points are selected and averaged based on a certain spatial angle in the far field. In some embodiments, the listening measurement method may involve selecting a point near a point sound source as the listening position and using the sound pressure amplitude measured at the listening position as the listening value. In some embodiments, the listening position may be on a line connecting two point sound sources or may not be on a line connecting two point sound sources. The listening measurement method and calculation method can be reasonably adjusted according to actual conditions, for example, averaging the sound pressure amplitudes of other points or one or more points in the near field. For example, the point sound source is taken as the center of a circle, and the sound pressure amplitudes of two or more points are selected and averaged based on a certain spatial angle in the near field. In some embodiments, the distance between the near-field listening position and the point sound source is much smaller than the distance between the point sound source and the far-field sound leakage measurement sphere.

[0054] Naturally, the sound pressure Pear transmitted from the earphone 10 to the user's ear should be sufficiently large to improve the listening experience, and the far-field sound pressure Pfar should be sufficiently small to improve the sound leakage reduction effect. Therefore, the sound leakage index α can be used as an index to evaluate the sound leakage reduction ability of the earphone 10.

[0055]

number

[0056] As can be seen from equation (1), the smaller the sound leakage index, the higher the sound leakage reduction capability of the earphone, and the smaller the far-field sound leakage when the near-field listening volume at the listening position is the same.

[0057] FIG. 4 is a comparison diagram of the sound leakage index at different frequencies between a single point sound source and dual point sound sources according to some embodiments of the present specification. The dual point sound source (also referred to as a dipole sound source) in FIG. 4 may be a typical dual point sound source, i.e., the distance between the two point sound sources is constant, and the two point sound sources have the same amplitude and opposite phase. Note that the use of a typical dual point sound source is merely for the purpose of illustrating the principle and effect. Adjusting the parameters of each point sound source according to actual needs can result in a certain difference from the typical dual point sound source. As shown in FIG. 4, when the distance between the two point sound sources is constant, the sound leakage generated by the dual point sound source increases with increasing frequency, and the sound leakage reduction ability decreases with increasing frequency. When the frequency is higher than a certain frequency value (e.g., about 8000 Hz shown in FIG. 4), the generated sound leakage is greater than the sound leakage generated by a single point sound source. This frequency (e.g., 8000 Hz) is the upper limit frequency at which the dual point sound source can reduce sound leakage.

[0058] In some embodiments, a baffle may be installed between the sound outlet 112 and the decompression outlet 113 to improve the sound output effect of the earphone 10, i.e., to increase the sound intensity at the near-field listening position and reduce the volume of far-field sound leakage.

[0059] FIG. 5 is an exemplary distribution diagram of a dipole sound source with a baffle installed between two sound sources according to some embodiments of the present disclosure. As shown in FIG. 5, when a baffle is installed between point sound source A1 and point sound source A2, in the near field, sound waves from point sound source A2 can only interfere with sound waves from point sound source A1 at the listening position by bypassing the baffle, which corresponds to an increase in the acoustic distance from point sound source A2 to the listening position. Therefore, assuming that point sound source A1 and point sound source A2 have the same amplitude, the amplitude difference between the sound waves from point sound source A1 and point sound source A2 at the listening position is greater than when a baffle is not installed. This reduces the degree to which the sounds from the two paths cancel each other out at the listening position, resulting in a higher volume at the listening position. In the far field, sound waves generated by point sound source A1 and point sound source A2 can interfere over a wide spatial range without bypassing the baffle (similar to when there is no baffle), so there is no significant increase in far-field sound leakage compared to when there is no baffle. Therefore, by installing a baffle structure around one of the point sound sources A1 and A2, the volume at the near-field listening position can be significantly increased without significantly increasing the volume of far-field sound leakage.

[0060] FIG. 6 illustrates the sound leakage index when a baffle is installed between two dipole sound sources and when no baffle is installed, according to some embodiments of the present disclosure. Adding a baffle between the two point sound sources corresponds to an increase in the distance between the two point sound sources in the near field. The volume at the listening position in the near field corresponds to that generated by two point sound sources with a large distance between them, so the listening volume in the near field is significantly increased compared to when no baffle is installed. In the far field, the sound field of the two point sound sources is less affected by the baffle, and the resulting sound leakage corresponds to that generated by two point sound sources with a small distance between them. Therefore, as shown in FIG. 6, the sound leakage index is significantly smaller after the baffle is installed than when no baffle is installed. That is, for the same listening volume, the far-field sound leakage is smaller than when no baffle is installed, demonstrating a significant improvement in sound leakage reduction capability.

[0061] Fig. 7 is a schematic diagram of an exemplary wearing of an earphone according to some embodiments of the present disclosure. Fig. 8 is a schematic diagram of the ear side of the earphone shown in Fig. 7. Fig. 9 is a schematic diagram of the housing of the earphone shown in Fig. 7.

[0062] 7, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear unit 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE that is connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the earphone 10 is in the worn state, the first portion 121 of the ear hook 12 (e.g., the hook-shaped portion of the ear hook 12) is hooked between the user's auricle (e.g., the helix 107) and the head, and the second portion 122 of the ear hook 12 (e.g., the connecting portion of the ear hook) extends to the side of the auricle facing away from the head and is connected to the connection end CE of the sound generating unit 11, so that the sound generating unit 11 is worn in a position near the ear canal without blocking the ear canal.

[0063] 7 and 8 , the sound generating unit 11 may have an inner surface IS (also referred to as the inner surface of the housing 111) facing the ear portion along the thickness direction Z when worn, an outer surface OS (also referred to as the outer surface of the housing 111) facing away from the ear portion, and a connecting surface connecting the inner surface IS and the outer surface OS. When viewed from the direction of the coronal axis (i.e., the thickness direction Z) when worn, the sound generating unit 11 may have a shape such as a circle, an ellipse, a rounded square, or a rounded rectangle. When the sound generating unit 11 has a shape such as a circle or an ellipse, the connecting surface may refer to an arc-shaped side surface of the sound generating unit 11. When the sound generating unit 11 has a shape such as a rounded square or a rounded rectangle, the connecting surface may include a lower surface LS (also referred to as the lower surface of the housing 111), an upper surface US (also referred to as the upper surface of the housing 111), and a rear surface RS (also referred to as the rear surface of the housing 111), which will be described later. The upper side surface US and the lower side surface LS may refer to the side facing away from the ear canal 101 and the side close to the ear canal 101 along the short axis direction Y of the sound generating unit 11 when the earphone is worn, respectively, and the rear side surface RS may refer to the side facing the back of the head along the length direction X of the sound generating unit 11 when the earphone is worn. For ease of explanation, this specification will exemplarily describe the sound generating unit 11 as a rounded rectangle. The length of the sound generating unit 11 in the long axis direction X may be greater than the width of the sound generating unit 11 in the short axis direction Y. In some embodiments, the rear side surface RS of the earphone may be an arcuate surface to improve the aesthetics and wearing comfort of the earphone.

[0064] A transducer capable of converting an electrical signal into a corresponding mechanical vibration to generate sound may be installed within the sound generating unit 11. The transducer (e.g., a diaphragm) may divide the housing 111 into a front cavity and a rear cavity of the earphone. The sounds generated in the front cavity and the rear cavity are out of phase with each other. The inner surface IS may have a sound output hole 112 communicating with the front cavity, allowing the sound generated in the front cavity to be guided out of the housing 111 and transmitted to the ear canal so that the user can hear the sound. One or more decompression holes 113 communicating with the rear cavity may be formed on other sides of the housing 111 (e.g., the outer surface OS, the upper surface US, or the lower surface LS), allowing the sound generated in the rear cavity to be guided out of the housing 111 and then interfere with and cancel out the sound leaking through the sound output hole 112 in the far field. In some embodiments, the decompression hole 113 is located further away from the ear canal than the sound output hole 112, thereby reducing anti-phase cancellation at the listening position (e.g., ear canal) between the sound output through the decompression hole 113 and the sound output through the sound output hole 112, thereby increasing the volume of the sound at the listening position.

[0065] In some embodiments, in addition to the inner surface IS, at least two decompression holes 113 may be formed on other sides of the housing 111 (e.g., the outer surface OS, the upper surface US, or the lower surface LS). By providing at least two decompression holes 113, standing waves in the rear cavity can be broken and the resonant frequency of the sound emitted from the decompression holes 113 to the outside of the housing 111 can be increased as much as possible. This allows the frequency response of the rear cavity to have a wide flat region (e.g., the region before the resonant peak) and achieve a higher sound leakage reduction effect in the mid-to-high frequency range (e.g., 2 kHz to 6 kHz). By way of example only, the decompression holes 113 may include a first decompression hole 1131 and a second decompression hole 1132. The second decompression hole 1132 may be closer to the sound output hole 112 than the first decompression hole 1131. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on the same side of the housing 111, for example, both the first decompression hole 1131 and the second decompression hole 1132 may be located on the outer side OS, the upper side US, or the lower side LS. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on two different sides of the housing 111, for example, the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the upper side US, or the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the lower side LS. In some embodiments, to maximize the destruction of standing waves in the rear cavity, the two decompression holes 113 may be located on opposite sides of the housing 111, for example, the first decompression hole 1131 may be located on the upper side US and the second decompression hole 1132 may be located on the lower side LS. For convenience of explanation, the present specification will exemplarily describe the first decompression hole 1131 as being located on the upper side US and the second decompression hole 1132 as being located on the lower side LS.

[0066] In some embodiments, to prevent the sound output from the first decompression hole 1131 and the second decompression hole 1132 from affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible, and for example, the center of the sound output hole 112 may be set to be located on or near the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 2 mm away from the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, further, to avoid the sound emitted from the second decompression hole 1132 and the sound emitted from the sound emission hole 112 being cancelled out in antiphase in the ear canal (i.e., the listening position) and reducing the listening volume, the area of ​​the second decompression hole 1132 can be reduced to weaken the intensity of the sound derived from the second decompression hole 1132 and transmitted to the ear canal, and in this case, the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131 (as shown in Figure 17).

[0067] 7, when the earphone 10 is in the worn state, the long axis direction X of the sound-generating unit 11 may be set horizontally or approximately horizontally (similar to position C shown in FIG. 2), and in this case, the sound-generating unit 11 may be at least partially located in the antihelix 105, and the free end FE of the sound-generating unit 11 may be directed toward the back of the head. When the sound-generating unit 11 is in the horizontal or approximately horizontal state, the projection of the long axis direction X of the sound-generating unit 11 onto the sagittal plane may coincide with the direction of the sagittal axis, the projection of the short axis direction Y onto the sagittal plane may coincide with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane.

[0068] In some embodiments, to improve the fit between the earphone 10 and the ear piece 100 and to increase the wearing stability of the earphone 10, the inner surface IS of the housing 111 may be pressed against the surface of the ear piece 100 (e.g., the antihelix 105) to increase the resistance of the earphone 10 to removal from the ear piece 100.

[0069] 7 and 8 , when the earphone 10 is pressed against the ear section 100, the projection of the sound emitting hole 112 on the sagittal plane may partially or completely overlap with the projection of the inner concave structure of the ear section (e.g., the concha scapula 103) on the sagittal plane so that the sound emitting hole 112 on the inner surface IS is not blocked by ear tissue. In some embodiments, the concha scapula 103 communicates with the cavity of the concha 102, and the ear canal is located within the cavity of the concha 102. Therefore, when at least a portion of the projection of the sound emitting hole 112 on the sagittal plane is located within the concha scapula 103, sound output from the sound emitting hole 112 can reach the ear canal without hindrance, resulting in a high volume of sound received in the ear canal. In some embodiments, the major axis dimension of the sound-generating unit 11 should not be too long. If it is too long, the projection of the free end FE on the sagittal plane will exceed the projection of the ear section on the sagittal plane, which will affect the fit between the sound-generating unit 11 and the ear section. Therefore, the major axis dimension of the sound generating unit 11 can be designed so that the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane.

[0070] The sound output holes 112 and the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132) are provided in the housing 111, and since each side wall of the housing 111 has a uniform thickness, the sound output holes 112 and the decompression holes 113 are holes with a uniform depth. In this case, the sound output holes 112 and the decompression holes 113 may each have an inner opening and an outer opening. For convenience of explanation, in this application, the center O of the sound output hole 112 above and below may refer to the centroid of the outer opening of the sound output hole 112, and the center of the decompression hole 113 above and below may refer to the centroid of the outer opening of the decompression hole 113 (e.g., the center O1 of the first decompression hole 1131 may refer to the centroid of the outer opening of the first decompression hole 1131, and the center O2 of the second decompression hole 1132 may refer to the centroid of the outer opening of the second decompression hole 1132). For convenience of explanation, in this specification, the area of ​​the sound emitting holes 112 and the decompression holes 113 (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) may refer to the area of ​​the outer openings of the sound emitting holes 112 and the decompression holes 113 (e.g., the area of ​​the outer opening on the inner surface IS of the sound emitting hole 112, the area of ​​the outer opening on the upper surface US of the first decompression hole 1131, and the area of ​​the outer opening on the lower surface LS of the second decompression hole 1132). Note that in some other embodiments, the area of ​​the sound emitting holes 112 and the decompression holes 113 may refer to the area of ​​other cross sections of the sound emitting holes 112 and the decompression holes 113, for example, the area of ​​the inner openings of the sound emitting holes 112 and / or the decompression holes 113, or the average value of the area of ​​the inner openings and the area of ​​the outer openings of the sound emitting holes 112 and / or the decompression holes 113.

[0071] In some embodiments, the sound emitting hole 112 communicating with the front cavity can be regarded as the point sound source A1 shown in Fig. 5, the decompression hole 113 (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) communicating with the rear cavity can be regarded as the point sound source A2 shown in Fig. 5, and the ear canal can be regarded as the listening position shown in Fig. 5. At least a part of the housing of the sound generating unit 11 and / or at least a part of the pinna can be regarded as a baffle shown in Fig. 5, thereby increasing the difference in acoustic distance to the ear canal between the sound emitting hole 112 and the first decompression hole 1131 and / or the second decompression hole 1132, thereby increasing the intensity of the sound in the ear canal and maintaining the effect of reducing far-field sound leakage. 7, i.e., when at least a portion of the housing 111 is located at the antihelix 105, sound waves from the sound emitting hole 112 can directly reach the ear canal, with respect to the listening effect. In this case, the sound emitting hole 112 may be located close to the lower surface LS of the inner surface IS, and at least one decompression hole may be located away from the sound emitting hole 112. For example, the first decompression hole 1131 may be located away from the sound emitting hole 112 on the outer surface OS or the upper surface US. The sound waves from the first decompression hole 1131 can only interfere with the sound waves from the sound emitting hole 112 in the ear canal by bypassing the outside of the sound generating unit 11. In addition, the convex-upper and concave-lower structure of the pinna (e.g., the antihelix, tragus, etc. in the transmission path) also increases the acoustic distance over which sound from the first decompression hole 1131 is transmitted to the ear canal. Therefore, the sound generating unit 11 itself and / or at least a part of the pinna corresponds to a baffle between the sound emitting hole 112 and the first decompression hole 1131, and the baffle increases the acoustic distance from the first decompression hole 1131 to the ear canal and increases the intensity of the sound waves from the first decompression hole 1131 in the ear canal, thereby reducing the degree to which the sounds emitted from the sound emitting hole 112 and the first decompression hole 1131 are canceled out in the ear canal and increasing the volume in the ear canal. Regarding the sound leakage reduction effect, the sound waves generated by the sound emitting hole 112, the first decompression hole 1131 and / or the second decompression hole 1132 can interfere over a wide spatial range without bypassing the sound generating unit 11 itself (similar to when there is no baffle), so sound leakage does not obviously increase.Therefore, by placing the sound emission hole 112, the first decompression hole 1131 and the second decompression hole 1132 in appropriate positions, the volume in the ear canal can be significantly increased without significantly increasing the volume of sound leakage.

[0072] In some embodiments, when the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane, the first decompression holes 1131 and the second decompression holes 1132 may be distributed approximately symmetrically with respect to the longitudinal center plane of the sound-generating unit 11 (e.g., the inward-facing surface NN′ perpendicular to the paper surface as shown in FIG. 8 ) to facilitate production manufacturing. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower surface LS to the posterior surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper surface US to the posterior surface RS is less than 10%. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower surface LS to the posterior surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper surface US to the posterior surface RS is less than 5%. In some embodiments, the difference between the distance a2 from the center O2 of the second decompression hole 1132 on the lower side surface LS to the rear side surface RS and the distance a1 from the center O1 of the first decompression hole 1131 on the upper side surface US to the rear side surface RS is less than 2%. Note that in some embodiments, the rear side surface RS of the earphone may be an arcuate surface to improve the aesthetics and wearing comfort of the earphone. When the rear side surface RS is an arcuate surface, the distance from a specific position (e.g., the center O1 of the first decompression hole 1131) to the rear side surface RS may refer to the distance from that position to a tangent plane parallel to the minor axis of the rear side surface RS.

[0073] In some embodiments, because the sound emitting hole 112 is located close to the ear canal, the second decompression hole 1132 on the lower surface LS should be located as far away from the sound emitting hole 112 as possible, thereby reducing the cancellation effect at the listening position (i.e., the ear canal) between the sound emitted from the second decompression hole 1132 and the sound emitted from the sound emitting hole 112 and increasing the volume at the listening position. Therefore, when the sound emitting hole 112 is located close to the lower surface LS and the connecting end CE, the second decompression hole 1132 can be located close to the rear surface RS to maximize the distance between the sound emitting hole 112 and the second decompression hole 1132. In some embodiments, when the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane, the distance a2 from the center O2 of the second decompression hole 1132 to the rear surface RS may be in the range of 8.60 mm to 20.27 mm. In some embodiments, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 8.60 mm to 12.92 mm. In some embodiments, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 9.60 mm to 11.92 mm. In some embodiments, when the earphone 10 is in an in-ear state, the free end FE may come into contact with the ear unit (e.g., the helix 107), causing a portion of the upper side surface US and / or the lower side surface LS to be blocked by the ear unit. In this case, to avoid the second decompression hole 1132 on the lower side surface LS (or the first decompression hole 1131 on the upper side surface US) being blocked by the ear unit 100 and affecting the acoustic performance of the earphone 10, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may range from 10.10 mm to 11.42 mm. More preferably, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may be in the range of 10.30 mm to 11.12 mm.More preferably, the distance a2 from the center O2 of the second decompression hole 1132 to the rear side surface RS may be in the range of 10.60 mm to 11.82 mm.

[0074] In some embodiments, the distance a1 from the center O1 of the first decompression hole 1131 to the posterior side surface RS may range from 8.60 mm to 15.68 mm, provided that the difference between the distance a2 from the center O2 of the second decompression hole 1132 to the posterior side surface RS and the distance a1 from the center O1 of the first decompression hole 1131 to the posterior side surface RS is less than 10%. In some embodiments, the distance a1 from the center O1 of the first decompression hole 1131 to the posterior side surface RS may range from 8.60 mm to 12.92 mm. In some embodiments, the distance a1 from the center O1 of the first decompression hole 1131 to the posterior side surface RS may range from 9.60 mm to 11.92 mm, such that the projection of the first decompression hole 1131 onto the sagittal plane mostly overlaps with the projection of the inner recess structure of the ear onto the sagittal plane. Preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.10 mm to 11.42 mm. More preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.30 mm to 11.12 mm. More preferably, the distance a1 from the center O1 of the first decompression hole 1131 to the rear side surface RS may be in the range of 10.60 mm to 11.82 mm.

[0075] In some embodiments, the first decompression hole 1131 may be farther from the sound output hole 112 than the second decompression hole 1132, and because the gap between the ear portion 100 and the inner surface IS is smaller, sound generated by the first decompression hole 1131 is less likely to be transmitted to the ear canal than the second decompression hole 1132. Therefore, in some embodiments, the distance from the center O1 of the first decompression hole 1131 to the rear side surface RS may be smaller than the distance from the center O2 of the second decompression hole 1132 to the rear side surface RS. For example, the range of the distance from the center O1 of the first decompression hole 1131 to the rear side surface RS is 10.44 mm to 15.68 mm, and the range of the distance from the center O2 of the second decompression hole 1132 to the rear side surface RS is 13.51 mm to 20.27 mm.

[0076] In some embodiments, as shown in FIG. 9 , the sound generation efficiency of the earphone 10 (i.e., the listening volume at the listening position) can be improved by increasing the dimension of the earphone 10 in the thickness direction Z to increase the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal. Furthermore, by positioning the first decompression hole 1131 and / or the second decompression hole 1132 away from the inner surface IS, the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal can be further increased, thereby improving the sound generation efficiency of the earphone 10. Furthermore, the overall dimension of the sound-generating unit 11 is limited to not be too large (e.g., the dimension of the sound-generating unit 11 in the Z direction should not be too large), otherwise the overall mass of the earphone 10 will increase, affecting the user's wearing comfort. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 4.24 mm to 7.96 mm. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 4.43 mm to 7.96 mm. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 5.43 mm to 6.96 mm. In some embodiments, the first decompression hole 1131 and / or the second decompression hole 1132 may be positioned away from the inner surface IS so that the projection of the first decompression hole 1131 onto a horizontal plane slightly overlaps or does not overlap the projection of the ear unit 100 onto a horizontal plane when worn, thereby achieving the purpose of allowing more sound output from the first decompression hole 1131 and / or the second decompression hole 1132 to be radiated to the outside without being transmitted to the ear canal or being reflected and refracted through a part of the structure of the ear unit 100 (e.g., the pinna) and transmitted to the ear canal. This arrangement can further increase the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal, thereby improving the sound generation efficiency of the earphone 10. In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 5.63 mm to 7.96 mm.In some embodiments, the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS ranges from 6.25 mm to 7.56 mm.

[0077] In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS may be the same as the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 4.43 mm to 7.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 5.43 mm to 6.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 5.63 mm to 7.96 mm. In some embodiments, the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS ranges from 6.25 mm to 7.56 mm.

[0078] In some embodiments, the sound emitting holes 112 need to be closer to the lower surface LS in order to increase the volume at the listening position by bringing the sound emitting holes 112 closer to the ear canal. In this case, the second decompression holes 1132 are closer to the inner surface IS than the first decompression holes 1131. In order to reduce the cancellation effect at the listening position (i.e., the ear canal) between the sound emitted from the second decompression holes 1132 and the sound emitted from the sound emitting holes 112 and increase the volume at the listening position, the second decompression holes 1132 may be farther from the inner surface IS in the Z direction than the first decompression holes 1131; that is, the distance d2 from the center O2 of the second decompression holes 1132 to the inner surface IS may be different from the distance d1 from the center O1 of the first decompression holes 1131 to the inner surface IS. For example, the range of the distance d1 from the center O1 of the first decompression hole 1131 to the inner surface IS is 5.63 mm to 6.5 mm, and the range of the distance d2 from the center O2 of the second decompression hole 1132 to the inner surface IS is 6.5 mm to 7.56 mm.

[0079] The above description of the earphone 10 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art may make various changes and modifications based on the description of the present application. For example, if only one decompression hole is provided in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, i.e., the decompression hole may be provided on the upper surface US. The distance from the center of the decompression hole to the inner surface IS may range from 4.24 mm to 7.96 mm, and the distance from the center of the decompression hole to the rear surface RS may range from 8.60 mm to 15.68 mm. These changes and modifications remain within the scope of protection of the present application.

[0080] In some embodiments, a cavity structure can be configured around one of the dual point sound sources to increase the listening volume, especially for mid-low frequencies, while maintaining the cancellation effect of far-field sound leakage. Figure 10 is an exemplary schematic diagram of a cavity structure configured around one of the dipole sound sources, according to some embodiments of the present disclosure.

[0081] As shown in FIG. 10 , when a cavity structure 41 is installed between dipole sound sources, one of the dipole sound sources and the listening position are inside the cavity structure 41, and the other of the dipole sound sources is outside the cavity structure 41. The sound radiated from the dipole sound source inside the cavity structure 41 is confined by the cavity structure 41. That is, the cavity structure 41 collects the sound and transmits more sound to the listening position, thereby improving the volume and quality of the sound at the listening position. In this application, the “cavity structure” may be understood as a semi-enclosed structure surrounded by the side walls of the sound-generating unit 11 and the concha structure. The semi-enclosed structure does not completely seal the interior and isolate it from the external environment, but has a leaking structure 42 (e.g., an opening, a gap, a tube, etc.) that acoustically communicates with the external environment. Exemplary leaking structures may include, but are not limited to, openings, gaps, tubes, etc., or any combination thereof.

[0082] In some embodiments, the cavity structure 41 may include a listening position and at least one sound source. Here, "including" may indicate that at least one of the listening position and the sound source is inside the cavity, or at the edge of the cavity. In some embodiments, the listening position may be the opening of the ear canal or the acoustic reference point of the ear.

[0083] 11A and 11B are schematic diagrams of a dipole sound source structure and a listening principle when a cavity structure is configured around one of the dipole sound sources according to some embodiments of the present disclosure, respectively, and a sound leakage principle when a cavity structure is configured around one of the dipole sound sources according to some embodiments of the present disclosure.

[0084] For near-field listening, as shown in FIG. 11A , in a dipole with a cavity structure around one of the sound sources, most of the radiated sound reaches the listening position via direct or reflected radiation because one of the sound sources, A, is surrounded by the cavity structure. In contrast, without a cavity structure, most of the sound radiated from the sound source does not reach the listening position. Therefore, the installation of a cavity structure significantly increases the volume of the sound reaching the listening position. Furthermore, only a small portion of the anti-phase sound radiated from an anti-phase sound source B outside the cavity structure enters the cavity structure through the leaking structure of the cavity structure. This corresponds to the generation of a secondary sound source B' in the leaking structure, whose intensity is significantly lower than that of sound source B and significantly lower than that of sound source A. The sound generated by secondary sound source B' has a low anti-phase cancellation effect with sound source A within the cavity, thereby significantly increasing the listening volume at the listening position.

[0085] Regarding sound leakage, as shown in Fig. 11B, when sound source A radiates sound to the outside through the leaking structure of the cavity, this is equivalent to the generation of secondary sound source A' in the leaking structure, and since most of the sound radiated from sound source A is output from the leaking structure and the structural scale of the cavity is much smaller (at least one order of magnitude smaller) than the spatial scale for evaluating sound leakage, the intensity of secondary sound source A' is considered to be equivalent to the intensity of sound source A. The canceling effect of the sounds generated by secondary sound source A' and sound source B in the external space is equivalent to the canceling effect of the sounds generated by sound source A and sound source B. In other words, the cavity structure still maintains a certain degree of sound leakage reduction effect.

[0086] The leakage structure with one opening described above is merely exemplary. A cavity-structured leakage structure may include one or more openings and achieve a superior listening index. The listening index may refer to 1 / α, the inverse of the sound leakage index α. Using a structure with two openings as an example, the following analyses will discuss the cases of equal openings and equal opening ratios. Compared to a structure with only one opening, "equal openings" refers to the installation of two openings with the same dimensions as a structure with only one opening, and "equal opening ratio" refers to the sum of the opening areas of the two openings being the same as that of a structure with only one opening. Equal openings are equivalent to doubling the relative opening size (i.e., the ratio between the opening area S of the cavity-structured leakage structure and the area S0 directly affected by a sound source contained within the cavity structure) of a structure with only one opening, which, as described above, reduces the overall listening index. Even if the S / S0 ratio is the same as that of a structure with only one hole when the aperture ratio is equal, the listening index is different because the distances from the two openings to the external sound source are different.

[0087] 12A is a schematic diagram of a cavity structure having two horizontal openings according to some embodiments of the present disclosure. FIG. 12B is a schematic diagram of a cavity structure having two vertical openings according to some embodiments of the present disclosure. As shown in FIG. 12A, when the line connecting the two openings is parallel to the line connecting the two sound sources (i.e., two horizontal openings), the distances from the two openings to the external sound source are maximum and minimum, respectively. As shown in FIG. 12B, when the line connecting the two openings is perpendicular (i.e., two vertical openings), the distances from the two openings to the external sound source are equal and intermediate.

[0088] FIG. 13 is a comparison diagram of the listening index curves of a cavity structure with two openings and a cavity structure with one opening, according to some embodiments of the present disclosure. As shown in FIG. 13, the cavity structure with equal openings has a lower overall listening index than the cavity structure with one opening. For the cavity structure with equal opening ratio, the listening index is different due to the different distances from the two openings to the external sound source. As can be seen from FIGS. 12A, 12B, and 13, the listening index of the leaky structure with equal opening ratio is higher than that of the leaky structure with equal opening ratio, whether it is a horizontal or vertical opening. This is because the relative opening size S / S0 of the leaky structure with equal opening ratio is reduced by half compared to the leaky structure with equal opening ratio, resulting in a higher listening index. Also, as can be seen from FIGS. 12A, 12B, and 13, the listening index of the leaky structure with equal opening ratio is higher than that of the leaky structure with equal opening ratio, whether it is a horizontal opening or a vertical opening. This is because the distance from one opening of the horizontal opening leakage structure to the external sound source is smaller than the distance between the two sound sources, and the distance between the secondary sound source thus formed and the external sound source is closer than the distance between the original two sound sources, resulting in a higher listening index and an improved sound leakage reduction effect. Therefore, in order to improve the sound leakage reduction effect, the distance from at least one opening to the external sound source may be made shorter than the distance between the two sound sources.

[0089] Furthermore, as shown in Figure 13, a cavity structure with two openings can better increase the resonant frequency of airborne sound within the cavity structure compared to a cavity structure with one opening, thereby providing the entire device with a higher listening index in the high-frequency band (e.g., sounds with frequencies close to 10,000 Hz) compared to a cavity structure with only one opening. The high-frequency band is where the human ear is more sensitive, so there is a greater need for sound leakage reduction. Therefore, to improve the sound leakage reduction effect in the high-frequency band, a cavity structure with more than one opening can be selected.

[0090] Fig. 14 is a schematic diagram illustrating an example of how an earphone according to some other embodiments of the present application is worn. Fig. 15 is a schematic diagram illustrating the ear side of the earphone shown in Fig. 14 .

[0091] The earphone 10 shown in FIG. 14 has a structure similar to that of the earphone 10 shown in FIG. 7 , and for example, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear unit 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the earphone 10 is in a worn state, the first portion 121 of the ear hook 12 (e.g., the hook-shaped portion of the ear hook 12) is hooked between the user's auricle (e.g., the helix 107) and the head, and the second portion 122 of the ear hook 12 (e.g., the connecting portion of the ear hook) extends to the side of the auricle facing away from the head and is connected to the connection end CE of the sound generating unit 11, so that the sound generating unit 11 is worn in a position near the ear canal without blocking the ear canal. 14 is similar in structure to the earphone 10 shown in Fig. 7, but differs mainly in that the sound generating unit 11 is installed at an angle, and at least a portion of the housing 111 of the sound generating unit 11 is inserted into the cavity of the concha 102, such that, for example, the free end FE of the sound generating unit 11 is inserted into the cavity of the concha 102. The ear hook 12 and sound generating unit 11 having such a structure are highly compatible with the user's ear part 100, and by increasing the resistance to the earphone 10 coming off the ear part 100, the wearing stability of the earphone 10 can be improved.

[0092] In some embodiments, when viewed from the thickness direction Z while worn, the connection end CE of the sound generating unit 11 is closer to the top of the head than the free end FE so that the free end FE enters the cavity of the concha. Based on this, the included angle between the long axis direction X and the direction of the sagittal axis of the human body may be 15° to 60°. If the included angle is too small, the free end FE may not enter the cavity of the concha and the sound output hole 112 of the sound generating unit 11 may be too far from the auditory canal. If the included angle is too large, the sound generating unit 11 may not enter the cavity of the concha and the auditory canal may be blocked by the sound generating unit 11. In other words, by installing the sound generating unit 11 in this manner, the sound generating unit 11 can enter the cavity of the concha and the distance between the sound output hole 112 of the sound generating unit 11 and the auditory canal can be adjusted appropriately, thereby preventing the auditory canal from being blocked and allowing the user to hear more of the sound generated by the sound generating unit 11.

[0093] In some embodiments, the sound generating unit 11 and the ear hook 12 may clamp the ear region corresponding to the cavity of the concha from both the front and rear sides of the ear region, thereby increasing the resistance of the earphone 10 to coming off the ear and improving the stability of the earphone 10 when worn. For example, the free end FE of the sound generating unit 11 is pressed into the cavity of the concha in the thickness direction Z. Also, for example, the free end FE abuts against the cavity of the concha in the long axis direction X and the short axis direction Y.

[0094] In some embodiments, both ends of the second portion 122 of the earhook 12 may be connected to the first portion 121 of the earhook 12 and the connection end CE of the sound-generating unit 11, respectively (as shown in FIG. 15 ). In some embodiments, the second portion 122 of the earhook 12 may have a lowest point P and a highest point Q along the short-axis direction Y of the sound-generating unit 11. When the earphone 10 is in an worn state, a distance h1 between the center of the first decompression hole 1131 and the lowest point P in the long-axis direction X of the sound-generating unit 11 may be 5.28 mm to 7.92 mm so that the first decompression hole 1131 is not blocked by an ear structure (e.g., the helix or the tragus). In some embodiments, when a user is wearing the earphone 10, a distance h2 between the center of the first decompression hole 1131 and the highest point Q in the long-axis direction X of the sound-generating unit 11 may be 8.68 mm to 13.02 mm so that the earphone can fit snugly against the user's ear. In some embodiments, when a user is wearing the earphones, the range of the distance between the center of the first decompression hole 1131 and any point on the second portion 122 of the earhook 12 in the longitudinal axis direction X of the sound-generating unit 11 is 5.28 mm to 14 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second portion 122 of the earhook 12 in the longitudinal axis direction X of the sound-generating unit 11 is 5.28 mm to 13.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second portion 122 of the earhook 12 in the longitudinal axis direction X of the sound-generating unit 11 is 6.58 mm to 12.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second portion 122 of the earhook 12 in the longitudinal axis direction X of the sound-generating unit 11 is 7.58 mm to 10.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point on the second earhook portion 122 in the long axis direction X of the sound generating unit 11 is 8.58 mm to 9.02 mm.

[0095] As shown in FIG. 14, when a user wears the earphone 10, by positioning the housing 111 of the sound generating unit 11 so that at least a portion of it is inserted into the cavity of the concha 102, the cavity surrounded by the inner surface IS of the sound generating unit 11 and the cavity of the concha 102 can be regarded as the cavity structure 41 shown in FIG. 10, and the gap formed between the inner surface IS and the cavity of the concha (for example, a first leakage structure UC formed between the inner surface IS and the cavity of the concha close to the top of the head, and a second leakage structure LC formed between the inner surface IS and the ear close to the auditory canal) can be regarded as the leakage structure 42 shown in FIG. 10. The sound emitting hole 112 provided on the inner surface IS can be considered to be a point sound source inside the cavity structure 41 shown in Fig. 10, and the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132) provided on other sides (e.g., the upper surface US and / or the lower surface LS) of the sound generating unit 11 can be considered to be point sound sources outside the cavity structure 41 shown in Fig. 10. As a result, according to the related explanations of Figs. 10 to 13, when the earphone 10 is worn in a manner in which at least a portion is inserted into the cavity of the concha, that is, when worn in the manner shown in Fig. 14, in terms of listening effect, most of the sound emitting from the sound emitting hole 112 can reach the ear canal in a manner of direct emission or reflection, and the volume of the sound reaching the ear canal, particularly the listening volume of mid- to low-frequency sounds, can be significantly increased. Furthermore, only a small portion of the out-of-phase sound emitted from the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132) enters the cavity of the concha through the gaps (the first leakage structure UC and the second leakage structure LC), reducing the effect of out-of-phase cancellation with the sound output hole 112, thereby significantly increasing the listening volume in the auditory canal. Regarding the sound leakage reduction effect, the sound output hole 112 can output sound to the outside through the gaps, and the output sound and the sound generated by the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132) cancel each other out in the far field, thereby ensuring the sound leakage reduction effect.

[0096] In some embodiments, to prevent the sound output from the first decompression hole 1131 and the second decompression hole 1132 from affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible. For example, the center of the sound output hole 112 may be set to be located on or near the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 2 mm away from the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 1 mm away from the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound emission hole 112 may be 0 mm to 0.5 mm away from the perpendicular bisector of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132.

[0097] In some embodiments, by determining the relationship between the distance (also referred to as the first distance) between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 and the distance (also referred to as the second distance) between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112, the center O of the sound emission hole 112 can be positioned approximately on the perpendicular bisector of the connecting line O1O2. In some embodiments, the difference between the first distance and the second distance is less than 10%. In some embodiments, the difference between the first distance and the second distance is less than 8%. In some embodiments, the difference between the first distance and the second distance is less than 5%. In some embodiments, the difference between the first distance and the second distance is less than 2%.

[0098] In some embodiments, to prevent sound waves emitted from the decompression holes (e.g., the first decompression hole 1131 and the second decompression hole 1132) and the sound emission hole 112 from canceling out in the near field and affecting the user's listening quality, the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emission hole 112 should not be too close. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15.11 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5.12 mm to 15.11 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5 mm to 14 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 6 mm to 13 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 7 mm to 12 mm. In some embodiments, the distance between the center O1 of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 8 mm to 10 mm.

[0099] In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 4 mm to 16.1 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 4 mm to 15 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 5 mm to 14 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 5.12 mm to 16.1 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 6 mm to 13 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound output hole 112 may be 7 mm to 12 mm. In some embodiments, the distance between the center O2 of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 8 mm to 10 mm.

[0100] In some embodiments, to reduce the effect of the decompression holes on the sound output from the sound output hole, it is preferable that both the first decompression hole 1131 and the second decompression hole 1132 are located as far away from the sound output hole 112. Therefore, in order to ensure that both the first decompression hole 1131 and the second decompression hole 1132 are located away from the sound output hole 112, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is within a range of 0.9 to 1.1. In some embodiments, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is within a range of 0.92 to 1.08. In some embodiments, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is in the range of 0.94 to 1.06. In some embodiments, the ratio of the distance from the center O of the sound output hole 112 to the center O1 of the first decompression hole 1131 to the distance from the center O of the sound output hole 112 to the center O2 of the second decompression hole 1132 is in the range of 0.96 to 1.04.

[0101] In some embodiments, to further prevent the sound emitted from the second decompression hole 1132 from canceling out with the sound emitted from the sound emission hole 112 in the ear canal (i.e., the listening position) and reducing the listening volume, the area of ​​the second decompression hole 1132 can be reduced to weaken the intensity of the sound emitted from the second decompression hole 1132 and transmitted to the ear canal, and in this case, the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131 (shown in FIG. 17 ).

[0102] In some embodiments, in order to maximize the distance between the first decompression hole 1131 or the second decompression hole 1132 and the sound output hole 112, the included angle between the line O1O connecting the center O1 of the first decompression hole 1131 to the center O of the sound output hole 112 and the line O2O connecting the center O2 of the second decompression hole 1132 to the center O of the sound output hole 112 can be reduced. In some embodiments, the angle between the connecting line O1O and the connecting line O2O ranges from 46.40° to 114.04°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O ranges from 46.40° to 90.40°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O ranges from 46.40° to 70.04°. In some embodiments, the angle between the connecting line O1O and the connecting line O2O ranges from 46.40° to 60.04°.

[0103] In some embodiments, the angle between the line O1O2 connecting the center O1 of the first decompression hole 1131 and the center O2 of the second decompression hole 1132 and the connecting line O2O ranges from 19.72° to 101.16°. In some embodiments, the angle between the connecting line O1O2 and the connecting line O2O ranges from 19.71° to 97.75°.

[0104] FIG. 16 is a schematic diagram of a sagittal projection of an earphone in a worn state, according to some embodiments herein.

[0105] 14 and 16, in order to stably attach the sound generating unit 11 to the user's ear, easily configure the cavity structure shown in FIG. 10, and provide the cavity structure with at least two leak structures, the free end FE may abut the cavity of the concha in the long axis direction X and the short axis direction Y, where the inner surface IS of the sound generating unit 11 is inclined with respect to the sagittal plane, and at least a first leak structure UC (i.e., a gap formed between the concha and the upper boundary of the inner surface IS) close to the top of the head and a second leak structure LC (i.e., a gap formed between the concha and the lower boundary of the inner surface IS) close to the auditory canal are provided between the inner surface IS of the sound generating unit and the concha. This makes it possible to increase the listening volume, especially for mid-low frequencies, while still maintaining the effect of canceling far-field sound leakage, thereby improving the acoustic output performance of the earphone 10.

[0106] In some embodiments, when the earphone 10 is worn in the manner shown in Fig. 14, the first leakage structure UC and the second leakage structure LC formed between the inner surface IS of the sound generating unit 11 and the cavity of the concha have a constant scale in both the longitudinal axis direction X and the thickness direction Z. In some embodiments, to easily understand the positions of the first leakage structure UC and the second leakage structure LC, the midpoint of two points formed when the upper and lower boundaries of the inner surface IS of the earphone 10 in the worn state intersect with the ear part (e.g., the side wall of the cavity of the concha, the crus helicalis) can be used as the position reference point for the first leakage structure UC and the second leakage structure LC. In some embodiments, to easily understand the positions of the first leakage structure UC and the second leakage structure LC, when the earphone 10 is worn, the midpoint of the upper boundary of the inner surface IS can be used as the position reference point for the first leakage structure UC, and a trisection point close to the free end FE of the lower boundary of the inner surface IS (hereinafter abbreviated as the 1 / 3 point of the lower boundary of the inner surface IS) can be used as the position reference point for the second leakage structure LC.

[0107] If the boundary between the inner surface IS and the upper surface US and / or the lower surface LS is arc-shaped, the midpoint of the upper boundary of the inner surface IS of the sound generating unit 11 can be selected by the following exemplary method: A projected outline of the sound generating unit 11 along the thickness direction Z may be determined, or two first positioning points on the sound generating unit 11 that are the greatest perpendicular to the short-axis center plane of a magnetic circuit assembly (e.g., a magnetic circuit assembly 1144 described later) of the transducer along the long axis direction X and that are closest to the upper surface US may be determined, the projected outline of the sound generating unit 11 between the two first positioning points may be determined to be the projected line of the upper boundary of the inner surface IS, or the line segment on the sound generating unit 11 that is closest to the inner surface IS and whose projection completely overlaps the projected line of the upper boundary of the inner surface IS may be determined to be the upper boundary of the inner surface IS. In some alternative embodiments, when one or more side surfaces (e.g., inner surface IS, upper surface US, and / or lower surface LS) of the sound generating unit 11 are arcuate surfaces, the intersection line between a tangent plane parallel to the XY plane (formed by the major axis direction X and the minor axis direction Y) of the inner surface IS and a tangent plane parallel to the ZX plane (formed by the thickness direction Z and the major axis direction X) of the upper surface US may be determined to be the upper boundary of the inner surface IS. The midpoint of the upper boundary of the inner surface IS may be the intersection point of the upper boundary of the inner surface IS and the minor axis center plane of the magnetic circuit assembly. The minor axis center plane of the magnetic circuit assembly refers to a plane that is parallel to the minor axis direction Y and the thickness direction Z of the sound generating unit 11 and passes through the central axis of the magnetic circuit assembly.

[0108] Similarly, the 1 / 3 point of the lower boundary of the inner surface IS of the sound-generating unit 11 can be selected in the following exemplary manner: a projected outline of the sound-generating unit 11 along the thickness direction Z may be determined; two second positioning points on the sound-generating unit 11 that are the greatest perpendicular distance from the short-axis center plane of the magnetic circuit assembly along the long axis direction X and that are closest to the lower surface LS may be determined; the projected outline of the sound-generating unit 11 between the two second positioning points may be determined to be the projected line of the lower boundary of the inner surface IS; or the line segment on the sound-generating unit 11 that is closest to the inner surface IS and whose projection completely overlaps the projected line of the lower boundary of the inner surface IS may be determined to be the lower boundary of the inner surface IS. In some alternative embodiments, when one or more side surfaces (e.g., inner surface IS, upper surface US, and / or lower surface LS) of the sound generating unit 11 are arcuate surfaces, the intersection line between a tangent plane parallel to the YX plane (formed by the minor axis direction Y and the major axis direction X) of the inner surface IS and a tangent plane parallel to the ZX plane (formed by the thickness direction Z and the major axis direction X) of the lower surface LS may be determined to be the lower boundary of the inner surface IS. The one-third point of the lower boundary of the inner surface IS may be the intersection point of the lower boundary of the inner surface IS and a trisection plane adjacent to the free end FE of the magnetic circuit assembly. The trisection plane adjacent to the free end FE of the magnetic circuit assembly refers to a plane that is parallel to the minor axis direction Y and the thickness direction Z of the sound generating unit 11 and passes through the trisection point adjacent to the free end FE of the long axis of the magnetic circuit assembly.

[0109] For example only, in this specification, the midpoint of the upper boundary of the inner surface IS and the 1 / 3 point of the lower boundary thereof are set as the position reference points for the first leakage structure UC and the second leakage structure LC, respectively. Note that the selected midpoint of the upper boundary of the inner surface IS and the 1 / 3 point of the lower boundary thereof are merely exemplary reference points for describing the positions of the first leakage structure UC and the second leakage structure LC. In some embodiments, other reference points may be selected to describe the positions of the first leakage structure UC and the second leakage structure LC. For example, because different users' ears are different, the first leakage structure UC / second leakage structure LC formed when the earphone 10 is worn may be gaps with gradually changing widths. In this case, the reference positions of the first leakage structure UC / second leakage structure LC may be positions on the upper boundary / lower boundary of the inner surface IS that are close to the region where the gap width is largest. For example, the 1 / 3 point close to the free end FE of the upper boundary of the inner surface IS may be set as the position of the first leakage structure UC, and the midpoint of the lower boundary of the inner surface IS may be set as the position of the second leakage structure LC.

[0110] In some embodiments, as shown in FIGS. 14 to 16 , when the earphone 10 is worn, part or all of the projection of the sound emitting hole 112 onto the sagittal plane is located within the cavity of the concha, and the sound emitting hole 112 can be located as close to the ear canal as possible to increase the intensity of the sound in the ear canal (i.e., the listening position) from the sound emitting hole 112. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.05 mm to 6.05 mm. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.50 mm to 5.85 mm. In some embodiments, the range of the distance h from the center O of the sound emitting hole 112 to the lower side surface LS of the sound generating unit 11 along the Y direction is 4.80 mm to 5.50 mm. In some embodiments, the range of the distance h along the Y direction from the center O of the sound output hole 112 to the lower side surface LS of the sound generating unit 11 is 5.20 mm to 5.55 mm.

[0111] In some embodiments, the major axis dimension of the sound generating unit 11 must not be too long to ensure that at least a portion of the sound generating unit 11 is inserted into the cavity of the concha. To ensure that at least a portion of the sound generating unit 11 is inserted into the cavity of the concha, the distance from the center O of the sound emitting hole 112 to the rear surface RS of the sound generating unit 11 along the X direction must not be too close. Otherwise, all or part of the area of ​​the sound emitting hole may be blocked by the free end FE abutting against the wall of the cavity of the concha, reducing the effective area of ​​the sound emitting hole. Therefore, in some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear surface RS of the sound generating unit 11 along the X direction is 8.15 mm to 12.25 mm. In some embodiments, the range of the distance from the center O of the sound emitting hole 112 to the rear surface RS of the sound generating unit 11 along the X direction is 8.50 mm to 12.00 mm. In some embodiments, the range of the distance from the center O of the sound output hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 8.85 mm to 11.65 mm. In some embodiments, the range of the distance from the center O of the sound output hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 9.25 mm to 11.15 mm. In some embodiments, the range of the distance from the center O of the sound output hole 112 to the rear side surface RS of the sound generating unit 11 along the X direction is 9.60 mm to 10.80 mm.

[0112] 16 , the projection of the upper boundary of the medial surface IS onto the sagittal plane may overlap with the projection of the upper surface US onto the sagittal plane, and the projection of the lower boundary of the medial surface IS onto the sagittal plane may overlap with the projection of the lower surface LS onto the sagittal plane. The projection of the position reference point of the first leakage structure UC (i.e., the midpoint of the upper boundary of the medial surface IS) onto the sagittal plane is point A, the projection of the position reference point of the second leakage structure LC (i.e., the 1 / 3 point of the lower boundary of the medial surface IS) onto the sagittal plane is point C, the projection of the center O of the sound emission hole 112 onto the sagittal plane is point O′, the projection of the center O1 of the first decompression hole 1131 onto the sagittal plane is point O1′, and the projection of the center O2 of the second decompression hole 1132 onto the sagittal plane is point O2′.

[0113] 16 , in some embodiments, when the earphone 10 is worn, the projection of the sound generating unit 11 of the earphone 10 onto the sagittal plane may at least partially cover the user's ear canal, but the ear canal can communicate with the outside via the cavity of the concha, thereby freeing both ears of the user. In some embodiments, the sound emitting hole 112 outputs sound to the outside via the first leakage structure UC and the second leakage structure LC, and the sound is canceled out in the far field with the sound output from the first decompression hole 1131 and / or the second decompression hole 1132. Therefore, to ensure the sound leakage cancellation effect, it is necessary to reasonably design the distances between the sound emitting hole 112 and the first / second decompression holes 1131 / 1132 and the first leakage structure UC and the second leakage structure LC. In some embodiments, to ensure sound intensity in the ear canal, the sound output hole 112 needs to be located closer to the ear canal when the earphone is worn. Therefore, the sound output hole 112 can be located closer to the lower side surface LS than the upper side surface US, i.e., the sound output hole 112 can be located farther away from the first leakage structure UC. Considering that the greater the distance from the sound output hole 112 to the first leakage structure UC, the larger the required width dimension of the sound generating unit 11. In this case, the volume V of the cavity structure formed between the sound generating unit 11 and the cavity of the concha becomes larger, and accordingly, the listening index of the entire earphone 10 (within the entire frequency range) may become smaller. This is because, due to the influence of air-acoustic resonance within the cavity structure, air-acoustic resonance occurs within the cavity structure at the resonant frequency of the cavity structure, radiating sound outward at a much louder level than the decompression hole, significantly increasing sound leakage and significantly reducing the listening index near the resonant frequency.

[0114] Therefore, in some embodiments, assuming that at least a portion of the sound generating unit 11 is inserted into the cavity of the concha, the sound output hole 112 is located close to the auditory canal, the cavity structure has an appropriate volume V, and the sound collection effect of the auditory canal is improved. To achieve this, the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane may range from 10.0 mm to 15.2 mm. In some embodiments, the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane ranges from 11.0 mm to 14.2 mm. In some embodiments, the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane ranges from 12.0 mm to 14.7 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 12.5 mm to 14.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 13.0 mm to 13.7 mm.

[0115] In some embodiments, sound leaking from the sound output hole 112 through the first leak structure UC corresponds to the generation of a secondary sound source in the first leak structure UC. To ensure a cancellation effect in the far field between the sound output from the first decompression hole 1131 and the sound leaking from the sound output hole 112 through the first leak structure UC, the first decompression hole 1131 can be located closer to the first leak structure UC. In some embodiments, the first decompression hole 1131 can be located closer to the first leak structure UC than the sound output hole 112, i.e., the distance from the center O of the sound output hole 112 to the midpoint of the upper boundary of the inner surface IS is made larger than the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS, thereby improving the sound leakage cancellation effect when ensuring sound intensity in the ear canal. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is within a range of 1.3 to 2.1. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is within a range of 1.4 to 2.0. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is within a range of 1.5 to 1.9. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center O1 of the first decompression hole 1131 to the midpoint of the upper boundary of the inner surface IS is within a range of 1.6 to 1.8.

[0116] In some embodiments, a projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane may substantially overlap with a projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane. In some embodiments, the range of distances from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 2 mm or less. In some embodiments, the range of distances from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 1 mm or less. In some embodiments, the range of distances from the projection O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is 0.5 mm or less.

[0117] In some embodiments, the greater the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane, the greater the volume V of the cavity structure. Therefore, assuming that at least a portion of the sound generating unit 11 is inserted into the cavity of the concha, in order to install the sound output hole 112 close to the auditory canal and provide the cavity structure with an appropriate volume V to improve the sound collection effect of the auditory canal, in some embodiments, the range of the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 3.5 mm to 5.6 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound output hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 3.9 mm to 5.2 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 4.3 mm to 4.8 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 4.5 mm to 4.6 mm.

[0118] In some embodiments, the distance between the second decompression hole 1132 and the sound emitting hole 112 is increased to reduce the sound from the second decompression hole 1132 being transmitted to the cavity structure via the second leakage structure LC and being canceled out by the sound from the sound emitting hole 112. In some embodiments, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 8.16 mm to 12.24 mm. In some embodiments, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane is 9.16 mm to 11.24 mm. In some embodiments, the range of the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the lower 1 / 3 point of the medial surface IS onto the sagittal plane is 9.66 mm to 10.74 mm.

[0119] In some embodiments, sound leaking from the sound output hole 112 through the second leakage structure LC corresponds to the generation of a secondary sound source in the second leakage structure LC. Considering that the second decompression hole 1132 is close to the opening of the ear canal, the distance from the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) should not be too small to reduce the extent to which the sound from the second decompression hole 1132 is transmitted to the cavity structure through the second leakage structure LC and canceled out in the ear canal with the sound from the sound output hole 112. Furthermore, the distance from the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) should not be too large to ensure the cancellation effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 through the second leakage structure LC. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS (i.e., the second leakage structure LC) may be in the range of 0.65 to 1.05. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.75 to 1. In some embodiments, the ratio of the distance from the center O of the sound emitting hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.8 to 0.9. In some embodiments, in order to reduce the degree to which the sound from the second decompression hole 1132 is transmitted to the cavity structure via the second leakage structure LC and canceled out in the ear canal with the sound from the sound output hole 112, and to ensure a cancellation effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 via the second leakage structure LC, the ratio of the distance from the center O of the sound output hole 112 to the 1 / 3 point of the lower boundary of the inner surface IS to the distance from the center O2 of the second decompression hole 1132 to the 1 / 3 point of the lower boundary of the inner surface IS is in the range of 0.82 to 0.88.

[0120] In some embodiments, the positional relationship between the center O of the sound emitting hole 112, the 1 / 3 point of the lower boundary of the inner surface IS, and the center O2 of the second decompression hole 1132 may be represented by the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane, to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is within a range of 0.28 to 0.68. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is within a range of 0.33 to 0.59. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is within a range of 0.38 to 0.51. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emission hole 112 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point O2' of the center O2 of the second decompression hole 1132 onto the sagittal plane to the projection point C of the 1 / 3 point of the lower boundary of the inner surface onto the sagittal plane is within the range of 0.41 to 0.48.

[0121] In some embodiments, since the tragus is located near the ear canal opening, the sound emitting hole 112 is likely to be blocked by the tragus. In this case, the sound emitting hole 112 should be located as close to the ear canal as possible, and the sound emitting hole 112 should be kept as far away from the center of the ear canal opening as possible to avoid blocking it. In some embodiments, for convenience of explanation, the positional relationship between a specific position (e.g., the center O of the sound emitting hole 112) and the center of the ear canal opening may be expressed by the distance between the projection point of the position (e.g., the center O of the sound emitting hole 112) onto the sagittal plane and the centroid of the projection of the ear canal opening onto the sagittal plane. For example, in some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane is 2.2 mm to 3.8 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 2.4 mm to 3.6 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 2.6 mm to 3.4 mm. In some embodiments, the range of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 2.8 mm to 3.2 mm. Note that the shape of the projection of the auditory canal opening onto the sagittal plane can be considered to be approximately elliptical, and accordingly, the centroid of the projection of the auditory canal opening onto the sagittal plane can be considered to be the geometric center of the ellipse.

[0122] In some embodiments, to ensure that sound-generating unit 11 enters the cavity of the concha and that there is an adequate gap between the upper boundary of medial surface IS and the cavity of the concha (forming an opening in the cavity structure), the distance from point A, the projection of the midpoint of the upper boundary of medial surface IS onto the sagittal plane, to centroid B of the sagittal projection of the auditory canal opening ranges from 12 mm to 18 mm, and the distance from point O2', the projection of the center O2 of the second decompression hole onto the sagittal plane, to centroid B of the sagittal projection of the auditory canal opening ranges from 6.88 mm to 10.32 mm. In some embodiments, the distance from point A, the projection of the midpoint of the upper boundary of medial surface IS onto the sagittal plane, to centroid B of the sagittal projection of the auditory canal opening ranges from 14 mm to 16 mm, and the distance from point O2', the projection of the center O2 of the second decompression hole onto the sagittal plane, to centroid B of the sagittal projection of the auditory canal opening ranges from 7.88 mm to 9.32 mm. In some embodiments, the range of the distance from the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 14.5 mm to 15.5 mm, and the range of the distance from the projection point O2' of the center O2 of the second decompression hole onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is 7.88 mm to 8.32 mm.

[0123] In some embodiments, to ensure that the sound-generating unit 11 enters the cavity of the concha and that there is an adequate gap between the upper boundary of the medial surface IS and the cavity of the concha (forming an opening of the cavity structure), the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 12 mm to 18 mm. In some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 14 mm to 16 mm. In some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 14.5 mm to 15.5 mm.

[0124] In some embodiments, to ensure that the sound-generating unit 11 enters the cavity of the concha and that there is an adequate gap between the upper boundary of the medial surface IS and the cavity of the concha (forming an opening in the cavity structure), the distance from point C, projected onto the sagittal plane at one-third of the lower boundary of the medial surface IS, to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 1.76 mm to 2.64 mm. In some embodiments, the distance from point C, projected onto the sagittal plane at one-third of the lower boundary of the medial surface IS, to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 1.96 mm to 2.44 mm. In some embodiments, the distance from point C, projected onto the sagittal plane at one-third of the lower boundary of the medial surface IS, to the centroid B of the projection of the auditory canal opening onto the sagittal plane ranges from 2.16 mm to 2.24 mm.

[0125] In some embodiments, in order to allow the sound generating unit 11 to enter the cavity of the concha, to prevent the first decompression hole 1131 from being blocked by the ear structure, and to locate the sound emitting hole 112 as close to the ear canal as possible without blocking it, the ratio of the distance from the center O of the sound emitting hole 112 to the center of the ear canal opening and the distance from the center O1 of the first decompression hole 1131 to the center of the ear canal opening can be set within an appropriate range. Accordingly, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane and the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the ear canal opening onto the sagittal plane can be set within an appropriate range. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane may be in the range of 0.10 to 0.35. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is in the range of 0.15 to 0.28. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is within a range of 0.18 to 0.25. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane to the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the centroid B of the projection of the auditory canal opening onto the sagittal plane is within a range of 0.19 to 0.22.

[0126] As shown in FIGS. 14 to 16 , in some embodiments, the distance between the center O of the sound emitting hole 112 and the upper vertex M of the earhook 12 ranges from 22.5 mm to 34.5 mm when a user is wearing the earphone 10, so that part or all of the projection of the sound emitting hole 112 onto the sagittal plane is located within the area of ​​the cavity of the concha, and is premised on ensuring that at least a portion of the sound generating unit 11 is inserted into the cavity of the concha. In some embodiments, the upper vertex of the earhook 12 may be the position on the outer contour of the earhook that is the longest distance in the vertical axis direction relative to a specific point on the user's neck when the open-type earphone is worn by the user, such as the vertex M shown in FIG. 14 . In some embodiments, the upper vertex of the earhook 12 may be the highest point on the inner contour of the earhook along the vertical axis of the user when worn by the user. In some embodiments, the distance between the center O of the sound emitting hole 112 and the upper vertex M of the earhook 12 ranges from 25 mm to 32 mm when the user is wearing the earphone 10. In some embodiments, when a user is wearing the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper vertex M of the earhook 12 is 27.5 mm to 29.5 mm. In some embodiments, when a user is wearing the earphone 10, the range of the distance between the center O of the sound emitting hole 112 and the upper vertex M of the earhook 12 is 28 mm to 29 mm. In some embodiments, when a user is wearing the earphone 10, the range of the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the projection point M' of the upper vertex M of the earhook 12 onto the sagittal plane is 18 mm to 30 mm. In some embodiments, when a user is wearing the earphone 10, the range of the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the projection point M' of the upper vertex M of the earhook 12 onto the sagittal plane is 20 mm to 25 mm. In this specification, when the earphone is worn, the distance between the projection point O' of the center O of the sound hole 112 onto the sagittal plane and a specific point (for example, the projection point M' of the upper vertex M of the ear hook 12 onto the sagittal plane) can be determined by the following exemplary method.In the worn state, multiple components of the earphone 10 (e.g., the sound generating unit 11, the first earhook portion 121, and the second earhook portion 122) can be fixed to the stabilizing member using a fixing member or adhesive, and then the human head model and the pinna structure can be removed, with the earphone 10 fixed to the stabilizing member facing the ear, and its posture is the same as that in the worn state. At this time, the position of the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane can be determined. Furthermore, the distance between the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane and the specific point can be determined.

[0127] In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the top apex M of the earhook 12 must not be too small to prevent the sound generating unit 11 from blocking the first decompression hole 1131 when it enters the cavity of the concha. Furthermore, if at least a portion of the sound generating unit 11 can enter the cavity of the concha, the distance from the center O1 of the first decompression hole 1131 to the top apex M of the earhook 12 must not be too large. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the top apex M of the earhook 12 ranges from 16.15 mm to 24.25 mm. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the top apex M of the earhook 12 ranges from 17.55 mm to 23.25 mm. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 ranges from 19.55 mm to 20.55 mm. In some embodiments, the positional relationship between the center O1 of the first decompression hole 1131 and the upper apex M of the ear hook 12 may be represented by the distance between the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane and the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane. For example, in some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane ranges from 15.83 mm to 23.75 mm. In some embodiments, the distance from the projection point O1' of the center O1 of the first decompression hole 1131 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane ranges from 18 mm to 20 mm.

[0128] 14 , the ratio of the distance from the center O of the sound emitting hole 112 to the top vertex M of the ear hook 12 to the distance from the center O1 of the first decompression hole 1131 to the top vertex M of the ear hook 12 is within a range of 1.10 to 1.70. In some embodiments, when a user is wearing the earphone 10, the ratio of the distance from the center O of the sound emitting hole 112 to the top vertex M of the ear hook 12 to the distance from the center O1 of the first decompression hole 1131 to the top vertex M of the ear hook 12 is within a range of 1.25 to 1.65. Preferably, the ratio of the distance from the center O of the sound emitting hole 112 to the top vertex M of the ear hook 12 to the distance from the center O1 of the first decompression hole 1131 to the top vertex M of the ear hook 12 is within a range of 1.35 to 1.55. In some embodiments, the relative positional relationship between the center O of the sound emitting hole 112, the upper apex M of the ear hook 12, and the center O1 of the first decompression hole 1131 may be represented by the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12. For example, in some embodiments, in the wearing method shown in Fig. 14, the ratio of the distance from the projection point O' of the center O of the sound emitting hole 112 onto the sagittal plane to the projection point M' of the upper apex M of the ear hook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper apex M of the ear hook 12 is in the range of 1.11 to 1.71. In some embodiments, the ratio of the distance from the projection point O' of the center O of the sound emission hole 112 onto the sagittal plane to the projection point M' of the upper vertex M of the ear hook 12 onto the sagittal plane to the distance from the center O1 of the first decompression hole 1131 to the upper vertex M of the ear hook 12 is in the range of 1.35 to 1.50.

[0129] The above description of the earphone 10 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art may make various changes and modifications based on the description of the present application. For example, if only one decompression hole is provided in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, i.e., the decompression hole may be provided on the upper surface US. In this case, the decompression hole can be regarded as a single point sound source outside the cavity structure 41 shown in FIG. 10. The ratio of the distance from the center O of the sound output hole 112 to the midpoint of the upper boundary of the inner surface IS to the distance from the center of the decompression hole to the midpoint of the upper boundary of the inner surface IS is within the range of 1.3 to 2.1. These changes and modifications remain within the scope of protection of the present application.

[0130] FIG. 17 is a schematic diagram of an earphone housing according to some embodiments of the present disclosure.

[0131] In some embodiments, as shown in FIG. 17 , the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 may be racetrack-shaped, and both ends of the racetrack may be subarc-shaped or semicircular. In some embodiments, the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 all have a straight cylindrical structure. In some embodiments, to facilitate manufacturing and reduce process difficulty, the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 may all have a trumpet-shaped structure, for example, the area of ​​an inner opening is smaller than the area of ​​the corresponding outer opening, or the area of ​​an outer opening is smaller than the area of ​​the corresponding inner opening. The shapes of the sound emitting hole 112, the first decompression hole 1131, and the second decompression hole 1132 may include, but are not limited to, a circle, an ellipse, a racetrack, etc. For ease of explanation, the following description will be given taking as an example an example where the sound output hole 112, the first decompression hole 1131, and the second decompression hole 1132 have a racetrack-shaped straight cylindrical structure. In this case, the maximum dimension of the sound output hole 112 in the width direction Y is defined as the corresponding minor axis dimension (width), the maximum dimensions of the first decompression hole 1131 and the second decompression hole 1132 in the thickness direction Z are defined as the corresponding minor axis dimensions (width), the maximum dimensions of the sound output hole 112, the first decompression hole 1131, and the second decompression hole 1132 in the major axis direction X are defined as the corresponding major axis dimensions (length), the dimension of the sound output hole 112 in the thickness direction Z is defined as the corresponding depth, and the dimension of the first decompression hole 1131 and the second decompression hole 1132 in the width direction Y are defined as the corresponding depth.

[0132] In some embodiments, when the area S3 (hereinafter simply referred to as "area") of the outer opening of the sound output hole 112 increases or the depth D3 of the sound output hole 112 decreases, the resonant frequency f1 of the front cavity of the earphone shifts to a higher frequency. During vibration of the diaphragm, the air in the front cavity is compressed or expanded in accordance with the vibration of the diaphragm, and the compressed or expanded air moves back and forth in the air column at the sound output hole, causing the air column to radiate sound to the outside. In some embodiments, the air column at the sound output hole 112 has mass, which corresponds to the acoustic mass of the sound output hole 112. The acoustic mass affects the acoustic output of the sound generating unit 11 as part of the acoustic resistance. As a result, the dimensions of the sound output hole 112 also affect the acoustic mass Ma of the sound output hole 112. Specifically, when the area S3 of the sound output hole 112 increases or the depth D3 of the sound output hole 112 decreases, the acoustic mass Ma of the sound output hole 112 decreases.

[0133] In some embodiments, the area S3 of the sound emitting hole 112 needs to have a value within an appropriate range in order to increase the resonance frequency f1 of the front cavity and ensure the acoustic mass Ma of the sound emitting hole 112. In addition, if the area S3 of the sound emitting hole 112 is too large, it may have a certain impact on other aspects such as the appearance and structural strength of the earphone 10. Therefore, in some embodiments, the value range of the area S3 of the sound emitting hole 112 is 2.87 mm 2 ~46.10mm 2 In some embodiments, the range of values ​​for the area S3 of the sound emission hole 112 is 2.875 mm 2 ~46mm 2 In some embodiments, the range of values ​​for the area S3 of the sound emission hole 112 is 8 mm 2 ~30mm 2 In some embodiments, the range of values ​​for the area S3 of the sound emission hole 112 is 10 mm 2 ~26mm 2 By way of example only, the value of the area S3 of the sound emission hole 112 may be 11 mm 2 ~15mm 2 (For example, 11.49 mm 2) For example, the value of the area S3 of the sound emission hole 112 may be 25 mm 2 ~26mm 2 (For example, 25.29 mm 2 ) may also be used.

[0134] To ensure that the front cavity has a sufficiently large resonant frequency, the smaller the value of the depth D3 of the sound emitting hole 112, the better. However, because the sound emitting hole 112 is installed in the housing 111, the depth D3 of the sound emitting hole 112 is the thickness of the housing 111. If the thickness of the housing 111 is too small, it may affect the structural strength of the earphone 10 and increase the difficulty of the corresponding processing. In some embodiments, the value of the depth D3 of the sound emitting hole 112 may range from 0.3 mm to 3 mm. In some embodiments, the value of the depth D3 of the sound emitting hole 112 may range from 0.3 mm to 2 mm. In some embodiments, the value of the depth D3 of the sound emitting hole 112 may range from 0.3 mm to 1 mm.

[0135] In some embodiments, the range of values ​​for the area of ​​the sound emission hole 112 is 2.875 mm 2 ~46mm 2 The depth D3 of the sound emitting hole 112 may range from 0.3 mm to 3 mm. In this case, the ratio S3 / D3 of the area S3 of the corresponding sound emitting hole 112 to the square of the depth D3 is 2 The value of may range from 0.31 to 512.2. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value of may range from 1 to 400. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value of may range from 3 to 300. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value of may range from 5 to 200. In some embodiments, the ratio S3 / D3 of the area S3 of the sound emission hole 112 to the square of the depth D3 2 The value may range from 10 to 50.

[0136] In some embodiments, when other structures (e.g., sound outlet 112, etc.) are fixed, as the area of ​​decompression hole 113 (e.g., first decompression hole 1131 and / or second decompression hole 1132) gradually increases, the resonant frequency corresponding to the rear cavity of earphone 10 gradually shifts to higher frequencies, and the flat region of the frequency response curve becomes wider. In addition, in practical applications, if the area of ​​first decompression hole 1131 and / or the area of ​​second decompression hole 1132 are too large, it will have a certain impact on other aspects of earphone 10, such as appearance, structural strength, waterproofness, and dustproofness, so the area S1 of first decompression hole 1131 and / or the area S2 of second decompression hole 1132 should not be too large. In some embodiments, the area range of first decompression hole 1131 is 3.78 mm 2 ~86.21mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~54.68mm 2 In some embodiments, the area of ​​the first decompression hole 1131 is 3.78 mm 2 ~22.07mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~16.07mm 2 In some embodiments, the area of ​​the first decompression hole 1131 is 6.78 mm 2 ~20.07mm 2 and the area of ​​the second decompression hole 1132 is 4.78 mm 2 ~13.07mm 2 is.

[0137] In some embodiments, since the first decompression hole 1131, the second decompression hole 1132, and the sound emitting hole 112 are installed in the housing 111, the depth D1 of the first decompression hole 1131 and the depth D2 of the second decompression hole 1132 may be the same as the depth D3 of the sound emitting hole 112 to facilitate processing and design. In some embodiments, the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may range from 0.3 mm to 3 mm. In some embodiments, the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may range from 0.3 mm to 2 mm. In some embodiments, the depth D1 of the first decompression hole 1131 (or the depth D2 of the second decompression hole 1132) may range from 0.3 mm to 1 mm.

[0138] In some embodiments, the resonant frequency f2 of the rear cavity may be close to or equal to the resonant frequency f1 of the front cavity 114 to better cancel the second sound leakage formed by the decompression holes 113 and the first sound leakage formed in the far field by the sound emission holes 112. Based on equation (2), the ratio of the resonant frequency f1 of the front cavity 114 to the resonant frequency f2 of the rear cavity,

[0139]

number

[0140] is as follows:

[0141]

number

[0142] Based on equation (2), the ratio of the resonant frequency f1 of the front cavity 114 to the resonant frequency f2 of the rear cavity may be related to the volume ratio between the front cavity and the rear cavity, the ratio between the opening area of ​​the sound emitting hole 112 and the opening area of ​​the decompression hole 113, and the ratio between the depth of the sound emitting hole 112 and the depth of the decompression hole 113. By setting the range of some of these parameters (e.g., the ratio between the opening area of ​​the sound emitting hole 112 and the opening area of ​​the decompression hole 113) to other parameters (e.g., the volume ratio between the front cavity and the rear cavity), the second sound leakage formed by the decompression hole 113 and the first sound leakage formed in the far field by the sound emitting hole 112 can be better offset, thereby improving the output effect of the earphone 10.

[0143] In some embodiments, the ratio of the area S3 to the depth D3 of the sound emitting holes 112 to the ratio of the total area of ​​the decompression holes 113 to their corresponding depths is set to a range of 1.10 to 1.75 to achieve a resonance frequency ratio between the front cavity and the rear cavity in the range of 0.5 to 1.5. In some embodiments, the ratio of the area S3 to the depth D3 of the sound emitting holes 112 to the ratio of the total area of ​​the decompression holes 113 to their corresponding depths is set to a range of 1.25 to 1.65 to achieve a resonance frequency ratio between the front cavity and the rear cavity in the range of 0.7 to 1.3. In some embodiments, the ratio of the area S3 to the depth D3 of the sound emitting holes 112 to the ratio of the total area of ​​the decompression holes 113 to their corresponding depths is set to a range of 1.35 to 1.55 to achieve a resonance frequency ratio between the front cavity and the rear cavity in the range of 0.8 to 1.2.

[0144] In some embodiments, the shape of the sound emitting hole 112 also affects the acoustic resistance of the sound emitting hole 112. For example, the longer and narrower the sound emitting hole 112, the greater the acoustic resistance of the sound emitting hole 112, which is detrimental to the acoustic output of the front cavity. Therefore, to ensure good low-frequency output of the sound emitting hole 112 and to increase the volume of sound output from the sound emitting hole 112, the ratio of the long axis dimension L3 to the short axis dimension W3 of the sound emitting hole 112 (also called the aspect ratio of the sound emitting hole 112) needs to be within a predetermined appropriate value range. In some embodiments, when the area of ​​the sound emitting hole 112 is constant, the aspect ratio of the sound emitting hole 112 may be within a range of 1 to 10 to ensure a strong frequency response at low frequencies in the frequency response curve of the front cavity. In some embodiments, the aspect ratio of the sound emitting hole 112 may be between 2 and 7. In some embodiments, the aspect ratio of the sound emitting hole 112 may be between 2 and 3. In some embodiments, the aspect ratio of the sound emitting holes 112 may be 2. In some embodiments, the length L3 of the sound emitting holes 112 may be large to increase the resonance frequency of the resonance peak of the front cavity as much as possible. However, in order to avoid reducing the high-frequency output corresponding to the resonance peak of the front cavity and taking into consideration the structural stability of the sound generating unit 11, the length L3 of the sound emitting holes 112 may be 17 mm or less, and the width W3 of the sound emitting holes 112 may be 10 mm or less. In some embodiments, the length L3 of the sound emitting holes 112 may be 2 mm to 11 mm. In some embodiments, the length L3 of the sound emitting holes 112 may be 3 mm to 11 mm. In some embodiments, the length L3 of the sound emitting holes 112 may be 3 mm to 16 mm. In some embodiments, the length L3 of the sound emitting holes 112 may be 5 mm to 13 mm. In some embodiments, the length L3 of the sound emitting holes 112 may be 6 mm to 9 mm.

[0145] In some embodiments, the width W3 of the sound emitting hole 112 can be determined based on the length L3 and the aspect ratio. For example, if the aspect ratio of the sound emitting hole 112 is 2, the width W3 of the sound emitting hole 112 is 1.5 mm to 5.5 mm. The area of ​​the corresponding racetrack-shaped sound emitting hole 112 is 4.02 mm. 2 ~54mm 2 By setting the range of the length L3 of the sound output hole 112, the flat region of the frequency response curve can be increased to improve the sound quality of the earphone 10, while also achieving a structural design for the sound generating unit 11. As a mere example, the area of ​​the racetrack-shaped sound output hole 112 can be approximately 11.5 mm 2 Accordingly, the length L3 of the sound emitting hole 112 can be determined to be 5 mm to 6 mm, and the width W3 of the sound emitting hole 112 can be determined to be 2.5 mm to 3 mm. Within the above size range, the earphone 10 can have a flat frequency response curve over a wide frequency range and sufficient high-frequency output. Furthermore, a small area value is also advantageous for structural stability.

[0146] In some embodiments, as shown in FIGS. 14 to 16 and their descriptions, the center of the sound emitting hole 112 is located on or near the perpendicular bisecting plane of the line connecting the center of the first decompression hole 1131 and the center of the second decompression hole 1132, and the sound emitting hole 112 is located on the side of the housing 111 closest to the second decompression hole 1132 in the Y direction, rather than at the middle position. Because the sound emitting hole 112 is installed close to the ear canal, the second decompression hole 1132 is closer to the ear canal, and the first decompression hole 1131 is farther from the ear canal. Compared to the first decompression hole 1131, the sound waves emitted from the second decompression hole 1132 are more likely to cancel out in the near field with the sound waves emitted from the sound emitting hole 112. Therefore, the sound pressure amplitude at the second decompression hole 1132 may be smaller than the sound pressure amplitude at the first decompression hole 1131, thereby increasing the listening volume in the ear canal. In some embodiments, the second decompression holes 1132 may have a larger acoustic resistance than the first decompression holes 1131. For example, the dimensions of the second decompression holes 1132 may be smaller than the dimensions of the first decompression holes 1131, thereby allowing the second decompression holes 1132 to have a larger acoustic resistance. For example, the area of ​​the first decompression holes 1131 may be larger than the area of ​​the second decompression holes 1132.

[0147] In some embodiments, to ensure that the sound generation efficiency of sound generating unit 11 is sufficiently high and that at least a portion of sound generating unit 11 can be inserted into the cavity of the concha, the volumes of the front and rear cavities of sound generating unit 11 must be neither too large nor too small, and the ratio of the area of ​​sound emitting hole 112 to the total area of ​​decompression holes 113 (for example, the sum of the areas of first decompression hole 1131 and second decompression hole 1132) is set to 0.3 to 0.9 so that the resonant frequency ratio between the front cavity and the rear cavity is within a range of 0.3 to 1.7. In some embodiments, the ratio of the area of ​​sound emitting hole 112 to the total area of ​​decompression holes 113 is set to 0.5 to 0.85 so that the resonant frequency ratio between the front cavity and the rear cavity is within a range of 0.5 to 1.5. In some embodiments, the ratio of the area of ​​the sound emitting holes 112 to the total area of ​​the decompression holes 113 is set to 0.6 to 0.8 in order to set the resonance frequency ratio between the front cavity and the rear cavity in the range of 0.7 to 1.3. In some embodiments, the ratio of the area of ​​the sound emitting holes 112 to the total area of ​​the decompression holes 113 is set to 0.65 to 0.75 in order to set the resonance frequency ratio between the front cavity and the rear cavity in the range of 0.8 to 1.2.

[0148] In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is between 0.5 and 1.5. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is between 0.6 and 1.3. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is between 0.65 and 1.25. In some embodiments, when the earphone 10 includes only one decompression hole, the ratio of the area S3 of the sound emitting hole 112 to the area of ​​the decompression hole is between 0.7 and 1.2.

[0149] FIG. 18 is a contour map of the volume ratio between the front cavity and the rear cavity and the ratio between the opening area of ​​the sound emitting hole and the opening area of ​​the decompression hole according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 18, the range of the resonant frequency ratio between the front cavity and the rear cavity may be related to the ratio between the area of ​​the sound emitting hole and the area of ​​the decompression hole and the volume ratio between the front cavity and the rear cavity. Thus, by setting the ratio between the area of ​​the sound emitting hole and the area of ​​the decompression hole and the volume ratio between the front cavity and the rear cavity, the resonant frequency ratio between the front cavity and the rear cavity can be kept within a target range. For example, as shown in FIG. 18, if the value of the ratio f1 / f2 between the resonant frequency f1 of the front cavity and the resonant frequency f2 of the rear cavity is set to a range of 0.1 to 5, the opening area S3 of the sound emitting hole 112 is set to a value within the total opening area S of the first decompression hole 1131 and the second decompression hole 1132. 1+2 For example, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be smaller than the opening area S 1+2 The ratio S3 / S 1+2 may be in the range of 0.1 to 0.99, and the value of the ratio V2 / V1 of the volume V2 of the rear cavity to the volume V1 of the front cavity may be in the range of 0.1 to 10. Also, for example, if the value of the ratio f1 / f2 of the resonance frequency f1 of the front cavity to the resonance frequency f2 of the rear cavity is in the range of 0.5 to 2, the opening area S3 of the sound release hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 will be 1+2 The ratio S3 / S 1+2 may be 0.2 to 0.7, and the ratio V2 / V1 of the volume V2 of the rear cavity to the volume V1 of the front cavity may be in the range of 1 to 7.

[0150] In some embodiments, the opening area S3 of the sound emission hole 112 is the sum of the opening area S of the first decompression hole 1131 and the second decompression hole 1132. 1+2 For example, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be larger than the above. 1+2 The ratio S3 / S 1+2may be in the range of 1 to 10, and the value of the ratio V2 / V1 of the volume V2 of the rear cavity 116 to the volume V1 of the front cavity 114 may be in the range of 0.1 to 10. As shown in FIG. 18, the value of the ratio f1 / f2 of the resonance frequency f1 of the corresponding front cavity 114 to the resonance frequency f2 of the rear cavity 116 may be in the range of 0.5 to 10. Also, for example, when the opening area S3 of the sound release hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 are 1+2 The ratio S3 / S 1+2 18, the ratio f1 / f2 of the resonant frequency f1 of the front cavity 114 to the resonant frequency f2 of the rear cavity 116 may be in the range of 1 to 8.

[0151] In some embodiments, S3 / S is calculated based on V2 / V1 with reference to the contours shown in FIG. 1+2 Determine the range of values ​​of S3 / S 1+2 By determining the value range of V2 / V1 based on the above, the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity, and further, the second sound leakage formed by the decompression hole 113 and the first sound leakage formed in the far field by the sound emission hole 112 can be better offset, improving the output effect of the earphone 10. For example, as can be seen from equation (2), in order for the rear cavity to have a sufficiently large resonant frequency f2, the volume V2 of the rear cavity may be small, for example, V2 / V1 may be smaller than 1. As shown in FIG. 18, if the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity (for example, if the value of f1 / f2 is about 1), S3 / S 1+2 The value may range from 1 to 2.5.

[0152] As an example only, the volume of the front cavity V1 is 190 mm 3 ~220mm 3The volume V2 of the rear cavity may be within the range of 60 mm 3 ~80mm 3 In some embodiments, the value of V2 / V1 may be in the range of 0.2 to 0.4. In some embodiments, the value of V2 / V1 may be in the range of 0.25 to 0.45.

[0153] In some embodiments, by combining the above-mentioned related contents, the opening area S3 of the sound emission hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 can be calculated. 1+2 The ratio S3 / S 1+2 By adjusting the range, the earphone can have a good output effect. For example, the length L3 of the sound emitting hole 112 can be 3mm to 11mm, the ratio of the length L3 to the width W3 of the cross section of the sound emitting hole 112 is 2, and the area of ​​the corresponding racetrack-shaped sound emitting hole 112 is 4.02mm. 2 ~54mm 2 The first decompression hole 1131 may have a length L1 of 6 mm and a width W1 of 1.5 mm, and accordingly, the area of ​​the first decompression hole 1131 may be 8.51 mm 2 The second decompression hole 1132 may have a length L2 of 3 mm and a width W2 of 1.5 mm, and accordingly, the area of ​​the second decompression hole 1132 may be 4.02 mm 2 As a result, the opening area S3 of the sound release hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 may be 1+2 The ratio S3 / S 1+2 For example, the first decompression hole 1131 may have a length L1 of 2 mm to 8 mm and a width W1 of 1.5 mm, and the area of ​​the first decompression hole 1131 may be 2.517 mm 2 ~11.5171mm 2 The second decompression hole 1132 may have a length L2 of 3 mm to 6 mm and a width W2 of 1.5 mm, and the area of ​​the second decompression hole 1132 is 4.017 mm 2 ~8.5171mm 2The sound emission hole 112 may have a length L3 of 5 mm and a width W3 of 2.5 mm, and accordingly, the area S3 is 11.16 mm 2 As a result, the opening area S3 of the sound release hole 112 and the total opening area S of the first decompression hole 1131 and the second decompression hole 1132 are 1+2 The ratio S3 / S 1+2 is 0.56 to 1.71.

[0154] As shown in Figure 18, V2 / V1 is in the range of 0.25 to 0.45, and S3 / S 1+2 When V2 / V1 is in the range of 0.25 to 0.45, and S3 / S 1+2 When f1 / f2 is in the range of 0.56 to 1.71, f1 / f2 is in the range of 0.5 to 0.9. As can be seen from the above, by determining the volume ratio and / or area ratio based on the above range, the resonant frequency f2 of the rear cavity is close to or equal to the resonant frequency f1 of the front cavity.

[0155] Figure 19 is a frequency response curve diagram corresponding to different volume levels at the sound output holes according to some embodiments herein, Figure 20 is a frequency response curve diagram corresponding to different volume levels at the first decompression hole according to some embodiments herein, and Figure 21 is a frequency response curve diagram corresponding to different volume levels at the second decompression hole according to some embodiments herein. As shown in Figures 19-21, as the volume gradually decreases from the maximum volume, the sound pressure at the sound output holes 112, the sound pressure at the first decompression hole 1131, and the sound pressure at the second decompression hole 1132 all gradually decrease.

[0156] The sound pressure at sound emitting hole 112, the sound pressure at first decompression hole 1131, and the sound pressure at second decompression hole 1132 refer to the sound pressure at a point 4 mm away from sound emitting hole 112, a point 4 mm away from first decompression hole 1131, and a point 4 mm away from second decompression hole 1132, respectively. In the process of measuring the sound pressure at each hole, other holes are not blocked. For example, when measuring the sound pressure at sound emitting hole 112, first decompression hole 1131 and second decompression hole 1132 are not blocked or blocked.

[0157] 10 to 13 and their descriptions, by providing a cavity structure, sound waves emitted from the decompression holes (first decompression holes 1131 or second decompression holes 1132) and sound leakage caused by the sound output holes 112 can be offset in the far field, which is advantageous for reducing far-field sound leakage and minimizing the impact of sound waves emitted from the decompression holes on near-field listening. Thus, in some embodiments, by making the sound pressure amplitude at the decompression holes 113 (first decompression holes 1131 or second decompression holes 1132) closer to the sound pressure amplitude at the sound output holes 112, far-field sound leakage can be effectively reduced without affecting near-field listening. In some embodiments, to effectively reduce far-field sound leakage, the ratio of the sound pressure at the sound output holes 112 to the sound pressure at the first decompression holes 1131 can be set to a range of 0.8 to 1.2 within a specific frequency range (e.g., a range of 3.5 kHz to 4.5 kHz). In some embodiments, the ratio of the sound pressure at the sound emitting holes 112 to the sound pressure at the first decompression holes 1131 may be in the range of 0.9 to 1.1. In some embodiments, the ratio of the sound pressure at the sound emitting holes 112 to the sound pressure at the first decompression holes 1131 may be in the range of 0.95 to 1.05. In some embodiments, to effectively reduce far-field sound leakage, the ratio of the sound pressure at the sound emitting holes 112 to the sound pressure at the second decompression holes 1132 may be in the range of 0.8 to 1.2. In some embodiments, the ratio of the sound pressure at the sound emitting holes 112 to the sound pressure at the second decompression holes 1132 may be in the range of 0.9 to 1.1. In some embodiments, the ratio of the sound pressure at the sound emitting holes 112 to the sound pressure at the second decompression holes 1132 may be in the range of 0.95 to 1.05. In some embodiments, to effectively reduce far-field sound leakage, the ratio of the sound pressure at the sound output hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 0.4 to 0.6. In some embodiments, the ratio of the sound pressure at the sound output hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 0.45 to 0.55. Note that the sound pressure at the sound output hole 112, the sound pressure at the first decompression hole 1131, and the sound pressure at the second decompression hole 1132 refer to sound pressures that correspond to corresponding frequencies at the same volume.

[0158] 19 to 21, at maximum volume and 4000 Hz, the sound pressure at sound output hole 112 is 103.54 dB, the sound pressure at first decompression hole 1131 is 104.5 dB, and the sound pressure at second decompression hole 1132 is 100.74 dB. At this time, the sound pressure at sound output hole 112 is close to the sound pressure at first decompression hole 1131 and the sound pressure at second decompression hole 1132, respectively, so far-field sound leakage can be effectively reduced.

[0159] In some embodiments, when reducing the sound pressure at the second decompression hole 1132 (to reduce the degree to which the sound generated by the second decompression hole 1132 cancels out in the ear canal with the sound generated by the sound output hole 112), and when ensuring a cancellation effect in the far field between the sound output from the second decompression hole 1132 and the sound leaking from the sound output hole 112 via the second leakage structure LC, the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 must not be too small. Also, to avoid the difference between the acoustic resistance at the first decompression hole 1131 and the acoustic resistance at the second decompression hole 1132 affecting the effect of destroying standing waves in the rear cavity, the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 must not be too large. In some embodiments, in order to keep the ratio of the sound pressure at the sound emitting hole 112 to the total sound pressure at the first decompression hole 1131 and the second decompression hole 1132 within an appropriate range (e.g., 0.4 to 0.6), the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 can be within a range of 2.5 to 3.9. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 may be within a range of 2.7 to 3.7. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 may be in the range of 2.85 to 3.45. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 may be in the range of 2.9 to 3.4. In some embodiments, the ratio of the difference (S1-S2) between the area S1 of the first decompression hole 1131 and the area S2 of the second decompression hole 1132 to the area S3 of the sound emitting hole 112 may be in the range of 3.1 to 3.3.

[0160] FIG. 22 is an exemplary internal structural diagram of a sound generating unit according to some embodiments of the present disclosure.

[0161] 22 , the sound-generating unit 11 may include a housing 111 connected to the ear hook 12 and a transducer 116 disposed within the housing 111. In some embodiments, the sound-generating unit 11 may further include a main control circuit board 13 disposed within the housing 111 and a battery (not shown) disposed at the end of the ear hook 12 remote from the sound-generating unit 11, with the battery and the transducer 116 each being electrically connected to the main control circuit board 13 so that the battery can supply power to the transducer 116 under the control of the main control circuit board 13. Of course, both the battery and the transducer 116 may be disposed within the sound-generating unit 11, with the battery being closer to the connected end CE and the transducer 116 being closer to the free end FE.

[0162] In some embodiments, the earphone 10 may include an adjustment mechanism connecting the sound generating unit 11 and the ear hook 12, and different users can use the adjustment mechanism to adjust the relative position of the sound generating unit 11 in their ears while wearing the earphones, thereby positioning the sound generating unit 11 appropriately so that the sound generating unit 11 and the concha form a cavity structure. In addition, the presence of the adjustment mechanism allows users to adjust the earphones 10 to wear them in a more stable and comfortable position.

[0163] Because the cavity of the concha has a certain volume and depth, a certain distance can be maintained between the inner surface IS of the sound-generating unit 11 and the cavity of the concha after the free end FE enters the cavity of the concha. In other words, when worn, the sound-generating unit 11 can form a cavity structure in combination with the cavity of the concha that communicates with the ear canal, and sound emitting holes 112 can be provided in the sound-generating unit 11 (e.g., the inner surface IS), at least a portion of the sound emitting holes 112 can be located within the cavity structure. In this way, when worn, sound waves transmitted through the sound emitting holes 112 are restricted by the cavity structure. That is, the cavity structure can collect sound waves and better transmit them into the ear canal, thereby improving the volume and quality of sounds heard by the user in the near field and thus favoring the improvement of the acoustic effects of the earphone 10. Furthermore, since the sound-generating unit 11 can be installed so as not to block the ear canal when worn, the cavity structure can be semi-open. In this way, part of the sound waves transmitted from the sound emission hole 112 is transmitted to the ear canal, allowing the user to hear the sound, and the other part, together with the sound reflected in the ear canal, is transmitted to the outside of the earphone 10 and the ear unit through the gap between the sound generation unit 11 and the ear unit (for example, the part of the cavity of the concha that is not covered by the sound generation unit 11), thereby forming a first sound leakage in the far field. At the same time, the sound waves transmitted through the decompression holes 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) formed in the sound generation unit 11 usually form a second sound leakage in the far field, where the intensity of the first sound leakage and the intensity of the second sound leakage are equal and the phase of the first sound leakage and the phase of the second sound leakage are (substantially) opposite phases, thereby canceling out the two in the far field, which is advantageous for reducing sound leakage in the far field of the earphone 10.

[0164] In some embodiments, a front cavity 114 may be formed between the transducer 116 and the housing 111, and the sound emission hole 112 is located in an area of ​​the housing 111 that surrounds and forms the front cavity 114, and the front cavity 114 is in communication with the outside through the sound emission hole 112.

[0165] In some embodiments, the front cavity 114 is disposed between the diaphragm of the transducer 116 and the housing 111. To ensure that the diaphragm has sufficient vibration space, the front cavity 114 may have a large depth (i.e., the distance between the diaphragm of the transducer 116 and the housing 111 facing it). In some embodiments, as shown in FIG. 22 , the sound emission holes 112 are disposed on the inner surface IS in the thickness direction Z. In this case, the depth of the front cavity 114 may refer to the dimension of the front cavity 114 in the Z direction. However, if the depth of the front cavity 114 is too large, the dimension of the sound generating unit 11 becomes large, which affects the wearing comfort of the earphone 10. In some embodiments, the depth of the front cavity 114 may be 0.55 mm to 1.00 mm. In some embodiments, the depth of the front cavity 114 may be 0.66 mm to 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.76 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.96 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be 0.97 mm.

[0166] To improve the sound output effect of the earphone 10, the resonant frequency of the Helmholtz resonator-like structure formed by the front cavity 114 and the sound output hole 112 is set as high as possible, so that the overall frequency response curve of the sound generating section has a wide flat region. In some embodiments, the resonant frequency f1 of the front cavity 114 may be 3 kHz or higher. In some embodiments, the resonant frequency f1 of the front cavity 114 may be 4 kHz or higher. In some embodiments, the resonant frequency of the front cavity 114 may be 6 kHz or higher. In some embodiments, the resonant frequency of the front cavity 114 may be 7 kHz or higher. In some embodiments, the resonant frequency of the front cavity 114 may be 8 kHz or higher.

[0167] 22, in some embodiments, an acoustic resistance mesh 118 may be installed at a position corresponding to the first decompression hole 1131 and / or the second decompression hole 1132, and the acoustic resistance mesh 118 may adjust the amplitude at the resonance frequency of the rear cavity and also serve as dustproof and waterproof. In some embodiments, an acoustic resistance mesh 118 may be installed at the position of the sound emission hole 112, and may adjust the amplitude at the corresponding resonance peak of the front cavity 114 and also serve as dustproof and waterproof.

[0168] In some embodiments, the acoustically resistive mesh 118 may include gauze, steel mesh, or a combination thereof. In some embodiments, the acoustic impedance set for the front cavity 114 and the acoustic impedance set for the rear cavity 116 may be the same, i.e., the acoustically resistive mesh 118 installed in the sound output hole 112 and the acoustically resistive mesh 118 installed in at least one decompression hole (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) may have the same acoustic impedance. For example, the same acoustically resistive mesh 118 may be installed in the sound output hole 112 and at least one decompression hole to facilitate assembly of the structure (e.g., to reduce the number of material types and / or avoid mixing of materials) and to improve consistency in appearance. In some embodiments, the acoustically resistive mesh 118 installed in the front cavity 114 and the acoustically resistive mesh 118 installed in the rear cavity 116 may have different acoustic impedances, i.e., the acoustically resistive mesh 118 installed in the sound output holes 112 may have different acoustic impedances from the acoustically resistive mesh 118 installed in at least one decompression hole. For example, by installing acoustically resistive meshes 118 with different acoustic impedances in the front cavity 114 and the rear cavity 116 based on other parameters of the front cavity 114 and the rear cavity 116 (e.g., the area (or area ratio) of the sound output holes 112 and / or the decompression holes, the depth of each hole, aspect ratio, etc.), a predetermined output effect can be achieved (e.g., by installing acoustically resistive meshes 118 with different acoustic impedances, the sound pressure output from the sound output holes 112 can be closer to the sound pressure output from the decompression hole, thereby effectively reducing far-field sound leakage).

[0169] When other parameters of the acoustic resistive mesh 118 are constant, the magnitude of its acoustic resistance is related to its thickness, and acoustic resistive meshes of different thicknesses have a certain impact on the acoustic output performance of the corresponding acoustic holes. Therefore, there is a certain limit to the thickness of the acoustic resistive mesh 118. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and / or the second decompression hole 1132 may range from 35 μm to 300 μm. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may range from 40 μm to 150 μm. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may range from 50 μm to 65 μm. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may range from 55 μm to 62 μm. On the other hand, the greater the distance between the end of the acoustic resistive mesh 118 facing outward from the housing 111 (i.e., the upper surface of the acoustic resistive mesh 118) and the outer surface of the housing 111, the closer the installation position of the corresponding acoustic resistive mesh 118 to the rear cavity, and the smaller the volume of the rear cavity. In some embodiments, the distance between the upper surface of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 111 may be 0.8 mm to 0.9 mm, and the distance between the upper surface of the acoustic resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 111 may be 0.7 mm to 0.8 mm. In some embodiments, the distance between the upper surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 111 may be 0.82 mm to 0.88 mm, and the distance between the upper surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 111 may be 0.72 mm to 0.76 mm.In some embodiments, the distance between the top surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 111 may be 0.86 mm, and the distance between the top surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 111 may be 0.73 mm.

[0170] In some embodiments, different types of acoustically resistive mesh 118 may have different mesh densities, which may result in different acoustic resistances for the corresponding acoustic holes and affect the output of the corresponding acoustic cavities. Therefore, the configuration and type of the acoustically resistive mesh 118 need to be designed. In some embodiments, to achieve waterproofing and dustproofing and improve structural stability, the first decompression hole 1131 and / or the second decompression hole 1132 and / or the sound output hole 112 may be made of steel mesh, or a combination of gauze and steel mesh may be used. In some embodiments, to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustically resistive mesh 118 installed in the front cavity 114 may include a steel mesh (e.g., an etched steel mesh), and the mesh count of the steel mesh may be in the range of 60 to 100. In some embodiments, in order to further reduce the acoustic impedance of the acoustic resistive mesh 118 and increase the output sound pressure of the sound generating unit 11, the acoustic resistive mesh 118 installed in the front cavity 114 may include a steel mesh, and the mesh number of the steel mesh may be in the range of 70 to 90. In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and provide the sound generating unit 11 with a large output sound pressure, the acoustic resistive mesh 118 installed in the front cavity 114 may include gauze and a steel mesh (e.g., an etched steel mesh), and the acoustic impedance of the gauze may be in the range of 2 MKS rayls to 50 MKS rayls, and the mesh number of the steel mesh may be in the range of 60 to 100.In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and to provide the sound generating unit 11 with a large output sound pressure, the acoustic resistive mesh 118 installed in the front cavity 114 may include gauze and steel mesh, the acoustic impedance of the gauze may be in the range of 5 MKS rayls to 20 MKS rayls, and the mesh number of the steel mesh may be in the range of 70 to 90. In some embodiments, in order to improve the smoothness of the frequency response curve of the sound generating unit 11 and to provide the sound generating unit 11 with a large output sound pressure, the acoustic resistive mesh 118 installed in the front cavity 114 may include gauze and steel mesh, the acoustic impedance of the gauze may be in the range of 6 MKS rayls to 10 MKS rayls, and the mesh number of the steel mesh may be in the range of 75 to 85. In some embodiments, when the acoustically resistive mesh 118 disposed in the front cavity 114 includes a steel mesh (e.g., an etched steel mesh) or a combination of gauze and steel mesh, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 10 MKS rayls. In some embodiments, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 5 MKS rayls. In some embodiments, the acoustic impedance of the steel mesh may be in the range of 0.1 MKS rayls to 3 MKS rayls.

[0171] FIG. 23 is an exemplary internal structural view of a transducer according to some embodiments of the present disclosure.

[0172] 23 , the housing 111 accommodates the transducer 116, which includes a diaphragm 1161, a voice coil 1162, a frame 1163, and a magnetic circuit assembly 1164. The frame 1163 is installed to surround the diaphragm 1161, the voice coil 1162, and the magnetic circuit assembly 1164 and provides a mounting and fixing platform. The transducer 116 may be connected to the housing 111 via the frame 1163. The diaphragm 1161 covers the voice coil 1162 and the magnetic circuit assembly 1164 in the Z direction. The voice coil 1162 enters the magnetic circuit assembly 1164 and is connected to the diaphragm 1161. The magnetic field generated after the voice coil 1162 is energized interacts with the magnetic field formed by the magnetic circuit assembly 1164 to drive the diaphragm 1161 to generate mechanical vibrations, and further generates sound through transmission through a medium such as air. The sound is output through the sound output hole 112.

[0173] In some embodiments, the magnetic circuit assembly 1164 includes a magnetic flux conducting plate 11641, a magnet 11642, and a housing member 11643, where the magnetic flux conducting plate 11641 and the magnet 11642 are connected to each other, the side of the magnet 11642 away from the magnetic flux conducting plate 11641 is attached to the bottom wall of the housing member 11643, and there is a gap between the peripheral side of the magnet 11642 and the inner peripheral wall of the housing member 11643. In some embodiments, the outer peripheral wall of the housing member 11643 is connected and fixed to the frame 1163. In some embodiments, both the housing member 11643 and the magnetic flux conducting plate 11641 may use a magnetically permeable material (e.g., iron).

[0174] In some embodiments, the periphery of the diaphragm 1161 may be connected to the frame 1163 via a fixing ring 1165. In some embodiments, the material of the fixing ring 1165 may include stainless steel or other metal materials to accommodate the manufacturing process of the diaphragm 1161.

[0175] 22 and 23 , in some embodiments, the larger the projected area of ​​the diaphragm 1161 along the Z direction, the better in order to improve the acoustic output (especially low-frequency output) effect of the sound generating unit 11 and the ability of the diaphragm 1161 to push air. However, if the area of ​​the diaphragm 1161 is too large, the dimensions of the transducer 116 will be too large, and the housing 111 will be too large, which will easily cause collision friction between the housing 111 and the pinna and affect the wearing comfort of the sound generating unit 11. For this reason, it is necessary to design the dimensions of the housing 111. For example, the short axis dimension (also referred to as width dimension) of the housing 111 in the Y direction can be determined based on the dimension of the concha cavity along the Y direction (e.g., 17 mm), and then the long axis dimension (also referred to as length dimension) of the housing 111 in the X direction (e.g., 21.49 mm) can be determined to fit the dimension of the concha cavity along the X direction by selecting an appropriate aspect ratio (i.e., the ratio of the dimension of the housing 111 in the X direction to the dimension of the housing 111 in the Y direction) based on wearing comfort.

[0176] In some embodiments, a predetermined range of values ​​can be used for the dimensions of the housing 111 to facilitate wearing by most users (e.g., most users can insert the sound-generating unit 11 into the cavity of the concha or abut against the antihelix region when wearing the earphone 10), form a cavity structure with high acoustic efficiency, and, for example, form a first leakage structure UC and a second leakage structure LC between the earphone 10 and the user's ear when wearing the earphone 10, thereby improving the acoustic performance of the earphone. In some embodiments, based on the range of the width dimension of the cavity of the concha along the Y direction, the width dimension of the housing 111 along the Y direction may be in the range of 11 mm to 16 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 11 mm to 15 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 14 mm to 15 mm. In some embodiments, the ratio of the dimension of the housing 111 in the X direction to the dimension in the Y direction may be 1.2 to 5. In some embodiments, the ratio of the X-direction dimension of the housing 111 to the Y-direction dimension may be 1.4 to 4. In some embodiments, the ratio of the X-direction dimension of the housing 111 to the Y-direction dimension may be 1.5 to 2. In some embodiments, the length dimension of the housing 111 along the X direction may be in the range of 15 mm to 30 mm. In some embodiments, the length dimension of the housing 111 along the X direction may be 16 mm to 28 mm. In some embodiments, the length dimension of the housing 111 along the X direction may be 19 mm to 24 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be in the range of 5 mm to 20 mm to avoid the housing 111 being too large in volume and affecting the wearing comfort of the earphone 10. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be 5.1 mm to 18 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be 6 mm to 15 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be between 7 mm and 10 mm.In some embodiments, the area of ​​the inner surface IS of the housing 111 (equal to the product of the length and width of the housing 111 when the inner surface IS is rectangular) is 90 mm. 2 ~560mm 2 In some embodiments, the area of ​​the inner surface IS can be considered to be approximately equal to the projected area of ​​the diaphragm 1161 along the Z direction. For example, the difference between the area of ​​the inner surface IS and the projected area of ​​the diaphragm 1161 along the Z direction is 10%. In some embodiments, the area of ​​the inner surface IS is 150 mm 2 ~360mm 2 In some embodiments, the area of ​​the inner surface IS may be 160 mm 2 ~240mm 2 In some embodiments, the area of ​​the inner surface IS may be 180 mm 2 ~200mm 2 10 to 13, earphone 10 is worn in the manner shown in Fig. 14, and the dimensions of earphone 10 are designed to provide comfortable wearing, and its acoustic performance is superior to that of conventional earphones, that is, the dimensions of earphone 10 may be smaller than those of conventional earphones, provided that the earphone achieves equivalently excellent acoustic performance.

[0177] 22 and 23 , in some embodiments, the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 may be related to the vibration range of the diaphragm 1161 and the thickness of the magnetic circuit assembly 1164. The vibration range of the diaphragm 1161 may affect the amount of air pushed by the transducer of the sound generating unit 11. The greater the vibration range of the diaphragm 1161, the greater the amount of air pushed by the transducer of the sound generating unit 11, and the higher the sound generation efficiency of the sound generating unit. The greater the thickness of the magnetic circuit assembly 1164, the greater the total weight of the sound generating unit 11, which affects the wearing comfort of the user. Furthermore, when the thickness of the sound generating unit in the Z direction is constant, the smaller the distance along the Z direction from the center O of the sound output hole 112 to the bottom surface of the magnetic circuit assembly 1164, the larger the volume of the rear cavity may be. In this case, the smaller the resonant frequency of the rear cavity, the lower the resonant peak of the rear cavity will be, and the smaller the flat region of the frequency response curve will be. To ensure that the sound generation efficiency of the sound generating unit is sufficiently high, the resonant frequency of the rear cavity is within an appropriate frequency range (e.g., 1000 Hz to 5000 Hz), and the user's wearing comfort is sufficient, taking into consideration the structural strength, the difficulty of process realization, and the overall thickness of the housing 111, the range of the distance along the Z direction from the center O of the sound output hole 112 to the bottom surface of the magnetic circuit assembly 1164 (i.e., the side of the housing member 11643 away from the sound output hole 112 along the Z direction) is 5.65 mm to 8.35 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.00 mm to 8.00 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.35 mm to 7.65 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.70 mm to 7.30 mm. In some embodiments, the range of the distance from the center of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction is 6.95 mm to 7.05 mm.

[0178] In some embodiments, the volume V of the rear cavity needs to be within an appropriate range to increase the resonant frequency of the rear cavity and the acoustic capacitance Ca of the rear cavity. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 can be reasonably designed to achieve the volume of the rear cavity within an appropriate range. As shown in FIGS. 22 and 23 , when the thickness of the sound generating unit 11 in the Z direction is constant, the smaller the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164, the larger the volume of the rear cavity may be. In this case, the acoustic capacitance Ca of the rear cavity increases, but the corresponding resonant frequency of the rear cavity decreases. To ensure that the sound generation efficiency of the sound generating unit 11 is sufficiently high, the resonant frequency of the rear cavity is within an appropriate frequency range (e.g., 2000 Hz to 6000 Hz), and the user's wearing comfort is sufficient, taking into consideration the structural strength, the difficulty of process realization, and the overall thickness of the housing 111, the distance d5 along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 (i.e., the side of the accommodating member 11643 that is away from the sound emission hole 112 along the Z direction) ranges from 1.31 mm to 1.98 mm. In some embodiments, the distance d5 along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 ranges from 1.31 mm to 1.98 mm. In some embodiments, the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.41 mm to 1.88 mm. In some embodiments, the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.51 mm to 1.78 mm. In some embodiments, the distance d5 from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.56 mm to 1.72 mm.Similarly, in some embodiments, the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.31 mm to 1.98 mm. In some embodiments, the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.41 mm to 1.88 mm. In some embodiments, the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.51 mm to 1.78 mm. In some embodiments, the distance d6 from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 along the Z direction ranges from 1.56 mm to 1.72 mm.

[0179] In some embodiments, when the thickness of the sound generating unit is constant, the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 should not be too large or too small. If it is too large, the volume of the front cavity will be too large, which is likely to cause the resonant frequency of the front cavity to be small. If it is too small, the volume of the front cavity will be too small, which is likely to cause the vibration range of the diaphragm 1161 to be small, which will affect the amount of air pushed by the transducer of the sound generating unit 11 and affect the sound generation efficiency of the sound generating unit 11. In some embodiments, to ensure that the sound generation efficiency of the sound generating unit 11 is sufficiently high, the resonant frequency of the rear cavity is within an appropriate frequency range (e.g., 2000 Hz to 6000 Hz), and the user's wearing comfort is sufficient, the distance in the Z direction between the first decompression hole 1131 and the second decompression hole 1132 and the sound output hole 112 can be limited to increase the sound collection effect of the sound output hole 112 in the ear canal and increase the sound leakage cancellation effect. In some embodiments, the difference between the distance along the Z direction from the center O of the sound output hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 3.65 mm to 7.05 mm. In some embodiments, the difference between the distance along the Z direction from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 4.00 mm to 6.85 mm. In some embodiments, the difference between the distance along the Z direction from the center O of the sound emitting hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 4.80 mm to 5.50 mm.In some embodiments, the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is in the range of 5.20 mm to 5.55 mm.

[0180] In some embodiments, the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 may be the same as the distance along the Z direction from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164. In some embodiments, in order to increase the listening volume by reducing the effect of sound emitted from the second decompression hole 1132 canceling out sound emitted from the sound emission hole 112 in the ear canal (i.e., the listening position), the second decompression hole 1132 may be farther away from the sound emission hole 112 in the Z direction than the first decompression hole 1131. For example, if the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O1 of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 3.67 mm to 5.57 mm, the difference between the distance along the Z direction from the center O of the sound emission hole 112 to the bottom surface of the magnetic circuit assembly 1164 and the distance along the Z direction from the center O2 of the second decompression hole 1132 to the bottom surface of the magnetic circuit assembly 1164 is within a range of 5.57 mm to 7.04 mm.

[0181] In some embodiments, the distance from the center O of the sound emitting hole 112 to the long axis central plane of the magnetic circuit assembly 1164 (e.g., the inward surface NN' perpendicular to the paper surface as shown in FIG. 23 ) ranges from 1.45 mm to 2.15 mm. In this specification, the long axis central plane of the magnetic circuit assembly 1164 refers to a plane that is parallel to the lower side surface LS of the sound generating unit 11 and passes through the geometric center of the magnetic circuit assembly 1164. In other words, the long axis central plane of the magnetic circuit assembly 1164 can divide the magnetic circuit assembly 1164 into two equal parts along the direction X. The distance between the center O of the sound emitting hole 112 and the long axis central plane of the magnetic circuit assembly 1164 is the distance from the center O of the sound emitting hole 112 to the long axis central plane along the short axis direction Y. In some embodiments, the distance from the center O of the sound emitting hole 112 to the long axis central plane ranges from 1.55 mm to 2.05 mm. In some embodiments, the distance from the center O of the sound emitting hole 112 to the long axis central plane ranges from 1.65 mm to 1.95 mm. In some embodiments, the distance from the center O of the sound emitting hole 112 to the long axis central plane ranges from 1.75 mm to 1.85 mm.

[0182] In some embodiments, the dimension of the sound generating unit 11 along the Y direction can be limited to accommodate the dimensions of the cavity of the concha. In some embodiments, the dimension of the sound generating unit 11 along the Y direction can be determined by the distance from the center O1 of the first decompression hole 1131 to the longitudinal center plane of the magnetic circuit assembly 1164 (e.g., the inward-facing surface N-N' perpendicular to the paper surface in FIG. 23 ). In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the longitudinal center plane of the magnetic circuit assembly 1164 (e.g., the inward-facing surface N-N' perpendicular to the paper surface in FIG. 23 ) can be limited to facilitate design. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the longitudinal center plane of the magnetic circuit assembly 1164 is 5.45 mm to 8.19 mm. In this application, the long axis center plane of the magnetic circuit assembly 1164 refers to a plane that is parallel to the lower side surface LS of the sound generating unit 11 and passes through the center of mass of the magnetic circuit assembly 1164. That is, the long axis center plane of the magnetic circuit assembly 1164 can divide the magnetic circuit assembly 1164 into two equal parts along the direction X. The distance between the center O1 of the first decompression hole 1131 and the long axis center plane of the magnetic circuit assembly 1164 is the distance from the center O1 of the first decompression hole 1131 to the long axis center plane along the short axis direction Y. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the long axis center plane of the magnetic circuit assembly 1164 is 5.95 mm to 8.69 mm. In some embodiments, the range of the distance from the center O1 of the first decompression hole 1131 to the long axis center plane of the magnetic circuit assembly 1164 is 6.45 mm to 7.19 mm. In some embodiments, the distance from the center O1 of the first decompression hole 1131 to the longitudinal central plane of the magnetic circuit assembly 1164 ranges from 6.65 mm to 6.99 mm. Similarly, in some embodiments, the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 ranges from 5.46 mm to 8.20 mm. In some embodiments, the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 ranges from 5.96 mm to 8.70 mm.In some embodiments, the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 ranges from 6.46 mm to 7.20 mm. In some embodiments, the distance from the center O2 of the second decompression hole 1132 to the longitudinal central plane of the magnetic circuit assembly 1164 ranges from 6.66 mm to 7.00 mm.

[0183] In some embodiments, in order to bring the sound emitting hole 112 closer to the auditory canal, the sound emitting hole 112 can be positioned closer to the second decompression hole 1132 than to the first decompression hole 1131 in the Y direction. By limiting the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emitting hole 112 in the Y direction, the sound collection effect of the sound emitting hole 112 in the auditory canal can be improved, and the far-field sound leakage cancellation effect can be improved. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emitting hole 112 to the longitudinal central plane of the magnetic circuit assembly 1164 along the Y direction and the distance from the center O1 of the first decompression hole 1131 to the longitudinal central plane along the Y direction is within a range of 4.0 mm to 6.1 mm. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emitting hole 112 to the longitudinal central plane and the distance from the center O1 of the first decompression hole 1131 to the longitudinal central plane is within a range of 4.5 mm to 5.5 mm. In some embodiments, the absolute value of the difference between the distance from the center O of the sound emission hole 112 to the long axis central plane and the distance from the center O1 of the first decompression hole 1131 to the long axis central plane is in the range of 4.8 mm to 5.2 mm.

[0184] In some embodiments, due to the presence of decompression holes 113 (e.g., first decompression hole 1131 and second decompression hole 1132), the air pressure in the rear cavity at positions close to the decompression holes 113 is close to the outside air pressure, and the air pressure in positions away from the decompression holes 113 is higher than the outside air pressure. The frame 1163 is provided with sound vent holes (not shown) that communicate between the rear side of the diaphragm 1161 and the cavity 115. Therefore, in order to balance the air pressure between the rear side of the diaphragm 1161 and the cavity 115, the sound vent holes in the frame can be arranged asymmetrically to better balance the airflow. Specifically, the air pressure is higher at positions away from the first decompression hole 1131 and / or the second decompression hole 1132, so the dimensions of the sound vent holes may be larger. The air pressure is lower at positions close to the first decompression hole 1131 and / or the second decompression hole 1132, so the dimensions of the sound vent holes may be smaller. In some embodiments, the dimensions (e.g., area size) of the first decompression hole 1131, the second decompression hole 1132, and / or the sound vent holes can be adjusted to make the vibration of the earphone 10 more stable at low frequencies. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 can be offset in the X direction to make the air pressure in the rear cavity more stable and the vibration of the diaphragm more stable. In this case, the first decompression hole 1131 and the second decompression hole 1132 are installed so that their projections onto the long axis central plane partially overlap or do not overlap. In some embodiments, the overlapping area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 onto the long axis central plane is 10.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 6.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 4.77 mm 2 In some embodiments, the overlap area of ​​the first decompression hole 1131 and the second decompression hole 1132 projected onto the long axis central plane is 2.77 mm 2 The following is the result.

[0185] Having described the basic concepts above, it will be apparent to those skilled in the art that the detailed disclosure above is provided by way of example only and is not intended to limit the scope of the present application. Although not expressly described herein, those skilled in the art may make various changes, improvements, and modifications to the present application. These changes, improvements, and modifications are intended to be suggested by the present application and are therefore within the spirit and scope of the exemplary embodiments of the present application.

[0186] The specific embodiments described in this application are merely illustrative, and one or more technical features in the specific embodiments are optional or optional and are not required technical features to constitute the inventive concept of this application. In other words, the scope of protection of this application covers the specific embodiments and is much broader than them. [Explanation of symbols]

[0187] 10. Earphones 11. Sound generation section 111 Housing 112 Sound emission hole 113 Decompression hole 1131 First decompression hole 1132 Second decompression hole 12 ear hooks 116 Transducer 1161 Vibration plate 114 Front cavity 116 Rear cavity 1164 Magnetic Circuit Assembly 118 Acoustic Resistance Mesh

Claims

1. a sound generating portion including a transducer including a diaphragm for generating sound under the influence of an excitation signal, and a housing forming a cavity for receiving said transducer; a suspension structure that, in a worn state, wears the sound generating unit in a position near the ear canal but not blocking the ear canal, At least a portion of the housing is inserted into the cavity of the concha; a sound output hole is formed on an inner surface of the housing facing the auricle, through which sound generated in front of the diaphragm is guided out of the housing and transmitted to the ear canal; The earphone has a first decompression hole formed in at least one of the upper surface, lower surface, or outer surface of the housing, which guides sound generated behind the diaphragm out of the housing, and the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface is greater than the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface.

2. The earphone according to claim 1, wherein a ratio of the distance from the center of the sound emission hole to the midpoint of the upper boundary of the inner surface to the distance from the center of the first decompression hole to the midpoint of the upper boundary of the inner surface is within a range of 1.3 to 2.

1.

3. The earphone according to claim 1, wherein a ratio of an area of ​​the sound emission hole to a depth of the sound emission hole and a ratio of an area of ​​the first decompression hole to a depth of the first decompression hole is in a range of 1.10 to 1.

75.

4. The earphone according to claim 1 , wherein a ratio of an area of ​​the sound emission hole to an area of ​​the first decompression hole is within a range of 0.5 to 1.

5.

5. 2. The earphone according to claim 1, wherein, when the earphone is worn, the ratio of the distance from the projection point of the center of the sound emission hole onto the sagittal plane to the centroid of the projection of the ear canal opening of the ear canal onto the sagittal plane to the distance from the projection point of the center of the first decompression hole onto the sagittal plane to the centroid of the projection of the ear canal opening onto the sagittal plane is within a range of 0.10 to 0.

35.

6. The earphone according to claim 1, wherein the suspension structure includes an ear hook, and in a worn state, a first portion of the ear hook is hung between the user's auricle and head, and a second portion of the ear hook extends on a side of the auricle facing away from the head and is connected to the sound generating unit, and a ratio of a distance from a center of the sound emission hole to a top vertex of the ear hook to a distance from a center of the first pressure reduction hole to a top vertex of the ear hook is within a range of 1.10 to 1.

70.

7. 2. The earphone according to claim 1, wherein the transducer further includes a magnetic circuit assembly that provides a magnetic field, and an absolute value of a difference between a distance from a center of the sound emission hole to a longitudinal central plane of the magnetic circuit assembly and a distance from a center of the first decompression hole to the longitudinal central plane is within a range of 4.0 mm to 6.1 mm.

8. 2. The earphone according to claim 1, wherein a second decompression hole is further formed in at least one of the upper surface, the lower surface, or the outer surface of the housing, and the area of ​​the first decompression hole is larger than the area of ​​the second decompression hole.

9. The earphone according to claim 8, wherein the distance from the center of the sound emission hole to the perpendicular bisector of the line connecting the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

10. The earphone according to claim 9 , wherein the first decompression hole is formed in the upper surface of the housing, and the second decompression hole is formed in the lower surface of the housing.

11. 9. The earphone according to claim 8, wherein, when the earphone is worn, the ratio of the distance from the projection point of the center of the sound emission hole onto the sagittal plane to the projection point of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane to the distance from the projection point of the center of the second decompression hole onto the sagittal plane to the projection point of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane is within a range of 0.65 to 1.

05.

12. The earphone according to claim 8, wherein the angle between a line connecting the center of the sound emitting hole to the center of the first decompression hole and a line connecting the center of the sound emitting hole to the center of the second decompression hole is within a range of 46.40° to 70.04°.

13. The earphone according to claim 8, wherein a ratio of a distance from the center of the sound emitting hole to the center of the first decompression hole to a distance from the center of the sound emitting hole to the center of the second decompression hole is within a range of 0.9 to 1.

1.

14. The earphone according to claim 8, wherein a ratio of a difference between an area of ​​the first decompression hole and an area of ​​the second decompression hole to an area of ​​the sound emission hole is within a range of 2.5 to 3.

9.

15. The earphone according to claim 8, wherein an acoustic resistance mesh is installed in at least one of the first decompression hole and the second decompression hole, and the thickness of the acoustic resistance mesh is in the range of 40 μm to 150 μm.

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