Sensor unit and sensor assembly

The sensor unit design with parallel conductive members, through holes, and resin protrusions addresses detachment issues, ensuring robust fixation and reduced leakage, resulting in a compact and efficient sensor assembly.

JP7754890B2Active Publication Date: 2025-10-15YAZAKI CORP
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
JP2023116011
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-07-14
Publication Date
2025-10-15
Estimated Expiration
2043-07-14

AI Technical Summary

Technical Problem

The sensor unit in existing technologies has a structure where the polymer body molded onto the lead conductor connected to the temperature sensor element can come off, leading to potential detachment issues.

Method used

A sensor unit design featuring a sensor element with parallel conductive members, a resin molded portion covering the base and intermediate portions of the conductive members, and a through hole in the intermediate portion, along with a protrusion and different resin types for the molded portions, enhances fixation and reduces stress concentration.

Benefits of technology

Prevents the resin molded portion from detaching, maintains structural integrity, and reduces leakage current, allowing for a more compact and robust sensor unit design.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007754890000001
    Figure 0007754890000001
  • Figure 0007754890000002
    Figure 0007754890000002
  • Figure 0007754890000003
    Figure 0007754890000003
Patent Text Reader

Abstract

To provide a sensor unit and a sensor assembly which can suppress removal of a resin molded part.SOLUTION: The sensor unit according to an embodiment includes: a sensor element; a pair of conductive members extending from the sensor element in parallel to one another; and a resin molded part for covering a part of the pair of conductive members. The pair of conductive members include: a base end part connected to the sensor element; a top end part on the opposite side to side where the base end part is located; and a middle part with a through-hole, the middle part being between the base end part and the top end part. The resin molded part covers the base end part and the middle part while exposing the top end part.SELECTED DRAWING: Figure 2
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION Embodiments of the present invention relate to a sensor unit and a sensor assembly. [Background technology]

[0002] It is known to use sensors to measure the state of fluids and the like within a structure. For example, Patent Document 1 discloses that a sensor unit is provided on the wall of an engine flow path to measure the temperature of fluids such as lubricants, coolants, and fuels. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] European Patent No. 2485023 Summary of the Invention [Problem to be solved by the invention]

[0004] The sensor unit disclosed in Patent Document 1 has a structure in which a polymer body is molded onto the lead conductor connected to the temperature sensor element, and therefore the polymer body may come off the lead conductor.

[0005] An embodiment of the present invention provides a sensor unit and a sensor assembly that can prevent a resin molded portion from coming off. [Means for solving the problem]

[0006] A sensor unit according to one embodiment of the present invention includes a sensor element, a pair of conductive members extending parallel to each other from the sensor element, and a resin molded portion covering a portion of the pair of conductive members. The pair of conductive members include a base end connected to the sensor element, a tip end opposite the base end, and an intermediate portion having a through hole between the base end and the tip end. The resin molded portion covers the base end and the intermediate portion while leaving the tip end exposed.

[0007] A sensor assembly according to one embodiment of the present invention includes a sensor element and a pair of conductive members extending parallel to each other from the sensor element, each of the conductive members including a base end connected to the sensor element, a tip end opposite the base end, and an intermediate portion having a through hole between the base end and the tip end. [Effects of the Invention]

[0008] According to the sensor unit or sensor assembly of one embodiment of the present invention, it is possible to prevent the resin molded portion from coming off. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective view of a sensor unit according to the embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 1 is a perspective view of a sensor assembly according to an embodiment. [Figure 4] FIG. 4 is an enlarged view of part IV in FIG. 3. [Figure 5] FIG. 2 is a plan view of a pair of conductive members and a first molded portion according to the embodiment. [Figure 6] FIG. 2 is a partial perspective view of a pair of conductive members and a first molded portion according to the embodiment. [Figure 7] FIG. 10 is a perspective view illustrating a step of inserting the sensor unit according to the embodiment. [Figure 8] FIG. 10 is a perspective view illustrating a step of fitting the sensor unit according to the embodiment. [Figure 9] FIG. 10 is a perspective view illustrating a creepage distance according to a comparative example. [Figure 10] FIG. 2 is a perspective view illustrating a creepage distance according to the embodiment. [Figure 11] FIG. 10 is a partial perspective view of a pair of conductive members and a first molded portion according to a first modified example of the embodiment. [Figure 12] FIG. 10 is a partial perspective view of a pair of conductive members and a first molded portion according to a second modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] <Embodiment> The sensor unit and sensor assembly of the embodiment will be described below with reference to the drawings. The sensor unit 9 of the embodiment is provided in a fluid flow path or a structure such as a tank in which the fluid is stored, in order to measure the temperature of the fluid, such as cooling water or oil.

[0011] (Sensor unit configuration) 1 and 2, a sensor unit 9 of this embodiment includes a sensor assembly 1, a resin molded portion 4, a first seal member 5, and a second seal member 6. The sensor assembly 1 includes a sensor element 2 and a pair of conductive members 3.

[0012] (Configuration of sensor element) The sensor element 2 is provided across a pair of conductive members 3. Both ends of the sensor element 2 are joined (for example, soldered) to the pair of conductive members 3. The sensor element 2 is a temperature sensor for measuring the temperature of a fluid. The sensor element 2 is, for example, a thermistor. The electrical characteristics of the sensor element 2, which depend on the temperature of the fluid, are measured via the pair of conductive members 3, thereby making it possible to measure the temperature of the fluid.

[0013] (Construction of conductive member) The pair of conductive members 3 extend parallel to each other from the sensor element 2. In this embodiment, the pair of conductive members 3 are lead frames. Hereinafter, the direction in which the pair of conductive members 3 extend is referred to as the Z direction, and the directions that intersect with each other in a plane facing the Z direction are referred to as the X direction and the Y direction. For example, the X direction, the Y direction, and the Z direction may be directions that are perpendicular to each other.

[0014] As shown in FIG. 3 , each conductive member 3 extends in the Z direction. Each conductive member 3 has a plate shape with its thickness direction in the Y direction. Each conductive member 3 has a constant thickness throughout the entire conductive member 3. Each conductive member 3 includes, in order in the Z direction, a base end portion 31, an intermediate portion 32, and a tip end portion 33. The base end portion 31 is one of the two ends of each conductive member 3. The tip end portion 33 is the end of each conductive member 3 opposite the base end portion 31. The intermediate portion 32 is a portion between the base end portion 31 and the tip end portion 33. The sensor element 2 is connected to the tip of the base end portion 31. The tip end portion 33 is a portion exposed from the resin molded portion 4. The base end portion 31 is a portion covered by a first molded portion 41, which will be described later. The intermediate portion 32 is a portion covered by a second molded portion 42, which will be described later.

[0015] As shown in FIG. 4 , the intermediate portion 32 has a bent portion 321. The bent portion 321 bends in the X direction in a direction in which the pair of conductive members 3 move away from each other. The intermediate portion 32 has a through hole 32H. The through hole 32H penetrates in the Y direction. The through hole 32H is a circular hole. The through hole 32H is formed in a portion of the bent portion 321 that is wider in the X direction. The bent portion 321 has a first edge portion P1 on one side in the X direction and a second edge portion P2 on the other side in the X direction. The first edge portion P1 and the second edge portion P2 are located at different positions in the Z direction, sandwiching the portion where the through hole 32H is located. The first edge portion P1 is inclined in the X direction with respect to the Z direction so that the X direction width of the bent portion 321 is wider in the portion where the through hole 32H is formed. The second edge P2 is inclined in the X direction with respect to the Z direction so that the X-direction width of the bent portion 321 is wider in the portion where the through hole 32H is formed. The first edge P1 and the second edge P2 are arranged in the region where the through hole 32H is present in the Z direction. With this arrangement, the remaining widths W1 and W2 of the bent portion 321 on both sides of the through hole 32H are widths that can maintain the mechanical strength of each conductive member 3. In this embodiment, the diameter of the through hole 32H is larger than W1 and larger than W2. On the other hand, the diameter of the through hole 32H is larger than half the width W3 of the portion of the intermediate portion 32 where the width in the X direction is smallest.

[0016] (Configuration of resin molded part) As shown in FIGS. 1 and 2, the resin molded portion 4 covers the base end portion 31 and the intermediate portion 32 while leaving the tip end portion 33 exposed. The resin molded portion 4 includes a first molded portion 41 and a second molded portion 42. A portion of the resin molded portion 4 is provided inside the through hole 32H. In this embodiment, after the first molded portion 41 is formed by transfer molding, the second molded portion 42 is formed by injection molding. That is, a portion of the second molded portion 42 is provided inside the through hole 32H.

[0017] The first molded portion 41 is formed of a resin having different properties from the second molded portion 42. The first molded portion 41 is formed of a resin that is softer and has higher thermal conductivity than the resin forming the second molded portion 42. For example, when the second molded portion 42 is formed of a polyamide (PA) resin or a polyphenylene sulfide (PPS) resin as such a resin, the first molded portion 41 is formed of an epoxy resin.

[0018] The first molded portion 41 covers the base end portion 31 and the sensor element 2 so as to seal the base end portion 31 and the sensor element 2. The first molded portion 41 has a joint surface 41s with which the second molded portion 42 is joined.

[0019] The first molded portion 41 has a first seal groove 413. The first seal groove 413 has an annular shape on the outer circumferential surface of the first molded portion 41 and extends in the circumferential direction of the outer circumferential surface of the first molded portion 41.

[0020] The first molded portion 41 has a protrusion 411 on the joining surface 41s. The protrusion 411 protrudes in the Z direction toward the second molded portion 42. The pair of conductive members 3 are arranged so as to pass through the protrusion 411. As shown in FIG. 5, the protrusion 411 has an elliptical shape when viewed from the Z direction, which is the joining direction between the first molded portion 41 and the second molded portion 42. The long axis direction of this elliptical shape is the same as the direction in which the pair of conductive members 3 are arranged. In this specification, an "ellipse" generally refers to a shape that does not include straight line portions, but it can be any shape that is non-circular and has no corners, and can also be a shape that includes straight line portions or is asymmetric (oval). On the other hand, the outer peripheral shape of the first molded portion 41 when viewed from the Z direction is a perfect circle.

[0021] As shown in FIG. 6, the protrusion 411 has a groove 411g. The groove 411g is recessed in the Z direction toward the side away from the second molded portion 42. The groove 411g extends between the pair of conductive members 3 on the end surface 411e of the protrusion 411 so as to cross the end surface 411e when viewed from the Z direction. In this embodiment, the width of the groove 411g in the X direction is equal to or greater than half the width between the pair of conductive members 3 in the X direction. In a cross section parallel to the ZX plane, the groove 411g has an arc shape.

[0022] The second molded portion 42 covers the intermediate portion 32 so as to seal the intermediate portion 32. As shown in FIGS. 1 and 2, the second molded portion 42 has a joining surface 42s with the first molded portion 41. The second molded portion 42 has a first recess 421 on the joining surface 42s. The first recess 421 has a shape corresponding to the protrusion 411 and is recessed in the Z direction toward the side away from the first molded portion 41. The second molded portion 42 is joined to the first molded portion 41 in a state in which the protrusion 411 fits into the first recess 421 and the inner periphery of the first recess 421 contacts the outer periphery of the protrusion 411. Due to shrinkage of the second molded portion 42 during molding, the second molded portion 42 sandwiches the protrusion 411 of the first molded portion 41 from both sides (both sides in the X direction and both sides in the Y direction).

[0023] The second molded portion 42 has a second recess 422 at one of its two ends in the Z direction opposite the end where the first recess 421 is provided. The second recess 422 is recessed in the Z direction toward the intermediate portion 32. In the second recess 422, each of the tip ends 33 of the pair of conductive members 3 is exposed. Therefore, each of the tip ends 33 of the pair of conductive members 3 is used as a measurement terminal.

[0024] The second molded portion 42 has a second seal groove 423. The second seal groove 423 has an annular shape extending in the circumferential direction of the outer circumferential surface of the second molded portion 42, on the outer circumferential surface of the second molded portion 42. The second seal groove 423 is provided between the bent portion 321 and the joining surface 42s in the Z direction.

[0025] The second molded portion 42 is provided on its outer periphery with a flange 424, a pair of extension portions 425, and a rotation prevention mechanism 426. The flange 424 protrudes around the entire circumference of the second molded portion 42 at a position in the Z direction that includes the boundary between the intermediate portion 32 and the tip portion 33. The pair of extension portions 425 protrude on both sides in the X direction at a position in the Z direction between the second seal groove 423 and the flange 424. The rotation prevention mechanism 426 extends from the flange 424 along the outer periphery of the flange 424 and has a hook at the extended tip.

[0026] (Configuration of the first seal member and the second seal member) The first seal member 5 is an O-ring fitted in the first seal groove 413. The second seal member 6 is an O-ring fitted in the second seal groove 423. The first seal member 5 and the second seal member 6 are arranged to sandwich the joining surface 41s and the joining surface 42s. The first seal member 5 and the second seal member 6 seal the infiltration path of the fluid that would infiltrate between the joining surface 41s and the joining surface 42s.

[0027] (How to install the sensor unit) The method of attaching the sensor unit will now be described. To measure the temperature of a fluid such as cooling water or oil, an operator attaches the sensor unit 9 to a flow path through which the fluid flows or to a structure 81 such as a tank in which the fluid is stored.

[0028] First, as shown in Fig. 7 , an operator inserts sensor unit 9 into seat 82 fixed to structure 81 until flange 424 comes into contact with seat 82. Seat 82 has opening 821 that opens toward the fluid inside structure 81. Seat 82 has first locking portion 822 and second locking portion 823. With such seat 82, an operator inserts sensor unit 9 into opening 821 until a pair of extension portions 425 fit within opening 821.

[0029] 8 , the worker rotates the sensor unit 9 around the axis AX extending through the central axis of the sensor unit 9, hooks the pair of extensions 425 onto the first locking portion 822, and hooks the rotation prevention mechanism 426 onto the second locking portion 823. By this operation, the worker fits the sensor unit 9 into the seating surface 82. In this way, the pair of extensions 425 and the rotation prevention mechanism 426 fix the sensor unit 9 to the structure 81 so that the tip of the sensor unit 9 corresponding to the Z-direction position where the sensor element 2 is provided comes into contact with the fluid inside the structure 81.

[0030] (Action and effect) According to the sensor unit 9, a through hole 32H is provided in the portion where the resin molded portion 4 is molded. With this structure, the resin molded portion 4 is molded through the through hole 32H. Molding in this manner reinforces the fixation of the resin molded portion 4 to the pair of conductive members 3. Therefore, the sensor unit 9 can prevent the resin molded portion 4 from coming off.

[0031] According to the sensor unit 9, a bent portion 321 and a through hole 32H are provided in the portion where the resin molded portion 4 is molded. With these configurations, the resin molded portion 4 can be formed so as to be caught on the bent portion 321 in the portion where the resin molded portion 4 is molded through the through hole 32H. Such bent portion 321 can reinforce the fixation of the resin molded portion 4 to the pair of conductive members 3. Therefore, the sensor unit 9 can prevent the resin molded portion 4 from coming off.

[0032] According to the sensor unit 9, a through hole 32H is provided in the portion where the second molded portion 42 is molded. With this configuration, the second molded portion 42 is molded through the through hole 32H, which reinforces the fixation of the second molded portion 42 to the pair of conductive members 3. Due to this reinforcement, the sensor unit 9 can prevent the second molded portion 42 from coming off the first molded portion 41, regardless of the shape of the joint between the first molded portion 41 and the second molded portion 42. Therefore, compared to a configuration in which the first molded portion 41 is provided with a special structure to prevent the second molded portion 42 from coming off, the shape of the first molded portion 41 can be simplified, and the sensor unit 9 can be made more compact.

[0033] According to the sensor unit 9, since the protrusion 411 is provided, when the resin molded portion 4 is molded, the second molded portion 42 contracts so as to come into contact with the circumferential surface of the protrusion 411. Due to this contraction, the gap at the interface between the first molded portion 41 and the second molded portion 42 is reduced.

[0034] According to the sensor unit 9, the creepage distance within the joint surface 41s is increased by providing the protrusion 411. Such a creepage distance can suppress leakage current due to migration.

[0035] 9, when the bonding surface is flat, the creepage distance D2 within the bonding surface is a linear distance. On the other hand, as shown in FIG. 10, according to the sensor unit 9 of this embodiment, the creepage distance D1 within the bonding surface 41s is a distance that follows the undulations of the protrusion 411. Due to these undulations, the creepage distance D1 within the bonding surface 41s of the sensor unit 9 of this embodiment is longer than the creepage distance D2 of the comparative example.

[0036] According to the sensor unit 9, the protrusion 411 has an elliptical shape when viewed from the Z direction. This shape allows the stress generated by the rotational torque applied to the second molded portion 42 during assembly of the sensor unit 9 to be borne not only by the pair of conductive members 3 but also by the protrusion 411. This structure reduces the stress applied to the pair of conductive members 3. This is expected to improve the strength of the sensor unit 9 against the stress generated during assembly of the sensor unit 9.

[0037] In particular, the stress generated by the rotational torque of the second molded portion 42 increases because frictional forces generated between the resin molded portion 4 and the first and second seal members 5 and 6 are added to the stress. Therefore, reducing the stress applied to the pair of conductive members 3 is effective in improving the strength of the sensor unit 9.

[0038] According to the sensor unit 9, the protrusion 411 has an elliptical shape when viewed from the Z direction. Compared to a shape with corners, an elliptical shape is a shape that is less likely to concentrate stress generated in the second molded portion 42 in response to rotational torque. Therefore, with the protrusion 411 having an elliptical shape, cracks are less likely to occur in the second molded portion 42.

[0039] According to the sensor unit 9, the groove 411g is provided, thereby increasing the creepage distance within the joint surface 41s. Such a creepage distance can suppress leakage current due to migration.

[0040] According to the sensor unit 9, the first seal member 5 and the second seal member 6 sandwich the joining surface 41s and the joining surface 42s. Due to this structure, the first seal member 5 can prevent fluid from penetrating from the structure 81 side into the interface between the first molded portion 41 and the second molded portion 42. On the other hand, the second seal member 6 can prevent fluid from penetrating from the flange 424 side into the interface between the first molded portion 41 and the second molded portion 42.

[0041] According to the sensor assembly 1, when the resin molded portion is molded in the sensor assembly 1, a through hole 32H is provided in the portion where the resin molded portion 4 is molded. With this structure, the resin molded portion 4 is molded through the through hole 32H. Molding in this manner reinforces the fixation of the resin molded portion 4 to the pair of conductive members 3. Therefore, the sensor assembly 1 can prevent the resin molded portion 4 from coming off.

[0042] (First Modification) In this embodiment, the protrusion 411 may have any configuration instead of / in addition to the groove 411g. As a first modified example, as shown in FIG. 11 , the protrusion 411 may have a bulge 411r instead of the groove 411g. The bulge 411r bulges in the Z direction toward the second molded portion 42. The bulge 411r extends between the pair of conductive members 3 on the end surface 411e of the protrusion 411 so as to cross the end surface 411e when viewed from the Z direction. If the protrusion 411 has the bulge 411r, the creepage distance within the joint surface 41s can be increased.

[0043] (Second Modification) In this embodiment, the protrusion 411 has a groove 411g. However, the protrusion 411 may have any configuration. As a second modification, as shown in FIG. 12, the protrusion 411 may have a sleeve 411v. The sleeve 411v rises from the end face 411e so as to surround the periphery of each conductive member 3. If the protrusion 411 has the sleeve 411v, the creepage distance within the joining surface 41s can be increased.

[0044] (Other variations) In this embodiment, the protrusion 411 has an elliptical shape when viewed from the Z direction. However, the protrusion 411 may have any shape when viewed from the Z direction. As a modification, the protrusion 411 may have a non-circular shape, such as a polygonal shape, an I-shape, an S-shape, a U-shape, or an X-shape, when viewed from the Z direction. If the protrusion 411 has a non-circular shape, the protrusion 411 can withstand stress generated by the rotational torque of the second molded portion 42 when the sensor unit 9 is assembled. As another modification, the protrusion 411 may have a circular shape when viewed from the Z direction if the stress generated by the rotational torque of the second molded portion 42 when the sensor unit 9 is assembled is small enough not to affect the strength of the sensor unit 9.

[0045] In this embodiment, the pair of conductive members 3 are lead frames. On the other hand, the pair of conductive members 3 may be made of any conductive material such as a metal plate or a metal rod.

[0046] In this embodiment, the first molded portion 41 is molded by transfer molding, and then the second molded portion 42 is molded by injection molding. On the other hand, as long as the resin molded portion 4 includes the first molded portion 41 and the second molded portion 42, the resin molded portion 4 may be molded in any manner. As a modified example, the first molded portion 41 may be molded by injection molding, and then the second molded portion 42 may be molded by injection molding. As another modified example, the first molded portion 41 may be molded by transfer molding, and then the second molded portion 42 may be molded by transfer molding.

[0047] In this embodiment, the resin molded portion 4 seals the base end portion 31 and the sensor element 2. On the other hand, the resin molded portion 4 may be configured in any manner as long as it covers the base end portion 31 and the sensor element 2. As a modified example, the resin molded portion 4 may include a hollow resin molded cap, and the hollow resin molded cap may cover the sensor element 2 and the portion of the base end portion 31 to which the sensor element 2 is connected.

[0048] In this embodiment, the first molded portion 41 is made of epoxy resin. On the other hand, the first molded portion 41 may be made of any material. For example, if the sensor unit 9 measures the temperature of coolant, the first molded portion 41 may be made of a water-resistant material. For example, if the sensor unit 9 measures the temperature of oil, the first molded portion 41 may be made of an oil-resistant material. Furthermore, in this embodiment, the second molded portion 42 is made of polyamide (PA) resin or polyphenylene sulfide (PPS) resin. On the other hand, the second molded portion 42 may be made of any material.

[0049] In this embodiment, the resin molded portion 4 includes a first molded portion 41 and a second molded portion 42. On the other hand, the resin molded portion 4 may include only one molded portion. That is, the resin molded portion 4 may be a one-color molded portion instead of a two-color molded portion.

[0050] In this embodiment, the sensor element 2 is a temperature sensor. On the other hand, the sensor element 2 is not limited to a temperature sensor and may be any type of sensor.

[0051] In this embodiment, the through-hole 32H is a circular hole. However, the through-hole 32H may have any shape. The through-hole 32H may be a circular hole, a perfect circle, or an ellipse. However, as a modified example, the through-hole 32H may be a polygonal hole. As another modified example, the through-hole 32H may be a slit hole.

[0052] In this embodiment, the remaining widths W1 and W2 are widths that can maintain the mechanical strength of each conductive member 3. As a modified example, the sum of the remaining widths W1 and W2 may be configured to be greater than half the width W3 so that the mechanical strength of each conductive member 3 can be further maintained.

[0053] Although the embodiment of the present disclosure has been described above, this embodiment is shown as an example and is not intended to limit the scope of the present disclosure. This embodiment can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the present disclosure.

[0054] <Additional Notes> Some sensor units and sensor assemblies are listed below.

[0055] [1] A sensor element; a pair of conductive members extending parallel to each other from the sensor element; a resin molded portion covering a portion of the pair of conductive members; Equipped with The pair of conductive members are a base end connected to the sensor element; a distal end portion opposite the proximal end portion; an intermediate portion between the base end portion and the tip end portion, the intermediate portion having a through hole; Including, The resin molded portion covers the base end portion and the intermediate portion while leaving the tip end portion exposed. Sensor unit.

[0056] According to the configuration [1] above, a through hole is provided in the part where the resin molded portion is molded. With this structure, the resin molded portion is molded through the through hole. Because it is molded in this manner, the fixation of the resin molded portion to the pair of conductive members can be reinforced. Therefore, the sensor unit can prevent the resin molded portion from coming off.

[0057] [2] the intermediate portion has a bent portion that bends in a direction in which the pair of conductive members move away from each other, The through hole is formed in the bent portion. [1] The sensor unit according to [1].

[0058] According to the configuration [2] above, a bent portion and a through hole are provided in the portion where the resin molded portion is molded. This configuration allows the resin molded portion to be configured to be caught on the bent portion in the portion where the resin molded portion is molded through the through hole. This configuration reinforces the fixation of the resin molded portion to the pair of conductive members. Therefore, the sensor unit can prevent the resin molded portion from coming off.

[0059] [3] The resin molded portion is a first molded portion covering the base end portion; a second molded portion covering the intermediate portion and joined to the first molded portion; Contains The sensor unit according to [1] or [2].

[0060] According to the configuration [3] above, a through hole is provided in the portion where the second molded portion is molded. With this configuration, the second molded portion is molded through the through hole, thereby reinforcing the fixation of the second molded portion to the pair of conductive members. Due to this reinforcement, the sensor unit can prevent the second molded portion from coming off the first molded portion, regardless of the shape of the joint between the first molded portion and the second molded portion. This makes it possible to simplify the shape of the first molded portion and reduce the size of the sensor unit.

[0061] [4] the first molded portion has a protrusion that protrudes toward the second molded portion on a surface to be joined with the second molded portion, The pair of conductive members are arranged to pass through the protrusions. [3] The sensor unit according to [3].

[0062] According to the above configuration [4], by providing the protrusion, the second molded part contracts so as to come into contact with the circumferential surface of the protrusion during molding of the resin molded part, thereby reducing the gap at the interface between the first molded part and the second molded part.

[0063] In addition to or instead of the above-mentioned effect, the configuration [4] above has a protrusion, which increases the creepage distance within the joining surface, thereby suppressing leakage current due to migration.

[0064] [5] The protrusion has a non-circular shape when viewed from the joining direction of the first molded portion and the second molded portion. [4] The sensor unit according to [4].

[0065] According to the configuration [5] above, when assembling the sensor unit, the stress generated by the rotational torque of the second molded part can be borne not only by the pair of conductive members but also by the protrusions. This structure reduces the stress applied to the pair of conductive members. Therefore, it is expected that the strength of the sensor unit will be improved against the stress generated when assembling the sensor unit.

[0066] [6] The protrusion has a groove or a bulge extending across the end surface between the pair of conductive members when viewed from the joining direction of the first molded portion and the second molded portion. The sensor unit according to [4] or [5].

[0067] According to the above-mentioned configuration [6], the provision of the groove or the bulge increases the creepage distance within the joining surface, which can suppress leakage current due to migration.

[0068] [7] A sensor element; a pair of conductive members extending parallel to each other from the sensor element; Equipped with The pair of conductive members are a base end connected to the sensor element; a distal end portion opposite the proximal end portion; an intermediate portion between the base end portion and the tip end portion, the intermediate portion having a through hole; Contains Sensor assembly.

[0069] According to the configuration [7] above, when the resin molded portion is molded into the sensor assembly, a through hole is provided in the portion where the resin molded portion is molded. With this structure, the resin molded portion is molded through the through hole. Because it is molded in this manner, the fixation of the resin molded portion to the pair of conductive members can be reinforced. Therefore, the sensor assembly can prevent the resin molded portion from coming off. [Explanation of symbols]

[0070] 1. Sensor assembly 2. Sensor element 3 Conductive materials 4 Resin molding part 5 First sealing member 6 Second sealing member 9 Sensor Unit 31 Proximal end 32 Middle section 32H through hole 33 Tip 41 First molding section 41s joint surface 42 Second molding section 42s joint surface 81 Structure 82 seat 321 Bend 411 Protrusion 411e End face 411g Groove 411r bulge 411v sleeve part 413 First seal groove 421 First Recess 422 Second recess 423 Second seal groove 424 flange 425 Extension 426 Rotation stop mechanism 821 Aperture 822 First Lock 823 Second locking part AX axis D1 creepage distance D2 creepage distance P1 first edge P2 Second edge

Claims

1. A sensor element; a pair of conductive members extending parallel to each other from the sensor element; a resin molded portion covering a portion of the pair of conductive members; Equipped with The pair of conductive members are a base end connected to the sensor element; a distal end portion opposite the proximal end portion; an intermediate portion between the base end portion and the tip end portion, the intermediate portion having a through hole; Including, the resin molded portion covers the base end portion and the intermediate portion while leaving the tip end portion exposed, the intermediate portion has a bent portion that bends in a direction in which the pair of conductive members move away from each other, The through hole is formed in the bent portion. Sensor unit.

2. The resin molded portion is a first molded portion covering the base end portion; a second molded portion covering the intermediate portion and joined to the first molded portion; Contains The sensor unit according to claim 1 .

3. A sensor element; a pair of conductive members extending parallel to each other from the sensor element; a resin molded portion covering a portion of the pair of conductive members; Equipped with The pair of conductive members are a base end connected to the sensor element; a distal end portion opposite the proximal end portion; an intermediate portion between the base end portion and the tip end portion, the intermediate portion having a through hole; Including, the resin molded portion covers the base end portion and the intermediate portion while leaving the tip end portion exposed, The resin molded portion is a first molded portion covering the base end portion; a second molded portion covering the intermediate portion and joined to the first molded portion; Including, the first molded portion has a protrusion that protrudes toward the second molded portion on a surface to be joined with the second molded portion, The pair of conductive members are arranged to pass through the protrusions. Sensor unit.

4. The protrusion has a non-circular shape when viewed from the joining direction of the first molded portion and the second molded portion. The sensor unit according to claim 3 .

5. The protrusion has a groove or a bulge extending across the end surface between the pair of conductive members when viewed from the joining direction of the first molded portion and the second molded portion. The sensor unit according to claim 3 .

6. A sensor element; a pair of conductive members extending parallel to each other from the sensor element; Equipped with The pair of conductive members are a base end connected to the sensor element; a distal end portion opposite the proximal end portion; an intermediate portion between the base end portion and the tip end portion, the intermediate portion having a through hole; Including, the intermediate portion has a bent portion that bends in a direction in which the pair of conductive members move away from each other, The through hole is formed in the bent portion. Sensor assembly.

Citation Information

Patent Citations

  • Thermally isolated temperature sensor

    EP2485023A2

  • Temperature sensor and its production method

    JP2002156290A

  • Sensor device

    JP2004198240A

  • Semiconductor device

    JP2017191863A

  • Plastic enclosed sensor

    US20040081225A1