Sensors and Electronic Devices

Abstract

To provide a sensor and an electronic device that can improve accuracy.SOLUTION: A sensor comprises a housing including a housing conductive section, a sensor section surrounded by the housing, a first connection conductive section, and a first connection member. The sensor section includes a base body including a base body conductive section, a first support section fixed to the base body, a first movable section supported by the first support section, and a first conductive section fixed to the base body. A first gap is provided between the base body and the first movable section. The first connection conductive section electrically connects the first conductive section with the housing conductive section. The first connection member electrically connects the base body conductive section with the first conductive section.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to sensors and electronic devices. [Background technology]

[0002] There are sensors such as gyro sensors, etc. Improved accuracy is desired in sensors and electronic devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-144065 Summary of the Invention [Problem to be solved by the invention]

[0004] Embodiments of the present invention provide sensors and electronics that allow for improved accuracy. [Means for solving the problem]

[0005] According to an embodiment of the present invention, a sensor includes a housing including a housing conductive portion, a sensor portion surrounded by the housing, a first connecting conductive portion, and a first connecting member. The sensor portion includes a base including a base conductive portion, a first support portion fixed to the base, a first movable portion supported by the first support portion, and a first conductive portion fixed to the base. A first gap is provided between the base and the first movable portion. The first connecting conductive portion electrically connects the first conductive portion to the housing conductive portion. The first connecting member electrically connects the base conductive portion to the first conductive portion. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 2] FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. [Figure 3] 3(a) to 3(c) are schematic cross-sectional views illustrating a method for manufacturing the sensor according to the first embodiment. [Figure 4] 4A and 4B are schematic cross-sectional views illustrating a method for manufacturing the sensor according to the first embodiment. [Figure 5] FIG. 5 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 7] FIG. 7 is a schematic view illustrating an electronic device according to the second embodiment. [Figure 8] 8(a) to 8(h) are schematic diagrams illustrating applications of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In this specification and in each drawing, elements similar to those previously described with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted where appropriate.

[0008] (First embodiment) FIG. 1 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. Fig. 1 is a cross-sectional view taken along line A1-A2 in Fig. 2. Fig. 2 is a plan view of a part of the structure illustrated in Fig. 1. 1, the sensor 110 according to the embodiment includes a housing 40, a sensor unit 10U, a first connecting conductive part 51, and a first connecting member 61. The sensor unit 10U is provided inside the housing 40.

[0009] As shown in FIG. 1, the housing 40 includes a housing conductive portion 41C. The housing 40 includes, for example, a first planar portion 41a, a second planar portion 41b, a first side portion 42a, and a second side portion 42b. As shown in FIG. 2, the housing 40 includes a third side portion 42c and a fourth side portion 42d. The first planar portion 41a is, for example, a bottom portion. The second planar portion 41b is, for example, a lid portion. The sensor unit 10U is located between the first planar portion 41a and the second planar portion 41b. The sensor unit 10U is provided between the first side portion 42a and the second side portion 42b. The sensor unit 10U is provided between the third side portion 42c and the fourth side portion 42d. The pressure inside the housing 40 is reduced. The pressure inside the housing 40 is lower than 1 atmosphere. In one example, the pressure is 1 Pa or less. FIG. 2 illustrates a state in which the second planar portion 41b has been removed.

[0010] As shown in FIG. 1, the sensor unit 10U includes a base 10s, a first support member 11S, a first movable member 11M, and a first conductive member 18a. The base 10s includes a base conductive member 10C. The base conductive member 10C may include, for example, a semiconductor. The base conductive member 10C is, for example, a silicon substrate. In this example, the base 10s further includes a base insulating member 10I. The base insulating member 10I may be provided on a portion of the base conductive member 10C. The base insulating member 10I includes, for example, silicon oxide.

[0011] The first support portion 11S is fixed to the base body 10s. The first movable portion 11M is supported by the first support portion 11S.

[0012] A first gap g1 is provided between the base body 10s and the first movable part 11M. In this example, the sensor part 10U includes a first connecting part 11C. One end of the first connecting part 11C is connected to the first supporting part 11S. The other end of the first connecting part 11C is connected to the first movable part 11M. The first connecting part 11C is, for example, a spring part. The first movable part 11M is supported by the first supporting part 11S via the first connecting part 11C.

[0013] The first movable part 11M is displaceable. The first movable part 11M is displaced, for example, in response to the inertia of the sensor unit 10U. The inertia includes, for example, at least one of the acceleration received by the sensor unit 10U, the angle of the sensor unit 10U, and the angular velocity of the sensor unit 10U. An electrical characteristic that occurs in response to the displacement is detectable.

[0014] 2, a first opposing electrode 11E is provided opposite to the first movable portion 11M. The capacitance between the first movable portion 11M and the first opposing electrode 11E changes in response to the displacement of the first movable portion 11M. By detecting the change in capacitance (electrical signal), inertia (at least one of acceleration, angle, and angular velocity) can be detected.

[0015] As shown in Fig. 1, the first conductive portion 18a is fixed to the base 10s. As shown in Fig. 1, for example, at least a portion of the base insulating portion 10I is provided between the base conductive portion 10C and the first support portion 11S, and between the base conductive portion 10C and the first conductive portion 18a. For example, the first support portion 11S, the first connection portion 11C, and the first movable portion 11M are insulated from the base conductive portion 10C.

[0016] A conductive layer 17 that will become the first support portion 11S, the first connecting portion 11C, and the first movable portion 11M is provided on the base insulating portion 10I. The conductive layer 17 is processed to form the first support portion 11S, the first connecting portion 11C, and the first movable portion 11M. The remaining portion of the conductive layer 17 also lies on the base insulating portion 10I. For example, this remaining portion of the conductive layer 17 becomes the first conductive portion 18a. As a result, the first conductive portion 18a is fixed to the base 10s. This remaining portion of the conductive layer 17 and the first conductive portion 18a are insulated from the base conductive portion 10C. An electrode 19a electrically connected to the first conductive portion 18a may be provided.

[0017] The first connecting conductive portion 51 electrically connects the first conductive portion 18a to the housing conductive portion 41C. In one example, the first connecting conductive portion 51 is a bonding wire. The first connecting conductive portion 51 may be electrically connected to the electrode 19a.

[0018] The first connection member 61 electrically connects the base conductive portion 10C to the first conductive portion 18a. The first connection member 61 contains, for example, Ag. The first connection member 61 is formed, for example, by applying a conductive paste (for example, a silver paste).

[0019] By providing the first connecting member 61, the base conductive portion 10C is electrically connected to the housing conductive portion 41C via the first connecting member 61, the first conductive portion 18a, and the first connecting conductive portion 51. The potential of the housing conductive portion 41C is fixed. The housing conductive portion 41C is, for example, the ground of the sensor 110. By fixing the potential of the base conductive portion 10C, a stable electrical signal can be obtained. High accuracy can be obtained.

[0020] There is a first reference example in which the first connection member 61 is not provided. In the first reference example, the base conductive portion 10C is insulated from the first conductive portion 18a. Therefore, the first conductive portion 18a is at a floating potential. This makes the electrical signal prone to instability.

[0021] In the embodiment, the first connecting member 61 is provided, thereby fixing the potential of the base conductive portion 10C. This allows a stable electrical signal to be obtained. High accuracy can be achieved. According to the embodiment, a sensor with improved accuracy can be provided.

[0022] On the other hand, a second reference example can be considered in which the first connecting member 61 is not provided and the base 10s is fixed to the housing 40 using a conductive paste or the like. In this case, the base conductive portion 10C can be fixed to the potential of the housing conductive portion 41C. This prevents accuracy degradation due to potential instability. However, in the second reference example, the temperature of the sensor unit 10U is likely to become unstable due to heat conduction from the outside via the conductive paste. In the second reference example, if the size of the conductive paste is reduced to suppress heat conduction, reliable fixation becomes difficult. In other words, with a method in which the base 10s is fixed to the housing 40 using a conductive member (conductive paste), it is difficult to simultaneously achieve stable potential of the base conductive portion 10C, reliable fixation, and suppression of heat conduction from the outside.

[0023] In the embodiment, the potential of the base conductive portion 10C is fixed by providing the first connection member 61. Fixing the base 10s and suppressing heat conduction can be achieved by other means.

[0024] As will be described later, in one example, the first connecting conductive part 51 may hold the first conductive part 18a while electrically connecting the first conductive part 18a to the housing conductive part 41C. For example, by the first connecting conductive part 51 holding the first conductive part 18a, the base body 10s may be held away from the housing 40, thereby suppressing heat conduction. The first connecting conductive part 51 having appropriate strength and size may stabilize the fixation of the sensor part 10U.

[0025] Additionally, in another example, the sensor 110 may include a separate fixing member 31, as shown in FIG.

[0026] The fixing member 31 fixes the base 10s to the housing 40. For example, the fixing member 31 fixes the base 10s to the first planar portion 41a. The fixing member 31 has low thermal conductivity. For example, the thermal conductivity of the fixing member 31 is lower than that of the first connecting conductive portion 51. Fixing the base 10s to the housing 40 with such a fixing member 31 achieves stable fixation while suppressing heat conduction from the outside. Meanwhile, as described above, the first connecting member 61 electrically connects the base conductive portion 10C to the housing conductive portion 41C. The potential of the base conductive portion 10C can be fixed. This makes it possible to provide a sensor with improved accuracy.

[0027] 1, at least a portion of the fixing member 31 is located between the first planar portion 41a and the base body 10s. A portion of the fixing member 31 may contact the side surface of the base body 10s. This provides more reliable fixation. The side surface of the base body 10s intersects with a plane perpendicular to the Z-axis direction.

[0028] In the embodiment, the thermal conductivity of the fixing member 31 is preferably, for example, 0.3 W / mK or less. This suppresses heat conduction and the effects of temperature changes. The thermal conductivity of the fixing member 31 may be 0.1 W / mKw or more. The thermal conductivity of the fixing member 31 may be 0.05 W / mKw or more.

[0029] The electrical conductivity of the fixing member 31 may be lower than that of the first connection conductive portion 51. Generally, higher electrical conductivity corresponds to higher thermal conductivity. It is preferable that the electrical conductivity of the first connection conductive portion 51 is high. This allows, for example, the potential of the base conductive portion 10C to be stably fixed. For example, it is preferable that the first connection conductive portion 51 contains at least one selected from the group consisting of C, Au, Ag, Cu, and Al. This makes it easier to obtain high electrical conductivity. The electrical conductivity of the first connection conductive portion 51 is, for example, 1×10 3 It is less than ΩM.

[0030] On the other hand, the conductivity of the fixing member 31 is, for example, 1×10 15 The conductivity of the fixing member 31 is 1×10 16 In the embodiment, the conductivity of the fixing member 31 is 1×10 19 ΩM or less is fine.

[0031] The fixing member 31 includes, for example, at least one selected from the group consisting of silicon and aluminum, and at least one selected from the group consisting of nitrogen and oxygen. The fixing member 31 may include, for example, at least one selected from the group consisting of silicon nitride, aluminum oxide, and aluminum nitride. Low thermal conductivity and low electrical conductivity can be obtained. Such inorganic materials suppress gas emission. For example, a low pressure can be stably maintained in the space surrounded by the housing 40.

[0032] The fixing member 31 may be formed, for example, by applying a liquid containing the inorganic material described above and then performing a heat treatment.

[0033] In the embodiment, the fixing member 31 does not need to contain an organic material. If the fixing member 31 contains an organic material (such as a resin adhesive), gas may be released from the organic material. If the fixing member 31 does not contain an organic material, gas will not be released. Alternatively, the fixing member 31 contains only a small amount of organic material. For example, the concentration of the organic material contained in the fixing member 31 is preferably 1 wt % or less. The concentration of the organic material contained in the fixing member 31 is the concentration after the fixing member 31 is formed (for example, after drying). Gas release is suppressed.

[0034] As shown in FIG. 1, the fixing member 31 does not have to be provided on the entire surface of the base body 10s. The base body 10s includes a first surface 10f. The first surface 10f faces the housing 40. For example, the first surface 10f faces the first planar portion 41a. The fixing member 31 is provided between the housing 40 (first planar portion 41a) and a portion of the first surface 10f. A second gap g2 is provided between the other portion of the first surface 10f and the housing 40 (first planar portion 41a). This structure further suppresses heat conduction.

[0035] For example, it is preferable that the ratio of the area of ​​the part of the first surface 10f (the part overlapping with the fixing member 31) to the area of ​​the first surface 10f be 0.5 or less, which makes it possible to more reliably suppress heat conduction.

[0036] As shown in FIG. 1, the sensor unit 10U may further include a second movable portion 12M and a second conductive portion 18b. The second movable portion 12M is supported by a first support portion 11S. A first gap g1 is provided between the base body 10s and the second movable portion 12M. In this example, the sensor unit 10U includes a second connecting portion 12C. One end of the second connecting portion 12C is connected to the first support portion 11S. The other end of the second connecting portion 12C is connected to the second movable portion 12M. The second connecting portion 12C is, for example, a spring portion. The second movable portion 12M is supported by the first support portion 11S via the second connecting portion 12C.

[0037] The second movable part 12M is displaceable. The second movable part 12M is displaced, for example, in response to the inertia of the sensor unit 10U. The inertia includes at least one of the acceleration received by the sensor unit 10U, the angle of the sensor unit 10U, and the angular velocity of the sensor unit 10U. An electrical characteristic that occurs in response to the displacement is detectable.

[0038] 2, a second opposing electrode 12E is provided opposite the second movable portion 12M. The capacitance between the second movable portion 12M and the second opposing electrode 12E changes in response to the displacement of the second movable portion 12M. By detecting the change in capacitance (electrical signal), inertia (at least one of acceleration, angle, and angular velocity) can be detected.

[0039] As shown in Fig. 1, the second conductive portion 18b is fixed to the base 10s. As shown in Fig. 1, for example, at least a portion of the base insulating portion 10I is provided between the base conductive portion 10C and the second conductive portion 18b. For example, the second conductive portion 18b is insulated from the base conductive portion 10C.

[0040] 1 and 2, a first support portion 11S is located between the first conductive portion 18a and the second conductive portion 18b. A first movable portion 11M is located between the first conductive portion 18a and the first support portion 11S. A second movable portion 12M is located between the second conductive portion 18b and the first support portion 11S.

[0041] 1 and 2, in this example, the sensor 110 further includes a second connecting conductive portion 52 and a second connecting member 62. The second connecting conductive portion 52 electrically connects the second conductive portion 18b to the housing conductive portion 41C. The second connecting conductive portion 52 may be electrically connected to the electrode 19b (see FIG. 1) electrically connected to the second conductive portion 18b. In one example, the second connecting conductive portion 52 is a bonding wire. The configuration and material of the second connecting conductive portion 52 may be substantially the same as the configuration and material of the first connecting conductive portion 51.

[0042] The second connecting member 62 electrically connects the base conductive portion 10C to the second conductive portion 18b. The material of the second connecting member 62 may be substantially the same as the material of the first connecting member 61.

[0043] For example, the first support portion 11S is located between the first connecting conductive portion 51 and the second connecting conductive portion 52. For example, the first support portion 11S is located between the first connecting member 61 and the second connecting member 62. These conductive portions and members are provided at symmetrical positions with the first support portion 11S at the center. This allows for more stable operation.

[0044] The sensor 110 may include a plurality of fixing members 31. One of the fixing members 31 fixes the base body 10s to the housing 40 near the first connecting member 61. Another of the fixing members 31 fixes the base body 10s to the housing 40 near the second connecting member 62. This provides a more stable fixation. As shown in FIG. 2 , in this example, the number of the fixing members 31 is four. In an embodiment, four or more fixing members 31 may be provided.

[0045] 2, a plurality of connection members (such as a first connection member 61 and a second connection member 62) are provided. The number of the connection members may be four or more. Alternatively, a single connection member (first connection member 61) may be provided.

[0046] 2, the sensor 110 may further include a third connecting conductive part 53. The third connecting conductive part 53 electrically connects the first support part 11S to the housing conductive part 41C. The third connecting conductive part 53 sets the potential of the first support part 11S to the potential of the housing conductive part 41C, thereby achieving stable operation.

[0047] As shown in FIG. 2, the sensor 110 may include a fourth connecting conductive portion 54 and a fifth connecting conductive portion 55. The fourth connecting conductive portion 54 electrically connects the first opposing electrode 11E to one of the plurality of terminals. The fifth connecting conductive portion 55 electrically connects the second opposing electrode 12E to another of the plurality of terminals. For example, an electrical signal between the housing conductive portion 41C and these terminals is detected. In an embodiment, an electrical signal for vibrating the movable portion may be input.

[0048] 2, the sensor 110 may further include a sixth connecting conductive portion 56. The sixth connecting conductive portion 56 electrically connects the conductive portion of the first planar portion 41a to the housing conductive portion 41C.

[0049] An example of a method for manufacturing the sensor 110 according to the embodiment will now be described.

[0050] 3(a) to 3(c), 4(a) and 4(b) are schematic cross-sectional views illustrating the method for manufacturing the sensor according to the first embodiment. As shown in Fig. 3(a), the sensor unit 10U is prepared. As shown in Fig. 3(b), a first connecting member 61 and a second connecting member 62 are formed. For example, a conductive paste that will become the connecting members is applied and dried to form these connecting members.

[0051] As shown in FIG. 3(c), the sensor unit 10U is fixed onto the first planar portion 41a of the housing 40 via a material that will become the fixing member 31. For example, a liquid (paste) containing an inorganic material is applied, and the sensor unit 10U is placed on top of it. This is then subjected to a heat treatment. This results in a solid fixing member 31. The sensor unit 10U is fixed to the first planar portion 41a of the housing 40 by the fixing member 31. The temperature for the heat treatment may be, for example, 200°C or higher (e.g., 230°C).

[0052] 4(a), first conductive part 18a is electrically connected to housing conductive part 41C by first connecting conductive part 51. Second conductive part 18b is electrically connected to housing conductive part 41C by second connecting conductive part 52. These connecting conductive parts are, for example, bonding wires.

[0053] As shown in FIG. 4(b), the second planar portion 41b is fixed to the side portions (the first to fourth side portions 42a to 42d, etc.). The pressure is reduced. Sealing is performed. In this way, the sensor 110 is obtained.

[0054] FIG. 5 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. As shown in Fig. 5, the sensor 110a according to this embodiment is provided with a plurality of fixing members 31. One of the fixing members 31 is located between the first planar portion 41a and the first support portion 11S in the Z-axis direction. This makes the position of the first support portion 11S more stable. In the example of the sensor 110a, the fixing member 31 provided at the end of the base body 10s may be omitted.

[0055] FIG. 6 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. As shown in FIG. 6, the fixing member 31 is omitted in the sensor 111 according to the embodiment. In the sensor 111, the position of the sensor unit 11U is fixed by, for example, the first connecting conductive part 51 and the second connecting conductive part 52. The sensor 111 also has a first connecting member 61 (and a second connecting member 62). This stabilizes the potential of the base conductive part 10C. Since the sensor unit 10U is fixed without using a conductive paste or the like, the effects of heat conduction are suppressed. The sensor 111 can also provide a sensor that can improve accuracy.

[0056] (Second embodiment) The second embodiment relates to an electronic device. FIG. 7 is a schematic view illustrating an electronic device according to the second embodiment. As shown in FIG. 7, an electronic device 310 according to the embodiment includes a sensor according to the embodiment and a circuit control unit 170. In the example of FIG. 7, a sensor 110 (or a sensor device 210) is depicted as the sensor. The circuit control unit 170 can control a circuit 180 based on a signal S1 obtained from the sensor. The circuit 180 is, for example, a control circuit for a driving device 185. According to the embodiment, the circuit 180 for controlling the driving device 185 can be controlled with high precision based on highly accurate detection results.

[0057] 8(a) to 8(h) are schematic diagrams illustrating applications of electronic devices. As shown in FIG. 8(a), the electronic device 310 may be at least a part of a robot. As shown in FIG. 8(b), the electronic device 310 may be at least a part of a machine robot installed in a manufacturing factory or the like. As shown in FIG. 8(c), the electronic device 310 may be at least a part of an automated guided vehicle in a factory or the like. As shown in FIG. 8(d), the electronic device 310 may be at least a part of a drone (unmanned aerial vehicle). As shown in FIG. 8(e), the electronic device 310 may be at least a part of an airplane. As shown in FIG. 8(f), the electronic device 310 may be at least a part of a ship. As shown in FIG. 8(g), the electronic device 310 may be at least a part of a submarine. As shown in FIG. 8(h), the electronic device 310 may be at least a part of an automobile. The electronic device 310 may include, for example, at least one of a robot and a moving object.

[0058] The embodiment may include the following configurations (for example, technical solutions). (Configuration 1) a housing including a housing conductive portion; A sensor unit enclosed in the housing, the sensor unit comprising: a substrate including a substrate conductive portion; a first support portion fixed to the base; a first movable portion supported by the first support portion; a first conductive portion fixed to the base; the sensor unit including: a first gap provided between the base and the first movable part; a first connecting conductive portion that electrically connects the first conductive portion to the housing conductive portion; a first connection member that electrically connects the base conductive portion to the first conductive portion; A sensor comprising:

[0059] (Configuration 2) Further comprising a fixing member, the fixing member fixes the base to the housing, The sensor according to configuration 1, wherein the thermal conductivity of the fixing member is lower than the thermal conductivity of the first connecting conductive portion.

[0060] (Configuration 3) the base includes a first surface facing the housing, the fixing member is provided between the housing and a part of the first surface, The sensor according to configuration 2, wherein a second gap is provided between the other portion of the first surface and the housing.

[0061] (Configuration 4) 4. The sensor of claim 3, wherein a ratio of an area of ​​the portion of the first surface to an area of ​​the first surface is 0.5 or less.

[0062] (Configuration 5) 5. The sensor according to any one of configurations 2 to 4, wherein the thermal conductivity of the fixing member is 0.05 W / mKw or more and 0.3 W / mK or less.

[0063] (Configuration 6) 5. The sensor according to any one of configurations 2 to 4, wherein the thermal conductivity of the fixing member is 0.1 W / mKw or more.

[0064] (Configuration 7) The sensor according to any one of configurations 1 to 7, wherein the electrical conductivity of the fixing member is lower than the electrical conductivity of the first connecting conductive portion.

[0065] (Configuration 8) The conductivity of the fixing member is 1×10 15 ΩM or more, 1×10 19 8. The sensor of claim 7, wherein the resistance is ΩM or less.

[0066] (Configuration 9) The conductivity of the fixing member is 1×10 16 8. The sensor of claim 7, wherein the resistance is ΩM or greater.

[0067] (Configuration 10) 10. The sensor according to any one of configurations 1 to 9, wherein the fixing member includes at least one selected from the group consisting of silicon and aluminum, and at least one selected from the group consisting of nitrogen and oxygen.

[0068] (Configuration 11) 11. The sensor according to any one of configurations 1 to 10, wherein the fixing member does not contain an organic material, or the concentration of the organic material contained in the fixing member is 1 wt % or less.

[0069] (Configuration 12) 12. The sensor according to any one of configurations 1 to 11, wherein the first connecting conductive portion includes at least one selected from the group consisting of Au, Ag, Cu, and Al.

[0070] (Configuration 13) 13. The sensor according to any one of aspects 1 to 12, wherein the first connecting member contains Ag.

[0071] (Configuration 14) The sensor unit a second movable portion supported by the first support portion; a second conductive portion fixed to the substrate; further comprising the first support portion is located between the first conductive portion and the second conductive portion, the first movable portion is located between the first conductive portion and the first support portion, 14. The sensor according to any one of configurations 1 to 13, wherein the second movable portion is located between the second conductive portion and the first support portion.

[0072] (Configuration 15) a second connecting conductive portion that electrically connects the second conductive portion to the housing conductive portion; a second connection member that electrically connects the base conductive portion to the second conductive portion; 15. The sensor of claim 14, comprising:

[0073] (Configuration 16) 16. The sensor according to any one of configurations 1 to 15, further comprising a third connecting conductive part that electrically connects the first support part to the housing conductive part.

[0074] (Configuration 17) the substrate further includes a substrate insulating portion; The sensor of any one of configurations 1 to 16, wherein at least a portion of the base insulating portion is provided between the base conductive portion and the first support portion, and between the base conductive portion and the first conductive portion.

[0075] (Configuration 18) 18. The sensor of any one of configurations 1 to 17, wherein the pressure inside the housing is less than 1 atmosphere.

[0076] (Configuration 19) The sensor according to any one of configurations 1 to 18, a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

[0077] (Configuration 20) 20. The electronic device of claim 19, wherein the electronic device includes at least one of a robot and a mobile object.

[0078] According to the embodiment, a sensor and electronic device can be provided that can improve accuracy.

[0079] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element included in the sensor, such as the sensor unit, support unit, movable unit, movable member, electrode, opposing unit, and circuit unit, are within the scope of the present invention as long as a person skilled in the art can implement the present invention in a similar manner and obtain similar effects by appropriately selecting them from known ranges.

[0080] Furthermore, any combination of two or more elements of each specific example within the scope of technical feasibility is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0081] In addition, all sensors and electronic devices that can be implemented by a person skilled in the art by appropriately modifying the design based on the sensors and electronic devices described above as embodiments of the present invention also fall within the scope of the present invention, as long as they include the gist of the present invention.

[0082] In addition, within the scope of the concept of the present invention, a person skilled in the art may come up with various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0083] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0084] DESCRIPTION OF SYMBOLS 10C...base conductive portion, 10I...base insulating portion, 10U...sensor portion, 10f...first surface, 10s...base, 11C, 12C...first and second connecting portions, 11E, 12E...first and second opposing electrodes, 11M, 12M...first and second movable portions, 11S...first support portion, 17...conductive layer, 18a, 18b...first and second conductive portions, 19a, 19b...electrodes, 31...fixing member, 40...casing, 41C...casing conductive portion, 41a, 41b...first and second planar portions, 42a-42d...first to fourth side portions, 51-56...first to sixth connecting conductive portions, 61, 62...first and second connecting members, 110, 110a, 111...sensor, 170...circuit control section, 180...circuit, 185...drive device, 210...sensor device, 310...electronic device, S1...signal, g1, g2...first and second gaps

Claims

1. a housing including a housing conductive portion; A sensor unit enclosed in the housing, the sensor unit comprising: a substrate including a substrate conductive portion; a first support portion fixed to the base; a first movable portion supported by the first support portion; a first conductive portion fixed to the base; the sensor unit including: a first gap provided between the base body and the first movable part; a first connecting conductive portion that electrically connects the first conductive portion to the housing conductive portion; a first connection member that electrically connects the base conductive portion to the first conductive portion; A fixing member; Equipped with the fixing member fixes the base to the housing, the thermal conductivity of the fixing member is lower than the thermal conductivity of the first connection conductive portion; the concentration of the organic material contained in the fixing member is 1 wt % or less; the base includes a first surface facing the housing, the fixing member is provided between the housing and a portion of the first surface, A second gap is provided between the other portion of the first surface and the housing.

2. The sensor according to claim 1 , wherein a portion of the fixing member is in contact with a side surface of the base body.

3. 3. The sensor according to claim 1, wherein the fixing member includes at least one selected from the group consisting of silicon and aluminum, and at least one selected from the group consisting of nitrogen and oxygen.

4. 4. The sensor according to claim 1, wherein the first connecting conductive portion includes at least one selected from the group consisting of Au, Ag, Cu, and Al.

5. The sensor unit a second movable portion supported by the first support portion; a second conductive portion fixed to the substrate; further comprising the first support portion is located between the first conductive portion and the second conductive portion, the first movable portion is located between the first conductive portion and the first support portion, The sensor according to claim 1 , wherein the second movable portion is located between the second conductive portion and the first support portion.

6. a second connecting conductive portion that electrically connects the second conductive portion to the housing conductive portion; a second connection member that electrically connects the base conductive portion to the second conductive portion; The sensor of claim 5 , comprising:

7. the substrate further includes a substrate insulating portion; The sensor according to any one of claims 1 to 6, wherein at least a portion of the base insulating portion is provided between the base conductive portion and the first support portion, and between the base conductive portion and the first conductive portion.

8. A sensor according to any one of claims 1 to 7; a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

9. The electronic device according to claim 8 , wherein the electronic device includes at least one of a robot and a mobile object.

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