Lithium anode device stack fabrication

Abstract

To provide an anode electrode structure and methods for fabricating the same.SOLUTION: An anode electrode structure comprises: a current collector comprising copper; a lithium metal film formed on the current collector; a metal film formed on the lithium metal film, where the metal film covers a top surface and sidewalls of the lithium metal film and extends to contact the current collector; a protective film formed on the metal film; and a ceramic film formed on the protective film. The protective film is a lithium-ion conducting film comprising lithium-ion conducting ceramic, lithium-ion conducting glass, lithium-ion conducting polymer, lithium-ion conducting liquid crystal, or a combination thereof. The metal film is selected from a copper film, a bismuth film, a tin film, or a combination thereof. The ceramic film is selected from aluminum oxide (Al2O3), AlOx, AlOxNy, aluminum oxyhydroxide AlO(OH) and AlN.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] TECHNICAL FIELD

[0001] Implementations described herein relate generally to metal electrodes, and more particularly to lithium-containing anodes, high performance electrochemical devices such as secondary batteries that include such lithium-containing electrodes, and methods for making the same. [Background technology]

[0002] 2. Description of Related Art

[0002] Rechargeable electrochemical storage systems are becoming increasingly valuable in many areas of daily life. High-capacity electrochemical energy storage devices, such as lithium-ion (Li-ion) batteries, are being used in an increasing number of applications, including portable electronics, medical care, transportation, grid-connected bulk energy storage, renewable energy storage, and uninterruptible power supplies (UPS). Traditional lead / sulfuric acid batteries often lack capacity and are often not sufficiently recyclable for these growing application areas. Lithium-ion batteries, on the other hand, are believed to offer great opportunities.

[0003]

[0003] Generally, lithium-ion batteries do not contain metallic lithium for safety reasons and instead use graphite material as the anode. However, the use of graphite, which can be charged to a limit composition LiC6 at the state of charge, results in significantly lower capacity compared to metallic lithium. Currently, the industry is transitioning from graphite-based anodes to silicon-blended graphite to increase energy cell density. However, silicon-blended graphite anodes suffer from first-cycle capacity loss. Therefore, lithium metal deposition is required to replenish the first-cycle capacity loss of silicon-blended graphite anodes. However, lithium metal faces several device integration challenges.

[0004]

[0004] Lithium is an alkali metal. Like its heavy group 1 homologues, lithium is characterized by strong reactivity with a variety of substances. It reacts violently with water, alcohols, and other substances containing protic hydrogen, often resulting in fire. Lithium is unstable in air and reacts with oxygen, nitrogen, and carbon dioxide. Lithium is usually handled under an inert gas atmosphere (a noble gas such as argon), and its highly reactive nature necessitates that other processing operations also be carried out under an inert gas atmosphere. As a result, lithium presents several challenges with regard to handling, storage, and transportation.

[0005]

[0005] Protective surface treatments for lithium metal have been developed. One method of protective surface treatment for lithium metal is to coat the lithium metal with a wax layer, such as polyethylene wax. However, typically, a large amount of coating is applied, which hinders subsequent processing of the lithium metal film.

[0006]

[0006] Another method of protective surface treatment has been proposed to produce lithium metal powders ("SLMPs") stabilized with continuous carbonate coatings, polymer coatings such as polyurethane, PTFE, PVC, polystyrene, and others. However, these polymer coatings can cause problems when prelithiating the electrode material.

[0007]

[0007] Therefore, there is a need for a method and system for depositing and processing lithium metal in energy storage systems. Summary of the Invention

[0008]

[0008] Implementations described herein generally relate to metal electrodes, and more specifically to lithium-containing anodes, high-performance electrochemical devices such as secondary batteries including such lithium-containing electrodes, and methods for fabricating the same. In one implementation, an anode electrode structure is provided. The anode electrode structure includes a current collector made of copper, a lithium metal film formed on the current collector, a copper film formed on the lithium metal film, and a protective film formed on the copper film. The protective film is a lithium ion conductive film selected from the group including lithium ion conductive ceramic, lithium ion conductive glass, or ion conductive liquid crystal.

[0009]

[0009] In another implementation, an anode electrode structure is provided. The anode electrode structure includes a current collector including copper, a silicon-graphite anode formed on the current collector, a lithium metal film formed on the silicon-graphite anode, and a protective film formed on the lithium metal film. The protective film is a lithium ion conductive material selected from the group including lithium ion conductive ceramics, lithium ion conductive glasses, ion conductive polymers, ion conductive liquid crystals, composite combinations thereof, or combinations of unit layers thereof.

[0010]

[0010] In yet another implementation, an anode electrode structure is provided. The anode electrode structure includes a current collector including copper, a lithium metal film formed on the current collector, and a protective film stack formed on the lithium metal film. The protective film stack includes a protective film formed on the lithium metal film, a first polymer film formed on the protective film, a ceramic film formed on the first polymer film, and a second polymer film formed on the ceramic film. The protective film is selected from the group consisting of lithium fluoride (LiF), aluminum oxide, bismuth chalcogenide, copper chalcogenide, lithium carbonate (Li2CO3), and combinations thereof.

[0011] In yet another implementation, an anode electrode structure is provided. The anode electrode structure includes a current collector including copper, a lithium metal film formed on the current collector, and a protective film stack formed on the lithium metal film. The protective film stack includes a first polymer film formed on the lithium metal film, a dielectric film formed on the first polymer film, and a second polymer film formed on the ceramic film.

[0012]

[0012] In yet another implementation, an anode electrode structure is provided. The anode electrode structure includes a current collector including copper, a lithium metal film formed on the current collector, and a protective film stack formed on the lithium metal film. The protective film stack includes a copper film formed on the lithium metal film, a dielectric film formed on the copper film, and a polymer film formed on the dielectric film.

[0013]

[0013] In yet another implementation, a method is provided. The method includes forming a lithium metal film on a current collector. The current collector includes copper. The method further includes forming a copper film on the lithium metal film and forming a protective film on the copper film. The protective film is a lithium ion conductive film selected from the group including lithium ion conductive ceramic, lithium ion conductive glass, ion conductive polymer, ion conductive liquid crystal, a composite combination thereof, or a combination of unit layers thereof.

[0014]

[0014] In yet another implementation, a method is provided. The method includes forming a silicon graphite film on a current collector. The current collector includes copper. The method further includes forming a film of lithium metal on the silicon graphite anode and forming a protective film on the lithium metal film. The protective film is a lithium ion conductive material selected from the group including lithium ion conductive ceramic, lithium ion conductive glass, ion conductive polymer, ion conductive liquid crystal, composite combinations thereof, or combinations of unit layers thereof.

[0015] In yet another implementation, a method is provided. The method includes forming a lithium metal film on a current collector. The current collector includes copper. The method further includes forming a protective film stack on the lithium metal film. The protective film stack includes forming a protective film on the lithium metal film, forming a first polymer film formed on the protective film, forming a ceramic film formed on the first polymer film, and forming a second polymer film on the ceramic film. The protective film is selected from the group consisting of lithium fluoride (LiF), aluminum oxide, bismuth chalcogenide, copper chalcogenide, lithium carbonate (Li2CO3), and combinations thereof.

[0016] In yet another implementation, a method is provided. The method includes forming a lithium metal film on a current collector. The current collector includes copper. The method further includes forming a protective film stack on the lithium metal film. The protective film stack includes forming a first polymer film on the lithium metal film, forming a dielectric film on the first polymer film, and forming a second polymer film on the dielectric film.

[0017] In yet another implementation, a method is provided. The method includes forming a lithium metal film on a current collector. The current collector includes copper. The method further includes forming a protective film stack on the lithium metal film. The protective film stack includes forming a metal film on the lithium metal film, forming a dielectric film on a first polymer film, and forming a polymer film on the dielectric film.

[0018]

[0018] In order that the above-described features of the present disclosure may be understood in detail, a more particular description of the implementations briefly summarized above may be had by reference to the implementations, some of which are illustrated in the accompanying drawings. However, it should be noted that, because the present disclosure may admit of other equally effective implementations, the accompanying drawings illustrate only typical implementations of the present disclosure and therefore should not be considered as limiting the scope of the present invention. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a schematic cross-sectional view of one implementation of an energy storage device including an electrode structure formed in accordance with the implementations described herein. [Figure 2] 1 illustrates a cross-sectional view of one implementation of a double-sided anode electrode structure formed in accordance with the implementations described herein. [Figure 3] 1 illustrates a cross-sectional view of another implementation of a double-sided anode electrode structure formed in accordance with implementations described herein. [Figure 4] 1 illustrates a cross-sectional view of another implementation of a double-sided anode electrode structure formed in accordance with implementations described herein. [Figure 5] 1 illustrates a cross-sectional view of another implementation of a double-sided anode electrode structure formed in accordance with implementations described herein. [Figure 6] 1 illustrates a cross-sectional view of another implementation of a double-sided anode electrode structure formed in accordance with implementations described herein. [Figure 7] FIG. 1 is a process flow diagram outlining one implementation of a method for forming an anode electrode structure according to implementations described herein. [Figure 8] FIG. 1 is a process flow diagram outlining one implementation of a method for forming an anode electrode structure according to implementations described herein. [Figure 9] FIG. 1 is a process flow diagram outlining one implementation of a method for forming an anode electrode structure according to implementations described herein. [Figure 10] FIG. 1 is a process flow diagram outlining one implementation of a method for forming an anode electrode structure according to implementations described herein. [Figure 11] FIG. 1 is a process flow diagram outlining one implementation of a method for forming an anode electrode structure according to implementations described herein. [Figure 12] 1 is a schematic diagram of an integrated processing tool for forming an anode electrode structure according to implementations described herein. DETAILED DESCRIPTION OF THE INVENTION

[0020]

[0031] To facilitate understanding, wherever possible, identical reference numerals have been used to designate identical elements common to the figures, and it is contemplated that elements and features of one implementation may be beneficially incorporated in other implementations without further recitation.

[0021]

[0032] The following disclosure describes anode electrodes, high performance electrochemical cells, and batteries, including the aforementioned anode electrodes and methods for fabricating the same. Specific details are presented in the following description and in FIGS. 1-12 to provide a thorough understanding of various embodiments of the present disclosure. In many cases, other details describing well-known structures and systems related to electrochemical cells and batteries are included in the following disclosure to avoid unnecessarily obscuring the description of various implementations.

[0022]

[0033] Many of the details, dimensions, angles, and other features shown in the figures are merely illustrative of particular implementations. Thus, other implementations may have other details, components, dimensions, angles, without departing from the spirit and scope of the present disclosure. In addition, implementations of the present disclosure may also be practiced without some of the details described below.

[0023]

[0034] The implementations described herein are described below with reference to reel-to-reel coating systems such as TopMet™, SMARTWEB™, and TopBeam™, all of which are available from Applied Materials, Inc., Santa Clara, California. Other tools capable of performing physical vapor deposition processes (e.g., high-rate evaporation and magnetron sputtering processes) may also be adapted to take advantage of the implementations described herein. Moreover, any system capable of performing the physical vapor deposition processes described herein may also be used to advantage. The apparatus descriptions described herein are exemplary and should not be understood or construed as limiting the scope of the implementations described herein. While described herein as a reel-to-reel process, it should also be understood that the implementations described herein may also be performed on individual substrates.

[0024]

[0035] Energy storage devices, such as batteries, typically consist of a positive electrode, an anode electrode separated by a porous separator, and an electrolyte used as an ion-conducting matrix. While graphite anodes are the current state of the art, the industry is transitioning from graphite-based anodes to silicon-mixed graphite anodes to increase cell energy density. However, silicon-mixed graphite anodes often suffer from irreversible capacity loss during the first cycle. Therefore, a method for replenishing this first-cycle capacity loss is needed.

[0025]

[0036] Deposition of lithium metal is one method for replacing this first cycle capacity loss of silicon-graphite anodes. While there are many methods for lithium metal deposition (e.g., thermal evaporation, lamination, printing, etc.), handling of lithium metal deposited on a spool prior to device lamination must be addressed, especially in mass production environments. In one implementation, a method and system for forming a lithium anode device is provided.

[0026]

[0037] Using the implementations described herein, either single-sided or double-sided deposited lithium metal can be protected during downstream reeling and unwinding. The deposition of a thin film of Li-ion conductive polymer, ion-conductive ceramic, or ion-conductive glass has several advantages. First, reels of electrodes containing lithium metal can be wound and unwound without the lithium metal contacting adjacent electrodes. Second, a stable solid electrolyte interface (SEI) is established for better battery performance and high electrochemical utilization of the lithium metal. The protective layer can also help suppress or eliminate lithium dendrites, especially in high-current-density operation. Furthermore, the use of a protective film reduces the complexity of the manufacturing system and is compatible with current manufacturing systems.

[0027]

[0038] FIG. 1 shows a schematic cross-sectional view of one implementation of an energy storage device 100 incorporating an anode electrode structure formed in accordance with the implementations described herein. While the energy storage device 100 is shown as a planar structure, it may be formed into a cylindrical shape by winding a stack of layers, and other cell configurations (e.g., prismatic cells, button cells, or stacked electrode cells) may also be formed. The energy storage device 100 includes an anode electrode structure 110 and a cathode electrode structure 120 with a separator membrane 130 disposed therebetween. The cathode electrode structure 120 includes a cathode current collector 140 and a cathode membrane 150. The anode electrode structure 110 includes an anode current collector 160, an anode membrane 170, and at least one of a protective membrane 175, a lithium-ion conducting polymer membrane 180, a ceramic coating 185, and a bonded porous polymer membrane 190.

[0028]

[0039] The cathode electrode structure 120 includes a cathode current collector 140 and a cathode film 150 formed on the cathode current collector 140. It should be understood that the cathode electrode structure 120 may include other elements or films.

[0029]

[0040] The current collectors 140, 160 on the cathode film 150 and the anode film 170, respectively, may be the same electronic conductor or may be different electronic conductors. Examples of metals that can be used to construct the current collectors 140, 160 include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, at least one of the current collectors 140, 160 is perforated. In one implementation, at least one of the current collectors 140, 160 includes a polyethylene terephthalate (PET) polymer substrate coated with a metallic material. In one implementation, the anode current collector 160 is a copper-coated PET film. In another implementation, the anode current collector 160 is a multi-metal layer on PET. The multi-metal layer may be a combination of copper, chromium, nickel, etc. In one implementation, the anode current collector 160 is a multilayer structure including a copper-nickel clad material. In one implementation, the multilayer structure includes a first layer of nickel or chromium, a second layer of copper formed on the first layer, and a third layer including nickel, chromium, or both formed on the second layer. In one implementation, the anode current collector 160 is nickel-coated copper. Furthermore, the current collector can be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure. Typically, in prismatic cells, the tab is formed of the same material as the current collector, but it can be formed during stack fabrication or added later. In some implementations, the current collector extends beyond the stack, and the portion of the current collector that extends beyond the stack can be used as the tab. All components except the current collectors 140 and 160 contain a lithium-ion electrolyte. In one implementation, the cathode current collector 140 is aluminum. In another implementation, the cathode current collector 140 includes aluminum deposited on a PET film. In one implementation, the cathode current collector 140 has a thickness of about 0.5 μm to about 20 μm (e.g., about 1 μm to about 10 μm, about 2 μm to about 8 μm, about 5 μm to about 10 μm).In one implementation, anode current collector 160 is copper. In one implementation, anode current collector 160 has a thickness of about 0.5 μm to about 20 μm (e.g., about 1 μm to about 10 μm, about 2 μm to about 8 μm, about 6 μm to about 12 μm, about 5 μm to about 10 μm).

[0030]

[0041] The cathode membrane 150, or cathode, may be any material compatible with the anode, including intercalation compounds, insertion compounds, or electrochemically active polymers. Suitable intercalation materials include, for example, lithium-containing metal oxides, MoS2, FeS2, BiF3, Fe2OF4, MnO2, TiS2, NbSe3, LiCoO2, LiNiO2, LiMnO2, LiMn2O4, VO 13 Suitable polymers include, for example, polyacetylene, polypyrrole, polyaniline, and polythiophene. The cathode film 150 or cathode may be made from a layered oxide such as lithium cobalt oxide, an olivine such as lithium iron phosphate, or a spinel such as lithium manganese oxide. Exemplary lithium-containing oxides may be layered, such as lithium cobalt oxide (LiCoO), or may be layered, such as LiNiCoO. 1-2x MnO2, LiNiMnCoO2 (“NMC”), LiNi 0.5 Mn 1.5 O4, Li(Ni 0.8 Co 0.15 Al 0.05 )O2, mixed metal oxides such as LiMn2O4, as well as doped lithium-rich layered materials, where x is a zero or non-zero number. An exemplary phosphate may be fayalite (LiFePO4), which is a variety (LiFe (1-x) Mg x PO4), LiMoPO4, LiCoPO4, LiNiPO4, Li3V2(PO4)3, LiVOPO4, LiMP2O7, or LiFe 1.5PO7, where x is zero or a non-zero number. Exemplary fluorophosphates may be LiVPO4F, LiAlPO4F, Li5V(PO4)2F2, Li5Cr(PO4)2F2, Li2CoPO4F, or Li2NiPO4F. Exemplary silicates may be Li2FeSiO4, Li2MnSiO4, or Li2VOSiO4. An exemplary non-lithium compound is Na5V2(PO4)2F3.

[0031]

[0042] The anode electrode structure 110 includes an anode current collector 160, and an anode membrane 170 formed on the anode current collector 160. The anode electrode structure 110 may optionally include at least one of a protective membrane 175, a lithium-ion conducting polymer membrane 180, a ceramic coating 185, and a bonded porous polymer membrane 190. In the embodiment shown in FIG. 1 , the protective membrane 175 is formed on the anode membrane 170. A membrane of the lithium-ion conducting polymer membrane 180 is formed on the protective membrane 175. The ceramic coating 185 is formed on the lithium-ion conducting polymer membrane 180. A bonded porous polymer membrane 190 is formed between the separator membrane 130 and the anode membrane 170.

[0032]

[0043] The anode film 170 may be made of any material compatible with the cathode film 150. The anode film 170 may have an energy capacity of 372 mAh / g or greater, preferably 700 mAh / g or greater, and most preferably 1000 mAh / g or greater. The anode film 170 may be composed of graphite, silicon-containing graphite, lithium metal, lithium metal foil, or lithium alloy foil (e.g., lithium aluminum alloy), or a mixture of lithium metal and / or lithium alloy with materials such as carbon (e.g., coke, graphite), nickel, copper, tin, indium, silicon, oxides thereof, or combinations thereof. The anode film 170 typically includes a lithium-containing intercalation compound or a lithium-containing insertion compound. In some implementations in which the anode film 170 includes lithium metal, the lithium metal may be deposited using methods described herein.

[0033]

[0044] In one implementation, the anode film 170 has a thickness of about 10 μm to about 200 μm (e.g., about 1 μm to about 100 μm, about 10 μm to about 30 μm, about 20 μm to about 30 μm, about 1 μm to about 20 μm, or about 50 μm to about 100 μm). In one implementation, the anode film 170 is a lithium metal film.

[0034]

[0045] In some implementations, a protective film 175 is formed on the anode film 170. The protective film 175 includes at least one of lithium fluoride (LiF), a metal film (e.g., copper, bismuth, tin, or a combination thereof), a copper chalcogenide (e.g., CuS, CuSe, CuS), a bismuth chalcogenide (e.g., BiTe, BiSe), and lithium carbonate (LiCO). In some implementations, the protective film 175 is permeable to at least one of lithium ions and lithium atoms. The protective film 175 provides surface protection for the anode film 170, which allows the anode film to be handled in a dry chamber. Without being bound by theory, it is believed that the protective film 175 can capture lithium-conducting electrolyte and form a gel during device fabrication. This is beneficial for forming a good solid electrolyte interface (SEI), further helping to reduce resistance. In some implementations where the energy storage device 100 is a solid-state energy storage device, the protective film 175 helps to build a better SEI and improve device performance. The protective film 175 can be deposited directly on the anode film 170 by physical vapor deposition (PVD), such as evaporation or sputtering, atomic layer deposition (ALD), a slot-die process, dip coating, a thin film transfer process, gravure coating, or a three-dimensional lithium printing process. PVD is a preferred method for depositing the protective film 175.

[0035]

[0046] In some implementations, the protective film 175 is a metal film. The metal film may be an ultra-thin metal seed film. The metal film may be a copper film. The copper film may be an ultra-thin copper film.

[0036]

[0047] The protective film 175 can be a coating or a discrete layer having a thickness in the range of 1 nanometer to 2,000 nanometers (e.g., 10 nanometers to 600 nanometers, 50 nanometers to 100 nanometers, 50 nanometers to 200 nanometers, 100 nanometers to 150 nanometers). The protective film 175 is a discrete film having a thickness in the range of 1 micron to 50 microns (e.g., 1 micron to 25 microns).

[0037]

[0048] The protective membrane 175 can be porous. In some implementations, the protective membrane 175 has nanopores. In one implementation, the protective membrane 175 has a plurality of nanopores sized to have an average pore size or diameter of less than about 10 nanometers (e.g., about 1 nanometer to about 10 nanometers, about 3 nanometers to about 5 nanometers). In another implementation, the protective membrane 175 has a plurality of nanopores sized to have an average pore size or diameter of less than about 5 nanometers. In one implementation, the protective membrane 175 has a plurality of nanopores with diameters in the range of about 1 nanometer to about 20 nanometers (e.g., about 2 nanometers to about 15 nanometers, or about 5 nanometers to about 10 nanometers).

[0038]

[0049] In some implementations, a lithium ion conducting polymer film 180 is formed over the protective film 175. Without being bound by theory, it is believed that the lithium ion conducting polymer film 180 conducts lithium ions and blocks any dendrites that may form from the anode film 170. Examples of ion conducting polymers that can be used to form the lithium ion conducting polymer film 180 include, but are not limited to, polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, poly(sulfur-random)-triallylamine, polyetheretherketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof.

[0039]

[0050] In some implementations, a ceramic coating 185 is formed on the lithium-ion conducting polymer membrane 180. The ceramic coating 185 includes one or more dielectric materials. The dielectric material may be a ceramic material. The ceramic material may be an oxide. Examples of ceramic materials include aluminum oxide (Al2O3), AlO x , AlO x N y, aluminum oxyhydroxide AlO(OH), AlN (aluminum deposited in a nitrogen environment), calcium carbonate (CaCO3), titanium dioxide (TiO2), niobium oxide (Nb2O5), SiS2, SiPO4, silicon oxide (SiO2), zirconium oxide (ZrO2), MgO, TiO2, Ta2O5, Nb2O5, LiAlO2, LiNbO3, LiTaO3, Li2NbO3, BaTiO3, BN, ion-conducting garnets, ion-conducting perovskites, ion-conducting inverse perovskites, porous glass-ceramics, and the like, or combinations thereof. In one implementation, the ceramic material is selected from the group consisting of porous aluminum oxide, porous ZrO2, porous SiO2, porous MgO, porous TiO2, porous Ta2O5, porous Nb2O5, porous LiAlO2, porous LiNbO3, porous LiTaO3, porous Li2NbO3, porous BaTiO3, ion-conducting garnets, anti-ion-conducting perovskites, Li2S-P2S5 glass, porous glass dielectrics, or combinations thereof. The ceramic coating 185 is a binderless dielectric film. In some implementations, the ceramic coating 185 is a porous aluminum oxide film.

[0040]

[0051] The ceramic coating 185 may be a lithium ion conductive ceramic or a lithium ion conductive glass. Examples of Li-ion conductive materials include LiPON, Li7La3Zr2O 12 doped variants of either the crystalline or amorphous phase of Li2S-P2S5, Li2S, LiKSO4, Li3P, Li5B7S 13 , Li 10 GeP2S 12 , Li3PS4, LiNH2, LiNO3, Lithium borohydride amide Li(BH4) 1-x (NH2) x, lithium phosphate glass, (1-x)LiI-(x)Li4SnS4, xLiI-(1-x)Li4SnS4, mixed sulfide and oxide electrolytes (crystalline LLZO, amorphous (1-x)LiI-(x)Li4SnS4 mixture, and amorphous xLiI-(1-x)Li4SnS4). In one implementation, x is between 0 and 1 (e.g., 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, and 0.9). The lithium ion conductive material can be deposited directly on the lithium metal film using any of physical vapor deposition (PVD), chemical vapor (CVD), spray, doctor blade, printing, or a number of coating methods. A suitable method for some implementations is PVD. In some implementations, the ceramic coating 185 need not be ion conductive, but when filled with an electrolyte (liquid, gel, solid, combinations thereof, etc.), the combination of the porous substrate and the electrolyte becomes ion conductive.

[0041]

[0052] In some embodiments, the ceramic coating 185 is lithium zirconate (Li2ZrO3), LiPON, garnet-type Li7La3Zr2O 12 in the crystalline or amorphous phase, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Si x P 3-x O 12 , where 0 < x < 3), lithium borohydride (LiBH4), doped inverse perovskite compositions, lithium containing sulfides (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12 and Li3PS4), and lithium argyrodite (e.g., LiPS5X where X is Cl, Br or I).

[0042]

[0053] The ceramic coating 185 has a thickness in the range of 1 nanometer to 2,000 nanometers (e.g., in the range of 10 nanometers to 600 nanometers, in the range of 50 nanometers to 100 nanometers, in the range of 100 nanometers to 200 nanometers, in the range of 100 nanometers to 150 nanometers).

[0043]

[0054] In some implementations, a bonded porous polymeric membrane 190 is formed between the ceramic coating 185 and the separator membrane 130. Without being bound by theory, it is believed that the bonded porous polymeric membrane 190 helps to improve adhesion between the anode electrode structure 110 and the separator membrane 130 when bonded together.

[0044]

[0055] The polymer for the bonded porous polymer membrane 190 can be selected from polymers currently used in the Li-ion battery industry. Examples of polymers that can be used to form gel polymer membranes include, but are not limited to, polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquids, and combinations thereof. Without being bound by theory, it is believed that the bonded porous polymer membrane 190 can incorporate lithium-conducting electrolyte to form a gel during device fabrication. This is beneficial for the formation of a good solid electrolyte interface (SEI), further helping to reduce resistance. In some implementations, gel or liquid crystal electrolytes are made by using a mixture of warm liquid and a lithium-ion-conducting salt. The warm liquid mixture is poured into the spirally wound or stacked electrodes, filling the pores of the network electrode, and the electrolyte forms a solid or gel at room temperature. The bonded porous polymer layer 190 can be formed by dip coating, slot die coating, gravure coating, or printing. Organic polymers with sulfur ions (e.g., polyphenylene sulfide with LiO mixtures) have shown good results with lithium metal-based anodes, potentially forming liquid crystal electrolytes.

[0045]

[0056] The bonded porous polymeric membrane 190 can have a thickness in the range of 5 nanometers to 2,000 micrometers (e.g., in the range of 10 nanometers to 600 nanometers, in the range of 50 nanometers to 100 nanometers, in the range of 100 nanometers to 200 nanometers, in the range of 100 nanometers to 150 nanometers).

[0046]

[0057] The separator membrane 130 is formed between the anode electrode structure 110 and the cathode electrode structure 120. The separator membrane 130 comprises a porous (e.g., microporous) polymeric substrate having pores capable of conducting ions (e.g., the separator membrane). In some implementations, the porous polymeric substrate itself need not be ionically conductive, but once filled with an electrolyte (liquid, gel, solid, combinations thereof, etc.), the combination of the porous substrate and the electrolyte becomes ionically conductive. In one implementation, the porous polymeric substrate is a multi-membrane polymeric substrate. In one implementation, the pores are micropores. In some implementations, the porous polymeric substrate comprises any commercially available polymeric microporous membrane (e.g., single-ply or multi-ply). For example, these products are manufactured by Polypore (Celgard, Inc., Charlotte, North Carolina), Toray Tonen (battery separator membrane (BSF)), SK Energy (lithium-ion battery separator (LiBS)), Evonik Industries (SEPARION® ceramic separator membrane), Asahi Kasei (Hipore™ polyolefin flat membrane), DuPont (Energain®), and others. In some implementations, the porous polymeric substrate has a porosity in the range of 20 to 80% (e.g., in the range of 28 to 60%). In some implementations, the porous polymeric substrate has an average pore size in the range of 0.02 to 5 microns (e.g., 0.08 to 2 microns). In some implementations, the porous polymeric substrate has a Gurley number in the range of 15 to 150 seconds. In some implementations, the porous polymeric substrate is made of a polyolefin. Exemplary polyolefins include polypropylene, polyethylene, or a combination thereof.

[0047]

[0058] In some implementations where the energy storage device 100 is a solid-state battery, the separator membrane 130 is replaced with a lithium-ion conducting glass. The lithium-ion conducting material may be a lithium-ion conducting ceramic or a lithium-ion conducting glass. Examples of the Li-ion conducting material include LiPON, Li7La3Zr2O, and the like. 12doped variants of either the crystalline or amorphous phase of Li2S-P2S5, doped antiperovskite compositions, Li2S-P2S5, Li 10 GeP2S 12 , and Li3PS4, lithium phosphate glass, (1-x)LiI-(x)Li4SnS4, xLiI-(1-x)Li4SnS4, mixed sulfide and oxide electrolytes (crystalline LLZO, amorphous (1-x)LiI-(x)Li4SnS4 mixtures, and amorphous xLiI-(1-x)Li4SnS4). In one implementation, x is between 0 and 1 (e.g., 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, and 0.9).

[0048]

[0059] The electrolytes infused into the anode electrode structure 110, the cathode electrode structure 120, and the separator membrane 130 can be composed of liquid / gel or solid polymers, and each can be different. In some implementations, the electrolyte primarily comprises a salt and a medium (e.g., in a liquid electrolyte, the medium may be referred to as a solvent, while in a gel electrolyte, the medium may be a polymer matrix). The salt can be a lithium salt. Lithium salts can include, for example, LiPF, LiAsF, LiCF, SO, LiN(CF, SO), LiBF, and LiClO, BETTE electrolyte (commercially available from 3M Corp., Minneapolis, Minnesota), and combinations thereof. Solvents can include, for example, ethylene carbonate (EC), propylene carbonate (PC), EC / PC, 2-MeTHF (2-methyltetrahydrofuran) / EC / PC, EC / DMC (dimethyl carbonate), EC / DME (dimethylethane), EC / DEC (dimethyl carbonate), EC / EMC (ethyl methyl carbonate), EC / EMC / DMC / DEC, EC / EMC / DMC / DEC / PE, PC / DME, and DME / PC. Polymer matrices can include, for example, PVDF (polyvinylidene fluoride), PVDF:THF (PVDF:tetrahydrofuran), PVDF:CTFE (PVDF:chlorotrifluoroethylene), PAN (polyacrylonitrile), and PEO (polyethylene oxide). In one implementation, the electrolyte is a solvent in a salt, and the solvent ratio is much lower than the solvent ratio in typical electrolytes.

[0049]

[0060] 2 shows a cross-sectional view of one implementation of an anode electrode structure 200 formed in accordance with the implementations described herein. While the anode current collector 160 is shown in FIG. 2 as extending beyond the stack, it should be noted that the anode current collector 160 need not extend beyond the stack, but rather the portion that extends beyond the stack may be used as a tab. While the anode electrode structure 200 is depicted as a double-sided electrode structure, it should be understood that the implementations described herein may also be applied to single-sided electrode structures.

[0050]

[0061] The anode electrode structure 200 includes an anode current collector 160 and anode films 170a, 170b (collectively 170) formed on the opposite side of the anode current collector 160. In one implementation, the anode film 170 is a lithium metal film. In one implementation, the anode film 170 has a thickness of 20 micrometers or less (e.g., about 1 micrometer to about 20 micrometers). Metal films 210a, 210b (collectively 210) are formed on each anode film 170a, 170b. In one implementation, the metal films are selected from copper films, bismuth films, or tin films. In one implementation, the metal films are ultrathin metal films having a thickness of 100 nanometers or less (e.g., about 5 nanometers to about 100 nanometers, about 5 nanometers to about 40 nanometers, about 10 nanometers to about 20 nanometers, or about 50 nanometers to about 100 nanometers). In some implementations, as depicted in FIG. 2 , the metal film 210 coats the exposed surfaces (e.g., top and sidewalls) of the anode film 170 that extend to contact the anode current collector 160. Metal films 220a, 220b (collectively 220) are formed on each anode film 210a, 210b. In some implementations, the protective film 220 is permeable to at least one of lithium ions and lithium atoms. In one implementation, the protective film 220 is selected from a group including lithium ion conductive ceramic, lithium ion conductive glass, or ion conductive liquid crystal. The protective film 220 can have a thickness in the range of 5 nanometers to 2,000 micrometers (e.g., in the range of 10 nanometers to 600 nanometers, 50 nanometers to 100 nanometers, 100 nanometers to 200 nanometers, or 100 nanometers to 150 nanometers).

[0051]

[0062] 3 shows a cross-sectional view of another implementation of an anode electrode structure 300 formed in accordance with the implementations described herein. While the anode current collector 160 is shown in FIG. 3 as extending beyond the stack, it should be noted that the anode current collector 160 need not extend beyond the stack, but rather the portion that extends beyond the stack may be used as a tab. While the anode electrode structure 300 is depicted as a double-sided electrode structure, it should be understood that the implementations described herein may also be applied to single-sided electrode structures.

[0052]

[0063] The anode electrode structure 300 includes an anode current collector 160 and anode films 170a, 170b (collectively 170) formed on the opposite side of the anode current collector 160. In one implementation, the anode film 170 is a silicon graphite film. In one implementation, the anode film 170 has a thickness of about 100 micrometers or less (e.g., about 1 μm to about 100 μm, about 10 μm to about 30 μm, about 20 μm to about 30 μm, about 3 μm to about 20 μm, or about 50 μm to about 100 μm). Lithium metal films 310a, 310b (collectively 310) are formed on upper surfaces 320a, 320b (collectively 320) of the anode films 170a, 170b, respectively. In some implementations, a lithium metal film 310 is formed on the exposed surfaces of the anode membrane 170, including the top surface 320 and sidewalls 330a, 330b (collectively 330). The lithium metal film 310 replenishes the first cycle capacity loss of the silicon-implanted graphite anode. The lithium metal film 310 is an ultrathin lithium film having a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers).

[0053]

[0064] In some implementations, as depicted in FIG. 3 , protective films 340a, 340b (collectively 340) coat the exposed surfaces of the lithium metal film 310 and the exposed surfaces (e.g., top and sidewalls) of the anode film 170 that extend to contact the anode current collector 160. In some implementations, the protective film 340 is permeable to at least one of lithium ions and lithium atoms. In one implementation, the protective film 340 is selected from a group including a lithium ion conductive ceramic, a lithium ion conductive glass, or an ion conductive liquid crystal. The protective film 340 can have a thickness in the range of 5 nanometers to 2,000 micrometers (e.g., in the range of 10 nanometers to 600 nanometers, in the range of 50 nanometers to 100 nanometers, in the range of 100 nanometers to 200 nanometers, or in the range of 100 nanometers to 150 nanometers).

[0054]

[0065] 4 shows a cross-sectional view of another implementation of an anode electrode structure 400 formed in accordance with the implementations described herein. While the anode current collector 160 is shown in FIG. 4 as extending beyond the stack, it should be noted that the anode current collector 160 need not extend beyond the stack, but rather the portion that extends beyond the stack may be used as a tab. While the anode electrode structure 400 is depicted as a double-sided electrode structure, it should be understood that the implementations described herein may also be applied to single-sided electrode structures.

[0055]

[0066] The anode electrode structure 400 includes an anode current collector 160 and an anode film 170a, 170b (collectively 170) formed on the opposite side of the anode current collector 160. In one implementation, the anode film 170 is a silicon graphite film. In one implementation, the anode film 170 is a lithium metal film. In one implementation, the anode film 170 has a thickness of about 100 micrometers or less (e.g., about 1 μm to about 100 μm, about 10 μm to about 30 μm, about 20 μm to about 30 μm, about 3 μm to about 20 μm, or about 50 μm to about 100 μm). Protective film stacks 410a, 410b (collectively 410) are formed on the anode film 170. In some implementations, a protective film stack 410 is formed on exposed surfaces of the anode membrane 170, including the top surface 420a, 420b (collectively 420) and sidewalls 430a, 430b (collectively 430) of the anode membrane 170. The protective film stack 410 includes protective films 440a, 440b (collectively 440), first polymer films 450a, 450b (collectively 450) formed on the protective film stack 410, ceramic films 460a, 460b (collectively 460) formed on the first polymer film 450, and second polymer films 470a, 470b (collectively 470) formed on the ceramic film 460.

[0056]

[0067] The protective film 440 is selected from the group consisting of lithium fluoride (LiF), aluminum oxide, aluminum oxyhydroxide (AlO(OH)), copper chalcogenides (e.g., CuS, CuSe, CuS), bismuth chalcogenides (e.g., BiTe, BiSe), lithium carbonate (LiCO), and combinations thereof. In one implementation, the protective film 440 is a lithium carbonate film (LiCO). In one implementation, the protective film 440 is an ultrathin film having a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, a protective film 440 is formed over exposed surfaces of the anode film 170, including the top surfaces 420a, 420b (collectively 420) and sidewalls 430a, 430b (collectively 430) of the anode film 170.

[0057]

[0068] The first polymer film 450 is formed on the protective film 440. The first polymer film 450 functions as a bonding layer and enhances ionic conductivity. In one implementation, the first polymer film 450 is selected from the group consisting of polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR) ionic liquid, and combinations thereof. In one implementation, the first polymer film 450 has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the first polymer film 450 is formed on the exposed surface of the protective film 440 including the upper surface and sidewalls of the protective film 440.

[0058]

[0069] The ceramic film 460 is formed on the first polymer film 450. The ceramic film 460 functions as a lithium-ion conducting enhancer and blocks dendritic crystals. In one implementation, the ceramic film 460 is a porous film. The ceramic film 460 can be similar to the ceramic coating 185. In one implementation, the ceramic film 460 is LiPON, garnet-type Li7La3Zr2O 12 of the crystalline phase or amorphous phase, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Si x P 3-x O 12 , where 0 < x < 3), lithium borohydride (LiBH4), doped inverse perovskite composition, lithium containing sulfide (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12and Li3PS4), and lithium argyrodite (e.g., LiPS5X, where X is Cl, Br, or I). In one implementation, ceramic film 460 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, ceramic film 460 is formed on exposed surfaces of first polymer film 450, including the top surface and sidewalls of first polymer film 450.

[0059]

[0070] A second polymer film 470 is formed on the ceramic film 460. The second polymer film 470 functions as a bonding layer and enhances ionic conductivity. In one implementation, the second polymer film 470 is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the second polymer film 470 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, the second polymer film 470 is formed over the exposed surfaces of the ceramic film 460 , including the top surface and sidewalls of the second polymer film 470 .

[0060]

[0071] 5 shows a cross-sectional view of another implementation of an anode electrode structure 500 formed in accordance with the implementations described herein. While the anode current collector 160 is shown in FIG. 5 as extending beyond the stack, it should be noted that the anode current collector 160 need not extend beyond the stack, but rather the portion that extends beyond the stack can be used as a tab. While the anode electrode structure 500 is depicted as a double-sided electrode structure, it should be understood that the implementations described herein can also be applied to single-sided electrode structures.

[0061]

[0072] The anode electrode structure 500 includes an anode current collector 160 and anode films 170a, 170b (collectively 170) formed on the opposite side of the anode current collector 160. In one implementation, the anode film 170 is a silicon graphite film. In one implementation, the anode film 170 has a thickness of about 100 micrometers or less (e.g., about 1 μm to about 100 μm, about 10 μm to about 30 μm, about 20 μm to about 30 μm, about 3 μm to about 20 μm, or about 50 μm to about 100 μm). In one implementation, the anode film 170 is a lithium metal film. Protective film stacks 510a, 510b (collectively 510) are formed on the anode film 170. In some implementations, a protective film stack 510 is formed on the exposed surfaces of the anode film 170, including the top surfaces 520a, 520b (collectively 520) and sidewalls 530a, 530b (collectively 530) of the anode film 170. The protective film stack 510 includes first polymer films 550a, 550b (collectively 550) formed on the exposed surfaces of the anode film 170, dielectric films 560a, 560b (collectively 560) formed on the first polymer film 550, and second polymer films 570a, 570b (collectively 570) formed on the dielectric film 560.

[0062]

[0073] The first polymer film 550 is formed on the anode film 170. The first polymer film 550 functions as a bonding layer and enhances ion conductivity. In one implementation, the first polymer film 550 is selected from the group consisting of polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR) ionic liquid, and combinations thereof. In one implementation, the first polymer film 550 has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the first polymer film 550 is formed on the exposed surface of the anode film 170 including the upper surface 520 and the side wall 530 of the protective film 170.

[0063]

[0074] The dielectric film 560 is formed on the first polymer film 550. The dielectric film 560 functions as a lithium ion conduction promoter and blocks dendritic crystals. In one implementation, the dielectric film 560 is a porous film. The dielectric film 560 can be similar to the ceramic coating 185. In one implementation, the dielectric film 560 is LiPON, garnet-type Li7La3Zr2O 12 of the crystalline phase or amorphous phase, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Si x P 3-x O 12 ., where 0 < x < 3), lithium borohydride (LiBH4), doped inverse perovskite composition, lithium containing sulfide (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12and Li3PS4), and lithium argyrodite (e.g., LiPS5X, where X is Cl, Br, or I). In one implementation, the dielectric film 560 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, the dielectric film 560 is formed on exposed surfaces of the first polymer film 550, including the top surface and sidewalls of the first polymer film 550.

[0064]

[0075] A second polymer film 570 is formed on the dielectric film 560. The second polymer film 570 functions as a bonding layer and enhances ionic conductivity. In one implementation, the second polymer film 570 is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the second polymer film 570 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, the second polymer film 570 is formed over the exposed surfaces of the dielectric film 560, including the top surface and sidewalls of the dielectric film 560.

[0065]

[0076] 6 shows a cross-sectional view of another implementation of an anode electrode structure 600 formed in accordance with the implementations described herein. While the anode current collector 160 is shown in FIG. 6 as extending beyond the stack, it should be noted that the anode current collector 160 need not extend beyond the stack, but rather the portion that extends beyond the stack can be used as a tab. While the anode electrode structure 600 is depicted as a double-sided electrode structure, it should be understood that the implementations described herein can also be applied to single-sided electrode structures.

[0066]

[0077] The anode electrode structure 600 includes an anode current collector 160 and anode films 170a, 170b (collectively 170) formed on the opposite side of the anode current collector 160. In one implementation, the anode film 170 is a silicon graphite film. In one implementation, the anode film 170 has a thickness of about 100 micrometers or less (e.g., about 1 μm to about 100 μm, about 10 μm to about 30 μm, about 20 μm to about 30 μm, about 3 μm to about 20 μm, or about 50 μm to about 100 μm). In one implementation, the anode film 170 is a lithium metal film. Protective film stacks 610a, 610b (collectively 610) are formed on the anode film 170. In some implementations, a protective film stack 610 is formed on the exposed surfaces of the anode film 170, including the top surfaces 620a, 620b (collectively 620) and sidewalls 630a, 630b (collectively 630) of the anode film 170. The protective film stack 610 includes metal films 650a, 650b (collectively 650) formed on the exposed surfaces of the anode film 170, dielectric films 660a, 660b (collectively 660) formed on the metal films 650, and polymer films 670a, 670b (collectively 670) formed on the dielectric films 660.

[0067]

[0078] The metal film 650 is formed on the anode film 170. The metal film 650 functions as a protective film. The metal film 650 can be similar to the protective film 175. In one implementation, the metal film 650 is an ultra-thin metal seed film. The metal film 650 can be a copper film. The copper film can be an ultra-thin copper film. In one implementation, the metal film 650 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, the metal film 650 is formed on exposed surfaces of the anode film 170, including the top surface 620 and sidewalls 630 of the anode film 170.

[0068]

[0079] The dielectric film 660 is formed on the metal film 650. The dielectric film 660 functions as a lithium ion conduction promoter and blocks dendritic crystals. In one implementation, the dielectric film 660 is a porous film. The dielectric film 660 can be similar to the ceramic coating 185. In one implementation, the dielectric film 660 is LiPON, garnet-type Li7La3Zr2O 12 crystalline phase or amorphous phase of, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Si x P 3-x O 12 , where 0 < x < 3), lithium borohydride (LiBH4), doped inverse perovskite composition, lithium containing sulfide (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12 and Li3PS4), and lithium argyrodite (e.g., LiPS5X where X is Cl, Br or I) selected from the group consisting of. In one implementation, the dielectric film 660 has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the dielectric film 660 is formed on the exposed surface of the metal film 650 including the upper surface and side walls of the metal film 650.

[0069]

[0080] A polymer film 670 is formed on the dielectric film 660. The polymer film 670 functions as a bonding layer and enhances ionic conductivity. In one implementation, the polymer film 670 is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the polymer film 670 has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, the polymer film 670 is formed over exposed surfaces of the dielectric film 660, including the top surface and sidewalls of the dielectric film 660.

[0070]

[0081] FIG. 7 shows a process flow diagram outlining one implementation of a method 700 for forming an anode electrode structure according to implementations described herein. The anode electrode structure may be the anode electrode structure 200 shown in FIG. 2. In step 710, a substrate is provided. In one implementation, the substrate is a continuous sheet of material 1250, as shown in FIG. 12. In one implementation, the substrate is an anode current collector 160. Examples of metals from which the substrate may be constructed include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, the substrate is a copper material. In one implementation, the substrate is perforated. Furthermore, the substrate may be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure.

[0071]

[0082] In some implementations, the substrate is exposed to a pretreatment process including at least one of a plasma treatment or a corona discharge treatment to remove organic materials from the exposed surface of the current collector, the pretreatment process being performed prior to film deposition on the substrate.

[0072]

[0083] In step 720, a lithium metal film is formed on a substrate. In one implementation, the lithium metal film is an anode film 170, and the substrate is an anode current collector 160. In one implementation, the lithium metal film is formed on a copper current collector. In some implementations, if an anode film is already present on the substrate, the lithium metal film is formed on the anode film. If an anode film 170 is not present, the lithium metal film can be formed directly on the substrate. Any suitable lithium deposition process for depositing a thin film of lithium metal can be used to deposit the thin film of lithium metal. The deposition of the thin film of lithium metal can be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. The chamber for depositing the thin film of lithium metal can include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0073]

[0084] In step 730, a metal film is formed on the lithium metal film. In one implementation, the metal film is a copper film, a bismuth film, or a tin film. Referring to FIG. 2, the metal film may be metal film 210, and the lithium metal film may be anode film 170. In one implementation, the metal film is selected from a copper film, a bismuth film, a tin film, or a combination thereof. In one implementation, the metal film is an ultra-thin copper film having a thickness of 100 nanometers or less (e.g., about 5 nanometers to 100 nanometers, about 10 nanometers to about 20 nanometers, or about 50 nanometers to about 100 nanometers). Any suitable copper film deposition process for depositing a thin copper film may be used to deposit the thin copper film. The deposition of the thin copper film may be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. Chambers for depositing thin films of lithium metal can include PVD systems such as electron beam evaporators, thermal evaporators, or sputtering systems, thin film transfer systems (including large area pattern printing systems such as gravure printing systems), or slot die deposition systems.

[0074]

[0085] In step 740, a protective film may be formed on the metal film. Referring to FIG. 2, the protective film may be protective film 220, and the copper film may be metal film 210. In some implementations, protective film 220 is permeable to at least one of lithium ions and lithium atoms. In one implementation, protective film 220 is selected from the group including lithium ion conductive ceramic, lithium ion conductive glass, ion conductive polymer, ion conductive liquid crystal, a composite combination thereof, or a combination of unit layers thereof. Protective film 220 may have a thickness in the range of 5 nanometers to 2,000 micrometers (e.g., 10 nanometers to 600 nanometers, 50 nanometers to 100 nanometers, 100 nanometers to 200 nanometers, 100 nanometers to 150 nanometers). Protective film 220 may be deposited directly on the copper film using physical vapor deposition (PVD), chemical vapor deposition (CVD), spraying, doctor blading, printing, or any of a number of coating methods. A suitable method for some implementations is PVD. In some implementations, the protective membrane 220 need not be ionically conductive, but when filled with an electrolyte (liquid, gel, solid, combinations thereof, etc.), the combination of the porous substrate and electrolyte becomes ionically conductive.

[0075]

[0086] FIG. 8 shows a process flow diagram outlining one implementation of a method 800 for forming an anode electrode structure according to implementations described herein. The anode electrode structure may be the anode electrode structure 300 shown in FIG. 3. In step 810, a substrate is provided. In one implementation, the substrate is a continuous sheet of material 1250. In one implementation, the substrate is an anode current collector 160. Examples of metals from which the substrate may be constructed may include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, the substrate is a copper material. In one implementation, the substrate is perforated. Furthermore, the substrate may be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure.

[0076]

[0087] In some implementations, the substrate is exposed to a pretreatment process including at least one of a plasma treatment or a corona discharge treatment to remove organic materials from the exposed surface of the current collector, the pretreatment process being performed prior to film deposition on the substrate.

[0077]

[0088] In step 820, a silicon graphite film is formed on a substrate. In one implementation, the silicon graphite film is an anode film 170, and the substrate is an anode current collector 160. In one implementation, the silicon graphite film is formed on a copper current collector. The silicon graphite film may be formed in a first processing chamber 1210 (see FIG. 12). Any suitable silicon graphite film deposition process for depositing a silicon graphite thin film may be used to deposit the silicon graphite thin film. The silicon graphite thin film may be deposited by a PVD process such as evaporation, a slot-die process, a transfer process, electroplating, or a three-dimensional lithium printing process. The chamber for depositing the silicon graphite thin film may include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large-area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0078]

[0089] In step 830, a lithium metal film is formed on the silicon graphite film. Referring to FIG. 3 , in one implementation, the lithium metal film is lithium metal film 310, and the silicon graphite film is anode film 170. Any suitable lithium metal film deposition process for depositing a thin film of lithium metal can be used to deposit the thin film of lithium metal. The deposition of the thin film of lithium metal can be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. The chamber for depositing the thin film of lithium metal can include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0079]

[0090] In step 840, a protective film can be formed on the lithium metal film. Referring to FIG. 3 , the protective film can be protective film 340, and the lithium metal film can be lithium metal film 310. In some implementations, protective film 340 is permeable to at least one of lithium ions and lithium atoms. In one implementation, protective film 340 is selected from the group including lithium ion conductive ceramic, lithium ion conductive glass, ion conductive polymer, ion conductive liquid crystal, a composite combination thereof, or a combination of unit layers thereof. Protective film 340 can have a thickness in the range of 5 nanometers to 2,000 micrometers (e.g., 10 nanometers to 600 nanometers, 50 nanometers to 100 nanometers, 100 nanometers to 200 nanometers, 100 nanometers to 150 nanometers). Protective film 340 can be deposited directly on the lithium metal film using physical vapor deposition (PVD), chemical vapor deposition (CVD), spraying, doctor blading, printing, or any of a number of coating methods. A suitable method for some implementations is PVD. In some implementations, the protective membrane 340 does not need to be ionically conductive, but when filled with an electrolyte (liquid, gel, solid, combinations thereof, etc.), the combination of the porous substrate and electrolyte becomes ionically conductive.

[0080]

[0091] FIG. 9 shows a process flow diagram outlining one implementation of a method 900 for forming an anode electrode structure according to implementations described herein. The anode electrode structure may be the anode electrode structure 400 shown in FIG. 4. In step 910, a substrate is provided. In one implementation, the substrate is a continuous sheet of material 1250, as shown in FIG. 12. In one implementation, the substrate is the anode current collector 160. Examples of metals from which the substrate may be constructed may include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, the substrate is a copper material. In one implementation, the substrate is perforated. Furthermore, the substrate may be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure.

[0081]

[0092] In some implementations, the substrate is exposed to a pretreatment process including at least one of a plasma treatment or a corona discharge treatment to remove organic materials from the exposed surface of the current collector, the pretreatment process being performed prior to film deposition on the substrate.

[0082]

[0093] In step 920, a lithium metal film is formed on a substrate. In one implementation, the lithium metal film is an anode film 170, and the substrate is an anode current collector 160. In one implementation, the lithium metal film is formed on a copper current collector. In some implementations, if an anode film is already present on the substrate, the lithium metal film is formed on the anode film. If an anode film 170 is not present, the lithium metal film can be formed directly on the substrate. Any suitable lithium metal film deposition process can be used to deposit a thin film of lithium metal. The deposition of the thin film of lithium metal can be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. The chamber for depositing the thin film of lithium metal can include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large-area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0083]

[0094] In step 930, a protective film is formed on the lithium metal film. Referring to FIG. 4, the protective film may be protective film 440, or the lithium metal film may be anode film 170. In one implementation, the protective film is similar to protective film 175 described in connection with FIG. 1. The protective film includes at least one of lithium fluoride (LiF), a metal film (e.g., copper, bismuth, tin, or a combination thereof), a copper chalcogenide (e.g., CuS, CuSe, CuS), a bismuth chalcogenide (e.g., BiTe, BiSe), and lithium carbonate (LiCO). Protective film 175 provides surface protection for anode film 170. The protective film can be deposited directly on the anode film 170 by physical vapor deposition (PVD), such as evaporation or sputtering, atomic layer deposition (ALD), a slot-die process, dip coating, a thin film transfer process, gravure coating, comma bar coating, kiss-roll coating, or a three-dimensional lithium printing process. PVD is a preferred method for depositing the protective film. The protective film can be either a coating or a discrete layer having a thickness in the range of 1 nanometer to 2,000 nanometers (e.g., 10 nanometers to 600 nanometers, 50 nanometers to 100 nanometers, 50 nanometers to 200 nanometers, or 100 nanometers to 150 nanometers). The protective film can be a discrete film having a thickness in the range of 5 microns to 50 microns (e.g., 6 microns to 25 microns).

[0084]

[0095] In process 940, the first polymer film is formed on the protective film. Referring to FIG. 4, the first polymer film may be the first polymer film 450, and the protective film may be the protective film 440. The first polymer film functions as a bonding layer and enhances ionic conductivity. In one implementation, the first polymer film is selected from the group consisting of polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR) ionic liquid, and combinations thereof. In one implementation, the first polymer film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the first polymer film is formed on the exposed surface of the protective film, including the upper surface and sidewalls of the protective film. The first polymer film can be directly deposited on the protective film by physical vapor deposition (PVD) such as evaporation or sputtering, atomic layer deposition (ALD), slot die process, dip coating, thin film transfer process, gravure coating, or three-dimensional lithium printing process.

[0085]

[0096] In process 950, the ceramic film is formed on the first polymer film. Referring to FIG. 4, the ceramic film may be the ceramic film 460, and the first polymer film may be the first polymer film 450. The ceramic film functions as a lithium ion conduction promoter and blocks dendritic crystals. In one implementation, the ceramic film is a porous film. The ceramic film can be similar to the ceramic coating 185 described in relation to FIG. 1. In one implementation, the ceramic film is LiPON, garnet-type Li7La3Zr2O 12 of the crystalline phase or amorphous phase, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Six P 3-x O 12 Here, 0 < x < 3), lithium borohydride (LiBH4), a doped inverse perovskite composition, lithium sulfide (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12 and Li3PS4), and lithium argyrodite (e.g., LiPS5X where X is Cl, Br, or I) selected from the group consisting of. In one implementation, the ceramic film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the ceramic film is formed on the exposed surface of the first polymer film including the upper surface and sidewalls of the first polymer film. The ceramic film can be directly deposited on the protective film by physical vapor deposition (PVD) such as evaporation or sputtering, atomic layer deposition (ALD), slot die process, dip coating, thin film transfer process, gravure coating or three-dimensional lithium printing process.

[0086]

[0097] In step 960, a second polymer film is formed on the ceramic film. Referring to FIG. 4, the second polymer film may be second polymer film 470, and the ceramic film may be ceramic film 460. The second polymer film 470 functions as a tie layer and enhances ionic conductivity. In one implementation, the second polymer film is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the second polymer film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the second polymer film is formed on the exposed surfaces of the ceramic film, including the top surface and sidewalls of the second polymer film. The second polymer film can be deposited directly on the protective film by physical vapor deposition (PVD), such as evaporation or sputtering, atomic layer deposition (ALD), a slot-die process, dip coating, a thin film transfer process, gravure printing, or a three-dimensional lithium printing process.

[0087]

[0098] FIG. 10 shows a process flow diagram outlining one implementation of a method 1000 for forming an anode electrode structure according to implementations described herein. The anode electrode structure can be the anode electrode structure 500 shown in FIG. 5. In step 1010, a substrate is provided. In one implementation, the substrate is a continuous sheet of material 1250, as shown in FIG. 12. In one implementation, the substrate is an anode current collector 160. Examples of metals from which the substrate can be constructed include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, the substrate is a copper material. In one implementation, the substrate is perforated. Furthermore, the substrate can be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure.

[0088]

[0099] In some implementations, the substrate is exposed to a pretreatment process including at least one of a plasma treatment or a corona discharge treatment to remove organic materials from the exposed surface of the current collector, the pretreatment process being performed prior to film deposition on the substrate.

[0089]

[0100] In step 1020, a lithium metal film is formed on a substrate. In one implementation, the lithium metal film is an anode film 170, and the substrate is an anode current collector 160. In one implementation, the lithium metal film is formed on a copper current collector. In some implementations, if an anode film is already present on the substrate, the lithium metal film is formed on the anode film. If an anode film 170 is not present, the lithium metal film can be formed directly on the substrate. Any suitable lithium metal film deposition process can be used to deposit a thin film of lithium metal. The deposition of the thin film of lithium metal can be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. The chamber for depositing the thin film of lithium metal can include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large-area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0090]

[0101] In process 1030, the first polymer film is formed on the lithium metal film. Referring to FIG. 5, the first polymer film may be the first polymer film 550, and the lithium metal film may be the anode film 170. The first polymer film functions as a bonding layer and enhances ionic conductivity. In one implementation, the first polymer film is selected from the group consisting of polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR) ionic liquid, and combinations thereof. In one implementation, the first polymer film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the first polymer film is formed on the exposed surface of the lithium metal film including the upper surface and sidewalls of the protective film. The first polymer film can be directly deposited on the protective film by physical vapor deposition (PVD) such as evaporation or sputtering, atomic layer deposition (ALD), slot die process, dip coating, thin film transfer process, gravure coating or three-dimensional lithium printing process.

[0091]

[0102] In process 1040, the dielectric film is formed on the first polymer film. Referring to FIG. 5, the dielectric film may be the dielectric film 560, and the first polymer film may be the first polymer film 550. The dielectric film functions as a lithium ion conduction promoter and blocks dendritic crystals. In one implementation, the dielectric film is a porous film. The dielectric film can be similar to the ceramic coating 185 described in relation to FIG. 1. In one implementation, the dielectric film is LiPON, garnet-type Li7La3Zr2O 12 crystalline phase or amorphous phase of, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Six P 3-x O 12 Here, 0 < x < 3), lithium borohydride (LiBH4), a doped inverse perovskite composition, lithium containing sulfide (e.g., Li2S, Li2S - P2S5, Li 10 GeP2S 12 and Li3PS4), and lithium argyrodite (e.g., LiPS5X where X is Cl, Br or I) are selected from the group consisting of. In one implementation, the dielectric film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the dielectric film is formed on the exposed surface of the first polymer film including the upper surface and sidewalls of the first polymer film. The dielectric film can be directly deposited on the protective film by physical vapor deposition (PVD) such as chemical vapor deposition (CVD), evaporation or sputtering, atomic layer deposition (ALD), slot die process, dip coating, thin film transfer process, gravure coating or three - dimensional lithium printing process.

[0092]

[0103] In step 1050, a second polymer film is formed on the dielectric film. Referring to FIG. 5, the second polymer film may be second polymer film 570, and the dielectric film may be dielectric film 560. Second polymer film 570 functions as a tie layer and enhances ionic conductivity. In one implementation, the second polymer film is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the second polymer film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the second polymer film is formed on the exposed surfaces of the ceramic film, including the top surface and sidewalls of the second polymer film. The second polymer film can be deposited directly on the protective film by physical vapor deposition (PVD), such as evaporation or sputtering, atomic layer deposition (ALD), a slot-die process, dip coating, a thin film transfer process, gravure printing, or a three-dimensional lithium printing process.

[0093]

[0104] FIG. 11 shows a process flow diagram outlining one implementation of a method 1100 for forming an anode electrode structure according to implementations described herein. The anode electrode structure may be the anode electrode structure 600 shown in FIG. 6. In step 1110, a substrate is provided. In one implementation, the substrate is a continuous sheet of material 1250, as shown in FIG. 12. In one implementation, the substrate is an anode current collector 160. Examples of metals from which the substrate may be constructed include aluminum (Al), copper (Cu), zinc (Zn), nickel (Ni), cobalt (Co), manganese (Mn), chromium (Cr), stainless steel, clad materials, alloys thereof, and combinations thereof. In one implementation, the substrate is a copper material. In one implementation, the substrate is perforated. Furthermore, the substrate may be of any form factor (e.g., metal foil, sheet, or plate), shape, and micro / macro structure.

[0094]

[0105] In some implementations, the substrate is exposed to a pretreatment process including at least one of a plasma treatment or a corona discharge treatment to remove organic materials from the exposed surface of the current collector, the pretreatment process being performed prior to film deposition on the substrate.

[0095]

[0106] In step 1120, a lithium metal film is formed on a substrate. In one implementation, the lithium metal film is an anode film 170, and the substrate is an anode current collector 160. In one implementation, the lithium metal film is formed on a copper current collector. In some implementations, if an anode film is already present on the substrate, the lithium metal film is formed on the anode film. If an anode film 170 is not present, the lithium metal film can be formed directly on the substrate. The lithium metal film can be formed in the first processing chamber 1210 and / or the second processing chamber 1220. Any suitable lithium metal film deposition process can be used to deposit the lithium metal thin film. The lithium metal thin film can be deposited by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. Chambers for depositing thin films of lithium metal can include PVD systems such as electron beam evaporators, thermal evaporators, or sputtering systems, thin film transfer systems (including large area pattern printing systems such as gravure printing systems), or slot die deposition systems.

[0096]

[0107] In step 1130, a metal film is formed on the lithium metal film. Referring to FIG. 6 , the metal film may be metal film 650, and the lithium metal film may be anode film 170. In one implementation, the metal film is an ultra-thin metal film having a thickness of 100 nanometers or less (e.g., about 5 nanometers to 100 nanometers, about 10 nanometers to about 20 nanometers, or about 50 nanometers to about 100 nanometers). In one implementation, the metal film is a copper film. Any suitable metal film deposition process for depositing a thin film of metal can be used to deposit the thin film of metal. The deposition of the metal film can be by a PVD process such as evaporation, a slot-die process, a transfer process, or a three-dimensional lithium printing process. The chamber for depositing the metal film can include a PVD system such as an electron beam evaporator, a thermal evaporator, or a sputtering system, a thin film transfer system (including a large-area pattern printing system such as a gravure printing system), or a slot-die deposition system.

[0097]

[0108] In Project 1140, the dielectric film is formed on the metal film. Referring to FIG. 6, the dielectric film may be dielectric film 660, and the metal film may be metal film 650. The dielectric film functions as a lithium ion conduction promoter and blocks dendritic crystals. In one implementation, the dielectric film is a porous film. The dielectric film can be similar to the ceramic coating 185 described in relation to FIG. 1. In one implementation, the dielectric film is LiPON, garnet-type Li7La3Zr2O 12 crystalline phase or amorphous phase of, LISICON (e.g., Li 2+2x Zn 1-x GeO4, where 0 < x < 1), NASICON (e.g., Na 1+x Zr2Si x P 3-x O 12 , where 0 < x < 3), lithium borohydride (LiBH4), doped inverse perovskite composition, lithium containing sulfide (e.g., Li2S, Li2S-P2S5, Li 10 GeP2S 12 and Li3PS4), and lithium argyrodite (e.g., LiPS5X where X is Cl, Br or I) selected from the group consisting of. In one implementation, the dielectric film has a thickness of 20 nanometers or less (e.g., about 1 nanometer to about 20 nanometers, about 1 nanometer to about 10 nanometers, or about 5 nanometers to about 10 nanometers). In some implementations, the dielectric film is formed on the exposed surface of the first polymer film including the upper surface and sidewalls of the first polymer film. The dielectric film can be directly deposited on the protective film by physical vapor deposition (PVD) such as chemical vapor deposition (CVD), evaporation or sputtering, atomic layer deposition (ALD), slot die process, dip coating, thin film transfer process, gravure coating or three-dimensional lithium printing process.

[0098]

[0109] In step 1150, a polymer film is formed on the dielectric film. Referring to FIG. 6, the polymer film may be polymer film 670, and the dielectric film may be dielectric film 660. The polymer film 670 functions as a bonding layer and enhances ionic conductivity. In one implementation, the polymer film is selected from the group including polyvinylidene fluoride (PVDF), polyethylene oxide (PEO), ethylene oxide (EO), polyacrylonitrile (PAN), succinonitrile (C2H4(CN)2), 2,3-dichloro-5,6-dicyano-1,4-benzoquinone, polyphenylene sulfide, polyether ether ketone (PEEK), carboxymethyl cellulose (CMC), styrene butadiene rubber (SBR), ionic liquid, and combinations thereof. In one implementation, the polymer film has a thickness of 20 nanometers or less (e.g., from about 1 nanometer to about 20 nanometers, from about 1 nanometer to about 10 nanometers, or from about 5 nanometers to about 10 nanometers). In some implementations, a polymer film is formed on the exposed surfaces of the metal film, including the top surface and sidewalls of the polymer film. The polymer film may be deposited directly on the protective film by physical vapor deposition (PVD), such as evaporation or sputtering, atomic layer deposition (ALD), a slot-die process, dip coating, a thin film transfer process, gravure printing, or a three-dimensional lithium printing process.

[0099]

[0110] FIG. 12 shows a schematic diagram of an integrated processing tool 1200 for forming an anode electrode structure according to implementations described herein. The integrated processing tool 1200 may be a SMARTWEB® tool manufactured by Applied Materials, Inc., and may be adapted for manufacturing lithium anode devices according to implementations described herein. The integrated processing tool 1200 is configured as a roll-to-roll system including an unloading module 1202, a processing module 1204, and a take-up module 1206. In a particular implementation, the processing module 1204 includes multiple processing modules or chambers 1210, 1220, 1230, and 1240 arranged in a row, each configured to perform one processing operation on a continuous sheet of material 1250. In one implementation, as depicted in FIG. 12, the processing chambers 1210-1240 are arranged radially around a processing drum 1255. Other non-radial arrangements are also contemplated. In one implementation, the processing chambers 1210-1240 are stand-alone modular processing chambers, with each modular processing chamber being structurally isolated from the other modular processing chambers. Thus, the stand-alone modular processing chambers can be individually positioned, rearranged, replaced, or maintained without affecting each other. While four processing chambers 1210-1240 are shown, it should be understood that any number of processing chambers can be included in the integrated processing tool 1200.

[0100]

[0111] The processing chambers 1210-1240 may include any suitable structure, configuration, arrangement, and / or components that enable the integrated processing tool 1200 to deposit lithium anode devices according to embodiments of the present disclosure. For example, without limitation, the processing chambers may include a suitable deposition system including a coating source, a power supply, individual pressure controls, a deposition control system, and temperature control. According to typical implementations, the chambers include individual gas supplies. The chambers are typically separated from one another to provide good gas isolation. The integrated processing tool 1200 according to implementations described herein is not limited by the number of deposition chambers. For example, without limitation, the integrated processing tool 1200 may include three, six, or twelve processing chambers.

[0101]

[0112] In some implementations, any of the processing chambers 1210-1240 of the integrated processing tool 1200 may be configured to perform deposition by sputtering, such as magnetron sputtering. As used herein, "magnetron sputtering" refers to sputtering performed using a magnet assembly, i.e., a unit capable of generating a magnetic field. Typically, such a magnet assembly includes a permanent magnet. This permanent magnet is typically disposed within a rotatable target or coupled to a planar target such that free electrons are trapped within the generated magnetic field that is generated below the rotatable target surface. Such a magnet assembly may also be disposed and coupled to a planar cathode.

[0102]

[0113] Magnetron sputtering can be achieved with a double magnetron cathode, such as, but not limited to, a TwinMag™ cathode assembly. In some implementations, the cathodes in the processing chamber may be interchangeable. Thus, a modular design of the apparatus is provided, which facilitates optimizing the apparatus for specific manufacturing requirements. In some implementations, the number of cathodes in the chamber for sputter deposition is selected to optimize the optimal productivity of the integrated processing tool 1200.

[0103]

[0114] In some implementations, one or more of the processing chambers 1210-1240 may be configured to perform sputtering without a magnetron assembly. In particular, one or more of the chambers may be configured to perform deposition by other methods, such as chemical vapor deposition, atomic laser deposition, or pulsed laser deposition.

[0104]

[0115] In certain implementations, the processing chambers 1210-1240 are configured to process both sides of the continuous sheet of material 1250. While the integrated processing tool 1200 is configured to process a horizontally oriented continuous sheet of material 1250, the integrated processing tool 1200 may be configured to process substrates positioned at various orientations, such as a vertically oriented continuous sheet of material 1250. In certain implementations, the continuous sheet of material 1250 is a flexible, conductive substrate. In certain implementations, the continuous sheet of material 1250 includes a conductive substrate having one or more layers formed thereon. In certain implementations, the conductive substrate is a copper substrate having one or more silicon-graphite layers formed thereon.

[0105]

[0116] In certain implementations, the integrated processing tool 1200 includes a transport mechanism 1252. The transport mechanism 1252 may include any transport mechanism capable of moving a continuous sheet of material 1250 through the processing regions of the processing chambers 1210-1240. The transport mechanism 1252 may include a common transport architecture. The common transport architecture may include a reel-to-reel system having a common take-up reel 1254 disposed in the take-up module 1206, a processing drum 1255 disposed in the processing module 1204, and a supply reel 1256 disposed in the unwind module 1202. The take-up reel 1254, processing drum 1255, and supply reel 1256 may be individually heated. The take-up reel 1254, processing drum 1255, and supply reel 1256 may be individually heated using an internal heat source disposed within each reel or an external heat source. The common transport architecture may further include a take-up reel 1254 and one or more auxiliary transfer reels 1253a, 1253b disposed between the processing drum 1255 and the supply reel 1256. While the integrated processing tool 1200 is shown as having a single processing region, it may be advantageous in certain implementations to have separate or distinct processing regions for each individual processing chamber 1210-1240. In implementations with distinct processing regions, modules, or chambers, the common transport architecture may be a reel-to-reel system in which each chamber or processing region has its own take-up reel and supply reel, and one or more optional intermediate transfer reels disposed between the take-up reel and supply reel. The common transport architecture may include a track system that extends through multiple processing regions or multiple separate processing regions. The track system is configured to transport either web substrates or separate substrates.

[0106]

[0117] The integrated processing tool 1200 may include a supply reel 1256 and a take-up reel 1254 for moving a continuous sheet of material 1250 through the different processing chambers 1210-1240. In one implementation, the first processing chamber 1210 and the second processing chamber 1220 are each configured to deposit a portion of a lithium metal film. The third processing chamber 1230 is configured to deposit a copper film. The fourth processing chamber 1240 is configured to deposit a protective coating over the copper film and the lithium metal film to protect the lithium metal film from ambient oxidizing agents. In some implementations, the completed negative electrode is not collected on the take-up reel 1254 as shown, but may be directly integrated with a separator and a positive electrode to form a battery cell.

[0107]

[0118] In one implementation, the processing chambers 1210-1230 are configured to deposit a thin film of lithium metal onto the continuous sheet of material 1250. Any suitable lithium deposition process for depositing a thin film of lithium metal can be used to deposit the thin film of lithium metal. The deposition of the thin film of lithium metal can be by a PVD process such as evaporation, a slot-die process, a transfer process, a lamination process, or a three-dimensional lithium printing process. The chamber for depositing the thin film of lithium metal can include a PVD system such as an electron beam evaporator, a thin film transfer system (including large area pattern printing systems such as gravure printing systems), a lamination system, or a slot-die deposition system.

[0108]

[0119] In one implementation, the fourth processing chamber 1240 is configured to form a protective coating on the lithium metal film. The fourth processing chamber 1240 is configured to form a protective coating on the lithium metal film. The protective coating may be an ionically conductive material as described herein. The protective coating may be formed by dip coating, slot die coating, gravure coating, or printing. In one implementation, the fourth processing chamber 1240 is an evaporation chamber or PVD chamber configured to deposit a ceramic or dielectric layer on the continuous sheet of material 1250. In one implementation, the evaporation chamber has a processing region shown with an evaporation source that may be disposed in a crucible. This may be, for example, a thermal evaporator or a (low-temperature) electron beam evaporator in a vacuum environment.

[0109]

[0120] In summary, some of the advantages of the present disclosure include the efficient integration of lithium metal deposition into currently available processing systems. Currently, lithium metal deposition is performed in a dry chamber or an argon gas atmosphere. Due to the volatility of lithium metal, subsequent processing operations are performed in an argon gas atmosphere. The ability to perform subsequent processing operations in an argon gas atmosphere would involve retrofitting current manufacturing tools. The inventors have discovered that by coating the lithium metal with a protective film prior to subsequent processing, subsequent processing can be performed either under vacuum or in air. The protective film eliminates the need for additional processing operations in an inert gas atmosphere, reducing tooling complexity. The protective film also enables transportation, storage, or both of the anode on which the lithium metal film is formed. Furthermore, in implementations where the protective film is an ionically conductive film, the ionically conductive film can be incorporated into the final battery structure, reducing the complexity of the battery formation process. This reduces tooling complexity and, subsequently, the cost of ownership.

[0110]

[0121] When introducing elements of the present disclosure or example aspects or implementations thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements.

[0111]

[0122] The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements.

[0112]

[0123] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. a current collector comprising copper; a lithium metal film formed on the current collector; a metal film formed on the lithium metal film, the metal film coating a top surface and sidewalls of the lithium metal film that extend into contact with the current collector; a protective film formed on the metal film; a ceramic film formed on the protective film; An anode electrode structure comprising: the protective film is a lithium ion conductive film comprising a lithium ion conductive ceramic, a lithium ion conductive glass, a lithium ion conductive polymer, a lithium ion conductive liquid crystal, or a combination thereof; the metal film is selected from a copper film, a bismuth film, a tin film, or a combination thereof; The ceramic film is made of aluminum oxide (Al ２ O ３ ), aluminum oxide, aluminum oxynitride, aluminum oxyhydroxide AlO(OH), and AlN.

2. 10. The anode electrode structure of claim 1, wherein the copper film has a thickness between 5 nanometers and 40 nanometers.

3. The anode electrode structure of claim 2 , wherein the copper film has a thickness between 10 nanometers and 20 nanometers.

4. The lithium ion conductive film is made of aluminum oxide (Al ２ O ３ ), LiPON, Li ７ La ３ Zr ２ O １２ (LLZO), Li ２ S-P ２ S ５ , Li １０ GeP ２ S １２ , Li ３ P.S. ４ , (1-x)LiI-(x)Li ４ SnS ４ , (where 0<x<1).

5. 3. The anode electrode structure of claim 2, wherein the lithium metal film has a thickness between 1 micrometer and 20 micrometers.

6. The anode electrode structure of claim 5 , wherein the current collector has a thickness between 2 micrometers and 8 micrometers.

7. The current collector comprises: a first nickel or chromium-containing film; a copper film formed on the first nickel or chromium-containing film and having a thickness between 50 nanometers and 500 nanometers; a second nickel or chromium-containing film formed on the copper film and having a thickness between 20 nanometers and 50 nanometers; The anode electrode structure of claim 1 , comprising:

8. The current collector comprises: a polyethylene terephthalate (PET) polymer substrate; a copper film formed on the PET polymer substrate; The anode electrode structure of claim 1 , comprising:

9. a current collector comprising copper; a silicon graphite anode formed on the current collector; a film of lithium metal formed on the silicon graphite anode; a protective film formed on the lithium metal film; a ceramic coating formed on the protective film; An anode electrode structure comprising: The protective film is a lithium ion conductive film including a lithium ion conductive ceramic, a lithium ion conductive glass, a lithium ion conductive polymer, a lithium ion conductive liquid crystal, or a combination thereof, and the protective film coats the top surface and sidewalls of the silicon graphite anode extending to contact the current collector, and the ceramic coating is aluminum oxide (Al ２ O ３ ), aluminum oxide, aluminum oxynitride, aluminum oxyhydroxide AlO(OH), and AlN.

10. The lithium ion conductive film is made of aluminum oxide (Al ２ O ３ ), LiPON, Li ７ La ３ Zr ２ O １２ (LLZO), Li ２ S-P ２ S ５ , Li １０ GeP ２ S １２ , Li ３ P.S. ４ , (1-x)LiI-(x)Li ４ SnS ４ 10. The anode electrode structure of claim 9, wherein the anode electrode structure comprises one or more of: , (where 0<x<1).

11. 10. The anode electrode structure of claim 9, wherein the lithium metal film has a thickness between 1 micrometer and 20 micrometers.

12. 12. The anode electrode structure of claim 11, wherein the current collector has a thickness between 2 micrometers and 8 micrometers.

13. The current collector comprises: a first nickel or chromium-containing film; a copper film formed on the first nickel or chromium-containing film and having a thickness between 50 nanometers and 500 nanometers; a second nickel or chromium-containing film formed on the copper film and having a thickness between 20 nanometers and 50 nanometers; The anode electrode structure of claim 9 , comprising:

14. The current collector comprises: a polyethylene terephthalate (PET) polymer substrate; 10. The anode electrode structure of claim 9, further comprising a copper film formed on the PET polymer substrate.

Images