Manufacturing method of capacitor parts

Abstract

To provide a manufacturing method of a capacitor component capable of thinning an internal electrode layer and improving thickness uniformity thereof.SOLUTION: A manufacturing method of a capacitor component includes: forming a dielectric green sheet; and inkjet-printing a conductive pattern on the dielectric green sheet. The step of inkjet-printing the conductive pattern includes: inkjet-printing a base pattern on the dielectric green sheet; and inkjet-printing a reinforcing pattern on at least a portion of each of both widthwise end portions of the base pattern.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a capacitor component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of capacitor component, are important chip components used in industries such as communications, computers, home appliances, and automobiles due to their small size, high capacitance, and ease of mounting. In particular, they are key passive elements used in various electrical, electronic, and information and communication devices such as mobile phones, computers, and digital TVs.

[0003] Generally, MLCCs are manufactured by forming green internal electrode layers on dielectric green sheets, stacking a plurality of dielectric green sheets with the green internal electrode layers, and then sintering the stack. Here, the green internal electrode layers are generally formed by screen printing or gravure printing of a conductive paste, but these methods have limitations on how thin the internal electrode layers can be. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2017-221917 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of one embodiment of the present invention is to provide a method for manufacturing a capacitor component that can reduce the thickness of the internal electrode layers.

[0006] Another object of the present invention is to provide a method for manufacturing a capacitor component that can improve the thickness uniformity of the internal electrode layers. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a method for manufacturing a capacitor component, comprising: forming a dielectric green sheet; and inkjet printing a conductive pattern on the dielectric green sheet, wherein the inkjet printing of the conductive pattern comprises inkjet printing a base pattern on the dielectric green sheet and inkjet printing a reinforcing pattern on at least a portion of each of both widthwise ends of the base pattern. [Effects of the Invention]

[0008] A method for manufacturing a capacitor component according to one aspect of the present invention can reduce the thickness of the internal electrode layers.

[0009] A method for manufacturing a capacitor component according to another aspect of the present invention can improve the thickness uniformity of the internal electrode layers. [Brief explanation of the drawings]

[0010] [Figure 1] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 2] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 3] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 4] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 5] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 6]2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 7] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 8] 2A to 2C are diagrams sequentially illustrating some steps of a method for manufacturing a capacitor component according to an embodiment of the present invention. [Figure 9] 1 is a view schematically illustrating an example of a capacitor component manufactured by a method for manufacturing a capacitor component according to an embodiment of the present invention; [Figure 10] 10 is a cross-sectional view taken along line II' of FIG. 9. DETAILED DESCRIPTION OF THE INVENTION

[0011] The terms used in this application are merely used to describe particular embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to specify the presence of a feature, numeral, step, operation, component, part, or combination thereof described in the specification, but should be understood as not precluding the presence or possibility of addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. Furthermore, throughout the specification, the term "on" means located above or below a target part, and does not necessarily mean located on the upper side relative to the direction of gravity.

[0012] Furthermore, the term "bonding" does not only refer to direct physical contact between components in the contact relationship between them, but also encompasses cases where other components are interposed between the components and the components are in contact with each other.

[0013] The size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation, and the present invention is not necessarily limited to those shown.

[0014] In the drawings, the T direction can be defined as the first direction or thickness direction, the L direction can be defined as the second direction or length direction, and the W direction can be defined as the third direction or width direction.

[0015] Hereinafter, a method for manufacturing a capacitor component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components will be given the same drawing numbers, and duplicate descriptions thereof will be omitted.

[0016] Figures 1 to 8 are drawings sequentially showing some steps of a method for manufacturing a capacitor component according to one embodiment of the present invention, Figure 9 is a drawing schematically showing an example of a capacitor component manufactured by a method for manufacturing a capacitor component according to one embodiment of the present invention, and Figure 10 is a drawing showing a cross section taken along line II' in Figure 9. Meanwhile, each of Figures 1 to 5 shows a plan view at the top and a cross section at the bottom.

[0017] 9 and 10, a capacitor component 1000 according to this embodiment includes a body 100 and external electrodes 210 and 220. The body 100 includes a dielectric layer 110 and internal electrode layers 121 and 122.

[0018] The main body 100 forms the exterior of the capacitor component 1000 according to the present embodiment. There is no particular limitation on the specific shape of the main body 100, but as shown in the figure, the main body 100 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the main body 100 during the sintering process, the main body 100 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0019] 1 and 2, the main body 100 includes a first surface 101 and a second surface 102 facing each other in a thickness direction T, a third surface 103 and a fourth surface 104 facing each other in a length direction L, and a fifth surface 105 and a sixth surface 106 facing each other in a width direction Y. The third to sixth surfaces 103, 104, 105, and 106 of the main body 100 correspond to wall surfaces of the main body 100 connecting the first surface 101 and the second surface 102 of the main body 100. Hereinafter, both end surfaces (one end surface and the other end surface) of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body, and both side surfaces (one side surface and the other side surface) of the main body 100 may refer to the fifth surface 105 and the sixth surface 106 of the main body. Furthermore, the one surface and the other surface of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body 100, respectively. One surface 101 of the main body 100 can be used as a mounting surface when mounting the capacitor component 1000 according to this embodiment on a mounting board such as a printed circuit board.

[0020] The main body 100 includes a dielectric layer 110 and first and second internal electrode layers 121 and 122 that are alternately arranged with the dielectric layer 110 sandwiched therebetween. Each of the dielectric layer 110, the first internal electrode layer 121, and the second internal electrode layer 122 is formed of a plurality of layers. Hereinafter, the first and second internal electrode layers 121 and 122 will be referred to as internal electrode layers 121 and 122 unless a distinction between them is necessary. Therefore, the description of the portions commonly referred to as internal electrode layers 121 and 122 can be applied commonly to the first and second internal electrode layers 121 and 122.

[0021] The multiple dielectric layers 110 forming the body 100 are in a sintered state, and the boundaries between adjacent dielectric layers 110 can be integrated to the extent that they are difficult to see without using a scanning electron microscope (SEM).

[0022] The raw material for forming the dielectric layer 110 is not particularly limited as long as it can obtain sufficient capacitance, and may be, for example, barium titanate (BaTiO) powder. The material for forming the dielectric layer 110 may be a powder such as barium titanate (BaTiO) to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0023] A cover layer 130 may be disposed on the upper and lower portions of the body 100, i.e., on both ends in the thickness direction (Z direction). The cover layer 130 may play a role in maintaining the reliability of the capacitor component against external impact. The cover layer 130 may be formed using a material for forming the dielectric layer 110 or a material different from the material for forming the dielectric layer 110. For example, in the latter case, the material for forming the dielectric layer 110 and the material for forming the cover layer 110 may differ from each other in at least one of the composition, size, content, and degree of dispersion of ceramic particles therein, or at least one of the composition, size, content, and degree of dispersion of minor components therein.

[0024] The internal electrode layers 121, 122 are alternately arranged with the dielectric layer 110 and may include first and second internal electrode layers 121, 122. The first and second internal electrode layers 121, 122 are alternately arranged to face each other with the dielectric layer 110 sandwiched therebetween and may be exposed to the third and fourth surfaces 103, 104 of the body 100, respectively.

[0025] The internal electrode layers 121, 122 have a generally plate-like shape and are alternately exposed on the third surface 103 and the fourth surface 104, which are both end surfaces in the longitudinal direction X of the body 100, to be connected to the first and second external electrodes 210, 220. That is, the first internal electrode layer 121 is exposed on the third surface 103 of the body 100 and connected to the first external electrode 210, but is not exposed on the fourth surface 104 of the body 100 and is not connected to the second external electrode 220. The second internal electrode layer 122 is exposed on the fourth surface 104 of the body 100 and connected to the second external electrode 220, but is not exposed on the third surface 103 of the body 100 and is not connected to the first external electrode 210. Therefore, the first internal electrode layer 121 is spaced a certain distance from the fourth surface 104 of the body 100, and the second internal electrode layer 122 is spaced a certain distance from the third surface 103 of the body 100. At this time, the internal electrode layers 121 and 122 may be electrically isolated from each other by the dielectric layer 110 disposed therebetween.

[0026] The internal electrode layers 121 and 122 may include one or more conductors selected from the group consisting of palladium (Pd), silver (Ag), nickel (Ni), and copper (Cu). For example, the internal electrode layers 121 and 122 may be formed by inkjet printing conductive droplets onto a dielectric green sheet to form a conductive pattern on the dielectric green sheet, stacking a plurality of dielectric green sheets with the conductive patterns formed thereon, and then sintering the stack. Here, the conductive droplets for forming the internal electrode layers may include conductive powder containing nickel (Ni), a binder, a solvent, and the like.

[0027] The average thickness T1 of each of the internal electrode layers 121, 122 may be 200 nm or more and 250 nm or less. If the thickness T1 of the internal electrode layers 121, 122 is less than 200 nm, the connectivity of the internal electrode layers 121, 122 may be reduced, resulting in a reduced capacitance. If the thickness T1 of the internal electrode layers 121, 122 is more than 250 nm, the thickness of the dielectric layer 110 is formed to be thin relative to components of the same size, making it difficult to achieve electrical insulation between the internal electrode layers 121, 122.

[0028] The average thickness T1 of the internal electrode layers 121, 122 may be measured using an optical image or an SEM image obtained by scanning a length-thickness cross-section (LT cross-section) obtained by cutting the capacitor component at the center in the width direction W. As an example, the average thickness T1 of the internal electrode layers 121, 122 may refer to the arithmetic average of a dimension of one of the internal electrode layers 121, 122 shown in the image, measured along the length direction L, and measured multiple times along the length direction L. Such multiple measurements along the length direction L may be performed at equal intervals along the length direction L, but are not limited to this. Alternatively, the average thickness T1 of the internal electrode layers 121, 122 may refer to the average thickness of each of the internal electrode layers 121, 122 calculated using the above-described method for each of the internal electrode layers 121, 122 shown in the image, and divided by the total number of the internal electrode layers 121, 122.

[0029] Voids and ceramic particles may be disposed within the internal electrode layers 121 and 122. The ceramic particles may be due to ceramic powder, such as barium titanate, added to the conductive droplets for forming the internal electrode layers. The ceramic particles may be a barium titanate-based material, similar to the dielectric of the dielectric layer 110, but are not limited thereto. The voids may be formed by diffusion and recrystallization of conductive powder, such as nickel (Ni), contained in the conductive droplets during a sintering process, or by removal of organic substances, such as solvents, contained in the conductive droplets during a heat treatment process, such as a drying process and / or a sintering process.

[0030] The external electrodes 210, 220 are disposed on the main body 100 and connected to the internal electrode layers 121, 122. As shown in Figures 9 and 10, the external electrodes 210, 220 may include first and second external electrodes 210, 220 disposed on the third and fourth surfaces 103, 104 of the main body 100, respectively, and connected to the first and second internal electrode layers 121, 122, respectively.

[0031] The first and second external electrodes 210 and 220 may be disposed on the third and fourth surfaces 103 and 104 of the main body 100, respectively, and may include first and second connecting portions connected to the first and second internal electrode layers 121 and 122, and first and second extending portions extending from the first and second connecting portions to the first surface 101 of the main body 100. The first and second extending portions are disposed spaced apart from each other on the first surface 101 of the main body 100. Meanwhile, the first and second extending portions may extend not only to the first surface 101 of the main body 100 but also to the second, fifth, and sixth surfaces 102, 105, and 106 of the main body 100, respectively, although the scope of the present invention is not limited thereto. That is, as shown in FIG. 9, each of the external electrodes 210 and 220 applied to this embodiment may be a normal type formed on five sides of the main body 100, but is not limited thereto, and may be an L type formed on two sides of the main body 100, a C type formed on three sides of the main body 100, etc.

[0032] The external electrodes 210, 220 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc. Furthermore, the external electrodes 210, 220 may have a multi-layer structure. For example, each of the external electrodes 210, 220 may include a first layer and a second layer. Here, the first layer may be formed by sintering a sinterable conductive paste including a conductive powder, such as copper (Cu), and glass, or by hardening a hardening conductive paste including a conductive powder, such as copper (Cu), and a base resin, or by vapor deposition. The second layer may be a nickel (Ni) plating layer and a tin (Sn) plating layer sequentially formed on the first layer by plating.

[0033] Meanwhile, in this embodiment, the capacitor component 100 has a structure having two external electrodes 210 and 220, but the number and shape of the external electrodes 210 and 220 may be changed depending on the shape of the internal electrode layers 121 and 122 and other purposes.

[0034] An example of a method for manufacturing the capacitor component shown in FIG. 9 will be described below with reference to FIGS.

[0035] First, as shown in FIG. 1, a dielectric green sheet is formed.

[0036] The dielectric green sheet 10 can be formed from a dielectric paste, which will become the dielectric layer 110 through subsequent processes. The dielectric paste can be made by adding various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. to ceramic powder such as barium titanate (BaTiO3), which is a dielectric, according to the purpose of the present invention.

[0037] The dielectric green sheet 10 may be divided into an inner region 11 where a conductive pattern 20 (described later) is to be formed, and an outer region 12 that surrounds the inner region and where a dummy pattern D (described later) is to be formed.

[0038] Meanwhile, although not shown, the dielectric green sheet 10 may be formed on a support plate such as a PET film, and the support plate may support the dielectric green sheet 10 during the process.

[0039] Next, referring to FIGS. 2 and 3, a dummy pattern is formed in the outer region of the dielectric green sheet.

[0040] The dummy pattern D includes a plain pattern D1 formed at the outermost portion of the outer region 11 of the dielectric green sheet 10 and an index pattern D2 formed in a region of the outer region 11 of the dielectric green sheet 10 that is close to the inner region 12. Each of the plain pattern D1 and the index pattern D2 may be formed by inkjet printing. An inkjet head used for inkjet printing may include a plurality of outlets for discharging droplets. In this process, the inkjet head may discharge droplets for forming the plain pattern and droplets for forming the index pattern, respectively, to form the dummy pattern D. The droplets for forming the plain pattern and the droplets for forming the index pattern may be made of different materials from the dielectric green sheet described above and the conductive droplets for forming the internal electrodes described below. For example, the droplets for forming the plain pattern and the droplets for forming the index pattern may not contain ceramic dielectric particles, unlike the dielectric paste used to form the dielectric green sheet, and may not contain conductive particles, unlike the conductive droplets for forming the conductive pattern. In this embodiment, the droplets for forming the dummy pattern D are formed from a material different from the dielectric paste for forming the dielectric green sheet and the conductive droplets for forming the conductive pattern, so that the dummy pattern D, which is a part that will not remain in the final part, can be formed more simply and at reduced cost.

[0041] For example, the plain pattern D1 is disposed on the outer side of the index pattern D2 and the conductive pattern 20, thereby protecting the index pattern D2 and the conductive pattern 20 from the outside. Furthermore, in a process of laminating a plurality of dielectric green sheets, which will be described later, steps that would otherwise occur due to the absence of a pattern on the outer edge of the dielectric green sheets can be prevented. The index pattern D2 can serve as a reference in a process of cutting the laminate 30, which will be described later, but the scope of the present invention is not limited thereto. While each of FIGS. 2 to 6 shows the plain pattern D1 and the index pattern D2 formed in a square ring shape, this is merely an example. As another example, the index pattern D2 can be disposed on each of a plurality of dicing lines used in a process of cutting the laminate 30, which will be described later, and formed spaced apart from each other.

[0042] Next, referring to FIGS. 4 to 6, a conductive pattern is inkjet printed on the dielectric green sheet.

[0043] The conductive pattern (20 in FIG. 5) is configured to become the internal electrode layers (121, 122 in FIG. 10) of the capacitor component (1000 in FIG. 9) through subsequent processes. In this embodiment, the conductive pattern 20 is formed by forming a base pattern 21 by inkjet printing as shown in FIG. 4, and then inkjet printing a reinforcing pattern 22 on at least a portion of each of both widthwise end portions 21B of the base pattern 21 as shown in FIG.

[0044] First, as shown in FIG. 4, a base pattern of the conductive pattern 20 is formed in the internal region 11 of the dielectric green sheet by inkjet printing. In this process, conductive droplets DL1 used in inkjet printing to form the base pattern may be ejected from multiple ejection ports of an inkjet head H. Due to the characteristics of inkjet printing and the conductive droplets DL1, the base pattern 21 may be printed such that the average thickness at the widthwise center portion 21A is thicker than the average thickness at both widthwise end portions 21B. Here, the base pattern 21 may be printed such that the thickness of each of the widthwise end portions 21B becomes thinner toward the outside in the width direction. That is, the base pattern 21 may be formed to have a dome-shaped cross section due to the relatively low viscosity and surface tension of the conductive droplets DL1.

[0045] The widthwise central portion 21A and widthwise outer portion 21B of the base pattern 21 can be defined, for example, as a region having a thickness of 90% or more of the maximum thickness of the base pattern 21, and the widthwise outer portion 21B can be defined as a region having a thickness of 90% or less of the maximum thickness of the base pattern 21. Alternatively, the widthwise central portion 21A and widthwise outer portion 21B of the base pattern 21 can be defined, for example, by dividing the dimension of the base pattern 21 along the width direction into thirds.

[0046] The base patterns 21 can be formed as a plurality of base patterns spaced apart from one another in the inner region 11 of the dielectric green sheet 10 using a single inkjet head H by controlling whether or not droplets DL1 are discharged from a plurality of discharge ports of the inkjet head H. Thus, even if the inkjet head H moves only once in the length direction L, the plurality of base patterns 21 spaced apart from one another can be formed.

[0047] 5, the reinforcement pattern 22 is formed by inkjet printing the reinforcement pattern forming droplets DL2 on at least a portion of each of the widthwise end portions 21B of the base pattern 21. For the above reasons, the widthwise end portions 21B of the base pattern 21 are formed to be thinner than the central portion 21A. However, the reinforcement pattern 22 is formed on at least a portion of the widthwise end portions 21B of the base pattern 21, thereby reducing the thickness difference along the widthwise direction of the base pattern 21. As a result, the reinforcement pattern 22 can reduce the thickness difference along the widthwise direction of the conductive pattern 20. The conductive droplets DL2 used in inkjet printing to form the reinforcement pattern in this process can be ejected through a plurality of ejection ports of the inkjet head H, which correspond to the positions of the widthwise end portions 21B of each base pattern 21. As a result, the reinforcement pattern 22 can be formed only on at least a portion of the widthwise end portions 21B of the base pattern 21, and not on the widthwise central portion 21A of the base pattern 21. The reinforcement pattern 22 is formed at both ends 21B of the base pattern 21 after the inkjet head H moves once in the length direction L to form the base pattern 21. Therefore, the reinforcement pattern 22 is formed later than the base pattern 21 by the time it takes for the inkjet head H to make one round trip in the length direction L. As a result, the conductive droplets DL2 for forming the reinforcement pattern are formed on the surface of the base pattern 21 that has been dried for the above-mentioned time. Therefore, the reinforcement pattern 22 is formed at both ends 21B of the base pattern 21, but the thickness of the regions near both ends in the width direction of the base pattern 21 can be formed thicker than the thickness of the region near the center 21A in the width direction of the base pattern 21. Here, for the above-mentioned reason, i.e., because the base pattern 21 is dried for the above-mentioned time after the formation of the base pattern 21 and before the formation of the reinforcement pattern 22, the reinforcement pattern 22 can be formed in a form that does not contact the dielectric green sheet 10, but the scope of the present embodiment is not limited thereto. Meanwhile, the base pattern 21 and the reinforcement pattern 22 can be formed using the same conductive droplets, which can reduce manufacturing costs and simplify processes and equipment.

[0048] Thereafter, as shown in FIG. 6, the steps of FIGS. 4 and 5 are repeated at least once more to form a plurality of conductive patterns 20 in the internal region 11 of the dielectric green sheet 10.

[0049] Next, referring to FIGS. 7 and 8, a plurality of dielectric green sheets having conductive patterns printed thereon are stacked to form a laminate, and the laminate is cut to form at least one green chip.

[0050] 1 to 6 are repeated a plurality of times to form a plurality of dielectric green sheets 10 on which conductive patterns 20 are printed. Next, a plurality of dielectric green sheets 10 each having a printed conductive pattern 20 are stacked to form a laminate 30. In this case, the above-mentioned support plate may be formed on each dielectric green sheet 10, but the support plate attached to each dielectric green sheet 10 may be removed before the process of forming the laminate 30.

[0051] Thereafter, the laminate 30 is cut to form a plurality of green chips 40 corresponding to the main bodies of the capacitor components.

[0052] Next, although not shown, each green chip 40 is fired to form a body (100 in Figure 10) in which dielectric layers (110 in Figure 10) and internal electrode layers (121, 122 in Figure 10) are alternately arranged, and external electrodes (210, 220 in Figures 9 and 10) are formed on both end faces (103, 104 in Figures 9 and 10) facing each other in the longitudinal direction L of the body (100 in Figure 10).

[0053] In this embodiment, the conductive pattern 20 for forming the internal electrode layers 121, 122 is formed by inkjet printing, thereby thinning the internal electrode layers 121, 122 of the final component after firing. That is, in the case of conventional screen printing and gravure printing, it is difficult to thin the conductive pattern by printing a paste, and it is further difficult to thin the internal electrode layers, but this embodiment is advantageous in thinning the conductive pattern 20 by forming the conductive pattern 20 by ejecting conductive droplets (inkjet printing). As a result, it is advantageous in thinning the internal electrode layers 121, 122 of the final component.

[0054] Furthermore, in the case of this embodiment, when forming the conductive pattern 20, the base pattern 21 is formed by inkjet printing, and reinforcing patterns are further formed by inkjet printing at both end portions 21B of the base pattern 21, thereby reducing the thickness difference along the width direction of the base pattern 21 formed by inkjet printing. This improves the thickness uniformity along the width direction of the conductive pattern 20, and as a result, improves the thickness uniformity of the internal electrode layers 121, 122 of the final component.

[0055] Although one embodiment of the present invention has been described above, a person having ordinary knowledge in the art can modify and change the present invention in various ways by adding, changing, or deleting components within the scope of the concept of the present invention as set forth in the claims, and this can also be said to fall within the scope of the present invention. [Explanation of symbols]

[0056] 10 Dielectric green sheet 20 Conductive pattern 21 Bass Pattern 22 Reinforcement Pattern 30 laminate 40 Green Chip 100 units 110 dielectric layer 121, 122 Internal electrode layer 130 Cover Layer 210, 220 external electrode D dummy pattern DL1, DL2 droplets H Inkjet head 1000 Capacitor Components

Claims

1. forming a dielectric green sheet; inkjet printing a conductive pattern on the dielectric green sheet; The step of inkjet printing the conductive pattern includes: inkjet printing a base pattern on the dielectric green sheet; and A method for manufacturing a capacitor component, comprising inkjet printing a reinforcing pattern on at least a portion of each of both widthwise ends of the base pattern.

2. In the step of inkjet printing a base pattern on the dielectric green sheet, The base pattern is The method for manufacturing a capacitor component according to claim 1 , wherein the average thickness at the center in the width direction is printed to be thicker than the average thickness at both ends in the width direction.

3. In the step of inkjet printing a base pattern on the dielectric green sheet, The base pattern is The method for manufacturing a capacitor component according to claim 2 , wherein the thickness of each of the opposite widthwise ends is printed so as to become thinner toward the outside in the widthwise direction.

4. In the step of inkjet printing the reinforcement pattern, The reinforcement pattern is The method for manufacturing a capacitor component according to claim 2 or 3, wherein the thickness of the base pattern in regions near both ends in the width direction is printed to be thicker than the thickness of the base pattern in a region near the center in the width direction.

5. In the step of inkjet printing the base pattern and the reinforcing pattern, The method for manufacturing a capacitor component according to claim 4 , wherein the base pattern and the reinforcing pattern are printed using conductive droplets.

6. In the step of inkjet printing the reinforcement pattern, The method for manufacturing a capacitor component according to claim 2 , wherein the reinforcing pattern is printed so as not to come into contact with the dielectric green sheet.

7. The method may further include forming a dummy pattern on an outer periphery of the dielectric green sheet between the steps of forming the dielectric green sheet and inkjet printing the conductive pattern, In the step of inkjet printing the conductive pattern, The method for manufacturing a capacitor component according to claim 1 , wherein the conductive pattern is printed inside the dielectric green sheet surrounded by a dummy pattern of the dielectric green sheet.

8. In the step of inkjet printing the conductive pattern, The method of claim 7 , wherein the conductive patterns are printed in the dielectric green sheet in a plurality of patterns spaced apart from each other in the width direction.

9. After the inkjet printing step, forming a laminate by stacking a plurality of the dielectric green sheets on which the conductive patterns are printed; cutting the laminate to form at least one green chip; The method of claim 5 , further comprising: firing the green chip to form a body in which dielectric layers and internal electrode layers are alternately arranged.

10. The method for manufacturing a capacitor component according to claim 9, wherein the internal electrode layers have an average thickness of 200 nm or more and 250 nm or less.

Images