Substrate inspection device, substrate inspection method, and substrate inspection program

Abstract

To acquire an image from which a defect of a substrate can be detected with higher precision.SOLUTION: A substrate inspection apparatus, which inspects a substrate using an image obtained by imaging a surface of the substrate, includes: a holding portion that holds the substrate; a first light source portion that emits visible light to the substrate held by the holding portion; a second light source portion that emits ultraviolet light to the substrate held by the holding portion; a first imaging sensor that captures a visible light image of the substrate by receiving reflected light from the substrate as a result of radiating the visible light; a second imaging sensor that captures an ultraviolet light image of the substrate by receiving reflected light or scattered light from the substrate as a result of radiating the ultraviolet light; and a control portion that acquires the visible light image from the first imaging sensor and the ultraviolet light image from the second imaging sensor. The visible light image from the first imaging sensor and the ultraviolet light image from the second imaging sensor are images obtained by imaging a common region of the substrate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate inspection device, a substrate inspection method, and a substrate inspection program. [Background technology]

[0002] Patent Document 1 describes an apparatus for measuring the thickness of a film formed on a substrate, in which data showing the correlation between the measured film thickness value and the pixel value in an image of the substrate is prepared in advance, and the film thickness of the substrate is estimated from the pixel value of the image obtained by capturing an image of the substrate surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-215193 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for acquiring images that allow for more accurate detection of defects on a substrate. [Means for solving the problem]

[0005] A substrate inspection device according to one aspect of the present disclosure is a substrate inspection device that inspects a substrate using an image captured of the substrate having a target film formed on its surface, the substrate inspection device including: a holder that holds the substrate; a first light source that emits visible light to the substrate held in the holder; a second light source that emits ultraviolet light to the substrate held in the holder; a first image sensor that receives reflected light from the substrate when irradiated with the visible light and captures a visible light image of the substrate; a second image sensor that receives reflected light or scattered light from the substrate when irradiated with the ultraviolet light and captures an ultraviolet image of the substrate; and a control unit that acquires the visible light image and the ultraviolet light image, wherein the visible light image and the ultraviolet light image are images captured of a common region of the substrate. [Effects of the Invention]

[0006] According to the present disclosure, a technique for acquiring an image that allows for detection of defects on a substrate with higher accuracy is provided. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing an example of a schematic configuration of a substrate processing system. [Figure 2] FIG. 2 is a schematic diagram showing an example of a coating and developing apparatus. [Figure 3] FIG. 3 is a schematic diagram showing an example of the configuration of the imaging unit as viewed from above. [Figure 4] FIG. 4 is a schematic diagram illustrating an example of the configuration of the imaging unit as viewed from the side. [Figure 5] FIG. 5 is a schematic diagram illustrating an example of the configuration of the imaging unit as viewed from the side. [Figure 6] FIG. 6 is a block diagram illustrating an example of a functional configuration of the control device. [Figure 7] FIG. 7 is a block diagram illustrating an example of a hardware configuration of the control device. [Figure 8] FIG. 8 is a flowchart showing an example of the inspection process. DETAILED DESCRIPTION OF THE INVENTION

[0008] Various exemplary embodiments are described below.

[0009] In one exemplary embodiment, there is provided a substrate inspection apparatus for inspecting a substrate having a target film formed on its surface using an image of the substrate, the substrate inspection apparatus including: a holder for holding the substrate; a first light source for emitting visible light to the substrate held in the holder; a second light source for emitting ultraviolet light to the substrate held in the holder; a first imaging sensor for receiving light reflected from the substrate by irradiating the visible light and capturing a visible light image of the substrate; a second imaging sensor for receiving light reflected or scattered from the substrate by irradiating the ultraviolet light and capturing an ultraviolet light image of the substrate; and a controller for acquiring the visible light image and the ultraviolet light image, wherein the visible light image and the ultraviolet light image are images of a common region of the substrate.

[0010] In the above-described substrate inspection device, a first image sensor captures a visible light image of the substrate, and a second image sensor captures an ultraviolet light image of the substrate. The visible light image and the ultraviolet light image are images of a common area of ​​the substrate. Therefore, depending on the characteristics of the target film formed on the substrate, inspection can be performed using either of these images, making it possible to obtain images that can detect substrate defects with higher accuracy.

[0011] In the substrate inspection device, the visible light image and the ultraviolet light image may both be images of a common region on the entire surface of the substrate, and with this configuration, inspection of the entire surface of the substrate can be performed based on these images.

[0012] In the substrate inspection device, the visible light image and the ultraviolet light image may both be images of a common area relating to the peripheral edge of the substrate, and inspection of the peripheral edge of the substrate can be performed based on these images.

[0013] In the above-described substrate inspection device, the control unit may be configured to control the first and second image sensors so that, when the thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value, only the first image sensor captures the visible light image. When the target film becomes thicker, the visible light image can be used to inspect the target film. Therefore, with the above configuration, it is possible to obtain an image capable of detecting substrate defects with high accuracy for a target film having a thickness equal to or greater than a first film thickness value.

[0014] In the above-described substrate inspection device, the control unit may be configured to control the first and second image sensors so that, when the thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value, only the ultraviolet image is captured by the second image sensor. When the film thickness of the target film becomes small, inspection of the target film can be performed using the ultraviolet image. Therefore, with the above configuration, it is possible to obtain an image that can detect substrate defects with high accuracy for a target film that is equal to or less than the second film thickness value.

[0015] In the above-described substrate inspection device, the control unit may be configured to control the first and second image sensors to capture both the visible light image by the first image sensor and the ultraviolet light image by the second image sensor when the film thickness of the target film formed on the surface of the substrate is between a third film thickness value and a fourth film thickness value. Depending on the film thickness of the target film, it may not be clear which of the visible light image and the ultraviolet light image is more suitable for inspection. In such cases, the above configuration makes it possible to use an image suitable for detecting defects in the substrate for inspection.

[0016] In the above substrate inspection device, the control unit may be configured to select either the first imaging sensor to capture the visible light image or the second imaging sensor to capture the ultraviolet light image based on the target film formation procedure on the substrate, and control the first imaging sensor and the second imaging sensor based on the selection result.If the target film formation procedure specifies an image to be used for inspection, or if the target film formation procedure includes information specifying which image is suitable for inspection, the control unit may select the image to be used based on this information and control each imaging sensor.

[0017] In the above-described substrate inspection device, the second imaging sensor may be capable of acquiring a bright-field image and a dark-field image as the ultraviolet light image, and the control unit may acquire the bright-field image and the dark-field image as the ultraviolet light image from the second imaging sensor. In ultraviolet light images, the bright-field image and the dark-field image may provide different pieces of information about the substrate. Therefore, by configuring the device to acquire both images, it is possible to obtain images suitable for more accurate substrate inspection.

[0018] In another exemplary embodiment, a substrate inspection method is provided for inspecting a substrate having a target film formed on a surface thereof using an image captured of the substrate, the method including: holding the substrate with a holder; emitting visible light from a first light source onto the substrate held by the holder; emitting ultraviolet light from a second light source onto the substrate held by the holder; receiving light reflected from the substrate by the visible light irradiation with a first image sensor to capture a visible light image of the surface of the substrate; receiving light reflected or scattered from the substrate by the ultraviolet light irradiation with a second image sensor to capture an ultraviolet light image of the surface of the substrate; and acquiring the visible light image and the ultraviolet light image by a controller, wherein the visible light image and the ultraviolet light image are images captured of a common region of the substrate.

[0019] In the above substrate inspection method, a first image sensor acquires a visible light image of the substrate, and a second image sensor acquires an ultraviolet light image of the substrate. The visible light image and the ultraviolet light image are images of a common area of ​​the substrate. Therefore, depending on the characteristics of the target film formed on the substrate, inspection can be performed using either of these images, making it possible to acquire images that can detect substrate defects with higher accuracy.

[0020] In the substrate inspection method, the visible light image and the ultraviolet light image may both be images of a common region on the entire surface of the substrate, allowing inspection of the entire surface of the substrate based on these images.

[0021] In the substrate inspection method, the visible light image and the ultraviolet light image may both be images of a common region relating to the peripheral edge of the substrate, and inspection of the peripheral edge of the substrate can be performed based on these images.

[0022] The substrate inspection method may further include controlling the first and second image sensors by the control unit to capture only the visible light image using the first image sensor when the film thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value. When the film thickness of the target film increases, the target film can be inspected using the visible light image. Therefore, with the above configuration, it is possible to obtain an image capable of detecting substrate defects with high accuracy for a target film having a film thickness equal to or greater than a first film thickness value.

[0023] The substrate inspection method may further include controlling the first and second image sensors by the control unit to capture only the ultraviolet image using the second image sensor when the film thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value. When the film thickness of the target film becomes small, inspection of the target film can be performed using the ultraviolet image. Therefore, with the above configuration, it is possible to obtain an image that can detect substrate defects with high accuracy for a target film that is equal to or less than the second film thickness value.

[0024] The substrate inspection method may further include controlling the first and second image sensors by the control unit to capture both the visible light image by the first image sensor and the ultraviolet light image by the second image sensor when the film thickness of the target film formed on the surface of the substrate is between a third film thickness value and a fourth film thickness value. Depending on the film thickness of the target film, it may not be clear which of the visible light image and the ultraviolet light image is more suitable for inspection. In such cases, the above configuration makes it possible to use an image suitable for detecting defects in the substrate for inspection.

[0025] In the substrate inspection method, the control unit may select, based on the target film formation procedure on the substrate, whether to capture the visible light image with the first imaging sensor or the ultraviolet light image with the second imaging sensor, and control the first imaging sensor and the second imaging sensor based on the selection result. If the target film formation procedure specifies an image to be used for inspection, or if the target film formation procedure includes information specifying which image is suitable for inspection, the image to be used may be selected based on this information, and each imaging sensor may be controlled.

[0026] In the above-described substrate inspection method, the second imaging sensor may be capable of acquiring a bright-field image and a dark-field image as the ultraviolet light image, and in acquiring the visible light image and the ultraviolet light image, the control unit may acquire the bright-field image and the dark-field image as the ultraviolet light image from the second imaging sensor. In ultraviolet light images, the bright-field image and the dark-field image may provide different pieces of information about the substrate. Therefore, by configuring the system to acquire both images, it is possible to obtain images suitable for more accurate substrate inspection.

[0027] In the substrate inspection method described above, the control unit may select whether the bright-field image or the dark-field image is to be captured by the second imaging sensor based on the target film formation procedure on the substrate, and control the second imaging sensor based on the result of the selection. If the target film formation procedure specifies the image to be used for inspection, or if the target film formation procedure includes information specifying which image is suitable for inspection, the control unit may select the bright-field image or the dark-field image to be used based on this information and control each imaging sensor.

[0028] In another exemplary embodiment, there is provided a substrate inspection program that causes a computer to inspect a substrate having a target film formed on its surface using an image captured by a substrate inspection device, the program causing the computer to hold the substrate using a holder, emitting visible light from a first light source to the substrate held by the holder, emitting ultraviolet light from a second light source to the substrate held by the holder, receiving light reflected from the substrate by the visible light irradiation with a first image sensor to capture a visible light image of the surface of the substrate, receiving light reflected or scattered from the substrate by the ultraviolet light irradiation with the first image sensor to capture an ultraviolet light image of the surface of the substrate, and acquiring the visible light image and the ultraviolet light image by a control unit, wherein the visible light image and the ultraviolet light image are images captured of a common region of the substrate.

[0029] According to the above-described substrate inspection program, the same effects as those of the substrate inspection method can be achieved.

[0030] Various exemplary embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0031] [Substrate processing system] The substrate processing system 1 is a system that forms a photosensitive coating on a workpiece W, exposes the photosensitive coating, and develops the photosensitive coating. The workpiece W to be processed is, for example, a substrate, or a substrate on which a film, circuit, or the like has been formed by performing a predetermined process. One example of the substrate is a silicon wafer. The workpiece W (substrate) may be circular. The workpiece W may also be a glass substrate, a mask substrate, or an FPD (Flat Panel Display), etc. The photosensitive coating is, for example, a resist film.

[0032] As shown in FIGS. 1 and 2, the substrate processing system 1 includes a coating / developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 performs an exposure process on a resist film (photosensitive coating) applied to a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates an exposure target portion of the resist film with energy rays using a method such as immersion exposure. The coating / developing apparatus 2 performs a process of coating a resist film on the surface of the workpiece W (substrate) before the exposure process by the exposure apparatus 3, and then performs a development process on the resist film after the exposure process. A resist film having a predetermined pattern is formed by performing a series of processes.

[0033] [Circuit board inspection equipment] The configuration of a coating and developing apparatus 2 will be described below as an example of a substrate processing apparatus. As shown in FIGS. 1 and 2, the coating and developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100 (control unit). A display unit 200 is connected to the control device 100. The coating and developing apparatus 2 described in this embodiment as a substrate inspection apparatus has a function of inspecting the state of a target film formed on a substrate.

[0034] The carrier block 4 introduces the workpiece W into the coating and developing apparatus 2 and removes the workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support a plurality of carriers C (storage sections) for the workpiece W and has a built-in transport device A1 including a transfer arm. The carrier C stores a plurality of circular workpieces W, for example. The transport device A1 removes the workpiece W from the carrier C and passes it to the processing block 5, and receives the workpiece W from the processing block 5 and returns it to the carrier C. The processing block 5 has a plurality of processing modules 11, 12, 13, and 14.

[0035] The processing module 11 incorporates multiple coating units U1, multiple heat treatment units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 11 forms an underlayer film on the surface of the workpiece W using the coating units U1 and heat treatment units U2. The coating unit U1 of the processing module 11 applies a treatment liquid for forming the underlayer film to the workpiece W, for example, while rotating the workpiece W at a predetermined rotation speed. The heat treatment unit U2 of the processing module 11 performs various heat treatments associated with the formation of the underlayer film. The heat treatment unit U2 incorporates, for example, a hot plate and a cooling plate, and heats the workpiece W to a predetermined heating temperature using the hot plate and then cools the heated workpiece W using the cooling plate to perform the heat treatment. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0036] The processing module 12 incorporates multiple coating units U1, multiple heat treatment units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 12 forms an intermediate film on the base film using the coating units U1 and heat treatment units U2. The coating unit U1 of the processing module 12 applies a treatment liquid for forming the intermediate film onto the base film to form a coating film on the surface of the workpiece W. The heat treatment unit U2 of the processing module 12 performs various heat treatments associated with the formation of the intermediate film. The heat treatment unit U2 incorporates, for example, a hot plate and a cooling plate, and heats the workpiece W to a predetermined heating temperature using the hot plate and then cools the heated workpiece W using the cooling plate to perform the heat treatment. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0037] The processing module 13 incorporates multiple coating units U1, multiple heat-treating units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 13 forms a resist film on the intermediate film using the coating units U1 and heat-treating units U2. The coating unit U1 of the processing module 13 applies a resist film-forming treatment liquid to the intermediate film while rotating the workpiece W at a predetermined rotation speed, for example. The heat-treating unit U2 of the processing module 13 performs various heat treatments associated with the formation of the resist film. The heat-treating unit U2 of the processing module 13 forms a resist film by performing a heat treatment (PAB: Post Applied Bake) at a predetermined heating temperature on the workpiece W on which the coating film has been formed. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0038] The processing module 14 incorporates multiple coating units U1, multiple thermal processing units U2, and a transport device A3 that transports the workpiece W to these units. The processing module 14 uses the coating units U1 and thermal processing units U2 to perform a development process on the exposed resist film R. The coating unit U1 of the processing module 14, for example, rotates the workpiece W at a predetermined rotation speed while applying a developer to the exposed surface of the workpiece W, and then rinses the developer away with a rinse liquid, thereby performing a development process on the resist film R. The thermal processing unit U2 of the processing module 14 performs various thermal processes associated with the development process. Specific examples of thermal processes include a post-exposure bake (PEB) before the development process and a post-exposure bake (PB) after the development process.

[0039] A shelf unit U10 is provided on the carrier block 4 side within the processing block 5. The shelf unit U10 is divided into multiple cells arranged in the vertical direction. A transport device A7 including a lifting arm is provided near the shelf unit U10. The transport device A7 raises and lowers the workpiece W between the cells of the shelf unit U10.

[0040] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

[0041] The interface block 6 transfers the workpiece W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transport device A8 including a transfer arm, and is connected to the exposure apparatus 3. The transport device A8 transfers the workpiece W placed on the shelf unit U11 to the exposure apparatus 3, receives the workpiece W from the exposure apparatus 3, and returns it to the shelf unit U11.

[0042] [Imaging unit] The imaging unit U3 included in the processing modules 11 to 13 will be described with reference to Figures 3 to 5. Figure 4 is a view seen from the arrows IV-IV in Figure 3, and Figure 5 is a view seen from the arrows VV in Figure 3. For reference, Figure 5 also shows the structure of a rotational holding subunit 30, which will be described later, in the same way as Figure 4.

[0043] The imaging unit U3 has the function of capturing images of the surfaces of films (e.g., underlayer films, intermediate films, resist films, etc.) formed by the coating unit U1 and the heat treatment unit U2, and obtaining image data. As shown in Figures 3 to 5, the unit U3 has a housing 20, a rotational holding subunit 30, a surface visible light imaging subunit 40, a peripheral visible light imaging subunit 50, a first surface ultraviolet light imaging subunit 60, a second surface ultraviolet light imaging subunit 70, and a peripheral ultraviolet light imaging subunit 80. These subunits are arranged inside the housing 20. One end wall of the housing 20 is formed with a loading / unloading opening 21 for loading the workpiece W into the housing 20 and unloading it from the housing 20.

[0044] The rotational holding subunit 30 includes a holding table 31, actuators 32 and 33, and a guide rail 34. The holding table 31 is, for example, a suction chuck that holds the workpiece W substantially horizontally by suction or the like. The rotational holding subunit 30 functions as a holding section that holds the workpiece W.

[0045] The actuator 32 is, for example, an electric motor, and rotates the holder 31. That is, the actuator 32 rotates the workpiece W held on the holder 31. The actuator 32 may include an encoder for detecting the rotational position of the holder 31. In this case, the image capturing position of each surface of the workpiece W by each imaging subunit can be associated with the rotational position. If the workpiece W has a cutout, the posture of the workpiece W can be identified based on the cutout identified by each imaging subunit and the rotational position detected by the encoder. The rotational position of the holder 31 is the rotational angle of the holder 31.

[0046] The actuator 33 is, for example, a linear actuator, and moves the holder 31 along the guide rail 34. That is, the actuator 33 transports the workpiece W held on the holder 31 between one end and the other end of the guide rail 34. Therefore, the workpiece W held on the holder 31 can move between a first position closer to the carry-in / out port 21 and a second position closer to the peripheral visible light imaging subunit 50. The guide rail 34 extends linearly (for example, straight) within the housing 20.

[0047] The surface visible light imaging subunit 40 includes a camera 41 (first imaging sensor) and an illumination module 42. The camera 41 includes a lens and one imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 41 faces the illumination module 42.

[0048] The lighting module 42 includes a half mirror 43 and a light source 44 (first light source unit). The half mirror 43 is arranged in the housing 20 at an angle of approximately 45° with respect to the horizontal. The half mirror 43 is located above the middle part of the guide rail 34 so as to intersect with the extension direction of the guide rail 34 when viewed from above. The half mirror 43 has a rectangular shape. The length (longitudinal length) of the half mirror 43 is greater than the diameter of the workpiece W.

[0049] The light source 44 is located above the half mirror 43 and emits visible light. The wavelength range of the light emitted from the light source 44 is not particularly limited as long as it is within the range of general visible light (for example, wavelengths of 380 nm to 780 nm), but as an example, white light that evenly includes light in the visible light wavelength range can be used.

[0050] The light emitted from the light source 44 passes entirely through the half mirror 43 and is irradiated downward (toward the guide rail 34). The light that passes through the half mirror 43 is reflected by an object located below the half mirror 43, then reflected again by the half mirror 43, passes through the lens of the camera 41, and is incident on the image sensor of the camera 41. That is, the camera 41 can capture an image of an object present in the area illuminated by the light source 44 via the half mirror 43. For example, when the holder 31 that holds the workpiece W is moved along the guide rail 34 by the actuator 33, the camera 41 can capture an image of the surface of the workpiece W passing through the area illuminated by the light source 44. The captured image data captured by the camera 41 is transmitted to the control device 100.

[0051] The peripheral visible light imaging subunit 50 includes a camera 51 (first imaging sensor), an illumination module 52, and a mirror member 53. The camera 51 includes a lens and one imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 51 faces the illumination module 52. The subject of imaging by the peripheral visible light imaging subunit 50 is the peripheral edge and end face of the surface of the workpiece W. In the following embodiments, these may be included in the term "peripheral portion of the workpiece W (substrate)."

[0052] The lighting module 52 is disposed above the workpiece W held on the holder 31. The lighting module 52 includes a light source 54 (first light source unit) and a half mirror 55. The light source 54 emits visible light. The wavelength range of the light emitted from the light source 54 is not particularly limited as long as it is within the visible light range, but as an example, white light that evenly includes light in the visible light wavelength range can be used. As shown in FIG. 4, the half mirror 55 is disposed in a state inclined at approximately 45° with respect to the horizontal direction. As shown in FIGS. 3 and 4, the mirror member 83 is disposed below the lighting module 52. The mirror member 53 includes a main body formed of an aluminum block and a reflective surface.

[0053] When the workpiece W held on the holder 31 is in the second position, the reflective surface of the mirror member 53 faces the peripheral edge of the end face and back face of the workpiece W held on the holder 31. The reflective surface of the mirror member 53 is inclined with respect to the rotation axis of the holder 31. The reflective surface of the mirror member 53 is mirror-finished. For example, a mirror sheet may be attached to the reflective surface, or the reflective surface may be aluminum-plated or aluminum material may be vapor-deposited. This reflective surface is a curved surface that is recessed toward the side away from the end face of the workpiece W held on the holder 31.

[0054] In the lighting module 52, light emitted from the light source 54 passes entirely through the half mirror 55 and is irradiated downward. The light that passes through the half mirror 55 is reflected by the reflective surface of the mirror member 53 located below the half mirror 55. When the workpiece W held on the holder 31 is in the second position, the light that passes through the half mirror 55 and is reflected by the reflective surface of the mirror member 53 is irradiated mainly onto the end face and peripheral edge of the surface of the workpiece W.

[0055] The light reflected from the periphery of the surface of the workpiece W does not head toward the reflective surface of the mirror member 53 but directly enters the half mirror 55. This reflected light then enters the imaging element of the camera 51. On the other hand, the light reflected from the end face of the workpiece W heads toward the reflective surface of the mirror member 53. This reflected light is sequentially reflected by the reflective surface of the mirror member 53 and the half mirror 55, and then enters the imaging element of the camera 51. In this way, the light reflected from the periphery of the workpiece W and the light reflected from the end face of the workpiece W enter the imaging element of the camera 51 via different optical paths. As a result, both the light from the periphery of the surface of the workpiece W and the light from the end face of the workpiece W are input to the imaging element of the camera 51. In other words, when the workpiece W held on the holder 31 is in the second position, the camera 81 is configured to capture images of both the periphery of the surface of the workpiece W and the end face of the workpiece W to generate captured images of the periphery and end face of the surface. The captured image data captured by the camera 51 is transmitted to the control device 100.

[0056] The surface ultraviolet light imaging first sub-unit 60 includes a camera 61 (second imaging sensor) and an illumination module 62. The camera 61 includes a lens and one imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 61 faces the illumination module 62. The illumination module 62 includes a half mirror 63 and a light source 64 (second light source unit).

[0057] The first surface ultraviolet light imaging sub-unit 60 is almost the same as the surface visible light imaging sub-unit 40 except for the type of light source 64 included in the illumination module 62, so a detailed description will be omitted.

[0058] The light source 64 is located above the half mirror 63 and emits ultraviolet light. Regarding the ultraviolet light emitted from the light source 64, in this embodiment, a case where light in a wavelength range close to visible light, among so-called near-ultraviolet light with a wavelength of 300 nm to 400 nm, is used is described as an example. The wavelength range of the light emitted from the light source 64 is not particularly limited as long as it includes the ultraviolet light range. However, the light emitted from the light source 64 may also include components other than the ultraviolet light described above. As an example, the ultraviolet light from the light source 64 may be light with a single wavelength in the wavelength range of 350 nm to 400 nm, for example, light with a wavelength near 400 nm. As another example, the light source 64 may include light with a wavelength range of 300 to 450 nm. Ultraviolet light in the above wavelength range causes little damage to the film to be inspected by the imaging unit U3. Furthermore, the film formed on the workpiece W has a higher absorption efficiency for ultraviolet light in the above wavelength range than for visible light. In other words, the reflected or scattered light from such a film that easily absorbs ultraviolet light can contain information that better reflects the shape and characteristics of the film.

[0059] The operation of the first surface ultraviolet light imaging subunit 60 during imaging is also substantially the same as that of the surface visible light imaging subunit 40. Light emitted from the light source 64 passes entirely through the half mirror 63 and is irradiated downward (toward the guide rail 34). The light that passes through the half mirror 63 is reflected by an object located below the half mirror 63, then reflected again by the half mirror 63, passes through the lens of the camera 61, and is incident on the imaging element of the camera 61. In other words, the camera 61 can image an object present in the area illuminated by the light source 64 via the half mirror 63. For example, when the holder 31 holding the workpiece W is moved along the guide rail 34 by the actuator 33, the camera 61 can image the surface of the workpiece W passing through the area illuminated by the light source 64. The image data captured by the camera 61 is transmitted to the control device 100.

[0060] In this way, the first surface ultraviolet light imaging sub-unit 60 has the function of acquiring a bright field image when the surface of the workpiece W is irradiated with ultraviolet light.

[0061] On the other hand, the second surface ultraviolet light imaging sub-unit 70 has a function of acquiring a dark field image when the surface of the workpiece W is irradiated with ultraviolet light.

[0062] The surface ultraviolet light imaging second sub-unit 70 includes a camera 71 (second imaging sensor) and a light source 72 (second light source unit). The camera 71 includes a lens and one imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The lens of the camera 71 is provided on the side facing the surface of the workpiece W.

[0063] The light source 72 emits ultraviolet light. The characteristics of the light emitted from the light source 72 are similar to those of the light source 64, and are not particularly limited as long as it includes light in the ultraviolet wavelength range. The light emitted from the light source 72 may be light of a single wavelength in the wavelength range of 300 nm to 400 nm, for example, light with a wavelength of around 400 nm.

[0064] The direction of emission of the ultraviolet light from the light source 72 is not perpendicular to the surface of the workpiece W but is tilted relative to the surface. As an example, as shown in Fig. 4, the light source 72 emits ultraviolet light L1 tilted in a direction from a first position closer to the loading / unloading port 21 to a second position closer to the peripheral visible light imaging subunit 50.

[0065] As shown in FIG. 4, ultraviolet light L1 emitted from the light source 72 of the second surface ultraviolet light imaging subunit 70 is directed downward at an angle relative to the surface of the workpiece W. The ultraviolet light L1 is reflected by an object below. At this time, scattered light L2 from the object below passes through the lens of the camera 71 and enters the imaging element of the camera 71. That is, the camera 71 receives scattered light L2 from objects present in the irradiation area of ​​the ultraviolet light L1 from the light source 72 and captures a dark-field image of the ultraviolet light L1. For example, when the holder 31 holding the workpiece W moves along the guide rail 34 by the actuator 33, the camera 71 can capture a dark-field image of the surface of the workpiece W passing through the irradiation area of ​​the light source 72. The captured image data captured by the camera 71 is transmitted to the control device 100.

[0066] The above-described first surface ultraviolet light imaging subunit 60 and second surface ultraviolet light imaging subunit 70 both capture images of the surface of the workpiece W, similar to the surface visible light imaging subunit 40. In other words, these subunits acquire images of the same region (two-dimensional region).

[0067] The peripheral ultraviolet light imaging subunit 80 includes a camera 81 (second imaging sensor), an illumination module 82, and a mirror member 83. The camera 81 includes a lens and one imaging element (e.g., a CCD image sensor, a CMOS image sensor, etc.). The camera 81 faces the illumination module 82. The subject of imaging by the peripheral ultraviolet light imaging subunit 80 is the periphery and end face of the surface of the workpiece W (periphery of the workpiece W), just like the peripheral visible light imaging subunit 50.

[0068] The lighting module 82 is disposed above the workpiece W held on the holder 31. The lighting module 82 includes a first light source 84 (first light source unit), a half mirror 85, and a second light source 86 (second light source unit). Of these, the second light source 86 is provided at a position separated from the other components.

[0069] The first light source 84 emits ultraviolet light. The characteristics of the light emitted from the first light source 84 are similar to those of the light source 64, and are not particularly limited as long as it includes light in the ultraviolet wavelength range. The light emitted from the first light source 84 may be light of a single wavelength in the wavelength range of 300 nm to 400 nm, for example, light with a wavelength of around 400 nm. As shown in FIG. 5, the half mirror 85 is disposed in a state inclined at approximately 45° with respect to the horizontal direction. As shown in FIGS. 3 and 5, the mirror member 83 is disposed below the illumination module 82. The mirror member 83 includes a main body formed of an aluminum block and a reflective surface.

[0070] When the workpiece W held on the holder 31 is in the second position, the reflective surface of the mirror member 83 faces the peripheral edge of the end face and back face of the workpiece W held on the holder 31. The reflective surface of the mirror member 83 is inclined with respect to the rotation axis of the holder 31. The reflective surface of the mirror member 83 is mirror-finished. For example, a mirror sheet may be attached to the reflective surface, or the reflective surface may be aluminum-plated or aluminum material may be vapor-deposited. This reflective surface is a curved surface that is recessed toward the side away from the end face of the workpiece W held on the holder 31.

[0071] In the lighting module 82, the light emitted from the first light source 84 passes entirely through the half mirror 85 and is irradiated downward. The light that passes through the half mirror 85 is reflected by the reflective surface of the mirror member 83 located below the half mirror 85. When the workpiece W held on the holding table 31 is in the second position, the light that passes through the half mirror 85 and is reflected by the reflective surface of the mirror member 83 is irradiated mainly onto the end face and peripheral edge of the surface of the workpiece W.

[0072] The light reflected from the periphery of the surface of the workpiece W does not head toward the reflective surface of the mirror member 83 but directly enters the half mirror 85. This reflected light then enters the imaging element of the camera 81. On the other hand, the light reflected from the end face of the workpiece W heads toward the reflective surface of the mirror member 83. This reflected light is sequentially reflected by the reflective surface of the mirror member 83 and the half mirror 85, and then enters the imaging element of the camera 81. In this way, the light reflected from the periphery of the workpiece W and the light reflected from the end face of the workpiece W enter the imaging element of the camera 81 via different optical paths. As a result, both the light from the periphery of the surface of the workpiece W and the light from the end face of the workpiece W are input to the imaging element of the camera 81. In other words, when the workpiece W held on the holder 31 is in the second position, the camera 81 is configured to capture images of both the periphery of the surface of the workpiece W and the end face of the workpiece W when irradiated with ultraviolet light from the first light source 84, thereby generating captured images of the periphery and end face of the surface. At this time, the image captured by the camera 81 is a bright field image. The captured image data captured by the camera 81 is transmitted to the control device 100.

[0073] On the other hand, the second light source 86 is a light source used when capturing a dark-field image using ultraviolet light with the camera 81 of the peripheral ultraviolet light imaging subunit 80. The second light source 86 is, for example, provided closer to the first position than the illumination module 82. The second light source 86 emits ultraviolet light. The characteristics of the light emitted from the second light source 86 are similar to those of the light source 64, and are not particularly limited as long as it includes light in the ultraviolet wavelength range. The light emitted from the second light source 86 may be light of a single wavelength in the wavelength range of 300 nm to 400 nm, for example, light with a wavelength around 400 nm. The emission direction of the ultraviolet light from the second light source 86 is not perpendicular to the surface of the workpiece W but is inclined. As an example, as shown in FIG. 5, the light source 72 emits ultraviolet light L3 in an inclined state in a direction from the first position to the second position.

[0074] A portion of the scattered light of the ultraviolet light L3 emitted from the second light source 86 enters the camera 81 via the half mirror 85 and the mirror member 83. Specifically, a portion of the scattered light from the peripheral edge of the surface of the workpiece W does not head toward the reflective surface of the mirror member 83 but directly enters the half mirror 85. This light then enters the imaging element of the camera 81. On the other hand, a portion of the scattered light from the end surface of the workpiece W heads toward the reflective surface of the mirror member 83. This light is sequentially reflected by the reflective surface of the mirror member 83 and the half mirror 85 and enters the imaging element of the camera 81. In this way, the scattered light from the peripheral edge of the workpiece W and the scattered light from the end surface of the workpiece W enter the imaging element of the camera 81 via different optical paths. As a result, both the light from the peripheral edge of the surface of the workpiece W and the light from the end surface of the workpiece W are input to the imaging element of the camera 81. That is, when the workpiece W held on the holder 31 is in the second position, the camera 81 is configured to capture images of both the periphery of the surface of the workpiece W and the end face of the workpiece W when ultraviolet light is irradiated from the first light source 84, and generate captured images of the periphery and end face of the surface. At this time, the image captured by the camera 81 is a dark-field image. The captured image data captured by the camera 81 is transmitted to the control device 100.

[0075] It should be noted that the above-described peripheral ultraviolet light imaging subunit 80 cannot simultaneously capture a bright-field image and a dark-field image. Therefore, when acquiring both a bright-field image and a dark-field image, the step of capturing the bright-field image and the step of capturing the dark-field image are performed separately.

[0076] The above-described peripheral ultraviolet light imaging subunit 80, like the peripheral visible light imaging subunit 50, captures images of the peripheral portion and end surface of the workpiece W. In other words, these subunits acquire images of the same region (two-dimensional region).

[0077] [Control device]

[0078] An example of the control device 100 will be described in detail. The control device 100 controls each element included in the coating and developing apparatus 2. The control device 100 is configured to execute process treatments including forming each of the above-mentioned films on the surface of the workpiece W and performing a development process. The control device 100 is also configured to execute a process of inspecting the surface of the workpiece W and displaying the results. Here, an example of the configuration of the control device 100 as a substrate inspection device that inspects substrates in the coating and developing apparatus 2 will be described.

[0079] As shown in Figure 6, the control device 100 has, as its functional configuration, an imaging instruction acquisition unit 101, an imaging control unit 102, a surface image acquisition unit 103, a peripheral image acquisition unit 104, an image storage unit 105, an inspection instruction acquisition unit 106, an image inspection unit 107, and an output unit 108.

[0080] The imaging instruction acquisition unit 101 has a function of acquiring instructions relating to imaging of the workpiece W by the imaging unit U3. The instructions may be given, for example, by a user of the coating and developing apparatus 2. Furthermore, execution of a program relating to substrate processing of the workpiece W that has been created in advance may essentially be the imaging instruction for the imaging unit U3.

[0081] The imaging control unit 102 has a function of controlling the imaging unit U3 to capture an image of a predetermined position on the processed workpiece W based on an instruction acquired by the imaging instruction acquisition unit 101. The predetermined position is any one of the surface, the periphery of the surface, and the end face of the workpiece W.

[0082] The surface image acquisition unit 103 has a function of acquiring an image of the surface of the workpiece W from a camera mounted on any of the surface visible light imaging subunit 40, the first surface ultraviolet light imaging subunit 60, and the second surface ultraviolet light imaging subunit 70 of the imaging unit U3. Specifically, it acquires image data acquired by any of the cameras 41, 61, and 71.

[0083] The peripheral image acquisition unit 104 has a function of acquiring an image of the peripheral edge and end face of the surface of the workpiece W from the camera of the peripheral visible light imaging subunit 50 of the imaging unit U3 or the peripheral ultraviolet light imaging subunit 80. Specifically, it acquires image data acquired by either the camera 51 or 81.

[0084] The image storage unit 105 has a function of storing the images acquired by the surface image acquisition unit 103 and the peripheral image acquisition unit 104. The image information stored in the image storage unit 105 is used in the inspection of the workpiece W.

[0085] The inspection instruction acquisition unit 106 has a function of acquiring instructions related to the inspection of the workpiece W based on the image of the workpiece W captured by the imaging unit U3. The instructions may be given, for example, by a user of the coating and developing apparatus 2. Furthermore, the instruction related to the inspection may essentially be to execute a program related to substrate processing of the workpiece W that has been created in advance.

[0086] The image inspection unit 107 has a function of controlling the inspection of the workpiece W using an image of the workpiece W based on instructions acquired by the inspection instruction acquisition unit 106. Examples of inspection of the workpiece W using an image include inspection of the presence or absence of defects on the surface or end face of the workpiece W, the state of warping that occurs on the periphery of the workpiece W, and the state of removal of a treatment film from the periphery of the workpiece W (so-called EBR). In addition, the images stored in the image storage unit 105 may be used to perform inspection of the film characteristics, the shape of the workpiece W, etc.

[0087] The output unit 108 has a function of outputting, for example, the inspection results of the image inspection unit 107 to a display device or an external device, etc. Examples of the output destination include a display device such as a monitor, and other devices that use the inspection results based on the images.

[0088] The control device 100 is composed of one or more control computers. For example, the control device 100 has a circuit 120 shown in FIG. 7. The circuit 120 has one or more processors 121, a memory 122, a storage 123, and an input / output port 124. The storage 123 has a computer-readable storage medium, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute the substrate inspection procedure described below. The storage medium may be a removable medium, such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily stores the program loaded from the storage medium of the storage 123 and the results of calculations by the processor 121. The processor 121 executes the program in cooperation with the memory 122 to configure each of the above-mentioned functional modules. The input / output port 124 inputs and outputs electrical signals to and from the components to be controlled in accordance with instructions from the processor 121.

[0089] The hardware configuration of the control device 100 is not necessarily limited to configuring each functional module by a program. For example, each functional module of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such dedicated logic circuits.

[0090] In the following embodiment, a case will be described in which the above configuration is included in the control device 100, but all of the above functions do not necessarily have to be included in the control device 100. For example, a functional unit serving as a database, such as the image storage unit 105, may be provided in an external device.

[0091] Furthermore, the control device 100 and the display unit 200 may be configured to be connected to the carrier block 4, the processing block 5, and the interface block 6 in the coating and developing apparatus 2 via a wired or wireless network. In other words, the control device 100 may be provided in a position separate from the block that actually processes the workpiece W in the coating and developing apparatus 2.

[0092] [Processing Procedure] The process procedure executed in the coating and developing apparatus 2 will be described.

[0093] In the process treatment procedure, the control device 100 first controls the transport device A1 to transport the work W to be processed in the carrier C to the shelf unit U10, and then controls the transport device A7 to place the work W in the cell for the treatment module 11.

[0094] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 11. The control device 100 also controls the coating unit U1 and heat treatment unit U2 to form an underlayer film on the surface of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W on which the underlayer film has been formed to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 12.

[0095] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 12. The control device 100 also controls the coating unit U1 and heat treatment unit U2 to form an intermediate film on the underlying film of the workpiece W. For example, the control device 100 controls the coating unit U1 to form an intermediate film by applying a treatment liquid for forming an intermediate film on the underlying film of the workpiece W. Next, the control device 100 controls the heat treatment unit U2 to perform heat treatment on the intermediate film. After the intermediate film is formed, the control device 100 controls the transport device A3 to transport the workpiece W to the imaging unit U3, and controls the imaging unit U3 to capture an image of the surface of the workpiece W and acquire image information. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 13.

[0096] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to each unit in the processing module 13, and controls the coating unit U1 and the heat-treating unit U2 to form a resist film on the intermediate film of the workpiece W. For example, the control device 100 controls the coating unit U1 to form a resist film by applying a processing liquid for forming a resist film on the intermediate film of the workpiece W. Next, the control device 100 controls the heat-treating unit U2 to perform a heat treatment on the resist film. After the resist film is formed, the control device 100 controls the transport device A3 to transport the workpiece W to the imaging unit U3, and controls the imaging unit U3 to capture an image of the surface of the workpiece W and acquire image information (post-processing image). Thereafter, the control device 100 controls the transport device A3 to transport the workpiece W to the shelf unit U11.

[0097] Next, the control device 100 controls the transport device A8 to send the workpiece W on the shelf unit U11 to the exposure device 3. Thereafter, the control device 100 controls the transport device A8 to receive the workpiece W that has been subjected to the exposure process from the exposure device 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0098] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U11 to each unit in the processing module 14, and controls the coating unit U1 and the heat treatment unit U2 to perform development processing on the resist film R on the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport devices A7 and A1 to return the workpiece W into the carrier C. This completes the process.

[0099] [Board inspection method] A substrate inspection method under the control of the control device 100 of the coating and developing apparatus 2 will be described with reference to FIG.

[0100] First, the control device 100 executes step S01. In step S01, the imaging instruction acquisition unit 101 acquires an imaging instruction, and the inspection instruction acquisition unit 106 acquires an inspection instruction. Here, it is assumed that the control device 100 acquires a series of instructions related to substrate processing including the inspection of the workpiece W. In this case, in the control device 100, it may occur to acquire an imaging instruction and an inspection instruction. Note that in the instructions acquired in step S01, it may also be determined whether to image the surface image of the workpiece W or the images of the peripheral portion and the end face of the workpiece W.

[0101] Next, the control device 100 executes step S02. In step S02, the imaging control unit 102 determines the type of image to be captured according to the thickness of the film (target film) to be inspected.

[0102] As an example, the imaging control unit 102 determines whether to acquire a visible light image or an ultraviolet light image regarding the target film based on the thickness of the target film. This is due to the fact that different types of images can perform substrate inspection more accurately depending on the film thickness of the target film.

[0103] The image captured using visible light is effective for films with a certain film thickness, but it is difficult to grasp the state of films with very thin film thicknesses (for example, 20 nm or less). This is because the target film is often transparent and visible light passes through the surface of the target film. On the other hand, by using ultraviolet light with a shorter wavelength than visible light, it becomes possible to capture the surface features as an image even when the film thickness of the target film is short. Therefore, select the image to be used for substrate inspection according to the film thickness of the target film.

[0104] Here, as an example, the case will be described where two-stage film thicknesses (Anm, Bnm; A < B) are set as the criteria for selecting the image to be used, and the type of image to be captured is specified according to which range the film thickness falls into. For example, A can be set to 15 nm to 30 nm, and B can be set to 30 nm to 70 nm, but the numerical ranges of A and B are not limited to the above.

[0105] For example, when the thickness of the target film is less than Am, the ultraviolet light image may be more likely to capture the characteristics of the target film, as described above. Therefore, the control device 100 executes step S03. In step S03, the surface image acquisition unit 103 and / or the peripheral image acquisition unit 104 acquire an ultraviolet light image of the workpiece W. When acquiring an ultraviolet light image, both a bright-field image and a dark-field image may be acquired. The bright-field image is suitable for detecting abnormalities such as stains and spots (watermarks) on the surface of the workpiece W. On the other hand, the dark-field image is suitable for detecting foreign matter present in the film of the workpiece W. Therefore, by acquiring these two types of images and using them to inspect the substrate, it is expected that accurate surface inspection can be performed even when the target film is particularly thin.

[0106] Next, if the thickness of the target film is greater than Anm and less than B nm, the control device 100 executes step S04. In step S04, the surface image acquisition unit 103 and / or the peripheral image acquisition unit 104 acquire both an ultraviolet light image and a visible light image of the workpiece W. When the film thickness is in the range of Anm to B nm, it may be possible to appropriately evaluate the film using a visible light image. However, depending on the optical characteristics (e.g., optical transparency) of the target film, it is possible that the visible light image may not provide sufficient information. Therefore, both images are acquired. Then, in step S05, the image to be used for evaluation may be determined in the image inspection unit 107. The criteria for determining the image to be used for evaluation in the image inspection unit 107 may include, for example, using a visible light image or an ultraviolet light image (bright-field image) with a large variation in pixel values, but are not limited thereto. Note that once the image to be used for evaluation is determined, the control device 100 may be configured to retain information identifying which image was used so that the same type of image is used for subsequent workpieces W formed with the same type and thickness of target film.

[0107] Furthermore, when the film thickness of the target film is B nm or more, it is considered that the characteristics of the target film can be sufficiently captured even with a visible light image, so the control device 100 executes step S06. In step S06, the surface image acquisition unit 103 and / or the peripheral image acquisition unit 104 acquire a visible light image of the workpiece W. The acquired image is stored in the image storage unit 105.

[0108] After acquiring a visible light image or an ultraviolet light image (bright-field image and dark-field image) according to the film thickness of the target film in the above procedure, the control device 100 executes step S07. In step S07, the image inspection unit 107 evaluates (inspects) the target film of the workpiece W using the visible light image or the ultraviolet light image stored in the image storage unit 105.

[0109] Next, the control device 100 executes step S08, in which the output unit 108 outputs the evaluation results.

[0110] Although FIG. 9 illustrates a sequence of steps S01 to S08, this sequence may be modified as appropriate. For example, the inspection instruction described in step S01 may be acquired at a different time from step S01, and the acquisition of this inspection instruction may trigger execution of step S07. Furthermore, if the instruction acquired in step S01 specifies whether visible light images or ultraviolet light images should be used for evaluation, the images to be acquired may be determined based on the instruction, rather than determining the procedure based on the film thickness of the target film as in step S02. For example, information specifying the formation procedure of the target film on the workpiece W may include information specifying the film thickness of the target film or information specifying the image to be used when inspecting the target film. In such cases, the type of image to be captured for inspection may be identified from visible light images and ultraviolet light images (bright-field images or dark-field images) based on this information.

[0111] [Effect] In the coating and developing apparatus 2 and substrate inspection method corresponding to the above-described substrate inspection apparatus, cameras 41 and 51 functioning as first imaging sensors acquire visible light images of the substrate. Also, cameras 61, 71, and 81 functioning as second imaging sensors acquire ultraviolet light images of the substrate. The visible light image and the ultraviolet light image are images of a common region of the substrate. Therefore, depending on the characteristics of the target film formed on the substrate, inspection can be performed using either of these images, making it possible to acquire images that enable more accurate detection of substrate defects.

[0112] The visible light image and the ultraviolet light image may both be images of a common region across the entire surface of the substrate, allowing inspection of the entire surface of the substrate based on these images.

[0113] The visible light image and the ultraviolet light image may both be images of a common region related to the peripheral edge of the substrate, and by using such a configuration, inspection of the peripheral edge of the substrate can be performed based on these images.

[0114] When the film thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value (e.g., B nm in the above embodiment), the control device 100 may control the first and second image sensors to capture only visible light images. As described above, when the film thickness of the target film increases, the visible light images can be used to inspect the target film. Therefore, with the above configuration, it is possible to acquire images that can detect substrate defects with high accuracy for target films that are equal to or greater than the first film thickness value.

[0115] When the thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value (e.g., Am in the above embodiment), the control device 100 may control the first image sensor and the second image sensor to capture only the ultraviolet image. When the film thickness of the target film is small, the ultraviolet image can be used to inspect the target film. Therefore, with the above configuration, it is possible to acquire an image that can detect defects on the substrate with high accuracy for a target film that is equal to or less than the second film thickness value.

[0116] When the film thickness of the target film formed on the surface of the substrate is between the third and fourth film thickness values ​​(for example, between Anm and B nm in the above embodiment), the control device 100 may control the first and second image sensors to capture both visible light images and ultraviolet light images. Depending on the film thickness of the target film, it may not be clear which of visible light images and ultraviolet light images is more suitable for inspection. In such cases, the above configuration makes it possible to use an image suitable for inspecting defects in the substrate.

[0117] The control device 100 may select whether to capture a visible light image or an ultraviolet light image based on the target film formation procedure on the substrate. Furthermore, the first and second image sensors may be controlled based on the result of the selection. If the target film formation procedure specifies the image to be used for inspection, or if the target film formation procedure includes information specifying which image is suitable for inspection, the image to be used may be selected based on this information, and each image sensor may be controlled.

[0118] Furthermore, like the above-described cameras 61, 71, and 81, the second imaging sensor may be capable of acquiring a bright-field image and a dark-field image as the ultraviolet light image. In this case, the control device 100 may acquire a bright-field image and a dark-field image as the ultraviolet light image. In the ultraviolet light image, the bright-field image and the dark-field image may provide different information about the substrate. Therefore, by configuring the device to acquire both images, it is possible to obtain images suitable for inspecting the substrate with higher accuracy.

[0119] Furthermore, the control device 100 may select whether the second imaging sensor should capture a bright-field image or a dark-field image based on the target film formation procedure on the substrate, and control the second imaging sensor based on the result. It is conceivable that the image to be used for inspection is specified in the target film formation procedure, or that the target film formation procedure includes information specifying which image is suitable for inspection. In such cases, the bright-field image or dark-field image to be used may be selected based on this information, and each imaging sensor may be controlled.

[0120] [Variations] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments.

[0121] For example, in the above embodiment, the wavelength of the ultraviolet light used to capture the ultraviolet image is not limited to the above-mentioned wavelength range of so-called near-ultraviolet light of about 300 nm to 400 nm. That is, the ultraviolet light used to capture the ultraviolet image may be near-ultraviolet light with a wavelength of 200 nm to 300 nm or far-ultraviolet light with a wavelength shorter than 200 nm.

[0122] In the above embodiment, a single imaging unit U3 simultaneously captures both visible light images and ultraviolet light images while moving the workpiece W. However, instead of this configuration, the visible light images and ultraviolet light images may be captured sequentially. The arrangement of the light source and camera within the imaging unit U3 may also be changed as appropriate. The number and arrangement of optical elements for adjusting the path of light in each imaging subunit may also be changed as appropriate depending on the arrangement of the light source and camera. In the above embodiment, the peripheral ultraviolet light imaging subunit 80 captures both bright-field images and dark-field images. Alternatively, a configuration for capturing bright-field images and a configuration for capturing dark-field images may be separately provided, such as the first surface ultraviolet light imaging subunit 60 and the second surface ultraviolet light imaging subunit 70. Conversely, a single subunit may capture both bright-field images and dark-field images as a configuration for capturing ultraviolet light images of the surface.

[0123] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims. [Explanation of symbols]

[0124] 1...substrate processing system, 2...coating and developing apparatus, 3...exposure apparatus, 20...housing, 30...rotating holding subunit, 31...holding stand, 40...surface visible light imaging subunit, 41...camera, 44...light source, 50...periphery visible light imaging subunit, 51...camera, 54...light source, 60...first surface ultraviolet light imaging subunit, 61...camera, 64...light source, 70...second surface ultraviolet light imaging subunit, 71...camera, 72...light source, 80...periphery ultraviolet light imaging subunit, 81...camera, 84...first light source, 86...second light source, 100...control device (control unit), 101...imaging instruction acquisition unit, 102...imaging control unit, 103...surface image acquisition unit, 104...periphery image acquisition unit, 105...image holding unit, 106...inspection instruction acquisition unit, 107...image inspection unit, 108...output unit.

Claims

1. A substrate inspection device that inspects a substrate using an image of the substrate having a target film formed on its surface, a holder for holding the substrate; a first light source unit that emits visible light toward the substrate held by the holder; a second light source unit that emits ultraviolet light toward the substrate held by the holder; a first image sensor that receives reflected light from the substrate when the visible light is irradiated thereon and captures a visible light image of the substrate; a second image sensor that receives reflected light or scattered light from the substrate when the substrate is irradiated with the ultraviolet light and captures an ultraviolet light image of the substrate; a control unit that acquires the visible light image and the ultraviolet light image; and the visible light image and the ultraviolet light image are images of a common region of the substrate, The control unit controlling the first and second image capture sensors so that only the first image capture sensor captures the visible light image when the film thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value; controlling the first image sensor and the second image sensor so that, when a film thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value that is smaller than the first film thickness value, only the ultraviolet light image is captured by the second image sensor; a substrate inspection device that controls the first image sensor and the second image sensor so that, when the film thickness of the target film formed on the surface of the substrate is between the second film thickness value and the first film thickness value, the first image sensor captures the visible light image and the second image sensor captures the ultraviolet light image.

2. The substrate inspection device according to claim 1 , wherein the visible light image and the ultraviolet light image are both images of a common region across the entire surface of the substrate.

3. The substrate inspection device according to claim 1 , wherein the visible light image and the ultraviolet light image are both images of a common area relating to a peripheral edge portion of the substrate.

4. A substrate inspection device as described in any one of claims 1 to 3, wherein the control unit inspects the substrate using either the visible light image or the ultraviolet light image when both the visible light image is captured by the first imaging sensor and the ultraviolet light image is captured by the second imaging sensor.

5. the second image sensor is capable of acquiring a bright-field image and a dark-field image as the ultraviolet light image, 5. The substrate inspection device according to claim 1, wherein the control unit acquires the bright-field image and the dark-field image as the ultraviolet light images from the second imaging sensor.

6. A substrate inspection method for inspecting a substrate having a target film formed on a surface thereof using an image of the substrate, the method comprising: holding the substrate with a holding portion; emitting visible light from a first light source unit to the substrate held by the holder; emitting ultraviolet light from a second light source unit to the substrate held by the holder; receiving reflected light from the substrate by a first image sensor to capture a visible light image of the surface of the substrate; receiving reflected light or scattered light from the substrate by a second image sensor to capture an ultraviolet light image of the surface of the substrate; acquiring the visible light image and the ultraviolet light image by a control unit; Including, the visible light image and the ultraviolet light image are images of a common region of the substrate, controlling the first image sensor and the second image sensor by the control unit so that, when a film thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value, only the visible light image is captured by the first image sensor; controlling, by the control unit, the first image sensor and the second image sensor so that, when a film thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value that is smaller than the first film thickness value, only the second image sensor captures the ultraviolet light image; and controlling, by the control unit, the first image sensor and the second image sensor to capture both the visible light image by the first image sensor and the ultraviolet light image by the second image sensor when a film thickness of a target film formed on the surface of the substrate is between the second film thickness value and the first film thickness value.

7. The substrate inspection method according to claim 6 , wherein the visible light image and the ultraviolet light image are both images of a common region over the entire surface of the substrate.

8. The substrate inspection method according to claim 6 , wherein the visible light image and the ultraviolet light image are both images of a common region relating to a peripheral edge portion of the substrate.

9. A substrate inspection method described in any one of claims 6 to 8, further comprising, when both the visible light image is captured by the first imaging sensor and the ultraviolet light image is captured by the second imaging sensor, inspecting the substrate using either the visible light image or the ultraviolet light image by the control unit.

10. the second image sensor is capable of acquiring a bright-field image and a dark-field image as the ultraviolet light image, A substrate inspection method according to any one of claims 6 to 9, wherein in acquiring the visible light image and the ultraviolet light image, the control unit acquires the bright-field image and the dark-field image as ultraviolet light images from the second imaging sensor.

11. A substrate inspection program that causes a computer to inspect a substrate having a target film formed on its surface using an image of the substrate, in a substrate inspection device, comprising: holding the substrate with a holding portion; emitting visible light from a first light source unit to the substrate held by the holder; emitting ultraviolet light from a second light source unit to the substrate held by the holder; receiving, by a first image sensor, light reflected from the substrate as a result of irradiating the substrate with visible light, and capturing a visible light image of the surface of the substrate; receiving reflected light or scattered light from the substrate by a second image sensor to capture an ultraviolet light image of the surface of the substrate; acquiring the visible light image and the ultraviolet light image by a control unit; causing the computer to execute the visible light image and the ultraviolet light image are images of a common region of the substrate, controlling the first image sensor and the second image sensor so that, when a film thickness of the target film formed on the surface of the substrate is equal to or greater than a first film thickness value, only the visible light image is captured by the first image sensor; controlling the first image sensor and the second image sensor so that, when a film thickness of the target film formed on the surface of the substrate is equal to or less than a second film thickness value that is smaller than the first film thickness value, only the second image sensor captures the ultraviolet light image; and controlling the first and second image sensors so that, when a film thickness of a target film formed on the surface of the substrate is between the second film thickness value and the first film thickness value, the first image sensor captures the visible light image and the second image sensor captures the ultraviolet light image.

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