Capacitor parts

Abstract

To provide a capacitor component with improved moisture resistance reliability and increased capacity per unit volume.SOLUTION: A capacitor component according to an embodiment of the present invention includes a main body including a dielectric layer, a laminated portion in which first and second internal electrodes are laminated in the first direction, and first and second connecting portions respectively arranged on both surfaces of the laminated portion in a second direction which is perpendicular to the first direction, and first and second external electrodes arranged on the first and second connecting portions, respectively, and the first and second connecting portions include a metal layer disposed on the laminated portion and a ceramic layer disposed on the metal layer, and edges of the main body in the cross sections in the first and second directions have round shapes.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a capacitor component. [Background technology]

[0002] Among capacitor components, multi-layer ceramic capacitors (MLCCs) have the advantages of being small in size, ensuring high capacitance, and being easy to mount.

[0003] With the trend toward miniaturization and higher capacitance of multilayer ceramic capacitors (MLCCs), it is becoming increasingly important to increase the effective volume ratio (the ratio of the volume that contributes to capacitance to the total volume) of multilayer ceramic capacitors.

[0004] Conventionally, when forming external electrodes, a paste containing conductive metal is used, and the exposed surface of the main body where the internal electrodes are located is dipped into the paste.

[0005] However, the thickness of the external electrodes formed by the dipping method is not uniform, with the external electrodes being very thin at the edge of the body and very thick in other areas, which makes it difficult to ensure a high effective volume ratio. This also creates problems such as the plating solution penetrating into the body when forming a plating layer on the external electrodes to improve the connectivity and mountability of the multilayer ceramic capacitor, thereby reducing the reliability of the multilayer ceramic capacitor. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a capacitor component having improved moisture resistance reliability and improved capacitance per unit volume. [Means for solving the problem]

[0007] One embodiment of the present invention provides a capacitor component comprising: a body including a laminated section in which a dielectric layer, first and second internal electrodes are laminated in a first direction, and first and second connecting sections respectively arranged on both sides of the laminated section in a second direction perpendicular to the first direction; and first and second external electrodes respectively arranged on the first and second connecting sections, wherein the first and second connecting sections include a metal layer arranged on the laminated section and a ceramic layer arranged on the metal layer, and the edges of the body in cross sections in the first and second directions are rounded.

[0008] Another embodiment of the present invention provides a capacitor component including: a body including a laminated section in which a dielectric layer and first and second internal electrodes are laminated in a first direction; first and second connecting sections respectively arranged on both sides of the laminated section in a second direction perpendicular to the first direction; and first and second margin sections respectively arranged on both sides of the laminated section in a third direction perpendicular to the first and second directions; and first and second external electrodes respectively arranged on the first and second connecting sections, wherein the first and second connecting sections include a metal layer arranged on the laminated section and a ceramic layer arranged on the metal layer. [Effects of the Invention]

[0009] According to one embodiment of the present invention, by disposing a connecting portion in a laminated portion, it is possible to improve the capacitance per unit volume and the moisture resistance reliability.

[0010] Furthermore, the edges of the body can be sufficiently rounded. When the edges of the body are rounded, the thickness of the external electrodes can be uniform and the external electrodes can be thin.

[0011] Furthermore, when margin portions are disposed on both sides of the laminated portion, there is an effect that the capacity per unit volume can be further improved.

[0012] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view schematically illustrating a capacitor component according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view schematically showing the main body of FIG. 1. [Figure 3] FIG. 2 is a perspective view showing the laminated portion of FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 5a] 2 is a cross-sectional view taken along the X and Y directions in FIG. 1, showing a cross section in which a first internal electrode is observed. FIG. [Figure 5b] 2 is a cross-sectional view taken along the X and Y directions in FIG. 1, showing a cross section in which a second internal electrode is observed. FIG. [Figure 6] 1A to 1C are diagrams illustrating a process of forming a connecting portion of a capacitor component by a transfer method according to an embodiment of the present invention. [Figure 7] 1A to 1C are diagrams illustrating a process of forming a connecting portion of a capacitor component by a transfer method according to an embodiment of the present invention. [Figure 8] 1A to 1C are diagrams illustrating a process of forming a connecting portion of a capacitor component by a transfer method according to an embodiment of the present invention. [Figure 9] 1A to 1C are diagrams illustrating a process of forming a connecting portion of a capacitor component by a transfer method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly explain the present invention, parts not relevant to the description are omitted in the drawings, thicknesses are exaggerated to clearly show various layers and regions, and the same reference numerals are used to refer to components that have the same function within the same concept. Furthermore, throughout the specification, the term "comprises" a certain component does not mean that other components are excluded, but that the component may further include other components, unless otherwise specified.

[0016] In the drawings, the X direction can be defined as the second direction, L direction or length direction, the Y direction can be defined as the third direction, W direction or width direction, and the Z direction can be defined as the first direction, T direction or thickness direction.

[0017] Capacitor parts FIG. 1 is a perspective view schematically showing a capacitor component according to one embodiment of the present invention.

[0018] FIG. 2 is a perspective view schematically showing the main body of FIG.

[0019] FIG. 3 is a perspective view showing the laminated portion of FIG.

[0020] FIG. 4 is a cross-sectional view taken along line II' in FIG.

[0021] 5a and 5b are cross-sectional views in the X and Y directions of FIG. 1, where FIG. 5a is a view showing a cross section where the first internal electrode is observed, and FIG. 5b is a view showing a cross section where the second internal electrode is observed.

[0022] A capacitor component according to one embodiment of the present invention will be described in detail below with reference to FIGS.

[0023] The capacitor component 10 of the present invention includes a main body 100 including a laminated portion 110 in which a dielectric layer 111, first and second internal electrodes 121, 122 are laminated in a first direction (Z direction), and first and second connecting portions 141, 142 respectively arranged on both sides of the laminated portion in a second direction (X direction) perpendicular to the first direction, and first and second external electrodes 151, 152 respectively arranged on the first and second connecting portions 141, 142, and the first and second connecting portions 141, 142 include metal layers 141a, 142a arranged on the laminated portion 110 and ceramic layers 141b, 142b arranged on the metal layers.

[0024] At this time, according to an embodiment of the present invention, the edges of the body 100 in the cross sections in the first and second directions may have a rounded shape.

[0025] In addition, according to another embodiment of the present invention, the main body 100 may include first and second margin portions 131 and 132 respectively arranged on both sides of the stacked portion 110 in a third direction perpendicular to the first and second directions.

[0026] The main body 100 includes a stacked portion 110 and first and second connecting portions 141 and 142 .

[0027] Although there is no particular limitation on the specific shape of the body 100, the body 100 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 100 during the firing process, the body 100 may not be a hexahedral shape with perfectly straight lines, but may have a substantially hexahedral shape.

[0028] The main body 100 may have first and second surfaces 1, 2 facing each other in the thickness direction (Z direction), third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the length direction (X direction), and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and connected to the third and fourth surfaces 3, 4, and facing each other in the width direction (Y direction).

[0029] In the laminated section 110, dielectric layers 111 and internal electrodes 121, 122 are alternately laminated.

[0030] The multiple dielectric layers 111 that form the laminate 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to identify without the use of a scanning electron microscope (SEM).

[0031] According to an embodiment of the present invention, the material for forming the dielectric layer 111 is not particularly limited as long as it can provide sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used.

[0032] The material forming the dielectric layer 111 may be a powder such as barium titanate (BaTiO3), to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0033] The laminated portion can be formed by alternately stacking ceramic green sheets having a first internal electrode 121 printed on a dielectric layer 111 and ceramic green sheets having a second internal electrode 122 printed on a dielectric layer 111 in the thickness direction (Z direction).

[0034] The laminated portion 110 may include a capacitance forming portion in which capacitance is formed including the first and second internal electrodes 121 and 122 arranged to face each other across the dielectric layer 111, and protective portions 112 formed on the upper and lower parts of the capacitance forming portion.

[0035] The upper and lower protective parts may be made of the same composition as the dielectric layer 111, and may be formed by laminating at least one dielectric layer not including an internal electrode above the top internal electrode of the main body 100 and below the bottom internal electrode of the main body 100.

[0036] The upper and lower protective portions 112 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0037] The thickness tp of each of the upper and lower protective portions 112 does not need to be particularly limited, but according to one embodiment of the present invention, by arranging the connecting portions 141 and 142 in the laminate portion 110, the edges of the main body 100 can be sufficiently rounded, thereby minimizing the thickness tp of each of the upper and lower protective portions and improving the capacitance per unit volume of the capacitor component 10.

[0038] For example, according to one embodiment of the present invention, even when tp is 20 μm or less, the roundness can be sufficiently formed and the internal electrodes can be protected, thereby improving the capacity per unit volume. Therefore, when tp is 20 μm or less, the effect of the present invention is greater.

[0039] The lower limit of tp is not particularly limited and can be appropriately selected taking into consideration the radius of curvature R1 of the edge of the main body in the cross section in the first and second directions, and can be, for example, 5 μm or more.

[0040] Here, the thickness tp of each of the upper and lower protective portions may refer to the length of the upper and lower protective portions 112 in the first direction (Z direction).

[0041] Meanwhile, the upper and lower protective parts 112 may be divided into a first region adjacent to the stacked part 110 and a second region adjacent to the outer surface of the main body.

[0042] In this case, the first and second regions of the protective part 112 may have different magnesium (Mg) contents.

[0043] This allows an oxide layer to be formed in the gap that contacts the capacitance forming portion, ensuring insulation and mitigating electric field concentration, thereby improving breakdown voltage (BDV) and reducing the incidence of short circuits.

[0044] Furthermore, by adjusting the second region of the protective portion 112 to have a higher magnesium (Mg) content than the first region, the density of the second region can be increased and the moisture resistance reliability can be improved, and by adjusting the first region of the protective portion 112 to have a lower magnesium (Mg) content than the second region, the adhesion strength with the capacitance forming portion can be increased.

[0045] The internal electrodes 121 and 122 are arranged to face each other with the dielectric layer 111 interposed therebetween.

[0046] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 that are alternately arranged to face each other with the dielectric layer 111 interposed therebetween.

[0047] The first internal electrode 121 may be exposed to one surface of the laminated part 110 in the second direction (X direction), and the portion exposed to one surface in the second direction (X direction) may be connected to the metal layer 141a of the first connecting part.

[0048] The second internal electrode 122 may be exposed to the other surface of the laminated part 110 in the second direction (X direction), and the portion exposed to the other surface in the second direction (X direction) may be connected to the metal layer 142a of the second connecting part.

[0049] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0050] The material for forming the first and second internal electrodes 121, 122 is not particularly limited, and may be formed using a conductive paste containing one or more of precious metal materials such as palladium (Pd) and palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu).

[0051] The conductive paste may be printed by screen printing or gravure printing, but the present invention is not limited to this method.

[0052] The first and second connecting portions 141 and 142 are respectively arranged on both sides of the stacked portion 110 in a second direction (X direction) perpendicular to the first direction.

[0053] Conventionally, the external electrodes are formed by dipping the exposed surfaces of the first and second internal electrodes into a conductive paste.

[0054] The thickness of the external electrodes formed by the dipping method is not uniform, and the external electrodes are formed very thinly at the edge of the body, while they are formed very thickly in other parts.

[0055] If the external electrodes are formed too thin on the edge of the body, they act as a path for moisture to penetrate, reducing moisture resistance reliability. Therefore, to ensure that the external electrodes on the edge are thicker than a certain thickness, the external electrodes had to be formed thicker. This resulted in problems such as a decrease in packaging density or plating defects due to glass beading or blisters.

[0056] On the other hand, if the body has sharp edges, chipping, a phenomenon in which the edges are damaged due to collisions between chips during the MLCC manufacturing process, can occur, resulting in poor appearance and reduced moisture resistance reliability.

[0057] In order to solve the above problems, attempts have been made to polish the edges of the body to have a rounded shape, thereby preventing the external electrodes from being formed too thinly on the edges and suppressing chipping defects.

[0058] However, polishing the edges of the body can cause problems such as the exposure of the internal electrodes, and it is difficult to ensure a sufficient roundness at the edges of the body in the structure of conventional capacitor components. Furthermore, if the thickness of the protective layer is increased to prevent the internal electrodes from being exposed, the capacitance per unit volume of the capacitor component decreases.

[0059] According to one embodiment of the present invention, by arranging the first and second connecting parts 141 and 142 on both sides of the laminated part 110 in the second direction (X direction), respectively, the edges of the main body 100 can be sufficiently rounded, so that the capacitance per unit volume does not decrease, the external electrodes are prevented from being formed thinly at the edge parts, and chipping defects can be suppressed.

[0060] Referring to FIG. 4, when the thickness of each of the upper and lower protective parts 112 is defined as tp and the radius of curvature of the edge of the main body 100 in the cross sections in the first and second directions (ZX cross section, LT cross section) is defined as R1, R1 / tp may be 0.3 or more and 1.4 or less.

[0061] If R1 / tp is less than 0.3, the roundness cannot be sufficiently formed, which may result in chipping defects or the thickness of the external electrodes at the edge portions becoming thin.

[0062] On the other hand, if R1 / tp exceeds 1.4, a short circuit may occur due to the exposure of the internal electrodes, or it may be difficult to form the external electrodes. Here, a short circuit due to the exposure of the internal electrodes refers to a case where the first internal electrode 121 is exposed on the surface where the second external electrode 152 is formed and connected to the second external electrode 152, or a case where the second internal electrode 122 is exposed on the surface where the first external electrode 151 is formed and connected to the first external electrode 151, due to grinding the edge of the body.

[0063] In this case, the R1 / tp can be greater than 1.0 and equal to or less than 1.4.

[0064] If the connecting portions 141 and 142 are not present, there is a high risk of a short circuit occurring due to exposure of the internal electrodes when R1 / tp is controlled to be greater than 1.0. However, when the connecting portions 141 and 142 are provided according to the present invention, there is a significant reduction in the risk of a short circuit occurring due to exposure of the internal electrodes even when R1 / tp is controlled to be greater than 1.0 and equal to or less than 1.4.

[0065] The rounded edges of the body 100 in the cross sections in the first and second directions may be formed at the connecting portions 141 and 142, and may be extended to a portion of the stacked portion 110 as shown in FIGS.

[0066] The first and second connecting parts 141 and 142 include metal layers 141a and 142a disposed on the laminated part 110 and ceramic layers 141b and 142b disposed on the metal layers.

[0067] The metal layers 141a and 142a are respectively disposed on one surface and the other surface of the multilayer section 110 in the second direction (X direction), and are connected to the first and second internal electrodes 121 and 122, respectively.

[0068] The metal layers 141a and 142a may include a metal material with high electrical conductivity, and may include the same metal as the first internal electrode 121 to enhance electrical connectivity with the first internal electrode 121. For example, the metal layers 141a and 142a may include one or more of a noble metal material such as palladium (Pd) or a palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu).

[0069] The metal layers 141a and 142a may be provided in the form of sintered electrodes and may be sintered simultaneously with the main body 100. In this case, the metal layers 141a and 142a before sintering may be transferred to the main body 100 in a state including metal particles and organic materials such as a binder, and the organic materials may be removed after sintering.

[0070] The thickness ta of the metal layer is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness ta of the metal layer may refer to the length of the metal layer in the second direction (X direction).

[0071] The ceramic layers 141b and 142b are disposed on the metal layers 141a and 142a to improve sealing properties and minimize penetration of external moisture, plating solution, etc. The ceramic layers 141b and 142b may be formed so as not to cover the cross sections of the metal layers 141a and 142a in the first direction (Z direction) and third direction (Y direction).

[0072] The ceramic layers 141b and 142b may be made of a ceramic material such as barium titanate, etc. In this case, the ceramic layers 141b and 142b may contain the same ceramic material as that contained in the dielectric layer 111, or may be made of the same material as the dielectric layer 111.

[0073] The ceramic layers 141b and 142b may be formed by the same transfer method as the metal layers 141a and 142a, and then may undergo a sintering process. Because the ceramic layers 141b and 142b preferably have high adhesive strength before sintering for the transfer process, the ceramic layers 141b and 142b may contain a relatively large amount of organic material, such as a binder. In this case, some of the organic material may remain after sintering, so the ceramic layers 141b and 142b may contain a larger amount of organic material than the dielectric layer 111.

[0074] The thickness tb of the ceramic layer is not particularly limited, but may be, for example, 3 to 15 μm. Here, the thickness tb of the ceramic layer may refer to the length of the ceramic layer in the second direction (X direction).

[0075] The first and second connecting portions 141 and 142 may be formed by a sheet transfer method and may have a uniform thickness. Thus, the ratio of the minimum to the maximum thickness of the first and second connecting portions 141 and 142 may be 0.9 to 1.0. Here, the thickness of the first and second connecting portions 141 and 142 may refer to the length of the first and second connecting portions 141 and 142 in the second direction (X direction).

[0076] 6 to 9 are diagrams showing steps for forming connecting portion 141 of a capacitor component according to one embodiment of the present invention by a transfer method.

[0077] 6, in the transfer process of the metal layer 141a, the metal layer sheet 140a is placed on the support 300, and then the laminated part 110 is pressed onto the metal layer sheet 140a to attach the metal layer 141a to the surface of the laminated part 110. The metal layer sheet 140a is in a pre-sintered state and contains components such as a binder and an organic solvent.

[0078] 7, the ceramic layer sheet 140b is placed on the support 300, and then the laminated unit 110 is pressed against the ceramic layer sheet 140b to attach the ceramic layer 141b to the surface of the metal layer 141a. The ceramic layer sheet 140b is in a pre-sintered state and contains components such as a binder and an organic solvent.

[0079] Thereafter, the same process is repeated on the surface opposite to the surface on which the metal layer 141a and the ceramic layer 141b are formed to form a metal layer 142a and a ceramic layer 142b, thereby completing the main body 100 as shown in FIG.

[0080] Thereafter, the edges of the body are rounded through a polishing process, and the polished body 100 is dipped in a conductive paste to form external electrodes 151 and 152, thereby completing the capacitor component 10.

[0081] On the other hand, instead of transferring the metal layer and ceramic layer separately, the ceramic layer sheet 140b and the metal layer sheet 140a can be prepared in a stacked state on the support base 300 as shown in Figure 9, and the first connecting portion 141 can be formed by a single transfer process.

[0082] The first and second margin portions 131 and 132 may be disposed on both sides of the stacked portion in a third direction (Y direction) perpendicular to the first and second directions.

[0083] If the internal electrodes are exposed to the outside of the body, the intrusion of conductive foreign matter can cause short circuits and reduce the reliability of the multilayer ceramic capacitor. Therefore, when forming internal electrodes on dielectric layers, the area of ​​the dielectric layers is typically made larger than that of the internal electrodes, and a margin area is formed on the remaining edge of the internal electrodes, excluding the portion connected to the external electrode. When the internal electrodes are formed on the dielectric layers during the manufacturing process, they tend to protrude beyond the margin area. This protruding shape creates a step. When tens to hundreds of dielectric layers are stacked, the dielectric layers stretch to fill the step. As the dielectric layers stretch, the internal electrodes also bend. This bending of the internal electrodes can lead to a decrease in breakdown voltage (BDV) in the corresponding area.

[0084] Therefore, in the capacitor component according to an embodiment of the present invention, the margin areas on both sides in the third direction of the laminated part 110 are removed to prevent steps from being generated by the internal electrodes. This prevents the internal electrodes from bending in the third direction (Y direction), preventing problems with reduced voltage resistance characteristics, and improving the reliability of the capacitor component.

[0085] Since the first internal electrode 121 and the second internal electrode 122 are both formed so as to be exposed on both sides of the laminated portion 110 in the third direction, it is necessary to provide separate first and second margin portions 131 and 132 to protect the internal electrodes formed therein.

[0086] Furthermore, in the past, it was necessary to ensure a sufficient width for the margin region in consideration of manufacturing errors such as misalignment of the internal electrodes. However, according to one embodiment of the present invention, the laminated unit 110 is formed through a cutting process or the like so that both the first and second internal electrodes 121, 122 are exposed on both sides of the laminated unit 110 in the third direction, eliminating the need to consider manufacturing errors such as misalignment of the internal electrodes. Therefore, the thickness (wm) of the first and second marginal units 131, 132 can be set smaller than the thickness of the conventional margin region, thereby improving the capacitance per unit volume of the capacitor component.

[0087] Therefore, when the body 100 includes the first and second margin portions 131 and 132, the first internal electrode 121 may be exposed to both surfaces of the laminated unit 110 in the third direction and one surface of the laminated unit 110 in the second direction, and the portion exposed to one surface of the second direction may be connected to the first connecting portion 141. In addition, the second internal electrode 122 may be exposed to both surfaces of the laminated unit 110 in the third direction and the other surface of the second direction, and the portion exposed to the other surface of the second direction may be connected to the second connecting portion 142.

[0088] The first and second margin portions 131 and 132 may be made of an insulating material, such as a ceramic material such as barium titanate. In this case, the first and second margin portions 131 and 132 may contain the same ceramic material as that contained in the dielectric layer 111, or may be made of the same material as the dielectric layer 111.

[0089] The method for forming the first and second margin portions 131, 132 is not particularly limited, and for example, they may be formed by applying a slurry containing ceramic, or by stacking dielectric sheets in the third direction on both sides of the laminate portion in the third direction.

[0090] Alternatively, the first and second marginal portions 131 and 132 may be formed by transferring a dielectric sheet using the above-mentioned transfer method. This allows the first and second marginal portions 131 and 132 to have a uniform thickness. When the thickness of each of the first and second marginal portions 131 and 132 is defined as Wm, the ratio of the minimum value to the maximum value of Wm may be 0.9 to 1.0.

[0091] When the first and second margin portions 131 and 132 are formed by transferring a dielectric sheet, it is preferable that the first and second margin portions 131 and 132 have high adhesive strength before sintering for the transfer process. Therefore, the first and second margin portions 131 and 132 may contain a relatively large amount of organic material, such as a binder. In this case, some of the organic material may remain even after sintering, so the first and second margin portions 131 and 132 may contain a larger amount of organic material than the dielectric layer 111.

[0092] Although there is no need to particularly limit the thickness Wm of the first and second margin portions 131 and 132, according to the present invention, by arranging the connecting portions 141 and 142 in the laminate portion 110, it is possible to form a sufficient roundness on the edge of the main body, thereby minimizing Wm and improving the capacitance per unit volume of the capacitor component.

[0093] For example, according to the present invention, even if Wm is 15 μm or less, the rounds can be sufficiently formed and the internal electrodes 121 and 122 can be protected, so that the capacitance per unit volume can be improved.

[0094] Furthermore, the lower limit of Wm is not particularly limited and can be appropriately selected taking into consideration the radius of curvature R2 of the edge of the main body in the cross sections in the second and third directions (XY cross section, LW cross section), and can be, for example, 5 μm or more.

[0095] Here, the thickness Wm of the first and second margin portions may refer to the length of the first and second margin portions 131 and 132 in the third direction (Y direction).

[0096] Referring to Figures 5a and 5b, when the thickness of each of the first and second margin portions 131 and 132 is defined as Wm and the radius of curvature of the edge of the main body in the cross section in the second and third directions (XY cross section, LW cross section) is defined as R2, R2 / Wm can be 0.3 or more and 1.4 or less.

[0097] If R2 / Wm is less than 0.3, the roundness cannot be sufficiently formed, which may result in chipping defects or the thickness of the external electrodes at the edge portions becoming thin.

[0098] On the other hand, if R2 / Wm exceeds 1.4, a short circuit occurs due to the exposure of the internal electrodes, or it becomes difficult to form the external electrodes. Here, a short circuit due to the exposure of the internal electrodes refers to a case where the first internal electrode 121 is exposed on the surface where the second external electrode 152 is formed and connected to the second external electrode 152, or a case where the second internal electrode 122 is exposed on the surface where the first external electrode 151 is formed and connected to the first external electrode 151, due to grinding the edge of the body.

[0099] In this case, the R2 / Wm can be greater than 1.0 and not greater than 1.4.

[0100] If the connecting portions 141 and 142 are not present, controlling R2 / Wm to greater than 1.0 increases the risk of short circuits occurring due to exposure of the internal electrodes. However, if the connecting portions 141 and 142 are provided according to the present invention, controlling R2 / Wm to greater than 1.0 and less than 1.4 significantly reduces the risk of short circuits occurring due to exposure of the internal electrodes.

[0101] On the other hand, to facilitate the polishing process, the radius of curvature R2 of the edge of the body in the cross section in the second and third directions may be the same as the radius of curvature R1 of the edge of the body in the cross section in the first and second directions, but this is not particularly limited, and the edge of the body may be polished so that R2 and R1 are different.

[0102] In addition, the first and second margin portions 131 and 132 may be divided into a first region adjacent to the stacked portion and a second region adjacent to the outer surface of the main body.

[0103] At this time, the first and second regions of the margin portions 131 and 132 may have different magnesium (Mg) contents.

[0104] As a result, an oxide layer can be formed in the voids in contact with the laminated portion 110, ensuring insulation and reducing electric field concentration, thereby improving breakdown voltage (BDV) and reducing the incidence of short circuits.

[0105] In addition, by adjusting the second region of the margin portions 131, 132 to have a higher magnesium (Mg) content than the first region, the density of the second region can be increased and the moisture resistance reliability can be improved, and by adjusting the first region of the margin portions 131, 132 to have a lower magnesium (Mg) content than the second region, the adhesive strength with the laminate portion 110 can be increased.

[0106] After forming the first and second margin portions 131, 132 in the laminate portion 110, the first and second connecting portions 141, 142 are formed using a transfer method, so that the first connecting portion 141 is arranged to cover one side of the first and second margin portions 131, 132 in the second direction (X direction), and the second connecting portion 142 is arranged to cover the other side of the first and second margin portions 131, 132 in the second direction (X direction).

[0107] In addition, the first connecting portion 141 may be arranged within a range not deviating from one surface of the stacked portion 110 and the first and second margin portions 131 and 132 in the second direction (X direction), and the second connecting portion 142 may be arranged within a range not deviating from the other surface of the stacked portion 110 and the first and second margin portions 131 and 132 in the second direction (X direction). That is, the first connecting portion 141 does not extend to both surfaces of the stacked portion 110 in the first direction (Z direction), and does not extend to both surfaces of the first and second margin portions 131 and 132 in the third direction (Y direction).

[0108] The first and second external electrodes 151 and 152 are disposed on the first and second connecting portions 141 and 142, respectively.

[0109] The first external electrode 151 may be electrically connected to the first internal electrode 121 via the metal layer 141a of the first connecting portion 141, and the second external electrode 152 may be electrically connected to the second internal electrode 122 via the metal layer 142a of the second connecting portion 142.

[0110] The first and second external electrodes 151 and 152 may be disposed to extend on both sides of the first and second connecting parts 141 and 142 in the first direction (Z direction), and the metal layers 141a and 142a of the first and second connecting parts may be exposed in the first direction (Z direction) of the first and second connecting parts, respectively, and connected to the first and second external electrodes 151 and 152. In this case, the first and second external electrodes 151 and 152 may be disposed to extend on both sides of the first and second connecting parts 141 and 142 in the third direction (Y direction), and the metal layers 141a and 142a of the first and second connecting parts may be exposed in the third direction (Y direction) of the first and second connecting parts, respectively, and connected to the first and second external electrodes 151 and 152, respectively.

[0111] In addition, the first and second external electrodes 151 and 152 may be disposed so as to extend to parts of the first and second surfaces 1 and 2 of the main body. In this case, the first and second external electrodes 151 and 152 may be disposed so as to extend to parts of the fifth and sixth surfaces 5 and 6 of the main body.

[0112] The method for forming the first and second external electrodes 151 and 152 is not particularly limited, and for example, they can be formed by dipping the main body in a paste containing a conductive metal and glass.

[0113] In this case, the conductive metal may include at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0114] According to one embodiment of the present invention, the edges of the main body 100 are rounded, so that even if the external electrodes are formed using a dipping process, the phenomenon of the thickness of the external electrodes 151, 152 at the edges of the main body 100 becoming thin can be suppressed.

[0115] Therefore, when the thickness of each of the first and second external electrodes 151 and 152 is defined as tc, the ratio of the minimum value to the maximum value of tc may be 0.8 to 1.0.

[0116] Meanwhile, a plating layer may be formed on the first and second external electrodes 151 and 152 to improve mountability on a substrate.

[0117] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the external electrode, or may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0118] The size of the capacitor component 10 is not particularly limited, but the smaller the size of the capacitor component, the greater the effect of the present invention in improving capacitance per unit volume.

[0119] In particular, when applied to a 0603 size capacitor component having a length of 0.6 mm or less and a width of 0.3 mm or less, the capacitance per unit volume can be significantly improved. Here, the length of the capacitor component may refer to the length of the capacitor component in the second direction (X direction), and the width of the capacitor component may refer to the length of the capacitor component in the third direction (Y direction).

[0120] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0121] 10 Capacitor parts 100 units 110 Laminated section 111 Dielectric layer 112 Protection Department 121, 122 Internal electrode 131, 132 Margin 141, 142 Connection part 141a, 142a metal layer 141b, 142b ceramic layer 151, 152 External electrode

Claims

1. a main body including a laminated portion in which a dielectric layer and first and second internal electrodes are laminated in a first direction, and first and second connecting portions respectively disposed on both sides of the laminated portion in a second direction perpendicular to the first direction; first and second external electrodes disposed on the first and second connecting portions, respectively; the first and second connecting portions each include a metal layer disposed over the entire surface of each of the laminated portions on both sides in the second direction; The edges of the main body in the cross sections in the first and second directions have rounded shapes formed at the first and second connecting portions, The rounded shape is formed continuously across the laminated portion and the metal layer.

2. 2. The capacitor component according to claim 1, wherein a ratio of the minimum value to the maximum value of the thickness of the first and second connecting portions is 0.9 to 1.

0.

3. 3. The capacitor component according to claim 1, wherein the thickness of said metal layer is 2 to 7 μm.

4. The capacitor component according to claim 1 , wherein the first and second connecting portions are formed by transferring a sheet-shaped ceramic layer and a sheet-shaped metal layer in the second direction.

5. the first and second external electrodes are disposed to extend to both surfaces of the first and second connecting portions in the first direction, 5. The capacitor component according to claim 1, wherein the metal layers of the first and second connecting portions are exposed in the first and third directions of the first and second connecting portions, respectively, and are connected to the first and second external electrodes, respectively.

6. the main body includes first and second surfaces facing in the first direction, third and fourth surfaces facing in the second direction, and fifth and sixth surfaces facing in the third direction; The capacitor component according to claim 1 , wherein the first and second external electrodes are arranged to extend to a portion of the first and second surfaces of the body.

7. The capacitor component according to claim 1 , wherein the length of the capacitor component is 0.6 mm or less and the width of the capacitor component is 0.3 mm or less.

8. The capacitor component according to claim 1 , wherein the main body includes first and second margin portions respectively arranged on both sides of the laminated portion in a third direction perpendicular to the first and second directions.

9. the first connecting portion is disposed to cover one surface of the first and second margin portions in the second direction, The capacitor component according to claim 8 , wherein the second connecting portion is disposed to cover other surfaces of the first and second margin portions in the second direction.

10. the first connecting portion is disposed within a range not deviating from one surface of the stacked portion and the first and second margin portions in the second direction, The capacitor component according to claim 8 , wherein the second connecting portion is disposed within a range not deviating from other surfaces of the laminated portion and the first and second margin portions in the second direction.

11. the first internal electrodes are exposed to both surfaces of the laminated part in the third direction and one surface of the laminated part in the second direction; The capacitor component according to claim 8 , wherein the second internal electrodes are exposed on both surfaces of the laminated portion in the third direction and on another surface in the second direction.

12. The capacitor component according to claim 8 , wherein each of the first and second margin portions has a thickness of 15 μm or less.

13. 13. The capacitor component according to claim 8, wherein when the thicknesses of the first and second margin portions are defined as Wm, the ratio of the minimum value to the maximum value of Wm is 0.9 to 1.

0.

14. The capacitor component according to claim 8 , wherein the first and second margin portions are formed by transferring a dielectric sheet onto the main body in the third direction.

15. 15. A capacitor component according to claim 1, wherein the laminated portion includes a capacitance forming portion in which capacitance is formed including the first and second internal electrodes arranged to face each other across the dielectric layer, and upper and lower protective portions formed above and below the capacitance forming portion.

16. 16. The capacitor component of claim 15, wherein when the thickness of each of the upper and lower protective portions is defined as tp and the radius of curvature of the edge of the body in the cross section in the first and second directions is defined as R1, R1 / tp is greater than or equal to 0.3 and less than or equal to 1.

4.

17. 17. The capacitor component of claim 16, wherein R1 / tp is greater than 1.0 and not greater than 1.

4.

18. The capacitor component according to claim 15 , wherein each of the upper and lower protective portions has a thickness of 20 μm or less.

19. 9. The capacitor component of claim 8, wherein when the thickness of each of the first and second margin portions is defined as Wm and the radius of curvature of the edge of the body in the cross section in the second and third directions is defined as R2, R2 / Wm is greater than or equal to 0.3 and less than or equal to 1.

4.

20. 20. The capacitor component of claim 19, wherein R2 / Wm is greater than 1.0 and not greater than 1.

4.

21. 20. The capacitor component according to claim 1, wherein when the thickness of each of the first and second external electrodes is defined as tc, the ratio of the minimum value to the maximum value of tc is 0.8 to 1.0.

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