Wiring Module

The wiring module stabilizes electrical connections and prevents damage by using crimping portions and chip fuses, addressing stress and moisture issues in battery pack wiring.

JP7765755B2Active Publication Date: 2025-11-07AUTONETWORKS TECH LTD +2
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Patent Information

Application Number
JP2024207128
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-11-07
Estimated Expiration
2041-08-25

AI Technical Summary

Technical Problem

Existing wiring modules in battery packs of electric vehicles and hybrid vehicles face issues with stress-induced damage to the electrical connection between electric wires and circuit boards, leading to potential failure.

Method used

A wiring module design featuring busbar units with crimping portions that fix electric wires between the busbars and circuit boards, along with a circuit board configuration that includes conductive paths and chip fuses to enhance electrical connectivity and protect against overcurrents.

Benefits of technology

The design stabilizes the electrical connection between electric wires and circuit boards, reduces solder cracking, and prevents short circuits due to moisture, while effectively managing overcurrents.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a wiring module.SOLUTION: A wiring module 20 is a wiring module 20 mounted on a plurality of power storage elements 11 having electrode terminals 12A and 12B, includes a plurality of bus bar units 22 and a wire 21 connected to the bus bar units 22, wherein the bus bar unit 22 includes a bus bar 30 connected to the electrode terminals 12A and 12B, a circuit board 40 and fixing means 53 for fixing the circuit board 40 to the bus bar 30, the circuit board 40 is arranged with a conductive path 43, the conductive path 43 includes a connection land 45 electrically connected to the bus bar 30, and a wire land 46 connected to the wire 21 by soldering, the bus bar 30 has a calking part 37 for fixing the wire 21, and the wire 21 is sandwiched between the calking part 37 and the circuit board 40.SELECTED DRAWING: Figure 5
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Description

[Technical Field]

[0001] The present disclosure relates to a wiring module. [Background technology]

[0002] Conventionally, wiring modules connected to multiple unit cells in battery packs of electric vehicles, hybrid vehicles, etc. have been known. For example, a detection module described in JP 2016-115616 A (Patent Document 1 below) includes a busbar connection terminal connected to a busbar that connects electrode terminals of multiple unit cells, an electric wire connection terminal connected to an end portion of an electric wire, and a fuse connecting the busbar connection terminal and the electric wire connection terminal. The busbar connection terminal, the electric wire connection terminal, and the fuse are housed and integrated in a housing made of synthetic resin. Furthermore, this housing is held in a resin protector made of synthetic resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-115616 Summary of the Invention [Problem to be solved by the invention]

[0004] In order to simplify the configuration of the detection module, it is possible to use a circuit board equipped with a fuse. That is, the detection module can be configured to include a circuit board having a busbar connection portion connected to the busbar, an electric wire connection portion connected to the electric wire, and a fuse disposed between the busbar connection portion and the electric wire connection portion.

[0005] In a wiring module including an electrically connected electric wire and a circuit board, stress applied to the electric wire may damage the electrical connection between the electric wire and the circuit board. [Means for solving the problem]

[0006] The wiring module of the present disclosure is a wiring module attached to a plurality of energy storage elements having electrode terminals, and includes a plurality of busbar units and electric wires connected to the busbar units. The busbar units include busbars connected to the electrode terminals, a circuit board, and fixing means for fixing the circuit board to the busbars. Conductive paths are routed on the circuit board, and the conductive paths include connection lands electrically connected to the busbars and electric wire lands connected to the electric wires by soldering. The busbars have crimping portions for fixing the electric wires, and the electric wires are sandwiched between the crimping portions and the circuit board. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a wiring module in which the electrical connection between the electric wire and the circuit board is less likely to be impaired. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing a vehicle equipped with a power storage module according to a first embodiment. [Figure 2] FIG. 2 is a plan view of the electricity storage module. [Figure 3] FIG. 3 is an enlarged plan view of the energy storage module showing the bus bar unit. [Figure 4] FIG. 4 is an enlarged plan view of the wiring module showing the circuit board. [Figure 5] FIG. 5 is an enlarged perspective view of the wiring module showing the circuit board. [Figure 6] FIG. 6 is a cross-sectional view taken along line AA in FIG. [Figure 7] FIG. 7 is a cross-sectional view taken along line BB in FIG. [Figure 8] FIG. 8 is a plan view of the circuit board. [Figure 9] FIG. 9 is an enlarged perspective view of the bus bar showing the circuit board placement portion. [Figure 10] FIG. 10 is a cross-sectional view taken along the line AA in FIG. 4, showing a state in which a circuit board is disposed in the circuit board mounting portion. [Figure 11] FIG. 11 is a cross-sectional view taken along the line AA in FIG. 4, showing how the electric wire is crimped by the crimping portion. [Figure 12] FIG. 12 is an enlarged plan view of a wiring module showing a circuit board according to the second embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along CC in FIG. [Figure 14] FIG. 14 is a plan view of the circuit board. [Figure 15] FIG. 15 is an enlarged perspective view of the bus bar showing the circuit board placement portion. [Figure 16] FIG. 16 is a view showing how the electric wire is crimped by the crimping portion in the CC cross section of FIG. [Figure 17] FIG. 17 is an enlarged plan view of a wiring module showing a circuit board according to a third embodiment. [Figure 18] FIG. 18 is a cross-sectional view taken along line DD in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] (1) A wiring module according to the present disclosure is a wiring module attached to a plurality of energy storage elements having electrode terminals, the wiring module comprising a plurality of busbar units and electric wires connected to the busbar units, the busbar units comprising busbars connected to the electrode terminals, a circuit board, and fixing means for fixing the circuit board to the busbars, a conductive path routed on the circuit board, the conductive path comprising connection lands electrically connected to the busbars and electric wire lands connected to the electric wires by soldering, the busbars having crimping portions for fixing the electric wires, the electric wires being sandwiched between the crimping portions and the circuit board.

[0011] With this configuration, the electric wire is fixed by the crimped portion and the circuit board, so that the electrical connection between the electric wire and the circuit board is unlikely to be damaged even if an external force is applied to the electric wire.

[0012] (2) It is preferable that the circuit board has a fixing portion that clamps and fixes the electric wire together with the crimping portion, the surface of the circuit board on which the electric wire land is formed is a first surface, and the fixing portion is in contact with the electric wire on the first surface.

[0013] With this configuration, the wire land is formed on the first surface of the circuit board, and the fixing portion, which clamps and fixes the wire together with the crimping portion, is in contact with the wire on the first surface. This eliminates the need to bend the wire between the wire land and the fixing portion. Therefore, when the wire is fixed by the crimping portion and the fixing portion after soldering, solder cracking is suppressed. Furthermore, when the wire is soldered after being fixed by the crimping portion and the fixing portion, soldering is facilitated.

[0014] (3) Preferably, the circuit board has a second surface disposed on the opposite side to the first surface, and the fixing portion is in contact with the bus bar on the second surface.

[0015] With this configuration, the fixing portion is in contact with the bus bar on the second surface, so that the fixing portion can be supported by the bus bar. Also, the state in which the electric wire is fixed by the crimping portion and the fixing portion can be further stabilized.

[0016] (4) It is preferable that the circuit board has a notch disposed near the crimped portion.

[0017] With this configuration, moisture adhering to the circuit board can be drained through the notch, thereby preventing short circuits in the conductive paths due to moisture on the circuit board.

[0018] (5) It is preferable that the caulking portion is disposed inside the cutout portion.

[0019] With this configuration, the notch allows the bus bar and the circuit board to be positioned relative to each other.

[0020] (6) Preferably, the wiring module further includes a protector that holds the bus bar, and the circuit board has a clearance between it and the protector.

[0021] This configuration allows multiple bus bar units to be handled together using the protector. Furthermore, by providing a clearance between the circuit board and the protector, the circuit board is less likely to be subjected to stress from the protector, thereby preventing solder cracks.

[0022] (7) The conductive path preferably includes a chip fuse provided between the connection land and the electric wire land.

[0023] With this configuration, even if the conductive paths are short-circuited and an overcurrent occurs, the overcurrent can be restricted from flowing from the storage element to the conductive path.

[0024] (8) It is preferable that the bus bar has a first fixing hole, the circuit board has a second fixing hole, the fixing means is a rivet, and the rivet has a shaft portion inserted into the first fixing hole and the second fixing hole, and a head portion formed at the end of the shaft portion and having an outer diameter larger than the hole diameters of the first fixing hole and the second fixing hole.

[0025] With this configuration, the circuit board can be fixed to the bus bar by the rivet.

[0026] (9) The above-described wiring module is a wiring module for a vehicle that is electrically attached to the plurality of power storage elements mounted on the vehicle.

[0027] [Details of the embodiments of the present disclosure] The present disclosure will be described below with reference to exemplary embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0028] <Embodiment 1> A first embodiment of the present disclosure will be described with reference to Fig. 1 to Fig. 11. An electricity storage module 10 including a wiring module 20 of the present embodiment is applied to an electricity storage pack 2 mounted on a vehicle 1, for example, as shown in Fig. 1. The electricity storage pack 2 is mounted on the vehicle 1, such as an electric vehicle or a hybrid vehicle, and is used as a drive source for the vehicle 1. In the following description, when there are multiple members, only some of the members will be assigned reference numerals, and the reference numerals for the other members may be omitted.

[0029] As shown in FIG. 1, an electricity storage pack 2 is disposed near the center of a vehicle 1. A PCU 3 (Power Control Unit) is disposed in the front of the vehicle 1. The electricity storage pack 2 and the PCU 3 are connected by a wire harness 4. The electricity storage pack 2 and the wire harness 4 are connected by a connector (not shown). The electricity storage pack 2 has an electricity storage module 10 including a plurality of electricity storage elements 11. The electricity storage module 10 (and the wiring module 20) can be mounted in any orientation, but in the following description, except for FIG. 1, the direction indicated by arrow Z is defined as upward, the direction indicated by arrow X is defined as forward, and the direction indicated by arrow Y is defined as leftward.

[0030] [Electricity storage element, electrode terminal] As shown in FIG. 2, the energy storage module 10 includes a plurality of energy storage elements 11 arranged in a row in the left-right direction, and a wiring module 20 attached to the upper surfaces of the plurality of energy storage elements 11. The energy storage elements 11 are shaped like flat rectangular parallelepipeds. An energy storage element (not shown) is housed inside the energy storage elements 11. The energy storage elements 11 have positive and negative electrode terminals 12A, 12B on their upper surfaces. The energy storage elements 11 are not particularly limited and may be secondary batteries or capacitors. The energy storage elements 11 according to this embodiment are secondary batteries.

[0031] [Wiring module] 2, the wiring module 20 includes a plurality of busbar units 22, electric wires 21 connected to the busbar units 22, and a protector 70 that holds the busbar units 22 and the electric wires 21. The wiring module 20 is configured to be attached to the front and rear sides of the plurality of energy storage elements 11. The configuration of the wiring module 20 arranged on the front side will be described in detail below. Note that the wiring module 20 arranged on the rear side is reversed in both the front-to-rear and left-to-right directions, but in other respects there is no difference in configuration between the wiring module 20 arranged on the rear side and the wiring module 20 arranged on the front side.

[0032] [Busbar unit] 3, busbar unit 22 includes busbar 30 connected to electrode terminals 12A, 12B, circuit board 40 connecting busbar 30 and electric wire 21, and fixing means 53 for fixing circuit board 40 to busbar 30. Circuit board 40 of busbar unit 22 is connected to electric wire 21.

[0033] [Electric wire] As shown in Figs. 4 to 6, the electric wire 21 has a core wire 21A and an insulating coating 21B that covers the core wire 21A. As shown in Figs. 4 and 5, the core wire 21A exposed at one end of the electric wire 21 is connected to an electric wire land 46 of the circuit board 40 with solder S. As shown in Fig. 6, the insulating coating 21B at one end of the electric wire 21 is clamped in a substantially vertical direction between a crimping portion 37 and a fixing portion 48 of the circuit board 40, and is fixed to the bus bar 30 and the circuit board 40. Although not shown, the other end of the electric wire 21 is connected to an external ECU (Electronic Control Unit) or the like via a connector. The ECU is equipped with a microcomputer, elements, and the like, and has a well-known configuration that has functions for detecting the voltage, current, temperature, etc. of each storage element 11 and controlling the charging and discharging of each storage element 11.

[0034] [Busbar] Busbar 30 is made of a conductive metal plate. Examples of metals that make up busbar 30 include copper, copper alloy, aluminum, aluminum alloy, and stainless steel (SUS). As shown in FIG. 3, busbar 30 is placed on electrode terminals 12A and 12B, and busbar 30 and electrode terminals 12A and 12B are electrically connected by welding. Some busbars 30 connect electrode terminals 12A and 12B of adjacent energy storage elements 11, while others connect to the common positive or negative electrodes of multiple energy storage elements 11; however, no particular distinction will be made hereinafter.

[0035] 3, in bus bar 30 disposed in front of a plurality of energy storage elements 11, circuit board 40 is disposed at the right rear corner of bus bar 30, which is rectangular in plan view. The right rear corner of bus bar 30 where circuit board 40 is disposed is configured as circuit board mounting portion 33 (see FIG. 9).

[0036] [First fixing hole, crimping part] As shown in Figure 9, the circuit board mounting portion 33 of the bus bar 30 has a first fixing hole 34 that penetrates in the vertical direction, a recess 35 that is recessed inward from the outer edge of the bus bar 30, a positioning protrusion 36 that protrudes upward from the top surface of the circuit board mounting portion 33, and a crimping portion 37. The first fixing hole 34 is located approximately in the center of the circuit board mounting portion 33. The recess 35 is located on the left side of the circuit board mounting portion 33. The positioning protrusion 36 is located at the right end of the circuit board mounting portion 33. The crimping portion 37 is provided behind the recess 35.

[0037] As shown in Fig. 7, fixing means 53 (rivets 54) are adapted to be inserted into first fixing holes 34. As shown in Fig. 5, positioning protrusions 36 are received in positioning recesses 61 of circuit board 40, thereby positioning busbar 30 and circuit board 40. Recesses 35 are arranged around wire lands 46 of conductive paths 43. This ensures a spatial distance between busbar 30 and wire lands 46, thereby preventing short circuits between busbar 30 and conductive paths 43.

[0038] As shown in FIG. 9 , the crimping portion 37 includes a rising portion 37A rising above the upper surface of the circuit board mounting portion 33 and a bent portion 37B provided toward the tip of the rising portion 37A. The bent portion 37B is gently bent to the left. As shown in FIG. 10 , the crimping portion 37 as a whole has a crank shape when viewed from the front-to-rear direction. As shown in FIG. 11 , the bent portion 37B is bent so as to cover the electric wire 21 placed on the circuit board 40 from above, and the tip of the crimping portion 37 is arranged to the left of the electric wire 21. By bending the bent portion 37B in this manner, the electric wire 21 is sandwiched between the crimping portion 37 and a fixing portion 48 of the circuit board 40 in a substantially vertical direction, and is fixed to the bus bar 30 and the circuit board 40.

[0039] As shown in FIG. 6 , when the electric wire 21 is fixed by the crimping portion 37, the crimping portion 37 has a pressing portion 38 that presses the electric wire 21 and a position restricting portion 39 that restricts the electric wire 21 from coming out from between the pressing portion 38 and the fixing portion 48. The distance between the pressing portion 38 and the fixing portion 48 is smaller than the diameter of the electric wire 21, and the pressing portion 38 and the fixing portion 48 clamp the electric wire 21 in a compressed state in a substantially vertical direction. In FIG. 6 , the pressing portion 38 is arranged parallel to the circuit board 40, but the pressing portion 38 does not necessarily have to be parallel to the circuit board 40. The pressing portion 38 only needs to be arranged so that the pressing portion 38 and the fixing portion 48 face each other in the vertical direction. The position restricting portion 39 is composed of a first position restricting portion 39A on the base end side of the crimping portion 37 and a second position restricting portion 39B on the tip end side of the crimping portion 37. The position restricting portion 39 is disposed so as to extend downward from the pressing portion 38 .

[0040] 11 shows that the bent portion 37B is bent entirely, the bent portion 37B may be configured to be bent locally. For example, the second position restriction portion 39B on the tip end side of the crimping portion 37 may be formed in advance, and when the electric wire 21 is fixed by the crimping portion 37, only the base end side of the bent portion 37B may be bent.

[0041] [Circuit board, conductive path] As shown in FIG. 8, the circuit board 40 is a hard board and includes an insulating plate 42 having insulating properties and a conductive path 43 routed on the insulating plate 42. The conductive path 43 is formed on an upper surface 40A (an example of a first surface) of the circuit board 40. As shown in FIG. 6, the surface of the circuit board 40 opposite the upper surface 40A is a lower surface 40B. The insulating plate 42 is formed, for example, by impregnating glass fiber cloth with epoxy resin and curing it. The conductive path 43 is made of a metal such as copper or a copper alloy and is conductive. Although not shown, the conductive path 43 is covered with an insulating layer except for a portion soldered to the electric wire 21, etc. The insulating layer is made of a synthetic resin such as polyimide. As shown in FIG. 8, the conductive path 43 includes a connection land 45 arranged at one end of the conductive path 43, an electric wire land 46 arranged at the other end of the conductive path 43, and a chip fuse 47 provided between the connection land 45 and the electric wire land 46.

[0042] [Connection land, wire land] As shown in Figures 4 and 5, the connection land 45 is formed on the right side of the circuit board 40. The connection land 45 is electrically connected to the bus bar 30 via a small metal piece 45A made of copper or the like. The connection land 45 and the small metal piece 45A are connected by soldering, and the bus bar 30 and the small metal piece 45A are connected by welding. The electric wire land 46 is formed on the left side of the circuit board 40. The electric wire land 46 is connected to the core wire 21A of the electric wire 21 by soldering.

[0043] [Chip fuse] 4 and 5, a chip fuse 47 is provided in the conductive path 43 in a portion midway between the connection land 45 and the electric wire land 46. The chip fuse 47 and the conductive path 43 are connected by soldering. Although not shown in detail, one of a pair of electrodes of the chip fuse 47 is connected to the conductive path 43 on the connection land 45 side, and the other is connected to the conductive path 43 on the electric wire land 46 side.

[0044] By providing the chip fuse 47, even if a malfunction occurs in the external circuit to which the storage module 10 is connected, causing the conductive paths 43 to short-circuit and generate an overcurrent, it is possible to limit the flow of overcurrent from the storage element 11 to the conductive path 43.

[0045] [Second fixing hole] As shown in Fig. 8, a second fixing hole 50 that penetrates in the vertical direction is provided in the center of the circuit board 40. A first through hole 51 that penetrates in the vertical direction and has an elongated hole shape that extends in the left-right direction is provided behind the second fixing hole 50. The first through hole 51 is disposed between the second fixing hole 50 and the chip fuse 47. A second through hole 52 that penetrates in the vertical direction and has an elongated hole shape that extends in the front-rear direction is provided to the left of the second fixing hole 50. The second through hole 52 is disposed between the second fixing hole 50 and the wire land 46.

[0046] [Fixing means, rivet, shank, head] As shown in Fig. 7, rivets 54, which are fixing means 53 of this embodiment, are inserted through the first fixing holes 34 and the second fixing holes 50, and the bus bar 30 and the circuit board 40 are fixed by the rivets 54. The rivets 54 include a shank 55 that is inserted into the first fixing holes 34 and the second fixing holes 50, and a head 56 that is formed at the end of the shank 55 and has an outer diameter larger than the diameters of the first fixing holes 34 and the second fixing holes 50. The head 56 formed at the upper end of the shank 55 is referred to as an upper head 56A, and the head 56 formed at the lower end of the shank 55 is referred to as a lower head 56B. The rivets 54 of this embodiment are made of metal from the standpoint of strength, but may also be made of synthetic resin.

[0047] Although not shown, before being fixed to the bus bar 30 and the circuit board 40, the rivet 54 has a shank 55 and an upper head 56A, but does not have a lower head 56B. The shank 55, which does not have a lower head 56B, is inserted into the first fixing hole 34 and the second fixing hole 50 and crimped to form the lower head 56B.

[0048] Because the rivet 54 is made of metal, it has the same potential as the bus bar 30 and may have a high voltage. In this embodiment, as shown in Figs. 4 and 5 , the first through hole 51 and the second through hole 52 are arranged to surround the rivet 54. Therefore, the first through hole 51 and the second through hole 52 increase the creepage distance between the rivet 54 and the conductive path 43, thereby suppressing a short circuit between the bus bar 30 and the conductive path 43, and are used as insulating holes 57. The first through hole 51 and the second through hole 52 also function as drainage holes 58 that drain moisture that has adhered to the circuit board 40 due to condensation.

[0049] [Fixed part] As shown in FIG. 8 , the circuit board 40 has a fixing portion 48 behind the wire land 46. As shown in FIG. 6 , the fixing portion 48, together with the pressing portion 38 of the crimping portion 37, clamps and fixes the insulating coating 21B of the electric wire 21 in a substantially vertical direction. The fixing portion 48 contacts the insulating coating 21B on the upper surface 40A of the circuit board 40. That is, as shown in FIG. 5 , the portion where the fixing portion 48 contacts the insulating coating 21B and the wire land 46 to which the core wire 21A is soldered are both on the upper surface 40A of the circuit board 40. Therefore, the insulating coating 21B is arranged on the circuit board 40 so as to extend along the upper surface 40A of the circuit board 40 from the fixing portion 48 to the rear end of the wire land 46. That is, when viewed from the left and right, as shown in FIG. 7 , the insulating coating 21B is in a substantially horizontal position from the portion clamped between the crimping portion 37 and the circuit board 40 to the portion where the core wire 21A is exposed.

[0050] The electric wire 21 is arranged along the upper surface 40A of the circuit board 40 from the electric wire land 46 to the fixed portion 48. Therefore, even when the insulating coating 21B is sandwiched between the crimping portion 37 and the fixed portion 48 in a substantially vertical direction, the core wire 21A side of the electric wire 21 is unlikely to move. Therefore, when the insulating coating 21B is sandwiched between the crimping portion 37 and the fixed portion 48 after the core wire 21A is soldered to the electric wire land 46, stress is unlikely to be applied to the solder S, and the solder is unlikely to crack. Furthermore, when the core wire 21A is soldered to the electric wire land 46 after the insulating coating 21B is sandwiched between the crimping portion 37 and the fixed portion 48, the core wire 21A is unlikely to float, making soldering easy.

[0051] [Notch] 4 and 5, the outer edge of the circuit board 40 is provided with a positioning recess 61 and a cutout 60 that are recessed inward from the outer edge. The positioning recess 61 is provided to the right of the connection land 45. The positioning recess 61 receives the positioning protrusion 36 of the bus bar 30 and positions the bus bar 30 and the circuit board 40. The cutout 60 is provided near the crimping portion 37.

[0052] As shown in Fig. 8, the cutout portion 60 of this embodiment is composed of a first cutout portion 60A located on the right side of the fixing portion 48 and a second cutout portion 60B located on the left side of the fixing portion 48. As shown in Fig. 6, the rising portion 37A of the crimping portion 37 is disposed inside the first cutout portion 60A. The second cutout portion 60B is disposed so as to be able to accommodate the tip end of the crimping portion 37 therein. That is, although the tip end of the crimping portion 37 is shown to be inserted into the second cutout portion 60B in Fig. 6, depending on the diameter of the electric wire 21 and the amount of pressing of the crimping portion 37, the tip end of the crimping portion 37 may not be disposed inside the second cutout portion 60B.

[0053] Providing the cutout portion 60 in the circuit board 40 allows the positioning of the crimping portion 37 relative to the circuit board 40. Furthermore, by draining moisture adhering to the circuit board 40 or the crimping portion 37 through the cutout portion 60, it is possible to prevent a short circuit between the bus bar 30 and the conductive path 43 due to moisture.

[0054] [Protector] The protector 70 is made of insulating synthetic resin. As shown in FIG. 2, the protector 70 extends in the left-right direction and holds the busbar unit 22 and the electric wires 21. Note that the protector 70 in the wiring module 20 is only shown in FIGS. 2 and 3. As shown in FIG. 3, the protector 70 has a busbar accommodating recess 71 that accommodates the busbar 30 therein. The busbar accommodating recess 71 is frame-shaped and has an opening (not shown) at its bottom. The busbar 30 is adapted to be connected to the electrode terminals 12A, 12B through this opening. Although not shown in detail, the busbar accommodating recess 71 has locking portions and the like that hold the busbar 30 in a positioned state.

[0055] As shown in Fig. 3, the protector 70 has an electric wire routing recess 72 in which the electric wires 21 are routed. The electric wire routing recess 72 is groove-shaped and extends in the left-right direction. An electric wire locking piece 72A is provided on the bottom wall of the electric wire routing recess 72. The electric wire locking piece 72A locks one or more electric wires 21 in the electric wire routing recess 72. The bus bar accommodating recess 71 and the electric wire routing recess 72 are connected in the front-rear direction by a groove-shaped connecting portion 73.

[0056] 3, the circuit board 40 of the busbar unit 22 is disposed with a gap between it and the protector 70, specifically, the wall portions that define the busbar accommodating recess 71 and the connecting portion 73. That is, there is a clearance between the circuit board 40 and the protector 70. This makes it difficult for the protector 70 to apply stress to the circuit board 40.

[0057] [Method for manufacturing the wiring module according to this embodiment] Next, an example of a method for manufacturing the wiring module 20 according to this embodiment will be described. First, the circuit board 40 is manufactured using printed wiring technology, and the chip fuse 47 and the metal piece 45A are soldered to the circuit board 40 by reflow soldering.

[0058] A circuit board 40 (see FIG. 8 ) on which chip fuses 47 and other components are mounted is fixed to the bus bar 30 with a rivet 54. A shaft 55 is inserted through the first fixing hole 34 of the bus bar 30 and the second fixing hole 50 of the circuit board 40, and the shaft 55 is crimped to form a lower head 56B. After the lower head 56B is formed, the vertical dimension of the shaft 55 of the rivet 54 is set to be the same as the sum of the vertical dimensions of the bus bar 30 and the circuit board 40 (see FIG. 7 ). When fixing the circuit board 40 to the bus bar 30, the positioning protrusion 36 of the bus bar 30 is positioned in the positioning recess 61, and the rising portion 37A is positioned in the first cutout 60A (see FIG. 10 ). This positions the circuit board 40 and the bus bar 30. Next, the metal piece 45A and the bus bar 30 are connected by welding. This completes the manufacture of the bus bar unit 22.

[0059] Next, the electric wire 21 is connected to the bus bar unit 22. The core wire 21A of the electric wire 21 is soldered to the electric wire land 46. After the electric wire 21 is soldered, the electric wire 21 is clamped between the crimping portion 37 and the fixing portion 48 (see FIG. 11). The bent portion 37B of the crimping portion 37 is bent to form the holding portion 38 and the position restricting portion 39. As shown in FIG. 6, the electric wire 21 is clamped between the holding portion 38 and the upper surface 40A of the fixing portion 48, and is fixed to the bus bar 30 and the circuit board 40. The position restricting portions 39 are provided on both the left and right sides of the electric wire 21, making it difficult for the electric wire 21 to come off from between the holding portion 38 and the fixing portion 48. In this embodiment, as shown in FIG. 5, the electric wire 21 is arranged along the upper surface 40A of the circuit board 40 from the electric wire land 46 to the fixing portion 48, so that the solder is less likely to crack when the electric wire 21 is fixed by the crimping portion 37.

[0060] Finally, the busbar unit 22 connected to the electric wires 21 is placed in the protector 70 (see FIGS. 2 and 3). The busbars 30 are accommodated in the busbar accommodating recesses 71. The circuit board 40 is arranged inside the busbar accommodating recesses 71 and the connecting portions 73 so as not to come into direct contact with the protector 70. The electric wires 21 are arranged inside the connecting portions 73 and the electric wire routing recesses 72. The electric wires 21 are fixed in the electric wire routing recesses 72 by the electric wire locking pieces 72A. This completes the manufacture of the wiring module 20.

[0061] In the above-described method for manufacturing the wiring module 20, the electric wire 21 is fixed by the crimping portion 37 after being soldered to the electric wire land 46, but the electric wire 21 may be soldered to the electric wire land 46 after being fixed by the crimping portion 37. In this case, the electric wire 21 is arranged along the upper surface 40A of the circuit board 40 from the electric wire land 46 to the fixing portion 48. Therefore, even if the electric wire 21 is fixed by the crimping portion 37, the core wire 21A of the electric wire 21 is unlikely to float on the electric wire land 46, making soldering easy (see FIG. 5 ).

[0062] In the manufacturing method of the wiring module 20 described above, the electric wires 21 may also be soldered to the circuit board 40 in the process of soldering the chip fuses 47 and the like to the circuit board 40, and then the circuit board 40 to which the electric wires 21 are connected may be fixed to the bus bar 30.

[0063] [Effects of the First Embodiment] According to the first embodiment, the following actions and effects are achieved. The wiring module 20 according to the first embodiment is a wiring module 20 that is attached to a plurality of energy storage elements 11 having electrode terminals 12A, 12B, and includes a plurality of busbar units 22 and electric wires 21 connected to the busbar units 22. The busbar units 22 include a busbar 30 connected to the electrode terminals 12A, 12B, a circuit board 40, and a fixing means 53 that fixes the circuit board 40 to the busbar 30. A conductive path 43 is routed on the circuit board 40. The conductive path 43 includes a connection land 45 that is electrically connected to the busbar 30 and an electric wire land 46 that is connected to the electric wire 21 by soldering. The busbar 30 has a crimping portion 37 that fixes the electric wire 21. The wiring module 20 is configured as follows:

[0064] With this configuration, the electric wire 21 is fixed by the crimped portion 37 and the circuit board 40, so that even if an external force is applied to the electric wire 21, the electrical connection between the electric wire 21 and the circuit board 40 is unlikely to be damaged.

[0065] In embodiment 1, the circuit board 40 has a fixing portion 48 that clamps and fixes the electric wire 21 together with the crimping portion 37, and the surface of the circuit board 40 on which the electric wire land 46 is formed is the first surface (upper surface 40A), and the fixing portion 48 contacts the electric wire 21 on the first surface.

[0066] With this configuration, the wire land 46 is formed on the first surface of the circuit board 40, and the fixing portion 48, which sandwiches and fixes the wire 21 together with the crimping portion 37, is in contact with the wire 21 on the first surface. This means that the wire 21 does not need to be bent between the wire land 46 and the fixing portion 48. Therefore, when the wire 21 is fixed by the crimping portion 37 and the fixing portion 48 after soldering the wire 21, solder cracking is suppressed. Furthermore, when the wire 21 is soldered after being fixed by the crimping portion 37 and the fixing portion 48, soldering is facilitated.

[0067] In the first embodiment, the circuit board 40 has a notch 60 disposed near the crimping portion 37 .

[0068] With this configuration, moisture adhering to the circuit board 40 can be drained through the cutout portion 60. Therefore, short-circuiting of the conductive path 43 due to moisture on the circuit board 40 is suppressed.

[0069] In the first embodiment, the crimping portion 37 is disposed inside the cutout portion 60 .

[0070] With this configuration, the notch 60 allows the bus bar 30 and the circuit board 40 to be positioned relative to each other.

[0071] The wiring module 20 according to the first embodiment further includes a protector 70 that holds the bus bar 30, and the circuit board 40 has a clearance between itself and the protector 70.

[0072] With this configuration, multiple bus bar units 22 can be handled collectively using protector 70. Furthermore, by providing a clearance between circuit board 40 and protector 70, circuit board 40 is less likely to receive stress from protector 70, which can prevent solder cracking.

[0073] In the first embodiment, the conductive path 43 includes a chip fuse 47 provided between the connection land 45 and the wire land 46 .

[0074] With this configuration, even if conductive paths 43 are short-circuited and an overcurrent occurs, the overcurrent can be restricted from flowing from energy storage elements 11 to conductive paths 43 .

[0075] In embodiment 1, the busbar 30 has a first fixing hole 34, the circuit board 40 has a second fixing hole 50, and the fixing means 53 is a rivet 54, which has a shaft portion 55 inserted into the first fixing hole 34 and the second fixing hole 50, and a head portion 56 formed at the end of the shaft portion 55 and having an outer diameter larger than the hole diameters of the first fixing hole 34 and the second fixing hole 50.

[0076] With this configuration, the circuit board 40 can be fixed to the bus bar 30 by the rivet 54 .

[0077] The wiring module 20 according to the first embodiment is a wiring module 20 for a vehicle that is electrically attached to a plurality of energy storage devices 11 mounted on a vehicle 1.

[0078] <Embodiment 2> A second embodiment of the present disclosure will be described with reference to Figs. 12 to 16. In a wiring module 120 of the second embodiment, the configurations of the crimped portion 137 of the bus bar 130 and the fixing portion 148 of the circuit board 140 are different from those of the first embodiment. Hereinafter, a description of the configuration and effects similar to those of the first embodiment will be omitted. The same reference numerals as those of the first embodiment are used to refer to the same components as those of the first embodiment.

[0079] 15 and 16, crimped portion 137 of bus bar 130 has a support portion 137C extending leftward from circuit board mounting portion 33 at the base end, a rising portion 137A rising upward from support portion 137C, and a bent portion 137B gently bending to the right. Crimped portion 137 is generally C-shaped when viewed from the front-to-rear direction.

[0080] 16, when the electric wire 21 is fixed, the bent portion 137B is bent so that the tip of the crimping portion 137 is disposed to the right of the electric wire 21. As shown in FIG. 13, when the electric wire 21 is fixed, the crimping portion 137 has a pressing portion 138 that presses the electric wire 21 and a position restricting portion 139 that restricts the electric wire 21 from coming out from between the pressing portion 138 and the circuit board 140. The position restricting portion 139 is made up of a first position restricting portion 139A on the base end side of the crimping portion 137 and a second position restricting portion 139B on the tip end side of the crimping portion 137.

[0081] 13, the circuit board 140 includes a fixing portion 148 that clamps and fixes the electric wire 21 together with the crimping portion 137. The fixing portion 148 is in contact with the electric wire 21 on the upper surface 40A (an example of the first surface) of the circuit board 140. That is, as shown in FIG. 12, the electric wire 21 is arranged so as to run along the upper surface 40A of the circuit board 140 from the fixing portion 148 to the electric wire land 46.

[0082] 13, the fixing portion 148 is in contact with the supporting portion 137C of the crimping portion 137 on the lower surface 40B (an example of the second surface) of the circuit board 140. Therefore, the fixing portion 148 is supported from below by the bus bar 30. Furthermore, the fixing portion 148 is arranged so as to be wound together with the electric wire 21 inside the crimping portion 137. That is, not only is the electric wire 21 sandwiched between the fixing portion 148 and the pressing portion 138, but the fixing portion 148 is also sandwiched between the supporting portion 137C and the electric wire 21. Therefore, it is easy to maintain the state in which the electric wire 21 is fixed by the crimping portion 137 and the fixing portion 148.

[0083] [Notch] As shown in Fig. 14, a notch 160 is provided in the outer edge of the left rear of the circuit board 140. The notch 160 is the same as the second notch 60B in the first embodiment (see Fig. 8). Note that the circuit board 140 does not have the first notch 60A (located to the right of the fixing portion 48) in the first embodiment. As shown in Fig. 13, the rise portion 137A of the crimping portion 137 is accommodated inside the notch 160.

[0084] [Effects of Embodiment 2] According to the second embodiment, the following actions and effects are achieved. In the second embodiment, circuit board 140 has a second surface (lower surface 40B) disposed on the opposite side of first surface (upper surface 40A), and fixing portion 148 contacts bus bar 130 (support portion 137C) on the second surface.

[0085] According to this configuration, fixing portion 148 is in contact with bus bar 130 on the second surface, and therefore fixing portion 148 can be supported by bus bar 130. Furthermore, the state in which electric wire 21 is fixed by crimping portion 137 and fixing portion 148 can be further stabilized.

[0086] <Embodiment 3> A third embodiment of the present disclosure will be described with reference to Figures 17 and 18. Hereinafter, a description of the same configurations, functions, and effects as those of the first and second embodiments will be omitted. The same reference numerals as those of the first and second embodiments are used to designate the same components.

[0087] 17, the wiring module 220 of the third embodiment includes the circuit board 40 of the first embodiment and the bus bar 130 of the second embodiment. Strictly speaking, when comparing the third embodiment with the second embodiment, there are slight differences in the length and bending of the crimped portion 137 of the bus bar 130, but the components are essentially the same and therefore no distinction is made between the two.

[0088] 18, in the third embodiment, a rising portion 137A is arranged inside the second cutout portion 60B. The tip of the crimping portion 137 can be housed inside the first cutout portion 60A.

[0089] 18, the fixing portion 48 is in contact with the support portion 137C of the crimping portion 137 on the lower surface 40B (an example of the second surface) of the circuit board 40. Therefore, the fixing portion 48 is supported from below by the support portion 137C. In addition, the crimping portion 137 and the fixing portion 48 make it easier to maintain the state in which the electric wire 21 is fixed.

[0090] <Other embodiments> (1) In the above embodiment, the fixing means 53 for fixing the circuit boards 40, 140 to the bus bars 30, 130 is the rivet 54, but this is not limited to this. For example, screws, adhesive, etc. may also be used as the fixing means. (2) In the above embodiment, the circuit boards 40 and 140 are configured to have chip fuses 47, but this is not limitative, and the circuit boards may be configured without chip fuses. (3) In the above-described embodiments, the wiring modules 20, 120, and 220 are configured to include the protector 70. However, the present invention is not limited to this, and the wiring modules may be configured without including a protector. [Explanation of symbols]

[0091] 1: Vehicle 2: Energy storage pack 3: PCU 4: Wire harness 10: Energy storage module 11: Energy storage element 12A,12B: Electrode terminal 20,120,220: Wiring module 21: Electric wire 21A: Core wire 21B: Insulation coating 22: Busbar unit 30,130: Busbar 33: Circuit board placement area 34: 1st fixing hole 35: Recess 36: Positioning protrusion 37,137: Crimping part 37A, 137A: Rising section 37B, 137B: Bent section 137C: Support part 38,138: Clamp 39,139: Position regulation part 39A,139A: 1st position regulation part 39B,139B: 2nd position regulation part 40,140: Circuit board 40A: Top 40B: Bottom surface 42: Insulating board 43: Conductive Path 45: Connection Land 45A: Small metal piece 46: Electric Wire Land 47: Chip fuse 48: Fixed part 50: 2nd fixing hole 51: First through hole 52: Second through hole 53: Fixing means 54: Rivet 55: Shaft 56: Head 56A: Upper head 56B: Lower head 57: Insulation hole 58: Drain hole 60: Notch 60A: First notch 60B: Second notch 61: Positioning recess 70: Protector 71: Busbar receiving recess 72: Wire routing recess 72A: Wire locking piece 73: Connection part S: Solder

Claims

1. A wiring module attached to a plurality of energy storage elements having electrode terminals, a plurality of busbar units; an electric wire connected to the bus bar unit, the bus bar unit includes a bus bar connected to the electrode terminal and a circuit board, Conductive paths are routed on the circuit board, the conductive path includes a connection land electrically connected to the bus bar and an electric wire land connected to the electric wire by soldering, the bus bar has a crimping portion for fixing the electric wire, The wiring module, wherein the electric wire is sandwiched between the crimping portion and the circuit board.

2. the circuit board includes a fixing portion that clamps and fixes the electric wire together with the crimping portion, The surface of the circuit board on which the wire lands are formed is designated as a first surface, The wiring module according to claim 1 , wherein the fixing portion is in contact with the electric wire at the first surface.

3. the circuit board has a second surface disposed opposite the first surface; The wiring module according to claim 2 , wherein the fixing portion is in contact with the bus bar on the second surface.

4. The wiring module according to claim 1 , wherein the circuit board has a notch disposed near the crimping portion.

5. The wiring module according to claim 4 , wherein the crimping portion is disposed inside the notch portion.

6. Further, a protector for holding the bus bar is provided, The wiring module according to claim 1 , wherein the circuit board has a clearance between the circuit board and the protector.

7. The wiring module according to claim 1 , wherein the conductive path includes a chip fuse provided between the connection land and the electric wire land.

8. The busbar unit includes a fixing means for fixing the circuit board to the busbar, the bus bar has a first fixing hole; the circuit board has a second fixing hole; The fastening means is a rivet, 8. The wiring module according to claim 1, wherein the rivet comprises a shaft portion inserted into the first fixing hole and the second fixing hole, and a head portion formed at the end of the shaft portion and having an outer diameter larger than the hole diameters of the first fixing hole and the second fixing hole.

9. The wiring module according to claim 1 , wherein the wiring module is for a vehicle and is electrically attached to the plurality of power storage devices mounted on the vehicle.

Citation Information

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