Indication device

Abstract

A display device according to one embodiment of the present invention comprises: a substrate; a plurality of pixel circuits arranged on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes arranged on the insulating layer and connected to the plurality of pixel circuits, respectively; an organic layer arranged on the plurality of first electrodes; a plurality of linear second electrodes arranged on the organic layer; a sensor region facing a sensor superposed on the substrate; a relay wiring arranged between the substrate and the insulating layer; and a first and a second connection part. At least one of the plurality of second electrodes has a first and a second line separated from each other via the sensor region in a plan view. The relay wiring is connected to the first line by the first junction and connected to the second line by the second junction.

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a display device. [Background technology]

[0002] In recent years, display devices using organic light-emitting diodes (OLEDs) as display elements have come into practical use. These display elements include a first electrode, a second electrode, and an organic layer disposed between these electrodes.

[0003] Various sensors may be arranged over a display area including multiple pixels. In this case, it may be necessary to apply a structure different from that of the rest of the display area to the sensor area facing the sensor or its vicinity so as not to interfere with sensing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5386554 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-135325 [Patent Document 3] Japanese Patent Application Laid-Open No. 2000-195677 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to improve the structure of a sensor area facing the sensor and its vicinity in a display device in which a sensor is arranged so as to overlap a display area. [Means for solving the problem]

[0006] A display device according to one embodiment includes a substrate, a plurality of pixel circuits disposed on the substrate, an insulating layer covering the plurality of pixel circuits, a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, an organic layer disposed on the plurality of first electrodes, a plurality of linear second electrodes disposed on the organic layer, a sensor region facing a sensor overlaid on the substrate, relay wiring disposed between the substrate and the insulating layer, and a first connection portion and a second connection portion. At least one of the plurality of second electrodes has a first line portion and a second line portion spaced apart by the sensor region in a plan view. The relay wiring is connected to the first line portion by the first connection portion and to the second line portion by the second connection portion.

[0007] A display device according to another embodiment includes a substrate, a plurality of pixel circuits disposed on the substrate, an insulating layer covering the plurality of pixel circuits, a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, an organic layer disposed on the plurality of first electrodes, a plurality of linear second electrodes disposed on the organic layer, and a sensor region facing a sensor overlaid on the substrate. The sensor region is a region that includes the substrate and the insulating layer but does not include at least one of the first electrodes and the pixel circuits. At least one of the plurality of second electrodes crosses the sensor region.

[0008] According to yet another embodiment, a display device includes a substrate, a plurality of pixel circuits disposed on the substrate, an insulating layer covering the plurality of pixel circuits, a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, an organic layer disposed on the plurality of first electrodes, a plurality of linear second electrodes disposed on the organic layer, a sensor region facing a sensor overlaid on the substrate, and a conductive covering layer covering the sensor region. The sensor region is a region that includes the substrate and the insulating layer but does not include at least one of the first electrodes and the pixel circuits. The covering layer is connected to at least one of the plurality of second electrodes. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a display device according to the first embodiment. [Figure 2] FIG. 2 is a diagram showing an example of a layout of sub-pixels according to the first embodiment. [Figure 3] FIG. 3 is a schematic cross-sectional view of the display device taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing an example of a layer structure that can be applied to the organic layer. [Figure 5] FIG. 5 is a schematic cross-sectional view of the division structure and its vicinity according to the first embodiment. [Figure 6] FIG. 6 is a schematic plan view of the second electrode, relay wiring, and sensor region according to the first embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view of the display device taken along line VII-VII in FIG. [Figure 8] FIG. 8 is a schematic plan view of a second electrode, a relay wiring, and a sensor region according to the second embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view of a first connection portion according to the third embodiment. [Figure 10] FIG. 10 is a schematic plan view of a second electrode, a relay wiring, and a sensor region according to the fourth embodiment. [Figure 11] FIG. 11 is a schematic cross-sectional view of the display device taken along line XI-XI in FIG. [Figure 12] FIG. 12 is a schematic cross-sectional view showing another example of a structure that can be applied to the first connection portion according to the fourth embodiment. [Figure 13] FIG. 13 is a schematic plan view showing an example of a configuration that can be applied to the relay wiring according to the fourth embodiment. [Figure 14] FIG. 14 is a schematic plan view showing another configuration that can be applied to the relay wiring according to the fourth embodiment. [Figure 15] FIG. 15 is a schematic plan view of a second electrode and a sensor region according to the fifth embodiment. [Figure 16]FIG. 16 is a schematic cross-sectional view of the display device taken along line XVI-XVI in FIG. [Figure 17] FIG. 17 is a schematic cross-sectional view of another example that can be applied to the display device according to the fifth embodiment. [Figure 18] FIG. 18 is a schematic plan view of a second electrode and a sensor region according to the sixth embodiment. [Figure 19] FIG. 19 is a schematic cross-sectional view of a display device according to the seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments will be described with reference to the drawings. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily make while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, the drawings may be schematic in width, thickness, shape, etc., compared to the actual embodiment for clarity of explanation, but these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each drawing, components that perform the same or similar functions as those described above with reference to the previous drawings are designated by the same reference numerals, and redundant detailed descriptions may be omitted as appropriate.

[0011] In addition, to facilitate understanding, the drawings show, where necessary, mutually orthogonal X-, Y-, and Z-axes. The direction along the X-axis is called the first direction, the direction along the Y-axis is called the second direction, and the direction along the Z-axis is called the third direction. The plane defined by the X- and Y-axes is called the XY plane, and the plane defined by the X- and Z-axes is called the XZ plane. Viewing the XY plane is called planar view.

[0012] The display device DSP according to this embodiment is an organic electroluminescence display device having organic light-emitting diodes (OLEDs) as display elements, and can be mounted in televisions, personal computers, in-vehicle devices, tablet terminals, smartphones, mobile phone terminals, and the like.

[0013] [First embodiment] 1 is a diagram showing an example of the configuration of a display device DSP according to the first embodiment. The display device DSP has a display area DA for displaying an image and a peripheral area SA outside the display area DA, on an insulating base material 10. The base material 10 may be glass or a flexible resin film.

[0014] The display area DA includes a plurality of pixels PX arranged in a matrix in the first direction X and the second direction Y. Each pixel PX includes a plurality of subpixels SP. In one example, the pixel PX includes a red subpixel SP1, a green subpixel SP2, and a blue subpixel SP3. Note that the pixel PX may include four or more subpixels, including subpixels of other colors such as white, in addition to the above three subpixels.

[0015] The subpixel SP includes a pixel circuit 1 and a display element 20 driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a drive transistor 3, and a capacitor 4. The pixel switch 2 and the drive transistor 3 are switching elements formed of, for example, thin film transistors.

[0016] In the pixel switch 2, the gate electrode is connected to the scanning line GL. One of the source electrode and drain electrode of the pixel switch 2 is connected to the signal line SL, and the other is connected to the gate electrode of the drive transistor 3 and the capacitor 4. In the drive transistor 3, one of the source electrode and drain electrode is connected to the power supply line PL and the capacitor 4, and the other is connected to the anode of the display element 20. A common voltage is supplied to the cathode of the display element 20. Note that the configuration of the pixel circuit 1 is not limited to the example shown in the figure.

[0017] The display element 20 is an organic light-emitting diode (OLED) that functions as a light-emitting element. For example, the subpixel SP1 includes a display element that emits light corresponding to a red wavelength, the subpixel SP2 includes a display element that emits light corresponding to a green wavelength, and the subpixel SP3 includes a display element that emits light corresponding to a blue wavelength. The configuration of the display element 20 will be described later.

[0018] The display device DSP further includes a sensor 5. The sensor 5 is disposed on the rear surface side of the substrate 10. As shown in the figure, the sensor 5 overlaps with the display area DA in a plan view. Hereinafter, the area of ​​the display area DA that overlaps with the sensor 5 will be referred to as a sensor area 50.

[0019] For example, the sensor 5 includes at least one of a camera, a sensor for detecting ambient light, a sensor for detecting the proximity of an object, and a sensor for detecting a fingerprint. The sensor 5 may also be another type of sensor. A plurality of sensors 5 may be arranged in positions overlapping the display area DA, and a plurality of sensor areas 50 corresponding to these sensors 5 may be arranged in the display area DA.

[0020] The display area DA is rectangular and has a first side S1, a second side S2, a third side S3, and a fourth side S4. The first side S1 and the second side S2 are parallel to the first direction X. The third side S3 and the fourth side S4 are parallel to the second direction Y. In the example of FIG. 1, the distance between the sensor area 50 and the first side S1 is smaller than the distance between the sensor area 50 and the second side S2. The distance between the sensor area 50 and the third side S3 is the same as the distance between the sensor area 50 and the fourth side S4. Note that the positions of the sensor 5 and the sensor area 50 shown in FIG. 1 are merely examples, and the sensor 5 and the sensor area 50 may be arranged in various other ways in the display area DA.

[0021] 2 is a diagram showing an example of the layout of subpixels SP1, SP2, and SP3. Here, attention is focused on four pixels PX. In each pixel PX, the subpixels SP1, SP2, and SP3 are arranged in this order in the first direction X. That is, in the display area DA, a column made up of a plurality of subpixels SP1 arranged in the second direction Y, a column made up of a plurality of subpixels SP2 arranged in the second direction Y, and a column made up of a plurality of subpixels SP3 arranged in the second direction Y are arranged alternately in the first direction X.

[0022] Ribs 14 are arranged at the boundaries between the subpixels SP1, SP2, and SP3. In the example of Fig. 2, the ribs 14 are in a lattice shape having portions located between the subpixels SP adjacent to each other in the first direction X and portions located between the subpixels SP adjacent to each other in the second direction Y. The ribs 14 form openings OP in each of the subpixels SP1, SP2, and SP3.

[0023] Separation structures SSa extending in the second direction Y are arranged between the subpixels SP1 and SP2, between the subpixels SP2 and SP3, and between the subpixels SP1 and SP3. That is, each separation structure SSa is located at the boundary between subpixels SP of different colors. For example, the separation structure SSa is linear and extends between both ends of the display area DA in the second direction Y.

[0024] Fig. 3 is a schematic cross-sectional view of the display device DSP taken along line III-III in Fig. 2. In Fig. 3, the driving transistor 3 and the display element 20 are shown as elements arranged in the subpixels SP1, SP2, and SP3, and other elements are not shown.

[0025] The display device DSP includes the above-mentioned base material 10, insulating layers 11, 12, and 13, the above-mentioned rib 14, the sealing layer 15, and the above-mentioned dividing structure SSa. The insulating layers 11, 12, and 13 are stacked in the third direction Z on the base material 10. For example, the insulating layers 11 and 12 are made of an inorganic material, and the insulating layer 13, the rib 14, and the sealing layer 15 are made of an organic material.

[0026] The driving transistor 3 includes a semiconductor layer 30 and electrodes 31, 32, and 33. The electrode 31 corresponds to a gate electrode. One of the electrodes 32 and 33 corresponds to a source electrode, and the other corresponds to a drain electrode. The semiconductor layer 30 is disposed between the substrate 10 and the insulating layer 11. The electrode 31 is disposed between the insulating layers 11 and 12. The electrodes 32 and 33 are disposed between the insulating layers 12 and 13, and are in contact with the semiconductor layer 30 through contact holes that penetrate the insulating layers 11 and 12.

[0027] In this manner, the drive transistor 3 is disposed on the substrate 10 and covered with the insulating layer 13. Other elements of the pixel circuit 1 shown in FIG. 1 are similarly disposed on the substrate 10 and covered with the insulating layer 13. Another insulating layer may be interposed between the pixel circuit 1 and the substrate 10.

[0028] The display element 20 includes a first electrode E1, an organic layer OR, and a second electrode E2. The first electrode E1 is an electrode disposed for each subpixel SP and may be referred to as a pixel electrode, a lower electrode, or an anode. The second electrode E2 is an electrode disposed in common to multiple subpixels SP or multiple display elements 20 and may be referred to as a common electrode, an upper electrode, or a cathode.

[0029] The ribs 14 are disposed on the insulating layer 13. The first electrode E1 is disposed on the insulating layer 13 and overlaps with the opening OP. The peripheral edge of the first electrode E1 is covered by the ribs 14. The first electrode E1 is electrically connected to the electrode 33 through a contact hole that penetrates the insulating layer 13. The first electrode E1 is formed of a metal material. However, the first electrode E1 may be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), or may be a laminate of a transparent conductive material and a metal material.

[0030] The organic layer OR covers the first electrode E1 and the ribs 14. The organic layer OR is in contact with the first electrode E1 through the opening OP. A portion of the organic layer OR is located on the ribs 14.

[0031] The second electrode E2 covers the organic layer OR. The second electrode E2 is made of a metal material. However, the second electrode E2 may also be made of a transparent conductive material such as ITO or IZO.

[0032] As will be described in detail later, in this embodiment, the dividing structure SSa is disposed on the rib 14. The sealing layer 15 covers the dividing structure SSa and the second electrode E2. The sealing layer 15 is formed to be thicker than, for example, the insulating layers 11, 12, and 13 and the rib 14, and protects the organic layer OR from moisture and the like and also flattens the unevenness caused by the rib 14.

[0033] 4 is a cross-sectional view showing an example of a layer configuration applicable to the organic layer OR. For example, the organic layer OR includes a first functional layer F1, an emitting layer EL, and a second functional layer F2 stacked in this order from the first electrode E1 to the second electrode E2.

[0034] When the potential of the first electrode E1 is relatively higher than the potential of the second electrode E2, the first electrode E1 corresponds to the anode and the second electrode E2 corresponds to the cathode. When the potential of the second electrode E2 is relatively higher than the potential of the first electrode E1, the second electrode E2 corresponds to the anode and the first electrode E1 corresponds to the cathode.

[0035] As an example, when the first electrode E1 corresponds to an anode, the first functional layer F1 includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer F2 includes at least one of an electron transport layer, an electron injection layer, and a hole blocking layer.

[0036] When a potential difference is generated between the first electrode E1 and the second electrode E2, the emitting layer EL emits light. In this embodiment, it is assumed that the emitting layers EL included in the organic layers OR of the subpixels SP1, SP2, and SP3 all emit light of the same color (e.g., white). In this case, for example, color filters corresponding to the colors of the subpixels SP1, SP2, and SP3 may be disposed above the sealing layer 15. Furthermore, layers containing quantum dots that are excited by the light emitted by the emitting layers EL to generate light of colors corresponding to the subpixels SP1, SP2, and SP3 may be disposed in the subpixels SP1, SP2, and SP3.

[0037] 5 is a schematic cross-sectional view of the dividing structure SSa and its vicinity. While this figure shows the structure of the boundary between subpixels SP1 and SP2, a similar structure can also be applied to the boundary between subpixels SP2 and SP3 or the boundary between subpixels SP1 and SP3.

[0038] The dividing structure SSa includes a partition wall PTa disposed on the upper surface 14a of the rib 14. The partition wall PTa has an upper portion Ua and a lower portion Ba located below the upper portion Ua. The lower portion Ba is in contact with the upper surface 14a. The first width W1a of the upper portion Ua is larger than the second width W2a of the lower portion Ba (W1a>W2a). The width of the partition wall PTa decreases stepwise between the upper portion Ua and the lower portion Ba. Such a shape of the partition wall PTa can also be called an overhang shape.

[0039] The organic layer OR and the second electrode E2 are separated by a separating structure SSa. That is, the organic layer OR overlapping the opening OP of the subpixel SP1 is separated from the organic layer OR overlapping the opening OP of the subpixel SP2, with a partition wall PTa interposed between these organic layers OR. Furthermore, the second electrode E2 overlapping the opening OP of the subpixel SP1 is separated from the second electrode E2 overlapping the opening OP of the subpixel SP2, with a partition wall PTa interposed between these second electrodes E2. In this way, separating the organic layers OR of the subpixels SP of different colors can suppress crosstalk between these subpixels SP.

[0040] An organic layer ORa and a conductive layer E2a covering the organic layer ORa are disposed on the partition wall PTa. The organic layer ORa is formed of the same material as the organic layer OR. The conductive layer E2a is formed of the same material as the second electrode E2. The organic layer ORa is spaced apart from the organic layers OR disposed in the subpixels SP1 and SP2. The conductive layer E2a is spaced apart from the second electrodes E2 disposed in the subpixels SP1 and SP2.

[0041] The organic layer OR and the second electrode E2 are formed over the entire display area DA by, for example, vacuum deposition. At this time, the material from the deposition source adheres to the upper surface of the partition wall PTa, forming the organic layer ORa and the conductive layer E2a. On the other hand, the material from the deposition source is less likely to adhere to the side surface of the partition wall PTa. This separates the organic layer OR from the organic layer ORa, and separates the second electrode E2 from the conductive layer E2a.

[0042] 6 is a schematic plan view of the second electrode E2 and the sensor region 50. In this embodiment, the sensor region 50 is a circular hole (sensor hole) that penetrates the substrate 10 and the layers (substrate 10, insulating layers 11, 12, 13, sealing layer 15, etc.) arranged on the substrate 10 shown in FIG. 3. As an example, the sensor region 50 has a diameter of several mm. Note that the shape of the sensor region 50 is not limited to a circular shape, and may be other shapes such as an oval or a rectangle.

[0043] The second electrodes E2 are linear (strip-shaped) extending in the second direction Y. For example, the second electrode E2 shown on the left side of Fig. 6 overlaps with multiple subpixels SP1 aligned in the second direction Y, the second leftmost second electrode E2 overlaps with multiple subpixels SP2 aligned in the second direction Y, and the third leftmost second electrode E2 overlaps with multiple subpixels SP3 aligned in the second direction Y. In this way, the second electrode E2 overlapping with the subpixel SP1, the second electrode E2 overlapping with the subpixel SP2, and the second electrode E2 overlapping with the subpixel SP3 are aligned in the first direction X in the display area DA.

[0044] Although not shown in Fig. 6, the above-mentioned dividing structure SSa (partition wall PTa) is disposed between adjacent second electrodes E2. In addition, an organic layer OR having substantially the same shape as the second electrode E2 is disposed below the second electrode E2 shown in Fig. 6.

[0045] One end of the second electrode E2 is located in the peripheral area SA on the first side S1 side of the display area DA. The other end of the second electrode E2 is located in the peripheral area SA on the second side S2 side of the display area DA. Both of these ends are connected to a power supply line FL, which is a supply source of a common voltage, through a connection part CP provided in the peripheral area SA.

[0046] Some of the multiple second electrodes E2 have a first line portion LP1 and a second line portion LP2 that are spaced apart via a sensor region 50. The first line portion LP1 is located closer to the first side S1 than the sensor region 50. The second line portion LP2 is located closer to the second side S2 than the sensor region 50. Both line portions LP1 and LP2 are connected to a power supply line FL by a connection portion CP.

[0047] A plurality of relay wirings RL are arranged around the sensor area 50, bypassing the sensor area 50. The relay wirings RL and the first line portion LP1 are connected by a first connection portion CP1. The relay wirings RL and the second line portion LP2 are connected by a second connection portion CP2. In the example of FIG. 6, the relay wirings RL are arc-shaped and follow the periphery of the sensor area 50.

[0048] The sensor region 50 is surrounded by subpixels SP1, SP2, and SP3. Dummy subpixels DP that do not emit light are arranged around the sensor region 50. For example, the dummy subpixels DP are subpixels among the regularly arranged subpixels SP1, SP2, and SP3 that partially overlap the sensor region 50. Further dummy subpixels DP may be arranged around the dummy subpixels DP that partially overlap the sensor region 50 in this manner. Both connection portions CP1 and CP2 are arranged in the dummy subpixels DP.

[0049] Note that the sizes of the sensor region 50, second electrode E2, relay wiring RL, subpixels SP1, SP2, SP3, and dummy subpixels DP shown in Fig. 6 are merely examples. Fig. 6 partially omits the second electrode E2 that is divided into line portions LP1 and LP2 by the sensor region 50, and the relay wiring RL that connects these line portions LP1 and LP2.

[0050] Fig. 7 is a schematic cross-sectional view of the display device DSP taken along line VII-VII in Fig. 6. In this figure, a simplified pixel circuit 1 is shown. The pixel circuit 1 is disposed between a substrate 10 and an insulating layer 13.

[0051] The relay wiring RL is disposed between the insulating layers 12 and 13. This example is not limiting, and the relay wiring RL may be disposed at another position between the base material 10 and the insulating layer 13, for example, between the insulating layers 11 and 12 or between the base material 10 and the insulating layer 11. For example, the relay wiring RL can be formed using the same material and the same process as any of the conductive layers that make up the pixel circuit 1. As an example, the relay wiring RL is formed using the same material and the same process as any of the electrodes 31, 32, and 33 shown in FIG. 3.

[0052] The first connection portion CP1 includes a contact hole CH that penetrates the insulating layer 13 and a conductive layer CL that is disposed on the insulating layer 13. Both the contact hole CH and the conductive layer CL are disposed in the dummy subpixel DP. The conductive layer CL is in contact with the relay wiring RL through the contact hole CH. The conductive layer CL is formed, for example, from the same material and by the same process as the first electrode E1.

[0053] The first line portion LP1 extends continuously across the subpixel SP1 and the dummy subpixel DP. The first line portion LP1 is in contact with the conductive layer CL, thereby establishing electrical continuity between the first line portion LP1 and the relay wiring RL via the conductive layer CL.

[0054] In the example of FIG. 7, the organic layer OR is not disposed in the dummy subpixels DP. Furthermore, the pixel circuits 1 are not disposed in the dummy subpixels DP. As another example, the organic layer OR may extend into the dummy subpixels DP, or the pixel circuits 1 may be disposed in the dummy subpixels DP. As described above, the sensor region 50, which is a hole, is a space in which no component is disposed, for example. As another example, the sensor region 50 may be filled with a transparent resin or the like.

[0055] The second connection portion CP2 has a structure similar to that of the first connection portion CP1. That is, the second connection portion CP2 includes a contact hole CH that penetrates the insulating layer 13 and a conductive layer CL that is disposed on the insulating layer 13. The second line portion LP2 and the relay wiring RL are connected via this conductive layer CL.

[0056] In the above-described embodiment, several second electrodes E2 have first line portions LP1 and second line portions LP2 spaced apart via the sensor region 50, and these line portions LP1, LP2 are connected by relay wiring RL that bypasses the sensor region 50. This allows the second electrodes E2 to be conductive from the first side S1 to the second side S2.

[0057] Even if the line portions LP1 and LP2 are not connected by the relay wiring RL, a common voltage is applied to the first line portion LP1 through the connection portion CP near the first side S1, and a common voltage is applied to the second line portion LP2 through the connection portion CP near the second side S2. However, for example, the vicinity of the end of the second line portion LP2 on the sensor region 50 side is far from the connection portion CP, and therefore the voltage drops, which may cause display defects in the subpixels SP near the sensor region 50. In contrast, if the line portions LP1 and LP2 are connected by the relay wiring RL as in this embodiment, good image display is possible even near the sensor region 50.

[0058] In this embodiment, the dividing structure SSa is disposed between adjacent second electrodes E2. In this case, even if an attempt is made to form a detour structure similar to the relay wiring RL in the second electrode E2, it is difficult to realize such a detour structure due to the dividing structure SSa. If the relay wiring RL is formed below the insulating layer 13 as in this embodiment, the relay wiring RL is not affected by the dividing structure SSa.

[0059] In this embodiment, the connection portions CP1 and CP2 between the relay wiring RL and the line portions LP1 and LP2 are arranged in the dummy subpixel DP, thereby suppressing the influence of the connection portions CP1 and CP2 on the display quality of the subpixels SP1, SP2, and SP3 around the sensor region 50.

[0060] Hereinafter, the display device DSP according to the second to seventh embodiments will be described. For configurations not specifically mentioned in each embodiment, the same configurations as those in the preceding embodiments can be applied.

[0061] [Second embodiment] The shape of the relay wiring RL is not limited to that disclosed in the first embodiment. In the second embodiment, other examples that can be applied to the relay wiring RL are disclosed.

[0062] 8 is a schematic plan view of the second electrode E2, relay wiring RL, and sensor region 50 according to this embodiment. The relay wiring RL is ring-shaped and surrounds the sensor region 50. Each first line portion L1 is connected to the relay wiring RL via a first connection portion CP1. Each second line portion L2 is connected to the relay wiring RL via a second connection portion CP2.

[0063] In this manner, in this embodiment, a single relay wiring RL connects a plurality of first line portions LP1 and a plurality of second line portions LP2. In this case, it is not necessary to arrange a plurality of relay wirings RL around the sensor area 50. Therefore, it is possible to reduce the space required for arranging the relay wirings RL.

[0064] [Third embodiment] The structures of the first connecting portion CP1 and the second connecting portion CP2 are not limited to those shown in Fig. 7. In the third embodiment, other examples that can be applied to these connecting portions CP1 and CP2 will be disclosed.

[0065] 9 is a schematic cross-sectional view of a first connection portion CP1 according to this embodiment. The first connection portion CP1 has a conductive layer CL and a contact hole CH. The conductive layer CL is disposed on an upper surface 14a of a rib 14 located between the subpixel SP1 and the dummy subpixel DP. A portion of the conductive layer CL is covered with an organic layer OR. The contact hole CH penetrates the insulating layer 13 and the rib 14. The conductive layer CL is in contact with a relay wiring RL through the contact hole CH.

[0066] The first connection portion CP1 further includes a dividing structure SSb. In the example of FIG. 9, the dividing structure SSb is a partition wall PTb arranged on the conductive layer CL. The partition wall PTb has an upper portion Ub and a lower portion Bb located below the upper portion Ub. The lower portion Bb is in contact with the conductive layer CL. The first width W1b of the upper portion Ub is larger than the second width W2b of the lower portion Bb (W1b>W2b). The width of the partition wall PTb gradually decreases from the upper portion Ub toward the lower portion Bb. Such a shape of the partition wall PTb can also be called an inverse tapered shape.

[0067] The partition wall PTb separates the organic layer OR from the second electrode E2 (first line portion LP1) in the same manner as the partition wall PTa described above. Similar to the organic layer ORa and the conductive layer E2a shown in FIG. 5, an organic layer ORb made of the same material as the organic layer OR and a conductive layer E2b made of the same material as the second electrode E2 are disposed on the partition wall PTb.

[0068] Because the organic layer OR is divided by the partition wall PTb, an exposed area EA that is exposed from the organic layer OR is formed on the upper surface of the conductive layer CL. The first line portion LP1 is in contact with the conductive layer CL through the exposed area EA. This allows the first line portion LP1 and the relay wiring RL to be electrically connected via the conductive layer CL.

[0069] The second connection portion CP2 has a structure similar to that of the first connection portion CP1. That is, the second connection portion CP2 includes a contact hole CH, a conductive layer CL, and a separating structure SSb. The second line portion LP2 is in contact with the conductive layer CL through the exposed area EA formed by the separating structure SSb.

[0070] The configuration of the connecting parts CP1 and CP2 in this embodiment can exhibit high resistance to moisture penetration from the sensor region 50. That is, in the example of FIG. 9, an organic layer OR is also disposed in the dummy subpixel DP, and an end of this organic layer OR is exposed to the sensor region 50. Even if moisture penetrates from this end, the organic layer OR of the dummy subpixel DP and the organic layer OR of the subpixel SP1 are separated by the separating structure SSb, so that the moisture is unlikely to reach the organic layer OR of the subpixel SP1. This makes it possible to suppress degradation of the display quality of the subpixel SP.

[0071] The dividing structure SSb is not limited to that shown in Fig. 9. For example, the partition wall PTb, which is an example of the dividing structure SSb, may have an overhang shape similar to the partition wall PTa shown in Fig. 5. The dividing structure SSb may also be a trench (groove) provided in the rib 14. For example, if a trench is formed with a shape in which the width at the top is smaller than the width at the bottom, the organic layer OR formed by vapor deposition on the rib 14 can be divided by the trench.

[0072] The dividing structure SSa is not limited to that shown in Fig. 5. For example, the partition wall PTa, which is an example of the dividing structure SSa, may have an inverted tapered shape similar to the partition wall PTb shown in Fig. 9. Furthermore, the dividing structure SSa may be a trench provided in the rib 14.

[0073] [Fourth embodiment] 10 is a schematic plan view of the second electrode E2, relay wiring RL, and sensor region 50 according to the fourth embodiment. In the first embodiment, it is assumed that the sensor region 50 is a hole. In this embodiment, the base material 10, insulating layers 11, 12, and 13, and sealing layer 15 are also arranged in the sensor region 50. It is preferable that the base material 10, insulating layers 11, 12, and 13, and sealing layer 15 have high light transmittance so as not to interfere with sensing by the sensor 5. For example, the sensor region 50 does not have a rib 14 or a separating structure SSa.

[0074] For example, the sensor region 50 is a region that does not include at least one of the first electrode E1 and the pixel circuit 1. The sensor region 50 can also be said to be a region that does not include the subpixels SP. Such a sensor region 50 has a higher light transmittance than the surrounding region where the subpixels SP are arranged. This makes it less likely that sensing by the sensor 5 will be hindered.

[0075] 10, as in the above-described embodiments, the first line portion LP1 and the second line portion LP2 are connected by a relay wiring RL. The relay wiring RL crosses the sensor area 50. The relay wiring RL connects one first line portion LP1 and one second line portion LP2.

[0076] 11 is a schematic cross-sectional view of the display device DSP taken along line XI-XI in FIG. 10. The sensor region 50 includes a substrate 10, insulating layers 11, 12, and 13, and a sealing layer 15. The relay wiring RL is disposed between the insulating layers 12 and 13. This example is not limiting, and the relay wiring RL may be disposed at another position between the substrate 10 and the insulating layer 13, for example, between the insulating layers 11 and 12 or between the substrate 10 and the insulating layer 11. The first connection portion CP1 includes a contact hole CH and a conductive layer CL, similar to the example shown in FIG. 7.

[0077] 12 is a schematic cross-sectional view showing another example of a structure applicable to the first connection portion CP1. This first connection portion CP1 has a separating structure SSb, similar to the example shown in FIG. 9. The first line portion LP1 is in contact with the conductive layer CL through an exposed area EA formed by the separating structure SSb. Either of the structures shown in FIG. 11 or FIG. 12 can also be applied to the second connection portion CP2.

[0078] 13 is a schematic plan view showing an example of a configuration applicable to the relay wiring RL. The relay wiring RL is configured, for example, with a mesh-like metal wire. If the relay wiring RL has such a configuration, the transmittance of the sensor region 50 can be increased, and the relay wiring RL is less likely to interfere with sensing by the sensor 5.

[0079] 14 is a schematic plan view showing another configuration that can be applied to the relay wiring RL. In the example shown in this figure, the relay wiring RL, which is made of mesh-like metal wires, has a circular shape that overlaps the entire sensor area 50. The relay wiring RL connects a plurality of first line portions LP1 and a plurality of second line portions LP2.

[0080] The relay wiring RL is not limited to a mesh shape. As another example, the relay wiring RL may be formed of a transparent conductive material such as ITO. In this case, the relay wiring RL may be in a strip shape connecting one first line portion LP1 and one second line portion LP2. Furthermore, the relay wiring RL may be shaped so as to overlap the entire sensor region 50 and connect a plurality of first line portions LP1 and a plurality of second line portions LP2. Even when the relay wiring RL is formed of a transparent conductive material, the transmittance of the sensor region 50 can be increased.

[0081] [Fifth embodiment] 15 is a schematic plan view of a second electrode E2 and a sensor region 50 according to the fifth embodiment. As in the fourth embodiment, the sensor region 50 is not a hole, but is formed by arranging a base material 10, insulating layers 11, 12, and 13, a sealing layer 15, and the like.

[0082] In this embodiment, the second electrode E2 crosses the sensor region 50 without the relay wiring RL. For example, the width of the second electrode E2 is constant from the end on the first side S1 side to the end on the second side S2 side. As another example, the width of the second electrode E2 in the sensor region 50 may be different from the width of the second electrode E2 outside the sensor region 50. The shape of the portion of the second electrode E2 that overlaps with the sensor region 50 may be a mesh shape as shown in FIG. 13.

[0083] In order to form the second electrode E2 that crosses the sensor region 50, the ribs 14 and the dividing structure SSa may also be arranged in the sensor region 50. In this way, by depositing the material of the second electrode E2 over the entire display region DA including the sensor region 50, the second electrode E2 that crosses the sensor region 50 can be formed as shown in FIG.

[0084] Fig. 16 is a schematic cross-sectional view of the display device DSP taken along line XVI-XVI in Fig. 15. In the sensor region 50, the second electrode E2 is disposed on the insulating layer 13 and covered with the sealing layer 15. No organic layer OR is disposed in the sensor region 50. An end of the organic layer OR is located on, for example, a rib 14 close to the sensor region 50.

[0085] 17 is a schematic cross-sectional view of another example that can be applied to the display device DSP. In the example of this figure, an organic layer OR is also disposed in the sensor region 50. In the sensor region 50, the organic layer OR is located between the insulating layer 13 and the second electrode E2.

[0086] If the second electrode E2 is formed so as to cross the sensor region 50 as in the present embodiment, there is no need to provide the relay wiring RL or the connecting parts CP1 and CP2. Therefore, the manufacturing process of the display device DSP is simplified compared to the above-described embodiments.

[0087] [Sixth embodiment] 18 is a schematic plan view of a second electrode E2 and a sensor region 50 according to the sixth embodiment. As in the fourth and fifth embodiments, the sensor region 50 is not a hole, but rather includes a substrate 10, insulating layers 11, 12, and 13, a sealing layer 15, and the like.

[0088] 18, a conductive covering layer CV is disposed to cover the sensor region 50. The covering layer CV has, for example, the same circular shape as the sensor region 50 and overlaps the entire sensor region 50. The covering layer CV may have a shape larger than the sensor region 50. Alternatively, the covering layer CV may have a shape that covers only a portion of the sensor region 50.

[0089] The covering layer CV is connected to a plurality of second electrodes E2. The covering layer CV can be formed of the same material and by the same process as the second electrodes E2. In this case, the separating structure SSa is not arranged in the sensor region 50.

[0090] The cross-sectional structure including the coating layer CV is similar to, for example, the example in FIG. 16. That is, the coating layer CV is located between the insulating layer 13 and the sealing layer 15 in the sensor region 50. The cross-sectional structure including the coating layer CV may be similar to the example in FIG. 17. In this case, the organic layer OR is interposed between the coating layer CV and the insulating layer 13. For example, the organic layer OR has the same planar shape as the coating layer CV in the sensor region 50.

[0091] For example, when the relay wiring RL crosses the sensor region 50 as in the example of Fig. 10, when the relay wiring RL is in a mesh shape overlapping the sensor region 50 as in the example of Fig. 14, or when the second electrode E2 crosses the sensor region 50 as in the example of Fig. 15, diffraction of light due to the relay wiring RL and the second electrode E2 may occur, affecting sensing by the sensor 5. Furthermore, when the sensor 5 is a camera, ghosting due to the relay wiring RL and the second electrode E2 may occur. In contrast, a configuration in which a covering layer CV is provided to cover the sensor region 50 can suppress the occurrence of diffraction and ghosting.

[0092] [Seventh embodiment] In the above-described embodiments, it is assumed that the emitting layers EL included in the organic layers OR of the subpixels SP1, SP2, and SP3 all emit light of the same color. In the present embodiment, it is assumed that the emitting layers EL included in the organic layers OR of the subpixels SP1, SP2, and SP3 emit light of different colors.

[0093] 19 is a schematic cross-sectional view of a display device DSP according to a seventh embodiment. While this figure shows the structure of the boundary between subpixels SP1 and SP2, a similar structure can also be applied to the boundary between subpixels SP2 and SP3 or the boundary between subpixels SP1 and SP3. The shape of the dividing structure SSa (partition wall PTa) shown in FIG. 19 is the same as that of the example in FIG. 5.

[0094] In the example of Figure 19, an organic layer OR1 is disposed in the subpixel SP1, and an organic layer OR2 is disposed in the subpixel SP2. The organic layer OR1 includes an emitting layer EL that emits, for example, red light. The organic layer OR2 includes an emitting layer EL that emits, for example, green light. Although not shown in the cross section of Figure 19, the organic layer OR disposed in the subpixel SP3 includes an emitting layer EL that emits blue light.

[0095] The organic layer OR1 covers the first electrode E1 of the subpixel SP1 through the opening OP, and also covers a portion of the rib 14 closer to the subpixel SP1 than the partition wall PTa. The organic layer OR2 covers the first electrode E1 of the subpixel SP2 through the opening OP, and also covers a portion of the rib 14 closer to the subpixel SP2 than the partition wall PTa.

[0096] Organic layers OR1a and OR2a and a conductive layer E2a covering the organic layers OR1a and OR2a are disposed on the partition wall PTa. The organic layer OR1a is formed of the same material as the organic layer OR1. The organic layer OR2a is formed of the same material as the organic layer OR2. The conductive layer E2a is formed of the same material as the second electrode E2. The organic layer OR1a is spaced apart from the organic layer OR1. The organic layer OR2a is spaced apart from the organic layer OR2. In the example of FIG. 19, a portion of the organic layer OR1a is covered by the organic layer OR2a.

[0097] The organic layer OR1 is formed by vacuum deposition using a mask with an opening in the shape of the subpixel SP1. At this time, the material from the deposition source is deposited on the upper surface of the partition wall PTa, thereby forming the organic layer OR1a. After the formation of the organic layer OR1, the organic layer OR2 is formed by vacuum deposition using a mask with an opening in the shape of the subpixel SP2. At this time, the material from the deposition source is deposited on the upper surface of the partition wall PTa, thereby forming the organic layer OR2a.

[0098] The configuration of this embodiment can be applied to any of the above-described embodiments. For example, when a covering layer CV is disposed in the sensor region 50 as shown in Fig. 18, the organic layers OR1 and OR2 and the organic layer OR of the subpixel SP3 may be disposed under the covering layer CV.

[0099] All display devices that can be implemented by a person skilled in the art by appropriately modifying the design based on the display devices described above as embodiments of the present invention also fall within the scope of the present invention as long as they include the gist of the present invention.

[0100] Within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications, and these modifications are also understood to fall within the scope of the present invention. For example, even if a person skilled in the art appropriately adds or deletes components or modifies the design of the above-described embodiment, or adds or omits steps or modifies conditions, these modifications are also included within the scope of the present invention as long as they maintain the gist of the present invention.

[0101] Furthermore, with regard to other effects brought about by the aspects described in the above embodiments, those that are clear from the description in this specification or that can be appropriately thought of by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0102] DSP...display device, PX...pixel, SP...subpixel, DP...dummy subpixel, E1...first electrode, E2...second electrode, OR...organic layer, SSa, SSb...separation structure, RL...relay wiring, CP1...first connection portion, CP2...second connection portion, 1...pixel circuit, 5...sensor, 13...insulating layer, 14...rib, 20...display element, 50...sensor area.

Claims

1. A substrate, a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, respectively; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor area facing a sensor overlaid on the base material; a relay wiring disposed between the base material and the insulating layer; a first connection portion and a second connection portion, At least one of the plurality of second electrodes has a first line portion and a second line portion that are spaced apart from each other across the sensor region in a plan view, the relay wiring is connected to the first line portion by the first connection portion and to the second line portion by the second connection portion; the sensor region is a region that includes the base material and the insulating layer but does not include at least one of the first electrode and the pixel circuit, The relay wiring is composed of a mesh-like metal wire that crosses the sensor area. Display device.

2. A substrate, a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, respectively; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor area facing a sensor overlaid on the base material; a relay wiring disposed between the base material and the insulating layer; a first connection portion and a second connection portion, At least one of the plurality of second electrodes has a first line portion and a second line portion that are spaced apart from each other across the sensor region in a plan view, the relay wiring is connected to the first line portion by the first connection portion and to the second line portion by the second connection portion; Each of the first connection portion and the second connection portion is a contact hole penetrating the insulating layer; a conductive layer disposed on the insulating layer and connected to the relay wiring through the contact hole; Equipped with the first line portion contacts the conductive layer of the first connection portion; the second line portion contacts the conductive layer of the second connection portion; the conductive layer of each of the first connection portion and the second connection portion is covered with the organic layer; each of the first connection portion and the second connection portion further includes a dividing structure that divides the organic layer to form an exposed region in which a portion of the conductive layer is exposed from the organic layer; the first line portion contacts the conductive layer of the first connection portion through the exposed region formed by the dividing structure of the first connection portion; the second line portion is in contact with the conductive layer of the second connection portion through the exposed region formed by the dividing structure of the second connection portion. Display device.

3. the sensor region is a hole penetrating the substrate and the insulating layer; The display device according to claim 2 .

4. further comprising a sealing layer covering the second electrode; The hole penetrates the sealing layer. The display device according to claim 3 .

5. the sensor area is circular; the relay wiring has an arc shape that follows the periphery of the sensor area; The display device according to claim 2 .

6. the dividing structure includes a partition wall disposed on the conductive layer; The partition wall has an upper portion with a first width and a lower portion with a second width smaller than the first width. The display device according to claim 2 .

7. further comprising a rib disposed on the insulating layer; the contact hole penetrates the insulating layer and the rib. The display device according to claim 2 .

8. further comprising a plurality of dummy sub-pixels that do not emit light and are arranged around the sensor region; The display device according to claim 2 .

9. the first connection portion and the second connection portion are disposed in the dummy subpixel; The display device according to claim 8 .

10. the sensor includes at least one of a camera, a sensor for detecting ambient light, a sensor for detecting proximity of an object, and a sensor for detecting a fingerprint; The display device according to any one of claims 1 to 9.

11. A substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, respectively; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor area facing a sensor overlaid on the base material; the sensor region is a region that includes the base material and the insulating layer but does not include at least one of the first electrode and the pixel circuit, At least one of the plurality of second electrodes crosses the sensor area; the organic layer is disposed between the second electrode and the insulating layer in the sensor region; Display device.

12. A substrate; a plurality of pixel circuits disposed on the substrate; an insulating layer covering the plurality of pixel circuits; a plurality of first electrodes disposed on the insulating layer and connected to the plurality of pixel circuits, respectively; an organic layer disposed on the plurality of first electrodes; a plurality of linear second electrodes disposed on the organic layer; a sensor area facing a sensor overlaid on the base material; a conductive covering layer covering the sensor area; the sensor region is a region that includes the base material and the insulating layer but does not include at least one of the first electrode and the pixel circuit, the covering layer is connected to at least one of the plurality of second electrodes; Display device.

13. the organic layer is disposed between the covering layer and the insulating layer in the sensor region; The display device according to claim 12.

14. The covering layer covers the entire sensor area. The display device according to claim 12.

15. the sensor area and the covering layer are circular; The display device according to claim 14.

Images