Hardening components

Abstract

The present application provides a curable composition or thermal interface material having low density and high thermal conductivity while exhibiting low adhesive strength to a predetermined adherend, and a curable composition or thermal interface material that ensures excellent flame retardancy without using halogen flame retardants and phosphorus-based flame retardants or, if used, minimizes the usage ratio thereof, and exhibits dischargeability and thixotropy suitable for processing.

Description

[Technical Field]

[0001] Cross-reference to related applications This application claims the benefit of priority based on Korean Patent Application No. 10-2021-0129972 filed on September 30, 2021, and Korean Patent Application No. 10-2022-0117998 filed on September 19, 2022, and all contents disclosed in the documents of said Korean patent applications are incorporated herein by reference. Technical Field This application relates to curable compositions, thermal interface materials (TIMs), and uses thereof. [Background technology]

[0002] With the increase in electric or electronic devices that require heat management, such as batteries, the importance of heat dissipation materials such as TIM (Thermal Interface Material) is increasing. Various types of heat dissipation materials are known. One conventional heat dissipation material is a material in which a resin binder is filled with a heat dissipation filler (for example, Patent Document 1). In the heat dissipating material as described above, silicone resin, polyolefin resin, acrylic resin, epoxy resin, or the like is usually used as the resin binder.

[0003] A heat dissipation material is basically required to have excellent thermal conductivity, and additional functions are required depending on the application. For example, depending on the application, a heat dissipation material is required to have high thermal conductivity as well as low adhesive strength to a specific adherend. For example, if a part in a product that comes into contact with the heat dissipation material needs to be replaced, or if the position of the heat dissipation material needs to be changed during processing, the heat dissipation material needs to exhibit low adhesive strength.

[0004] Among known heat dissipation materials, materials that exhibit low adhesive strength include those that use silicone resin as a resin binder. However, silicone resin is relatively expensive. Furthermore, silicone resin contains components that can cause contact failure when applied to electronic / electrical products, limiting its applications.

[0005] The polyurethane material used in Patent Document 1 can be used to form a heat-dissipating material with high thermal conductivity and has various other advantages, but it is also a material that exhibits high adhesive strength to most adherends.

[0006] One way to reduce the adhesive strength of materials that exhibit high adhesive strength is to incorporate a component known as a plasticizer. However, the plasticizers incorporated in large amounts to control adhesive strength have problems such as impairing the inherent advantages of the material itself and leaching out during use.

[0007] Heat dissipating materials may be required to be flame retardant to ensure safety against fires that may occur in electrical appliances, electronic products, batteries, etc. One method for ensuring flame retardancy is to incorporate ingredients known as flame retardants.

[0008] The flame retardant must have good compatibility with the raw materials and further additives, not affect the mechanical properties of the final product, and, taking into account the usage environment, minimize the generation of toxic gases.

[0009] As the flame retardant, a flame retardant containing a halogen element (so-called halogen flame retardant, for example, a bromine-based flame retardant) may be used. Although the halogen-containing flame retardant can ensure excellent flame retardancy, it has problems such as being corrosive when burned, affecting the mechanical properties of the final product, and being harmful to the human body, as well as releasing dioxin, which is an environmentally hazardous substance.

[0010] In addition, a flame retardant containing phosphorus (P) (so-called phosphorus-based flame retardant) may be used as the flame retardant. The phosphorus-containing flame retardant is less toxic than the halogen-containing flame retardant and can ensure excellent flame retardancy, but is known to be expensive and to have problems with reduced heat dissipation. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] Korean Patent Publication No. 10-2016-0105354 Summary of the Invention [Problem to be solved by the invention]

[0012] The present application aims to provide a curable composition, a thermal interface material (TIM), and uses thereof. The thermal interface material may be formed by curing the curable composition. One object of the present application is to provide the curable composition or thermal interface material, etc., with low density and high thermal conductivity while exhibiting low adhesive strength to a predetermined substrate.

[0013] Another object of the present invention is to ensure excellent flame retardancy without using halogen flame retardants and phosphorus-based flame retardants or by minimizing their use ratio, and to exhibit dischargeability and thixotropy suitable for processing.

[0014] Another object of the present application is to provide a product comprising the curable composition, a cured product of the curable composition, or a thermal interface material. [Means for solving the problem]

[0015] In the present application, when a physical property is affected by the measurement temperature, the physical property is measured at room temperature unless otherwise specified.

[0016] The term "room temperature" used in this application refers to a natural temperature without heating or cooling, and may mean, for example, any one temperature within a range of 10°C to 30°C, such as a temperature of about 15°C or higher, about 18°C ​​or higher, about 20°C or higher, about 23°C or higher, about 27°C or lower, or 25°C. Unless otherwise specified in this application, the unit of temperature is Celsius (°C).

[0017] In the present application, when a physical property is affected by measurement pressure, the physical property is measured at normal pressure unless otherwise specified. The term "normal pressure" used in this application refers to natural pressure that is neither increased nor decreased, and generally refers to atmospheric pressure within the range of approximately 700 mmHg to 800 mmHg.

[0018] The term a to b used in this application includes a and b and means within the range between a and b. For example, including a to b parts by weight is the same as including within the range of a to b parts by weight.

[0019] The term "relative humidity" used in this application is the percentage (%) of the amount of water vapor currently contained in a unit volume of air relative to the maximum saturated water vapor pressure that a unit volume of air can contain, and can be expressed as RH%.

[0020] The term weight average molecular weight (M w ) can be measured using GPC (Gel permeation chromatography), and specifically, can be measured by the following physical property measurement method. Furthermore, the term polydispersity index PDI (polydispersity index) used in this application is a measure of the weight average molecular weight (M w ) to the number average molecular weight (M n ) divided by (M w / M n ) and means the molecular weight distribution of the polymer. n) can also be measured using GPC (gel permeation chromatography) as needed.

[0021] The term "excellent thermal conductivity" as used herein may mean that when a curable composition is prepared into a cured product (sample) having a diameter of 2 cm or more and a thickness of 5 mm and the cured product (sample) is measured along the thickness direction of the sample according to ASTM D5470 or ISO 22007-2, the measured thermal conductivity is about 2.0 W / mK or more, 2.1 W / mK or more, 2.2 W / mK or more, 2.3 W / mK or more, 2.4 W / mK or more, 2.5 W / mK or more, 2.6 W / mK or more, 2.7 W / mK or more, 2.8 W / mK or more, 2.9 W / mK or more, or 3.0 W / mK or more.

[0022] The term "low specific gravity" or "low specific gravity" as used in this application may mean that the specific gravity of a curable composition, a cured product of the curable composition, a filler, etc., measured at room temperature is 3 or less.

[0023] The term "high specific gravity" or "high specific gravity" as used herein may refer to a curable composition, a cured product of the curable composition, a filler, etc., whose specific gravity measured at room temperature exceeds 3.

[0024] The term "excellent flame retardancy" used in this application may mean that the result of evaluation according to the following physical property measurement method (UL94V) is V-0 or higher.

[0025] The term viscosity used in this application may be a value measured at 25°C unless otherwise specified, and specifically, it can be measured by the following physical property measurement method.

[0026] The term "substantially free of a specific substance" used in this application means that the specific substance is not intentionally included. However, if the specific substance is naturally included, unless otherwise specified, it can be said to be substantially free if it is contained in an amount of 0.1 wt % or less, 0.05 wt % or less, or 0.01 wt % or less based on the total weight.

[0027] The term "substituted" as used in the present application means that a hydrogen atom bonded to a carbon atom of a compound is replaced with another substituent, and the position of the substitution is not particularly limited as long as it is a position at which a hydrogen atom is substituted, i.e., a position at which a substituent can be substituted, and when two or more substituents are substituted, the substituents may be the same or different from each other.

[0028] The term halogen or halogen element as used in this application means a Group 17 element of the periodic table, and in this application may specifically mean the group of Group 17 elements consisting of chlorine (Cl), iodine (I), bromine (Br), and fluorine (F).

[0029] As used herein, the term "substituent" refers to an atom or group of atoms replacing one or more hydrogen atoms on a hydrocarbon parent chain, and includes, but is not limited to, those described below, which may be further substituted with, or unsubstituted by, any of the substituents described below, unless otherwise specified in this application.

[0030] Unless otherwise specified, the term alkyl or alkylene group used in this application may be a straight-chain or branched alkyl or alkylene group having 1 to 20 carbon atoms, or 1 to 16 carbon atoms, or 1 to 12 carbon atoms, or 1 to 8 carbon atoms, or 1 to 6 carbon atoms, or a cyclic alkyl or alkylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, the cyclic alkyl or alkylene group includes an alkyl or alkylene group consisting of only a ring structure and an alkyl or alkylene group containing a ring structure. For example, a cyclohexyl group and a methylcyclohexyl group are both cyclic alkyl groups. In addition, for example, The alkyl or alkylene group is specifically methyl(ylene), ethyl(ylene), n-propyl(ylene), isopropyl(ylene), n-butyl(ylene), isobutyl(ylene), tert-butyl(ylene), sec-butyl(ylene), 1-methyl-butyl(ylene), 1-ethyl-butyl(ylene), n-pentyl(ylene), isopentyl(ylene), neopentyl(ylene), tert-pentyl(ylene), n-hexyl(ylene), 1-methylpentyl(ylene), 2-methylpentyl(ylene), 4-methyl-2-pentyl(ylene), 3,3-dimethyl Examples of olefins include, but are not limited to, butyl(ylene), 2-ethylbutyl(ylene), n-heptyl(ylene), 1-methylhexyl(ylene), n-octyl(ylene), tert-octyl(ylene), 1-methylheptyl(ylene), 2-ethylhexyl(ylene), 2-propylpentyl(ylene), n-nonyl(ylene), 2,2-dimethylheptyl(ylene), 1-ethylpropyl(ylene), 1,1-dimethylpropyl(ylene), isohexyl(ylene), 2-methylpentyl(ylene), 4-methylhexyl(ylene), and 5-methylhexyl(ylene).Specific examples of the cycloalkyl group or cycloalkylene group include cyclopropyl(ylene), cyclobutyl(ylene), cyclopentyl(ylene), 3-methylcyclopentyl(ylene), 2,3-dimethylcyclopentyl(ylene), cyclohexyl(ylene), 3-methylcyclohexyl(ylene), 4-methylcyclohexyl(ylene), 2,3-dimethylcyclohexyl(ylene), 3,4,5-trimethylcyclohexyl(ylene), 4-tert-butylcyclohexyl(ylene), cycloheptyl(ylene), and cyclooctyl(ylene), but are not limited to these.

[0031] Unless otherwise specified, the term alkenyl group or alkenylene group used in this application may be a straight-chain or branched-chain acyclic alkenyl group or alkenylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms; or a cyclic alkenyl group or alkenylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, if an alkenyl group or alkenylene group having a ring structure is included, it corresponds to a cyclic alkenyl group or alkenylene group. Also, for example, ethenyl(ren), n-propenyl(ren), isopropenyl(ren), n-butenyl(ren), isobutenyl(ren), tert-butenyl(ren), sec-butenyl(ren), 1-methyl-butenyl(ren), 1-ethyl-butenyl(ren), n-pentenyl(ren), isopentenyl(ren), neopentenyl(ren), tert-pentenyl(ren), n-hexenyl(ren), 1-methylpentenyl(ren), 2-methylpentenyl(ren), 4-methyl-2-pentenyl(ren), 3,3-dimethylbutenyl(ren), 2-ethyl-2-pent ... Examples include, but are not limited to, thylbutenyl(ren), n-heptenyl(ren), 1-methylhexenyl(ren), n-octenyl(ren), tert-octenyl(ren), 1-methylheptenyl(ren), 2-ethylhexenyl(ren), 2-propylpentenyl(ren), n-nonylenyl(ren), 2,2-dimethylheptenyl(ren), 1-ethylpropenyl(ren), 1,1-dimethylpropenyl(ren), isohexenyl(ren), 2-methylpentenyl(ren), 4-methylhexenyl(ren), and 5-methylhexenyl(ren).Specific examples of the cycloalkenyl group or cycloalkenylene group include cyclopropenyl(ylene), cyclobutenyl(ylene), cyclopentenyl(ylene), 3-methylcyclopentenyl(ylene), 2,3-dimethylcyclopentenyl(ylene), cyclohexenyl(ylene), 3-methylcyclohexenyl(ylene), 4-methylcyclohexenyl(ylene), 2,3-dimethylcyclohexenyl(ylene), 3,4,5-trimethylcyclohexenyl(ylene), 4-tert-butylcyclohexenyl(ylene), cycloheptenyl(ylene), and cyclooctenyl(ylene), but are not limited to these.

[0032] Unless otherwise specified, the term alkynyl group or alkynylene group used in this application may be a straight-chain or branched-chain acyclic alkynyl group or alkynylene group having 2 to 20 carbon atoms, or 2 to 16 carbon atoms, or 2 to 12 carbon atoms, or 2 to 8 carbon atoms, or 2 to 6 carbon atoms, or a cyclic alkynyl group or alkynylene group having 3 to 20 carbon atoms, or 3 to 16 carbon atoms, or 3 to 12 carbon atoms, or 3 to 8 carbon atoms, or 3 to 6 carbon atoms. Here, if an alkynyl group or alkynylene group having a ring structure is included, it corresponds to a cyclic alkynyl group or alkynylene group. Also, for example, ethynyl(ren), n-propynyl(ren), isopropynyl(ren), n-butynyl(ren), isobutynyl(ren), tert-butynyl(ren), sec-butynyl(ren), 1-methyl-butynyl(ren), 1-ethyl-butynyl(ren), n-pentynyl(ren), isopentynyl(ren), neopentynyl(ren), tert-pentynyl(ren), n-hexynyl(ren), 1-methylpentynyl(ren), 2-methylpentynyl(ren), 4-methyl-2-pentynyl(ren), 3,3-dimethylbutynyl(ren), 2-ethyl-2-pent ... Examples include, but are not limited to, ethylbutynyl(ren), n-heptynyl(ren), 1-methylhexynyl(ren), n-octynyl(ren), tert-octynyl(ren), 1-methylheptynyl(ren), 2-ethylhexynyl(ren), 2-propylpentynyl(ren), n-nonynyl(ren), 2,2-dimethylheptynyl(ren), 1-ethylpropynyl(ren), 1,1-dimethylpropynyl(ren), isohexynyl(ren), 2-methylpentynyl(ren), 4-methylhexynyl(ren), and 5-methylhexynyl(ren).Specific examples of the cycloalkynyl group or cycloalkynylene group include cyclopropynyl(ylene), cyclobutynyl(ylene), cyclopentynyl(ylene), 3-methylcyclopentynyl(ylene), 2,3-dimethylcyclopentynyl(ylene), cyclohexynyl(ylene), 3-methylcyclohexynyl(ylene), 4-methylcyclohexynyl(ylene), 2,3-dimethylcyclohexynyl(ylene), 3,4,5-trimethylcyclohexynyl(ylene), 4-tert-butylcyclohexynyl(ylene), cycloheptynyl(ylene), and cyclooctynyl(ylene), but are not limited to these.

[0033] The alkyl group, alkylene group, alkenyl group, alkenylene group, alkynyl group, or alkynylene group may be optionally substituted with one or more substituents, which may be, but are not limited to, one or more selected from the group consisting of halogen (chlorine (Cl), iodine (I), bromine (Br), and fluorine (F)), aryl group, heteroaryl group, epoxy group, alkoxy group, cyano group, carboxyl group, acryloyl group, methacryloyl group, acryloyloxy group, methacryloyloxy group, carbonyl group, and hydroxy group.

[0034] The term "aryl group" used herein refers to an aromatic ring formed by removing one hydrogen atom from an aromatic hydrocarbon ring, and the aromatic hydrocarbon ring may be a monocyclic or polycyclic ring. The number of carbon atoms in the aryl group is not particularly limited; unless otherwise specified, the aryl group may be an aryl group having 6 to 30 carbon atoms, 6 to 26 carbon atoms, 6 to 22 carbon atoms, 6 to 20 carbon atoms, 6 to 18 carbon atoms, or 6 to 15 carbon atoms. The term "arylene group" used herein refers to an aryl group having two bonding positions, i.e., a divalent group. The above description of the aryl group applies, except that these are divalent groups. Examples of the aryl group include, but are not limited to, a phenyl group, a phenylethyl group, a phenylpropyl group, a benzyl group, a tolyl group, a xylyl group, and a naphthyl group.

[0035] The term "heteroaryl group" as used herein refers to an aromatic ring containing one or more non-carbon heteroatoms. Specifically, the heteroatoms may include one or more atoms selected from the group consisting of nitrogen (N), oxygen (O), sulfur (S), selenium (Se), and tellurium (Te). In this case, the atoms constituting the ring structure of the heteroaryl group are referred to as ring atoms. The heteroaryl group may also contain a monocyclic or polycyclic ring. The number of carbon atoms in the heteroaryl group is not particularly limited, and unless otherwise specified, may be a heteroaryl group having 2 to 30, 2 to 26, 2 to 22, 2 to 20, 2 to 18, or 2 to 15 carbon atoms. In other examples, the number of ring atoms in the heteroaryl group is not particularly limited, and may be a heteroaryl group having 5 to 30, 5 to 25, 5 to 20, 5 to 15, 5 to 10, or 5 to 8 ring atoms. Examples of the heteroaryl group include a thiophene group, a furan group, a pyrrole group, an imidazolyl group, a thiazolyl group, an oxazolyl group, an oxadiazolyl group, a triazolyl group, a pyridyl group, a bipyridyl group, a pyrimidyl group, a triazinyl group, an acridyl group, a pyridazinyl group, a pyrazinyl group, a quinolinyl group, a quinazolinyl group, a quinoxalinyl group, a phthalazinyl group, a pyridopyrimidinyl group, a pyridopyrazinyl group, a pyrazinopyrazinyl group, an isoquinolinyl group, an indole group, a carbazolyl group, a benzoxazolyl group, a benzimidazolyl group, a benzothiazolyl group, a benzocarbazolyl group, a dibenzocarbazolyl group, a benzothiophene group, a dibenzothiophene group, a benzofuran group, a dibenzofuran group, a benzosilole group, a dibenzosilole group, a phenanthrolinyl group, group), an isoxazolyl group, a thiadiazolyl group, a phenothiazinyl group, a phenoxazine group, and condensed structures thereof, but are not limited to these.

[0036] The term "heteroarylene group" used in the present application refers to a heteroaryl group having two bonding positions, i.e., a divalent group. The above description of the heteroaryl group is applicable to these groups, except that they are both divalent groups.

[0037] The aryl group or heteroaryl group may be optionally substituted with one or more substituents, which may be, but are not limited to, one or more selected from the group consisting of halogens (chlorine (Cl), iodine (I), bromine (Br), and fluorine (F)), aryl groups, heteroaryl groups, epoxy groups, alkoxy groups, cyano groups, carboxyl groups, acryloyl groups, methacryloyl groups, acryloyloxy groups, methacryloyloxy groups, carbonyl groups, and hydroxy groups.

[0038] The present application relates to a curable composition. The term "curable composition" used in the present application means a composition that cures through a curing reaction. In the present application, whether or not curing has been properly completed through the curing reaction can be confirmed by Fourier Transform Infrared (FT-IR), Differential Thermal Analysis (DSC), and Dynamic Mechanical Analysis (DMA) measurements. For example, when the base resin is a polyol resin and the curing agent is an isocyanate compound, the 2250 cm -1 This can be confirmed by the fact that the NCO peak conversion rate around 2250 cm is 80% or more. Specifically, when the base resin is a polyol resin and the curing agent is an isocyanate compound, the NCO peak conversion rate around 2250 cm is confirmed by FT-IR analysis based on 24-hour curing under normal temperature and humidity conditions. -1 This can be confirmed by the fact that the NCO peak conversion rate near the peak is 80% or more. In this application, "curing" does not only mean attempting to carry out a curing reaction, but also means that the curing is properly completed as described above.

[0039] The curable composition according to one embodiment of the present application may be a resin composition. The term "resin composition" as used herein refers to a composition containing a component known in the art as a resin, or a composition that does not contain a resin but contains a component capable of forming a resin through a curing reaction or the like. Therefore, the term "resin" or "resin component" as used herein includes not only components generally known as resins, but also components capable of forming a resin through a curing and / or polymerization reaction.

[0040] The curable composition according to one example of the present application can be cured to form a thermal interface material (TIM). Therefore, in the present application, the cured product of the curable composition and the thermal interface material can be referred to as the same object.

[0041] The curable composition according to the present application may be a one-component or two-component composition. The term "one-component composition" used herein refers to a curable composition in which the components participating in curing are physically in contact with each other. The term "two-component composition" used herein may refer to a curable composition in which at least some of the components participating in curing are physically separated.

[0042] The curable composition according to one example of the present application may be a room temperature curable composition, a heat curable composition, an energy ray curable composition, and / or a moisture curable composition. The term room temperature curable composition used in the present application refers to a curable composition in which the curing reaction can be initiated and / or proceeded at room temperature. The term heat curable composition used in the present application refers to a curable composition in which the curing reaction can be initiated and / or proceeded by the application of heat. The term energy ray curable composition used in the present application refers to a curable composition in which the curing reaction can be initiated and / or proceeded by irradiation with energy rays (e.g., ultraviolet rays, electron beams, etc.). The term moisture curable composition used in the present application refers to a curable composition in which the curing reaction can be initiated and / or proceeded in the presence of moisture.

[0043] The curable composition according to this embodiment may be a solvent-based or solventless composition. In consideration of application efficiency and environmental impact, the solvent-free composition is preferred.

[0044] The curable composition according to one example of the present application may be a polyurethane composition. In such a case, the curable composition may contain polyurethane or a component capable of forming polyurethane. For example, a thermal interface material, which is a cured product of the curable composition, may contain the polyurethane. The polyurethane may be formed by a reaction between a base part and a component in a curing agent part, as described below in one example.

[0045] A curable composition or a cured product thereof according to one embodiment of the present application may have at least one or more of the following physical properties. Each of the following physical properties is independent, and no one physical property takes precedence over the other physical properties. At least one or more of the following physical properties may be satisfied. The following physical properties result from the combination of the components contained in the curable composition or a cured product thereof.

[0046] A curable composition or a cured product thereof according to an embodiment of the present application may exhibit low adhesion to a specific substrate or may form a cured product capable of exhibiting low adhesion. Such a curable composition may be the polyurethane composition. Polyurethanes are known as adhesive materials that exhibit excellent adhesion to various substrates. Therefore, a method for making a polyurethane composition exhibit low adhesion to a substrate typically involves introducing a component that reduces adhesion, such as a plasticizer. While the addition of such a component can reduce the adhesive strength of the polyurethane material, it can also cause problems, such as reducing other physical properties maintained by the polyurethane or leaching out of the material during use. However, the present application achieves the low adhesive strength of a polyurethane material while minimizing the amount of an adhesive-reducing component, such as a plasticizer. Therefore, the present application provides a material that retains the advantages of polyurethane materials while addressing the problem of high adhesive strength not required for certain applications.

[0047] The curable composition or its cured product according to one example of the present application has an adhesive strength to aluminum of 1 N / mm 2 In another example, the upper limit of the adhesive strength of the curable composition or the cured product thereof to aluminum may be 0.1 N / mm 2 , 0.099N / mm 2 , 0.098N / mm 2 , 0.097N / mm 2 , 0.096N / mm 2 , 0.095N / mm 2 , 0.094N / mm 2 , 0.093N / mm 2 , 0.092N / mm 2 , 0.091N / mm 2 or 0.09N / mm 2The adhesive strength of the curable composition or the cured product thereof to aluminum may be equal to or less than any one of the upper limits described above. In the present application, the lower limit of the adhesive strength to aluminum is not particularly limited. In one example, the adhesive strength to aluminum is 0 N / mm 2 or more or 0N / mm 2 The curable composition may be a curable composition whose adhesive strength to aluminum is not substantially measurable, or may be a curable composition capable of forming a cured product whose adhesive strength to aluminum is substantially measurable. Therefore, the adhesive strength to aluminum is 0 N / mm 2 or more or 0N / mm 2 The adhesion strength of the curable composition or its cured product to aluminum can be measured by the method described in the Examples section of this specification.

[0048] The curable composition or its cured product according to one example of the present application may have an adhesive strength to polyester of 100 gf / cm or less. In other examples, the upper limit of the adhesive strength of the curable composition or its cured product to polyester may be 99.9 gf / cm, 99.8 gf / cm, 99.7 gf / cm, 99.6 gf / cm, 99.5 gf / cm, 99.4 gf / cm, 99.3 gf / cm, 99.2 gf / cm, 99.1 gf / cm, or 99 gf / cm. The adhesive strength of the curable composition or its cured product to polyester may be equal to or less than any one of the above upper limits. In the present application, the lower limit of the adhesive strength to polyester is not particularly limited. In one example, the lower limit of the adhesive strength of the curable composition or its cured product to polyester may be approximately 0 gf / cm, 2 gf / cm, 4 gf / cm, 6 gf / cm, 8 gf / cm, 10 gf / cm, 12 gf / cm, 14 gf / cm, 16 gf / cm, 18 gf / cm, or 20 gf / cm. The curable composition or its cured product may exhibit substantially no adhesive strength to polyester. The adhesive strength of the curable composition or its cured product to polyester may be in a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. The adhesive strength of the curable composition or its cured product to polyester may be measured by the method described in the Examples of this specification.

[0049] A curable composition or a cured product thereof according to an example of the present application may exhibit excellent thermal conductivity. For example, the lower limit of the thermal conductivity of the curable composition or a cured product thereof may be approximately 2.0 W / mK, 2.1 W / mK, 2.2 W / mK, 2.3 W / mK, 2.4 W / mK, 2.5 W / mK, 2.6 W / mK, 2.7 W / mK, 2.8 W / mK, 2.9 W / mK, or 3 W / mK. The thermal conductivity may be equal to or greater than any one of the above lower limits. There is no particular limit on the upper limit of the thermal conductivity. For example, the upper limit of the thermal conductivity of the curable composition or a cured product thereof may be approximately 10 W / mK, 9 W / mK, 8 W / mK, 7 W / mK, 6 W / mK, 5 W / mK, or 4 W / mK. The thermal conductivity may be in a range between any one of the above lower limits and any one of the above upper limits. The thermal conductivity of such a curable composition or a cured product thereof can be measured by the method disclosed in the Examples below.

[0050] The curable composition or its cured product according to an embodiment of the present application may also exhibit an appropriate hardness. For example, if the hardness of the curable composition or its cured product is too high, significant brittleness may occur, causing problems. Furthermore, adjusting the hardness of the curable composition or its cured product may ensure impact resistance and vibration resistance, thereby ensuring product durability, depending on the application. The upper limit of the Shore OO hardness of the curable composition or its cured product may be 100, 98, 96, 94, 92, or 90. The Shore OO hardness may be equal to or less than any one of the above upper limits. The lower limit of the Shore OO hardness may be 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, or 80. The Shore OO hardness may be equal to or greater than any one of the above lower limits. The Shore OO hardness may be within a range between any one of the upper limits described above and any one of the lower limits described above. The hardness of the curable composition or the cured product thereof may be measured by the method disclosed in the Examples below.

[0051] The curable composition or its cured product according to an example of the present application may also exhibit appropriate flexibility. For example, adjusting the flexibility of the curable composition or its cured product to a desired level can greatly expand its application range. For example, the upper limit of the radius of curvature of the curable composition or its cured product may be approximately 20 mm, 19 mm, 18 mm, 17 mm, 16 mm, 15 mm, 14 mm, 13 mm, 12 mm, 11 mm, 10 mm, or 9 mm. The radius of curvature may be equal to or less than any one of the above upper limits. The lower limit of the radius of curvature may be, for example, approximately 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, or 7 mm. The radius of curvature may be equal to or greater than any one of the above lower limits. The radius of curvature may be within a range between any one of the above upper limits and any one of the above lower limits. The radius of curvature of the curable composition or its cured product may be measured using the method disclosed in the Examples below.

[0052] A curable composition or a cured product thereof according to an example of the present application may be insulating. That is, the curable composition has insulating properties and / or can form a cured product having insulating properties. For example, the curable composition or a cured product thereof may have a lower limit of breakdown voltage measured in accordance with ASTM D149 of approximately 3 kV / mm, 5 kV / mm, 7 kV / mm, 10 kV / mm, 15 kV / mm, or 20 kV / mm. The breakdown voltage may be equal to or greater than any one of the above lower limits. A higher breakdown voltage indicates better insulating properties. The upper limit is not particularly limited, but taking into account the composition of the curable composition, the upper limit of the breakdown voltage may be approximately 50 kV / mm, 45 kV / mm, 40 kV / mm, 35 kV / mm, or 30 kV / mm. The breakdown voltage may be equal to or less than any one of the above upper limits. The breakdown voltage can be controlled by adjusting the insulating properties of the curable composition, for example, by incorporating an insulating filler into the composition. Among fillers, ceramic fillers are generally known to be components that can ensure insulating properties. Furthermore, if the cured product of the curable composition can ensure the above-described electrical insulating properties, it can maintain performance and stability with various materials, such as cases and battery cells included in battery modules.

[0053] A curable composition or a cured product thereof according to an example of the present application may have flame retardancy. The curable composition or a cured product thereof may exhibit a V-0 rating in the UL 94 V Test (Vertical Burning Test). This ensures stability against fires and other potential accidents depending on the intended use of the curable composition. Conventionally, flame retardancy has generally been achieved through the use of halogen-containing flame retardants, phosphorus-containing flame retardants, or combinations thereof. However, the curable composition or a cured product thereof may be substantially free of halogen-containing flame retardants and phosphorus (P)-containing flame retardants by using an appropriate combination of a polyol component and a filler component, as described below, and may achieve a V-0 rating in the UL 94 V Test.

[0054] In one example of the present application, the curable composition or its cured product may have a combined halogen and phosphorus content of 0.3 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the combined halogen and phosphorus content may be 0.29 wt%, 0.28 wt%, 0.27 wt%, 0.26 wt%, 0.25 wt%, 0.24 wt%, 0.23 wt%, 0.22 wt%, 0.21 wt%, or 0.2 wt% based on the total content of the curable composition or cured product. The combined halogen and phosphorus content may be equal to or less than any one of the above upper limits. The lower limit of the combined halogen and phosphorus content is not particularly limited, but may be 0 wt% (not included) or greater than 0 wt% based on the total content of the curable composition or cured product. The combined halogen and phosphorus content of the curable composition or its cured product confirms that the curable composition or its cured product is substantially free of halogen-containing flame retardants and phosphorus-containing flame retardants. The combined content of the halogen and phosphorus elements may be equal to or greater than any one of the above-mentioned lower limits, or may be within a range between any one of the above-mentioned upper limits and any one of the above-mentioned lower limits.

[0055] The halogen content, phosphorus content, and combined halogen and phosphorus content of a curable composition or a cured product thereof according to an example of the present application can be measured by ICP analysis. The ICP analysis used in the present application may be performed using an inductively coupled plasma-optical emission spectrometer (ICP-OES), an inductively coupled plasma-atomic emission spectrometer (ICP-AES), an inductively coupled plasma mass spectrometer (ICP-MS), or an inductively coupled plasma-atomic absorption spectrometer (ICP-AAS), depending on the appropriate circumstances. Considering the object to be measured, ICP-OES is preferred. Specifically, the measurement can be performed using the method described in the examples of the present specification. The halogen content, phosphorus content, and combined halogen and phosphorus content can be measured using the method described in the examples below.

[0056] According to one embodiment of the present application, the curable composition or cured product thereof may have a halogen content of 0.3 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the halogen content may be 0.29 wt%, 0.28 wt%, 0.27 wt%, 0.26 wt%, 0.25 wt%, 0.24 wt%, 0.23 wt%, 0.22 wt%, 0.21 wt%, or 0.2 wt% based on the total content of the curable composition or cured product. The halogen content may be equal to or less than any one of the above upper limits. The lower limit of the halogen content is not particularly limited, but may be 0 wt% (not included) or greater than 0 wt% based on the total content of the curable composition or cured product. The halogen content of the curable composition or cured product thereof can be used to confirm that the curable composition or cured product is substantially free of a halogen-containing flame retardant. The halogen content may be equal to or greater than any one of the above lower limits. The halogen content may be within a range between any one of the above upper limits and any one of the above lower limits.

[0057] In one example of the present application, the curable composition or a cured product thereof may have a phosphorus content of 0.3 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the phosphorus content may be 0.29 wt%, 0.28 wt%, 0.27 wt%, 0.26 wt%, 0.25 wt%, 0.24 wt%, 0.23 wt%, 0.22 wt%, 0.21 wt%, or 0.2 wt% based on the total content of the curable composition or cured product. The phosphorus content may be equal to or less than any one of the above upper limits. The lower limit of the phosphorus content is not particularly limited, but may be 0 wt% (not included) or more than 0 wt% based on the total content of the curable composition or cured product. The phosphorus content of the curable composition or a cured product thereof can be used to confirm that the curable composition or a cured product thereof is substantially free of a phosphorus-containing flame retardant. The phosphorus content may be equal to or greater than any one of the above lower limits. The phosphorus content may be within a range between any one of the above upper limits and any one of the above lower limits.

[0058] In a curable composition or a cured product thereof according to one example of the present application, the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or the cured product. The upper limit of the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt% based on the total content of the curable composition or the cured product. The combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant is not particularly limited, and may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or the cured product. The combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be equal to or greater than any one of the above-mentioned lower limits, or may be within a range between any one of the above-mentioned upper limits and any one of the above-mentioned lower limits.

[0059] In a curable composition or a cured product thereof according to one example of the present application, the content of the halogen-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the content of the halogen-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt%, based on the total content of the curable composition or cured product. The content of the halogen-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the content of the halogen-containing flame retardant is not particularly limited, but may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or cured product. The content of the halogen-containing flame retardant may be equal to or greater than any one of the above lower limits. The content of the halogen-containing flame retardant may be within a range between any one of the above upper limits and any one of the above lower limits.

[0060] In a curable composition or a cured product thereof according to one example of the present application, the content of the phosphorus-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the content of the phosphorus-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt%, based on the total content of the curable composition or cured product. The content of the phosphorus-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the content of the phosphorus-containing flame retardant is not particularly limited, but may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or cured product. The content of the phosphorus-containing flame retardant may be equal to or greater than any one of the above lower limits. The content of the phosphorus-containing flame retardant may be within a range between any one of the above upper limits and any one of the above lower limits.

[0061] The curable composition or cured product thereof according to one example of the present application may have a specific gravity of 3 or less. The upper limit of the specific gravity may be 2.99, 2.98, 2.97, or 2.96. The upper limit of the specific gravity may be equal to or less than any one of the above upper limits. The above specific gravity can be achieved by applying a filler with a low specific gravity and / or a surface-treated filler. Furthermore, since a lower specific gravity value is advantageous for reducing the weight of applied products, the lower limit is not particularly limited. For example, the specific gravity may be equal to or greater than about 1.5 or 2. The specific gravity may be equal to or greater than any one of the above lower limits. The specific gravity may be within a range between any one of the above upper limits and any one of the above lower limits.

[0062] As described above, a curable composition or a cured product thereof according to an embodiment of the present application can be used as a thermal interface material, for example, to rapidly dissipate heat generated during fast charging of a battery, thereby reducing the risk of fire. However, achieving heat dissipation performance typically requires the use of an excessive amount of a high-specific-gravity, thermally conductive filler, which increases the weight of the battery and ultimately the weight of the product to which the battery is applied. In particular, when applied to electric vehicles, this can be detrimental to the vehicle's fuel economy. Therefore, to achieve a low specific gravity, the content of the high-specific-gravity filler must be reduced. However, reducing the amount of the high-specific-gravity filler reduces heat dissipation performance, making it difficult to prevent fires caused by accumulated heat. In other words, low specific gravity and high thermal conductivity are in a trade-off relationship.

[0063] The curable composition or its cured product according to one embodiment of the present application can simultaneously ensure low specific gravity and heat dissipation properties despite the trade-off relationship through an appropriate combination of filler components described below.

[0064] The curable composition according to an embodiment of the present application may have low shrinkage during or after curing. This can prevent peeling or voids that may occur during application. The shrinkage may be appropriately adjusted within a range that can exhibit the above-mentioned effects, and may be, for example, less than 5%, less than 3%, or less than about 1%. The lower the shrinkage, the more advantageous it is, so the lower limit is not particularly limited.

[0065] The curable composition or its cured product according to an embodiment of the present application may have a low coefficient of thermal expansion (CTE). This can prevent peeling or voids that may occur during application or use. The CTE can be appropriately adjusted within a range that can exhibit the above-mentioned effects, and may be, for example, less than 300 ppm / K, less than 250 ppm / K, less than 200 ppm / K, less than 150 ppm / K, or less than about 100 ppm / K. The lower the CTE, the more advantageous it is, so there is no particular lower limit.

[0066] The curable composition or its cured product according to one example of the present application may also have a 5% weight loss temperature of 400°C or higher in thermogravimetric analysis (TGA) and an 800°C residual of 70% by weight or higher. Such characteristics can further improve high temperature stability. In other examples, the 800°C residual may be about 75% by weight or higher, about 80% by weight or higher, about 85% by weight or higher, or about 90% by weight or higher. In other examples, the 800°C residual may be about 99% by weight or lower. The thermogravimetric analysis (TGA) is performed at 60 cm 3 The thermogravimetric analysis (TGA) results can be measured in the range of 25°C to 800°C at a heating rate of 20°C / min under a nitrogen (N2) atmosphere. The thermogravimetric analysis (TGA) results can also be achieved by adjusting the composition of the curable composition. For example, the 800°C residual capacity usually depends on the type and proportion of filler contained in the curable composition, and if an excessive amount of filler is contained, the residual capacity increases.

[0067] A curable composition according to one example of the present application may include a polyol component, which may comprise 55% or more, 60% or more, 65% or more, 70% or more, 75% or more, 80% or more, 85% or more, 90% or more, 95% or more, 99% or more, or 100% by weight of polyol based on the total weight of the polyol component.

[0068] The term "polyol" used in the present application may refer to a compound having a lower limit of the number of hydroxy groups of about 2 or 3 per molecule. The upper limit of the number of hydroxy groups of the polyol is not particularly limited, but may be about 10, 9, 8, 7, 6, 5, 4, or 3 per molecule. The number of hydroxy groups possessed by the polyol may be equal to or less than any one of the upper limits described above. The number of hydroxy groups contained in the polyol may be within the range between any one of the lower limits described above and any one of the upper limits described above. The number of hydroxy groups contained in the polyol is 1 This can be confirmed by H NMR, 1 The number of hydroxy groups can be confirmed based on the peak present in the region of 3 to 4 ppm by H NMR. The polyol can also be named according to the number of hydroxy groups, such as a bifunctional polyol (having two hydroxy groups). A curable composition according to one example of the present application may contain a polyol component in a range of 1 to 80 parts by weight relative to 100 parts by weight of a filler component (described below). The upper limit of the polyol component content may be approximately 60, 50, 40, 30, 20, or 15 parts by weight relative to 100 parts by weight of the filler component, and the lower limit of the polyol component content may be approximately 2, 3, 4, 5, 6, 7, 8, 9, or 10 parts by weight relative to 100 parts by weight of the filler component. The polyol component content may be equal to or greater than any one of the lower limits listed above, equal to or less than any one of the upper limits listed above, or between any one of the lower limits listed above and any one of the upper limits listed above. Controlling the ratio of the polyol component to the filler component content as described above allows for excellent compoundability, ensures viscosity and thixotropy suitable for processing, and forms a cured product with excellent thermal conductivity.

[0069] In one example of a curable composition according to the present application, the polyol component may include a first polyol that is a bifunctional polyol and a second polyol that is trifunctional or higher. By simultaneously including the first and second polyols as the polyol components, the curable composition can ensure viscosity and thixotropy suitable for processing, can cure more densely during curing, can ensure excellent curability, and can form a cured product that exhibits low adhesion to a specific substrate or that can exhibit low adhesion.

[0070] In the curable composition according to one example of the present application, the polyol component is not particularly limited as long as it is one used in the art, and examples thereof include polyester polyols, polyether polyols, polycarbonate polyols, polyester polycarbonate polyols, polyolefin polyols, conjugated diene polymer polyols, castor oil polyols, silicone polyols, vinyl polymer polyols, etc., depending on the skeletal structure contained therein. These may be used alone or in combination of two or more.

[0071] In the curable composition according to one example of the present application, the first or second polyol of the polyol component may be an oil-modified polyol as described below, or may be a non-oil-modified polyol.

[0072] The term "oil-modified polyol" used in this application means a polyol containing a linear or branched hydrocarbon group having 3 or more carbon atoms at its end. Accordingly, a polyol that does not contain a linear or branched hydrocarbon group having 3 or more carbon atoms at its end can be called a non-oil-modified polyol in this application. That is, the first or second polyol of the polyol component may contain a branched hydrocarbon chain having 3 or more carbon atoms at its end. Whether the first or second polyol contains the hydrocarbon group depends on the following: 1 This can be confirmed by H NMR, 1The presence and number of hydrocarbon groups can be confirmed based on the peak in the 4-5 ppm region of H NMR. By using the oil-modified polyol, polyurethane materials can be formed, and low adhesion to specific materials can be ensured while minimizing the amount of adhesive-reducing ingredients such as plasticizers, resulting in excellent compatibility.

[0073] The lower limit of the number of carbon atoms in the linear or branched hydrocarbon group contained at the terminal of the oil-modified polyol may be about 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, or 17. The number of carbon atoms may be equal to or greater than any one of the above lower limits. The upper limit of the number of carbon atoms may be about 50, 49, 48, 47, 46, 45, 44, 43, 42, 41, 40, 39, 38, 37, 36, 35, 34, 33, 32, 31, 30, 29, 28, 27, 26, 25, 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, or 8. The number of carbon atoms may be equal to or less than any one of the upper limits described above. The number of carbon atoms may be within a range between any one of the lower limits described above and any one of the upper limits described above.

[0074] The linear or branched hydrocarbon group may or may not contain a double bond. If it contains a double bond, the double bond may be a conjugated double bond or a cis double bond.

[0075] Specific examples of the hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group. In one example, the hydrocarbon group may be linked to the polyol compound via a carbonyl group or a carbonyloxy group. In this case, the hydrocarbon group may be an alkylcarbonyl group, an alkenylcarbonyl group, an alkynylcarbonyl group, an alkylcarbonyloxy group, an alkenylcarbonyloxy group, or an alkynylcarbonyloxy group. In the above, the number of carbon atoms in the alkyl group, alkenyl group, or alkynyl group may be equal to or greater than any one of the lower limits of the number of carbon atoms in the linear or branched hydrocarbon group described above, equal to or less than any one of the upper limits of the number of carbon atoms in the linear or branched hydrocarbon group described above, or may be within a range between any one of the lower limits of the number of carbon atoms in the linear or branched hydrocarbon group described above and any one of the upper limits of the number of carbon atoms in the linear or branched hydrocarbon group described above.

[0076] The alkyl group, alkenyl group, or alkynyl group may be linear or branched, and may be optionally substituted with one substituent. When a substituent is present, the type of the substituent is not particularly limited, and examples of the substituent include a halogen atom such as fluorine (F).

[0077] In one example, the hydrocarbon group may be included in the substituent of the following chemical formula 1:

[0078] [ka]

[0079] In Chemical Formula 1, R is a straight-chain or branched-chain hydrocarbon group. In Chemical Formula 1, the symbol * means that the moiety is linked to a polyol. Therefore, the oxygen atom in the substituent of Chemical Formula 1 may be linked to a polyol. In Chemical Formula 1, the specific types of hydrocarbon groups represented by R are as described above. Therefore, the content regarding the number, type, shape, and substituents of carbon atoms of the hydrocarbon groups described above can be applied in the same manner as above.

[0080] The number of hydrocarbon groups contained in the oil-modified polyol is not particularly limited. For example, the lower limit of the number of hydrocarbon groups contained in the oil-modified polyol may be 1 or 2 per molecule of the compound. The upper limit of the number of hydrocarbon groups contained in the oil-modified polyol may be about 10, 9, 8, 7, 6, 5, 4, 3, or 2 per molecule of the compound. The number of hydrocarbon groups may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or within a range between any one of the lower limits mentioned above and any one of the upper limits mentioned above.

[0081] The oil-modified polyol may have various forms as long as it contains the hydroxy group and hydrocarbon group.

[0082] In one example, the oil-modified polyol may be a compound in which at least a portion of the hydrogen atoms of a hydrocarbon compound such as an alkane, alkene, or alkyne are substituted with the hydroxy group and / or hydrocarbon group. The number of carbon atoms in the hydrocarbon compound such as an alkane, alkene, or alkyne may be, for example, 1 to 20, 1 to 16, 1 to 8, or 4 to 6. Such a hydrocarbon compound such as an alkane, alkene, or alkyne may be linear, branched, or cyclic. Furthermore, the hydroxy group and / or hydrocarbon group may be substituted on the same carbon atom in the alkane, alkene, or alkyne, or may be substituted on a different carbon atom.

[0083] In another example, the oil-modified polyol may have a polyester skeleton or a polyether skeleton. In such a case, the oil-modified polyol may be an oligomeric compound or a polymeric compound.

[0084] In one example, the oil-modified polyol having a polyester skeleton is a so-called polyester polyol, and may be a polyol having a structure in which the hydrocarbon group is linked to such a polyester polyol.

[0085] The oil-modified polyol having a polyether skeleton is a so-called polyether polyol, and may be a polyol having a structure in which the hydrocarbon group is linked to such a polyether polyol.

[0086] In one example, the polyester skeleton may be a so-called polycaprolactone skeleton, and the polyether skeleton may be a so-called polyalkylene skeleton.

[0087] In one example, the polyester skeleton may be a skeleton having a repeating unit represented by the following Chemical Formula 2:

[0088] [ka]

[0089] In Chemical Formula 2, X1 and X2 are each independently a single bond or an oxygen atom, L1 may be an alkylene group or an alkylidene group, and n is any number. In this application, the term single bond refers to the absence of an atom at that site. In Chemical Formula 2, the alkylene group may be, for example, an alkylene group having 2 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, 4 to 12 carbon atoms, or 4 to 8 carbon atoms, and may be linear or branched. In Chemical Formula 2, the alkylidene group may be, for example, an alkylidene group having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, 4 to 12 carbon atoms, or 4 to 8 carbon atoms, and may be linear or branched.

[0090] In the present application, an alkylene group and an alkylidene group both refer to a divalent substituent formed by the removal of two hydrogen atoms from an alkane. The alkylene group is a divalent substituent formed by the removal of the two hydrogen atoms from other carbon atoms of the alkane, while the alkylidene group is a divalent substituent formed by the removal of the two hydrogen atoms from one carbon atom of the alkane, and they are distinguished from each other.

[0091] In one example, the polyester skeleton may be a polycaprolactone skeleton, and in this case, L1 in Chemical Formula 2 may be a linear alkylene group having 5 carbon atoms or a linear alkylidene group having 5 carbon atoms.

[0092] In Chemical Formula 2, n is an arbitrary number representing the number of repeating units. The lower limit of n may be, for example, about 1, 2, 3, 4, or 4.5, and the upper limit may be about 25, 20, 15, 10, or 5. The n may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0093] The skeleton of Chemical Formula 2 may be a skeleton of a so-called carboxylic acid polyol or a skeleton of a caprolactone polyol. Such skeletons can be formed by known methods. For example, the skeleton of the carboxylic acid polyol can be formed by reacting a component including a carboxylic acid with a polyol (e.g., a diol or triol), and the skeleton of the caprolactone polyol can be formed by reacting a component including caprolactone with a polyol (e.g., a diol or triol). The carboxylic acid may be a dicarboxylic acid.

[0094] In the oil-modified polyol having the skeleton of Chemical Formula 2, the hydroxy group or the hydrocarbon group described above may be present at the end of the skeleton of Chemical Formula 2. In this case, the skeleton of Chemical Formula 2 can be represented by Chemical Formula 3 below.

[0095] [ka]

[0096] In Chemical Formula 3, X1, X2, L1, and n are as defined in Chemical Formula 2, and R1 may be a hydroxy group or a substituent of Chemical Formula 4 below.

[0097] [ka]

[0098] In Chemical Formula 4, X3 is a single bond or an oxygen atom, and R is the same as R in Chemical Formula 1.

[0099] In Chemical Formula 3, when R1 is a hydroxy group, X1 may be a single bond and X2 may be an oxygen atom; when R1 is a substituent of Chemical Formula 4, either one of X1 and X3 may be a single bond and the other may be an oxygen atom.

[0100] In the oil-modified polyol, the lower limit of the number of skeletons of Chemical Formula 2 or 3 may be about 1 or 2, and the upper limit may be about 10, 9, 8, 7, 6, 5, 4, 3, or 2. The number of skeletons may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0101] The oil-modified polyol having a polyester skeleton may have a linear or branched chain structure.

[0102] The linear structure described above is a structure in which a main chain containing the skeleton of Chemical Formula 2 or 3 is present and no other polymer chains are linked to the main chain, and the branched structure may be a structure in which a chain containing the skeleton of Chemical Formula 2 or 3 is linked as a side chain to the main chain containing the skeleton of Chemical Formula 2 or 3. In the branched structure described above, the number of chains containing the skeleton of Chemical Formula 2 or 3 linked as side chains may be, for example, 1 to 5, 1 to 4, 1 to 3, 1 to 2, or 1.

[0103] In one example, the oil-modified polyol having a polyester skeleton may be a compound in which at least a portion of the hydrogen atoms of a hydrocarbon compound such as an alkane, alkene, or alkyne is substituted with the hydroxy group and / or the skeleton of Chemical Formula 3. The number of carbon atoms of the hydrocarbon compound such as an alkane, alkene, or alkyne may be, for example, 1 to 20, 1 to 16, 1 to 8, or 4 to 6.

[0104] The hydrocarbon compound such as an alkane, alkene, or alkyne may be linear, branched, or cyclic, and the hydroxy group and / or the skeleton of Formula 3 may be substituted on the same carbon atom in the alkane, alkene, or alkyne, or may be substituted on another carbon atom.

[0105] In one example, the polyether skeleton may be a skeleton having a repeating unit represented by the following Chemical Formula 5.

[0106] [ka]

[0107] In Chemical Formula 5, X4 and X5 are each independently a single bond or an oxygen atom, L2 may be an alkylene group or an alkylidene group, and m is an arbitrary number. In Chemical Formula 5, the alkylene group may be, for example, an alkylene group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms, and may be linear or branched. In Chemical Formula 5, the alkylidene group may be, for example, an alkylidene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, and may be linear or branched.

[0108] The meanings of the alkylene group and alkylidene group are as described above. In Chemical Formula 5, m is an arbitrary number indicating the number of repeating units, and may be, for example, a number within the range of 1 to 25. In the oil-modified polyol having the skeleton of Chemical Formula 5, the hydroxy group or the hydrocarbon group described above may be present at the end of the skeleton of Chemical Formula 5. In this case, the skeleton of Chemical Formula 5 can be represented by Chemical Formula 6 below.

[0109] [ka]

[0110] In Chemical Formula 6, X4, X5, L2 and m are as defined in Chemical Formula 5, and R2 may be a hydroxy group or a substituent of Chemical Formula 7 below.

[0111] [ka]

[0112] In Chemical Formula 7, X6 is a single bond or an oxygen atom, and R is the same as R in Chemical Formula 1.

[0113] In Chemical Formula 6, when R2 is a hydroxy group, X4 is a single bond, and when R2 is a substituent of Chemical Formula 7, one of X4 and X6 is a single bond and the other is an oxygen atom.

[0114] The oil-modified polyol may contain one or more or two or more skeletons of Chemical Formula 5 or 6. The polyol compound may contain 10 or less, 9 or less, 8 or less, 7 or less, 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less skeletons of Chemical Formula 5 or 6.

[0115] The oil-modified polyol having a polyether skeleton may have a linear or branched chain structure.

[0116] The linear structure described above is a structure in which a main chain containing the skeleton of Chemical Formula 5 or 6 is present and no other polymer chains are linked to the main chain, and the branched structure may be a structure in which a chain containing the skeleton of Chemical Formula 5 or 6 is linked as a side chain to the main chain containing the skeleton of Chemical Formula 5 or 6. In the branched structure described above, the number of chains containing the skeleton of Chemical Formula 5 or 6 linked as side chains may be, for example, 1 to 5, 1 to 4, 1 to 3, 1 to 2, or 1.

[0117] In one example, the oil-modified polyol having a polyether skeleton may be a compound in which at least a portion of the hydrogen atoms of a hydrocarbon compound such as an alkane, alkene, or alkyne are substituted with a hydroxy group and / or the skeleton of Chemical Formula 5. The number of carbon atoms of the hydrocarbon compound such as an alkane, alkene, or alkyne may be, for example, 1 to 20, 1 to 16, 1 to 8, or 4 to 6.

[0118] The hydrocarbon compound such as an alkane, alkene, or alkyne may be linear, branched, or cyclic, and the hydroxy group and / or the skeleton of Formula 5 may be substituted on the same carbon atom in the alkane, alkene, or alkyne, or may be substituted on another carbon atom.

[0119] When the oil-modified polyol is an oligomeric or polymeric compound, the compound may have an appropriate level of molecular weight.

[0120] For example, the weight-average molecular weight of the oligomeric or polymeric oil-modified polyol may have a lower limit of about 100 g / mol, 200 g / mol, 300 g / mol, 400 g / mol, 500 g / mol, 600 g / mol, or 700 g / mol, and an upper limit of about 5,000 g / mol, 4,500 g / mol, 4,000 g / mol, 3,500 g / mol, 3,000 g / mol, 2,500 g / mol, 2,000 g / mol, 1,500 g / mol, 1,000 g / mol, or 900 g / mol. The weight-average molecular weight may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0121] By using the oil-modified polyol as described above, the desired physical properties can be more effectively ensured. In addition, by using the oil-modified polyol as the first polyol, the desired physical properties can be further effectively ensured.

[0122] The oil-modified polyol can be synthesized by a known synthesis method. That is, the polyol can be produced by reacting a compound capable of introducing the hydrocarbon group corresponding to the oil-modified moiety with a known polyol or alcohol compound. Here, the term "polyol" is as defined in the present application, and the term "alcohol compound" refers to a compound containing one hydroxy group per molecule. Examples of the compound capable of introducing a hydrocarbon group include saturated or unsaturated fatty acids, such as butyric acid, caproic acid, 2-ethylhexanoic acid, caprylic acid, isononanoic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, linoleic acid, and oleic acid, but are not limited thereto.

[0123] Furthermore, there is no particular limitation on the type of polyol or alcohol compound to be reacted with the saturated or unsaturated fatty acid. For example, appropriate types of general polyols described below can be used, but the invention is not limited thereto. The non-oil-modified polyol may have a variety of forms.

[0124] In one example, the non-oil-modified polyol may be a polyester polyol, such as a so-called carboxylic acid polyol or caprolactone polyol.

[0125] In one example, the polyester polyol may have a skeleton having a repeating unit represented by the following chemical formula 8: [ka]

[0126] In Chemical Formula 8, X7 and X8 are each independently a single bond or an oxygen atom, L3 may be an alkylene group or an alkylidene group, and p is an arbitrary number. In Chemical Formula 8, the alkylidene group may be, for example, an alkylidene group having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, 4 to 12 carbon atoms, or 4 to 8 carbon atoms, and may be linear or branched. In Chemical Formula 8, the alkylene group may be, for example, an alkylene group having 2 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, 4 to 12 carbon atoms, or 4 to 8 carbon atoms, and may be linear or branched.

[0127] When the polyester polyol is a polycaprolactone polyol, L3 in Chemical Formula 8 may be a linear alkylene group having 5 carbon atoms.

[0128] In addition, in the above chemical formula 8, p is an arbitrary number indicating the number of repeating units, and may be a number within the range of 1 to 25, for example.

[0129] The polyester polyol having the skeleton of Formula 8 may be a so-called carboxylic acid polyol or caprolactone polyol. Such polyol compounds may be formed by known methods. For example, the carboxylic acid polyol may be formed by reacting a component containing a carboxylic acid with a polyol (e.g., a diol or triol), and the caprolactone polyol may be formed by reacting a component containing caprolactone with a polyol (e.g., a diol or triol). The carboxylic acid may be a dicarboxylic acid.

[0130] In the polyol compound having the skeleton of Chemical Formula 8, the hydroxy group may be present at the terminal of the skeleton of Chemical Formula 8 or at another site of the polyester polyol.

[0131] When the non-oil-modified polyol contains the skeleton of Chemical Formula 8, the lower limit of the number of skeletons may be about 1 or 2, and the upper limit may be about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1. The number of skeletons may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0132] The non-oil-modified polyol having a polyester skeleton may have a linear or branched chain structure.

[0133] The linear structure described above is a structure in which a main chain containing the skeleton of Chemical Formula 8 is present and no other polymer chains are linked to the main chain, and the branched structure may be a structure in which a chain containing the skeleton of Chemical Formula 8 is linked as a side chain to the main chain containing the skeleton of Chemical Formula 8. In the branched structure described above, the number of chains containing the skeleton of Chemical Formula 8 linked as side chains may be, for example, 1 to 5, 1 to 4, 1 to 3, 1 to 2, or 1.

[0134] Other examples of the non-oil-modified polyol include polyols having polycaprolactone polyol units or alkanediol units, polyol units, and dicarboxylic acid units. Such polyols may be mixtures of the polycaprolactone polyol or alkanediol, polyol, and dicarboxylic acid, or may be reaction products thereof. That is, the polycaprolactone polyol units, alkanediol units, polyol units, and dicarboxylic acid units may be units derived from polycaprolactone polyol, alkanediol polyol, and dicarboxylic acid, respectively. In this case, examples of the alkanediol include diol compounds having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms, such as 3-methyl-1,5-pentanediol, 1,9-nonanediol, and 1,6-hexanediol. Examples of the polyol unit include alkanes having 1 to 20 carbon atoms, 4 to 20 carbon atoms, 4 to 16 carbon atoms, or 4 to 12 carbon atoms, substituted with 3 to 10, 3 to 9, 3 to 8, 3 to 7, 3 to 6, 3 to 5, or 3 to 4 hydroxy groups, such as trimethylolpropane. Examples of the dicarboxylic acid include adipic acid, terephthalic acid, isophthalic acid, and sebacic acid. Polyol compounds of this type are known, for example, by Kuraray under the product names P-510, P-1010, P-2010, P-3010, P-4010, P-5010, P-6010, F-510, F-1010, F-2010, F-3010, P-2011, P-520, P-2020, P-1012, P-2012, P-630, P-2030, P-2050 or N-2010.

[0135] When the non-oil-modified polyol is an oligomeric or polymeric compound, the compound may have an appropriate level of molecular weight.

[0136] For example, the weight-average molecular weight of the oligomeric or polymeric non-oil-modified polyol may have a lower limit of about 100 g / mol, 200 g / mol, 300 g / mol, 400 g / mol, 500 g / mol, 600 g / mol, or 700 g / mol, and an upper limit of about 5,000 g / mol, 4,500 g / mol, 4,000 g / mol, 3,500 g / mol, 3,000 g / mol, 2,500 g / mol, 2,000 g / mol, 1,500 g / mol, 1,000 g / mol, or 900 g / mol. The weight-average molecular weight may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0137] By using the non-oil-modified polyols described above, the desired physical properties can be more effectively ensured. In addition, by using the oil-modified polyol described above as the first polyol and the non-oil-modified polyol described above as the second polyol, the desired physical properties can be more effectively ensured.

[0138] In a curable composition according to one example of the present application, the first or second polyol of the polyol component may be a polyester polyol having a polyester skeleton. The polyester polyol may be the oil-modified polyol or non-oil-modified polyol described above. By including a first polyol that is a polyester oil-modified polyol having a polyester skeleton and a second polyol that is a polyester non-oil-modified polyol having a polyester skeleton, the polyol component can more effectively ensure the desired physical properties.

[0139] In a curable composition according to an example of the present application, the first polyol of the polyol component may be an oligomeric or polymeric compound and may have an appropriate molecular weight. The weight-average molecular weight of the first polyol may have a lower limit of about 100 g / mol, 200 g / mol, 300 g / mol, 400 g / mol, 500 g / mol, 600 g / mol, or 700 g / mol, and an upper limit of about 2,000 g / mol, 1,500 g / mol, 1,000 g / mol, or 900 g / mol. The weight-average molecular weight may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0140] In a curable composition according to an example of the present application, the second polyol of the polyol component may be an oligomeric or polymeric compound and may have an appropriate molecular weight. The weight-average molecular weight of the second polyol may have a lower limit of about 500 g / mol, 600 g / mol, or 700 g / mol, and an upper limit of about 5,000 g / mol, 4,500 g / mol, 4,000 g / mol, 3,500 g / mol, 3,000 g / mol, 2,500 g / mol, 2,000 g / mol, 1,500 g / mol, 1,000 g / mol, or 900 g / mol. The weight-average molecular weight may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0141] In the curable composition according to one example of the present application, by controlling the weight average molecular weights of the first polyol and the second polyol of the polyol component within the above range, viscosity and thixotropy suitable for processing can be ensured.

[0142] In one example of a curable composition according to the present application, the polyol component may include a first polyol in an amount greater than 80 wt%, based on the total weight of the polyol component. The lower limit of the content of the first polyol in the polyol component may be about 81 wt%, 82 wt%, 83 wt%, 84 wt%, 85 wt%, 86 wt%, 87 wt%, 88 wt%, 89 wt%, or 90 wt%, based on the total weight of the polyol component, and the upper limit may be about 97 wt%, 96 wt%, 95 wt%, 94 wt%, 93 wt%, 92 wt%, or 91 wt%. The content of the first polyol in the polyol component may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0143] By controlling the content of the first polyol as described above, it is possible to obtain excellent compoundability in combination with the filler component described below, ensure viscosity and thixotropy suitable for the process, and ensure more dense curing during curing, ensuring excellent curability, and forming a cured product that exhibits low adhesive strength to a specific adherend, or that can exhibit low adhesive strength.

[0144] In a curable composition according to one example of the present application, a first polyol (P A ) and a second polyol (P B ) weight ratio (P A / P B ) may be 5 or more. A / P B The lower limit of the weight ratio (P) may be about 5.5, 6, 6.5, 7, 7.5, 8, 8.5, or 9, and the upper limit may be about 20, 18, 16, 14, 12, or 10. A / P B ) may be equal to or greater than any one of the aforementioned lower limits, equal to or less than any one of the aforementioned upper limits, or within a range between any one of the aforementioned lower limits and any one of the aforementioned upper limits.

[0145] The first polyol (P A ) and a second polyol (P B ) weight ratio (P A / P B By controlling the polyol content as described above, it is possible to obtain excellent compoundability in combination with the filler component described below, and to ensure viscosity and thixotropy suitable for the process. It is also possible to obtain a more dense cured product upon curing, ensuring excellent curability, and forming a cured product that exhibits low adhesive strength to a specific substrate, or that can exhibit low adhesive strength. In particular, when the polyol component of the curable composition is a first polyol (P A ) and a second polyol (P B ) weight ratio (P A / P B ) as described above, it is possible to form a cured product that exhibits low adhesion to both PET and aluminum, or that is capable of exhibiting low adhesion to both PET and aluminum.

[0146] In a curable composition according to one example of the present application, the first polyol may have an OH% in the range of 3 to 20. The lower limit of the OH% of the first polyol may be 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, or 7.5, and the upper limit may be 18, 16, 14, 12, or 10. The OH% of the first polyol may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. Furthermore, when the OH% of the first polyol satisfies the above range, a cured product of the curable composition having an appropriate hardness without brittleness can be obtained.

[0147] The term "OH% of a polyol" used in the present application may refer to the percentage by weight of hydroxy groups (-OH) contained in 1 mol of the polyol relative to the weight of 1 mol of the polyol.

[0148] In a curable composition according to one example of the present application, the second polyol may have an OH% in the range of 0.5 to 5. The lower limit of the OH% of the second polyol may be 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.25, 1.5, 1.75, 2, 2.25, or 2.5, and the upper limit may be 4.5, 4, 3.5, or 3. The OH% of the second polyol may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or between any one of the above lower limits and any one of the above upper limits. Furthermore, when the OH% of the first polyol satisfies the above range, a cured product of the curable composition having an appropriate hardness without brittleness can be obtained.

[0149] In the curable composition according to one example of the present application, the polyol component may further include another polyol different from the first polyol and the second polyol, which may be the oil-modified polyol or non-oil-modified polyol described above, or a mixture thereof.

[0150] The curable composition according to an embodiment of the present application may include a filler component. The curable composition may have viscosity and thixotropy suitable for processing through the combination of the polyol component and the filler component.

[0151] The curable composition according to one example of the present application is 2.4s -1The viscosity measured under a shear rate condition of 100 kcP or less at 25°C may be 400 kcP or less. The upper limit of the viscosity of the curable composition may be about 390 kcP, 380 kcP, 370 kcP, 360 kcP, 350 kcP, 340 kcP, 330 kcP, 320 kcP, 310 kcP, or 300 kcP, and the lower limit may be about 100 kcP, 105 kcP, 110 kcP, 115 kcP, 120 kcP, 125 kcP, 130 kcP, or 135 kcP. The viscosity of the curable composition may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or within a range between any one of the lower limits described above and any one of the upper limits described above.

[0152] A curable composition according to one example of the present application may have a thixotropic index (TI) of 5 or less, as determined by the following general formula 1: The upper limit of the thixotropic index of the curable composition may be about 4.9, 4.8, 4.7, 4.6, 4.5, 4.4, 4.3, 4.2, 4.1, or 4, and the lower limit may be about 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, or 2.7. The thixotropic index of the curable composition may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0153] [General formula 1] Thixotropic index (TI)=V1 / V2 In General Formula 1, V1 is 25°C and 0.24s -1 V2 is the viscosity of the curable composition measured under the conditions of 25°C and 2.4 s -1 The viscosity of the curable composition was measured under the following conditions.

[0154] A curable composition according to one embodiment of the present application may contain a filler component in a range of 70% by weight or more to 98% by weight or less, based on the total weight of the curable composition. The lower limit of the filler component content may be approximately 72% by weight, 74% by weight, 76% by weight, 78% by weight, 80% by weight, 82% by weight, 84% by weight, or 86% by weight, based on the total weight of the curable composition. The upper limit of the filler component content may be approximately 97% by weight, 96% by weight, 95% by weight, 94% by weight, 93% by weight, 92% by weight, or 91% by weight, based on the total weight of the curable composition. The filler component content may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. By controlling the filler component content as described above, a cured product having viscosity and thixotropy suitable for processing and excellent thermal conductivity may be formed.

[0155] In a curable composition according to an example of the present application, the filler component may include a filler. The type, shape, size, etc. of the filler are not particularly limited as long as they are those commonly used in the art. The filler component may include one or more fillers. The filler component may be the same type of filler, or a mixture of fillers with different shapes, sphericity, etc., or a mixture of fillers with different average particle sizes. For example, the filler component may be a mixture of aluminum hydroxide and aluminum oxide (alumina), and the aluminum hydroxide and aluminum oxide may have different shapes and average particle sizes.

[0156] In this application, the average particle size of filler particles is the D50 particle size of the filler, which is the particle size measured using a Marvern MASTERSIZER 3000 device in accordance with ISO-13320. Distilled water was used as the solvent during measurement. The incident laser is scattered by the filler dispersed in the solvent, and the intensity and directionality of the scattered laser vary depending on the size of the filler. The D50 particle size can be determined by analyzing this using Mie theory. Through this analysis, the distribution is determined by converting to the diameter of a sphere having the same volume as the dispersed filler, and the particle size can be evaluated by determining the D50 value, which is the median of the distribution.

[0157] In this application, a filler having a spherical shape may mean that the sphericity is about 0.9 or greater, and a non-spherical shape may mean that the sphericity is less than about 0.9. The sphericity can be confirmed through particle size analysis of the filler. Specifically, the sphericity of a filler, which is a three-dimensional particle, can be defined as the ratio (S' / S) of the surface area of ​​the particle (S) to the surface area of ​​a sphere having the same volume as the particle. For actual particles, circularity is generally used. The circularity is calculated by obtaining a two-dimensional image of the actual particle and expressing the ratio of the boundary of the image (P) to the boundary of a circle having the same area (A) as the same image, using the following formula:

[0158] <Circularity formula> Circularity = 4πA / P 2 The circularity is expressed as a value between 0 and 1, with a perfect circle having a value of 1 and particles with an irregular shape having a value lower than 1. The sphericity value in this application can be measured as the average value of the circularity measured using a particle size analyzer (FPIA-3000) from Marvern.

[0159] In one example of a curable composition according to the present application, the filler component may include a first filler having a specific gravity of 3 or less and a second filler having a specific gravity of more than 3. In the present application, the specific gravity of the filler may be based on a value measured by the density measurement method of JIS Z2512 (2012). By including the first filler and the second filler, the curable composition can simultaneously ensure low specific gravity and heat dissipation properties. The lower limit of the specific gravity of the first filler is not particularly limited, but may be approximately 0.5, 0.6, or 0.7. The specific gravity of the first filler may be within a range of 3 or less to any one of the above-mentioned lower limits. The upper limit of the specific gravity of the second filler is not particularly limited, but may be approximately 30, 28, 26, 24, 22, or 20. The specific gravity of the second filler may be within a range of more than 3 to any one of the above-mentioned upper limits. The specific gravity of the second filler may be within a range between 3.1 or more and any one of the upper limits mentioned above.

[0160] In a curable composition according to one example of the present application, the filler component may include a first filler in a range of 10% by weight to 80% by weight, based on the total weight of the curable composition. The upper limit of the content of the first filler may be approximately 75%, 70%, 65%, 60%, 55%, or 50% by weight, based on the total weight of the curable composition, and the lower limit of the content of the first filler may be approximately 11%, 12%, 13%, 14%, 15%, or 16% by weight, based on the total weight of the curable composition. The content of the first filler may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. By controlling the content of the first filler as described above, it is possible to simultaneously ensure low specific gravity and heat dissipation properties, and to prevent a sudden increase in adhesive strength in a thermal shock test according to Mil-Std-883 Method 1010 or JEDEC JESD22-A104.In addition, by controlling the content of the first filler as described above, it is possible to ensure a V-0 rating in the UL 94 V Test, even though the material is substantially free of halogen-containing flame retardants and phosphorus (P)-containing flame retardants.

[0161] In the curable composition according to one example of the present application, the first filler may be a metal hydroxide. The type of the metal hydroxide is not particularly limited, but may include one or more selected from the group consisting of aluminum hydroxide and magnesium hydroxide.

[0162] In a curable composition according to one example of the present application, for example, the first filler may be a metal hydroxide and have an average particle size of 60 μm or less. The lower limit of the average particle size of the first filler is not particularly limited, and may be 0.1 μm, 0.5 μm, or 1 μm. The average particle size of the first filler may be within a range between 60 μm or less and any one of the lower limits mentioned above. By controlling the average particle size of the first filler within the above ranges, it is possible to simultaneously ensure low specific gravity and heat dissipation properties, and to exhibit dischargeability and thixotropy suitable for processing.

[0163] In one example of the curable composition of the present application, the first filler may include one or more fillers having an average particle size of 60 μm or less. For example, the first filler may include a metal hydroxide having an average particle size of about 1 μm, or may include a filler having an average particle size of about 1 μm and a metal hydroxide having an average particle size of about 50 μm.

[0164] In a curable composition according to one example of the present application, the first filler may include a first metal hydroxide (O1) having an average particle size in the range of 10 μm or less than any one of the lower limits of the average particle size of the first filler, and a second metal hydroxide (O2) having an average particle size of 60 μm or less to more than 10 μm. By including the first metal hydroxide and the second metal hydroxide, the first filler can simultaneously ensure low specific gravity and heat dissipation properties, and can exhibit dischargeability and thixotropy suitable for processing.

[0165] In a curable composition according to one example of the present application, the weight ratio (O1 / O2) of the first metal hydroxide (O1) to the second metal hydroxide (O2) may be in the range of 0.1 to 2. The upper limit of the weight ratio (O1 / O2) may be about 1.8, 1.6, 1.4, 1.2, or 1, and the lower limit of the weight ratio (O1 / O2) may be about 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, or 0.8. The weight ratio (O1 / O2) may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. When the weight ratio (O1 / O2) of the first metal hydroxide (O1) to the second metal hydroxide (O2) of the first filler is within the above-mentioned range, low specific gravity and heat dissipation properties can be ensured at the same time, and the first filler can exhibit ejectability and thixotropy suitable for the process.

[0166] In one example of the curable composition of the present application, the ratio (D1 / D2) of the average particle size (D1) of the first metal hydroxide to the average particle size (D2) of the second metal hydroxide may be within a range of 0.005 to 0.1. The upper limit of the average particle size ratio (D1 / D2) may be approximately 0.09, 0.08, 0.07, or 0.06, and the lower limit of the average particle size ratio (D1 / D2) may be approximately 0.01, 0.015, or 0.02. The average particle size ratio (D1 / D2) may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or between any one of the lower limits and any one of the upper limits. When the average particle size ratio (D1 / D2) is within the aforementioned range, low specific gravity and heat dissipation properties can be simultaneously ensured, and the composition may exhibit process-appropriate dischargeability and thixotropy.

[0167] In a curable composition according to one example of the present application, the first filler may be a metal hydroxide and may include one or more fillers having an average particle size of more than 60 μm to 200 μm. Alternatively, the first filler may be a metal hydroxide and may include one or more fillers having an average particle size of 0.1 μm to 60 μm. Alternatively, the first filler may be a metal hydroxide and may include a filler having an average particle size of more than 60 μm to 200 μm and a filler having an average particle size of 0.1 μm to 60 μm, mixed in an appropriate ratio.

[0168] In a curable composition according to one example of the present application, the filler component may include a second filler in a range of 50 to 800 parts by weight relative to 100 parts by weight of the first filler. The upper limit of the content of the second filler may be approximately 750 parts by weight, 700 parts by weight, 650 parts by weight, 600 parts by weight, 550 parts by weight, or 500 parts by weight relative to 100 parts by weight of the first filler, and the lower limit of the content of the second filler may be approximately 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, or 80 parts by weight relative to 100 parts by weight of the first filler. The content of the second filler may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or within a range between any one of the lower limits and any one of the upper limits. By controlling the content of the second filler as described above, low specific gravity and heat dissipation properties can be simultaneously ensured.

[0169] In a curable composition according to one example of the present application, the second filler may include one or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, silicon nitride, aluminum nitride, silicon carbide, copper, silver, iron, and titanium.

[0170] In a curable composition according to one example of the present application, the second filler may be limited to the above-described type and may include a 2A filler having an average particle size of 65 μm or more. The upper limit of the average particle size of the 2A filler is not particularly limited, but may be approximately 200 μm, 180 μm, 160 μm, 140 μm, 120 μm, 100 μm, or 80 μm. The average particle size of the 2A filler may be within a range between 65 μm or more and any one of the above upper limits. By including a 2A filler having an average particle size within the above range in the second filler, low specific gravity and heat dissipation properties can be simultaneously ensured, and the composition can exhibit dischargeability and thixotropy suitable for processing.

[0171] In the curable composition according to one example of the present application, when the average particle size of the first filler is 60 μm or less as described above and the second filler includes a 2A filler, it is possible to simultaneously ensure even better low specific gravity characteristics and heat dissipation properties, and to exhibit ejection properties and thixotropy suitable for processing.

[0172] In the curable composition according to one example of the present application, the second filler may further include a second filler B having an average particle size of less than 65 μm to 10 μm or more. By including the second filler B, excellent heat dissipation properties can be ensured.

[0173] In a curable composition according to one example of the present application, the second filler comprises a second A filler and a second B filler, and the second A filler (X 2A ) and 2nd B filler (X 2B ) weight ratio (X 2A / X 2B ) may be in the range of 1 to 10. 2A / X 2B The upper limit of the weight ratio (X 2A / X 2B The lower limit of the weight ratio (X 2A / X 2B) may be equal to or greater than any one of the lower limits mentioned above, equal to or less than any one of the upper limits mentioned above, or may be within a range between any one of the lower limits mentioned above and any one of the upper limits mentioned above. 2A ) and 2nd B filler (X 2B ) weight ratio (X 2A / X 2B ) satisfies the above-mentioned range, low specific gravity characteristics and heat dissipation properties can be ensured at the same time, and the ink can exhibit ejection properties and thixotropy suitable for the process.

[0174] In a curable composition according to one example of the present application, the second filler includes a second A filler and a second B filler, and the second A filler has an average particle size (D 2A ) and the average particle size of the second B filler (D 2B ) ratio (D 2A / D 2B ) may be in the range of 1 to 10. 2A / D 2B The upper limit of the average particle diameter ratio (D 2A / D 2B The lower limit of the ratio of the average particle diameter (D 2A / D 2B ) satisfies the above-mentioned range, low specific gravity characteristics and heat dissipation properties can be ensured at the same time, and the ink can exhibit ejection properties and thixotropy suitable for the process.

[0175] In a curable composition according to one example of the present application, the second filler may be limited to the types described above, and may include a second C filler having an average particle size of less than 10 μm. The lower limit of the average particle size of the second C filler is not particularly limited, but may be approximately 0.01 μm, 0.05 μm, 0.1 μm, 0.5 μm, or 1 μm. The average particle size of the second C filler may be within a range from less than 10 μm to any one of the above-mentioned lower limits.

[0176] In a curable composition according to an example of the present application, one or more of the first filler and the second filler may be a thermally conductive filler. The thermally conductive filler may refer to a filler whose internal thermal conductivity is approximately 0.1 W / mK, 0.5 W / mK, 1 W / mK, 5 W / mK, 10 W / mK, or 15 W / mK at a lower limit, or approximately 400 W / mK, 380 W / mK, 350 W / mK, 320 W / mK, or 300 W / mK at an upper limit, but not particularly limited, of approximately 400 W / mK, 380 W / mK, 350 W / mK, 320 W / mK, or 300 W / mK at an upper limit, and whose internal thermal conductivity is within a range between any one of the above lower limits and any one of the above upper limits. The internal thermal conductivity of the filler may be measured according to ASTM E1461.

[0177] The thermal conductivity of the first filler may have a lower limit of about 0.1 W / mK, 0.5 W / mK, 1 W / mK, 5 W / mK, 10 W / mK, or 15 W / mK, or an upper limit of the thermal conductivity of the first filler, which is not particularly limited, may be about 400 W / mK, 380 W / mK, 350 W / mK, 320 W / mK, or 300 W / mK. The thermal conductivity of the first filler may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0178] The thermal conductivity of the second filler may have a lower limit of about 1 W / mK, 5 W / mK, 10 W / mK, or 15 W / mK, or an upper limit of the thermal conductivity of the second filler, which is not particularly limited, but may be about 400 W / mK, 380 W / mK, 350 W / mK, 320 W / mK, or 300 W / mK. The thermal conductivity of the first filler may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0179] In a curable composition according to an example of the present application, the filler component may further include a third filler different from the first filler and the second filler. The third filler may be a thermally conductive filler. The type of the third filler is not particularly limited, but may include one or more selected from the group consisting of metal oxide fillers such as aluminum oxide (alumina), magnesium oxide, beryllium oxide, or titanium oxide; metal hydroxide fillers such as aluminum hydroxide or magnesium hydroxide; nitride fillers such as boron nitride, silicon nitride, or aluminum nitride; carbide fillers such as silicon carbide; metal fillers such as copper, silver, iron, aluminum, or nickel; and metal alloy fillers. The shape and size of the third filler are not particularly limited as long as they are those commonly used in the art.

[0180] The curable composition according to one embodiment of the present application may further contain one or more additives exemplified below as needed to ensure further physical properties, however, the additives may be any additives commonly used in the art and are not necessarily limited to the additives exemplified below.

[0181] The curable composition according to one embodiment of the present application may further include a plasticizer. The type of plasticizer is not particularly limited, and may be one or more selected from the group consisting of phthalic acid compounds, phosphoric acid compounds, adipic acid compounds, sebacic acid compounds, citric acid compounds, glycolic acid compounds, trimellitic acid compounds, polyester compounds, epoxidized soybean oil, chlorinated paraffin, chlorinated fatty acid esters, fatty acid compounds, compounds having a saturated aliphatic chain substituted with a sulfonic acid group bonded to a phenyl group (e.g., mesamoll from LANXESS), and vegetable oils.

[0182] The phthalic acid compound may be one or more of dimethyl phthalate, diethyl phthalate, dibutyl phthalate, dihexyl phthalate, di-n-octyl phthalate, di-2-ethylhexyl phthalate, diisooctyl phthalate, dicapryl phthalate, dinonyl phthalate, diisononyl phthalate, didecyl phthalate, diundecyl phthalate, dilauryl phthalate, ditridecyl phthalate, dibenzyl phthalate, dicyclohexyl phthalate, butyl benzyl phthalate, octyl decyl phthalate, butyl octyl phthalate, octyl benzyl phthalate, n-hexyl n-decyl phthalate, n-octyl phthalate, and n-decyl phthalate. The phosphate compound may be one or more of tricresyl phosphate, trioctyl phosphate, triphenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, and trichloroethyl phosphate. The adipic acid compound can be one or more of dibutoxyethoxyethyl adipate (DBEEA), dioctyl adipate, diisooctyl adipate, di-n-octyl adipate, didecyl adipate, diisononyl adipate (DINA), diisodecyl adipate (DIDP), n-octyl n-decyl adipate, n-heptyl adipate, and n-nonyl adipate. The sebacic acid compound can be one or more of dibutyl sebacate, dioctyl sebacate, diisooctyl sebacate, and butyl benzyl. The citric acid compound can be one or more of triethyl citrate, acetyl triethyl citrate, tributyl citrate, acetyl tributyl citrate, and acetyl trioctyl citrate. The glycolic acid compound may be one or more of methylphthalyl ethyl glycolate, ethylphthalyl ethyl glycolate, and butylphthalyl ethyl glycolate.The trimellitic acid compound may be one or more of trioctyl trimellitate and tri-n-octyl n-decyl trimellitate.The polyester compound may be a reaction product of a diol selected from butanediol, ethylene glycol, propane 1,2-diol, propane 1,3-diol, polyethylene glycol, glycerol, a diacid (selected from adipic acid, succinic acid, succinic anhydride) and a hydroxy acid (e.g., hydroxystearic acid).

[0183] A curable composition according to one example of the present application may contain 0.1 to 2 parts by weight of a plasticizer relative to 100 parts by weight of the filler component. The upper limit of the plasticizer content may be approximately 1.9, 1.8, 1.7, 1.6, or 1.5 parts by weight relative to 100 parts by weight of the filler component, and the lower limit of the plasticizer content may be approximately 0.2, 0.3, 0.4, 0.5, 0.6, or 0.7 parts by weight relative to 100 parts by weight of the filler component. The plasticizer content may be equal to or greater than any one of the above lower limits, equal to or less than any one of the above upper limits, or within a range between any one of the above lower limits and any one of the above upper limits.

[0184] The curable composition according to the present application may further include a dispersant. Examples of the dispersant include polyamidoamines and their salts, polycarboxylic acids and their salts, modified polyurethanes, modified polyesters, modified poly(meth)acrylates, (meth)acrylic copolymers, naphthalenesulfonic acid-formalin condensates, polyoxyethylene alkyl phosphates, polyoxyethylene alkylamines, and pigment derivatives. However, any dispersant known in the art can be used without limitation.

[0185] Furthermore, the curable composition according to the present application may further include a viscosity modifier, such as a thixotropic agent, a diluent, or a coupling agent, to adjust the viscosity, for example, to increase or decrease the viscosity, or to adjust the viscosity under shear stress. The thixotropic agent can adjust the viscosity under shear stress. An example of a thixotropic agent that can be used is fumed silica. The diluent is typically used to reduce viscosity, and various types of diluents known in the art can be used without limitation as long as they can exhibit the above-mentioned function. The coupling agent can be used, for example, to improve the dispersibility of a filler component (e.g., alumina), and various types of coupling agents known in the art can be used without limitation as long as they can exhibit the above-mentioned function.

[0186] The curable composition according to one embodiment of the present application may further include a curing agent part that reacts with the polyol. Hereinafter, a composition that includes the curable composition as the main part and a curing agent part will be referred to as a two-component curable composition.

[0187] A two-part curable composition according to one example of the present application may include a base part and a curing agent part, where the base part includes a polyol component and a first filler component, and the curing agent part includes an isocyanate component and a second filler component.

[0188] In the two-component curable composition according to one example of the present application, the curable composition according to the above-mentioned example of the present application can be used as the base component. That is, the content of the polyol component of the curable composition according to the above-mentioned example of the present application can be referenced, and the content of the filler component of the curable composition can be referenced as the first filler component of the two-component curable composition.

[0189] A two-part curable composition according to one example of the present application contains at least some of the components that participate in curing physically separated. The two-part curable composition or a cured product thereof may have at least one of the following physical properties. Each of the following physical properties is independent, and no one property takes precedence over the other properties. At least one or more of the following physical properties may be satisfied. The following physical properties result from the combination of the components contained in the curable composition or a cured product thereof.

[0190] A two-component curable composition or a cured product thereof according to an embodiment of the present application may exhibit low adhesion to a specific substrate or may form a cured product capable of exhibiting low adhesion. Such a curable composition may be the polyurethane composition. Polyurethanes are known as adhesive materials that exhibit excellent adhesion to a variety of substrates. Therefore, a common method for making a polyurethane composition exhibit low adhesion to a substrate is to incorporate a component that reduces adhesion, such as a plasticizer. While the addition of such a component can reduce the adhesive strength of the polyurethane material, it can also cause problems, such as reducing other physical properties maintained by the polyurethane or leaching out of the material during use. However, the present application achieves the low adhesion of a polyurethane material while minimizing the amount of an adhesion-reducing component, such as a plasticizer. Therefore, the present application provides a material that retains the advantages of polyurethane materials while addressing the problem of high adhesive strength, which is not required for certain applications.

[0191] The two-component curable composition or its cured product according to one example of the present application has an adhesive strength to aluminum of 1 N / mm 2 In another example, the upper limit of the adhesive strength of the curable composition or the cured product thereof to aluminum may be 0.1 N / mm 2 , 0.099N / mm 2 , 0.098N / mm 2 , 0.097N / mm 2, 0.096N / mm 2 , 0.095N / mm 2 , 0.094N / mm 2 , 0.093N / mm 2 , 0.092N / mm 2 , 0.091N / mm 2 or 0.09N / mm 2 The adhesive strength of the curable composition or the cured product thereof to aluminum may be equal to or less than any one of the upper limits described above. In the present application, the lower limit of the adhesive strength to aluminum is not particularly limited. In one example, the adhesive strength to aluminum is 0 N / mm 2 or more or 0N / mm 2 The curable composition may be a curable composition whose adhesive strength to aluminum is not substantially measurable, or may be a curable composition capable of forming a cured product whose adhesive strength to aluminum is substantially measurable. Therefore, the adhesive strength to aluminum is 0 N / mm 2 or more or 0N / mm 2 The adhesion strength of the curable composition or its cured product to aluminum can be measured by the method described in the Examples section of this specification.

[0192] The two-component curable composition or its cured product according to one example of the present application may have an adhesive strength to polyester of 100 gf / cm or less. In other examples, the upper limit of the adhesive strength of the curable composition or its cured product to polyester may be 99.9 gf / cm, 99.8 gf / cm, 99.7 gf / cm, 99.6 gf / cm, 99.5 gf / cm, 99.4 gf / cm, 99.3 gf / cm, 99.2 gf / cm, 99.1 gf / cm, or 99 gf / cm. The adhesive strength of the curable composition or its cured product to polyester may be equal to or less than any one of the above upper limits. In the present application, the lower limit of the adhesive strength to polyester is not particularly limited. In one example, the lower limit of the adhesive strength of the curable composition or its cured product to polyester may be approximately 0 gf / cm, 2 gf / cm, 4 gf / cm, 6 gf / cm, 8 gf / cm, 10 gf / cm, 12 gf / cm, 14 gf / cm, 16 gf / cm, 18 gf / cm, or 20 gf / cm. The curable composition or its cured product may exhibit substantially no adhesive strength to polyester. The adhesive strength of the curable composition or its cured product to polyester may be in a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. The adhesive strength of the curable composition or its cured product to polyester may be measured by the method described in the Examples of this specification.

[0193] A two-component curable composition or a cured product thereof according to an example of the present application may exhibit excellent thermal conductivity. For example, the lower limit of the thermal conductivity of the curable composition or a cured product thereof may be approximately 2.0 W / mK, 2.1 W / mK, 2.2 W / mK, 2.3 W / mK, 2.4 W / mK, 2.5 W / mK, 2.6 W / mK, 2.7 W / mK, 2.8 W / mK, 2.9 W / mK, or 3 W / mK. The thermal conductivity may be equal to or greater than any one of the above-mentioned lower limits. There is no particular limit on the upper limit of the thermal conductivity. For example, the upper limit of the thermal conductivity of the curable composition or a cured product thereof may be approximately 10 W / mK, 9 W / mK, 8 W / mK, 7 W / mK, 6 W / mK, 5 W / mK, or 4 W / mK. The thermal conductivity may be in a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. The thermal conductivity of such a curable composition or a cured product thereof can be measured by the method disclosed in the Examples below.

[0194] A two-part curable composition or a cured product thereof according to an embodiment of the present application may also exhibit an appropriate hardness. For example, if the hardness of the curable composition or the cured product thereof is too high, significant brittleness may occur, causing problems. Furthermore, adjusting the hardness of the curable composition or the cured product thereof can ensure impact resistance and vibration resistance, thereby ensuring product durability, depending on the application. The curable composition or the cured product thereof may have a Shore OO hardness of 100, 98, 96, 94, 92, or 90. The Shore OO hardness may be equal to or less than any one of the above upper limits. The lower limit of the Shore OO hardness may be 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, or 80. The Shore OO hardness may be equal to or greater than any one of the above lower limits. The Shore OO hardness may be within a range between any one of the upper limits described above and any one of the lower limits described above. The hardness of the curable composition or the cured product thereof may be measured by the method disclosed in the Examples below.

[0195] A two-part curable composition or a cured product thereof according to an example of the present application may also exhibit appropriate flexibility. For example, adjusting the flexibility of the curable composition or a cured product thereof to a desired level can greatly expand the range of applications. For example, the upper limit of the radius of curvature of the curable composition or a cured product thereof may be approximately 20 mm, 19 mm, 18 mm, 17 mm, 16 mm, 15 mm, 14 mm, 13 mm, 12 mm, 11 mm, 10 mm, or 9 mm. The radius of curvature may be equal to or less than any one of the upper limits described above. The lower limit of the radius of curvature may be, for example, approximately 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, or 7 mm. The radius of curvature may be equal to or greater than any one of the lower limits described above. The radius of curvature may be within a range between any one of the upper limits described above and any one of the lower limits described above. The radius of curvature of such a curable composition or a cured product thereof may be measured using the method disclosed in the Examples described below.

[0196] A two-component curable composition or a cured product thereof according to one embodiment of the present application may be insulating. That is, the curable composition has insulating properties and / or can form a cured product having insulating properties. For example, the curable composition or a cured product thereof may have a lower limit of breakdown voltage measured in accordance with ASTM D149 of approximately 3 kV / mm, 5 kV / mm, 7 kV / mm, 10 kV / mm, 15 kV / mm, or 20 kV / mm. The breakdown voltage may be equal to or greater than any one of the above lower limits. A higher breakdown voltage indicates better insulating properties. The upper limit is not particularly limited, but taking into account the composition of the curable composition, the upper limit of the breakdown voltage may be approximately 50 kV / mm, 45 kV / mm, 40 kV / mm, 35 kV / mm, or 30 kV / mm. The breakdown voltage may be equal to or less than any one of the above upper limits. The breakdown voltage can be controlled by adjusting the insulating properties of the curable composition, for example, by incorporating an insulating filler into the composition. Among fillers, ceramic fillers are generally known to be components capable of ensuring insulating properties. Furthermore, if the cured product of the curable composition can ensure the electrical insulating properties, it can maintain performance and ensure stability with various materials, such as cases and battery cells included in battery modules.

[0197] A two-part curable composition or a cured product thereof according to an embodiment of the present application may have flame retardancy. The curable composition or a cured product thereof may exhibit a V-0 rating in the UL 94 V Test (Vertical Burning Test). This ensures stability against fires and other accidents that may be a concern depending on the application of the curable composition. Conventionally, flame retardancy has generally been achieved through the use of halogen-containing flame retardants, phosphorus-containing flame retardants, or combinations thereof.

[0198] However, the curable composition or its cured product may be substantially free of a halogen-containing flame retardant and a phosphorus (P)-containing flame retardant through an appropriate combination of a polyol component and a filler component described below, and may be rated V-0 when measured according to the UL 94 V Test.

[0199] In a two-component curable composition or a cured product thereof according to an embodiment of the present application, the combined content of halogen and phosphorus may be 0.3 wt % or less, based on the total content of the curable composition or cured product. The upper limit of the combined content of halogen and phosphorus may be 0.29 wt %, 0.28 wt %, 0.27 wt %, 0.26 wt %, 0.25 wt %, 0.24 wt %, 0.23 wt %, 0.22 wt %, 0.21 wt %, or 0.2 wt % based on the total content of the curable composition or cured product. The combined content of halogen and phosphorus may be equal to or less than any one of the above upper limits. The lower limit of the combined content of halogen and phosphorus is not particularly limited, but may be 0 wt % (not included) or more than 0 wt % based on the total content of the curable composition or cured product. The combined content of halogen and phosphorus confirms that the curable composition or a cured product thereof is substantially free of halogen-containing flame retardants and phosphorus-containing flame retardants. The combined content of the halogen and phosphorus elements may be equal to or greater than any one of the above-mentioned lower limits, or may be within a range between any one of the above-mentioned upper limits and any one of the above-mentioned lower limits.

[0200] The halogen content, phosphorus content, and combined halogen and phosphorus content of a two-part curable composition or a cured product thereof according to an example of the present application can be measured by ICP analysis. The halogen content of a two-part curable composition or a cured product thereof according to an example of the present application may be 0.3 wt% or less based on the total content of the curable composition or cured product. The upper limit of the halogen content may be 0.29 wt%, 0.28 wt%, 0.27 wt%, 0.26 wt%, 0.25 wt%, 0.24 wt%, 0.23 wt%, 0.22 wt%, 0.21 wt%, or 0.2 wt% based on the total content of the curable composition or cured product. The halogen content may be equal to or less than any one of the above upper limits. The lower limit of the halogen content is not particularly limited, but may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or cured product. The curable composition or its cured product can be confirmed to be substantially free of a halogen-containing flame retardant through the halogen content. The halogen content may be equal to or greater than any one of the above-mentioned lower limits. The halogen content may be within a range between any one of the above-mentioned upper limits and any one of the above-mentioned lower limits.

[0201] In a two-component curable composition or a cured product thereof according to an example of the present application, the phosphorus content may be 0.3 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the phosphorus content may be 0.29 wt%, 0.28 wt%, 0.27 wt%, 0.26 wt%, 0.25 wt%, 0.24 wt%, 0.23 wt%, 0.22 wt%, 0.21 wt%, or 0.2 wt% based on the total content of the curable composition or cured product. The phosphorus content may be equal to or less than any one of the above upper limits. The lower limit of the phosphorus content is not particularly limited, but may be 0 wt% (absent) or more than 0 wt% based on the total content of the curable composition or cured product. The phosphorus content of the curable composition or a cured product thereof can be used to confirm that the curable composition or a cured product thereof is substantially free of a phosphorus-containing flame retardant. The phosphorus content may be equal to or greater than any one of the above lower limits. The phosphorus content may be within a range between any one of the above upper limits and any one of the above lower limits.

[0202] In a two-component curable composition or a cured product thereof according to one example of the present application, the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or the cured product. The upper limit of the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt% based on the total content of the curable composition or the cured product. The combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant is not particularly limited, and may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or the cured product. The combined content of the halogen-containing flame retardant and the phosphorus-containing flame retardant may be equal to or greater than any one of the above-mentioned lower limits, or may be within a range between any one of the above-mentioned upper limits and any one of the above-mentioned lower limits. In a two-component curable composition or a cured product thereof according to one example of the present application, the content of the halogen-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the content of the halogen-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt%, based on the total content of the curable composition or cured product. The content of the halogen-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the content of the halogen-containing flame retardant is not particularly limited, but may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or cured product. The content of the halogen-containing flame retardant may be equal to or greater than any one of the above lower limits. The content of the halogen-containing flame retardant may be within a range between any one of the above upper limits and any one of the above lower limits.

[0203] In a two-component curable composition or a cured product thereof according to one example of the present application, the content of the phosphorus-containing flame retardant may be 1 wt% or less, based on the total content of the curable composition or cured product. The upper limit of the content of the phosphorus-containing flame retardant may be 0.9 wt%, 0.8 wt%, 0.7 wt%, 0.6 wt%, 0.5 wt%, 0.4 wt%, 0.3 wt%, 0.2 wt%, 0.1 wt%, 0.01 wt%, or 0.001 wt%, based on the total content of the curable composition or cured product. The content of the phosphorus-containing flame retardant may be equal to or less than any one of the above upper limits. The lower limit of the content of the phosphorus-containing flame retardant is not particularly limited, but may be 0 wt% (excluding) or more than 0 wt% based on the total content of the curable composition or cured product. The content of the phosphorus-containing flame retardant may be equal to or greater than any one of the above lower limits. The content of the phosphorus-containing flame retardant may be within a range between any one of the above upper limits and any one of the above lower limits.

[0204] A two-component curable composition or a cured product thereof according to one example of the present application may have a specific gravity of 3 or less. The upper limit of the specific gravity may be 2.99, 2.98, 2.97, or 2.96. The upper limit of the specific gravity may be equal to or less than any one of the above upper limits. The above specific gravity can be achieved by applying a filler with a low specific gravity and / or a surface-treated filler. Furthermore, since a lower specific gravity value is advantageous for reducing the weight of applied products, the lower limit is not particularly limited. For example, the specific gravity may be equal to or greater than about 1.5 or 2. The specific gravity may be equal to or greater than any one of the above lower limits. The specific gravity may be within a range between any one of the above upper limits and any one of the above lower limits.

[0205] As described above, a two-part curable composition or a cured product thereof according to an embodiment of the present application can be used as a thermal interface material, for example, to rapidly dissipate heat generated during fast charging of a battery, thereby reducing the risk of fire. However, achieving heat dissipation performance typically requires the use of an excessive amount of a high-specific-gravity, thermally conductive filler, which increases the weight of the battery and ultimately the weight of the product to which the battery is applied. This is particularly detrimental to the fuel economy of electric vehicles. Therefore, to achieve a low specific gravity of the curable composition or a cured product thereof, the content of the high-specific-gravity filler must be reduced. However, reducing the amount of the high-specific-gravity filler reduces heat dissipation performance, making it difficult to prevent fires caused by accumulated heat. In other words, low specific gravity and high thermal conductivity are in a trade-off relationship.

[0206] The two-component curable composition or its cured product according to one example of the present application can simultaneously ensure low specific gravity and heat dissipation properties despite the trade-off relationship by using an appropriate combination of filler components described below.

[0207] The curable composition according to an embodiment of the present application may have low shrinkage during or after curing. This can prevent peeling or voids that may occur during application. The shrinkage may be appropriately adjusted within a range that can exhibit the above-mentioned effects, and may be, for example, less than 5%, less than 3%, or less than about 1%. The lower the shrinkage, the more advantageous it is, so the lower limit is not particularly limited.

[0208] A two-part curable composition or a cured product thereof according to an embodiment of the present application may have a low coefficient of thermal expansion (CTE). This can prevent peeling or voids that may occur during application or use. The CTE can be appropriately adjusted within a range that can exhibit the above-mentioned effects, and may be, for example, less than 300 ppm / K, less than 250 ppm / K, less than 200 ppm / K, less than 150 ppm / K, or less than about 100 ppm / K. Since a lower CTE is more advantageous, the lower limit of the CTE is not particularly limited.

[0209] The two-component curable composition or its cured product according to one example of the present application may also have a 5% weight loss temperature of 400°C or higher in thermogravimetric analysis (TGA) and an 800°C residual of 70% by weight or higher. Such characteristics can further improve high-temperature stability. In other examples, the 800°C residual may be about 75% by weight or higher, about 80% by weight or higher, about 85% by weight or higher, or about 90% by weight or higher. In other examples, the 800°C residual may be about 99% by weight or lower. The thermogravimetric analysis (TGA) is performed at 60 cm 3 The thermogravimetric analysis (TGA) results can be measured in the range of 25°C to 800°C at a heating rate of 20°C / min under a nitrogen (N2) atmosphere. The thermogravimetric analysis (TGA) results can also be achieved by adjusting the composition of the curable composition. For example, the 800°C residual capacity usually depends on the type and proportion of filler contained in the curable composition, and if an excessive amount of filler is contained, the residual capacity increases.

[0210] In one example of the two-component curable composition of the present application, the isocyanate component contained in the curing agent part may contain 55% by weight or more, 60% by weight or more, 65% by weight or more, 70% by weight or more, 75% by weight or more, 80% by weight or more, 85% by weight or more, 90% by weight or more, 95% by weight or more, 99% by weight or more, or 100% by weight of the isocyanate compound relative to the total weight.

[0211] The term "isocyanate compound" used in the present application may refer to a compound having a minimum number of isocyanate groups of about one or two per molecule. The maximum number of isocyanate groups in the isocyanate is not particularly limited, but may be about 10, 9, 8, 7, 6, 5, 4, or 3 per molecule. The number of isocyanate groups contained in the isocyanate compound may be equal to or greater than any one of the lower limits listed above, equal to or less than any one of the upper limits listed above, or within a range between any one of the lower limits listed above and any one of the upper limits listed above. In the present application, when the isocyanate compound has one isocyanate group per molecule, the isocyanate compound can be referred to as a monofunctional isocyanate compound. When the isocyanate compound has two or more isocyanate groups per molecule, the isocyanate compound can be referred to as a polyisocyanate compound. From the viewpoint of reacting with the polyol component in the base resin to form a polyurethane resin, the isocyanate compound is suitably a polyisocyanate compound. The isocyanate compound can be named according to the number of isocyanate groups, such as a bifunctional isocyanate compound or a diisocyanate compound (having two isocyanate groups).

[0212] In the two-component curable composition according to one example of the present application, the type of isocyanate compound is not particularly limited, but a non-aromatic polyisocyanate containing no aromatic group can be used to ensure the desired physical properties. Furthermore, in the two-component curable composition according to one example of the present application, when taking into consideration the combination of polyol components contained in the base composition, it is more suitable to use a non-aromatic polyisocyanate containing no aromatic group and having three or more isocyanate groups as the isocyanate compound to ensure the desired physical properties.

[0213] Examples of the polyisocyanate compound include aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate, and tetramethylene diisocyanate; alicyclic polyisocyanates such as transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanatomethyl)cyclohexane diisocyanate, and dicyclohexylmethane diisocyanate; and carbodiimide-modified polyisocyanates and isocyanurate-modified polyisocyanates containing one or more of the above. The polyisocyanate may also be an addition reaction product of the above-mentioned diisocyanates and polyols (e.g., trimethylolpropane). Examples of the polyisocyanate compound include trimers of the above-mentioned diisocyanates. Also, mixtures of two or more of the compounds listed above can be used.

[0214] In one example of a two-component curable composition according to the present application, the curing agent part may contain an isocyanate component in a range of 1 wt% to 10 wt% based on the total weight of the curing agent part. The upper limit of the isocyanate component content may be approximately 9 wt%, 8 wt%, 7 wt%, or 6 wt% based on the total weight of the curing agent part, and the lower limit of the isocyanate component content may be approximately 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, or 3.5 wt%. The isocyanate component content may be equal to or greater than any one of the lower limits listed above, equal to or less than any one of the upper limits listed above, or between any one of the lower limits listed above and any one of the upper limits listed above.

[0215] In the two-component curable composition according to one embodiment of the present application, the curing agent part may include a second filler component. The combination of the isocyanate component and the second filler component allows the curing agent part to have viscosity and thixotropy suitable for processing.

[0216] In one example of the two-part curable composition of the present application, the curing agent part is 2.4s -1 The viscosity of the curing agent part measured under a shear rate condition of 390 kcP or less at 25°C may be approximately 380 kcP, 370 kcP, 360 kcP, 350 kcP, 340 kcP, 330 kcP, 320 kcP, 310 kcP, or 300 kcP. The upper limit of the viscosity of the curing agent part may be approximately 90 kcP, 100 kcP, 105 kcP, 110 kcP, 115 kcP, 120 kcP, 125 kcP, 130 kcP, or 135 kcP. The viscosity of the curing agent part may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or within a range between any one of the lower limits and any one of the upper limits.

[0217] In a two-component curable composition according to one example of the present application, the curing agent part may have a thixotropic index (TI) of 10 or less, as determined by the following general formula 2: The upper limit of the thixotropic index of the curing agent part may be about 9, 8, or 7, and the lower limit of the thixotropic index of the curing agent part may be about 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, or 2.8. The thixotropic index of the curing agent part may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or within a range between any one of the lower limits described above and any one of the upper limits described above.

[0218] [General formula 2] Thixotropic index (TI)=V3 / V4 In general formula 2, V3 is 25°C and 0.24s -1V4 is the viscosity of the hardener part measured under the conditions of 25°C and 2.4s -1 The viscosity of the curing agent part was measured under the following conditions.

[0219] In one example of a two-component curable composition according to the present application, the curing agent part may contain a second filler component in an amount ranging from 1,000 to 3,000 parts by weight per 100 parts by weight of the isocyanate component. The lower limit of the amount of the second filler component may be approximately 1,100 parts by weight, 1,200 parts by weight, 1,300 parts by weight, 1,400 parts by weight, 1,500 parts by weight, 1,600 parts by weight, or 1,700 parts by weight per 100 parts by weight of the isocyanate component. The upper limit of the amount of the second filler component may be approximately 2,900 parts by weight, 2,800 parts by weight, 2,700 parts by weight, 2,600 parts by weight, 2,500 parts by weight, or 2,400 parts by weight per 100 parts by weight of the isocyanate component. The content of the second filler component may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. By controlling the content of the second filler component as described above, a cured product having viscosity and thixotropy suitable for processing and excellent thermal conductivity can be formed.

[0220] In a two-component curable composition according to one example of the present application, the second filler component of the curing agent part may include a filler. The type, shape, size, etc. of the filler are not particularly limited as long as they are those commonly used in the art. The filler component may include one or more fillers. The filler component may be the same type, or may be a mixture of fillers with different shapes or sphericities, or a mixture of fillers with different average particle diameters.

[0221] In a two-component curable composition according to one example of the present application, the second filler component of the curing agent part may include a second filler having a specific gravity of more than 3. The upper limit of the specific gravity of the second filler is not particularly limited, but may be approximately 30, 28, 26, 24, 22, or 20. The specific gravity of the second filler may be in a range between more than 3 and any one of the above-mentioned upper limits. The specific gravity of the second filler may be in a range between 3.1 or more and any one of the above-mentioned upper limits.

[0222] In a two-component curable composition according to one example of the present application, the second filler component of the curing agent part may optionally contain a first filler having a specific gravity of 3 or less. The lower limit of the specific gravity of the first filler is not particularly limited, but may be about 0.5, 0.6, or 0.7, and the specific gravity of the first filler may be within a range between 3 or less and any one of the above-mentioned lower limits.

[0223] In one example of a two-part curable composition according to the present application, the second filler component of the curing agent part may include one or more thermally conductive fillers. The fillers included in the second filler component may include one or more fillers selected from the group consisting of metal oxide fillers such as aluminum oxide (alumina), magnesium oxide, beryllium oxide, or titanium oxide; metal hydroxide fillers such as aluminum hydroxide or magnesium hydroxide; nitride fillers such as boron nitride, silicon nitride, or aluminum nitride; carbide fillers such as silicon carbide; metal fillers such as copper, silver, iron, aluminum, or nickel; and metal alloy fillers. The shape and size of the third filler are not particularly limited as long as they are those commonly used in the art.

[0224] In the two-component curable composition according to one embodiment of the present application, the curing agent part may further contain one or more additives exemplified below, if necessary, to ensure further physical properties. However, the additives may be any additives commonly used in the art, and are not necessarily limited to the additives exemplified below.

[0225] In one example of the two-part curable composition of the present application, the curing agent part may further include a plasticizer. The type of plasticizer is not particularly limited, and may be, for example, one or more selected from phthalic acid compounds, phosphoric acid compounds, adipic acid compounds, sebacic acid compounds, citric acid compounds, glycolic acid compounds, trimellitic acid compounds, polyester compounds, epoxidized soybean oil, chlorinated paraffin, chlorinated fatty acid esters, fatty acid compounds, compounds having a saturated aliphatic chain substituted with a sulfonic acid group bonded to a phenyl group (e.g., mesamoll by LANXESS), and vegetable oils.

[0226] The phthalic acid compound may be one or more of dimethyl phthalate, diethyl phthalate, dibutyl phthalate, dihexyl phthalate, di-n-octyl phthalate, di-2-ethylhexyl phthalate, diisooctyl phthalate, dicapryl phthalate, dinonyl phthalate, diisononyl phthalate, didecyl phthalate, diundecyl phthalate, dilauryl phthalate, ditridecyl phthalate, dibenzyl phthalate, dicyclohexyl phthalate, butyl benzyl phthalate, octyl decyl phthalate, butyl octyl phthalate, octyl benzyl phthalate, n-hexyl n-decyl phthalate, n-octyl phthalate, and n-decyl phthalate. The phosphate compound may be one or more of tricresyl phosphate, trioctyl phosphate, triphenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, and trichloroethyl phosphate. The adipic acid compound can be one or more of dibutoxyethoxyethyl adipate (DBEEA), dioctyl adipate, diisooctyl adipate, di-n-octyl adipate, didecyl adipate, diisononyl adipate (DINA), diisodecyl adipate (DIDP), n-octyl n-decyl adipate, n-heptyl adipate, and n-nonyl adipate. The sebacic acid compound can be one or more of dibutyl sebacate, dioctyl sebacate, diisooctyl sebacate, and butyl benzyl. The citric acid compound can be one or more of triethyl citrate, acetyl triethyl citrate, tributyl citrate, acetyl tributyl citrate, and acetyl trioctyl citrate. The glycolic acid compound may be one or more of methylphthalyl ethyl glycolate, ethylphthalyl ethyl glycolate, and butylphthalyl ethyl glycolate.The trimellitic acid compound may be one or more of trioctyl trimellitate and tri-n-octyl n-decyl trimellitate.The polyester compound may be a reaction product of a diol selected from butanediol, ethylene glycol, propane 1,2-diol, propane 1,3-diol, polyethylene glycol, glycerol, a diacid (selected from adipic acid, succinic acid, succinic anhydride), and a hydroxy acid (e.g., hydroxystearic acid).

[0227] In one example of a two-component curable composition according to the present application, the curing agent part may contain 50 to 200 parts by weight of a plasticizer relative to 100 parts by weight of the isocyanate component. The upper limit of the plasticizer content may be approximately 190 parts by weight, 180 parts by weight, 170 parts by weight, 160 parts by weight, 150 parts by weight, 140 parts by weight, 130 parts by weight, or 120 parts by weight relative to 100 parts by weight of the isocyanate component. The lower limit of the plasticizer content may be approximately 70 parts by weight, 80 parts by weight, or 90 parts by weight relative to 60 parts by weight of the isocyanate component. The plasticizer content may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits.

[0228] In the two-part curable composition according to one embodiment of the present application, the curing agent part may further include a dispersant. Examples of the dispersant include polyamidoamines and their salts, polycarboxylic acids and their salts, modified polyurethanes, modified polyesters, modified poly(meth)acrylates, (meth)acrylic copolymers, naphthalenesulfonic acid-formaldehyde condensates, polyoxyethylene alkyl phosphates, polyoxyethylene alkylamines, and pigment derivatives. However, any dispersant known in the art can be used without limitation.

[0229] In a two-component curable composition according to one example of the present application, the curing agent part may further contain a viscosity modifier, such as a thixotropic agent, diluent, or coupling agent, to adjust the viscosity, for example, to increase or decrease the viscosity, or to adjust the viscosity under shear stress. The thixotropic agent can adjust the viscosity under shear stress. An example of a thixotropic agent that can be used is fumed silica. The diluent is typically used to reduce viscosity, and various types known in the art can be used without limitation as long as they can exhibit the above-mentioned function. In the case of a coupling agent, for example, it can be used to improve the dispersibility of a filler component (e.g., alumina), and various types known in the art can be used without limitation as long as they can exhibit the above-mentioned function.

[0230] In one example of a two-component curable composition according to the present application, the combined content of the first filler component in the base part and the second filler component in the curing agent part may be in the range of 70% by weight to 98% by weight, based on the total weight of the two-component curable composition. The lower limit of the combined content of the first filler component and the second filler component may be approximately 72%, 74%, 76%, 78%, 80%, 82%, 84%, or 86% by weight, based on the total weight of the two-component curable composition. The upper limit of the combined content of the first filler component and the second filler component may be 97%, 96%, 95%, 94%, 93%, 92%, or 91% by weight, based on the total weight of the two-component curable composition. The combined content of the first filler component and the second filler component may be equal to or greater than any one of the lower limits described above, equal to or less than any one of the upper limits described above, or between any one of the lower limits described above and any one of the upper limits described above. By controlling the combined content of the first filler component and the second filler component as described above, a cured product having viscosity and thixotropy suitable for processing and excellent thermal conductivity can be formed.

[0231] In a two-component curable composition according to one example of the present application, one or more selected from the group consisting of a first filler component of the base part and a second filler component of the curing agent part may include a first filler having a specific gravity of 3 or less. The lower limit of the specific gravity of the first filler is not particularly limited, but may be about 0.5, 0.6, or 0.7, and the specific gravity of the first filler may be within a range between 3 or less and any one of the above-mentioned lower limits.

[0232] In one example of the two-component curable composition of the present application, the first filler may be contained in an amount ranging from 5% by weight to 60% by weight, based on the total weight of the two-component curable composition. The upper limit of the amount of the first filler may be approximately 59%, 58%, 57%, 56%, 55%, 54%, 53%, 52%, 51%, 50%, 49%, 48%, 47%, 46%, 45%, or 44% by weight, based on the total weight of the two-component curable composition. The lower limit of the amount of the first filler may be approximately 5.2%, 5.4%, 5.6%, 5.8%, 6%, 6.2%, 6.4%, 6.6%, 6.8%, 7%, 7.2%, or 7.4% by weight. The content of the first filler may be equal to or greater than any one of the lower limits, equal to or less than any one of the upper limits, or between any one of the lower limits and any one of the upper limits. By controlling the content of the first filler as described above and combining it with the polyol and isocyanate compound, etc., it is possible to ensure a V-0 rating in the UL 94 V Test even without substantially containing a halogen-containing flame retardant or a phosphorus (P)-containing flame retardant. Furthermore, if the content of the first filler is less than the above range, it may be difficult to ensure flame retardancy without the use of a halogen-containing flame retardant or a phosphorus (P)-containing flame retardant. In addition, by controlling the content of the first filler as described above and combining it with the aforementioned polyol and isocyanate compound, it is possible to simultaneously ensure low specific gravity characteristics and heat dissipation properties, and to prevent a sudden increase in adhesive strength even in a thermal shock test according to Mil-Std-883 Method 1010 or JEDEC JESD22-A104.

[0233] In a two-component curable composition according to one example of the present application, one or more selected from the group consisting of the first filler component of the base part and the second filler component of the curing agent part may include a second filler having a specific gravity of more than 3. The upper limit of the specific gravity of the second filler is not particularly limited, but may be about 30, 28, 26, 24, 22, or 20, and the specific gravity of the second filler may be in a range between more than 3 and any one of the above upper limits. Furthermore, the specific gravity of the second filler may be in a range between 3.1 or more and any one of the above upper limits.

[0234] A two-part curable composition according to an example of the present application may include a first filler and a second filler. The two-part curable composition may include 100 to 2,000 parts by weight of the second filler relative to 100 parts by weight of the first filler. The lower limit of the content of the second filler may be approximately 105, 110, 115, 120, or 125 parts by weight relative to 100 parts by weight of the first filler, and the upper limit of the content of the second filler may be approximately 1,900, 1,800, 1,700, 1,600, 1,500, 1,400, or 1,300 parts by weight. The content of the second filler may be equal to or greater than any one of the above-mentioned lower limits, equal to or less than any one of the above-mentioned upper limits, or within a range between any one of the above-mentioned lower limits and any one of the above-mentioned upper limits. By controlling the content of the second filler as described above, it is possible to simultaneously ensure low specific gravity and heat dissipation properties.

[0235] The two-component curable composition according to one example of the present application is a base part (V A ) and hardener parts (V B ) volume ratio (V A / V B ) may be in the range of 0.5 or more and 2 or less. A / V B The upper limit of the volume ratio (V A / V B The lower limit of the volume ratio (V A / V B ) may be equal to or greater than any one of the aforementioned lower limits, equal to or less than any one of the aforementioned upper limits, or within a range between any one of the aforementioned lower limits and any one of the aforementioned upper limits.

[0236] A device according to one example of the present application includes a heat-generating element and a heat transfer body in thermal contact with the heat-generating element, and the heat transfer body may include a cured product of a curable composition. The heat transfer body of the device may also include a cured product of a two-component curable composition containing a base part and a hardener part. That is, the heat transfer body of the device may include a cured product of a curable composition, and the heat transfer body may include one or more selected from the group consisting of two-component curable compositions containing a base part and a hardener part. The term "thermal contact" as used herein means that the cured product of the curable composition is in direct physical contact with the heat-generating element to dissipate heat generated by the heat-generating element, or that the cured product of the curable composition is in direct physical contact with the heat-generating element to dissipate heat generated by the heat-generating element, even if the cured product of the curable composition is not in direct contact with the heat-generating element (i.e., there is an additional layer between the cured product of the curable composition and the heat-generating element).

[0237] Examples of devices according to the present application include various electrical and electronic products such as irons, washing machines, dryers, clothes care machines, electric shavers, microwave ovens, electric ovens, electric rice cookers, refrigerators, dishwashers, air conditioners, electric fans, humidifiers, air purifiers, mobile phones, walkie-talkies, televisions, radios, computers, and laptops, as well as batteries such as secondary batteries. A cured product of the curable composition can dissipate heat generated in the devices. In particular, the curable composition of the present application can be used as a material connecting battery modules in electric vehicle batteries, which are manufactured by assembling battery cells to form a battery module and then assembling multiple battery modules to form a battery pack. When the curable composition of the present application is used as a material connecting battery modules, it can dissipate heat generated in the battery cells and secure the battery cells against external shock and vibration.

[0238] The device according to an example of the present application may also dissipate heat generated by the heat-generating element through a heat transfer body and transfer the heat to a cooling portion. The cooling portion may be in thermal contact with the heat transfer body and may have a lower temperature than the heat-generating element. The cooling portion may refer to a portion having a lower temperature than the heat-generating element due to a medium such as cooling water, or may refer to an air region having a lower temperature than the heat-generating element. [Effects of the Invention]

[0239] The present application can provide curable compositions or thermal interface materials that have low density and exhibit high thermal conductivity while also exhibiting low adhesion to a given substrate.

[0240] The present application also provides a curable composition or thermal interface material that ensures excellent flame retardancy without using halogen flame retardants and phosphorus-based flame retardants, or even if used, with a minimized usage ratio, and exhibits process-suitable dischargeability and thixotropy.

[0241] The present application may also provide an article of manufacture comprising the curable composition, a cured product of the curable composition, or a thermal interface material. DETAILED DESCRIPTION OF THE INVENTION

[0242] The present invention will be described below based on examples and comparative examples, but the scope of the present invention is not limited to the contents presented below.

[0243] Production example 1. Polyol (A) of the following chemical formula A was prepared in the following manner.

[0244] [ka]

[0245] In chemical formula A, n and m are each greater than 0, and the sum (n+m) is approximately 4.8. Polycaprolactone polyol (Perstorp, Capa 3031) and the saturated fatty acid isononanoic acid were mixed in a weight ratio of 1:0.53 (Capa 3031:isononanoic acid). Next, 0.1 parts by weight of a catalyst (Tin(II) 2-ethylhexanoate (Sigma-Aldrich)) was added per 100 parts by weight of the mixture, and the mixture was stirred and maintained at 150°C for 30 minutes under an inert gas purge. A small amount of xylene, an azeotropic solution, was then added, and the temperature was raised to 200°C. The reaction was continued for at least 3 hours, after which the pressure was reduced to below 80 Torr and the xylene and unreacted materials were removed. The reaction mixture was cooled and filtered to obtain the target product (compound of formula A), a bifunctional polyol with a weight-average molecular weight of approximately 876 g / mol.

[0246] In the following examples and comparative examples, the first filler component contained in the base part may be represented as filler component (F1), and the second filler component contained in the hardener part may be represented as filler component (F2). In addition, the mixture of the base part and the hardener part is represented as the final curable composition, and the filler components (F1+F2) contained in the final curable composition include the first filler component and the second filler component.

[0247] Example 1 Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 9.8:89.1:1.1 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0248] The polyol component (P) was prepared by mixing the polyol (A) from Production Example 1 with a trifunctional polyester polyol (supplier: Kuraray, product name: F-2010, weight average molecular weight: 2,000 g / mol) in a weight ratio of 9:1 (A:F-2010).

[0249] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, spherical alumina (F12) having an average particle size of approximately 20 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 70:12:18 (F11:F12:F13).

[0250] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 3.9:91.7:4.4 (H:F2:Pc), and the hardener component (V B Tolonate HDT-LV2 corresponds to hexamethylene diisocyanate trimer.

[0251] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 60:10:30 (F21:F22:F23).

[0252] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 89 wt% of filler components (F1 + F2) based on the total weight, and approximately 7.4 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 1,107 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. In addition, the combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be less than 0.2 wt% based on the total weight of the curable composition.

[0253] Example 2. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 9.8:89.1:1.1 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0254] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0255] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, spherical alumina (F12) having an average particle size of approximately 20 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 45:30:25 (F11:F12:F13).

[0256] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 3.9:91.7:4.4 (H:F2:Pc), and the hardener component (V B ) was manufactured.

[0257] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 40:30:30 (F21:F22:F23).

[0258] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 89 wt% of filler components (F1 + F2) based on the total weight, and approximately 8.4 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 977 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. In addition, the combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0259] Example 3 Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 11.6:87.5:0.9 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0260] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0261] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F14) having an average particle size of approximately 50 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 45:30:25 (F11:F14:F13).

[0262] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 4:91.7:4.3 (H:F2:Pc), and the hardener component (V) was prepared. B ) was manufactured.

[0263] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 40:30:30 (F21:F22:F23).

[0264] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B) and mixed to prepare a final curable composition. The curable composition contained approximately 89 wt% of filler components (F1+F2) based on the total weight, and approximately 20.7 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 332 wt% of alumina based on 100 wt% of aluminum hydroxide. The combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) according to the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0265] Example 4. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 11.0:88.2:0.8 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0266] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0267] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F15) having an average particle size of approximately 17 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 60:20:20 (F11:F15:F13).

[0268] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 5.2:89.9:4.9 (H:F2:Pc), and the hardener component (V B ) was manufactured.

[0269] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, aluminum hydroxide (F24) having an average particle size of approximately 17 μm, and aluminum hydroxide (F25) having an average particle size of approximately 1 μm, in a weight ratio of 60:20:20 (F21:F24:F25).

[0270] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) were added to a static mixer in a volume ratio of 1:1 (VA:VB) and mixed to prepare the final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight of the curable composition and approximately 35.4 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 150 wt% of alumina per 100 wt% of aluminum hydroxide. Furthermore, the combined content of halogens and phosphorus (P) measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be less than 0.2 wt% based on the total weight of the curable composition.

[0271] Example 5. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 11.6:87.7:0.7 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0272] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0273] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F15) having an average particle size of approximately 17 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 50:30:20 (F11:F15:F13).

[0274] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 5.5:89.4:5.1 (H:F2:Pc), and the hardener component (V B ) was manufactured.

[0275] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, aluminum hydroxide (F24) having an average particle size of approximately 17 μm, and aluminum hydroxide (F25) having an average particle size of approximately 1 μm, in a weight ratio of 50:30:20 (F21:F24:F25).

[0276] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight of the curable composition, and approximately 43.9 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 100 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. The combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0277] Comparative Example 1 Manufacturing of base parts Polyol component (P), filler component (F1), plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate), and solid flame retardant containing phosphorus (P) (SF, CHEMPIA Co., Ltd., X-GUARD FR-119L) were mixed in a weight ratio of 8.5:88.9:1.2:1.4 (P:F1:Pc:SF) to form the main component (V). A ) was manufactured.

[0278] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0279] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, spherical alumina (F12) having an average particle size of approximately 20 μm, and alumina (F16) having an average particle size of approximately 1 μm, in a weight ratio of 60:20:20 (F11:F12:F16).

[0280] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), plasticizer (Pc, Aekyung Yu-Hwa, diisononyl adipate), and solid flame retardant containing phosphorus (P) (SF, CHEMPIA, X-GUARD FR-119L) were mixed in a weight ratio of 3.8:90.2:4.4:1.6 (H:F2:Pc:SF), and the hardener component (V) was prepared. B ) was manufactured.

[0281] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 60:20:20 (F21:F22:F23).

[0282] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A:V B ) and mixed to prepare the final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight. The curable composition also contained approximately 1.52 wt% of a solid flame retardant containing phosphorus (P) based on the total weight. Meanwhile, the combined content of halogen and phosphorus (P) measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be approximately 0.35 wt% or more based on the total weight of the curable composition.

[0283] Comparative Example 2 Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 9.8:89.1:1.1 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0284] The polyol component (P) used was the same as the polyol component (P) used in Example 1.

[0285] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, spherical alumina (F12) having an average particle size of approximately 20 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 67:22:11 (F11:F12:F13).

[0286] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 3.9:91.7:4.4 (H:F2:Pc), and the hardener component (V B ) was manufactured.

[0287] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 60:20:20 (F21:F22:F23).

[0288] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 89 wt% of filler components (F1 + F2) based on the total weight, and approximately 4.6 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 1,848 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. In addition, the combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0289] Comparative Example 3. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 11.7:87.1:1.2 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0290] The polyol (A) of Production Example 1 was used as the polyol component (P). The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F14) having an average particle size of approximately 50 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 45:30:25 (F11:F14:F13).

[0291] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 4.2:91.6:4.2 (H:F2:Pc), and the hardener component (V B ) was manufactured.

[0292] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 40:30:30 (F21:F22:F23).

[0293] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight, and approximately 20 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 341 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. The combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0294] Comparative Example 4. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical Co., Ltd., diisononyl adipate) were mixed in a weight ratio of 12.3:87.1:0.6 (P:F1:Pc), and the main component (V) was prepared. A ) was manufactured.

[0295] The polyol component (P) was prepared by mixing the polyol (A) from Production Example 1 with a trifunctional polyester polyol (supplier: Kuraray, product name: F-2010, weight average molecular weight: 2,000 g / mol) in a weight ratio of 8:2 (A:F-2010).

[0296] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F14) having an average particle size of approximately 50 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 45:30:25 (F11:F14:F13).

[0297] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 3.8:91.7:4.5 (H:F2:Pc), and the hardener component (V) was prepared. B ) was manufactured.

[0298] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 40:30:30 (F21:F22:F23).

[0299] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B) and mixed to prepare a final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight, and approximately 20 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 341 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. The combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0300] Comparative Example 5. Manufacturing of base parts The polyol component (P), filler component (F1), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 11.6:87.5:0.9 (P:F1:Pc) to form the main component (V). A ) was manufactured.

[0301] As the polyol component (P), a trifunctional polyester polyol (supplier: Kuraray Corporation, product name: F-2010, weight average molecular weight: 2,000 g / mol) was used.

[0302] The filler component (F1) is a mixture of spherical alumina (F11) having an average particle size of approximately 70 μm, aluminum hydroxide (F14) having an average particle size of approximately 50 μm, and aluminum hydroxide (F13) having an average particle size of approximately 1 μm, in a weight ratio of 45:30:25 (F11:F14:F13).

[0303] Hardener part manufacturing The isocyanate component (H, Vencorex, Tolonate HDT-LV2), filler component (F2), and plasticizer (Pc, Aekyung Oil & Chemical, diisononyl adipate) were mixed in a weight ratio of 4:91.7:4.3 (H:F2:Pc), and the hardener component (V) was prepared. B ) was manufactured.

[0304] The filler component (F2) is a mixture of spherical alumina (F21) having an average particle size of approximately 70 μm, spherical alumina (F22) having an average particle size of approximately 20 μm, and alumina (F23) having an average particle size of approximately 1 μm, in a weight ratio of 40:30:30 (F21:F22:F23).

[0305] Preparation of the Final Curable Composition The main component (V A ) and hardener parts (V B ) into a static mixer at 1:1 (V A :V B ) and mixed to prepare a final curable composition. The curable composition contained approximately 88 wt% of filler components (F1 + F2) based on the total weight, and approximately 20 wt% of aluminum hydroxide based on the total weight of the curable composition. The curable composition also contained approximately 341 parts by weight of alumina per 100 parts by weight of aluminum hydroxide. The combined content of halogen and phosphorus (P) elements measured by ICP (Inductively Coupled Plasma) using the following physical property measurement method was found to be 0.2 wt% or less based on the total weight of the curable composition.

[0306] The physical properties presented in the examples and comparative examples were evaluated by the following methods. <Physical property measurement method> 1. Viscosity and Thixotropy Index (TI) [Viscosity measurement method] The viscosity of the base material and the hardener in the examples and comparative examples was measured using a viscosity measuring device (manufacturer: Brookfield, model name: DV3THB-CP) and a spindle CPA-52Z at a shear rate of 2.4 s -1 The viscosity was measured at 25°C after 180 seconds of rotation.

[0307] Specifically, a plate was attached to the plate connector of the viscosity measuring device, and an adjustment lever was used to adjust the gap between the spindle and the plate to a certain value. The plate was separated, and approximately 0.5 mL of the measurement target was applied to the center of the separated plate. The plate with the measurement target applied was then attached to the plate connector of the viscometer, and after waiting until the torque value reached 0, the shear rate was increased to 2.4 s -1 The viscosity was measured by rotating the mixture for 180 seconds, and the final viscosity value was measured as the viscosity of the object to be measured. Here, the object to be measured means the base resin part or the hardener part.

[0308] [Method for measuring thixotropy index] The viscosity of the measurement object is measured using the same method as the viscosity measurement method described above, and the shear rate is set to 0.24 s -1 and 2.4s -1 After measuring the viscosity of each sample, the thixotropic index (TI) was measured according to the following formula.

[0309] [Calculation formula for thixotropy index] Thixotropic index (TI)=V1 / V2 In the above formula, V1 is 25°C and 0.24 s -1 V2 is the viscosity of the object measured under the conditions of 25°C and 2.4s -1 The viscosity of the object to be measured is measured under the following conditions.

[0310] 2.Specific gravity Each final curable composition prepared in the Examples and Comparative Examples was cured at about 25°C for about 24 hours to form a cured product, which was then fragmented to prepare a sample. The specific gravity of the sample was measured at 25°C using a pycnometer. The specific gravity was calculated based on the density of water (1 g / cm) measured at 1 atmosphere and 4°C. 3 ) and has dimensionless units.

[0311] 3. Thermal conductivity Thermal conductivity was measured using a hot disk method. Specifically, the final curable compositions prepared in the examples and comparative examples were placed in disk molds with a diameter of approximately 4 cm and a thickness of approximately 5 mm and cured at approximately 25°C for 24 hours. The thermal conductivity of the cured samples was measured along the thickness direction of the samples using a thermal constant analyzer in accordance with ISO 22007-2. As specified in ISO 22007-2, the hot disk device measures temperature changes (electrical resistance changes) when a sensor with a double spiral nickel wire is heated, and thermal conductivity was measured according to this standard.

[0312] 4.Flame retardant Each final curable composition prepared in the examples and comparative examples was cured at about 25°C for about 24 hours to form a cured product measuring 13 mm wide, 125 mm long, and 2 mm thick. The cured product was then measured according to the UL94V measurement standard. If the result of measurement according to the UL94V measurement standard was V-0, it was evaluated as PASS, and if the result was any other grade, it was evaluated as NG.

[0313] 5. Measurement of adhesive strength to polyester Test specimens prepared by adhering a polyethylene terephthalate (PET) film to an aluminum plate were evaluated. The PET film was approximately 10 mm wide and 200 mm long, and the aluminum plate was approximately 100 mm wide and 100 mm long. The test specimens were prepared by coating the entire surface of the aluminum plate with the final curable composition of the Examples or Comparative Examples (to a thickness of approximately 2 mm after curing) and then maintaining the PET film in close contact with the curable composition at approximately 25°C for approximately 24 hours. The entire width and approximately 100 mm of the length of the PET film were attached to the aluminum plate via the curable composition. The PET film was peeled from the aluminum plate in the longitudinal direction while the aluminum plate was fixed to the test specimen, and the adhesive strength to the polyester was measured. The peeling was performed at a peeling rate of approximately 0.5 mm / min and a peeling angle of approximately 180° until the PET film was completely peeled off.

[0314] 6. Measurement of adhesion strength to aluminum Each final curable composition according to the Examples or Comparative Examples was coated onto the center of an aluminum substrate measuring 2 cm in width and 7 cm in length, to a width of approximately 2 cm and a length of 2 cm. An aluminum substrate measuring 2 cm in width and 7 cm in length was then attached onto the coating layer and maintained in this state to cure the curable composition. The curing was carried out at approximately 25°C for approximately 24 hours. The two aluminum substrates were attached at a 90° angle to each other. The force required to separate the lower aluminum substrate was measured by pressing the upper aluminum substrate at a speed of 0.5 mm / min while the upper aluminum substrate was fixed. The maximum force measured during this process was divided by the area of ​​the test specimen to determine the adhesion strength to aluminum.

[0315] 7. Shore OO hardness The Shore 00 hardness of the cured product of each final curable composition in the Examples and Comparative Examples was measured according to ASTM D 2240. The initial hardness was measured by applying a load of 1 kg or more (approximately 1.5 kg) to the surface of the cured product in the form of a film, and the hardness was evaluated by checking the stabilized reading after 15 seconds. The cured product was formed by storing the final curable composition at about 25°C for about 24 hours.

[0316] 8. Radius of curvature The radius of curvature of the cured product of each final curable composition in the Examples and Comparative Examples was evaluated using a cured product measuring 1 cm wide, 10 cm long, and 2 mm thick. The radius of curvature was the smallest radius of the cylinder at which the cured product did not crack when attached to cylinders of various radii and bent vertically. The cured products were formed by maintaining the final curable composition at about 25°C for about 24 hours.

[0317] 9.Module workability Each final curable composition according to the Examples or Comparative Examples was applied to an aluminum plate in the shape of a square measuring 8 cm wide and 8 cm long, with a thickness of approximately 2 mm. The applied curable composition was then cured at approximately 25°C for approximately 24 hours. The cured product was then detached from the aluminum plate, and the module workability was evaluated according to the following [Evaluation Criteria for Module Workability]. [Evaluation criteria for module workability] PASS: The cured product is released in a sheet form without leaving any residue on the aluminum plate. NG: The cured product does not detach from the aluminum plate, or if it does detach, residue remains.

[0318] 10. Measurement of average particle size The average particle size of the filler is the D50 particle size of the filler, which is the particle size measured by the MASTERSIZER 3000 equipment of Malvern in accordance with the ISO-13320 standard. During the measurement, distilled water was used as the solvent. The laser incident on the filler dispersed in the solvent is scattered, and the values of the intensity and directionality of the scattered laser vary depending on the size of the filler. By analyzing this using Mie theory, the D50 particle size can be obtained. Through the conversion to the diameter of a sphere having the same volume as the dispersed filler through the analysis, the distribution can be obtained, and through this, the D50 value, which is the median value of the distribution, can be obtained to evaluate the particle size.

[0319] 11. Measurement of Weight-Average Molecular Weight The weight-average molecular weight (Mw) was measured using GPC (Gel permeation chromatography). Specifically, for the weight-average molecular weight (Mw), the sample to be analyzed was loaded into a 5 mL vial, diluted with a THF (tetrahydrofuran) solvent to a concentration of approximately 1 mg / mL, and then the calibration standard sample and the analysis sample were filtered through a syringe filter (pore size: 0.45 μm) and measured. As the analysis program, ChemStation of Agilent technologies was used, and the weight-average molecular weight (Mw) could be obtained by comparing the elution time of the sample with the calibration curve. <GPC Measurement Conditions> Equipment: 1200 series of Agilent technologies Columns: TL Mix.A&B of Agilent technologies were used Solvent: THF (tetrahydrofuran) Column temperature: 35 °C Sample concentration: 1 mg / mL, 200 μl injection Standard sample: Polystyrene (MP: 3900000, 723000, 316500, 52200, 31400, 7200, 3940, 485) was used

[0320] 12. Measurement of halogens and phosphorus elements A 0.1 g sample of each final curable composition prepared in the Examples and Comparative Examples was weighed out and placed in a vial, followed by the addition of 1 mL of nitric acid. A small amount of hydrogen peroxide was then added to the vial, and the sample was dissolved by heating on a hot plate. Once the sample was completely dissolved and transparent, tertiary ultrapure water was added to the sample to make a total volume of 10 mL to prepare an analytical sample. The halogen and phosphorus contents of the analytical sample were measured using an inductively coupled plasma-optical emission spectrometer (ICP-OES). The analytical conditions were as follows: The halogen and phosphorus contents measured by the analysis can be measured individually, and the combined halogen and phosphorus contents can be determined by adding them together.

[0321] [ICP-OES analysis conditions] RF power: 1,300W Torch Height: 15.0mm Plasma Gas Flow: 15.00 L / min Sample Gas Flow: 0.8 L / min Aux.Gas Flow: 0.2L / min Pump Speed: 1.5mL / min Internal Standard: Yttrium (Y) or Scandium (Sc) The test data measured in the above examples and comparative examples are summarized in Tables 1 and 2 below.

[0322] [Table 1]

[0323] [Table 2]

[0324] Referring to Table 1, it can be seen that in Examples 1 to 5, the base resin part and the curing agent part have appropriate viscosities and thixotropy indices. Referring to Table 2, it can be seen that Examples 1 to 5 have low specific gravity characteristics and excellent thermal conductivity, and that excellent flame retardancy is ensured without the addition of phosphorus- or halogen-based flame retardants. It can also be seen that Examples 1 to 5 have low adhesive strength to polyester and aluminum, which is suitable for the purpose of this application. Furthermore, it can be seen that Examples 1 to 5 have surface hardness suitable for the purpose of this application, flexibility, and excellent workability.

[0325] On the other hand, referring to Table 2, Comparative Example 1 had a relatively high specific gravity and insufficient flame retardancy. In addition, Comparative Example 1 had reduced heat dissipation due to the use of a phosphorus-based flame retardant, and showed low thermal conductivity despite the use of an excessive amount of alumina.

[0326] Also, referring to Table 2, Comparative Example 2 had a low aluminum hydroxide content relative to the overall composition, and when measured according to the UL94V measurement standard, it partially burned up to the clamp, indicating a lack of flame retardancy. In the examples, the aluminum hydroxide content was within the range specified in this application, but a comparison of Example 1 and Comparative Example 2 in particular revealed a noticeable difference in flame retardancy. This indicates that the aluminum hydroxide content is critical. Furthermore, Comparative Example 2 exhibited adhesion strength between the PET and aluminum plate that was inappropriate for the purposes of this application due to an imbalance in the combination of the filler component and the polyol and isocyanate components within the composition.

[0327] Referring to Table 2, it can be seen that Comparative Examples 3 and 4 did not combine the polyol components as shown in the present application, and therefore the adhesion to aluminum or PET was not suitable for the purpose of the present application. Also, referring to Table 1, Comparative Example 4 did not combine the polyol components as shown in the present application, and therefore the viscosity of the base resin part and the curing agent part was high, and therefore it was not suitable for processing.

[0328] Referring to Tables 1 and 2, in Comparative Example 5, the viscosity of the base resin part and the curing agent part was so high that blending was impossible, and therefore the physical properties could not be measured.

Claims

1. Polyol component; an isocyanate component; and Contains filler ingredients, The polyol component includes a first polyol which is a difunctional polyol and a second polyol which is a trifunctional or higher functional polyol, First polyol (P Ａ ) and a second polyol (P Ｂ ) weight ratio (P Ａ / P Ｂ ) is 5 or more, the filler component includes a first filler having a specific gravity of 3 or less and a second filler having a specific gravity of more than 3; A curable composition that forms a cured product having a specific gravity of 3 or less, a thermal conductivity of 2 W / mK or more, a combined content of halogen and phosphorus elements of 0.3 wt % or less, and a flame retardancy of V-0 or higher.

2. A polyol component; and Contains filler ingredients, The polyol component includes a first polyol which is a difunctional polyol and a second polyol which is a trifunctional or higher functional polyol, the weight ratio (P A / P B ) of the first polyol (P A ) to the second polyol (P B ) is 5 or more; the filler component includes a first filler having a specific gravity of 3 or less and a second filler having a specific gravity of more than 3; A curable composition for undergoing a curing reaction with a curing agent containing an isocyanate component, which has a specific gravity of 3 or less, a thermal conductivity of 2 W / mK or more, a combined content of halogen and phosphorus elements of 0.3 wt % or less, and forms a cured product exhibiting flame retardancy of V-0 grade or higher.

3. Adhesion strength to aluminum is 0.1 N / mm ２ The curable composition according to claim 1 or 2, which forms a cured product having an adhesive strength to polyester of 100 gf / cm or less.

4. 2.4 seconds －１ 3. The curable composition according to claim 1, wherein the viscosity of the curable composition measured under a shear rate condition of 400 kcP or less at 25°C.

5. The curable composition according to claim 1 or 2, wherein the first polyol or the second polyol contains a branched hydrocarbon chain having 3 or more carbon atoms at its terminal.

6. the first polyol or the second polyol is a polyol having polycaprolactone polyol units, or a polyol having alkanediol units, polyol units, and dicarboxylic acid units; 3. The curable composition according to claim 1, wherein the polyol unit is a unit derived from a polyol that is an alkane having 1 to 20 carbon atoms substituted with 3 to 10 hydroxy groups.

7. The curable composition of claim 1 or 2, wherein the first polyol and the second polyol are polyester polyols.

8. 3. The curable composition of claim 1 or 2, wherein the polyol component comprises greater than 80 wt% of the first polyol, based on the total weight of the polyol component.

9. 3. The curable composition of claim 1, wherein the first polyol has a weight average molecular weight of 100 g / mol to 2,000 g / mol and the second polyol has a weight average molecular weight of 500 g / mol to 5,000 g / mol.

10. The curable composition according to claim 1 or 2, which contains a filler component in an amount of 70% by weight or more based on the total weight of the composition.

11. The curable composition according to claim 1 or 2, wherein the first filler is a metal hydroxide.

12. The curable composition according to claim 1 or 2, comprising the first filler in an amount of 10% by weight or more based on the total weight of the composition.

13. 3. The curable composition of claim 1 or 2, wherein the second filler comprises one or more selected from the group consisting of aluminum oxide, magnesium oxide, beryllium oxide, titanium oxide, silicon nitride, aluminum nitride, silicon carbide, copper, silver, iron, and titanium.

14. The curable composition according to claim 1 or 2, wherein the filler component contains the second filler in an amount of 50 to 800 parts by weight per 100 parts by weight of the first filler.

15. a base part including a polyol component and a first filler component; and a curing agent part including an isocyanate component and a second filler component; The polyol component includes a first polyol which is a difunctional polyol and a second polyol which is a trifunctional or higher functional polyol, First polyol (P Ａ ) and a second polyol (P Ｂ ) weight ratio (P Ａ / P Ｂ ) is 5 or more, one or more selected from the group consisting of the first filler component and the second filler component includes a first filler having a specific gravity of 3 or less; The first filler having a specific gravity of 3 or less is contained in an amount of 5% by weight or more based on the total weight of the two-component curable composition, The second filler component includes a second filler having a specific gravity of greater than 3; The combined content of halogen and phosphorus is 0.3% by weight or less, and the flame retardancy is V-0 or higher. The adhesive strength to aluminum is 0.1 N / mm ２ A two-component curable composition that forms a cured product having the following properties:

16. The curable composition of claim 15, wherein the isocyanate component is a non-aromatic isocyanate compound.

17. a heat generating element and a heat transfer body in thermal contact with the heat generating element; The heat transfer body comprises one or more selected from the group consisting of a cured product of the curable composition of claim 1 and a cured product of the two-component curable composition of claim 15.