Redundant Factory Interfaces

Abstract

A substrate processing system for an electronic device manufacturing system can include a factory interface forming an interior space and a partition disposed within the factory interface. The partition can divide the interior space into a first factory interface chamber forming a second interior space and a second factory interface chamber forming a third interior space. The partition can be configured to provide a first sealed environment within the first factory interface chamber and a second sealed environment within the second factory interface chamber.

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION Embodiments of the present disclosure generally relate to systems and methods for enabling multiple subsystems within a factory interface to facilitate redundancy in the event of a component failure. [Background technology]

[0002] An electronic device manufacturing system may include one or more tools or components for transporting and manufacturing substrates. Such tools or components may include a factory interface connected to a load lock and / or a transfer chamber. The factory interface may include a factory interface robot configured to transfer substrates between a substrate carrier docked to a load port and the load lock. The factory interface may further maintain an inert gas environment at or near atmospheric pressure to facilitate the transfer of substrates to and from the load lock. However, if any component fails, such as the factory interface robot, an air utility line configured to supply air to the factory interface, or a vacuum utility line configured to provide a vacuum to the factory interface, the entire manufacturing system may be shut down for maintenance. Therefore, improved electronic device manufacturing systems, apparatus, and methods for providing redundancy in the event of a component failure are desired. Summary of the Invention

[0003] Some of the described embodiments are directed to a substrate processing system for an electronic device manufacturing system. The substrate processing system includes a factory interface defining an interior space and a partition disposed within the factory interface. The partition divides the interior space into a first factory interface chamber defining a second interior space and a second factory interface chamber defining a third interior space. The partition is configured to provide a first sealed environment within the first factory interface chamber and a second sealed environment within the second factory interface chamber.

[0004] Some embodiments are directed to an electronic device manufacturing system including a first factory interface subsystem, a second factory interface subsystem, a partition wall having an opening and positioned between the first and second factory interface subsystems, a first load lock coupled to a backside of the first factory interface subsystem, a second load lock coupled to a backside of the second factory interface subsystem, a first factory interface robot positioned within an interior space of the first factory interface subsystem, and a second factory interface robot positioned within the interior space of the second factory interface subsystem. The first factory interface robot can be configured to transfer a substrate to the second factory interface robot through the opening in the partition wall.

[0005] In some embodiments, a method for transferring a substrate from a first factory interface robot to a second factory interface robot includes retrieving the substrate from a substrate carrier by a first end effector of the first factory interface robot, the method further including positioning the substrate on a substrate pass-through station located within the first factory subsystem, and retrieving the substrate from the substrate pass-through station by a second end effector of a second factory interface robot, the second factory interface robot retrieving the substrate by passing the end effector through an opening in a partition separating the first and second factory interface robots.

[0006] The present disclosure is illustrated by way of example, and not limitation, in the figures of the accompanying drawings, in which like reference numerals indicate like elements. It should be noted that different references to "an" or "one" embodiment in this disclosure do not necessarily refer to the same embodiment, and such references do mean at least one. [Brief explanation of the drawings]

[0007] [Figure 1A] FIG. 1 is a schematic plan view of an example electronic device manufacturing system according to aspects of the present disclosure. [Figure 1B] FIG. 1 is a schematic front view of an example electronic device manufacturing system according to aspects of the present disclosure. [Figure 1C] FIG. 1 is a schematic plan view of another example of an electronic device manufacturing system according to aspects of the present disclosure. [Figure 1D] FIG. 1 is a schematic front view of another example of an electronic device manufacturing system according to aspects of the present disclosure. [Figure 2] FIG. 1 is a front view of an electronic device manufacturing system according to aspects of the present disclosure. [Figure 3A] FIG. 1 is a front view of another electronic device manufacturing system according to aspects of the present disclosure. [Figure 3B]FIG. 1 is a front view of another electronic device manufacturing system according to aspects of the present disclosure. [Figure 4A] 1 illustrates a pair of pass-through doors in an open position according to aspects of the present disclosure. [Figure 4B] 1 illustrates a pair of pass-through doors in a closed position according to aspects of the present disclosure. [Figure 5A] 10A-10C illustrate another pair of pass-through doors in an open position according to aspects of the present disclosure. [Figure 5B] 10A-10C illustrate another pair of pass-through doors in a closed position according to aspects of the present disclosure. [Figure 6] 1A-1C illustrate a method of transporting substrates from a substrate carrier to a factory interface according to an embodiment of the present disclosure. [Figure 7] 1 illustrates a method for transporting a substrate from a first factory interface robot to a second factory interface robot according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0008]

[0003] Embodiments described herein relate to systems and methods for enabling multiple subsystems within a factory interface to facilitate redundancy in the event of a component failure. The embodiments encompass multiple different designs for independent subsystems within the factory interface, each capable of providing a controlled environment for transferring substrates between load locks and substrate carriers docked to load ports. Furthermore, floor space in fabrication facilities (fabs) for electronic devices is very expensive, and increasing the footprint of electronic device manufacturing systems can increase the cost of ownership of those systems. The embodiments described herein can provide redundancy for factory interfaces (e.g., front-end equipment modules (EFEMs)) through multiple subsystems with independent load locks, load ports, factory interface robots, and internal environments that do not increase the footprint and overall cost of ownership of the electronic device manufacturing systems.

[0009] In some embodiments, the factory interface is divided into two smaller factory interfaces (e.g., left and right factory interfaces) that share a common structure using a partition wall, with each smaller factory interface forming a factory interface chamber. A partition wall can be disposed between the two smaller factory interfaces (hereinafter, the "first factory interface subsystem" and the "second factory interface subsystem") to form each factory interface chamber. Each factory interface subsystem (e.g., factory interface chamber) can interact with a respective load lock. In particular, each of the two factory interface chambers can include a respective factory interface robot configured to position substrates from a substrate carrier (coupled to a load port) to a respective load lock or vice versa. Each factory interface chamber can maintain separate compartments housing electronic systems (e.g., servers, air conditioning units, etc.), utility cables, gas or air recirculation, gas supply, gas exhaust, etc., to provide control functions for each subsystem, as well as separate sealed environments. For example, a first factory interface subsystem may maintain a first sealed environment (e.g., a non-reactive gas environment at a slight positive pressure), and a second factory interface subsystem may maintain a second sealed environment.

[0010] In some embodiments, the bulkhead can include an opening that allows one factory interface robot to transfer one or more substrates to the other factory interface robot and / or vice versa. The bulkhead can include one or more pass-through doors located on either side of the bulkhead or incorporated into the bulkhead. In a closed position, the pass-through doors can provide an airtight seal to maintain a first sealed environment within the first factory interface subsystem and a second sealed environment within the second factory interface subsystem. In an open position, the pass-through doors can expose a pass-through area formed by the opening in the bulkhead, allowing the first and second factory interface robots to transfer substrates to each other.

[0011] In some embodiments, a factory operator can access a factory interface robot, load port, load lock, or any other component of one of the factory interface chambers of a factory interface for maintenance or repair with the bulkhead door closed without shutting down the entire factory interface. For example, a factory operator can shut down one factory interface subsystem to perform maintenance on that component while leaving the other factory interface subsystem fully operational.

[0012] By providing a system that incorporates multiple smaller factory interfaces into a single factory interface space, an electronic device manufacturing system is provided that promotes redundancy in the event of a component failure. Specifically, conventional electronic device manufacturing system designs typically require complete shutdowns to perform maintenance, resulting in reduced or lost yield and unscheduled downtime. By maintaining one operational smaller factory interface chamber undergoing repair in conjunction with another smaller factory interface chamber that shares a common chassis with the factory interface chamber being repaired, the manufacturing system of the present disclosure allows for continuous throughput, which can improve overall system yield and / or costs (e.g., manufacturing costs, material costs, packaging costs, shipping costs, etc.).

[0013] Embodiments are described in the context of a factory interface that includes two independent subsystems (e.g., two separate factory interface chambers) separated by a partition. However, it should be understood that redundancy can be expanded and that in some embodiments, three, four, or more factory interface subsystems can be used. For example, a factory interface can include three factory interface chambers, where a first partition separates a first factory interface chamber from a second factory interface chamber, and a second partition separates the second factory interface chamber from a third factory interface chamber. In embodiments, each of the factory interface chambers can include its own factory interface robot, one or more load ports, etc.

[0014] 1A and 1B depict an electronic device manufacturing system 100 having a factory interface 106 with two factory interface subsystems 107A, 107B and a pass-through door 150. FIG. 1A is a schematic plan view of an exemplary electronic device manufacturing system 100 according to an embodiment of the present disclosure. FIG. 1B is a schematic front view of an exemplary electronic device manufacturing system 100 according to an embodiment of the present disclosure. FIGS. 1C and 1D depict an electronic device manufacturing system 105 having a factory interface 106 with two factory interface subsystems 107A, 107B and pass-through doors 150A, 150B according to an embodiment of the present disclosure. FIG. 1C is a schematic plan view of an exemplary electronic device manufacturing system 105 according to an embodiment of the present disclosure. FIG. 1D is a schematic front view of an exemplary electronic device manufacturing system 100 according to an embodiment of the present disclosure. Note that FIGS. 1A-1D are used for illustrative purposes, and different components may be located in different locations with respect to each figure. Additionally, not all components of the factory interface 106 or other components of the device manufacturing systems 100, 105 are shown.

[0015] 2 illustrates one embodiment of factory interface 106 having two factory interface subsystems 107A, 107B separated by a bulkhead 142 that includes a pass-through door 150 located to the right of the bulkhead 142, with each subsystem 107A, 107B configured to interact with a respective load lock 120A, 120B. Note that FIG. 2 is used for illustrative purposes and different components may be located in different locations relative to the manufacturing system 100.

[0016] 3A and 3B illustrate another embodiment of the factory interface 106, which includes two factory interface subsystems 107A, 107B separated by a bulkhead 142 that includes two pass-through doors 150A, 150B positioned on either side of the bulkhead 142, with each subsystem 107A, 107B configured to interact with a respective load lock 120A, 120B. FIG. 3A illustrates the pass-through doors 150A, 150B in an open position, while FIG. 3B illustrates the pass-through doors 150A, 150B in a closed position. Note that FIGS. 3A and 3B are used for illustrative purposes, and different components may be located in different locations relative to the manufacturing system 100.

[0017] 1A, 1B, 1C, 1D, 2, 3A, and 3B, electronic device manufacturing systems 100, 105 (also referred to as electronic processing systems) are configured to perform one or more processes on a substrate 102. The substrate 102 may be any suitably rigid, flat article of predetermined dimensions, such as, for example, a silicon-containing disk or wafer, a patterned wafer, a glass plate, or the like, suitable for fabricating electronic devices or for fabricating circuit components on electronic devices.

[0018] The electronic device manufacturing systems 100, 105 include a processing tool (e.g., mainframe) 104 and a factory interface 106 coupled to the processing tool 104. The processing tool 104 includes a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 includes one or more processing chambers (also referred to as process chambers) 114, 116, 118 disposed around and coupled to the transfer chamber. The processing chambers 114, 116, 118 may be coupled to the transfer chamber 110 via respective ports, such as slit valves.

[0019] The processing chambers 114, 116, 118 may be adapted to perform any number of processes on the substrate 102. The same or different substrate processes may be performed in each processing chamber 114, 116, 118. Example substrate processes include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, hardening, pre-cleaning, metal or metal oxide removal, etc. In one example, a PVD process is performed in one or both processing chambers 114, an etching process is performed in one or both processing chambers 116, and an annealing process is performed in one or both processing chambers 118. Other processes may also be performed on a substrate in the chambers. The processing chambers 114, 116, 118 may each include a substrate support assembly. The substrate support assembly may be configured to hold a substrate in place during substrate processing.

[0020] The transfer chamber 110 also includes a transfer chamber robot 112. The transfer chamber robot 112 can include one or more arms, where each arm includes one or more end effectors at the end of each arm. The end effectors can be configured to handle specific objects, such as wafers. Alternatively or additionally, the end effectors can be configured to handle objects, such as process kit rings. In some embodiments, the transfer chamber robot 112 is a Selective Compliance Assembly Robot Arm (SCARA) robot, such as a two-link SCARA robot, a three-link SCARA robot, or a four-link SCARA robot.

[0021] The factory interface 106 can interact with respective load locks 120A, 120B through factory interface subsystems 107A, 107B, respectively. The load locks 120A, 120B can also be coupled to the housing 108 and the transfer chamber 110. The load locks 120A, 120B can be configured to interface and couple to the transfer chamber 110 and the factory interface 106A, 106B, respectively, on one side. Each load lock 120A, 120B can have an environmentally controlled atmosphere that can be changed from a vacuum environment (where substrates can be transferred to and from the transfer chamber 110) to an inert gas environment at or near atmospheric pressure (where substrates can be transferred to and from the factory interface 106), in some embodiments.

[0022] The factory interface 106 may be any suitable enclosure, such as, for example, a front-end equipment module (EFEM). The factory interface 106 may include two subsystems, a factory interface subsystem 107A and a factory interface subsystem 107B, which may be separated from one another via a bulkhead 142. The bulkhead 142 may include one or more pass-through doors 150, 150A, 150B, which may provide an airtight seal so that the factory interface subsystem 107A and the factory interface subsystem 107B can each maintain separate, sealed environments, as described in more detail below. The factory interface 106 may be configured to receive substrates 102 from substrate carriers 122A-122F (e.g., front-opening unified pods (FOUPs)) docked to various load ports 124 of the factory interface 106. The load ports 124 may be located at one or more elevations on the front side of the factory interface 106. The factory interface 106 can be configured with any number of load ports 124, and the load ports 124 can be located on one or more sides of the factory interface 106 at the same height or at different heights.

[0023] As shown in FIGS. 1B and 1D, the load ports 124 may be positioned at different heights along the walls of the factory interface 106. Elevating the load ports 124 allows for one or more auxiliary components 170 to be positioned at the base of the factory interface 106. The auxiliary components 170 are described in more detail below. In some embodiments, one or more auxiliary components 170 may be positioned on either or both sides of the factory interface 106 (as shown in FIGS. 1B and 1D), or may be positioned in one or more locations behind the factory interface 106 (as shown in FIGS. 1A and 1C). In some embodiments, as shown in FIGS. 1B and 1D, one or more load ports 124 may be located at or near the factory interface base on the front side of the factory interface 106, while one or more additional load ports 124 may be located at a higher height (e.g., approximately 2 meters from the ground). In some embodiments, one or more substrate carrier elevators 113 can be configured to elevate substrate carriers 122A-122F. In some embodiments, the substrate carrier elevator 113 can elevate one or more substrate carriers 122A-122F to overhead automation components (not shown). The overhead automation components can deliver one or more substrate carriers 122A-122F to one or more elevated load ports 124. Additionally, the overhead automation components can remove one or more substrate carriers 122A-122F from one or more elevated load ports 124.In one example, a factory operator can load substrate carriers 122A-122F onto the substrate carrier elevator 113, engage the elevator to raise the substrate carriers 122A-122F up to the overhead automation components, engage the overhead automation components to deliver the substrate carriers 122A-122F to the load port 124, then engage the overhead automation components to remove the substrate carriers 122A-122F from the load port, and once empty, engage the elevator to lower the substrate carriers 122A-122F.

[0024] In some embodiments, at least one load port 124 can be located at a low elevation accessible to a factory operator who can manually load one or more substrate carriers 122A-122F onto the load port 124. One or more load ports 124 can be located at a higher elevation, in which case a factory operator can engage the substrate carrier elevator 113 and overhead automation components to load one or more substrate carriers 122A-122F onto the higher load port 124. Such a configuration allows for additional space at the front base of the factory interface so that components located therein do not increase the operating footprint of the electronic device manufacturing system 100. For example, in some embodiments, auxiliary components 170 can replace load ports 124. For example, four or six load ports 124 can be located at or near the factory interface base at the front of the factory interface 106. In some other embodiments, one or more load ports 124 can be loaded onto a sidewall of the factory interface 106.

[0025] Factory interface robots 126A, 126B can be configured to transfer substrates 102 between substrate carriers (also called containers) 122A-122F and load locks 120A, 120B. In one embodiment, factory interface subsystem 107A includes factory interface robot 126A, and factory interface subsystem 107B includes factory interface robot 126B. For example, factory interface subsystem 107A can include factory interface robot 126A disposed within factory interface 107A on a first side (e.g., left side) of factory interface 106, and factory interface subsystem 107B can include factory interface robot 126B disposed within factory interface 107B on a second side (e.g., right side) of factory interface 106.

[0026] In one example, factory interface robot 126A may be configured to transfer substrates 102 between a first set of substrate carriers (e.g., substrate carriers 122A-122C) and load lock 120A. In another example, factory interface robot 126B may be configured to transfer substrates 102 between a second set of substrate carriers (e.g., substrate carriers 122D-122F) and load lock 120B. In other and / or similar embodiments, factory interface subsystems 107A, 107B are configured to receive replacement parts from a replacement parts storage container, and factory interface robots 126A, 126B are configured to transport such replacement parts to and from one or more of load locks 120A-120B. In some embodiments, factory interface robot 126A cannot access load lock 120B, and factory interface robot 126B cannot access load lock 120A.

[0027] Each of the factory interface robots 126A, 126B can include one or more robot arms and can be or include a SCARA robot, a mast-type robot, a lift-type (e.g., scissor lift) robot, or any combination thereof. In some embodiments, the factory interface robots 126A, 126B have more links and / or more degrees of freedom than the transfer chamber robot 112. Each of the factory interface robots 126A, 126B can include an actuator or assembly that can adjust the height of one or more of the robot arms of the respective factory interface robot 126A, 126B, thereby enabling the factory interface robot 126A, 126B to reach carriers connected to load ports at different heights. Each of the factory interface robots 126A, 126B can include one or more end effectors at the end of each robot arm. The end effectors can be configured to pick up and handle specific objects, such as wafers. Alternatively or additionally, the end effectors can be configured to handle objects, such as process kit rings. Any conventional robot type can be used for the factory interface robots 126A, 126B. Transfers can be performed in any order or direction.

[0028] In some embodiments, each factory interface subsystem 107A, 107B can be maintained in a non-reactive gas environment (using, for example, nitrogen as the non-reactive gas), for example, at a slight positive pressure. In some embodiments, each factory interface 107A, 107B includes an independent environmental control system with one or more inert gas supply lines, one or more exhaust lines, and one or more sensors usable to measure one or more of humidity, O2 levels, temperature, pressure, gas flow rate, and / or other parameters. Each environmental control system can adjust the gas and / or rate of gas entering and / or exiting the respective factory interface subsystem 107A, 107B based on the one or more measured parameters. In some embodiments, each factory interface subsystem 107A, 107B can further include a recirculation system that can filter gases exhausted from the factory interface and recirculate the filtered gases back into the factory interface.

[0029] In the illustrated embodiment, each of factory interface subsystems 107A, 107B can be provided with a separate environmental controller that provides an environmentally controlled atmosphere therein. In particular, a first environmental controller is coupled to factory interface subsystem 107A and is operable to monitor and / or control environmental conditions within the factory interface chamber of factory interface subsystem 107A. Similarly, a second environmental controller is coupled to factory interface subsystem 107B and is operable to monitor and / or control environmental conditions within the factory interface chamber of factory interface subsystem 107B. In some embodiments, at a particular time, one or both of the interior spaces of factory interface subsystems 107A, 107B can receive therein a purge gas (e.g., an inert and / or non-reactive gas), such as argon (Ar), nitrogen (N), helium (He), or clean, dry air, from a purge gas supply. The purge gas supply may be individually coupled to the factory interface chamber of each of the factory interface subsystems 107A, 107B by appropriate conduits and one or more valves.

[0030] More specifically, the environmental control system can control at least one of 1) relative humidity (RH), 2) temperature (T), 3) amount of oxygen (O), and / or 4) amount of purge gas within each factory interface chamber. Other environmental conditions of the factory interface chamber can be monitored and / or controlled, such as gas flow rates into the factory interface chamber, or pressure within the factory interface chamber, or both.

[0031] Each of the load locks 120A, 120B may include one or more slit valves and / or doors configured to open when receiving or releasing substrates from or to the factory interface robots 126A, 126B and the transfer chamber robot 112. The slit valves and / or doors may be used to maintain a vacuum environment, a clean environment, and / or a temperature-controlled environment. For example, the slit valves and / or doors may be used to maintain a vacuum environment in the transfer chamber 110 and an inert gas environment in the factory interface 106 (e.g., factory interface subsystems 107A, 107B). The load lock 120A may include one or more doors (not shown) that can provide access to the factory interface robot 126A. The load lock 120B may include one or more doors (not shown) that can provide access to the factory interface robot 126B.

[0032] In one embodiment, side door 128A is approximately parallel to the back side of factory interface 106 and approximately perpendicular to door 130. Similarly, in one embodiment, side door 128B is approximately perpendicular to the back side of factory interface 106 and approximately parallel to door 130.

[0033] In some embodiments, the factory interface robots 126A, 126B can orient their end effectors in a first direction that is pointed toward and generally perpendicular to the front of the factory interface when retrieving and / or placing substrates into the vessels 122A-122F. In embodiments, the factory interface robot 126A can orient its end effectors in a second direction that can be generally parallel to the first direction when retrieving and / or placing substrates into the load lock 120A. Similarly, the factory interface robot 126B can orient its end effectors in a third direction that can be generally parallel to the first direction when retrieving and / or placing substrates into the load lock 120B.

[0034] In some embodiments, the transfer chamber 110, the processing chambers 114, 116, 118, and / or the load locks 120A, 120B are maintained at a vacuum level. The electronic device manufacturing system 100 may include one or more vacuum ports coupled to one or more stations of the electronic device manufacturing system 100. For example, a vacuum port 130 may be coupled to and located between the load locks 120A, 120B. In some embodiments, additional vacuum ports may be used. For example, additional vacuum ports (not shown) may couple the factory interface subsystems 107A, 107B to the load locks 120A, 120B, respectively.

[0035] In some embodiments, one or more utility lines (not shown) are configured to provide utilities to each factory interface subsystem 107A, 107B. The utility lines may include a respective power utility line configured to supply power to the factory interface subsystem 107A, 107B, a respective air utility line (e.g., a clean dry air (CDA) utility line) configured to provide air to the factory interface subsystem 107A, 107B, a respective vacuum utility line configured to apply a vacuum to the vacuum port 130 and / or the interior chamber of the factory interface subsystem 107A, 107B, and / or a respective nitrogen utility line configured to supply nitrogen to the factory interface subsystem 107A, 107B.

[0036] One or more utility cables may be configured to protect one or more utility lines. For example, each utility line may be housed within a utility cable. Multiple utility lines may be housed within the same utility cable and / or may be included in separate utility cables. A first end of each utility cable may be attached to an outlet of a utility source (e.g., a power source, an air source, a vacuum pump, a nitrogen source, etc.). In some embodiments, the outlet of the utility source is connected to the floor (or wall) of electronic device manufacturing system 100, 200. Thus, the first end of each utility cable may be attached to the ground of the fab (e.g., the ground on which factory interface subsystems 107A, 107B are installed). A second end of each utility cable may be attached to an inlet of factory interface subsystem 107A, 107B. In some embodiments, each inlet is located at the bottom of factory interface subsystem 107A, 107B. Thus, the second end of each utility cable is attached to the bottom of factory interface subsystem 107A, 107B.

[0037] The electronic device manufacturing system 100 may also include a system controller 140. Alternatively, a separate system controller 140 may be included for each factory interface subsystem 107A, 107B. The system controller 140 may be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. The system controller 140 may include one or more processing devices, which may be general-purpose processing devices such as a microprocessor, a central processing unit, etc. More specifically, the processing devices may be complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors implementing other instruction sets or combinations of instruction sets. The processing devices may also be one or more special-purpose processing devices such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. The system controller 140 may include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interfaces, and / or other components. The system controller 128 may execute instructions to perform any one or more of the methods and / or embodiments described herein. The instructions may be stored in a computer-readable storage medium, which may include main memory, static memory, secondary storage, and / or a processing device (during execution of the instructions). The system controller 140 may include an environmental controller configured to control the environment (e.g., pressure, moisture level, vacuum level, etc.) within the factory interface 106. In an embodiment, execution of instructions by the system controller 140 causes the system controller to perform one or more of the methods of FIGS. 6 and 7.System controller 140 may also be configured to allow for the input and display of data, operational commands, etc. by a human operator.

[0038] The system controller 140 may include a suitable processor, memory, and electronics for receiving inputs from various sensors and controlling one or more valves to control the environmental conditions within each of the factory interface chambers of the factory interface subsystems 107A, 107B. In one or more embodiments, the system controller 140 may include an environmental control system that can monitor the relative humidity (RH) of one or more of the factory interface subsystems 107A, 107B using one or more sensors via RH sensing. Any suitable type of sensor that measures relative humidity, such as a capacitive sensor, may be used. RH may be reduced by flowing an appropriate amount of purge gas from a purge gas supply in the environmental control system into one or both of the factory interface chambers. In some embodiments, for example, compressed bulk inert gas with low HO levels (e.g., purity ≥ 99.9995%, HO ≤ 5 ppm) may be used as the purge gas supply in the environmental control system. Other appropriately low HO levels may be used.

[0039] In other aspects, a sensor can measure multiple environmental conditions. For example, in some embodiments, a sensor can measure a relative humidity value. In one or more embodiments, the predetermined reference relative humidity value can be less than 1000 ppm moisture, less than 500 ppm moisture, or even less than 100 ppm moisture, depending on the level of moisture that can be tolerated in a particular process being performed in system 100 or on a particular substrate exposed to the environment of one or both of the factory interface chambers.

[0040] The environmental monitor may also measure oxygen (O) levels within one or more factory interface chambers. In some embodiments, a control signal from the system controller 140 to an environmental control device that initiates the flow of an appropriate amount of purge gas from a purge gas supply to the appropriate factory interface chamber may be provided to control the oxygen (O) level below an O threshold. In one or more embodiments, the O threshold may be less than 50 ppm, less than 10 ppm, or less than 5 ppm, depending on the level of O that is acceptable (does not affect quality) for a particular process being performed within the system 100 or on a particular substrate being exposed to the environment of one of the factory interface chambers. In some embodiments, a sensor may sense the oxygen level within one of the factory interface chambers to exceed a safe threshold level that allows entry into the factory interface chamber.

[0041] The sensor may also measure the absolute or relative pressure within one of the factory interface chambers. In some embodiments, the system controller 140 may control the flow of purge gas from a purge gas supply to one or both of the factory interface chambers to control the pressure within each factory interface chamber.

[0042] In the embodiment illustrated herein, the system controller 140 may include a processor, memory, and peripheral components configured to receive control inputs from sensors (e.g., relative humidity and / or oxygen) and execute a closed-loop or other suitable control scheme. In one embodiment, the control scheme may vary the flow rate of purge gas introduced into the factory interface chamber to achieve predetermined environmental conditions within the factory interface chamber. In other embodiments, the control scheme may determine when to transfer a substrate to the appropriate one of the factory interface chambers or when to open the doors of the substrate carriers 122A-122F.

[0043] As previously mentioned, factory interface subsystem 107A can be separated from factory interface subsystem 107B via partition 142. Bulkhead 142 can include one or more openings that allow factory interface robot 126A to transfer one or more substrates to factory interface robot 126B, or vice versa. Bulkhead 142 can include one or more pass-through doors 150, 150A, 150B. For example, as shown in FIGS. 1A, 1B, and 2, pass-through door 150 can be located to the right of partition 142 within the space of factory interface subsystem 107B. In another example, as shown in FIGS. 1C, 1D, 3A, and 3B, pass-through door 150A can be located to the left of partition 142, and pass-through door 150B can be located to the right of partition 142. In some embodiments (not shown), the pass-through door 150 can be located to the left of the partition wall 142 within the space of the factory interface subsystem 107A. In the closed position, the pass-through door can maintain an airtight seal. Thus, the factory interface subsystem 107A and the factory interface subsystem 107B can maintain separate atmospheres that are sealed off from each other. In the open position, the pass-through door can expose a pass-through area formed by the opening in the partition wall 142, allowing the factory interface robot 126A and the factory interface robot 126B to transfer substrates to each other.

[0044] 1A and 2, in some embodiments, factory interface subsystem 107A can include a substrate pass-through station 144. Note that substrate pass-through station 144 is shown in factory interface subsystem 107A by way of example only, and that substrate pass-through station 144 can also be located in factory interface subsystem 107B or in both factory interface subsystems 107A and 107B. Substrate pass-through station 144 can include one or more substrate platforms 146A, 146B and lifting components 148. Substrate pass-through station 144 can facilitate the transfer of substrates between factory interface robot 126A and factory interface robot 126B. In one example, factory interface robot 126A can be configured to place a substrate on substrate platform 146A or 146B, and factory interface robot 126B can retrieve the substrate through an opening in bulkhead 142. In another example, the factory interface robot 126B can be configured to place a substrate onto the substrate platform 146A or 146B through the opening in the bulkhead 142, and the factory interface robot 126A can retrieve the substrate. The lifting component 148 can be any mechanism (e.g., electrical, mechanical, pneumatic, or hydraulic actuators, valve systems, elevator systems, etc.) used to raise and lower the substrate platforms 146A, 146B. For example, the lifting component 148 can be configured to raise the platforms 146A, 146B to a height that enables the factory interface robot 126B to place and / or retrieve a substrate through the opening in the bulkhead 142, and to lower the platforms 146A, 146B to a height that prevents the substrate pass-through station 144 from interfering with the factory interface robot 126A transferring substrates between the load port 124 and the load lock 120A.

[0045] 3A, 3B, 4A, and 4B, in some embodiments, the pass-through station can be a component of a pass-through door. In particular, FIG. 4A shows the pass-through doors 150A, 150B in an open position, and FIG. 4B shows the pass-through doors 150A, 150B in a closed position. According to an embodiment of the present disclosure, the pass-through doors 150A, 150B can be coupled to pistons 452A, 452B, respectively. The pistons 452A, 452B can be coupled to a drive mechanism 454. The drive mechanism 454 can include one or more pneumatic devices, electromechanically driven devices, actuators, or similar mechanisms, and the drive mechanism 454 can raise and / or lower the pistons 452A, 452B using compressed air or gas, electricity, and mechanical mechanisms. Thus, the drive mechanism 454 can position the pass-through doors 150A, 150B in an open position and / or a closed position.

[0046] The pass-through doors 150A, 150B can include pass-through stations 430A, 430B, respectively. In some embodiments, the pass-through stations 430A, 430B can be located above the pass-through doors 150A, 150B. In other embodiments, the pass-through stations 430A, 430B can be located to the side of or below the pass-through doors 150A, 150B. The pass-through stations 430A, 430B can include one or more platforms, fins, brackets, shelves, or any other components configured to receive one or more substrates 102. In one embodiment, the pass-through stations include wafer fins with stacks of up to seven wafers. For example, as shown in FIG. 4A , the pass-through stations 430A, 430B include a bracket arrangement capable of receiving two substrates. In one example, the factory interface robot 126A can position a substrate 102 on the pass-through stations 430A, 430B, and the factory interface robot 126B can remove the substrate 102, or vice versa. While FIGS. 4A and 4B show two pass-through stations (430A, 430B), those skilled in the art will appreciate that any number of pass-through stations can be coupled to the pass-through doors 150A, 150B. The pass-through doors can form an airtight seal on both sides of the partition separating the two factory interface subsystems 107A, 107B. Wafer pass-through stations (not shown) can be positioned above the pass-through doors 150A, 150B. In some embodiments, the pass-through doors 150A, 150B open vertically (e.g., by sliding or swinging up and down). In some embodiments, the doors are L-shaped doors with both vertical and horizontal strokes. The door stroke can protect an independent wafer pass-through station positioned in an opening in the partition. In this configuration, opening the right door allows the right robot to access the pass-through station, and opening the left door allows the left robot to access the pass-through station.In some embodiments, when both doors are closed, two separate EFEM spaces are separated and the pass-through station is inaccessible.

[0047] In some embodiments, each pass-through station 430A, 430B can independently hold one or more substrates. In such embodiments, when one pass-through door (e.g., pass-through door 150A) is closed and the other pass-through door (e.g., pass-through door 150B) is open, a factory interface robot (e.g., factory interface robot 126B) of the factory interface subsystem with the open pass-through door can position and / or remove substrates from pass-through station 430B.

[0048] When the door is down, the wafer pass-through station may be available, and when the door is up, the opening in the bulkhead may be sealed and the pass-through station may not be available.

[0049] 5A-5B show another embodiment in which a set of pass stations 530A-530D has a pair of pass doors 550A, 550B disposed in an opening in the partition wall 142. In particular, according to an embodiment of the present disclosure, FIG. 5A shows the pass doors 550A, 550B in an open position, and FIG. 5B shows the pass doors 550A, 550B in a closed position. The pass doors 550A, 550B may each be an L-shaped door. The pass doors 550A, 550B may be coupled to pistons 552A, 552B, respectively. The pistons 552A, 552B may be coupled to drive mechanisms 554A, 554B, respectively. The drive mechanisms 554A, 554B can include one or more pneumatic devices, electromechanically driven devices, actuators, or similar mechanisms, where the drive mechanisms 554A, 554B can use compressed air or gas, electricity, and / or mechanical mechanisms to raise and / or lower the pistons 552A, 552B, move the pistons 552A, 552B in a horizontal motion, rotate the pistons 552A, 552B, or any combination thereof. Thus, the drive mechanisms 554A, 554B can position the pass-through doors 550A, 550B in an open and / or closed position. In one example, the drive mechanisms 554A, 554B can move the pistons 552A, 552B, respectively, horizontally toward the bulkhead 142 and then vertically raise the pistons 552A, 552B toward the bulkhead top 560. In another example, the drive mechanisms 554A, 554B can raise the pistons 552A, 552B vertically toward the partition upper end 560 and then move the pistons 552A, 552B horizontally toward the partition 142. In some embodiments, the partition upper end 560 and / or the pass-through doors 550A, 550B can include one or more seals capable of providing an airtight seal. For example, in the closed position, the pass-through doors 550A, 550B can form a seal with the partition 142 via the bottom of the pass-through doors 550A, 550B and a seal with the partition upper end 560 via the upper ends of the pass-through doors 550A, 550B. The pass-through doors 550A, 550B can be opened and closed independently of each other.For example, pass-through door 550A can be in an open position while pass-through door 550B is in a closed position, or vice versa.

[0050] Pass-through stations 530A, 530B may be coupled to bulkhead tops 560, walls of factory interface subsystems 107A, 107B, or other portions of electronic device manufacturing systems 100, 102. Each pass-through station may include a substrate platform for receiving one or more substrates. In one example, factory interface robot 126A may position a substrate 102 on pass-through stations 530A, 530B, 530C, and / or 530D, and factory interface robot 126B may retrieve a substrate 102, or vice versa. While FIGS. 5A and 5B show four pass-through stations (530A-530D, 530B), one skilled in the art will appreciate that any number of pass-through stations may be used.

[0051] As shown in FIGS. 1A-1D , the factory interface 106 can include one or more auxiliary components 170 that are accessible by the factory interface robots 126A, 126B and are part of the mini-environment of the factory interface subsystems 107A, 107B. The auxiliary components 170 can include substrate wafer storage stations, metrology stations, cooling stations, servers, or any other substrate pre- or post-processing stations. Substrate storage containers can store substrates and / or substrate carriers (e.g., FOUPs), for example. Metrology equipment can be used to determine characteristic data of products manufactured by the electronic device manufacturing system 100. In some embodiments, the factory interface robots 126A, 126B can access the auxiliary components 170. For example, the factory interface robots 126A, 126B can place substrates in or on the auxiliary components 170 or retrieve substrates from the auxiliary components 170. 1B, 1D, and 2, factory interface subsystem 107A can include upper compartment 160A, and factory interface subsystem 107B can include upper compartment 160B. Upper compartments 160A, 160B can house electronic systems (e.g., servers, air conditioning units, etc.), utility cables, system controller 140, or other components.

[0052] The factory interface 106 may include one or more access doors 134A, 134B that may be used to perform inspection or maintenance of the load locks 120A, 120B, the factory interface robots 126A, 126B, or other components. In some embodiments, the factory interface subsystem 107A may include the side access door 134A, and the factory interface subsystem 107B may include the side access door 134B.

[0053] 2, 3A, and 3B, each factory interface subsystem 107A, 107B can include one or more substrate storage stations 152A-152D and / or one or more alignment pedestals 154A, 154B. The substrate storage stations 152A, 152B can include one or more slots for storing substrates. For example, the factory interface robot 126A can retrieve a substrate from the load lock 120A or a substrate carrier and place the substrate in one of the slots of the substrate storage stations 152A or 152B, or vice versa. Similarly, the factory interface robot 126B can retrieve a substrate from the load lock 120B or a substrate carrier and place the substrate in one of the slots of the substrate storage stations 152C or 152D, or vice versa.

[0054] The alignment pedestals 154A, 154B may include a device for orienting the substrate in a predetermined direction. For example, the alignment pedestals 154A, 154B may optically scan the substrate 102 to identify a notch (not shown) located on the substrate 102. The alignment pedestals 154A, 154B may then align the substrate 102 by rotating the substrate 102 until the notch is oriented in a predetermined direction. Examples of alignment procedures and alignment pedestals are described in U.S. Patent Nos. 3,972,424, 5,102,280, and 6,275,742.

[0055] In the illustrative example, factory interface 106 includes multiple sides, including a back side configured to face transfer chamber 110 of electronic device manufacturing system 100, a front side, a right side, and a left side. A first factory interface robot (e.g., factory interface robot 126A) is positioned proximate the left side of factory interface 106 within the interior space of factory interface subsystem 107A, and a second factory interface robot (e.g., factory interface robot 126B) is positioned proximate the right side of factory interface 106 within the interior space of factory interface subsystem 107B. A first load lock (e.g., load lock 120A) and a second load lock (e.g., load lock 120B) are positioned adjacent the back side and behind the first and second factory interface robots, such that the first load lock is closer to the first factory interface robot than the second load lock, and the second load lock is closer to the second factory interface robot than the first load lock. Factory interface subsystem 107A includes a first set of load ports (e.g., one or more of load ports 124) for receiving a first set of substrate carriers (e.g., one or more of substrate carriers 122A-122C), where the first set of load ports is located in a first portion of the front face near the left side. Factory interface subsystem 107B includes a second set of load ports (e.g., one or more of load ports 124) for receiving a second set of substrate carriers (e.g., one or more of substrate carriers 122D-122F), where the second set of load ports is located in a second portion of the front face near the right side. Factory interface 106 can include at least one of a substrate storage container or metrology equipment located below a load port 122 of the first set of load ports or the second set of load ports.

[0056] In some embodiments, a factory operator can access the factory interface robots 126A, 126B, the load ports 124, the load locks 120A, 120B, the substrate pass-through station 144, the upper compartment 160A, 160B, or any other components for maintenance or repair without shutting down the entire factory interface 106. In particular, a factory operator can perform maintenance on the factory interface robot 126A, the first set of load ports 124, the load lock 120A, the substrate pass-through station 144, the substrate storage station 152A, the alignment pedestal 154A, and / or the upper compartment 160A while the factory interface subsystem 107B and its components remain fully operational. Similarly, a factory operator can perform maintenance on the factory interface robot 126B, the second set of load ports 124, the load lock 120B, the pass-through door 150, the substrate storage station 152A, the alignment pedestal 154A, and / or the upper compartment 160B while the factory interface subsystem 107A and its components remain fully operational.

[0057] 6 is a flowchart of a method 600 for transporting a substrate from a substrate carrier to a factory interface subsystem according to an embodiment of the present disclosure. Method 600 is performed by processing logic, which may include hardware (circuitry, dedicated logic, etc.), software (such as running on a general-purpose computer system or a dedicated machine), firmware, or some combination thereof. In one implementation, method 600 may be performed by a computer system such as system controller 140 of FIG. 1. In other or similar implementations, one or more steps of method 600 may be performed by one or more other machines not shown.

[0058] In step 610, the load port receives the substrate carrier. In one example, the substrate carrier is a FOUP. In some embodiments, the load port includes a frame adapted to connect the load port to a factory interface. The frame has a transport opening through which one or more substrates can be transported between the substrate carrier and the factory interface. The load port also includes an actuator coupled to the frame and a load port door coupled to the actuator. The load port door can be configured to seal the transport opening. The actuator can position the load port door from a closed position to an open position and from the open position to the closed position.

[0059] In step 620, the load port door is positioned from a closed position to an open position, for example, via a door mechanism operated by the load port controller.

[0060] A factory interface robot located within the factory interface subsystem removes the substrate from the substrate carrier in step 630. In some embodiments, the factory interface robot can engage a vertical drive mechanism to position an end effector in a horizontal plane associated with the load port.

[0061] In step 640, the factory interface robot may place the substrate on one or more components associated with the factory interface subsystem. For example, the factory interface robot may place the substrate on a substrate pass-through station, a load port, an alignment pedestal, a slot in a substrate storage station, a substrate carrier, or pass the substrate to another factory interface robot.

[0062] 7 is a flowchart of a method 700 for transporting a substrate from a first factory interface robot to a second factory interface robot according to an embodiment of the present disclosure. Method 700 is performed by processing logic, which may include hardware (circuitry, dedicated logic, etc.), software (such as running on a general-purpose computer system or a dedicated machine), firmware, or some combination thereof. In one implementation, method 700 may be performed by a computer system such as system controller 140 of FIG. 1. In other or similar implementations, one or more steps of method 700 may be performed by one or more other machines not shown.

[0063] In step 710, a first factory robot removes a substrate from a substrate carrier. In one example, the substrate carrier is a FOUP.

[0064] In step 720, the first factory interface robot transfers the substrate to the second factory robot. In one example, the first factory robot is disposed within the first factory interface subsystem, and the second factory robot is disposed within the second factory interface subsystem. The first factory robot and / or the second factory robot can engage with their respective mechanisms to adjust the position of their end effectors to predetermined positions associated with retrieving, transporting, or transferring the substrate. The first factory interface robot can be configured to transfer the substrate to the second factory interface robot using a pass-through area in a partition between the first factory interface subsystem and the second factory interface subsystem. In some embodiments, the processing logic can first open a pass-through door to allow transfer of the substrate from the first factory interface robot to the second factory interface robot. The first factory interface robot can be configured to transfer the substrate to the second factory interface robot through the pass-through area. In another example, the first factory robot can place the substrate on a substrate pass-through station. Once positioned, the second factory interface robot can remove the substrate from the substrate passing station.

[0065] In step 730, the second factory interface robot places the substrate in a load lock coupled to the factory interface. In some embodiments, the first factory interface robot does not have access to the load lock. In one example, the second factory robot can retrieve the substrate from inside a load lock located in the second factory interface subsystem. The second factory robot can then transfer the substrate to the first factory robot. The second factory interface robot can be configured to transfer the substrate to the first factory interface robot using a pass-through area. The first factory robot can then place the substrate in a substrate carrier.

[0066] The above description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, those skilled in the art will recognize that at least some embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details set forth are merely exemplary. Particular implementations may vary from these example details and still be considered within the scope of the present disclosure.

[0067] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the term "about" or "approximately" is used herein, it is intended to mean that the stated nominal value is accurate to within ±10%.

[0068] Although the method steps herein are shown and described in a particular order, the order of each method step may be changed such that certain steps may be performed in reverse order, such that certain steps may be performed at least partially concurrently with other steps. In other embodiments, instructions or sub-operations of separate steps may be performed in an intermittent and / or alternating manner.

[0069] It is understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. The scope of the present disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A factory interface forming an internal space; a partition disposed within the factory interface, the partition dividing the interior space into a first factory interface chamber forming a second interior space and a second factory interface chamber forming a third interior space, the partition configured to provide a first sealed environment within the first factory interface chamber and a second sealed environment within the second factory interface chamber; A substrate processing system comprising: the partition wall has an opening, and the substrate processing system includes: a first door disposed within the first factory interface chamber, the first door configured to cover the opening when closed to separate the second interior space from the third interior space and to provide at least one of the first sealed environment within the first factory interface chamber or the second sealed environment within the second factory interface chamber; The substrate processing system further comprises:

2. a second door disposed within the second factory interface chamber, the second door configured to cover the opening when closed to separate the second interior space from the third interior space and to provide at least one of the first sealed environment within the first factory interface chamber or the second sealed environment within the second factory interface chamber; The substrate processing system of claim 1 , further comprising:

3. 10. The substrate processing system of claim 1, wherein the first door comprises a substrate pass-through station for passing substrates between the first factory interface chamber and the second factory interface chamber.

4. The substrate processing system of claim 3 , wherein a first factory interface robot is configured to at least one of place a substrate on the substrate passing station or remove the substrate from the substrate passing station.

5. The substrate processing system of claim 2 , wherein a substrate passing station is disposed between the first door and the second door.

6. The substrate processing system of claim 1 , wherein the first door is an L-shaped door that is capable of vertical and horizontal movement.

7. A factory interface forming an internal space; a partition disposed within the factory interface, the partition dividing the interior space into a first factory interface chamber forming a second interior space and a second factory interface chamber forming a third interior space, the partition configured to provide a first sealed environment within the first factory interface chamber and a second sealed environment within the second factory interface chamber; a first factory interface robot disposed within the second interior space of the first factory interface chamber; a second factory interface robot disposed within the third interior space of the second factory interface chamber; a first set of load ports coupled to the first factory interface chamber for receiving a first set of substrate carriers, the first set of load ports positioned to be accessible by the first factory interface robot; a second set of load ports coupled to the second factory interface chamber for receiving a second set of substrate carriers, the second set of load ports positioned to be accessible by the second factory interface robot; A substrate processing system comprising:

8. A factory interface forming an internal space; a partition disposed within the factory interface, the partition dividing the interior space into a first factory interface chamber forming a second interior space and a second factory interface chamber forming a third interior space, the partition configured to provide a first sealed environment within the first factory interface chamber and a second sealed environment within the second factory interface chamber; a first factory interface robot disposed within the second interior space of the first factory interface chamber; a second factory interface robot disposed within the third interior space of the second factory interface chamber; a substrate pass station located in at least one of the first factory interface chamber or the second factory interface chamber for passing a substrate between the first factory interface chamber and the second factory interface chamber, the first factory interface robot configured to at least one of place a substrate on the substrate pass station or remove the substrate from the substrate pass station; A substrate processing system comprising:

9. a first load lock coupled to a rear wall of the first factory interface chamber and accessible by the first factory interface robot; a second load lock coupled to a rear wall of the second factory interface chamber and accessible by the second factory interface robot; The substrate processing system according to claim 7 or 8, further comprising:

10. a first compartment housing an electronic system associated with the first factory interface chamber; a second compartment housing an electronic system associated with the second factory interface chamber; The substrate processing system of claim 1 , 7 or 8 further comprising:

11. The substrate processing system of claim 8 , wherein the substrate passing station comprises at least one substrate platform and lifting components.

12. a first alignment pedestal disposed within the second interior space of the first factory interface chamber; a second alignment pedestal disposed within the third interior space of the second factory interface chamber; The substrate processing system of claim 1 , 7 or 8 further comprising:

13. a first recirculation system for recirculating gas within the second interior space of the first factory interface chamber; a second recirculation system for recirculating gas within the third interior space of the second factory interface chamber; The substrate processing system of claim 1 , 7 or 8 further comprising:

14. a first factory interface subsystem; a second factory interface subsystem; a partition disposed between the first factory interface subsystem and the second factory interface subsystem, the partition including an opening; a first load lock coupled to a backside of the first factory interface subsystem; a second load lock coupled to a back side of the second factory interface subsystem; a first factory interface robot disposed within the interior volume of the first factory interface subsystem; a second factory interface robot disposed within the interior volume of the second factory interface subsystem; Equipped with the first factory interface robot is configured to transfer a substrate to the second factory interface robot through the opening in the partition; Electronic device manufacturing system.

15. The electronic device manufacturing system of claim 14 , wherein the partition is configured to provide a first sealed environment within the first factory interface subsystem and a second sealed environment within the second factory interface subsystem.

16. a first door located within the first factory interface subsystem and configured to cover the opening and provide a first sealed environment within the first factory interface subsystem and a second sealed environment within the second factory interface subsystem; a second door located within the second factory interface subsystem and configured to cover the opening and provide a first sealed environment within the first factory interface subsystem and a second sealed environment within the second factory interface subsystem; The electronic device manufacturing system of claim 14 further comprising:

17. a substrate pass station located within the first factory interface subsystem, the first factory interface robot configured to at least one of place a substrate on or remove the substrate from the substrate pass station; The electronic device manufacturing system of claim 14 further comprising:

18. 15. The electronic device manufacturing system of claim 14, wherein the first factory interface subsystem is configured to perform an action in consideration of at least one of a failure to a component of the second factory interface subsystem or a shutdown of the second factory interface subsystem.

19. 1. A method of transferring a substrate from a first factory interface robot to a second factory interface robot, comprising: removing a substrate from a substrate carrier by a first end effector of the first factory interface robot; placing the substrate on a substrate passing station; removing the substrate from the substrate passing station with a second end effector of the second factory interface robot, the second factory interface robot removing the substrate by passing the second end effector through an opening in a partition separating the first factory interface robot and the second factory interface robot; A method comprising:

20. 20. The method of claim 19, wherein one or more doors are configured to cover the opening to provide a first enclosed environment for the first factory interface robot and a second enclosed environment for the second factory interface robot.

21. 21. The method of claim 20, wherein the one or more doors comprise a pass-through station.

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