Non-contact communication media

Abstract

To improve the heat-resisting properties of a storage body that accommodates an electronic component.SOLUTION: A non-contact communication medium according to the present disclosure has a storage body and an electronic component. The storage body has an accommodation space therein. The electronic component is located in the accommodation space and performs non-contact communication. The storage body has a first cylindrical body, a first lid body, and a second lid body. The first cylindrical body is formed of ceramics, and has a first opening, a second opening, and an accommodation space communicating with the first opening and second opening. The first lid body is formed of ceramics and closes the first opening. The second lid body is formed of ceramics and closes the second opening.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The present disclosure relates to contactless communication media. [Background technology]

[0002] Conventionally, goods are managed using RFID (Radio Frequency Identifier) ​​tags.

[0003] Patent Document 1 discloses a technology for sealing an RFID tag in a heat-insulating container in order to use the RFID tag to manage parts that are processed at high temperatures in factories, etc. The container described in Patent Document 1 has a container for storing the RFID tag and a lid that is joined to the container. The RFID tag sealed in the container is transported through the manufacturing process together with the parts. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-129838 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present disclosure is to provide a non-contact communication medium that can improve the heat resistance of a housing that houses electronic components. [Means for solving the problem]

[0006] A contactless communication medium according to one embodiment of the present disclosure includes a housing and an electronic component. The housing has an internal storage space. The electronic component is located in the storage space and performs contactless communication. The housing also includes a first cylindrical body, a first lid, and a second lid. The first cylindrical body is made of ceramics and has a first opening, a second opening, and a storage space communicating with the first opening and the second opening. The first lid is made of ceramics and closes the first opening. The second lid is made of ceramics and closes the second opening. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to improve the heat resistance of a housing that houses electronic components. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view of a contactless communication medium according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along the line II-II of FIG. [Figure 3] FIG. 3 is a schematic enlarged view of the portion H shown in FIG. [Figure 4] FIG. 4 is an enlarged cross-sectional view of a non-contact communication medium according to a first modification. [Figure 5] FIG. 5 is a diagram showing another example of the covering layer according to the first modified example. [Figure 6] FIG. 6 is an enlarged cross-sectional view of a non-contact communication medium according to a second modification. [Figure 7] FIG. 7 is a diagram showing another example of the covering layer according to the second modified example. [Figure 8] FIG. 8 is an enlarged cross-sectional view of a non-contact communication medium according to a third modification. [Figure 9] FIG. 9 is a diagram showing another example of the covering layer according to the third modified example. [Figure 10] FIG. 10 is an enlarged cross-sectional view of a non-contact communication medium according to a fourth modification. [Figure 11] FIG. 11 is a diagram showing another example of the covering layer according to the fourth modified example. [Figure 12]FIG. 12 is a cross-sectional view of a non-contact communication medium according to a fifth modified example. [Figure 13] FIG. 13 is a plan view of a contactless communication medium according to a sixth modified example. [Figure 14] 14 is a cross-sectional view taken along the line XIV-XIV in FIG. [Figure 15] FIG. 15 is a plan view of a contactless communication medium according to a seventh modification. [Figure 16] 16 is a cross-sectional view taken along the line XVI-XVI in FIG. [Figure 17] FIG. 17 is a cross-sectional view of a non-contact communication medium according to an eighth modification. [Figure 18] FIG. 18 is a cross-sectional view of a non-contact communication medium according to a ninth modification. [Figure 19] FIG. 19 is a cross-sectional view of a contactless communication medium according to a tenth modification. [Figure 20] FIG. 20 is a perspective view of a contactless communication medium according to an eleventh modification. [Figure 21] FIG. 21 is a cross-sectional view of a contactless communication medium according to an eleventh modification. [Figure 22] FIG. 22 is a view of the receiving hole according to the twelfth modification, seen along the extending direction of the receiving hole. [Figure 23] FIG. 23 is a cross-sectional view of a non-contact communication medium according to a thirteenth modification. [Figure 24] FIG. 24 is a cross-sectional view of a non-contact communication medium according to a fourteenth modification. [Figure 25] FIG. 25 is a plan view of a first base material according to a fourteenth modification. [Figure 26] FIG. 26 is an enlarged cross-sectional view of a non-contact communication medium according to a fifteenth modification. [Figure 27] FIG. 27 is an enlarged cross-sectional view of a non-contact communication medium according to a sixteenth modification. [Figure 28] FIG. 28 is an enlarged cross-sectional view of a non-contact communication medium according to a seventeenth modification. [Figure 29] FIG. 29 is an enlarged cross-sectional view of a non-contact communication medium according to an eighteenth modification. [Figure 30] FIG. 30 is a cross-sectional view of a non-contact communication medium according to a nineteenth modification. [Figure 31] FIG. 31 is a plan view of a first base material according to a nineteenth modification. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a form for implementing a contactless communication medium according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the contactless communication medium according to the present disclosure is not limited to this embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause contradiction in processing content. Furthermore, the same components in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0010] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0011] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being perpendicular to each other, and the positive Z-axis direction is the vertically upward direction.

[0012] <Configuration of contactless communication medium> The configuration of a non-contact communication medium according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a plan view of the non-contact communication medium according to the embodiment. Fig. 2 is a cross-sectional view taken along the line II-II in Fig. 1.

[0013] 1 and 2, a contactless communication medium 1 according to the embodiment includes an electronic component 10 and a container 20. The electronic component 10 is, for example, an RFID tag.

[0014] Electronic component 10 as RFID has an antenna for contactless communication, an IC chip that performs contactless communication via the antenna, and a memory that stores identification information, all on a substrate made of, for example, LTCC (Low Temperature Co-fired Ceramics) etc. Electronic component 10 as RFID can transmit the identification information stored in the memory to an external device (for example, an RFID reader) by contactless communication using electromagnetic induction, radio waves, etc.

[0015] The non-contact communication medium 1 according to the embodiment is used, for example, in a high-temperature environment exceeding the heat-resistant temperature of the electronic component 10. For example, the non-contact communication medium 1 according to the embodiment is attached to a component to be plated, and plated together with the component. The temperature of the plating solution for hot dip galvanizing or the like is, for example, 75°C to 500°C.

[0016] Furthermore, the non-contact communication medium 1 according to the embodiment may be treated with acidic or alkaline chemicals together with the electronic component 10. In this manner, the non-contact communication medium 1 according to the embodiment may be used in an acidic or alkaline environment that exceeds the chemical resistance of the electronic component 10.

[0017] Therefore, the contactless communication medium 1 according to the embodiment has a housing 20 that seals the electronic component 10 to protect the electronic component 10 from a high-temperature environment and an acidic / alkaline environment. The housing 20 has an internal housing space 25 in which the electronic component 10 is housed.

[0018] The container 20 has a first base material 21, a second base material 22, and an adhesive layer 5. The first base material 21 and the second base material 22 are bonded to each other via the adhesive layer 5.

[0019] The first substrate 21 and the second substrate 22 have a relatively flat cylindrical shape. Specifically, the first substrate 21 and the second substrate 22 have two flat surfaces (upper end surface and lower end surface) that are circular in plan view, and a curved surface (outer peripheral surface) that connects these two flat surfaces. One flat surface 21a (upper end surface) of the first substrate 21 and one flat surface 22a (lower end surface) of the second substrate 22 face each other with approximately the same diameter, and the adhesive layer 5 is located between them.

[0020] The first base material 21 has an accommodating recess 25a that accommodates the electronic component 10. The accommodating recess 25a opens in the center of the flat surface 21a. The first base material 21 and the second base material 22 are joined via the adhesive layer 5, thereby closing the flat surface 21a of the first base material 21. As a result, the electronic component 10 is sealed inside the housing 20.

[0021] The first substrate 21 and the second substrate 22 are made of ceramics. For example, cordierite can be used as the ceramic that constitutes the first substrate 21 and the second substrate 22. Cordierite has a small thermal expansion coefficient, which provides excellent thermal shock resistance, and also has low thermal conductivity, which makes it difficult for heat to be transferred to the electronic component 10. In this way, by using cordierite, the electronic component 10 can be appropriately protected from high-temperature environments. However, the ceramic that constitutes the first substrate 21 and the second substrate 22 does not necessarily have to be cordierite. This point will be described later.

[0022] The adhesive layer 5 is located between the flat surface 21a of the first base material 21 and the flat surface 22a of the second base material 22, and bonds the first base material 21 and the second base material 22. The adhesive layer 5 spreads over the entire flat surface 22a of the second base material 22. Therefore, a portion of the adhesive layer 5 faces the storage space 25.

[0023] In the adhesive layer 5 according to this embodiment, the porosity at the end portion 5a is lower than the porosity at the interior portion 5b. In other words, "low porosity" means that the adhesive layer 5 is dense. In other words, "high porosity" means that the adhesive layer 5 is sparse.

[0024] The end 5a of the adhesive layer 5 refers to a portion of the adhesive layer 5 that is relatively close to the outside of the container 20. Specifically, the end 5a of the adhesive layer 5 is a region that includes the end surface of the adhesive layer 5 that is exposed to the outside and may come into contact with a plating solution, etc. For example, the end 5a of the adhesive layer 5 is a region up to 300 μm from the end surface of the adhesive layer 5.

[0025] The inner portion 5b of the adhesive layer 5 refers to a portion of the adhesive layer 5 that is relatively close to the accommodation space 25 of the housing body 20. Specifically, the inner portion 5b of the adhesive layer 5 is a portion that is located more inward in the housing body 20 than the end portion 5a of the adhesive layer 5. For example, the inner portion 5b of the adhesive layer 5 may be a region that faces the accommodation space 25 formed inside the housing body 20.

[0026] In this way, the adhesive layer 5 according to the embodiment has a density difference such that "outside (end 5a)>inside (inner part 5b)".

[0027] This point will be explained more specifically with reference to Fig. 3. Fig. 3 is a schematic enlarged view of part H shown in Fig. 2.

[0028] As shown in FIG. 3, the adhesive layer 5 according to the embodiment includes an adhesive 51 and a sealant 52.

[0029] The adhesive 51 only needs to have heat resistance that can withstand the environment in which the non-contact communication medium 1 is used. For example, an inorganic adhesive can be used as such an adhesive. Alternatively, an inorganic adhesive to which ceramic powder has been added can be used as the adhesive.

[0030] For example, the adhesive 51 contains silica as a main component and also contains alumina, calcia, zircon, sodium glass, and the like.

[0031] The adhesive 51 has voids 511 throughout the entire area, including the end portion 5a and the interior portion 5b. The voids 511 are distributed almost evenly throughout the entire area of ​​the adhesive 51.

[0032] The sealant 52 fills the voids 511 in the adhesive 51, thereby filling the voids 511. Specifically, the sealant 52 fills the voids 511 located at the end 5a among the voids 511 distributed throughout the entire area of ​​the adhesive 51.

[0033] Specifically, the sealing agent 52 contains fine particles and a binder, and the fine particles enter the voids 511, and the binder connects the fine particles that have entered the voids 511 to the adhesive 51, thereby sealing the voids 511. In terms of the manufacturing process, it is preferable that the sealing agent 52 contains a solvent. By including a solvent, it is possible to facilitate the penetration of the fine particles and the binder into the adhesive 51. Note that the solvent does not need to be included in the finished product, because the solvent evaporates from the voids 511 during the manufacturing process.

[0034] The fine particles are, for example, silica fine particles. The binder is, for example, silicone or epoxy. From the viewpoint of heat resistance, it is preferable to use silicone as the binder. Note that the sealing agent 52 does not contain alumina or zircon.

[0035] Sealing agent 52 is not limited to those having the above-mentioned components as long as it can seal voids 511 in adhesive 51. For example, sealing agent 52 may be a resin.

[0036] The voids 511 located at the end 5a of the adhesive 51 are sealed with the sealant 52, thereby forming a density difference of "outside (end 5a) > inside (inside 5b)" in the adhesive layer 5. In other words, the porosity at the end 5a of the adhesive layer 5 becomes lower than the porosity at the inside 5b of the adhesive layer 5.

[0037] The porosity of the end 5a of the adhesive layer 5, which is relatively close to the outside of the accommodation body 20, is low, in other words, the end 5a of the adhesive layer 5 is dense, which can prevent the plating solution and the like from entering the accommodation space 25 from the outside of the accommodation body 20. Furthermore, the porosity of the inside 5b of the adhesive layer 5, which is relatively close to the accommodation space 25 of the accommodation body 20, is high, in other words, the inside 5b of the adhesive layer 5 is sparse, which can improve the heat insulating properties of the adhesive layer 5.

[0038] In this way, the non-contact communication medium 1 according to the embodiment can appropriately protect the electronic component 10 from high-temperature environments while preventing external liquids and gases from entering through the joints of the housing 20.

[0039] <Manufacturing method> Next, an example of a method for manufacturing the non-contact communication medium 1 according to the embodiment will be described.

[0040] First, cordierite powder and sintering aid powder are prepared. Examples of sintering aids include rare earth oxides (yttrium oxide, cerium oxide, etc.), alkali metal oxides (lithium oxide, sodium oxide, etc.), and alkaline earth metals (calcium oxide). Instead of cordierite powder, a mixture of magnesium oxide, aluminum oxide, and silicon oxide in the desired cordierite composition ratio may also be used. Next, the prepared powder is placed in a vibration mill together with water as a solvent, and pulverized and mixed to obtain the raw material.

[0041] Next, organic components such as binders, plasticizers, and release agents are added to the raw materials obtained by grinding and mixing, and then these are stirred to produce a slurry.The slurry is then spray-dried using a spray dryer to produce ceramic granules.

[0042] Next, the produced ceramic granules are subjected to powder press molding to obtain the green bodies of the first base material 21 and the second base material 22. The receiving recess 25a is also formed by the mold in this step.

[0043] Next, the compact is degreased by heat treating it in an air atmosphere, a vacuum atmosphere, or a nitrogen gas atmosphere, and then the compact is fired to obtain the first substrate 21 and the second substrate 22. Note that, in order to obtain a desired shape, cutting and grinding processes may be performed on the compacts of the first substrate 21 and the second substrate 22 or the fired first substrate 21 and the second substrate 22.

[0044] Subsequently, after the electronic component 10 is accommodated in the accommodation recess 25a, the flat surface 21a of the first base material 21 and the flat surface 22a of the second base material 22 are joined together using the adhesive 51.

[0045] Thereafter, a sealing agent 52 is applied to the end face (outer peripheral surface) of the adhesive 51. As described above, the sealing agent 52 may contain a solvent in order to enhance permeability. The sealing agent 52 penetrates into the voids 511 located at the end 5a of the adhesive 51, and seals the voids 511. This creates a density difference in the adhesive layer 5 of "outside (end 5a) > inside (inside 5b)". In this way, a contactless communication medium 1 according to the embodiment is obtained.

[0046] <First Modification> Fig. 4 is an enlarged cross-sectional view of the non-contact communication medium according to the first modified example, and Fig. 5 is a diagram showing another example of the cover layer according to the first modified example.

[0047] 4, the non-contact communication medium 1A according to the first modification further includes a covering layer 30A. The covering layer 30A is located outside the region between the first substrate 21 and the second substrate 22, i.e., outside the region where the adhesive layer 5 is present, and covers the end 5a of the adhesive layer 5.

[0048] Specifically, the coating layer 30A of the first modified example covers the end 5a of the adhesive layer 5 and also covers the exposed surface of the outer surface of the container 20 where the end 5a of the adhesive layer 5 is exposed, in this case, part of the outer surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

[0049] In the first modified example, the coating layer 30A is made of a sealant 52. Alternatively, as shown in FIG. 5, the coating layer 30A may be made of an adhesive 51 and a sealant 52. In this case, the adhesive 51 may be located closer to the adhesive layer 5, and the sealant 52 may be located outside of the adhesive 51. The sealant 52 fills voids 511 (not shown here) in the adhesive 51 contained in the coating layer 30A, so that the porosity of the adhesive 51 contained in the coating layer 30A is equal to or lower than the porosity of the end 5a of the adhesive layer 5. Note that while FIG. 5 shows an example in which the adhesive 51 and the sealant 52 are clearly separated, the adhesive 51 and the sealant 52 may be mixed.

[0050] In this way, by covering the outside of the adhesive layer 5 with the covering layer 30A having a porosity similar to that of the end portion 5a of the adhesive layer 5, the intrusion of plating solution and the like into the storage space 25 can be further suppressed.

[0051] <Second Modification> Fig. 6 is an enlarged cross-sectional view of a non-contact communication medium according to the second modified example, and Fig. 7 is a diagram showing another example of a coating layer according to the second modified example.

[0052] 6, the non-contact communication medium 1B according to the second modification further includes a coating layer 30B. The coating layer 30B is made of a sealing agent 52, for example.

[0053] The covering layer 30B according to the second modification covers the end portion 5a of the adhesive layer 5 and also covers the entire outer peripheral surfaces 21b and 22b of the first substrate 21 and the second substrate 22.

[0054] In this way, the coating layer 30B may extend over the entire outer peripheral surfaces 21b, 22b of the first base material 21 and the second base material 22. This makes it possible to more reliably prevent the plating solution and the like from entering the accommodation space 25.

[0055] As shown in FIG. 7, the covering layer 30B may be made of an adhesive 51 and a sealant 52. In this case, the adhesive 51 may be located closer to the adhesive layer 5, and the sealant 52 may be located outside of the adhesive 51. The sealant 52 fills voids 511 (not shown here) in the adhesive 51 contained in the covering layer 30B, so that the porosity of the adhesive 51 contained in the covering layer 30B is equal to or lower than the porosity of the end 5a of the adhesive layer 5. Note that while FIG. 7 shows an example in which the adhesive 51 and the sealant 52 are clearly separated, the adhesive 51 and the sealant 52 may be mixed.

[0056] In this way, by covering the entire outer peripheral surfaces 21b, 22b of the first base material 21 and the second base material 22 with the adhesive 51, the heat resistance and chemical resistance of the housing body 20 can be improved.

[0057] <Third Modification> Fig. 8 is an enlarged cross-sectional view of a non-contact communication medium according to the third modified example, and Fig. 9 is a diagram showing another example of a cover layer according to the third modified example.

[0058] 8, the non-contact communication medium 1C according to the third modification further includes a coating layer 30C. The coating layer 30C is made of a sealing agent 52, for example.

[0059] The covering layer 30C according to the third modification not only covers the end portion 5a of the adhesive layer 5, but also covers the entire outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22. Furthermore, the covering layer 30C according to the third modification covers a part of the lower end surface 21c of the first substrate 21 that is continuous with the outer peripheral surface 21b of the first substrate 21, including the outer peripheral portion, and a part of the upper end surface 22c of the second substrate 22 that is continuous with the outer peripheral surface 22b of the second substrate 22, including the outer peripheral portion.

[0060] In this way, the coating layer 30C may extend over a portion of the other surfaces (the lower end surface 21c and the upper end surface 22c) of the outer surface of the housing body 20 that are continuous with the outer peripheral surfaces 21b, 22b of the first base material 21 and the second base material 22. This makes it possible to more reliably prevent the plating solution and the like from entering the housing space 25.

[0061] 9, the coating layer 30C may be made of an adhesive 51 and a sealing agent 52. In this case, the adhesive 51 of the coating layer 30C may be located only on the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

[0062] <Fourth Modification> Fig. 10 is an enlarged cross-sectional view of a non-contact communication medium according to the fourth modification, and Fig. 11 is a diagram showing another example of the cover layer according to the fourth modification.

[0063] 10, a non-contact communication medium 1D according to the fourth modification further includes a coating layer 30D. The coating layer 30D is made of a sealing agent 52, for example.

[0064] The covering layer 30D according to the fourth modification covers the entire surface of the housing body 20. By covering the entire housing body 20 with the covering layer 30D in this manner, it is possible to more reliably prevent the plating solution and the like from entering the housing space 25.

[0065] 11, the covering layer 30D may be made of an adhesive 51 and a sealing agent 52. In this case, the adhesive 51 of the covering layer 30D may be located only on the outer peripheral surfaces 21b, 22b of the first substrate 21 and the second substrate 22.

[0066] <Fifth Modification> Fig. 12 is a cross-sectional view of a non-contact communication medium according to Modification 5. A container 20E of a non-contact communication medium 1E shown in Fig. 12 has a dense member 40 between the first base material 21 and the second base material 22 and on the outside of an adhesive layer 5E.

[0067] The dense member 40 may have a lower porosity than the end 5a of the adhesive layer 5E, i.e., may be denser than the end 5a of the adhesive layer 5E. For example, the dense member 40 may be the above-mentioned sealing agent 52. The dense member 40 may also be a heat-resistant resin such as PEEK (polyether ether ketone), polyimide, or silicone.

[0068] In this way, the non-contact communication medium 1E may have a dense member 40 between the first substrate 21 and the second substrate 22 and on the outside of the adhesive layer 5E. Covering the outside of the adhesive layer 5E with the dense member 40 can more reliably prevent the plating solution and the like from entering the housing space 25. Furthermore, positioning the dense member 40 between the first substrate 21 and the second substrate 22 can reduce the unevenness of the housing body 20E, thereby preventing damage to the housing body 20E such as chipping and cracking.

[0069] <Sixth Modification> Fig. 13 is a plan view of a non-contact communication medium according to a sixth modified example, and Fig. 14 is a cross-sectional view taken along the line XIV-XIV in Fig. 13 .

[0070] As shown in FIGS. 13 and 14, a contactless communication medium 1H according to the sixth modification has a container 20H.

[0071] The container 20H according to the sixth modification has a first base material 21H and a second base material 22 made of ceramics, and an adhesive layer 5H, and the first base material 21H and the second base material 22 are bonded to each other via the adhesive layer 5H.

[0072] The first base material 21H has a cylindrical shape, and has flat surfaces (upper end surface and lower end surface) that are circular in plan view at both ends, as well as a curved surface (outer peripheral surface) that connects these end surfaces.

[0073] One end surface (hereinafter referred to as first flat surface 211) of first base material 21H has an accommodating hole 25Ha that accommodates electronic component 10. Accommodating hole 25Ha opens in the center of first flat surface 211 and extends perpendicular to first flat surface 211. Accommodating hole 25Ha has a circular shape in a plan view.

[0074] The second base material 22H has a cylindrical shape, with flat surfaces (upper and lower end surfaces) that are circular in plan view at both ends, and a curved surface (outer peripheral surface) that connects these end surfaces. The planar shape of the second base material 22H is the same circle as the planar shape of the accommodation hole 25Ha, and has a smaller diameter than the planar shape of the accommodation hole 25Ha.

[0075] The second base material 22H is inserted into the accommodation hole 25Ha. When inserted into the accommodation hole 25Ha, one end surface of the second base material 22H (hereinafter referred to as the second flat surface 221) is flush with the first flat surface 211 of the first base material 21H. In this manner, the second base material 22H is inserted into the accommodation hole 25Ha in a nested manner.

[0076] The adhesive layer 5H is located between the inner circumferential surface 251 of the accommodating hole 25Ha and the outer circumferential surface 222 of the second substrate 22H, and bonds the first substrate 21H and the second substrate 22H together. As a result, the accommodating hole 25Ha is closed by the second substrate 22H and the adhesive layer 5H, and the electronic component 10 accommodated in the accommodating hole 25Ha is sealed. The interior of the accommodating hole 25Ha closed by the second substrate 22H and the adhesive layer 5H forms an accommodating space 25H, and the electronic component 10 is positioned away from the second substrate 22H and the adhesive layer 5H.

[0077] As described above, the non-contact communication medium 1H according to the embodiment has a structure in which the accommodating hole 25Ha is closed with the second substrate 22H, thereby sealing the electronic component 10 in the accommodating hole 25Ha. In the non-contact communication medium 1H, the adhesive layer 5H that bonds the first substrate 21H and the second substrate 22H is located between the inner circumferential surface of the accommodating hole 25Ha and the outer circumferential surface of the second substrate 22H, i.e., within the accommodating hole 25Ha. In other words, the adhesive layer 5H, which is the bonding portion of the housing body 20H, is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1H according to the embodiment, peeling of the bonding portion of the housing body 20H is unlikely to occur.

[0078] In the non-contact communication medium 1H, the adhesive layer 5H has a lower porosity at the end 5Ha, which is relatively close to the outside of the housing 20H, than at the interior 5Hb, which is relatively close to the housing space 25H. This prevents external liquids and gases from penetrating through the joints of the housing 20H. Furthermore, the electronic component 10 can be appropriately protected from high-temperature environments.

[0079] The non-contact communication medium 1H may have a covering layer, as in the first to fifth modified examples described above. That is, the non-contact communication medium 1H may have a covering layer that covers the end 5Ha of the adhesive layer 5H. This covering layer may cover not only the adhesive layer 5H, but also part or all of the first flat surface 211 and the second flat surface 221. Furthermore, the covering layer may further cover part or all of the outer circumferential surface of the first base material 21H.

[0080] <Seventh Modification> In the seventh to tenth modified examples shown below, examples in which the housing is composed of three or more base materials will be described. First, the seventh modified example will be described with reference to Fig. 15 and Fig. 16. Fig. 15 is a plan view of a non-contact communication medium according to the seventh modified example. Fig. 16 is a cross-sectional view taken along the arrows XVI-XVI shown in Fig. 15.

[0081] 15 and 16, a contactless communication medium 1J according to the seventh modification includes an electronic component 10 and a container 20J. The electronic component 10 is, for example, an RFID tag.

[0082] 16, the first substrate 21J, the second substrate 22J, and the third substrate 23J are stacked in the order of the third substrate 23J, the first substrate 21J, and the second substrate 22J from the bottom up.

[0083] The first substrate 21J has a relatively flat cylindrical shape. Specifically, the first substrate 21J has a through-hole 25Ja that passes through the first substrate 21J from top to bottom. The second substrate 22J and the third substrate 23J also have a relatively flat cylindrical shape.

[0084] First base material 21J and second base material 22J are bonded to each other via adhesive layer 5J. Similarly, second base material 22J and third base material 23J are bonded to each other via adhesive layer 5J. This closes through-hole 25Ja of first base material 21J, thereby forming housing space 25J for electronic component 10 inside housing body 20J.

[0085] In this way, the housing body 20J may be formed by bonding three base materials 21J to 23J with adhesive layer 5J. By stacking three or more base materials 21J to 23J, the housing body 20J can be made thicker in the stacking direction of the base materials 21J to 23J. This can improve, for example, the heat resistance and chemical resistance of the housing body 20J.

[0086] <Eighth Modification> Fig. 17 is a cross-sectional view of a non-contact communication medium according to Modification 8. As shown in Fig. 17, a container 20K of a non-contact communication medium 1K according to Modification 8 has a first base material 21K.

[0087] The first base material 21K may have an annular recess 25Jb surrounding the through-hole 25Ja, for example, on the surface (upper end surface) facing the second base material 22J. The recess 25Jb functions as a space for collecting plating solution or the like that has entered from the outside. This can prevent external liquid or gas from reaching the accommodation space 25J through the joint portion of the accommodation body 20K.

[0088] The recess 25Jb does not necessarily have to be circumferential. For example, the first base material 21K may have a plurality of recesses that are circular in plan view, and these recesses may be arranged circumferentially.

[0089] Furthermore, although an example in which the recess 25Jb is provided in the first base material 21K has been shown here, the recess 25Jb may be provided in the second base material 22 or the third base material 23J.

[0090] <Ninth Variation> Fig. 18 is a cross-sectional view of a non-contact communication medium according to Modification 9. As shown in Fig. 18, a container 20L of a non-contact communication medium 1L according to Modification 9 has a first base material 21L.

[0091] The first base material 21L according to the ninth modification is made up of two concentrically arranged cylindrical members. Specifically, the first base material 21L includes a first cylindrical member 21L1 and a second cylindrical member 21L2 positioned outside the first cylindrical member 21L1. The first cylindrical member 21L1 has a first through-hole 25La that serves as a housing space 25J for the electronic component 10. The second cylindrical member 21L2 has a second through-hole 25Lb.

[0092] The housing body 20L having the first base material 21L has a gap between the first cylindrical member 21L1 and the second cylindrical member 21L2. Similar to the recess 25Jb described above, this gap functions as a space for collecting, for example, a plating solution that has entered from the outside. This prevents external liquid or gas from reaching the housing space 25J through the joint portion of the housing body 20L.

[0093] <Tenth Modification> Fig. 19 is a cross-sectional view of a non-contact communication medium according to Modification 10. As shown in Fig. 19, a container 20M of a non-contact communication medium 1M according to Modification 10 has a second base material 22M and a third base material 23M.

[0094] The second substrate 22M according to the tenth modification has a recess 22Ma on the surface (lower end surface) facing the first substrate 21J. The recess 22Ma communicates with the through-hole 25Ja of the first substrate 21J when the first substrate 21J and the second substrate 22M are joined together.

[0095] Similarly, the third base material 23M according to the tenth modification has a recess 23Ma on the surface (upper end surface) facing the first base material 21J. The recess 23Ma communicates with the through-hole 25Ja of the first base material 21J when the first base material 21J and the third base material 23M are joined together.

[0096] In this way, by providing the recesses 22Ma, 23Ma in the second base material 22M and the third base material 23M, which communicate with the through-hole 25Ja of the first base material 21J, the accommodation space 25J for the electronic component 10 can be made larger. This makes it possible, for example, to make it more difficult for heat to be transferred from the outside to the electronic component 10. Note that the recesses 22Ma, 23Ma do not necessarily have to be formed in the second base material 22M and the third base material 23M. The recesses 22Ma, 23Ma may be formed in only one of the second base material 22M and the third base material 23M.

[0097] In the sixth to tenth modified examples described above, the accommodation space 25J for the electronic component 10 may be filled with, for example, a porous body. The same applies to the recess 25Jb in the eighth modified example and the gap between the first cylindrical member 21L1 and the second cylindrical member 21L2 in the ninth modified example.

[0098] In the sixth to tenth modifications described above, the adhesive layer 5J may have a density difference such that the outside is greater than the inside. That is, the adhesive layer 5J may have a lower porosity at the ends than at the inside.

[0099] In the sixth to tenth modified examples described above, examples have been described in which the housing body has three base materials, but the housing body may also be configured by stacking four or more base materials.

[0100] <Eleventh Modification> Fig. 20 is a perspective view of a non-contact communication medium according to an eleventh modification, and Fig. 21 is a cross-sectional view of the non-contact communication medium according to the eleventh modification.

[0101] 20, a contactless communication medium 1N according to the eleventh modification includes a container 20N. The container 20N includes a first base material 21N, a second base material 22N, and an adhesive layer 5N.

[0102] The first base material 21N has a relatively flat cylindrical shape. Specifically, the first base material 21N has two flat surfaces (upper end surface and lower end surface) that are circular in plan view, and a curved surface (outer peripheral surface) that connects these two flat surfaces.

[0103] More specifically, the first base material 21N includes a first first base material 21N1 and a second first base material 21N2. The first first base material 21N1 and the second first base material 21N2 have a relatively flat cylindrical shape.

[0104] The first first base material 21N1 and the second first base material 21N2 are bonded at a lower end surface 215 of the first first base material 21N1 and an upper end surface 216 of the second first base material 21N2. The bonding between the first first base material 21N1 and the second first base material 21N2 is achieved, for example, when compacts or sintered bodies of the first first base material 21N1 and the second first base material 21N2 are stacked and fired, causing glass components in the grain boundaries to fuse and bond together. The lower end surface 215 of the first first base material 21N1 and the upper end surface 216 of the second first base material 21N2 may also be bonded by, for example, an adhesive layer.

[0105] The first base material 21N has an accommodating hole 25N extending from the outer peripheral surface of the first base material 21N toward the inside of the first base material 21N. The accommodating hole 25N is composed of a first groove portion 217 located in the lower end surface 215 of the first first base material 21N1 and a second groove portion 218 located in the upper end surface 216 of the second first base material 21N2.

[0106] Specifically, the first groove 217 extends, for example, from the outer edge of the first base material 21N1 toward the center. When the first groove 217 is viewed along the direction in which the first groove 217 extends, the first groove 217 has, for example, a semicircular shape. The second groove 218 extends from the outer edge of the second base material 21N2 toward the center. When the second groove 218 is viewed along the direction in which the second groove 218 extends, the second groove 218 has, for example, a semicircular shape. The accommodating hole 25N formed by the first groove 217 and the second groove 218 is a cylindrical space extending from the outer peripheral surface of the first base material 21N toward the interior (center) of the first base material 21N. The electronic component 10 is accommodated in the accommodating hole 25N.

[0107] The second base material 22N has a cylindrical shape. Specifically, the second base material 22N has flat surfaces (both left and right end surfaces in FIG. 21) that are circular in plan view at both ends, and a curved surface (outer peripheral surface) that connects these end surfaces. The planar shape of the second base material 22N is the same circle as the planar shape of the accommodation hole 25N, and has a smaller diameter than the planar shape of the accommodation hole 25N.

[0108] The second base material 22N is inserted into the accommodation hole 25N. When inserted into the accommodation hole 25N, one end surface of the second base material 22N (hereinafter referred to as the first flat surface 225) is flush with, for example, the outer circumferential surface of the first base material 21N. In this manner, the second base material 22N is inserted into the accommodation hole 25N in a nested manner.

[0109] The adhesive layer 5N is located between the inner circumferential surface of the accommodating hole 25N and the outer circumferential surface of the second base material 22N, and bonds the first base material 21N and the second base material 22N together. As a result, the accommodating hole 25N is closed by the second base material 22N and the adhesive layer 5N, and the electronic component 10 accommodated in the accommodating hole 25N is sealed. The interior of the accommodating hole 25N closed by the second base material 22N and the adhesive layer 5N forms an accommodating space, and the electronic component 10 is positioned away from the second base material 22N and the adhesive layer 5N.

[0110] As described above, the non-contact communication medium 1N according to the embodiment has a structure in which the accommodating hole 25N is closed with the second substrate 22N, thereby sealing the electronic component 10 in the accommodating hole 25N. In this non-contact communication medium 1N, the adhesive layer 5N that bonds the first substrate 21N and the second substrate 22N is located between the inner circumferential surface of the accommodating hole 25N and the outer circumferential surface of the second substrate 22N, i.e., within the accommodating hole 25N. In other words, the adhesive layer 5N, which is the bonding portion of the housing body 20N, is hardly exposed to the outside. Therefore, according to the non-contact communication medium 1N according to the embodiment, peeling of the bonding portion of the housing body 20N is unlikely to occur.

[0111] In the non-contact communication medium 1N, the porosity of the adhesive layer 5N at an end relatively close to the outside of the housing 20N may be lower than the porosity of an interior relatively close to the housing hole 25N. This can prevent external liquid or gas from entering through the joint portion of the housing 20N. Also, the electronic component 10 can be appropriately protected from high-temperature environments. The non-contact communication medium 1N may also have a coating layer. That is, the non-contact communication medium 1N may have a coating layer that covers at least the end of the adhesive layer 5N.

[0112] <Twelfth Modification> 22 is a view of the accommodating hole according to the twelfth modification seen along the extending direction of the accommodating hole. Note that the configuration of the non-contact communication medium 1P according to the twelfth modification, other than the accommodating hole 25P, is the same as the configuration of the non-contact communication medium 1N according to the eleventh modification.

[0113] 22, the accommodating hole 25P of the non-contact communication medium 1P according to the twelfth modification may have a shape in which the first groove portion 217 of the first first base material 21P1 and the second groove portion 218 of the second first base material 21P2 are offset in the circumferential direction of the first base material 21P. With this configuration, the bonding area of ​​the adhesive layer 5P increases, and the first base material 21P and the second base material 22P can be bonded more firmly. Therefore, the non-contact communication medium 1P according to the twelfth modification can have improved reliability.

[0114] The non-contact communication medium 1P may have a covering layer, that is, the non-contact communication medium 1P may have a covering layer that covers at least the end of the adhesive layer 5P.

[0115] <13th Modification> 23 is a cross-sectional view of a non-contact communication medium according to Modification 13. The configuration of the non-contact communication medium 1Q according to Modification 13, other than the accommodating hole 25Q, is the same as the configuration of the non-contact communication medium 1N according to Modification 11.

[0116] As shown in FIG. 23, a non-contact communication medium 1Q according to the thirteenth modification has a first base material 21Q, a second base material 22Q, and an adhesive layer (not shown here).

[0117] The accommodating hole 25Q of the non-contact communication medium 1Q according to the thirteenth modification may have a step 255 at the bottom in the extension direction. For example, the accommodating hole 25Q having the step 255 can be obtained by forming the first groove portion 217 of the first first base material 21Q1 longer than the second groove portion 218 of the second first base material 21Q2. The same applies when the second groove portion 218 is formed longer than the first groove portion 217. Furthermore, the first first base material 21Q1 and the second first base material 21Q2 may be joined in a state where they are offset along the extension direction of the first groove portion 217 and the second groove portion 218. In this case as well, the accommodating hole 25Q having the step 255 can be obtained.

[0118] In this way, by providing step 255 at the bottom of accommodating hole 25Q, electronic component 10 is less likely to come into surface contact with first base material 21Q, and the contact area between electronic component 10 and first base material 21Q can be reduced. This makes it difficult for heat to be transferred to electronic component 10, thereby improving the reliability of non-contact communication medium 1Q.

[0119] The non-contact communication medium 1Q may have a covering layer, that is, the non-contact communication medium 1Q may have a covering layer that covers at least the end of the adhesive layer (not shown here).

[0120] <14th Modification> Fig. 24 is a cross-sectional view of a non-contact communication medium according to the fourteenth modification. Fig. 25 is a plan view of a first substrate according to the fourteenth modification. The cross-sectional view shown in Fig. 24 is a cross-sectional view taken along the arrow XXIV-XXIV line shown in Fig. 25. The configuration of the non-contact communication medium 1R according to the fourteenth modification, other than the first substrate 21R, is the same as the configuration of the non-contact communication medium 1 according to the embodiment.

[0121] 24, a container 20R included in a non-contact communication medium 1R according to the fourteenth modification includes a first base material 21R, a second base material 22R, and an adhesive layer 5R. The first base material 21R and the second base material 22R are bonded to each other via the adhesive layer 5R.

[0122] An accommodating recess 25a is located on the flat surface 21a (upper end surface) of the first base material 21R. The accommodating recess 25a opens in the center of the flat surface 21a. The first base material 21R and the second base material 22R are joined together via an adhesive layer 5R, thereby closing the flat surface 21a of the first base material 21R. This forms a sealed accommodating space 25R. The electronic component 10 is sealed in the accommodating space 25R.

[0123] A plurality of protrusions 26 are further positioned on the flat surface 21a of the first base material 21R. As shown in FIG. 25, the plurality of protrusions 26 are arranged, for example, in a circumferential manner so as to surround the accommodating recess 25a. Here, an example is shown in which four protrusions 26 are positioned on the flat surface 21a of the first base material 21R, but the number of protrusions 26 may be five or more. The number of protrusions 26 may also be three or less. The plurality of protrusions 26 does not necessarily have to be arranged in a circumferential manner.

[0124] Moreover, although an example has been shown here in which the multiple protrusions 26 are located more inward of the end 5a of the adhesive layer 5R in the housing body 20R, the multiple protrusions 26 may also be located at the end 5a of the adhesive layer 5R. Moreover, the multiple protrusions 26 may also be located on the flat surface 22a of the second base material 22R.

[0125] As described above, the non-contact communication medium 1R according to the fourteenth modification has a plurality of protrusions 26. In this case, the protrusions 26 can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1R via the adhesive layer 5R. Therefore, the non-contact communication medium 1R according to the fourteenth modification can enhance the heat insulating effect. In addition, the propagation of cracks can be suppressed.

[0126] The non-contact communication medium 1R may have a covering layer, that is, the non-contact communication medium 1R may have a covering layer that covers at least the end portion of the adhesive layer 5R.

[0127] <15th Modification> Fig. 26 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 15. As shown in Fig. 26, a container 20S included in a non-contact communication medium 1S according to Modification 15 has a first base material 21S, a second base material 22S, and an adhesive layer 5S.

[0128] The convex portion 26S of the first base material 21S has a curved convex shape in a cross-sectional view. The second base material 22S has a concave portion 27S at a position on the flat surface 22a opposite the convex portion 26S.

[0129] 26, specifically, in a cross-sectional view of the housing body 20S cut along a plane perpendicular to the flat surface 21a of the first base material 21S and the flat surface 22a of the second base material 22S and passing through the centers of the flat surfaces 21a and 22a, the width W1 of the recess 27S is smaller than the width W2 of the protrusion 26S. In this case, the protrusion 26S contacts the open end 27S1 of the recess 27S to close the recess 27S. The internal space 27S2 of the recess 27S closed by the protrusion 26S may have a cavity that is not filled with adhesive.

[0130] In this way, by making the width of the recess 27S smaller than the width of the protrusion 26S, an internal space 27S2 can be formed between the recess 27S and the protrusion 26S. In this case, the internal space 27S2 acts as a heat insulating layer, which can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1S via the adhesive layer 5S. Therefore, according to the non-contact communication medium 1S of the fifteenth modification, the heat insulating effect can be further improved. In addition, the progression of cracks can be further suppressed.

[0131] Furthermore, according to the non-contact communication medium 1S of the 15th variant, the position of the recess 27S corresponds to the position of the protrusion 26S, which makes it easier to align the first substrate 21S and the second substrate 22S during the manufacturing process of the non-contact communication medium 1S.

[0132] The non-contact communication medium 1S may have a covering layer, that is, the non-contact communication medium 1S may have a covering layer that covers at least the end portion of the adhesive layer 5S.

[0133] <16th Modification> Fig. 27 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 16. As shown in Fig. 27, a container 20T included in a non-contact communication medium 1T according to Modification 16 has a first base material 21T, a second base material 22T, and an adhesive layer 5T.

[0134] The protrusions 26T of the first substrate 21T are rectangular and have flat tip surfaces. On the other hand, the inner surfaces of the recesses 27T of the second substrate 22T are curved. The width W1 of the recesses 27T of the second substrate 22T is greater than the width W2 of the protrusions 26T.

[0135] In this case, the protrusion 26T contacts the curved inner surface of the recess 27T, closing the recess 27T. The internal space 27T2 of the recess 27T closed by the protrusion 26T may have a cavity that is not filled with adhesive. In this case, the internal space 27T2 acts as a heat insulating layer, thereby inhibiting the transfer of heat from the outside to the inside of the non-contact communication medium 1T via the adhesive layer 5T. Therefore, the non-contact communication medium 1T according to the sixteenth modification can further enhance the heat insulating effect. In addition, the progression of cracks can be further suppressed.

[0136] Furthermore, according to the non-contact communication medium 1T of the 16th variant, the position of the recess 27T corresponds to the position of the protrusion 26T, which makes it easier to align the first substrate 21T and the second substrate 22T during the manufacturing process of the non-contact communication medium 1T.

[0137] The non-contact communication medium 1T may have a covering layer, that is, the non-contact communication medium 1T may have a covering layer that covers at least the end portion of the adhesive layer 5T.

[0138] <17th Modification> Fig. 28 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 17. As shown in Fig. 28, a container 20U included in a non-contact communication medium 1U according to Modification 17 has a first base material 21U, a second base material 22U, and an adhesive layer 5U.

[0139] The protrusion 26U of the first base material 21U and the recess 27U of the second base material 22U have a curved concave shape in a cross-sectional view. The width W1 of the recess 27U is greater than the width W2 of the protrusion 26U. In this case, the protrusion 26U comes into contact with the recess 27U.

[0140] As described above, an internal space (cavity) does not necessarily need to be located between the first substrate 21U and the second substrate 22U. Even in such a case, the convex portion 26U can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1U via the adhesive layer 5U. Therefore, the non-contact communication medium 1U according to the seventeenth modification can enhance the heat insulating effect. Furthermore, the progression of cracks can be suppressed. Furthermore, the non-contact communication medium 1U according to the seventeenth modification can facilitate the alignment of the first substrate 21U and the second substrate 22U in the manufacturing process of the non-contact communication medium 1U.

[0141] The non-contact communication medium 1U may have a covering layer, that is, the non-contact communication medium 1U may have a covering layer that covers at least the end of the adhesive layer 5U.

[0142] <18th Variation> Fig. 29 is an enlarged cross-sectional view of a non-contact communication medium according to Modification 18. As shown in Fig. 29, a container 20V included in a non-contact communication medium 1V according to Modification 18 has a first base material 21V, a second base material 22V, and an adhesive layer 5V.

[0143] The protrusions 26V of the first substrate 21V and the recesses 27V of the second substrate 22V have curved concave shapes in a cross-sectional view. The width of the recesses 27V of the second substrate 22V is the same as the width of the protrusions 26V of the first substrate 21V. The depth of the recesses 27V is the same as the protrusion height of the protrusions 26V.

[0144] In the non-contact communication medium 1V according to the eighteenth modification, the convex portion 26V is not in contact with the concave portion 27V, and an adhesive layer 5V is interposed between the convex portion 26V and the concave portion 27V. Thus, the convex portion 26V does not necessarily need to be in contact with the second base material 22V. Even in such a case, the convex portion 26V can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1V via the adhesive layer 5V. Therefore, the non-contact communication medium 1V according to the eighteenth modification can enhance the heat insulating effect. Furthermore, the progression of cracks can be suppressed. Furthermore, the non-contact communication medium 1V according to the eighteenth modification can facilitate the alignment of the first base material 21V and the second base material 22V during the manufacturing process of the non-contact communication medium 1V.

[0145] The non-contact communication medium 1V may have a covering layer, that is, the non-contact communication medium 1V may have a covering layer that covers at least the end portion of the adhesive layer 5V.

[0146] <19th Variation> Fig. 30 is a cross-sectional view of a non-contact communication medium according to the 19th modification. Fig. 31 is a plan view of a first substrate according to the 19th modification. The cross-sectional view shown in Fig. 31 is a cross-sectional view taken along the arrow XXXI-XXXI line shown in Fig. 30. The configuration of the non-contact communication medium 1W according to the 19th modification, other than the first substrate 21W, is the same as the configuration of the non-contact communication medium 1 according to the embodiment.

[0147] 30, a container 20W included in a non-contact communication medium 1W according to the 19th modification includes a first base material 21W, a second base material 22W, and an adhesive layer 5W. The first base material 21W and the second base material 22W are bonded to each other via the adhesive layer 5W.

[0148] An accommodating recess 25a is located on the flat surface 21a (upper end surface) of the first base material 21W. The accommodating recess 25a opens in the center of the flat surface 21a. The first base material 21W and the second base material 22W are joined together via an adhesive layer 5W, thereby closing the flat surface 21a of the first base material 21W. This forms a sealed accommodating space 25W. The electronic component 10 is sealed in this accommodating space 25W.

[0149] A plurality of recesses 28 are further positioned on the flat surface 21a of the first base material 21W. As shown in Fig. 31, the plurality of recesses 28 are arranged, for example, circumferentially so as to surround the accommodation recess 25a. Here, an example is shown in which four recesses 28 are positioned on the flat surface 21a of the first base material 21W, but the number of recesses 28 may be five or more. The number of recesses 28 may also be three or less.

[0150] Furthermore, the plurality of recesses 28 do not necessarily need to be provided circumferentially. Although an example has been shown here in which the plurality of recesses 28 are located inside the housing body 20W relative to the end 5a of the adhesive layer 5W, the plurality of recesses 28 may also be located at the end 5a of the adhesive layer 5W. The plurality of recesses 28 may also be located on the flat surface 22a of the second base material 22W.

[0151] As described above, the non-contact communication medium 1W according to the 19th modification has a plurality of recesses 28. In this case, the space within the recesses 28 acts as a heat insulating layer, thereby inhibiting the transfer of heat from the outside to the inside of the non-contact communication medium 1W. Therefore, the non-contact communication medium 1W according to the 19th modification can enhance the heat insulating effect. Furthermore, the gaps in the recesses 28 can suppress the progression of cracks.

[0152] Although an example in which the inside of the recess 28 is hollow has been shown here, the inside of the recess 28 may be filled with adhesive. Even in such a case, the recess 28 can inhibit the transfer of heat from the outside to the inside of the non-contact communication medium 1W.

[0153] The non-contact communication medium 1W may have a covering layer, that is, the non-contact communication medium 1W may have a covering layer that covers at least the end of the adhesive layer 5W.

[0154] Although an example in which multiple recesses 28 are arranged circumferentially has been shown here, first base material 21W may have an annular recess 28 surrounding accommodating recess 25a. By having an annular recess 28, it is possible to enhance the heat insulating effect and to suppress the progression of cracks. Furthermore, first base material 21W may have multiple such annular recesses 28. In such a case, it is possible to further enhance the heat insulating effect and to further suppress the progression of cracks.

[0155] <Other variations> The end of the adhesive layer may be covered with, for example, water glass, metal, or the like. That is, the covering layer may be water glass, metal, or the like. In this case, the covering layer may have, for example, a second covering layer made of at least one of water glass and metal on the outside of a first covering layer made of at least one of an adhesive and a sealant. This can further prevent external liquids and gases from penetrating through the joints of the container.

[0156] The ceramics constituting the first and second substrates are not limited to cordierite. For example, the ceramics constituting the first and second substrates may be Al2O3 (alumina), Si3N4 (silicon nitride), SiC (silicon carbide), or Al2TiO5 (aluminum titanate). The ceramics constituting the first and second substrates may also be crystallized glass such as Li2O-Al2O3-SiO2.

[0157] The housing preferably has a lightness index L* (the value of the dimension L, which represents lightness in the Lab color space) of 50 or more. This makes dirt on the housing more noticeable, making it easier to determine when it's time to replace it. Furthermore, compared to a housing with a lightness index L* of less than 50 (i.e., a dark color), heat is less likely to build up, making it harder for heat to be transferred to electronic components. The lightness of the housing can be adjusted, for example, by using pigments (see, for example, Japanese Patent Nos. 5762522 and 5744045).

[0158] The first and second substrates may also be different colors. This improves top-to-bottom visibility, facilitating the work of attaching the non-contact communication medium to the component to be monitored. For example, when a worker wants to place an electronic component closer to the component to be monitored, the worker can easily identify the first substrate, of the first and second substrates, that houses the electronic component, and place the first substrate closer to the component to be monitored.

[0159] When the first and second substrates have different colors, the color of the first substrate housing the electronic components may be brighter than the color of the second substrate. This improves top and bottom visibility while reducing the transfer of heat to the electronic components. Additionally, it is preferable that the electronic components are located far away from components with a low brightness index. This reduces the transfer of heat to the electronic components.

[0160] The electronic component is not limited to an RFID tag, but may be any other electronic component that performs contactless communication. For example, the electronic component may be a sensor with contactless communication capabilities. The sensor may also be a sensor, such as a temperature sensor, that measures the processing environment of the component to be monitored.

[0161] The component to which the non-contact communication medium is attached is not limited to a component to be plated. For example, the non-contact communication medium may be attached to a component such as a cast piece produced in a foundry of a metal material.

[0162] Furthermore, the non-contact communication medium according to the present disclosure may be used for managing items in the vulcanization process in the manufacturing process of rubber products.

[0163] The vulcanization process is a process in which sulfur or peroxides, etc., blended into the rubber-based raw materials are chemically reacted over time and temperature to crosslink the molecules in order to increase the elastic limit of the raw materials. Note that pressure may also be applied during the vulcanization process. The temperature during the vulcanization process is, for example, 100°C to 200°C. The pressure during the vulcanization process is, for example, 0.5 MPa to 2 MPa.

[0164] As an example, the contactless communication medium according to the present disclosure may be attached to a used tire that is to be recycled as a retread tire. A retread tire is obtained by scraping the surface of a used tire, attaching a new rubber sheet onto the scraped surface, and then vulcanizing the tire.

[0165] Known vulcanization processes for retread tires include the remolding method and the precure method. The remolding method involves laminating an unvulcanized rubber sheet to the surface of a used tire, and then vulcanizing the tire at high temperature and high pressure using a mold. The precure method involves laminating a vulcanized rubber sheet to the surface of a used tire, and then vulcanizing the tire at low temperature and low pressure in a vulcanizer. The non-contact communication medium disclosed herein is applicable to both the remolding method and the precure method. In particular, the precure method is intended for small-lot, high-mix production, and therefore involves a relatively large number of manual inspection processes. In contrast, managing goods using the non-contact communication medium disclosed herein can reduce labor costs and improve the production efficiency of retread tires.

[0166] The non-contact communication medium according to the present disclosure is preferably attached to a location other than the tread portion where the rubber sheet is attached. For example, the non-contact communication medium according to the present disclosure may be disposed inside a used tire.

[0167] Additionally, a contactless communication medium according to the present disclosure may be attached to a medical instrument (eg, forceps, needle holder, etc.).

[0168] In the medical field, issues include how to prevent medical instruments from remaining inside the body, how to streamline the management of medical instruments, how to prevent the mix-up of medical instruments during surgery, etc. By attaching the contactless communication medium according to the present disclosure to medical instruments, it becomes possible to manage each individual medical instrument using an RFID tag, which can contribute to solving the above issues.

[0169] The non-contact communication medium according to the present disclosure may also be used for marking to identify lesions within the body.

[0170] A conventional marking method is the biomarker staining method, which uses dye to stain lesions found in the body during an examination. However, the biomarker staining method stains a wide area and the dye diffuses over time, making it difficult to precisely identify the lesion. Another proposed marking method involves placing metal needles or clips at the lesion site. However, this method has issues, such as the need to prepare a CT scan device during surgery and the risk of excessive radiation exposure.

[0171] When the non-contact communication medium according to the present disclosure is used for marking, the non-contact communication medium according to the present disclosure is first placed at the lesion site before surgery. Then, during surgery, a sensor antenna is used to measure, for example, the distance between the RFID tag and the sensor antenna, thereby estimating the position of the RFID, i.e., the position of the lesion site.

[0172] Thus, when the contactless communication medium according to the present disclosure is used for marking, it is desirable that the contactless communication medium according to the present disclosure be as small as possible because it is placed inside the body. In this regard, the ceramic constituting the housing of the present disclosure has a higher dielectric constant than, for example, resin, and is less likely to interfere with RFID communication. Therefore, the contactless communication medium according to the present disclosure can be made smaller than, for example, a contactless communication medium having a housing made of resin.

[0173] The adhesive layer may contain a larger amount of chemical-resistant resin at an end portion relatively closer to the exterior of the housing than at an interior portion relatively closer to the housing space.

[0174] The chemical-resistant resin is, for example, a resin that has higher chemical resistance than the glass component contained in the adhesive 51. Examples of the chemical-resistant resin include PEEK (polyether ether ketone), PI (polyimide), and PBI (polybenzimidazole).

[0175] In this way, by including a large amount of chemical-resistant resin at the end of the adhesive layer, it is possible to provide a non-contact communication medium suitable for use in acidic or alkaline liquids.

[0176] The peripheral edges of the upper and lower end faces of the housing may be chamfered. Specifically, the housing may have a chamfered or rounded surface between the upper end face and the outer periphery. Similarly, the housing may have a chamfered or rounded surface between the lower end face and the outer periphery. This configuration can prevent the housing from chipping.

[0177] In the above-described embodiment and modified example, an example in which the container has a cylindrical shape has been described, but the shape of the container is not limited to a cylindrical shape. For example, the container may have a spherical shape. For example, a spherical container can be obtained by bonding a hemispherical first base material and a hemispherical second base material with an adhesive layer. In this way, by making the container a spherical shape without corners, damage to the container 20, such as chipping or cracking, can be further suppressed.

[0178] As described above, the non-contact communication medium according to the embodiment (for example, non-contact communication media 1, 1A to 1E, 1H, 1J to 1N, 1P to 1W) includes a housing (for example, housings 20, 20E, 20H, 20J, 20K to 20N, 20P to 20W) and an electronic component (for example, electronic component 10). The housing includes an internal storage space (for example, storage spaces 25, 25H, 25J, 25N, 25R, 25W). The electronic component is located in the storage space and performs non-contact communication. The housing has at least two ceramic substrates (for example, first substrates 21, 21J-21N, 21P-21W and second substrates 22, 22J, 22M, 22N, 22P-22W) and an adhesive layer (for example, adhesive layers 5, 5E, 5H, 5J, 5N, 5P, 5R-5W) located between the two substrates and bonding the two substrates together. A portion of the adhesive layer faces the housing space, and the porosity of an end portion (for example, end portions 5a, 5Ha) relatively close to the exterior of the housing is lower than the porosity of an interior portion (for example, interior portions 5b, 5Hb) relatively close to the housing space.

[0179] Therefore, the contactless communication medium according to the embodiment can prevent external liquid or gas from entering through the joint portion of the container.

[0180] The non-contact communication medium according to the embodiment may have a coating layer (e.g., coating layers 30A to 30D) positioned outside the space between the two substrates and covering the end of the adhesive layer. In this case, the porosity of the coating layer may be equal to or less than the porosity of the end of the adhesive layer. This can further prevent the intrusion of liquids and the like from the outside.

[0181] The covering layer (for example, covering layer 30A) may cover the end of the adhesive layer and a part of the exposed surface of the outer surface of the housing where the end is exposed (for example, the outer peripheral surfaces 21b and 22b of the first base material 21 and the second base material). This can further prevent the intrusion of liquids and the like from the outside.

[0182] The coating layer (for example, coating layer 30B) may extend over the entire exposed surface, which can further prevent the intrusion of liquids and the like from the outside.

[0183] The coating layer (for example, coating layer 30C) may extend over at least a portion of other surfaces (for example, bottom end surface 21c of first base material 21 and top end surface 22c of second base material 22) that are continuous with the exposed surface of the outer surface of the housing body. This can further prevent the intrusion of liquids and the like from the outside.

[0184] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0185] 1: Contactless communication medium 5: Adhesive layer 5a: End 5b: Internal 10: Electronic components 20: Containment Unit 21: 1st base material 22:Second base material 25: Containment space 30A~30D: Covering layer 51: Adhesive 52: Sealer 511 :Void

Claims

1. a housing having an internal housing space; an electronic component that is located in the accommodation space and performs contactless communication; and The container is a first cylindrical body made of ceramics and having a first opening, a second opening, and the storage space communicating with the first opening and the second opening; a first lid made of ceramics that closes the first opening; a second lid made of ceramics that closes the second opening; and The non-contact communication medium, wherein each of the first cylindrical body, the first lid body, and the second lid body is made of ceramics that does not have wiring inside.

2. The non-contact communication medium according to claim 1 , wherein the first cylindrical body has a space between an inner wall surface and an outer wall surface.

3. the container further includes a second cylindrical body surrounding the first cylindrical body and having a third opening and a fourth opening; the first cover closes the third opening, The second cover closes the fourth opening. The contactless communication medium according to claim 1 .

4. The non-contact communication medium according to claim 3 , wherein the second cylindrical body is made of ceramics.

5. The non-contact communication medium according to claim 1 , wherein at least one of the first lid and the second lid has a recess communicating with the accommodation space.

6. The contactless communication medium according to claim 5 , wherein an edge of the recess is positioned outside an edge of the accommodation space.

7. an adhesive layer is disposed between the first cylindrical body and the first and second lids, and the adhesive layer bonds the first and second lids to the first cylindrical body; A non-contact communication medium described in any one of claims 1 to 6, wherein a portion of the adhesive layer faces the storage space, and the porosity at the end relatively close to the outside of the storage body is lower than the porosity at the inside relatively close to the storage space.

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