Thin-film solid oxide fuel cell package with stack structure

Abstract

To provide a thin film type solid oxide fuel cell package having a stack structure.SOLUTION: A stack structure of a thin film type solid oxide fuel cell package includes: a laminate of a plurality of unit cells each having a membrane structure in which an electrolytic film and electrodes are formed on a silicon substrate by a Free Standing method; an oxygen supply line for supplying oxygen to an oxygen electrode of the unit cell; a fuel supply line for supplying a gaseous or liquid fuel to a fuel electrode of the unit cell; and a ceramic binder for sealing the inside of the laminate such that oxygen supplied through the oxygen supply line and the fuel supplied through the fuel supply line do not contact each other in the laminate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a thin film solid oxide fuel cell package having a stack structure. [Background technology]

[0002] A solid oxide fuel cell (SOFC) is a type of highly efficient energy conversion device that converts chemical energy into electrical energy, and is a fuel cell that uses a solid oxide membrane as an electrolyte.

[0003] The electrolyte used in the electrolyte membrane of SOFCs is mainly YSZ (Yttria Stabilized Zirconia), and thin-film SOFCs manufactured through a Micro-electro-mechanical System (MEMS) process have a membrane structure that is etched after forming the electrolyte membrane and electrodes on a silicon substrate using a free-standing method (see, for example, Patent Document 1).

[0004] Here, for an effective microstructure, the electrolyte can be reduced in thickness to reduce resistance and thereby offset ion conduction at low temperatures, and the electrodes can be nanostructured to increase the specific surface area, thereby offsetting low activity at low temperatures by increasing the density of reaction sites.

[0005] In order for a stack of unit cells housed in a specified package to function as a fuel cell, the inside of the stack must be sealed so that the fuel is separated from oxygen (air).

[0006] In the case of polymer fuel cells, it is possible to seal the fuel flow path using bolts and gaskets, but in the case of small and lightweight thin-film solid oxide fuel cells, it is not easy to seal the inside of the stack due to the limitations of the membrane structure in which the electrolyte film and electrodes are formed on a silicon substrate using a free-standing method. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 4914831 Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made in view of the above, and an object of the present invention is to provide a thin film solid oxide fuel cell package having a stack structure.

[0009] It is yet another object of the present invention to provide a solid oxide fuel cell including a thin film solid oxide fuel cell package having a stack structure.

[0010] The problems to be solved by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by a person having ordinary skill in the art from the following description. [Means for solving the problem]

[0011] In at least one embodiment of the present invention, a stack of a plurality of unit cells each having a membrane structure in which an electrolyte membrane and an electrode are formed on a silicon substrate by a free-standing method, an oxygen supply line for supplying oxygen to the oxygen electrode of the unit cell, and a fuel supply line for supplying fuel in a gaseous or liquid state to the fuel electrode of the unit cell, and a ceramic binder for sealing the inside of the stack so that oxygen supplied through the oxygen supply line and fuel supplied through the fuel supply line do not come into contact with each other within the stack.

[0012] In at least one embodiment of the present invention, each unit cell constituting the stack of the plurality of unit cells includes a silicon substrate, an electrolyte membrane formed on a first surface of the silicon substrate, a first electrode formed on at least a portion of the first surface of the electrolyte membrane, a recess portion formed on a second surface of the silicon substrate opposite to the first surface such that a portion of the second surface of the electrolyte membrane opposite to the first surface, the second surface, facing the first electrode, is exposed, and a second electrode formed on at least the exposed second surface of the electrolyte membrane, wherein a multilayer structure formed by the first electrode, the electrolyte membrane, and the second electrode includes a plurality of trench-shaped sub-cells having a predetermined depth, and the silicon substrate includes a porous portion formed at least near an edge of the recess portion.

[0013] In at least one embodiment of the present invention, each unit cell constituting the stack of the plurality of unit cells includes a silicon substrate, an electrolyte membrane formed on a first surface of the silicon substrate, a first electrode formed on at least a portion of the first surface of the electrolyte membrane, a recess formed on a second surface of the silicon substrate opposite the first surface such that a portion of the second surface of the electrolyte membrane opposite the first surface is exposed, and a second electrode formed on at least the exposed second surface of the electrolyte membrane, wherein a multilayer structure formed by the first electrode, the electrolyte membrane, and the second electrode includes a plurality of trench-shaped sub-cells having a predetermined depth, and the silicon substrate includes a porous silicon substrate.

[0014] In at least one embodiment of the present invention, there is provided a solid oxide fuel cell comprising a stack structure of the above thin film solid oxide fuel cell unit cells.

[0015] In at least one embodiment of the present invention, there is provided a solid oxide fuel cell package comprising: a stack structure of thin film solid oxide fuel cell unit cells; and a housing for accommodating the stack structure of thin film solid oxide fuel cell unit cells.

[0016] In at least one embodiment of the present invention, the fuel cell further comprises a heat insulating structure disposed between the stack structure of thin film solid oxide fuel cell unit cells and the housing, the heat insulating structure including an embossing formed on the inner surface of the housing.

[0017] In at least one embodiment of the present invention, the embossing has at least one of a dome-shaped tip, a cone-shaped tip, a pyramid-shaped tip, a multi-projection-shaped tip, and a tapered tip.

[0018] In at least one embodiment of the present invention, the thermal insulation structure further includes a first thermal insulation layer and a second thermal insulation layer disposed between the embossing and the stack structure of the thin film solid oxide fuel cell unit cells.

[0019] In at least one embodiment of the present invention, the first thermal insulation layer comprises aluminum; The second thermal insulating layer includes sapphire.

[0020] In at least one embodiment of the present invention, each unit cell constituting the stack of the plurality of unit cells includes a silicon substrate, an electrolyte membrane formed on a first surface of the silicon substrate, a first electrode formed on at least a portion of the first surface of the electrolyte membrane, a recess portion formed on a second surface of the silicon substrate opposite the first surface such that a portion of the second surface of the electrolyte membrane opposite the first surface, the second surface, facing the first electrode, is exposed, and a second electrode formed on at least the exposed second surface of the electrolyte membrane, wherein a multilayer structure formed by the first electrode, the electrolyte membrane, and the second electrode includes a plurality of trench-shaped sub-cells having a predetermined depth, and the silicon substrate includes a porous portion formed at least near an edge of the recess portion.

[0021] In at least one embodiment of the present invention, each unit cell constituting the unit cell stack includes a silicon substrate, an electrolyte membrane formed on a first surface of the silicon substrate, a first electrode formed on at least a portion of the first surface of the electrolyte membrane, a recess formed such that a portion of the second surface of the electrolyte membrane opposite the first surface is exposed from a second surface of the silicon substrate opposite the first surface, and a second electrode formed on at least the exposed second surface of the electrolyte membrane, wherein a multilayer structure formed of the first electrode, the electrolyte membrane, and the second electrode includes a plurality of trench-shaped subcells having a predetermined depth, and the silicon substrate includes a porous silicon substrate.

[0022] In at least one embodiment of the present invention, a solid oxide fuel cell is provided, comprising the thin film solid oxide fuel cell package.

[0023] Although the embodiments in this specification are described independently of each other, they may be combined with each other, and the combined embodiments are also included within the scope of the present invention.

[0024] The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, additional aspects, embodiments, and features will become apparent by reference to the drawings and detailed description. [Effects of the Invention]

[0025] At least one embodiment of the present invention provides an advantageous effect of providing a thin film solid oxide fuel cell package having a stack structure.

[0026] Furthermore, at least one embodiment of the present invention provides a solid oxide fuel cell including a thin film solid oxide fuel cell package having a stack structure.

[0027] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a conceptual diagram of a stack structure in accordance with at least one embodiment of the present invention. [Figure 2] 1 is a perspective view of a fuel cell package having a stack structure in accordance with at least one embodiment of the present invention. [Figure 3] 1 is a cross-sectional side view of a fuel cell package having a stack structure in accordance with at least one embodiment of the present invention. [Figure 4] 1 is a conceptual diagram of a fuel cell package insulation structure having a stack structure according to at least one embodiment of the present invention. [Figure 5] FIG. 1 is a cross-sectional side view of a unit cell in accordance with at least one embodiment of the present invention. [Figures 6A-6G] 1A-1C are schematic diagrams illustrating a manufacturing process for a unit cell in accordance with at least one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A thin film solid oxide fuel cell having a stress relaxation structure using porous silicon and a method for manufacturing the same according to at least one embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

[0030] Figure 1 is a conceptual diagram of a stack structure 100 of thin film solid oxide fuel cell unit cells according to at least one embodiment of the present invention. Figure 2 is a perspective view of a fuel cell package having the stack structure 100 according to at least one embodiment of the present invention.

[0031] As shown in FIGS. 1 and 2, a stack structure 100 according to at least one embodiment of the present invention includes a stack of a plurality of unit cells 110, each having a membrane structure in which an electrolyte membrane and an electrode are formed on a silicon substrate using a free-standing method; an oxygen supply line 120 for supplying oxygen to the oxygen electrode of each unit cell 110; a fuel supply line 130 for supplying fuel in a gaseous or liquid state to the anode of each unit cell 110; and a ceramic binder 140 for sealing the inside of the stack so that the oxygen supplied through the oxygen supply line 120 and the fuel supplied through the fuel supply line 130 do not come into contact with each other within the stack.

[0032] In the examples shown in Figures 1 and 2, lines for supplying fuel and oxygen (air) are shown in a zigzag pattern along each layer, but this is for convenience of explanation, and the lines for supplying fuel and oxygen may be formed as multiple lines parallel to each layer.

[0033] Thin-film solid oxide fuel cells manufactured through the MEMS process have a rear-etched membrane structure in which an electrolyte membrane and electrodes are formed on a silicon substrate using a free-standing method.

[0034] The electrolyte obtained with such a microstructure can offset the decrease in ionic conductivity at low temperatures by reducing its thickness and reducing its resistance, and the nanostructure of the electrode can create a large specific surface area, thereby offsetting the low activity at low temperatures by increasing the density of reaction sites.

[0035] In order for a fuel cell with a stack structure of unit cells housed in a specified package to function as a fuel cell, the inside of the stack must be sealed to prevent the fuel from coming into contact with oxygen. In the case of polymer fuel cells, the fuel flow path can be sealed using bolts and gaskets, but in the case of small and lightweight thin-film solid oxide fuel cells, the limitations of the membrane structure make it impossible to apply physical force such as bolts and gaskets to seal the inside of the stack.

[0036] Therefore, in at least one embodiment of the present invention, as shown in FIGS. 1 and 2, the layers of the laminate are bonded and sealed using a ceramic binder 140 without the use of fasteners such as bolts or sealing members such as gaskets.

[0037] The ceramic binder has excellent heat resistance, water resistance, and adhesiveness, and for example, a general one-component ceramic binder can be used.

[0038] Fig. 3 is a side cross-sectional view of a fuel cell package having a stack structure 100 according to at least one embodiment of the present invention. Fig. 4 is a conceptual diagram of a heat insulating structure of a fuel cell package having a stack structure 100 according to at least one embodiment of the present invention.

[0039] As shown in Figures 3 and 4, a fuel cell package having a thermal insulation structure according to at least one embodiment of the present invention comprises a housing 200, a unit cell stack 100 housed within the housing 200, and a thermal insulation structure disposed between the housing 200 and the unit cell stack 100.

[0040] This is a MEMS (Micro-electro-mechanical System) based thin film solid oxide fuel cell. The unit cell stack 100, which is made up of a stack of multiple unit cells, has an optimum operating temperature of approximately 500°C, and for this purpose, a separate thin film heater (not shown) is provided.

[0041] For the stable operation of such a solid oxide fuel cell, an insulating structure is required to stably maintain the internal temperature at an appropriate operating temperature and to stabilize the surface temperature of the package by reducing heat conduction to the outside.

[0042] In at least one embodiment of the present invention, the thermal insulation structure disposed between the housing 200 and the unit cell stack 100 includes an embossing 201 formed on the inner surface of the housing 200 .

[0043] The embossings 201 formed on the inner surface of the housing 200 can minimize heat transmission from the unit cell stack 100 to the outside through the housing 200 by insulating the space between the protrusions and minimizing the cross-sectional contact area with the unit cell stack 100.

[0044] Although FIG. 3 shows the tip of the embossing 201 as having a circular dome shape as an example, in at least one embodiment of the present invention, the tip of the embossing 201 may be formed in at least one of a dome shape, a cone shape, a pyramid shape, a multi-projection shape, and a tapered shape.

[0045] In at least one embodiment of the present invention, the thermal insulation structure disposed between the housing 200 and the unit cell stack 100 may further include a first thermal insulation layer 202 and a second thermal insulation layer 203 disposed between the embossing 201 and the unit cell stack 100.

[0046] For more reliable and efficient thermal insulation, in at least one embodiment of the present invention, first insulating layer 202 can include aluminum and second insulating layer 203 can include sapphire.

[0047] Each unit cell constituting the unit cell stack 100 has a structure including an electrolyte, an anode, and a separator, and an air passage and a fuel passage for passing air and fuel are formed between each unit cell. However, since various known techniques can be applied to such a structure, detailed description thereof will be omitted in this specification.

[0048] FIG. 5 is a cross-sectional side view of a unit cell 500 in accordance with at least one embodiment of the present invention.

[0049] In at least one embodiment of the present invention, the unit cell 500 has a nanomembrane structure in which an electrolyte membrane and electrodes are formed on a silicon substrate in a free-standing manner, and may include a plurality of sub-cells (not shown) formed in a trench shape.

[0050] As shown in FIG. 1, a unit cell 500 according to at least one embodiment of the present invention includes a porous portion 560 formed in a silicon substrate 510 at least near the edge of a recessed portion 540 .

[0051] Although FIG. 5 shows an example in which the porous portion 560 is formed near the edge of the recessed portion 540, the entire silicon substrate 510 may be made porous.

[0052] A thin film solid oxide fuel cell according to at least one embodiment of the present invention may include a stack of unit cells 500 .

[0053] As shown in FIG. 5, a unit cell 500 according to at least one embodiment of the present invention comprises a silicon substrate 510, an electrolyte membrane 520 formed on a first surface (top surface in the example shown in FIG. 5) of the silicon substrate 510, a first electrode 530 formed on at least a portion of the first surface of the electrolyte membrane 520, a recess 540 formed so that a portion of the second surface (bottom surface in the example shown in FIG. 5) of the electrolyte membrane 520 opposite the first surface of the silicon substrate 510 that faces the first electrode 530 is exposed from the second surface (bottom surface in the example shown in FIG. 5) that is the opposite surface of the first surface of the silicon substrate 510, and a second electrode 550 formed on the second surface of the electrolyte membrane 520 exposed at least through the recess 540.

[0054] The unit cell 500 according to at least one embodiment of the present invention is a MEMS-based thin-film SOFC, and has a structure in which the membrane and electrodes are formed as thin films to minimize ohmic loss due to ionic conduction in the electrolyte and improve operating performance at low temperatures.

[0055] To solve the problem that stress occurs near the edge of the membrane (near the edge of the recessed portion 540 in the membrane) during operation, damaging the cells located in this vicinity, the unit cell 500 according to at least one embodiment of the present invention includes a porous portion 560 formed of porosity at least near the edge of the recessed portion 540 in the silicon substrate 510.

[0056] In this way, by forming a porous portion 560 formed of porosity at least near the edge of the recess portion 540 of the silicon substrate 510, stress concentrated near the edge of the membrane (near the edge of the recess portion 540 in the membrane) can be dispersed.

[0057] Figure 5 shows an example in which a porous portion 560 formed with porosity is formed near the edge of a recessed portion 540 in a silicon substrate 510 to disperse stress concentrated near the edge of the membrane (near the edge of the recessed portion 540 in the membrane), but it is also possible to make the entire silicon substrate 510 porous to disperse stress concentrated near the edge of the membrane (near the edge of the recessed portion 540 in the membrane).

[0058] To this end, in at least one embodiment of the present invention, the unit cell 500 comprises a porous silicon substrate 510, an electrolyte membrane 520 formed on a first surface of the porous silicon substrate 510, a first electrode 530 formed on at least a portion of the first surface of the electrolyte membrane 520, a recess 540 formed on the second surface of the porous silicon substrate 510 so as to expose a portion of the second surface of the electrolyte membrane 520 facing the first electrode 530, and a second electrode 550 formed on the second surface of the electrolyte membrane 520 exposed at least through the recess 540.

[0059] In at least one embodiment of the present invention, the electrolyte membrane 520 may be formed of an ion-conductive ceramic electrolyte membrane using an MEMS process, and the first electrode 530 and the second electrode 550 may be formed using a porous platinum material.

[0060] In at least one embodiment of the present invention, the electrolyte membrane 520 can be formed of a solid oxygen ion conductor such as yttria stabilized zirconia (YSZ) or a proton conductor such as yttrium doped BaZrO3 (BYZ).

[0061] 6A-6G are schematic diagrams illustrating a process for fabricating a unit cell 500 in accordance with at least one embodiment of the present invention.

[0062] 6A, dielectric films 511 and 512 are deposited on a first surface (upper surface in the example shown in FIG. 6A) of a silicon substrate 510 whose both surfaces have been polished, and on a second surface (lower surface in the example shown in FIG. 6A) opposite to the first surface, respectively. Here, SiN can be used for the dielectric films 511 and 512.

[0063] 6B, the dielectric film 512 deposited on the second surface is removed according to a predetermined pattern. That is, the SiN dielectric film 512 is patterned by photolithography using a mask having a predetermined pattern on the dielectric film deposited on the second surface, and then the dielectric film 512 is removed along the pattern by etching using an appropriate etchant.

[0064] 6C, electrolyte film 520 is formed on the first surface of dielectric film 511 deposited on the first surface. The order of the step of removing dielectric film 512 deposited on the second surface according to a predetermined pattern and the step of forming electrolyte film 520 on the first surface of dielectric film 511 deposited on the first surface may be reversed.

[0065] 6D, the portion of the second surface from which the dielectric film 512 has been removed is etched to expose the dielectric film 511 deposited on the first surface, thereby forming a recess 540. At this time, wet etching using a KOH solution can be performed to etch the silicon substrate 510 from below.

[0066] Thereafter, as shown in FIG. 6E, the dielectric film 511 deposited on the first surface exposed through the recessed portion 540 and the dielectric film 512 remaining on the second surface are removed.

[0067] 6F, at least the area around the edge of the recessed portion 540 of the silicon substrate 510 is made porous. At this time, for example, a method of forming porous silicon can be used, in which single-crystal silicon is immersed in a hydrofluoric acid solution of a predetermined concentration and then anodized.

[0068] Then, as shown in FIG. 6G, a first electrode 530 is formed on at least a portion of the first surface of the electrolyte membrane 520, and a second electrode 550 is formed on the exposed second surface of the electrolyte membrane 520 by removing the dielectric film 511 deposited on the first surface exposed through the recess portion 540.

[0069] The unit cell 500 manufactured in this way is a MEMS-based thin-film SOFC, and by forming the membrane and electrodes as thin films, it is possible to minimize ohmic loss due to ionic conduction in the electrolyte and improve operating performance at low temperatures.

[0070] In order to prevent stress from concentrating near the edge of the membrane (near the edge of the recessed portion 540 in the membrane) during operation and damaging the cells located in this vicinity, a porous portion 560 formed with porosity is formed at least near the edge of the recessed portion 540 in the silicon substrate 510, thereby dispersing the stress concentrating near the edge of the membrane (near the edge of the recessed portion 540 in the membrane).

[0071] In at least one embodiment of the present invention, the electrolyte membrane 520 may be formed as an ion-conductive ceramic electrolyte membrane using an MEMS process, and the first electrode 530 and the second electrode 550 may be formed using a porous platinum material.

[0072] In at least one embodiment of the present invention, the electrolyte membrane 520 can be formed of a solid oxygen ion conductor such as yttria stabilized zirconia (YSZ) or a proton conductor such as yttrium doped BaZrO3 (BYZ).

[0073] 6A to 6G show an example in which a porous portion 560 formed with porosity is formed near the edge of the recess portion 540 of the silicon substrate 510 to disperse stress concentrated near the edge of the membrane (near the edge of the recess portion 540 in the membrane), but it is also possible to make the entire silicon substrate 510 porous to disperse stress concentrated near the edge of the membrane (near the edge of the recess portion 540 in the membrane).

[0074] For example, a dielectric film 511 and a dielectric film 512 are deposited on a first surface and a second surface of a double-sided polished single crystal silicon substrate 510, respectively. Here, the dielectric films 511 and 512 can be made of SiN.

[0075] Thereafter, the dielectric film 512 deposited on the second surface is removed according to a predetermined pattern. That is, the SiN dielectric film 512 is patterned by photolithography using a mask having a predetermined pattern on the dielectric film deposited on the second surface, and then the dielectric film 512 is removed along the pattern by etching using an appropriate etchant.

[0076] Thereafter, electrolyte membrane 520 is formed on the first surface of dielectric film 511 deposited on the first surface. The order of the step of removing dielectric film 512 deposited on the second surface according to a predetermined pattern and the step of forming electrolyte membrane 520 on the first surface of dielectric film 511 deposited on the first surface may be reversed.

[0077] Thereafter, the portion of the second surface from which the dielectric film 512 has been removed is etched to expose the dielectric film 511 deposited on the first surface, thereby forming a recess 540. At this time, wet etching using a KOH solution can be performed to etch the silicon substrate 510 from below.

[0078] Thereafter, the dielectric film 511 deposited on the first surface exposed through the recessed portion 540 and the dielectric film 512 remaining on the second surface are removed.

[0079] Thereafter, the silicon substrate 510 is made porous. At this time, for example, a method of forming porous silicon by immersing single crystal silicon in a hydrofluoric acid solution of a predetermined concentration and then anodizing the same can be used.

[0080] Then, a first electrode 530 is formed on at least a portion of the first surface of the electrolyte membrane 520, and a second electrode 550 is formed on the exposed second surface of the electrolyte membrane 520 by removing the dielectric film 511 deposited on the first surface exposed through the recess portion 540.

[0081] The thin-film solid oxide fuel cell 100 manufactured in this way is a MEMS-based thin-film SOFC, and by forming the membrane and electrodes as thin films, it is possible to minimize ohmic loss due to ionic conduction in the electrolyte and improve operating performance at low temperatures.

[0082] In order to prevent stress from concentrating near the edge of the membrane (near the edge of the recessed portion 540 in the membrane) during operation and damaging the cells located in this vicinity, the silicon substrate 510 is made porous, which allows the stress concentrating near the edge of the membrane (near the edge of the recessed portion 540 in the membrane) to be dispersed.

[0083] In at least one embodiment of the present invention, the electrolyte membrane 520 may be formed as an ion-conductive ceramic electrolyte membrane using an MEMS process, and the first electrode 530 and the second electrode 550 may be formed using a porous platinum material.

[0084] In at least one embodiment of the present invention, the electrolyte membrane 520 can be formed of a solid oxygen ion conductor such as yttria stabilized zirconia (YSZ) or a proton conductor such as yttrium doped BaZrO3 (BYZ).

[0085] As described above, according to at least one embodiment of the present invention, a thin film solid oxide fuel cell package having a stack structure can be provided.

[0086] Additionally, in accordance with at least one embodiment of the present invention, a solid oxide fuel cell may be provided that includes a thin film solid oxide fuel cell package having a stack structure.

[0087] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention. [Explanation of symbols]

[0088] 100: Unit cell stack 110: Unit cell 120: Oxygen supply line 130: Fuel supply line 140: Ceramic binder 200: Housing 201: Embossing 202: First insulation layer 203: Second insulation layer 500: unit cell 510: Silicon substrate 511, 512: Dielectric film 520: Electrolyte membrane 530: 1st electrode 540: Recess 550: 2nd electrode 560: Porous part

Claims

1. a stack of a plurality of unit cells, each having a membrane structure in which an electrolyte membrane and electrodes are formed on a silicon substrate; an oxygen supply line for supplying oxygen to the oxygen electrode of the unit cell; a fuel supply line for supplying a fuel in a gaseous or liquid state to the anode of the unit cell; a ceramic binder for sealing the inside of the stack so that the oxygen supplied through the oxygen supply line and the fuel supplied through the fuel supply line do not come into contact with each other within the stack; Equipped with Each unit cell constituting the stack of the plurality of unit cells is a unit cell in which a dielectric film is deposited on a first surface and a second surface opposite to the first surface of a silicon substrate, the dielectric film deposited on the second surface being removed according to a predetermined pattern, an electrolyte film is formed on the first surface of the dielectric film deposited on the first surface, the portion of the second surface from which the dielectric film is removed is etched to form a recess so as to expose the dielectric film deposited on the first surface, the dielectric film deposited on the first surface exposed through the recess and the dielectric film remaining on the second surface are removed, at least a side surface of the recess of the silicon substrate is made porous, a first electrode is formed on at least a portion of the first surface of the electrolyte film, and a second electrode is formed on a second surface opposite to the first surface of the electrolyte film exposed by removing the dielectric film deposited on the first surface exposed through the recess. Stack structure of thin-film solid oxide fuel cell unit cells.

2. a stack of a plurality of unit cells each having a membrane structure in which an electrolyte membrane and electrodes are formed on a silicon substrate; an oxygen supply line for supplying oxygen to the oxygen electrode of the unit cell; a fuel supply line for supplying a fuel in a gaseous or liquid state to the anode of the unit cell; a ceramic binder for sealing the inside of the stack so that the oxygen supplied through the oxygen supply line and the fuel supplied through the fuel supply line do not come into contact with each other within the stack; Equipped with Each unit cell constituting the stack of the plurality of unit cells is a unit cell in which a dielectric film is deposited on a first surface and a second surface opposite to the first surface of a single crystal silicon substrate, the dielectric film deposited on the second surface being removed according to a predetermined pattern, an electrolyte film is formed on the first surface of the dielectric film deposited on the first surface, the portion of the second surface from which the dielectric film is removed is etched to form a recess so that the dielectric film deposited on the first surface is exposed, the dielectric film deposited on the first surface exposed through the recess and the dielectric film remaining on the second surface are removed, the silicon substrate is formed to be porous, a first electrode is formed on at least a portion of the first surface of the electrolyte film, and a second electrode is formed on a second surface opposite to the first surface of the electrolyte film exposed by removing the dielectric film deposited on the first surface exposed through the recess. Stack structure of thin-film solid oxide fuel cell unit cells.

3. A stack structure of thin film solid oxide fuel cell unit cells according to claim 1 or 2, Solid oxide fuel cell.

4. A stack structure of thin film solid oxide fuel cell unit cells according to claim 1 or 2; a housing for accommodating the stack structure of the thin film solid oxide fuel cell unit cells; Equipped with Solid oxide fuel cell package.

5. Each unit cell constituting the stack of the plurality of unit cells includes a silicon substrate, an electrolyte membrane formed on a first surface of the silicon substrate, a first electrode formed on at least a portion of the first surface of the electrolyte membrane, a recess formed such that a portion of the second surface of the electrolyte membrane, the second surface opposite to the first surface, facing the first electrode, is exposed from a second surface of the silicon substrate opposite to the first surface, and a second electrode formed at least on the exposed second surface of the electrolyte membrane, the multilayer structure formed by the first electrode, the electrolyte membrane, and the second electrode includes a plurality of trench-shaped subcells having a predetermined depth; 5. The solid oxide fuel cell package of claim 4.

6. A thin film solid oxide fuel cell package according to claim 4, Solid oxide fuel cell.

Images