Electrode filament connecting member, CVD apparatus, and method for manufacturing recording medium substrate

Abstract

To provide an electrode filament connection member, a CVD apparatus, and a manufacturing method of a recording medium substrate that can suppresses deposition and falling of a solid matter generated in a chamber when forming a film on a substrate in the chamber by a CVD method using an electrode filament.SOLUTION: An electrode filament connection member of the invention is set so as to penetrate an outer wall and connects electrically a wire from a power source outside the chamber and an electrode filament in a CVD apparatus having the electrode filament installed in the chamber enclosed by the outer wall. The electrode filament connection member includes a head part to which the electrode filament is attached and a rod part to which the wire from the power source is connected through the outer wall. The head part has an electrode filament fitting part arranged at the tip and a side face formed so as to gradually spread toward the connecting face side from the tip. The outer shape of the side face of the head part agrees with the outer shape of the electrode filament connection member when viewed from the axial direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrode filament connecting member, a CVD apparatus, and a method for manufacturing a recording medium substrate. [Background technology]

[0002] Chemical vapor deposition (CVD) is a method for forming a film on the surface of a substrate through a chemical reaction in the gas phase. CVD requires relatively small equipment for the scale of production, has a fast film formation speed, and allows for highly precise control of the composition and thickness of the film produced, making it a method suitable for mass production and widely used.

[0003] Examples of CVD methods include CVD methods using electrode filaments, such as hot filament CVD and hot filament-plasma CVD. In CVD methods using electrode filaments, an electrode filament connecting member is used to connect wiring from a power source outside the chamber to the electrode filament inside the chamber.

[0004] For example, Patent Document 1 discloses an electrode filament connecting member that connects wiring from a cathode power supply to a cathode filament in a chamber.

[0005] Fig. 7 is a cross-sectional view showing the configuration of a conventional electrode filament connecting member. As shown in Fig. 7, the electrode filament connecting member 7 has a cylindrical head 71, a disk-shaped flange 72 at one end of the head 71 that has a larger diameter than the head 71, and a cylindrical rod 73 that extends from the flange 72 to the opposite side of the head 71 and has a smaller diameter than the flange 72.

[0006] In the CVD apparatus, the head 71 is located within the chamber, and an electrode filament is attached to one end of the head 71. The flange 72, when attached to the electrode filament, is provided as an umbrella to prevent solid matter generated within the chamber from adhering to the attachment portion of the electrode filament connecting member 7. The rod 73 penetrates the outer wall of the chamber, and is connected to wiring from a power source outside the chamber.

[0007] Patent Document 2 discloses a socket that penetrates the wall of a vacuum chamber to connect a cathode to a power source. The socket in Patent Document 2 has a roughened surface by metal spraying or the like to prevent peeling of the carbon film attached to its surface. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] International Publication No. 2016 / 024361 [Patent Document 2] Japanese Patent Application Laid-Open No. 2000-222724 Summary of the Invention [Problem to be solved by the invention]

[0009] However, the CVD method using an electrode filament has a problem in that solid matter generated in the chamber, such as components derived from the source gas, adheres to and accumulates on the electrode filament connecting member, and falls off into the chamber. In the conventional electrode filament connecting member such as that shown in Patent Document 1 or Fig. 7, solid matter accumulates in the recessed portion 74 formed in the connecting portion between the head portion 71 and the flange portion 72, and may fall off in the form of large lumps.

[0010] Even in the socket of Patent Document 2, there is room for improvement in the deposition and shedding of solid matter generated in the chamber.

[0011] Therefore, the present invention aims to provide an electrode filament connecting member, a CVD apparatus, and a method for manufacturing a recording medium substrate that can suppress the accumulation and detachment of solid matter generated in a chamber when forming a film on a substrate in a chamber using a CVD method using an electrode filament. [Means for solving the problem]

[0012] The present invention has the following configuration to achieve the above object. [1] In a CVD apparatus in which an electrode filament is disposed in a chamber formed by an outer wall, an electrode filament connecting member is attached to penetrate the outer wall and electrically connects the electrode filament to wiring from a power source outside the chamber, a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; The rod portion is parallel to the axial direction penetrating the outer wall, or the rod portion is On the side and a side surface formed to gradually widen toward the side surface, An electrode filament connecting member in which, when projected from the axial direction, the outer shape of the side surface of the head coincides with the outer shape of the electrode filament connecting member. [2] The electrode filament connecting member according to [1], wherein the side surface is a continuous surface. [3] The side surface extends from the tip portion to the outer wall The electrode filament connecting member according to [1] or [2], which is formed so as to gradually widen toward the side. [4] When the electrode filament connecting member is inserted through the mounting hole provided in the outer wall and mounted, and the mounting hole is projected from the axial direction, head of External shape is the above Mounting hole of outside The electrode filament connecting member according to any one of [1] to [3], which is located on the side of the electrode filament connecting member. [5] A CVD apparatus in which an electrode filament is disposed in a chamber formed by an outer wall, an electrode filament connecting member that is attached through the outer wall and that electrically connects a wiring from a power source outside the chamber to the electrode filament; The electrode filament connecting member is a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; The rod portion is parallel to the axial direction penetrating the outer wall, or the rod portion is On the side and a side surface formed to gradually widen toward the side surface, A CVD apparatus in which, when projected from the axial direction, the outer shape of the side surface of the head coincides with the outer shape of the electrode filament connecting member. [6] A method for manufacturing a recording medium substrate, in which a film formation process is performed using a CVD apparatus in which an electrode filament is disposed in a chamber formed by an outer wall, Said CVD device teeth, an electrode filament connecting member that is attached through the outer wall and electrically connects the electrode filament to a wiring from a power source outside the chamber; Equipped with The electrode filament connecting member is a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; The rod portion is parallel to the axial direction penetrating the outer wall, or the rod portion is On the side and a side surface formed to gradually widen toward the side surface, A method of manufacturing a recording medium substrate, wherein the outer shape of the side surface of the head matches the outer shape of the electrode filament connecting member when viewed in the axial direction. [7] The method for manufacturing a recording medium substrate according to [6], wherein the recording medium substrate is a magnetic recording medium. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an electrode filament connecting member, a CVD apparatus, and a method for manufacturing a recording medium substrate that can suppress the deposition and detachment of solid matter generated in a chamber when forming a film on a substrate in a chamber using a CVD method using an electrode filament. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a diagram schematically illustrating an example of a CVD apparatus according to one embodiment of the present invention. [Figure 2] FIG. 1 is a cross-sectional view showing an example of a filament socket according to an embodiment of the present invention. [Figure 3] 3 is a view of the filament socket shown in FIG. 2 as seen from inside the chamber in the axial direction. [Figure 4] FIG. 10 is a cross-sectional view showing a modified example of a filament socket according to an embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view showing a modified example of a filament socket according to an embodiment of the present invention. [Figure 6] FIG. 10 is a cross-sectional view showing a modified example of a filament socket according to an embodiment of the present invention. [Figure 7] FIG. 10 is a cross-sectional view showing the configuration of a conventional electrode filament connecting member. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described in detail. To facilitate understanding of the description, the same components in each drawing will be assigned the same reference numerals, and duplicate explanations will be omitted. The scale of each member in the drawings may differ from the actual scale. In this specification, unless otherwise specified, "to" indicating a range of values ​​means that the values ​​before and after it are included as the lower and upper limits.

[0016] In the embodiment described below, the CVD apparatus has an electrode filament disposed within a chamber formed by an outer wall. In this CVD apparatus, an electrode filament connecting member that electrically connects the electrode filament to wiring from a power source outside the chamber is attached to the outer wall and penetrates it. Note that in the following description, the electrode filament connecting member is a filament socket for the cathode of a hot filament plasma CVD apparatus, but it can also be applied to other CVD apparatuses that use a filament.

[0017] <1.CVD equipment> 1-1. Device configuration FIG. 1 is a diagram schematically illustrating an example of a CVD apparatus according to one embodiment of the present invention. The CVD apparatus 1 is an apparatus that performs a film deposition process on a substrate W in a chamber C. The shape of the substrate W is not particularly limited, but may be, for example, a disk. The CVD apparatus 1 according to this embodiment is capable of performing a film deposition process on both sides of the substrate W, and the configuration inside the chamber C described below is similarly provided on both sides of the substrate W, although FIG. 1 shows only one side. Note that the CVD apparatus may also be configured to perform a film deposition process on only one side of the substrate W.

[0018] 1, the CVD apparatus 1 includes an outer wall 11, a cathode filament 12 which is an electrode filament, a filament socket 13 which is an electrode filament connecting member, a cathode power supply 14 which is a power supply, an anode 15, an anode power supply 16, a gas inlet 17, a gas outlet 18, a substrate holder 19, an ion acceleration power supply 20, and an inner shield 21. The CVD apparatus 1 may include other components as necessary.

[0019] The outer wall 11 forms an airtight internal space, i.e., a chamber C. The chamber C formed by the outer wall 11 accommodates a cathode filament 12, an anode 15, a substrate holder 19, and a substrate W. A film deposition process for the substrate W is performed in the chamber C. Other components may be accommodated in the chamber C as needed. The outer wall 11 also has a socket mounting hole 111 for mounting a filament socket 13, the details of which will be described later.

[0020] The cathode filament 12 may be made up of a single wire or multiple wires. When the cathode filament 12 is made up of multiple wires, it is preferable that the cathode filament 12 is formed of a stranded wire. The material of the cathode filament 12 can be, for example, tungsten, but is not limited to this.

[0021] The filament socket 13 is attached to a socket attachment hole 111 in the outer wall 11 while penetrating the outer wall 11, and electrically connects the cathode filament 12 in the chamber C to the wiring from the cathode power supply 14. Two filament sockets 13 are provided, and each filament socket 13 electrically connects each end of the cathode filament 12 separately to the wiring from the cathode power supply 14 outside the chamber C.

[0022] The filament socket 13 is attached to the outer wall 11 so as to maintain airtightness inside the chamber C. In this embodiment, the filament socket 13 is a conductor, and a specific preferred material is copper or the like. The filament socket 13 and the outer wall 11 are electrically insulated by an insulating member 13A. Examples of the insulating member include an insulator. Details of the filament socket 13 will be described later with reference to FIG. 2.

[0023] The cathode power supply 14 is an AC power supply. The voltage of the cathode power supply 14 is preferably 100V to 300V, but is not limited to this range. Each terminal of the cathode power supply 14 is separately connected to each filament socket 13. With this configuration, an AC voltage is applied to the cathode filament 12, and the cathode filament 12 is heated by the flowing current. In addition, one terminal of the cathode power supply 14 is connected to earth E.

[0024] The anode 15 has an anode plate 151 that surrounds the cathode filament 12 and is open on the substrate W side. The anode plate 151 has a taper that widens toward the substrate W side. The anode plate 151 may have a curved surface. The anode plate 151 is electrically insulated from the outer wall 11. In the example of FIG. 1, the anode plate 151 is provided so as to cover the inner surface of the outer wall 11 in the vicinity of the attachment portion of the cathode filament socket 13. In this example, the anode plate 151 is provided in a through hole 152 so as not to come into contact with the filament socket 13, as will be described in detail later.

[0025] The anode power supply 16 is a DC power supply. The voltage of the anode power supply 16 is preferably 0 V to 300 V, but is not limited to this range. The positive electrode of the anode power supply 16 is connected to the anode 15, and the negative electrode is connected to the terminal of the cathode power supply 14 that is not connected to the earth E. The wiring connecting the anode 15 and the anode power supply 16 is electrically insulated from the outer wall 11 by an insulating member 16A.

[0026] The gas introduction unit 17 introduces a source gas from an external gas supply source (not shown) into the chamber C. In this embodiment, the source gas is an organic compound. Examples of the organic compound include, but are not limited to, hydrocarbons such as methane, ethane, benzene, and toluene.

[0027] The gas exhaust unit 18 exhausts the gas inside the chamber C to the outside. The pressure inside the chamber C is controlled by the gas exhaust unit 18. The device for controlling the pressure inside the chamber C is not particularly limited, but examples thereof include a pump.

[0028] The substrate holder 19 holds the substrate W in the chamber C. The substrate holder 19 may have a driving device (not shown) and may be able to move the position of the substrate W. The substrate W may be moved in directions perpendicular or parallel to the surface of the plate, but may also be moved in a direction oblique to these directions.

[0029] The ion acceleration power supply 20 is a DC power supply. The voltage of the ion acceleration power supply 20 is preferably 50 V to 1000 V, but is not limited to this range. The voltage of the ion acceleration power supply 20 may be varied as appropriate depending on the progress of the process. The positive electrode of the ion acceleration power supply 20 is connected to earth E, and the negative electrode is connected to the substrate W. Wiring from the ion acceleration power supply 20 to the substrate W may be attached inside the substrate holder 19. The wiring connecting the ion acceleration power supply 20 and the substrate W is electrically insulated from the outer wall 11 by an insulating member 20A.

[0030] The inner shield 21 covers the inner surface of the outer wall 11 between the anode plate 151 and the substrate W. The inner shield 21 prevents solid matter generated in the chamber C from adhering to the inner surface of the outer wall 11. A gap is provided between the inner shield 21 and the anode plate 151. In this example, the source gas entering from the gas inlet 17 passes between the inner shield 21 and the anode plate 151 and enters the chamber C. In addition, the inner shield 21 is preferably at a float potential.

[0031] [1-2. Device Operation] According to the above configuration, the cathode filament 12 generates heat due to the current supplied from the cathode power supply 14. The source gas is converted into a plasma state by the heat generated by the cathode filament 12 and the discharge between the cathode filament 12 and the anode 15. The substrate W is at a negative potential due to the ion acceleration power supply 20. Therefore, the plasma is accelerated toward the substrate W, and when the plasma collides with the substrate W, a film made of components derived from the source gas is formed on the surface of the substrate W.

[0032] <2. Filament socket> The filament socket, which is an electrode filament connecting member according to this embodiment, will now be described in detail. FIG. 2 is a cross-sectional view showing an example of a filament socket according to this embodiment. The pair of filament sockets 13 connected to both sides of the cathode filament 12 have the same configuration. Note that in this embodiment, the configuration shown in FIG. 2 is merely an example and can be modified as appropriate within the scope of achieving the object of this embodiment. Here, the end (tip) of the filament socket 13 inside the chamber C is referred to as one end, and the end of the filament socket 13 outside the chamber C is referred to as the other end.

[0033] The tip portion refers to the tip of the filament socket 13 or a region including the tip and its surrounding area. When the filament socket 13 has a tip surface 133 on the head portion 131 as described below, the tip portion refers to the tip surface 133, and when the filament socket 13 does not have a tip surface 133 on the head portion 131, the tip portion refers to the tip and its surrounding area.

[0034] As shown in FIG. 2, the outer wall 11 is provided with a socket mounting hole 111 through which the filament socket 13 passes, and the filament socket 13 is mounted through the socket mounting hole 111. An insulating member 13A is interposed between the filament socket 13 and the outer wall 11 in the socket mounting hole 111. For example, an insulator or the like can be used as the insulating member 13A. In FIG. 2, in the socket mounting hole 111 of the outer wall 11, the insulating member 13A surrounds a rod portion 132 (described later) of the filament socket 13 while making contact with the entire periphery. The outer periphery of the insulating member 13A is surrounded by and makes contact with the outer wall 11. This configuration allows electrical insulation between the outer wall 11 and the filament socket 13, i.e., between the outer wall 11 and the wiring of the cathode power supply 14, while maintaining airtightness within the chamber C.

[0035] The anode plate 151 is provided with a through-hole 152 for passing the filament socket 13 therethrough. The diameter of the through-hole 152 is larger than the outer diameter of a rod portion 132 (described later) of the filament socket 13, and the through-hole 152 is spaced apart from the rod portion 132. That is, a gap is provided between the filament socket 13 and the anode plate 151, and the filament socket 13 and the anode plate 151 are attached so that they do not come into contact with each other. The clearance between the filament socket 13 and the anode plate 151 is preferably determined so that dielectric breakdown does not occur based on the voltage between these components.

[0036] The filament socket 13 includes a head 131 to which the cathode filament 12 is attached within the chamber C, and a rod 132 that extends from the head 131 through the outer wall 11 toward the outside of the chamber C and is connected to wiring from a cathode power supply 14 provided outside the chamber C. In the following description, the direction in which the rod 132 penetrates the outer wall is referred to as the axial direction Ax. In this embodiment, the axial direction Ax and the surface of the outer wall 11 on the inside of the chamber C at the portion (socket mounting hole 111) through which the rod 132 penetrates are orthogonal to each other.

[0037] The head 131 has a tip surface 133 of the head 131 located inside the chamber C, an electrode filament mounting portion 134 provided on the tip surface 133, a side surface 135 formed from the tip surface 133 toward the outer wall 11 side which is outside the chamber C, a connection surface 136 formed at the connection portion of the side surface 135 with the rod portion 132, a filament fixing hole 137, and a jig mounting hole 138.

[0038] The tip surface 133 is a plane perpendicular to the axial direction Ax, but may be a tapered surface widening from the electrode filament mounting portion 134 toward the side surface 135, or may be a spherical surface convex toward the inside of the chamber C.

[0039] The tip surface 133 may have a fine uneven pattern such as a knurled pattern. This configuration prevents solid matter generated in the chamber C from accumulating and forming large lumps. The solid matter generated in the chamber C may be, for example, a component derived from the source gas, such as carbon, but is not limited to this. When the tip surface 133 has a fine uneven pattern, the tip surface 133 is an envelope of the uneven pattern. Note that the depth of the fine uneven pattern from the envelope is preferably one-tenth or less, and more preferably one-twentieth or less, of the maximum length of the filament socket 13 projected in the mounting direction onto the outer wall 11.

[0040] The electrode filament attachment portion 134 is a hole provided in the tip surface 133, and the cathode filament 12 is inserted into the electrode filament attachment portion 134.

[0041] 2, the electrode filament attachment portion 134 may be, for example, a hook or the like that protrudes from the tip end surface 133 toward the inside of the chamber C. In this case, it is preferable to provide an engagement structure corresponding to the hook, such as a hook-shaped or ring-shaped structure, on the cathode filament 12 side.

[0042] The side surface 135 extends from the tip surface 133 located inside the chamber C toward the outer wall 11. ( Connection surface 136 side ) It is formed so that it gradually widens towards the

[0043] The side surface 135 is preferably a continuous surface, as shown in Fig. 2. The side surface 135 may be a tapered surface formed so as to increase in diameter from the tip surface 133 toward the connecting surface 136. When viewed from a direction perpendicular to the axial direction of the filament socket 13, the side surface 135 may be, for example, a curved surface formed so as to be convex outward from the tip surface 133 toward the connecting surface 136, or a curved surface formed so as to be concave inward from the tip surface 133 toward the connecting surface 136.

[0044] As will be described later, when projected in the mounting direction of the filament socket 13 onto the outer wall 11, the outer shape of the side surface 135 of the head 131 coincides with the outer shape of the filament socket 13. That is, as shown in FIG. 2, the maximum diameter of the side surface 135 is the outer diameter at the connection surface 136, which is the maximum diameter of the filament socket 13. With this configuration, discontinuous recesses (for example, recessed portion 74 in FIG. 7) can be reduced. This prevents solid matter generated in the chamber C from accumulating on the surface of the filament socket 13 and forming large lumps.

[0045] The side surface 135 may have a fine uneven pattern such as a knurled pattern. This configuration prevents solid matter generated in the chamber C from accumulating and forming large lumps. When the side surface 135 has a fine uneven pattern, the side surface 135 is an envelope surface of the uneven pattern. Note that the depth of the fine uneven pattern from the envelope surface is preferably one-tenth or less, and more preferably one-twentieth or less, of the maximum length of the filament socket 13 projected onto the outer wall 11 in the mounting direction.

[0046] 2, the connection surface 136 is a flat surface that connects the end of the side surface 135 on the outer wall 11 side to the end of one end of the rod portion 132. The connection surface 136 is separated from the outer wall 11. Note that the shape of the connection surface 136 is not limited to this, and it may be a tapered surface that narrows toward the outside of the chamber C. The connection surface 136 does not need to be a continuous surface, and may have irregularities.

[0047] 2, the filament fixing hole 137 may be provided in the side surface 135. The filament fixing hole 137 does not necessarily have to be provided, and may be provided as needed.

[0048] The filament fixing hole 137 is a hole that intersects with the hole in the electrode filament attachment portion 134 and passes through the head portion 131. The filament fixing hole 137 is a screw hole and may have a threaded groove on its inner wall. A pair of screw members 137A and 137B, each having a groove on its outer periphery, are inserted into the filament fixing hole 137 from both sides as fixing members, and sandwich the cathode filament 12. The cathode filament 12 is fixed in the filament fixing hole 137 by being sandwiched between the screw members 137A and 137B.

[0049] In this embodiment, a pair of screw members 137A and 137B is provided in the filament fixing hole 137, but the cathode filament 12 may be fixed by a fixing member other than the pair of screw members 137A and 137B. Also, depending on the structure of the electrode filament mounting portion 134, for example, if the electrode filament mounting portion 134 is hook-shaped, the pair of screw members 137A and 137B may not be provided in the cathode filament 12.

[0050] 2, the jig attachment hole 138 may be provided in the side surface 135. Note that the jig attachment hole 138 does not necessarily have to be provided, and may be provided as needed.

[0051] The jig attachment hole 138 is a hole that penetrates the head 131. For example, a tool or the like is inserted into the jig attachment hole 138 to remove the filament socket 13 from the outer wall 11. Note that if no tool is required to attach or remove the filament socket 13, the jig attachment hole 138 does not need to be provided.

[0052] 2, the rod portion 132 is fixed in a state in which it penetrates through the socket mounting hole 111 of the outer wall 11 via an insulating member 13A. The rod portion 132 has a cylindrical shape, but may also be a polygonal prism such as a square prism, or the outer wall may be tapered.

[0053] The rod portion 132 may have a wiring connection hole 139 extending from the other end toward one end of the filament socket 13. A terminal 141 of a wiring from the cathode power supply 14 may be inserted into the wiring connection hole 139 to connect the filament socket 13 to the wiring from the cathode power supply 14.

[0054] The connection structure of the rod portion 132 with the wiring from the cathode power supply 14 is not limited to this, and for example, a through hole may be provided in the side surface of the rod portion 132 to engage with the terminal 141 of the wiring.

[0055] The filament socket 13 is made of an electrically conductive material, since it electrically connects the cathode filament 12 and the wiring from the cathode power supply 14 via the filament socket 13 .

[0056] Fig. 3 is a view of the filament socket 13 shown in Fig. 2 as seen from inside the chamber C in the axial direction Ax. For ease of explanation, in Fig. 3, lines other than the outline of the head 131 and the tip surface 133 shown by solid lines, and the rod portion 132, insulating member 13A, side surface 135, and through-hole 152 shown by dotted lines are omitted for the filament socket 13.

[0057] 3, the outer shape of the side surface 135 of the head portion 131 matches the outer shape of the filament socket 13. That is, when viewed projected from the axial direction Ax, the outer shape of the side surface 135 of the head portion 131 matches the outer shape of the filament socket 13.

[0058] If necessary, a protrusion, for example, a reinforcing rib extending along the axial direction Ax, may be provided partially on the side surface 135. In this case, since the protrusion is not on the side surface 135, it is not necessary for the entire outer shape of the filament socket 13 to coincide with the outer shape of the side surface 135.

[0059] When the filament socket 13 is attached to the outer wall 11, the socket attachment hole 111 of the outer wall 11 is located inside the outline of the side surface 135 of the head 131. That is, when the filament socket 13 is attached to the outer wall 11 and viewed in projection from the axial direction Ax of the socket attachment hole 111, the socket attachment hole 111 is located inside the outline of the projection of the axial direction Ax of the side surface 135. (When viewed from the axial direction Ax, the outer shape of the head 131 is outside the outer shape of the socket mounting hole 111.) With this configuration, the head 131 of the filament socket 13 acts as an umbrella, which prevents solid matter generated in the chamber C from adhering to the mounting portion of the filament socket 13, particularly to the insulating member 13A, and prevents short circuits between the filament socket 13 and the outer wall 11.

[0060] With the filament socket 13 attached to the outer wall 11, the through hole 152 of the anode 15 is located inside the outline of the side surface 135 of the head 131. That is, with the filament socket 13 attached to the outer wall 11, when viewed projected in the axial direction Ax of the through hole 152 of the anode 15, the socket attachment hole 111 is located inside the outline of the projection of the axial direction Ax of the side surface 135 of the head 131. With this configuration, the head 131 of the filament socket 13 acts as an umbrella, and it is possible to prevent solid matter generated in the chamber C from entering through the gap between the rod portion 132 of the filament socket 13 and the through hole 152 of the anode plate 151 and contaminating the inner surface of the outer wall 11.

[0061] <3. Modified filament socket> The side surface 135 of the head portion 131 of the filament socket 13 can be designed to have any suitable shape as long as the filament socket 13 is formed so that solid matter produced in the chamber C does not accumulate on the side surface 135. Modified examples of the filament socket 13 according to this embodiment will be described below.

[0062] [3-1. First Modification] Fig. 4 is a cross-sectional view showing a first modified example of the filament socket 13 according to this embodiment. As shown in Fig. 4, in this modified example, the head 131 has no end face, and the side face 135 is formed so as to gradually widen from the tip, specifically, the electrode filament attachment portion 134 provided at the end inside the chamber C, toward the outer wall 11 side (outside the chamber C).

[0063] According to this configuration, the corners of the tip surface 133 (see FIG. 2) inside the chamber C can be reduced, so that solid matter adhering to the filament socket 13 can be prevented from falling off.

[0064] [3-2. Second Modification] Fig. 5 is a cross-sectional view showing a second modified example of the filament socket 13 according to the present embodiment. As shown in Fig. 5, in this modified example, the angle of the side surface 135 of the head 131 with respect to the axial direction Ax is formed so as to gradually decrease from the tip surface 133 toward the outer wall 11 (outside the chamber C). In other words, the side surface 135 has a curved surface that is convex outward from the tip surface 133 toward the connecting surface 136.

[0065] Furthermore, the corner between the tip surface 133 and the side surface 135 may be rounded or the like, so that the tip surface 133 and the side surface 135 form a continuous surface.

[0066] Furthermore, the side 135 of the chamber C outside side( rod Part 13 2 The portion (side) may be a cylindrical surface parallel to the axial direction Ax.

[0067] The angle of the side surface 135 of the head portion 131 with respect to the axial direction Ax may be formed so as to gradually increase from the tip surface 133 toward the outer wall 11. In other words, the side surface 135 may have a curved surface that is concave outward from the tip surface 133 toward the connecting surface 136.

[0068] [3-3. Third Modification] 6 is a cross-sectional view showing a third modified example of the filament socket 13 according to the present embodiment. As shown in FIG. 6, in this modified example, the side surface 135 of the head 131 has a cylindrical surface parallel to the axial direction Ax. The diameter of the cylindrical surface forming the side surface 135 is larger than the diameter of the rod portion 132. Therefore, the outer shape of the side surface 135 of the head 131 matches the outer shape of the filament socket 13.

[0069] <4. Method for manufacturing recording medium substrate> In the method for manufacturing a recording medium substrate according to this embodiment, a film made of components derived from a raw material gas is formed on the surface of a substrate W by performing a film formation process using a CVD apparatus 1. This allows a recording medium substrate to be manufactured for use in a magnetic recording medium or the like. (Note that the recording medium substrate may also be used as a magnetic recording medium, etc.) .

[0070] <5. Effects of this embodiment> The filament socket 13 according to this embodiment is attached to a CVD apparatus 1 in which a cathode filament 12 is disposed inside a chamber C formed by an outer wall 11, penetrating the outer wall 11. The filament socket 13 electrically connects wiring from a cathode power supply 14 provided outside the chamber C to the cathode filament 12 provided inside the chamber C.

[0071] The filament socket 13 is provided in the chamber C and includes a head portion 131 to which the cathode filament 12 is attached, and a rod portion 132 that passes through the outer wall 11 from the head portion 131 and to which wiring from the cathode power supply 14 is connected.

[0072] In the example of FIG. 2, the head 131 has an electrode filament attachment portion 134 provided at the tip end located inside the chamber C, and a tip end surface 133. Exterior wall 11 side (Connection surface 136 side)The head 131 has a side surface 135 formed so as to gradually widen toward the tip end. As in the first modified example, the head 131 may not have a tip surface, and the side surface 135 may be a surface that extends from the tip end where the cathode filament 12 is attached toward the outside of the chamber C. As in the second modified example, the angle of the side surface 135 with respect to the axial direction Ax may change, or a part of the side surface 135 may be parallel to the axial direction Ax. As in the fourth modified example, the side surface 135 may be parallel to the axial direction Ax.

[0073] Furthermore, if the direction in which the rod portion 132 penetrates the outer wall 11 is defined as the axial direction Ax, the outer shape of the side surface 135 of the head portion 131 coincides with the outer shape of the filament socket 13 when viewed projected from the axial direction Ax.

[0074] When projected in the axial direction Ax, the filament socket 13 has a head portion 131 whose outer shape is larger than that of the rod portion 132. Therefore, the head portion 131 functions as an umbrella that prevents solid matter generated in the chamber C from adhering to the inner surface of the outer wall 11. Therefore, when a film is formed on the substrate W in the chamber C by the CVD method using the cathode filament 12, the filament socket 13 can prevent solid matter generated in the chamber C from adhering to the socket mounting hole 111 through which the filament socket 13 is mounted on the outer wall 11.

[0075] Furthermore, the filament socket 13 does not have a recess such as the recessed portion 74 between the head portion 71 and the flange portion 72 as in the conventional electrode filament connecting member shown in Fig. 7. Therefore, the filament socket 13 can prevent solid matter produced in the chamber C from accumulating on the head portion 131 and becoming large lumps that fall off.

[0076] The CVD apparatus 1 according to this embodiment includes a filament socket 13. Therefore, when a film is formed on a substrate W in a chamber C by a CVD method using a cathode filament 12, the CVD apparatus 1 can prevent solid matter generated in the chamber C from adhering to the socket mounting hole 111 through which the filament socket 13 is mounted on the outer wall 11. Furthermore, because the CVD apparatus 1 includes the filament socket 13, it can prevent solid matter generated in the chamber C from accumulating on the head 131 and falling off as large lumps.

[0077] The method for manufacturing a recording medium substrate according to this embodiment uses a filament socket 13. Therefore, according to the method for manufacturing a recording medium substrate according to this embodiment, when a film is formed on a substrate W in a chamber C by a CVD method using a cathode filament 12, it is possible to prevent solid matter generated in the chamber C from adhering to the socket attachment hole 111 where the filament socket 13 is attached to the outer wall 11. Furthermore, because the method for manufacturing a recording medium substrate according to this embodiment uses the filament socket 13, it is possible to prevent solid matter generated in the chamber C from accumulating on the head 131 and falling off as large lumps.

[0078] Thus, according to this embodiment, it is possible to provide an electrode filament connecting member, a CVD apparatus, and a method for manufacturing a recording medium substrate that can suppress contamination of the outer wall 11 of the chamber C and suppress the accumulation and detachment of solid matter generated in the chamber C when forming a film on a substrate W in the chamber C using a CVD method using a cathode filament 12.

[0079] Although the embodiments have been described above, they are presented as examples and the present invention is not limited to the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as set forth in the claims. [Explanation of symbols]

[0080] 1 CVD equipment 11 Exterior Wall 111 Socket mounting hole 12 Cathode filament (electrode filament) 13 Filament socket (electrode filament connecting member) 13A, 16A, 20A insulating material 131 Head 132 Rod section 133 Tip surface 134 Electrode filament attachment part 135 Side 136 Connection Surface 137 Filament fixing hole 137A, 137B Screw member (fixing member) 14 Cathode power supply (power supply) 15 anodes 151 Anode plate 16 Anode power supply 17 Gas inlet 18 Gas exhaust section 19 Board holding part 20 Ion acceleration power supply Ax axis direction C Chamber E Earth W substrate

Claims

1. In a CVD apparatus in which an electrode filament is disposed within a chamber formed by an outer wall, an electrode filament connecting member is attached to penetrate the outer wall and electrically connects the electrode filament to wiring from a power source outside the chamber, a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; a side surface formed parallel to the axial direction in which the rod portion penetrates the outer wall or gradually widening from the tip portion toward the outer wall; and The side surface is a continuous surface and is formed to gradually widen from the tip portion toward the outer wall side, The other end of the rod portion is provided outside the outer wall, a wiring connection hole to which a terminal of the wiring is connected is provided at the other end of the rod portion; An electrode filament connecting member in which, when projected from the axial direction, the outer shape of the side surface of the head coincides with the outer shape of the electrode filament connecting member.

2. An electrode filament connecting member as described in Claim 1, wherein the rod portion is fixed to the outer wall via an insulating member.

3. The electrode filament attachment portion is provided at the tip portion located inside the chamber, and is a hole into which the electrode filament is inserted; 3. The electrode filament connecting member according to claim 1, wherein the head portion has a filament fixing hole that penetrates the side surface and fixes the electrode filament that is inserted from the electrode filament attachment portion.

4. An electrode filament connecting member as described in any one of claims 1 to 3, wherein when the electrode filament connecting member is inserted through an attachment hole provided in the outer wall and the attachment hole is viewed projected from the axial direction, the outer shape of the head is outside the attachment hole.

5. A CVD apparatus having an electrode filament disposed within a chamber formed by an outer wall, an electrode filament connecting member that is attached through the outer wall and that electrically connects the electrode filament to a wiring from a power source outside the chamber; The electrode filament connecting member is a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; a side surface formed parallel to the axial direction in which the rod portion penetrates the outer wall or gradually widening from the tip portion toward the outer wall; and The side surface is a continuous surface and is formed to gradually widen from the tip portion toward the outer wall side, The other end of the rod portion is provided outside the outer wall, a wiring connection hole to which a terminal of the wiring is connected is provided at the other end of the rod portion; A CVD apparatus in which, when projected from the axial direction, the outer shape of the side surface of the head coincides with the outer shape of the electrode filament connecting member.

6. A method for manufacturing a recording medium substrate, which performs a film formation process using a CVD apparatus in which an electrode filament is disposed in a chamber formed by an outer wall, The CVD apparatus comprises: an electrode filament connecting member that is attached through the outer wall and electrically connects the electrode filament to a wiring from a power source outside the chamber; Equipped with The electrode filament connecting member is a head portion provided within the chamber and to which the electrode filament is attached; a rod portion that passes through the outer wall from the head portion and to which the wiring from the power source is connected, The head portion an electrode filament attachment portion provided at a tip portion located inside the chamber; a side surface formed parallel to the axial direction in which the rod portion penetrates the outer wall or gradually widening from the tip portion toward the outer wall; and The side surface is a continuous surface and is formed to gradually widen from the tip portion toward the outer wall side, The other end of the rod portion is provided outside the outer wall, a wiring connection hole to which a terminal of the wiring is connected is provided at the other end of the rod portion; A method of manufacturing a recording medium substrate, wherein the outer shape of the side surface of the head matches the outer shape of the electrode filament connecting member when viewed in the axial direction.

7. 7. The method for manufacturing a recording medium substrate according to claim 6, wherein the recording medium substrate is a magnetic recording medium.

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