Processing equipment

Abstract

To provide a processing device which can share data of a key pattern or the like used in image processing such as alignment without a sense of discomfort in an image displayed by display means even if the processing device includes upper imaging means and lower imaging means.SOLUTION: A processing device comprises: holding means 20 which holds a wafer 10; processing means which performs processing on the held wafer; feeding means which relatively processing-feeds the holding means and the processing means; imaging means 30 which images the held wafer and detects a region to be processed; and display means which displays the photographed image. The holding means comprises: a transparent plate which has an upper surface that holds the wafer; and a frame body which supports the transparent plate. The imaging means comprises upper imaging means 31 which is positioned on the upper surface side and lower imaging means 32 which is positioned on the lower surface side so as to hold the transparent plate therebetween. The processing device corrects the brightness to a hierarchy of the brightness of the image photographed by the lower imaging means with a function, and approximates it to the image quality photographed by the upper imaging means.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus having an imaging means for imaging a workpiece held by a holding means and detecting an area to be processed. [Background technology]

[0002] Wafers with multiple devices such as ICs and LSIs formed on their surfaces, which are divided by planned division lines, are then divided into individual device chips using a dicing machine or laser processing machine, and these are used in electrical devices such as mobile phones and personal computers.

[0003] The dicing device comprises at least a chuck table for holding a wafer, a cutting means having a rotatable cutting blade for cutting the wafer held on the chuck table, a feeding means for relatively feeding the chuck table and the cutting means for processing, an imaging means for imaging the wafer held on the chuck table to detect the area to be cut, and a display means for displaying the image captured by the imaging means, and can divide the wafer into individual device chips with high precision based on the captured image (see, for example, Patent Document 1).

[0004] The laser processing device is realized by replacing the above-mentioned cutting means with a laser irradiation means, and by making the other configurations approximately the same as those of the above-mentioned dicing device, it is possible to laser process the wafer with high precision (see, for example, Patent Document 2).

[0005] The present applicant has also developed and proposed a processing device in which the chuck table that holds the wafer is made of a transparent plate, a lower imaging means that images the wafer from below through the chuck table is arranged on the underside of the chuck table, and the surface of the wafer is held on the chuck table, and an image is taken from below to detect the area to be cut (see Patent Document 3). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-166991 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-146403 [Patent Document 3] Patent Publication No. 2021-052144 Summary of the Invention [Problem to be solved by the invention]

[0007] Even in the processing apparatus equipped with the lower imaging means disclosed in Patent Document 3, there are cases where the wafer is processed with its front surface facing upward relative to the chuck table. In such cases, an upper imaging means must also be provided to image the wafer from above while holding it on the chuck table with its front surface facing upward. That is, depending on whether the wafer's front surface faces upward or downward, either the upper or lower imaging means is used to image the wafer's front surface and detect the area to be cut. However, when the wafer is imaged from below using the lower imaging means disclosed in Patent Document 3, the wafer's front surface is imaged through the dicing tape and transparent plate, which creates a significantly different imaging environment compared to when the wafer is imaged from above. As a result, the image quality of an image taken of a specified area of ​​a wafer from above using the upper imaging means differs significantly from the image quality of an image taken from below using the lower imaging means. This results in an unnatural appearance in the image displayed by the display means even when the same area of ​​the wafer is imaged, and also in the problem that data such as key patterns used in alignment performed before processing cannot be shared between when the upper imaging means and the lower imaging means are used.

[0008] The present invention has been made in consideration of the above facts, and its main technical object is to provide a processing device that, even when equipped with an upper imaging means and a lower imaging means, does not cause any sense of incongruity in the images displayed by the display means and can share data such as key patterns used in image processing such as alignment. [Means for solving the problem]

[0009] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a processing device comprising: a holding means for holding a workpiece; a processing means for processing the workpiece held by the holding means; a feeding means for feeding the holding means and the processing means relatively for processing; an imaging means for imaging the workpiece held by the holding means and detecting the area to be processed; and a display means for displaying the image captured by the imaging means, wherein the holding means comprises at least a transparent plate having an upper surface for holding the workpiece and a frame body supporting the transparent plate, and the imaging means comprises an upper imaging means positioned on the upper side of the transparent plate so as to sandwich the transparent plate, and a lower imaging means positioned on the lower side of the transparent plate, and the processing device corrects the brightness for the brightness hierarchy of the image captured by the lower imaging means from the lower side of the transparent plate using a function to approximate the image quality to that of an image captured by the upper imaging means from above the transparent plate.

[0010] The function is preferably a gamma correction conversion formula, and the range of the brightness levels is preferably adjustable. [Effects of the Invention]

[0011] The processing device of the present invention is a processing device comprising: holding means for holding a workpiece; processing means for processing the workpiece held by the holding means; feeding means for relatively feeding the holding means and the processing means for processing; imaging means for imaging the workpiece held by the holding means and detecting an area to be processed; and display means for displaying the image captured by the imaging means. The holding means comprises at least a transparent plate having an upper surface for holding the workpiece, and a frame body for supporting the transparent plate. The imaging means is positioned on the upper surface side of the transparent plate so as to sandwich the transparent plate. The image capturing apparatus comprises an upper imaging means positioned above the transparent plate and a lower imaging means positioned below the transparent plate, and the brightness of the image captured by the lower imaging means from the underside of the transparent plate is corrected using a function to approximate the image quality of the image captured by the upper imaging means from above the transparent plate. This solves the problem of the image quality of the image captured by the upper imaging means and the image captured by the lower imaging means being similar and looking unnatural, and also enables the upper and lower imaging means to share data such as key patterns used in image processing. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is an overall perspective view of the dicing device. [Figure 2] 3 is an exploded perspective view showing a part of a holding means disposed in the dicing apparatus shown in FIG. 2. FIG. [Figure 3] 2 is a perspective view showing a wafer as a workpiece to be processed by the dicing apparatus shown in FIG. 1. FIG. [Figure 4] FIG. 10 is a perspective view showing a mode of imaging a wafer held by a holding means. [Figure 5] 10 is a front view showing an image of a wafer before correction captured by a lower imaging means and an image of the wafer after correction using a function. FIG. [Figure 6] 10(a) to 10(e) are conceptual diagrams showing examples of functions for correcting images captured by the lower imaging means. [Figure 7] FIG. 10 is a perspective view showing a mode in which cutting is performed. DETAILED DESCRIPTION OF THE INVENTION

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a processing apparatus configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0014] 1 shows an overall perspective view of a dicing apparatus 1, which is an example of a processing apparatus of the present invention. The dicing apparatus 1 includes holding means 20 for holding a workpiece, imaging means 30 for imaging the workpiece held by holding means 20 and detecting the area to be processed, cutting means 40 provided as processing means for processing the workpiece held by holding means 20, X-axis feed means 50 provided as feeding means for relatively feeding the holding means 20 and cutting means 40 in the X-axis direction indicated by the arrow X in the figure, and display means 60 for displaying the image captured by imaging means 30.

[0015] Furthermore, the dicing device 1 is provided with a Y-axis feeding means 70 that indexes and feeds the cutting means 40 in the Y-axis direction indicated by the arrow Y in the drawing, which is perpendicular to the X-axis direction.

[0016] The holding means 20 includes a rectangular X-axis direction movable plate 21 mounted on the base 2 so as to be movable in the X-axis direction, a support base 22 with a U-shaped cross section fixed to the upper surface of the X-axis direction movable plate 21, a transparent plate 23 having an upper surface 23a for holding the workpiece, a rotatably arranged cylindrical frame 24 that supports the transparent plate 23, and clamps 25 that function as fixing parts of a frame (described later) that supports the workpiece. The clamps 25 are arranged between the transparent plate 23 and the frame 24, and a plurality of clamps 25 are arranged at equal intervals in the circumferential direction.

[0017] The X-axis feed means 50 converts the rotational motion of the motor 51 into linear motion via a ball screw 52 and transmits it to the X-axis movable plate 21, thereby moving the support base 22 back and forth in the X-axis direction together with the X-axis movable plate 21 along the X-axis guide rails 2A, 2A on the base 2.

[0018] The cutting means 40 is disposed at a rear position adjacent in the Y-axis direction to the area where the holding means 20 moves in the X-axis direction. The cutting means 40 includes a spindle unit 41. The spindle unit 41 includes a cutting blade 43 fixed to the tip of a rotating spindle 42 and having a cutting edge on its outer periphery, and a blade cover 44 that protects the cutting blade 43. A cutting water supply means 45 is disposed on the blade cover 44 at a position adjacent to the cutting blade 43, and supplies cutting water introduced through the blade cover 44 toward the cutting position. A rotational drive source such as a motor (not shown) is housed at the other end of the spindle unit 41, and rotating the motor rotates the cutting blade 43.

[0019] The cutting means 40 is supported by a vertical support portion 47a that constitutes the cutting means support portion 47. A pair of Y-axis guide rails 2B, 2B that are parallel to the Y-axis direction are arranged on the base 2, and a horizontal wall portion 47b that constitutes the cutting means support portion 47 and on which the vertical support portion 47a is erected is slidably attached to the Y-axis guide rails 2B, 2B. The cutting means support portion 47 is configured to be movable along the Y-axis direction by a Y-axis feed means 70. The Y-axis feed means 70 converts the rotational motion of a motor 71 into linear motion via a ball screw 72 and transmits the linear motion to the horizontal wall portion 47b of the cutting means support portion 47, thereby moving the cutting means support portion 47 back and forth in the Y-axis direction along the Y-axis guide rails 2B, 2B on the base 2.

[0020] A pair of Z-axis guide rails 48, 48 (partially shown by dashed lines) are provided on the side of the cutting means support part 47, parallel to the Z-axis direction (up and down direction) indicated by arrow Z. A Z-axis moving base 46 that supports the spindle unit 41 is slidably attached to the Z-axis guide rails 48. A motor 49 is disposed in the cutting means support part 47, and the rotation of the motor 49 is converted into linear motion via a ball screw (not shown) and transmitted to the Z-axis moving base 46. By rotating the motor 49 forward or backward, the spindle unit 41 is moved back and forth in the Z-axis direction via the Z-axis moving base 46.

[0021] The imaging means 30 includes an upper imaging means 31 that can be positioned on the upper surface 23a side of the transparent plate 23 arranged on the holding means 20, and a lower imaging means 32 that can be positioned on the lower surface side opposite the upper surface 23a. The upper imaging means 31 includes an upper extension 33 extending from the spindle unit 41 and an upper camera 34 arranged facing downward at the tip of the upper extension 33. The lower imaging means 32 includes a lower extension 35 arranged on the horizontal support part 47b of the cutting means support part 47 and extending in the Y-axis direction, and a lower camera 36 arranged facing upward at the tip of the lower extension 35. Although the spindle unit 41 on which the upper camera 34 is arranged moves up and down by the action of the motor 49 as described above, the upper camera 34 and the lower camera 36 are configured to always coincide in X and Y coordinates. Therefore, when the support base 22 is moved in the X-axis direction and the transparent plate 23 is positioned directly below the upper camera 34, the lower camera 36 of the lower imaging means is positioned inside the U-shaped support base 22, and on the lower surface opposite the upper surface 23a of the transparent plate 23. As a result, it is possible to image the workpiece supported on the transparent plate 23 at the same X and Y coordinate positions using either the upper camera 34 or the lower camera 36. When the workpiece is cut, the imaging means 30 images the workpiece to obtain an image, performs alignment, and detects the position of the area of ​​the workpiece to be cut.

[0022] The dicing apparatus 1 is provided with a control means 100. The control means 100 is configured by a computer and includes a central processing unit (CPU) that executes arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program, etc., a readable / writable random access memory (RAM) that temporarily stores images captured by the imaging means 30 and other arithmetic results, etc., an input interface, and an output interface (details not shown). The control means 100 controls each operating unit of the dicing apparatus 1, stores appropriate information including images captured by the imaging means 30, corrects the image quality of the images, and detects the position of the area to be processed on the workpiece by performing pattern matching, etc. based on the images captured by the imaging means 30.

[0023] With reference to FIG. 2, the configuration of the support base 22, the transparent plate 23, and the frame 24 arranged in the holding means 20 will be described in more detail.

[0024] FIG. 2 is an exploded view of the components arranged on the support base 22 that constitute the holding means 20. A ring-shaped sliding member 22b is disposed on the upper surface 22a of the support base 22, which has a U-shaped cross section. The sliding member 22b is formed with a suction groove 22d at its bottom, with a suction hole 22c connected to a suction pump (not shown). A cylindrical member 22e is erected inside the sliding member 22b. The frame 24 that supports the transparent plate 23 is a substantially cylindrical member. The cylindrical member 22e is inserted from below into the hollow portion 24a of the frame 24, and the annular bottom portion 24b of the frame 24 is placed on the sliding member 22b. A driven gear groove 24c is formed on the lower outer periphery of the frame 24, and is configured to mesh with a gear of a rotation transmission unit 26 that transmits rotation from a motor (not shown) disposed on the upper surface 22a of the support base 22. The inner diameter of the hollow portion 24a of the frame body 24 is slightly larger than the outer diameter of the cylindrical member 22e, and a ring-shaped protrusion (not shown) of a slight height that coincides with the suction groove 22d of the sliding member 22b is formed on the bottom portion 24b of the frame body 24. The top surface of the sliding member 22b is coated with a fluororesin, and the frame body 24 is smoothly rotated by the rotation of the rotation transmitting portion 26 being transmitted thereto. A communication hole 24d that penetrates the frame body 24 in the vertical direction is formed. The negative pressure of the suction hole 22c, which communicates with the space formed by the suction groove 22d and the bottom portion of the frame body 24, is transmitted to the upper surface side of the frame body 24 via the communication hole 24d.

[0025] As shown in FIG. 2, a circular transparent plate 23 is placed on the upper surface of the frame 24. The transparent plate 23 has an upper surface 23a that supports the workpiece of this embodiment, more specifically, the wafer 10 shown in FIG. 3, and is made of a transparent plate such as an acrylic resin. The material of the transparent plate is not limited to acrylic resin and may be a transparent glass plate or the like. A ring-shaped suction groove 23b is formed on the outer periphery of the upper surface 23a of the transparent plate 23, and a suction hole 23c that communicates with the communication hole 24d of the frame 24 is formed at the bottom of the suction groove 23b. The suction groove 23b has a diameter slightly larger than that of the wafer 10. When the wafer 10 is fixed on the transparent plate 23, the tape T that supports the wafer 10 is sucked along the outer periphery of the wafer 10 to fix it.

[0026] FIG. 3 shows a wafer 10 to be processed by the dicing apparatus 1 of this embodiment. As shown in the upper part of FIG. 3, the wafer 10 has a plurality of devices 12 formed on its front surface 10a, which is partitioned by planned division lines 14. The wafer 10 is inverted so that its back surface 10b faces upward and its front surface 10a faces downward. The wafer 10 is then positioned in an opening of a frame F having an opening capable of accommodating the wafer 10. The wafer is then attached to an adhesive tape T, and the frame F is attached to the outer periphery of the tape T to form a single unit. The adhesiveness of the tape T may be imparted by applying a glue to its surface, or it may be a thermocompression tape that becomes adhesive upon heating. The thermocompression tape is preferably selected from a polyolefin sheet or a polyester sheet. A heating roller (not shown) incorporating a heating means is used to apply the thermocompression tape. In this embodiment, as shown in FIG. 3, an example is shown in which the wafer 10 is processed while attached to a tape T with the surface 10a facing downward and held in a frame F, but cutting processing may also be performed while the wafer 10 is held in the frame F with the surface 10a facing upward.

[0027] The dicing device 1 of this embodiment has roughly the configuration as described above, and the operation of the dicing device 1 of this embodiment, particularly the operation of the imaging means 30, will be described below.

[0028] As described above, once the wafer 10 is supported on the frame F via the tape T, the side of the tape T with the surface 10a of the wafer 10 attached thereto is placed on the upper surface 23a of the transparent plate 23, and a suction pump (not shown) is operated to generate negative pressure through the suction holes 23c in the suction grooves 23b of the transparent plate 23, sucking the tape T along the outer periphery of the wafer 10, and the frame F is fixed by the clamps 25 as shown in Figure 4.

[0029] Once the wafer 10 is held on the transparent plate 23, the X-axis feed means 60 is operated to move the support table 22 in the X-axis direction, and as shown in FIG. 4, the wafer 10 is moved directly above the lower camera 36 of the lower imaging means 32. Next, the front surface 10a of the wafer 10 is imaged from below by the lower camera 36 through the transparent plate 23 and the tape T, and the image data captured by the lower camera 36 is sent to the control means 100 disposed in the dicing apparatus 1. Once the image data is sent to the control means 100, an image D1 of the imaged area is displayed on the display monitor 60 shown on the left side of FIG. 5. The display monitor 60 displays the intended division lines 14 formed on the front surface 10a of the wafer 10, the devices 12, and patterns P1', P2', and P3' that are candidates for key patterns used during alignment.

[0030] Here, image D1 displayed on display means 60 shown on the left side of Fig. 5 is an image captured through transparent plate 23 and tape T without any correction. Because image D1 was captured through transparent plate 23 and tape T, the brightness of image D1 is significantly different from that of an image captured directly from above on the front surface 10a side of wafer 10 by upper camera 34 having the same function. Note that image D1 shown on display means 60 on the left side of Fig. 5 is indicated by a dashed line for the sake of convenience, but the brightness and image quality of image D1 will vary significantly depending on the materials and transparency of transparent plate 23 and tape T.

[0031] 5, the brightness level x (pixel value) of each pixel constituting image D1 on the left side captured by the lower camera 36 is corrected based on a function 110 (y=f(x)) stored in the control means 100, and the image is output as image D2 shown on the right side. The brightness level x input to function 110 is set to, for example, 0-255 (256 levels), corrected by function 110, converted (normalized) to a brightness y defined by 0-100, and output. A specific example of function 110 used for the correction will be described below.

[0032] 6(a) to 6(c) show an example in which an exponential function that is a conversion formula for gamma correction as shown below is set as the function 110. In FIG. 6(a), the function 110 is set as follows: y=a·(x / 255) γ (a=100,γ=1) (1) Assuming that the layer x (horizontal axis) of each pixel is corrected to the brightness y (vertical axis) shown in the above formula (1). As can be seen from Fig. 6(a), in the case of the above formula (1), the pixel values ​​of the 266 layers are essentially just normalized to brightness 0 to 100 using the coefficient a, and in cases where the transparency of the transparent plate 23 and tape T is extremely high, the image D1 before correction is output as is as the same image.

[0033] In Figure 6(b), γ in the above equation (1) is changed to y=a·(x / 255) γ (a=100,γ=2) (2) The above equation (2) shows the conversion in which the layer x (horizontal axis) of each pixel is corrected to a brightness y (vertical axis) of 0 to 100. As can be seen from Figure 6(b), in the case of the above equation (2), the image D1 before correction is darkened overall, while the high pixel value, i.e., the bright parts are corrected and output to be more emphasized.

[0034] Furthermore, in Figure 6(c), γ in the above equation (1) is changed to y=a·(x / 255) γ (a=100,γ=0.5) (3) The above equation (3) shows the conversion for correcting the layer x (horizontal axis) of each pixel to a brightness y (vertical axis) of 0 to 100. As can be seen from Figure 6(c), in the case of the above equation (3), the image D1 before correction is brightened overall, while the low pixel value, i.e., the dark parts are corrected and output to be more emphasized.

[0035] 6(a) to 6(c) is a correction using an exponential function known as γ (gamma) correction, and an operator determines the function 110 by adjusting the γ value through experiments or the like based on the gamma correction conversion formula described above so that the image quality of image D1 captured by lower camera 36 becomes image D2 that is close to the image quality of an image captured by upper camera 34 of the same area as image D1. Note that the optimal γ value in the conversion formula described above differs depending on the material and transparency of transparent plate 23 and tape T, and can be adjusted as appropriate through experiments or the like.

[0036] The present invention is not limited to using the function 110 set based on the above-described gamma correction conversion formula. For example, the function y = f(x) shown in FIG. 6(d) is a function shown as a conversion table that converts according to the level x so that the image quality of the image D1 captured by the lower camera 36 more closely resembles the image quality of an image captured by the upper camera 34, instead of the above-described conversion formula. The function is set so that low- and high-brightness areas are emphasized without significantly changing intermediate brightness. The conceptual diagram shown in FIG. 6(e) explains functions that can be applied to the above-described FIGS. 6(a) to 6(d), and shows that the function has an adjustment function that limits the range of brightness level x converted by the function y = f(x). More specifically, the range of brightness level x (0 to 255) of the function before correction, indicated by the dashed line, is adjusted by using the touch panel function of the display means 60, by touching with the operator's finger H and moving in the direction of the arrow, so that the converted brightness level x is limited to, for example, 80 to 200 and converted to a brightness y of 0 to 100. By using such a function, correction is performed excluding low brightness areas and high brightness areas, and when correcting the image D1 before correction, areas of too dark and too bright levels, which are thought to be prone to noise, are not reflected as the brightness y of the image D2, making it possible to prevent erroneous recognition of the key pattern when performing alignment.

[0037] As described above, an appropriate function 110 is selected and used to convert the image D1 captured by the lower camera 36 into image D2, and patterns P1' to P3' (see the left side of FIG. 5) that are candidates for key patterns during alignment become patterns P1 to P3 that are suitable for performing alignment (see the right side of FIG. 5). As a result, the image displayed by the display means 60 resembles an image obtained by directly capturing an image of the front surface 10a of the wafer 10 from above, and no sense of incongruity is felt. The data of the key pattern used in image processing during alignment can be shared with the image obtained by capturing an image of the front surface 10a of the wafer 10 from above by the upper camera 34, and by performing alignment, the coordinate positions of the planned dividing lines 14 to be processed can be appropriately detected.

[0038] Once alignment has been performed as described above, the X-axis feed means 60 is operated to move the wafer 10 together with the support table 22 in the X-axis direction until it is positioned directly below the cutting blade 43 of the cutting means 40, as shown in Fig. 7. The cutting means 40 includes a rotating spindle 42 disposed and held in the Y-axis direction indicated by the arrow Y in the figure, and an annular cutting blade 43 held at the tip of the rotating spindle 42.

[0039] When performing the cutting process, the predetermined dividing lines 14 of the wafer 10 are aligned in the X-axis direction based on the position information of the predetermined dividing lines 14 detected by the alignment described above, and are aligned with the cutting blade 43. Next, the cutting blade 43, rotated at high speed, is positioned at a position along the dividing lines 14 aligned in the X-axis direction and cuts from the back surface 10b, while the wafer 10 is processed and fed in the X-axis direction to form cutting grooves 16. Furthermore, the cutting blade 43 is indexed and fed to a position adjacent in the Y-axis direction to the region corresponding to the dividing lines 14 where the cutting grooves 16 are formed and corresponding to the dividing lines 14 where the cutting grooves 16 are not formed, and cutting is performed in the same manner as above to form cutting grooves 16. By repeating these steps, cutting grooves 16 are formed from the back surface 10b along all the dividing lines 14 along the X-axis direction. Next, the rotation transmission unit 26 disposed on the upper surface 22a of the support table 22 is operated to rotate the wafer 10 together with the frame 24 by 90 degrees in the direction indicated by the arrow R, so that the direction perpendicular to the direction in which the cut grooves 16 were previously formed is aligned with the X-axis direction. Next, the above-mentioned cutting process is performed on all of the division lines 14 newly aligned with the X-axis direction, and cut grooves 16 are formed along all of the division lines 14 formed on the wafer 10. After the cutting process is performed in this manner and the wafer 10 is divided into device chips for each device 12, the wafer 10 is transported to the next process or collected in a storage cassette or the like.

[0040] The present invention is not limited to the above-described embodiment. In the above-described embodiment, an example was shown in which the imaging means 30 of the present invention was applied to the dicing apparatus 1, but for example, instead of the cutting means 40, a laser beam application means for applying a laser beam may be provided, alignment may be performed using the imaging means 30, and a laser beam having a wavelength that is absorbed by the wafer 10 may be applied from the back side of the wafer 10 along the division lines 14 formed on the wafer 10, thereby dividing the wafer 10 into individual device chips. [Explanation of symbols]

[0041] 1: Dicing equipment 2: Support base 2A: X-axis guide rail 2B: Y-axis guide rail 20: Holding means 21:X-axis movable plate 22: Support stand 22a:Top surface 22b: sliding member 22c: Suction hole 22d: Suction groove 22e: Cylindrical member 23: Transparent plate 23a:Top surface 23b: Suction groove 23c: Suction hole 24:Frame body 24a: Hollow part 24b: Bottom 24c: Driven gear groove 24d: Communication hole 25: Clamp 26: Rotation transmission part 30: Imaging means 31: Upper imaging means 32: Lower imaging means 33:Top extension 34: Upper camera 35: Lower extension 36: Lower camera 40:Cutting means 41: Spindle unit 42: Rotating spindle 43: Cutting blade 44: Blade cover 45: Cutting water supply means 46:Z-axis moving base 47: Cutting means support part 48: Z-axis guide rail 49: Motor 50:Display means 60: X-axis feed means 61: Motor 62: Ball screw 70: Y-axis feed means 71: Motor 72: Ball screw 100: Control means 110: Function

Claims

1. A processing device comprising: holding means for holding a workpiece; processing means for processing the workpiece held by the holding means; feeding means for relatively feeding the holding means and the processing means; imaging means for imaging the workpiece held by the holding means and detecting an area to be processed; and display means for displaying an image captured by the imaging means, the holding means includes at least a transparent plate having an upper surface for holding the workpiece, and a frame for supporting the transparent plate; the imaging means includes an upper imaging means positioned on the upper surface side of the transparent plate so as to sandwich the transparent plate therebetween, and a lower imaging means positioned on the lower surface side of the transparent plate; A processing device that corrects the brightness of the image captured from the underside of the transparent plate by the lower imaging means using a function to approximate the image quality of the image captured from the above side of the transparent plate by the upper imaging means.

2. 2. The processing device according to claim 1, wherein the function is a conversion formula for gamma correction.

3. 2. The processing device according to claim 1, wherein the range of the brightness levels is adjustable.

Images