Electronic Unit

Abstract

To provide an electronic unit that is suppressed in excessive performance, and therefor can be made compact.SOLUTION: An electronic unit 1 comprises a substrate 2 on which an electronic component 3 is mounted, an electric power source terminal 4 which is mounted on the substrate 2 and supplied with electric power from outside, a plurality of output terminals 5 which are mounted on the substrate 2 and connected to an external load, and a flat plate band-like bus bar 10 which is electrically conductive and mounted on a mount surface 2a of the substrate 2. The substrate 2 has a first wiring pattern 6 which is mounted on the mount surface 2a and connected to the electric power source terminal 4, and a plurality of second wiring patterns 7 which are mounted on the mount surface 2a and connected to the respective output terminals 5. The bus bar 10 is stood along a direction crossing the mount surface 2a, and connected to the first wiring pattern 6 and each of the second wiring patterns 7.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic unit. [Background technology]

[0002] Conventionally, semiconductor relays have increasingly been used in automobiles and other vehicles to supply power to the electrical loads and various systems installed in the vehicle. The semiconductor relays are mounted in the same electronic unit (or on the same board) as a control unit such as a microcomputer (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-3740 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-136114 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in order to reduce the number of man-hours required for vehicle design, it is important to have a MIX-MAX common design for electronic units, from LO grade to HI grade. Therefore, when standardization is promoted too much in the design of boards, wiring patterns with excessive width are used in the trunk lines connecting the power supply terminals and output terminals for LO grade products, for which medium or low current specifications are sufficient. This leaves room for improvement in terms of excessive performance due to the design objectives.

[0005] An object of the present invention is to provide an electronic unit that can be miniaturized by suppressing excessive performance. [Means for solving the problem]

[0006] In order to achieve the above object, an electronic unit according to the present invention includes a substrate on which at least electronic components are mounted, power supply terminals mounted on the substrate and to which power is supplied from an external source, a plurality of output terminals mounted on the substrate and connected to external loads, and a flat, strip-shaped bus bar that is conductive and disposed on a mounting surface of the substrate, wherein the substrate has a first wiring pattern mounted on the mounting surface and connected to the power supply terminals, and a plurality of second wiring patterns mounted on the mounting surface and connected to each of the output terminals, and the bus bar is erected along a direction intersecting the mounting surface and is connected to the first wiring pattern and the second wiring pattern. the bus bar has a plurality of protrusions that protrude from an end portion facing the mounting surface and are fixed to the board by a fixing member while being inserted into holes provided on the mounting surface, and the plurality of protrusions include: a terminal portion that protrudes from the end portion of the bus bar in the direction intersecting with the mounting surface and is connected to one of the first wiring pattern and the second wiring pattern; and a stress absorbing portion that protrudes from the end portion of the bus bar in the direction intersecting with the mounting surface, has a shape different from that of the terminal portion, and has a protrusion portion that branches into two midway in the direction intersecting with the mounting surface. It is characterized by: [Effects of the Invention]

[0007] The electronic unit according to the present invention has the effect of suppressing excessive performance and achieving miniaturization. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of an electronic unit according to an embodiment. [Figure 2] FIG. 2 is a block diagram showing a schematic configuration of the electronic unit according to the embodiment. [Figure 3] FIG. 3 is a perspective view showing a schematic configuration of the bus bar according to the embodiment. [Figure 4] FIG. 4 is a perspective view showing a schematic configuration of an electronic unit in which bus bars are changed in accordance with various electric loads of a vehicle. [Figure 5] FIG. 5 is a perspective view showing a schematic configuration of a bus bar according to a modified example of the embodiment. [Figure 6] FIG. 6 is a perspective view showing a schematic configuration of a bus bar according to another modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiments. That is, the components in the following embodiments include those that can be easily imagined by a person skilled in the art or those that are substantially the same, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention.

[0010] [Embodiment] The electronic unit 1 according to this embodiment is mounted on a vehicle such as an automobile. The electronic unit 1 electrically connects a power supply mounted on the vehicle to a plurality of electrical loads and distributes the power supplied from the power supply to each of the electrical loads. The power supply includes, for example, a battery (not shown). The electrical loads include, for example, components related to vehicle control, headlamps, room lamps, tail / stop lamps, wiper motors, etc.

[0011] In the following description, the X direction in the drawings is the width direction of the electronic unit 1 in this embodiment. The Y direction is the depth direction of the electronic unit 1 in this embodiment, perpendicular to the width direction. The Z direction is the up-down direction of the electronic unit 1 in this embodiment, perpendicular to the width direction and depth direction. These directions are referred to as the "width direction X," "depth direction Y," and "up-down direction Z," respectively. In particular, one of the width directions X is the X1 direction, and the other is the X2 direction. Furthermore, one of the up-down directions Z is the upward direction or Z1 direction, and the other is the downward direction or Z2 direction. In the following description, unless otherwise specified, the electronic unit 1 is described as the direction when it is properly mounted in the device or equipment to which it is to be attached. Furthermore, the up-down direction Z is the direction along the up-down direction of the electronic unit 1, but it may also be along the vertical direction.

[0012] As shown in FIGS. 1 and 4, the electronic unit 1 includes a substrate 2 on which electronic components 3 and the like are mounted, a power supply terminal 4, an output terminal 5, and a bus bar 10.

[0013] Examples of the electronic component 3 include, but are not limited to, fuses, capacitors, relays, resistors, transistors, transformers, coils, IPS (Intelligent Power Switches), ECUs (Electronic Control Units) including microcomputers (MCs), various sensors, LEDs (Light Emitting Diodes), etc. Note that, in Figures 1 and 4, one electronic component 3 is shown, but other electronic components are omitted.

[0014] The substrate 2 has an electronic component 3, a power supply terminal 4, an output terminal 5, and a bus bar 10 mounted on a mounting surface 2a thereof, and constitutes an electric circuit (FIG. 2) that electrically connects these components. As shown in FIG. 1, the substrate 2 is formed in a rectangular shape when viewed from one side of the vertical direction Z (Z1 direction), with each side extending along the width direction X and the depth direction Y. The substrate 2 is a so-called printed circuit board. As shown in FIGS. 1 and 3, the electronic component 3 is mounted, for example, in an area 30 on the mounting surface 2a of the substrate 2. The area 30 has a smaller area than the mounting surface 2a of the substrate 2, and is set to be approximately rectangular when viewed from one side of the vertical direction Z (Z1 direction).

[0015] The substrate 2 has a plurality of holes 2b formed to penetrate the substrate 2 in the thickness direction. The holes 2b may be through holes that penetrate the substrate 2 in the thickness direction, or may be non-through holes that do not penetrate the substrate 2. Lead wires (not shown) of the electronic components 3, power supply terminals 4, output terminals 5, and protrusions of the bus bars 10 are inserted into the holes 2b and electrically connected to the electric circuit by fixing members 40. Note that the fixing members 40 are shown in FIG. 1 but are omitted in FIG. 4.

[0016] The substrate 2 has an insulating layer made of an insulating material such as epoxy resin, glass epoxy resin, paper epoxy resin, ceramic, etc., on which a wiring pattern (printed pattern) is printed using a conductive material such as copper foil, thereby forming an electric circuit. This wiring pattern includes a first wiring pattern 6 and a second wiring pattern 7, which will be described later.

[0017] The power supply terminal 4 and the output terminal 5 are each formed from a conductive material such as metal. The power supply terminal 4 and the output terminal 5 are formed as terminals by bending a flat strip conductor made of a conductive material such as metal as a base material into an L-shape at a predetermined length, or by punching a metal plate as a base material into an L-shape.

[0018] The power supply terminal 4 is mounted on the substrate 2 and receives power from an external source. When viewed from the depth direction Y, the power supply terminal 4 has one extending portion sandwiching an L-shaped bend electrically connected to an external power supply, and the other extending portion inserted into a hole 2b of the substrate 2 and fixed to the mounting surface 2a by a fixing member 40, and electrically connected to an electrical circuit configured on the substrate 2. Here, the fixing member 40 is, for example, solder. Therefore, the power supply terminal 4 is fixed to the mounting surface 2a by soldering or the like.

[0019] The output terminal 5 is mounted on the substrate 2 and is connected to an external electrical load. When viewed from the depth direction Y, the output terminal 5 has one extending portion sandwiching the L-shaped bend electrically connected to the external electrical load, and the other extending portion inserted into the hole 2b of the substrate 2 and fixed to the mounting surface 2a by the fixing member 40, and is electrically connected to the circuit configured on the substrate 2.

[0020] The first wiring pattern 6 is mounted on the mounting surface 2a of the substrate 2 and connected to the power supply terminals 4 and the busbar 10. The first wiring pattern 6 is fixed to the mounting surface 2a by fixing members 40 to the power supply terminals 4 and the busbar 10, respectively, to form electrical connection sites between the power supply terminals 4 and the busbar 10, thereby electrically connecting the power supply terminals 4 and the busbar 10.

[0021] The second wiring pattern 7 is mounted on the mounting surface 2a of the substrate 2 and connected to the bus bar 10 and the output terminal 5. The second wiring pattern 7 is fixed to the mounting surface 2a by fixing members 40 to the bus bar 10 and the output terminal 5, respectively, to form an electrical connection between the bus bar 10 and the output terminal 5, thereby electrically connecting the bus bar 10 and the output terminal 5. The second wiring pattern 7 includes a semiconductor relay 20, a power supply side wiring pattern 21, and an output side wiring pattern 22.

[0022] The semiconductor relay 20 is disposed on an electric path between the power supply terminal 4 and the output terminal 5, and opens and closes the electric path. The semiconductor relay 20 is configured to include at least two terminals, one terminal connected to the power supply side wiring pattern 21 and the other terminal connected to the output side wiring pattern 22, and is capable of interrupting (opening) and conducting (closing) the electrical continuity between the power supply side wiring pattern 21 and the output side wiring pattern 22. The semiconductor relay 20 is configured to include, for example, a plurality of MOS-FETs.

[0023] The power supply side wiring pattern 21 is disposed on an electric path between the power supply terminal 4 and the output terminal 5, and constitutes a part of the electric path. One end of the power supply side wiring pattern 21 is connected to the bus bar 10, and the other end is connected to the semiconductor relay 20.

[0024] The output side wiring pattern 22 is disposed on an electric path between the power supply terminal 4 and the output terminal 5, and constitutes a part of the electric path. One end of the output side wiring pattern 22 is connected to the semiconductor relay 20, and the other end is connected to the output terminal 5.

[0025] The busbar 10 is a conductive member that is electrically conductive and is mounted on the mounting surface 2a of the substrate 2. The busbar 10 is formed from a flat band-like metal material. The first surface 10a and the second surface 10b of the busbar 10 are both formed flat. When the busbar 10 is mounted on the mounting surface 2a of the substrate 2, the busbar 10 stands upright from the mounting surface 2a in a direction intersecting the mounting surface 2a (here, the vertical direction Z). When mounted, the busbar 10 is connected to the first wiring pattern 6 and the second wiring pattern 7.

[0026] The busbar 10 has a length L along its extension direction and a height (width) H along the vertical direction Z when the busbar 10 is mounted on the mounting surface 2a of the circuit board 2. The length L of the busbar 10 is the length between P and Q shown in FIGS. 2 and 3 and between PR shown in FIG. 4. The length L of the busbar 10 is set relatively depending on, for example, the L / O of the power terminal 4 and the output terminal 5 on the circuit board 2. The length L of the busbar 10 is relatively short when the output terminal 5 to which power is to be supplied is located relatively close to the power terminal 4, as in the case of the busbar 10A shown in FIG. 4, and is relatively long when the output terminal 5 to which power is to be supplied is located relatively far away (L1>L2). The height H of the busbar 10 is set relatively depending on, for example, the amount of current to be supplied to various electrical loads designed for the vehicle. The height H of the busbar 10 is relatively low when the amount of current supplied to the various electrical loads designed for the vehicle is relatively small, such as the busbar 10A shown in Figure 4, and is relatively high when the amount of current is relatively large (H1>H2).

[0027] The busbar 10 has a bent portion 13 that is bent in one direction in the thickness direction of the busbar 10. The bent portion 13 is bent at a right angle or an angle close to a right angle when viewed from the up-down direction Z. The busbar 10 has a first main body portion 11 and a second main body portion 12 sandwiching the bent portion 13 therebetween.

[0028] The first body portion 11 is located along the width direction X of the substrate 2 in a mounted state in which the busbar 10 is mounted on the mounting surface 2a of the substrate 2. The first body portion 11 has an end portion 14 on the other side (Z2 direction) of the busbar 10 in the up-down direction Z connected to the first wiring pattern 6. The height of the first body portion 11 in the up-down direction Z is the same as the height of the busbar 10 in the up-down direction Z. The first body portion 11 has a first protrusion 15 formed on the end portion 14.

[0029] The first protrusion 15 protrudes from the end 14 facing the mounting surface 2a of the substrate 2 and is fixed to the substrate 2 by the fixing member 40 while inserted into a hole 2b provided in the mounting surface 2a. The arrangement of the first protrusion 15 at the end 14 of the first body 11 is determined depending on the power terminal 4 connected to the substrate 2. In this embodiment, when the busbar 10 is mounted on the mounting surface 2a of the substrate 2, one first protrusion 15 is formed on one side of the end 14 in the width direction X (X1 direction). The first protrusion 15 is formed, for example, in a quadrangular prism shape. The first protrusion 15 is shorter than the height H of the first body 11 in the up-down direction Z. The first protrusion 15 constitutes a terminal connected to the first wiring pattern 6 and is connected to the power terminal 4 via the first wiring pattern 6, thereby electrically connecting the power terminal 4 and the busbar 10.

[0030] The second body portion 12 is located along the depth direction of the substrate 2 in a mounted state in which the busbar 10 is mounted on the mounting surface 2a of the substrate 2. The second body portion 12 has an end portion 14 on the other side (Z2 direction) of the busbar 10 in the up-down direction Z connected to the second wiring pattern 7. The height of the second body portion in the up-down direction Z is the same as the height of the first body portion in the up-down direction Z. The electronic component 3 is mounted on the mounting surface 2a of the substrate 2 in an area 30 that is at least partially surrounded by the first body portion 11 and the second body portion 12. The second body portion 12 has a second protrusion 16 formed on the end portion 14.

[0031] The second protrusions 16 protrude from the end 14 facing the mounting surface 2a of the substrate 2 and are fixed to the substrate 2 by the fixing member 40 while inserted into holes 2b provided in the mounting surface 2a. The arrangement of the second protrusions 16 at the end 14 of the second body 12 is determined depending on the output terminals 5 connected to the substrate 2. In this embodiment, when the busbar 10 is mounted on the mounting surface 2a of the substrate 2, multiple second protrusions 16 are formed at intervals along the depth direction Y of the end 14. Like the first protrusions 15, the second protrusions 16 are formed in, for example, a quadrangular prism shape. The second protrusions 16 are shorter than the height H of the second body 12 in the up-down direction Z. The second protrusions 16 constitute terminals connected to the second wiring pattern 7 and are connected to the output terminals 5 via the second wiring pattern 7, thereby electrically connecting the busbar 10 and the output terminals 5.

[0032] The output terminal 5 of this embodiment includes five output terminals 5A, 5B, 5C, 5D, and 5E corresponding to various electrical loads designed for the vehicle. For example, when the substrate 2 of the electronic unit 1 configures the electrical circuit shown in Fig. 2, the output terminals 5A to 5E are connected to various different electrical loads.

[0033] The second wiring pattern 7 of this embodiment includes five second wiring patterns 7A, 7B, 7C, 7D, and 7E corresponding to various electrical loads designed for the vehicle. On the other hand, as shown in FIG. 4 , if no electrical load is connected to output terminals 5D and 5E among output terminals 5A to 5E according to various electrical loads designed for the vehicle, the length L2 of busbar 10A in the extension direction becomes relatively shorter than the length L1 of busbar 10, and no second wiring patterns corresponding to output terminals 5D and 5E are formed. In this case, the length of first body portion 11A in the extension direction is the same as the length of first body portion 11, and the length of second body portion 12A in the extension direction becomes relatively shorter than the length of second body portion 12. Furthermore, in this case, the power supply side wiring pattern 21 and the output side wiring pattern 22 remain on the mounting surface 2a of the substrate 2, and the semiconductor relay 20 connecting the power supply side wiring pattern 21 and the output side wiring pattern 22 is not mounted.

[0034] The second protrusion 16 of this embodiment is configured to include five second protrusions 16A, 16B, 16C, 16D, and 16E corresponding to various electrical loads designed for the vehicle (FIG. 3). On the other hand, as shown in FIG. 4, when no electrical load is connected to the output terminals 5D and 5E among the output terminals 5A to 5E according to various electrical loads designed for the vehicle, the length in the extension direction of the second main body portion 12A becomes relatively shorter than the length in the extension direction of the second main body portion 12, as described above, and the second protrusions 16D and 16E corresponding to the output terminals 5D and 5E are not formed.

[0035] The electronic unit 1 according to the present embodiment described above includes a conductive, flat, strip-shaped bus bar 10 arranged on the mounting surface 2a of the substrate 2, and the substrate 2 has a first wiring pattern 6 mounted on the mounting surface 2a and connected to the power supply terminals 4, and a plurality of second wiring patterns 7 mounted on the mounting surface 2a and connected to each of the output terminals 5. The bus bar 10 is erected in a direction intersecting the mounting surface 2a and is connected to the first wiring pattern 6 and the second wiring pattern 7.

[0036] With the above configuration, the electronic unit 1 can be connected by the busbar 10 without using a wide wiring pattern (copper foil pattern) for the trunk portion connecting, for example, the power supply terminal 4 and the output terminal 5. This allows the board size to be standardized without changing depending on, for example, the amount of current flowing between the power supply terminal 4 and the output terminal 5 or the number of electrical loads connected to the output terminal 5. Furthermore, since the wiring pattern for the trunk portion routed on the mounting surface 2a of the board 2 is no longer necessary, the board 2 can be made smaller. Furthermore, it is possible to avoid having to make the board 2 multi-layered in order to route the trunk portion. Furthermore, the height H of the busbar 10 in the vertical direction Z can be changed depending on the amount of current, and the length L of the busbar 10 can be changed depending on the number of electrical loads, making it possible to accommodate a wide range of grades from LO to HI.

[0037] Furthermore, since the busbar 10 of the electronic unit 1 is made of a conductive metal member, it has good thermal conductivity and is expected to efficiently dissipate heat generated by the semiconductor relay 20 and the like into the air. Furthermore, since the busbar 10 of the electronic unit 1 is erected in a direction intersecting the mounting surface 2a of the substrate 2, contact and interference between the busbar 10 and the electronic components 3 can be minimized.

[0038] Furthermore, in the electronic unit 1 according to this embodiment, the busbar 10 has one bent portion 13 that bends in one direction in the thickness direction of the busbar 10. This allows the busbar 10 of the electronic unit 1 to be positioned on the substrate 2 more stably and easily than a busbar without a bent portion.

[0039] The electronic unit 1 according to the embodiment of the present invention described above is not limited to the above embodiment, and various modifications are possible within the scope of the claims.

[0040] In the above description, in the busbar 10, the first protrusions 15 formed on the first body portion 11 are conductively connected to the power supply terminals 4 via the first wiring pattern 6, and the second protrusions 16 formed on the second body portion 12 are conductively connected to the output terminals 5 via the second wiring pattern 7. However, this is not limited to this. FIG. 5 shows an example of a modified example of the busbar 10. The busbar 10B according to the modified example shown in FIG. 5 differs from the busbar 10 in that the first body portion 11B has a plurality of first protrusions 15, and the second body portion 12B has a plurality of second protrusions 16.

[0041] The plurality of first protrusions 15 are configured to include first stress absorbing portions 15S and first terminal portions 15T. The plurality of second protrusions 16 are configured to include second stress absorbing portions 16S and second terminal portions 16T.

[0042] The first stress-absorbing portions 15S are formed on both sides of the first main body portion 11B in the extension direction. The second stress-absorbing portions 16S are formed on both sides of the second main body portion 12B in the extension direction. The pair of first stress-absorbing portions 15S have the same shape as the second stress-absorbing portions 16S. That is, each first stress-absorbing portion 15S protrudes from the other end 14 of the busbar 10 in the up-down direction Z and has a protruding portion that branches into two midway along the up-down direction Z. Each protruding portion is formed, for example, in the shape of a rectangular pillar. When the busbar 10 is mounted on the mounting surface 2a of the substrate 2, the first stress-absorbing portion 15S is inserted into a hole 2b provided in the mounting surface 2a and fixed to the substrate 2 by a fixing member 40.

[0043] In this embodiment, the first stress absorbing portion 15S and the second stress absorbing portion 16S are fixed to the substrate 2 by the fixing member 40 while being inserted into the hole 2b in the mounting surface 2a, but the wiring patterns to be fixed are not electrically connected to, for example, the power supply terminal 4 or the output terminal 5. In other words, the first stress absorbing portion 15S and the second stress absorbing portion 16S are only fixed to the substrate 2.

[0044] The first terminal portion 15T is disposed between a pair of first stress absorbing portions 15S and is connected to the first wiring pattern 6. The arrangement of the first terminal portion 15T at the end portion 14 of the first body portion 11B is set in accordance with the power supply terminal 4 connected to the substrate 2. The second terminal portion 16T is disposed between a pair of second stress absorbing portions 16S and is connected to the second wiring pattern 7. The arrangement of the second terminal portion 16T at the end portion 14 of the second body portion 12B is set in accordance with the output terminal 5 connected to the substrate 2. For example, the five second terminal portions 16T correspond to the five second protrusions 16A to 16E described above.

[0045] In the electronic unit 1 according to the modified example, the busbar 10B has a pair of first stress-absorbing portions 15S formed on the first body portion 11B, and the first stress-absorbing portions 15S are formed at both ends of the first body portion 11B in the extension direction. The busbar 10B also has a pair of second stress-absorbing portions 16S formed on the second body portion 12B, and the second stress-absorbing portions 16S are formed at both ends of the second body portion 12B in the extension direction. As a result, when the busbar 10B is connected and fixed to the board 2, the first stress-absorbing portions 15S and the second stress-absorbing portions 16S absorb stress generated due to the difference in thermal contraction rate between the board 2 and the busbar 10B, thereby maintaining a stable connection between the busbar 10B and the board 2.

[0046] In the above embodiment, the first stress absorbing portion 15S and the second stress absorbing portion 16S are not electrically connected to the power supply terminal 4, the output terminal 5, etc., and are only fixed to the substrate 2, but the present invention is not limited to this. In this case, the first stress absorbing portion 15S may be connected to the first wiring pattern 6 and connected to the power supply terminal 4 via the first wiring pattern 6 in a mounted state in which the busbar 10 is mounted on the mounting surface 2a of the substrate 2. Furthermore, the second stress absorbing portion 16S may be connected to the second wiring pattern 7 and connected to the output terminal 5 via the second wiring pattern 7 in the above mounted state.

[0047] In the above description, both the first surface 10a and the second surface 10b of the busbar 10B are flat, but this is not limiting. A busbar 10C according to a modification of this embodiment differs from the busbar 10B in that the surface has an uneven shape, as shown in FIG.

[0048] The busbar 10C has, for example, protrusions 17 formed to protrude outward from the second surface 10b (the side opposite to the first surface 10a). For example, four protrusions 17 are formed on the first main body portion 11C, and three are formed on the second main body portion 12C. The seven protrusions 17 are formed at intervals along the extension direction. The protrusions 17 have a semicircular cross section in a direction perpendicular to the extension direction of the busbar 10C. The protrusions 17 have a substantially circular shape when viewed from a direction perpendicular to the second surface 10b (or the first surface 10a). The protrusions 17 are formed in a convex shape when viewed from a direction perpendicular to the second surface 10b, but are formed in a concave shape when viewed from a direction perpendicular to the first surface 10a.

[0049] With the above configuration, the electronic unit 1 according to another modification has a busbar with an uneven surface. This allows the uneven surface of the busbar 10C to diffuse the airflow over the board 2 that has been heated by heat generated in the electronic components 3 mounted on the board 2 and the busbar 10C. This makes it possible to homogenize the temperature around the electronic unit 1. Furthermore, the surface area of ​​the busbar 10C can be increased, increasing the contact area with the air and enabling heat removal from the busbar 10C.

[0050] In the above embodiment and modified examples, the busbar 10 has one bent portion 13, but is not limited to this and may have two or more bent portions 13.

[0051] In the above embodiments and variations, the number of output terminals 5A to 5E, second wiring patterns 7A to 7E, and second protrusions 16A to 16E, together with the height H in the vertical direction Z and the length L in the extension direction of the busbar 10, depends on the various electrical loads designed for the vehicle, and is not limited to five.

[0052] In the above embodiment and modified examples, the protrusions 17 are formed to protrude from the second surface 10b toward the side opposite to the first surface 10a, but this is not limited thereto. The protrusions 17 may be formed to protrude from the first surface 10a toward the side opposite to the second surface 10b. The multiple protrusions 17 are formed to protrude in the same direction relative to the busbar 10C, but this is not limited thereto. For example, the multiple protrusions 17 may be formed so that adjacent protrusions 17 along the extension direction protrude in different directions. The multiple protrusions 17 are formed at intervals along the extension direction of the busbar 10C, but this is not limited thereto and the multiple protrusions 17 may be formed consecutively without any intervals. The number of protrusions 17 is not limited to that shown in the drawings. The cross-sectional shape of the protrusions 17 in a direction perpendicular to the extension direction of the busbar 10C is not limited to a semicircular shape. [Explanation of symbols]

[0053] 1 Electronic Unit 2 boards 2a Mounting surface 3. Electronic Components 4 Power terminal 5 Output terminal 6 First wiring pattern 7 Second wiring pattern 21 Power supply wiring pattern 22 Output side wiring pattern 10 Bus Bar 11 First main body part 12 Second main body part 13 Bend 14 End 15 1st protrusion 15S First stress absorption section 15T First terminal 16 Second protrusion 16S Second stress absorption section 16T 2nd terminal section 17 Convex part 20 Solid State Relay 30 areas 40 Fixing member

Claims

1. a substrate on which at least electronic components are mounted; a power supply terminal mounted on the substrate and receiving power from an external source; a plurality of output terminals mounted on the substrate and connected to external loads; a conductive flat band-shaped bus bar disposed on the mounting surface of the board; The substrate is a first wiring pattern mounted on the mounting surface and connected to the power supply terminal; a plurality of second wiring patterns mounted on the mounting surface and connected to the output terminals, The bus bar is the wiring pattern is provided in a direction intersecting the mounting surface and is connected to the first wiring pattern and the second wiring pattern; The bus bar is a plurality of protrusions protruding from an end portion facing the mounting surface and fixed to the substrate by a fixing member in a state where the protrusions are inserted into holes formed in the mounting surface; The plurality of protrusions are a terminal portion formed to protrude from an end portion of the bus bar in the direction intersecting the mounting surface and connected to one of the first wiring pattern and the second wiring pattern; a stress absorbing portion that protrudes from the end of the bus bar in the direction intersecting with the mounting surface, has a shape different from that of the terminal portion, and has a protruding portion that branches into two midway in the direction intersecting with the mounting surface, An electronic unit characterized by:

2. The bus bar is The bus bar has at least one bent portion that is bent in one direction in the plate thickness direction of the bus bar. The electronic unit according to claim 1 .

3. The bus bar is a first main body portion and a second main body portion sandwiching the bent portion; The first main body portion is Among the plurality of protrusions, there are a plurality of first protrusions including a pair of first stress absorbing portions formed at both ends of the first main body portion in the extension direction, and a first terminal portion disposed between the pair of first stress absorbing portions and connected to the first wiring pattern, The second main body portion is Among the plurality of protrusions, there are a plurality of second protrusions including a pair of second stress absorbing portions formed at both ends of the second main body portion in the extension direction, and a plurality of second terminal portions disposed between the pair of second stress absorbing portions and respectively connected to the second wiring pattern. The electronic unit according to claim 2 .

4. The electronic component is On the mounting surface, the first body portion and the second body portion are disposed in an area surrounded by the first body portion and the second body portion. The electronic unit according to claim 3 .

5. The bus bar is The substrate has a first surface formed in a flat shape, a second surface formed in a flat shape on the back side of the first surface, and a convex portion formed by protruding from the second surface toward the first surface, The protrusions have a semicircular cross section and are arranged at intervals along the extending direction of the bus bar. The electronic unit according to any one of claims 1 to 4.

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