Circuit Protection Elements

Abstract

To provide a circuit protection element capable of suppressing the change of an exterior appearance.SOLUTION: A circuit protection element 10 comprises: each of electrode parts 12 and 14; an element part 16 that is provided between both of the electrode parts 12 and 14; a plate body 18 that is made of an insulation body arranged along the element part 16; and an outer casing member 20 that covers the element part 16 and the plate body 18. A heat transmission when the element part 16 is melted is blocked by the plate body 18, and thus, the heat transmission to the outer casing member 20 at the time of melting is suppressed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a circuit protection element. [Background technology]

[0002] Patent Document 1 discloses a circuit protection element. This circuit protection element includes a pair of electrodes, and a metal wire is disposed between the electrodes. One end of the metal wire is joined to one electrode, and the other end of the metal wire is joined to the other electrode.

[0003] A low-melting glass body is provided around the metal wire, and the low-melting glass body is covered with a synthetic resin. The synthetic resin is molded with a molded resin body, and a molded case is formed by the molded resin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-76728 Summary of the Invention [Problem to be solved by the invention]

[0005] In such a circuit protection element, in order to allow a large current to pass through, it is necessary to make the metal wire thicker.

[0006] If the metal wire is made thicker, the impact when the metal wire melts due to an overcurrent exceeding the allowable limit will be greater, and the amount of heat generated from the metal wire when it melts will also be greater.

[0007] This increases the amount of heat transferred to the mold case when the wire is cut. The low-melting-point glass melts due to the heat generated during cutting, causing thermal expansion, increasing the internal pressure around the metal wire. Furthermore, the impact when the metal wire is cut increases.

[0008] These factors may cause deformation of the molded case, making it difficult to maintain the external shape of the circuit protection element.

[0009] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a circuit protection element that can suppress changes in its external shape. [Means for solving the problem]

[0010] A circuit protection element according to a first aspect of the present invention includes a pair of electrode portions, an element portion provided between the electrode portions, a plate body made of an insulator and arranged along the element portion, and an exterior member covering the element portion and the plate body. The plate is fixed to the element portion via an inorganic adhesive, A distance D1 from the side surface of the element portion to the side surface of the adhesive is greater than a distance D2 from the element portion to the plate body. . In addition, a circuit protection element of a second aspect of the present invention comprises a pair of electrode portions, an element portion provided between the two electrode portions, a plate body made of an insulator arranged along the element portion, and an exterior member covering the element portion and the plate body, wherein the exterior member is made of a molding material that adheres to the plate body and the electrode portions. Furthermore, a circuit protection element according to a third aspect of the present invention includes a pair of electrode portions, an element portion provided between the electrode portions, a plate body made of an insulator and arranged along the element portion, and an exterior member covering the element portion and the plate body, the plate body having a groove on its surface. . [Effects of the Invention]

[0011] In the circuit protection element of this embodiment, a plate is disposed along an element portion provided between electrode portions, and the plate is disposed between the element portion and the exterior member.

[0012] Therefore, the plate blocks the transfer of heat when the element melts due to an overcurrent, thereby suppressing the transfer of heat to the exterior member when the element melts, thereby preventing deformation of the exterior member due to the heat when the element melts.

[0013] Furthermore, even if the member provided on the outer periphery of the element unit melts and thermally expands, the plate can prevent the transmission of pressure caused by thermal expansion.Furthermore, the plate can prevent the transmission of impact when the metal wire melts.As a result, deformation of the exterior member can be suppressed compared to when the pressure caused by thermal expansion or the impact when the metal wire melts is directly transmitted to the exterior member.

[0014] Therefore, it is possible to suppress changes in the external shape of the circuit protection element. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a cross-sectional view showing a circuit protection element according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line BB in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a circuit protection element according to a second embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing a circuit protection element according to a third embodiment. [Figure 6] FIG. 6 is a plan view showing a plate body of a circuit protection element according to a third embodiment. [Figure 7] FIG. 7 is a plan view showing a plate body of a circuit protection element according to a fourth embodiment. [Figure 8] FIG. 8 is a plan view showing a plate body of a circuit protection element according to a fifth embodiment. [Figure 9] FIG. 9 is a plan view showing a plate body of a circuit protection element according to a sixth embodiment. [Figure 10] FIG. 10 is a plan view showing a plate body of a circuit protection element according to the seventh embodiment. [Figure 11] FIG. 11 is a plan view showing a plate body of a circuit protection element according to the eighth embodiment. [Figure 12] FIG. 12 is a cross-sectional view showing a circuit protection element according to a ninth embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along line CC in FIG. [Figure 14] FIG. 14 is a cross-sectional view showing a circuit protection element according to a tenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016] First Embodiment The first embodiment will be described with reference to the drawings.

[0017] Fig. 1 is a cross-sectional view showing a circuit protection element 10 according to a first embodiment. Fig. 2 is a cross-sectional view taken along line AA in Fig. 1. Fig. 3 is a cross-sectional view taken along line BB in Fig. 2.

[0018] The circuit protection element 10 is, for example, an element that allows current to flow through a circuit while preventing overcurrent from passing through. The circuit protection element 10 behaves as a conductor when a current within a predetermined range passes through. On the other hand, the circuit protection element 10 protects the circuit by melting the fusible conductor and interrupting the current when a current exceeding the allowable amount passes through.

[0019] Electric vehicles (EVs) and the like are provided with large-current circuits through which large currents flow, and these large-current circuits also use circuit protection elements 10. Such circuit protection elements 10 are required to be small in size and have the performance to allow the passage of large currents.

[0020] As shown in FIGS. 1 and 2, the circuit protection element 10 is formed to a size that allows it to be mounted on a printed wiring board, for example.

[0021] The circuit protection element 10 is formed in a horizontally elongated rectangular parallelepiped shape. The upper surface of the circuit protection element 10 in the height direction H constitutes a rectangular upper surface 10A, and the lower surface in the height direction H constitutes a rectangular lower surface 10B.

[0022] The circuit protection element 10 has a surface on one side in the longitudinal direction L that forms a rectangular first side surface 10C, and a surface on the other side in the longitudinal direction L that forms a rectangular second side surface 10D. The circuit protection element 10 also has a surface on one side in the short side direction S that forms a rectangular third side surface 10E, and a surface on the other side in the short side direction S that forms a rectangular fourth side surface 10F.

[0023] This circuit protection element 10 comprises a first electrode portion 12 and a second electrode portion 14, an element portion 16 provided between the two electrode portions 12 and 14, a plate body 18 made of an insulator arranged along the element portion 16, and an exterior member 20 covering both the element portion 16 and the plate body 18.

[0024] Each of the electrode sections 12, 14 and the element section 16 is formed from a single metal plate, and each of the electrode sections 12, 14 and the element section 16 is formed as a single unit. This reduces the risk of disconnection between the element section 16 and each of the electrode sections 12, 14 due to repeated energization or vibrations input during use, compared to when the element section 16 is formed as a separate body and joined to each of the electrode sections 12, 14.

[0025] Specifically, the electrodes 12, 14 and the element 16 are formed from long metal plates. The metal plates are made of phosphor bronze, which has low resistivity. The phosphor bronze that forms the electrodes 12, 14 and the element 16 is suitable for carrying large currents.

[0026] 2, the metal plate has rectangular cutouts on both side edges facing inward at the center in the longitudinal direction L. As a result, a narrow portion 17 that is narrower in width than each of the electrode portions 12, 14 is formed at the center in the longitudinal direction L of the metal plate, and this narrow portion 17 constitutes the element portion 16.

[0027] The area on one side of the metal plate separated by the narrow portion 17 constitutes a first electrode portion 12 that is wider than the narrow portion 17. The area on the other side of the metal plate separated by the narrow portion 17 constitutes a second electrode portion 14 that is wider than the narrow portion 17.

[0028] (Element section) The element portion 16 has a narrower width and a smaller cross-sectional area than the electrode portions 12, 14. Therefore, the current density of the current flowing between the electrode portions 12 and 14 becomes higher in the element portion 16. As a result, when a current exceeding a predetermined current value flows through the element portion 16, the element portion 16 generates heat and melts.

[0029] The element portion 16 is disposed at the center of the circuit protection element 10 in the longitudinal direction L and in the lateral direction S. The element portion 16 is also disposed at the center of the circuit protection element 10 in the height direction H.

[0030] (electrode part) As shown in FIG. 1, an end of the first electrode portion 12 extends from the first side surface 10C of the circuit protection element 10, and this extending portion forms a first extending portion 22.

[0031] A base end of first extending portion 22 is bent along first side surface 10C, and first extending portion 22 includes first side surface extending portion 24 extending along first side surface 10C. A tip end of first side surface extending portion 24 of first extending portion 22 is bent along lower surface 10B, and first extending portion 22 includes first lower surface extending portion 26 extending along lower surface 10B.

[0032] An end of the second electrode portion 14 extends from the second side surface 10D of the circuit protection element 10, and this extending portion constitutes a second extending portion 30.

[0033] A base end of the second extending portion 30 is bent along the second side surface 10D, and the second extending portion 30 includes a second side surface extending portion 32 extending along the second side surface 10D. A tip end of the second side surface extending portion 32 of the second extending portion 30 is bent along the lower surface 10B, and the second extending portion 30 includes a second lower surface extending portion 34 extending along the lower surface 10B.

[0034] As a result, the first lower surface extension 26 of the first electrode portion 12 and the second lower surface extension 34 of the second electrode portion 14 are provided on the lower surface 10B of the circuit protection element 10.

[0035] By arranging the bottom surface 10B of this circuit protection element 10 facing the printed wiring board, the bottom extensions 26, 34 of the electrodes 12, 14 can be aligned with the lands of the printed wiring board. Then, by joining the bottom extensions 26, 34 of the electrodes 12, 14 to the lands of the printed wiring board, the circuit protection element 10 can be surface-mounted on the printed wiring board.

[0036] (Plate) The plate 18 includes a first plate 40 arranged on the upper side, which is one side of the element portion 16, and a second plate 42 arranged on the lower side, which is the other side of the element portion 16.

[0037] Each of the plates 40, 42 has a rectangular shape, and both plates 40, 42 have the same shape. Each of the plates 40, 42 is made of a material different from that of the exterior member 20, and when an exterior member 20 having the same thickness as each of the plates 40, 42 is assumed, the strength of each of the plates 40, 42 is higher than that of the assumed exterior member 20.

[0038] Each of the plates 40, 42 is made of an inorganic material, and carbonization of each of the plates 40, 42 is suppressed. Examples of the inorganic material that makes up each of the plates 40, 42 include ceramics such as alumina, and inorganic materials made of glass.

[0039] 2, each of the plates 40, 42 covers the entire length of the element portion 16, and also covers a portion of the first electrode portion 12 and a portion of the second electrode portion 14. The width H1 of each of the plates 40, 42 is wider than the width H2 of the element portion 16 and narrower than the width H3 of each of the electrode portions 12, 14.

[0040] The distance from each side edge of each plate body 40, 42 to the third side surface 10E or the fourth side surface 10F of the circuit protection element 10 is greater than the distance from each side edge of each electrode portion 12, 14 to the third side surface 10E or the fourth side surface 10F.

[0041] The upper and lower portions of the exterior member 20, which are separated by the electrode portions 12, 14 and the element portion 16, are made up of first connecting portions 46 formed on both sides of the plates 40, 42 and the element portion 16, and second connecting portions 48 formed on both sides of the electrode portions 12, 14. The width dimension in the short side direction S of the first connecting portion 46 is larger than the width dimension in the short side direction S of the second connecting portion 48.

[0042] As shown in FIG. 3, the plates 40 and 42 are fixed to the element section 16 and the electrode sections 12 and 14 via an inorganic adhesive 50 .

[0043] Specifically, the first plate 40 and the second plate 42 are arranged so that their respective back surfaces 40A, 42A face the element portion 16, and their respective front surfaces 42B, 42B face away from the element portion 16. The back surfaces 40A, 42A of the plates 40, 42 are fixed to the element portion 16 with adhesive 50, and the two plates 40, 42 sandwich the element portion 16 from above and below.

[0044] Each of the plates 40, 42 suppresses the transmission of heat generated when the element section 16 melts. Each of the plates 40, 42 also suppresses the transmission of pressure due to thermal expansion that may occur when the element section 16 melts. Furthermore, each of the plates 40, 42 suppresses the transmission of impact that occurs when the element section 16 melts.

[0045] Therefore, each of the plates 40, 42 can be rephrased as a buffer member that suppresses the transmission of pressure or impact to the exterior member 20, or as an explosion-proof member that suppresses deformation and destruction of the exterior member 20 due to pressure.

[0046] The element portion 16 is surrounded by the solidified adhesive 50. A distance D1 from the side surface of the element portion 16 to the side surface of the adhesive 50 is greater than a distance D2 from the upper or lower surface of the element portion 16 to each of the plates 40, 42.

[0047] An inorganic material is used for the adhesive 50 that secures the plates 40, 42. This prevents the adhesive 50 from carbonizing even when it is subjected to heat when the element 16 is melted, and prevents the melted element 16 from being electrically connected via carbide.

[0048] (exterior materials) The exterior member 20 is composed of a molding material 52 that surrounds the two plates 40 and 42, the electrodes 12, 14, and the adhesive 50 so as to be in close contact with them. The exterior member 20 forms the outer shape of the circuit protection element 10.

[0049] The molding material 52 is made of, for example, a synthetic resin, and the exterior member 20 made of the molding material 52 covers the electrode portions 12, 14, the element portion 16, and the plates 40, 42 from the outer periphery.

[0050] In this embodiment, the case where the exterior member 20 is made of the molding material 52 will be described, but the present embodiment is not limited to this. For example, the exterior member 20 may be in the form of a container that covers the element portion 16 and the plates 40, 42.

[0051] (Action and effect) Next, the effects of this embodiment will be described.

[0052] The circuit protection element 10 of this embodiment comprises each electrode portion 12, 14, an element portion 16 provided between the two electrode portions 12 and 14, a plate body 18 made of an insulator arranged along the element portion 16, and an exterior member 20 covering the element portion 16 and the plate body 18.

[0053] According to this configuration, the plate 18 is arranged along the element portion 16 provided between the electrode portions 12 and 14 , and the plate 18 is arranged between the element portion 16 and the exterior member 20 .

[0054] Therefore, the transfer of heat when the element part 16 melts due to an overcurrent is blocked by the plate body 18. This suppresses the transfer of heat to the exterior member 20 when the element part 16 melts, thereby suppressing deformation of the exterior member 20 due to the heat when the element part 16 melts.

[0055] Furthermore, even if a material such as the adhesive 50 provided on the outer periphery of the element portion 16 or the molding material 52 that has entered between the plates 40 and 42 melts and thermally expands, the plate 18 can prevent the transmission of pressure caused by the thermal expansion. Furthermore, the plate 18 can suppress the transmission of the impact that occurs when the element portion 16 melts.

[0056] Therefore, deformation of the exterior member 20 can be suppressed compared to when the pressure caused by thermal expansion or the impact caused at the time of fusing is directly transmitted to the exterior member 20 .

[0057] Therefore, it is possible to prevent the external shape of the circuit protection element 10 from changing.

[0058] In particular, even if the circuit protection element 10 employs an element portion 16 capable of conducting large currents to enable use in a large current circuit, it is possible to suppress changes in the external shape of the circuit protection element 10.

[0059] In addition, in the circuit protection element 10 of this embodiment, the plate body 18 includes a first plate body 40 arranged on one side of the element portion 16 and a second plate body 42 arranged on the other side of the element portion 16.

[0060] According to this configuration, the first plate 40 can suppress shape changes on one side of the element portion 16, and the second plate 42 can suppress shape changes on the other side of the element portion 16.

[0061] This eliminates the need for a deformation suppression structure on the other side of the element portion 16, as is the case when the plate body 18 is disposed only on one side of the element portion 16. Specifically, it is not necessary to maintain the appearance quality of the other side of the circuit protection element 10 by forming the exterior member 20 on the other side of the element portion 16 thick or by disposing the other side of the element portion 16 on the printed wiring board side, thereby improving convenience.

[0062] In the circuit protection device 10 of this embodiment, the plate 18 is made of an inorganic material.

[0063] According to this configuration, the plate body 18, which is arranged along the element part 16 and can be subjected to the heat when the element part 16 melts, is made of an inorganic material, and carbonization of the plate body 18 is suppressed even when subjected to the heat when the element part 16 melts.

[0064] Therefore, it is possible to prevent the plate 18 from being carbonized by the heat generated during the fusing process, and the blown element portion 16 from being electrically connected via the carbonized plate 18.

[0065] In the circuit protection element 10 of this embodiment, the element portion 16 is formed of a narrow portion 17 formed on a long metal plate. The electrode portion includes a first electrode portion 12 formed on one side of the metal plate separated by the narrow portion 17, and a second electrode portion 14 formed on the other side of the metal plate separated by the narrow portion 17.

[0066] According to this configuration, the element portion 16 and each of the electrode portions 12, 14 can be integrally formed.

[0067] Therefore, compared to when the element portion 16 formed separately is joined to each of the electrode portions 12, 14, the joining operation between the element portion 16 and each of the electrode portions 12, 14 is not required.

[0068] Furthermore, compared to joining the element portion 16 to each electrode portion 12, 14, it is possible to suppress breaks that may occur between the element portion 16 and each electrode portion 12, 14 due to repeated current application to the circuit protection element 10 or vibrations input during use.

[0069] In the circuit protection device 10 of this embodiment, the element portion 16 is made of phosphor bronze.

[0070] According to this configuration, the element portion 16 is made of phosphor bronze, which has a low specific resistance, and therefore, the current that can be passed between the electrode portions 12 and 14 can be increased.

[0071] In the circuit protection device 10 of this embodiment, the plate 18 is fixed to the element portion 16 via an inorganic adhesive 50 .

[0072] With this configuration, the heat generated when the element portion 16 melts is transferred to the plate body 18 via the adhesive 50, thereby improving the durability of the plate body 18. Furthermore, since the adhesive 50 is present between the element portion 16 and the plate body 18, the circuit protection element 10 is more resistant to shocks that may occur when the element portion 16 melts.

[0073] The adhesive 50 that fixes the plate body 18 to the element portion 16 is made of an inorganic material, and carbonization of the adhesive 50 when subjected to heat during fusing is suppressed.

[0074] Therefore, it is possible to prevent a situation in which the adhesive 50 is carbonized by the heat generated during melting, and the melted element portion 16 is electrically connected via the carbonized adhesive 50 .

[0075] Second Embodiment Fig. 4 is a cross-sectional view showing a circuit protection element 60 according to a second embodiment, and the second embodiment will be described using Fig. 4. Note that parts that are the same as or equivalent to those in the first embodiment are given the same reference numerals and will not be described again, and only different parts will be described.

[0076] The circuit protection element 60 according to the second embodiment differs from the circuit protection element 10 according to the first embodiment in that the thickness T of each of the plates 62, 64 is different.

[0077] That is, in the circuit protection element 60 according to the second embodiment, the thickness T of each of the plates 62, 64 is set to 100 μm or less.

[0078] The lower limit of the thickness T of each of the plate bodies 62, 64 is determined by the material forming each of the plate bodies 62, 64. The range of this thickness T is, for example, 50 μm or more and 100 μm or less. In this embodiment, the thickness T of each plate body is 100 μm.

[0079] (Action and effect) Next, the effects of this embodiment will be described.

[0080] In this embodiment, the same functions and effects as those of the first embodiment can be obtained for the same or equivalent parts as those of the first embodiment.

[0081] In the circuit protection element 10 of this embodiment, each of the plates 62, 64 has a thickness T of 100 μm or less.

[0082] According to this configuration, the thickness T of each of the plates 62, 64 is 100 μm or less, which makes it possible to make each of the plates 62, 64 easily breakable due to pressure caused by thermal expansion when the element part 16 melts or due to impact when the element part 16 melts. By breaking, each of the plates 62, 64 absorbs the energy released when melting.

[0083] Therefore, compared to a circuit protection element in which the plate thickness T exceeds 100 μm and the plate body 18 is less likely to crack, the deformation prevention effect of the exterior member 20 can be improved.

[0084] Third Embodiment Fig. 5 is a cross-sectional view showing a circuit protection element 70 according to the third embodiment. Fig. 6 is a plan view showing the plate 18 of the circuit protection element 70 according to the third embodiment. The third embodiment will be described using Figs. 5 and 6. Note that parts that are the same as or equivalent to those in the above-described embodiments will be given the same reference numerals and their description will be omitted, and only different parts will be described.

[0085] The circuit protection element 70 according to the third embodiment differs from the circuit protection elements 10 and 60 according to the above-described embodiments in the structure of the surfaces 72A and 74A of the plates 72 and 74.

[0086] That is, the plates 72, 74 of the circuit protection element 70 according to the third embodiment have grooves 76, 78 on their surfaces 72A, 74A.

[0087] As shown in Figure 6 (only one plate 72 is shown), the grooves 76 (78) on the surface 72A (74A) of each plate 72 (74) are composed of long grooves 80 extending in the longitudinal direction L of each plate 72 (74) and short grooves 82 extending in the lateral direction S of each plate 72 (74). The long grooves 80 and the short grooves 82 intersect (are perpendicular to each other) at the center of each plate 72 (74), and this intersection 84 is positioned so as to be located at the center of the element section 16.

[0088] Each of the grooves 80, 82 has a V-shaped cross section, and the thickness of each of the plates 72 (74) is thin at the bottom of each of the grooves 80, 82.

[0089] (Action and effect) Next, the effects of this embodiment will be described.

[0090] In this embodiment, the same functions and effects as those of the above-described embodiments can be obtained for the same or equivalent parts as those of the above-described embodiments.

[0091] Furthermore, the plates 72, 74 of the circuit protection element 70 of this embodiment have grooves 76, 78 on their surfaces 72A, 74A.

[0092] According to this configuration, each of the plates 72, 74 has grooves 76, 78 on the surfaces 72A, 74A. Therefore, even if the thickness of each of the plates 72, 74 is not reduced, each of the plates 72, 74 can be made more likely to break due to pressure caused by thermal expansion when the element section 16 melts or due to impact when the element section 16 melts. By breaking, each of the plates 72, 74 absorbs the energy released when the element section 16 melts.

[0093] Therefore, compared to when a plate having no grooves on the surface and being less likely to crack is used, the deformation prevention effect of the exterior member 20 can be improved.

[0094] In this embodiment, the long groove 80 and the short groove 82 intersect at the center of each plate 72 , 74 , and this intersection 84 is disposed so as to be located at the center of the element portion 16 .

[0095] Therefore, compared to when the intersection 84 is located at a position away from the center of the element portion 16, each of the plate members 72, 74 can be made more likely to break.

[0096] In this embodiment, the grooves 76, 78 are formed on the surfaces 72A, 74A of the plates 72, 74, but the present embodiment is not limited to this. For example, grooves may be formed on the back surfaces 72B, 74B of the plates 72, 74, or grooves may be formed on the surfaces 72A, 74A and the back surfaces 72B, 74B.

[0097] Furthermore, in this embodiment, the case where there is one short groove 82 has been described, but this embodiment is not limited to this structure.

[0098] For example, the configurations shown in the fourth and fifth embodiments may be adopted.

[0099] <Fourth embodiment> FIG. 7 is a plan view showing a plate body 92 of a circuit protection element according to a fourth embodiment.

[0100] Two short grooves 82A and 82B are formed at a distance from each other on a surface 92A of a plate 92 of a circuit protection element according to the fourth embodiment.

[0101] Fifth Embodiment FIG. 8 is a plan view showing a plate 102 of a circuit protection element according to a fifth embodiment.

[0102] The plate 102 of the circuit protection element of the fifth embodiment has three short grooves 82C, 82D, and 82E formed at a distance from each other, and the intersection 104 between the centrally located short groove 82D and the long groove 80 is positioned so as to be located at the center of the element portion 16.

[0103] (Action and effect) Next, the effects of this embodiment will be described.

[0104] The circuit protection element according to the fourth embodiment and the circuit protection element according to the fifth embodiment can also achieve the same effects as those of the third embodiment.

[0105] In the third to fifth embodiments, the long groove 80 is formed so as to pass through the center of each plate body 18, 92, 102 in the short direction S, but this embodiment is not limited to this structure.

[0106] For example, the configurations shown in the sixth and seventh embodiments may be adopted.

[0107] Sixth Embodiment FIG. 9 is a plan view showing a plate 112 of a circuit protection element according to the sixth embodiment.

[0108] The plate 112 of the circuit protection element according to the sixth embodiment differs from the third embodiment in that two long grooves 80A and 80B are formed at a distance from each other.

[0109] Seventh Embodiment FIG. 10 is a plan view showing a plate 122 of a circuit protection element according to a seventh embodiment.

[0110] The plate 122 of the circuit protection element according to the seventh embodiment differs from that of the sixth embodiment in that two short grooves 82F, 82G are formed at a distance from each other.

[0111] (Action and effect) Next, the effects of this embodiment will be described.

[0112] The circuit protection element according to the sixth embodiment and the circuit protection element according to the seventh embodiment can also achieve the same effects as those of the third to fifth embodiments.

[0113] In the third to seventh embodiments, the long grooves 80, 80A, and 80B extend in the longitudinal direction L of the plates 18, 92, 102, 110, and 122. Furthermore, in the third to seventh embodiments, the short grooves 82, 82A to 82G extend in the lateral direction S, but the present embodiments are not limited to this structure.

[0114] For example, it may be configured as shown in the eighth embodiment.

[0115] Eighth Embodiment FIG. 11 is a plan view showing a plate 132 of a circuit protection element according to the eighth embodiment.

[0116] The plate 132 of the circuit protection element according to the eighth embodiment differs from the third to seventh embodiments in that the groove 76 is composed of two oblique grooves 134, 136 that extend obliquely relative to each of the plates 18, 92, 102, 110, and 122. In addition, the intersection 138 of the two oblique grooves 134, 136 is positioned so as to be located at the center of the element part 16.

[0117] (Action and effect) Next, the effects of this embodiment will be described.

[0118] The circuit protection element according to the eighth embodiment can also achieve the same effects as those of the third to seventh embodiments.

[0119] Ninth Embodiment Fig. 12 is a cross-sectional view showing a circuit protection element 140 according to a ninth embodiment. Fig. 13 is a cross-sectional view taken along line CC in Fig. 12. The ninth embodiment will be described with reference to Figs. 12 and 13.

[0120] Note that parts that are the same as or equivalent to those in the above-described embodiments are given the same reference numerals and explanations thereof will be omitted, and only different parts will be explained.

[0121] The circuit protection element 140 according to the ninth embodiment differs from the circuit protection elements 10, 60, and 70 according to the above-described embodiments in the structure of the electrodes 142 and 144.

[0122] That is, in the circuit protection element 140 according to the ninth embodiment, each electrode portion 142, 144 has a first claw 150 and a second claw 152 that protrude beyond an upper surface 146 of the electrode portion 142, 144 and are inserted into the molding material 52 that constitutes the exterior member 20. Each claw 150, 152 protrudes from each electrode portion 142, 144 toward the upper surface 140A of the exterior member 20.

[0123] Specifically, a cut-out portion is formed in the portion of the first electrode portion 142 arranged within the exterior member 20, the cut-out portion being bent toward the upper surface 140A of the circuit protection element 140, and the first claw 150 is formed by this cut-out portion.

[0124] First claw 150 is formed by forming a U-shaped slit in first electrode portion 142 and cutting out the inside of this slit. Then, first claw 150 is caused to bite into molding material 52 that constitutes exterior member 20, thereby strengthening the bond between first electrode portion 142 and the portion of exterior member 20 that is arranged above first electrode portion 142.

[0125] The first claw 150 is formed in the center of the first electrode portion 142 in the short-side direction S, and the first claw 150 is inclined toward the first side surface 140C as it approaches the top surface 140A of the circuit protection element 140.

[0126] In addition, a cut-and-raised portion is formed in the portion of the second electrode portion 144 arranged inside the exterior member 20, which is cut and raised toward the upper surface 140A of the circuit protection element 140, and this cut-and-raised portion forms a second claw 152.

[0127] The second claws 152 are formed by forming a U-shaped slit in the second electrode portion 144 and cutting out the inside of the slit. Then, by having the second claws 152 bite into the molding material 52 that constitutes the exterior member 20, the bond between the second electrode portion 144 and the portion of the exterior member 20 that is arranged above the second electrode portion 144 is strengthened.

[0128] The second claw 152 is formed in the center of the second electrode portion 144 in the short-side direction S, and the second claw 152 is inclined toward the second side surface 140D as it approaches the upper surface 140A of the circuit protection element 140.

[0129] (Action and effect) Next, the effects of this embodiment will be described.

[0130] In this embodiment, the same functions and effects as those of the above-described embodiments can be obtained for the same or equivalent parts as those of the above-described embodiments.

[0131] The exterior member 20 of the circuit protection element 140 of this embodiment is composed of a molding material 52 that adheres closely to the plates 40, 42 and the electrode portions 142, 144. The electrode portions 142, 144 are each provided with claws 150, 152 that protrude beyond one surface 146 of the electrode portions 142, 144 and are inserted into the molding material 52.

[0132] According to this configuration, even if pressure and impact generated when the element portion 16 is melted are applied to the portion of the exterior member 20 above each electrode portion 142, 144, the claws 150, 152 can prevent the portion of the exterior member 20 located above from deforming upward.

[0133] In this embodiment, the claws 150, 152 are formed in a rectangular shape, but the present embodiment is not limited to this.

[0134] For example, each of the claws 150, 152 may be formed in a T-shape. In this case, the bonding strength between each of the claws 150, 152 and the exterior member 20 can be increased.

[0135] The portions of the exterior member 20 arranged below the electrodes 142, 144 are prevented from being deformed by the printed wiring board on which the circuit protection element 140 is mounted.

[0136] Tenth Embodiment 14 is a cross-sectional view showing a circuit protection element 160 according to a tenth embodiment. The ninth embodiment will be described with reference to FIG.

[0137] Note that parts that are the same as or equivalent to those in the above-described embodiments are given the same reference numerals and explanations thereof will be omitted, and only different parts will be explained.

[0138] The circuit protection element 160 according to the tenth embodiment differs from the circuit protection element 140 according to the ninth embodiment in the structure of each of the claws 162, 164.

[0139] That is, the claws 162, 164 of the circuit protection element 160 according to the tenth embodiment are longer than the claws 150, 152 of the ninth embodiment.

[0140] The base end of the first claw 162 is bent along one end surface of the first plate 62, and the first claw 162 has a first end surface extension portion 166 that extends along one end surface of the first plate 62. The tip end of the first end surface extension portion 166 of the first claw 162 is bent along the surface 62A of the first plate 62, and the first claw 162 has a first surface extension portion 168 that extends along the surface 62A of the first plate 62.

[0141] As a result, the first claw 162 clamps, between the first electrode portion 170 and the first surface extension portion 168, one end of the first plate 62 fixed to the element portion 16 with the adhesive 50.

[0142] Furthermore, the base end of the second claw 164 is bent along the other end surface of the first plate 62, and the second claw 164 has a second end surface extending portion 172 that extends along the other end surface of the first plate 62. The tip end of the second end surface extending portion 172 of the second claw 164 is bent along the surface 62A of the first plate 62, and the second claw 164 has a second surface extending portion 174 that extends along the surface 62A of the first plate 62.

[0143] As a result, the second claw 164 clamps the other end of the first plate 62 fixed to the element portion 16 with the adhesive 50 between the second electrode portion 176 and the second surface extension portion 174 .

[0144] (Action and effect) Next, the effects of this embodiment will be described.

[0145] In this embodiment, the same functions and effects as those of the above-described embodiments can be obtained for the same or equivalent parts as those of the above-described embodiments.

[0146] Furthermore, the claws 162, 164 of the circuit protection element 160 of this embodiment clamp the end of the first plate 62 fixed to the element part 16 with the adhesive 50. The claws 162 and 164 also hold the first plate 62 fixed to the element part 16 with the adhesive 50 from both ends.

[0147] Therefore, even if pressure and impact generated when the element portion 16 is blown out are applied to the first plate 62, the first plate 62 can be prevented from moving upward unexpectedly.

[0148] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and it is not intended that the technical scope of the present invention be limited to the specific configurations of the above embodiments. [Explanation of symbols]

[0149] 10, 60, 70, 140, 160 Circuit protection element 10A top 10B Bottom 10C First side view 10D Second Side View 12, 142, 170 First Electrode Section 14, 144, 176 Second Electrode Section 16 エレメントBU 17 Narrow section 18, 72, 92, 102, 112, 122, 132 plate body 20 Exterior parts 22 First Extension Section 24 The first side extends into the part 26 The first part extends into the lower part 30 Second Extension 32 The second side extends into the part 34 The second part extends into the lower part 40, 62 First Plate 42, 64 Second Plate 50 Next 52 モールド material 76 Ditch 146 One side 150, 162 First claw 152, 164 Second claw

Claims

1. A pair of electrode portions; an element portion provided between the two electrode portions; a plate body made of an insulator arranged along the element portion; an exterior member that covers the element portion and the plate body, the plate is fixed to the element portion via an inorganic adhesive; a distance D1 from a side surface of the element portion to a side surface of the adhesive is greater than a distance D2 from the element portion to the plate body; Circuit protection element.

2. A pair of electrode parts; an element portion provided between the two electrode portions; a plate body made of an insulator arranged along the element portion; an exterior member that covers the element portion and the plate body, The exterior member is made of a molding material that is in close contact with the plate body and the electrode portion. Circuit protection element.

3. A pair of electrode parts; an element portion provided between the two electrode portions; a plate body made of an insulator arranged along the element portion; an exterior member that covers the element portion and the plate body, The plate has a groove on its surface. Circuit protection element.

4. The circuit protection element according to any one of claims 1 to 3, The plate body includes a first plate body arranged on one side of the element part and a second plate body arranged on the other side of the element part. Circuit protection element.

5. The circuit protection element according to any one of claims 1 to 4, The plate is made of an inorganic material. Circuit protection element.

6. The circuit protection element according to any one of claims 1 to 5, The element portion is configured by a narrow portion formed on a long metal plate, the electrode portion includes a first electrode portion configured on one side of the metal plate with the narrow portion as a boundary, and a second electrode portion configured on the other side of the metal plate with the narrow portion as a boundary, Circuit protection element.

7. The circuit protection element according to any one of claims 1 to 6, The element part is made of phosphor bronze. Circuit protection element.

8. The circuit protection element according to any one of claims 2 to 7, The plate is fixed to the element portion via an inorganic adhesive. Circuit protection element.

9. 3. The circuit protection element according to claim 2, The electrode portion includes a claw that protrudes from one surface of the electrode portion and is inserted into the molding material. Circuit protection element.

10. 10. The circuit protection element of claim 9, the extending portion of the electrode portion extending from the exterior member includes a side extending portion extending along a side surface of the exterior member and a bottom extending portion extending along a bottom surface of the exterior member, The claws protrude from the electrode portions toward the upper surface of the exterior member. Circuit protection element.

11. The circuit protection element according to any one of claims 1 to 10, The plate has a thickness of 100 μm or less. Circuit protection element.

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