Multilayer capacitors

Abstract

To provide a laminated capacitor capable of improving a mounting stability and a pickup property.SOLUTION: A laminated capacitor 1 satisfies an equation of 0<Y<Ht on at least a curved surface P1 side in each of a pair of first external electrodes 3 and 3 in the case where a distance between a front surface and the curvature surface P1 of a first external electrode 3 at a top position K1 of the first external electrode 3 is Ht and a distance in an opposite direction D3 of a pair of main surfaces 2C and 2C between the top position K1 and a top position K2 of the main surface 2C is Y, in view from the opposite direction D2 of the pair of side surfaces 2B and 2B. The laminated capacitor satisfies an equation of Ht>Hs on both sides of the pair of main surfaces 2C and 2C in each of a pair of second external electrodes 4 and 4 in the case where a distance between the front surface and the main surface 2C of a second external electrode 4 at a top position K3 of the second external electrode 4 in view of the opposite direction D3 of the pair of main surfaces 2C and 2C.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to multilayer capacitors. [Background technology]

[0002] An example of a conventional multilayer capacitor is the feedthrough capacitor described in Patent Document 1. This conventional feedthrough capacitor is a so-called three-terminal multilayer ceramic capacitor. In this feedthrough capacitor, a laminate formed by stacking a plurality of dielectric layers is alternately arranged with feedthrough conductor layers extending to a pair of opposing first end faces and ground electrode layers facing the feedthrough conductor layers via the dielectric layers and extending to another pair of opposing second end faces of the laminate. A pair of input / output terminals connected to both end portions of the feedthrough conductor layers is formed on the pair of first end faces. A ground terminal connected to both end portions of the ground electrode layer is formed on the pair of second end faces. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-102243 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-described three-terminal multilayer capacitor is mounted on an electronic device or the like by soldering the terminal electrodes to a circuit board or the like. However, the end faces of the element body of the multilayer capacitor may be curved convexly in the lamination direction of the internal electrodes, for example. Therefore, a technical challenge is to improve the mounting stability and pickup performance while taking into account the shape of the element body.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a multilayer capacitor that is improved in mounting stability and pickup performance. [Means for solving the problem]

[0006] A multilayer capacitor according to one aspect of the present disclosure includes a body having a pair of end faces facing each other, a pair of side faces and a pair of main faces extending in the facing direction of the pair of end faces between the pair of end faces, a plurality of first internal electrodes arranged in the facing direction of the pair of main faces within the body and extending in the facing direction of the pair of end faces, a plurality of second internal electrodes arranged in the facing direction of the pair of main faces within the body and extending in the facing direction of the pair of side faces, a pair of first external electrodes arranged so as to wrap around the pair of end faces, and a pair of second external electrodes arranged so as to wrap around the pair of main faces on the pair of side faces and spaced apart from the first external electrodes. At least one of the pair of main faces is a curved surface that curves convexly. When the distance between the surface of the first external electrode and the main face at the apex position of the first external electrode is Ht and the distance in the facing direction of the pair of main faces between the apex position and the apex position of the curved surface is Y when viewed from the facing direction of the pair of side faces, for each of the pair of first external electrodes, at least on the curved surface side, 0 < Y < Ht is satisfied. When the distance between the surface of the second external electrode and the main face at the apex position of the second external electrode is Hs when viewed from the facing direction of the pair of end faces, for each of the pair of second external electrodes, on both sides of the pair of main faces, Ht > Hs is satisfied. Main surface In this multilayer capacitor, by satisfying 0 < Y at least on the curved surface side, even when at least one of the pair of main faces is a convex curved surface, it is possible to prevent the body from protruding beyond the first external electrode in the facing direction of the pair of main faces. As a result, self-alignment of the multilayer capacitor during mounting becomes easy. Also, by satisfying Y < Ht at least on the curved surface side, it is possible to prevent insufficient protrusion of the body in the facing direction of the pair of main faces. As a result, the pick-up property of the multilayer capacitor during mounting can be improved. Furthermore, by satisfying Ht > Hs on both sides of the pair of main faces, regardless of which main face is the mounting surface, the thickness of the first external electrode is sufficiently ensured, and the mounting stability can be improved.

[0007]

[0008] ​When viewed from the opposing direction of the pair of principal surfaces, the distance between the surface and side of the first external electrode at the vertex position of the first external electrode is Hw, and the distance between the surface and side of the second external electrode at the vertex position of the second external electrode is Ts, Ts > Hw may be satisfied for each of the pair of second external electrodes. In this case, a sufficient mounting area for the second external electrodes can be ensured, making self-alignment of the multilayer capacitor during mounting even easier. [Effects of the Invention]

[0009] According to the present disclosure, mounting stability and pick-up properties are improved. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic perspective view of a multilayer capacitor according to an embodiment of the present disclosure. [Figure 2] 2 is a cross-sectional view of a pair of end faces of the multilayer capacitor; [Figure 3] 2 is a cross-sectional view of a multilayer capacitor between a pair of side surfaces; [Figure 4] FIG. 2 is a cross-sectional view of the multilayer capacitor in the plane of the first internal electrode. [Figure 5] FIG. 2 is a cross-sectional view of the multilayer capacitor in the plane of the second internal electrode. [Figure 6] 2 is an enlarged view of a main part of the multilayer capacitor as viewed from a direction in which a pair of side surfaces face each other; FIG. [Figure 7] 2 is an enlarged view of a main part of the multilayer capacitor as viewed from the opposing direction of a pair of end faces. FIG. [Figure 8] 2 is an enlarged view of a main part of the multilayer capacitor as viewed from the opposing direction of a pair of main surfaces. FIG. [Figure 9] FIG. 10(a) is a diagram showing the results of measurements of Ht, Y, and Hs, and FIG. 10(b) is a diagram showing the results of measurements of Hw and Ts. [Figure 10] FIG. 10 is a diagram showing the results of an effect confirmation test of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, preferred embodiments of a multilayer capacitor according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0012] FIG. 1 is a schematic perspective view of a multilayer capacitor according to an embodiment of the present disclosure. As shown in the figure, the multilayer capacitor 1 according to this embodiment is configured as a so-called three-terminal feedthrough capacitor. The multilayer capacitor 1 can be mounted on, for example, a circuit board of an electronic device. The chip size of the multilayer capacitor 1 is, for example, 3216 size (length 3.2 mm × width 1.6 mm × height 1.6 mm). There are no particular limitations on the chip size of the multilayer capacitor 1, and it may be a size other than 3216 size.

[0013] As shown in Fig. 1, the multilayer capacitor 1 includes an element body 2, a pair of first external electrodes 3, 3, and a pair of second external electrodes 4, 4. The pair of first external electrodes 3, 3 function as signal external electrodes, and the pair of second external electrodes 4, 4 function as grounding external electrodes.

[0014] The element body 2 is formed by laminating multiple dielectric layers. Each dielectric layer is formed, for example, by a sintered ceramic green sheet containing a dielectric material (dielectric ceramic such as BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based). In the actual element body 2, the dielectric layers are integrated to the extent that their boundaries are not visible. The element body 2 has a substantially rectangular parallelepiped shape. The rectangular parallelepiped shape may include a shape with chamfered corners and ridges. The rectangular parallelepiped shape may include a shape with rounded corners and ridges.

[0015] The element body 2 has a pair of end faces 2A, 2A facing each other, a pair of side faces 2B, 2B facing each other, and a pair of main faces 2C, 2C facing each other. The pair of side faces 2B, 2B and the pair of main faces 2C, 2C extend between the pair of end faces 2A, 2A in the opposing direction of the pair of end faces 2A, 2A. The pair of end faces 2A, 2A, the pair of side faces 2B, 2B, and the pair of main faces 2C, 2C are perpendicular to each other.

[0016] One of the pair of principal surfaces 2C, 2C serves as a mounting surface (surface facing a circuit board or the like) when mounting the multilayer capacitor 1 on a circuit board or the like of an electronic device. At least one of the pair of principal surfaces 2C, 2C serves as a curved surface P1 that is curved in a convex shape. In this embodiment, one of the pair of principal surfaces 2C, 2C (the principal surface 2C on the upper side of the paper in FIG. 1) serves as a curved surface P1 that is curved in a gentle convex shape. In addition, the other of the pair of principal surfaces 2C, 2C (the principal surface 2C on the lower side of the paper in FIG. 1) serves as a flat surface P2 that is flatter than the curved surface P1.

[0017] Here, the opposing direction of the pair of end faces 2A, 2A is referred to as D1, the opposing direction of the pair of side faces 2B, 2B is referred to as D2, and the opposing direction of the pair of main faces 2C, 2C is referred to as D3. The opposing direction D1 of the pair of end faces 2A, 2A corresponds to the length direction of the element body 2, and the opposing direction D2 of the pair of side faces 2B, 2B corresponds to the width direction of the element body 2. The opposing direction D3 of the pair of main faces 2C, 2C corresponds to the height direction of the element body 2. The opposing direction D3 of the pair of main faces 2C, 2C coincides with the stacking direction of the multiple dielectric layers that make up the element body 2.

[0018] The pair of first external electrodes 3, 3 are provided on the pair of end faces 2A, 2A, respectively. The first external electrode 3 has a main body 3a that covers the entire end face 2A, wraparound portions 3b, 3b that extend from the main body 3a around the edges of the pair of side faces 2B, 2B, respectively, and wraparound portions 3c, 3c that extend from the main body 3a around the edges of the pair of main faces 2C, 2C, respectively.

[0019] The first external electrode 3 is formed on the end surface 2A so as to cover the lead-out portion (connection portion 6b described below) of the first internal electrode 6. The first external electrode 3 may be configured to include a sintered layer covering the lead-out portion and a plating layer covering the sintered layer. Sintered layerThe plating layer may include a metal or glass. The metal may be Cu, Ni, Ag, etc. The plating layer may be either a single layer or a multilayer. In the case of a multilayer, it may include a Ni plating layer, a Sn layer covering the Ni plating layer, etc. In this embodiment, the first external electrode 3 has a three-layer structure consisting of a Cu sintered layer 3A, a Ni plating layer 3B, and a Sn plating layer 3C (see FIG. 2, etc.).

[0020] Each of the pair of second external electrodes 4 is provided on each of the pair of side surfaces 2B in the longitudinal center of the element body 2. The second external electrode 4 has a main body portion 4a that extends with a predetermined width in the height direction of the element body 2 on the side surface 2B, and wrap-around portions 4b that wrap around from the main body portion 4a to the edge portions of each of the pair of main surfaces 2C.

[0021] The second external electrode 4 is formed on the side surface 2B so as to cover the lead-out portion (connection portion 7b described below) of the second internal electrode 7. Similar to the first external electrode 3, the second external electrode 4 may be configured to include a sintered layer covering the lead-out portion and a plating layer covering the sintered layer. Sintered layer The plating layer may include a metal or glass. The metal may be Cu, Ni, Ag, or the like. The plating layer may be either a single layer or a multilayer. In the case of a multilayer, it may include a Ni plating layer, a Sn layer covering the Ni plating layer, and the like. In this embodiment, the second external electrode 4 has a three-layer structure including a Cu sintered layer 4A, a Ni plating layer 4B, and a Sn plating layer 4C (see FIG. 3, etc.).

[0022] As shown in FIGS. 2 to 5, a plurality of first internal electrodes 6 and a plurality of second internal electrodes 7 are arranged within the element body 2. Examples of materials constituting the first internal electrodes 6 and the second internal electrodes 7 include conductive materials (such as Ni or Cu) that are generally used as internal electrodes for multilayer electric elements. The first internal electrodes 6 and the second internal electrodes 7 are formed by sintering a conductive paste containing the above-mentioned conductive material. As shown in FIGS. 2 and 3, the plurality of first internal electrodes 6 and the plurality of second internal electrodes 7 are alternately stacked with dielectric layers interposed between them in the opposing direction D3 of the pair of main surfaces 2C, 2C.

[0023] As shown in FIG. 4, the first internal electrode 6 has a main electrode portion 6a and a connection portion 6b. The main electrode portion 6a has a rectangular shape in a plan view. The long sides of the main electrode portion 6a extend along the opposing direction D1 of the pair of end faces 2A, 2A, and the short sides of the main electrode portion 6a extend along the opposing direction D2 of the pair of side faces 2B, 2B. The connection portion 6b protrudes in a strip shape from the center of the short side of the main electrode portion 6a and extends to the pair of end faces 2A, 2A. This electrically connects the first internal electrode 6 to the first external electrodes 3, 3 at the pair of end faces 2A, 2A. The width of the connection portion 6b is, for example, smaller than the short sides of the main electrode portion 6a.

[0024] As shown in FIG. 5 , the second internal electrode 7 has a main electrode portion 7a and a connection portion 7b. The main electrode portion 7a has a rectangular shape in a plan view. The long sides of the main electrode portion 7a extend along the opposing direction D1 of the pair of end faces 2A, 2A, and the short sides of the main electrode portion 7a extend along the opposing direction D2 of the pair of side faces 2B, 2B. When viewed from the opposing direction D3 of the pair of principal faces 2C, 2C, the main electrode portion 7a is positioned so as to overlap with the main electrode portion 6a of the first internal electrode 6. The connection portion 7b protrudes in a strip shape from the center of the long side of the main electrode portion 6a and extends to the pair of side faces 2B, 2B. This electrically connects the second internal electrode 7 to the second external electrodes 4, 4 at the pair of side faces 2B, 2B. The width of the connection portion 7b is, for example, smaller than the width of the connection portion 6b of the first internal electrode 6.

[0025] Next, the dimensional relationship between the element body 2, first external electrode 3, and second external electrode 4 in the above-mentioned multilayer capacitor 1 will be described with reference to Figures 6 to 8. Note that, although the first external electrode 3 and second external electrode 4 have a three-layer structure made up of a sintered layer and a plated layer as described above, in Figures 6 to 8, in order to avoid complicating the illustration, the first external electrode 3 and second external electrode 4 are shown as a single unit of the three layers.

[0026] 6 is an enlarged view of a main portion of the multilayer capacitor as viewed from the opposing direction of a pair of side surfaces. While one of the end surfaces 2A is shown in the figure, the other end surface 2A has a similar configuration. As shown in FIG. 6, in the multilayer capacitor 1, the distance between the surface of the first external electrode 3 at the vertex position K1 of the first external electrode 3 and the main surface 2C when viewed from the opposing direction D2 of the pair of side surfaces 2B is defined as Ht.

[0027] The vertex position K1 of the first external electrode 3 is the position of the first external electrode 3 that is farthest from the element body 2 in the height direction (the opposing direction D3 of the pair of principal surfaces 2C, 2C). Here, the vertex position K1 is located at the wraparound portion 3c of the first external electrode 3 that wraps around to the principal surface 2C. Ht corresponds to the length of a perpendicular line drawn from the vertex position K1 of the first external electrode 3 toward the principal surface 2C in the opposing direction D3 of the pair of principal surfaces 2C, 2C until the perpendicular line touches the principal surface 2C.

[0028] 6, in the multilayer capacitor 1, the distance in the opposing direction D3 of the pair of principal surfaces 2C, 2C between the vertex position K1 of the first external electrode 3 and the vertex position K2 of the principal surface 2C when viewed from the opposing direction D2 of the pair of side surfaces 2B, 2B is defined as Y. The vertex position K2 of the principal surface 2C is the highest position on the principal surface 2C in the height direction (the opposing direction D3 of the pair of principal surfaces 2C, 2C). Y corresponds to the length of a perpendicular line drawn from a line passing through the vertex position K1 of the first external electrode 3 in the opposing direction D1 of the pair of end faces 2A, 2A toward the principal surface 2C in the opposing direction D3 of the pair of principal surfaces 2C, 2C, until the perpendicular line tangent to the principal surface 2C.

[0029] When Ht and Y are defined as described above, in the multilayer capacitor 1, for each of the pair of first external electrodes 3, 3, at least on the curved surface P1 side, 0 < Y < Ht is satisfied. When Y = 0, the height of the main surface 2C at the vertex position K2 is equal to the height of the first external electrode 3. When Y < 0, the height of the main surface 2C at the vertex position K2 becomes larger exceeding the height of the first external electrode 3. In this case, in the height direction of the dielectric body 2, it means that the main surface 2C protrudes more than the first external electrode 3. In the multilayer capacitor 1, in order to satisfy 0 < Y, in the height direction of the dielectric body 2, the main surface 2C is not made to protrude more than the first external electrode 3.

[0030] When Y = Ht, the height difference between the main surface 2C and the first external electrode 3 is equal to the thickness in the height direction of the first external electrode 3 at the vertex position K1. When Y > Ht, the height difference between the main surface 2C and the first external electrode 3 becomes larger than or equal to the thickness in the height direction of the first external electrode 3 at the vertex position K1. In the multilayer capacitor 1, in order to satisfy Y < Ht, in the height direction of the dielectric body 2, the height difference between the main surface 2C and the first external electrode 3 is suppressed to be less than the thickness in the height direction of the first external electrode 3 at the vertex position K1.

[0031] FIG. 7 is an enlarged view of a main part of the multilayer capacitor as viewed from the direction facing the pair of end faces. In the figure, one side of the side surfaces 2B, 2B is shown, but the other side of the side surfaces 2B, 2B has the same configuration. As shown in FIG. 7, in the multilayer capacitor 1, when viewed from the direction D1 facing the pair of end faces 2A, 2A, the distance between the surface of the second external electrode 4 and the main surface 2C at the vertex position K3 of the second external electrode 4 is defined as Hs.

[0032] The vertex position K3 of the second external electrode 4 is the position in the second external electrode 4 that is farthest from the dielectric body 2 in the height direction (the direction D3 facing the pair of main surfaces 2C, 2C). The vertex position K3 is located in the recessed portion 4b of the second external electrode 4 that wraps around the main surface 2C. Hs corresponds to the length obtained by drawing a perpendicular line from the vertex position K3 of the second external electrode 4 toward the main surface 2C in the direction D3 facing the pair of main surfaces 2C, 2C until the perpendicular line contacts the main surface 2C.

[0033] When Hs is defined as described above, in the multilayer capacitor 1, for each of the pair of second external electrodes 4, 4, Ht > Hs is satisfied on both sides of the pair of main surfaces 2C, 2C. When Ht = Hs, the thickness in the height direction of the first external electrode 3 at the vertex position K1 is equal to the thickness in the height direction of the second external electrode 4 at the vertex position K3. When Ht < Hs, the thickness in the height direction of the first external electrode 3 at the vertex position K1 is smaller than the thickness in the height direction of the second external electrode 4 at the vertex position K3. In the multilayer capacitor 1, in order to satisfy Ht > Hs, the thickness in the height direction of the first external electrode 3 at the vertex position K1 is larger than the thickness in the height direction of the second external electrode 4 at the vertex position K3.

[0034] FIG. 8 is an enlarged view of a main part of the multilayer capacitor as viewed from the direction in which the pair of main surfaces face each other. In the figure, one side of the end faces 2A, 2A is shown, but the other side of the end faces 2A, 2A has the same configuration. As shown in FIG. 8, in the multilayer capacitor 1, when viewed from the facing direction D3 of the pair of main surfaces 2C, 2C, the distance between the surface of the first external electrode 3 and the side surface 2B at the vertex position K4 of the first external electrode 3 is defined as Hw.

[0035] The vertex position K4 of the first external electrode 3 is the position in the first external electrode 3 that is farthest from the element body 2 in the width direction (the facing direction D2 of the pair of side surfaces 2B, 2B). Here, the vertex position K4 is located in the recessed portion 3b that wraps around the side surface 2B of the first external electrode 3. Hw corresponds to the length obtained by drawing a perpendicular line from the vertex position K4 of the first external electrode 3 toward the side surface 2B in the facing direction D2 of the pair of side surfaces 2B, 2B until the perpendicular line touches the side surface 2B.

[0036] Also, as shown in FIG. 8, in the multilayer capacitor 1, when viewed from the facing direction D3 of the pair of main surfaces 2C, 2C, the distance between the surface and the side surface 2B of the second external electrode 4 at the vertex position K5 of the second external electrode 4 is defined as Ts. The vertex position K5 of the second external electrode 4 is the position that is farthest from the element body 2 in the width direction (the facing direction D2 of the pair of side surfaces 2B, 2B) among the second external electrodes 4. Here, the vertex position K5 is located in the main body portion 4a of the second external electrode 4. Ts corresponds to the length obtained by drawing a perpendicular line from the vertex position K5 of the second external electrode 4 toward the side surface 2B in the facing direction D2 of the pair of side surfaces 2B, 2B until the perpendicular line contacts the side surface 2B.

[0037] When Hw and Ts are defined as described above, in the multilayer capacitor 1, for each of the pair of second external electrodes 4, 4, Ts > Hw is satisfied. When Ts = Hw, the thickness in the width direction of the second external electrode 4 at the vertex position K5 becomes equal to the thickness in the width direction of the first external electrode 3 at the vertex position K4. When Ts < Hw, the thickness in the width direction of the second external electrode 4 at the vertex position K5 becomes smaller than the thickness in the width direction of the first external electrode 3 at the vertex position K4.

[0038] In the multilayer capacitor 1, in order to satisfy Ts > Hw, the thickness in the width direction of the second external electrode 4 at the vertex position K5 is larger than the thickness in the width direction of the first external electrode 3 at the vertex position K4. Therefore, in the multilayer capacitor 1, when viewed from the facing direction D3 of the pair of main surfaces 2C, 2C, the amount of protrusion of the second external electrode 4 in the width direction is larger than the amount of protrusion of the first external electrode 3 in the same direction.

[0039] As described above, in the multilayer capacitor l, by satisfying 0 < Y at least on the curved surface P l side, even when at least one of the pair of main surfaces 2C, 2C is a convex curved surface P l, it is possible to prevent the element body 2 from protruding beyond the first external electrode 3 in the facing direction D3 of the pair of main surfaces 2C, 2C. As a result, the posture of the multilayer capacitor 1 becomes more stable in the length direction, and the self - alignment of the multilayer capacitor l during mounting becomes easier.

[0040] Further, in the multilayer capacitor 1, by satisfying Y < Ht at least on the curved surface P1 side, it is possible to prevent the body 2 from protruding insufficiently in the facing direction D3 of the pair of main surfaces 2C, 2C. As a result, it becomes possible to easily bring the suction head of the pickup device or the like into contact with the main surface 2C of the body 2, and the pickup property of the multilayer capacitor 1 during mounting can be improved. Further, in the multilayer capacitor 1, by satisfying Ht > Hs on both sides of the pair of main surfaces 2C, 2C, the thickness of the first external electrode 3 is sufficiently ensured regardless of which main surface 2C is used as the mounting surface. Therefore, the posture of the multilayer capacitor 1 in the length direction becomes more stable, and the mounting stability can be improved.

[0041] In the multilayer capacitor 1, by satisfying Ts > Hw for each of the pair of second external electrodes 4, 4, the amount of protrusion of the second external electrode 4 in the width direction becomes larger than the amount of protrusion of the first external electrode 3 in the width direction, and a sufficient mounting area of the second external electrode 4 can be ensured. As a result, the posture of the multilayer capacitor 1 becomes more stable in the width direction, and the self-alignment of the multilayer capacitor 1 during mounting becomes easier.

[0042] Hereinafter, embodiments of the present disclosure will be described. In this embodiment, first, a plurality of samples of multilayer capacitors having the same configuration as the above multilayer capacitor 1 were manufactured, and Ht, Y, and Hs were each measured. The number of samples was set to 10, and the size of each sample was set to 3216 size.

[0043] FIG. 9(a) is a diagram showing the measurement results of Ht, Y, and Hs. Further, FIG. 9(b) is a diagram showing the measurement results of Hw and Ts. In the actual measurement, each dimension was measured using a measurement microscope at a cross section obtained by center polishing the sample from the end face side, side face side, and plane side. The average of the measured values at each measurement point in each sample was calculated for each of Ht, Hs, Y, Hw, and Ts.

[0044] As shown in Fig. 9(a), in each of the above samples, the average value of Ht was 27.16 μm, the average value of Hs was 18.93 μm, and the average value of Y was 9.95 μm. From these results, it can be estimated that the optimal range of Ht is 21 μm to 33 μm, the optimal range of Hs is 13 μm to 25 μm, and the optimal range of Y is 6 μm to 14 μm. Also, as shown in Fig. 9(b), in each of the above samples, the average value of Hw was 26.44 μm and the average value of Ts was 49.78 μm. From these results, it can be estimated that the optimal range of Hw is 20 μm to 32 μm and the optimal range of Ts is 44 μm to 56 μm.

[0045] Also, Fig. 10 is a diagram showing the results of the effect confirmation test of the present disclosure. In this test, samples satisfying both 0 < Y < Ht and Ht > Hs were used as examples, samples satisfying only 0 < Y < Ht were used as Comparative Example 1. Also, samples with Y > Ht were used as Comparative Example 2, and samples with Y < 0 were used as Comparative Example 3. In the example, Ht was 27 μm, Hs was 20 μm, and Y was 10 μm. In Comparative Example 1, Ht was 15 μm, Hs was 30 μm, and Y was 8 μm. In Comparative Example 2, Ht was 27 μm, Hs was 20 μm, and Y was 40 μm. In Comparative Example 3, Ht was 27 μm, Hs was 20 μm, and Y was -10 μm.

[0046] The evaluation items were two items: mounting stability and pick-up property. Regarding the mounting stability, both of a pair of first external electrodes were observed in the sample after mounting, and those in which neither of the first external electrodes was floating with respect to the substrate were rated as "good (OK)", and those in which one of the first external electrodes was floating with respect to the substrate were rated as "bad (NG)". However, a poor stability does not necessarily mean a poor mounting. Regarding the pick-up property, a pick-up test (evaluation number n = 10000) using a mounter was carried out, and cases where no pick-up failure occurred were rated as "good (OK)", and cases where a pick-up failure occurred were rated as "bad (NG)".

[0047] As shown in Fig. 10, in the embodiment, both the mounting stability and the pick-up property were obtained. However, in Comparative Examples 1 and 3, although the pick-up property was ensured, the mounting stability could not be ensured. Further, in Comparative Example 2, although the mounting stability was ensured, the pick-up property could not be ensured. From this result, it was confirmed that satisfying 0 < Y < Ht and Ht > Hs as in the present disclosure contributes to improving the mounting stability and the pick-up property of the multilayer capacitor.

Explanation of Reference Numerals

[0048] 1... Multilayer capacitor, 2... Element body, 2A... End face, 2B... Side face, 2C... Main face, 3... First external electrode, 4... Second external electrode, 6... First internal electrode, 7... Second internal electrode, D1... Opposite direction of a pair of end faces, D2... Opposite direction of a pair of side faces, D3... Opposite direction of a pair of main faces, K1, K4... Vertex positions of the first external electrode, K2... Vertex position of the main face, K3... Vertex position of the second external electrode, P1... Curved surface.

Claims

1. an element body having a pair of end faces opposing each other, and a pair of side surfaces and a pair of main surfaces extending between the pair of end faces in the opposing direction of the pair of end faces; a plurality of first internal electrodes arranged in the element body in the opposing direction of the pair of main surfaces and extending in the opposing direction of the pair of end surfaces; a plurality of second internal electrodes arranged in the element body in the opposing direction of the pair of main surfaces and extending in the opposing direction of the pair of side surfaces; a pair of first external electrodes arranged on the pair of end surfaces so as to wrap around the pair of side surfaces and the pair of main surfaces; a pair of second external electrodes that are arranged on the pair of side surfaces and wrap around the pair of main surfaces and are spaced apart from the first external electrodes, One of the pair of main surfaces is a curved surface that is convexly curved, the other of the pair of main surfaces is a flat surface that is flat compared to the curved surface, when viewed from the opposing direction of the pair of side surfaces, a distance between a surface of the first external electrode at a vertex position of the first external electrode and the main surface is defined as Ht, and a distance in the opposing direction of the pair of main surfaces between the vertex position and a vertex position of the main surface is defined as Y, the relationship 0<Y<Ht is satisfied at least on the curved surface side for each of the pair of first external electrodes, a multilayer capacitor in which, when viewed from the opposing direction of the pair of end faces, a distance Hs is defined as a distance between a surface of the second external electrode at a vertex position of the second external electrode and the main surface, and Ht>Hs is satisfied on both sides of the pair of main surfaces for each of the pair of second external electrodes.

2. an element body having a pair of end faces opposing each other, and a pair of side surfaces and a pair of main surfaces extending between the pair of end faces in the opposing direction of the pair of end faces; a plurality of first internal electrodes arranged in the element body in the opposing direction of the pair of main surfaces and extending in the opposing direction of the pair of end surfaces; a plurality of second internal electrodes arranged in the element body in the opposing direction of the pair of main surfaces and extending in the opposing direction of the pair of side surfaces; a pair of first external electrodes arranged on the pair of end surfaces so as to wrap around the pair of side surfaces and the pair of main surfaces; a pair of second external electrodes that are arranged on the pair of side surfaces and wrap around the pair of main surfaces and are spaced apart from the first external electrodes, At least one of the pair of main surfaces is a curved surface that is convexly curved, when viewed from the opposing direction of the pair of side surfaces, a distance between a surface of the first external electrode at a vertex position of the first external electrode and the main surface is defined as Ht, and a distance in the opposing direction of the pair of main surfaces between the vertex position and a vertex position of the main surface is defined as Y, the relationship 0<Y<Ht is satisfied at least on the curved surface side for each of the pair of first external electrodes, when viewed from the opposing direction of the pair of end faces, a distance Hs is defined as a distance between a surface of the second external electrode at a vertex position of the second external electrode and the main surface, and Ht>Hs is satisfied on both sides of the pair of main surfaces for each of the pair of second external electrodes; a multilayer capacitor in which, when viewed from the opposing direction of the pair of main surfaces, a distance between a surface of the first external electrode and the side surface at a vertex position of the first external electrode is defined as Hw, and a distance between a surface of the second external electrode and the side surface at a vertex position of the second external electrode is defined as Ts, and Ts > Hw is satisfied for each of the pair of second external electrodes.

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