Chuck table and processing device

Abstract

To provide a chuck table and a processing device capable of suppressing the possibility that the direction (angle) of the chuck table is calculated at an erroneous angle.SOLUTION: A chuck table 10 includes a holding portion 11 that holds a workpiece, and a frame 12 surrounding the workpiece and provided with a continuously changing annular mark 15, and an angle 18 of the chuck table 10 can be seen from the mark portion 15. The mark portion 15 may be formed in a spiral shape, and the thickness of the line may change depending on the angle.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a chuck table for holding a workpiece and a processing device for processing the workpiece. [Background technology]

[0002] Known types of machines for processing plate-shaped workpieces, such as wafers on which semiconductor devices are formed, resin package substrates, and ceramic substrates, include cutting machines that use a cutting blade attached to the tip of a spindle to cut the workpiece, laser processing machines that use a laser beam irradiation unit to process the workpiece with a laser beam, and grinding machines that grind the workpiece to thin it.

[0003] As electronic devices become lighter, thinner, and smaller, wafers are being processed to be extremely thinned to 50 μm or less in order to thin semiconductor devices. However, when the R portion (curved portion) on the outer periphery of the wafer is thinned, it becomes a sharp knife edge, making the outer periphery of the wafer more susceptible to chipping during grinding. Therefore, a so-called edge trimming technique has been developed in which the wafer is cut along the outer periphery to remove the R portion (curved portion) before grinding (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-093333 Summary of the Invention [Problem to be solved by the invention]

[0005] In edge trimming, the chuck table is rotated with a cutting blade cutting into the outer edge of the wafer, removing a narrow area of ​​just a few millimeters from the wafer's outer edge where no devices are formed. Three or more locations on the wafer's outer edge are photographed, the center coordinates of the wafer are determined from the coordinates of the outer edge, and the relationship between the offset and angle between the center of the wafer and the center of rotation of the chuck table is calculated. The cutting blade position is adjusted to match the coordinates of the wafer's outer edge in accordance with the direction of the rotating chuck table, and cutting is performed, thereby removing only a specified width of the outer edge. When photographing the wafer's outer edge, the chuck table is rotated in a specified direction.

[0006] The orientation (angle) of the chuck table is calculated from the signal from the encoder of the motor that rotates the chuck table, so there was a risk that an incorrect angle would be calculated if the motor accelerated or decelerated or malfunctioned, which could cause problems such as the wafer's center coordinates being calculated incorrectly.

[0007] The present invention has been made in consideration of such problems, and its purpose is to provide a chuck table and a processing device that can reduce the risk of the orientation (angle) of the chuck table being calculated at an incorrect angle. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the chuck table of the present invention is a chuck table that holds a workpiece, and is composed of a holding portion that holds the workpiece and a frame body that surrounds the workpiece and has a continuously changing annular mark portion, and is characterized in that the angle of the chuck table can be determined by the mark portion.

[0009] The marking portion may be formed in a spiral shape.

[0010] The mark portion may have a line thickness that changes depending on the angle.

[0011] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention includes the above-mentioned chuck table that holds a workpiece on a holding surface, a rotation unit that rotates the chuck table about a rotation axis perpendicular to the holding surface of the chuck table, a processing unit that processes the workpiece held on the chuck table, and a camera that photographs the workpiece held on the chuck table and the mark portion of the chuck table. system Equipped with a control unit and The mark portion is formed over the entire circumference of the upper surface of the frame of the chuck table, and is formed so that a predetermined parameter changes depending on the angle from the reference direction while it moves from a reference direction along the radial direction around the center of the holding surface in the circumferential direction once and then returns to the reference direction again, and the control unit pre-stores the relationship between the angle and the predetermined parameter, and acquires images by using the camera to photograph the outer periphery of the workpiece held on the chuck table and the mark portion in at least three or more areas, detects the predetermined parameter of the mark portion based on the coordinates of the outer periphery and the coordinates of the mark portion in each of the acquired images, calculates an angle linked to the detected predetermined parameter, detects the position of the workpiece on the chuck table from the calculated angle and the coordinates of the outer periphery, and The processing unit and the rotation unit are controlled based on the 、 It is something. [Effects of the Invention]

[0012] The present invention can reduce the risk of the orientation (angle) of the chuck table being calculated at an incorrect angle. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a top view showing a main part of the processing apparatus of FIG. [Figure 3] FIG. 3 is a cross-sectional view showing a main part of the processing apparatus of FIG. [Figure 4] FIG. 4 is a top view illustrating an example of the operation process of the processing apparatus of FIG. [Figure 5] FIG. 5 is a diagram showing an example of an image acquired by the processing device of FIG. 1 in the operation process of FIG. [Figure 6] FIG. 6 is a diagram showing an example of an image acquired by the processing device of FIG. 1 in the operation process of FIG. [Figure 7] FIG. 7 is a cross-sectional view showing edge trimming by the processing apparatus of FIG. [Figure 8] FIG. 8 is a perspective view showing a configuration example of a processing device according to the second embodiment. [Figure 9] FIG. 9 is a perspective view showing a configuration example of a processing device according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A chuck table 10 and a processing device 1 according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the processing device 1 according to the first embodiment. FIG. 2 is a top view showing a main part of the processing device 1 of FIG. 1. FIG. 3 is a cross-sectional view showing a main part of the processing device 1 of FIG. 1. As shown in FIG. 1, the processing device 1 according to the first embodiment includes the chuck table 10 according to the first embodiment, a rotation unit 20, a processing unit 30, a moving unit 40, a camera 50, and a control unit 60.

[0016] In the first embodiment, the workpiece 100, which is the object to be processed by the processing apparatus 1, is, for example, a disk-shaped semiconductor device wafer or optical device wafer made of a base material such as silicon, sapphire, silicon carbide (SiC), or gallium arsenide. As shown in Fig. 1, the workpiece 100 has a plurality of planned division lines 102 formed in a lattice pattern on a flat surface 101, and devices 103 are formed in areas partitioned by the plurality of planned division lines 102. In the present invention, the workpiece 100 may also be a circular package substrate, a ceramic plate, a glass plate, or the like, having a plurality of devices sealed with resin.

[0017] The chuck table 10 has a disk-shaped holding portion 11 and a disk-shaped frame 12 having a recess into which the holding portion 11 is fitted. In the first embodiment, the holding portion 11 is formed from a porous porous ceramic or the like and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the holding portion 11 is a holding surface 13 on which a workpiece 100 is placed and which suction-holds the placed workpiece 100. In the first embodiment, the workpiece 100 is placed with its front surface 101 facing upward, and the holding surface 13 suction-holds the placed workpiece 100 from a back surface 104 behind the front surface 101. The holding surface 13 and an upper surface 14 of the frame 12 are arranged on the same plane and are formed parallel to the horizontal XY plane. The chuck table 10 is rotatable by the rotation unit 20 on a rotation axis 21 (see Figure 3) that is vertical and parallel to the Z-axis direction perpendicular to the holding surface 13, and is movable in the X-axis direction, which is one horizontal direction, by the X-axis movement unit 41 of the movement unit 40.

[0018] As shown in FIG. 2 , the frame 12 has an annular marking portion 15 on its upper surface 14. The annular marking portion 15 is formed around the entire periphery of the upper surface 14 of the frame 12, surrounding the holding surface 13 of the holder 11, and is provided in an area that is exposed on the outer periphery side of the outer edge 105 (see FIGS. 1 and 3 ) of the workpiece 100 when the workpiece 100 is held on the holding surface 13. The annular marking portion 15 is formed so that a predetermined parameter continuously and monotonically changes in accordance with an angle 18 from a predetermined radial reference direction 17, from which the annular marking portion 15 rotates around a predetermined circumferential direction, until it returns to the predetermined reference direction 17, with the center of rotation 16 on the holding surface 13 of the chuck table 10 as its origin. Here, the angle 18 from the predetermined reference direction 17 is a parameter that represents the circumferential position of the chuck table 10.

[0019] In the example of embodiment 1 shown in FIG. 2 , the annular mark portion 15 is a line formed in a spiral (spiral) shape, and the radial position (distance) 19 from the center of rotation 16 changes continuously and monotonically (decreases in the example of FIG. 2 ) as a predetermined parameter depending on the angle 18 from a predetermined reference direction 17. The present invention is not limited to this, and may be, for example, a line (figure) whose radial thickness changes continuously and monotonically as a predetermined parameter depending on the angle 18 from the predetermined reference direction 17. Furthermore, in the example shown in FIG. 2 , the radial position (distance) 19 (predetermined parameter) of the annular mark portion 15 decreases as the angle 18 increases, but this is not limited to this, and the radial position (distance) 19 (predetermined parameter) may increase. Furthermore, in the example shown in FIG. 2 , the radial position (distance) 19 (predetermined parameter) of the annular mark portion 15 changes uniformly as the angle 18 increases, but this is not limited to this, and the change amount may not be uniform.

[0020] In this way, the annular mark portion 15 is formed so that there is a one-to-one correspondence between the angle 18 from the predetermined reference direction 17 and predetermined parameters such as the radial position (distance) 19 and the radial thickness. As a result, the annular mark portion 15 makes it possible to detect and calculate the direction of the chuck table 10 as the angle 18 from the predetermined reference direction 17 based on the predetermined parameters such as the position (distance) 19 and the radial thickness.

[0021] As shown in Fig. 1, the rotation unit 20 is provided below the chuck table 10, and rotates the chuck table 10 about a rotation axis 21 that is perpendicular to the holding surface 13, as shown in Fig. 3. The rotation axis 21 intersects with the holding surface 13 of the chuck table 10 at a rotation center 16. The rotation unit 20, together with the chuck table 10, is provided so as to be movable in the X-axis direction by an X-axis movement unit 41 of the movement unit 40. In the first embodiment, the rotation unit 20 has a motor that rotates the chuck table 10, an encoder is installed on the motor, and a signal from the encoder is output to the control unit 60, but the present invention is not limited to this.

[0022] In the first embodiment, as shown in FIG. 1 , the processing unit 30 is a cutting unit including a spindle 32 to which a cutting blade 31 is attached at its tip. The cutting blade 31 attached to the tip of the spindle 32 is rotated around an axis parallel to a Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction, by the rotation of the spindle 32, thereby cutting a workpiece 100 held on the chuck table 10. The processing unit 30 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 42 of the movement unit 40 relative to the workpiece 100 held on the chuck table 10, and is also provided so as to be movable in the Z-axis direction (up and down direction) by a Z-axis movement unit 43 of the movement unit 40. As shown in FIG. 1 , the processing apparatus 1 is provided with two processing units 30 (cutting units), i.e., a two-spindle dicer, a so-called facing dual-type cutting apparatus.

[0023] The moving unit 40 includes an X-axis moving unit 41, a Y-axis moving unit 42, and a Z-axis moving unit 43. The X-axis moving unit 41 moves the chuck table 10 along the X-axis direction relative to the processing unit 30. The Y-axis moving unit 42 and the Z-axis moving unit 43 move the processing unit 30 along the Y-axis direction and the Z-axis direction, respectively, relative to the chuck table 10.

[0024] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 are respectively provided with an X-axis position detection unit (not shown) that detects the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) that detects the position of the machining unit 30 in the Y-axis direction, and a Z-axis position detection unit that detects the position of the machining unit 30 in the Z-axis direction. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit each output the detected positions to the control unit 60. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit can each be configured with a linear scale parallel to the X-axis, Y-axis, or Z-axis direction, and a read head that is provided so as to be movable in the X-axis, Y-axis, and Z-axis directions by the X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43, respectively, and that reads the graduations of the linear scale. In the present invention, the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit are not limited to configurations having a linear scale and a read head, and may be encoders installed on the motors of the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit, respectively.

[0025] The processing device 1 uses the X-axis moving unit 41, Y-axis moving unit 42, and Z-axis moving unit 43 to set the cutting blade 31 at a predetermined position relative to the workpiece 100 held on the chuck table 10, and by rotating the cutting blade 31 and moving it relatively along the planned dividing line 102, the cutting blade 31 can cut the workpiece 100 along the planned dividing line 102 and form processing marks (cutting grooves) along the planned dividing line 102.

[0026] The camera 50 is equipped with an imaging element that captures images of the planned dividing line 102 and outer peripheral edge 105 of the workpiece 100 held on the chuck table 10, processing marks formed on the workpiece 100 by the processing unit 30, etc. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. In the first embodiment, the camera 50 is fixed to the processing unit 30 so as to move integrally with the processing unit 30.

[0027] The camera 50 photographs the workpiece 100 held on the chuck table 10 before cutting, to obtain images for performing alignment to align the workpiece 100 with the processing unit 30 (cutting blade 31), and outputs the obtained images to the control unit 60. The camera 50 also photographs the workpiece 100 held on the chuck table 10 after cutting, to obtain images for performing a so-called kerf check to automatically check whether the processing marks are within the planned division lines 102 and whether any large chips have occurred, and outputs the obtained images to the control unit 60.

[0028] 2 and 3, the camera 50 has a photographing field of view 51 in the axial direction of the spindle 22 that is longer than the radial distance between the annular mark portion 15 and the outer peripheral edge 105 of the workpiece 100 held on the chuck table 10. Therefore, the camera 50 can photograph the annular mark portion 15 and the outer peripheral edge 105 of the workpiece 100 held on the chuck table 10 within one photographing field of view 51, and thereby can acquire an image including the annular mark portion 15 and the outer peripheral edge 105 of the workpiece 100 held on the chuck table 10.

[0029] The control unit 60 controls the operation of each component of the processing apparatus 1, causing the processing apparatus 1 to perform processing by the processing unit 30, alignment using the camera 50, kerf check, and processing to detect position information indicating the position of the workpiece 100 on the chuck table 10. In the first embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having memory such as a ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60 and outputs control signals for controlling the processing apparatus 1 to each component of the processing apparatus 1 via the input / output interface device of the processing apparatus 1.

[0030] As shown in FIG. 1 , the processing apparatus 1 further includes a cassette mounting section 71, a cleaning unit 72, and a transport unit (not shown). The cassette mounting section 71 is a mounting table on which a cassette 75, which is a container for accommodating multiple workpieces 100, is mounted, and moves the mounted cassette 75 up and down in the Z-axis direction. The cleaning unit 72 cleans the workpiece 100 after processing by the processing unit 30 and removes foreign matter such as processing chips adhering to the workpiece 100. The transport unit (not shown) transports the workpiece 100 before processing from the cassette 75 onto the chuck table 10, transports the processed workpiece 100 from the chuck table 10 to the cleaning unit 72, and transports the cleaned workpiece 100 from the cleaning unit 72 into the cassette 75.

[0031] Next, this specification will describe an example of the operation processing of the processing device 1 according to the first embodiment. Fig. 4 is a top view illustrating an example of the operation processing of the processing device 1 of Fig. 1. Fig. 5 is a diagram illustrating an example of an image 211 acquired by the processing device 1 of Fig. 1 in the operation processing of Fig. 4. Fig. 6 is a diagram illustrating an example of an image 212 acquired by the processing device 1 of Fig. 1 in the operation processing of Fig. 4. Fig. 7 is a cross-sectional view illustrating edge trimming by the processing device 1 of Fig. 1.

[0032] The control unit 60 of the processing apparatus 1 moves the camera 50 using the moving unit 40, and positions the camera's field of view 51 in an area 201 that includes the outer periphery 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10, as shown in Fig. 4. The control unit 60 detects the coordinates (camera coordinates) of the center of the camera's field of view 51 relative to the chuck table 10 at this time using the position detection units in each axial direction of the moving unit 40. The control unit 60 uses the center of rotation 16 on the holding surface 13 of the chuck table 10 as the origin and detects the camera coordinates in an apparatus Cartesian coordinate system (XY coordinate system) that is fixed within the processing apparatus 1, regardless of the rotation of the chuck table 10. In the example of embodiment 1 shown in Figure 4, the control unit 60 of the processing device 1 positions the shooting field of view 51 of the camera 50 in the area on the base end side (+Y direction side) of the spindle 32 on the chuck table 10, so that the Y coordinate of the camera coordinates essentially indicates the distance from the center of rotation 16 of the chuck table 10.

[0033] The control unit 60 uses the camera 50, whose field of view 51 is positioned in the area 201, to capture an image 211 shown in FIG. 5 of the outer peripheral edge 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10. As shown in FIG. 5, the image 211 is captured with different brightness levels for the workpiece 100 and the top surface 14 of the frame 12 of the chuck table 10. Based on the image 211 and the camera coordinates at the time the image 211 was captured, the control unit 60 detects the coordinates of the outer peripheral edge 105 of the workpiece 100 (outer peripheral edge coordinates 311) and the coordinates of the annular mark portion 15 (mark portion coordinates 301) in the apparatus orthogonal coordinate system at the lateral center of the image 211, as shown in FIG.

[0034] The control unit 60 calculates the radial position (distance) 19, which is a predetermined parameter of the annular mark portion 15, for the image 211 based on the mark portion coordinates 301, and then calculates the angle 18 from a predetermined reference direction 17, which is the direction of the chuck table 10, based on this. The control unit 60 associates the calculated angle 18 with the outer periphery coordinates 311. As a result, the outer periphery coordinates 311 are expressed by the distance from the rotation center 16 and the angle 18 from the predetermined reference direction 17. In other words, the outer periphery coordinates 311 are essentially converted into a table circular coordinate system (rθ coordinate system) that rotates together with the rotation of the chuck table 10, with the rotation center 16 on the holding surface 13 of the chuck table 10 as the origin and the predetermined reference direction 17 as the angular reference.

[0035] After capturing image 211, the control unit 60 rotates the chuck table 10 about the rotation axis 21 using the rotation unit 20, and positions the field of view 51 of the camera 50 in an area 202 (see FIG. 4 ) different from the area 201 including the outer peripheral edge 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10. The control unit 60 captures an image of the outer peripheral edge 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10 using the camera 50 whose field of view 51 is positioned in the area 202, thereby obtaining image 212 shown in FIG. 6. Based on image 212 and the camera coordinates that have not changed since image 211 was captured, the control unit 60 detects the coordinates of the outer peripheral edge 105 of the workpiece 100 (outer peripheral edge coordinates 312) and the coordinates of the annular mark portion 15 (mark portion coordinates 302), as shown in FIG. 6 . The control unit 60 performs the same processing on the image 212 as on the image 211, calculates the angle 18 from the predetermined reference direction 17 based on the landmark coordinates 302, and links this calculated angle 18 to the outer edge coordinates 312.

[0036] After capturing images 211 and 212, the control unit 60 further rotates the chuck table 10 about the rotation axis 21 using the rotation unit 20 to position the field of view 51 of the camera 50 in another area different from areas 201 and 202, captures an image different from images 211 and 212, performs the same processing on this other image as for images 211 and 212, detects outer periphery coordinates and mark portion coordinates, calculates angle 18 from a predetermined reference direction 17 based on the mark portion coordinates, and associates the calculated angle 18 with the outer periphery coordinates. In this way, the control unit 60 captures images of the outer periphery 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10 for at least three areas, and associates the detected outer periphery coordinates with angle 18 from a predetermined reference direction 17 calculated based on the detected mark portion coordinates.

[0037] The control unit 60 calculates position information of the workpiece 100 based on each outer periphery coordinate linked to each angle 18 detected based on images captured in at least three or more regions. Here, the position information of the workpiece 100 is the coordinate of the center 106 of the workpiece 100 held on the chuck table 10 in the table coordinate system, and the position of the outer periphery 105 of the workpiece 100 in the table coordinate system. In this way, the control unit 60 detects the position information of the workpiece 100 held on the chuck table 10 using the images captured by the camera 50.

[0038] After detecting the position information of the workpiece 100, the control unit 60 sets the cutting blade 31 on the outer peripheral edge 105 of the workpiece 100 held on the chuck table 10 where no device 103 is formed, as shown in Figure 7, and while the rotating cutting blade 31 is cut into the outer peripheral edge 105 of the workpiece 100 from the surface 101 side to a predetermined cutting depth, the rotation unit 20 rotates the chuck table 10 holding the workpiece 100 around the rotation axis 21, and performs so-called edge trimming, which cuts and chamfers the entire circumference of the outer peripheral edge 105 of the workpiece 100 in a circular shape.

[0039] 7, the control unit 60 causes the rotating cutting blade 31 to cut into the outer peripheral edge 105 of the workpiece 100 in an area on the base end side (+Y direction side) of the spindle 32 on the chuck table 10. When performing edge trimming, the control unit 60 controls the rotation unit 20 and the processing unit 30 based on the position information of the workpiece 100 detected earlier, and controls the movement unit 40 to control the positional relationship between the chuck table 10 and the processing unit 30 while the chuck table 10 is rotating.

[0040] Specifically, when performing edge trimming, the control unit 60 first obtains information about the orientation (angle) of the chuck table 10 at the position where the cutting blade 31 is cutting into the outer peripheral edge 105 of the workpiece 100 by obtaining a signal from the encoder of the motor of the rotation unit 20. Then, based on the orientation (angle) of the chuck table 10 and the position of the outer peripheral edge 105 of the workpiece 100 in the table coordinate system, which is position information of the workpiece 100, the control unit 60 adjusts the cutting position of the cutting blade 31 in the axial direction of the spindle 32, using the Y-axis moving unit 42 of the moving unit 40, to match the position of the outer peripheral edge 105 of the workpiece 100 at the position where the cutting blade 31 is cutting into. In the example of embodiment 1, if the orientation (angle) of the chuck table 10 at the position where the cutting blade 31 is cutting causes the outer peripheral edge 105 of the workpiece 100 to bulge outward, the control unit 60 causes the Y-axis moving unit 42 to move the cutting blade 31 toward the base end (+Y direction) of the spindle 32, and if the outer peripheral edge 105 of the workpiece 100 causes the inner peripheral edge 105 to shrink, the control unit 60 causes the Y-axis moving unit 42 to move the cutting blade 31 toward the tip end (-Y direction) of the spindle 32.

[0041] In addition, when the processing device 1 is a facing dual type cutting device as in embodiment 1, the control unit 60 may, instead of acquiring the signal from the encoder of the motor of the rotation unit 20, acquire information on the orientation (angle) of the chuck table 10 at the position where the cutting blade 31 is cutting into the outer peripheral edge 105 of the workpiece 100 by using a camera 50 fixed to a processing unit 30 other than the side where the cutting blade 31 is cutting, to photograph the annular mark portion 15 on the opposite side from the side where the cutting blade 31 is cutting.

[0042] In the chuck table 10 and processing device 1 according to the first embodiment having the above-described configuration, the annular mark portion 15 indicating the orientation of the chuck table 10 (angle 18 from a predetermined reference direction 17) is provided in an area exposed on the outer periphery of the workpiece 100 held on the chuck table 10. Therefore, the chuck table 10 and processing device 1 according to the first embodiment can detect not only the position of the outer periphery 105 of the workpiece 100 but also the orientation of the chuck table 10 by photographing the outer periphery 105 of the workpiece 100 and the annular mark portion 15. This eliminates the need to determine the orientation of the chuck table from a signal from the encoder of the motor of the rotation unit when detecting the position of the outer periphery of the workpiece, as in the conventional case, thereby achieving the advantageous effect of reducing the risk of the orientation of the chuck table 10 being calculated at an incorrect angle. Furthermore, the chuck table 10 and processing device 1 according to the first embodiment therefore have the advantage of being able to detect the position of the outer circumferential edge 105 of the workpiece 100 held on the chuck table 10 more accurately than before.

[0043] Furthermore, in the chuck table 10 and processing device 1 according to embodiment 1, the still image captured using the camera 50 includes an annular mark portion 15 containing information about the orientation of the chuck table 10 relative to a predetermined reference direction 17. This eliminates the need to perform the conventional process of determining the orientation of the chuck table at the time of image capture based on a signal from the encoder of the rotation unit, using the orientation of the chuck table at the time the chuck table starts to rotate as a reference, and also reduces the risk that the detected orientation of the chuck table 10 will differ from the timing at which the outer edge 105 of the workpiece 100 is detected.

[0044] Furthermore, in the chuck table 10 and processing device 1 according to the first embodiment, the annular mark portion 15 is formed in a spiral shape, and therefore the orientation of the chuck table 10 can be reliably detected by detecting the radial position (distance) 19 from the center of rotation 16 of the annular mark portion 15. Furthermore, the chuck table 10 and processing device 1 may be configured so that the line thickness of the annular mark portion 15 changes depending on the angle 18 from a predetermined reference direction 17, and in this case, the orientation of the chuck table 10 can be detected by detecting the line thickness of the annular mark portion 15.

[0045] Furthermore, in the processing device 1 according to embodiment 1, the control unit 60 controls the processing unit 30 and the rotation unit 20 based on the position information of the workpiece 100 detected using the image captured by the camera 50, and processes the workpiece 100, so that the workpiece 100 can be processed accurately according to the position of the outer edge 105 or center 106 on the chuck table 10.

[0046] [Embodiment 2] A processing device 1-2 according to embodiment 2 of the present invention will be described with reference to the drawings. Fig. 8 is a perspective view showing an example of the configuration of the processing device 1-2 according to embodiment 2. In Fig. 8, the same parts as those in embodiment 1 are assigned the same reference numerals, and their description will be omitted.

[0047] 8, a processing apparatus 1-2 according to the second embodiment is obtained by changing the processing unit 30 in the processing apparatus 1 according to the first embodiment to a processing unit 30-2, and by changing the arrangement and functions of the other components accordingly. In the second embodiment, the chuck table 10 is provided with an annular mark portion 15 on the upper surface 14 of the frame body 12, similar to that of the first embodiment.

[0048] 8, in the second embodiment, the processing unit 30-2 is a laser processing unit that irradiates a laser beam onto the workpiece 100 held on the chuck table 10 and laser processes the workpiece 100 with the laser beam. The processing unit 30-2 irradiates a laser beam with a wavelength that is absorbed by the workpiece 100 and performs so-called ablation processing in which the workpiece 100 is ablated (sublimated or evaporated) with the laser beam to form processing marks (laser-processed grooves), or irradiates a laser beam with a wavelength that is transmissive to the workpiece 100 and forms a modified layer, which is a fracture starting point, inside the workpiece 100 with the laser beam.

[0049] In the second embodiment, the chuck table 10 and the rotation unit 20 are provided above the X-axis moving unit 41 and the Y-axis moving unit 42 with the holding surface 13 facing upward, and are movable in the X-axis and Y-axis directions by the X-axis moving unit 41 and the Y-axis moving unit 42, respectively. In the second embodiment, the processing unit 30-2 is provided fixedly within the processing apparatus 1-2. In the second embodiment, the moving unit 40 does not include the Z-axis moving unit 43.

[0050] Next, this specification will describe an example of the operation processing of the processing device 1-2 according to embodiment 2. Similar to the processing device 1 according to embodiment 1, the control unit 60 of the processing device 1-2 uses the camera 50 to capture images of the outer periphery 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10 in at least three or more areas, and detects position information of the workpiece 100 held on the chuck table 10 using these images captured by the camera 50.

[0051] In the second embodiment, the control unit 60 sets the machining unit 30-2 at a predetermined position relative to the workpiece 100 held on the chuck table 10 using the moving unit 40, and while irradiating the workpiece 100 with a laser beam using the machining unit 30-2, moves the workpiece 100 held on the chuck table 10 along the planned dividing line 102 relative to the machining unit 30-2 using the moving unit 40, thereby laser-machining the workpiece 100 with the laser beam along the planned dividing line 102. In the second embodiment, the control unit 60 controls the machining unit 30-2 and the moving unit 40 based on the position information of the workpiece 100 detected earlier when performing laser machining, to perform so-called edge alignment, which controls the positional relationship between the workpiece 100 placed on the chuck table 10 and the machining unit 30-2, so that the laser beam irradiated from the machining unit 30-2 does not extend beyond the outer periphery 105 of the workpiece 100, i.e., so that the laser beam does not overrun the workpiece 100.

[0052] The processing device 1-2 of embodiment 2 having the above-described configuration is configured by replacing the processing unit 30, which is a cutting unit in embodiment 1, with a processing unit 30-2, which is a laser processing unit that irradiates a laser beam, and by changing the control unit 60 so that, instead of controlling the positional relationship between the chuck table 10 and the processing unit 30 when performing edge trimming, it performs edge alignment that controls the positional relationship between the workpiece 100 placed on the chuck table 10 and the processing unit 30-2 when performing laser processing, and therefore has the same effects as embodiment 1.

[0053] [Embodiment 3] A processing device 1-3 according to a third embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a perspective view showing an example of the configuration of the processing device 1-3 according to the third embodiment. In Fig. 9, the same parts as those in the first and second embodiments are designated by the same reference numerals, and the description thereof will be omitted.

[0054] 9, a processing apparatus 1-3 according to the third embodiment is obtained by changing the processing unit 30 in the processing apparatus 1 according to the first embodiment to a processing unit 30-3, and by changing the arrangement and functions of the other components accordingly. In the third embodiment, the chuck table 10 is provided with an annular mark portion 15 on the upper surface 14 of the frame body 12, similar to those in the first and second embodiments.

[0055] 9, the processing unit 30-3 is a grinding unit equipped with a spindle 32-3 having a grinding wheel 31-3 attached to its tip. The grinding wheel 31-3 attached to the tip of the spindle 32-3 is rotated about an axis parallel to the Z-axis direction by the rotation of the spindle 32-3, thereby grinding the workpiece 100 held on the chuck table 10.

[0056] In the third embodiment, the camera 50 is provided above the carry-in / out position 90 and facing the carry-in / out position 90. The camera 50 is provided so that the imaging field of view 51 includes the outer circumferential edge 105 of the workpiece 100 held on the chuck table 10 positioned at the carry-in / out position 90, and the annular mark portion 15 of the chuck table 10 positioned at the carry-in / out position 90.

[0057] As shown in FIG. 9 , the processing apparatus 1-3 further includes an alignment unit 83, a carry-in unit 84, an unloading unit 85, a cleaning unit 86, and a carry-in / out unit 87. The alignment unit 83 is a table on which the workpiece 100 removed from the cassette 75 is temporarily placed and whose center is aligned. The carry-in unit 84 has a suction pad and sucks and holds the pre-grinding workpiece 100 that has been aligned by the alignment unit 83, and carries it onto the chuck table 10 positioned at the carry-in / out position 90. The carry-out unit 85 sucks and holds the post-grinding workpiece 100 held on the chuck table 10 positioned at the carry-in / out position 90, and carries it out to the cleaning unit 86. The cleaning unit 86 cleans the workpiece 100 after grinding to remove contaminants such as grinding debris adhering to the ground surface. The carry-in / out unit 87 is, for example, a robot pick equipped with a circular hand, and uses the circular hand to suck and hold the workpiece 100 and transport the workpiece 100. The carry-in / out unit 87 carries the workpiece 100 before grinding from the cassette 75 to the alignment unit 83, and carries the workpiece 100 after grinding from the cleaning unit 86 to the cassette 75.

[0058] Next, this specification will describe an example of the operation processing of the processing device 1-3 according to embodiment 3. When the chuck table 10 holding the workpiece 100 is positioned at the carry-in / out position 90, the control unit 60 of the processing device 1-3 uses the camera 50 to capture images of the outer circumferential edge 105 and the annular mark portion 15 of the workpiece 100 held on the chuck table 10 in at least three or more areas, as in embodiments 1 and 2, and detects position information of the workpiece 100 held on the chuck table 10 using these images captured by the camera 50.

[0059] In the third embodiment, the control unit 60 uses the moving unit 40 to set the grinding wheel 31-3 attached to the tip of the spindle 32-3 at a predetermined position relative to the workpiece 100 held on the chuck table 10, and while rotating the grinding wheel 31-3, presses the grinding wheel 31-3 against the back surface 104 of the workpiece 100, which is rotating in accordance with the rotation of the chuck table 10, along the grinding feed direction (the Z-axis direction parallel to the vertical direction), thereby grinding the back surface 104 of the workpiece 100. In the third embodiment, the control unit 60 performs edge alignment similar to that of the second embodiment based on the position information of the workpiece 100 detected earlier when performing the grinding process, and performs so-called TAIKO (registered trademark) grinding, which grinds the area where the device 103 is formed to form a circular recess and forms an annular protrusion in the area of ​​the outer circumferential edge 105 where the device 103 is not formed.

[0060] The processing device 1-3 of embodiment 3 having the above-described configuration is configured by replacing the processing unit 30, which is a cutting unit in embodiment 1, with a processing unit 30-3, which is a grinding unit that grinds with a grinding wheel 31-3, and by changing the control unit 60 so that it performs edge alignment similar to embodiment 2 instead of controlling the positional relationship between the chuck table 10 and the processing unit 30 when performing edge trimming, and therefore has the same effects as embodiment 1 and embodiment 2.

[0061] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. For example, the chuck table on which the markings are formed is not limited to a porous chuck table, and any chuck table may be used as long as suction holes for sucking the workpiece are opened on the holding surface. Furthermore, when photographing the workpiece and the markings, a video may be taken with a camera while rotating the chuck table, and a still image (frame) may be selected from the video data and used to detect the coordinates of the outer periphery of the workpiece and the markings. [Explanation of symbols]

[0062] 1,1-2,1-3 Processing equipment 10 Chuck table 11 Holding part 12 Frame 15 Marking section 20 Rotating Units 30, 30-2, 30-3 Processing Unit 50 cameras 60 Control Unit 100 Workpiece 105 outer edge

Claims

1. A chuck table for holding a workpiece, a holding portion for holding the workpiece; It is composed of a frame body that surrounds the workpiece and has a continuously changing annular marking portion, The chuck table is characterized in that the angle of the chuck table can be determined by the mark portion.

2. 2. The chuck table according to claim 1, wherein the marking portion is formed in a spiral shape.

3. 2. The chuck table according to claim 1, wherein the marking portion has a line thickness that changes depending on the angle.

4. a chuck table according to claim 1, 2 or 3, which holds a workpiece on a holding surface; a rotation unit that rotates the chuck table about a rotation axis that is perpendicular to the holding surface of the chuck table; a processing unit that processes the workpiece held on the chuck table; a camera for photographing the workpiece held on the chuck table and the mark portion of the chuck table; a control unit; the mark portion is formed over the entire periphery of the upper surface of the frame body of the chuck table, and is formed so that a predetermined parameter changes depending on an angle from a reference direction along a radial direction, making one revolution along a circumferential direction around the center of the holding surface, and then returning to the reference direction again; The control unit a relationship between the angle and the predetermined parameter is stored in advance; The camera photographs the outer periphery and the mark portion of the workpiece held on the chuck table in at least three or more areas to acquire images, detects predetermined parameters of the mark portion based on the coordinates of the outer periphery and the coordinates of the mark portion in each acquired image, calculates an angle associated with the detected predetermined parameter, and detects the position of the workpiece on the chuck table from the calculated angle and the coordinates of the outer periphery, controlling the machining unit and the rotation unit based on the detected position of the workpiece on the chuck table to machine the workpiece; Processing equipment.

Images