Photosensitive resin composition, photosensitive resin film, display device, and method for producing photosensitive resin film

Abstract

To provide a photosensitive resin composition that is sufficiently curable even at low temperatures, offers superior solvent resistance and coating appearance characteristics, along with superior color characteristics, and demonstrates high reliability and pattern precision, a photosensitive resin layer made using the same, a display device, and a method of manufacturing a photosensitive resin layer.SOLUTION: The present invention provides a photosensitive resin composition including (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator and (E) a solvent. The binder resin includes an acrylic binder resin with a specific structure having ethylenically unsaturated double bonds in its side chains.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film, a display device, and a method for producing a photosensitive resin film. [Background technology]

[0002] Recently, there has been growing interest in self-luminous micro OLED display panels, which emit light themselves, as display panels applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices.

[0003] In the case of micro OLED display panels, which have pixel size about 10 times smaller than that of general OLED display panels, it is difficult to precisely form red (R), green (G), and blue (B) light-emitting layers using existing FMM (Fine Metal Mask) technology. In other words, when applying existing LCD displays to devices such as VR and AR, the color filter pattern size is too large, making it difficult to increase resolution.

[0004] Recently, OLEDoS (OLED on Silicon) technology has been introduced to achieve high resolutions of over 4000 ppi. This technology uses an OLED deposited on a silicon wafer as a backlight, on which a color filter is patterned. Color filters used in existing LCDs are cured through an exposure process in which a pattern of approximately 100 μm is formed on the glass, followed by a post-bake process at a high temperature of over 230°C. However, color filters formed on OLEDoS cannot undergo high-temperature processes due to the nature of OLEDs, so they must be cured at low temperatures. Furthermore, fine patterning is also essential to achieve the desired resolution. Due to the small size of VR, AR, and MR devices, fine patterning is essential to achieve the desired resolution.

[0005] However, color filters made from existing materials are cured only at low temperatures (below 100°C), making it difficult to improve solvent resistance and coating appearance characteristics, and ensuring color properties is also difficult. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 10-2022-0081693 Summary of the Invention [Problem to be solved by the invention]

[0007] One embodiment provides a photosensitive resin composition that cures sufficiently even at low temperatures, has excellent solvent resistance and coating appearance properties, and also has excellent color properties, resulting in high reliability and patternability.

[0008] Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

[0009] Another embodiment provides a display device including the photosensitive resin film.

[0010] Another embodiment provides a method for producing the photosensitive resin film. [Means for solving the problem]

[0011] A photosensitive resin composition according to one embodiment includes (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent, wherein the binder resin includes at least one structural unit selected from the group consisting of structural units represented by the following chemical formulas 1 and 2, and at least two structural units selected from the group consisting of structural units represented by the following chemical formulas 3 to 5. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] [Chemical formula 4] [ka] [Chemical formula 5] [ka] In the above chemical formulas 1 to 5, R 1 ~R 6 and R 8 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 7 and R 9 each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L 1 ~L 6 are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0012] The binder resin can contain structural units represented by Chemical Formula 1 and Chemical Formulas 3 to 5.

[0013] In Chemical Formula 1 and Chemical Formulas 3 to 5, R 1 , R 4 , and R 6 are each independently a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, and R 2 , R 5 , and R 8 are each independently a hydrogen atom, and L 1 ~L 6may each independently be a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0014] The binder resin can have a weight average molecular weight of 5000 g / mol to 8000 g / mol.

[0015] The binder resin can have a double bond equivalent weight of 150 g / mol to 500 g / mol.

[0016] The solid content constituting the photosensitive resin composition may be contained in an amount of 12% by weight to 24% by weight based on the total amount of the photosensitive resin composition.

[0017] The polymerizable monomer can include one or more compounds containing three or more functional groups.

[0018] The polymerizable monomer may be a mixture of two compounds, each of which may independently contain three or more functional groups.

[0019] The two types of compounds are a first polymerizable monomer containing 3 to 5 functional groups and a second polymerizable monomer containing 6 or more functional groups, and the first polymerizable monomer may be contained in a smaller amount than the second polymerizable monomer.

[0020] The photosensitive resin composition can contain, relative to the total amount of the photosensitive resin composition, 5% by weight to 20% by weight of (A) a binder resin, 70% by weight to 90% by weight of (B) a colorant, 1% by weight to 10% by weight of (C) a polymerizable monomer, 0.1% by weight to 5% by weight of (D) a polymerization initiator, and the remainder being (E) a solvent.

[0021] The photosensitive resin composition may further contain an antioxidant.

[0022] The antioxidant may be contained in an amount of 0.01% by weight to 1% by weight based on the total amount of the photosensitive resin composition.

[0023] The photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof.

[0024] The photosensitive resin composition may be a composition for a micro OLED display device.

[0025] A photosensitive resin film according to another embodiment is produced using a photosensitive resin composition.

[0026] A display device according to another embodiment includes a photosensitive resin film.

[0027] The display device may include an OLED substrate deposited on a silicon wafer and a color filter layer laminated on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights, the color filter layer including a red color filter, a green color filter, and a blue color filter.

[0028] In addition, a method for producing a photosensitive resin film according to another embodiment includes the steps of applying a photosensitive resin composition, pre-baking the applied composition at a temperature of 100°C or less, exposing the pre-baked composition to i-line light, and developing the resulting composition.

[0029] Other specific aspects of the present invention are included in the detailed description below. [Effects of the Invention]

[0030] The photosensitive resin composition according to one embodiment can be cured at a low temperature of 100°C or less, ensuring high resolution through the realization of fine patterns, and has excellent spectral characteristics and a wide color gamut. In particular, it has excellent solvent resistance and residue characteristics even when pre-baked at 100°C or less and photo-cured (i-line exposure) only, and is suitable for use in micro OLED display devices because it has excellent coating appearance characteristics. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition according to Example 1 at low temperature. [Figure 2] 1 is an optical microscope photograph of a photosensitive resin film obtained by low-temperature curing the photosensitive resin composition according to Comparative Example 1. [Figure 3] 1 is an optical microscope photograph of a photosensitive resin film obtained by low-temperature curing the photosensitive resin composition according to Comparative Example 2. [Figure 4] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition according to Example 1 at low temperature. [Figure 5] 1 is an optical microscope photograph of a photosensitive resin film obtained by low-temperature curing the photosensitive resin composition according to Comparative Example 1. [Figure 6] 1 is an optical microscope photograph of a photosensitive resin film obtained by low-temperature curing the photosensitive resin composition according to Comparative Example 2. DETAILED DESCRIPTION OF THE INVENTION

[0032] DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the present invention is provided by way of example only and is not intended to limit the scope of the present invention, which is defined solely by the claims that follow.

[0033] Unless otherwise specified, in this specification, an "alkyl group" means an alkyl group having 1 to 20 carbon atoms, an "alkenyl group" means an alkenyl group having 2 to 20 carbon atoms, a "cycloalkenyl group" means a cycloalkenyl group having 3 to 20 carbon atoms, a "heterocycloalkenyl group" means a heterocycloalkenyl group having 3 to 20 carbon atoms, an "aryl group" means an aryl group having 6 to 20 carbon atoms, an "arylalkyl group" means an arylalkyl group having 6 to 20 carbon atoms, an "alkylene group" means an alkylene group having 1 to 20 carbon atoms, an "arylene group" means an arylene group having 6 to 20 carbon atoms, an "alkylarylene group" means an alkylarylene group having 6 to 20 carbon atoms, a "heteroarylene group" means a heteroarylene group having 3 to 20 carbon atoms, and an "alkoxysilane group" means an alkoxysilane group having 1 to 20 carbon atoms.

[0034] Unless otherwise specified in this specification, "substituted" means that at least one hydrogen atom has been replaced with a halogen atom (F, Cl, Br, I), a hydroxy group, an alkoxy group having 1 to 20 carbon atoms, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, an alkyl group having 1 to 20 carbon atoms, a carbon atom, a It means being substituted by an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkenyl group having 3 to 20 carbon atoms, a cycloalkynyl group having 3 to 20 carbon atoms, a heterocycloalkyl group having 2 to 20 carbon atoms, a heterocycloalkenyl group having 2 to 20 carbon atoms, a heterocycloalkynyl group having 2 to 20 carbon atoms, a heteroaryl group having 3 to 20 carbon atoms, or a combination thereof.

[0035] In addition, unless otherwise specified in this specification, "hetero" means that at least one heteroatom selected from N, O, S, and P is contained in the chemical formula.

[0036] In addition, unless otherwise specified in this specification, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0037] Unless otherwise defined herein, "combination" means a mixture or copolymerization, and "copolymerization" means block copolymerization or random copolymerization, and "copolymer" means block copolymerization or random copolymerization.

[0038] In the chemical formulas herein, unless otherwise defined, if no chemical bond is drawn at a position where a chemical bond should be drawn, this means that a hydrogen atom is bonded to that position.

[0039] Unless otherwise defined herein, "*" means a moiety attached to the same or different atom or chemical formula.

[0040] A photosensitive resin composition according to one embodiment includes (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent, wherein the binder resin includes at least one structural unit selected from the group consisting of structural units represented by the following chemical formulas 1 and 2, and at least two structural units selected from the group consisting of structural units represented by the following chemical formulas 3 to 5. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] [Chemical formula 4] [ka] [Chemical formula 5] [ka] In the above chemical formulas 1 to 5, R 1 ~R 6 and R 8 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 7 and R 9 each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L 1 ~L 6 are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0041] Liquid crystal display (LCD) devices, a type of display device, boast advantages such as lightweight, thin design, low cost, low power consumption, and excellent compatibility with integrated circuits, expanding their use in laptops, monitors, and TVs. These LCD devices feature color filters, each consisting of a repeating unit pixel, each consisting of a group of subpixels of red (R), green (G), and blue (B), which correspond to the three primary colors of light. When adjacent subpixels are arranged and color signals are applied to each subpixel to control brightness, a specific color is displayed in the unit pixel through the combination of the three primary colors. Color filters are manufactured using red (R), green (G), and blue (B) dyes or pigments. These dye materials convert white light from a backlight unit into its corresponding color. The dye material's spectrum is enhanced when it has a narrow absorption band, eliminating unnecessary wavelengths other than the desired absorption wavelengths. Furthermore, it must have excellent heat, light, and chemical resistance to withstand UV, acid, and base exposure during the color resist etching process, preventing fading or discoloration. Color filters using photosensitive resin compositions can be produced by coating three or more colors onto a transparent substrate using methods such as dyeing, electrodeposition, printing, and pigment dispersion.

[0042] In addition to LCD processes, photosensitive resin compositions can also be used in next-generation displays based on dye and pigment technologies. While existing LCD processes are designed for durability in high-temperature processes, next-generation displays require low-temperature processes to minimize thermal deformation loss due to the material properties of the thin film. Since materials for organic light-emitting diodes (OLEDs) can also only be processed at low temperatures, there is an increasing demand for low-temperature curing resin compositions. However, low-temperature curing can result in insufficient curing, resulting in poor heat and chemical resistance. Using excessively curable materials to address this issue can result in uneven surface properties and fragile residues during thin film formation.

[0043] Therefore, the inventors of the present invention have finally completed the present invention after several years of trial and error to develop a photosensitive resin composition that has a high degree of cure at low temperatures and has excellent solvent resistance and uniform coating properties. Specifically, one embodiment relates to a photosensitive resin composition for forming a color filter that can be cured at low temperatures and has excellent chemical resistance, more specifically, a photosensitive resin composition that has high reliability and patternability with only pre-baking at 100°C and photo-curing (i-line (365 nm) exposure).

[0044] Meanwhile, conventional color photoresists are negative-type photosensitive liquid materials that realize red, green, and blue color patterns, and technological developments have been directed toward gradually modifying the composition of the liquid materials. For example, efforts have been made to improve color purity by changing the type and content of the pigment dispersion liquid, which is the coloring material that realizes the color pattern, to improve patterning by modifying the composition of the binder resin or photopolymerization initiator, or to improve coating properties and color uniformity by using other additives such as leveling agents.

[0045] However, one embodiment relates to a photosensitive resin composition that differs from conventional color photoresists and is applied to color filter processes used in micro OLED display devices.

[0046] Micro OLED refers to a WOLED (White OLED) deposited on a silicon wafer. Inventors also call it OLEDoS (Organic Light Emitting Diode on Silicon). And a micro OLED display device refers to a display device to which a micro OLED is applied.

[0047] As the Metaverse market grows rapidly with the advent of the Fourth Industrial Revolution, there is a growing need to develop display devices that enhance the realism and visibility of AR, VR, and MR devices and minimize the risk of vertigo. To this end, there are various candidate technologies, including LCoS (Liquid Crystal on Silicon), LEDoS (Light Emitting Diode on Silicon), and OLEDoS (Organic Light Emitting Diode on Silicon). Among these, OLEDoS technology is being rapidly developed in various areas due to its advantages of a high contrast ratio, fast response speed, and self-luminous nature, which allows for a relatively simple optical system and reduces the volume and weight of devices.

[0048] In the case of OLEDoS, there are many difficulties in development as it is necessary to create pixels of several μm units, which are much smaller than existing displays, in order to realize a high-resolution microdisplay, and the color filter must be formed through a low-temperature process to avoid damaging the lower OLED.

[0049] Under these circumstances, the inventors have limited the type of binder resin to achieve low-temperature curing and fine patterning, and have further controlled the molecular weight of the binder resin and the content of the solids constituting the photosensitive resin composition to complete a photosensitive resin composition that can be cured at low temperatures of 100°C or less, has excellent solvent resistance, generates almost no residue, and allows for uniform exterior coating. Due to these properties, the photosensitive resin composition of one embodiment can be applied to next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) display devices, for example, micro OLED display devices.

[0050] Each component will be specifically described below.

[0051] (A) Binder resin The binder resin may be an acrylic binder resin.

[0052] For example, the acrylic binder resin may be an epoxy group-free acrylic binder resin that does not contain an epoxy group.

[0053] The acrylic binder resin contains at least one selected from the group consisting of structural units represented by Chemical Formula 1 and Chemical Formula 2, and at least two selected from the group consisting of structural units represented by Chemical Formulas 3 to 5. Because the acrylic binder resin has such a structure, the photosensitive resin composition according to one embodiment has superior solvent resistance and coating appearance properties compared to conventional photosensitive resin compositions.

[0054] For example, the binder resin may contain structural units represented by Chemical Formula 1 and Chemical Formulas 3 to 5. In this case, R 1 , R 4 and R 6 are each independently a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, and R 2 , R 5 and R 8 are each independently a hydrogen atom, and L 1 ~L 6 may each independently be a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms. In this case, the photosensitive resin composition according to one embodiment can have even higher reliability and patternability even when cured at low temperature and exposed to i-line light alone.

[0055] If the binder resin contains a cardo-based binder resin, an epoxy-based binder resin, a silsesquioxane-based binder resin, and / or an epoxy acrylic-based binder resin, it may not cure well at temperatures below 100°C, making it difficult to improve reliability and patternability, and may also result in reduced residue characteristics and coating uniformity.

[0056] That is, the photosensitive resin composition according to one embodiment has excellent residue characteristics and coating uniformity even when exposed to i-line at a low temperature of 100°C or less, and further has improved color characteristics, because the structure of the binder resin, specifically the acrylic binder resin, is controlled as described above.

[0057] Furthermore, when the weight average molecular weight and double bond equivalent of the acrylic binder resin having the controlled structure as described above are further controlled, the effects of improving residue properties, coating uniformity, and color properties are more excellent.

[0058] For example, the binder resin can have a weight average molecular weight of 5000 g / mol to 8000 g / mol.

[0059] For example, the binder resin can have a double bond equivalent weight of 150 g / mol to 500 g / mol.

[0060] When the weight average molecular weight and / or double bond equivalent of the acrylic binder resin is controlled as described above, the above-mentioned improvement effect can be further increased even at a low temperature of 100° C. or less and by i-line exposure alone.

[0061] Meanwhile, the photosensitive resin composition according to one embodiment can also enhance the above-mentioned effects by controlling the content of the solid content constituting the composition. Specifically, the solid content constituting the photosensitive resin composition may be contained in an amount of 12 wt % to 24 wt % based on the total amount of the photosensitive resin composition.

[0062] While conventional photosensitive resin compositions for color filters typically contain more solids than the above range, the photosensitive resin composition of one embodiment is intended for use in a micro OLED display device, which uses a WOLED deposited on a glass substrate or a silicon wafer (not polyimide) as a light source. Therefore, low-temperature curing is essential. Therefore, controlling the solids content as described above is advantageous for improving patternability. Specifically, when the solids content satisfies 12 wt% to 24 wt% of the total weight of the photosensitive resin composition, sufficient polymerization occurs with the photopolymerization initiator (described below) during exposure in a low-temperature pattern formation process, resulting in the formation of a pattern with excellent heat resistance, light resistance, and chemical resistance, even at low temperatures below 100°C. Existing color filters for liquid crystal displays (LCDs) use resists to form patterns of approximately 100 μm in size, which is too large for use in micro OLED display devices. Therefore, the inventors have achieved fine patterns and low-temperature curing by controlling the solids content of the photosensitive resin composition as described above, in addition to the type of binder resin, weight-average molecular weight, and double bond equivalent.

[0063] The binder resin may be contained in an amount of 5 to 20% by weight, for example, 5 to 15% by weight, for example, 7 to 12% by weight, based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, developability, resolution, and linearity of the pattern can be obtained.

[0064] (B) Colorant The photosensitive resin composition according to an embodiment includes a colorant, and the colorant may be a green pigment, a blue pigment, a red pigment, a purple pigment, a yellow pigment, or the like.

[0065] The red pigment may be, but is not limited to, CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, etc., which may be used alone or in combination of two or more kinds, in the Color Index.

[0066] The purple pigment may be, but is not limited to, CI Violet Pigment 23 (V.23), CI Violet Pigment 29, Dioxazine Violet, Fast Violet B, Methyl Violet Lake, Indanthrene Brilliant Violet, or the like, which may be used alone or in combination of two or more kinds.

[0067] The green pigment may be, but is not limited to, CI Green Pigment 7, CI Green Pigment 36, CI Green Pigment 58, CI Green Pigment 59, etc., in the Color Index, which may be used alone or in combination of two or more.

[0068] The blue pigment may be a copper phthalocyanine pigment such as CI Blue Pigment 15:6, CI Blue Pigment 15, CI Blue Pigment 15:1, CI Blue Pigment 15:2, CI Blue Pigment 15:3, CI Blue Pigment 15:4, CI Blue Pigment 15:5, CI Blue Pigment 15:6, or CI Blue Pigment 16 in the Color Index, which may be used alone or in combination of two or more, but is not limited thereto.

[0069] The yellow pigment may be an isoindoline pigment such as CI Yellow Pigment 185 or CI Yellow Pigment 139, a quinophthalone pigment such as CI Yellow Pigment 138, or a nickel complex pigment such as CI Yellow Pigment 150, all of which may be used alone or in combination, but is not limited thereto.

[0070] The pigments can be used alone or in combination of two or more.

[0071] The pigment may be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is pretreated before use, the average particle size of the pigment can be reduced.

[0072] The pretreatment can be carried out by kneading the pigment with a water-soluble inorganic salt and a wetting agent, and then filtering and washing the pigment obtained from the kneading step.

[0073] The kneading can be carried out at a temperature of 40°C to 100°C, and the filtration and washing can be carried out by washing the inorganic salt with water or the like and then filtering.

[0074] Examples of water-soluble inorganic salts include, but are not limited to, sodium chloride, potassium chloride, etc. The wetting agent acts as a medium that allows the pigment and water-soluble inorganic salt to be uniformly mixed and facilitates the pulverization of the pigment, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, etc., and these can be used alone or in combination.

[0075] The pigment after the kneading step can have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. When the average particle size of the pigment is within the above range, the pigment has excellent stability in the pigment mill base (pigment dispersion liquid), and there is no risk of a decrease in pixel resolution.

[0076] The pigment may be used in the form of a pigment dispersion, such as a millbase, together with a dispersant and a solvent.

[0077] The dispersant helps the pigment to be uniformly dispersed in the dispersion, and nonionic, anionic, or cationic dispersants can be used. Specifically, polyalkylene glycols or their esters, polyoxyalkylenes, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxide adducts, alkylamines, etc. can be used alone or in combination of two or more.

[0078] Examples of commercially available dispersants include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemical; and Solsperse 5000 and Solsperse 6000 from Zeneka. 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, or Solsperse 28000, or Ajinomoto's PB711 or PB821.

[0079] The dispersant may be contained in an amount of 0.1 to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the above range, the composition has excellent dispersibility, resulting in excellent stability, developability, and patternability during production of the photosensitive resin film.

[0080] In addition to the pigment, dispersant, and (dispersion) solvent, the pigment dispersion may further contain a dispersion aid, a dispersion resin, etc. The solid pigment may be contained in an amount of 5% by weight to 20% by weight, for example 8% by weight to 15% by weight, based on the total amount of the pigment dispersion.

[0081] As the (dispersion) solvent for the pigment dispersion, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, or the like can be used, and among these, propylene glycol methyl ether acetate can be preferably used.

[0082] The dispersing resin can be an acrylic resin containing a carboxy group, which can not only improve the stability of the pigment dispersion liquid but also the patternability of the pixels.

[0083] The colorant may include a pigment and a dye, and in this case, the photosensitive resin composition according to an embodiment may be a hybrid composition. The dye is not particularly limited, but may include a metal complex dye.

[0084] Metal complex dyes can be compounds with maximum absorbance in the wavelength range of 200nm to 650nm, and in order to match the color coordinates to the combination of dyes, metal complex dyes of any color that are soluble in organic solvents can be used as long as they have absorbance in this range.

[0085] Specifically, the metal complex dye may be a green dye having a maximum absorbance in the wavelength range of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength range of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength range of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength range of 500 nm to 650 nm, or a combination thereof.

[0086] The metal complex dye may be a direct dye, an acid dye, a basic dye, an acid mordant dye, a sulfur dye, a reduction dye, an azoic dye, a disperse dye, a reactive dye, an oxidation dye, an oil-soluble dye, an azo dye, an anthraquinone dye, an indigoid dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye, or a combination thereof.

[0087] The metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

[0088] Metal complex dyes include CI solvent dyes such as CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, and 35, and CI Acid Greens such as CI Acid Green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, and 109. CI Direct Dyes, such as CI Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, and 82; CI Basic Dyes, such as CI Basic Green 1; and CI Mordent Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, and 41. , 43, 53, and the like; green pigments such as CI Pigment Green 7, 36, 58, and the like; Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132, and Solvent Red 218; and a complex of at least one selected from the group consisting of a metal ion.

[0089] The dye containing a metal complex may have a solubility of 5 or more, specifically 5 to 10, in the solvent used in the photosensitive resin composition according to one embodiment, i.e., the solvent described below. The solubility can be determined by the amount (g) of dye that dissolves in 100 g of solvent. When the solubility of the dye containing a metal complex is within the above-mentioned range, compatibility with other components constituting the photosensitive resin composition according to one embodiment and coloring power can be ensured, and precipitation of the dye can be prevented.

[0090] The solvent may be, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

[0091] The dye containing a metal complex may be contained in an amount of 0.01 to 1% by weight, for example, 0.01 to 0.5% by weight, based on the total amount of the photosensitive resin composition. When the dye containing a metal complex is used in the above range, high brightness and contrast ratio can be achieved with desired color coordinates.

[0092] When dyes and pigments are mixed, they can be used in a weight ratio of 0.1:99.9 to 99.9:0.1, specifically 1:9 to 9:1. When mixed in the above weight ratio range, chemical resistance and maximum absorption wavelength can be controlled within appropriate ranges, and high brightness and contrast ratio can be achieved with desired color coordinates.

[0093] The colorant may be included in an amount of 70 wt % to 90 wt %, for example, 70 wt % to 85 wt %, for example, 75 wt % to 80 wt %, based on the total amount of the photosensitive resin composition. When the colorant is included in such a very high amount, the coloring effect and developability are excellent in the micro OLED display device, and it may be easy to ensure high color reproduction and viewing angle characteristics.

[0094] (C) Polymerizable monomer The polymerizable monomer in the photosensitive resin composition according to an embodiment may include one or more compounds having three or more functional groups, where the functional groups may be, but are not limited to, (meth)acrylate groups, epoxy groups, etc.

[0095] A photosensitive resin composition according to one embodiment has been developed for use in micro OLED display devices. A low-temperature curing process is essential. In a low-temperature curing patterning process, the contribution of thermal curing decreases, while the influence of photocuring increases. Therefore, increasing the photocuring efficiency is advantageous for ensuring excellent patterning under low-temperature curing. According to one embodiment, the photocuring efficiency can be increased by using a compound having at least three functional groups as a polymerizable monomer. Specifically, the photocuring efficiency is significantly affected by the weight-average molecular weight and the number of functional groups of the polymerizable monomer. Generally, the photocuring efficiency increases as the weight-average molecular weight of the polymerizable monomer decreases and the number of functional groups in the polymerizable monomer increases. For example, a compound having at least three functional groups in the monomer has a low weight-average molecular weight and a large number of functional groups, which is advantageous for increasing the photocuring efficiency.

[0096] For example, the polymerizable monomer may be a mixture of two compounds, each of which independently contains three or more functional groups. For example, the polymerizable monomer may be a mixture of a first polymerizable monomer containing three to five functional groups and a second polymerizable monomer containing six or more functional groups. When the polymerizable monomer has the above-mentioned mixed composition, it may be possible to maximize photocuring efficiency while maintaining the above-mentioned color characteristics, thereby facilitating the formation of a low-temperature cured pattern.

[0097] For example, the first polymerizable monomer may be contained in a smaller amount than the second polymerizable monomer. When the two compounds are mixed in the above weight ratio, the low-temperature curing patternability is most excellent.

[0098] For example, a polymerizable compound containing three or four functional groups can be represented by the following Chemical Formula 1, but is not necessarily limited thereto. [Chemical formula 1] [ka] In the above chemical formula 1, L a ~L d each independently represents a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, a substituted or unsubstituted oxyalkylene group having 1 to 20 carbon atoms, or a combination thereof, R a ~R d are each independently a hydrogen atom, a hydroxy group, an epoxy group, or a substituted or unsubstituted (meth)acrylate group, provided that the R 1 ~R 4 At least three of these groups are necessarily epoxy groups or substituted or unsubstituted (meth)acrylate groups.

[0099] For example, the compound containing 5 to 6 functional groups may be, but is not necessarily limited to, pentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, or a combination thereof.

[0100] The polymerizable monomer may be treated with an acid anhydride to provide better developability.

[0101] The polymerizable monomer may be contained in an amount of 1 wt % to 10 wt %, for example, 1 wt % to 5 wt %, based on the total amount of the photosensitive resin composition. When the polymerizable monomer is contained within the above range, sufficient curing occurs upon exposure in a low-temperature pattern formation process, resulting in excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion.

[0102] (D) Polymerization initiator According to one embodiment, the photosensitive resin composition includes a polymerization initiator. The polymerization initiator content is controlled to 0.1 wt % to 5 wt %, for example, 1 wt % to 3 wt %, based on the total weight of the photosensitive resin composition. When the polymerization initiator content is controlled in this manner, an optimal pattern can be formed in a low-temperature curing process in conjunction with the aforementioned polymerizable monomer, binder resin, and colorant composition. Using a polymerization initiator outside the above content range in conjunction with the aforementioned polymerizable monomer, binder resin, and colorant composition may be undesirable, as it may significantly reduce patternability during the low-temperature curing process.

[0103] The polymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof.

[0104] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0105] Examples of benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0106] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0107] Examples of the benzoin-based compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0108] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine. 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0109] Examples of oxime compounds that can be used include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyloxime compounds include, but are not limited to, 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0110] In addition to the above-mentioned compounds, the photopolymerization initiator can also be used together with, for example, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, and the like.

[0111] (E) Solvent The solvent may be a substance that is compatible with but does not react with the pigment dispersion containing the colorant, the binder resin, the polymerizable monomer, and the polymerization initiator.

[0112] Examples of the solvent include alcohols such as methanol and ethanol, ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran, glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether, cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate, carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether, propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl- Ketones such as n-propyl ketone, methyl n-butyl ketone, methyl n-amyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxypropionic acid methyl ester 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; methyl 2-methoxypropionate, ethyl 2-methoxypropionate, and ethyl 2-ethoxypropionate;2-alkoxypropionic acid alkyl esters such as methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; Examples of suitable solvents include ketone acid esters such as ethyl pyruvate, and high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0113] Of these, in consideration of compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether, ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate, esters such as ethyl 2-hydroxypropionate, carbitols such as diethylene glycol monomethyl ether, and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate can be preferably used.

[0114] The solvent may be contained in an amount of, for example, 0.1 to 20% by weight, for example, 1 to 20% by weight, for example, 3 to 18% by weight relative to the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability during the production of a photosensitive resin film.

[0115] (F) Other additives Meanwhile, the photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, an antioxidant, or a combination thereof.

[0116] The silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group in order to improve adhesion to the substrate.

[0117] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like, which can be used alone or in combination of two or more.

[0118] The silane coupling agent may be contained in an amount of 0.01 to 10 parts by weight relative to 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the composition has excellent adhesion, storage stability, etc.

[0119] Furthermore, the photosensitive resin composition may further contain a surfactant, such as a fluorine-based surfactant and / or a silicone-based surfactant, to improve coating properties and prevent defects, if necessary.

[0120] Examples of fluorine-based surfactants that can be used include those commercially available under the names BM-1000 and BM-1100 from BM Chemie, Megafac (registered trademark) F 142D, F 172, F 173, F 183, F 554, and F 556 from Dainippon Ink and Chemicals, Inc., Fluorad FC-135, FC-170C, FC-430, and FC-431 from Sumitomo 3M Limited, Surflon (registered trademark) S-112, S-113, S-131, S-141, and S-145 from Asahi Glass Co., Ltd., and SH-28PA, S-190, S-193, SZ-6032, and SF-8428 from Toray Silicone Co., Ltd.

[0121] As the silicone surfactant, those commercially available from BYK Chem under the names BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc. can be used.

[0122] The surfactant can be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is contained within the above range, coating uniformity is ensured, no unevenness occurs, and excellent wetting is achieved on IZO substrates or glass substrates.

[0123] The antioxidant may include, but is not limited to, a hydroquinone-based compound, a catechol-based compound, or a combination thereof. When the photosensitive resin composition according to an embodiment further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, room temperature crosslinking can be prevented during exposure after coating the photosensitive resin composition.

[0124] For example, the hydroquinone-based compound, the catechol-based compound, or a combination thereof can include, but is not necessarily limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, t-butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminum, or a combination thereof.

[0125] The hydroquinone compound, the catechol compound, or a combination thereof can be used in the form of a dispersion, and the antioxidant in the form of a dispersion may be contained in an amount of 0.001% by weight to 3% by weight, for example, 0.01% by weight to 1% by weight, based on the total amount of the photosensitive resin composition. When the antioxidant is contained within the above range, problems associated with aging at room temperature can be solved, and at the same time, a decrease in sensitivity and surface peeling can be prevented.

[0126] Furthermore, the photosensitive resin composition may contain a certain amount of other additives such as stabilizers within a range that does not impair the physical properties.

[0127] The photosensitive resin composition according to an embodiment may be a positive type or a negative type, but is preferably a negative type in order to more completely remove residues in areas where a pattern is exposed after exposure and development of a composition having light-blocking properties.

[0128] Another embodiment provides a photosensitive resin film manufactured by low-temperature curing, exposing, and developing the photosensitive resin composition.Compared to conventional LCD processes, the difference is that no post-curing (post-baking) process is required.

[0129] The photosensitive resin film is produced as follows.

[0130] (1) Coating and film formation stage (low-temperature curing) The photosensitive resin composition is applied to a substrate, such as a glass substrate or ITO substrate, that has been pretreated to a desired thickness using methods such as spin or slit coating, roll coating, screen printing, or applicator, and then heated to 100°C or less, for example, 85°C, for 1 to 10 minutes to remove the solvent, forming a photosensitive resin film. This step can improve image quality unevenness.

[0131] (2) Exposure stage To form the required pattern on the resulting photosensitive resin film, the film is irradiated with i-line actinic radiation through a mask. The light source used for irradiation can be a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon gas laser, or, in some cases, X-rays or electron beams.

[0132] The exposure dose varies depending on the type and amount of each component of the composition and the thickness of the dried film, but when using a high-pressure mercury lamp, it is 500 mJ / cm 2 (365nm sensor) or less. However, in some cases the exposure dose may be 500mJ / cm 2 (365nm sensor) In some cases, it may exceed this limit. Through this step, pixel size can be finely adjusted, allowing for high resolution.

[0133] (3) Development stage As for the development method, after the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts to form a pattern. Through this step, a profile can be formed, realizing high resolution, ensuring color uniformity and improving clarity.

[0134] Another embodiment provides a display device including a photosensitive resin film.

[0135] The display device may be a micro organic light emitting diode (OLED) display device.

[0136] The micro organic light emitting device (OLED) display device includes an OLED substrate deposited on a silicon wafer and a color filter layer laminated on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights, and the color filter layer can include a red color filter, a green color filter, and a blue color filter.

[0137] For example, a micro organic light emitting device (OLED) display device may include an OLED substrate deposited on a silicon wafer, an inorganic layer stacked on the OLED substrate, a protective adhesive layer stacked on the inorganic layer, and a color filter layer stacked on the protective adhesive layer to convert white light generated from the OLED substrate into multiple color lights, and the color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0138] For example, the photosensitive resin composition according to one embodiment may be a green photosensitive resin composition, and the green color filter in the micro OLED display device may be a low-temperature cured film of the green photosensitive resin composition.

[0139] While conventional OLED substrates have been constructed by depositing OLEDs on glass or polyimide substrates, a micro OLED display device according to an embodiment has OLEDs deposited on a silicon wafer, which is more advantageous for realizing a micro display. Such micro displays are gaining attention as next-generation displays and are expected to be applied to devices such as mixed reality (MR). In fact, Apple, Meta, and LG Display have all either already entered or are planning to enter the next-generation MR device market. For example, a micro OLED display device may further include a micro lens array. The micro lens array may be disposed on a protective adhesive layer and may surround a color filter layer.

[0140] The micro OLED display device with the above structure can be driven pixel by pixel as WOLED is deposited on a highly integrated silicon wafer, and it is advantageous in ensuring high color reproduction and high resolution as it is easy to control the transmission wavelength through the color filter layer patterned with a resolution of 3μm or less.

[0141] For example, the thickness of the protective adhesive layer may be 1 μm or less, which can further enhance the above-mentioned effects.

[0142] For example, the thickness of the color filter layer may be 1.1 μm to 1.6 μm.

[0143] If the thickness of the color filter layer is controlled as described above, it is more advantageous in realizing a micro OLED display device.

[0144] For example, the thickness of the inorganic layer may be 2 μm or less. Even in WOLEDs, light does not always diffuse only in the direction perpendicular to the OLED substrate, so color mixing of red, green, and blue inevitably occurs. Therefore, in the past, an inorganic layer was deposited on the OLED substrate to prevent this color mixing. However, since color mixing cannot be completely prevented even by depositing an inorganic layer, in one embodiment, the inorganic layer is made thin, for example, the thickness of the inorganic layer is controlled to 2 μm or less, thereby preventing the phenomenon of minute light leakage.

[0145] As a result, the photosensitive resin composition according to one embodiment can produce a cured film by only pre-baking at a low temperature (100°C) and curing with i-line light, as described above, and therefore has a significantly higher achievable resolution than conventional display devices.

[0146] Preferred examples of the present invention will be described below, but the following examples are merely preferred examples of the present invention and the present invention is not limited to the following examples. [Example]

[0147] (Photosensitive resin composition production) (Examples 1 to 10, Comparative Examples 1 and 2) A polymerization initiator was dissolved in a solvent according to the composition shown in Tables 1 and 2 below, and the solution was stirred at room temperature for 2 hours. A binder resin and a polymerizable monomer were added to the solution, and the solution was stirred at room temperature for 1 hour. Other additives and a colorant were added to the solution, and the solution was stirred at room temperature for 1 hour. The entire solution was then stirred for 2 hours. The solution was filtered three times to remove impurities, and a photosensitive resin composition was prepared.

[0148] [Table 1]

[0149] (A) Binder resin (A-1) Acrylic binder resin (Showa Denko) containing a structural unit represented by chemical formula A (8000 g / mol) [Chemical formula A] [ka] (A-2) Acrylic binder resin (Showa Denko) containing a structural unit represented by chemical formula A (5000 g / mol) (A-3) Acrylic binder resin (Showa Denko) containing a structural unit represented by chemical formula B (5000 g / mol) [Chemical formula B] [ka] (A-4) Acrylic binder resin (Showa Denko) containing a structural unit represented by chemical formula A (4000 g / mol) (A-5) Acrylic binder resin (Showa Denko) containing a structural unit represented by chemical formula A (9000 g / mol) (A-6) Epoxy binder resin (EHPE3150, Daicel Chemical Industries, Ltd.) (A-7) Silsesquioxane binder resin (EHPE3150, Daicel Chemical Industries, Ltd.) (B) Colorant Pigment dispersion (Sanyo, BA6136) (C) Polymerizable monomer (C-1) Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Kayaku Co., Ltd.) (C-2) pentaerythritol triacrylate (PE-3A, Kyoeisha) (D) Polymerization initiator Oxime initiator (SPI-03, Sanyosha) (E) Solvent Propylene glycol monomethyl ether acetate (PGMEA, Daicel) (F) Other additives (F-1) Leveling agent (F-554, DIC) (F-2) Silane coupling agent (KBM503, ShinEtsu Co., Ltd.) (F-3) Antioxidant (2-Methylhydroquinone, JHChem)

[0150] (evaluation) Using a K-spin8 (SEMES) (Track) device, the photosensitive compositions prepared in Examples 1 to 10 and Comparative Examples 1 and 2 were coated onto 8-inch silicon wafers at a rpm sufficient to achieve a consistent thickness (1.5 μm) for each sample. The wafers were then baked at 100°C for 3 minutes on the Track's hot plate, and a Nikon i-line stepper was used to adjust the exposure dose (exposure conditions: Dose: 800 ms / Focus: -0.3) to expose the pattern. The thickness was measured using a KLA-Tenscor device during the exposure process, followed by development to reveal the pattern. EHD-100S solution (TMAH) was used as the developer. After development, the 96 μm intaglio pattern on the patterned substrate was confirmed using a Hitachi CD-SEM to check the pattern sensitivity and peripheral residue. Large-area coating uniformity was also confirmed using an Olympus optical microscope. Coating uniformity was checked with the naked eye, and excellent results were marked with ○, poor results with △, and extremely poor results that were deemed difficult to commercialize were marked with X.

[0151] The patterned substrate was then immersed in BASF's TMAH (2.38%) developer for 5 minutes to check for any additional color changes. Color measurements were performed using a fine pattern colorimeter (LCF).

[0152] The evaluation results are shown in Table 2 below and in FIGS.

[0153] [Table 2]

[0154] From Table 2 and FIGS. 1 to 6, it can be seen that the photosensitive resin composition according to an embodiment can realize fine patterns even when cured at low temperature, and has excellent residue properties, coating uniformity, and color properties, making it suitable for use in micro OLED display devices.

[0155] The present invention is not limited to the examples, and can be manufactured in various different forms, and a person skilled in the art to which the present invention pertains can understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the above-described examples are illustrative in all respects and are not limiting.

Claims

1. (A) a binder resin; (B) a colorant; (C) a polymerizable monomer; (D) a polymerization initiator; (E) a solvent; Including, The binder resin is a photosensitive resin composition containing structural units represented by the following Chemical Formulas 1 to 4: The photosensitive resin composition contains, relative to the total amount of the photosensitive resin composition, 5% by weight to 20% by weight of the binder resin (A); 70% by weight to 90% by weight of the colorant (B); 1% by weight to 10% by weight of the polymerizable monomer (C); 0.1% by weight to 5% by weight of the (D) polymerization initiator; the remaining amount of the (E) solvent; A photosensitive resin composition comprising: [Chemical formula 1] 【Chemistry 1】 [Chemical formula 2] 【Chemistry 2】 [Chemical formula 3] 【Transformation 3】 [Chemical formula 4] 【Chemistry 4】 (In the above chemical formulas 1 to 4, R １ , R 2 , R 4 to R ６ and R ８ are each independently a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R ７ and R ９ each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L １ ~L ６ are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

2. In the above Chemical Formulas 1 to 4, R １ , R ４ , and R ６ are each independently a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R ２ , R ５ , and R ８ are each independently a hydrogen atom, L １ ~L ６ and each independently represent a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

3. 2. The photosensitive resin composition according to claim 1, wherein the binder resin has a weight average molecular weight of 5000 g / mol to 8000 g / mol.

4. 2. The photosensitive resin composition according to claim 1, wherein the binder resin has a double bond equivalent weight of 150 g / mol to 500 g / mol.

5. 2. The photosensitive resin composition according to claim 1, wherein the solid content constituting the photosensitive resin composition is contained in an amount of 12% by weight to 24% by weight based on the total amount of the photosensitive resin composition.

6. The photosensitive resin composition according to claim 1 , wherein the polymerizable monomer comprises one or more compounds containing three or more functional groups.

7. the polymerizable monomer is a mixture of two compounds, The photosensitive resin composition according to claim 6 , wherein the two compounds each independently contain three or more functional groups.

8. 8. The photosensitive resin composition according to claim 7, wherein the two compounds are a first polymerizable monomer having 3 to 5 functional groups and a second polymerizable monomer having 6 or more functional groups, and the first polymerizable monomer is contained in a smaller amount than the second polymerizable monomer.

9. The photosensitive resin composition according to claim 1 , further comprising an antioxidant.

10. 10. The photosensitive resin composition according to claim 9, wherein the antioxidant is contained in an amount of 0.01% by weight to 1% by weight based on the total amount of the photosensitive resin composition.

11. The photosensitive resin composition according to claim 1, further comprising an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, and a combination thereof.

12. A photosensitive resin film produced using the photosensitive resin composition according to claim 1.

13. A display device comprising the photosensitive resin film according to claim 12.

14. The display device includes an OLED substrate deposited on a silicon wafer, and a color filter layer stacked on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights; 14. The display device of claim 13, wherein the color filter layer includes a red color filter, a green color filter, and a blue color filter.

15. Applying the photosensitive resin composition of claim 1; After the coating, pre-baking at a temperature of 100° C. or less; After the pre-baking, exposing the resist to i-line light; a developing step; A method for producing a photosensitive resin film comprising the steps of:

Images